Injection molding device for packaging TVs diode

Abstract

The invention relates to the field of injection molding devices, and discloses an injection molding device for TVs diode packaging, the injection molding device comprises an injection molding machine and an injection molding mold communicated with the injection molding machine, the injection molding machine is provided with a feed hopper, the feed hopper is provided with a tank body, and the interior of the tank body is rotatably provided with a drying mechanism for dehumidifying epoxy molding compound particles in different temperature stages; an annular shell protruding outwards is arranged on the outer wall of the tank body, and when the drying mechanism moves downwards, the annular shell provides a receding space for dried epoxy molding compound particles on the upper layer, so that the particles are transferred downwards to the lower layer. According to the injection molding device for TVs diode packaging, through cooperation of staged temperature drying, vacuum dehumidification and particle turning, particle moisture is removed through gradient temperature of multiple layers of drying discs, the vacuum degree of a tank body is increased through a suction mechanism, evaporation is accelerated, particles are evenly heated through shifting pieces, and the defects of injection molding air holes and the like are avoided; the annular shell and the temporary baffle are matched to achieve continuous drying of particles, the efficiency is improved through the layered design, and batch production is adapted.

Description

Technical Field

[0001] This invention relates to the field of injection molding apparatus technology, and more specifically, to an injection molding apparatus for packaging TVs diodes. Background Technology

[0002] A TVS diode (transient voltage suppressor diode) is a specialized circuit protection device whose core function is to protect against instantaneous overvoltages such as lightning strikes and electrostatic discharges. It can rapidly transition from a high-resistance state to a low-resistance state within picoseconds to nanoseconds, dissipating dangerous surge energy to ground or the power line while clamping the voltage within a safe range, thus protecting downstream precision components from damage. Structurally, a TVS diode is similar to a conventional diode, consisting of a PN junction with corresponding electrode leads and a packaged injection molded assembly.

[0003] However, when performing injection molding on TVS diodes, the epoxy molding compound has strong hygroscopic properties. If it contains moisture, it can cause fatal defects such as pores, silver paste breakage, and delamination inside the device at high injection molding temperatures, thus affecting its molding quality. Summary of the Invention

[0004] This invention provides an injection molding apparatus for TVs diode packaging, solving the technical problem in related technologies where moisture in the injection molding apparatus affects the injection molding quality.

[0005] The present invention provides an injection molding apparatus for TVs diode packaging, including an injection molding machine and an injection mold connected to the injection molding machine. The injection molding machine is provided with a feed hopper, and a tank is provided on the feed hopper. The tank is provided with a drying mechanism with temperature-stage dehumidification for epoxy molding compound particles. The outer wall of the tank is provided with an outwardly protruding annular shell. When the drying mechanism moves down, the annular shell provides space for the dried epoxy molding compound granules of the previous layer, allowing the granules to be transferred to the next layer. A drive disc is installed on the outer periphery of the drying mechanism, and a wavy area is formed around the outer periphery of the drive disc; The transmission disc is equipped with a suction mechanism. When the transmission disc rotates, it drives the suction mechanism to extend and retract, thereby continuously evacuating air from the inside of the tank and increasing the vacuum level. At the same time, the change in the length of the suction mechanism drives the agitator to turn the epoxy molding compound granules, achieving simultaneous vacuuming and uniform drying.

[0006] As a further optimization of the present invention, the drying mechanism includes multiple drying discs, a rotating rod and a temporary baffle. The multiple drying discs are distributed in sequence from top to bottom inside the tank. The rotating rod is rotatably disposed in the middle of the tank and is respectively fitted with the transmission disc, the drying disc and the temporary baffle. The temporary baffle is located at the annular shell and has a first position state and a second position state. In the first position state, the temporary baffle releases the seal on the annular shell; In the second position, the drying tray moves down into the annular shell area to discharge the epoxy molding compound particles. At this time, a temporary baffle blocks the bottom of the annular shell to catch the epoxy molding compound particles.

[0007] As a further optimization of the present invention, the temporary baffle is tapered from the outer periphery to the center.

[0008] As a further optimization of the present invention, the rotating rod is connected to a driving component, which includes a drive motor, a linear actuator and a mounting plate. The mounting plate is rotatably sleeved on the rotating rod, the drive motor is mounted on the mounting plate, and gears that drive each other are fitted on the drive shaft of the drive motor and the rotating rod.

[0009] As a further optimization of the present invention, the top of the tank is connected to a feeding hopper, and a shut-off valve is provided at the discharge end of the feeding hopper.

[0010] As a further optimization of the present invention, the suction mechanism includes a sleeve, a moving rod, a spring, a one-way air inlet valve, and a one-way air outlet valve. The sleeve is fitted onto the tank body, with one end of the sleeve extending out of the tank body and being closed, and communicating with the one-way air outlet valve. One end of the moving rod slides into the inside of the sleeve and is connected to the sleeve through the spring. The one-way air inlet valve is assembled at the location of the sleeve inside the tank body, and the end of the moving rod away from the sleeve is engaged with the transmission disc for transmission.

[0011] As a further optimization of the present invention, a groove is provided on the moving rod, and a roller adapted to the transmission disk is rotatably connected to the groove through a rotating shaft.

[0012] As a further optimization of the present invention, a cover plate is installed on the feed hopper, and the cover plate is rotatably connected to a flip cover by a hinge, and the flip cover is fastened to the feed hopper by a snap lock.

[0013] As a further optimization of the present invention, the actuating mechanism includes a paddle and a mounting bracket, the moving rod is connected to the paddle through the mounting bracket, and a flat plate for leveling epoxy molding compound particles is installed inside the can. The bottom of the tank is inclined and equipped with a discharge valve that connects to the feed hopper.

[0014] As a further optimization of the present invention, a toggle plate is connected to the outer periphery of the rotating rod to move the epoxy molding compound particles to the discharge valve.

[0015] The beneficial effects of this invention are as follows: 1. The injection molding device for TVs diode packaging described in this invention significantly reduces the moisture content of epoxy molding compound particles through a triple synergy of "staged temperature drying + vacuum dehumidification + particle turning". The multi-layer drying tray of the drying mechanism removes free water on the particle surface and bound water inside the particles with gradient temperature. The suction mechanism continuously increases the vacuum degree of the tank to accelerate moisture evaporation. The turning mechanism ensures that the particles are heated evenly and avoids localized dampness. This process can completely avoid fatal defects such as pores, silver paste breakage, and delamination caused by moisture under high injection molding temperature, and ensure the structural stability and electrical performance of TVs diode after packaging.

[0016] 2. The injection molding device for TVs diode packaging described in this invention uses an annular shell on the outer wall of the tank to cooperate with a temporary baffle of the drying mechanism. When the drying tray moves down, the annular shell provides space for the dried particles in the upper layer. The temporary baffle accurately receives and releases particles in two position states, avoiding mixing of undried and dried particles, and realizing a continuous process of "upper layer drying - middle layer transfer - lower layer continued drying". The layered drying design results in a small amount of particles in each layer and high heat transfer efficiency. Compared with traditional single-layer drying, the overall drying cycle can be shortened, which is suitable for the mass production needs of TVs diodes. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of an injection molding device for TVs diode packaging proposed in this invention.

[0018] Figure 2 This is a schematic diagram of the structure of an injection molding device for TVs diode packaging proposed in this invention.

[0019] Figure 3 This is a schematic diagram of the internal structure of the can in an injection molding device for TVs diode packaging proposed in this invention.

[0020] Figure 4 This is a schematic diagram of the transmission disk in an injection molding device for TVs diode packaging proposed in this invention.

[0021] Figure 5 This is a schematic diagram of the internal structure of the sleeve in an injection molding device for TVs diode packaging proposed in this invention.

[0022] In the picture: 1. Injection molding machine; 2. Injection mold; 3. Feed hopper; 4. Tank body; 41. Annular shell; 5. Drying mechanism; 51. Drying tray; 52. Rotating rod; 53. Temporary baffle; 6. Transmission disc; 7. Suction mechanism; 71. Sleeve; 72. Moving rod; 73. Spring; 74. One-way air inlet valve; 75. One-way air outlet valve; 76. Roller; 8. Actuating mechanism; 81. Paddle; 82. Mounting bracket; 83. Flat plate; 9. Driving component; 91. Drive motor; 92. Linear actuator; 93. Mounting plate; 94. Gear; 10. Feed hopper; 11. Shut-off valve; 12. Cover plate; 13. Flip cover; 14. Hook and loop lock; 15. Discharge valve; 16. Actuating plate. Detailed Implementation

[0023] The subject matter described herein will now be discussed with reference to exemplary embodiments. It should be understood that these embodiments are discussed only to enable those skilled in the art to better understand and implement the subject matter described herein, and changes may be made to the function and arrangement of the elements discussed without departing from the scope of this specification. Various processes or components may be omitted, substituted, or added as needed in the examples. Furthermore, features described in some examples may be combined in other examples.

[0024] like Figures 1 to 3 As shown in the figure, an injection molding device for TVs diode packaging according to an embodiment of the present invention includes an injection molding machine 1 and an injection mold 2 connected to the injection molding machine 1. The injection molding machine 1 is provided with a feed hopper 3, and the feed hopper 3 is provided with a tank 4. The tank 4 is provided with a drying mechanism 5 that is divided into temperature stages to dehumidify the epoxy molding compound particles. The outer wall of the tank 4 is provided with an outwardly protruding annular shell 41. When the drying mechanism 5 moves down, the annular shell 41 provides space for the dried epoxy molding compound granules of the previous layer, so that the granules can be transferred to the next layer. A drive disc 6 is installed on the outer periphery of the drying mechanism 5, and a wavy area is formed around the outer periphery of the drive disc 6. The transmission disc 6 is coupled with the suction mechanism 7. When the transmission disc 6 rotates, it drives the suction mechanism 7 to extend and retract, thereby continuously evacuating air from the inside of the tank 4 and increasing the vacuum level. At the same time, the change in length of the suction mechanism 7 drives the agitator 8 to turn the epoxy molding compound particles, so as to achieve uniform drying while evacuating vacuum.

[0025] Epoxy molding compound granules first enter the tank 4. The drying mechanism 5 dehumidifies the granules at stages with different temperatures. When the drying mechanism 5 moves downward, the annular shell 41 provides space for the dried granules in the previous layer, and the granules are smoothly transferred to the next layer, realizing orderly transfer and continuous drying of the granules. The drying mechanism 5 drives the transmission disk 6 to rotate. Because the outer circumference of the transmission disk 6 is a wavy area, the rotation will drive the suction mechanism 7 to extend and retract. During the extension and retraction of the suction mechanism 7, the air inside the tank 4 is continuously pumped out, increasing the vacuum degree inside the tank and accelerating the discharge of moisture. At the same time, the change in the length of the suction mechanism 7 drives the turning mechanism 8 to turn the granules, so that the granules are heated evenly, realizing uniform drying while vacuuming.

[0026] After absorbing moisture, epoxy molding compound granules require different drying temperatures at different moisture content stages. In the initial high moisture stage, a lower temperature is needed to remove surface free water first (to avoid high temperature causing a crust to form on the surface of the granules, which would hinder the removal of internal moisture). In the later low moisture stage, a slightly higher temperature is needed to remove internal bound water (to ensure that deep moisture evaporates completely).

[0027] By combining staged drying, orderly particle transfer, vacuuming and turning, the moisture content of epoxy molding compound particles is significantly reduced, avoiding defects such as air holes, silver paste streaking, and delamination caused by moisture during injection molding, thus improving the injection molding quality of TVs diodes.

[0028] like Figure 3 As shown, the drying mechanism 5 includes multiple drying discs 51, a rotating rod 52, and a temporary baffle 53. The drying disc 51 is composed of a disc body and a heating wire. Multiple drying discs 51 are distributed from top to bottom inside the tank body 4. The rotating rod 52 is rotatably set in the middle of the tank body 4 and is respectively fitted with the transmission disc 6, the drying discs 51, and the temporary baffle 53. The temporary baffle 53 is located at the annular shell 41 and has a first position state and a second position state. In the first position state, the temporary baffle 53 releases the seal on the annular shell 41; In the second position, the drying tray 51 moves down into the area of ​​the annular shell 41 to discharge the epoxy molding compound particles. At this time, the temporary baffle 53 blocks the bottom of the annular shell 41 to catch the epoxy molding compound particles.

[0029] When in the first position, the temporary baffle 53 does not block the annular shell 41, and the particles on the drying tray 51 can smoothly enter the annular shell 41 area in subsequent operations.

[0030] When it is necessary to transfer particles, the drying tray 51 moves down into the area of ​​the annular shell 41 to discharge the dried particles. At the same time, the temporary baffle 53 switches to the second position to block the bottom of the annular shell 41, catch the particles, and prevent the particles from falling to the next drying tray 51 (because the particles on the next drying tray 51 have not been completely discharged).

[0031] When the rotating rod 52 rotates, it will drive the drying tray 51 and the temporary baffle 53 to move synchronously, ensuring that drying and particle transfer are carried out in an orderly manner. The two position states of the temporary baffle 53, in coordination with the drying tray 51, realize the precise transfer of particles, avoid mixing of particles that have not been further dried with particles that have been further dried, ensure the drying effect, and further improve the uniformity and efficiency of particle drying. When the drying tray 51 moves up and is in the first position, the epoxy molding compound particles on the drying tray 51 will fall below it.

[0032] The temporary baffle 53 forms a tapered shape from its outer periphery to its center. This tapered design solves the problem of particle accumulation on the temporary baffle 53, ensuring smooth particle transfer, reducing particle residue, and allowing the particles to be more evenly distributed in the subsequent drying process, thus improving the overall drying quality.

[0033] like Figure 3 As shown, the rotating rod 52 is connected to a driving component 9, which includes a drive motor 91, a linear actuator 92, and a mounting plate 93. The linear actuator 92 is a hydraulic cylinder or an electric push rod. The mounting plate 93 is rotatably sleeved on the rotating rod 52. The drive motor 91 is mounted on the mounting plate 93, and gears 94 that drive each other are mounted on the drive shaft of the drive motor 91 and the rotating rod 52. The drive end of the linear actuator 92 is connected to the mounting plate 93.

[0034] When the drive motor 91 is started, its drive shaft drives its own gear 94 to rotate. Through the meshing transmission of the gear 94, the rotating rod 52 is driven to rotate. The rotating rod 52 then drives the drying tray 51, temporary baffle 53 and transmission tray 6 of the drying mechanism 5 to rotate, thereby realizing the functions of drying and transmission.

[0035] When the vertical position of the drying mechanism 5 needs to be adjusted, the linear actuator 92 is activated, pushing or pulling the mounting plate 93 to move axially along the rotating rod 52. The mounting plate 93 drives the drive motor 91 and gear 94 to move synchronously. Since the gear 94 is always meshed with the rotating rod 52, the rotating rod 52 will move up and down with the mounting plate 93, thereby driving the drying mechanism 5 to move up and down, so as to meet the position requirements of the drying mechanism 5 when the particles are transferred.

[0036] like Figure 3 As shown, the top of the tank 4 is connected to a feeding hopper 10, and a shut-off valve 11 is provided at the discharge end of the feeding hopper 10. A linear actuator 92 is installed on the feeding hopper 10.

[0037] When adding epoxy molding compound granules into the tank 4, open the shut-off valve 11. The granules enter the tank 4 from the feeding hopper 10 and fall onto the top drying tray 51. After adding, close the shut-off valve 11 to prevent the tank 4 from communicating with the outside air during the vacuum drying process, and to avoid external moisture entering the tank and affecting the drying effect.

[0038] like Figures 3-5As shown, the suction mechanism 7 includes a sleeve 71, a moving rod 72, a spring 73, a one-way air inlet valve 74, and a one-way air outlet valve 75. The sleeve 71 is fitted onto the tank body 4, with one end of the sleeve 71 extending out of the tank body 4 and being closed, and communicating with the one-way air outlet valve 75. One end of the moving rod 72 slides into the inside of the sleeve 71 and is connected to the sleeve 71 through the spring 73. The one-way air inlet valve 74 is assembled in the sleeve 71 located inside the tank body 4, and the end of the moving rod 72 away from the sleeve 71 is engaged with the transmission disc 6.

[0039] When the drive disc 6 rotates, its wave-like area pushes the moving rod 72 to move axially along the sleeve 71. When the moving rod 72 moves outward from the sleeve 71, the space inside the sleeve 71 increases and the pressure decreases. The one-way air inlet valve 74 opens, and air from the tank 4 enters the sleeve 71. When the wave-like area of ​​the drive disc 6 rotates to its lowest point, the moving rod 72 moves inward from the sleeve 71, the space inside the sleeve 71 decreases and the pressure increases. The one-way exhaust valve 75 opens, expelling the air from the sleeve 71 out of the tank. The drive disc 6 continues to rotate, and the moving rod 72 moves back and forth continuously, achieving continuous air extraction from the inside of the tank 4. The suction mechanism 7 achieves continuous air extraction through mechanical transmission, increasing the vacuum degree inside the tank 4 and accelerating the evaporation and discharge of moisture from the epoxy molding compound particles.

[0040] To increase the smoothness of transmission, a groove is provided on the moving rod 72, and a roller 76 adapted to the transmission disc 6 is rotatably connected to the groove through a rotating shaft.

[0041] like Figure 3 As shown, a cover plate 12 is installed on the feed hopper 3. The cover plate 12 is rotatably connected to a flip cover 13 via a hinge, and the flip cover 13 is fastened to the feed hopper 3 via a latch lock 14.

[0042] When it is necessary to add other materials into the feed hopper 3, open the latch lock 14 and rotate the flip cover 13 around the hinge to open the feed hopper 3; after the operation is completed, close the flip cover 13 and fasten it to the feed hopper 3 through the latch lock 14 to achieve sealing of the feed hopper 3.

[0043] like Figure 3 As shown, the actuating mechanism 8 includes a paddle 81 and a mounting bracket 82. The moving rod 72 is connected to the paddle 81 through the mounting bracket 82. A flat plate 83 for smoothing epoxy molding compound particles is installed inside the tank body 4. The bottom of the tank 4 is inclined and is equipped with a discharge valve 15 that communicates with the feed hopper 3.

[0044] When the moving rod 72 moves back and forth, it drives the paddle 81 to move synchronously through the mounting bracket 82. During the movement, the paddle 81 flips the epoxy molding compound granules in the tank 4, so that the granules are heated evenly and the clumps of granules are broken up. The flat plate 83 plays a role in leveling the granules, preventing the granules from piling up too high in some areas in the tank 4, ensuring that the granule layer thickness is uniform, which is conducive to the drying mechanism 5 to heat and dehumidify the granules evenly. The dried granules finally fall into the inclined bottom of the tank 4. Due to the inclination of the bottom, the granules gather towards the discharge valve 15 under the action of gravity. When the discharge valve 15 is opened, the granules can enter the feed hopper 3 and then enter the injection molding machine 1.

[0045] To improve the discharge effect, a toggle plate 16 is connected to the outer periphery of the rotating rod 52 to move the epoxy molding compound particles to the discharge valve 15.

[0046] The embodiments of the present invention have been described above. However, the embodiments are not limited to the specific implementation methods described above. The specific implementation methods described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present embodiments, all of which are within the protection scope of the present embodiments.

Claims

1. A TV diode package injection molding device, comprising an injection molding machine (1) and an injection molding mold (2) in communication with the injection molding machine (1), and a feeding hopper (3) is arranged on the injection molding machine (1), characterized in that: a tank body (4) is arranged on the feeding hopper (3), and a drying mechanism (5) for dehumidifying epoxy molding powder in different temperature stages is rotatably arranged in the tank body (4); an annular shell (41) is arranged on the outer wall of the tank body (4), and when the drying mechanism (5) moves downward, the annular shell (41) provides a space for the epoxy molding powder in the last layer which has been dried, so that the powder can be transferred to the next layer; a transmission disc (6) is mounted on the outer periphery of the drying mechanism (5), and a wave area is formed on one circle of the outer periphery of the transmission disc (6); the transmission disc (6) is drivingly matched with a suction mechanism (7), and when the transmission disc (6) rotates, the suction mechanism (7) is driven to produce extension and contraction, so as to continuously suck air in the tank body (4) and improve the vacuum degree, and at the same time, the length change of the suction mechanism (7) drives the epoxy molding powder to be turned over through a poking mechanism (8). The drying mechanism (5) comprises a plurality of drying discs (51), a rotating rod (52) and a temporary baffle (53), the plurality of drying discs (51) are arranged in the tank body (4) from top to bottom, the rotating rod (52) is rotatably arranged in the middle of the tank body (4) and is sleeved with the transmission disc (6), the drying disc (51) and the temporary baffle (53), the temporary baffle (53) is located at the annular shell (41) and has a first position state and a second position state; In the first position state, the temporary baffle (53) unblocks the annular shell (41); in the second position state, the drying disc (51) moves downward into the annular shell (41) to discharge the epoxy molding powder, and at this time, the temporary baffle (53) blocks the bottom end of the annular shell (41) to receive the epoxy molding powder. The temporary baffle (53) is tapered from the outer periphery to the middle. The rotating rod (52) is connected with a driving member (9), the driving member (9) comprises a driving motor (91), a linear actuator (92) and a mounting plate (93), the mounting plate (93) is rotatably sleeved on the rotating rod (52), the driving motor (91) is mounted on the mounting plate (93), gear (94) which is drivingly matched with each other is sleeved on the driving shaft of the driving motor (91) and the rotating rod (52), and the driving end of the linear actuator (92) is connected with the mounting plate (93).

2. The injection molding apparatus for TV diode package as claimed in claim 1, wherein: A feeding hopper (10) is in communication with the top of the tank body (4), and a stop valve (11) is arranged at the discharging end of the feeding hopper (10). ​ ​ 3. The injection molding apparatus for TV diode package as claimed in claim 1, wherein: ​ 4. The injection molding apparatus for TVS diode package according to claim 2, wherein: ​ 5. The injection molding apparatus for TVS diode package as claimed in claim 4, wherein: ​ 6. The injection molding apparatus for TVS diode package as claimed in claim 4, wherein: The suction mechanism (7) comprises a sleeve (71), a moving rod (72), a spring (73), a one-way air inlet valve (74) and a one-way air outlet valve (75), the sleeve (71) is sleeved on the tank body (4), one end of the sleeve (71) extends outside the tank body (4), is closed and arranged, and is in communication with the one-way air outlet valve (75), one end of the moving rod (72) slides into the inside of the sleeve (71) and is connected with the sleeve (71) through the spring (73), the one-way air inlet valve (74) is assembled at the position of the sleeve (71) inside the tank body (4), and the end, away from the sleeve (71), of the moving rod (72) is in transmission cooperation with the transmission disc (6).

7. The injection molding apparatus for TVS diode package as claimed in claim 6, wherein: A groove is formed in the moving rod (72), and a roller (76) matched with the transmission disc (6) is rotatably connected to the groove through a rotating shaft.

8. The injection molding apparatus for TVS diode package as claimed in claim 4, wherein: The feeding hopper (3) is provided with a cover plate (12), the cover plate (12) is rotatably connected with a turnover cover (13) through a hinge, and the turnover cover (13) is buckled with the feeding hopper (3) through a buckle lock (14).

9. The injection molding device for TV diode packaging according to claim 8, characterized in that: The dial mechanism (8) comprises a dial piece (81) and a mounting frame (82), the moving rod (72) is connected with the dial piece (81) through the mounting frame (82), and a flat plate (83) for leveling epoxy molding particles is arranged in the inside of the tank body (4).

10. The injection molding apparatus for TV diode package as claimed in claim 9, wherein: The outer periphery of the rotating rod (52) is connected with a dial plate (16) for dialing the epoxy molding particles to the discharging valve (15).

Images