Bowl-shaped piece and substrate processing equipment

By introducing curved outlet and inlet guides into the exhaust duct of the bowl-shaped component, the problem of low gas exhaust efficiency at high rotational speeds is solved, achieving smooth gas discharge and reducing substrate defects.

CN121237676APending Publication Date: 2025-12-30SYSTEM ENGINEERING MEGA SOLUTION CO LTD
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Patent Information

Application Number
CN202510259231.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-06-28
Filing Date
2025-03-06
Publication Date
2025-12-30

AI Technical Summary

Technical Problem

Existing bowl-shaped components have low gas exhaust efficiency at high rotation speeds, leading to increased gas backflow and substrate defects.

Method used

In the exhaust pipe of the bowl-shaped component, outlet and inlet guides are introduced to form curved outlet and inlet openings in the lower and upper parts of the exhaust pipe, respectively, to guide the gas to be discharged smoothly and reduce flow resistance.

Benefits of technology

This improves the gas exhaust efficiency from the bowl-shaped part to the exhaust pipe, prevents gas backflow, and reduces the substrate defect rate.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a bowl and a substrate processing apparatus. The bowl includes: a bowl body provided to surround a support unit that supports and rotates a substrate, and having an exhaust pipe formed in a lower portion of the bowl body to be connected to an exhaust duct provided in a lower side of the bowl body; and an outlet guide formed in a lower portion of the exhaust pipe and having an outlet opening formed in an extension direction of the exhaust duct oriented toward an exhaust portion so as to guide gas introduced into the exhaust pipe from the bowl body to the exhaust portion of the exhaust duct.
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Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0084926, filed on June 28, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure relates to a bowl-shaped component and substrate processing equipment for use in substrate processing processes. Background Technology

[0004] To manufacture semiconductor devices, various processes such as cleaning, deposition, photolithography, etching, and ion implantation are performed. Among these processes, photolithography can include: a coating process in which a photosensitive liquid, such as a photoresist, is applied to the surface of a substrate to form a film; an exposure process in which a circuit pattern is transferred to the film formed on the substrate; and a development process in which the film formed on the substrate is selectively removed from the exposed area or the opposite area.

[0005] A substrate processing apparatus for a coating process in which a photosensitive liquid, such as a photoresist, is applied to form a film may include a cup-shaped member having a processing space, a support unit that supports and rotates the substrate in the processing space, and a nozzle unit that supplies the photoresist to the substrate placed on the support unit.

[0006] The exhaust unit is connected to the bottom of the bowl-shaped component to expel the atmosphere from the processing space. Typically, the exhaust unit includes an integrated duct for connecting multiple exhaust pipes that are respectively connected to multiple bowl-shaped components, and multiple processing spaces can be simultaneously exhausted through the integrated duct. Summary of the Invention

[0007] This disclosure provides a bowl-shaped component that increases the exhaust efficiency of the bowl-shaped component.

[0008] To achieve the above aspects, the bowl-shaped member according to an embodiment of the present disclosure includes: a bowl-shaped member body, a support unit configured to support and rotate a substrate, and having an exhaust pipe formed in a lower portion of the bowl-shaped member body for connection to an exhaust conduit provided in the lower side of the bowl-shaped member body; and an outlet guide formed in the lower portion of the exhaust pipe, and having an outlet opening formed in an extending direction of the exhaust conduit toward an exhaust portion, so as to guide gas introduced into the exhaust pipe from the bowl-shaped member body to the exhaust portion of the exhaust conduit.

[0009] The body of the outlet guide can be formed by extending curvedly from the upper end of the outlet guide toward the outlet opening.

[0010] The angle from the upper end of the outlet guide to the outlet opening can be from 10° to 130°.

[0011] Exhaust pipes can be formed in the vertical direction.

[0012] The exhaust pipe may have a convexly curved shape in the direction of rotation of the gas within the bowl-shaped body.

[0013] The exhaust pipe can be configured to tilt in the direction of rotation of the gas within the bowl-shaped body as the exhaust pipe moves downward.

[0014] The bowl-shaped member disclosed herein may further include: an inlet guide formed in the upper portion of the exhaust pipe, and having an inlet opening formed in the inlet guide to at least partially face the direction of rotation of the gas within the body of the bowl-shaped member.

[0015] The body of the inlet guide may be formed to extend curvedly from the lower end of the inlet guide to the inlet opening.

[0016] The angle from the lower end of the inlet guide to the inlet opening can be from 10° to 130°.

[0017] According to another aspect of this disclosure, a bowl-shaped member is provided, comprising: a bowl-shaped member body, a support unit configured to support and rotate a substrate, and having an exhaust pipe formed in a lower portion of the bowl-shaped member body for connection to an exhaust conduit disposed on a lower side of the bowl-shaped member body; and an inlet guide formed in an upper portion of the exhaust pipe, and having an inlet opening formed in the inlet guide to at least partially face the rotational direction of a gas within the bowl-shaped member body, so as to guide the gas within the bowl-shaped member body to the exhaust pipe.

[0018] According to another aspect of this disclosure, a substrate processing apparatus is provided, comprising: a process chamber; a support unit for supporting and rotating a substrate within the process chamber; a nozzle unit for discharging a chemical substance into the substrate; a bowl-shaped member disposed within the process chamber; an exhaust conduit disposed in the lower side of the bowl-shaped member and having an exhaust portion formed therein; an exhaust pipe formed in the lower portion of the bowl-shaped member for insertion into the exhaust pipe, or formed in the upper portion of the exhaust pipe for insertion into the bowl-shaped member, thereby connecting the bowl-shaped member and the exhaust pipe; an outlet guide formed in the lower portion of the exhaust pipe and having an outlet opening formed in an extension direction of the exhaust pipe toward the exhaust portion of the exhaust pipe; and an inlet guide formed in the upper portion of the exhaust pipe and having an inlet opening formed at least partially facing the rotational direction of the gas.

[0019] This disclosure can guide the gas discharged from the bowl-shaped member to the exhaust pipe through the exhaust pipe to increase the exhaust efficiency of the gas from the bowl-shaped member to the exhaust pipe, thereby reducing the amount of reduction in the flow rate of the gas through the exhaust pipe even when the rotational speed of the gas increases.

[0020] Therefore, this disclosure can prevent substrate defects by preventing the backflow of gas in the bowl-shaped part. Attached Figure Description

[0021] The above and other aspects, features and advantages of this disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0022] Figure 1 This is a perspective view showing a substrate processing facility according to an embodiment of the present disclosure;

[0023] Figure 2 This is observed from the top. Figure 1 A view of the substrate processing facility;

[0024] Figure 3 When observed in direction AA Figure 2 A view of the substrate processing facility;

[0025] Figure 4 When observing from the direction BB Figure 2 A view of the substrate processing facility;

[0026] Figure 5 This is a schematic diagram showing the interior of the substrate processing apparatus according to the present disclosure;

[0027] Figure 6 It is a cross-sectional perspective view showing an exhaust pipe and a cup-shaped component according to conventional technology;

[0028] Figure 7 It is along Figure 6 A sectional view taken from line II;

[0029] Figure 8 It is shown Figure 5 A cross-sectional perspective view of the exhaust pipe of the substrate processing equipment and the bowl-shaped member according to the first embodiment;

[0030] Figure 9 yes Figure 8 A side view of the bowl-shaped component;

[0031] Figure 10 This is a cross-sectional view of the bowl-shaped member according to the second embodiment of this disclosure;

[0032] Figure 11This is a cross-sectional view of the bowl-shaped member according to the third embodiment of this disclosure;

[0033] Figure 12 This is a cross-sectional view of the bowl-shaped member according to the fourth embodiment of this disclosure;

[0034] Figure 13 This is a cross-sectional view of the bowl-shaped member according to the fifth embodiment of this disclosure; and

[0035] Figure 14 It demonstrates conventional technology and its basis Figure 11 A graph comparing the reduction in the flow rate of gas passing through the exhaust pipe between the third embodiment of this disclosure. Detailed Implementation

[0036] In the following, preferred exemplary embodiments will be described in detail with reference to the accompanying drawings, enabling those skilled in the art to readily implement this disclosure. However, in describing preferred exemplary embodiments of this disclosure in detail, detailed descriptions of related known functions or configurations will be omitted where it is determined that such detailed descriptions might unnecessarily obscure the essential points of this disclosure. Furthermore, the same reference numerals are used throughout the drawings to refer to the same or similar parts. Additionally, it will be understood in this specification that expressions such as “above,” “over,” “upper part,” “lower part,” “below,” “side,” and “side” are used only for indication based on the drawings and may actually vary depending on the orientation of the components.

[0037] Furthermore, throughout the specification, the terms "connected to" or "linked to" are used to specify a connection or link between one element and another element, including cases where an element is "directly connected or directly linked to" another element and cases where an element is "indirectly connected or indirectly linked to" another element through yet another element. Additionally, when a section "includes" or "comprises" a component, this means that other components are not excluded, and other components may be included unless otherwise specified.

[0038] Figure 1 This is a perspective view showing a substrate processing facility according to an embodiment of the present disclosure. Figure 2 This is observed from the top. Figure 1 A view of the substrate processing facility. Figure 3 When observed in direction AA Figure 2 A view of the substrate processing facility, and Figure 4 When observing from the direction BB Figure 2 A view of the substrate processing facility.

[0039] refer to Figures 1 to 4The substrate processing facility 1 includes a loading port 100, an indexing module 200, a buffer module 300, a coating and developing module 400, and an interface module 600. The loading port 100, the indexing module 200, the buffer module 300, the coating and developing module 400, and the interface module 600 are arranged sequentially in a single direction.

[0040] In the following text, the orientation in which the loading port 100, the transposition module 200, the buffer module 300, the coating and developing module 400 and the interface module 600 are arranged is referred to as the first direction (Y direction), the direction perpendicular to the first direction (Y direction) when viewed from above is referred to as the second direction (X direction), and the direction perpendicular to the first direction (Y direction) and the second direction (X direction) is referred to as the third direction (Z direction).

[0041] The substrate S moves while stored in the carrier C. The carrier C has a structure that can be sealed from the outside. For example, a front-opening unified pod (FOUP) with a door at the front can be used as the carrier C.

[0042] The loading port 100, the transposition module 200, the buffer module 300, the coating and developing module 400 and the interface module 600 will be described in detail below.

[0043] The loading port 100 has a mounting stage 120, on which a carrier C, including the substrate S, is placed. Multiple mounting stages 120 are provided, and the mounting stages 120 are arranged in a row in a second direction (X direction). Figure 2 The image shows an example in which four mounting platforms 120 are set up, but the number of mounting platforms 120 can be changed.

[0044] The indexing module 200 transfers a substrate S between a carrier C placed on a mounting stage 120 at the loading port 100 and a buffer module 300. The indexing module 200 includes a frame 210, an indexing robot 220, and a guide rail 230. The frame 210 is typically configured as a cuboid with an empty interior and is positioned between the loading port 100 and the buffer module 300. The frame 210 of the indexing module 200 may be positioned at a height lower than the frame 310 of the buffer module 300. The indexing robot 220 and the guide rail 230 are disposed within the frame 210. The indexing robot 220 is configured such that a hand 221 for directly manipulating the substrate S can move and rotate in a first direction (Y direction), a second direction (X direction), and a third direction (Z direction). The indexing robot 220 includes a hand 221, an arm 222, a support 223, and a base 224. The hand 221 is fixedly mounted in the arm 222. The arm 222 has both a resilient structure and a rotatable structure. Support member 223 is configured such that its longitudinal direction is aligned in a third direction (Z direction). Arm 222 is connected to support member 223 so that it is movable along support member 223. Support member 223 is fixedly connected to base 224. Guide rail 230 is configured such that its longitudinal direction is aligned in a second direction (X direction). Base 224 is connected to guide rail 230 so that it can move linearly along guide rail 230. Furthermore, although not shown, frame 210 is also provided with a door opener for opening and closing the door of carrier C.

[0045] The buffer module 300 includes a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 is configured as a cuboid with an empty interior and is positioned between the indexing module 200 and the coating and developing module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer robot 360 are disposed within the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are arranged sequentially from bottom to top in the third direction (Z-direction). The first buffer 320 is positioned at a height corresponding to the coating module 401 of the coating and developing module 400, and the second buffer 330 and the cooling chamber 350 are positioned at a height corresponding to the developing module 402 of the coating and developing module 400. The first buffer robot 360 is spaced apart from the second buffer 330, the cooling chamber 350, and the first buffer 320 in the second direction (X-direction). The first buffer 320 and the second buffer 330 temporarily store multiple substrates S, respectively. The second buffer 330 has a housing 331 and multiple support members 332. The support members 332 are disposed in the housing 331 and spaced apart from each other in the third direction (Z direction). A substrate S is placed on each of the support members 332. The housing 331 has openings in the direction of setting the transfer robot 220 and in the direction of setting the first buffer robot 360, so that the transfer robot 220 and the first buffer robot 360 can load or unload the substrate S into the support members 332 in the housing 331. The first buffer 320 has a structure that is substantially similar to that of the second buffer 330. However, the housing 321 of the first buffer 320 has openings in the direction of setting the first buffer robot 360 and in the direction of setting the coating robot 432, which is disposed in the coating module 401. The number of support members 322 disposed in the first buffer 320 and the number of support members 332 disposed in the second buffer 330 may be the same or different from each other. In one example, the number of supports 332 provided in the second buffer 330 may be greater than the number of supports 322 provided in the first buffer 320.

[0046] like Figure 2As shown, a first buffer robot 360 transfers a substrate S between a first buffer 320 and a second buffer 330. The first buffer robot 360 includes a hand 361, an arm 362, and a support member 363. The hand 361 is fixedly mounted in the arm 362. The arm 362 has a flexible structure that allows the hand 361 to move in a second direction (X direction). The arm 362 is connected to the support member 363 so that it can move linearly along the support member 363 in a third direction (Z direction). The support member 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320. The support member 363 may be configured to be longer than its length in either the upper or lower direction. The first buffer robot 360 may be configured such that the hand 361 is driven only on two axes in the second direction (X direction) and the third direction (Z direction).

[0047] like Figure 3 As shown, the cooling chamber 350 cools the substrate S. The cooling chamber 350 includes a housing 351 and a cooling plate 352. The cooling plate 352 has an upper surface on which the substrate S is placed and a cooling tool 353 for cooling the substrate S. As the cooling tool 353, various methods can be used, such as cooling with cooling water or cooling with a thermoelectric device. In addition, the cooling chamber 350 may be provided with a lifting pin assembly for positioning the substrate S on the cooling plate 352. The housing 351 has openings in the direction of setting the indexing robot 220 and in the direction of setting the developing robot, so that the indexing robot 220 and the developing robot provided in the developing module 402 can load or unload the substrate S in the cooling plate 352. In addition, the cooling chamber 350 may be provided with a door for opening or closing the above-mentioned openings.

[0048] The coating module 401 includes a process of coating a substrate S with a photosensitive liquid such as a photoresist, and heat treatment processes such as heating and cooling the substrate S before and after the photoresist coating process. The coating module 401 has a coating chamber 410, a baking chamber portion 500, and a transfer chamber 430. The coating chamber 410, the transfer chamber 430, and the baking chamber portion 500 are arranged sequentially in a second direction (X direction). That is, based on the transfer chamber 430, the coating chamber 410 is disposed on one side of the transfer chamber 430, and the baking chamber portion 500 is disposed on the other side of the transfer chamber 430.

[0049] Multiple coating chambers 410 are provided, and the multiple coating chambers 410 are respectively arranged in a first direction (Y direction) and a third direction (Z direction). The baking chamber portion 500 includes multiple baking chambers 510, and the multiple baking chambers 510 are respectively arranged in the first direction (Y direction) and a third direction (Z direction). A transfer chamber 430 is arranged parallel to the first buffer 320 of the buffer module 300 in the first direction (Y direction). A coating robot 432 and a guide rail 433 are disposed in the transfer chamber 430. The transfer chamber 430 has a generally rectangular shape. The coating robot 432 transfers the substrate S between the baking chamber 510, the coating chamber 410, and the first buffer 320 of the buffer module 300.

[0050] The guide rail 433 is configured such that its longitudinal direction is parallel to the first direction (Y direction). The guide rail 433 guides the coating robot 432 to move linearly in the first direction (Y direction). Figure 4 As shown, the coating robot 432 has a hand 434, an arm 435, a support member 436, and a base 437. The hand 434 is fixedly mounted in the arm 435. The arm 435 is provided with a resilient structure that allows the hand 434 to move in the horizontal direction. The support member 436 is configured such that the longitudinal direction of the support member 436 is oriented in the third direction (Z direction). The arm 435 is coupled to the support member 436 such that the arm 435 can move linearly along the support member 436 in the third direction (Z direction). The support member 436 is fixedly coupled to the base 437, and the base 437 is coupled to a guide rail 433 so that it is movable along the guide rail 433.

[0051] The coating chambers 410 may all have the same structure, but the types of chemicals used in the coating chambers 410 may differ from one another. The chemicals may be those used to form a photoresist film or an antireflective film. See below for reference. Figure 5 The description includes a substrate processing apparatus with a coating chamber 410.

[0052] The baking chamber 510 has an internal processing space equipped with a support unit 511 and a heater 512 built into the support unit 511. When the substrate S is placed on the support unit 511, the coating robot 432 heat-processes the substrate S. For example, the baking chamber 510 performs a pre-baking process to heat the substrate S to a predetermined temperature and remove organic matter or moisture from the surface of the substrate S before coating the substrate S with photoresist, or performs a soft baking process after coating the substrate S with photoresist, and performs a cooling process to cool the substrate S after each heating process.

[0053] Interface module 600 connects coating and developing module 400 to exposure apparatus 700. Interface module 600 includes interface frame 610, first interface buffer 620, second interface buffer 630, and transfer robot 640. After completing coating and developing module 400, transfer robot 640 transfers substrate S, which has been transferred to first interface buffer 620 and second interface buffer 630, to exposure apparatus 700. First interface buffer 620 and second interface buffer 630 include housing 621 and support member 622. Transfer robot 640 and coating robot 432 load substrate S onto / unload substrate S from support member 622.

[0054] The structure of a substrate processing apparatus including a process chamber will be described in detail below. As an example, a process chamber configured as a coating and developing module 400 will be described. In the process chamber, a process for forming a film, such as a protective film or an anti-reflective film, on a substrate can be performed within the processing space inside the process chamber. Additionally, a process for developing a substrate by supplying a developer to the substrate can be performed within the processing space inside the process chamber.

[0055] Figure 5 This is a schematic diagram showing the interior of the substrate processing apparatus according to the present disclosure.

[0056] refer to Figure 5 The substrate processing equipment 1000 may include a process chamber 1100, a support unit 1200, a nozzle unit 1300, and an exhaust unit 1400.

[0057] The process chamber 1100 is configured as a rectangular / cylindrical shape with an internal space. An opening (not shown) may be formed on one side of the process chamber 1100. The opening can serve as a channel through which the substrate S is loaded and unloaded. A door (not shown) is installed in the opening, and the door can open or close the opening. On the upper wall of the process chamber 1100, a fan filter unit 1110 for supplying downward airflow to the internal space of the process chamber 1100 may be provided. The fan filter unit 1110 may include a fan that introduces external air into the internal space and a filter for filtering the external air. A plurality of fan filter units 1110 may be provided in the upper portion of each of a plurality of bowl-shaped members 1410. A plurality of support units 1200 and a plurality of nozzle units 1300 may be provided in the internal space of the process chamber 1100.

[0058] The support unit 1200 can support and rotate the substrate S within the internal space 1410a of the bowl-shaped member 1410. The support unit 1200 may include a support plate 1210, a drive shaft 1220, and a drive member 1230. The support plate 1210 may have a circular upper surface. The support plate 1210 may have a diameter smaller than the diameter of the substrate S. The support plate 1210 is configured to support the substrate S by vacuum pressure. Optionally, the support plate 1210 may have a mechanical clamping structure for supporting the substrate S. The drive shaft 1220 is coupled to the center of the lower surface of the support plate 1210, and the drive member 1230, which supplies rotational force to the drive shaft 1220, may be disposed on the drive shaft 1220. The drive member 1230 may be a motor. Although not shown in the figures, a lifting drive member for adjusting the relative height of the support plate 1210 and the bowl-shaped member 1410 may be disposed in the support unit 1200.

[0059] Nozzle unit 1300 can supply chemicals to substrate S. Nozzle unit 1300 may include a first nozzle 1310 and a second nozzle 1320. A plurality of first nozzles 1310 are provided, and chemicals can be supplied to substrates S provided to each of the support units 1200. The first nozzles 1310 may be configured to supply the same type of liquid. According to one embodiment, the first nozzle 1310 may supply a rinsing liquid for cleaning substrate S. For example, the rinsing liquid may be water. According to another embodiment, the first nozzle 1310 may supply a removal liquid for removing photoresist from edge regions of substrate S. For example, the removal liquid may be a diluent. The first nozzle 1310 can rotate about its axis of rotation between a process position and a standby position. The process position is a position for discharging chemicals to substrate S, and the standby position may be a position where chemicals wait in a first standby port 1311 between bowls 1410 when chemicals are not discharged from the first nozzle 1310. Second nozzle 1320 supplies a processing liquid to substrate S provided to support unit 1200. The processing liquid may be photoresist. The second nozzle 1320 can move along the guide between a first process position, a second process position, a third process position, and a standby position. The first process position to the third process position can be a position for supplying processing liquid to the substrate S supported by a plurality of support units 1200. The standby position can be a position where the chemical substance waits in a second standby port 1321 disposed between the bowl-shaped members 1410 when the photoresist is not ejected from the second nozzle 1320.

[0060] The exhaust unit 1400 may include a cup-shaped member 1410 and an exhaust pipe 1420.

[0061] Here, a plurality of bowl-shaped components 1410 may be disposed in the process chamber 1100. Each of the plurality of bowl-shaped components 1410 may have an internal space 1410a, and the internal space 1410a may be configured such that its upper portion is open.

[0062] Additionally, multiple exhaust pipes 1420 can be provided so as to be installed in each of the multiple bowl-shaped members 1410. The exhaust pipes 1420 are connected to the bowl-shaped members 1410 via multiple exhaust pipes 1411a. Each of the multiple exhaust pipes 1420 can be connected to an integrated conduit 1430 via an exhaust portion 1421. The integrated conduit 1430 can be arranged on one side of the multiple exhaust portions 1421 in the arrangement direction. The integrated conduit 1430 can be provided with a pressure-reducing member 1431 to provide fluid pressure for exhaust. For example, the pressure-reducing member 1431 can be a pump or a fan.

[0063] Furthermore, before describing the bowl-shaped component according to this disclosure in detail, reference will be made to the following: Figure 6 and Figure 7 A bowl-shaped component describing conventional technology.

[0064] Gas G introduced into the bowl-shaped member 11 is discharged to the lower side of the bowl-shaped member 11. For this purpose, the bowl-shaped member 11 is connected to an exhaust pipe 12 in the lower portion of the bowl-shaped member 11, and the exhaust pipe 12 is configured to communicate with the bowl-shaped member 11 through an exhaust pipe 11a formed in the lower side of the bowl-shaped member 11. For reference, the lower portion of the bowl-shaped member 11 is shown in the accompanying drawings.

[0065] When the chemical substance is sprayed onto the substrate through the nozzle unit, the support unit disposed inside the bowl-shaped member 11 rotates the substrate. The substrate rotates due to the rotation of the support unit, and thus, a swirling flow in which the gas G rotates is generated in the internal space of the bowl-shaped member 11.

[0066] As the rotational speed of the substrate increases, the rotational speed of the gas G also increases. However, when the rotational speed of the gas G increases, the gas G may not be able to be smoothly discharged to the exhaust pipe 12 connected to the lower part of the bowl-shaped member 11. In order for the gas G to rotate and be smoothly discharged from the bowl-shaped member 11, the gas G should flow smoothly toward the exhaust pipe 12 on the lower side. However, due to the flow resistance generated by the vertically upright exhaust pipe 11a, the exhaust may not be performed smoothly.

[0067] Specifically, as the rotational speed of gas G increases, it becomes more difficult to exhaust gas through the exhaust pipe 11a on the lower side, resulting in a decrease in the exhaust efficiency of gas G in the bowl-shaped member 11. Consequently, the gas pressure in the bowl-shaped member 11 increases, leading to backflow. Therefore, the substrate may experience increased defect rate due to particulate contamination contained in the gas backflow.

[0068] Figure 8 It is shown Figure 5 A cross-sectional perspective view of the exhaust pipe of the substrate processing equipment and the bowl-shaped member according to the first embodiment, and Figure 9 yes Figure 8 Side view of the bowl-shaped component.

[0069] Referring to the accompanying drawings, the bowl-shaped member 1410 according to the first embodiment of this disclosure may include a bowl-shaped member body 1411 and an outlet guide 1412. For reference, the drawings show the lower portion of the bowl-shaped member 1410.

[0070] The bowl-shaped body 1411 can be configured to surround and rotate the support unit 1200 of the substrate (see...). Figure 5 That is, the bowl-shaped body 1411 is configured along the circumference of the support unit 1200 of the support substrate, so as to recover the chemicals and gases discharged to the substrate.

[0071] The bowl-shaped body 1411 may have an exhaust pipe 1411a formed in the lower portion of the bowl-shaped body 1411 for connection to an exhaust pipe 1420 in the lower side. That is, the bowl-shaped body 1411 may have a structure in which the bowl-shaped body 1411 communicates with the exhaust pipe 1420 in the lower side via the exhaust pipe 1411a. The exhaust pipe 1411a is a cylindrical member formed in the lower portion of the bowl-shaped body 1411 and connects the internal space of the bowl-shaped body 1411 with the internal space of the exhaust pipe 1420. Through the exhaust pipe 1411a, gas G in the internal space of the bowl-shaped body 1411 can be discharged into the internal space of the exhaust pipe 1420.

[0072] In this case, the exhaust pipe 1411a can be formed in the vertical direction.

[0073] An exhaust pipe 1411a may be formed in the lower portion of the bowl-shaped member 1410 so as to be inserted into the exhaust pipe 1420, such that the bowl-shaped member 1410 and the exhaust pipe 1420 are connected to each other as shown in the accompanying drawings of this disclosure.

[0074] Furthermore, although not shown in the accompanying drawings, an exhaust pipe may be formed in the upper part of the exhaust pipe so as to be inserted into the cup-shaped piece, thereby connecting the cup-shaped piece and the exhaust pipe to each other.

[0075] However, in this specification, the case in which the exhaust pipe 1411a is formed in the bowl-shaped member 1410 is described as an example.

[0076] The outlet guide 1412 may be formed in the lower part of the exhaust pipe 1411a.

[0077] Specifically, the outlet guide 1412 is a structure formed downward in the lower part of the exhaust pipe 1411a, and can be formed as an integral structure extending downward from the lower end of the exhaust pipe 1411a, or it can be formed as a separate structure installed downward in the lower end of the exhaust pipe 1411a.

[0078] The outlet guide 1412 may have an outlet opening 1412a formed in the extending direction of the exhaust pipe 1420 oriented toward the exhaust portion 1421 of the exhaust pipe 1420. The outlet guide 1412 may be in the form of a pipe extending from the exhaust pipe 1411a, and the outlet opening 1412a, as the discharge portion through which the exhaust gas G is discharged, may be formed in the extending direction of the exhaust pipe 1420 oriented toward the exhaust portion 1421 of the exhaust pipe 1420.

[0079] The outlet guide 1412 configured in this way is used to guide the gas G introduced into the exhaust pipe 1411a to the exhaust section 1421 of the exhaust pipe 1420.

[0080] That is, when the gas G discharged from the bowl-shaped body 1411 to the exhaust pipe 1420 through the exhaust pipe 1411a is discharged from the exhaust pipe 1411a to the exhaust pipe 1420, the exhaust direction is guided by the outlet guide 1412 to the exhaust portion 1421 of the exhaust pipe 1420.

[0081] When there is no outlet guide 1412 in the conventional technology, when gas G is discharged from exhaust pipe 1411a to exhaust pipe 1420, gas G collides with the bottom of exhaust pipe 1420 and has a vortex form, so that exhaust does not occur smoothly.

[0082] Conversely, in this disclosure, by forming an outlet guide 1412 in the lower portion of the exhaust pipe 1411a, the exhaust direction of gas G is guided to the exhaust portion 1421 of the exhaust pipe 1420, so that gas G can be smoothly discharged through the exhaust pipe 1411a.

[0083] Furthermore, gas G can be easily introduced from the bowl-shaped body 1411 into the exhaust pipe 1411a, thereby improving the exhaust efficiency of gas G from the bowl-shaped body 1410 to the exhaust pipe 1420.

[0084] Specifically, the body 1412b of the outlet guide 1412 can be formed to extend in a curved manner, for example, extending in a curved manner from the upper end 1412c of the outlet guide 1412 toward the outlet opening 1412a.

[0085] When gas G is drawn from exhaust pipe 1411a into outlet guide 1412, and as gas G passes through outlet guide 1412, the curved shape of outlet guide 1412 can minimize the flow resistance of gas G through outlet guide 1412.

[0086] That is, when gas G is drawn from the exhaust pipe 1411a into the outlet guide 1412, and when gas G passes through the outlet guide 1412, since the direction of gas G does not change suddenly but gradually, the exhaust efficiency of gas G from the bowl-shaped member 1410 to the exhaust pipe 1420 can be increased.

[0087] Figure 10 This is a cross-sectional view showing a bowl-shaped member according to a second embodiment of the present disclosure.

[0088] According to the second embodiment of this disclosure, the bowl-shaped member 1410 can have an angle of 10° to 130° from the upper end 1412c of the outlet guide 1412 to the outlet opening 1412a. Preferably, the angle α from the upper end 1412c of the outlet guide 1412 to the outlet opening 1412a can be 45° to 120°.

[0089] For example, as shown in the attached figure, the angle α from the upper end 1412c of the outlet guide 1412 to the outlet opening 1412a can be 120°.

[0090] When the angle α from the upper end 1412c of the outlet guide 1412 to the outlet opening 1412a is less than 10°, the outlet guide 1412 guiding the gas G is significantly smaller. Therefore, when the gas G is discharged from the exhaust pipe 1411a to the exhaust pipe 1420, the gas G is guided to the exhaust portion 1421 of the exhaust pipe 1420 (see...). Figure 8 The effect is minimal. That is, since the outlet opening 1412a extends closer to the bottom direction of the exhaust pipe 1420 than the direction of the exhaust portion 1421 of the exhaust pipe 1420, when gas G is discharged from the exhaust pipe 1411a into the exhaust pipe 1420, the gas G may have a vortex form, making the effect of guiding gas G to the exhaust portion 1421 almost non-existent.

[0091] Furthermore, when the angle α from the upper end 1412c of the outlet guide 1412 to the outlet opening 1412a is greater than 130°, the outlet guide 1412 for guiding the gas G is elongated, minimizing the effect of guiding the gas G to the exhaust portion 1421 of the exhaust pipe 1420 when the gas G is discharged from the exhaust pipe 1411a to the exhaust pipe 1420. In other words, because the outlet opening 1412a excessively points upwards towards the exhaust pipe 1411a, the gas G may become a vortex when it is discharged from the exhaust pipe 1411a to the exhaust pipe 1420. Therefore, the effect of the outlet guide 1412 for guiding the gas G to the exhaust portion 1421 is almost non-existent.

[0092] Furthermore, apart from the angled structure of the outlet guide 1412 described above in the second embodiment, the basic structure of the outlet guide 1412 and the exhaust pipe 1411a formed in the bowl-shaped body 1411 together with the bowl-shaped body 1411 Figure 9 The first embodiment shown is the same, and therefore, its description is omitted.

[0093] Figure 11 This is a cross-sectional view showing a bowl-shaped member according to a third embodiment of the present disclosure.

[0094] refer to Figure 11 ,Apart from Figure 9 In addition to the outlet guide 1412, the bowl-shaped member 1410 according to the third embodiment of this disclosure may also include an inlet guide 1413.

[0095] The inlet guide 1413 may be formed in the upper part of the exhaust pipe 1411a. Specifically, the inlet guide 1413 is a structure formed upward in the upper part of the exhaust pipe 1411a, and may be formed as an integral structure extending upward from the upper end of the exhaust pipe 1411a, or may be formed as a separate structure installed upward in the upper end of the exhaust pipe 1411a.

[0096] The inlet guide 1413 may have an inlet opening 1413a formed to at least partially face the rotational direction of the gas G. The inlet guide 1413 may have a pipe form extending from the exhaust pipe 1411a, and is formed such that the inlet opening 1413a, which is the inlet portion through which the gas G enters, is at least partially facing the rotational direction of the gas G.

[0097] The inlet guide 1413 configured in this way is used to guide the gas G rotating inside the bowl-shaped body 1411 to the exhaust pipe 1411a.

[0098] That is, when the gas G rotating inside the bowl-shaped body 1411 is discharged from the bowl-shaped body 1411 to the exhaust pipe 1411a, the exhaust direction is guided to the exhaust pipe 1411a by the inlet guide 1413.

[0099] In this way, since the inlet guide 1413 of this disclosure is formed in the upper part of the exhaust pipe 1411a to guide the exhaust direction of gas G to the exhaust pipe 1411a, the exhaust of gas G through the exhaust pipe 1411a can be performed smoothly.

[0100] Furthermore, since gas G is easily introduced from the bowl-shaped body 1411 into the exhaust pipe 1411a, gas G flows from the bowl-shaped member 1410 to the exhaust pipe 1420. Figure 8 The exhaust efficiency can be improved.

[0101] Specifically, the body 1413b of the inlet guide 1413 can be formed to extend in a curved manner, for example, extending from the lower end 1413c of the inlet guide 1413 to the inlet opening 1413a.

[0102] When gas G is drawn from the bowl-shaped body 1411 into the inlet guide 1413, and as gas G passes through the inlet guide 1413, the curved shape of the inlet guide 1413 can minimize the flow resistance of gas G through the inlet guide 1413.

[0103] That is, when gas G is drawn from the bowl-shaped body 1411 into the inlet guide 1413, and when gas G passes through the inlet guide 1413, the exhaust efficiency of gas G from the bowl-shaped body 1410 to the exhaust pipe 1420 can be increased because the direction of gas G changes gradually rather than suddenly.

[0104] Furthermore, the bowl-shaped member 1410 of this disclosure can have an angle β of 10° to 130° from the lower end 1413c of the inlet guide 1413 to the inlet opening 1413a. Preferably, the angle β from the lower end 1413c of the inlet guide 1413 to the inlet opening 1413a can be 45° to 120°.

[0105] When the angle β from the lower end 1413c of the inlet guide 1413 to the inlet opening 1413a is less than 10°, the effect of guiding the gas G from the bowl-shaped body 1411 to the exhaust pipe 1411a is minimal because the inlet guide 1413 guiding the gas G is significantly smaller. That is, since the inlet opening 1413a is almost not facing the direction of rotation of the gas G, the gas G rotating in the bowl-shaped body 1411 hardly flows into the inlet opening 1413a, making the effect of guiding the gas G toward the exhaust pipe 1411a almost non-existent.

[0106] Furthermore, when the angle β from the lower end 1413c of the inlet guide 1413 to the inlet opening 1413a is greater than 130°, the effect of guiding the gas G rotating in the bowl-shaped body 1411 to the exhaust pipe 1411a is minimal because the inlet guide 1413 is formed to be significantly long. That is, because the inlet opening 1413a points excessively downward toward the exhaust pipe 1411a, the gas G rotating in the bowl-shaped body 1411 hardly flows into the inlet opening 1413a, making the effect of guiding the gas G toward the exhaust pipe 1411a almost non-existent.

[0107] Figure 12 This is a cross-sectional view showing a bowl-shaped member according to a fourth embodiment of the present disclosure.

[0108] refer to Figure 12 The exhaust pipe 1411a may have a convexly curved shape in the direction of rotation of the gas G inside the bowl-shaped body 1411.

[0109] When gas G passes through exhaust pipe 1411a, the curved shape of exhaust pipe 1411a can minimize the flow resistance of gas G through exhaust pipe 1411a.

[0110] That is, when gas G passes through exhaust pipe 1411a, the direction of gas G does not change suddenly, but gradually, so that gas G flows from the cup-shaped member 1410 to the exhaust pipe 1420 (see...). Figure 8 The exhaust efficiency can be improved.

[0111] In addition, such as Figure 12 As shown, the exhaust pipe 1411a can be formed by connecting to the outlet guide 1412 and the inlet guide 1413.

[0112] Figure 13 This is a cross-sectional view showing a bowl-shaped member according to a fifth embodiment of the present disclosure.

[0113] refer to Figure 13 The exhaust pipe 1411a can be configured to tilt toward the direction of rotation of the gas G inside the bowl-shaped body 1411 as the exhaust pipe 1411a moves downward.

[0114] When gas G passes through exhaust pipe 1411a, the inclined shape of exhaust pipe 1411a can minimize the flow resistance of gas G caused by exhaust pipe 1411a.

[0115] That is, when gas G passes through exhaust pipe 1411a, since the direction of gas G is similar to the rotation direction of gas G in the bowl-shaped body 1411, gas G travels from the bowl-shaped member 1410 to the exhaust pipe 1420 (see...). Figure 8 The exhaust efficiency can be improved.

[0116] In addition, such as Figure 13 As shown, the inclined exhaust pipe 1411a can be formed by connecting it to the outlet guide 1412.

[0117] Figure 14 It demonstrates conventional technology and its basis Figure 11 A graph comparing the reduction in the flow rate of gas passing through the exhaust pipe between the third embodiment of this disclosure.

[0118] refer to Figure 11 and Figure 14 When the rotational speed of the substrate increases and the rotational speed of the gas inside the bowl-shaped body 1411 increases, in this disclosure including the outlet guide 1412 and the inlet guide 1413, the reduction in the flow rate of the gas G through the exhaust pipe 1411a is less than in conventional technology.

[0119] That is, according to conventional technology, when the substrate rotation speed is 2000 RPM, 3000 RPM and 4000 RPM, the reduction in the flow rate of gas G through exhaust pipe 1411a is 9%, 19% and 20% respectively. However, according to this disclosure, when the substrate rotation speed is 2000 RPM, 3000 RPM and 4000 RPM, the reduction in the flow rate of gas G through exhaust pipe 1411a is 5%, 8% and 7% respectively.

[0120] Therefore, although not shown in the accompanying drawings, the present disclosure, including the outlet guide 1412 and the inlet guide 1413, prevents the gas G inside the bowl-shaped body 1411 from flowing back toward the upper side of the bowl-shaped body 1411 until the rotational speed of the substrate reaches 4000 RPM.

[0121] In this manner, compared to conventional techniques, this disclosure includes an outlet guide 1412 and an inlet guide 1413 to increase the flow of gas G from the bowl-shaped member 1410 toward the exhaust duct. Figure 8 The exhaust efficiency of 1420) is improved, and therefore, even if the rotational speed of gas G increases, the amount of reduction in the flow rate of gas G through exhaust pipe 1411a can be reduced.

[0122] Furthermore, this disclosure can prevent substrate defects by preventing gas backflow inside the bowl-shaped member 1410.

[0123] Although embodiments of the present disclosure have been described with reference to the accompanying drawings, those skilled in the art will understand that the present disclosure may be implemented in other specific forms without altering its technical concept or essential characteristics. Therefore, it should be understood that the exemplary embodiments described above are exemplary and not limiting in any way.

Claims

1. A bowl comprising: a bowl body disposed to surround a support unit that supports and rotates a substrate, and having an exhaust pipe formed in a lower portion of the bowl body to be connected to an exhaust duct provided in a lower side of the bowl body; and an outlet guide formed in a lower portion of the exhaust pipe and having an outlet opening formed in an extension direction of the exhaust duct oriented toward an exhaust portion so as to guide a gas introduced into the exhaust pipe from the bowl body to the exhaust portion of the exhaust duct. 2.The bowl according to claim 1, a body of the outlet guide is formed by being curvedly extended from an upper end of the outlet guide toward the outlet opening. wherein 3.The bowl according to claim 2, an angle from the upper end of the outlet guide to the outlet opening is 10° to 130°. wherein 4.The bowl according to claim 1, the exhaust pipe is formed in a vertical direction. wherein 5.The bowl according to claim 1, the exhaust pipe has a convexly curved shape in a rotation direction of the gas within the bowl body. wherein 6.The bowl according to claim 1, the exhaust pipe is formed to be inclined in the rotation direction of the gas within the bowl body as the exhaust pipe moves downward. wherein 7.The bowl according to claim 1, further comprising: an inlet guide formed in an upper portion of the exhaust pipe and having an inlet opening formed in the inlet guide to at least partially face a rotation direction of the gas within the bowl body. 8.The bowl according to claim 7, a body of the inlet guide is formed to be curvedly extended from a lower end of the inlet guide to the inlet opening. wherein 9.The bowl according to claim 8, an angle from the lower end of the inlet guide to the inlet opening is 10° to 130°. wherein 10.A bowl comprising: a bowl body disposed to surround a support unit that supports and rotates a substrate, and having an exhaust pipe formed in a lower portion of the bowl body to be connected to an exhaust duct provided in a lower side of the bowl body; and an inlet guide formed in an upper portion of the exhaust pipe and having an inlet opening formed in the inlet guide to at least partially face a rotation direction of a gas within the bowl body so as to guide the gas within the bowl body to the exhaust pipe. 11.The bowl according to claim 10, a body of the inlet guide is formed by being curvedly extended from a lower end of the inlet guide to the inlet opening. 12.The bowl according to claim 10, wherein an angle from the lower end of the inlet guide to the inlet opening is 10° to 130°. 13.The bowl according to claim 10, wherein, the exhaust pipe is formed in a vertical direction. 14.The bowl according to claim 10, wherein, the exhaust pipe has a convexly curved shape in the rotation direction of the gas within the bowl body. ​ wherein, ​ 15. The bowl of claim 10, wherein, the exhaust pipe is formed to be inclined toward the direction of rotation of the gas within the bowl as the exhaust pipe moves downward.

16. A substrate processing apparatus comprising: a process chamber; a support unit that supports and rotates a substrate within the process chamber; a nozzle unit that discharges a chemical to the substrate; a bowl disposed within the process chamber; an exhaust duct disposed in a lower side of the bowl and having an exhaust portion formed therein; an exhaust pipe formed in a lower portion of the bowl to be inserted into the exhaust duct or formed in an upper portion of the exhaust duct to be inserted into the bowl so as to connect the bowl and the exhaust duct; an outlet guide formed in a lower portion of the exhaust pipe and having an outlet opening formed in an extension direction of the exhaust duct oriented toward the exhaust portion of the exhaust duct; and an inlet guide formed in an upper portion of the exhaust pipe and having an inlet opening formed to at least partially face a direction of rotation of a gas within the bowl. a body of the outlet guide is formed by curvilinearly extending from an upper end of the outlet guide to the outlet opening, and 17. The substrate processing apparatus of claim 16, wherein, a body of the inlet guide is formed by curvilinearly extending from a lower end of the inlet guide to the inlet opening. an angle from the upper end of the outlet guide to the outlet opening is 10° to 130°, and 18. The substrate processing apparatus of claim 17, wherein, an angle from the lower end of the inlet guide to the inlet opening is 10° to 130°. the exhaust pipe has a convexly curved shape in the direction of rotation of the gas in the bowl.

19. The substrate processing apparatus of claim 16, wherein, the exhaust pipe is formed to be inclined toward the direction of rotation of the gas within the bowl as the exhaust pipe moves downward.

20. The substrate processing apparatus of claim 16, wherein, ​

Citation Information

Patent Citations

  • 3D printing-based precious metal jewelry manufacturing method minimizing gold loss during casting

    KR1020240084926A