Inlay for card or document and method for assembling same

Abstract

An inlay (7) for a card or document, comprising: a first cover layer (10) wherein the first cover layer (2, 10) has at least one preformed window (6) and a first insert (3) arranged within the preformed window (6) of the first cover layer (10) wherein the insert (3) is configured to prevent deformation of the window (6) during lamination; a core layer (1) having a first side with which the core layer (1) is placed on the first cover layer (2, 10) and a second side, where the core layer (1) comprises a substrate and is configured to accommodate at least one electronic component (4, 5); a second cover layer (2, 10), the second cover layer (2, 10) having at least one prefabricated window (6); a second insert (3) arranged within the prefabricated window (6) of the second cover layer (2, 10), where the insert (3) is configured to prevent deformation of the prefabricated window (6) during lamination; wherein the second cover layer (2, 10) is placed on the second side of the core layer (1), and wherein the first cover layer (2, 10) and the second cover layer (2, 10) and the core layer (1) are laminated.

Description

TECHNICAL FIELD

[0001] The present application relates generally to an inlay for a card or a document and a method of assembling thereof. BACKGROUND

[0002] EP 3421235A1 and US2020202080A1 disclose a method of manufacturing a card having a transparent window. A pre-lamination step involves placing a sheet in contact with one or more sides of a lamination plate having a recess. The sheet is then laminated, resulting in a raised portion on the sheet. Thereafter, during an assembly step, another sheet is positioned in contact with the first sheet such that the raised portion of the first sheet is aligned and at least partially fits into an opening in the second sheet. The process ends with a lamination step in which the two sheets are laminated together to form the final product. SUMMARY

[0003] It is an object of the present application to provide a durable and secure inlay for a card or a document, which accommodates electronic components without deforming during lamination.

[0004] The object of the present application is solved by the features of the independent claims. Advantageous embodiments of the present application are described in the dependent claims.

[0005] The present application provides a solution for preventing deformation of pre-fabricated windows, ensuring the visibility and durability of embedded security features, achieving optimal adhesion and integration of layers, and meeting opacity requirements of consistent visual quality and security standards.

[0006] In a first aspect, the present application relates to elements of an inlay for a card or a document, various advantageous effects can be seen. These elements can be combined with other elements in the present application, as described below.

[0007] In this case, the inlay for a card or a document can comprise a first cover layer, a first insert, a core layer, a second cover layer, a second insert. The first cover layer can have at least one pre-fabricated window. The first insert can be arranged within the pre-fabricated window of the first cover layer, wherein the insert is configured to prevent deformation of the window during lamination. The core layer can have a first face and a second face and is placed on the first cover layer with the first face, wherein the core layer can comprise a substrate and is configured to accommodate at least one electronic component. The second cover layer can have at least one pre-fabricated window. Furthermore, the second insert can be arranged within the pre-fabricated window of the second cover layer, wherein the insert can be configured to prevent deformation of the pre-fabricated window during lamination. The second cover layer can be placed on the second face of the core layer, and wherein the first and second cover layers and the core layer can be laminated.

[0008] Inclusion of the preformed window with the insert in both the first and second cover layers ensures structural integrity of the window during the lamination process, thereby preventing any undesirable deformation that could compromise the visibility or functionality of the card or credential. The configuration of the core layer to house at least one electronic component allows for the integration of smart features, such as an RFID chip or antenna, thereby enhancing the functionality of the card or credential without compromising its physical structure. Laminating the first and second cover layers together with the core layer creates a durable and cohesive structure that protects the embedded electronic components and maintains the overall integrity of the card or credential over time. The inlay also provides the advantage of having a preformed window in the cover layer, thereby allowing for easy insertion of the insert without the need for additional cutting or shaping.

[0009] Furthermore, in the transition area between the second insert and the second cover layer, there can be interweaving between the material of the second insert and the material of the second cover layer, thereby providing a thermal bond between the second insert and the second cover layer. The interweaving between the material of the second insert and the second cover layer provides a secure thermal bond that enhances the durability of the window area, thereby ensuring that the insert remains securely in place even under stress or after repeated use. The thermal bond minimizes the risk of delamination or separation at the transition area between the second insert and the second cover layer, thereby preserving the aesthetic and functional quality of the card or credential.

[0010] At least one of the core layer, the first cover layer, or the second cover layer can be transparent or opaque. The option of the core layer, the first cover layer, or the second cover layer being transparent or opaque allows for the ability to customize the appearance of the card or credential and control the visibility of internal components or security features. The use of transparent materials can facilitate the integration of see-through windows or areas for displaying information, while opaque materials can be used to conceal sensitive components, thereby providing a balance between functionality and security. The versatility of transparency and opacity provides manufacturers with the flexibility to design cards or credentials that meet the specific requirements of a wide range of applications, from identification cards to secure access badges.

[0011] The substrate of the core layer can include a PC film, a PVC film, or a PETG film. The use of a PC film, a PVC film, or a PETG film as the substrate of the core layer provides a selection of materials with different properties, such as heat resistance and impact strength, thereby allowing for the customization of the physical properties of the card or credential based on the intended use environment. These materials are renowned for their durability and resistance to wear, which contributes to the longevity of the card or credential, reducing the need for frequent replacement and thereby providing cost savings over time. The selection of these films can also affect the flexibility and rigidity of the card or credential, enabling the creation of products that meet specific handling and use requirements, such as flexibility for wallet storage or rigidity for insertion into a reader.

[0012] Furthermore, the first and / or second overlay may comprise a PC film, PVC film, or PETG film. When using the same materials, selecting a PC film, PVC film, or PETG film for the first and / or second overlay provides a harmonious match with the core substrate, resulting in uniform thermal expansion properties and improved lamination quality. These films offer excellent printability and adhesion properties, essential for applying high-resolution graphics, text, and security features to the surface of cards or documents. Using these materials in the overlay enhances the card's or document's resistance to environmental factors such as UV light, moisture, and chemicals, thereby ensuring that printed information and embedded features remain intact throughout the product's lifespan.

[0013] Inserts can include PC films, PVC films, or PETG films. Inserts made of materials such as PC films, PVC films, or PETG films enhance the durability of the insert, providing resistance to environmental factors such as moisture, temperature fluctuations, and physical abrasion. Utilizing these types of films can improve the structural integrity of the insert, ensuring it maintains its shape and function over an extended service life. Films can be selected based on their specific properties (e.g., flexibility or rigidity) to adapt the insert to the requirements of various applications, thereby increasing the versatility of the insert for use in different products.

[0014] Inserts can include optically variable materials configured to provide security features. Combining optically variable materials as inserts provides dynamic security features that are difficult to replicate, thereby enhancing product anti-counterfeiting measures. Security features provided by optically variable materials can be easily verified through visual inspection, facilitating rapid authentication without the need for specialized equipment. The aesthetic appeal of optically variable materials can also serve as a unique branding element, contributing to product market differentiation and consumer appeal.

[0015] The core layer may include an optically variable material configured to provide a security feature. Embedding the optically variable material within the core layer of the inlay ensures that the security feature is integral with the inlay structure, making it less susceptible to tampering or removal. The core layer construction protects the optically variable material from surface abrasion and environmental damage, thus maintaining the effectiveness of the security feature throughout the product's lifespan. The integration of the security feature within the core layer allows for a seamless design that does not interfere with the overall thickness or flexibility of the inlay, thereby maintaining its compatibility with a wide range of applications.

[0016] The first and second opaque overlays may include highly opaque material layers configured to obscure the visibility of electronic components. The use of highly opaque material layers effectively conceals electronic components within the inlay, thereby preventing visual inspection and potential tampering or reverse engineering. By shielding internal components, the highly opaque material layers add an extra layer of security, protecting sensitive information that may be stored or transmitted by the electronic components. The highly opaque layers can also enhance the aesthetic design of the inlay by providing a uniform appearance, which can be customized with branding or infographics without exposing the underlying technology.

[0017] Transparent inserts can be made from optically variable materials, offering unique properties such as color shift, strong UV fluorescence, and other security features. Transparent inserts made from optically variable materials allow for unique visual effects, such as color shift and UV fluorescence, which can be used as security features and design elements. Using optically variable materials in transparent inserts allows the inlay to maintain a high level of security without compromising the design or visibility of other inlay components, such as printed information or branding. The unique properties offered by optically variable materials can be tailored for specific wavelengths or viewing angles, providing customizable security solutions that can be adapted to the needs of different industries and applications.

[0018] Optically variable materials can also include holographic or diffractive patterns. The combination of optically variable materials with holographic or diffractive patterns enhances the security features of the inlay, making it more resistant to counterfeiting and unauthorized copying. Holographic or diffractive patterns provide a visually unique appearance that can be easily identified by an individual, thus facilitating rapid authentication of the inlay without the need for specialized equipment.

[0019] The core layer may further include a lower transparent core layer, an upper transparent core layer, and a height-adjustable transparent core layer. The lower transparent core layer contacts one side of the first cover layer. The upper transparent core layer is on top of the lower transparent core layer, wherein the upper transparent core layer comprises at least one layer. The height-adjustable transparent core layer is located on top of at least one upper transparent core layer. The presence of the lower transparent core layer, which is in direct contact with the first cover layer, provides structural integrity and protection for the features below, thereby enhancing the durability of the inlay. Adding an upper transparent core layer consisting of at least one layer allows for customization of the inlay's thickness and stiffness, which can be tailored to specific application requirements. The height-adjustable transparent core layer enables precise control of the inlay's overall thickness, ensuring compatibility with a variety of devices and housings while maintaining the required level of transparency.

[0020] The inlay may include a third layer on the opposite side of the first and second cover layers, opposite to the core layer. The third layer on the opposite side of the first and second cover layers protects the core layer from environmental damage and physical abrasion, thereby extending the inlay's lifespan. The third layer may be designed to provide additional functionality, such as improved adhesion to external surfaces or enhanced tamper resistance, further increasing the inlay's utility.

[0021] An inlay may include a fourth layer on the side of the third layer opposite to the first and second cover layers. The fourth layer adds an extra level of protection and can be used to incorporate additional security features or aesthetic elements, which can enhance the overall value and appeal of the inlay. The presence of a fourth layer on the side of the third layer opposite to the first and second cover layers can provide a balanced structure, which can improve the handling and processing of the inlay during manufacturing and integration into the final product.

[0022] Electronic components can include chip modules and embedded antennas. The integration of electronic components, including chip modules and embedded antennas, enables the inlay to support electronic communication and data storage capabilities, which can be used for advanced authentication, tracking, and data exchange applications. The embedded antenna ensures that the electronic components maintain a low profile within the inlay, thus preserving the inlay's physical flexibility and aesthetic appearance, while providing reliable wireless connectivity.

[0023] The chip module can be a contactless chip module. The integration of a contactless chip module within an inlay enables secure and fast wireless communication, facilitating transactions and data exchange without physical contact. The presence of a contactless chip module enhances user convenience by allowing seamless integration with contactless readers, thereby improving the user experience in various applications such as access control, payment systems, and identification.

[0024] Embedded antennas can be integrated into the core layer using wire embedding, printing, or etching techniques. Using techniques such as wire embedding, printing, or etching to embed the antenna into the core layer allows for compact and robust designs, reducing the overall thickness of the inlay and improving durability. Integrating antennas through these methods improves signal performance and reliability, ensuring consistent communication with contactless readers even under challenging environmental conditions.

[0025] The prefabricated windows in the first and second overlay layers can have a minimum size of 5.0 × 5.0 mm with a tolerance of 10% to ensure compliance with specified safety feature dimensions. This minimum dimension specification ensures the inlay has sufficient structural stability to withstand handling and environmental stresses, thereby extending product lifespan. By defining the minimum dimension of the layers, the inlay can be designed to meet specific performance standards, such as mechanical strength and flexibility, which are crucial for certain applications such as ID cards or passports.

[0026] Each prefabricated window in both the first and second overlays includes a corner with a minimum radius greater than 0.2 mm to reduce stress concentration and enhance the structural integrity of the inlay. Including a corner with a minimum radius greater than 0.2 mm reduces stress concentration, which significantly enhances the structural integrity of the inlay and prevents cracking or breakage at the corner. The corner radius design also helps improve safety by eliminating sharp edges, thereby reducing the risk of injury to users during handling and use of products containing inlays.

[0027] Any lines or bars in the design of the prefabricated window can have a width greater than 2.0 mm to ensure sufficient visibility and durability of the embedded safety features. Ensuring that any lines or bars in the design of the prefabricated window have a width greater than 2.0 mm guarantees the visibility and legibility of the embedded safety features, which is crucial for verification and certification purposes. The minimum width specification of the line or bar poles contributes to the durability of the design element, preventing wear and tear that could otherwise compromise the safety features over time.

[0028] The insert, placed within a pre-formed window, can have a thickness of at least 30 μm, and preferably 50 μm, on one side to match the opacity requirements of the first and second overlays, thereby ensuring consistent visual quality and security standard compliance. The specific minimum thickness of the window ensures the inlay meets certain opacity standards, which is crucial for maintaining a uniform appearance across the entire card, thus enhancing the chip card's aesthetic appeal and professional presentation. By matching the opacity requirements of the overlays, the inlay contributes to the card's security features, as consistent visual quality helps prevent tampering and counterfeiting, thus providing a higher level of protection for sensitive information.

[0029] Thermal lamination can be performed at approximately 175°C for 15 minutes to achieve optimal adhesion and integration of the layers without compromising the material integrity of the inlay. Precise control of lamination temperature and duration ensures a strong bond between the layers of the inlay, enhancing the chip card's durability and lifespan by preventing delamination and wear over time. By optimizing the lamination process, material integrity is maintained, meaning the inlay retains its functionality and reliability even under the stresses of normal use, providing a reliable platform for secure transactions.

[0030] Furthermore, a chip card is provided. The chip card may include an inlay according to the embodiments described above. The integration of the disclosed inlay provides a foundation for a chip card designed to meet specific performance standards, thereby ensuring effective operation of the card in a wide range of transaction environments. Using the inlay according to the disclosed application allows for the creation of chip cards that can be customized to meet evolving standards in the payment industry, thus providing design flexibility and potential for future enhancements.

[0031] Additionally, this application relates to a method for assembling an inlay. The method may include the steps of: providing a first cover layer having at least one pre-fabricated window; and disposing a first insert within the pre-fabricated window of the first cover layer, wherein the insert is configured to prevent deformation of the window during lamination. Furthermore, the method may include the steps of: placing a core layer having a first side and a second side, wherein the first side is on the first cover layer, wherein the core layer includes a substrate and is configured to accommodate at least one electronic component; and providing a second cover layer having at least one pre-fabricated window. Furthermore, the method may include the steps of: disposing a second insert within the pre-fabricated window of the second cover layer, wherein the insert is configured to prevent deformation of the pre-fabricated window during lamination; placing the second cover layer on a second side of the core layer; and laminating the first cover layer, the second cover layer, and the core layer to assemble the inlay.

[0032] The outlined methodologies can lead to improved manufacturing processes, resulting in more efficient production of chip cards with potentially lower defect rates and higher yields. Further improvements to the methods for manufacturing the inlays can lead to chip cards exhibiting enhanced performance characteristics, such as better electrical connectivity or improved structural integrity, which can translate into a better user experience.

[0033] The method may further include the following steps: integrating electronic components within a core layer, wherein, in the transition region between a first insert and a first cover layer, there is an interweaving between the materials of the first insert and the first cover layer; providing a thermal bond between the first insert and the first cover layer by subjecting both the insert and the cover layer to heating so that they both melt and their molten materials permeate into each other and are then mechanically locked together after hardening, without adding additional adhesive material to the joint between the insert and the first cover layer. Including an additional layer as part of this method can provide the chip card with additional functionality or protection, such as increased resistance to environmental factors or additional security features. The additional layer can be designed to introduce new properties to the chip card, such as improved haptic feedback or visual elements, which can be used to differentiate cards in the market and add value for the end user.

[0034] Inlays can be assembled into inlay sheets consisting of multiple individual inlays, wherein the method also includes extracting individual inlays from the inlay sheet using a cutting technique. Assembling inlays into inlay sheets simplifies the manufacturing process, increases throughput, and reduces labor costs by allowing multiple inlays to be processed simultaneously. The ability to extract individual inlays from the inlay sheet using a cutting technique provides a precise and clean method for separating individual inlays, thereby improving the quality of the final product. This extraction method reduces material waste by allowing precise removal of inlays from the sheet, thus contributing to cost savings and environmental sustainability.

[0035] Those skilled in the art will recognize that the advantages, technical effects, and preferred embodiments discussed in connection with inlays are similarly applicable to methods for assembling inlays. Likewise, all the advantages, technical effects, and preferred embodiments described in connection with the method can be transferred to inlays.

[0036] Various advantageous effects can be observed in other aspects relating to the elements and characteristics of the multilayer inlay compositions. These elements can be combined with other elements of this application as described above and below.

[0037] In this respect, a multilayer inlay may include multiple layers, at least one core layer, and multiple inserts. The multiple layers may be arranged in any combination and arrangement of: a first cover layer and a second cover layer, wherein the first and second layers have at least one prefabricated window. At least one core layer may be placed between the first and second cover layers. Multiple inserts may be arranged within the prefabricated windows of the first and second cover layers, wherein the inserts are configured to prevent deformation of the windows during lamination.

[0038] Pre-fabricated windows in both the first and second cover layers allow for precise alignment of the insert, ensuring consistent quality and appearance of the final product. The insert's construction, which prevents deformation during lamination, enhances the inlay's structural integrity, maintaining the desired flatness and uniformity across the layers. The multi-layered structure with a core layer placed between the cover layers provides the inlay with additional strength and durability, potentially extending its lifespan and availability in a variety of applications.

[0039] The first and second cover layers may include optically variable materials, OVM layers, or white / opaque layers, and the core layer may include one or more transparent core layers or one or more OVM layers. The insert may also include OVM.

[0040] The arrangement of the layers and inserts can be configured to provide enhanced security features, visual effects, or electronic functionality, and each layer and insert can be joined using a lamination process that maintains the integrity and alignment of each layer and insert, despite differences in material properties.

[0041] The arrangement of multiple inserts within a prefabricated window contributes to the overall stability of the inlay, as it better withstands external pressure and resists deformation. The specific construction of the inserts, which counteracts deformation during the lamination process, ensures the window maintains its shape and dimensions, crucial for applications where dimensional accuracy is paramount. The multi-layer inlay design allows for customization and versatility in use, as different materials and properties can be combined into the core and cover layers to meet the specific requirements of various industries or products.

[0042] Various advantageous effects can be seen in other aspects of the elements relating to the method of assembling multilayer inlays with embedded inserts. These elements can be combined with other elements of this application as described above and below.

[0043] In this context, a method for assembling a multilayer inlay with an embedded insert is provided. The method may include the following steps: providing a first cover layer and a second cover layer having at least one prefabricated window; precisely positioning the insert within the prefabricated window using a pick-and-place machine; and securely engaging the positioned insert within the prefabricated window using micro-jointing technology.

[0044] Using pick-and-place machines to position inlays ensures high precision and repeatability during assembly, resulting in consistent quality across multi-layered inlays. Micro-jointing techniques, which engage inserts within prefabricated windows, allow for robust and durable connections without significantly increasing the thickness of the inlay layers or altering their structural integrity. This method enables the efficient assembly of complex inlays with embedded inserts, potentially reducing manufacturing time and costs associated with manual positioning and joining processes.

[0045] Micro-joining can involve applying localized heat and pressure to create a durable bond without damaging the surrounding material or insert. Each insert may include an optically variable material.

[0046] Inserts incorporating optically variable materials enhance the security features of multilayer inlays, making them more difficult to counterfeit and thus adding value in applications such as identification documents and currency. Optically variable materials can provide a unique visual effect that can be easily authenticated by individuals without the need for specialized equipment, thereby increasing the practicality of the security features. The use of optically variable materials in inserts allows for customization of the inlay's appearance, offering the possibility of creating unique and aesthetically pleasing designs for both security and branding purposes.

[0047] Various advantageous effects can be seen in other aspects of the elements relating to the construction and features of multilayer inlays with electronic modules. These elements can be combined with other elements of this application as described above and below.

[0048] A multilayer inlay may include at least one first cover layer, at least one first insert, and traces and / or wires for connecting electronic modules. At least one first cover layer may have at least one pre-fabricated window. At least one first insert may be located within the pre-fabricated window of the first cover layer, and the insert may be configured to prevent deformation of the window during lamination. Furthermore, the traces and / or wires for connecting electronic modules may be disposed within a core layer. The core layer may be placed adjacent to the first cover layer, and the wires may be positioned so that they are visible through a window or a window including the insert.

[0049] Including a prefabricated window in the first overlay ensures precise alignment with the underlying electronic module, facilitating accurate visual access to the components below. An insert within the prefabricated window maintains its structural integrity during the lamination process, preventing deformation that could obscure the visibility of the electronic module. By allowing traces and / or wires to be visible through the window or a window with the insert, this design enables easy inspection and verification of the circuitry without the need for disassembly or additional inspection tools.

[0050] The visibility of the antenna traces or wires through a window or a window including an insert provides at least one of the following: enhancing the aesthetic appearance of the device; providing visual verification of the presence and integrity of the electronic module; or serving as a security feature by combining specific visible patterns or configurations that are difficult to replicate without proper manufacturing capabilities.

[0051] Electronic modules may include antennas and / or chip modules.

[0052] The ability of inserts to enhance the aesthetic appearance of devices allows for customization and branding opportunities, enabling manufacturers to differentiate their products in the market with visually appealing designs that can be tailored to specific customer preferences or company identity. Providing visual verification of the presence and integrity of the electronic modules through inserts not only simplifies the quality control process but also gives end-users confidence in the authenticity and proper functioning of the device, potentially reducing the incidence of counterfeit products. Inserts that act as security features by incorporating specific visible patterns or configurations add an additional layer of protection against unauthorized copying, as these unique designs require specialized manufacturing techniques not easily accessible to counterfeiters, thus enhancing the overall security of the device.

[0053] Various advantageous effects can be seen in other aspects relating to the elements of the method for engaging the insert to the first cover layer. These elements can be combined with other elements of this application as described above and below.

[0054] In this regard, a method for bonding an insert to a first cover layer is provided. The method may include the steps of: aligning the insert with at least one first cover layer, wherein at least one of the insert and the first cover layer comprises a fusible material; applying heat and pressure to the aligned insert and the first cover layer to induce fusion between the materials of the insert and the first cover layer; and controlling the application of heat and pressure to form a cohesive undercut in the fusion region of the insert and / or the first cover layer, wherein the undercut interlocks to enhance the mechanical bond strength.

[0055] This method enhances the durability of the joined components by generating interlocking material cohesive undercuts, thus providing a stronger mechanical bond than bonds formed solely by surface adhesion. By utilizing the fusible material properties of the inserts or overlays, the need for additional adhesives is eliminated, simplifying the manufacturing process and reducing material costs. Controlled application of heat and pressure allows for precise manipulation of the joining environment, ensuring consistent quality of the joints across multiple components and reducing the likelihood of manufacturing defects.

[0056] No additional adhesives are required during the bonding process, and structural integrity can be achieved through material cohesion and undercut formation.

[0057] Eliminating additional adhesives during the bonding process reduces the likelihood of chemical incompatibility between the adhesive and the bonded materials, thereby enhancing the long-term stability and reliability of the product. This method promotes environmental sustainability by reducing the use of potentially hazardous adhesives and by simplifying the recycling process, as the bonded parts can be separated more easily without adhesive residue. The bonding process achieves structural integrity through material cohesion and undercut formation, which can result in lighter products, as the absence of additional adhesives helps reduce overall material usage.

[0058] Various advantageous effects can be seen in other aspects of the elements relating to the method of manufacturing laminated devices. These elements can be combined with other elements of this application as described above and below.

[0059] A method for manufacturing laminated devices may include the steps of: performing a first lamination cycle on a multilayer assembly comprising multiple layers bonded under heat and pressure; and immediately following the first lamination cycle, initiating an active cooling process. Initiating the active cooling process immediately after the first lamination cycle minimizes the heat exposure of the multilayer assembly, thereby reducing the risk of material thermal degradation. By transitioning directly from lamination to the cooling phase, this method potentially reduces overall manufacturing time, leading to increased yield and productivity. Rapidly initiating cooling after lamination enhances the bond strength between layers by preventing the adhesive material from loosening while still heated, resulting in more durable laminated devices.

[0060] The method may further include a step of controlling an active cooling process to rapidly reduce the temperature of the multilayer assembly to a predetermined level that effectively stabilizes the material and solidifies the bond formed during the first lamination cycle. Active cooling may involve applying a cooling medium directly to the surface of the multilayer assembly or circulating the cooling medium within a chamber containing the assembly. Furthermore, the method may include the steps of monitoring the temperature of the multilayer assembly using a temperature sensor during the active cooling process and adjusting the cooling rate based on real-time temperature data to prevent material deformation and enhance the structural integrity of the laminated product.

[0061] Controlling the active cooling process to rapidly reduce temperature to predetermined levels allows for precise material stabilization, ensuring consistent quality and performance of laminated devices. Circulating the cooling medium directly onto the surface or within the chamber of the multilayer assembly provides uniform cooling, crucial for maintaining dimensional accuracy and preventing warping or other forms of deformation. Real-time temperature monitoring based on this data and adjustable cooling rates enable optimization of the cooling process for different material and component configurations, thereby enhancing the structural integrity and reliability of the final product.

[0062] Various advantageous effects can be seen in other aspects of the elements relating to the method of manufacturing a chip card from an inlay sheet comprising multiple assembled inlays. These elements can be combined with other elements of this application as described above and below.

[0063] A method for manufacturing a chip card from an inlay sheet comprising a plurality of assembled inlays may include the following steps: providing an inlay sheet comprising a plurality of assembled inlays pre-arranged in defined card regions; and cutting a chip card from the inlay sheet using a stamping mechanism, wherein each defined card region corresponds to the size and shape of the finished chip card.

[0064] Offering an inlay sheet containing multiple assembled inlays pre-arranged within a defined card area simplifies the manufacturing process and improves production efficiency by enabling the simultaneous fabrication of multiple chip cards. By pre-arranging the inlays within the inlay sheet to correspond to the size and shape of the finished chip card, this method ensures the precision and consistency of the final product, thereby reducing the likelihood of errors and material waste. Cutting the chip cards from the inlay sheet using a stamping mechanism allows for clean and precise separation of individual cards, resulting in higher quality edge finishes and a more aesthetically pleasing final product.

[0065] This disclosure is illustrated by way of example and is not limited to the accompanying drawings, in which the same reference numerals indicate similar elements. Embodiments of this application will now be described with reference to the accompanying drawings: Another embodiment combines one or more elements relating to the inlay of a card or document with one or more elements relating to the multilayer inlay composition and features.

[0066] Another embodiment combines one or more elements of an aspect relating to an inlay for a card or document with one or more elements of an aspect relating to a method for assembling a multilayer inlay with embedded inserts.

[0067] Another embodiment combines one or more elements relating to an inlay of a card or document with one or more elements relating to the construction and features of a multilayer inlay having an electronic module.

[0068] Another embodiment combines one or more elements relating to the inlay of a card or document with one or more elements relating to the method of engaging the insert to the first overlay.

[0069] Another embodiment combines one or more elements relating to the inlay of a card or document with one or more elements relating to the method of manufacturing a laminated device.

[0070] Another embodiment combines one or more elements of an aspect relating to an inlay for a card or document with one or more elements of an aspect relating to a method for manufacturing a chip card from an inlay sheet comprising multiple assembled inlays.

[0071] Another embodiment combines one or more elements of an aspect relating to a multilayer inlay composition and features with one or more elements of an aspect relating to a method for assembling a multilayer inlay having an embedded insert.

[0072] Another embodiment combines one or more elements relating to aspects of multilayer inlay compositions and features with one or more elements relating to aspects of the construction and features of a multilayer inlay having electronic modules.

[0073] Another embodiment combines one or more elements of the aspect relating to the multilayer inlay composition and features with one or more elements of the aspect relating to the method of bonding the inlay to the first cover layer.

[0074] Another embodiment combines one or more elements relating to aspects of multilayer inlay compositions and features with one or more elements relating to aspects of methods for manufacturing laminated devices.

[0075] Another embodiment combines one or more elements of an aspect relating to a multilayer inlay composition and features with one or more elements of an aspect relating to a method for manufacturing a chip card from an inlay sheet comprising multiple assembled inlays.

[0076] Another embodiment combines one or more elements of an aspect relating to a method for assembling a multilayer inlay with embedded inserts with one or more elements of an aspect relating to the construction and features of a multilayer inlay with electronic modules.

[0077] Another embodiment combines one or more elements of an aspect relating to a method for assembling a multilayer inlay with an embedded insert with one or more elements of an aspect relating to a method for engaging the insert to a first cover layer.

[0078] Another embodiment will combine one or more elements of an aspect relating to a method for assembling a multilayer inlay with embedded inserts with one or more elements of an aspect relating to a method for manufacturing a laminated device.

[0079] Another embodiment will combine one or more elements of an aspect relating to a method for assembling a multilayer inlay with embedded inserts with one or more elements of an aspect relating to a method for manufacturing a chip card from an inlay sheet comprising multiple assembled inlays.

[0080] Another embodiment combines one or more elements of an aspect relating to the construction and features of a multilayer inlay having electronic modules with one or more elements of an aspect relating to a method for bonding the inlay to a first cover layer.

[0081] Another embodiment combines one or more elements relating to the construction and features of a multilayer inlay having electronic modules with one or more elements relating to a method for manufacturing a laminated device.

[0082] Another embodiment combines one or more elements of an aspect relating to the construction and features of a multilayer inlay having electronic modules with one or more elements of an aspect relating to a method of manufacturing a chip card from an inlay sheet comprising multiple assembled inlays.

[0083] Another embodiment will combine one or more elements of an aspect relating to a method for joining an insert to a first cover layer with one or more elements of an aspect relating to a method for manufacturing a laminated device.

[0084] Another embodiment will combine one or more elements of an aspect relating to a method for attaching an insert to a first cover layer with one or more elements of an aspect relating to a method for manufacturing a chip card from an inlay sheet comprising a plurality of assembled inlays.

[0085] Another embodiment combines one or more elements of an aspect relating to a method for manufacturing a laminated device with one or more elements of an aspect relating to a method for manufacturing a chip card from an inlay sheet comprising multiple assembled inlays. Attached Figure Description

[0086] Figure 1 A cross-sectional view of the inlay according to this application is shown, wherein the arrows indicate material flow during thermal lamination. Figure 2 It shows when in Figure 1 This occurs when a lamination step takes place in the inlay and material from the transparent core layer flows into window 6. Figure 3 The basis of this application is shown. Figure 2 A top view of the entrance, featuring a laminated transparent window 6 in shape, without insert 3. Figure 4A cross-sectional view of an inlay according to another embodiment of this application is shown, wherein the arrows indicate the flow behavior of the material compared between having the insert 3 and not having the insert 3. Figure 5 An inlay design with a transparent window 6 according to another embodiment of this application is shown. Figure 6 A cross-sectional view of an inlay design with pre-cut windows 6 or gaps according to another embodiment of this application is shown. Figure 7 A cross-sectional view of the insert structure of the insert 3 filling the window 6 according to another embodiment of this application is shown. Figure 8 A cross-sectional view of an inlay design with a highly opaque overlay according to another embodiment of this application is shown. Figure 9 A cross-sectional view of an inlay design in which an optically variable material insert 3 is added to a window 6, according to another embodiment of this application, is shown. Figure 10 A cross-sectional view of an inlay design with an optically variable material core layer according to another embodiment of this application is shown. Figure 11 A cross-sectional view of an inlay design having a transparent window 6 and a chip module 4 according to another embodiment of this application is shown. Figure 12 A cross-sectional view of an inlay design with a pre-cut window 6 according to this application is shown. Figure 13 Another embodiment according to this application is shown. Figure 12 The inlay design includes pre-cut windows or gaps where insert 3 filler is placed. Figure 14 A top view is shown of the interaction region between the entrance 3 and the opaque layer in the inlay design according to this application. Figure 15 The composition of an inlay design according to another embodiment of this application is shown. Figure 16 It shows Figure 15 The detailed components of the inlay design, and Figure 17 A cross-section of an inlay design including a layer above a top opaque layer, according to another embodiment of this application, is shown.

[0087] This disclosure is illustrated by way of example and is not limited to the accompanying drawings, in which the same reference numerals indicate similar elements. Embodiments of this application will now be described with reference to the accompanying drawings.

[0088] This application describes a product design and process for creating a transparent window 6 feature with a better appearance and integrating it into an inlay 7. This feature will then be used to display a security element embedded in a chip card 8, which is manufactured together with the inlay 7 according to this application. Detailed Implementation

[0089] The inlay 7 with transparent window 6 includes insert 3 and a multilayer substrate such as PC. The core layer 1 or more core layers 1 are transparent, in which copper wire antennas and chip 11 modules are embedded and covered on the top and bottom by white or opaque cover layer 9 or cover layer 10.

[0090] This application utilizes an opaque overlay 9 to create the surface of a white planar inlay 7, which also obscures the visibility of the overlay-embedded antenna and the chip 11 module. In the case of pre-perforated windows 6 in specific areas on both sides of the opaque overlay 9, it creates a see-through feature on the inlay 7. Inserts 3 are used to fill gaps, maintaining control over the shape and size of the windows 6 to keep them within defined dimensions.

[0091] This application addresses the following matters: 1. How to create a transparent window with feature 6 at inlay 7? 2. How to control the shrinking of transparent window 6.

[0092] The transparent window 6 of this application is built into the chip card 8 during the production of the card 8. This process is straightforward. One way to achieve this is to integrate it into the inlay 7 before using these inlays to make the card 8. This feature can be developed and incorporated into the inlay 7.

[0093] Basically, a transparent window 6 can be easily created by having a pre-perforated window 6 on an opaque overlay layer 9. However, using this current method, it is always difficult to maintain control over the shrinkage of the window 6 after lamination, so the size and shape of the window 6 will change and no longer conform to the defined dimensions.

[0094] Therefore, this application not only aims to provide an inlay 7 solution with the feature of a transparent window 6, but also to combine enhanced and industrialized methods to better keep the window 6 within a defined shape and size by using the insert 3 to fill the gap.

[0095] The insert 3 will act as a brick to prevent the core layer 1 and the cover layer 10 from flowing freely and uncontrollably into the gap during melting, thereby causing deformation of the transparent window 6.

[0096] Figure 1A cross-sectional view of the multilayer assembly 7 (insert 60) used in the lamination process is shown, specifically without the insert 3. This assembly comprises two white / opaque layers 2 (also referred to as the first cover layer 2 and the second cover layer 2) encapsulating a central transparent core layer 1. Integrated within the white / opaque layers 2 are two transparent windows 6, as indicated by arrows, which are crucial for the assembly process excluding the insert 3. The depicted construction ensures lamination integrity and the clarity of the transparent windows 6 throughout the process.

[0097] The multilayer inlay 60 specifies that the first cover layer and the second cover layer 2, 10 each have at least one prefabricated window 6. Although Figure 1 Insert 3 is not explicitly shown, but it demonstrates the potential to accommodate such insert to prevent deformation during lamination, consistent with the detailed steps in method 100 for assembling insert 7.

[0098] As described in claim 60 of the multilayer inlay, electronic modules such as antenna 5 and / or chip module 4 are intended to be configured within the core layer 1. Although these modules are... Figure 1 While not explicitly visible, the placement and visibility of these elements are indicated by transparent windows 6, which enhances aesthetic appeal, provides visual verification of the presence and integrity of the electronic modules, and serves as a security feature by incorporating specific visible patterns.

[0099] Additionally, the method 500 for manufacturing chip cards 8 from the insert sheet 16 involves providing a sheet containing pre-arranged assembled inserts 7, 60 and using a stamping mechanism to cut individual chip cards 8. Although Figure 1 The stamping process is not specifically shown, but the arrangement and layer composition serve as a base structure potentially suitable for further processing into defined card areas, aligned with the dimensions and shape of the finished chip card 8 specified in method 500.

[0100] Figure 2 A cross-sectional view of the laminated structure after the lamination process is depicted. The structure comprises two white / opaque layers 2 (also identified as the first and second capping layers 2, 10) surrounding a central transparent core layer 1. It is noteworthy that... Figure 2 The transparent window 6, retained after lamination, illustrates the lamination process without the insert 3. This structure exemplifies a clear visual path through the transparent window 6, which is crucial for the aesthetic and verification purposes outlined in the claims.

[0101] According to claim 60 of the multilayer inlay, this component configuration having a first cover layer and a second cover layer 2, 10, each having at least one prefabricated window 6, is ideal for enhancing the aesthetic appearance of the inlay, providing visual verification of the embedded electronic module, and incorporating specific visible security features. These claims emphasize the importance of the transparency and clarity of the laminated window 6, which in... Figure 2 It is appropriately indicated that this is true even in the absence of the insert 3, which is typically used to prevent window distortion. The multilayer inlay 60 specifies that the first cover layer and the second cover layer 2, 10 should each have at least one prefabricated window 6. Figure 2 The structure shown has a transparent window 6 that remains well after lamination, consistent with the requirements of the claims, including the absence of inserts 3, which are typically used to prevent deformation of the window 6 during lamination.

[0102] The visibility of potential electronic modules (such as antenna traces or wires configured within the core layer 1) visible through the transparent window 6 is directly related to the claims. These features enhance the aesthetic appearance of the device, provide visual verification of the presence and integrity of the electronic modules, and serve as security features through specific visible patterns that are difficult to replicate.

[0103] Method 100 for assembling inlays 7, 60 describes a process involving providing cover layers 2, 10 with prefabricated windows 6 and placing a core layer 1 between these layers, the core layer 1 being configured to accommodate electronic components 4, 5. Although Figure 2 While no electronic components are directly depicted, the layer setup instructions can support the configuration of such components in accordance with the functional requirements for accommodating and visually verifying them.

[0104] In addition, this arrangement supports the multi-layer inlay 60 frame by potentially enhancing the visual and functional properties of the inlay, making it not only a component of the finished product, but also an integral part of its manufacturing process as outlined in method 100.

[0105] Figure 2 The illustrations, serving as diagrams of how to effectively implement the described multilayer components according to the prescribed claims, demonstrate the post-lamination integrity of the transparent window 6 and its potential role in the aesthetics and functionality of the final product. Figure 2 The structures depicted illustrate the basic properties of the multilayer inlays 60 and 7 as described in claims, demonstrating how the lamination process preserves the key features required for functional and aesthetic purposes in the final product.

[0106] Figure 3 It provides clear front and rear perspective views of the lamination process within a multi-layered structure, for example... Figure 1 and Figure 2As shown, the transition of the transparent window 6 within the white / opaque layer 2 is emphasized. This illustration is crucial in demonstrating how the lamination process cleverly maintains the structural and aesthetic integrity required for advanced safety features, as well as compliance with precise manufacturing specifications.

[0107] In the depicted lamination process, a series of prefabricated windows 6 are encapsulated by a white / opaque layer 2, designated as both the first and second cover layers 2, 10. Method 100 ensures that these windows 6 are designed with specific dimensions (a minimum of 5.0 × 5.0 mm with a 10% tolerance) and corner radii (greater than 0.2 mm), which are crucial for reducing stress concentration and enhancing the structural integrity of the inlay. This strategic design is essential not only for maintaining physical dimensions during lamination but also for ensuring that the inlay meets stringent safety and durability standards. These windows are also designed to feature lines or bars with a width greater than 2.0 mm to ensure that any embedded security features remain visible and durable after lamination, a factor enhancing the practicality and safety of the multilayer inlay 60.

[0108] also, Figure 3 The purpose of the construction and method 200 is seamless alignment. Method 200 involves using an advanced pick-and-place machine to precisely position the inserts 3 within these prefabricated windows 6, followed by a micro-jointing technique to securely engage the inserts without damaging the surrounding material. Figure 3 The integrity of window 6 after mid-lamination indicates that the lamination process itself supports the structural prerequisites required for the subsequent embedding of safety features, which are visually verifiable and difficult to replicate, thereby enhancing the aesthetic appeal and safety functionality of the final product.

[0109] Figure 3 This comprehensive demonstration not only highlights the technical capability to maintain key manufacturing standards, but also illustrates the overall role of lamination in ensuring the functionality and compliance of the multilayer inlay 60 with the security features specified in the patent claims.

[0110] Figure 4 A cross-sectional view of the laminated multilayer structure 7 is shown, illustrating a comparison between portions with and without inserts 3 during the lamination process. This figure provides an insightful visual representation of the structural variations and the impact of the inserts on the integrity and function of the layered assembly.

[0111] The structure comprises a sandwich construction, in which a white / opaque layer 2 serves as both a first and second cover layer, encapsulating a transparent core layer 1. The figure shows two distinct areas: one where the insert 3 is included within the prefabricated window 6, and another where the window 6 is without the insert, highlighting the role of the insert in maintaining the integrity of the window during lamination. This side-by-side comparison in the same figure emphasizes the effectiveness of the insert 3 in preventing deformation of the window 6, a key aspect of maintaining the aesthetic and functional quality of the multilayer inlay.

[0112] As shown in the upper part of the figure, the integration of the insert 3 is consistent with claim 50 of the multilayer inlay, wherein the insert is arranged within the prefabricated window 6 of both the first and second cover layers 2, 10 to enhance security features, visual effects, and electronic functionality. These inserts 3, which may include optically variable materials (OVM), are crucial to ensuring that each layer, especially the transparent core layer 1, adheres to its intended design purpose without succumbing to deformations that could impair the visibility and effectiveness of embedded security elements (e.g., antenna traces or electronic wires).

[0113] Furthermore, this detailed arrangement supports the visibility requirements of the multilayer inlay 60 for internal components (such as antenna 5 or chip module 4) through window 6. This visibility is not only crucial for verifying the presence and integrity of electronic modules, but also for enhancing the security and aesthetic appeal of the inlay, thereby utilizing a specific visible pattern that is difficult to replicate. Figure 4 The comparisons shown vividly illustrate how the presence or absence of inserts 3 affects these critical aspects, validating the design considerations emphasized in method 100 for assembling inserts 7, 60. This method includes detailed steps for arranging these inserts 3 to prevent deformation of windows 6 during the lamination process, ensure proper placement of each layer, and maintain the alignment and integrity of the materials, despite their differing properties.

[0114] essentially, Figure 4 This diagram serves as a comprehensive demonstration of lamination techniques and material arrangements essential for achieving the high standards required to realize functional, safe, and visually appealing multilayer inlays. It provides a clear illustration of the technological vision involved in designing and implementing structures that meet stringent safety and functional specifications. Therefore, the diagram encapsulates the complex interplay between material properties, design precision, and functional requirements in advanced safety inlay manufacturing.

[0115] Figure 5The figure shows a multilayer inlay 7, in which advanced lamination techniques and material integration are used to construct a safe and operable structure. The figure illustrates how the inlay combines several key elements from the claims to form a durable and safe product. The inlay 7 includes a core layer 1 located between two white / opaque layers 2, each white / opaque layer 2 containing a prefabricated window 6 designed to accommodate an insert 3.

[0116] The assembly begins by providing prefabricated windows 6 for the first cover layer 2, as specified in the claims. These windows are carefully fabricated to precise dimensions to ensure they can accommodate inserts 3 to prevent any deformation during lamination. A core layer 1 is then placed on the first cover layer, wherein the core layer is designed to integrate a chip module 4 and an embedded antenna 5, thereby enhancing the functionality of the inlay.

[0117] According to the claim, the insert 3 is placed within the window 6 of both the first and second cover layers 2 and 10, achieving a strong bond without misalignment using techniques such as ultrasonic welding. This step ensures that the insert maintains its position and structural integrity throughout the lamination process. The second cover layer 2 is similarly positioned and arranged on top of the core layer 1, containing the additional insert 3 within its window 6. These layers and the insert 3 are then subjected to the lamination process under specific thermal and pressure conditions, ensuring thermal bonding between the layers without compromising material integrity.

[0118] This lamination involves applying heat to melt the material and then actively cooling it under pressure, as specified in the claims. This cooling stabilizes the joined structure, solidifying the molten components into a single, integrated insert. The claims also describe a transition region between the insert and the cover layer, in which the materials interweave during the heating process, allowing molten material from both the insert and the cover layer to permeate each other and mechanically lock in place after hardening, thereby achieving a bond without additional adhesives.

[0119] The entire process was designed to adhere to stringent standards, ensuring that each prefabricated window in the overlay meets specific dimensional requirements with precise tolerances for safety features. The design also enhances the structural integrity of the inlay by implementing windows with rounded corners to reduce stress concentration.

[0120] Furthermore, the inlay is constructed to include optically variable materials within the insert 3 and possibly the core layer 1, thereby providing visually striking and difficult-to-replicate unique security features. These features, along with embedded electronic components such as the chip module 4 and the antenna 5, are strategically integrated to provide enhanced security and functionality, ensuring that the inlay 7 meets the specific requirements of high-security applications in cards and documents.

[0121] Figure 5A sophisticated method for designing the multilayer inlay 7 is illustrated, which makes full use of advanced materials and manufacturing technologies to meet the detailed safety and operational specifications set forth in the patent claims.

[0122] Figure 6 An illustration of an inlay structure 7 is provided, designed for high security and functionality within cards or identification documents, utilizing a layered composition including advanced electronic components. The inlay 7 comprises multiple layers, each playing a critical role in the protection and operational integrity of the embedded electronics.

[0123] The core of this inlay is characterized by a transparent core layer 1, centrally positioned between two white / opaque layers 2. These layers are essential for providing structural support and concealing internal components from unauthorized observation, thus enhancing security. The transparency of the core layer 1 is critical because it houses complex electronic components, including a chip module 4 and possibly an antenna 5, allowing these components to be seen and verified through a pre-fabricated window 6 cut into the overlay layer.

[0124] These windows 6 are the focal point of the design, strategically positioned to align with the electronic components below. They not only allow for visual verification of the presence and integrity of the components but also serve as an aesthetic enhancement to the card design. By allowing certain portions of the antenna 5 or chip module 4 to be visible, these windows can contain specific visible patterns or configurations that make the design difficult to replicate without appropriate manufacturing capabilities.

[0125] The placement of inserts 3 within these windows 6 further stabilizes the structure. These inserts 3 are designed to prevent the windows from deforming during lamination, thus ensuring visibility and aesthetic appeal even under physical stress. The use of materials such as polycarbonate (PC), polyvinyl chloride (PVC), or polyethylene terephthalate modified (PETG) in the core 1 and cover layers 2, 10 provides a durable and robust structure capable of supporting high-quality safety features.

[0126] The lamination process itself is finely tuned, involving precise application of heat and pressure to seamlessly bond the layers without the need for additional adhesives. This method not only secures the internal components but also activates optically variable materials within the insert, thereby enhancing the inlay's security features, which possess properties such as color shift or holographic patterns.

[0127] Furthermore, the inlay is constructed according to stringent specifications to ensure perfect alignment of each component. Prefabricated windows have minimum size requirements and specially designed corner radii to reduce stress concentration, which helps maintain the structural integrity of the inlay under stress. The dimensions and shapes of these windows are manufactured to meet safety standards while also allowing for the durability and visibility of the embedded features.

[0128] Figure 6This design showcases a highly secure multilayer inlay 7 that is not only functional and robust, but also aesthetically pleasing and difficult to counterfeit. It represents an advanced approach combining modern security needs with hybrid technologies and materials science to protect and verify sensitive electronic components in a secure and visually verifiable manner.

[0129] Figure 7 The figure illustrates a stage in the assembly of the multilayer inlay 7, demonstrating the integration of technology and materials science to enhance the security and functionality of the laminated device. The figure shows the inlay 7 just before the final lamination process, where the insert 3 is strategically positioned within a prefabricated window 6 on both the first and second white / opaque overlay layers 2.

[0130] The method involves the precise placement of inserts 3, beginning with the provision of a first cover layer and a second cover layer 2, each equipped with a prefabricated window 6 of precise dimensions. These inserts 3 are made of an optically variable material and are designed to fit snugly within these windows 6, helping to maintain the intended visual and security characteristics of the inlay 7. A core layer 1 sandwiched between these cover layers is designed to be transparent, contributing to both the aesthetic and functional aspects of the inlay by allowing visibility of the embedded security features while also providing a substrate for additional components.

[0131] The placement of inserts 3 involves a series of detailed techniques to ensure proper alignment and engagement without the use of additional adhesives. Ultrasonic welding is employed to securely bond the inserts to the cover layer, a method consistent with the claims for enhancing the structural integrity and alignment of the insert components. This process not only ensures mechanical locking but also involves thermal bonding techniques, where the materials of the inserts and the cover layer interweave when heated. This interaction causes molten material from both components to penetrate each other, subsequently hardening to form a strong mechanical bond.

[0132] The prefabricated windows 6 in the cover layer 2 are carefully designed with corners having a minimum radius greater than 0.2 mm to reduce stress concentration, and each window is ensured to meet a specified size of at least 5.0 × 5.0 mm with a 10% tolerance. These specifications are crucial for maintaining the integrity and safety standards of the inlay. Furthermore, any lines or bars within the windows are designed to be wider than 2.0 mm to ensure the durability and clear visibility of the embedded features.

[0133] After the insert is aligned and placed, the inlay undergoes a critical lamination process. This process is carried out for a specified duration under controlled heating conditions at approximately 175°C to achieve optimal adhesion while preserving the material properties of the layers involved. Immediately following the heating phase, active cooling under pressure is performed to stabilize the newly formed bond and ensure the inlay's stability and readiness for subsequent integration into higher-level assembly processes, such as embedding in cards or identification documents.

[0134] Figure 7 Each layer and insert 3 is selected not only for their functional contribution but also for their compatibility and performance under the described conditions, thereby ensuring that the final product not only meets but exceeds the stringent requirements set forth in the relevant claims. The combination of high-opacity materials, optically variable materials, and precise manufacturing and bonding techniques exemplifies a sophisticated approach to creating secure, durable, and functional inlays suitable for a wide range of high-security applications.

[0135] Figure 8 This illustration shows an intermediate stage in assembling a highly secure multilayer inlay 7, where strategic material and process choices ensure both functionality and security. Specifically, the figure shows an assembly with first and second highly opaque overlays 2 having an embedded transparent core layer 1, clamping an insert 3 within a prefabricated window 6. This illustration highlights a nuanced approach to enhancing security features while maintaining the structural integrity required for high-performance applications.

[0136] Assembly begins with the provision of two highly opaque overlays 2, each featuring prefabricated windows 6 designed to meet specific dimensional and tolerance requirements. These windows are fabricated with a minimum dimension of 5.0 × 5.0 mm and a tolerance of 10%, ensuring they can accommodate the designed inserts 3 without compromising the overlay structure. The corners of these windows are designed with a minimum radius greater than 0.2 mm to reduce stress concentration, thereby enhancing the durability and lifespan of the inlay.

[0137] Inserts 3, composed of optically variable materials (OVM), are precisely positioned within these windows. OVM was chosen not only for its safe characteristics of providing color shift or UV fluorescence, but also for its compatibility with the lamination process. These materials are capable of undergoing a thermal bonding process, where they are bonded to the capping layer 2 without the need for additional adhesives. This is achieved through a controlled heating process, in which the inserts and capping materials interweave at the molecular level, creating mechanical locking as they cool and cure, thus ensuring a strong and permanent bond.

[0138] The core layer 1 sandwiched between the cover layers 2 is transparent, enhancing the visibility of the inlay's internal components, including any embedded electronic modules such as chip module 4 or antenna 5. This transparency is crucial not only for aesthetic reasons but also for functional checks and security verification.

[0139] Careful control of the lamination process itself, including applying heat of approximately 175°C for a precise duration, is crucial for achieving optimal adhesion without degrading the material. Following the application of heat, an active cooling process is initiated under pressure to rapidly stabilize the assembled structure. This rapid cooling helps lock the configuration in place and prevents any warping or misalignment that could compromise the inlay's function.

[0140] In addition, ultrasonic welding technology is used to ensure that the insert 3 remains perfectly aligned within its designated window 6 during the lamination process. This method helps maintain the precise positioning of the insert, which is crucial for the performance and durability of the inlay.

[0141] Then, leveraging its enhanced structural integrity, security features, and electronic compatibility, this multilayer inlay 7 is fabricated for further integration into secure credentials or chip cards. The entire assembly process emphasizes the integration of advanced materials and sophisticated manufacturing techniques to produce secure, functional, and reliable products suitable for a wide range of demanding applications.

[0142] Figure 9 A detailed view of the multilayer inlay 7 is shown, illustrating an advanced component designed for both security and functionality. The illustration features a transparent core layer 1 flanked by two highly opaque overlay layers 2, within which optically variable material (OVM) inserts 3 are embedded within prefabricated windows 6. This structure is suitable for optimal integration of electronic components while ensuring high security standards through material selection and assembly techniques.

[0143] The assembly process of inlay 7 begins with the provision of first and second highly opaque overlays 2, each overlay having precisely sized prefabricated windows 6. These windows 6 are designed to meet stringent dimensional tolerances, with dimensions of at least 5.0 × 5.0 mm and a tolerance of 10%, including fillets greater than 0.2 mm to reduce stress concentration. This strategic design of the windows plays a crucial role in maintaining the structural integrity of the inlay while facilitating the integration of security-enhancing features.

[0144] Within these windows 6, inserts 3, made of an optically variable material, are precisely positioned. This material was chosen because of its unique properties, such as color shift or UV fluorescence, which are crucial for safety applications. By having a minimum thickness of 30 μm, preferably 50 μm, consistent with the opacity requirements of the overlays 2 and 10, inserts 3 also contribute to the overall durability and visual consistency of the inlay 7.

[0145] The core layer 1 sandwiched between cover layers 2 and 10 is transparent, allowing for visual inspection and functional verification of embedded electronic components such as the contactless chip module 4 or the embedded antenna 5. Transparency is essential not only for aesthetic purposes but also for functional checks and safety verification.

[0146] The integration of these layers involves a complex lamination process in which heat—typically around 175°C for about 15 minutes—is applied to effectively fuse the layers without compromising their individual and collective integrity. This thermal bonding is reinforced by a controlled cooling process under pressure, ensuring that the assembled structure stabilizes rapidly to prevent any misalignment or warping.

[0147] Furthermore, the assembly technique includes the innovative use of ultrasonic welding to secure the insert 3 within its designated window 6. This method ensures that the insert remains perfectly aligned and engages with the cover layer, thereby maintaining the precision and alignment crucial to the performance and safety features of the inlay.

[0148] In the transition between insert 3 and cover layers 2 and 10, a thermal bonding technique is employed, in which the materials of insert 3 and cover layers interweave at the molecular level. This method eliminates the need for additional adhesives by allowing the materials themselves to melt, merge, and then mechanically lock together as they solidify, forming a durable and strong bond that enhances the integrity of the inlay.

[0149] Figure 9 This detailed view encapsulates a method for constructing multilayered inlays that balance functionality, safety, and structural integrity. It demonstrates the application of advanced materials and technologies in creating products that accommodate complex electronic components within robust and reliable structures while meeting stringent safety standards.

[0150] Figure 10 An advanced multilayer inlay 7 is depicted, highlighting the strategic integration of security features through the use of optically variable material (OVM) layers and precision-engineered components. This embodiment includes a central OVM core layer 1 located between two highly opaque layers 2, with a specially designed insert 3 situated within a prefabricated window 6.

[0151] The construction process begins with providing first and second highly opaque overlay layers 2. These layers are crucial for ensuring the concealment of the underlying safety components while also providing structural support. Each layer 2, 10 includes prefabricated windows 6, designed to be precisely sized to facilitate the integration of inserts 3 without distorting their shape during the lamination process. The windows 6 meet stringent specifications, with a minimum size of 5.0 × 5.0 mm and a tolerance of 10%, and the corners are designed with a radius greater than 0.2 mm to reduce stress concentration and enhance durability.

[0152] A core layer 1, made of an optically variable material, is located inside the inlay 7. This material was chosen because of its dynamic visual effects, including color shift and UV fluorescence, which significantly enhance the security and aesthetic appeal of the inlay 7. The transparency of this layer not only contributes to the visual appeal but also functions by allowing visual verification of the integrated security features.

[0153] Using precise alignment techniques, the inserts 3 are positioned within the window 6 and can be secured in place using ultrasonic welding. This ensures that the inserts 3 are perfectly aligned within the highly opaque overlay 2, thus maintaining the integrity and alignment of the inlay. The use of optically variable materials in the inserts adds another layer of security, providing a unique visual identifier that is difficult to replicate.

[0154] A key aspect of the component is the thermal bonding technique applied in the transition region between the insert 3 and the cover layer 2. This process involves melting the contact points between the insert and the layer, allowing the materials to interweave and mechanically lock together as they solidify. This method ensures a strong, adhesive-free bond that enhances the structural integrity of the inlay.

[0155] The entire assembly undergoes a controlled lamination process, in which heat and pressure are precisely applied to effectively bond the layers. This process is fine-tuned to maintain adhesion at approximately 175°C for 15 minutes, ensuring the bonding enhances the durability of the inlay without compromising material quality. Following lamination, an active cooling process is initiated to rapidly stabilize the newly formed structure and prevent any thermal deformation that could affect the inlay's functionality.

[0156] Figure 10 The depiction reflects the complex synthesis of materials and technologies designed to create highly secure inlays that are robust, visually distinguishable, and capable of integrating advanced electronic components such as chip modules and antennas. The multi-layered structure not only meets high security and functional standards but also adheres to stringent manufacturing specifications to ensure consistency and quality in mass production.

[0157] Figure 11 A complex inlay 7 is shown, designed to incorporate advanced security features through strategic material selection and integration techniques. This embodiment illustrates a multi-layered structure including top and bottom highly opaque layers 2 that enclose the chip module 4 and embedded antenna 5 within a core layer, described in detail by the presence of an optically variable material (OVM) that enhances security properties.

[0158] In this detailed illustration, the process begins with the provision of two highly opaque layers 2, each integrated with a prefabricated window 6. These windows are manufactured to precise specifications, each ensuring a minimum size of 5.0 x 5.0 mm with a tolerance of 10%, and are designed with rounded corners to enhance structural integrity and reduce stress concentration. The windows accommodate inserts 3, which are configured to remain undeformed during lamination, thus maintaining their precise alignment and function.

[0159] At the heart of the inlay's functionality is core layer 1, which houses chip module 4 and embedded antenna 5, showcasing advanced integration of electronic components within a secure framework. The positioning of chip module 4 and antenna 5 is crucial, not only for the inlay's operational effectiveness but also for maintaining its security integrity. Antenna 5 is intricately embedded, potentially using techniques such as wire embedding to ensure seamless connectivity and performance.

[0160] The insert 3, joined to this setup, is not only a filler material but also composed of an optically variable material. These materials were chosen because they exhibit unique visual effects, such as color shift and UV fluorescence, thereby enhancing the inlay's security level. The integration of this material requires precise temperature and pressure conditions during lamination to prevent degradation of optical properties and ensure perfect adhesion without the use of additional adhesive materials.

[0161] The lamination process itself is carefully controlled, with heat applied at approximately 175°C for about 15 minutes. This ensures optimal adhesion of the layers while maintaining the integrity and function of the embedded and surrounding materials. Following the application of heat, an active cooling process under pressure is implemented to rapidly stabilize the bonded structure, ensuring that the layers cure into cohesive units without any thermal deformation.

[0162] Furthermore, the assembly process can involve techniques such as ultrasonic welding to securely bond the insert 3 within the prefabricated window 6. This method is particularly beneficial for maintaining the alignment and positioning of the insert, which is crucial for the performance and durability of the inlay. Additionally, the transition region between the insert and the cover layer can undergo a molecular-level interweaving process, where the materials are heated and allowed to mix and mechanically lock together, resulting in a robust bond without the need for external adhesives.

[0163] The detailed construction of Inlay 7 not only meets high security and functional standards but also adheres to stringent manufacturing specifications to ensure consistency and quality in mass production. The comprehensive integration of advanced materials and sophisticated assembly techniques highlights the Inlay's ability to effectively serve high-security applications, providing a reliable and tamper-proof solution in the form of an advanced multilayer inlay system.

[0164] Figure 12 The illustration shows an inlay structure 7, meticulously designed to combine functionality with high security, employing a layered composition optimized for embedding electronic components within a secure environment. The illustration focuses on a multi-layered configuration fundamental to ensuring the physical integrity and operational efficiency of the embedded system.

[0165] At the core of the inlay, a transparent core layer 1 is sandwiched between two white / opaque layers 2. This central transparent layer is crucial because it houses the embedded electronic components and allows selective viewing of these components through strategically placed pre-cut windows 6. These windows 6 are not only functional but also designed to enhance the aesthetic value of the card or document while providing visual inspection of the integrity and presence of the electronic components housed within.

[0166] The white / opaque layers 2 located on the sides of the transparent core 1 serve multiple purposes. Primarily, they act as a protective barrier, shielding electronic components from external environmental factors and unauthorized scanning attempts, thereby enhancing the card's security level. Additionally, these layers contribute to the overall aesthetics by providing a clean and uniform background that can be customized as needed through printing or design.

[0167] The pre-cut windows 6 in these overlays 2, 10 are precisely designed to be perfectly aligned with the components beneath them, such as antenna traces or chip modules. This alignment is crucial not only for functional visibility but also for security. By allowing certain elements of the electronic components to be visible, the windows serve as security features, presenting a unique pattern that is difficult to replicate without specific manufacturing capabilities. This visibility method can also be used to directly verify the authenticity of the card.

[0168] The design and assembly of the inlay 7 followed stringent specifications to ensure durability and compliance with safety standards. The window 6 was designed with specific minimum dimensions and corner radii to reduce potential stress points that could lead to structural weaknesses. Furthermore, the width of lines or bars in the window design was carefully considered to balance visibility with durability, ensuring the embedded features are robust enough to withstand normal use without deterioration.

[0169] Figure 12 This paper demonstrates a sophisticated approach to designing secure inlays for modern cards and identification documents, integrating advanced materials technology and precise engineering to create secure and visually appealing products. This inlay structure utilizes the strength and transparency of its materials to effectively protect and display critical electronic components, making it ideal for high-security applications.

[0170] Figure 13 An advanced multilayer inlay 7 is depicted, designed to provide a robust and secure structure for high-security applications such as identity documents and smart cards. This embodiment focuses on a core layer 1 sandwiched between two highly opaque layers 2, 10, which is crucial for maintaining the confidentiality of internal components. The core layer 1, which may be made of materials such as polycarbonate (PC), polyvinyl chloride (PVC), or polyethylene terephthalate modified (PETG), is further characterized by a transparent window 6 that accommodates an insert 3 made of an optically variable material, thereby providing additional security features through visual effects such as color shift or UV fluorescence.

[0171] The construction of the inlay 7 begins with providing a first highly opaque overlay 2 equipped with prefabricated windows 6. These windows are carefully designed to precise dimensions (5.0 x 5.0 mm, tolerance ±10%) with corners having a minimum radius greater than 0.2 mm to reduce stress concentration and enhance durability. Advanced techniques (e.g., pick-and-place followed by micro-joining) are then used to precisely position the first insert 3 within these windows 6, ensuring that each insert is securely engaged without damaging the surrounding material.

[0172] After placing the first cover layers 2, 10, the core layer 1 is carefully aligned on top of them. This layer not only provides structural integrity but also houses various security components, which may include chip modules or embedded antennas, integrated using sophisticated techniques such as wire embedding, printing, or etching to ensure seamless functionality.

[0173] Then, a second highly opaque overlay layer 2, 10, which is identical to the first highly opaque overlay layer and also has the features of the prefabricated window 6, is positioned on the core layer 1. A second set of inserts 3, identical to the first set of inserts and made of the same optically variable material, is aligned and secured within these windows. This mirrored arrangement enhances the integrity and security features of the inlay.

[0174] The entire assembly undergoes a controlled lamination process in which heat (approximately 175°C for 15 minutes) and pressure are applied. This process not only ensures that all layers bond together as a single cohesive unit but also activates their properties without compromising the integrity of the optically variable material. Following lamination, an active cooling process under pressure is employed to stabilize the bonded structure, thereby ensuring that the layers cure without any thermal deformation.

[0175] During the lamination process, special attention is paid to the transition area between the insert 3 and the cover layer 2. Here, a thermal bonding technique is applied, in which the materials of the insert and the cover layer are interwoven at the molecular level. This is achieved by heating the two parts until they slightly melt, allowing their molten materials to mix, and then mechanically locking them together as they cool, forming a strong, adhesive-free bond.

[0176] Finally, the entire inlay assembly is manufactured within a larger inlay sheet 16, from which individual inlays 7 can be extracted using precise cutting techniques. This allows for the mass production of security inlays 7, with each inlay 7 maintaining high quality and consistency.

[0177] Figure 13 The detailed description not only illustrates the technical aspects of assembling the safety inlay, but also highlights the integration of multiple safety layers and advanced materials, all designed to enhance the functionality and safety of the final product.

[0178] Figure 14Presented is a complex view of the transition region 20 in inlay 7, showcasing a high level of technological innovation in material integration and bonding methods. The figure focuses on the highly specialized aspects of inlay construction, where materials undergo fusion without the use of adhesives, instead relying on their inherent properties to form a robust integrated structure.

[0179] In this detailed illustration, transition region 20 is shown as the area where the material of insert 3 intersects with the material of cover layer 2. Both insert 3 and cover layer 2 incorporate advanced optically variable materials that provide security features through unique visual effects, such as color shifts or patterns visible only under specific lighting conditions. These materials not only enhance security but also contribute to the mechanical and visual integrity of the final product.

[0180] The construction process begins with the alignment of the insert 3 within the prefabricated window 6 located in the first cover layer 2. This is a critical step as it ensures that the insert 3 is precisely positioned to maintain the aesthetic and functional aspects of the inlay 7 design. Following this, a core layer 1, which may comprise materials such as PC, PVC, or PETG, is placed across the first and second cover layers 2, thereby encapsulating the insert 3. The second cover layer 2 is then aligned onto the core layer 1, creating a sandwich structure that surrounds the insert 3.

[0181] A notable feature of this structure is the use of ultrasonic welding, a technique chosen for securely joining the insert 3 within the window 6 of both the first and second cover layers 2. This method is particularly advantageous because it provides a strong bond that maintains the alignment and positioning of the insert 3 without the need for additional adhesives, thereby preserving the clarity and function of the optically variable material within the insert.

[0182] The entire assembly undergoes a lamination process in which heat is applied (approximately 175°C for 15 minutes). This heat is sufficient not only to bond the layers together but also to activate the properties of the optically variable material within insert 3, ensuring seamless fusion with cover layer 2. Lamination is immediately followed by an active cooling process under pressure, which is crucial for stabilizing the bonded structure and ensuring it cures without warping or thermal deformation.

[0183] The figure also highlights the importance of precise materials engineering, particularly in the way the transition region 20 is designed. Here, the materials of the insert 3 and the cover layer 2 interweave at the molecular level when heated, allowing them to slightly melt and mix upon cooling before mechanical locking. This interweaving is crucial because it forms a mechanical bond that significantly enhances the durability and security of the inlay without the need for external adhesives.

[0184] In addition, the size and shape of windows 6 were carefully designed to ensure they meet safety specifications, with each window having a minimum size and corner radius to reduce stress concentration, thereby enhancing the structural integrity of the inlay.

[0185] Figure 15 A complex cross-sectional view of inlay 7 is shown, highlighting the layering and integration of various components crucial to ensuring the functionality and security of inlay 7. The figure emphasizes the advanced construction methods applied in creating the multi-layered inlay 7, which includes an embedded chip module 4 and an antenna 5, strategically encapsulated within several layers providing security and structural integrity.

[0186] The core of inlay 7 includes a transparent core layer 1, which is selected based on its properties and may include materials such as polycarbonate (PC), polyvinyl chloride (PVC), or polyethylene terephthalate modified (PETG). This layer is crucial because it supports electronic components, particularly the contactless chip module 4 and the embedded antenna 5, which are integrated using techniques such as wire embedding, printing, or etching, which are not visible in the figures but are implied by their functional necessity.

[0187] Including the core layer 1 are multiple white / opaque layers 2 serving as the first and second cover layers 2, 10. These layers are designed to shield the underlying components, thereby enhancing the security of the chip 4 and the antenna 5. Specified materials used for these layers may also include PC, PVC, or PETG films, known for their durability and effectiveness in protecting electronic devices from environmental factors and unauthorized tampering.

[0188] Embedded within these layers are strategically placed inserts 3, which are depicted at the locations of prefabricated windows 6. These inserts 3 are made of an optically variable material that not only enhances the structure but also provides unique visual security features, such as color shifts or holographic patterns, which increase the inlay's authentication capabilities.

[0189] The assembly process begins with placing the first insert 3 within the window 6 of the first cover layer 2, then aligning the core layer 1, followed by receiving the second insert 3 within the second cover layer 2. The precise positioning of these inserts 3 is crucial for maintaining the overall alignment and integrity of the inlay structure. The window 6 is designed with specific dimensions and corner radii to minimize stress concentration and enhance the inlay's durability.

[0190] The entire structure is then subjected to a lamination process, in which heat and pressure are applied to achieve a seamless bond between the layers without the use of additional adhesives. This process involves detailed temperature control—approximately 175°C for 15 minutes—to ensure that the layers fuse properly and that the optically variable materials are activated without deterioration.

[0191] Following lamination, an active cooling process under pressure is implemented to stabilize the bonded structure. This step is crucial for ensuring thermal bonding curing, maintaining the precise placement of each layer and insert, and preserving the functional and safety features of the inlay.

[0192] In general, Figure 15 A detailed description of the construction of a highly secure multilayer inlay 7 is provided, which utilizes advanced materials and manufacturing techniques to produce a product that is not only safe but also robust and reliable. The integration of electronic components within a protective and visually verifiable structure demonstrates the technical complexity involved in modern security inlay design.

[0193] Figure 16 A complex multilayered inlay 7 is shown, designed with intricate layers and embedded electronic components, providing advanced security features and functional benefits for smart cards or secure credentials. The illustration demonstrates how various materials and configurations can be used to achieve durability and security integrity.

[0194] At the heart of this structure is a transparent core layer 1, essential for housing critical electronic components such as chip module 4 and embedded antenna 5. The transparency of this layer is crucial for the visibility of the embedded components, which are integrated with the security and verification features of the inlay 7. It allows for visual inspection of the antenna wires, ensuring their proper integration and functionality.

[0195] Surrounding the transparent core layer 1 are multiple white / opaque layers 2. These layers, located above and below the core layer, provide a protective barrier and enhance contrast, which helps the visibility of the internal components through the pre-cut window 6. These layers not only protect the fragile inner core but also contribute to the overall structural stability of the inlay.

[0196] In this configuration, the additional dedicated layer enhances the functionality and integrity of the inlay: The lower transparent core layer 13 is in direct contact with the lower side of the first cover layers 2 and 10, thereby providing a foundation for the core layer 1.

[0197] Above it, a transparent core layer 14 is placed, which may consist of one or more layers, increasing the thickness and visibility depth, and helping to protect and display the embedded antenna 5 and the chip module 4.

[0198] Add a height-adjustable transparent core layer 15 on top of the upper transparent core layer 14, and fine-tune the spacing and alignment of the topmost element with the rest of the assembly.

[0199] The inlay 7 includes pre-cut windows 6 placed within the first and second overlay layers 2, 10. These windows are crucial because they are designed to be perfectly aligned with the embedded antenna 5 below, ensuring visibility and enhancing security features by making the antenna wires easily visible. These windows serve not only functional purposes but also contribute to aesthetic and verification aspects by allowing visible access to the internal wiring, which can be designed with a specific pattern that is difficult to replicate.

[0200] Inserts 3 are precisely positioned within these pre-cut windows 6 to prevent any deformation during the lamination process. These inserts may be made of optically variable materials that provide a unique visual effect, thereby enhancing security against copying attempts. They ensure that the windows maintain their clarity and structural integrity, preventing any material flow that could obscure the view of the internal components.

[0201] The entire assembly undergoes a carefully controlled lamination process. This process is essential for bonding the layers and inserts together without displacement, thus maintaining the precise arrangement of each component. Lamination involves applying significant heat (approximately 175°C) to ensure full bonding of each layer while preserving material properties and alignment.

[0202] Figure 16 This design showcases a detailed and intentional approach aimed at enhancing security through visibility, structural integrity, and the use of advanced materials, making the inlay ideal for high-security applications in smart cards and secure credentials. Each component from the layers, inserts, windows, and electronic parts plays a crucial role in achieving the desired functional and security outcomes.

[0203] Figure 17 An advanced multilayer inlay 7 is shown, embodying a series of carefully arranged layers and components, highlighting the integration of technology and security within the compact structure typically employed in the manufacture of chip cards 8. This inlay is designed to achieve high security and functional integration through its layered design and strategic placement of electronic components.

[0204] Building upon this multi-layered structure is a transparent core layer 1, which plays a crucial role in housing key electronic components. This core layer allows for the integration of the chip module 4 and the embedded antenna 5, which is essential for the operational efficiency of the smart card. The transparency of this core layer 1 is critical because it ensures the visibility of these components, which is indispensable not only for functionality but also for security verification purposes.

[0205] Surrounding the transparent core layer 1 are multiple white / opaque layers 2, which serve a dual purpose. First, these layers 2 act as a protective barrier for the internal components. Second, they enhance visual contrast, making the internal components easily visible through strategically placed pre-fabricated windows 6. These windows 6 are essential for inspecting the integrity of the embedded components and also serve as a security feature by making the antenna wiring visible, thus providing a unique pattern that enhances the card's anti-copying security.

[0206] The design includes a lower transparent core layer 13 and an upper transparent core layer 14 surrounding the main core layer, enhancing the structural integrity and visibility of the embedded components. It also includes a height-adjustable transparent core layer 15, which finely adjusts the thickness and spacing within the inlay, ensuring precise alignment of the cover layer without interfering with the placement of electronic components.

[0207] Inserts 3 are placed within prefabricated windows 6 to maintain window clarity and prevent deformation of the cover layer 2 during the lamination process. These inserts potentially include optically variable materials, which not only prevent visual distortion but also contribute to the security of the inlay by being difficult to replicate.

[0208] The cover layer 10, shown as a first cover layer and a second cover layer, includes areas that retain a cleared opaque treatment to form windows 6. These windows 6 are aligned with the internal antenna 5, enabling the visibility of the antenna by confirming the presence and proper placement of the antenna and chip module, which serves as both an aesthetic feature and a security element.

[0209] Additionally, the design includes a printed layer 17 and a transparent layer 18 added to the outer surfaces of the first and second overlay layers 2, 10. These layers provide various functions, including providing additional security features, improving the durability of the inlay, and allowing for further customization of the card's appearance.

[0210] The entire assembly undergoes a lamination process, in which heat and pressure are precisely applied to firmly bond all layers and inserts. This process not only ensures the stability and lifespan of the inlay but also maintains the precise alignment of each component, which is crucial for the functionality and safety of the final product.

[0211] Figure 17 An inlay design is illustrated, which utilizes advanced materials and manufacturing techniques to create secure, functional, and visually verifiable components for high-security applications such as smart cards and secure ID documents. This design effectively integrates transparency, reflectivity, and multi-layering to prevent unauthorized copying and ensure operational integrity.

[0212] This further explains the behavior of the capping layer and core layer 1 during lamination as they melt and move, flowing into the gaps.

[0213] The appearance of the transparent window 6 after lamination is also shown.

[0214] This application intentionally focuses on how to overcome the problems of material shrinkage and deformation by using inserts 3, prepared according to the size and shape of the pre-stamped window 6 of the opaque cover layer 9, to fill the gap. These inserts will technically block or prevent the cover layer and the transparent core layer 1 from moving into the gap during lamination, thereby altering the shape and size of the window 6.

[0215] Insert 3 will prevent material from moving freely into the gap and helps keep the transparent window 6 in its defined shape and size.

[0216] The different flow behaviors of the substrate during lamination when melting are described in comparison between products with and without insert 3.

[0217] An embodiment of a method for creating an inlay 7 for cards or identification documents is also described. The method involves providing a core layer 1 with two sides, designed to hold electronic components. A first or upper cover layer with pre-formed windows 6 is placed on one upper side of the core layer 1, while a second cover layer with pre-formed windows 6 is placed on the other side. A first insert 3 is disposed within the window 6 of the first cover layer to prevent deformation during lamination. Electronic components are integrated into the core layer 1. In the transition region between the first insert 3 and the first cover layer, the materials of the insert 3 and the cover layer interweave to create a strong adhesive bond. This bond is achieved by applying heat, allowing the materials to melt, permeate each other, and mechanically lock together after hardening to form a tight fit.

[0218] The inlay structure 7 with transparent window 6 is shown, which consists of 5 main components.

[0219] Transparent core layer 1: - It can be any substrate, such as PC film, PVC film or PETG film.

[0220] - Single or multiple layers.

[0221] - Transparent color, which can be a standard film, laser and / or optically variable material.

[0222] - The thickness can vary, mainly depending on the thickness of chip module 4.

[0223] -A layer embedding antenna 12 and chip module 4.

[0224] White / Opacity Layer 2: - It can be any substrate, such as PC film, PVC film or PETG film.

[0225] - Single or multiple layers.

[0226] - "White / Opaque" means that it can be either white or opaque.

[0227] -Thickness is variable.

[0228] It can contain a layer with 6 transparent windows.

[0229] Insert 3 - It can be any substrate, such as PC film, PVC film or PETG film.

[0230] - Transparent color, which can be a standard film, laser and / or optically variable material.

[0231] Chip Module 4 Non-contact chip module 4.

[0232] - This can be a memory and / or a controller chip 11 for storing data.

[0233] - Communication with the reader is completed wirelessly via electromagnetic induction using radio frequency through the embedded antenna 5 connected to the chip module 4.

[0234] Embedded antenna 5 - Copper-based conductor.

[0235] - Integrate into core layer 1 using wire embedding.

[0236] - Use thermoforming to connect to chip module 4.

[0237] The terms “chip module 4”, “copper wire”, and “embedded antenna 5” are often used as references to electronic component parts, and product designs with transparent window 6 features can be applied using other chip 11 form factors and antenna 12 form factors, such as bare dies using flip chip 11 technology on a substrate, where antenna 12 is completed using different technologies and materials such as printing or etching.

[0238] How to create and implement a transparent window 6. An opaque overlay 10 will be prepared as a pre-cut window 6 with a defined size and shape that can be freely adapted.

[0239] A second cover layer having at least one pre-stamped window 6 is described as being placed on the second side or underside of the core layer 1. A second insert 3 is arranged within the lower window 6 of the second cover layer to prevent deformation during lamination. In the transition region between the second insert 3 and the second cover layer, materials are interwoven to produce an adhesive bond achieved by applying heat, allowing the materials to melt, penetrate into each other, and mechanically lock together after hardening.

[0240] The transparent core layer 1 can be single or multiple layers, and electronic components such as chip module 4 and antenna 12 are located therein. The transparent core layer 1 will be sandwiched between two opaque overlay layers 9 with pre-cut windows 6 on both sides. The opaque overlay layers 9 will produce a white, flat inlay surface 7, leaving the pre-cut area visible, but it is crucial to ensure that the pre-cut areas are aligned on both sides during the layer finishing process (see also...). Figure 5 ).

[0241] Technically, the inlay 7 produced may have already created the transparent window 6. However, due to the fact that the inlay 7 is typically thermally laminated under high temperature and pressure for a certain period of time, the subject matter of this application is used to prevent material melting and shrinkage, especially in the pre-cut area, and to prevent material from flowing freely and uncontrollably into the gap. Therefore, the shape and size of the window 6 will not change and will remain according to the defined dimensions.

[0242] How to use insert 3 is described. Insert 3 is relevant to this application due to the shrinkage behavior of the material during melting, as described in the technical description.

[0243] Insert 3 can be a standard transparent film, laser, and / or optically variable material. Their shape and size are freely adjustable, consistent with the pre-cutting of the opaque overlay 9.

[0244] Insert 3 does not mean to change the shrinkage behavior of the material during hot lamination, because it cannot be changed, but in fact it will be specifically used to fill the pre-cut, eliminate gaps and prevent the cover layer and core layer 1 from melting.

[0245] Therefore, the combination of the opaque overlay 9 with pre-cut openings and the insert 3 filling technique not only enables the transparent window 6 to be contained in the inlay 7, but also provides an enhanced method to limit uncontrolled shrinkage and flow behavior that causes deformation of the shape and size of the window 6.

[0246] Step 6 - Optional Features: Optional feature: High opacity overlay More specifically, the idea behind the material to be used as the overlay is not simply to use a standard white / opaque color, but rather a highly opaque color. The advantage of a highly opaque material is that it will create a solid white plane on the surface of inlay 7, obscuring the visibility of chip module 4 and copper wire antenna 12. This will allow the customer to comfortably choose the transparent layer to add during the production of card 8.

[0247] Optional feature: Optical variable material insert 3 Insert 3 is typically a standard transparent film, but we can optionally replace it with an optically variable material (see [link]). Figure 8Optically variable materials are colored transparent films with properties such as color shift and strong UV fluorescence. Using optically variable materials as inserts (3) will introduce safer products.

[0248] Utilizing an optically variable material, the color of the transparent window 6 can switch between two colors depending on whether there is a light or dark background. Integrated into a transparent PC film used for the transparent window 6 application, it is compatible with existing manufacturing processes. The optically variable material provides a secure visual effect for the transparent window 6 in identity documents. The typical thickness of the optically variable material is approximately 100 μm. Under the flashlight of a smartphone or other conventional white light source, the insert 3 can change to a second color such as green, while it retains a first color such as pink in shadow. The optically variable material can be supplied according to the guidelines given in document WO2011064162.

[0249] Optional feature: Optically variable material core 1 The core layer 1, located where chip module 4 and antenna 12 are situated, is essentially a standard transparent film, but it can optionally be replaced with an optically variable material (see [link to relevant documentation]). Figure 9 This will provide a safer product, and the unique properties of its optically variable materials, such as synthetic color and strong fluorescence, will be fully visible at the edges.

[0250] Step 7 - Final Product: The inlay structure 7 with transparent window 6 is shown, which consists of 5 main components (in addition to layers 13, 14, 17, and 18).

[0251] Transparent core layer 1 - It can be any substrate, such as PC film, PVC film or PETG film.

[0252] - Single or multiple layers.

[0253] - Transparent color, which can be a standard film, laser and / or optically variable material.

[0254] - The thickness can vary, mainly depending on the thickness of chip module 4.

[0255] -A layer embedding antenna 12 and chip module 4.

[0256] White / Opacity Layer 2 - It can be any substrate, such as PC film, PVC film or PETG film.

[0257] - Single or multiple layers.

[0258] - White / Opaque color.

[0259] -Thickness is variable.

[0260] - It can contain layers with 6 transparent windows.

[0261] Insert 3 - It can be any substrate, such as PC film, PVC film or PETG film.

[0262] - Transparent color, which can be a standard film, laser and / or optically variable material.

[0263] Chip Module 4 -Contactless chip module 4.

[0264] - This can be a memory and / or a controller chip 11 for storing data.

[0265] - Communication with the reader is completed wirelessly via electromagnetic induction using radio frequency through the embedded antenna 5 connected to the chip module 4.

[0266] Embedded antenna 5 - Copper-based conductor.

[0267] - Integrate into core layer 1 using wire embedding.

[0268] - Use thermoforming to connect to chip module 4.

[0269] The terms “chip module 4” and “copper wire embedded antenna 5” are often used as references to electronic component parts, and product designs with transparent window 6 features can be applied using other chip 11 form factors and antenna 12 form factors, such as bare dies using flip chip 11 technology on a substrate, where antenna 12 is produced using different technologies and materials such as printing or etching.

[0270] How to create and implement a transparent window 6: An opaque overlay 10 will be prepared with a pre-cut window 6 having a defined size and shape that can be freely adapted.

[0271] The transparent core layer 1 can be single or multiple layers, and electronic components such as chip module 4 and antenna 12 are located therein. The transparent core layer 1 is sandwiched between two opaque overlay layers 9 with pre-cut windows 6 on both sides. The opaque overlay layers 9 will create a white, flat inlay surface 7, leaving the pre-cut area visible. In the next step, ensure that the pre-cut is aligned on both sides during the layer finishing process, see [link to next step]. Figure 11 .

[0272] Technically, using Figure 5The inlay 7 produced by the conceptual model can be considered as a transparent window 6, and because the inlay 7 is typically thermally laminated under high temperature and pressure for a certain period of time, the material melts and shrinks. Specifically, in the pre-cut area that creates the gap, the material can flow in freely and uncontrollably. Therefore, the shape and size of the window 6 will change and no longer conform to the defined dimensions.

[0273] It is the use of the described insert 3. The insert 3 is provided according to this application based on the shrinkage behavior of the material during melting, as described in the technical description.

[0274] Insert 3 can be a standard transparent film, laser, and / or optically variable material. Their shape and size are freely adjustable, consistent with the pre-cutting of the opaque overlay 9.

[0275] Inserts 3 do not imply altering the shrinkage behavior of the material during hot lamination, as it cannot be altered, and in fact they are specifically designed to fill pre-cuts, eliminate gaps, and prevent the cover layer and core layer 1 from melting into them.

[0276] Therefore, the combination of the opaque overlay 9 with pre-cut openings and the insert 3 filling technique not only enables the transparent window 6 to be contained in the inlay 7, but also provides an enhanced method to limit uncontrolled shrinkage and flow behavior that causes deformation of the shape and size of the window 6.

[0277] This application relates to a method for bonding a plastic cover layer including a pre-stamped window 6 to a plastic insert 3 positioned in the window 6. Specifically, after both the cover layer and the insert 3 undergo a lamination process, bonding occurs at a transition region between the cover layer and the insert 3. The lamination process causes the plastic of the insert 3 and the plastic of the cover layer to begin melting, resulting in adhesion between the insert 3 and the cover layer.

[0278] Physical absorption is a crucial mechanism for achieving adhesion between the surface of the insert 3 and the surface of the cover layer. This mechanism involves weak attractive forces acting between the adhesive and the adherend, known as van der Waals forces. These forces are of two types: weaker dispersive forces and stronger polar forces. Because van der Waals forces occur between any two molecules in contact, they contribute to all adhesive bonding. For good absorption, the distance between the molecules of the adhesive and the adherend can converge toward the molecular spacers, allowing van der Waals interactions to occur. The lamination process enables adhesion to occur on most or all of the surface between the cover layer and the insert 3.

[0279] Higher bonding strength can also be achieved through chemical bonding. This involves forming covalent, ionic, or hydrogen bonds at the interface. Introducing molecular bonding between the adhesive and the adherend can be achieved through reactions at the surface, the use of appropriate surface treatments at the surface between the capping layer and the insert 3, or additional coupling agents.

[0280] Diffusion is another bonding mechanism unique to polymers. The lamination process allows the polymer molecular chains to interpenetrate at the interface between the insert 3 and the surface of the capping layer, resulting in the two surfaces becoming interlocked at the molecular level and thus becoming a single entity.

[0281] Electrostatic adhesion is based on the difference in electronegativity of the adhesive materials. The adhesive force between the adhesive and the adhesive layer is applied through contact or transfer potentials. These transfer potentials result in the formation of an electric double layer at the adhesive-adhesive boundary, leading to a corresponding Coulomb attraction between the insert 3 and the surface of the cover layer.

[0282] While chemical bonds are a significant contributor to adhesive bonding, the crucial force behind the bond is mechanical interlocking. By subjecting both the insert 3 and the cover layer to heating, both melt, allowing their molten materials to permeate each other and then mechanically lock into the adhesive body upon hardening. This, along with the increased surface area at the transition region between them, results in a mechanical bond that significantly contributes to the overall strength of the bond between the plastic cover layer and the plastic insert 3.

[0283] In summary, the method of bonding a plastic cover layer with a pre-stamped window 6 to a plastic insert 3 involves a lamination process that melts the plastic of both components, thereby allowing adhesion between the insert 3 and the surface of the cover layer.

[0284] Any of the embodiments described herein can be advantageously combined with any other embodiment.

[0285] It is suggested that the described embodiments or combinations thereof be combined with one or more of the following technologies or processes or concepts or ideas or paradigms or states: The embodiment not shown here provides a system based on Figure 3 or Figure 4 The method includes optically variable material (OVM) in the insert 3 and core layer 1 to provide security features, and uses highly opaque material in the first cover layer and the second cover layer 10 to cover the visibility of electronic components.

[0286] OVM exhibits unique properties such as color shift, UV strong fluorescence, or holographic or diffraction patterns. Electronic components include a contactless chip module 4 and an embedded antenna 5 integrated into the core layer 1 using wire embedding.

[0287] Other embodiments include an inlay 7 for a card or document, characterized by a core layer 1 having a first side and a second side, configured to house electronic components. A first cover layer having at least one pre-formed window 6 is placed on the first side of the core layer 1, while a second cover layer having at least one pre-formed window 6 is placed on the second side. A first insert 3 is disposed within the window 6 of the first cover layer to prevent deformation during lamination. The electronic components are integrated within the core layer 1. In the transition region between the first insert 3 and the first cover layer, materials are interwoven to provide an adhesive bond between the first insert 3 and the first cover layer.

[0288] Other embodiments include an insert 7 comprising a second cover layer having at least one pre-stamped window 6 on a second side of the core layer 1. A second insert 3 is disposed within the window 6 of the second cover layer to prevent deformation during lamination. In the transition region between the second insert 3 and the second cover layer, materials are interwoven to create an adhesive bond between them.

[0289] In another embodiment, at least one of the core layer 1, the first cover layer, or the second cover layer has a different level of transparency or opacity, particularly The substrate of the core layer 1 is made of PC film, PVC film or PETG film.

[0290] The first cover layer, the second cover layer, or both can be made of PC film, PVC film, or PETG film, and the insert 3 can also be made of PC film, PVC film, or PETG film.

[0291] Insert 3 may include an optically variable material (OVM) that provides security features, and inlay 7 and core 1 may also include an optically variable material (OVM) designed to provide security features.

[0292] The first and second opaque overlays 10 can be made of highly opaque materials to conceal electronic components. The transparent insert 3 can be made of an optically variable material (OVM) that provides unique properties such as color shift, strong UV fluorescence, and additional security features. The optically variable material (OVM) can include holographic or diffractive patterns.

[0293] In other embodiments, the electronic components may include a chip module 4 and an embedded antenna 5, wherein the chip module 4 may be a contactless chip module 4.

[0294] The inlay 7 may have an embedded antenna 5, which is integrated into the core layer 1 using wire embedding.

[0295] The embodiments described above in this application can also be described using the following list of sub-items.

[0296] The first sub-item list relates to aspects relating to the multilayer inlay composition and features. Items in the first sub-item list may be combined with one or more items from all other sub-items in this document and one or more features from the claims.

[0297] First item list: 1. A multilayer inlay, comprising: - Multiple layers, wherein the multiple layers are arranged in any combination and arrangement of the following: - A first overlay layer and a second overlay layer, wherein the first overlay layer and the second overlay layer have at least one pre-made window; - At least one core layer, said at least one core layer being disposed between the first cover layer and the second cover layer, and - A plurality of inserts arranged within the prefabricated windows of the first and second cover layers, wherein the inserts are configured to prevent the windows from deforming during lamination.

[0298] 2. The multilayer inlay as described in Project 1, wherein, - The first and second cover layers comprise optically variable materials, such as so-called OVM layers or white / opaque layers; and wherein, - The core layer comprises a transparent core layer or two or more transparent core layers or OVM-layers or two or more OVM-layers; and wherein, - The insert includes an OVM, and wherein, The arrangement of the layers and inserts is configured to provide enhanced security features, visual effects, or electronic functionality, and wherein, - Each layer and insert is joined using a lamination process that maintains the integrity and alignment of each layer and insert, despite the different material properties.

[0299] The second sub-item list relates to aspects of methods for assembling multilayer inlays with embedded inserts. Items in the second sub-item list may be combined with one or more items from all other sub-items in this document and one or more features of the claims.

[0300] Second item list: 1. A method for assembling a multilayer inlay with embedded inserts, comprising: - Provide a first cover layer and a second cover layer having at least one pre-made window; - The insert is positioned within the prefabricated window using a pick-and-place machine; - Micro-jointing technology is used to join the positioned insert within the prefabricated window.

[0301] 2. The method according to Item 1, wherein the micro-joining involves applying localized heat and pressure to create a joint without damaging the surrounding material or the insert; and wherein each insert comprises an optically variable material.

[0302] The third sub-item list relates to aspects concerning the construction and features of multilayer inlays having electronic modules. Items in the third sub-item list may be combined with one or more items from all other sub-items in this document and one or more features of the claims.

[0303] Third item list: 1. A multilayer inlay, comprising: - At least one first overlay layer, the first overlay layer having at least one pre-made window; - At least a first insert within the prefabricated window of the first cover layer, wherein the insert is configured to prevent the window from deforming during lamination; - Traces and / or wires for connecting electronic modules configured within a core layer, the core layer being placed adjacent to the first cover layer, and wherein the wires are positioned to be visible through the window or a window including the insert.

[0304] 2. The multilayer inlay according to item 1, wherein the visibility of the trace or wire through the window or the window including the insert provides at least one of the following: -Enhance the aesthetic appearance of the device; - Provide visual verification of the presence and integrity of the electronic module; - It serves as a security feature by combining specific visible patterns or configurations that are difficult to replicate without proper manufacturing capabilities.

[0305] 3. The multilayer embedded system according to any one of items 1 or 2 above, wherein the electronic module includes an antenna and / or a chip module.

[0306] The fourth sub-item list relates to aspects of the method for engaging the insert to the first cover layer. Items in the fourth sub-item list may be combined with one or more items from all other sub-items lists in this document and one or more features of the claims.

[0307] Fourth item list: 1. A method for engaging an insert to a first cover layer, comprising: - Align the insert with at least one first cover layer, wherein at least one of the insert and the first cover layer comprises a fusible material; - Applying heat and pressure to the aligned insert and the first cover layer to induce fusion between the materials of the insert and the first cover layer (2, 10); and - The heat and pressure are controlled to form a cohesive undercut in the fusion region of the insert and / or the first cover layer, wherein the undercut interlocks to enhance the mechanical bond strength.

[0308] 2. The method according to Project 1, wherein no additional adhesive is used during the bonding process, and the bonding achieves structural integrity through material cohesion and undercut formation.

[0309] The fifth sub-item list relates to aspects relating to methods for manufacturing laminated devices. Items in the fifth sub-item list may be combined with one or more items from all other sub-items lists in this document and one or more features of the claims.

[0310] Fifth item list: 1. A method for manufacturing a laminated device, comprising: - Perform a first lamination cycle on a multilayer assembly comprising multiple layers bonded under heat and pressure; and - Immediately following the first lamination cycle, the active cooling process begins.

[0311] 2. The method described in Project 1 further includes: - Controlling the active cooling process to rapidly reduce the temperature of the multilayer assembly to a predetermined level, which effectively stabilizes the material and cures the bond formed during the first lamination cycle, and - Wherein, the active cooling involves applying a cooling medium directly to the surface of the multilayer assembly or circulating the cooling medium within a cavity containing the assembly; and - During the active cooling process, a temperature sensor is used to monitor the temperature of the multilayer component, and the cooling rate is adjusted based on real-time temperature data to prevent material deformation and enhance the structural integrity of the laminated product.

[0312] The sixth sub-item list relates to aspects of a method for manufacturing a chip card from an inlay sheet comprising multiple assembled inlays. Items in the sixth sub-item list may be combined with one or more items from all other sub-items in this document and one or more features of the claims.

[0313] Sixth item list: 1. A method for manufacturing a chip card from an inlay sheet comprising a plurality of assembled inlays, comprising: - Provides an inlay sheet comprising a plurality of assembled inlays pre-arranged in a defined card area; and - A stamping mechanism is used to cut chip cards from the insert sheet, wherein each defined card area corresponds to the size and shape of the finished chip card.

[0314] List of reference numerals in the attached diagram: 1 transparent core layer 1 core layer 1 Transparent window core layer 2 white / opaque layers 2 First Covering Layer 2 Second Covering Layer 3 inserts 3 inserts 4-chip module 5 Embedded Antenna 6 transparent windows 6 transparent windows 6 windows 6 windows 7 Inlays 7 Inlays 8 chip cards 8 cards 9 Opaque Overlays 9 covering layers 10 covering layers 10 First Covering Layer 10 Second Covering Layer 11 chips 12 antennas 13 Lower transparent core layer 14. A transparent core layer, which can be one or more layers. 15 Height Adjustable Transparent Core 16 Inlay Sheets 17 printing layers 18 transparent layers 20 transition zones 50+ layers of inlay 60+ layers of inlay 100 methods 100-150 Method Steps 200 methods 205-215 Method Steps 300 methods 305-315 Method Steps 400 methods 405-420 Method Steps 500 methods Methods and steps 505-510.

Claims

1. An inlay (7) for a card or a document, comprising: - a first cover layer (10), wherein the first cover layer (2, 10) has at least one pre-made window (6); - a first insert (3) arranged within the pre-made window (6) of the first cover layer (10), wherein the insert (3) is configured to prevent the window (6) from deforming during lamination; - at least one core layer (1) having a first side and a second side, the at least one core layer (1) being placed on the first cover layer (2, 10) with the first side, wherein the core layer (1) comprises a substrate and is configured to house at least one electronic component (4, 5); - a second cover layer (2, 10), wherein the second cover layer (2, 10) has at least one pre-made window (6); - a second insert (3) arranged within the pre-made window (6) of the second cover layer (2, 10), wherein the insert (3) is configured to prevent the pre-made window (6) from deforming during lamination; wherein, - the second cover layer (2, 10) is placed on the second side of the core layer (1), and wherein the first cover layer (2, 10) and the second cover layer (2, 10) and the core layer (1) are laminated.

2. The inlay (7) according to the preceding claim, wherein In the transition area between the second insert (3) and the second cover layer (10), there is interlacing between the material of the second insert (3) and the material of the second cover layer (10), thereby providing a thermal bond between the second insert (3) and the second cover layer (10).

3. The inlay (7) according to any one of the preceding claims, wherein At least one of the core layer (1), the first cover layer (10), or the second cover layer (10) is transparent or opaque.

4. The inlay (7) according to any one of the preceding claims, wherein The substrate of the core layer (1) comprises a PC film, a PVC film, or a PETG film.

5. The inlay (7) according to any one of the preceding claims, wherein The first cover layer (10) and / or the second cover layer (10) comprises a PC film, a PVC film, or a PETG film.

6. The inlay (7) according to any one of the preceding claims, wherein The insert (3) comprises a PC film, a PVC film, or a PETG film.

7. The inlay (7) according to any one of the preceding claims, wherein The insert (3) comprises an optically variable material configured to provide a security feature.

8. The inlay (7) according to any one of the preceding claims, wherein The core layer (1) comprises an optically variable material configured to provide a security feature.

9. The inlay (7) according to any one of the preceding claims, wherein The first opaque cover layer (10) and the second opaque cover layer (10) comprise a highly opaque material configured to cover the visibility of the electronic component.

10. The inlay (7) according to any one of the preceding claims, wherein The transparent insert (3) is made of an optically variable material providing unique properties such as color shifting, UV strong fluorescence, and other security features.

11. The inlay (7) according to claim 10, wherein The optically variable material further comprises a holographic or diffractive pattern.

12. The inlay (7) according to any one of the preceding claims, wherein The core layer (1) further comprises: - a lower transparent core layer (13) in contact with one side of the first cover layer (2, 10); - an upper transparent core layer (14) on top of the lower transparent core layer (13), wherein the upper transparent core layer (14) comprises at least one layer; and - a lower transparent core layer (13) in contact with one side of the first cover layer (2, 10); - an upper transparent core layer (14) on top of the lower transparent core layer (13), wherein the upper transparent core layer (14) comprises at least one layer; and - a height-adjusted transparent core layer (15) on top of the at least one upper transparent core layer (14).

13. The inlay (7) according to any one of the preceding claims, wherein The inlay (7) comprises a third layer (17) on the side of the first cover layer (2, 10) and the second cover layer (2, 10) opposite to the core layer (1).

14. The inlay (7) according to any one of the preceding claims, wherein The inlay (7) comprises a fourth layer (18) on the side of the third layer (17) opposite to the first cover layer (2, 10) and the second cover layer (2, 10).

15. The inlay (7) according to any one of the preceding claims, wherein The electronic component comprises a chip module (4) and an embedded antenna (5).

16. The inlay (7) according to claim 15, wherein The chip module (4) is a contactless chip module (4).

17. The inlay (7) according to any one of the preceding claims, wherein The embedded antenna (5) is integrated into the core layer (1) using wire embedding, printing or etching.

18. The inlay (7) according to any one of the preceding claims, wherein The pre-made window (6) in the first cover layer (2, 10) and the second cover layer (2, 10) has a minimum size of 5.0 x 5.0 mm with a tolerance of 10% to ensure compliance with the specified security feature size.

19. The inlay (7) according to any one of the preceding claims, wherein Each pre-made window (6) in the first cover layer (2, 10) and the second cover layer (2, 10) comprises a corner with a minimum radius greater than 0.2 mm to reduce stress concentration and enhance the structural integrity of the inlay.

20. The inlay (7) according to any one of the preceding claims, wherein Any lines or bars in the design of the pre-made window (6) have a width greater than 2.0 mm to ensure sufficient visibility and durability of the embedded security feature.

21. The inlay (7) according to any one of the preceding claims, wherein The insert (3) placed within the pre-made window (6) has a thickness of at least 30 pm and preferably 50 pm on one side to match the opacity requirements of the first cover layer (2, 10) and the second cover layer (2, 10), thereby ensuring consistent visual quality and safety standard compliance.

22. The inlay (7) according to any one of the preceding claims, wherein The thermal lamination is performed at about 175 °C for 15 minutes to achieve optimal adhesion and integration of the layers without compromising the material integrity of the inlay.

23. A chip card having an inlay (7) according to any one of claims 1 to 22.

24. A method (100) for assembling an inlay (7), comprising the steps of: - providing (105) a first cover layer (2, 10), wherein the first cover layer (2, 10) has at least one pre-made window (6); - arranging (110) a first insert (3) within the pre-made window (6) of the first cover layer (10), wherein the insert (3) is configured to prevent deformation of the window (6) during lamination; - placing (115) a core layer (1) having a first side and a second side, wherein the first side is on the first cover layer (2, 10), wherein the core layer (1) comprises a substrate and is configured to house at least one electronic component (4, 5); - providing (120) a second cover layer (2, 10), wherein the second cover layer (2, 10) has at least one pre-made window (6); - arranging (125) a second insert (3) within the preformed window (6) of the second cover layer (2, 10), wherein the insert (3) is configured to prevent the preformed window (6) from deforming during lamination; - placing (130) the second cover layer (2, 10) on the second side of the core layer (1), and - laminating (135) the first cover layer (2, 10) and the second cover layer (2, 10) and the core layer (1) to assemble the inlay (7).

25. The method (100) of claim 24, wherein The method further comprises: - integrating (140) electronic components within the core layer (1), wherein in the transition area between the first insert (3) and the first cover layer (2, 10) there is interlacing between the material of the first insert (3) and the material of the first cover layer (2, 10), such that by subjecting both the insert (3) and the cover layer (2, 10) to heat they both melt and their molten material penetrates into each other and then after hardening mechanically locks with each other, providing a thermal joint between the first insert (3) and the first cover layer (2, 10) without adding additional glue material into the joint between the insert (3) and the first cover layer (2, 10).

26. The method of any of the preceding claims, wherein, The step of placing (115) a core layer (1) further comprises: - placing a lower transparent core layer (13) in contact with one side of the first cover layer (2, 10); - placing an upper transparent core layer (14) on top of the lower transparent core layer (13), wherein the upper transparent core layer (14) is composed of at least one layer; and - placing a height-adjusting transparent core layer (15) on top of the at least one upper transparent core layer (14).

27. The method (100) according to any one of the preceding claims, wherein The method further comprises: - printing (145) a third layer (17) on the side of the first cover layer (2, 10) and the second cover layer (2, 10) opposite to the core layer (1).

28. The method (100) of claim 27, wherein The method further comprises: - printing (150) a fourth layer (18) on the side of the third layer (17) opposite to the first cover layer (2, 10) and the second cover layer (2, 10).

29. The method (100) of claim 28, wherein The method further comprises: - laminating (155) the inlay and the third layer (17) and the fourth layer (18) to assemble the inlay (7).

30. The method (100) according to any one of the preceding claims, wherein The lamination steps (135, 155) comprise applying heat sufficient to achieve thermal bonding between the layers and active cooling under pressure to stabilize the bonded structure.

31. The method (100) according to any one of the preceding claims, wherein The method step of arranging (110) the first insert (3) and the second insert (3) within the preformed window (6) comprises employing ultrasonic welding to bond the insert (3) to the first cover layer (2, 10) and the second cover layer (2, 10) at the preformed window (6) to maintain the alignment and positioning of the insert (3).

32. The method (100) according to any one of the preceding claims, wherein In the transition area between the second insert (3) and the second cover layer (2, 10), there is interlacing between the material of the second insert (3) and the material of the second cover layer (2, 10), so that by subjecting both the insert (3) and the cover layer (2, 10) to heating, they both melt and their molten material penetrates into each other and then, after hardening, mechanically locks with each other, providing a thermal joint between the first insert (3) and the second cover layer (2, 10), without adding additional glue material to the joint between the insert (3) and the second cover layer (2, 10).

33. The method (100) according to any one of the preceding claims, wherein: - the insert (3) comprises an optically variable material configured to provide a security feature, and / or - the core layer (1) comprises an optically variable material configured to provide a security feature, and / or - the core layer (1) comprises a material selected from the group consisting of polycarbonate (PC), polyvinyl chloride (PVC) or polyethylene terephthalate modified (PETG); - the first cover layer (2, 10) and the second cover layer (2, 10) comprise a highly opaque material configured to cover the visibility of the electronic component, and / or wherein the optically variable material OMV provides unique properties such as color shift, UV strong fluorescence or holographic or diffractive patterns, and / or wherein the electronic component comprises a chip module (4) in the form of a contactless chip module (4) and an embedded antenna (5) integrated into the core layer (1) using wire embedding.

34. The method (100) according to any one of the preceding claims, wherein The pre-made windows (6) in the first cover layer (2, 10) and the second cover layer (2, 10) have a minimum size of 5.0 x 5.0 mm with a tolerance of 10% to ensure compliance with the specified security feature size.

35. The method (100) according to any one of the preceding claims, wherein Each pre-made window (6) in the first cover layer (2, 10) and the second first cover layer (2, 10) comprises a corner with a minimum radius greater than 0.2 mm to reduce stress concentration and enhance the structural integrity of the inlay.

36. The method (100) according to any one of the preceding claims, wherein Any lines or bars in the design of the pre-made window (6) have a width greater than 2.0 mm to ensure sufficient visibility and durability of the embedded security feature.

37. The method (100) according to any one of the preceding claims, wherein The insert (3) placed within the pre-made window (6) has a thickness of at least 30 pm and preferably 50 pm on one side to match the opacity requirements of the first cover layer (2, 10) and the second cover layer (2, 10), thereby ensuring consistent visual quality and security standard compliance.

38. The method (100) according to any one of the preceding claims, wherein The thermal lamination is carried out at about 175°C for 15 minutes to achieve optimal adhesion and integration of the layers without compromising the material integrity of the inlay.

39. The method (100) according to any one of the preceding claims, wherein The inlay (7) is assembled in an inlay sheet (16) composed of a plurality of individual inlays (7), wherein the method further comprises: - extracting individual inlays (7) from the inlay sheet (16) by using cutting techniques.

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