Test interconnect temperature control with gas flow

Abstract

The invention relates to test interconnect temperature control with gas flow. Various embodiments include techniques for controlling the temperature of a test socket in a test system. The temperature controller determines an input temperature associated with a reference device under test (DUT) installed in the test socket. The temperature controller determines a flow rate of the gas based on the input temperature. The temperature controller adjusts the flow control valve to supply gas to the reference DUT at the flow rate.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit of co-pending U.S. Provisional Patent Application No. 63 / 665,208, filed June 27, 2024, entitled "TEST INTERCONNECT TEMPERATURE CONTROL WITH AIRFLOW". The subject matter of that related application is incorporated herein by reference. Technical Field

[0003] The various embodiments generally relate to integrated circuit manufacturing and testing, and more specifically, to test interconnect temperature control utilizing gas flow. Background Technology

[0004] Test systems used for testing one or more integrated circuits, multi-chip modules, etc., may exhibit one or more limitations. First, during testing, especially for new products and test procedures, the temperature of certain localized areas of the device under test (DUT) (referred to as the reference DUT) may exceed the melting point of the solder balls mounted on the reference DUT and / or the highest operating temperature of the interconnects transmitting and receiving signals from the reference DUT. In this situation, the solder balls may begin to melt and deform. Consequently, the reference DUT may adhere to components of the test system, causing damage to the reference DUT and / or the test system. Repairing such damage can be time-consuming and expensive. Second, in package-on-package (POP) stacked packages, it may be difficult to control the substrate die junction temperature from the top-side thermal control unit because the stacked components can interrupt conduction to the die below the top surface.

[0005] Third, some conventional test sockets lack a convenient mechanism to determine whether the temperature of the reference DUT is close to the solder melting point during testing. Furthermore, while the test system can be equipped with conventional temperature measurement devices, the test sockets that hold the reference DUT in place during testing will need to be redesigned to accommodate these devices. In some cases, existing test signal probes that transmit and receive electrical signals to and / or monitor these signals from the reference DUT may have to be increased in size and / or length to accommodate the redesigned test sockets that include such large temperature measurement devices.

[0006] As mentioned above, there is a need in the art for more efficient technologies to control the temperature in test interconnects. Summary of the Invention

[0007] Various embodiments of this disclosure illustrate a test socket. The test socket includes at least one probe housing in contact with a channel. The test socket also includes a probe field comprising a plurality of test spring probes at least partially disposed within the channel. The test socket further includes an inlet configured to introduce gas into the channel. The test socket also includes an outlet configured to discharge gas from the channel. Gas cooling is included for at least a portion of the plurality of test spring probes in the probe field.

[0008] Other embodiments include, but are not limited to, systems for implementing one or more aspects of the disclosed technology, one or more computer-readable media including instructions for performing one or more aspects of the disclosed technology, and methods for performing one or more aspects of the disclosed technology.

[0009] At least one technical advantage of the disclosed technology over the prior art lies in its ability to continuously monitor the spring probe temperature and / or DUT temperature using closed-loop temperature control, and adjust the gas flow to the test socket containing the reference DUT to maintain the desired temperature of the reference DUT. Furthermore, the test system can use the same spring probes deployed in conventional systems without requiring specially manufactured spring probes, such as those that may not be compatible with longer spring probes in existing test systems. Additionally, the disclosed solution can be adapted and integrated into existing gas connections, test systems, and test processing devices commonly found in test environments. These advantages represent one or more technical improvements over prior art methods. Attached Figure Description

[0010] To gain a more detailed understanding of the features described above in the various embodiments, reference can be made to a more specific description of the inventive concept briefly outlined above, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings illustrate only typical embodiments of the inventive concept and should not be construed as limiting the scope in any way, and that other equally effective embodiments exist.

[0011] Figure 1 This is a block diagram illustrating a computing system that can be used as a platform and / or control system configured to implement one or more aspects of various embodiments;

[0012] Figure 2 This illustrates the inclusion of various embodiments. Figure 1 A block diagram of the test system in a computing system;

[0013] Figure 3 Included according to various embodiments Figure 2 A more detailed view of the test sockets in the test system;

[0014] Figure 4 The illustration shows various embodiments including Figure 2 The test processing device in the test system;

[0015] Figure 5 The test socket according to various embodiments is installed when it is mounted Figure 2 A three-quarters cross-sectional view of a portion of the test system;

[0016] Figure 6 The test socket according to various embodiments is installed when it is mounted Figure 2 A frontal cross-sectional view of a portion of the test system;

[0017] Figure 7 A cross-sectional view of a test socket according to various embodiments is shown, the test socket having an inlet and an outlet disposed within one or more alignment pins of the test socket;

[0018] Figure 8 A cross-sectional view of a test socket according to various embodiments is shown, the test socket having an inlet for introducing gas into the chamber of the test socket;

[0019] Figures 9A-9B Various embodiments of measuring and Figure 2 The technology for testing the temperature associated with the socket;

[0020] Figure 10 This is an illustration based on various embodiments. Figure 2 The surface temperature change of the test system relative to the peak gas velocity; and

[0021] Figure 11 It is for control according to various embodiments Figure 3 A flowchart of the method steps for testing the temperature in the interconnection of sockets. Detailed Implementation

[0022] Various embodiments of the disclosed technology include a test socket equipped with standard spring probes, featuring an improved design such that a channel is formed between the upper and lower housings of the test socket through which gas (e.g., compressed dry air (CDA)) flows. This channel can expose the spring probes across the entire field to the gas flow. Alternatively, selected portions of the spring probes may be exposed to the gas flow, while other spring probes remain unexposed. This method of exposing only selected portions of the spring probes to the gas flow can be used for various purposes, such as maintaining consistent impedance along the path of a spring probe carrying a high-speed signal. The test socket is designed with connection points for gas supply and exhaust ports to the environment or for delivering exhaust gases to a preferred emission location.

[0023] One configuration involves supplying gas to the test socket via alignment pins, which are typically used to ensure the thermal head and / or hand-socket lid are precisely positioned and mounted on the test socket. Each of these alignment pins may have an axial bore along the main axis, and a sealing mechanism added to the test socket to prevent gas leakage. One alignment pin may connect to the supply side of the internal gas flow channel of the socket, while the other may connect to the exhaust side. If it is not necessary to divert the flow away from this area, the exhaust may also be delivered to a port on the socket frame. Another method utilizes purge gas entering from the thermal head condensation abatement chamber, which seals around the top of the socket when the thermal head is fully engaged. CDA is supplied to this sealed chamber and the sealed volume. Additionally, a portion of the CDA is diverted to an inlet in the test socket frame, which is also located within the sealed area. This configuration allows purified gas to flow through the test socket channel and then be discharged directly to a port outside the sealed area or through pipes and one or more manifolds to other test sockets. Some embodiments provide novel methods for connecting the gas supply and / or exhaust to the test sockets, which can simplify the integration of the test processing device or manual socket cover.

[0024] In the following description, numerous specific details are set forth to provide a more thorough understanding of the various embodiments. However, it will be apparent to those skilled in the art that the inventive concepts can be practiced without one or more of these specific details.

[0025] System Overview

[0026] Figure 1 This is a block diagram illustrating a computing system 100, which can be used as a platform and / or control system configured to implement one or more aspects of various embodiments. As shown, in some embodiments, the computing system 100 may be a "server" computer system. The computing system 100 includes an address / data bus 150 for transmitting information and a central processing unit complex 105 functionally coupled to the bus 150 for processing information and instructions. The bus 150 may include, for example, a Peripheral Component Interconnect Fast (PCIe) computer expansion bus, an Industry Standard Architecture (ISA), an Extended ISA (EISA), a MicroChannel, a Multibus, an IEEE 796, an IEEE 1196, an IEEE 1496, PCI, Computer Automatic Measurement and Control (CAMAC), an MBus, a Runway bus, a Computing Fast Link (CXL), etc.

[0027] In some embodiments, the central processing unit (CPU) complex 105 may include a single processor or multiple processors, such as a multi-core processor or multiple independent processors. The CPU complex 105 may include various types of known processors in any combination, including but not limited to digital signal processors (DSPs), graphics processing units (GPUs), complex instruction set (CISC) processors, reduced instruction set (RISC) processors, very long word (VLIW) processors, etc. The computing system 100 may also include volatile memory 115 (e.g., random access memory RAM) coupled to a bus 150 for storing information and instructions of the CPU complex 105, and non-volatile memory 110 (e.g., read-only memory ROM) coupled to the bus 150 for storing static information and instructions of the CPU complex 105. The computing system 100 may optionally include replaceable non-volatile memory 120 (e.g., NOR flash memory) for storing information and instructions of the CPU complex 105 that can be updated after the manufacture of the computing system 100. In some embodiments, only one of the non-volatile memory 110 or the replaceable non-volatile memory 120 may exist.

[0028] Figure 1 The computing system 100 also includes an optional input device 130. The input device 130 can selectively transmit information and commands to the central processing unit 105. The input device 130 can be any suitable device for transmitting information and / or commands to the computing system 100. For example, the input device 130 can take the form of a keyboard, buttons, joystick, trackball, audio sensor (e.g., microphone), touch-sensitive digitizer panel, eye scanner, etc.

[0029] The computing system 100 may include a display unit 125. The display unit 125 may include a liquid crystal display (LCD), a cathode ray tube (CRT), a field emission device (FED, also known as a flat panel CRT), a light-emitting diode (LED), a plasma display, an electroluminescent (EL) display, electronic paper, electronic ink (e-ink), and / or other display devices suitable for creating user-recognizable graphic images and / or alphanumeric characters. In some embodiments, the display unit 125 may have an associated lighting device.

[0030] The computing system 100 may also optionally include an expansion interface 135 coupled to the bus 150. The expansion interface 135 may implement many well-known standard expansion interfaces, including but not limited to a Secure Digital Card interface, a Universal Serial Bus (USB) interface, a Compact Flash memory interface, a Personal Computer (PC) Card interface, CardBus, a Peripheral Component Interconnect (PCI) interface, a Peripheral Component Interconnect Express (PCI Express) interface, a mini PCI interface, IEEE 8394, a Small Computer System Interface (SCSI), a Personal Computer Memory Card International Association (PCMCIA) interface, an Industry Standard Architecture (ISA) interface, an RS-232 interface, etc. In some embodiments of this disclosure, the expansion interface 135 may include signals substantially compatible with the signals of the bus 150.

[0031] Various known devices can be attached to the computing system 100 via bus 150 and / or expansion interface 135. Examples of such devices include, but are not limited to, rotating magnetic storage devices, flash memory devices, digital cameras, wireless communication modules, digital audio players, and global positioning system (GPS) devices.

[0032] The computing system 100 may also optionally include a communication port 140. The communication port 140 may be implemented as part of the expansion interface 135. When implemented as a standalone interface, the communication port 140 is typically used to exchange information with other devices via a communication data transmission protocol. Examples of communication ports include, but are not limited to, RS-232 ports, Universal Asynchronous Receiver Transmitter (UART), USB ports, infrared transceivers, Ethernet ports, IEEE 8394, and synchronous ports.

[0033] The computing system 100 may optionally include a network interface 160, which may implement a wired or wireless network interface. In some embodiments, the computing system 100 may include additional software and / or hardware features (not shown).

[0034] Figure 2 This illustrates the inclusion of various embodiments. Figure 1 A block diagram of the test system 200 within the computing system 100. The test system 200 includes, but is not limited to, a test socket 210, a test fixture 215, a temperature controller 220, a flow control valve 225, and a gas conditioning module 230. The test system 200 and / or any of its components can be implemented on one or more computing systems, for example, Figure 1The computing system 100. Certain components of the test system 200 can receive AC and / or DC power via the main power input 275. As shown, such components may include, but are not limited to, the test fixture 215, the temperature controller 220, the gas conditioning module 230, and / or any one or more other components of the test system 200.

[0035] Test socket 210 is configured to receive a reference DUT for testing. Prior to testing, the user can mount the reference DUT to test socket 210. Test socket 210 receives gas 270 from gas conditioning module 230. As described herein, the probe field included in test socket 210 is exposed to gas 270. Gas 270 cools the spring probes within the probe field to reduce the likelihood of solder balls melting on the reference DUT. Partially and / or completely melted solder balls can damage the reference DUT and / or test socket 210, cause spring probes to adhere to solder balls, or hinder removal of the reference DUT after testing, etc. This can lead to costly repairs of the reference DUT and / or test socket 210. In some embodiments, gas 270 may further provide condensation relief for the spring probes when the temperature of the spring probes, reference DUT, etc., is below the ambient dew point. Test socket 210 may be equipped with a temperature measuring device that measures the temperature of the reference DUT and / or test socket 210. Test socket 210 transmits the measured temperature as a temperature signal 240 to temperature controller 220. In some embodiments, test socket 210 or any part thereof may include a very high thermal conductivity (typically greater than 10 watts per meter Kelvin, W / m*K) and a very low electrical conductivity (typically less than 10 watts per meter Kelvin, W / m*K) e-6 Materials in microsiemens per centimeter (μS / cm).

[0036] Test fixture 215 tests the functionality of a reference DUT coupled (e.g., mounted) to test socket 210 by performing one or more test operations on the reference DUT. In various embodiments, test socket 210 may be fixedly attached or detachably attached to test fixture 215. In some embodiments, test fixture 215 includes a tester comprising one or more fixedly attached test sockets, such as test socket 210. In such embodiments, gas 270 may be supplied to and / or discharged from one or more test sockets via a fixed connection. In some embodiments, test fixture 215 includes a test processing device comprising one or more test sockets, such as test socket 210, mounted on a test interface board detachably attached to test system 200. In such embodiments, gas 270 may be supplied to and / or discharged from one or more test sockets 210 via a connection including a quick-disconnect mechanism. Test fixture 215 may be equipped with one or more temperature measuring devices that measure the temperature associated with the reference DUT and / or test socket 210. The test fixture 215 transmits the measured temperature as an auxiliary temperature signal 245 to the temperature controller 220.

[0037] In addition, the test fixture 215 includes an inlet 250 for receiving gas from an external source. The gas may be compressed dry air (CDA), uncompressed dry air, compressed or uncompressed nitrogen, etc. The test fixture 215 delivers at least a portion of the incoming gas as purge gas 255 to the flow control valve 225. The test fixture 215 may further direct a portion of the purge gas 255 to a reference load plate (…). Figure 2 (As shown in the image) for use in various purposes.

[0038] Temperature controller 220 provides closed-loop temperature control for test system 200. Temperature controller 220 receives temperature signal 240 from one or more temperature measuring devices included in test socket 210. Similarly, temperature controller 220 receives auxiliary temperature signal 245 from one or more temperature measuring devices included in test fixture 215. The one or more temperature measuring devices supplying temperature data to temperature signal 240 and / or auxiliary temperature signal 245 can measure the temperature of solder balls of reference DUT, junction temperature of reference DUT, package temperature and / or surface temperature of reference DUT, temperature of hothead or base coupled to reference DUT, etc. Based on temperature signal 240 and / or auxiliary temperature signal 245, temperature controller 220 determines the input temperature associated with reference DUT. Temperature controller 220 determines the flow rate of gas (e.g., purge gas 255) based on the input temperature. Temperature controller 220 transmits valve control signal 260 to flow control valve 225. By transmitting a valve control signal 260 to the flow control valve 225, the temperature controller 220 adjusts the flow control valve 225 to supply at least a portion of the purified gas 255 as confined gas 265 to the gas conditioning module 230. The gas conditioning module 230 then supplies at least a portion of the confined gas 265 as gas 270 to the reference DUT installed in the test socket 210.

[0039] Flow control valve 225 restricts gas flow to limit and / or control the amount of purified gas 255 passing through the flow control valve 225 as constricted gas 265. The amount of constricted gas 265 is based on a valve control signal 260 received from temperature controller 220. Flow control valve 225 can limit and / or control the flow of purified gas 255 using any technically feasible mechanism for controlling gas flow (e.g., solenoid, motor, diaphragm, piston, hydraulic control device, etc.). After limiting and / or controlling the amount of purified gas 255, flow control valve 225 supplies purified gas 255 as constricted gas 265 to gas conditioning module 230.

[0040] Gas conditioning module 230 receives confined gas 265 from flow control valve 225 and can adjust the temperature and / or humidity of the received confined gas 265. After adjusting the temperature and / or humidity of the confined gas 265, gas conditioning module 230 supplies the confined gas 265 as gas 270 to test socket 210. In some embodiments, gas conditioning module 230 can lower the temperature of gas 270 to enhance the cooling effect of gas 270 as it flows through test socket 210. Additionally and / or alternatively, gas conditioning module 230 can raise or lower the temperature of gas 270 to achieve the desired test temperature of a reference DUT installed in test socket 210. For example, gas conditioning module 230 can raise the temperature of gas 270 to compensate for the heat head ( Figure 2 Heat loss caused by the gas (not shown) being drawn from the reference DUT when installed in the test socket 210. Furthermore, the gas conditioning module 230 can adjust the temperature of the gas 270 to compensate for the thermal gain and / or heat loss caused by the reference DUT having a packaged stack (POP) configuration.

[0041] In some embodiments, if the gas 270 is not dry enough, the gas conditioning module 230 can reduce the humidity of the gas 270. Similarly, if it is desired that humid gas flows through the test socket 210, the gas conditioning module 230 can increase the humidity of the gas 270. In some examples, adjusting the humidity of the gas 270 can affect the cooling effect of the gas 270 on the spring probe included in the test socket 210.

[0042] In some embodiments, the gas conditioning module 230 may adjust the temperature of the gas 270 based on a temperature control signal (not shown) received from the temperature controller 220. Similarly, in some embodiments, the gas conditioning module 230 may adjust the humidity of the gas 270 based on a humidity control signal (not shown) received from the temperature controller 220. After adjusting the temperature and / or humidity, the gas conditioning module 230 supplies the gas 270 to the test socket 210.

[0043] Figure 3 Included according to various embodiments Figure 2 A more detailed view of the test socket 210 in the test system 200. As shown, the test socket 210 includes... Figure 2The gas conditioning module 230 receives gas 270 through an inlet 320. In some embodiments, the inlet 320 receives gas 270 that has been compressed before being supplied to the test socket 210. In some embodiments, the inlet 320 may be directly or indirectly coupled to an air compressor and / or other gas compression device (not shown). Such compressed gas, air compressor, and / or other gas compression device may actively push gas 270 from the inlet 320 through the test socket 210. Gas 270 flows through the inlet 320 and through the cavity 315 of the test socket 210. As gas 270 flows through the cavity 315, gas 270 cools the spring probes in the probe field of the test socket 210. After flowing through the cavity 315, gas 270 is discharged through the outlet 325. Additionally and / or alternatively, after flowing through the cavity 315, gas 270 is directly discharged to the surrounding environment. In some embodiments, the outlet 325 may be directly or indirectly coupled to a vacuum pump and / or other vacuum device (not shown). Such a vacuum pump and / or other vacuum device can actively extract residual gas from outlet 325 of test socket 210.

[0044] Figure 4 The illustration shows various embodiments including Figure 2 The test processing unit 400 is included in the test system 200. As shown, the test processing unit 400 includes, but is not limited to, a power distribution board (PDB) 410 and a test interface board (TIB) 415. The test processing unit 400 may be included in... Figure 2 The test system 200 includes a test fixture 215. A power distribution board 410 may be fixedly attached to the test fixture 215, while a test interface board 415 may be detachably attached to the test fixture 215. When the test interface board 415 is attached to the test fixture 215, the test interface board 415 is coupled to the power distribution board 410. The test interface board 415 may be attached to the power distribution board 410 before the test procedure is executed, and may be detached from the power distribution board 410 when the test procedure is completed. The test processing apparatus 400 may include an automatic placement machine (not shown) that can automatically attach the test interface board 415 to and / or detach the test interface board 415 from the power distribution board 410. Additionally and / or alternatively, a user may manually attach the test interface board 415 to and / or detach the test interface board 415 from the power distribution board 410.

[0045] Power distribution board 410 provides power to test interface board 415 to supply power during testing. Power distribution board 410 also supplies gas to test interface board 415 via main inlet 420 during testing. As shown in illustration 400A, main inlet 420 supplies gas to quick disconnect device (QD) inlet 435 on power distribution board 410. Gas transfer occurs through quick disconnect device 430 between power distribution board 410 and test interface board 415. After transfer through quick disconnect device 430, gas is distributed to various locations on test interface board 415 via one or more quick disconnect device outlets (e.g., quick disconnect device (QD) outlet 440 and / or quick disconnect device (QD) outlet 445).

[0046] The quick-disconnect device 430 can be a blind-mate quick-disconnect device without any locking mechanism. This blind-mate quick-disconnect device establishes a gas connection between the power distribution board 410 and the test interface board 415 when the test interface board 415 is automatically or manually inserted into the test processing device 400, locked in place, and mated to the power distribution board 410. In some embodiments, when the test interface board 415 is attached to the power distribution board 410, gas can automatically flow through the quick-disconnect device 430 from the quick-disconnect device inlet 435 to the quick-disconnect device outlet 440 and / or the quick-disconnect device outlet 445. Similarly, in such embodiments, when the test interface board 415 is detached from the power distribution board 410, gas can automatically stop flowing through the quick-disconnect device 430 from the quick-disconnect device inlet 435 to the quick-disconnect device outlet 440 and / or the quick-disconnect device outlet 445.

[0047] As shown in Figure 400B, the test interface board 415 may include one or more manifolds (e.g., manifold 450) that deliver gas from quick-disconnect device outlet 440 and / or quick-disconnect device outlet 445 to one or more test sockets 210 mounted on the test interface board 415. Manifold 450 receives gas from quick-disconnect device outlet 440 via manifold inlet 455. Manifold 450 distributes a first portion of the gas to one or more test sockets 210 coupled to manifold 450. Manifold 450 may distribute some gas to test sockets 210 coupled to test socket outlet 460. Furthermore, manifold 450 may distribute some gas to test sockets 210 coupled to test socket outlet 465. Furthermore, manifold 450 may distribute some gas to test sockets 210 coupled to test socket outlet 470. Additionally, manifold 450 distributes a second portion of the gas to one or more manifolds downstream of manifold 450 via an airtight conduit coupled to manifold outlet 475. As gas flows out of the downstream manifold 450, any remaining gas can be transmitted through manifold outlet 475 to be discharged into the surrounding environment and / or recovered by a gas collection module (not shown). (As in combination) Figure 3 The manifold outlet 475 of the most downstream manifold 450 and / or the outlet of the most downstream test socket 210 in any branch of the test interface plate 415 can be coupled to a vacuum pump and / or other vacuum device (not shown). Such a vacuum pump and / or other vacuum device can actively extract gas from the manifold outlet 475 of the manifold 450 and / or the outlet of the test socket 210 as needed. In this way, incoming gas from the main inlet 420 can flow through the quick-disconnect device 430 and through one or more manifolds 450 to distribute the incoming gas to the multiple test sockets 210 mounted on the test interface plate 415.

[0048] Figure 5 The test socket 210 according to various embodiments is installed when it is mounted Figure 2 A three-quarter section view 500 is shown as a portion of the test system 200. As shown in the three-quarter section view 500, solder balls 520 are configured in a solder ball array 515 and mounted on the lower surface of the reference DUT 510.

[0049] The probe field includes multiple spring probes 540, which can contract and / or expand to contact the solder balls 520 of the solder ball array 515. Similarly, the spring probes 540 can contract and / or expand to contact signal traces on the reference load board 550. In this way, the spring probes 540 can carry signals, power supply voltages, and / or ground connections between the reference DUT 510 and the reference load board 550.

[0050] A floating insert 525 is aligned with a spring probe 540 to establish electrical, mechanical, and / or thermal contact between the spring probe 540 and the corresponding solder ball 520. The spring probe 540 is disposed within a probe housing, which includes an upper probe housing 530 and a lower probe housing 545. The gap between the upper probe housing 530 and the lower probe housing 545 forms a probe field gas channel 535 through which incoming gas flows.

[0051] At least a portion of the spring probe 540 in the probe field is exposed to the incoming gas via the probe field gas channel 535. Gas flows along the flow direction 560 through the lower portion of at least a portion of the spring probe 540 included in the probe field. The amount of the spring probe 540 exposed to the incoming gas can be varied by adjusting the height of the floating insert 525, the upper probe box 530, and / or the lower probe box 545. Generally, the cooling effect of the incoming gas on the spring probe 540 is directly related to the surface area of ​​the spring probe 540 exposed to the incoming gas. Therefore, as the height of the probe field gas channel 535 increases, the cooling effect of the incoming gas flowing through the spring probe 540 increases. Similarly, as the height of the probe field gas channel 535 decreases, the cooling effect of the incoming gas flowing through the spring probe 540 decreases.

[0052] When the spring probe 540 carries signals, power, and / or ground current between the reference DUT 510 and the reference load board 550, the temperature of the spring probe 540 may rise. Although the solder balls 520 themselves have a cooling effect on the spring probe 540, the temperature rise of the spring probe 540 may still reach or exceed the melting point of the solder balls 520 in the solder ball array 515. Therefore, the solder balls 520 may begin to melt, deform, and / or adhere to the top of the spring probe 540.

[0053] These conditions can damage the reference DUT 510, spring probe 540, and / or other components of the test socket 210, such as the floating insert 525 and the upper probe housing 530. To reduce or eliminate melting and / or deformation of the solder ball 520, incoming gas flows through the spring probe 540 via the probe field gas channel 535. The incoming gas flow through the probe field gas channel 535 lowers the temperature of the spring probe 540 at or near the solder ball 520 to a temperature sufficiently below the solder melting point.

[0054] Figure 6 The test socket 210 according to various embodiments is installed when it is mounted Figure 2 A front cross-sectional view 600 of a portion of the test system 200. As shown in the front cross-sectional view 600, solder balls 620 are configured in a solder ball array 615 and mounted on the lower surface of the reference DUT 610.

[0055] The probe field includes multiple spring probes 640, which can retract and / or expand to contact the solder balls 620 of the solder ball array 615. Similarly, the spring probes 640 can retract and / or expand to contact signal traces on the reference load board 650. In this way, the spring probes 640 can carry signals, power supply voltages, and / or ground connections between the reference DUT 610 and the reference load board 650.

[0056] A floating insert 625 is aligned with a spring probe 640 to establish electrical, mechanical, and / or thermal contact between the spring probe 640 and the corresponding solder ball 620. The spring probe is disposed within a probe housing, which includes an upper probe housing 630 and a lower probe housing 645. The gap between the upper probe housing 630 and the lower probe housing 645 forms a probe field gas channel 635 through which incoming gas flows.

[0057] Spring probes 640(0)-640(2) in the probe field are exposed to incoming gas via probe field gas channel 635. Gas flows along flow direction 660 through the lower portion of at least a portion of spring probes 640(0)-640(2). The amount of spring probes 640(0)-640(2) exposed to the incoming gas can be varied by adjusting the height of floating insert 625, upper probe box 630, and / or lower probe box 645. Generally, the cooling effect of the incoming gas on spring probes 640(0)-640(2) is directly related to the surface area of ​​spring probes 640(0)-640(2) exposed to the incoming gas. Therefore, as the height of probe field gas channel 635 increases, the cooling effect of the incoming gas flowing through spring probes 640(0)-640(2) increases. Similarly, as the height of probe field gas channel 635 decreases, the cooling effect of the incoming gas flowing through spring probes 640(0)-640(2) decreases.

[0058] When spring probes 640(0)-640(2) carry signals, power, and / or ground current between reference DUT 610 and reference load board 650, the temperature of spring probes 640(0)-640(2) may rise. Furthermore, the heat generated by one spring probe 640(1) may raise the temperature of one or more adjacent spring probes 640(0), 640(2), and vice versa. Although solder balls 620 themselves have a cooling effect on spring probes 640(0)-640(2), the temperature rise of spring probes 640(0)-640(2) may still rise to near, reach, or exceed the melting point of solder balls 620 in solder ball array 615. Therefore, solder balls 620 may begin to melt, deform, and / or adhere to the top of spring probes 640.

[0059] These conditions may damage the reference device, spring probes 640(0)-640(2), and / or other components of the test socket 210, such as the floating insert 625 and the upper probe box 630. To reduce or eliminate melting and / or deformation of the solder ball 620, incoming gas flows through the spring probes 640(0)-640(2) via the probe field gas channel 635. The incoming gas flowing through the probe field gas channel 635 lowers the temperature of the spring probes 640(0)-640(2) at or near the solder ball 620 to a temperature sufficiently below the solder melting point.

[0060] Figure 7 A cross-sectional view 700 of a test socket 705 according to various embodiments is shown, the test socket 705 having an inlet 720 and an outlet 725 disposed within one or more alignment pins 775(0)-775(1) of the test socket 705. As shown, a reference DUT 710 is mounted in the test socket 705 for testing purposes. A hot head 785 compresses the reference DUT 710 downward toward a reference load plate 750. Alternatively, a manual socket cover (HSL) (not shown) compresses the reference DUT 710 downward toward the reference load plate 750. The hot head 785 or the manual socket cover can dissipate heat from the reference DUT 710. The hot head 785 or the manual socket cover may include an actuator, such as a manual lever, or alternatively, an actuator included in a test processing apparatus, such as... Figure 4 The test processing apparatus 400. When the actuator is engaged, the hot head 785 or manual socket cover compresses the reference DUT 710 by applying downward pressure to it. In some embodiments, the hot head 785 or manual socket cover applies downward pressure to the reference DUT 710 via the base 790. This downward pressure helps to ensure that each spring probe ( Figure 7 (As shown in the figure) Electrical, mechanical, and / or thermal contacts are made between the solder balls on the reference DUT 710 and the corresponding traces on the reference load board 750.

[0061] Test socket 705 may be configured to divide the downward pressure between the reference DUT 710 and the reference load plate 750, such that neither the reference DUT 710 nor the reference load plate 750 is subjected to excessive pressure that could cause damage. In this regard, test socket 705 may include independent force mechanisms. These independent force mechanisms may include a first force mechanism that applies downward pressure to the reference DUT 710 and a second force mechanism that applies downward pressure to the reference load plate 750. These independent force mechanisms may be configured to work with the reference DUT 710 including bare die packages and / or reference DUT 710 including capped packages.

[0062] Test socket 705 includes several alignment pins, including a first alignment pin 775(0) and a second alignment pin 775(1). The alignment pins 775 facilitate precise alignment of the heat head 785 with the test socket 705. Inlet 720 supplies gas to the test socket 705 via an axial hole provided in the first alignment pin 775(0). When the actuator is engaged, the heat head 785 or the manual socket cover applies downward pressure to a seal 780(0) placed near the engagement area of ​​the first alignment pin 775(0) to prevent gas leakage or escape at the inlet 720. Similarly, outlet 725 discharges gas from the test socket 705 via an axial hole provided in the second alignment pin 775(1). When the actuator is engaged, the heat head 785 or the manual socket cover applies downward pressure to a seal 780(1) placed near the engagement area of ​​the second alignment pin 775(1) to prevent gas leakage or escape at the outlet 725. Gas flows from inlet 720 to outlet 725 in the flow direction 760. In some embodiments, a portion of the gas received at inlet 720 may be diverted to flow along other portions of test socket 705 and / or hothead 785 to reduce condensation around reference DUT 710, adjust the temperature near reference DUT 710, etc.

[0063] use Figure 7 The method shown allows test socket 705 to eliminate the need for additional gas connections to be engaged and / or disengaged, for example, Figure 3 The test socket 210 shown has separate inlets 320 and outlets 325. Furthermore, the serviceability of the test socket 705 and its connection to... Figure 4 The integration level of the test interface board 415 has been improved. Furthermore, compared to... Figure 3 The test sockets 210 and 705 shown have a smaller footprint.

[0064] Figure 8 A cross-sectional view 800 of a test socket 805 according to various embodiments is shown, the test socket 805 having an inlet 820 for introducing gas into a chamber 875 of the test socket 805. As shown, a reference DUT 810 is mounted to the test socket 805 for testing purposes. A hot head 885 compresses the reference DUT 810 downward toward a reference load plate (not shown). Alternatively, a manual socket cover (HSL) (not shown) compresses the reference DUT 810 downward toward the reference load plate. The hot head 885 or the manual socket cover can dissipate heat from the reference DUT 810. The hot head 885 or the manual socket cover may include an actuator, such as a manual lever, or alternatively, an actuator included in a test processing apparatus, such as... Figure 4The test processing apparatus 400. When the actuator is engaged, the hot head 885 or the manual socket cover compresses the reference DUT 810 by applying downward pressure to it. In some embodiments, the hot head 885 or the manual socket cover applies downward pressure to the reference DUT 810 via the base 890. This downward pressure helps to ensure that each spring probe ( Figure 8 Electrical, mechanical, and / or thermal contacts are made between the solder balls on the reference DUT 810 and the corresponding traces on the reference load board (not shown in the diagram).

[0065] Test socket 805 may be configured to divide the downward pressure between the reference DUT 810 and the reference load plate, such that neither the reference DUT 810 nor the reference load plate is subjected to excessive pressure that could cause damage. In this regard, test socket 805 may include independent force mechanisms. These independent force mechanisms may include a first force mechanism that applies downward pressure to the reference DUT 810 and a second force mechanism that applies downward pressure to the reference load plate. These independent force mechanisms may be configured to work with reference DUT 810 including bare die packages and / or reference DUT 810 including capped packages.

[0066] Test socket 805 includes an inlet 820 that supplies incoming gas to a chamber 875 surrounding a reference DUT 810 and a hothead 885. A portion of the gas received at inlet 820 may be diverted to flow through chamber 875 and along portions of test socket 805 and / or hothead 885 to reduce condensation around reference DUT 810, adjust the temperature near reference DUT 810, etc. When the actuator is engaged, hothead 885 or the manual socket cover applies downward pressure to a gasket 880(0) placed near one end of test socket 805 to prevent gas leakage or escape at the first end of chamber 875. Similarly, when the actuator is engaged, hothead 885 or the manual socket cover applies downward pressure to a gasket 880(1) placed near inlet 820 to prevent gas leakage or escape at the second end of chamber 875. A portion of the gas is diverted to flow from inlet 820 to outlet 825 along flow direction 860. In some embodiments, outlet 825 discharges gas to an exhaust port to guide and / or recycle waste gas. In some embodiments, outlet 825 discharges gas to the surrounding environment. Discharging gas to the surrounding environment can increase the gas flow through chamber 875, which can make it easier to purify high-humidity gas and reduce condensation more efficiently.

[0067] Figures 9A-9B Various embodiments of measuring and Figure 3The technology for measuring the temperature associated with test socket 210. The temperature associated with test socket 210 can be measured using any technically feasible temperature sensing device, including but not limited to temperature sensors near the reference DUT, optical fibers coupled to an infrared camera or thermal imager, and temperature sensors near the base in contact with the reference DUT. Figure 9A As shown, temperature sensor 920 replaces the spring probe of the test socket. Temperature sensor 920 can be placed under the solder balls of the power pins, ground pins, signal pins, etc., of the reference DUT 910A. Temperature sensor 920 can be placed in any location of interest, such as near areas known to have relatively high temperatures, power or ground pins that consume large amounts of current, areas near circuitry of interest, etc. Like a spring probe, temperature sensor 920 is compressible or otherwise compliant to establish sufficient contact between the solder balls mounted on the reference DUT 910A and the signal traces on the reference load board 950A. For temperature measurement, temperature sensor 920 may include a thermocouple, a resistance temperature detector, etc. A first end of temperature sensor 920 contacts or is placed near the solder balls mounted on the reference DUT 910A or a portion of the bottom surface of the reference DUT 910A. The second end of the temperature sensor 920 passes through the reference load plate 950A and transmits a temperature signal 940. The temperature signal 940 can be combined with temperature signals from one or more other temperature measuring devices and transmitted as a combined temperature signal 240 and / or a combined auxiliary temperature signal 245 to... Figure 2 Temperature controller 220. In some embodiments, temperature sensor 920 may be small enough that it is feasible to place it between adjacent spring probes. In such embodiments, temperature sensor 920 may be placed in the gap between adjacent spring probes without replacing the spring probes with temperature sensor 920.

[0068] like Figure 9BAs shown, fiber optic cable 925 replaces the spring probe of the test socket. Fiber optic cable 925 can be placed under the solder balls of the power pins, ground pins, signal pins, etc., of the reference DUT 910B. Fiber optic cable 925 can be placed in any location of interest, such as near areas known to have relatively high temperatures, power or ground pins that consume large amounts of current, or areas near circuits of interest. The first end of fiber optic cable 925 contacts or is placed close to the solder balls mounted on the reference DUT 910B or a portion of the bottom surface of the reference DUT 910B. Fiber optic cable 925 passes through the reference load plate 950B, and the second end of the fiber contacts or is placed close to the infrared camera 930, thermal imager, and / or other suitable imaging equipment. Infrared camera 930 (or other imaging device) captures or acquires images of the solder balls and / or other parts of the bottom of reference DUT 910B. Infrared camera 930 determines temperature values ​​from the images using thermal imaging technology and / or other similar techniques. Infrared camera 930 transmits a temperature signal 945 based on the determined temperature values. Temperature signal 945 can be combined with temperature signals from one or more other temperature measuring devices and transmitted as a combined temperature signal 240 and / or a combined auxiliary temperature signal 245 to... Figure 2 Temperature controller 220. In some embodiments, optical fiber 925 may be small enough that it is feasible to place it between adjacent spring probes. In such embodiments, optical fiber 925 may be placed in the gap between adjacent spring probes without replacing the spring probes with optical fiber 925.

[0069] In some embodiments, the temperature sensor may be embedded in the base of the test socket, for example, Figure 7 The base 790 of the test socket 705 shown Figure 8 The base 890 of the test socket 805 shown is an example. Such a temperature sensor may include a thermocouple, a resistance temperature detector, etc. In some embodiments, the temperature may be determined based on the properties of the material in the package of the reference DUT itself. In such an embodiment, the temperature controller 220 can determine the temperature by measuring the voltage and current consumed by the power supply supplying the reference DUT. The temperature controller 220 can determine the total contact resistance to detect the increase in material conductivity due to temperature changes. Using this data, the temperature controller 220 can determine the temperature based on the material used in the contacts of the reference DUT, based on the rate at which the contact resistivity increases with temperature.

[0070] Figure 10 This is an illustration based on various embodiments. Figure 2The surface temperature change 1010 of the test system 200 is plotted as a curve 1000 relative to the peak gas velocity 1020. As shown in the figure, according to the characteristic curve 1030, as the peak gas velocity 1020 in the probe field increases, the surface temperature change 1010 in degrees Celsius (°C) either increases in magnitude or decreases in value. The characteristic curve 1030 can be determined based on any number of relevant factors, including but not limited to the configuration and materials of the reference DUT, the configuration and materials of the test socket on which the reference DUT is mounted, the specific incoming gas used to cool the spring probe of the test socket, and the temperature and humidity of the incoming gas.

[0071] As shown in the figure, characteristic curve 1030 indicates that there is no surface temperature change 1010 when there is no measurable peak gas velocity 1020 (0 m / s) passing through the probe field. Characteristic curve 1030 indicates that a peak gas velocity 1020 of 3 m / s passing through the probe field can produce a surface temperature change of approximately -12 degrees Celsius 1010. Furthermore, characteristic curve 1030 indicates that a peak gas velocity 1020 of 6 m / s passing through the probe field can produce a surface temperature change of approximately -22 degrees Celsius 1010. Characteristic curve 1030 indicates that a peak gas velocity 1020 of 9 m / s passing through the probe field can produce a surface temperature change of approximately -31 degrees Celsius 1010. Characteristic curve 1030 indicates that a peak gas velocity 1020 of 12 m / s passing through the probe field can produce a surface temperature change of approximately -37 degrees Celsius 1010. Characteristic curve 1030 shows that a peak gas velocity 1020 of 15 m / s passing through the probe field can produce a surface temperature change of about -42 degrees Celsius 1010.

[0072] Figure 2 Temperature controller 220 can measure one or more temperatures associated with a reference DUT. Based on these temperatures, temperature controller 220 can determine the amount of temperature change that sufficiently reduces the temperature of the one or more temperatures associated with the reference DUT. More specifically, temperature controller 220 can determine the amount of temperature change that reduces the temperature of the solder balls mounted on the reference DUT below the solder melting point. Temperature controller 220 can use characteristic curve 1030 and / or other suitable characteristic data to determine gas flow based on the amount of temperature change that sufficiently reduces the temperature of the reference DUT. Temperature controller 220 can transmit a valve control signal 260 to flow control valve 225 to cause flow control valve 225 to deliver gas to the test socket where the reference DUT is mounted at a determined flow rate.

[0073] Figure 11 It is for control according to various embodiments Figure 3 A flowchart of the method steps for testing the temperature in the interconnection of socket 210. Although combined Figures 1-10The system describes the method steps, but those skilled in the art will understand that any system configured to perform these method steps in any order is within the scope of this disclosure.

[0074] As shown in the figure, method 1100 begins with step 1102, wherein the temperature controller (e.g., Figure 2 The temperature controller 220 determines the input temperature associated with the reference device under test (DUT). The temperature controller receives temperature signals from one or more temperature measuring devices included in the test socket where the reference DUT is mounted. In some embodiments, the temperature controller may receive auxiliary temperature signals from one or more temperature measuring devices included in the test fixture including the test socket. The temperature signals may be generated by any suitable temperature sensing device, including but not limited to temperature sensors near the reference DUT, optical fibers coupled to an infrared camera or thermal imager, temperature sensors near a base in contact with the reference DUT, etc. Based on the temperature signals and / or auxiliary temperature signals, the temperature controller determines the input temperature associated with the reference DUT.

[0075] In step 1104, the temperature controller determines at least one of the following: gas flow rate, humidity level, and / or temperature, based on the input temperature determined in step 1102. The temperature controller may determine the flow rate based on a characteristic curve that defines the surface temperature change resulting from the peak gas velocity of the gas flowing through the spring probe in the test socket where the reference DUT is mounted. The characteristic curve may be determined based on any number of relevant factors, including but not limited to the configuration and materials of the reference DUT, the configuration and materials of the test socket where the reference DUT is mounted, the specific incoming gas used to cool the spring probe of the test socket, the temperature and humidity of the incoming gas, etc.

[0076] Furthermore, the temperature controller can adjust the gas temperature to compensate for heat loss caused by the heat head absorbing heat from the reference DUT when it is installed in the test socket 210, and to compensate for thermal gain and / or quantity loss caused by the reference DUT having a packaged stack (POP) configuration. If the gas is not dry enough, the temperature controller can also reduce the gas humidity. Similarly, the temperature controller can adjust the gas humidity to increase or decrease the cooling effect of the gas on the spring probe included in the test socket.

[0077] In step 1106, the temperature controller adjusts the flow control valve to deliver gas at that flow rate. During this process, the temperature controller transmits a valve control signal to the flow control valve. By transmitting the valve control signal, the temperature controller adjusts the flow control valve to direct at least a portion of the purified gas received from the test fixture and supply that portion of the gas to the test socket. The flow control valve restricts gas flow to limit and / or control the amount of purified gas passing through it. The flow control valve can restrict and / or control the flow of purified gas using any technically feasible mechanism for controlling gas flow (e.g., solenoid, motor, diaphragm, piston, hydraulic control device, etc.).

[0078] In step 1108, the temperature controller adjusts the humidity level of the gas. The temperature controller adjusts the humidity level by transmitting a humidity control signal to the gas conditioning module. In response, the gas conditioning module increases the humidity of the gas, decreases the humidity of the gas, or maintains the current humidity of the gas based on the humidity control signal.

[0079] In step 1110, the temperature controller adjusts the gas temperature. The temperature controller regulates the temperature by transmitting a humidity control signal to the gas conditioning module. In response, the gas conditioning module increases, decreases, or maintains the current gas temperature based on the temperature control signal.

[0080] In step 1112, the temperature controller supplies gas to the test socket where the reference device under test (DUT) is mounted. The temperature controller supplies gas to the test socket after adjusting the gas flow rate, the gas humidity level, and / or the gas temperature. During this process, the temperature controller provides closed-loop temperature control to continuously monitor the spring probe temperature and / or the DUT temperature. These adjustments maintain gas flow to the test socket to maintain the desired temperature of the solder balls mounted on the reference DUT and prevent the solder balls from melting.

[0081] In summary, the disclosed technology includes a test socket equipped with standard spring probes, featuring an improved design that forms a channel between the upper and lower housings of the test socket through which gas (e.g., compressed dry air (CDA)) flows. This channel can expose the spring probes across the entire field to the gas flow. Alternatively, selected portions of the spring probes can be exposed to the gas flow, while other spring probes remain unexposed. This method of exposing only selected portions of the spring probes to the gas flow can be used for various purposes, such as maintaining consistent impedance along the path of spring probes carrying high-speed signals. The test socket is designed with connection points for gas supply and exhaust ports to the environment or for delivering exhaust gases to a preferred emission location.

[0082] One configuration allows gas to be supplied to the test socket via alignment pins, which are typically used to ensure that the hothead and / or manual socket cover are accurately positioned and mounted on the test socket. Each of these alignment pins may have an axial bore along the main axis, and a sealing mechanism added to the test socket to prevent gas leakage. One alignment pin may be connected to the supply side of the internal socket gas flow passage, while another alignment pin may be connected to the exhaust side. If it is not necessary to divert the flow away from this area, the exhaust may also be delivered to a port on the socket frame. Another method utilizes purge gas entering from the hothead condensation elimination chamber, which seals around the top of the socket when the hothead is fully engaged. CDA is supplied to this enclosed chamber and sealed volume. Additionally, a portion of the CDA is diverted to an inlet in the test socket frame, also located within the sealed area. This configuration allows the purge gas to flow through the test socket passage and then be discharged directly to a port outside the sealed area or to other test sockets via piping and one or more manifolds. Some embodiments provide novel methods for connecting gas supply and / or exhaust to a test socket, which can simplify the integration of the test processing device or a manual socket cover.

[0083] At least one technical advantage of the disclosed technology over the prior art lies in its ability to continuously monitor the spring probe temperature and / or DUT temperature using closed-loop temperature control, and adjust the gas flow to the test socket containing the reference DUT to maintain the desired temperature of the reference DUT. Furthermore, the test system can use the same spring probes deployed in conventional systems without requiring specially manufactured spring probes, such as those that may not be compatible with longer spring probes in existing test systems. Additionally, the disclosed solution can be adapted and integrated into existing gas connections, test systems, and test processing devices commonly found in test environments. These advantages represent one or more technical improvements over prior art methods.

[0084] 1. In some embodiments, a method includes: determining an input temperature associated with a reference device under test (DUT); determining a gas flow rate based on the input temperature; and adjusting a flow control valve to supply gas to the reference DUT at that flow rate.

[0085] 2. The method according to Clause 1, wherein the gas comprises compressed dry air.

[0086] 3. The method according to Clause 1 or Clause 2, wherein: the reference DUT is installed in the test socket, and the gas is compressed before being supplied to the test socket.

[0087] 4. The method according to any one of Clauses 1-3, wherein: the reference DUT is mounted on the test socket, and gas is discharged from the test socket.

[0088] 5. The method according to any one of Clauses 1-4, wherein: the gas is discharged via the outlet of the test socket, the outlet being coupled to a vacuum device.

[0089] 6. The method according to any one of Clauses 1-5, wherein: the reference DUT is mounted on a test socket, the test socket is equipped with a spring probe, and gas is supplied to the spring probe through a channel between the upper housing and the lower housing of the test socket.

[0090] 7. The method according to any one of Clauses 1-6, wherein: the reference DUT is mounted on the test socket, and gas is supplied to the reference DUT via a channel between the bottom surface of the reference DUT and the top surface of the test socket.

[0091] 8. The method according to any one of Clauses 1-7, wherein: the reference DUT is mounted in the test socket, and the channel exposes gas to at least one of the spring probes provided in the test socket or solder balls coupled to the reference DUT.

[0092] 9. The method according to any one of Clauses 1-8, wherein: the reference DUT is mounted on a test socket, a first portion of a plurality of spring probes provided on the test socket is exposed to a gas, and a second portion of the plurality of spring probes is not exposed to a gas.

[0093] 10. The method according to any one of clauses 1-9, wherein: the reference DUT is mounted on the test socket, and gas is supplied to the reference DUT via a connection point including the inlet of the test socket.

[0094] 11. The method according to any one of Clauses 1-10, wherein: the reference DUT is mounted on the test socket, and gas is discharged from the reference DUT via at least one of: an exhaust port of the test socket to discharge gas to the surrounding environment; or a connection point including the outlet of the test socket to discharge gas to a designated location.

[0095] 12. The method according to any one of Clauses 1-11 further comprises: changing the temperature of the gas by cooling and / or heating the gas before supplying the gas to the reference DUT.

[0096] 13. The method according to any one of Clauses 1-12, wherein: the reference DUT is mounted on a test socket, a portion of which comprises a material having very high thermal conductivity and very low electrical conductivity.

[0097] 14. The method according to any one of Clauses 1-13, wherein: the reference DUT is mounted on the test socket, gas is supplied to the reference DUT via a first alignment pin of the test socket, and gas is discharged from the reference DUT via a second alignment pin of the test socket.

[0098] 15. The method according to any one of clauses 1-14, wherein: the first alignment pin includes a first axial bore through which gas is supplied, and the second alignment pin includes a second axial bore through which gas is discharged.

[0099] 16. The method according to any one of clauses 1-15, wherein: the reference DUT is mounted on the test socket, and gas is discharged from the reference DUT through an exhaust port on the frame of the test socket.

[0100] 17. The method according to any one of Clauses 1-16, wherein: the reference DUT is mounted on a first test socket, and the gas includes a portion of a stream of purge gas diverted from the hothead condensation elimination chamber, which is sealed to prevent the purge gas from escaping when the hothead of the first test socket is engaged.

[0101] 18. The method according to any one of clauses 1-17, wherein: the second reference DUT is mounted on the second test socket, gas is supplied via an inlet coupled to the hot head condensation elimination chamber, and gas is discharged via at least one of an outlet coupled to the hot head condensation elimination chamber or a conduit to the second test socket.

[0102] 19. The method according to any one of Clauses 1-18, wherein: gas is supplied via a manifold system equipped with a quick disconnect device to a plurality of test sockets installed in a test processing apparatus, with reference to the DUT installed in a first test socket included among the plurality of test sockets.

[0103] 20. The method according to any one of clauses 1-19, wherein the input temperature includes the junction temperature associated with the reference DUT.

[0104] 21. The method according to any one of clauses 1-20, wherein determining the input temperature comprises: receiving a temperature signal from a temperature probe coupled to a reference DUT; and setting the input temperature based on the temperature signal.

[0105] 22. The method according to any one of Clauses 1-21, wherein determining the input temperature comprises: acquiring an image of a portion of a reference DUT; determining a temperature associated with the reference DUT from the image; and setting the input temperature based on the temperature associated with the reference DUT.

[0106] 23. The method according to any one of clauses 1-22, wherein the image is acquired via at least one of: an optical fiber optically coupled to that portion of the reference DUT, or an infrared temperature measuring device configured to acquire the image.

[0107] 24. The method according to any one of clauses 1-23, wherein determining the input temperature comprises: receiving a temperature signal from a temperature sensor coupled to a base that compresses a reference DUT into a test socket; and setting the input temperature based on the temperature signal.

[0108] 25. In some embodiments, a test system includes: a test socket to which a reference device under test (DUT) is mounted; a temperature sensing device for generating a temperature signal associated with the reference DUT; and a temperature controller for determining an input temperature associated with the reference (DUT) based on the temperature signal, determining a gas flow rate based on the input temperature, and adjusting a flow control valve to supply gas to the reference DUT at the flow rate.

[0109] Any element of any claim recited in any claim and / or any element described in this application, and any combination thereof, falls in any way within the intended scope of this disclosure and protection.

[0110] The various modules of the disclosed system can access computer-readable media, which is known or understood to include removable media (e.g., security digital (SD) cards, optical discs (CD), digital versatile optical discs (DVD) ROMs, etc.) as well as non-removable or internal media (e.g., hard disk drives (HDDs), solid-state drives (SSDs), RAM, ROM, flash memory, etc.).

[0111] Although this disclosure has been illustrated and described with respect to one or more exemplary embodiments, equivalent changes and modifications will be available to those skilled in the art upon reading and understanding this specification and the accompanying drawings. In particular, with respect to the various functions performed by the aforementioned components (assemblies, devices, etc.), unless otherwise stated, the terminology used to describe these components (including references to “device”) is intended to correspond to any component performing a specified function of said component (e.g., functionally equivalent), even if structurally not equivalent to the disclosed structure performing that function in the illustrated exemplary embodiments of this disclosure. Furthermore, while specific features of this disclosure may be disclosed with respect to only one embodiment among several embodiments, such features may be combined with one or more features of other embodiments, which may be desirable and advantageous for any given or particular application. Those skilled in the art will understand that the architecture described in the figures does not limit the scope of the various embodiments of this disclosure.

[0112] The description of various embodiments is for illustrative purposes and is not intended to be exhaustive or limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments.

[0113] Various aspects of this embodiment may be embodied as a system, method, or computer program product. Therefore, aspects of this disclosure may take the form of a completely hardware embodiment, a completely software embodiment (including firmware, resident software, microcode, etc.), or an embodiment combining software and hardware aspects, which are generally referred to herein as “modules,” “systems,” or “computers.” Furthermore, any hardware and / or software techniques, processes, functions, components, engines, modules, or systems described in this disclosure may be implemented as circuits or sets of circuits. Additionally, aspects of this disclosure may take the form of a computer program product embodied in one or more computer-readable media having computer-readable program code.

[0114] Any combination of one or more computer-readable media may be used. A computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. For example, a computer-readable storage medium can be, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of computer-readable storage media will include the following: an electrical connection having one or more wires, a portable computer floppy disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable optical disc read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer-readable storage medium can be any tangible medium capable of containing or storing a program for use by or in connection with an instruction execution system, apparatus, or device.

[0115] The foregoing description of various aspects of this disclosure refers to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this disclosure. It will be understood that each block in the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine. When executed by a processor of a computer or other programmable data processing apparatus, these instructions can implement one or more functions / actions specified in the flowchart illustrations and / or block diagram blocks. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, an application-specific processor, a field-programmable gate array, etc.

[0116] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code, including one or more executable instructions for implementing one or more specified logical functions. It should also be noted that in some alternative implementations, the functions marked in the blocks may not appear in the order indicated in the figures. For example, two blocks shown consecutively may actually be executed substantially simultaneously, or the blocks may sometimes be executed in reverse order, depending on the functions involved. It will also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented by a system based on dedicated hardware, or a combination of dedicated hardware and computer instructions, that performs the specified functions or actions.

[0117] While the foregoing describes embodiments of this disclosure, other and further embodiments of this disclosure may be devised without departing from its essential scope, the scope of which is defined by the claims.

Claims

1. A method comprising: determining an input temperature associated with a reference device under test (DUT); determining a flow rate of a gas based on the input temperature; adjusting a flow control valve to supply the gas to the reference DUT at the flow rate. The gas comprises compressed dry air.

2. The method of claim 1, wherein, 3. The method of claim 1, wherein: the reference DUT is mounted to a test socket, and the gas is compressed prior to being supplied to the test socket.

4. The method of claim 1, wherein: the reference DUT is mounted to a test socket, and the gas is exhausted from the test socket.

5. The method of claim 4, wherein: the gas is exhausted via an outlet of the test socket, and the outlet is coupled to a vacuum device.

6. The method of claim 1, wherein: the reference DUT is mounted to a test socket, the test socket is equipped with spring probes, and the gas is supplied to the spring probes via a passage between an upper housing of the test socket and a lower housing of the test socket.

7. The method of claim 1, wherein: the reference DUT is mounted to a test socket, and the gas is supplied to the reference DUT via a passage between a bottom surface of the reference DUT and a top surface of the test socket.

8. The method of claim 7, wherein: the reference DUT is mounted to a test socket, and the passage exposes the gas to at least one of: spring probes equipped to the test socket, or solder balls coupled to the reference DUT.

9. The method of claim 1, wherein: the reference DUT is mounted to a test socket, a first portion of a plurality of spring probes equipped to the test socket is exposed to the gas, and a second portion of the plurality of spring probes is not exposed to the gas.

10. The method of claim 1, wherein: the reference DUT is mounted to a test socket, and the gas is supplied to the reference DUT via a connection point comprising an inlet of the test socket.

11. The method of claim 1, wherein: the reference DUT is mounted to a test socket, and the gas is exhausted from the reference DUT via at least one of: an exhaust port of the test socket that exhausts the gas to an ambient environment; or a connection point comprising an outlet of the test socket that exhausts the gas to a designated location. prior to supplying the gas to the reference DUT, changing a temperature of the gas by cooling the gas and / or heating the gas.

12. The method of claim 1, further comprising:

13. The method of claim 1, wherein: the reference DUT is mounted to a test socket, and a portion of the test socket comprises a material having very high thermal conductivity and very low electrical conductivity.

14. The method of claim 1, wherein: the reference DUT is mounted to a test socket, the gas is supplied to the reference DUT via a first alignment pin of the test socket, and the gas is exhausted from the reference DUT via a second alignment pin of the test socket. ​ 15. The method of claim 14, wherein: the first alignment pin includes a first axial bore through which the gas is supplied, and the second alignment pin includes a second axial bore through which the gas is exhausted.

16. The method of claim 1, wherein: the reference DUT is mounted to a test socket, and the gas is exhausted from the reference DUT via a gas exhaust on a frame of the test socket.

17. The method of claim 1, wherein: the reference DUT is mounted to a first test socket, and the gas includes a portion of a flow of purge gas diverted from a hot chuck condensate elimination chamber that is sealed to prevent the purge gas from escaping when a hot chuck of the first test socket is engaged.

18. The method of claim 17, wherein: a second reference DUT is mounted to a second test socket, the gas is supplied via a gas inlet coupled to the hot chuck condensate elimination chamber, and the gas is exhausted via at least one of: a gas outlet coupled to the hot chuck condensate elimination chamber, or a conduit to the second test socket.

19. The method of claim 17, wherein: the gas is supplied to a plurality of test sockets mounted to a test handling device via a manifold system equipped with a quick disconnect, and the reference DUT is mounted to a first test socket of the plurality of test sockets.

20. The method of claim 1, wherein, the input temperature includes a junction temperature associated with the reference DUT.

21. The method of claim 1, wherein, determining the input temperature includes: receiving a temperature signal from a temperature probe coupled to the reference DUT; and setting the input temperature based on the temperature signal.

22. The method of claim 1, wherein, determining the input temperature includes: acquiring an image of a portion of the reference DUT; determining a temperature associated with the reference DUT from the image; and setting the input temperature based on the temperature associated with the reference DUT.

23. The method of claim 22, wherein, the image is acquired via at least one of: an optical fiber optically coupled to the portion of the reference DUT, or an infrared temperature measurement device configured to acquire the image.

24. The method of claim 1, wherein, determining the input temperature includes: receiving a temperature signal from a temperature sensor coupled to a base that compresses the reference DUT into a test socket; and setting the input temperature based on the temperature signal.

25. A test system comprising: a test socket to which a reference device under test (DUT) is mounted; a temperature sensing device that generates a temperature signal associated with the reference DUT; a temperature controller that: determines an input temperature associated with the reference DUT based on the temperature signal, determines a flow rate of a gas based on the input temperature, and adjusts a flow control valve to supply the gas to the reference DUT at the flow rate. ​

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