Wafer oven and wafer baking device thereof

Abstract

The embodiment of the invention discloses a wafer oven and a wafer baking device thereof. Wherein the oven comprises a layered structure and a heat insulation structure, the layered structure is installed on the oven door through the heat insulation structure, and the heat insulation structure is arranged between the layered structure and the oven door; when the box door closes the opening, the layered structure is located between the box door and the opening; wherein the layered structure comprises at least three mounting layers, and the two adjacent mounting layers are filled with thermal insulation materials. According to the wafer oven, after the oven door is closed, the multiple installation layers are arranged, the space between every two adjacent installation layers is filled with the heat preservation material, meanwhile, the heat insulation structure is arranged, heat loss is avoided to the maximum extent, and therefore the heat preservation performance of the wafer oven is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer processing devices, and in particular to a wafer oven and a wafer baking device thereof. BACKGROUND

[0002] In the semiconductor manufacturing process, a wafer oven is a key heat treatment device to improve the structural stability, electrical performance of the wafer, and the reliability and yield of the final product.

[0003] The basic structure of such an oven usually includes a box body provided with a heating cavity, the box body is provided with an opening for taking and placing a wafer, and is provided with a movable box door, the closure of the box door realizes the airtightness of the heating cavity, thereby creating a controllable space isolated from the external environment for heat treatment. However, in actual production application, due to the difficulty in ensuring the flatness between the opening of the box body and the box door, and the difficulty in realizing the high-precision assembly between the box door and the box body, the airtightness and heat preservation of the oven are poor. SUMMARY

[0004] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a wafer oven and a wafer baking device thereof to solve the problem of poor heat preservation of the oven.

[0005] In a first aspect, the present application provides a wafer oven, comprising a box body having an opening and a box door connected to the box body, the wafer oven further comprises a layered structure and a heat insulation structure, the layered structure is installed on the box door through the heat insulation structure, and the heat insulation structure is arranged between the layered structure and the box door; when the box door closes the opening, the layered structure is located between the box door and the opening; wherein the layered structure comprises at least two installation layers, and adjacent two installation layers are filled with heat preservation materials.

[0006] Based on the above-mentioned wafer oven, after closing the box door, through the arrangement of multiple installation layers and filling the heat preservation materials between adjacent two installation layers, and through the arrangement of the heat insulation structure, the heat loss is avoided to the greatest extent, thereby improving the heat preservation of the wafer oven.

[0007] In one or more embodiments of the above-mentioned wafer oven, the at least two installation layers are connected through a partition structure, and the partition structure is used to separate and support the heat preservation materials.

[0008] In one or more embodiments of the above-mentioned wafer oven, the partition structure comprises reinforcing ribs arranged in a longitudinal and transverse interlaced manner.

[0009] In one or more embodiments of the wafer oven described above, the mounting layer near the door of the oven extends outwardly with a connecting plate connected with the heat insulation structure.

[0010] In one or more embodiments of the wafer oven described above, at least two of the mounting layers in the layered structure are connected through a reinforcing structure.

[0011] In one or more embodiments of the wafer oven described above, the perimeter of the opening of the oven body is provided with a sealing strip, the inner side of the oven door is provided with a pressing assembly, and the pressing assembly is distributed along the circumference of the oven door. The pressing assembly is used to press the sealing strip.

[0012] In one or more embodiments of the wafer oven described above, the pressing assembly includes at least four pressing driving members and at least two magnetic members, each of the magnetic members is arranged between two adjacent pressing driving members; the inner side of the oven body is provided with at least two magnetic seats, each of the magnetic seats is distributed along the circumference of the opening, and each of the magnetic seats is arranged one-to-one corresponding to each of the magnetic members; wherein the moving end of the pressing driving member faces the sealing strip; and when the oven door closes the opening, the distance between the magnetic seat and the corresponding magnetic member is within the effective action distance of both.

[0013] In one or more embodiments of the wafer oven described above, the pressing assembly includes at least two connecting members, at least two of all the connecting members are symmetrically distributed about the center line of the oven door; the inner side of the oven body is provided with at least two locking members, and each of the locking members corresponds to each of the connecting members; when the oven door closes the opening, the connecting member and the corresponding locking member are locked and connected.

[0014] In one or more embodiments of the wafer oven described above, a cooling channel is arranged in the oven body along the circumference of the sealing strip.

[0015] In a second aspect, the present application provides a wafer baking device, which includes a rack and at least two wafer ovens as described above, and each of the wafer ovens is fixedly installed on the rack.

[0016] The above one or more embodiments of the present application have at least one or more of the following beneficial effects: After closing the oven door, the heat loss is minimized by arranging multiple mounting layers, filling insulation materials between adjacent two mounting layers, and arranging a heat insulation structure, thereby improving the heat preservation of the wafer oven.

[0017] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0018] The disclosure of the present application will become more apparent from the following description in conjunction with the accompanying drawings. It is readily understood by those skilled in the art that the drawings are merely for the purpose of illustration and are not intended to limit the scope of protection of the present application. In addition, similar numbers in the figures represent similar components, wherein: Figure 1 is a structural schematic diagram of a wafer baking device provided by an embodiment of the present application; Figure 2 is an enlarged view of A in Figure 1 Figure 3 is a sectional view of a layered structure according to an embodiment of the present application.

[0019] BRIEF DESCRIPTION OF DRAWINGS 1, box; 11, opening; 12, cooling channel; 2, box door; 3, layered structure; 31, mounting layer; 32, thermal insulation material; 33, connecting plate; 4, heat insulation structure; 41, strip-shaped elongated structure; 5, partition structure; 51, reinforcing rib; 6, reinforcing structure; 7, sealing strip; 8, extrusion assembly; 81, extrusion driving member; 82, magnetic member; 83, magnetic seat; 9, rack. DETAILED DESCRIPTION

[0020] Some embodiments of the present application will be described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application, and are not intended to limit the scope of protection of the present application.

[0021] At present, when a wafer is heated using a common wafer oven, the flatness between the opening of the box and the box door is difficult to guarantee, and the high-precision assembly between the box door and the box is difficult to achieve, thereby resulting in poor air tightness and poor thermal insulation of the oven.

[0022] Therefore, the present application creatively proposes a wafer oven and a wafer baking device thereof. The wafer oven comprises a layered structure and a heat insulation structure. After the box door is closed, the mounting layers are arranged in multiple layers, the thermal insulation material is filled between the adjacent two mounting layers, and the heat insulation structure is arranged, so as to maximize the heat loss and improve the thermal insulation of the wafer oven.

[0023] The present application will be described in detail below through specific embodiments.

[0024] Embodiment 1 Referring to FIGS. 1 to Figure 3 ​As shown, this application embodiment provides a wafer oven, which has a housing 1 with an opening 11 and a door 2 connected to the housing 1 for opening and closing. The wafer oven also includes a layered structure 3 and a heat insulation structure 4. The layered structure 3 is installed on the door 2 through the heat insulation structure 4, and the heat insulation structure 4 is disposed between the layered structure 3 and the door 2. When the door 2 closes the opening 11, the layered structure 3 is located between the door 2 and the opening 11. The layered structure 3 includes at least two mounting layers 31, and the adjacent two mounting layers 31 are filled with heat insulation material 32.

[0025] The opening and closing connection includes rotational connection, sliding connection, etc. In this embodiment, the door 2 and the box body 1 are slidably connected. Specifically, the opening 11 is closed by the cooperation of the slider guide module and the cylinder. That is, the door 2 is connected to the slider, and the drive shaft of the cylinder is connected to the slider. The door 2 is moved by the extension and retraction of the drive shaft.

[0026] It should be noted that the mounting layer 31 can be a regular shape such as a rectangular plate, or any other irregular shape, as long as it matches the shape of the opening 11. In this embodiment, the opening 11 is rectangular, and correspondingly, the mounting layer 31 is a rectangular plate.

[0027] Furthermore, the mounting layer 31 can be made of either metallic or non-metallic materials, as long as it meets the requirements for high-temperature resistance and thermal insulation. Of course, for cost and manufacturing considerations, the material properties of the mounting layer 31 should prioritize high-temperature resistance, meaning it can be made of common metallic materials.

[0028] In some examples, the insulation material 32 can be a material that combines insulation and easy filling, such as insulation cotton.

[0029] Furthermore, the shape of the heat insulation structure 4 can be a regular shape such as a plate, a strip, or a cylinder, or any other irregular shape, as long as it meets the heat insulation requirements of the wafer oven. In this embodiment, the heat insulation structure 4 is generally strip-shaped. Thus, the strip-shaped heat insulation structure 4 allows for a gap between the layered structure 3 and the door 2. This part (corresponding to the gap) transfers heat through gas, resulting in low thermal conductivity. The solid part connecting the layered structure 3 and the door 2 is the heat insulation structure 4, and due to its inherent properties, the thermal conductivity of this part is also relatively low. Therefore, while reducing the amount of heat insulation structure 4 used, it also ensures good heat insulation performance.

[0030] In some examples, a strip-shaped elongated structure 41 can be added between the insulation structure 4 and the door 2 to further increase the distance between the door 2 and the layered structure 3, making the gap between the layered structure 3 and the door 2 larger and the heat conduction efficiency lower.

[0031] It should be noted that in this embodiment, the layered structure 3 includes three or more mounting layers 31 to further improve thermal insulation performance; and at least one of the mounting layers 31 in two adjacent layers has a perimeter edge to form a sealed space between adjacent mounting layers 31, preventing leakage of the insulation material 32. The insulation material 32 in different groups of the layered structure 3 (two adjacent layers form a group, and there are overlapping mounting layers 31 between adjacent groups) can be the same or different. For example, material A is used between the first and second layers, and material B is used between the second and third layers; the specific choice is based on a comprehensive consideration of thermal insulation requirements and cost requirements.

[0032] In some examples, refer to Figure 3 As shown, at least two mounting layers 31 are connected by a partition structure 5, which is used to separate and support the insulation material 32. By setting the partition structure 5, the possibility of the insulation material 32 accumulating during oven use can be reduced, so as to ensure the overall insulation performance of the layered structure 3; at the same time, the partition structure 5 can also play a role in structural reinforcement.

[0033] It should be noted that the partition structure 5 in different groups of the layered structure 3 (two adjacent layers form a group, and there is an overlapping installation layer 31 between two adjacent groups) can be the same or different, depending on the structural strength requirements and the usage of the oven.

[0034] Furthermore, in some examples, refer to Figure 3 As shown, the partition structure 5 includes crisscrossing reinforcing ribs 51. The crisscrossing reinforcing ribs 51 not only strengthen the overall strength of the layered structure 3, but also effectively separate the insulation material 32, greatly reducing the possibility of the insulation material 32 accumulating.

[0035] Of course, in some other examples, the partition structure 5 may also include other staggered forms of reinforcing bars 51, such as cross-shaped reinforcing bars 51; or include multiple rectangular reinforcing bars arranged linearly in the transverse and longitudinal directions, as long as they meet the requirements of structural reinforcement and effective support for the insulation material 32.

[0036] In some examples, refer to Figure 3 As shown, a connecting plate 33 extends outward from the mounting layer 31 near the door 2, and the connecting plate 33 is connected to the heat insulation structure 4. By setting the connecting plate 33, the distance between the layered structure 3 and the door 2 can be further increased, thereby making the heat conduction efficiency between the two lower, thus improving the heat preservation performance of the wafer oven.

[0037] In some examples, refer to Figure 3As shown, at least two mounting layers 31 in the layered structure 3 are connected by a reinforcing structure 6. The reinforcing structure 6 is used to improve the structural strength of the layered structure 3, prevent deformation of the layered structure 3 during use, and thus ensure the flatness of the layered structure 3 facing the opening 11, thereby ensuring the airtightness between the door 2 and the box body 1.

[0038] It should be noted that the mounting layers 31 in each group of the layered structure 3 can be provided with only the partition structure 5, or only the reinforcing structure 6; or even both the partition structure 5 and the reinforcing structure 6 can be provided simultaneously, depending on the actual structural strength and insulation requirements. In this embodiment, the layered structure 3 includes three mounting layers 31. The mounting layers 31 near the opening 11 are provided with the partition structure 5, and the mounting layers 31 away from the opening 11 are provided with the reinforcing structure 6. Thus, while taking into account the structural strength of the layered structure 3, the insulation material 32 is also adequately separated, avoiding the accumulation of insulation material 32 in the layered structure 3 after long-term use of the wafer oven.

[0039] In some examples, refer to Figure 2 and Figure 3 As shown, a sealing strip 7 is provided around the opening 11 of the cabinet 1, and a pressing component 8 is provided on the inner side of the cabinet door 2. The pressing component 8 is distributed around the circumference of the cabinet door 2 and is used to press the sealing strip 7. By pressing the sealing strip 7 with the pressing component 8, the airtightness between the cabinet door 2 and the cabinet 1 can be improved, thereby reducing heat loss and improving the heat preservation of the wafer oven.

[0040] It should be noted that the pressing points of the pressing assembly 8 on the sealing strip 7 can be continuously distributed along the circumference of the door 2, such as by setting a driving component and an annular pressing strip, and using the driving component to drive the pressing strip to completely press the sealing strip 7; or the pressing points of the pressing assembly 8 on the sealing strip 7 can be distributed at intervals along the circumference of the door 2.

[0041] As an example and not a limitation, the extrusion assembly 8 includes at least four extrusion drive members 81 and at least two magnetic members 82, each magnetic member 82 being disposed between two adjacent extrusion drive members 81; at least two magnetic seats 83 are provided on the inner side of the housing 1, each magnetic seat 83 being distributed circumferentially along the opening 11, and each magnetic seat 83 being disposed in a one-to-one correspondence with each magnetic member 82; wherein, the moving end of the extrusion drive member 81 faces the sealing strip 7; and when the housing door 2 closes the sealed opening 11, the distance between the magnetic seat 83 and its corresponding magnetic member 82 is less than the effective range of their magnetic action, which is within their effective range of action.

[0042] In this embodiment, the extrusion drive 81 is a cylinder, and an extrusion block is provided at the end of the cylinder's drive shaft.

[0043] After the oven door 2 is closed, the magnetic component 82 is attracted by the magnetic base 83, and the two are attracted to each other, thereby compressing the sealing strip 7 between them. When the gas inside the oven expands due to heating, causing the oven door 2 to be compressed, the magnetic component 82 and the magnetic base 83 can cooperate with each other to prevent the oven door 2 from being forced open. At the same time, each cylinder drives its corresponding compression block to compress the sealing strip 7, thereby achieving uniform and effective compression of the sealing strip 7 to improve the airtightness between the oven door 2 and the oven body 1.

[0044] In other examples, the extrusion assembly 8 includes at least two connectors (not shown), at least two of which are symmetrically distributed about the centerline of the door 2; the inner side of the housing 1 is provided with at least two locking elements, each corresponding to one of the connectors; when the door 2 closes the opening 11, the connectors and their corresponding locking elements are locked together. It is understood that in this particular example, the extrusion assembly 8 may still include at least four extrusion drive elements 81, and their positional relationship with the locking elements may be similar to that with the magnetic element 82.

[0045] In addition, locking connections include various methods such as plug-in connections, snap-fit ​​connections, threaded connections, and pin connections. In this embodiment, to achieve quick connection and separation between the connector and the locking component, the locking connection adopts a plug-in method, that is, the connector and the locking component are interference-fitted. The connector can be designed as a frustum shape, or its side has a partial protrusion, and the locking component has a plug hole that interferes with the connector.

[0046] When the door 2 is closed, the connector is inserted into the locking part. Only when the tension between the two is greater than a certain value (this value is greater than the reaction force generated by the hot gas on the door 2 under normal circumstances) will the two be separated, thus ensuring that the door 2 will not be pushed by the hot gas pressure.

[0047] In some examples, refer to Figure 3 As shown, the housing 1 is equipped with a cooling channel 12, which is arranged along the circumference of the sealing strip 7. The cooling channel 12 can continuously cool the sealing strip 7, preventing it from aging rapidly in a high-temperature environment and reducing its sealing performance.

[0048] In this embodiment, the housing 1 has a rectangular annular door frame along the opening 11 axial direction. The sealing strip 7 can be installed on the door frame. At the same time, cooling water can be passed into the doorway through the water system to cool the sealing strip 7.

[0049] Example 2 Corresponding to Embodiment 1 above, refer to Figure 1 As shown in the embodiment of this application, a wafer baking apparatus is also provided. The apparatus includes a rack 9 and at least two wafer ovens, each of which is fixedly mounted on the rack 9.

[0050] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0051] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0052] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A wafer oven comprising a housing (1) having an opening (11) and a door (2) which is connected to the housing (1) in a hinged manner, characterized in that The wafer oven further comprises a layered structure (3) and a heat insulation structure (4), the layered structure (3) is installed on the door (2) through the heat insulation structure (4), and the heat insulation structure (4) is arranged between the layered structure (3) and the door (2); When the door (2) closes the opening (11), the layered structure (3) is located between the door (2) and the opening (11); The layered structure (3) comprises at least two installation layers (31), and a thermal insulation material (32) is filled between adjacent two installation layers (31).

2. The wafer oven of claim 1, wherein, The at least two installation layers (31) are connected through a separation structure (5) for separating and supporting the thermal insulation material (32).

3. The wafer oven of claim 2, wherein, The separation structure (5) comprises reinforcing ribs (51) arranged in a longitudinal and transverse staggered manner.

4. The wafer oven of claim 1, wherein, The installation layer (31) close to the door (2) extends outwardly and is provided with a connecting plate (33), and the connecting plate (33) is connected with the heat insulation structure (4).

5. The wafer oven of claim 1, wherein, The at least two installation layers (31) in the layered structure (3) are connected through a reinforcing structure (6).

6. The wafer oven of claim 1, wherein, The opening (11) of the box body (1) is provided with a sealing strip (7), the inner side of the door (2) is provided with an extrusion assembly (8), and the extrusion assembly (8) is distributed along the circumference of the door (2), and the extrusion assembly (8) is used for extruding the sealing strip (7).

7. The wafer oven of claim 6, wherein, The extrusion assembly (8) comprises at least four extrusion driving members (81) and at least two magnetic members (82), each magnetic member (82) is arranged between adjacent two extrusion driving members (81); The inner side of the box body (1) is provided with at least two magnetic seats (83), each magnetic seat (83) is distributed along the circumference of the opening (11), and each magnetic seat (83) is arranged in one-to-one correspondence with each magnetic member (82); The moving end of the extrusion driving member (81) faces the sealing strip (7); and when the door (2) closes the opening (11), the distance between the magnetic seat (83) and the corresponding magnetic member (82) is within the effective action distance of both.

8. The wafer oven of claim 6, wherein, The extrusion assembly (8) comprises at least two connecting members, at least two of all the connecting members are symmetrically distributed about the center line of the door (2); The inner side of the box body (1) is provided with at least two locking members, and each locking member corresponds to each connecting member; When the door (2) closes the opening (11), the connecting member and the corresponding locking member are locked and connected.

9. The wafer oven of claim 6, wherein, The box body (1) is provided with a cooling channel (12), and the cooling channel (12) is arranged along the circumference of the sealing strip (7).

10. A wafer baking apparatus characterized by comprising: The device comprises a rack (9) and at least two wafer ovens according to any one of claims 1-9, and each wafer oven is fixedly installed on the rack (9).

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