Film peeling device and film peeling method

Abstract

The present invention provides a film peeling device and a film peeling method capable of reducing a film remaining on a substrate film. A film peeling device according to the present invention peels a film from a film with a film having a film containing a water-soluble resin on at least one surface of a base film, the film peeling device comprising: a conveyance mechanism that conveys the film with the film; a cleaning liquid applying means for applying a cleaning liquid to the surface of the film; a film peeling mechanism which is disposed on the downstream side of the cleaning liquid applying mechanism in the conveying direction and peels the film containing the cleaning liquid from the film with the film to which the cleaning liquid has been applied to the surface of the film; a cleaning liquid re-applying mechanism that is disposed on the downstream side of the film peeling mechanism in the conveyance direction and applies a cleaning liquid to the surface of the film remaining on the substrate film; and a suction mechanism which is disposed on the downstream side of the cleaning liquid re-applying mechanism in the conveying direction and sucks the cleaning liquid and the residue remaining on the film of the substrate film together.

Description

Technical Field

[0001] This invention relates to a film peeling device and a film peeling method that can efficiently remove the film from the surface of a substrate film. Background Technology

[0002] Plastics are used in various fields, but on the other hand, they are considered a cause of marine pollution such as microplastics, making it urgent to reduce the environmental burden caused by plastics.

[0003] Furthermore, in recent years, due to the evolution of the Internet of Things (IoT), the number of electronic devices such as central processing units (CPUs) in computers or smartphones has increased. Consequently, the number of multilayer ceramic capacitors (MLCCs) required to drive these electronic devices has also increased dramatically. A typical manufacturing method for MLCCs includes the following steps: using a release film with a release layer formed on a plastic substrate film as a carrier; forming a ceramic sheet layer on the release film; and peeling off the ceramic sheet layer to produce a ceramic green sheet. In these steps, the release film after peeling off the ceramic green sheet is discarded as a useless material.

[0004] In other words, the increase in release film as waste, accompanying the rapid increase in MLCC manufacturing volume in recent years, has become an environmental problem, leading to increasingly active measures for the reuse of substrate films. From the perspective of release properties, the components of the release layer contained in the release film are generally different from the components constituting the substrate film. Therefore, when the release film with the release layer is directly remelted to produce a recycled film, the components of the release layer exist as foreign matter, making it impossible to achieve stable film formation.

[0005] Patent Document 1 discloses a method for removing a release layer containing water-soluble resin from a release film, which involves applying a cleaning liquid in the form of droplets to the release layer, holding the cleaning liquid in the form of droplets on the surface of the release layer, and then peeling off the release layer containing the cleaning liquid.

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: International Publication No. 2022 / 190713 Summary of the Invention

[0009] The problem that the invention aims to solve

[0010] In the peeling method of Patent Document 1, there is a problem that when the surface roughness of the substrate film is large or there are scratches, the remaining film, especially the water-soluble resin layer that is in contact with the substrate film, causes a decrease in quality when the substrate film is used as a recyclable chip.

[0011] Therefore, the object of the present invention is to provide a coating peeling device and coating peeling method that can reduce the coating residue on the substrate film.

[0012] Technical means to solve the problem

[0013] [1] The coating peeling apparatus of the present invention, which solves the aforementioned problem, peels the coating from a film having a coating containing a water-soluble resin on at least one side of a substrate film. The coating peeling apparatus includes: a conveying mechanism for conveying the film with the coating; a cleaning liquid application mechanism for applying a cleaning liquid to the surface of the coating; a coating peeling mechanism disposed downstream of the conveying direction than the cleaning liquid application mechanism, and peeling the coating containing the cleaning liquid from the film with the coating having the cleaning liquid applied to the surface of the coating; a cleaning liquid reapplication mechanism disposed downstream of the conveying direction than the coating peeling mechanism, and applying a cleaning liquid to the surface of the coating remaining on the substrate film; and a suction mechanism disposed downstream of the conveying direction than the cleaning liquid reapplication mechanism, and suctioning the cleaning liquid and the residue of the coating remaining on the substrate film.

[0014] The film peeling device of the present invention is preferably any one of the following [2] to [4].

[0015] [2] According to the film peeling device described in [1], the suction mechanism is a suction roller, the suction roller having a tubular roller shaft with a plurality of holes and a non-woven fabric layer disposed on the outer periphery of the roller shaft.

[0016] [3] According to the film peeling device of [1] or [2], wherein the suction mechanism includes a speed adjustment mechanism for adjusting the rotation speed of the suction roller.

[0017] [4] According to the film peeling device of [2] or [3], the suction mechanism includes: a back roller disposed in a position facing the suction roller through the film covered by the film; and a clamping mechanism for pressing the suction roller and / or the back roller toward the film covered by the film.

[0018] [5] In addition, the coating peeling method of the present invention, which solves the above problem, is a method of peeling the coating from a film having a coating containing a water-soluble resin on at least one side of a substrate film using a coating peeling device according to any one of [1] to [4], wherein, while conveying the film with the coating, the surface of the coating is given the cleaning liquid, the coating peeling mechanism is brought into contact with the surface of the coating to peel off the coating containing the cleaning liquid, and then the cleaning liquid is given to the surface of the substrate film, and the cleaning liquid and the residue of the coating remaining on the substrate film are aspirated and removed.

[0019] The preferred method for peeling off the film of the present invention is as follows [6].

[0020] [6] According to the coating peeling method of [5], wherein the coating comprises a hardened silicone.

[0021] The effects of the invention

[0022] By using the coating stripping device and coating stripping method of the present invention, the amount of coating residue remaining on the substrate film can be reduced, resulting in high-quality recyclable chips. Attached Figure Description

[0023] [ Figure 1 ] Figure 1 This is a schematic diagram of a film peeling device according to an embodiment of the present invention.

[0024] [ Figure 2 ] Figure 2 yes Figure 1 A cross-sectional view of the suction mechanism used, parallel to the membrane width direction.

[0025] [ Figure 3 ] Figure 3 This is a schematic diagram of a film peeling device according to a modified example 1 of the present invention.

[0026] [ Figure 4 ] Figure 4 This is a schematic diagram of a film peeling device according to a modified example 2 of the present invention. Detailed Implementation

[0027] Hereinafter, embodiments of the present invention will be described based on the accompanying drawings. Furthermore, the following description illustrates embodiments of the present invention but is not limited thereto; various modifications or combinations can be made without departing from the spirit of the present invention.

[0028] (Implementation Method)

[0029] Figure 1This is a schematic diagram of the film peeling device 100 of the present invention. The film peeling device 100 includes: a winding device 10 for winding out a film 1 (hereinafter, sometimes referred to as a film with a film 3 on one side of a substrate film 2); a winding device 20 for winding the substrate film 2 after the film 3 has been peeled off from the surface of the film 1 with the film 3; and driving devices 30-1 and 30-2 for conveying the film in the direction of arrow X while the film is under tension. Additionally, the film peeling apparatus 100 includes: a cleaning fluid supply mechanism 40, which supplies cleaning fluid 41 to the surface of the film 3 of the film 1 with a film coating between the drive unit 30-1 and the drive unit 30-2; a film peeling mechanism 50, which is located downstream of the film 1 in the conveying direction than the cleaning fluid supply mechanism 40, and peels the film 3 containing the cleaning fluid 41 from the film 1 with the film coating 3 having the cleaning fluid 41 supplied to its surface; and a cleaning fluid resupply mechanism 60, which is located downstream of the film peeling mechanism 50. Downstream of the conveying direction, a cleaning liquid 61 is applied to the surface of the film 3 remaining on the substrate film 2; a suction mechanism 70 is disposed downstream of the conveying direction than the cleaning liquid re-application mechanism 60, and simultaneously suctions the cleaning liquid 61 and the residue of the film 3 remaining on the substrate film 2; rollers 81, 82, 83, 84, and 85 adjust the conveying direction of the film 1 or the substrate film 2 with the film; and a suction member 90 suctions the film 3, which is peeled off by the film peeling mechanism 50, as the peeling material. The film peeling apparatus 100 of this embodiment will be described below.

[0030] [A membrane with a liner]

[0031] In the film peeling apparatus 100 of the present invention, the film 1 with a film to be peeled has a film 3 on at least one side of the substrate film 2. The film 1 with a film to be peeled is a film with a film containing a water-soluble resin that takes into account environmental impact, etc. Among them, the water-soluble resin is more preferably at least one of the following as the main component: a water-soluble polyester resin, a polyester urethane resin, an acrylic resin, an ethylene ionomer resin, a polyvinyl alcohol resin, a polyvinylpyrrolidone resin, an ethylene-vinyl alcohol resin, and starch.

[0032] The coating containing water-soluble resin can be a single layer containing water-soluble resin, a laminate of two or more layers containing water-soluble resin, or a laminate of a layer containing water-soluble resin and a layer without water-soluble resin.

[0033] Furthermore, a release film containing a film in which a portion of the film contains a release agent in addition to a water-soluble resin is particularly preferred, as this can effectively exhibit the effect of film peeling. The release agent referred to herein is a component that increases the contact angle of the film surface with respect to the cleaning liquid, i.e., reduces the surface energy of the film. Examples include curable silicone resin compounds with a dimethylsiloxane-based backbone, compounds containing long-chain alkyl groups, and compounds containing fluorine. The film can be a layer containing a water-soluble resin and a release agent, or it can be a laminate of a layer containing a water-soluble resin and a layer containing a release agent. In the case of a laminated film, it is preferable to form a layer containing a water-soluble resin directly above the substrate film, and then form a layer containing a release agent on the outermost surface. The release agent is particularly preferably a water-permeable curable silicone resin compound with a dimethylsiloxane-based backbone that is suitable as a cleaning liquid.

[0034] [Cover peeling device]

[0035] To stably transport the film 1 with the coating and the substrate film 2 with the coating 3 removed, the drive units 30-1 and 30-2 are preferably structures capable of tension cutting. When tension cutting is performed using suction rollers, sometimes a portion of the coating on the film 1 is sucked in, causing a malfunction. Therefore, a structure using a metal drive roller and a rubber roller for clamping is more suitable. The drive units 30-1 and 30-2 are preferably made of stainless steel or have undergone surface treatment as a rust-proofing measure.

[0036] The cleaning fluid supply mechanism 40 has a spray nozzle for spraying cleaning fluid 41, a pump for supplying cleaning fluid 41 to the spray nozzle, and a tank for storing cleaning fluid 41.

[0037] The amount of cleaning solution applied to the surface of the coated membrane 1 is preferably set to 1 cm. 3 / m 2 In order to ensure that at least a portion of the components in the membrane are fully dissolved, the liquid delivery pump can be adjusted according to the conveying speed of the membrane 1 with the coating to determine the specifications of the nozzle and the liquid delivery pump, so that the required amount of cleaning liquid 41 can be applied to the coating surface of the membrane 1 with the coating. The nozzle only needs to be able to apply the cleaning liquid 41 to the coating surface of the membrane 1 with the coating, and examples include spray or shower head nozzles, high-pressure water jet nozzles, etc.

[0038] The cleaning fluid application mechanism 40 can apply cleaning fluid 41 to the surface of the membrane 1 with the coating, or it can have a liquid tank for storing cleaning fluid 41, and apply cleaning fluid 41 to the surface of the coating by immersing the membrane 1 with the coating in the liquid tank.

[0039] The cleaning solution 41 used in the film stripping apparatus 100 can be any solvent that can dissolve at least a portion of the components in the film, and any solvent will be effective. However, water is preferred to reduce environmental impact. In addition, surfactants or the like can be added to the cleaning solution 41 to improve wettability with the film-coated membrane and to facilitate the spread of the cleaning solution 41 across the film surface.

[0040] To rapidly dissolve at least a portion of the components in the coated membrane, it is preferable to apply the heated cleaning solution 41 to the coated surface of the membrane 1. When using a nozzle, the nozzle may include a heat source such as a cylindrical heater, or the tank storing the cleaning solution 41 may be heated. When using a liquid tank, the liquid tank may be heated, or an immersion heater may be installed inside the liquid tank. Any method is acceptable as long as the cleaning solution 41 can be heated; it is not limited to these methods.

[0041] The film peeling mechanism 50 has a front end portion 51 that extends in a ridge-like shape along the width direction and contacts the surface of the film 3 of the film 1 to peel off the film 3. The front end portion 51 is composed of an upstream side surface 52 in the film conveying direction, a downstream side surface 53 in the film conveying direction, and a side surface between the upstream side surface 52 and the downstream side surface 53. To make the front end portion 51 an acute angle, the downstream side surface 53 in the film conveying direction is provided with a gradient 53a. The film peeling mechanism 50 is preferably made of metal, but is not limited to this, and may also be made of resin. The film peeling mechanism 50 is disposed facing the film surface of the film 1.

[0042] The suction member 90 suctions the film 3, which is peeled off by the film peeling mechanism 50, as the peeling material. To improve the removability of the film 3 from the film 1 with the film attached, the front end 15 needs to be forcefully pressed against the film 1 with the film attached. In this embodiment, the conveying direction of the film 1 with the film attached is adjusted by rollers 81 and 82, reducing the angle θ between the film 1 with the film attached and the substrate film 2, while the front end 51 is forcefully pressed against the film 1 with the film attached. While reducing the angle θ between the film 1 with the film attached and the substrate film 2 improves the removability using the film peeling mechanism 50, sometimes the film 3 re-adheres to the substrate film 2. Therefore, it is preferable to remove the peeled film 3 by suction using the suction member 90. Furthermore, rollers 81, 82, the film peeling mechanism 50, and the suction member 90 are surrounded by the display stand 91. In order to quickly dissolve at least a portion of the components in the membrane 3, when using the heated cleaning solution 41, it is preferable to keep it warm or moist by having the cleaning solution dispensing mechanism 40 also surrounded by the display stand 91.

[0043] The cleaning fluid re-application mechanism 60 has a nozzle for spraying cleaning fluid 61 and a pump for delivering cleaning fluid 61 to the nozzle. Additionally, similar to the cleaning fluid application mechanism 40, it may also have a tank for storing the cleaning fluid 61. The cleaning fluid 61 can be any solvent capable of dissolving at least a portion of the components in the membrane 3; it can be the same as or different from the cleaning fluid 41, but water is preferred to reduce environmental impact.

[0044] The amount of cleaning solution 61 applied to the surface of the substrate film 2 is only sufficient to dissolve the residual film 3 remaining on the substrate film 2. Furthermore, to improve the removal performance of the residual film 3, it is preferable to apply the heated cleaning solution 61 to the surface of the substrate film 2.

[0045] The suction mechanism 70 simultaneously suctions the cleaning fluid 61 applied to the substrate film 2 by the cleaning fluid reapplying mechanism 60, as well as the residue remaining on the film 3 on the substrate film 2. The suction mechanism 70 can be a suction roller or the like. Figure 2 yes Figure 1 A cross-sectional view of the suction mechanism 70 used, parallel to the film width direction. The suction mechanism 70 consists of a tubular main body 71 having a hollow portion 72 inside and a roller layer 75 containing nonwoven fabric disposed on the outer periphery of the main body 71.

[0046] The main body 71 has connectors 73a and 73b at both ends. One connector 73b is closed, while the multiple connectors 73a are connected to a vacuum pump or other suction machine. The main body 71 is made of metal materials such as iron, stainless steel (SUS), or aluminum, and has multiple circular holes 74 perforated in an alternating pattern on its outer periphery. Cleaning liquid 61 containing the components of the film 3 absorbed by the roller layer 75 is discharged from the connectors 73a to the outside of the suction mechanism 70 through the holes 74 and the hollow portion 72.

[0047] Alternatively, the connector 73b may be connected to a blower or the like without being closed, allowing air to be intermittently introduced from the connector 73b to promote drainage from the hollow section 72. Furthermore, in this configuration, the cross-section of the hollow section 72 perpendicular to the central axis of the main body 71 is cylindrical from the connector 73a side to the connector 73b side, but it may also be conical with the cross-section increasing towards the connector 73b side.

[0048] Figure 3 This is a schematic diagram of the film peeling device 100A of a modified example 1 of the present invention. The roller 84 is positioned facing the suction mechanism 70 with the substrate film 2 in between. Furthermore, the roller 84 is preferably as follows... Figure 3The clamping mechanism 86 is provided as shown. By applying pressure to the substrate film 2 using the clamping mechanism 86, the suction volume of the cleaning liquid 61 containing the residual film 3 by the suction mechanism 70 can be increased. Furthermore, the effect of preventing the cleaning liquid 61 containing the film 3 from flowing out to the downstream side further downstream of the suction mechanism 70 in the conveying direction is also improved. The clamping mechanism 86 can be a cylinder or the like. In addition, the clamping mechanism 86 can be provided on the suction mechanism 70 side instead of the roller 84 side, or it can be provided on both the roller 84 and the suction mechanism 70.

[0049] Rollers 83 and 85 adjust the conveying direction of the substrate film 2, changing its relative position with the suction mechanism 70 to adjust the contact area between the substrate film 2 and the suction mechanism 70. The suction mechanism 70 is preferably used to rotate around the central axis of the main body 71. When the suction mechanism 70 rotates, by setting the rotation to a speed in the same direction as the conveying direction of the substrate film 2 with a circumferential speed approximately the same as the conveying speed, the substrate film 2 can be stably conveyed without slack or extreme high tension in the substrate film 2 before and after the suction mechanism 70. The circumferential speed of the suction mechanism 70 can be either free rotation or driven rotation, as long as it is approximately the same as the conveying speed of the substrate film 2. In the case of driven rotation, a speed adjustment mechanism that adjusts the rotation speed of the main body 71 of the suction mechanism 70 is preferred.

[0050] In addition, rollers 83 to 85, cleaning fluid re-application mechanism 60 and suction mechanism 70 are surrounded by booth 92.

[0051] Figure 4 This is a schematic diagram of the film peeling device 100B according to a modified example 2 of the present invention. The film peeling device 100B... Figure 1 The film peeling device 100 shown eliminates the roller 84, which is arranged facing the suction mechanism 70 with the substrate film 2 in between, thereby changing the relative position of the rollers 83 and 85 with the suction mechanism 70 and increasing the contact area between the substrate film 2 and the suction mechanism 70.

[0052] Since the film peeling device 100B is rollerless 84, the substrate film 2 can be intentionally slid and conveyed on the suction mechanism 70, creating a relative speed difference between the conveying speed of the substrate film 2 and the circumferential speed of the suction mechanism 70. This results in a state where the surface of the substrate film 2 is wiped by the suction mechanism 70.

[0053] Furthermore, by increasing the relative speed difference, the wiping distance per unit time increases. Additionally, by increasing the contact area, the suction range increases, thus tending to improve the removal capacity of the cleaning solution 61 containing the film 3. However, when the suction mechanism 70 exerts a large holding force on the substrate film 2, making it difficult for the substrate film 2 to slip, sometimes slack or extremely high tension may occur before and after the suction mechanism 70, hindering transport. Therefore, it is preferable to determine the relative speed difference and contact area while simultaneously checking the transport status of the substrate film 2.

[0054] In addition, the rotation direction of the suction mechanism 70 is preferably determined at the same time as the conveying state of the substrate film 2. As long as a relative speed difference is generated, it can be the same direction as the conveying direction, the opposite direction, or any rotation direction.

[0055] Furthermore, to confirm the quality of the substrate film 2 after the film 3 is peeled off by the film peeling mechanism 40, the film peeling devices 100, 100A, and 100B can also be equipped with an inspection machine (not shown) to detect residues on the film 3 or environmental foreign matter adhering to the process before the winding device 20. The inspection machine can be selected according to the properties of the substrate film 2, and an inspection machine utilizing transmitted or reflected light can be used appropriately. In addition, a marking device (not shown) for recording the location of film residues or environmental foreign matter adhering to the process detected by the inspection machine can be provided between the inspection machine and the winding device 20. As long as the location of the object to be inspected can be marked, the marking method can be any method such as a pen, a sticker, or a laser. By marking the film residues or environmental foreign matter adhering to the process, the areas can be removed before remelting, thus enabling more stable production of recycled film and preventing a decline in the quality of recycled film.

[0056] More preferably, the cleaning liquid is completely removed so that the substrate film 2, after being peeled off from the film 3 wound by the winding device 20 in the film peeling device 100, film peeling device 100A, and film peeling device 100B, can be stably produced as a recycled film after remelting. Alternatively, a drying device (not shown) can be provided between the suction mechanism 70 and the winding device 20. The drying device can be located before or after the winding device 30-2.

[0057] Regarding the coating stripping apparatus and coating stripping method of this embodiment, for the coating remaining on the substrate film, the cleaning liquid containing the coating can be removed by a suction mechanism after the cleaning liquid is applied again, so as to obtain a recycled chip with no coating residue and excellent quality.

[0058] Explanation of icon numbers

[0059] 1: Membrane with a coating

[0060] 2: Substrate film

[0061] 3: membrane

[0062] 10: Winding device

[0063] 20: Winding device

[0064] 30-1, 30-2: Drive unit

[0065] 40: Cleaning fluid supply mechanism

[0066] 41: Cleaning fluid

[0067] 50: Film peeling mechanism

[0068] 51: Front end

[0069] 52: Upstream side surface

[0070] 53: Downstream side surface

[0071] 53a: Gradient

[0072] 60: Cleaning fluid re-application mechanism

[0073] 61: Cleaning fluid

[0074] 70: Suction mechanism

[0075] 71: Main body

[0076] 72: Hollow section

[0077] 73a, 73b: Joint section

[0078] 74: Hole

[0079] 75: Roller layer

[0080] 81, 82, 83, 84, 85: Rollers

[0081] Booths 91 and 92:

[0082] 86: Clamping mechanism

[0083] 90: Suction component

[0084] Booths 91 and 92:

[0085] 100, 100A, 100B: Film peeling device

Claims

1. A coating peeling apparatus that peels a coating from a coated film having a coating containing a water-soluble resin on at least one side of a base film, the coating peeling apparatus comprising: a conveying mechanism that conveys the coated film; a cleaning liquid applying mechanism that applies a cleaning liquid to a surface of the coating; a coating peeling mechanism that is disposed on a downstream side in a conveying direction farther than the cleaning liquid applying mechanism and peels a coating containing a cleaning liquid from the coated film to which the cleaning liquid is applied to the surface of the coating; a cleaning liquid reapplying mechanism that is disposed on a downstream side in the conveying direction farther than the coating peeling mechanism and applies a cleaning liquid to the surface of the coating remaining on the base film; and a suction mechanism that is disposed on a downstream side in the conveying direction farther than the cleaning liquid reapplying mechanism and suctions the cleaning liquid and residue of the coating remaining on the base film together. The suction mechanism is a suction roll that includes a tubular main body portion having a hollow portion inside and formed with a plurality of holes and a roll layer containing a nonwoven fabric provided on an outer periphery of the main body portion.

2. The film peeling apparatus according to claim 1, wherein The suction mechanism includes a speed adjusting mechanism that adjusts a rotational speed of the suction roll.

3. The film peeling apparatus according to claim 2, wherein 4. The coating peeling apparatus according to claim 2, wherein the suction mechanism includes: a back roll disposed at a position facing the suction roll with the coated film interposed therebetween; and a pressing mechanism that presses the suction roll and / or the back roll toward the coated film.

5. A coating peeling method of peeling a coating from a coated film having a coating containing a water-soluble resin on at least one side of a base film using the coating peeling apparatus according to any one of claims 1 to 4, wherein while the coated film is conveyed, the cleaning liquid is applied to the surface of the coating, the coating peeling mechanism is brought into contact with the surface of the coating to peel a coating containing the cleaning liquid, and thereafter, a cleaning liquid is applied to the surface remaining on the base film, the cleaning liquid and residue of the coating remaining on the base film are suctioned together, and removed. The coating contains a hardened silicone.

6. The film peeling method according to claim 5, wherein ​

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