New diamond wire feeding method, computer readable storage medium and cutting machine

Abstract

The invention relates to the technical field of wire cutting, in particular to a new diamond wire feeding method, a computer readable storage medium and a cutting machine, which comprises the following steps: fixing a bar to be cut on a workbench of a cutting platform, and dividing the bar into N sections of cutting units according to the section; and a diamond wire is controlled to feed a new wire according to the needed wire feeding length, and each cutting unit is cut step by step in a segmented mode. The diamond wire cutting method has the beneficial effects that the limitation of one-time cutting or fixed parameter control in traditional wire cutting is broken through, according to the scheme, by means of segmented cutting and a multi-parameter compensation mechanism, use of the diamond wire is better matched with the actual cutting requirement, and the stability and consistency of the cutting process are remarkably improved. And due to the accurate control of the wire inlet amount, the invalid loss of the diamond wire is effectively reduced, and the material cost is reduced. According to the method, the influence of a plurality of parameters on the incoming length of the diamond wire is referred, so that the adaptability of equipment to different materials and different process requirements is enhanced, and the conversion from experience driving to data driving is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wire cutting, and in particular to a new wire feeding method for diamond wire, a computer readable storage medium and a cutting machine. BACKGROUND

[0002] In the current photovoltaic, semiconductor, LED and precision electronic manufacturing fields, diamond wire cutting technology has become the core process means for processing hard and brittle materials such as silicon wafers, sapphire, silicon carbide and ceramics. With the continuous improvement of the utilization rate of materials, cutting efficiency and surface quality requirements, as a key consumable, the use cost and cutting stability of diamond wire directly affect the overall production efficiency.

[0003] The diamond wire is reciprocating in the cutting process, and gradually feeds during the movement. The feeding length is the feeding amount of the new wire of the diamond wire. In the diamond wire cutting process, new wire feeding control is an important link to maintain the stability of the cutting performance. Traditionally, the bar material is cut in whole, and the feeding length of the diamond wire is not set according to the different stages of cutting. The feeding length of the new wire is set as a fixed value or roughly estimated based on the experience of the operator. For example, a fixed length of new wire is released after a certain time or a certain number of strokes to supplement the cutting ability lost due to wear. Such method is simple to implement, but lacks the ability to respond to real-time working condition changes.

[0004] However, under different working conditions, the wear rate and effective cutting ability of the diamond wire are significantly different. If the fixed feeding strategy is still used, it is easy to cause insufficient feeding of the new wire during high-load cutting, resulting in excessive fatigue of the diamond wire, decreased cutting force, rough surface and even broken wire. If the new wire is fed too much under low load or poor cooling conditions, not only the valuable diamond wire resources are wasted, but also the stability of the temperature field and tension field in the cutting area may be affected due to the rapid renewal of the wire body, thereby causing vibration, shaking and other problems, affecting the cutting precision and product yield. SUMMARY

[0005] (1) Technical problem to be solved

[0006] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present application provides a new wire feeding method for diamond wire, a computer readable storage medium and a cutting machine, which solves the technical problem of insufficient matching degree to actual working conditions in the prior art new wire feeding method using fixed value setting or rough estimation based on operator experience.

[0007] (2) Technical scheme

[0008] In order to achieve the above-mentioned purpose, the main technical scheme adopted by the present application includes:

[0009] In a first aspect, the present application provides a wire cutting machine cutting method, the method comprising:

[0010] S1: fixing the bar to be cut on the workbench of the cutting platform, and dividing the cross section of the bar into N segment cutting units;

[0011] S2: controlling the new wire of the diamond wire to feed according to the required wire length, and cutting each of the N segment cutting units in sections according to the N segment cutting units;

[0012] The control of the new wire of the diamond wire according to the required wire length is specifically: based on the environmental factors in the actual cutting process, the cutting speed of the diamond wire, the cutting area of each segment cutting unit, the area that the unit length of the diamond wire can effectively cut in the unit time, and the effective length of the diamond wire participating in the cutting process of each segment cutting unit, the new wire length of the diamond wire is obtained.

[0013] In one technical solution of the present application, the control of the new wire of the diamond wire according to the required wire length in step S2 specifically includes:

[0014] S2.1: determining a correction coefficient according to the environmental factors in the actual cutting process, and obtaining the cutting speed of the diamond wire, the cutting area of each segment cutting unit, the area that the unit length of the diamond wire can effectively cut in the unit time, and the effective length of the diamond wire participating in the cutting process of each segment cutting unit;

[0015] S2.2: based on the above parameters, the new wire length of the diamond wire is obtained, specifically: the correction coefficient of the environmental factors in the actual cutting process is denoted as α, the cutting speed of the diamond wire is denoted as S, the cutting area of each segment cutting unit is denoted as A, the area that the unit length of the diamond wire can effectively cut in the unit time is denoted as K, and the effective length of the diamond wire participating in the cutting process of each segment cutting unit is denoted as L,

[0016] Then the new wire length of the diamond wire V = α × S × A / [K × L].

[0017] In one technical solution of the present application, the correction coefficient is determined according to the environmental factors in the actual cutting process, specifically including: by monitoring the flow data of the cooling liquid in real time during the cutting process, the correction coefficient is determined. Wherein, 0.8 ≤ α ≤ 1.2.

[0018] In one technical solution of the present application, N ≥ 2. When the bar is a cuboid, A = a × W / N, wherein a is the length of the cross section of the bar, and W is the height of the cross section of the bar. When the bar is a cylinder, A = 2R / N × [D1+D2] / 2, wherein R is the radius of the bar, and D1 and D2 are the chord lengths of the adjacent arc cross sections after segmentation.

[0019] In one technical solution of the present application, the method for obtaining the effective length of the diamond wire comprises: obtaining a numerical value according to the wire layout of the wire cutting and the size of the cutting area, in combination with the winding layer number and the tension distribution of the diamond wire.

[0020] In one technical solution of the present application, the method is suitable for a wire cutting machine using diamond wire as the cutting medium.

[0021] In a second aspect, the present application provides a computer-readable storage medium, which stores program instructions, when the program instructions are executed by a processor, the steps of the wire cutting machine cutting method in any of the above technical solutions are implemented.

[0022] In a third aspect, the present application provides a diamond wire cutting machine, which comprises a control system configured to receive input parameters of cutting speed, cutting area, effective length of diamond wire, and unit length cutting area carrying capacity, and dynamically adjust the correction coefficient. According to V = alpha x S x A / [K x L], the new wire feeding length is calculated.

[0023] In one technical solution of the present application, the control system further comprises a flow sensor for real-time monitoring of the flow of the cooling liquid. A data storage module is used to store a database of the corresponding relationship between the unit length cutting area carrying capacity and the cutting conditions.

[0024] In one technical solution of the present application, the cutting machine is suitable for cutting hard and brittle materials. The hard and brittle materials include silicon wafers, gemstones or ceramics.

[0025] (Three) beneficial effects

[0026] The beneficial effects of the present application are: the diamond wire new wire feeding method, computer-readable storage medium and cutting machine of the present application fix the bar to be cut on the workbench of the cutting platform, and divide it into N cutting units according to its cross-sectional geometric characteristics, so as to realize the fine and segmented cutting control of the complex cross-section bar. In the cutting process, the system controls the diamond wire to feed the new wire according to the predetermined strategy, and sequentially completes the processing task of each cutting unit. Among them, the feeding of the new wire of the diamond wire is not a fixed value or an experience setting, but a scientific calculation and dynamic adjustment based on real-time working conditions. This method breaks through the limitations of one-size-fits-all or fixed parameter control in traditional wire cutting. Since there are differences in geometric characteristics and material removal amount of different cutting units, if a unified wire feeding strategy is adopted, it is easy to cause excessive wear or even breakage of the diamond wire in some sections, while the cutting capacity is idle in other sections. This scheme realizes segmented cutting and multi-parameter compensation mechanism, so that the use of diamond wire is more matched with the actual cutting demand, and the stability and consistency of the cutting process are significantly improved.

[0027] Furthermore, the precise control of the wire feed rate effectively reduces ineffective diamond wire loss and lowers material costs. Because this method considers the influence of multiple parameters on the diamond wire feed length, it enhances the equipment's adaptability to different materials and process requirements, achieving a shift from experience-driven to data-driven approaches. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the cutting process when the diamond wire of the present invention is used to cut a cylindrical rod.

[0029] Figure 2 This is a schematic diagram of the cutting process when the diamond wire of the present invention is used to cut a cuboid bar. Detailed Implementation

[0030] To better explain and facilitate understanding of this invention, the following description is provided in conjunction with the appendix. Figures 1-2 The present invention will be described in detail through specific embodiments. In this document, directional terms such as "upper" and "lower" are used interchangeably with other directional terms. Figure 1 The orientation is used as a reference.

[0031] Example 1:

[0032] Reference Figures 1-2 An embodiment of the present invention provides a wire EDM cutting method, comprising:

[0033] S1: Fix the bar to be cut on the worktable of the cutting platform and divide the cross-section of the bar into N cutting units;

[0034] S2: Control the diamond wire to feed new wire according to the required wire length, and cut each cutting unit step by step according to the N-segment cutting unit;

[0035] Specifically, controlling the diamond wire to feed new wire at the required feed length involves: determining the new wire feed length based on environmental factors during the actual cutting process, the cutting speed of the diamond wire, the cutting area of ​​each cutting unit, the area that a unit length of diamond wire can effectively cut per unit time, and the effective length of the diamond wire participating in the cutting process of each cutting unit.

[0036] Step S2, controlling the diamond wire to feed new wire to the required length, specifically includes:

[0037] S2.1: Determine the correction coefficient based on the environmental factors in the actual cutting process, and obtain the cutting speed of the diamond wire, the cutting area of ​​each cutting unit, the area that a unit length of diamond wire can effectively cut per unit time, and the effective length of the diamond wire participating in the cutting process of each cutting unit.

[0038] S2.2: Based on the above parameters, the new wire feed length of the diamond wire is determined. Specifically, the environmental factors in the actual cutting process are determined as a correction coefficient α, the cutting speed of the diamond wire is denoted as S, the cutting area of ​​each cutting unit is denoted as A, the area that a unit length of diamond wire can effectively cut per unit time is denoted as K, and the effective length of the diamond wire participating in the cutting process in each cutting unit is denoted as L.

[0039] Then the length of the new diamond wire V is V = α × S × A / [K × L];

[0040] Among them, the correction coefficient is used to quantify the impact of the cutting condition on the cutting load, the cutting speed, contact area and load capacity represent the current cutting load requirements, and the effective length reflects the length of the diamond wire actually involved in material removal.

[0041] In diamond wire cutting, precisely controlling the new wire feed length is crucial for ensuring cutting efficiency, maintaining stable diamond wire tension, and extending the lifespan of the diamond wire. Traditional methods often use a fixed feed length or estimate based on empirical parameters, which is difficult to adapt to dynamic changes under different materials and cutting conditions. Furthermore, traditional cutting methods are mostly single-cut, without tailored cutting for different cross-sections and shapes of bars, easily leading to excessive diamond wire consumption or insufficient cutting capacity.

[0042] In this embodiment, the bar stock to be cut is fixed to the worktable of the cutting platform and divided into N cutting units according to its cross-sectional geometry, thereby achieving refined, segmented cutting control of bar stock with complex cross-sections. During the cutting process, the system controls the diamond wire to dynamically feed new wire according to a predetermined strategy, and sequentially completes the processing tasks of each cutting unit. The feeding of the new diamond wire is not based on fixed values ​​or empirical settings, but rather on scientific calculations and dynamic adjustments based on real-time operating conditions. Specifically, before and during cutting, the system first collects and analyzes various environmental factors affecting cutting performance, thereby determining a correction coefficient that quantifies the impact of the current cutting conditions on the load. Simultaneously, the system acquires in real-time the current cutting speed, the specific cutting area of ​​each cutting unit, the maximum cutting area that a unit length of diamond wire can bear, and the effective length of the diamond wire actually participating in the material removal process under the current cutting posture. Based on these multi-dimensional parameters, the required new diamond wire length for each stage is calculated using an established mathematical model, ensuring that the feed amount meets the current cutting load requirements while avoiding resource waste.

[0043] This method overcomes the limitations of traditional wire EDM, which relies on a single cut or fixed parameter control. Because different cutting units have varying geometric characteristics and material removal rates, using a uniform wire feed strategy can easily lead to excessive wear or even breakage of the diamond wire in some sections, while other sections experience idle cutting capacity. This solution, through segmented cutting and a multi-parameter compensation mechanism, makes the use of diamond wire more aligned with actual cutting needs, significantly improving the stability and consistency of the cutting process.

[0044] Furthermore, the precise control of the wire feed rate effectively reduces ineffective diamond wire loss and lowers material costs. Because this method considers the influence of multiple parameters on the diamond wire feed length, it enhances the equipment's adaptability to different materials and process requirements, achieving a shift from experience-driven to data-driven approaches.

[0045] Let α be the correction factor for environmental factors during the actual cutting process, S be the cutting speed of the diamond wire, A be the cutting area of ​​each cutting unit, K be the area that a unit length of diamond wire can effectively cut per unit time, and L be the effective length of the diamond wire participating in the cutting process in each cutting unit.

[0046] Then the length of the new diamond wire V is V = α × S × A / [K × L].

[0047] This method requires collecting the diamond wire cutting speed S under the current operating conditions. The cutting area A refers to the cross-sectional area of ​​the diamond wire in contact with the bar stock during a single cut. The effective cutting area K that a unit length of diamond wire can bear reflects the cutting ability and wear characteristics of the diamond wire itself. The effective length L of the diamond wire participating in the actual cutting process is also required; that is, the length of the wire directly involved in material removal within the working section.

[0048] Based on the above parameters, the optimal new wire feed length V is calculated by constructing a mathematical model V = α × S × A / [K × L]. This method fully reflects the quantitative relationship between cutting load and diamond wire consumption, ensuring that the wire feed amount meets the needs of the current cutting task while avoiding resource waste and increased wire saw vibration caused by excessive wire feed. The wire feed control achieved by this method has good adaptability and accuracy, and can automatically adjust the wire feed strategy in cutting tasks with different materials and specifications.

[0049] This method significantly improves the utilization efficiency of diamond wire and reduces unit cutting costs because the wire feed length is highly matched to actual cutting factors. It also reduces the risk of wire breakage due to improper feed, improving equipment operational stability. Furthermore, it helps maintain the flatness and consistency of the cut surface, increasing product yield. In addition, the introduction of a dynamic correction mechanism α enhances the responsiveness to complex working conditions, providing reliable technical support for the construction of intelligent, unmanned cutting production lines.

[0050] The correction factor α is determined based on environmental factors during the actual cutting process, specifically including:

[0051] The correction factor α is determined by monitoring the coolant flow rate data in real time during the cutting process.

[0052] Where 0.8≤α≤1.2.

[0053] In this embodiment, the critical impact of coolant on the working state and cutting performance of diamond wire was fully considered when determining the correction coefficient α. Coolant not only cools the wire but also effectively washes away chips, reduces friction, and inhibits oxidation, thus directly affecting the wear rate and cutting efficiency of the diamond wire.

[0054] By monitoring the coolant flow rate in real time during the cutting process, it is possible to dynamically assess whether the supply is within the optimal range. When the coolant flow rate is sufficient and stable, the working temperature of the diamond wire remains within a reasonable range, chips are discharged smoothly, and the friction between the diamond wire and the bar stock is reduced. At this time, the cutting ability of the diamond wire can be fully utilized, and the load-bearing efficiency per unit length is high.

[0055] By combining a preset flow rate threshold range with linear or piecewise function mapping, the α coefficient is continuously and dynamically adjusted, making the calculation of the wire feed length more closely resemble real-world working conditions. This not only effectively extends the lifespan of the diamond wire and reduces abnormal wear, but also ensures the stability of the cutting process and reduces the risk of defects such as surface damage and edge chipping caused by insufficient cooling. Furthermore, by precisely controlling the wire feed, resource waste is avoided, improving the energy efficiency and economy of the processing, and providing strong support for achieving high-precision, high-reliability automated cutting.

[0056] Specifically, the correction factor α and the coolant flow rate are determined according to the following formula:

[0057]

[0058] Where Q represents the actual traffic flow. min Q is the minimum allowed flow rate. max The maximum allowed flow rate.

[0059] This correction method can yield a suitable α value.

[0060] Obtaining the cutting area A of the diamond wire specifically includes:

[0061] The bar stock is divided into N segments along the cutting path by process settings, where N≥2.

[0062] When the bar stock is a cuboid, A = a × W / N, where a is the length of the bar stock's cross section and W is the height of the bar stock's cross section.

[0063] When the bar stock is a cylinder, A = 2R / N × [D1 + D2] / 2, where R is the radius of the bar stock, and D1 and D2 are the chord lengths of adjacent arc-shaped sections after segmentation.

[0064] In this embodiment, during the process of obtaining the diamond wire cutting area A, a segmented modeling approach is used to refine the complex cutting path, thereby improving the accuracy of the cutting area calculation. Specifically, based on the actual process settings, the bar stock is divided into N continuous cutting segments along the predetermined cutting path, where N is not less than 2, to facilitate local approximate calculations and thus improve overall accuracy.

[0065] For bars of different shapes, appropriate geometric models are used for adaptation calculations.

[0066] When the bar being cut is a cuboid, its cut surface is rectangular. In this case, the cutting area A of each segment can be expressed as a×W / N, where a represents the length of the entire cut surface in the feed direction, W is the vertical height of the cut surface, i.e. the cutting depth, and N is the total number of segments.

[0067] For cylindrical bars with a circular cross-section, the cutting width of each segment changes with position during the cutting process. A trapezoidal approximation method is used, taking half the sum of "D1" and "D2", where D1 is the length of the upper base and D2 is the length of the lower base. This yields the equivalent cutting area A = 2R / N × [D1 + D2] / 2 for that segment. At the beginning and end of the cut, since the cross-section is approximately arched, it can be calculated as a triangle. For the beginning segment, D2 is set to zero, and for the end segment, D1 is set to zero.

[0068] This technical solution significantly improves the calculation accuracy of the cutting area A, thereby enhancing the control accuracy of the new wire feed length V. It avoids the problem of insufficient or excessive wire feed caused by area estimation errors, helping to maintain stable diamond wire tension and balanced cutting efficiency. Furthermore, this method can adapt to the needs of cuboid or cylindrical bars, offering excellent flexibility.

[0069] Specifically, in some implementations, N is usually taken as 5.

[0070] Methods for obtaining the area K that a unit length of diamond wire can effectively cut per unit time include:

[0071] The K value is derived by combining the cutting area A of each cutting unit, the number of wire meshes, the cutting speed, and the total length of the diamond wire.

[0072] Specifically, K = number of wire meshes * A / (length of diamond wires used in cutting * cutting time).

[0073] Where A is the cutting area of ​​each of the above cutting units.

[0074] For example, taking a 0.1*0.2 square bar as an example, if A is 0.02㎡, then the area of ​​each unit is A / 5 = 0.004㎡. If the wire mesh count is 800, the cutting time is 3 minutes (180 seconds), and the length of the diamond wire used in the cutting is 500m, then K is 800*0.004 / (500*180) = 3.56×10⁻⁶. -5 ㎡ / (s*m).

[0075] In this embodiment, the effective length L of the diamond wire refers to the portion of the wire that actually participates in material removal, bears cutting force, and affects energy transfer and tension distribution during the cutting process. Its value is not only related to the mechanical structure of the equipment, but also affected by the wire arrangement and force characteristics under dynamic operating conditions.

[0076] This technical solution improves the overall accuracy of new line feed length calculation and enhances the system's adaptability to different machine models and wiring methods. It helps optimize tension control strategies and reduces the risk of vibration, shaking, or wire breakage caused by misjudgment of effective length. Simultaneously, it provides reliable data support for equipment design improvements and process parameter simulation, further enhancing the stability, consistency, and intelligence of the cutting process.

[0077] Specifically, L is calculated as follows:

[0078] L=D*N+π*d*(k+θ / 360°).

[0079] Where D is the span of the diamond wire cutting area, and if both ends of the diamond wire segment are guide wheels, then it is the center distance of the guide wheels, such as D = 0.4m;

[0080] N is the number of nets, such as N = 800;

[0081] d is the diameter of the guide wheel, such as d = 0.2;

[0082] k represents the number of guide wheels, which is 2.

[0083] θ is the total wrap angle of the diamond wire on the guide wheel, such as 720° for two turns.

[0084] Therefore, L = 0.4 * 800 + 3.14 * 0.2 * (2 + 2) = 322.512 m

[0085] Taking a 0.1*0.2 square bar as an example, the K value of this diamond wire is 3.56×10. -5 ㎡ / (s*m), the cutting speed S is 25m / s, and α is taken as 1.

[0086] Then V=α×S×A / 5 / [K×L]=1*25*0.02 / 5 / [3.56×10 -5 [*322.512] = 8.71m, meaning the length of the new incoming line is 8.71m.

[0087] This method is applicable to wire EDM machines that use diamond wire as the cutting medium. It is suitable for multi-wire EDM machines used for hard and brittle materials such as photovoltaic silicon wafers, semiconductor materials, sapphire, and silicon carbide, as well as single-wire or high-speed reciprocating cutting systems for specific precision machining scenarios. Because its core parameter acquisition method fully considers the comprehensive influence of environmental factors, material properties, equipment structure, and process parameters in actual working conditions, it possesses good versatility and portability.

[0088] Example 2:

[0089] Figures 1-2 In addition to providing a computer-readable storage medium storing program instructions, embodiments of the present invention implement the steps of the wire cutting method as described in the above embodiments when the program instructions are executed by a processor.

[0090] In this embodiment, the storage medium can be a variety of computer-readable media, including but not limited to flash memory, solid-state drives, hard disk drives, optical discs, magnetic tapes, USB flash drives, or embedded memory, suitable for data storage and program execution environments in industrial control systems, CNC equipment, or intelligent manufacturing platforms. The program includes an integrated calculation module for the final feed length V = α × S × A / [K × L], ensuring that all parameters participate in the calculation collaboratively under a unified time base, outputting the optimal feed control quantity. The execution of this program instruction enables the cutting equipment to possess online calculation and intelligent decision-making capabilities, dynamically optimizing the new line feed strategy without relying on human experience.

[0091] This computer-readable storage medium enhances the automation and intelligence of the equipment, improving its adaptability to varying operating conditions. It ensures reasonable diamond wire consumption and stable cutting processes, effectively reducing the risk of wire breakage and material waste. Furthermore, by embedding advanced control logic in software, it facilitates rapid deployment and batch application across different models, significantly improving production consistency and operational efficiency.

[0092] Example 3:

[0093] Figures 1-2 Figures 1-2 An embodiment of the present invention provides a diamond wire cutting machine, including a control system, the control system being configured as follows:

[0094] It receives input parameters such as cutting speed S, cutting area A, effective length of diamond wire L, and load capacity per unit length of cutting area K, and dynamically adjusts the correction coefficient α.

[0095] Calculate the new line feed length V based on V = α × S × A / [K × L].

[0096] The diamond wire cutting machine provided in the embodiments of the present invention integrates an intelligent control system. This system, as the core computing and decision-making unit of the equipment, possesses the capabilities of multi-source parameter acquisition, dynamic compensation calculation, and real-time control output. The control system is connected to the communication interfaces of various sensors and process modules within the equipment. It receives key process parameters including the current cutting speed S, cutting area A, effective length L of the diamond wire involved in the cutting, and the cutting area capacity K per unit length of diamond wire. It accurately calculates the new wire feed length V required for the current cutting stage and generates corresponding control commands to output to the wire feeding drive mechanism, thereby achieving on-demand supply of diamond wire.

[0097] This control logic not only avoids the resource waste or insufficient supply problems caused by the traditional fixed wire feed mode, but also significantly improves the stability and consistency of the cutting process. Through a closed-loop, parameterized wire feed control strategy, it effectively extends the service life of diamond wire and reduces unit cutting costs. It also reduces wire breakage caused by insufficient cooling, wire fatigue, or tension imbalance. Simultaneously, it improves adaptability and yield in the processing of different materials and specifications of bars.

[0098] The control system also includes a flow sensor for real-time monitoring of coolant flow. A data storage module stores a database of the correspondence between the load capacity K per unit length of cut area and the cutting conditions.

[0099] The flow sensor continuously monitors the actual flow rate of coolant entering the cutting area in real time and transmits the collected data to the control unit in digital signal form. Based on a preset flow threshold range, the system determines whether the current cooling state is within the ideal operating range and dynamically adjusts the correction coefficient α accordingly. When the flow rate is sufficient and the cooling effect is good, the system determines that the diamond wire's working environment is stable and the cutting efficiency is high, thus appropriately increasing the α value to enhance the supply of new wire and fully utilize the wire's cutting capability. Conversely, when a decrease or abnormal fluctuation in flow rate is detected, the α value is reduced, and the wire feed speed is slowed down to avoid exacerbating wire wear or causing wire breakage under conditions of poor heat dissipation and poor chip removal. This achieves a closed-loop response to environmental factors, making wire feed control safer.

[0100] Simultaneously, the control system is equipped with a data storage module to build and maintain a structured database. This database stores the mapping relationship between the load-bearing capacity (K) per unit length of different types of diamond wire and their corresponding cutting conditions. These conditions include, but are not limited to, diamond wire quality, diamond particle characteristics, and cutting speed. During actual operation, the control system automatically retrieves the matching K value from the database to obtain load-bearing capacity parameters that more closely reflect actual performance. This database also supports online updates and learning functions, continuously optimizing the K value prediction accuracy by accumulating historical operating data, thus achieving adaptive evolution of the control model.

[0101] The cutting machine is suitable for cutting hard and brittle materials. Hard and brittle materials include silicon wafers, gemstones, or ceramics.

[0102] The applicable hard and brittle materials broadly cover silicon wafers in the photovoltaic and semiconductor fields, including monocrystalline silicon, polycrystalline silicon, gemstone materials in the optical and electronic industries such as sapphire and ruby, and high-performance structural and functional ceramics such as alumina, silicon nitride, and silicon carbide ceramics. These materials generally have characteristics such as high hardness, low fracture toughness, and significant anisotropy.

[0103] By integrating the aforementioned control system, this cutting machine not only improves cutting yield, reduces material loss, and lowers the cost of diamond wire consumption, but also significantly enhances the repeatability and automation of the processing. It meets the comprehensive needs of modern high-end manufacturing for precision, efficiency, and green cutting processes, and is particularly suitable for the batch and efficient processing of key hard and brittle materials in fields such as photovoltaics, integrated circuits, LEDs, and consumer electronics.

[0104] It can be understood that, except for conflicting parts, the above embodiments 1-3 can be freely combined to form other embodiments of the present invention.

[0105] In the description of this invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0106] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium. They can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0107] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that they are in indirect contact through an intermediate medium. Furthermore, "above," "over," or "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," or "beneath" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0108] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to those processes, articles, or apparatus / devices.

[0109] The technical solution of the present invention has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will all fall within the scope of protection of the present invention.

Claims

1. A wire EDM cutting method, characterized in that, The method includes: S1: Fix the bar to be cut on the worktable of the cutting platform and divide the cross-section of the bar into N cutting units; S2: Control the diamond wire to feed a new wire according to the required wire length, and cut each cutting unit step by step according to the divided N-segment cutting units; Specifically, the control of the diamond wire to feed new wire according to the required feed length is as follows: the feed length of the new diamond wire is determined based on environmental factors in the actual cutting process, the cutting speed of the diamond wire, the cutting area of ​​each cutting unit, the area that a unit length of diamond wire can effectively cut per unit time, and the effective length of the diamond wire participating in the cutting process of each cutting unit.

2. The wire EDM cutting method as described in claim 1, characterized in that: Step S2, which involves controlling the diamond wire to feed new wire to the required feed length, specifically includes: S2.1: Determine the correction coefficient based on the environmental factors in the actual cutting process, and obtain the cutting speed of the diamond wire, the cutting area of ​​each cutting unit, the area that a unit length of diamond wire can effectively cut per unit time, and the effective length of the diamond wire participating in the cutting process of each cutting unit. S2.2: Based on the above parameters, the new wire feed length of the diamond wire is obtained. Specifically, the environmental factors in the actual cutting process are determined and corrected by the coefficient (α), the cutting speed of the diamond wire is denoted as (S), the cutting area of ​​each cutting unit is denoted as (A), the area that a unit length of diamond wire can effectively cut per unit time is denoted as (K), and the effective length of the diamond wire participating in the cutting process in each cutting unit is denoted as (L). Then the length of the new diamond wire (V) is α×S×A / [K×L].

3. The wire EDM cutting method as described in claim 2, characterized in that: The determination of the correction coefficient (α) based on environmental factors during the actual cutting process specifically includes: The correction factor (α) is determined by monitoring the coolant flow rate data in real time during the cutting process.

4. The wire EDM cutting method as described in claim 3, characterized in that: N≥2； When the bar stock is a cuboid, A = a × W / N, where a is the length of the bar stock's cross section and W is the height of the bar stock's cross section. When the bar stock is a cylinder, A = 2R / N × [D1 + D2] / 2, where R is the radius of the bar stock, and D1 and D2 are the chord lengths of adjacent arc-shaped sections after segmentation.

5. The wire EDM cutting method as described in claim 4, characterized in that: The method for obtaining the area (K) that the diamond wire of a unit length can effectively cut per unit time includes: The value of (K) is derived by combining the cutting area (A), the number of wire meshes, the cutting speed, and the total length of the diamond wire for each cutting unit.

6. The wire EDM cutting method as described in claim 5, characterized in that: The method for obtaining the effective length (L) of the diamond wire includes: Based on the wire wheel layout and cutting area size of the wire EDM machine, combined with the number of diamond wire winding layers and tension distribution, the value of (L) is obtained.

7. A computer-readable storage medium, characterized in that: The storage medium stores program instructions, which, when executed by a processor, implement the steps of the wire EDM cutting method as described in any one of claims 1-6.

8. A diamond wire cutting machine, characterized in that: Includes a control system, which is configured as follows: It receives input parameters such as cutting speed (S), cutting area (A), effective length of diamond wire (L), and load capacity per unit length of cutting area (K), and dynamically adjusts the correction coefficient (α). Calculate the new line feed length (V) based on V = α × S × A / [K × L].

9. The diamond wire cutting machine according to claim 8, characterized in that: The control system also includes a flow sensor for real-time monitoring of coolant flow rate; The data storage module is used to store a database of the correspondence between the unit length cutting area bearing capacity (K) and the cutting conditions.

10. The diamond wire cutting machine according to claim 8 or 9, characterized in that: The cutting machine is suitable for cutting hard and brittle materials; The hard and brittle material includes silicon wafers, gemstones, or ceramics.

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