Heat dissipation structure and electronic device including same

By introducing a fan structure and a multi-exhaust port design into the head-mounted display device, the heat management problem caused by miniaturization and functional integration was solved, achieving convective heat management and ensuring the normal operation of the device.

CN121220192APending Publication Date: 2025-12-26SAMSUNG ELECTRONICS CO LTD
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Patent Information

Application Number
CN202480036405.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-10-16
Filing Date
2024-06-03
Publication Date
2025-12-26

AI Technical Summary

Technical Problem

With the miniaturization and increasing functional integration of electronic devices, thermal management has become a challenge, especially in head-mounted displays, where existing technologies struggle to effectively address the heat dissipation issues.

Method used

It adopts a fan structure and multiple exhaust port design, including a first exhaust port located near the printed circuit board to dissipate heat generated by the heat source, and a second exhaust port in contact with the display panel to dissipate heat generated by the display, and exhausts the heat to the outside of the device through convection.

Benefits of technology

Effectively manage the heat inside the head-mounted display device to ensure its normal operation and prevent performance degradation or malfunction due to heat accumulation.

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Abstract

A head-mounted display device, according to one embodiment of the present disclosure, may include: a housing; a printed circuit board positioned inside the housing and including a heat source; at least one display positioned inside the housing; at least one display panel supporting the display; and at least one fan structure that causes convection so as to discharge heat generated inside the head-mounted display device to the outside of the head-mounted display device, and includes a plurality of exhaust ports. The plurality of exhaust ports may include a first exhaust port disposed adjacent to the printed circuit board and configured to dissipate heat generated by the heat source, and a second exhaust port in contact with a portion of the display panel and configured to dissipate heat that has been generated by the display and transferred to the display panel. Various other embodiments are possible.
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Description

TECHNICAL FIELD

[0001] Embodiments disclosed herein relate to a heat dissipation structure and an electronic device including the same. BACKGROUND

[0002] Due to significant development of information communication technology and semiconductor technology, the popularity and use of various electronic devices are rapidly increasing. In particular, recently, electronic devices that enable users to communicate with each other while carrying the electronic devices are being developed.

[0003] An electronic device can refer to a device (e.g., an electronic diary, a portable multimedia reproducer, a mobile communication terminal, a tablet PC, an image / sound device, a desktop / laptop PC, or a vehicle navigation system, and a home appliance) that performs a specific function according to a program provided therein. For example, these electronic devices can output information stored therein as a sound or an image. With an increase in the integration of electronic devices and the popularization of ultra-high speed and high capacity wireless communication, recently, various functions can be installed in a single electronic device, such as a mobile communication terminal. For example, in addition to a communication function, an entertainment function such as a game, a multimedia function such as music / video playback, a communication and security function for mobile banking, and a function such as schedule management or an electronic wallet are integrated into a single electronic device. These electronic devices are experiencing miniaturization to facilitate user portability.

[0004] The foregoing information can be provided for the purpose of helping to understand the present disclosure. It is not admitted that any of the foregoing information constitutes prior art in relation to the present disclosure, by virtue of its inclusion herein. SUMMARY

[0005] [TECHNICAL SOLUTION] A head-mounted display device according to an embodiment of the disclosure can include a housing, a printed circuit board located inside the housing and including at least one heat source, at least one display located inside the housing, at least one display panel configured to support the display, and at least one fan structure including a fan and a plurality of exhaust ports and configured to guide heat generated inside the head-mounted display device to be discharged to the outside of the head-mounted display device. The plurality of exhaust ports can include a first exhaust port disposed adjacent to the printed circuit board and configured to dissipate heat generated from the heat source, and a second exhaust port disposed in contact with a portion of the display panel and configured to dissipate heat generated from the display and transferred to the display panel.

[0006] An electronic device according to an embodiment of the disclosure can include a housing, a printed circuit board located inside the housing and including at least one heat source, at least one display located inside the housing, at least one display plate configured to support the display, and at least one fan structure including a fan and a plurality of exhaust ports and configured to cause a convection so that heat generated inside the electronic device can be discharged to the outside of the electronic device. The plurality of exhaust ports can include a first exhaust port disposed adjacent to the printed circuit board and configured to dissipate heat generated from the heat source, and a second exhaust port disposed in contact with a portion of the display plate and configured to dissipate heat generated from the display and transferred to the display plate. The plurality of exhaust ports can include at least one column. BRIEF DESCRIPTION OF DRAWINGS

[0007] The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following detailed description, taken in conjunction with the accompanying drawings, in which: Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment of the disclosure.

[0008] Figure 2 is a perspective view of a wearable electronic device according to an embodiment of the disclosure.

[0009] Figure 3 is a perspective view illustrating an internal configuration of a wearable electronic device according to an embodiment of the disclosure.

[0010] Figure 4 is an exploded perspective view of a wearable electronic device according to an embodiment of the disclosure.

[0011] Figure 5 is a view illustrating an inside of an electronic device according to an embodiment of the disclosure.

[0012] Figure 6a and Figure 6b is a perspective view illustrating some internal components of an electronic device according to an embodiment of the disclosure, viewed from a front side.

[0013] Figure 7a , Figure 7b and Figure 7c is a perspective view illustrating some internal components of an electronic device according to an embodiment of the disclosure, viewed from a rear side.

[0014] Figure 8a , Figure 8b and Figure 8c are views illustrating a display plate according to various embodiments disclosed herein.

[0015] Figure 9is a side view illustrating some internal components of an electronic device according to embodiments disclosed herein, viewed in the direction of the X axis.

[0016] Figure 10 is a view illustrating a fan structure according to embodiments disclosed herein.

[0017] Figure 11a 、 Figure 11b 、 Figure 11c 、 Figure 11d 、 Figure 11e and Figure 11f is a view illustrating a coupling relationship between a fan structure and a display panel according to embodiments disclosed herein.

[0018] Figure 12a 、 12b and 12c are views illustrating a fan structure including a plurality of pillars according to embodiments disclosed herein.

[0019] Figure 13 is a view illustrating an electronic device including a small fan structure according to embodiments disclosed herein.

[0020] Figure 14a is a view illustrating a front side of a wearable electronic device according to embodiments of the disclosure.

[0021] Figure 14b is a view illustrating a rear side of a wearable electronic device according to embodiments of the disclosure. DETAILED DESCRIPTION

[0022] An electronic device according to various embodiments can be one of various types of electronic devices. The electronic devices can include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.

[0023] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish the respective component from another component and do not limit the component in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0024] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0025] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0026] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0027] Reference Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

[0028] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the result data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0029] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0030] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0031] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0032] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0033] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0034] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0035] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0036] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0037] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0038] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0040] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0041] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0042] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0043] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0044] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0045] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0046] According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0047] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0048] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0049] According to embodiments, each external electronic device (e.g., electronic device 102, electronic device 104, or server 108) may be a device of the same or different type as electronic device 101. According to embodiments, all or some of the operations performed on electronic device 101 may be performed using one or more external electronic devices (e.g., electronic device 102, electronic device 104, or server 108). For example, when electronic device 101 wishes to perform a function or service automatically or in response to a request from a user or another device, electronic device 101 may request one or more external electronic devices to perform at least a portion of the function or service without performing it itself, or electronic device 101 may request one or more external electronic devices to perform at least a portion of the function or service in addition to performing it itself. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service or additional functions or services associated with the request, and may transmit the result of the performance to electronic device 101. Electronic device 101 may provide at least a portion of the response to the request as is or after further processing. For example, an external electronic device (e.g., electronic device 102, electronic device 104, or server 108) can transmit content data executed by the application to electronic device 101 after rendering, and electronic device 101, upon receiving the data, can output the content data to the display module. When electronic device 101 detects user motion via an IMU sensor or the like, the processor of electronic device 101 can correct the rendering data received from the external electronic device (e.g., electronic device 102, electronic device 104, or server 108) based on information about the motion, and can output the corrected rendering data to the display module. Information about the motion can be transmitted to the external electronic device (e.g., electronic device 102, electronic device 104, or server 108) to request rendering so that the screen data is updated accordingly. According to embodiments, the external electronic device (e.g., electronic device 102, electronic device 104, or server 108) can be various types of devices, such as a smartphone or a housing device capable of storing and charging electronic device 101.

[0050] Figure 2 This is a perspective view of a wearable electronic device 200 according to an embodiment disclosed herein.

[0051] refer to Figure 2 Wearable electronic device 200 is an eyeglass-type electronic device (e.g., Figure 1 The wearable electronic device 200 (101) allows the user to visually identify surrounding objects or the environment while wearing it. For example, the wearable electronic device 200 may include a head-mounted device (HMD) or smart glasses that can provide an image directly in front of the user's eyes. Figure 2All or some components of the wearable electronic device 200 can be connected to Figure 1 The components of the electronic device 101 are the same.

[0052] According to an embodiment, the wearable electronic device 200 may include a housing 210 defining the external appearance of the wearable electronic device 200. The housing 210 may provide space in which components of the wearable electronic device 200 can be disposed. For example, the housing 210 may include a frame 202 and at least one wearable member 203.

[0053] According to an embodiment, the wearable electronic device 200 may include one or more display components 201 disposed within the housing 210 and capable of outputting visual images. For example, the wearable electronic device 200 may include one or more display components 201 capable of providing visual information (or images) to a user. For example, the display component 201 may include a lens, a display, a waveguide, and / or a module equipped with touch circuitry. According to an embodiment, the display component 201 may be transparent or translucent. According to an embodiment, the display component 201 may include glass made of a translucent material, or a window component whose light transmittance is adjustable according to its own color density.

[0054] According to an embodiment, the frame 202 may accommodate at least a portion of the display member 201. For example, the frame 202 may surround at least a portion of the edge of the display member 201. According to an embodiment, the frame 202 may position at least one of the display members 201 corresponding to a user's eye. According to an embodiment, the frame 202 may be the rim of a general eyeglass structure. According to an embodiment, the frame 202 may include at least one closed curve surrounding the display member 201. According to an embodiment, the frame 202 may include a first end 202c and a second end 202d opposite to the first end 202c. The first end 202c may be disposed adjacent to the first wearing member 203a, and the second end 202d may be disposed adjacent to the second wearing member 203b.

[0055] According to an embodiment, wearable member 203 may extend from frame 202. For example, wearable member 203 may each extend from an end of frame 202 and may be supported or positioned together with frame 202 on the user's body (e.g., ear). According to an embodiment, wearable member 203 may each be rotatably coupled to frame 202 via hinge structure 229. According to an embodiment, wearable member 203 may each include an inner surface 231c configured to face the user's body and an outer surface 231d opposite to the inner surface 231c. According to an embodiment (not shown), wearable member 203 may be at least partially made of a flexible material (e.g., rubber). For example, wearable member 203 may have a band shape surrounding at least a portion of the user's body (e.g., ear).

[0056] According to an embodiment, the wearable electronic device 200 may include a hinge structure 229 configured to allow the wearable member 203 to fold relative to the frame 202. The hinge structure 229 may be disposed between the frame 202 and the wearable member 203. When the wearable electronic device 200 is not worn, a user can carry or store the wearable electronic device 200 with the wearable member 203 folded to partially overlap with the frame 202. According to an embodiment, the hinge structure 229 may include a first hinge structure 229a and a second hinge structure 229b, the first hinge structure 229a being connected to a portion of the frame 202 (e.g., a first end 202c) and the first wearable member 203a, and the second hinge structure 229b being connected to a portion of the frame 202 (e.g., a second end 202d) and the second wearable member 203b.

[0057] According to an embodiment, the first hinge structure 229a and the second hinge structure 229b can be configured to be spaced apart from the display member 201 by a predetermined distance in the Y-axis direction. The hinge connection structure 230 may include the first hinge connection structure 230a and the second hinge connection structure 230b. The first hinge structure 229a can be fixed to the frame 202 via the first hinge connection structure 230a, and the second hinge structure 229b can be fixed to the frame 202 via the second hinge connection structure 230b.

[0058] Figure 3 This is a perspective view showing the internal structure of a wearable electronic device 200 in an assembled state according to an embodiment disclosed herein.

[0059] Figure 4 This is an exploded perspective view of a wearable electronic device 200 according to an embodiment disclosed herein.

[0060] Figure 3 and / or Figure 4 The display component 201, frame 202, wearable component 203, and hinge structure 229 can be constructed in conjunction with... Figure 2 The display component 201, the frame 202, the wearable component 203, and the hinge structure 229 are completely or partially identical in construction.

[0061] refer to Figure 3 and Figure 4 The wearable electronic device 200 may include one or more display components 201, a frame 202, one or more wearable components 203, one or more hinge structures 229, one or more circuit boards 241, one or more batteries 243, one or more power transmission structures 246, one or more camera modules 250 and / or one or more sensor modules 280.

[0062] According to an embodiment, the wearable electronic device 200 can be powered by a camera module 250 (e.g., Figure 1 The camera module 180 in the device acquires and / or identifies visual images of objects or the environment in the direction (e.g., the -Y direction) that the user is looking at or that the wearable electronics 200 is pointing towards, and can transmit these images via a network (e.g., Figure 1 The first network 198 or the second network 199 in the network receives data from an external electronic device (e.g., Figure 1 Electronic device 102 or 104 or Figure 1 The wearable electronic device 200 receives information about an object or environment from a server 108. In an embodiment, the wearable electronic device 200 may provide the received information about the object or environment to the user in an acoustic or visual form. The wearable electronic device 200 may use a display module (e.g., Figure 1 The display module 160 in the device provides the user with received information about an object or environment in a visual form via the display component 201. For example, the wearable electronic device 200 can realize augmented reality by visually displaying information about an object or environment and combining the visually displayed information with an actual image of the user's surrounding environment.

[0063] According to an embodiment, when the wearable electronic device 200 is worn on a user's body, the display components 201 can be provided as a pair and configured to correspond to the user's left and right eyes, respectively. For example, the display components 201 may include a first display component 201a and a second display component 201b spaced apart from the first display component 201a. The first display component 201a may correspond to the user's right eye, and the second display component 201b may correspond to the user's left eye.

[0064] According to an embodiment, each display component 201 may include a first surface F1 oriented in the direction of external light incidence (e.g., in the -Y direction) and a second surface F2 oriented in the opposite direction to the first surface F1 (e.g., in the +Y direction). When the user is wearing the wearable electronic device 200, at least a portion of the light or image incident through the first surface F1 can pass through the second surface F2 of the display component 201, which is configured to face the user's left and / or right eyes, and enter the user's left and / or right eyes.

[0065] According to an embodiment, the eyeglass frame 202 may include at least two or more frames. For example, the eyeglass frame 202 may include a first frame 202a and a second frame 202b. According to an embodiment, when a user wears the wearable electronic device 200, the first frame 202a may be the frame of the portion facing the user's face, and the second frame 202b may be the portion of the eyeglass frame 202 spaced apart from the first frame 202a in the user's gaze direction (e.g., the -Y direction).

[0066] According to embodiments, the wearable electronic device 200 may include one or more light output modules 211 configured to provide images and / or video to a user. For example, a light output module 211 may include a display panel (not shown) capable of outputting images, and a lens (not shown) corresponding to the user's eye and configured to guide the image to the display member 201. For example, a user can obtain an image output from the display panel of the light output module 211 through the lens of the light output module 211. According to various embodiments, each light output module 211 may each include means configured to display various information. For example, each light output module 211 may each include at least one of a liquid crystal display (LCD), a digital mirror device (DMD), a liquid crystal on silicon (LCoS), a silicon-based light-emitting diode (LED)-(LEDoS), an organic light-emitting diode (OLED), or a micro-light-emitting diode (micro-LED). According to an embodiment, when the light output module 211 and / or the display component 201 each include a liquid crystal display device, a digital mirror display device, or a liquid crystal on silicon (LCoS) display device, the wearable electronic device 200 may include a light source configured to emit light to the display area of ​​the light output module 211 and / or the display component 201. According to an embodiment, when the light output module 211 and / or the display component 201 each include an organic light-emitting diode or a micro LED, the wearable electronic device 200 can provide virtual images to the user without a separate light source.

[0067] According to an embodiment, the light output module 211 may be at least partially disposed inside the housing 210. For example, the light output module 211 may be connected to the display member 201 and may provide an image to the user via the display member 201. For example, an image output from the light output module 211 may be incident on the display member 201 via an input optical member (not shown) located at one end of the display member 201, and may be emitted to the user's eye via a waveguide (not shown) and an output optical member (not shown), each of which is located in at least a portion of the corresponding display member in the display member 201.

[0068] According to embodiments of this disclosure, each of the display components 201 may include an optical waveguide (e.g., a waveguide). According to embodiments of this disclosure, an output image of the optical output module 211 incident on one end of an optical waveguide can propagate within the optical waveguide and be provided to a user. According to embodiments of this disclosure, each optical waveguide may include at least one of a diffractive optical element (DOE), a holographic optical element (HOE), or a reflective element (e.g., a mirror). For example, the optical waveguide may guide the image output from the optical output module 211 to the user's eye by each including at least one of a diffractive optical element, a holographic optical element, or a reflective element (e.g., a mirror).

[0069] According to an embodiment, the wearable electronic device 200 may include circuit boards 241, each circuit board housing components for driving the wearable electronic device 200 (e.g., printed circuit board (PCB), printed board assembly (PBA), FPCB (flexible PCB), or rigid-flexible PCB (RFPCB)). For example, each circuit board 241 may each include at least one integrated circuit chip, and a processor (not shown) may be provided in the integrated circuit chip (e.g., Figure 1 The processor 120 and memory (not shown) are shown in the image. Figure 1 The memory 130 in the middle), power management module (not shown) (e.g., Figure 1 The power management module 188) or communication module (e.g., Figure 1 At least one of the communication modules 190 in the housing 210. According to an embodiment, the circuit board 241 may be disposed in the wearable member 203 of the housing 210. For example, the circuit board 241 may include a first circuit board 241a disposed within the first wearable member 203a and a second circuit board 241b disposed within the second wearable member 203b. According to an embodiment, the communication module (e.g., Figure 1 The communication module 190 in the first wearable component 203a can be disposed on the first circuit board 241a located within the first wearable component 203a, and the processor (e.g., Figure 1 The processor 120 in the second wearable member 203b can be disposed on a second circuit board 241b located within the second wearable member 203b. According to an embodiment, the circuit board 241b can be electrically connected to the battery 243 (e.g., via a power transmission structure 246). Figure 1 (Battery 189 in the middle). According to an embodiment, each of the circuit boards 241 may include an inner insert board.

[0070] According to an embodiment, the battery 243 can be electrically connected to components of the wearable electronic device 200 (e.g., light output module 211, circuit board 241, speaker module 245, microphone module 247 and / or camera module 250) and can supply power to the components of the wearable electronic device 200.

[0071] According to an embodiment, the batteries 243 may be at least partially disposed within the wearable member 203. According to an embodiment, the batteries 243 may include a first battery 243a disposed within the first wearable member 203a and a second battery 243b disposed within the second wearable member 203b. According to an embodiment, the batteries 243 may be disposed adjacent to the ends 203c and 203d of the wearable member 203, respectively.

[0072] According to one embodiment, speaker module 245 (e.g., Figure 1 The audio module 170 or sound output module 155 can convert electrical signals into sound. The speaker module 245 may be at least partially disposed within the wearable member 203 of the housing 210. According to an embodiment, the speaker module 245 may be located within the wearable member 203 to correspond to the user's ear. According to an embodiment (e.g., Figure 3 The speaker modules 245 can be respectively disposed next to the circuit board 241. For example, the speaker modules 245 can be respectively disposed between the circuit board 241 and the battery 243. According to an embodiment (not shown), the speaker modules 245 can be respectively disposed on the circuit board 241. For example, the speaker modules 245 can be respectively disposed on the circuit board 241 and the inner shell (e.g., Figure 4 Between the inner shell 231).

[0073] According to embodiments, the wearable electronic device 200 may include a power transmission structure 246 configured to transmit power from the battery 243 to electronic components of the wearable electronic device 200 (e.g., an optical output module 211). For example, the power transmission structure 246 may be electrically connected to the battery 243 and / or a circuit board 241, and the circuit board 241 may transmit power received via the power transmission structure 246 to the optical output module 211. According to embodiments, the power transmission structure 246 may have a configuration capable of transmitting power. For example, each of the power transmission structures 246 may include a flexible printed circuit board or wires. For example, the wires may include multiple cables (not shown). In various embodiments, the shape of the power transmission structure 246 may be modified differently depending on the number and / or type of cables.

[0074] According to an embodiment, microphone module 247 (e.g., Figure 1The input module 150 and / or audio module 170 in the wearable electronics 200 can convert sound into electrical signals. According to an embodiment, a microphone module 247 can be placed within the frame 202. For example, at least one microphone module 247 can be located at the lower end (e.g., in the -X-axis direction) and / or the upper end (e.g., in the +X-axis direction) of the wearable electronics 200. According to an embodiment, the wearable electronics 200 can more clearly distinguish a user's voice by using speech information (e.g., sound) acquired from one or more microphone modules 247. For example, the wearable electronics 200 can distinguish speech information from ambient noise based on the acquired speech information and / or additional information (e.g., low-frequency vibrations of the user's skin and bones). For example, the wearable electronics 200 can clearly distinguish a user's voice and can perform functions that reduce ambient noise (e.g., noise cancellation).

[0075] According to an embodiment, camera module 250 can capture still images and / or video images. Camera module 250 may each include at least one of a lens, at least one image sensor, an image signal processor, or a flash. According to one embodiment, camera module 250 may be disposed in frame 202 and surrounding display member 201.

[0076] According to an embodiment, each camera module 250 may include at least one first camera module 251. According to an embodiment, the first camera module 251 may capture the trajectory of a user's eye (e.g., pupil) or gaze. For example, the first camera module 251 may include a light-emitting unit (e.g., IR LED) (not shown) configured to emit light in the infrared band, and a camera structure (not shown) configured to image the reflected pattern of light emitted by the light-emitting unit to the user's eye. According to an embodiment, in order to make the virtual image projected onto the display member 201 correspond to the direction of the user's pupil gaze, the processor (e.g., ... Figure 1 The processor 120 in the image can adjust the position of the virtual image. According to an embodiment, the trajectory of a user's eye or gaze can be tracked by using multiple first camera modules 251 with the same standards and performance.

[0077] According to an embodiment, each camera module 250 may include a second camera module 253. According to an embodiment, the second camera module 253 can capture external images. According to an embodiment, the second camera module 253 can capture external images via a second optical aperture 223 provided in the second frame 202b. For example, the second camera module 253 may include a high-resolution color camera, and may be a high-resolution (HR) camera or a photo-video (PV) camera. According to an embodiment, the second camera module 253 may provide autofocus (AF) functionality and optical image stabilization (OIS) functionality.

[0078] According to an embodiment (not shown), the wearable electronic device 200 may include a flash (not shown) located near the second camera module 253. For example, the flash (not shown) may provide light when acquiring external images of the second camera module 253 to increase the brightness (e.g., illuminance) around the wearable electronic device 200 and may reduce the difficulty of acquiring images due to dark environments, the mixing of various light sources and / or light reflections.

[0079] According to an embodiment, each camera module 250 may include at least one third camera module 255. According to an embodiment, the third camera module 255 may capture user movement via a first optical aperture 221 provided in the frame 202. For example, the third camera module 255 may capture user gestures (e.g., hand movements). The third camera module 255 and / or the first optical aperture 221 may be correspondingly positioned at opposite ends of the frame 202 (e.g., the second frame 202b) in the Z direction. According to an embodiment, the third camera module 255 may include a global shutter (GS) type camera. For example, the third camera module 255 may utilize a camera supporting 3 degrees of freedom (3DoF) or 6DoF to provide 360-degree spatial (e.g., omnidirectional) orientation recognition and / or motion recognition. According to an embodiment, the third camera module 255 may perform simultaneous localization and mapping (SLAM) and user gesture recognition by using multiple global shutter type cameras with the same standards and performance as stereo cameras. According to an embodiment, the third camera module 255 may include an infrared (IR) camera (e.g., a time-of-flight (TOF) camera or a structured light camera). For example, the IR camera may serve as a sensor module configured to detect the distance to an object (e.g., Figure 1 It operates by at least a portion of the sensor module 176 in the sensor module.

[0080] According to an embodiment, at least one of the first camera module 251 and the third camera module 255 may be a sensor module (e.g., Figure 1 The sensor module 176 is replaced by the sensor module in the image. For example, the sensor module may include at least one of a vertical-cavity surface-emitting laser (VCSEL), an infrared sensor, and / or a photodiode. For example, the photodiode may include a positive intrinsically negative (PIN) photodiode or an avalanche photodiode (APD). The photodiode can be interpreted as a photodetector or a photoelectric sensor.

[0081] According to embodiments, at least one of the first camera module 251, the second camera module 253, or the third camera module 255 may include multiple camera modules (not shown). For example, the second camera module 253 may each include multiple lenses (e.g., wide-angle lenses and telephoto lenses) and an image sensor, and may be disposed on a surface of the wearable electronics 200 (e.g., a surface oriented in the -Y-axis direction). For example, the wearable electronics 200 may include multiple camera modules that have different attributes (e.g., viewing angles) or functions, and the camera modules may be controlled to change their viewing angles based on user selection and / or trajectory information. For example, at least one of the multiple camera modules may be a wide-angle camera, and at least another of the camera modules may be a telephoto camera.

[0082] According to an embodiment, the processor (e.g., Figure 1 The processor 120 in the middle can be used by using a sensor module (e.g., Figure 1 The wearable electronic device 200 is determined by acquiring information from at least one of the gesture sensor, gyroscope sensor, or accelerometer sensor in the sensor module 176, and by using the user's movement (e.g., the user's body approaching the wearable electronic device 200) acquired using the third camera module 255, and / or the user's gestures. According to embodiments, in addition to the sensors described above, the wearable electronic device 200 may include: a magnetic (geomagnetic) sensor capable of measuring azimuth using magnetic fields and magnetic lines of force, and / or a Hall sensor capable of acquiring movement information (e.g., direction of movement or distance of movement) using the strength of a magnetic field. For example, the processor may determine the movement of the wearable electronic device 200 and / or the user's movement based on information acquired from the magnetic (geomagnetic) sensor and / or the Hall sensor.

[0083] According to an embodiment (not shown), the wearable electronic device 200 can perform input functions (e.g., touch and / or pressure detection functions) capable of interacting with a user. For example, components configured to perform touch and / or pressure detection functions (e.g., touch sensors and / or pressure sensors) can be disposed on at least a portion of the wearable member 203. The wearable electronic device 200 can control a virtual image output through the display member 201 based on information acquired via the components. For example, sensors associated with the touch and / or pressure detection functions can be configured as various types, such as resistive, capacitive, electromagnetic (EM), or optical. According to an embodiment, all or some of the components configured to perform touch detection and / or pressure detection functions can be connected to... Figure 1 The components of input module 150 are the same.

[0084] According to an embodiment, the wearable electronic device 200 may include a reinforcing member 260 disposed in the interior space of the frame 202 and configured to have a higher stiffness than the frame 202.

[0085] According to an embodiment, the wearable electronic device 200 may include a lens structure 273. The lens structure 273 may refract at least a portion of light. For example, the lens structure 273 may be a prescription lens with a specified refractive power. According to an embodiment, the lens structure 273 may be at least partially disposed behind the display member 201 (e.g., in the +Y direction). For example, the lens structure 273 may be located between the display member 201 and the user's eye.

[0086] According to an embodiment, housing 210 may include hinge covers 227 capable of separately concealing portions of hinge structure 229. Other portions of hinge structure 229 may be accommodated or concealed between inner cover 231 and outer cover 233, as will be described later.

[0087] According to an embodiment, the wearable component 203 may each include an inner cover 231 and an outer cover 233. For example, the inner cover 231 is configured to face or be in direct contact with the user's body and may be made of a material with low thermal conductivity, such as a synthetic resin. According to an embodiment, the inner cover 231 may each include an inner surface facing the user's body (e.g., Figure 2 The inner surface 231c of the inner cover 231. For example, each of the outer covers 233 may at least partially comprise a material capable of conducting heat (e.g., a metallic material) and may be coupled to face the inner cover 231. According to an embodiment, each of the outer covers 233 may include an outer surface opposite to the inner surface 231c (e.g., an outer surface 231c). Figure 2 The outer surface 231d of the circuit board 241 or the speaker module 245 may be housed within the wearable member 203 in a space separate from the battery 243. In the illustrated embodiment, the inner cover 231 may include a first cover 231a accommodating the circuit board 241 and / or the speaker module 245 and a second cover 231b accommodating the battery 243, and the outer cover 233 may include a third cover 233a coupled to face the first cover 231a and a fourth cover 233b coupled to face the second cover 231b. For example, the first cover 231a and the third cover 233a (hereinafter referred to as "first cover units 231a and 233a") may be coupled to accommodate the circuit board 241 and / or the speaker module 245, and the second cover 231b and the fourth cover 233b (hereinafter referred to as "second cover units 231b and 233b") may be coupled to accommodate the battery 243.

[0088] According to an embodiment, first cover units 231a and 233a can be rotatably connected to the frame 202 via hinge structure 229, and second cover units 231b and 233b can be connected to or mounted on the ends of the first cover units 231a and 233a via connecting structure 235. According to an embodiment, the portion of the connecting structure 235 that contacts the user's body can be made of a material with low thermal conductivity (e.g., an elastic material such as silicone, polyurethane, or rubber), and the portion that does not contact the user's body can be made of a material with high thermal conductivity (e.g., a metallic material). For example, when heat is generated from the circuit board 241 or the battery 243, the connecting structure 235 prevents heat transfer to the portion that contacts the user's body and can dissipate or release heat through the portion that does not contact the user's body. According to an embodiment, the portion of the connecting member 235 that contacts the user's body can be interpreted as part of the inner cover 231, and the portion of the connecting member 235 that does not contact the user's body can be interpreted as part of the outer cover 233. According to an embodiment (not shown), each first cover 231a and each second cover 231b can be constructed as a single unit without the connecting structure 235, and each third cover 233a and each fourth cover 233b can be constructed as a single unit without the connecting structure 235. According to the embodiment, in addition to the components shown, other components (e.g., Figure 1 Antenna module 197), and can be used by using a communication module (e.g., Figure 1 The communication module 190 in the middle) is connected via a network (e.g., Figure 1 The first network 198 or the second network 199 in the network receives data from an external electronic device (e.g., Figure 1 Electronic device 102 or 104 or Figure 1 The server 108 in the middle receives information about objects or the environment.

[0089] According to an embodiment, the frame 202 may include a connecting portion 274 between the first display member 201a and the second display member 201b. For example, the connecting portion 274 may be interpreted as a portion corresponding to the nose pads of the glasses.

[0090] According to an embodiment, the wearable electronic device 200 may include a connection member 205. According to an embodiment, a circuit board 241 may be connected to the connection member 205, and electrical signals may be transmitted via the connection member 205 to components of the wearable electronic device 200 (e.g., light output module 211 and / or camera module 250). For example, from a processor located on the circuit board 241 (e.g., ...). Figure 1Control signals transmitted by the processor 120 can be transmitted to electronic components using at least a portion of the connection member 205. For example, at least a portion of the connection member 205 may include wires (not shown) electrically connected to components of the wearable electronic device 200.

[0091] According to an embodiment, the connecting member 205 may include a first connecting member 205a at least partially disposed in the first wearing member 203a and a second connecting member 205b at least partially disposed in the second wearing member 203b. According to an embodiment, the first connecting member 321 and / or the second connecting member 322 may at least partially face the hinge structure 229. For example, the first connecting member 205a may extend across the hinge structure 229 from the first circuit board 241a to the interior of the frame 202. The second connecting member 205b may extend across the hinge structure 229 from the second circuit board 241b to the interior of the frame 202. For example, a portion of the first connecting member 205a and a portion of the second connecting member 205b may be disposed within the wearing member 203, and other portions may be disposed within the frame 202.

[0092] According to an embodiment, the first connecting member 205a and the second connecting member 205b may each include a rotatably foldable or deployable structure based on the hinge structure 229. For example, the first connecting member 205a and / or the second connecting member 205b may include a flexible printed circuit board (FPCB). According to an embodiment, the first connecting member 205a may be electrically and / or mechanically connected to the first circuit board 241a. According to an embodiment, the second connecting member 205b may be electrically and / or mechanically connected to the second circuit board 241b. According to an embodiment, the first connecting member 205a and / or the second connecting member 205b may include structures for transmitting signals (e.g., wires and / or cables).

[0093] According to an embodiment, sensor module 280 (e.g., Figure 1The sensor module 276 can detect light passing through the display member 201. According to an embodiment, the sensor module 280 may include a first sensor module 281 capable of detecting light passing through the first display member 201a and a second sensor module 282 capable of detecting light passing through the second display member 201b. For example, the first sensor module 281 can detect light at the rear side (e.g., in the +Y direction) of the first display member 201a, and the second sensor module 282 can detect light at the rear side of the second display member 201b. According to an embodiment, the sensor module 280 may include a third sensor module 283 capable of detecting light at the front side (e.g., in the -Y direction) of the display member 201. For example, the third sensor module 283 can detect light at the front side (e.g., in the -Y direction) of the display member 201. According to an embodiment, the sensor module 280 may be an illuminance sensor. According to an embodiment, the configuration of the third sensor module 283 may be partially or entirely the same as the configuration of the second camera module 253.

[0094] Figure 5 This is a view showing the interior of an electronic device 300 according to an embodiment disclosed herein. Figure 6a This is a perspective view showing some internal components of an electronic device 300 according to an embodiment disclosed herein. Figure 6b This is a rear view showing some internal components of an electronic device 300 according to an embodiment disclosed herein. Figure 7a , Figure 7b and Figure 7c This is a perspective view showing some internal components of an electronic device 300 according to an embodiment disclosed herein.

[0095] refer to Figure 5 to Figure 7b The electronic device 300 may include a housing 301, a printed circuit board 310, at least one display 320, at least one display panel 330, and at least one fan structure 340. Figure 5 to Figure 7b Some or all of the components of the electronic device 300 can be with Figure 2 to Figure 4 The components are the same as those of the wearable electronic device 200. Figure 5 to Figure 7b The components in can be selectively coupled with Figure 2 to Figure 4 The combination of components in.

[0096] According to an embodiment, electronic device 300 may be a wearable electronic device provided in a form that can be worn on the human body. Examples of wearable electronic devices include head-mounted display devices (e.g., head-mounted devices (HMDs), smart glasses, smartwatches or wristbands, contact lens devices, ring devices, shoe-type devices, clothing-type devices, glove-type devices, etc.), and may have various forms that can be detached from or attached to a part of the human body or clothing. Wearable electronic devices are worn directly on the human body, thereby improving portability and user accessibility. Wearable electronic devices may be, for example, head-mounted display devices or head-mounted devices (HMDs) that can be mounted, for example, on the head or ears of a wearer. Head-mounted displays or head-mounted devices (HMDs) can generally be classified into see-through types that provide augmented reality (AR) and see-closed types that provide virtual reality (VR). Electronic device 300 according to the embodiment will be described in the context of head-mounted display devices (HMDs). However, the term "electronic device" can be broadly interpreted as other electronic devices.

[0097] According to an embodiment, a head-mounted display device (HMD) can be mounted on any part of the human body (e.g., the head) and can be used to display images. For example, the head-mounted display device can be configured in the shape of goggles or glasses. The head-mounted display device can have a display 320 configured to output images located at positions facing the user's eyes.

[0098] According to an embodiment, the printed circuit board 310 may be equipped with a processor, memory, and / or an interface. The processor may include one or more of, for example, a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. According to an embodiment, the printed circuit board 310 may include a flexible printed circuit board type radio frequency cable (FRC). For example, the printed circuit board 310 may be electrically connected to an antenna module (e.g., Figure 1 Antenna module 197) and communication module (e.g., Figure 1 (Communication module 190 in the middle).

[0099] According to an embodiment, it includes at least one heat source (e.g., Figure 7a to Figure 7cThe printed circuit board 310 (heat source 311) includes a flexible circuit board and / or a main circuit board connected to the display 320. Multiple electrical components can be placed on the printed circuit board 310. Some of these electrical components are heat sources 311 that generate heat, and may be one or more chips placed on the printed circuit board 310. For example, a display driver integrated circuit (DDI) can be placed on the flexible circuit board. As another example, at least one of a power management integrated circuit (PMIC), a power amplifier (PAM), an application processor (AP), a communication processor (CP), and a charger integrated circuit (IC) can be disposed on the main circuit board. Heat generated from at least one heat source 311 may cause malfunction and performance degradation of the electronic device.

[0100] According to an embodiment, the heat source 311 may be located at the center of the housing 301 relative to the Z-axis. For example, relative to the Z-axis, the heat source 311 may be located at the first display member 302a arranged corresponding to the user's left eye (e.g., Figure 4 The first display component 201a) and the second display component 302b (e.g., arranged corresponding to the user's right eye) are arranged in a way that is mutually exclusive. Figure 4 Between the second display component 201b in the first display component 302a. For example, with respect to the Z-axis, the heat source 311 may be located between the first display component 302a (e.g., Figure 4 The first display 320a is arranged corresponding to the first display component 201a) and the second display component 302b is arranged corresponding to the second display component 302b (e.g., Figure 4 The second display component 201b is arranged between the second displays 320b corresponding to the first display component 201b, and the second display component will be described later. However, the location and arrangement of the heat source 311 are not limited to the above embodiment and can be changed in various ways in design.

[0101] According to embodiments, a heat sink 312 (e.g., a vapor chamber, hot plate, heat spreader, or metal shield) may be disposed adjacent to a heat source 311. According to embodiments, heat dissipation components (such as heat pipes, heat sinks, heat dissipation pins, heat pipes, or heat dissipation pins) may be positioned in contact with the heat source 311 without requiring a separate heat sink. The heat sink 312 may be a heat transfer structure configured to dissipate and / or transfer heat from the heat source 311 to the exterior of the electronic device 300. For example, the heat sink 312 may be a heat transfer structure configured to diffuse heat from the heat source 311 to other areas of the electronic device 300. For example, the heat sink 312 may be a heat transfer structure configured to diffuse heat from the heat source 311 to a heat sink 360 of the electronic device 300. The heat sink 312 may be made of a metallic material with high thermal conductivity, such as aluminum, iron, copper, or alloys thereof. According to embodiments, the heat sink 312 may be T-shaped. For example, heat source 311 may be disposed on heat sink 312, and heat sink 312 may include a first portion (not shown) extending upward (e.g., in the +X axis direction) from the portion where heat source 311 is disposed, and a leftward direction perpendicular to the first direction (e.g., from the upper end of the first portion in the leftward direction perpendicular to the first direction). Figure 5 (in the +Z axis direction) and the rightward direction (e.g., Figure 5 The second part (not shown) extends in the Z-axis direction. The first part (not shown) may be located between the first display 320a and the second display 320b. The second part (not shown) may be connected to the upper side of the electronic device 300 (e.g., in the Z-axis direction). Figure 5 The heat sink 360 is located on the +X axis direction. According to an embodiment, the heat sink 312 may include at least one hole (not shown) for injecting thermal gel.

[0102] According to an embodiment, a thermal interface material (TIM) (not shown) may be located between a heat source 311 and a heat sink 312. The thermal interface material (not shown) may be designed to function when compressed between the heat source 311 and the heat sink 312. Heat generated from the heat source 311 can be transferred to the heat sink 312 via the thermal interface material (not shown). The thermal interface material (not shown) may include, for example, solder, polymer, polymer gel, polymer / solder mixture, thermal pad, or grease. In an embodiment, the thermal interface material (TIM) (not shown) may be omitted from the electronic device 300, or one or more other components may be added to the electronic device 300.

[0103] According to an embodiment, the heat sink 360 is used to rapidly dissipate heat generated within the electronic device 300 to the outside of the electronic device 300. For example, the heat sink 360 is used to dissipate heat generated from a heat source 311 inside the electronic device 300 and / or the display 320 to the outside. According to an embodiment, the heat sink 360 may be located on the upper side of the electronic device 300 (e.g., on the side of the display 320). Figure 5 (in the +X axis direction). For example, the heat sink may be located on the upper side of the fan structure 340 of the electronic device 300 (e.g., in the +X axis direction). Figure 5 (in the +X axis direction). For example, a heat sink may be located on the display component of the electronic device 300 (e.g., Figure 6a The upper side of the first display member 302a and the second display member 302b in the middle (e.g., in Figure 5 In the +X axis direction. According to an embodiment, the heat sink 360 can be connected to the heat sink 312. For example, the heat sink can be connected to a second portion (not shown) of the heat sink 312 and can extend in the Z-axis direction corresponding to the second portion (not shown) of the heat sink 312. For example, the heat sink 360 may include a portion disposed on the upper side of the first display member 302a (e.g., on the +X axis direction). Figure 7c The first heat sink 360a is located on the +X axis direction, and the second heat sink 360a is located on the upper side of the second display member 302b (e.g., on the +X axis direction). Figure 7c The second heat sink 360b is located in the +X axis direction. According to the embodiment, the heat sink 360 may be made of aluminum, copper and the equivalent of them, but is not limited thereto.

[0104] According to an embodiment, the display 320 can provide the user with information about objects or the environment in a visual form through display components (e.g., a first display component 302a and a second display component 302b). According to an embodiment, the display 320 may include a first display 320a arranged corresponding to the user's left eye and a second display 320b arranged corresponding to the user's right eye. According to an embodiment, in the case of a head-mounted display device (HMD), when using a 4K display with high power consumption, a heat dissipation structure may be required that can effectively dissipate heat not only from the heat source 311 (e.g., the AP) but also from the display 320.

[0105] According to an embodiment, the display panel 330 can be configured to fix the position of the display 320. According to an embodiment, the display 320 may include a first display panel 330a arranged corresponding to the user's left eye and in contact with the first display 320a, and a second display panel 330b arranged corresponding to the user's right eye and in contact with the second display 320b. For example, the display panel 330 may be made of a metallic material, such as aluminum, iron, copper, or alloys thereof. The electronic device 300 according to the embodiment can effectively dissipate heat from the display 320 by using the display panel 330 as a heat dissipation structure for dissipating heat from the display 320.

[0106] According to an embodiment, the fan structure 340 can be configured to induce convection so that heat generated inside the electronic device 300 can be dissipated to the outside of the electronic device 300. For example, the fan structure 340 can be configured to induce convection towards the upper side where the heat sink 360 is disposed (e.g., Figure 5 The fan structure 340 facilitates convection in the +X axis direction, allowing heat generated from the heat source 311 and display 320 within the electronic device to be dissipated to the outside of the electronic device via the heat sink 360. According to an embodiment, the fan structure 340 may include a first fan structure 340a positioned corresponding to the user's left eye and in contact with the first display panel 330a, and a second fan structure 340b positioned corresponding to the user's right eye and in contact with the second display panel 330b. According to an embodiment, the fan structure 340 may include multiple exhaust vents for not only reducing the temperature of the main heat source 311 (e.g., AP) but also removing heat generated by the display 320. This will be described later.

[0107] According to an embodiment, an inlet vent (not shown) for allowing external air to enter the interior of the electronic device can be positioned on a surface (facing the -X-axis direction) at the lower end of the electronic device. According to an embodiment, an exhaust vent (not shown) for allowing air to escape from the interior of the electronic device to the outside can be positioned on a surface (facing the +X-axis direction) at the upper end of the electronic device. For example, air can flow through the inlet vent (not shown) for allowing air to enter the interior of the electronic device and the exhaust vent (not shown) for allowing air to escape to the outside, thus enabling air circulation.

[0108] Figure 8a , Figure 8b and Figure 8c This is a view showing a display panel 330 according to an embodiment disclosed herein. Figure 9 This is a side view showing some internal components of an electronic device 300 according to an embodiment disclosed herein, viewed along the X-axis.

[0109] refer to Figure 8a to Figure 9 Electronic devices (e.g.)Figure 5 The electronic device 300 may include at least one display panel 330. Figure 8a to Figure 9 The components of the display panel 330 in the middle can be with Figure 5 to 7c All or some of the components of the display panel 330 are the same. Figure 8a to Figure 9 The components in can be selectively coupled with Figure 5 to Figure 7c The combination of components in.

[0110] According to an embodiment, the display panel 330 may include a support member 331 and a protruding member 332 that is substantially vertically connected to the support member 331. According to an embodiment, the first display panel 330a, arranged corresponding to the user's left eye and in contact with the first display 320a, may include a support member 331a and a protruding member 332a that is substantially vertically connected to the support member 331a (see [link to embodiment]). Figure 8a According to an embodiment, the second display panel 330b, which is arranged corresponding to the user's right eye and in contact with the second display 320b, may include a support member 331b and a protruding member 332b that is substantially vertically connected to the support member 331b.

[0111] According to an embodiment, the support member 331 of the display panel 330 may include a surface facing the display 320 and oriented in a first direction (e.g., rearward direction). Figure 9 The first surface 3311 (in the +Y axis direction) and a surface facing the fan structure 340 and oriented in a second direction opposite to the first surface 3311 (e.g., forward direction). Figure 9 The second surface 3312 (in the Y-axis direction). According to an embodiment, the support member 331 of the display panel 330 may substantially correspond to the display 320 in size and / or shape.

[0112] According to an embodiment, the protruding member 332 of the display panel 330 can extend from the edge of the second surface 3312 of the supporting member 331 along a substantially vertical second direction (e.g., forward direction). Figure 9 (Extending in the -Y axis direction). The protruding member 332 of the display panel 330 can be connected to the fan structure 340. The protruding member 332 of the display panel 330 can contact a portion of the fan structure 340.

[0113] According to the embodiment, see Figure 8aThe protruding member 332 of the display panel 330 may include a plurality of strips 333a that extend vertically from the protruding member 332 and are arranged at regular intervals to support smooth airflow. Because the plurality of strips 333a are arranged vertically from the protruding member 332, an empty space can be formed in the Z-axis direction. Accompanying the airflow generated by the fan structure 340, heat generated from the display 320 can be effectively transferred to the outside through the empty space formed between the plurality of strips 333a. Instead of the plurality of strips 333a, terms such as bracket, support member, or air circulation member may also be used.

[0114] According to the embodiments, refer to Figure 8b and Figure 8c The protruding member 332 of the display panel 330 may include a plurality of holes 333b and 333c. For example, see reference. Figure 8b The plurality of holes 333b can be circular. For example, the plurality of circular holes 333b can be arranged at predetermined intervals. For example, see reference. Figure 8c The multiple holes 333b can be diamond-shaped. For example, the multiple diamond-shaped holes 333c can be arranged at predetermined intervals. As airflow generated by the fan structure 340 passes through the multiple holes 333b and 333c, heat generated from the display 320 can be effectively transferred to the outside. However, the shape of the display panel 330 and / or the structure formed in the protruding member 332 for heat transfer are not limited to the above embodiments, and can be designed and modified in various ways according to the airflow in the fan structure 340 to increase the air contact area, thereby maximizing heat dissipation performance.

[0115] The electronic device according to the embodiment can effectively dissipate heat from the display 320 by using the display panel 330 as a heat dissipation structure for dissipating heat from the display 320. For example, the protruding member 332 of the display panel 330 can be connected to the fan structure 340 to allow heat generated from the display 320 to be transferred to the fan structure 340 via the display panel 330.

[0116] Figure 10 This is a view showing a fan structure 340 according to an embodiment disclosed herein. Figure 11a to Figure 11f This is a view showing the connection relationship between the fan structure 340 and the display panel 330 according to an embodiment disclosed herein.

[0117] refer to Figure 10 to Figure 11f Electronic devices (e.g.) Figure 5 The electronic device 300 may include at least one display panel 330 and at least one fan structure 340. Figure 10 to Figure 11f The components of the display panel 330 and fan structure 340 can be combined with Figure 5 to Figure 9All or some of the components of the display panel 330 and the fan structure 340 are the same. Figure 10 to Figure 11f The components can be selectively coupled with Figure 5 to 9 Component combination.

[0118] According to an embodiment, the fan structure 340 may include a fan 341 and a fan cover member 342 covering the fan 341. For example, the first fan structure 340a may include a first fan (not shown) and a first fan cover member (not shown) covering the first fan (not shown). For example, the second fan structure 340b may include a second fan 341b and a second fan cover member 342b covering the second fan 341b. Figure 10 to Figure 11f The fan structure shown is the second fan structure 340b, but it can be applied to the first fan structure 340a.

[0119] According to an embodiment, the fan cover member 342 of the fan structure 340 may include a first surface, a second surface facing in a direction opposite to the first surface, and a third surface, the third surface being a side surface disposed substantially perpendicular to the first and second surfaces. The first surface of the fan cover member 342 may face a surface of the support member 331 of the display panel 330. At least a portion of the third surface of the fan cover member 342 may contact the protruding member 332 of the display panel 330.

[0120] According to an embodiment, the fan cover member 342 of the fan structure 340 may include a plurality of exhaust ports 350. The plurality of exhaust ports 350 may be disposed in the fan cover member 342 of the fan structure 340. The plurality of exhaust ports 350 may be openings disposed in a third surface that serves as a side surface of the fan cover member 342. The plurality of exhaust ports 350 may include a first exhaust port 351 and a second exhaust port 352, the first exhaust port 351 having an upward direction of the electronic device (e.g., Figure 10 The second exhaust port 352 has an opening formed in the +X axis direction of the electronic device, and has an opening in the lateral direction of the electronic device (e.g., in the +X axis direction). Figure 10 An opening formed in the Z-axis direction. For example, a second exhaust port 352 formed in the first fan structure 340b can be provided on the right side surface of the third surface of the electronic device 300 (e.g., in the Z-axis direction). Figure 10 (in the +Z axis direction). For example, the second exhaust port 352 may be provided in the upper portion of a side surface of the third surface of the electronic device 300 (e.g., in the +Z axis direction). Figure 10 In the +X axis direction), so as to move in the upward direction ( Figure 10Heat is transferred in the +X axis direction. The first exhaust port 351 can be arranged substantially perpendicular to the second exhaust port 352. According to an embodiment, the first exhaust port 351 and / or the second exhaust port 352 can have a square shape. However, the first exhaust port 351 and / or the second exhaust port 352 are not limited to the above embodiment and can be designed in various shapes, such as circular.

[0121] According to an embodiment, among the plurality of exhaust ports 350, a first exhaust port 351 may be disposed adjacent to the printed circuit board 310 and configured to dissipate heat generated from a heat source 311 disposed on the printed circuit board 310. For example, heat generated from the heat source 311 may be transferred to the upper side of the electronic device via a heat sink 312, and the heat flow may be effectively moved upward through the first exhaust port 351, which is an opening disposed on the upper side, so that the heat may be effectively dissipated by a heat sink 360 disposed on the upper side.

[0122] According to an embodiment, among the plurality of exhaust ports 350, a second exhaust port 352 can be connected to the display panel 330, and heat generated from the display 320 can be transferred to the display panel 330. The heat transferred to the display panel 330 can have its flow direction changed and guided to the central portion of the electronic device 300 through the second exhaust port 352, which is an opening provided on the side surface. The heat moving to the central portion of the electronic device 300 can be effectively dissipated, together with the heat generated from the heat source 311, to the heat sink 360 provided on the upper side.

[0123] Figure 12a to Figure 12c This is a view illustrating a fan structure 340 including multiple columns according to an embodiment disclosed herein.

[0124] refer to Figure 12a to Figure 12c Electronic devices (e.g.) Figure 5 The electronic device 300 may include at least one display panel 330 and at least one fan structure 340. Figure 12a to Figure 12c The components of the display panel 330 and fan structure 340 can be combined with Figure 5 to Figure 11f All or some of the components of the display panel 330 and the fan structure 340 are the same. Figure 12a to Figure 12c The components in can be selectively coupled with Figure 5 to Figure 11f The combination of components in.

[0125] According to an embodiment, the plurality of exhaust ports 350 of the fan structure 340 may include at least one post 380 to improve the rigidity of the fan cover member 342. The fan structure 340 may include at least one post 380 disposed at the locations where the plurality of exhaust ports 350 are located. According to an embodiment, the plurality of exhaust ports 350 of the fan structure 340 may include a plurality of posts 380 arranged to take into account noise attenuation and performance generated during fan operation. The plurality of posts 380 may be configured to vertically connect the first and second surfaces of the fan cover member in the empty space of the first exhaust port 351 and / or the second exhaust port 352. The plurality of posts 380 can reduce noise by preventing eddies caused by the movement of air generated by fan operation. Instead of a plurality of posts 380, terms such as a plurality of rods, a plurality of rails, and a plurality of supports may be used.

[0126] According to the embodiments, refer to Figure 12a The second exhaust port 352 may include a plurality of posts 380 with different intervals. For example, the distance between the plurality of posts 380 may be directed toward the lower side of the second exhaust port 352 (e.g., in...). Figure 5 The second exhaust port 352 narrows along the X-axis direction. For example, the second exhaust port 352 may include a plurality of first pillars 380a arranged at a first interval d1, and a plurality of second pillars 380b arranged at a second interval d2 narrower than the first interval d1, located below the plurality of first pillars. This is to prevent the formation of vortices and increased wind noise when air moves to the lower side of the second exhaust port 352, and to direct the air upwards (e.g., in the X-axis direction). Figure 5 (Flow in the +X axis direction).

[0127] According to the embodiments, refer to Figure 12b The first exhaust port 351 may include at least one third post 381, and the second exhaust port 352 may include at least one fourth post 382. For example, the first exhaust port 351 may include one third post 381, and the second exhaust port 352 may include a plurality of fourth posts 382 arranged at a narrower interval than the first exhaust port 351. For example, the first exhaust port 351 may include one third post 381, and the second exhaust port 352 may include three fourth posts 382. However, the presence or absence of posts and the spacing between the multiple posts are not limited to the above embodiments and can be designed and changed in various ways according to heat dissipation performance and noise.

[0128] According to the embodiments, refer to Figure 12cThe first exhaust port 351 may include at least one fifth post 383, and the second exhaust port 352 may include at least one sixth post 384. For example, the first exhaust port 351 may include a fifth post 383, and the second exhaust port 352 may include a sixth post 384. However, the presence or absence of posts and the spacing between multiple posts are not limited to the above embodiments and can be designed and changed in various ways according to heat dissipation performance and noise.

[0129] Figure 13 This is a view showing an electronic device 300 including a small fan structure 370 according to an embodiment disclosed herein.

[0130] refer to Figure 13 The electronic device 300 may include a housing 301, a printed circuit board 310, at least one display 320, at least one display panel 330, at least one fan structure 340, and at least one small fan structure 370. Figure 13 Some or all of the components of the electronic device 300 can be with Figure 2 to Figure 4 The components are the same as those in the wearable electronic device 200. Figure 13 The components in can be selectively coupled with Figure 2 to Figure 4 The combination of components in.

[0131] According to an embodiment, the small fan structure 370 may be located in the central portion of the electronic device 300 and guides the heat generated in the display 320 upwards. According to an embodiment, the small fan structure 370 may be located in the central portion of the electronic device and guides the heat generated in the display 320 upwards (e.g., in…). Figure 5 (In the +X axis direction) guides to deliver to the heatsink 360.

[0132] Figure 14a This is a view showing the front side of a wearable electronic device according to an embodiment of the present disclosure. Figure 14b This is a view showing the rear side of a wearable electronic device according to an embodiment of the present disclosure.

[0133] Figure 14a and Figure 14b The components of the wearable electronic device 400 can be connected with Figure 2 to Figure 4 All or some components of the wearable electronic device 200 and Figure 5 to Figure 13 The components of the electronic device 300 are the same. Figure 14a and Figure 14b The components in can be selectively coupled with Figure 2 to Figure 13 The combination of components in.

[0134] In this embodiment, the wearable electronic device 400 may be AR glasses or Video See-Through (VST) type VR glasses. In this embodiment, the VST type VR glasses can capture images of the external environment using a camera (not shown) and display the captured images of the external environment and VR content to the user via a display. For example, the VR content may be data related to navigation or content about specific objects.

[0135] refer to Figure 14a and Figure 14b In an embodiment, camera modules 411, 412, 413, 414, 415 and 416 and / or depth sensor 417 configured to acquire information related to the surrounding environment of the wearable electronics 400 may be arranged on the first surface 410 of the housing.

[0136] In an embodiment, camera modules 411 and 412 can acquire images related to the surrounding environment of the wearable electronic device.

[0137] In embodiments, camera modules 413, 414, 415, and 416 can acquire images while the wearable electronics 400 is worn by a user. Camera modules 413, 414, 415, and 416 can be used for hand detection and tracking or user gesture (e.g., hand movements) recognition. Camera modules 413, 414, 415, and 416 can be used for 3-DOF or 6DoF head tracking, position (space, environment) recognition, and / or motion recognition. In embodiments, camera modules 411 and 412 can be used for hand detection and tracking as well as user gesture recognition.

[0138] In an embodiment, depth sensor 417 may be configured to send signals and receive signals reflected from an object, and may be used to identify the distance to the object, such as time-of-flight (TOF). As an alternative to or supplement to depth sensor 217, camera modules 213, 214, 215, and 216 may identify the distance to the object.

[0139] According to an embodiment, camera modules 425 and 426 for facial recognition and / or display 421 (and / or lens) may be disposed on the second surface 420 of the housing.

[0140] In this embodiment, facial recognition camera modules 425 and 426 located near the display can be used to recognize the user's face, or to recognize and / or track the user's eyes.

[0141] In one embodiment, the display 421 (and / or lens) may be disposed on the second surface 420 of the wearable electronic device 400. In another embodiment, the wearable electronic device 400 may not include some of the camera modules 415 and 416 among the plurality of camera modules 413, 414, 415 and 416.Figure 14a and Figure 14b At least one of the components shown may be omitted from the wearable electronic device 400, or the electronic device 400 may also include components not shown in the figures. For example, at least one of the camera modules described above may be omitted from the wearable electronic device 400, or the electronic device 400 may include a greater number of camera modules.

[0142] As described above, the wearable electronic device 400 according to the embodiments may have a shape factor intended to be worn on a user's head. The wearable electronic device 400 may also include straps and / or wearing members for securing it to a part of the user's body. When worn on a user's head, the wearable electronic device 400 may provide a user experience based on augmented reality, virtual reality, and / or mixed reality.

[0143] Typically, a fan 341 is used within an electronic device to improve its heat dissipation performance. However, the fan may be designed primarily to dissipate heat from the main heat source 311 (e.g., the AP). In the case of a head-mounted display (HMD), since the display 320 consumes higher power, a heat dissipation structure may be required to effectively dissipate the heat from the display 320. Typically, it may be difficult to structurally connect both the main heat source 311 (e.g., the AP) and the display 320 to a single heat sink 360, and the exhaust port of the unidirectional fan 341 may be limiting in terms of its structural use for dissipating heat from both the main heat source 311 (e.g., the AP) and the display 320.

[0144] According to an embodiment, an electronic device equipped with a heat dissipation device can be provided, which can effectively dissipate the heat generated when the electronic device is driven and the heat generated by the operation of the display 320.

[0145] According to an embodiment, an electronic device may be provided, which includes a fan structure 340 including a plurality of exhaust ports 350 to effectively dissipate heat generated from a main heat source 311 (e.g., AP) and a display 320.

[0146] According to an embodiment, an electronic device may be provided in which a display panel 330 configured to fix a display 320 is connected to a fan structure 340 to effectively dissipate heat generated from a main heat source 311 (e.g., AP) and the display 320.

[0147] The electronic device according to the embodiment can effectively dissipate heat from the display 320 by using the display panel 330 as a heat dissipation structure for dissipating heat from the display 320. For example, the protruding member 332 of the display panel 330 can be connected to the fan structure 340 to allow heat generated from the display 320 to be transferred to the fan structure 340 via the display panel 330.

[0148] The technical problems to be solved by this disclosure are not limited to those described above, and those skilled in the art to which this disclosure pertains will clearly understand from the following description other technical problems not described above.

[0149] A head-mounted display device according to embodiments of the present disclosure may include: a housing 301; a printed circuit board 310 located inside the housing and including a heat source; at least one display 320 located inside the housing; at least one display panel 330 configured to support the display; and at least one fan structure 340 including a fan and a plurality of exhaust ports, configured to direct heat generated inside the head-mounted display device to the outside of the head-mounted display device. The plurality of exhaust ports may include a first exhaust port and a second exhaust port, the first exhaust port being disposed adjacent to the printed circuit board and configured to dissipate heat generated from the heat source, and the second exhaust port being configured to contact a portion of the display panel and to dissipate heat generated from the display and transferred to the display panel.

[0150] According to an embodiment, the display panel may include a support member 331 and a protruding member 332 vertically connected to the support member.

[0151] According to an embodiment, the support member may include a first surface 3311 facing the display and oriented in a first direction, and a second surface 3312 facing the fan structure and oriented in a second direction opposite to the first direction in which the first surface is arranged, and the protruding member may extend from the edge of the second surface of the support member along the second direction.

[0152] According to an embodiment, the protruding member may further include a plurality of strips 333a extending vertically from the protruding member and spaced apart from each other at regular intervals.

[0153] According to an embodiment, the protruding member may also include a plurality of holes 333b.

[0154] According to an embodiment, the fan structure may include a fan 341 and a fan cover member 342 covering the fan, and the fan cover member may include a plurality of exhaust ports.

[0155] According to an embodiment, the second exhaust port in the fan structure and the protruding member of the display panel can contact each other.

[0156] According to an embodiment, the head-mounted display device may further include a heat sink 312, which includes a heat-dissipating material and is disposed adjacent to a heat source, and is configured to transfer heat from the heat source 311 to the interior of the head-mounted display device 300.

[0157] According to an embodiment, the heat sink may be T-shaped.

[0158] According to an embodiment, the plurality of exhaust ports 350 may include at least one column 380.

[0159] According to an embodiment, the second exhaust port may include a plurality of first posts 380a arranged at a first interval d1, and a plurality of second posts 380b located below the plurality of first posts and arranged at a second interval d2 that is narrower than the first interval d1.

[0160] An electronic device according to embodiments of the present disclosure may include: a housing; a printed circuit board located inside the housing and including a heat source; at least one display located inside the housing; at least one display panel configured to support the display; and at least one fan structure including a fan and a plurality of exhaust vents, configured to induce convection so that heat generated inside the electronic device can be dissipated to the outside of the electronic device. The plurality of exhaust vents may include a first exhaust vent and a second exhaust vent, the first exhaust vent being disposed adjacent to the printed circuit board and configured to dissipate heat generated from the heat source, and the second exhaust vent being configured to contact a portion of the display panel and to dissipate heat generated from the display and transferred to the display panel. The plurality of exhaust vents 350 may include at least one post 380.

[0161] According to an embodiment, the display panel may include a support member 331 and a protruding member 332 vertically connected to the support member.

[0162] According to an embodiment, the support member may include a first surface 3311 facing the display and oriented in a first direction, and a second surface 3312 facing the fan structure and oriented in a second direction opposite to the first direction in which the first surface is arranged, and the protruding member may extend from the edge of the second surface of the support member along the second direction.

[0163] According to an embodiment, the protruding member may further include a plurality of strips 333a extending vertically from the protruding member and spaced apart from each other at regular intervals.

[0164] According to an embodiment, the protruding member may also include a plurality of holes 333b.

[0165] According to an embodiment, the fan structure may include a fan 341 and a fan cover member 342 covering the fan, and the fan cover member may include a plurality of exhaust ports.

[0166] According to an embodiment, the second exhaust port in the fan structure and the protruding member of the display panel can contact each other.

[0167] According to one embodiment, the head-mounted display device may further include a heat sink 312, which is positioned adjacent to a heat source and configured to transfer heat from the heat source 311 to the interior of the electronic device 300.

[0168] According to one embodiment, the heat sink may be T-shaped.

[0169] The effects achievable through this disclosure are not limited to those described above, and based on the following description, those skilled in the art will clearly understand other effects not described above. While this disclosure has been illustrated and described with reference to various exemplary embodiments, it should be understood that these exemplary embodiments are intended to be illustrative and not restrictive. Those skilled in the art will further understand that various changes in form and detail may be made without departing from the true spirit and full scope of this disclosure, including the appended claims and their equivalents. It should also be understood that any embodiment described herein may be used in conjunction with any other embodiment described herein.

Claims

1. A head-mounted display device (300), the head-mounted display device comprising: Housing (301); A printed circuit board (310) is disposed inside the housing and includes at least one heat source; At least one display (320) is disposed inside the housing; At least one display panel (330) is configured to support the display; as well as At least one fan structure (340) configured to direct heat generated inside the head-mounted display device to the outside of the head-mounted display device, the at least one fan structure including a fan and a plurality of exhaust ports. The plurality of exhaust ports include: A first exhaust port, disposed adjacent to the printed circuit board and configured to dissipate heat generated from the heat source; and A second exhaust port is configured to contact a portion of the display panel and to dissipate heat generated from the display and transferred to the display panel.

2. The head-mounted display device according to claim 1, wherein, The display panel includes a support member (331) and a protruding member (332), the protruding member being vertically connected to the support member and facing the second exhaust port.

3. The head-mounted display device according to claim 2, wherein, The support member includes a first surface (3311) and a second surface (3312). The first surface faces a surface of the display and is oriented in a first direction in which the display is positioned. The second surface faces a surface of the fan structure and is oriented in a second direction opposite to the first direction. The protruding member extends from the edge of the second surface of the support member along the second direction.

4. The head-mounted display device according to claim 2, wherein, The protruding member also includes a plurality of strips (333a) that extend vertically from a portion of the protruding member and are spaced apart from each other at regular intervals.

5. The head-mounted display device according to claim 2, wherein, The protruding member also includes multiple holes (333b).

6. The head-mounted display device according to any one of claims 1 to 5, wherein, The fan structure includes a fan (341) and a fan cover member (342), the fan cover member covering the fan and including the plurality of exhaust ports.

7. The head-mounted display device according to any one of claims 2 to 5, wherein, The second exhaust port in the fan structure is configured to contact the protruding member of the display panel.

8. The head-mounted display device according to any one of claims 1 to 7, the head-mounted display device further comprising a heat sink (312), the heat sink comprising a heat-dissipating material and disposed adjacent to the heat source and configured to transfer heat from the heat source (311) to the location of the first exhaust port or the second exhaust port.

9. The head-mounted display device according to claim 8, wherein, The heat sink is configured to at least partially contact at least a portion of the first exhaust port.

10. The head-mounted display device according to any one of claims 1 to 9, wherein, The plurality of exhaust ports (350) include at least one column (380).

11. The head-mounted display device according to any one of claims 1 to 10, wherein, At least one of the first exhaust port and the second exhaust port includes: a plurality of first pillars (380a) arranged at a first interval (d1), and a plurality of second pillars (380b) arranged at a second interval (d2) narrower than the first interval (d1) below the plurality of first pillars.

12. An electronic device, the electronic device comprising: Housing (301); A printed circuit board (310) is disposed inside the housing and includes at least one heat source; At least one display (320) is disposed inside the housing; At least one display panel (330) is configured to support the display; as well as At least one fan structure (340) includes a plurality of exhaust ports and is configured to induce convection so that heat generated inside the electronic device can be exhausted to the outside of the electronic device. The at least one fan structure includes a fan and a plurality of exhaust ports. The plurality of exhaust ports include: A first exhaust port, disposed adjacent to the printed circuit board and configured to dissipate heat generated from the heat source; and A second exhaust port is configured to contact a portion of the display panel and to dissipate heat generated from the display and transferred to the display panel. The plurality of exhaust ports (350) include at least one column (380).

13. The electronic device according to claim 12, wherein, The display panel includes a support member (331) and a protruding member (332) that is perpendicularly connected to the support member.

14. The electronic device according to claim 13, wherein, The support member includes a first surface (3311) and a second surface (3312). The first surface faces a surface of the display and is oriented in a first direction. The second surface faces a surface of the fan structure and is oriented in a second direction opposite to the first direction in which the first surface is arranged. The protruding member extends from the edge of the second surface of the support member along the second direction.

15. The electronic device according to claim 13, wherein, The protruding member also includes a plurality of strips (333a) that extend vertically from a portion of the protruding member and are spaced apart from each other at regular intervals.