Cooling system for liquid immersion cooling of electronic components

Abstract

The invention relates to a cooling system (1) for liquid immersion cooling of electronic components, comprising:-a container (3), the interior of which can be filled with a two-phase heat transfer fluid, the electronic components being immersible in the liquid phase of which fluid, where the container (3) has a gas space above the surface of the liquid heat transfer fluid,-heat exchanger means in the gas space of the container (3), the invention relates to a heat exchanger (1) comprising a container (3) for forming a liquid heat transfer fluid,-at least one condenser unit (7) wherein the condenser unit (7) is in contact with a gas space of the container (3) via at least one fluid inlet opening (71) and at least one fluid outlet opening (72) for mass transfer of a gaseous medium to the condenser unit (7) or mass transfer of a liquid medium from the condenser unit (7), the condenser unit (7) has an outlet (79) through which the residual gas phase can be discharged, the condenser unit (7) having a tube bundle (73) in the closed housing (74) downstream of the at least one fluid inlet opening (71) in the flow direction (S), said tube bundle having heat exchanger tubes (731) running parallel to one another in the axial direction thereof, the tube bundle (73) is arranged in the housing (74) such that the tube bundle (73) forms a flow channel (75) in the housing (74), and the tube bundle (73) is arranged in the housing (74) such that the gaseous medium flows in the flow channel (75) in the axial direction of the heat exchanger tubes (731).

Description

[0001] The present invention relates to a cooling system for liquid immersion cooling of electronic components, as described in the preamble of claim 1.

[0002] Cooling systems for liquid immersion cooling, such as two-phase immersion cooling systems, are an effective cooling solution for electronic components that generate significant heat during operation. When the components are immersed in a preferably low-boiling-point two-phase heat transfer fluid, the heat generated by the electronic components evaporates the surrounding liquid heat transfer fluid, thereby dissipating the heat from the electronic components. A condenser device liquefies the gaseous heat transfer fluid and then returns it to a reservoir for cooling.

[0003] Document US 10 512 192 B2 discloses a two-phase immersion cooling system with a cooling tank. During the cooling process, a gaseous fluid is condensed and connected to a liquid fluid in the cooling tank via a condensation chamber. In this case, a vapor redirection structure is arranged above the heat-generating electronic components located within the cooling medium in the cooling tank. The evaporated fluid is guided to the condensation chamber for liquefaction via the vapor redirection structure. The condensation chamber is located within the cooling tank.

[0004] Document US 10 966 349 B1 discloses a two-phase immersion cooling system having an immersion tank and a main condenser for a gaseous heat transfer fluid. The main condenser is thermally connected to the internal volume of the immersion tank. The immersion cooling system also includes a steam management system, which is fluidly connected to the top space of the immersion tank. The steam management system effectively manages high steam generation cycles by removing fluid vapor and other gases from the top space of the immersion tank, condensing the vapor into a liquid, and returning the liquid to the immersion tank.

[0005] Furthermore, US 10 477 726 B1 discloses a cooling system for computer components. A thermally conductive, dielectric heat transfer fluid in both liquid and gas phases, with a boiling point below 80°C at atmospheric pressure, is located in a pressure-controlled container. Computer components are arranged within the container, at least partially immersed in the liquid phase of the heat transfer fluid. The dielectric phase fluid evaporated by the heat generated by the computer components is condensed into a dielectric liquid phase fluid via a condenser. The internal pressure within the pressure-controlled container is reduced to as low as 650 hPa. By controlling the pressure within the container operating here, the user can influence the temperature at which the dielectric liquid evaporates. This allows for increased cooling capacity. Operating a computer system within a pressure-controlled container at operating pressures different from ambient pressure typically requires structural adaptation of the entire system.

[0006] Document US 2021 / 0153392 A1 discloses a cooling system having a container that can be filled with a two-phase heat transfer fluid as a coolant, with electronic components capable of being immersed in the liquid phase of the two-phase heat transfer fluid. The container has a gas space above the surface of the liquid heat transfer fluid. A separate external condenser unit is arranged above the container and configured to condense the vapor phase of the heat transfer fluid and return it as liquid coolant to the container containing the electronic components. For this purpose, the system includes return lines and supply lines connected to both the condenser unit and the container to form a heat exchange loop. The system also includes a collection container arranged on the supply line and configured to collect the condensed liquid heat transfer fluid before the coolant is supplied to the container. The energy storage device also provides reserve cooling capacity for the cooling system.

[0007] Document EP 3 453 235 B1 discloses a cooling system for immersion cooling of electronic components, comprising a pressure-sealed tank configured to maintain a heat transfer fluid in liquid form, into which the electronic device is immersed. A vapor space exists above the surface of the liquid heat transfer fluid. A condenser is arranged outside the pressure-sealed tank, having an inlet connected to the vapor space via a riser and configured to receive heat transfer fluid vapor. The condenser also has a vapor outlet for residual gas that can be sealed shut off, and a condensate outlet with a condensate return line leading to the tank. The condensate return line is designed to allow condensed heat transfer fluid to flow back to the tank from the condensate outlet. Additional condenser tubes for liquefied gaseous heat transfer fluid may also be present inside the tank.

[0008] The purpose of this invention is to further develop a liquid immersion cooling system for electronic components, relative to heat exchanger devices.

[0009] This invention is embodied by the features of claim 1. Further claims relating to this claim relate to advantageous embodiments and modifications of the invention.

[0010] This invention includes a cooling system for liquid immersion cooling of electronic components. The cooling system includes:

[0011] - A container that can be filled with a two-phase heat transfer fluid, into which electronic components can be immersed, wherein the container has a gas space above the surface of the liquid heat transfer fluid.

[0012] - A heat exchanger device in the gas space of a container for the formation of a liquid heat transfer fluid.

[0013] - At least one condenser unit, wherein the condenser unit is in contact with the gas space of the container through at least one fluid inlet opening for mass transfer of a gaseous medium to the condenser unit or mass transfer of a liquid medium from the condenser unit, and the condenser unit has an outlet through which residual gas phase can be discharged.

[0014] According to the invention, the condenser unit, within a closed housing, has a tube bundle with heat exchanger tubes extending parallel to each other in the axial direction after at least one fluid inlet opening, thereby forming a flow channel within the housing. Furthermore, the tube bundle is arranged within the housing such that a gaseous medium flows along the axial direction of the heat exchanger tubes within the flow channel.

[0015] This invention is based on the concept that the outer shell of the condenser unit, together with the inner bundle of straight and parallel heat exchanger tubes, forms an elongated cooling section in which the gaseous heat transfer fluid from the container is cooled and liquefied. The heat transfer fluid condensed at the heat exchanger tubes drips onto the bottom of the outer shell, which preferably has a sufficient inclination relative to the horizontal plane in the direction of the fluid outlet opening to allow for the return flow of the liquid heat transfer fluid into the container through the fluid outlet opening. The condensation process results in a steady reduction in the amount of gaseous heat transfer fluid, thereby establishing a negative pressure in the outer shell of the condenser unit relative to the container. This has the consequence that the gaseous heat transfer fluid flows steadily from the gas chamber of the container into the outer shell of the condenser unit through at least one fluid inlet opening. Therefore, the system can be independently regulated according to pressure and heat transfer area. Depending on the requirements of the cooler, multiple condenser units can also be designed individually in different locations within or outside the container.

[0016] A particular advantage of the solution according to the invention is the exceptionally long cooling section formed by the heat exchanger tubes, along which the gaseous fluid is forced to flow within the elongated housing.

[0017] The vessel can be a pressure-sealed design. Advantageously, the vessel can be designed as a pressure vessel, which can be operated under negative and / or positive pressure. Increased cooling capacity can be achieved by controlling the pressure at which the cooling system operates within the vessel.

[0018] The heat exchanger assembly in the gas chamber preferably consists of at least one tube bundle, which is formed by a plurality of heat exchanger tubes arranged in parallel to each other. The tube bundle may have a plurality of heat exchanger tubes arranged in parallel to each other, with two tube bends at the ends.

[0019] The heat exchanger tubes are preferably finned tubes, produced from smooth tubes and formed. They are particularly well-suited as components of compact and extremely stable, highly efficient heat exchangers, exhibiting a high heat transfer coefficient. The tube surface is optimized according to the specific heat transfer requirements of the application. A wide selection of materials, including copper, copper alloys, steel, titanium, or titanium alloys, ensures that materials suitable for various needs are available, particularly in terms of durability and deformability.

[0020] Two-phase heat transfer fluids, also known as refrigerants, constitute the external fluid located within the container, with electronic components immersed in its liquid portion. The internal fluid located in the heat exchanger tubes is typically a single-phase heat carrier medium, such as process water, ethylene glycol, or hot oil. However, two-phase media can also be used in conjunction with the refrigeration circuit here.

[0021] In the container, electronic components are arranged in a tank of liquid heat transfer fluid in a manner suitable for cooling, and the electronic components are cooled by the evaporation of the liquid fluid. In this case, a portion of the non-condensable gases can be effectively removed from the system before or during startup.

[0022] In an embodiment of the invention, the computing components, immersion cooling device, and associated power supply, network connection, wiring connection, etc., can be arranged in a container that has an internal pressure different from the ambient pressure during operation.

[0023] In this context, it is also advantageous to combine power, water, vacuum, and network connections in a wiring harness to minimize access to the container and reduce the risk of leakage, especially when the system is under vacuum or positive pressure during operation.

[0024] In an advantageous embodiment, during operation, the container is maintained at a pressure up to 200 hPa below ambient pressure, which helps to lower the boiling point of the two-phase heat transfer fluid, thereby reducing the operating temperature of computer chips and other components. In some specific embodiments, the pressure-controlled container can be designed for even lower pressures, up to 500 hPa below ambient pressure.

[0025] An embodiment of the cooling system according to the invention includes a container for a dielectric cooling fluid, a heat exchanger assembly, and a condenser unit for condensing the dielectric fluid from the gas phase into a liquid. The condenser unit, located inside or outside the container, is designed to condense the residual gaseous heat transfer fluid, which also contains a portion of air and water vapor, into a liquid heat transfer fluid to the greatest extent possible. Ideally, the remaining heat transfer fluid is condensed almost completely from the gas phase, so that essentially only air and water vapor remain as residual gas phase. Here, the purpose of separating the liquid heat transfer fluid is, in this case, to retain the water vapor in the gas phase through the appropriate cooling capacity of the system. The residual gas mixture is discharged from the cooling system via the outlet of the condenser unit.

[0026] Furthermore, means for holding computer components and for distributing current from the power supply system to the devices and components located inside the container can be arranged. Needless to say, numerous dedicated connections are used for operating the computer system within the container, for example, maintaining it under negative pressure. Some embodiments of the system according to the invention may use a series of fiber optic interfaces that allow connectivity within the container and distribute fiber optics to various holding devices for electronic components. Some embodiments of the container may include monitoring sensors for safe operation. These sensors may include temperature sensors, level sensors, pressure sensors, position sensors, electrical sensors, and / or cameras to ensure and automate the operation of the system.

[0027] These systems may include, for example, pressure sensors inside a pressure-controlled container that monitor pressure to ensure there is no significant leakage. Similarly, gas sensors may be provided positioned on the outside of the pressure-controlled container to detect the presence of any dielectric vapor escaping from it.

[0028] The cooling system may also advantageously have a control device designed to regulate the operation of the fluid circulation, for example, based on the temperature and pressure conditions of the two-phase heat transfer fluid in the container.

[0029] In a preferred configuration of the invention, the flow channels can vary in the flow direction with respect to their cross-sectional area for the fluid. This measure aims to concentrate the flow of the heat transfer fluid on the heat exchanger tubes that extend parallel to each other in the axial direction and to prevent backflow.

[0030] Advantageously, the flow channel can have multiple chambers connected by connecting channels with relatively small cross-sections. In this way, the gaseous heat-transfer fluid is guided from one chamber to another until liquefaction occurs. This aims to increase the residence time in the respective chambers and control the flow via a pressure gradient set at the contraction.

[0031] Furthermore, it is advantageous that the tube bundle with heat exchanger tubes can pass through the chamber and connecting channels in the flow path. This measure also aims to concentrate the flow of the heat transfer fluid on the heat exchanger tubes that extend parallel to each other in the axial direction and to prevent backflow.

[0032] In an advantageous embodiment of the invention, a guiding structure for the gaseous fluid can be arranged. This forces the vapor to flow along the heat exchanger surface of the tube bundle towards the outlet, thereby condensing as much refrigerant as possible.

[0033] In an advantageous configuration of the invention, the condenser unit can be arranged inside or outside the container. Depending on the structural design and space requirements, the condenser unit is a standalone module that only needs to be connected to the gas space of the container in a suitable manner for mass transfer of the fluid.

[0034] Advantageously, the condenser units arranged inside the container can be positioned within the container's gas space, above or beside the heat exchanger assembly. In these regions, a gaseous fluid phase to which residual gases (e.g., air components or water vapor) have been added is present and can be used for further condensation.

[0035] In a preferred embodiment of the invention, a collection container may be arranged downstream of the outlet of the condenser unit, through which residual gas phase can be discharged. The container also ensures that no air can enter the cooling system from the surrounding environment. The container may be an inflatable elastic bladder or a variable-volume bellows.

[0036] In a particularly preferred embodiment, a drying unit for separating water vapor from the gas phase can be arranged between the outlet and the collection container. The pressure level throughout the cooling system typically varies with the load. If necessary, outside air or residual gas can be introduced into the cooling system via the collection container and the drying unit for pressure compensation purposes. Silica gel is suitable for such drying units for binding water vapor.

[0037] In a further advantageous configuration of the invention, a vacuum pump can be arranged downstream of the outlet, through which the residual gas phase can be discharged. In this case, the residual gas phase (composed of water vapor and air) at the outlet can also have a negative pressure relative to the surrounding environment, because the vacuum pump always ensures the outward flow direction of the residual gas.

[0038] Advantageously, the heat exchanger unit and the condenser unit can have a common supply unit for the first single-phase heat transfer medium used for cooling. Therefore, the two units are at a uniform temperature level suitable for the heat exchange fluid separation process.

[0039] In a preferred embodiment of the invention, the condenser unit may have a second supply unit for a second single-phase heat carrier medium for cooling. Then, independent, different temperature levels can be set in the condenser unit to further effectively separate the individual phase components.

[0040] In a particularly preferred embodiment, the condenser unit can be designed to operate at a lower temperature with a single-phase heat transfer medium for cooling compared to a heat exchanger device. Particular consideration should be given to selecting pressure and temperature conditions not lower than the moisture dew point to retain water vapor in the residual gas phase and to allow it to be discharged. The condenser unit can be optimally used within this pressure-temperature range.

[0041] Exemplary embodiments of the present invention will be discussed in more detail based on the schematic diagrams.

[0042] in:

[0043] Figure 1 A schematic front view of a cooling system with a condenser unit is shown.

[0044] Figure 2 A schematic side view of a cooling system with a condenser unit is shown.

[0045] Figure 3 Another side view of the cooling system with a condenser unit is shown, and

[0046] Figure 4 Another side view of the cooling system with a condenser unit is shown.

[0047] In all the figures, corresponding parts are indicated by the same reference numerals.

[0048] Figure 1 A schematic front view of a cooling system 1 for liquid immersion cooling of electronic component 2 is shown. The cooling system 1 includes a container 3 filled with a two-phase heat transfer fluid. The two-phase heat transfer fluid constitutes an external fluid located within the container 3, having a liquid heat transfer fluid portion 4 into which the electronic component 2 is immersed, and a gas space 5 having a gaseous heat transfer fluid portion. Within the container 3, a heat exchanger device 6 is arranged in the gas space 5 of the container 3 to form the liquid heat transfer fluid 4.

[0049] In this advantageous embodiment, the heat exchanger device 6 in the gas space 5 consists of tube bundles, each tube bundle having a plurality of heat exchanger tubes arranged in parallel with each other.

[0050] exist Figure 1 In the illustrated embodiment, container 3 is slightly tapered in the region of the liquid heat transfer fluid 4 because the container walls protrude inward and open only in the gas space 5. The form of container 3 is supported by a metal profile frame 31. Therefore, container 3 is surrounded by a stable outer frame.

[0051] The condenser unit 7 is arranged on the outer left side of the container 3 and the inner right side of the container 3. The condenser unit 7 is connected to the gas space 5 of the container 3 through a fluid inlet opening 71 for mass transfer of the gaseous medium. In addition, at the end of the sloping bottom surface of the outer shell 74, a fluid outlet opening 72 is arranged for liquefied heat transfer fluid to the container 3, through which the liquid heat transfer fluid re-enters the container 3 from the condenser unit 7.

[0052] To regulate mass transfer, valve 710 is installed in the fluid inlet opening 71, and valve 720 is installed in the fluid outlet opening 72. Therefore, through valve 710 in the fluid inlet opening 71, a gaseous mixture consisting of the heat transfer fluid, air, and water vapor is periodically or continuously drawn from the container 3. Through valve 720 in the fluid outlet opening 72, only the liquid heat transfer fluid is returned to the container 3.

[0053] The remaining residual gas phase, consisting essentially of only air and water vapor after the heat transfer fluid has almost completely condensed, is discharged to the outside through outlet 79 by means of valve 910. To further separate water vapor, a drying unit 8 for separating water vapor from the gas phase is arranged between outlet 79 and collection container 9.

[0054] The residual gas phase can be directly discharged into the surrounding environment depending on the pressure level. Alternatively, the residual gas phase can also be discharged via vacuum pump 10. For this purpose, outlet 79 is connected to vacuum pump 10 via supply line 101, which regulates the residual gas flow via valve controller 1010, and discharges to the outside via exhaust line 102 of vacuum pump 10.

[0055] Alternatively or additionally, the residual gas phase can also be supplied to the collection container 9 via a supply line 91 with a valve 910. This collection container can be designed as a bellows with an expandable volume to generate negative pressure. If the valve 910 leading to the collection container 9 is closed during operation, the residual gas can be discharged via the discharge line 92 of the collection container 9 with the valve 920 open.

[0056] Figure 2A schematic side view of a cooling system 1 with a condenser unit 7 is shown. The condenser unit 7 is attached to the outer side of the long side of the container 3. A fluid inlet opening 71 connects the gas space of the container 3 located behind it to the condenser unit 7. Gaseous fluid flows in from the container 3 through this fluid inlet opening 71. A fluid outlet opening 72 is located at the end of a slope at the lowest point of the bottom surface 741 of the outer shell 74 of the condenser unit 7. Through this fluid outlet opening 72, the condensed liquid fluid returns to the container 3. The gaseous fluid flowing in through the fluid inlet opening 71 encounters a tube bundle 73, which consists of multiple heat exchanger tubes 731, and is conveyed in the flow channel 75 substantially along the axial direction of the heat exchanger tubes 731 in the flow direction S. A guide structure 78 is provided for the targeted deflection of the gaseous fluid, thereby forcing the gaseous fluid preferably to flow along the tube bundle 73 toward the outlet 79. During condensation, the volume of the gaseous fluid, and therefore its pressure, steadily decreases along the tube bundle 73. The pressure gradient thus created results in a negative pressure relative to container 3 in condenser unit 7, causing gaseous fluid to flow steadily in through fluid inlet 71. In the area of ​​outlet 79, due to the steady condensation of the gaseous fluid, non-condensable gaseous components, such as air and water vapor, accumulate. These non-condensable gaseous components are then discharged from cooling system 1 through outlet 79.

[0057] Figure 3 A schematic view of another side of the cooling system 1 with condenser unit 7 is shown. Figure 2 In the same manner shown, the condenser unit 7 is arranged on the upper outer side of the container 3, with a fluid inlet opening 71 and a fluid outlet opening 72. The bottom surface 741 of the outer casing 74 is again designed to have a downward slope in the direction of the fluid outlet opening 72.

[0058] On the top side of the outer casing 74, a recess 742 is formed in the flow direction S, resulting in the formation of chambers 76. These chambers facilitate the mass transfer of the gaseous fluid through a narrowing connecting channel 77. However, these contractions still possess a sufficient channel cross-section D through which the tube bundle 73 with the heat exchanger tubes 731 passes. Therefore, a row of continuous chambers 76 is arranged in the flow channel 75 along the flow direction S, each chamber increasing the residence time of the gaseous fluid and preventing backflow. Also at the outlet 79, specifically, non-condensable gaseous components are discharged from the cooling system 1.

[0059] Figure 4A schematic view of another side of the cooling system 1 with condenser unit 7 is shown, employing a configuration of a tube bundle finned heat exchanger 73. In this embodiment, the fins act as guide structures 78, guiding the gaseous fluid on one hand and forming multiple chambers 76 through which the gaseous fluid is guided in the flow direction S from the fluid inlet opening 71 to the outlet 79. The bottom surface 741 of the housing 74 is again designed to be inclined relative to the fluid outlet opening 72 to return the condensed liquid fluid to the container 3. In the tube bundle finned heat exchanger 73, the tubes are routed parallel to each other along the length of the housing 74 and connected in series at their ends via tube bends in terms of flow. The guide structures 78, formed as fins, have channel points in the flow direction S as connecting channels 77, so that the gaseous fluid flows substantially axially along the heat exchanger tubes 731. The heat exchanger tubes 731 are preferably designed as straight lines, but may also have other elongated shapes, such as elongated spiral coils.

[0060] List of reference numerals

[0061] 1 Cooling System

[0062] 2 Electronic components

[0063] 3 containers

[0064] 31 Metal Profile Frame

[0065] 4. Heat transfer fluid

[0066] 41 Surface of liquid heat transfer fluid

[0067] 5. Gas Space

[0068] 6. Heat exchanger unit

[0069] 7 Condenser Unit

[0070] 71 Fluid enters the opening

[0071] 710 valve

[0072] 72 Fluid outlet opening

[0073] 720 valve

[0074] 73 Tubes

[0075] 731 heat exchanger tube

[0076] 74. Outer shell

[0077] 741 Bottom surface of the casing

[0078] 742 recess

[0079] 75 Flow Channel

[0080] 76 chambers

[0081] 77 Connection Channel

[0082] 78 Guide Structure

[0083] 79 Exports

[0084] 8 Drying Units

[0085] 9. Collection container, bellows

[0086] 91 Supply lines for collection containers

[0087] 910 Valve for the supply line of the collection container

[0088] 92. Discharge lines for collection containers

[0089] 920 Valve for discharge lines of collection containers

[0090] 10 Vacuum Pumps

[0091] 101 Supply lines for vacuum pumps

[0092] 1010 Valves for vacuum pump supply lines

[0093] 102 Discharge line for vacuum pump

[0094] D Channel Cross Section

[0095] S Flow direction

Claims

1. A cooling system (1) for liquid immersion cooling of electronic components (2), comprising: - A container (3) is filled with a two-phase heat transfer fluid (4), and electronic components (2) are immersed in its liquid phase, wherein, The container (3) has a gas space (5) above the surface (41) of the liquid heat transfer fluid (4). - A heat exchanger device (6) in the gas space (5) of the container (3) for the formation of the liquid heat transfer fluid (4), - At least one condenser unit (7), wherein the condenser unit (7) is in contact with the gas space (5) of the container (3) through at least one fluid inlet opening (71) and at least one fluid outlet opening (72) for mass transfer of gaseous medium to the condenser unit (7) or mass transfer of liquid medium from the condenser unit (7), and the condenser unit (7) has an outlet (79) through which residual gas phase is discharged. Its features are, - In the enclosed housing (74), the condenser unit (7) has a tube bundle (73) in the flow direction (S) after at least one fluid inlet opening (71), the tube bundle having heat exchanger tubes (731) extending parallel to each other in the axial direction, thereby forming a flow channel (75) in the housing (74). - The tube bundle (73) is arranged in the housing (74) such that the gaseous medium flows in the flow channel (75) along the axial direction of the heat exchanger tube (731).

2. The cooling system (1) according to claim 1, characterized in that, The flow channel (75) varies in the flow direction (S) with respect to its channel cross-section (D) for the fluid.

3. The cooling system (1) according to claim 1 or 2, characterized in that, The flow channel (75) has multiple chambers (76) connected by connecting channels (77) with relatively small channel cross-sections (D).

4. The cooling system (1) according to claim 3, characterized in that, In the flow channel (75), a tube bundle (73) with heat exchanger tubes (731) passes through the chamber (76) and the connecting channel (77).

5. The cooling system (1) according to any one of claims 1 to 4, characterized in that, A guiding structure (78) for gaseous fluids is provided.

6. The cooling system (1) according to any one of claims 1 to 5, characterized in that, The condenser unit (7) is arranged inside or outside the container (3).

7. The cooling system (1) according to any one of claims 1 to 6, characterized in that, The condenser unit (7) arranged inside the container (3) is arranged above or next to the heat exchanger device (6) in the gas space (5) of the container (3).

8. The cooling system (1) according to any one of claims 1 to 7, characterized in that, The collection container (9) is arranged to be connected downstream of the outlet (79) of the condenser unit (7), through which the residual gas phase is discharged.

9. The cooling system (1) according to claim 8, characterized in that, A drying unit (8) for separating water vapor from the gas phase is arranged between the outlet (79) and the collection container (9).

10. The cooling system (1) according to any one of claims 1 to 7, characterized in that, A vacuum pump (10) is arranged downstream of the outlet (79) to discharge the residual gas phase.

11. The cooling system (1) according to any one of claims 1 to 10, characterized in that, The heat exchanger unit (6) and the condenser unit (7) have a common supply unit for a first single-phase heat carrier medium for cooling.

12. The cooling system (1) according to any one of claims 1 to 10, characterized in that, The condenser unit (7) has a second supply unit for a second single-phase heat carrier medium for cooling.

13. The cooling system (1) according to any one of claims 1 to 10, characterized in that, The condenser unit (7) is designed to operate at a lower temperature with a single-phase heat transfer medium for cooling, compared to the heat exchanger unit (6).

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