Electronic device and method for forming electronic device

Abstract

A method for forming an electronic device is provided. The method comprises: providing a light transmissive carrier having an auxiliary layer on a front surface thereof; forming a plurality of conductive patterns on the auxiliary layer; disposing at least one electronic component on at least a portion of the plurality of conductive patterns via a plurality of solder bumps; exposing the auxiliary layer to a light source through the light-transmitting carrier to heat the auxiliary layer and reflow the plurality of solder bumps; forming a mold cover on the auxiliary layer to encapsulate the plurality of conductive patterns and the at least one electronic component to form the electronic device; and removing the auxiliary layer and the light transmissive carrier from the electronic device to expose the plurality of conductive patterns.

Description

Technical Field

[0001] This application generally relates to semiconductor technology, and more specifically, to an electronic device and a method for forming the electronic device. Background Technology

[0002] The semiconductor industry has consistently faced complex integration challenges as consumers demand smaller, faster, and higher-performing electronic devices, packing increasing functionality into single devices. Typically, semiconductor packaging and assembly processes involve attaching electronic components (such as semiconductor chips) to conductive pads on a substrate, with solder bumps positioned between the conductive pads and the electronic components. Heating processes can be used to reflow the solder bumps, thus bonding the electronic components to the substrate.

[0003] In some cases, electronic devices may not require a substrate; that is, the electronic components of the device can be integrally formed with the conductive pattern using a mold or similar encapsulation. Substrate-free electronic devices offer the advantages of reduced device warpage during the packaging process and smaller package size. However, current bonding techniques used to bond electronic components to conductive patterns can be ineffective and may potentially introduce defects within the resulting electronic device.

[0004] Therefore, effective bonding techniques are needed to form substrate-free electronic devices. Summary of the Invention

[0005] The objective of this application is to provide a method for forming substrate-free electronic devices using an efficient bonding technique.

[0006] According to one aspect of this application, a method for forming an electronic device is provided. The method includes: providing a light-transmitting carrier having an auxiliary layer on its front surface; forming a plurality of conductive patterns on the auxiliary layer; placing at least one electronic component on at least a portion of the plurality of conductive patterns via a plurality of solder bumps; exposing the auxiliary layer to a light source through the light-transmitting carrier to heat the auxiliary layer and reflow the plurality of solder bumps; forming a mold cap on the auxiliary layer to encapsulate the plurality of conductive patterns and the at least one electronic component to form the electronic device; and removing the auxiliary layer and the light-transmitting carrier from the electronic device to expose the plurality of conductive patterns.

[0007] It should be understood that the above general description and the following detailed description are merely illustrative and explanatory and do not limit the invention. Furthermore, the accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. Attached Figure Description

[0008] The drawings referenced herein form part of this specification. Unless the detailed description explicitly indicates otherwise, the features shown in the drawings illustrate only some embodiments of this application, and not all embodiments of this application, and should not be implied by the reader of this specification in the contrary.

[0009] Figures 1A to 1G The various steps of a method for forming an electronic device according to a first embodiment of this application are shown.

[0010] Figure 2 The laser irradiation step for heating the auxiliary layer and reflow solder bumps in a method for forming an electronic device according to a second embodiment of this application is shown.

[0011] Use the same icon number to refer to the same or similar parts in a continuous diagram. Detailed Implementation

[0012] The following detailed description of exemplary embodiments of this application takes into account the accompanying drawings, which form a part of the description. The drawings illustrate specific exemplary embodiments in which this application may be practiced. The detailed description, including the drawings, describes these embodiments in sufficient detail to enable those skilled in the art to practice this application. Those skilled in the art may further utilize other embodiments of this application and make logical, mechanical, and other changes without departing from the spirit or scope of this application. Therefore, the reader of the following detailed description should not interpret the description in a limiting sense, and the scope of the embodiments of this application is defined only by the appended claims.

[0013] In this application, unless otherwise expressly stated, the use of the singular includes the plural form. In this application, unless otherwise stated, the use of “or” means “and / or”. Furthermore, the use of the term “comprising” is not restrictive. Additionally, unless otherwise expressly stated, terms such as “element” or “assembly” cover both elements and assemblies comprising one unit and elements and assemblies comprising more than one sub-unit. Furthermore, the section headings used herein are for organizational purposes only and should not be construed as limiting the subject matter described.

[0014] As used herein, for ease of description, spatial relative terms such as “below,” “under,” “above,” “upper,” “upper,” “lower,” “left,” “right,” “vertical,” “horizontal,” and “side” may be used to describe the relationship between an element or feature and another element (or feature) or feature (or feature), as shown in the diagrams. In addition to the orientations depicted in the diagrams, the spatial relative terms are intended to cover different orientations of the device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein shall be interpreted accordingly. It should be understood that when an element is referred to as “connected to” or “coupled to” another element, the element may be directly connected to or coupled to the other element, or there may be intermediate elements present.

[0015] As mentioned above, some electronic devices may use a mold or similar encapsulation instead of a substrate to form a single unit with a conductive pattern (e.g., conductive pads). Substrate-free electronics can have the advantages of reduced device warpage during the packaging process and smaller package size. Typically, laser-assisted bonding (LAB) technology can be applied to bond electronic components to conductive pads with better temperature control. During the LAB bonding process, a laser source emits a laser beam that can directly reach the electronic component, then heats and re-solders the solder bumps between the electronic component and the conductive pattern to form an electrical connection therebetween. However, the inventors of this application have noted that in some cases, the electronic components of such devices may have different sizes, and the laser energy received by the solder bumps under the electronic components of different sizes during the LAB process may be very different, resulting in undesirable temperature differences between the solder bumps.

[0016] To address this problem, a novel method for forming electronic devices is provided. A light-transmitting carrier having an auxiliary layer thereon is provided. Next, a conductive pattern is formed on the auxiliary layer, and at least one electronic component is disposed on the conductive pattern via solder bumps. Next, a laser beam is emitted from the back of the auxiliary layer through the light-transmitting carrier to the auxiliary layer to heat the auxiliary layer and re-solder the solder bumps. Therefore, the auxiliary layer can receive substantially uniform laser radiation and further convert the laser energy into heat that is more uniformly distributed on the auxiliary layer. Thus, the solder bumps on the auxiliary layer can be heated and re-soldered more uniformly. The auxiliary layer and the light-transmitting carrier can be removed in subsequent steps. In this way, a substrate-free electronic device with improved bonding quality can be formed.

[0017] Figures 1A to 1G The various steps of a method for forming an electronic device according to a first embodiment of this application are illustrated. The electronic device formed using said method... Figure 1G It is displayed in the middle.

[0018] like Figure 1A As shown, a carrier assembly 100 is provided, which can be used as a platform for forming electronic devices thereon. In some embodiments, the carrier assembly 100 may include a copper-clad laminate (CCL) layer having a light-transmitting carrier 101 and an auxiliary layer disposed on the front surface of the light-transmitting carrier 101. The light-transmitting carrier 101 may contain a transparent material, such as glass or quartz, that allows a laser beam to pass through it. The auxiliary layer may contain a metallic material, such as a copper layer, which can facilitate subsequent formation of conductive patterns thereon and can also aid in the bonding process for forming electronic devices.

[0019] exist Figure 1A In the embodiments shown, the auxiliary layer further includes a first auxiliary film 110 formed on and in contact with the light-transmitting carrier 101, and a second auxiliary film 111 attached to the first auxiliary film 110. Specifically, the first auxiliary film 110 may include a copper foil, and the second auxiliary film 111 may include another copper foil identical to the copper foil of the first auxiliary film 110. In some embodiments, the second auxiliary film 111 can be attached to the first auxiliary film 110 by electrostatic adsorption to form a temporary connection with the first auxiliary film 110. For example, before or during the step of attaching the second auxiliary film 111 to the first auxiliary film 110, an electrostatic generator may be coupled to the second auxiliary film 111 to generate static electricity in the second auxiliary film 111. Therefore, when the second auxiliary film 111 approaches the first auxiliary film 110, the second auxiliary film 111 can adhere to the first auxiliary film 110 by electrostatic adsorption. Temporary adhesion can be provided between the first auxiliary film 110 and the second auxiliary film 111 by electrostatic adsorption, and the first auxiliary film 110 and the second auxiliary film 111 can be easily separated when the first auxiliary film 110 and the second auxiliary film 111 are pulled apart.

[0020] Furthermore, the back surface of the second auxiliary film 111 and / or the front surface of the first auxiliary film 110 may be roughened surfaces formed by a knurling tool, which enhances the adhesion between the auxiliary films 110 and 111. In some embodiments, an adhesive material may be further applied between the first auxiliary film 110 and the second auxiliary film 111 to provide additional adhesion. In some embodiments, an adhesive interlayer may be applied between the light-transmitting carrier 101 and the first auxiliary film 110, such that the first auxiliary film 110 can be firmly adhered to the light-transmitting carrier 101. It should be noted that the adhesion between the light-transmitting carrier 101 and the first auxiliary film 110 may be stronger than the adhesion between the first auxiliary film 110 and the second auxiliary film 111, which allows the carrier assembly 100 to separate at the interface between the first auxiliary film 110 and the second auxiliary film 111 when subjected to external force, as will be described in detail later.

[0021] The auxiliary films 110 and 111 may be temporarily connected together in other ways. In some alternative embodiments, at least one of the first auxiliary film 110 and the second auxiliary film 111 may contain a ferromagnetic material, such that the first auxiliary film 110 and the second auxiliary film 111 may be attached to each other by magnetic attraction.

[0022] The second auxiliary film 111 can also be used as a seed layer for forming conductive patterns thereon. Therefore, the material of the second auxiliary film 111 can be selected to have good compatibility with the conductive pattern to be formed. In some embodiments, the second auxiliary film 111 may contain a different material than the first auxiliary film 110. Therefore, the first auxiliary film 110 can be designed to allow better adhesion to the light-transmitting carrier 101, and the second auxiliary film 111 can be designed to allow better formation of conductive patterns.

[0023] Furthermore, the auxiliary layer mentioned above can be a two-layer or multi-layer structure. Alternatively, in some embodiments, the auxiliary layer may be formed as a single piece instead of such a laminated structure. For example, the auxiliary layer can be adhered to the light-transmitting carrier via an adhesive material between the auxiliary layer and the light-transmitting carrier.

[0024] In some embodiments, the carrier assembly 100 may be commercially available from a supplier. For example, the carrier assembly 100 may be a copper-clad laminate. It is also understood that the carrier assembly 100 may be formed on-site by laminating two or more layers where other subsequent processing steps can be performed, which allows for better customization, such as customizing the material composition or structure of auxiliary layers.

[0025] Next, as Figure 1B As shown, the conductive pattern 112 is formed on an auxiliary layer, or specifically, on a first auxiliary film 111. The conductive pattern 112 may comprise copper, nickel, or a combination thereof, or any other suitable conductive material. As mentioned above, the conductive pattern 112 may comprise the same or similar material as the second auxiliary film 111, such that the second auxiliary film 111 can guide and facilitate the formation of the conductive pattern 112 thereon. More specifically, a conductive material layer may first be formed on the second auxiliary film 111 as a raw material for forming the conductive pattern 112. Next, a mask layer having openings therethrough may be formed on the top surface of the conductive material layer to define the layout of the conductive pattern 112 to be formed. Next, an etching process may be performed to remove at least a portion of the conductive material layer exposed from the openings in the mask layer, thereby forming the conductive pattern 112. It is also understood that the removal process may be performed by other techniques, such as laser etching, milling, drilling, clamping, or a combination thereof, or any other suitable processing.

[0026] Next, as Figure 1CAs shown, at least one electronic component 121 is disposed on at least a portion of a conductive pattern 112 via solder bumps 123. The at least one electronic component 121 may include a conductive pad 122 on its back surface, the conductive pad 122 being aligned with a portion of the conductive pattern 112. More specifically, solder bump material comprising metal powder may be disposed or applied on the conductive pattern 112. Then, at least one electronic component 121 may be disposed on the conductive pattern 112, wherein the solder bump material is disposed between one of the conductive patterns 112 and a corresponding conductive pad 122 of the at least one electronic component 121.

[0027] In some embodiments, electronic component 121 may comprise a semiconductor die. In some other embodiments, electronic component 121 may comprise various types of electronic modules, such as semiconductor chips, resistors, capacitors, or other integrated circuit chips. Furthermore, as... Figure 1C As shown, a plurality of electronic components 121 are mounted on a conductive pattern 112, wherein the electronic components 121 have various sizes and layouts. In some embodiments, flux material may be further applied within the solder bump material or dispensed onto the conductive pattern 112 to facilitate subsequent bonding processes.

[0028] Next, a light source, such as a laser source 130, can be placed below the light-transmitting carrier 101 to emit a laser beam, thereby bonding at least one electronic component 121 to the conductive pattern 112.

[0029] like Figure 1D As shown, a laser source 130 is activated to emit a laser beam that radiates directly through a light-transmitting carrier 101 to the first auxiliary film 110 and the second auxiliary film 111. In this way, a sufficient amount of laser radiation can reach the first auxiliary film 110 and the second auxiliary film 111. Since the first auxiliary film 110 and the second auxiliary film 111 may contain a metallic material (e.g., copper), they can effectively absorb laser energy and heat to a relatively high temperature in a short time. A sufficient amount of the absorbed energy can then be transferred to the conductive pattern 112 and the solder bump 123 between the conductive pattern 112 and at least one electronic component 121, thereby heating and reflowing the solder bump 123 to form an electrical connection between at least one electronic component 121 and the conductive pattern 112. Since each of the first auxiliary film 110 and the second auxiliary film 111 is formed of a homogeneous material, the auxiliary layer comprising the first auxiliary film 110 and the second auxiliary film 111 can have a uniform temperature distribution, which can be used as a uniform heating medium. Therefore, the solder bumps 123 placed at different locations on the conductive pattern 112 can be uniformly heated by the auxiliary layer, which helps to uniformly reflow all the solder bumps 123 and, in turn, helps to achieve better bonding quality between at least one electronic component 121 and the conductive pattern 112.

[0030] Specifically, in some embodiments, multiple electronic components 121 of various sizes and layouts are mounted on a conductive pattern 112. The heating of the solder bumps 123 beneath the different electronic components 121 may not be affected by the various sizes and layouts of the electronic components 121 because the solder bumps 123 are heated from the underlying auxiliary layer rather than from above. Therefore, regardless of the various structures of the electronic components 121, a uniform bond can be formed between the electronic components 121 and the conductive pattern 112. Furthermore, since the auxiliary layer can have a uniform temperature distribution, warpage problems of the auxiliary layer and the formed electronic device can be reduced after the bonding process. In addition, the laser-assisted bonding process allows for rapid heating and cooling of the auxiliary layer, which helps to better control the temperature of the solder bumps 123 during the bonding process. In this way, solder bumps 123 with the desired shape and height can be formed, which optimizes the bonding quality of the formed electronic device, especially for cases where the solder bumps 123 can be reflowed within a relatively narrow gap between at least one electronic component 121 and the conductive pattern 112.

[0031] Furthermore, in some other embodiments, the laser source 130 can individually emit laser beams to heat and reflow solder bumps 123 beneath electronic components 121 of different sizes in a customized manner. More specifically, the laser source 130 can be moved to different locations or the emission direction of the laser beam can be changed to pass through different portions of the light-transmitting carrier 101. Therefore, the solder bumps 123 beneath electronic components 121 of different sizes can be individually heated using customized laser bonding processes (e.g., various laser energies or heating durations), rather than being heated together in the same laser radiation process. In this way, the reflow process of the solder bumps 123 beneath the electronic components 121 can be more precisely controlled. Reflow solder bumps 123 with controlled height and structure can be achieved, thereby improving the quality of the solder bumps 123 for electronic components 121 of different sizes.

[0032] In some embodiments, the auxiliary layer comprising the first auxiliary film 110 and the second auxiliary film 111 may be designed to have a sufficient thickness to absorb a large amount of heat energy from the laser beam, thereby providing sufficient heat energy to heat and reflow the solder bumps 123. In some preferred embodiments, the thickness of the first auxiliary film 110 may be from 5 μm to 60 μm, and the thickness of the second auxiliary film 111 may be from 1 μm to 10 μm.

[0033] Next, as Figure 1EAs shown, a mold cap 140 is formed on a second auxiliary film 111 to encapsulate a conductive pattern 112 and at least one electronic component 121 to form an electronic device 150. The electronic device 150 includes the conductive pattern 112, at least one electronic component 121 bonded thereon, and the mold cap 140. More specifically, the mold cap 140 is formed using a molding process (e.g., injection molding) that covers the respective front surface of the conductive pattern 112, the at least one electronic component 121, and the exposed portion of the second auxiliary film 111 for encapsulation. The mold cap 140 material includes epoxy resin, polyester resin, etc. In some embodiments, the mold cap 140 can be formed using various other molding techniques including transfer molding, compression molding, or film-assisted molding (FAM) processes.

[0034] Next, the light-transmitting carrier 101 is removed from the electronic device 150. For example... Figure 1F As shown, the light-transmitting carrier 101 can be mechanically detached from the electronic device 150 at the interface between the first auxiliary film 110 and the second auxiliary film 111 by external force. In some embodiments, the electronic device 150 formed on the second auxiliary film 111 can be secured by a holding device (e.g., clamps or chucks). It is also understood that the electronic device 150 can be contained and secured by a container. Then, external force can be applied to the light-transmitting carrier 101, for example, by a chuck, to move the light-transmitting carrier 101 away from the electronic device 150. Alternatively, the light-transmitting carrier 101 can be secured, and external force can be applied to the electronic device 150, for example, to the mold cover 140. As mentioned above, since the adhesion between the light-transmitting carrier 101 and the first auxiliary film 110 can be stronger than the adhesion between the first auxiliary film 110 and the second auxiliary film 111, the adhesion between the first auxiliary film 110 and the second auxiliary film 111 can be broken first, while the first auxiliary film 110 still adheres to the light-transmitting carrier 101. In this manner, the light-transmitting carrier 101 and the first auxiliary film 110 can be separated and removed from the second auxiliary film 111 and the electronic device 150 formed thereon. It should be noted that the magnitude of the external force used to separate and remove the light-transmitting carrier 101 from the electronic device 150 can be adjusted according to the adhesion between the first auxiliary film 110 and the second auxiliary film 111.

[0035] In some embodiments where the second auxiliary film 111 is attached to the first auxiliary film 110 by electrostatic adsorption generated by an electrostatic generator, the electrostatic generator may further generate an opposite static charge to counteract the initially generated static charge, thereby eliminating electrostatic adsorption. Therefore, the light-transmitting carrier 101 can be more easily separated from the electronic device 150.

[0036] In some embodiments where the adhesive material is contained between the first auxiliary film 110 and the second auxiliary film 111, a solution may be applied to dissolve the adhesive material before the light-transmitting carrier 101 is mechanically detached from the electronic device 150.

[0037] Next, as Figure 1G As shown, a second auxiliary film is removed from the back surface of the mold cover 140 and the conductive pattern 112 to expose the conductive pattern 112, thereby forming the electronic device 150 after the removal of the processing attachments. At least one electronic component 121 contained within the electronic device 150 can be directly mounted on the conductive pattern 112 without a substrate. The substrate-free electronic device 150 can have a smaller package height and a lower risk of warpage, which helps to optimize integration level and electrical reliability.

[0038] In some embodiments, the second auxiliary film 111 can be removed by an etching process. In some other embodiments, the second auxiliary film 111 can be removed by using planarization techniques (e.g., chemical mechanical polishing (CMP) or grinding processes).

[0039] In some other embodiments, the light-transmitting carrier 101 can also be mechanically removed from the electronics 150 at the interface between the first auxiliary film 110 and the light-transmitting carrier 101. Then, the first auxiliary film 110 can be removed together with the second auxiliary film 111 to expose the conductive pattern 112 and the back surface of the mold cover 140.

[0040] The auxiliary layer mentioned above may be a two-layer structure. Alternatively, in some embodiments, the auxiliary layer may be formed as a single piece. The light-transmitting carrier 101 may be separated and removed from the electronics 150 at the interface between the light-transmitting carrier 101 and the auxiliary layer, and then the auxiliary layer may be removed from the electronics 150.

[0041] Next, additional solder bumps 160 may be formed on at least a portion of the back surface of the conductive pattern 112 for mounting the electronic device 150 onto an external electronic module. Since the conductive pattern 112 is in direct contact with the additional solder bumps 160, the electrical connection path is shortened and simplified, allowing for more efficient signal transmission from the electronic device 150 to the external electronic module.

[0042] Figure 2 The laser irradiation step for heating the auxiliary layer and reflow solder bumps in a method for forming an electronic device according to a second embodiment of this application is shown. Figure 2 The steps shown can be performed in the following way. Figures 1A to 1C Execute after the steps in the middle, instead of Figure 1D The steps in the process, and after execution Figure 2 After the steps shown, you can proceed. Figures 1E to 1G The steps are as follows. Therefore, details of the other steps can be found in [reference]. Figures 1A to 1G The embodiments shown are not described in detail here.

[0043] Specifically, after at least one electronic component 121 is placed on the conductive pattern 112 via solder bumps 123 (e.g. Figures 1A to 1C As shown, a laser source 130 is positioned below the light-transmitting carrier 101 to emit a laser beam, thereby bonding at least one electronic component 121 to the conductive pattern 112. In this embodiment, the laser source 130 is similar to... Figure 1D The laser source 130 is shown in the figure.

[0044] like Figure 2 As shown, a laser source 130 is activated to emit a laser beam that passes through the light-transmitting carrier 101 to reach the first auxiliary film 110 and the second auxiliary film 111, heating the first and second auxiliary films 110 and re-soldering the solder bumps 123. During this process, at least one electronic component 121 can be pressed downwards against the first and second auxiliary films 110 and 111 by a pressure bar 240. In some embodiments, multiple electronic components 121 of various sizes and layouts are mounted on the carrier 101, and the pressure bar 240 can have a shape at different locations matching the different heights of the multiple electronic components 121. For example, the pressure bar 240 or its bottom portion can be formed from a thermosetting material that can be shaped to match the multiple electronic components 121 by a pressing step at a thermosetting temperature. Furthermore, the pressure bar 240 can be preheated to a high temperature, such as 70°C to 120°C, before the laser irradiation step. Thus, the temperature of the preheated pressure bar 240 can be close to the bonding temperature required for the solder bumps 123. Next, during the bonding process, the pressure bar 240 comes into direct contact with at least one electronic component 121, which facilitates the reflow process of the solder bump 123 and reduces potential warping issues.

[0045] After at least one electronic component 121 is bonded to the conductive pattern 112, the process can continue. Figures 1E to 1G The steps are to form electronic devices.

[0046] Although the exemplary method for forming electronic devices of this application has been described in conjunction with the corresponding figures, those skilled in the art will understand that modifications and adaptations can be made to the method for forming electronic devices without departing from the scope of the invention.

[0047] Various embodiments have been described herein with reference to the accompanying drawings. However, it will be apparent that various modifications and changes can be made thereto, and additional embodiments can be implemented, without departing from the broader scope of the invention as set forth in the appended claims. Furthermore, other embodiments will become apparent to those skilled in the art upon consideration of the description and practice of one or more embodiments of the invention disclosed herein. Therefore, it is intended that this application and the examples herein be considered merely exemplary, wherein the true scope and spirit of the invention are indicated by the appended list of exemplary claims.

Claims

1. A method for forming an electronic device, characterized by, The method includes: providing a light-transmissive carrier having an auxiliary layer on a front surface thereof; forming a plurality of conductive patterns on the auxiliary layer; positioning at least one electronic component on at least a portion of the plurality of conductive patterns via a plurality of solder bumps; exposing the auxiliary layer to a light source through the light-transmissive carrier to heat the auxiliary layer and reflow the plurality of solder bumps; forming a mold cap on the auxiliary layer to encapsulate the plurality of conductive patterns and the at least one electronic component to form the electronic device; and removing the auxiliary layer and the light-transmissive carrier from the electronic device to expose the plurality of conductive patterns.

2. The method of claim 1, wherein, The auxiliary layer includes a metallic material.

3. The method of claim 1, wherein, The auxiliary layer includes: a first auxiliary film formed on the light-transmissive carrier; and a second auxiliary film attached on the first auxiliary film.

4. The method of claim 3, wherein, The second auxiliary film is attached on the first auxiliary film by electrostatic adsorption.

5. The method of claim 3, wherein, The material of the first auxiliary film is the same as the material of the second auxiliary film.

6. The method of claim 5, wherein, The first auxiliary film includes a copper foil and the second auxiliary film includes another copper foil.

7. The method of claim 4, wherein, The auxiliary layer further includes an adhesive material coated between the first auxiliary film and the second auxiliary film.

8. The method of claim 3, wherein, The second auxiliary film is attached on the first auxiliary film by the adhesive material.

9. The method of claim 3, wherein, The process of removing the auxiliary layer and the light-transmissive carrier from the mold cap includes: mechanically detaching the light-transmissive carrier from the electronic device at an interface between the first auxiliary film and the second auxiliary film; and removing the second auxiliary film from the electronic device.

10. The method of claim 1, wherein, After removing the auxiliary layer and the light-transmissive carrier from the mold cap, the method further includes: forming a plurality of additional solder bumps on the plurality of conductive patterns.

11. The method of claim 1, wherein, The process of forming a plurality of conductive patterns on the auxiliary layer includes: forming a layer of conductive material on the auxiliary layer; and removing at least a portion of the layer of conductive material to form the plurality of conductive patterns.

12. The method of claim 1, wherein, The light-transmissive carrier includes glass or quartz.

13. The method of claim 1, wherein, The electronic component includes a semiconductor die.

14. An electronic device, characterized by The electronic device is formed using the method according to any one of claims 1-13.

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