Slag adhering conveyor, laser machining device and workpiece machining method

Abstract

The invention provides a hanging slag conveyor, a laser processing device and a workpiece processing method. The adhering slag conveyor includes: a set of conveying plates including a first conveying plate extending in a first direction and a second conveying plate disposed adjacent to the first conveying plate and extending in the first direction, the conveying plates conveying adhering slag generated by irradiating a workpiece with laser light; a first temperature rise suppression surface that covers at least a portion of the first transport plate and suppresses temperature rise of the first transport plate due to energy of the laser light; and a second temperature rise suppression surface that covers at least a portion of the second transport plate and suppresses temperature rise of the second transport plate due to energy of the laser light.

Description

Technical Field

[0001] This invention relates to a slag-coating conveyor, a laser processing device, and a workpiece processing method. Background Technology

[0002] Laser processing machines that include a chip conveyor are known.

[0003] As a related technology, Patent Document 1 discloses a chip conveyor for a laser processing machine. The chip conveyor described in Patent Document 1 has multiple plates constituting a conveyor belt. Each plate is flexibly connected to the other plates via joints.

[0004] Patent Document 1: Microfilm of Japanese Patent Application No. 3-19091 (Japanese Patent Application No. 4-108984) Summary of the Invention

[0005] The purpose of this invention is to provide a slag-carrying conveyor, a laser processing device, and a workpiece processing method that can suppress thermal deformation of the conveyor plate.

[0006] Some embodiments of the slag-coating conveyor include: a set of conveying plates, comprising a first conveying plate extending in a first direction and a second conveying plate disposed adjacent to the first conveying plate and extending in the first direction, for conveying slag generated by irradiating a workpiece with a laser; a first temperature-inhibiting surface covering at least a portion of the first conveying plate to inhibit the first conveying plate from heating up due to the energy of the laser; and a second temperature-inhibiting surface covering at least a portion of the second conveying plate to inhibit the second conveying plate from heating up due to the energy of the laser.

[0007] Some embodiments of the slag-coating conveyor include a set of conveyor plates, said set of conveyor plates comprising a first conveyor plate extending in a first direction and a second conveyor plate disposed adjacent to the first conveyor plate and extending in the first direction, for conveying slag generated by irradiating a workpiece with a laser. The main material of the first conveyor plate is copper, a copper alloy, aluminum, or an aluminum alloy, and at least a portion of the first conveying surface of the first conveyor plate is made of copper, a copper alloy, aluminum, or an aluminum alloy. The main material of the second conveyor plate is copper, a copper alloy, aluminum, or an aluminum alloy, and at least a portion of the second conveying surface of the second conveyor plate is made of copper, a copper alloy, aluminum, or an aluminum alloy.

[0008] Some embodiments of a laser processing apparatus include: a laser irradiation device comprising a laser head for irradiating a workpiece with a laser; a moving device for moving the laser head relative to a workpiece support member supporting the workpiece; a control device for controlling the laser irradiation device and the moving device; and a slag conveyor. The slag conveyor includes: a set of conveyor plates comprising a first conveyor plate extending in a first direction and a second conveyor plate disposed adjacent to the first conveyor plate and extending in the first direction, for conveying slag generated by irradiating the workpiece with the laser; a first temperature-inhibiting surface covering at least a portion of the first conveyor plate to inhibit the first conveyor plate from heating due to the energy of the laser; and a second temperature-inhibiting surface covering at least a portion of the second conveyor plate to inhibit the second conveyor plate from heating due to the energy of the laser.

[0009] Some embodiments of a workpiece processing method include: a step of processing the workpiece by irradiating it with a laser; and a step of conveying slag generated by irradiating the workpiece with the laser using a set of conveyor plates, including a first conveyor plate extending in a first direction and a second conveyor plate disposed adjacent to the first conveyor plate and extending in the first direction. The workpiece processing step is performed while the first conveyor plate is prevented from heating up due to the laser energy by a first heating-suppressing surface covering at least a portion thereof. The workpiece processing step is also performed while the second conveyor plate is prevented from heating up due to the laser energy by a second heating-suppressing surface covering at least a portion thereof.

[0010] According to the present invention, a slag-carrying conveyor, a laser processing apparatus, and a workpiece processing method capable of suppressing thermal deformation of the conveyor plate can be provided. Attached Figure Description

[0011] Figure 1 This is a schematic cross-sectional view of the laser processing apparatus according to the first embodiment. Figure 2 This is a schematic cross-sectional view illustrating a portion of the laser processing apparatus according to the first embodiment. Figure 3 This is a schematic cross-sectional view of a portion of a comparative example laser processing apparatus. Figure 4 This is a schematic perspective view of the laser processing apparatus according to the first embodiment. Figure 5 It is a schematic perspective view showing a set of conveyor plates, including a first conveyor plate and a second conveyor plate, that can move along a circular track. Figure 6 This is a schematic perspective view of the slag conveyor of the first embodiment. Figure 7 It is an exploded perspective view schematically representing a portion of a set of conveyor plates. Figure 8 This diagram schematically illustrates the installation of a first conveyor plate on a first annular chain and a second annular chain. Figure 9 This is a schematic cross-sectional view used to illustrate the first and second conveyor plates. Figure 10 This is a schematic perspective view used to illustrate the first and second conveyor plates. Figure 11 This is a schematic cross-sectional view showing the enlarged rotating part of the slag conveyor of the first embodiment. Figure 12 This is a schematic cross-sectional view illustrating a portion of the laser processing apparatus according to the first embodiment. Figure 13 This is a schematic three-dimensional diagram illustrating the first example of a surface designed to suppress temperature rise. Figure 14 This is a schematic cross-sectional view illustrating a portion of the laser processing apparatus according to the first embodiment. Figure 15 This is a schematic cross-sectional view illustrating a portion of the laser processing apparatus according to the first embodiment. Figure 16 This is a schematic perspective view illustrating a second example of a surface designed to suppress temperature rise. Figure 17 This is a schematic cross-sectional view illustrating a portion of the laser processing apparatus according to the first embodiment. Figure 18 This is a schematic cross-sectional view illustrating a portion of the laser processing apparatus according to the first embodiment. Figure 19 This is a schematic cross-sectional view illustrating a portion of the laser processing apparatus according to the first embodiment. Figure 20 This is a schematic perspective view of the fourth example used to illustrate a surface for suppressing temperature rise. Figure 21 This is a schematic perspective view of the fourth example used to illustrate a surface for suppressing temperature rise. Figure 22 This is a schematic perspective view of the fourth example used to illustrate a surface for suppressing temperature rise. Figure 23 This is a schematic perspective view of the fourth example used to illustrate a surface for suppressing temperature rise. Figure 24 This is a schematic cross-sectional view illustrating a portion of the laser processing apparatus according to the first embodiment. Figure 25 It is a schematic cross-sectional view illustrating a set of conveyor plates encircling a track with an incline. Figure 26 This is a schematic side view of the laser processing apparatus according to the first embodiment. Figure 27 This is a schematic top view illustrating a portion of the laser processing apparatus according to the first embodiment. Figure 28 This is a schematic perspective view illustrating an example of a workpiece support component. Figure 29 This is a schematic perspective view of a laser processing apparatus of a first modified example of the first embodiment. Figure 30 It is a schematic top view showing the process of removing the finished workpiece from the workpiece support member. Figure 31 This is a schematic perspective view of a laser processing apparatus, representing a second variation of the first embodiment. Figure 32 This diagram schematically illustrates a situation where a control device can control multiple controlled objects. Figure 33 This is a schematic side view of the laser processing apparatus according to the first embodiment. Figure 34 This is a schematic cross-sectional view of a portion of a laser processing apparatus that includes a cooling device. Figure 35 This is a schematic cross-sectional view illustrating the laser processing apparatus of the second embodiment. Figure 36 This is a schematic cross-sectional view illustrating a portion of the laser processing apparatus according to the second embodiment. Figure 37 It is an exploded perspective view schematically representing a portion of a set of conveyor plates. Figure 38 It is a schematic perspective view showing a set of conveyor plates, including a first conveyor plate and a second conveyor plate, that can move along a circular track. Figure 39 This is a schematic cross-sectional view illustrating a portion of the laser processing apparatus according to the second embodiment. Figure 40 This is a schematic cross-sectional view illustrating a portion of the laser processing apparatus according to the second embodiment. Figure 41 This is a schematic cross-sectional view illustrating a portion of the laser processing apparatus according to the second embodiment. Figure 42 This is a flowchart illustrating an example of a workpiece processing method according to the third embodiment. Detailed Implementation

[0012] The following description, with reference to the accompanying drawings, will explain the slag conveyor 2, the laser processing apparatus 1, and the workpiece processing method according to the embodiments. Furthermore, in the following description of the embodiments, parts and components with the same function will be labeled with the same reference numerals, and repeated descriptions of parts and components labeled with the same reference numerals will be omitted.

[0013] (Definition of the term) like Figure 2 As illustrated, a set of conveyor plates 3 each has a conveying surface 3u. In this specification, a conveying surface refers to the surface that directly or indirectly supports the slag during conveying. More specifically, the conveying surface 3u is the surface that faces approximately upwards during slag conveying.

[0014] like Figure 2 As illustrated, each of the conveyor plates 3 has a back surface 3n. In this specification, the back surface refers to the side of each conveyor plate opposite to the conveying surface 3u. More specifically, the back surface 3n is the side that faces approximately downwards when conveying slag.

[0015] In this specification, the area that the laser emitted from the laser irradiation device 60 can reach is defined as the "processing area RG1" (refer to...). Figure 1 The workpiece W, positioned in the processing area RG1, is laser-processed (more specifically, cut or perforated). The dross generated by irradiating the workpiece W with a laser is received in the processing area RG1 by a set of conveyor plates 3.

[0016] (Definition of direction) In this specification, the extending direction of the first conveyor plate 3-1 (or the extending direction of each conveyor plate 3) is defined as the first direction DR1. In this specification, the moving direction of a group of conveyor plates 3 (or the moving direction of each conveyor plate 3) is defined as the second direction DR2. For example... Figure 5 As illustrated, in this specification, the inner side of the surrounding track OB of a set of conveyor plates 3 (refer to the inner side of the track OB) will be used. Figure 5 The direction (with the shaded area formed by the dots) towards the outside of the orbit OB is defined as the third direction DR3, and the direction opposite to the third direction DR3 is defined as the fourth direction DR4. For example... Figure 2 As illustrated, the third-direction DR3 is the direction from the first back surface 3n-1 of the first conveyor plate 3-1 toward the first conveying surface 3u-1 of the first conveyor plate 3-1. Furthermore, the third-direction DR3 is the direction from the second back surface 3n-2 of the second conveyor plate 3-2 toward the second conveying surface 3u-2 of the second conveyor plate 3-2. Figure 2As illustrated, the fourth direction DR4 is from the first conveying surface 3u-1 of the first conveyor plate 3-1 toward the first back surface 3n-1 of the first conveyor plate 3-1. Furthermore, the fourth direction DR4 is from the second conveying surface 3u-2 of the second conveyor plate 3-2 toward the second back surface 3n-2 of the second conveyor plate 3-2.

[0017] (First Implementation) Reference Figures 1 to 34 The slag conveyor 2A and the laser processing apparatus 1A of the first embodiment will be described. Figure 1 This is a schematic cross-sectional view of the laser processing apparatus 1A according to the first embodiment. Figure 2 This is a schematic cross-sectional view of a portion of the laser processing apparatus 1A according to the first embodiment. Figure 3 This is a schematic cross-sectional view of a portion of a comparative example laser processing apparatus. Figure 4 This is a schematic perspective view of the laser processing apparatus 1A according to the first embodiment. Figure 5 This is a schematic perspective view showing a set of conveyor plates 3, including a first conveyor plate 3-1 and a second conveyor plate 3-2, that can move along the surrounding track OB. Figure 6 This is a schematic perspective view of the slag-hanging conveyor 2A according to the first embodiment. Figure 7 It is an exploded perspective view schematically representing a portion of a set of conveyor plates 3. Figure 8 This is a schematic diagram showing the first conveyor plate 3-1 installed on the first annular chain 21a and the second annular chain 22a. Figure 9 This is a schematic cross-sectional view used to illustrate the first conveyor plate 3-1 and the second conveyor plate 3-2. Figure 10 This is a schematic perspective view used to illustrate the first conveyor plate 3-1 and the second conveyor plate 3-2. Figure 11 This is a schematic cross-sectional view showing the enlarged rotating part of the slag conveyor 2A of the first embodiment. Figure 12 This is a schematic cross-sectional view of a portion of the laser processing apparatus 1A according to the first embodiment. Figure 13 This is a schematic three-dimensional diagram illustrating the first example of a surface designed to suppress temperature rise. Figure 14 This is a schematic cross-sectional view of a portion of the laser processing apparatus 1A according to the first embodiment. Figure 15 This is a schematic cross-sectional view of a portion of the laser processing apparatus 1A according to the first embodiment. Figure 16 This is a schematic perspective view illustrating a second example of a surface designed to suppress temperature rise. Figure 17 This is a schematic cross-sectional view of a portion of the laser processing apparatus 1A according to the first embodiment. Figure 18 This is a schematic cross-sectional view of a portion of the laser processing apparatus 1A according to the first embodiment. Figure 19This is a schematic cross-sectional view of a portion of the laser processing apparatus 1A according to the first embodiment. Figures 20 to 23 This is a schematic perspective view of the fourth example used to illustrate a surface for suppressing temperature rise. Figure 24 This is a schematic cross-sectional view of a portion of the laser processing apparatus 1A according to the first embodiment. Figure 25 This is a schematic cross-sectional view illustrating the case where a set of conveyor plates 3 surrounds the track OB, including the ramp CL. Figure 26 This is a schematic side view of the laser processing apparatus 1A according to the first embodiment. Figure 27 This is a schematic top view illustrating a portion of the laser processing apparatus 1A according to the first embodiment. Figure 28 This is a schematic perspective view of an example of a workpiece support member 90. Figure 29 This is a schematic perspective view of a laser processing apparatus 1A, representing a first variation of the first embodiment. Figure 30 This is a schematic top view showing the process of removing the machined workpiece Wb from the workpiece support member 90. Figure 31 This is a schematic perspective view of a laser processing apparatus 1A, representing a second variation of the first embodiment. Figure 32 This diagram schematically illustrates a situation where the control device 8 can control multiple controlled objects. Figure 33 This is a schematic side view of the laser processing apparatus 1A according to the first embodiment. Figure 34 This is a schematic cross-sectional view of a portion of a laser processing apparatus including a cooling device 95.

[0018] like Figure 2 As illustrated, the slag conveyor 2A of the first embodiment includes a set of conveyor plates 3.

[0019] A set of conveyor plates 3 transports the slag D generated by irradiating the workpiece W with laser LB. In addition to transporting the slag D, the set of conveyor plates 3 can also transport the cut pieces CF generated by irradiating the workpiece W with laser LB.

[0020] Furthermore, in this specification, dross refers to an irregularly shaped block (in other words, a block of random shape) formed by the solidification of material (more specifically, metallic material) melted by laser irradiation.

[0021] A set of conveyor plates 3 includes a first conveyor plate 3-1 extending in the first direction DR1, and a second conveyor plate 3-2 extending in the first direction DR1. Each of the conveyor plates 3 is an elongated plate with the first direction DR1 as its long side. Figure 2 In the example described, the second conveyor plate 3-2 is arranged adjacent to the first conveyor plate 3-1.

[0022] exist Figure 2 In the recorded example, the laser LB passes through workpiece W and reaches the slag-coating conveyor 2A. For example... Figure 3 As illustrated, if laser LB reaches conveyor plate 3, conveyor plate 3 undergoes thermal deformation. Figure 3 In the documented example, because the laser LB reaches multiple conveyor plates 3 respectively, the multiple conveyor plates 3 irregularly deflect in a third direction DR3 (more specifically, deflect due to thermal deformation). The conveyor plates 3 are designed to suppress excessive deflection and also have sufficient resistance to thermal deformation. In particular, as shown in the example... Figure 3 The conveyor plate 3 shown has high bending stiffness and is difficult to bend. However, if the power of the laser LB is increased or the energy density of the laser LB is made greater, even as... Figure 3 The conveyor plate 3 shown in the diagram is also susceptible to excessive thermal deformation. Furthermore, if the thermal deformation of the conveyor plate 3 is excessive, it may hinder the smooth movement of a set of conveyor plates 3.

[0023] like Figure 2 As illustrated, the slag conveyor 2A of the first embodiment includes a first temperature-inhibiting surface 4-1 and a second temperature-inhibiting surface 4-2.

[0024] The first temperature-inhibiting surface 4-1 covers at least a portion of the surface of the first conveyor plate 3-1. Furthermore, the first temperature-inhibiting surface 4-1 inhibits the first conveyor plate 3-1 from heating up due to the energy of the laser LB. Figure 2 In the described example, the first temperature-inhibiting surface 4-1 includes the surface of a first laser reflective layer 4r-1 that covers at least a portion of the first conveying surface 3u-1 of the first conveying plate 3-1.

[0025] The second temperature-inhibiting surface 4-2 covers at least a portion of the surface of the second conveyor plate 3-2. Furthermore, the second temperature-inhibiting surface 4-2 inhibits the second conveyor plate 3-2 from heating up due to the energy of the laser LB. Figure 2 In the described example, the second temperature-inhibiting surface 4-2 includes the surface of the second laser reflective layer 4r-2 that covers at least a portion of the second conveying surface 3u-2 of the second conveying plate 3-2.

[0026] In the slag-coating conveyor 2A of the first embodiment, the first laser reflective layer 4r-1 covering at least a portion of the first conveying surface 3u-1 effectively reflects the laser LB emitted from the laser irradiation device 60. This suppresses heat input toward the first conveying plate 3-1, inhibiting thermal deformation and deflection of the first conveying plate 3-1. Furthermore, the second laser reflective layer 4r-2 covering at least a portion of the second conveying surface 3u-2 effectively reflects the laser LB emitted from the laser irradiation device 60. This suppresses heat input toward the second conveying plate 3-2, inhibiting thermal deformation and deflection of the second conveying plate 3-2. Therefore, a set of conveying plates 3 including the first conveying plate 3-1 and the second conveying plate 3-2 can move smoothly.

[0027] like Figure 1 As illustrated, the laser processing apparatus 1A of the first embodiment includes: the aforementioned slag conveyor 2A; a laser irradiation device 60, comprising a laser head 61 that irradiates a workpiece W with laser LB; a moving device 7 that moves the laser head 61 relative to a workpiece support member 90 supporting the workpiece W; and a control device 8 that controls the laser irradiation device 60 and the moving device 7. Furthermore, the control device 8 may function as a single computer, or it may function as a control device 8 through the cooperation of multiple computers.

[0028] The laser processing apparatus 1A of the first embodiment achieves the same effect as the slag conveyor 2A of the first embodiment.

[0029] (arbitrarily added structure) Next, refer to Figures 1 to 34 Any additional structures that can be used in the slag conveyor 2A and laser processing apparatus 1A of the first embodiment (or the slag conveyor 2B and laser processing apparatus 1B of the second embodiment described later) will be described.

[0030] (Slag Conveyor 2A) exist Figure 1 In the example described, a portion of the slag-coating conveyor 2A is positioned directly below the laser irradiation device 60. Furthermore, a set of conveyor plates 3 of the slag-coating conveyor 2A is configured to move across the processing area RG1 (more specifically, the area directly below the laser irradiation device 60).

[0031] exist Figure 1 In the documented example, a set of conveyor plates 3 transports slag from processing area RG1 to discharge area RG2. Figure 1In the described example, a set of conveyor plates 3 rotates (more specifically, rotates 180 degrees about a horizontal axis) in the discharge zone RG2. As a result, the slag D conveyed by the set of conveyor plates 3 is discharged from the set of conveyor plates 3 into the container 13 in the discharge zone RG2. Furthermore, the cut piece CF (see reference...) is conveyed by the set of conveyor plates 3... Figure 2 In the case of ), the cut piece CF is also discharged from a set of conveyor plates 3 to container 13 in the discharge area RG2.

[0032] exist Figure 4 In the described example, the slag-hanging conveyor 2A includes a first annular component 21, a second annular component 22, and a drive unit 29. The first annular component 21 and the second annular component 22 support a set of conveyor plates 3. More specifically, a set of conveyor plates 3 is mounted on the first annular component 21 and the second annular component 22.

[0033] The first annular member 21 and the second annular member 22 are driven directly or indirectly by the drive device 29. More specifically, the first annular member 21 is driven directly or indirectly by the drive device 29 to travel along the first circular track B1 (see reference). Figure 5 The second annular member 22 is driven directly or indirectly by the drive device 29 to travel along the second annular track B2 (see reference 1) which is parallel to the first annular track B1. Figure 5 The distance between the first orbital track B1 and the second orbital track B2 (in other words, the distance between the first orbital track B1 and the second orbital track B2 in the direction along the first direction DR1) is, for example, more than 1m and less than 3m.

[0034] exist Figure 6 In the recorded example, the first ring member 21 is the first ring chain 21a, and the second ring member 22 is the second ring chain 22a. Figure 6 In the described example, the slag-coating conveyor 2 has multiple sprockets 28, including a first sprocket 28a, a second sprocket 28b, a third sprocket 28c, and a fourth sprocket 28d. A first annular chain 21a engages at least with the first sprocket 28a and the second sprocket 28b (more specifically, the first annular chain 21a is at least wound around the first sprocket 28a and the second sprocket 28b). Furthermore, a second annular chain 22a engages at least with the third sprocket 28c and the fourth sprocket 28d (more specifically, the second annular chain 22a is at least wound around the third sprocket 28c and the fourth sprocket 28d).

[0035] exist Figure 6 In the recorded example, the first ring chain 21a is driven by the drive device 29 at least by the first sprocket 28a, and the second ring chain 22a is driven by the drive device 29 at least by the third sprocket 28c.

[0036] A set of conveyor plates 3 moves along the circular track OB. For example... Figure 5 As illustrated, the surrounding track OB of a set of conveyor plates 3 is parallel to the first surrounding track B1 of the first annular chain 21a and parallel to the second surrounding track B2 of the second annular chain 22a.

[0037] (One set of conveyor plates 3) like Figure 2 As illustrated, a set of conveyor plates 3 respectively conveys a portion of multiple slag plates D generated by irradiating the workpiece W with a laser LB, which are heated by the laser LB. For example, the first conveyor plate 3-1 and the second conveyor plate 3-2 respectively convey a portion of the multiple slag plates D generated by irradiating the workpiece W with a laser LB, which are heated by the laser LB. A set of conveyor plates 3 can be composed of a single component or an assembly of multiple components.

[0038] exist Figure 2 In the described example, the slag-hanging conveyor 2A has a set of conveyor plates 3, which includes a first conveyor plate 3-1, a second conveyor plate 3-2, and a third conveyor plate 3-3. The set of conveyor plates 3 extends along a first direction DR1. The number of conveyor plates 3 in a set of conveyor plates 3 is, for example, 20 or more, 50 or more, or 80 or more. In this specification, the number of conveyor plates 3 in a set of conveyor plates 3 is defined as "N". "N" is, for example, a natural number of 20 or more.

[0039] When "K" is defined as any natural number greater than 1 and less than "N-1", the (K+1)th conveyor plate is arranged adjacent to the Kth conveyor plate. Furthermore, the first conveyor plate 3-1 is arranged adjacent to the Nth conveyor plate. Thus, a group of conveyor plates 3 are arranged in a ring. For example, the second conveyor plate 3-2 is arranged adjacent to the first conveyor plate 3-1 and adjacent to the third conveyor plate 3-3.

[0040] A set of conveyor plates 3 each has a front end 3f, a rear end 3e, and an intermediate portion 3m connecting the front end 3f and the rear end 3e. Furthermore, in Figure 2 In the example described, the front end 3f of each conveyor plate 3 is the end on the front side of the movement direction (in other words, the end on the side of the second direction DR2), and the rear end 3e of each conveyor plate 3 is the end on the rear side of the movement direction (in other words, the end on the side opposite to the second direction DR2).

[0041] exist Figure 2In the described example, the front end 3f of each conveyor plate 3 is configured to overlap with the rear end 3e of another adjacent conveyor plate 3 when viewed from above (in other words, when viewed along the fourth direction DR4), and the rear end 3e of each conveyor plate 3 is configured to overlap with the front end 3f of yet another adjacent conveyor plate when viewed from above (in other words, when viewed along the fourth direction DR4).

[0042] For example, the first front end portion 3f-1 of the first conveyor plate 3-1 is configured to overlap the rear ends portion 3e-N of the other conveyor plates 3-N when viewed from above (in other words, when viewed along the fourth direction DR4). More specifically, the rear ends portion 3e-N of the other conveyor plates 3-N are covered by the first front end portion 3f-1 of the first conveyor plate 3-1.

[0043] For example, the first rear end portion 3e-1 of the first conveyor plate 3-1 is configured to overlap with the second front end portion 3f-2 of the second conveyor plate 3-2 when viewed from above (in other words, when viewed along the fourth direction DR4). More specifically, the first rear end portion 3e-1 of the first conveyor plate 3-1 is covered by the second front end portion 3f-2 of the second conveyor plate 3-2.

[0044] For example, the second rear end portion 3e-2 of the second conveyor plate 3-2 is configured to overlap with the third front end portion 3f-3 of the third conveyor plate 3-3 when viewed from above. More specifically, the second rear end portion 3e-2 of the second conveyor plate 3-2 is covered by the third front end portion 3f-3 of the third conveyor plate 3-3.

[0045] like Figure 7 As illustrated, a set of conveyor plates 3 each has a left end 3a and a right end 3b. Figure 7 In the recorded example, when the conveying surface 3u of the conveying plate 3 is viewed from the rear end 3e toward the front end 3f, the left end 3a of each conveying plate 3 is the left end, and when the conveying surface 3u of the conveying plate 3 is viewed from the rear end 3e toward the front end 3f, the right end 3b of each conveying plate 3 is the right end.

[0046] The first conveyor plate 3-1 has a first front end 3f-1, a first rear end 3e-1, a first intermediate portion 3m-1 connecting the first front end 3f-1 and the first rear end 3e-1, a left end 3a-1, and a right end 3b-1.

[0047] The second conveyor plate 3-2 has a second front end portion 3f-2, a second rear end portion 3e-2, a second intermediate portion 3m-2 connecting the second front end portion 3f-2 and the second rear end portion 3e-2, a left end portion 3a-2, and a right end portion 3b-2.

[0048] The third conveyor plate 3-3 has a third front end 3f-3, a third rear end 3e-3, a third intermediate portion 3m-3 connecting the third front end 3f-3 and the third rear end 3e-3, a left end 3a-3, and a right end 3b-3.

[0049] The length of each of the conveyor plates 3 (more specifically, the length along the first direction DR1) is, for example, more than 1m and less than 3m. The length L1 of the first conveyor plate 3-1 is, for example, more than 1m and less than 3m, and the length of the second conveyor plate 3-2 is, for example, more than 1m and less than 3m.

[0050] The width of each of the conveyor plates 3 (more specifically, the width of each of the conveyor plates 3 in the direction along the second direction DR2) is, for example, 40 mm or more and 200 mm or less. The width W1 of the first conveyor plate 3-1 is, for example, 40 mm or more and 200 mm or less, and the width W2 of the second conveyor plate 3-2 is, for example, 40 mm or more and 200 mm or less.

[0051] Each of the three conveyor plates has a thickness of, for example, less than 5 mm or less than 3 mm. Figure 7 In the described example, the thickness of the first front end portion 3f-1 of the first conveyor plate 3-1 is approximately fixed, and the thickness of the first rear end portion 3e-1 of the first conveyor plate 3-1 is approximately fixed. Furthermore, the thickness of the first middle portion 3m-1 of the first conveyor plate 3-1 is approximately fixed. Figure 7 In the recorded example, the thickness of the first conveyor plate 3-1 is generally fixed.

[0052] Each set of conveyor plates 3 is made of metal. For example, each set of conveyor plates 3 is made of steel, and more specifically, of hot-rolled mild steel plate, cold-rolled steel plate, or cold-rolled stainless steel plate.

[0053] The left end 3a of each of a set of conveyor plates 3 is mounted to the first annular member 21 (more specifically, the first annular chain 21a). In addition, the right end 3b of each of a set of conveyor plates 3 is mounted to the second annular member 22 (more specifically, the second annular chain 22a).

[0054] exist Figure 7 In the described example, a hole h1 for inserting a bolt is formed at the left end 3a-1 of the first conveyor plate 3-1, and a hole h2 for inserting a bolt is formed at the right end 3b-1 of the first conveyor plate 3-1. Figure 8 In the recorded example, the left end 3a-1 of the first conveyor plate 3-1 is mounted to the first annular chain 21a by means of bolt BT, and the right end 3b-1 of the first conveyor plate 3-1 is mounted to the second annular chain 22a by means of bolt BT. (As from...) Figure 2As is known, the first conveyor plate 3-1 is not connected to any adjacent conveyor plates. Therefore, if the first conveyor plate 3-1 is damaged, it is easy to replace the first conveyor plate 3-1 with a new one.

[0055] exist Figure 9 In the example described, the first conveyor plate 3-1 has a first conveyor surface 3u-1 and a first back surface 3n-1.

[0056] When the slag is conveyed by the first conveyor plate 3-1, the first conveying surface 3u-1 directly or indirectly supports the slag, either by means of a first laser reflective layer or the like. When the slag is conveyed by the first conveyor plate 3-1, the first conveying surface 3u-1 of the first conveyor plate 3-1 generally faces upwards. The first back surface 3n-1 is a surface disposed on the opposite side of the first conveying surface 3u-1 within the first conveyor plate 3-1. The first back surface 3n-1 of the first conveyor plate 3-1 is the surface located below the first conveying surface 3u-1 when the slag is conveyed by the first conveyor plate 3-1. When the slag is conveyed by the first conveyor plate 3-1, the first back surface 3n-1 generally faces downwards.

[0057] exist Figure 9 In the example described, the second conveyor plate 3-2 has a second conveying surface 3u-2 and a second back surface 3n-2.

[0058] When the slag is conveyed by the second conveyor plate 3-2, the second conveying surface 3u-2 directly or indirectly supports the slag, either by means of a second laser reflective layer or the like. When the slag is conveyed by the second conveyor plate 3-2, the second conveying surface 3u-2 of the second conveyor plate 3-2 generally faces upwards. The second back surface 3n-2 is a surface disposed on the opposite side of the second conveying surface 3u-2 within the second conveyor plate 3-2. The second back surface 3n-2 of the second conveyor plate 3-2 is the surface located below the second conveying surface 3u-2 when the slag is conveyed by the second conveyor plate 3-2. When the slag is conveyed by the second conveyor plate 3-2, the second back surface 3n-2 generally faces downwards.

[0059] exist Figure 9 In the example described, the front end portion 3f of each of a set of conveyor plates 3 has a convex bend CP extending in the first direction DR1.

[0060] For example, the first front end portion 3f-1 of the first conveyor plate 3-1 has a convex curved portion CP1 extending in the first direction DR1. Furthermore, the first front end portion 3f-1 of the first conveyor plate 3-1 has a convex conveying surface SU1 extending in the first direction DR1. The convex conveying surface SU1 is the surface of the convex curved portion CP1 on the third direction DR3 side. Figure 10 In the example described, the convex conveying surface SU1 is a curved surface that protrudes towards the third direction DR3 and forms part of the first conveying surface 3u-1 of the first conveying plate 3-1.

[0061] For example, the second front end portion 3f-2 of the second conveyor plate 3-2 has a convex curved portion CP2 extending in the first direction DR1. Furthermore, the second front end portion 3f-2 of the second conveyor plate 3-2 has a convex conveying surface SU2 extending in the first direction DR1. The convex conveying surface SU2 is the surface of the convex curved portion CP2 on the third direction DR3 side. Figure 10 In the example described, the convex conveying surface SU2 is a curved surface that protrudes towards the third direction DR3 and forms part of the second conveying surface 3u-2 of the second conveying plate 3-2.

[0062] Furthermore, in the first embodiment, the shape of the front end portion 3f of each of the set of conveyor plates 3 is not limited to Figure 10 Examples recorded.

[0063] exist Figure 9 In the example described, the rear end 3e of each of the set of conveyor plates 3 has an upright setting TP that protrudes toward the third direction DR3.

[0064] For example, the first rear end portion 3e-1 of the first conveyor plate 3-1 has a first upright setting portion TP1 that extends in the first direction DR1 and protrudes in the third direction DR3. Figure 11 In the example described, the first erecting part TP1 removes the slag D below the convex curved part CP2 of the second conveyor plate 3-2 when the first conveyor plate 3-1 turns.

[0065] For example, the second rear end portion 3e-2 of the second conveyor plate 3-2 has a second upright setting portion TP2 that extends in the first direction DR1 and protrudes in the third direction DR3. Figure 11 In the recorded example, the second erecting unit TP2 removes the slag hanging below the convex curved part CP3 of the third conveyor plate 3-3 when the second conveyor plate 3-2 turns.

[0066] Furthermore, in the first embodiment, the shape of the rear end portion 3e of each of the set of conveyor plates 3 is not limited to Figure 11 Examples recorded. For instance, the shape of the rear end 3e of each of a set of conveyor plates 3 can also be approximately arc-shaped or approximately circular when viewed along the first direction DR1.

[0067] exist Figure 9 In the example described, the middle portion 3m of each of a set of conveyor plates 3 connects the front end 3f to the rear end 3e.

[0068] For example, the first intermediate portion 3m-1 of the first conveyor plate 3-1 connects the first front end portion 3f-1 of the first conveyor plate 3-1 to the first rear end portion 3e-1 of the first conveyor plate 3-1. Figure 10In the described example, the front end of the first intermediate portion 3m-1 is connected to the first front end portion 3f-1 (more specifically, the convex curved portion CP1) via a first buckling portion BA1 extending in the first direction DR1. Furthermore, the rear end of the first intermediate portion 3m-1 is connected to the first rear end portion 3e-1 (more specifically, the first erected portion TP1) via a second buckling portion BB1 extending in the first direction DR1. Figure 10 In the described example, the first intermediate portion 3m-1 has a first flat plate portion FP1. Furthermore, the first intermediate portion 3m-1 has a flat conveying surface SF1 extending in a first direction DR1. The flat conveying surface SF1 is the surface of the first flat plate portion FP1 on the third direction DR3 side. The flat conveying surface SF1 constitutes a part of the first conveying surface 3u-1 of the first conveying plate 3-1.

[0069] For example, the second middle portion 3m-2 of the second conveyor plate 3-2 connects the second front end portion 3f-2 of the second conveyor plate 3-2 to the second rear end portion 3e-2 of the second conveyor plate 3-2. Figure 10 In the described example, the front end of the second intermediate portion 3m-2 is connected to the second front end portion 3f-2 (more specifically, the convex curved portion CP2) via a third buckling portion BA2 extending in the first direction DR1. Furthermore, the rear end of the second intermediate portion 3m-2 is connected to the second rear end portion 3e-2 (more specifically, the second upright setting portion TP2) via a fourth buckling portion BB2 extending in the first direction DR1. Figure 10 In the described example, the second intermediate portion 3m-2 has a second flat plate portion FP2. Furthermore, the second intermediate portion 3m-2 has a flat conveying surface SF2 extending in the first direction DR1. The flat conveying surface SF2 is the surface of the second flat plate portion FP2 on the third direction DR3 side. The flat conveying surface SF2 constitutes a part of the second conveying surface 3u-2 of the second conveying plate 3-2.

[0070] Furthermore, in the first embodiment, the shape of the middle portion 3m of each of the set of conveyor plates 3 is not limited to Figure 10 Examples recorded. For instance, at least a portion of the middle section 3m of each of a set of conveyor plates 3 may also appear generally arc-shaped, generally V-shaped, or generally U-shaped when viewed along the first direction DR1.

[0071] The following describes some examples of heat-suppressing surfaces, but the heat-suppressing surfaces are not limited to the examples described below. Furthermore, the following description takes the first heat-suppressing surface 4-1 that suppresses the heat rise of the first conveyor plate 3-1 and the second heat-suppressing surface 4-2 that suppresses the heat rise of the second conveyor plate 3-2 as representative examples, and the description of heat-suppressing surfaces that suppress the heat rise of other conveyor plates is omitted.

[0072] (The first example of a surface that inhibits temperature rise) exist Figure 12 In the described example, the first temperature-inhibiting surface 4-1 includes a surface of a first laser-reflecting layer 4r-1 that covers at least a portion of the first conveying surface 3u-1 of the first conveying plate 3-1. In other words, at least a portion of the first conveying surface 3u-1 of the first conveying plate 3-1 is covered by the first laser-reflecting layer 4r-1.

[0073] The first laser reflective layer 4r-1 covering at least a portion of the first conveyor plate 3-1 is made of a material with high laser reflectivity (e.g., copper, silver, or aluminum). The first conveyor plate 3-1 is made of steel, for example, hot-rolled mild steel plate, cold-rolled steel plate, or cold-rolled stainless steel plate.

[0074] The laser reflectivity of the first laser reflective layer 4r-1 is higher than that of the first conveying plate 3-1. Furthermore, in the first embodiment (or the second embodiment described later), the wavelength of the laser LB emitted from the laser irradiation device 60 is, for example, 1060 nm or more and 1080 nm or less. The laser reflectivity of the first laser reflective layer 4r-1 for lasers with wavelengths of 1060 nm or more and 1080 nm or less is, for example, 70% or more, 80% or more, or 90% or more.

[0075] exist Figure 12 In the described example, the first laser reflective layer 4r-1 covers a portion of the first conveying surface 3u-1 of the first conveying plate 3-1 (e.g., the conveying surface of the first intermediate portion 3m-1). In addition, another portion of the first conveying surface 3u-1 of the first conveying plate 3-1 (e.g., the conveying surface of the first front end portion 3f-1) is not covered by the first laser reflective layer 4r-1 but is exposed.

[0076] exist Figure 13 In the described example, at least a portion of the conveying surface (more specifically, the flat conveying surface SF1) of the first intermediate portion 3m-1 is covered by the first laser reflective layer 4r-1. Therefore, the relatively easily deformable thermal deformation of the first intermediate portion 3m-1 is suppressed by the first laser reflective layer 4r-1. More specifically, the laser LB traveling toward the first intermediate portion 3m-1 is reflected by the first laser reflective layer 4r-1, thereby suppressing heat input toward the first intermediate portion 3m-1. Furthermore, in Figure 13 In order to make it easier to control the laser reflective layers (4r-1, 4r-2), shadows formed by dots were added to the laser reflective layers (4r-1, 4r-2).

[0077] exist Figure 13 In the described example, the conveying surface (more specifically, the convex conveying surface SU1) of the first front end 3f-1 of the first conveying plate 3-1 is entirely exposed and not covered by the first laser reflective layer 4r-1. Furthermore, in Figure 13 In the described example, the first rear end portion 3e-1 (more specifically, the first erected portion TP1) is not entirely covered by the first laser reflective layer 4r-1 but is exposed. In this case, the area where the first laser reflective layer 4r-1 is disposed can be reduced, thereby reducing material costs.

[0078] Alternatively, such as Figure 14 As illustrated, the first conveying surface 3u-1 of the first conveying plate 3-1 may also be substantially entirely covered by the first laser reflective layer 4r-1. Furthermore, in Figure 13 In the described example, laser light is not irradiated onto the left end 3a-1 and the right end 3b-1 of the first conveyor plate 3-1, therefore the left end 3a-1 and the right end 3b-1 are not covered by the first laser reflective layer 4r-1. Of course, the left end 3a-1 and the right end 3b-1 can also be covered by the first laser reflective layer 4r-1.

[0079] exist Figure 12 or Figure 14 In the described example, a first laser reflective layer 4r-1 (e.g., a copper or aluminum layer covering at least a portion of the first conveying surface 3u-1) effectively reflects the laser LB emitted from the laser irradiation device 60. This suppresses heat input toward the first conveying plate 3-1 and inhibits temperature rise in the first conveying plate 3-1. Furthermore, it suppresses thermal deformation and deflection of the first conveying plate 3-1.

[0080] The first laser reflective layer 4r-1 may include, for example, a copper plating layer, a silver plating layer, or an aluminum plating layer. The first laser reflective layer 4r-1 may be a plating layer formed on the first conveyor plate 3-1 by a wet film deposition method, or it may be a plating layer formed on the first conveyor plate 3-1 by a dry film deposition method (which may include vapor deposition). Alternatively, the first laser reflective layer 4r-1 may also include a laser reflective plate (e.g., a copper or copper alloy plate, or an aluminum or aluminum alloy plate) mounted on the first conveyor plate 3-1.

[0081] exist Figure 12 In the described example, the second temperature-inhibiting surface 4-2 includes a surface of a second laser reflective layer 4r-2 that covers at least a portion of the second conveying surface 3u-2 of the second conveying plate 3-2. In other words, at least a portion of the second conveying surface 3u-2 of the second conveying plate 3-2 is covered by the second laser reflective layer 4r-2.

[0082] The second laser reflective layer 4r-2, covering at least a portion of the second conveyor plate 3-2, is made of a material with high laser reflectivity (e.g., copper, silver, or aluminum). The second conveyor plate 3-2 is made of steel, for example, and more specifically, of hot-rolled mild steel sheet, cold-rolled steel sheet, or cold-rolled stainless steel sheet.

[0083] The laser reflectivity of the second laser reflective layer 4r-2 is higher than that of the second conveying plate 3-2. The laser reflectivity of the second laser reflective layer 4r-2 for lasers with wavelengths above 1060nm and below 1080nm is, for example, above 70%, above 80%, or above 90%.

[0084] exist Figure 12 In the described example, the second laser reflective layer 4r-2 covers a portion of the second conveying surface 3u-2 of the second conveying plate 3-2 (e.g., the conveying surface of the second intermediate portion 3m-2). Furthermore, another portion of the second conveying surface 3u-2 of the second conveying plate 3-2 (e.g., the conveying surface of the second front end portion 3f-2) is not covered by the second laser reflective layer 4r-2 but is exposed.

[0085] exist Figure 13 In the described example, at least a portion of the conveying surface (more specifically, the flat conveying surface SF2) of the second intermediate portion 3m-2 is covered by the second laser reflective layer 4r-2. Therefore, the thermal deformation of the relatively easily deformable second intermediate portion 3m-2 is suppressed by the second laser reflective layer 4r-2.

[0086] exist Figure 13 In the described example, the conveying surface (more specifically, the convex conveying surface SU2) of the second front end portion 3f-2 of the second conveying plate 3-2 is entirely exposed and not covered by the second laser reflective layer 4r-2. Furthermore, in Figure 13 In the described example, the second rear end portion 3e-2 (more specifically, the second erected portion TP2) is entirely exposed and not covered by the second laser reflective layer 4r-2. In this case, the area where the second laser reflective layer 4r-2 is disposed can be reduced, thereby lowering material costs.

[0087] Alternatively, such as Figure 14 As illustrated, the second conveying surface 3u-2 of the second conveying plate 3-2 may also be substantially entirely covered by the second laser reflective layer 4r-2. Furthermore, in Figure 13 In the described example, laser light is not irradiated onto the left end 3a-2 of the second conveyor plate 3-2 or the right end 3b-2 of the second conveyor plate 3-2, therefore the left end 3a-2 and the right end 3b-2 are not covered by the second laser reflective layer 4r-2. Of course, the left end 3a-2 and the right end 3b-2 can also be covered by the second laser reflective layer 4r-2.

[0088] exist Figure 12 or Figure 14In the described example, the second laser reflective layer 4r-2, covering at least a portion of the second conveying surface 3u-2, effectively reflects the laser LB emitted from the laser irradiation device 60. This suppresses heat input toward the second conveying plate 3-2 and inhibits temperature rise in the second conveying plate 3-2. Furthermore, it suppresses thermal deformation and deflection of the second conveying plate 3-2.

[0089] The second laser reflective layer 4r-2 may include, for example, a copper plating layer, a silver plating layer, or an aluminum plating layer. Alternatively, the second laser reflective layer 4r-2 may also include a laser reflective plate (e.g., a copper or copper alloy plate, or an aluminum or aluminum alloy plate) mounted on the second conveyor plate 3-2.

[0090] (Second example of a surface that inhibits temperature rise) exist Figure 15 In the described example, the first temperature-inhibiting surface 4-1 includes a surface of a first thermally conductive layer 4c-1 covering at least a portion of the first back surface 3n-1 of the first conveyor plate 3-1 (i.e., the surface of the first conveyor plate 3-1 opposite to the first conveying surface 3u-1). In other words, at least a portion of the first back surface 4n-1 of the first conveyor plate 3-1 is covered by the first thermally conductive layer 4c-1.

[0091] The thermal conductivity of the first heat-conducting layer 4c-1 is higher than that of the first conveying plate 3-1. The first heat-conducting layer 4c-1 is made of a material with high thermal conductivity (e.g., copper, silver, or aluminum). The first conveying plate 3-1 is made of steel, for example, hot-rolled mild steel sheet, cold-rolled steel sheet, or cold-rolled stainless steel sheet. The thermal conductivity of the first heat-conducting layer 4c-1 is, for example, 150 W / m·K or higher, 200 W / m·K or higher, or 300 W / m·K or higher.

[0092] exist Figure 15 In the described example, the first thermally conductive layer 4c-1 covers a portion of the first back surface 3n-1 of the first conveyor plate 3-1 (e.g., the back surface of the first intermediate portion 3m-1). Furthermore, another portion of the first back surface 3n-1 of the first conveyor plate 3-1 (e.g., the back surface of the first front end portion 3f-1) is not covered by the first thermally conductive layer 4c-1 but is exposed.

[0093] exist Figure 16 In the described example, at least a portion of the back side (more specifically, the flat back side SN1) of the first intermediate portion 3m-1 is covered by the first thermally conductive layer 4c-1. Therefore, heat from the first intermediate portion 3m-1 is effectively diffused through the first thermally conductive layer 4c-1. For example, consider a case where the temperature of the first intermediate portion 3m-1 rises due to laser LB incident on it. In this case, heat rapidly diffuses from the area of ​​the first intermediate portion 3m-1 irradiated by laser LB to other areas via the first thermally conductive layer 4c-1. Furthermore, in Figure 16In order to make it easier to control the heat-conducting layers (4c-1, 4c-2), shadows formed by dots were added to the heat-conducting layers (4c-1, 4c-2).

[0094] exist Figure 16 In the described example, the back side (more specifically, the concave back side SD1) of the first front end 3f-1 of the first conveyor plate 3-1 is entirely exposed and not covered by the first thermally conductive layer 4c-1. Furthermore, in Figure 16 In the described example, the first rear end portion 3e-1 (more specifically, the first upright mounting portion TP1) is entirely exposed and not covered by the first heat-conducting layer 4c-1. In this case, the area where the first heat-conducting layer 4c-1 is configured can be reduced, thereby lowering material costs.

[0095] Alternatively, such as Figure 17 As illustrated, the first back surface 3n-1 of the first conveyor plate 3-1 may also be substantially entirely covered by the first thermally conductive layer 4c-1. Furthermore, in Figure 16 In the described example, laser light is not irradiated onto the left end 3a-1 and the right end 3b-1 of the first conveyor plate 3-1, therefore the left end 3a-1 and the right end 3b-1 are not covered by the first thermally conductive layer 4c-1. Of course, the left end 3a-1 and the right end 3b-1 can also be covered by the first thermally conductive layer 4c-1.

[0096] exist Figure 15 or Figure 17 In the described example, a first heat-conducting layer 4c-1 (e.g., a copper, silver, or aluminum layer covering at least a portion of the first back surface 3n-1 of the first conveyor plate 3-1) rapidly diffuses heat from the area of ​​the first conveyor plate 3-1 irradiated by laser LB to other areas of the first conveyor plate 3-1. This suppresses localized temperature rise in the first conveyor plate 3-1 and inhibits thermoplastic deformation of the first conveyor plate 3-1. Furthermore, the surface of the first heat-conducting layer 4c-1 rapidly releases heat from the first conveyor plate 3-1 toward the surrounding air. Figure 15 or Figure 17 In the recorded example, the heat conduction of the first heat-conducting layer 4c-1 and the heat dissipation from the surface of the first heat-conducting layer 4c-1 can suppress the temperature rise of the first conveying plate 3-1 and suppress the thermal deformation and deflection of the first conveying plate 3-1.

[0097] The first thermally conductive layer 4c-1 may include, for example, a copper plating layer, a silver plating layer, or an aluminum plating layer. The first thermally conductive layer 4c-1 may be a plating layer formed on the first conveyor plate 3-1 by a wet film-forming method or by a dry film-forming method. Alternatively, the first thermally conductive layer 4c-1 may also include a heat-conducting plate (e.g., a copper or copper alloy plate, or an aluminum or aluminum alloy plate) mounted on the first conveyor plate 3-1, or a heat sink (e.g., a graphite sheet, a resin-based heat sink, or a fluororubber-based heat sink) mounted on the first conveyor plate 3-1. Furthermore, the first thermally conductive layer 4c-1 may also include a layer composed of a heat-dissipating coating.

[0098] exist Figure 15 In the described example, the second temperature-inhibiting surface 4-2 includes a surface of a second thermally conductive layer 4c-2 that covers at least a portion of the second back surface 3n-2 of the second conveying plate 3-2 (i.e., the surface of the second conveying plate 3-2 opposite to the second conveying surface 3u-2). In other words, at least a portion of the second back surface 4n-2 of the second conveying plate 3-2 is covered by the second thermally conductive layer 4c-2.

[0099] The thermal conductivity of the second heat-conducting layer 4c-2 is higher than that of the second conveying plate 3-2. The second heat-conducting layer 4c-2 is made of a material with high thermal conductivity (e.g., copper, silver, or aluminum). The second conveying plate 3-2 is made of steel, for example, hot-rolled mild steel sheet, cold-rolled steel sheet, or cold-rolled stainless steel sheet. The thermal conductivity of the second heat-conducting layer 4c-2 is, for example, 150 W / m·K or higher, 200 W / m·K or higher, or 300 W / m·K or higher.

[0100] exist Figure 15 In the described example, the second thermally conductive layer 4c-2 covers a portion of the second back surface 3n-2 of the second conveyor plate 3-2 (e.g., the back surface of the second intermediate portion 3m-2). Furthermore, another portion of the second back surface 3n-2 of the second conveyor plate 3-2 (e.g., the back surface of the second front end portion 3f-2) is not covered by the second thermally conductive layer 4c-2 but is exposed.

[0101] exist Figure 16 In the described example, at least a portion of the back side of the second intermediate portion 3m-2 (more specifically, the flat back side SN2) is covered by the second thermally conductive layer 4c-2. Therefore, the heat of the second intermediate portion 3m-2 is effectively diffused by the second thermally conductive layer 4c-2.

[0102] exist Figure 16 In the described example, the back side (more specifically, the concave back side SD2) of the second front end 3f-2 of the second conveyor plate 3-2 is entirely exposed and not covered by the second heat-conducting layer 4c-2. Furthermore, in Figure 16In the described example, the second rear end portion 3e-2 (more specifically, the second upright mounting portion TP2) is entirely exposed and not covered by the second heat-conducting layer 4c-2. In this case, the area where the second heat-conducting layer 4c-2 is configured can be reduced, thereby lowering material costs.

[0103] Alternatively, such as Figure 17 As illustrated, the second back surface 3n-2 of the second conveyor plate 3-2 may also be substantially entirely covered by the second thermally conductive layer 4c-2.

[0104] exist Figure 15 or Figure 17 In the described example, the second heat-conducting layer 4c-2, covering at least a portion of the second back surface 3n-2 of the second conveyor plate 3-2, rapidly diffuses heat from the area of ​​the second conveyor plate 3-2 irradiated by laser LB to other areas of the second conveyor plate 3-2. This suppresses localized temperature rise in the second conveyor plate 3-2 and inhibits thermoplastic deformation of the second conveyor plate 3-2. Furthermore, the surface of the second heat-conducting layer 4c-2 rapidly releases heat from the second conveyor plate 3-2 toward the surrounding air. Figure 15 or Figure 17 In the recorded example, the heat conduction of the second heat-conducting layer 4c-2 and the heat dissipation from the surface of the second heat-conducting layer 4c-2 can suppress the temperature rise of the second conveying plate 3-2 and suppress the thermal deformation and deflection of the second conveying plate 3-2.

[0105] The second thermally conductive layer 4c-2 may include, for example, a copper plating layer, a silver plating layer, or an aluminum plating layer. Alternatively, the second thermally conductive layer 4c-2 may also include a thermally conductive plate (e.g., a copper or copper alloy plate, or an aluminum or aluminum alloy plate) mounted on the second conveyor plate 3-2, or a heat sink (e.g., a graphite sheet, a resin-based heat sink, or a fluororubber-based heat sink) mounted on the second conveyor plate 3-2. Furthermore, the second thermally conductive layer 4c-2 may also include a layer composed of a heat-dissipating coating.

[0106] (The third example of a surface that inhibits temperature rise) The third example of a temperature-suppressing surface is a combination of the first and second examples of a temperature-suppressing surface. In other words, at least a portion of the first conveying surface 3u-1 of the first conveying plate 3-1 is covered by the first laser reflective layer 4r-1, and at least a portion of the first back surface 3n-1 of the first conveying plate 3-1 is covered by the first thermally conductive layer 4c-1. Furthermore, at least a portion of the second conveying surface 3u-2 of the second conveying plate 3-2 is covered by the second laser reflective layer 4r-2, and at least a portion of the second back surface 3n-2 of the second conveying plate 3-2 is covered by the second thermally conductive layer 4c-2.

[0107] More specifically, such as Figure 18As illustrated, the first temperature-suppressing surface 4-1 includes a surface of a first laser-reflecting layer 4r-1 covering at least a portion of the first conveying surface 3u-1 of the first conveying plate 3-1, and a surface of a first thermally conductive layer 4c-1 covering at least a portion of the first back surface 3n-1 of the first conveying plate 3-1. Furthermore, the second temperature-suppressing surface 4-2 includes a surface of a second laser-reflecting layer 4r-2 covering at least a portion of the second conveying surface 3u-2 of the second conveying plate 3-2, and a surface of a second thermally conductive layer 4c-2 covering at least a portion of the second back surface 3n-2 of the second conveying plate 3-2.

[0108] In the third example of the temperature-suppressing surface, the structures of the first laser reflective layer 4r-1 and the second laser reflective layer 4r-2 can each adopt all the matters described in the first example of the temperature-suppressing surface. Furthermore, in the third example of the temperature-suppressing surface, the structures of the first thermally conductive layer 4c-1 and the second thermally conductive layer 4c-2 can each adopt all the matters described in the second example of the temperature-suppressing surface.

[0109] In the first, second, or third example of the temperature-suppressing surface, the main material of the first conveyor plate 3-1 is, for example, steel. Similarly, the main material of the second conveyor plate 3-2 is, for example, steel. Furthermore, in this specification, the main material of the first conveyor plate 3-1 refers to the material whose weight accounts for the largest proportion of the total weight of the first conveyor plate 3-1. Likewise, in this specification, the main material of the second conveyor plate 3-2 refers to the material whose weight accounts for the largest proportion of the total weight of the second conveyor plate 3-2.

[0110] In the first, second, or third example of the temperature-suppressing surface, the first temperature-suppressing surface 4-1 is made of, for example, copper, silver, or aluminum. More specifically, the first temperature-suppressing surface 4-1 is made of copper, a copper alloy, aluminum, or an aluminum alloy. Furthermore, the second temperature-suppressing surface 4-2 is made of, for example, copper, silver, or aluminum. More specifically, the second temperature-suppressing surface 4-2 is made of copper, a copper alloy, aluminum, or an aluminum alloy.

[0111] When the main material of the first conveyor plate 3-1 is steel and the first temperature suppression surface 4-1 is made of copper, silver or aluminum, all the requirements of the first conveyor plate 3-1, including strength, formability, manufacturing cost and temperature suppression, can be met.

[0112] When the main material of the second conveyor plate 3-2 is steel and the second temperature suppression surface 4-2 is made of copper, silver or aluminum, all the requirements of the second conveyor plate 3-2, including strength, formability, manufacturing cost and temperature suppression, can be met.

[0113] (Fourth example of surface with temperature-inhibiting properties) exist Figure 19 In the described example, the first temperature-inhibiting surface 4-1 includes the surface of a first heat-dissipating member 5-1 configured to contact at least a portion of the first back surface 3n-1 of the first conveying plate 3-1.

[0114] exist Figure 19 In the described example, the slag-hanging conveyor 2A includes a first heat-dissipating member 5-1 supported by a first conveying plate 3-1. The first conveying plate 3-1 has a contact surface 31t that contacts the first heat-dissipating member 5-1. Furthermore, the contact surface 31t includes at least a portion of a first back surface 3n-1 of the first conveying plate 3-1.

[0115] The first heat dissipation component 5-1 is installed on the first conveyor plate 3-1. The first heat dissipation component 5-1 can be installed on the first conveyor plate 3-1 by welding, or by bolts, adhesive sheets or other installation components.

[0116] exist Figure 19 In the described example, the first heat dissipation member 5-1 includes a first radiator 50-1. The first radiator 50-1 may also have a first base portion 51-1 and a plurality of first heat dissipation fins 52-1 disposed on the first base portion 51-1 (e.g., a plurality of heat dissipation pins 52p-1 or a plurality of heat dissipation fins 52f-1 described later). In addition to having the first radiator 50-1, the first heat dissipation member 5-1 may also have heat dissipation fins (more specifically, heat-conducting fins with high thermal conductivity) disposed between the first radiator 50-1 and the first conveying plate 3-1. The first radiator 50-1 is, for example, made of aluminum, copper, or ceramic.

[0117] exist Figure 20 In the described example, the first heat dissipation member 5-1 includes multiple heat dissipation protrusions (more specifically, multiple heat dissipation pins 52p-1). These multiple heat dissipation protrusions (more specifically, multiple heat dissipation pins 52p-1) each protrude, for example, in a fourth direction DR4. Alternatively, as... Figure 21 As illustrated, the first heat dissipation member 5-1 may also include a plurality of heat dissipation fins 52f-1. The plurality of heat dissipation fins 52f-1 protrude, for example, in the fourth direction DR4.

[0118] exist Figure 20 or Figure 21 In the described example, the first heat dissipation component 5-1 is configured to contact at least a portion of the first intermediate portion 3m-1 (more specifically, the first flat plate portion FP1) of the first conveying plate 3-1.

[0119] exist Figure 19In the described example, the first heat dissipation member 5-1 receives heat from the first conveyor plate 3-1 and releases the received heat to the air surrounding the first heat dissipation member 5-1. In this way, the surface of the first heat dissipation member 5-1 (i.e., the heat dissipation surface) can be used to suppress the temperature rise of the first conveyor plate 3-1 caused by laser irradiation, and to suppress the thermal deformation and deflection of the first conveyor plate 3-1.

[0120] exist Figure 19 In the described example, the second temperature suppression surface 4-2 includes the surface of the second heat dissipation member 5-2 configured to contact at least a portion of the second back surface 3n-2 of the second conveyor plate 3-2.

[0121] exist Figure 19 In the described example, the slag-hanging conveyor 2A includes a second heat dissipation member 5-2 supported by a second conveying plate 3-2. The second conveying plate 3-2 has a contact surface 32t that contacts the second heat dissipation member 5-2. Furthermore, the contact surface 32t includes at least a portion of a second back surface 3n-2 of the second conveying plate 3-2.

[0122] The second heat dissipation component 5-2 is installed on the second conveyor plate 3-2. The second heat dissipation component 5-2 can be installed on the second conveyor plate 3-2 by welding, or by bolts, adhesive sheets or other mounting components.

[0123] exist Figure 19 In the described example, the second heat dissipation member 5-2 includes a second radiator 50-2. The second radiator 50-2 may also have a second base portion 51-2 and a plurality of second heat dissipation fins 52-2 (e.g., a plurality of heat dissipation pins, a plurality of heat dissipation fins) disposed on the second base portion 51-2. In addition to including the second radiator 50-2, the second heat dissipation member 5-2 may also include heat dissipation sheet material (more specifically, a heat-conducting sheet material with high thermal conductivity) disposed between the second radiator 50-2 and the second conveying plate 3-2. The second radiator 50-2 may be made of, for example, aluminum, copper, or ceramic.

[0124] exist Figure 22 In the described example, the second heat dissipation member 5-2 includes multiple heat dissipation protrusions (more specifically, multiple heat dissipation pins 52p-2). These multiple heat dissipation protrusions (more specifically, multiple heat dissipation pins 52p-2) each protrude, for example, in a fourth direction DR4. Alternatively, as... Figure 23 As illustrated, the second heat dissipation member 5-2 may also include a plurality of heat dissipation fins 52f-2. The plurality of heat dissipation fins 52f-2 protrude, for example, in the fourth direction DR4.

[0125] exist Figure 22 or Figure 23In the described example, the second heat dissipation member 5-2 is configured to contact at least a portion of the second intermediate portion 3m-2 (more specifically, the second flat plate portion FP2) of the second conveying plate 3-2.

[0126] exist Figure 19 In the described example, the second heat dissipation member 5-2 receives heat from the second conveying plate 3-2 and releases the received heat to the air surrounding the second heat dissipation member 5-2. In this way, the surface of the second heat dissipation member 5-2 (i.e., the heat dissipation surface) can be used to suppress the temperature rise of the second conveying plate 3-2 caused by laser irradiation, and to suppress the thermal deformation and deflection of the second conveying plate 3-2.

[0127] (Fifth example of surface with temperature-inhibiting properties) In the first to fourth examples of the temperature-suppressing surface, a first temperature-suppressing surface 4-1 is provided independently of the first conveyor plate 3-1, and a second temperature-suppressing surface 4-2 is provided independently of the second conveyor plate 3-2. In the fifth example of the temperature-suppressing surface, the first conveyor plate 3-1 itself has a temperature-suppressing surface for suppressing the temperature rise of the first conveyor plate 3-1, and the second conveyor plate 3-2 itself has a temperature-suppressing surface for suppressing the temperature rise of the second conveyor plate 3-2.

[0128] exist Figure 24 In the recorded example, the main material of the first conveyor plate 3-1 is copper or aluminum. More specifically, the first conveyor plate 3-1 is made of copper or a copper alloy, or aluminum or an aluminum alloy.

[0129] exist Figure 24 In the described example, at least a portion of the first conveying surface 3u-1 of the first conveyor plate 3-1 is made of copper or aluminum. Alternatively, the entire first conveying surface 3u-1 of the first conveyor plate 3-1 may be made of copper or aluminum. Figure 24 In the described example, at least a portion of the copper or aluminum surface of the first conveying surface 3u-1 constituting the first conveying plate 3-1 is a heat-suppressing surface with high laser reflectivity. This copper or aluminum surface effectively reflects the laser LB emitted from the laser irradiation device 60.

[0130] exist Figure 24 In the recorded example, the main material of the second conveyor plate 3-2 is copper or aluminum. More specifically, the second conveyor plate 3-2 is made of copper or a copper alloy, or aluminum or an aluminum alloy.

[0131] exist Figure 24 In the described example, at least a portion of the second conveying surface 3u-2 of the second conveyor plate 3-2 is made of copper or aluminum. Alternatively, the entire second conveying surface 3u-2 of the second conveyor plate 3-2 may be made of copper or aluminum. Figure 24In the described example, at least a portion of the copper or aluminum surface of the second conveying surface 3u-2 constituting the second conveying plate 3-2 is a heat-suppressing surface with high laser reflectivity. This copper or aluminum surface effectively reflects the laser LB emitted from the laser irradiation device 60.

[0132] When the main material of the first conveyor plate 3-1 is copper or aluminum, the first conveyor plate 3-1 has high laser reflectivity and high thermal conductivity. Therefore, the temperature rise of the first conveyor plate 3-1 can be suppressed by the first conveyor plate 3-1 itself.

[0133] When the main material of the second conveyor plate 3-2 is copper or aluminum, the second conveyor plate 3-2 has high laser reflectivity and high thermal conductivity. Therefore, the second conveyor plate 3-2 itself can suppress the temperature rise of the second conveyor plate 3-2.

[0134] (The ramp around track OB) like Figure 25 As illustrated, the surrounding track OB of a set of conveyor plates 3 may also include a ramp CL that increases in height as it moves from the processing area RG1 toward the discharge area RG2. When the surrounding track OB includes the ramp CL, it is easy to receive the slag D from the slag conveyor 2A via the container 13 or the second conveyor 15 (if necessary) from the slag conveyor 2A. Figure 31 It is configured in the discharge area RG2.

[0135] (Laser processing device 1A) like Figure 1 As illustrated, the laser processing apparatus 1A includes a slag conveyor 2A, a laser irradiation device 60, a moving device 7, and a control device 8. Alternatively, the laser processing apparatus 1A may also include a workpiece support member 90.

[0136] Since the slag-coating conveyor 2A has already been described, a repeat description of the slag-coating conveyor 2A will be omitted.

[0137] like Figure 26 As illustrated, the laser irradiation device 60 has a laser head 61 with an emission outlet OP for emitting laser light. The laser irradiation device 60 may also include a laser source 63 and optical components 65 (e.g., optical fiber) for transmitting laser light from the laser source 63 to the laser head 61.

[0138] The moving device 7 moves the laser head 61 relative to the workpiece support member 90. Furthermore, the moving device 7 moves the laser head 61 relative to the workpiece W supported by the workpiece support member 90. The workpiece W supported by the workpiece support member 90 is, for example, a sheet metal.

[0139] exist Figure 26In the example described, the moving device 7 has a moving body (71a, 73a) that supports the laser head 61 and a driving device (71b, 73b) that moves the moving body (71a, 73a).

[0140] exist Figure 26 In the described example, the mobile device 7 has a first mobile device 71. The first mobile device 71 has a first moving body 71a that supports the laser head 61 and a first driving device 71b (e.g., a first motor) that moves the first moving body 71a.

[0141] exist Figure 26 In the described example, the first moving body 71a functions as a Z-axis saddle, and the first drive device 71b functions as a Z-axis drive unit. The first drive device 71b moves the first moving body 71a in a direction parallel to the vertical direction (in other words, the Z-axis direction). More specifically, the first drive device 71b can move the first moving body 71a downwards to bring it closer to the workpiece support member 90. Furthermore, the first drive device 71b can move the first moving body 71a upwards to move it away from the workpiece support member 90.

[0142] exist Figure 26 In the described example, the moving device 7 has a second moving device 73. The second moving device 73 has a second moving body 73a and a second drive device 73b (e.g., a second motor) for moving the second moving body 73a. The second moving body 73a supports the first moving body 71a so that it can move in a direction parallel to the vertical direction.

[0143] exist Figure 26 In the described example, the second moving body 73a functions as a Y-axis saddle, and the second drive device 73b functions as a Y-axis drive unit. The second drive device 73b moves the second moving body 73a in a direction parallel to the horizontal plane (more specifically, the Y-axis direction).

[0144] exist Figure 27 In the described example, the moving device 7 has a third moving device 75. The third moving device 75 has a third moving body 75a and a third drive device 75b (e.g., a third motor) for moving the third moving body 75a. The third moving body 75a supports the second moving body 73a so that it can move in a direction parallel to the Y-axis.

[0145] exist Figure 27 In the described example, the third moving body 75a functions as an X-axis saddle, and the third drive unit 75b functions as an X-axis drive unit. The third drive unit 75b moves the third moving body 75a in a direction parallel to the horizontal plane (more specifically, in the X-axis direction perpendicular to the Z and Y axes).

[0146] like Figure 26 As illustrated, the third moving body 75a can also be constructed from a portal frame. Figure 27 In the described example, the third moving body 75a can move across the machining area RG1 when viewed from above. The third moving body 75a is supported by the base 70 so that it can move in a direction parallel to the X-axis.

[0147] exist Figure 28 In the described example, the workpiece support member 90 includes a pin header that supports the workpiece as a sheet metal. The pin header has multiple tops 92 that support the workpiece W as a sheet metal.

[0148] exist Figure 28 In the described example, the workpiece support member 90 has a configuration relative to the horizontal plane (e.g., Figure 28 The XY plane in the middle is a plurality of plate members 91 in an upright position. In addition, the plurality of plate members 91 each have a serrated edge portion EG.

[0149] The workpiece support member 90 may have 10 or more plate members 91 arranged in an upright position relative to the horizontal plane, or it may have 20 or more plate members 91 arranged in an upright position relative to the horizontal plane. Each plate member 91 is, for example, made of metal.

[0150] exist Figure 28 In the described example, the workpiece support member 90 is a transferable pallet PT. The pallet PT has multiple plate members 91 and a frame 93 for mounting the multiple plate members 91. The bottom of the frame 93 is defined by a bottom opening. The slag D generated by irradiating the workpiece W with laser LB falls toward the slag conveyor 2A through the space between two adjacent plate members 91 and the bottom opening defined by the frame 93.

[0151] like Figure 29 As illustrated, the laser processing apparatus 1A may also include a transfer device 11 for transferring the workpiece support member 90. The transfer device 11 transfers the workpiece support member 90 from the processing area RG1 to the removal area RG3. Thereafter, the processed workpiece Wb (more specifically, the processed sheet metal) is removed from the workpiece support member 90 located in the removal area RG3. Figure 30 As illustrated, the removal can be performed using a suction cup 121 capable of adsorbing the processed workpiece Wb, or it can be performed using a fork capable of lifting the processed workpiece Wb. Alternatively, the removal can be performed by a robot or an operator.

[0152] exist Figure 30In the described example, the laser processing apparatus 1A has a workpiece transfer device 12 (e.g., a robotic arm) for transferring the workpiece before processing and the processed workpiece Wb. The workpiece transfer device 12 may also be a sheet metal transfer device 12a for transferring workpieces as sheet metal. The sheet metal transfer device 12a may also have multiple suction cups 121 for adsorbing workpieces as sheet metal or forks for supporting workpieces as sheet metal from below.

[0153] exist Figure 1 In the described example, the laser processing apparatus 1A has a container 13 that receives slag D from the slag conveyor 2A. This container 13 is positioned directly below the slag conveyor 2A in the discharge area RG2.

[0154] The laser processing apparatus 1A may also have a second conveyor 15 that receives the slag D from the slag conveyor 2A. Figure 31 In the recorded example, the slag-carrying conveying surface of the second conveyor 15 is positioned directly below the slag-carrying conveyor 2A in the discharge area RG2. Figure 31 In the recorded example, the second conveyor 15 conveys the slag received from the slag conveyor 2A to the container 13.

[0155] exist Figure 32 In the described example, control device 8 controls laser irradiation device 60 and moving device 7 (e.g., first drive device 71b, second drive device 73b, and third drive device 75b). Control device 8 can also control the transfer device 11 that transfers the workpiece support member 90 (see reference). Figure 29 ) and / or the workpiece transfer device 12 for transferring workpiece W (refer to Figure 30 In addition, the control device 8 can also control the drive device 29 of the slag conveyor 2A.

[0156] exist Figure 33 In the described example, the control device 8 sends an emission command R1 to the laser irradiation device 60 (e.g., laser source 63), thereby causing the laser LB to be emitted from the laser head 61. More specifically, the control device 8 sends an emission command R1 to the laser irradiation device 60 (e.g., laser source 63), and the laser irradiation device 60, receiving the emission command R1, emits the laser LB from the laser head 61 (more specifically, the emission outlet of the laser head 61).

[0157] exist Figure 33 In the described example, the control device 8 moves the laser head 61 by sending a movement command S to the moving device 7. More specifically, the control device 8 sends a movement command S to the moving device 7, and the moving device 7, receiving the movement command S, moves the laser head 61.

[0158] like Figure 33As illustrated, the control device 8 includes a hardware processor 80 (hereinafter referred to as "processor 80"), a memory 82, a communication circuit 84, and an input device 86 (e.g., a display 862 with a touch panel). The processor 80, memory 82, communication circuit 84, and input device 86 are interconnected via a bus 88. Data required for the processing of workpiece W (e.g., workpiece data 826 containing shape data and processing position data of workpiece W) can be input to the control device 8 via the input device 86, or from another computer via the communication circuit 84. Furthermore, the input device 86 is not limited to the display 862 with a touch panel. For example, the control device 8 may also include input devices 86 such as buttons, switches, joysticks, pointing devices, and keyboards, as well as a display that shows the data or other information input to the input device 86.

[0159] The memory 82 stores data such as workpiece data 826 and programs such as machining program 822. The memory 82 is a storage medium that can be read by the processor 80 of the control device 8. The memory 82 can be, for example, a non-volatile or volatile semiconductor memory such as RAM, ROM, or flash memory, or a disk, or other forms of memory.

[0160] The control device 8 generates control commands by executing the machining program 822 stored in the memory 82 through the processor 80. Furthermore, the communication circuit 84 sends these control commands to the controlled equipment (more specifically, the laser irradiation device 60, the moving device 7, the transfer device 11, the workpiece transfer device 12, and the drive device 29, etc.). Thus, by executing the machining program 822 through the processor 80, the control device 8 can control the laser irradiation device 60, the moving device 7, the transfer device 11, the workpiece transfer device 12, and the drive device 29, etc.

[0161] The control device 8 can also be linked with the control of at least one of the laser irradiation device 60 and the moving device 7 to control the moving speed of the first set of conveyor plates 3.

[0162] For example, the control device 8 can also control the drive device 29 to move the first set of conveyor plates 3 at a first speed (a speed other than zero) when the laser irradiation device 60 stops emitting laser LB, and control the drive device 29 to move the first set of conveyor plates 3 at a second speed faster than the first speed when the laser irradiation device 60 emits laser LB.

[0163] For example, the control device 8 can also control the drive device 29 to change the moving speed of the first set of conveyor plates 3 according to the power of the laser LB emitted by the laser irradiation device 60 or the type of processing performed by the laser irradiation device 60 (e.g., hole drilling or cutting).

[0164] (Cooling device 95) like Figure 34 As illustrated, the laser processing apparatus 1A may also have a cooling device 95 for forced cooling of a set of conveyor plates 3.

[0165] For example, the laser processing apparatus 1A may also include an air-cooled cooling device 95a that blows air onto a set of conveyor plates 3. Figure 34 In the described example, the cooling device 95a has an air jet device 96 that blows air onto the back surface 3n of each of the set of conveyor plates 3. Alternatively or additionally, the cooling device 95a may also have an air jet device that blows air onto the conveying surface 3u of each of the set of conveyor plates 3.

[0166] Alternatively or additionally, the laser processing apparatus 1A may also include a liquid-cooled cooling device 95b that cools a set of conveyor plates 3 by means of liquid. Figure 34 In the described example, the cooling device 95b has a liquid tank 97 (e.g., a water tank) configured to traverse a surrounding track of a set of conveyor plates 3. The set of conveyor plates 3 are cooled by the liquid (e.g., water) within the liquid tank 97. Furthermore, the liquid adhering to the surface of the set of conveyor plates 3 is vaporized by laser irradiation (heat of vaporization), which suppresses the temperature rise of the conveyor plates 3.

[0167] (Second Implementation) Reference Figures 35 to 41 The slag conveyor 2B and the laser processing device 1B of the second embodiment will be described. Figure 35 This is a schematic cross-sectional view of the laser processing apparatus 1B according to the second embodiment. Figure 36 This is a schematic cross-sectional view of a portion of the laser processing apparatus 1B according to the second embodiment. Figure 37 It is an exploded perspective view schematically representing a portion of a set of conveyor plates 3. Figure 38 This is a schematic perspective view showing a set of conveyor plates 3, including a first conveyor plate 3-1 and a second conveyor plate 3-2, that can move along the surrounding track OB. Figures 39 to 41 This is a schematic cross-sectional view of a portion of the laser processing apparatus 1B according to the second embodiment.

[0168] In the second embodiment of the slag-hanging conveyor 2B, the aspect in which a group of conveyor plates 3 are respectively hinged to other conveyor plates is different from that of the first embodiment of the slag-hanging conveyor 2A.

[0169] In the second embodiment, the description focuses on the differences from the first embodiment. Furthermore, in the second embodiment, repetitive explanations of matters already described in the first embodiment are omitted. Therefore, in the second embodiment, even without explicit explanation, matters already described in the first embodiment can certainly be applied to the second embodiment. Conversely, all matters described in the second embodiment can also be applied to the first embodiment.

[0170] exist Figure 35 and Figure 36 In the example described, the slag conveyor 2B of the second embodiment includes a set of conveyor plates 3, which convey slag generated by irradiating the workpiece with a laser. The set of conveyor plates 3 includes a first conveyor plate 3-1 extending in the first direction DR1, and a second conveyor plate 3-2 disposed adjacent to the first conveyor plate 3-1 and extending in the first direction DR1.

[0171] like Figure 36 As illustrated, the slag conveyor 2B includes a first temperature-inhibiting surface 4-1 and a second temperature-inhibiting surface 4-2.

[0172] The first temperature-inhibiting surface 4-1 covers at least a portion of the first conveyor plate 3-1. Furthermore, the first temperature-inhibiting surface 4-1 inhibits the first conveyor plate 3-1 from heating up due to the energy of the laser LB.

[0173] The second temperature-inhibiting surface 4-2 covers at least a portion of the second conveyor plate 3-2. Furthermore, the second temperature-inhibiting surface 4-2 inhibits the second conveyor plate 3-2 from heating up due to the energy of the laser LB.

[0174] exist Figure 35 In the described example, the laser processing apparatus 1B of the second embodiment includes: the slag conveyor 2B described above; a laser irradiation device 60, including a laser head 61 that irradiates a workpiece W with a laser; a moving device 7 that moves the laser head 61 relative to a workpiece support member 90 that supports the workpiece W; and a control device 8 that controls the laser irradiation device 60 and the moving device 7.

[0175] Therefore, the slag conveyor 2B and laser processing device 1B of the second embodiment achieve the same effect as the slag conveyor 2A and laser processing device 1A of the first embodiment.

[0176] like Figure 37 As illustrated, the first rear end 3e-1 of the first conveyor plate 3-1 is hinged to the second front end 3f-2 of the second conveyor plate 3-2. Figure 37In the described example, the first rear end 3e-1 of the first conveyor plate 3-1 is hinged to the second front end 3f-2 of the second conveyor plate 3-2 by configuring the rod (hereinafter referred to as "the second rod RD2") to pass through both the first rear end 3e-1 of the first conveyor plate 3-1 and the second front end 3f-2 of the second conveyor plate 3-2. Furthermore, the second rear end 3e-2 of the second conveyor plate 3-2 is hinged to the third front end 3f-3 of the third conveyor plate 3-3 by configuring the rod (hereinafter referred to as "the third rod RD3") to pass through both the second rear end 3e-2 of the second conveyor plate 3-2 and the third front end 3f-3 of the third conveyor plate 3-3.

[0177] (arbitrarily added structure) Next, refer to Figures 1 to 41 Any additional structures that can be used in the slag conveyor 2B and laser processing apparatus 1B of the second embodiment will be described.

[0178] (Slag Conveyor 2B) exist Figure 35 In the described example, a portion of the slag-coating conveyor 2B is positioned directly below the laser irradiation device 60. Furthermore, a set of conveyor plates 3 of the slag-coating conveyor 2B is configured to move across the processing area RG1 (more specifically, the area directly below the laser irradiation device 60).

[0179] exist Figure 35 In the documented example, a set of conveyor plates 3 transports the slag from the processing area RG1 to the discharge area RG2. Figure 35 In the described example, a set of conveyor plates 3 rotates (more specifically, rotates 180 degrees about a horizontal axis) in the discharge zone RG2. As a result, the slag D conveyed by the set of conveyor plates 3 is discharged from the set of conveyor plates 3 in the discharge zone RG2. Furthermore, the cut piece CF (see reference...) is conveyed by the set of conveyor plates 3... Figure 36 In the case of ), the cut piece CF is also discharged from a set of conveyor plates 3 in the discharge area RG2.

[0180] exist Figure 38 In the described example, the slag-hanging conveyor 2B includes a first annular member 21 (more specifically, a first annular chain 21a), a second annular member 22 (more specifically, a second annular chain 22a), and a drive unit 29. The first annular member 21 and the second annular member 22 support a set of conveyor plates 3. More specifically, a set of conveyor plates 3 is mounted on the first annular member 21 and the second annular member 22.

[0181] The first annular member 21 and the second annular member 22 are driven directly or indirectly by the driving device 29. The first annular member 21, the second annular member 22 and the driving device 29 have been described in the first embodiment, so a repeated description of their structure is omitted.

[0182] (One set of conveyor plates 3) A set of conveyor plates 3 moves along the circular track OB. For example... Figure 38 As illustrated, the surrounding track OB of a set of conveyor plates 3 is parallel to the first surrounding track B1 of the first annular chain 21a and parallel to the second surrounding track B2 of the second annular chain 22a. Figure 35 In the example described, a set of conveyor plates 3 are configured to be connected in a manner that forms a ring-shaped conveyor body.

[0183] Each of the conveyor plates 3 has a length, for example, between 1m and 3m. Each of the conveyor plates 3 has a width, for example, between 40mm and 200mm. The thickness of each of the conveyor plates 3 (more specifically, the thickness of the middle 3m portion of each conveyor plate 3) is, for example, 5mm or less or 3mm or less. Each of the conveyor plates 3 is made of metal. Each of the conveyor plates 3 is, for example, made of steel, more specifically, hot-rolled mild steel sheet, cold-rolled steel sheet, or cold-rolled stainless steel sheet.

[0184] exist Figure 37 In the described example, the first conveyor plate 3-1 has a first front end portion 3f-1, a first rear end portion 3e-1, and a first intermediate portion 3m-1 connecting the first front end portion 3f-1 and the first rear end portion 3e-1. A plurality of front receiving portions 30f-1 (more specifically, a plurality of through holes for inserting the first rod RD1) are formed in the first front end portion 3f-1 of the first conveyor plate 3-1. Furthermore, a plurality of rear receiving portions 30e-1 (more specifically, a plurality of through holes for inserting the second rod RD2) are formed in the first rear end portion 3e-1 of the first conveyor plate 3-1.

[0185] exist Figure 37 In the described example, the second conveyor plate 3-2 has a second front end portion 3f-2, a second rear end portion 3e-2, and a second intermediate portion 3m-2 connecting the second front end portion 3f-2 and the second rear end portion 3e-2. A plurality of front receiving portions 30f-2 (more specifically, a plurality of through holes for inserting the second rod RD2) are formed on the second front end portion 3f-2 of the second conveyor plate 3-2. Furthermore, a plurality of rear receiving portions 30e-2 (more specifically, a plurality of through holes for inserting the third rod RD3) are formed on the second rear end portion 3e-2 of the second conveyor plate 3-2.

[0186] (The first example of a surface that inhibits temperature rise) exist Figure 36 In the described example, the first temperature-inhibiting surface 4-1 includes a surface of a first laser-reflecting layer 4r-1 that covers at least a portion of the first conveying surface 3u-1 of the first conveying plate 3-1. In other words, at least a portion of the first conveying surface 3u-1 of the first conveying plate 3-1 is covered by the first laser-reflecting layer 4r-1.

[0187] The first laser reflective layer 4r-1 covering at least a portion of the first conveyor plate 3-1 is made of a material with high laser reflectivity (e.g., copper, silver, or aluminum). The first conveyor plate 3-1 is made of steel, for example, hot-rolled mild steel plate, cold-rolled steel plate, or cold-rolled stainless steel plate.

[0188] The laser reflectivity of the first laser reflective layer 4r-1 is higher than that of the first conveying plate 3-1. The laser reflectivity of the first laser reflective layer 4r-1 is, for example, 70% or more, 80% or more, or 90% or more.

[0189] The first laser reflective layer 4r-1 may also cover only a portion of the first conveying surface 3u-1 of the first conveying plate 3-1 (e.g., the conveying surface of the first intermediate portion 3m-1 of the first conveying plate 3-1). Alternatively, the first laser reflective layer 4r-1 may also cover the entire first conveying surface 3u-1 of the first conveying plate 3-1. Figure 36 In the recorded example, the first laser reflective layer 4r-1 covers at least a portion of the flat conveying surface SF1 of the first conveying plate 3-1.

[0190] The first laser reflective layer 4r-1 has already been described in the first embodiment, so a repeating description of the first laser reflective layer 4r-1 is omitted.

[0191] exist Figure 36 In the described example, the second temperature-inhibiting surface 4-2 includes a surface of a second laser reflective layer 4r-2 that covers at least a portion of the second conveying surface 3u-2 of the second conveying plate 3-2. In other words, at least a portion of the second conveying surface 3u-2 of the second conveying plate 3-2 is covered by the second laser reflective layer 4r-2.

[0192] The second laser reflective layer 4r-2, covering at least a portion of the second conveyor plate 3-2, is made of a material with high laser reflectivity (e.g., copper, silver, or aluminum). The second conveyor plate 3-2 is made of steel, for example, and more specifically, of hot-rolled mild steel sheet, cold-rolled steel sheet, or cold-rolled stainless steel sheet.

[0193] The laser reflectivity of the second laser reflective layer 4r-2 is higher than that of the second conveyor plate 3-2. The laser reflectivity of the second laser reflective layer 4r-2 is, for example, 70% or higher, 80% or higher, or 90% or higher.

[0194] The second laser reflective layer 4r-2 may also cover only a portion of the second conveying surface 3u-2 of the second conveying plate 3-2 (e.g., the conveying surface of the second intermediate portion 3m-2 of the second conveying plate 3-2). Alternatively, the second laser reflective layer 4r-2 may also cover the entire second conveying surface 3u-2 of the second conveying plate 3-2. Figure 36 In the recorded example, the second laser reflective layer 4r-2 covers at least a portion of the flat conveying surface SF2 of the second conveying plate 3-2.

[0195] The second laser reflective layer 4r-2 has already been described in the first embodiment, so a repeating description of the second laser reflective layer 4r-2 is omitted.

[0196] (Second example of a surface that inhibits temperature rise) exist Figure 39 In the described example, the first temperature-inhibiting surface 4-1 includes a surface of a first thermally conductive layer 4c-1 covering at least a portion of the first back surface 3n-1 of the first conveyor plate 3-1 (i.e., the surface of the first conveyor plate 3-1 opposite to the first conveying surface 3u-1). In other words, at least a portion of the first back surface 4n-1 of the first conveyor plate 3-1 is covered by the first thermally conductive layer 4c-1.

[0197] The thermal conductivity of the first heat-conducting layer 4c-1 is higher than that of the first conveying plate 3-1. The first heat-conducting layer 4c-1 is made of a material with high thermal conductivity (e.g., copper, silver, or aluminum). The first conveying plate 3-1 is made of steel, for example, hot-rolled mild steel plate, cold-rolled steel plate, or cold-rolled stainless steel plate.

[0198] The first thermally conductive layer 4c-1 may also cover only a portion of the first back surface 3n-1 of the first conveyor plate 3-1 (e.g., the back surface of the first middle portion 3m-1 of the first conveyor plate 3-1). Alternatively, the first thermally conductive layer 4c-1 may also cover the entire first back surface 3n-1 of the first conveyor plate 3-1.

[0199] The first thermally conductive layer 4c-1 has already been described in the first embodiment, so a repeating description of the first thermally conductive layer 4c-1 is omitted.

[0200] exist Figure 39 In the described example, the second temperature-inhibiting surface 4-2 includes a surface of a second thermally conductive layer 4c-2 that covers at least a portion of the second back surface 3n-2 of the second conveying plate 3-2 (i.e., the surface of the second conveying plate 3-2 opposite to the second conveying surface 3u-2). In other words, at least a portion of the second back surface 4n-2 of the second conveying plate 3-2 is covered by the second thermally conductive layer 4c-2.

[0201] The thermal conductivity of the second heat-conducting layer 4c-2 is higher than that of the second conveying plate 3-2. The second heat-conducting layer 4c-2 is made of a material with high thermal conductivity (e.g., copper, silver, or aluminum). The second conveying plate 3-2 is made of steel, for example, hot-rolled mild steel sheet, cold-rolled steel sheet, or cold-rolled stainless steel sheet.

[0202] The second thermally conductive layer 4c-2 may also cover only a portion of the second back surface 3n-2 of the second conveyor plate 3-2 (e.g., the back surface of the second middle portion 3m-2 of the second conveyor plate 3-2). Alternatively, the second thermally conductive layer 4c-2 may also cover the entire second back surface 3n-2 of the second conveyor plate 3-2.

[0203] The second heat-conducting layer 4c-2 has already been described in the first embodiment, so a repeating description of the second heat-conducting layer 4c-2 is omitted.

[0204] (The third example of a surface that inhibits temperature rise) The third example of a temperature-inhibiting surface is a combination of the first and second examples of temperature-inhibiting surfaces. For example... Figure 39 As illustrated, at least a portion of the first conveying surface 3u-1 of the first conveying plate 3-1 is covered by the first laser reflective layer 4r-1, and at least a portion of the first back surface 3n-1 of the first conveying plate 3-1 is covered by the first thermally conductive layer 4c-1. Furthermore, at least a portion of the second conveying surface 3u-2 of the second conveying plate 3-2 is covered by the second laser reflective layer 4r-2, and at least a portion of the second back surface 3n-2 of the second conveying plate 3-2 is covered by the second thermally conductive layer 4c-2.

[0205] In the first, second, or third example of the temperature-suppressing surface, the main material of the first conveyor plate 3-1 is, for example, steel. Furthermore, the main material of the second conveyor plate 3-2 is, for example, steel.

[0206] In the first, second, or third example of the temperature-suppressing surface, the first temperature-suppressing surface 4-1 is made of, for example, copper, silver, or aluminum. More specifically, the first temperature-suppressing surface 4-1 is made of copper, a copper alloy, aluminum, or an aluminum alloy. Furthermore, the second temperature-suppressing surface 4-2 is made of, for example, copper, silver, or aluminum. More specifically, the second temperature-suppressing surface 4-2 is made of copper, a copper alloy, aluminum, or an aluminum alloy.

[0207] (Fourth example of surface with temperature-inhibiting properties) exist Figure 40 In the described example, the first temperature-inhibiting surface 4-1 includes the surface of a first heat-dissipating member 5-1 configured to contact at least a portion of the first back surface 3n-1 of the first conveying plate 3-1.

[0208] exist Figure 40 In the described example, the slag-hanging conveyor 2B includes a first heat-dissipating member 5-1 supported by a first conveying plate 3-1. The first conveying plate 3-1 has a contact surface 31t that contacts the first heat-dissipating member 5-1. Furthermore, the contact surface 31t includes at least a portion of a first back surface 3n-1 of the first conveying plate 3-1.

[0209] The first heat dissipation component 5-1 is installed on the first conveyor plate 3-1. The first heat dissipation component 5-1 can be installed on the first conveyor plate 3-1 by welding, or by bolts, adhesive sheets, etc.

[0210] exist Figure 40 In the described example, the first heat dissipation member 5-1 includes a first radiator 50-1. The first radiator 50-1 may also have a first base portion 51-1 and a plurality of first heat dissipation fins 52-1 disposed on the first base portion 51-1. In addition to including the first radiator 50-1, the first heat dissipation member 5-1 may also include heat dissipation fins (more specifically, heat-conducting fins with high thermal conductivity) disposed between the first radiator 50-1 and the first conveying plate 3-1. The first radiator 50-1 is, for example, made of aluminum, copper, or ceramic.

[0211] exist Figure 40 In the described example, the first heat dissipation component 5-1 is configured to contact at least a portion of the first intermediate portion 3m-1 (more specifically, the first flat plate portion FP1) of the first conveying plate 3-1.

[0212] The first heat dissipation component 5-1 has already been described in the first embodiment, so a repeating description of the first heat dissipation component 5-1 is omitted.

[0213] exist Figure 40 In the described example, the second temperature suppression surface 4-2 includes the surface of the second heat dissipation member 5-2 configured to contact at least a portion of the second back surface 3n-2 of the second conveyor plate 3-2.

[0214] exist Figure 40 In the described example, the slag-hanging conveyor 2B includes a second heat dissipation member 5-2 supported by a second conveying plate 3-2. The second conveying plate 3-2 has a contact surface 32t that contacts the second heat dissipation member 5-2. Furthermore, the contact surface 32t includes at least a portion of a second back surface 3n-2 of the second conveying plate 3-2.

[0215] The second heat dissipation component 5-2 is installed on the second conveyor plate 3-2. The second heat dissipation component 5-2 can be installed on the second conveyor plate 3-2 by welding, or by bolts, adhesive sheets or other mounting components.

[0216] exist Figure 40 In the described example, the second heat dissipation member 5-2 includes a second radiator 50-2. The second radiator 50-2 may also have a second base portion 51-2 and a plurality of second heat dissipation fins 52-2 disposed on the second base portion 51-2. In addition to including the second radiator 50-2, the second heat dissipation member 5-2 may also include heat dissipation fins (more specifically, heat-conducting fins with high thermal conductivity) disposed between the second radiator 50-2 and the second conveying plate 3-2. The second radiator 50-2 may be made of, for example, aluminum, copper, or ceramic.

[0217] exist Figure 40 In the described example, the second heat dissipation member 5-2 is configured to contact at least a portion of the second intermediate portion 3m-2 (more specifically, the second flat plate portion FP2) of the second conveying plate 3-2.

[0218] The second heat dissipation component 5-2 has already been described in the first embodiment, so a repeating description of the second heat dissipation component 5-2 is omitted.

[0219] (Fifth example of surface with temperature-inhibiting properties) In the first to fourth examples of the temperature-suppressing surface, a first temperature-suppressing surface 4-1 is provided independently of the first conveyor plate 3-1, and a second temperature-suppressing surface 4-2 is provided independently of the second conveyor plate 3-2. In the fifth example of the temperature-suppressing surface, the first conveyor plate 3-1 itself has a temperature-suppressing surface for suppressing the temperature rise of the first conveyor plate 3-1, and the second conveyor plate 3-2 itself has a temperature-suppressing surface for suppressing the temperature rise of the second conveyor plate 3-2.

[0220] exist Figure 41 In the recorded example, the main material of the first conveyor plate 3-1 is copper or aluminum. More specifically, the first conveyor plate 3-1 is made of copper or a copper alloy, or aluminum or an aluminum alloy.

[0221] exist Figure 41 In the described example, at least a portion of the first conveying surface 3u-1 of the first conveyor plate 3-1 is made of copper, a copper alloy, aluminum, or an aluminum alloy. Alternatively, the entire first conveying surface 3u-1 of the first conveyor plate 3-1 may be made of copper, a copper alloy, aluminum, or an aluminum alloy. Figure 41 In the recorded example, at least a portion of the copper or aluminum surface of the first conveying surface 3u-1 constituting the first conveying plate 3-1 is a heat-suppressing surface with high laser reflectivity.

[0222] exist Figure 41 In the recorded example, the main material of the second conveyor plate 3-2 is copper or aluminum. More specifically, the second conveyor plate 3-2 is made of copper or a copper alloy, or aluminum or an aluminum alloy.

[0223] exist Figure 41In the described example, at least a portion of the second conveying surface 3u-2 of the second conveyor plate 3-2 is made of copper, a copper alloy, aluminum, or an aluminum alloy. Alternatively, the entire second conveying surface 3u-2 of the second conveyor plate 3-2 may be made of copper, a copper alloy, aluminum, or an aluminum alloy. Figure 41 In the recorded example, at least a portion of the copper or aluminum surface of the second conveying surface 3u-2 constituting the second conveying plate 3-2 is a heat-suppressing surface with high laser reflectivity.

[0224] (Laser processing device 1B) like Figure 35 As illustrated, the laser processing apparatus 1B includes a slag conveyor 2B, a laser irradiation device 60, a moving device 7, and a control device 8. Alternatively, the laser processing apparatus 1B may also include a workpiece support member 90. The laser irradiation device 60, the moving device 7, the control device 8, and the workpiece support member 90 have already been described in the first embodiment, therefore, a repeated description of their structure is omitted.

[0225] (Third Implementation) Reference Figures 1 to 42 The workpiece processing method of the third embodiment will be described. Figure 42 This is a flowchart illustrating an example of a workpiece processing method according to the third embodiment.

[0226] The workpiece processing method of the third embodiment can be executed using the laser processing apparatus 1A of the first embodiment, the laser processing apparatus 1B of the second embodiment, or other laser processing apparatuses.

[0227] In the first step ST1, workpiece W is processed. The first step ST1 is the workpiece processing step. In this step, workpiece W is processed by irradiating it with laser LB. More specifically, workpiece W is processed by irradiating it with laser LB from the laser head 61 of the laser irradiation device 60. The wavelength of the laser LB emitted from the laser head 61 of the laser irradiation device 60 is, for example, 1060 nm or more and 1080 nm or less.

[0228] The workpiece W processed in the workpiece processing step (first step ST1) is, for example, a sheet metal. The workpiece processing step may also include laser cutting of the workpiece W by moving the laser head 61 that emits the laser LB. Furthermore, the workpiece processing step may also include laser perforation of the workpiece W by emitting the laser LB from the temporarily stationary laser head 61. By processing the workpiece W with the laser LB, a product (e.g., a sheet metal product) is formed from the workpiece W.

[0229] In the workpiece processing step (first step ST1), a slag D is generated from the workpiece W by irradiating it with a laser LB. Optionally, a cut piece CF can also be generated from the workpiece W by irradiating it with a laser LB. The generated slag D and / or cut piece CF fall downwards in the processing area RG1. The falling slag D and / or cut piece CF are received by the slag conveyor 2.

[0230] In the workpiece processing step (first step ST1), the laser LB passing through the workpiece W reaches the slag-coating conveyor 2. The laser LB reaching the slag-coating conveyor 2 heats up a set of conveyor plates 3, including the first conveyor plate 3-1 and the second conveyor plate 3-2. The first conveyor plate 3-1 and the second conveyor plate 3-2 deform due to thermal expansion.

[0231] In the second step ST2, the slag coating D is conveyed. The second step ST2 is the slag coating conveying process. In this process, a set of conveyor plates 3, comprising a first conveyor plate 3-1 extending in the first direction DR1 and a second conveyor plate 3-2 adjacent to the first conveyor plate 3-1 and extending in the first direction DR1, conveys the slag coating D generated by irradiating the workpiece W with laser LB. More specifically, the set of conveyor plates 3 conveys the slag coating D from the processing area RG1 to the discharge area RG2.

[0232] The second step ST2 (slag conveying process) is performed in parallel with the first step ST1 (workpiece processing process). More specifically, while the slag conveyor 2 is driven (in other words, while a set of conveyor plates 3 are moving along the surrounding track OB), laser LB is irradiated onto the workpiece W from the laser irradiation device 60. By irradiating the workpiece W with laser LB, slag D and / or cut pieces CF are generated intermittently or continuously, and the generated slag D and / or cut pieces CF are sequentially conveyed by the slag conveyor 2.

[0233] exist Figure 12 , Figure 14 , Figure 15 , Figure 17 , Figure 18 , Figure 19 , Figure 36 , Figure 39 or Figure 40 In the described example, a workpiece processing step (processing workpiece W) is performed when the first heat-inhibiting surface 4-1, covering at least a portion of the first conveyor plate 3-1, suppresses the temperature rise of the first conveyor plate 3-1 due to the energy of the laser LB. Furthermore, a workpiece processing step (processing workpiece W) is performed when the second heat-inhibiting surface 4-2, covering at least a portion of the second conveyor plate 3-2, suppresses the temperature rise of the second conveyor plate 3-2 due to the energy of the laser LB.

[0234] For example, in Figure 12, Figure 14 , Figure 18 , Figure 36 , Figure 39 or Figure 40 In the described example, a workpiece processing step (processing workpiece W) is performed when the first laser reflective layer 4r-1, covering at least a portion of the first conveying surface 3u-1 of the first conveying plate 3-1, suppresses the heating of the first conveying plate 3-1 due to the energy of the laser LB. For example, during the execution of the workpiece processing step (processing workpiece W), a portion of the laser LB emitted from the laser irradiation device 60 is reflected by the first laser reflective layer 4r-1. Furthermore, a workpiece processing step (processing workpiece W) is performed when the second laser reflective layer 4r-2, covering at least a portion of the second conveying surface 3u-2 of the second conveying plate 3-2, suppresses the heating of the second conveying plate 3-2 due to the energy of the laser LB. For example, during the execution of the workpiece processing step (processing workpiece W), a portion of the laser LB emitted from the laser irradiation device 60 is reflected by the second laser reflective layer 4r-2.

[0235] For example in Figure 15 , Figure 17 , Figure 18 or Figure 39 In the described example, a workpiece processing step (processing workpiece W) is performed when the first heat-conducting layer 4c-1, covering at least a portion of the first back surface 3n-1 of the first conveyor plate 3-1, suppresses the heating of the first conveyor plate 3-1 due to the energy of the laser LB. For example, during the execution of the workpiece processing step (processing workpiece W), the heat generated by the first conveyor plate 3-1 being irradiated by the laser diffuses through the first heat-conducting layer 4c-1. Furthermore, a workpiece processing step (processing workpiece W) is performed when the second heat-conducting layer 4c-2, covering at least a portion of the second back surface 3n-2 of the second conveyor plate 3-2, suppresses the heating of the second conveyor plate 3-2 due to the energy of the laser LB. For example, during the execution of the workpiece processing step (processing workpiece W), the heat generated by the second conveyor plate 3-2 being irradiated by the laser diffuses through the second heat-conducting layer 4c-2.

[0236] For example Figure 19 or Figure 40In the described example, a workpiece processing step (processing workpiece W) is performed when the first heat dissipation member 5-1, configured to contact at least a portion of the first back surface 3n-1 of the first conveyor plate 3-1, suppresses the temperature rise of the first conveyor plate 3-1 due to the energy of the laser LB. For example, during the execution of the workpiece processing step (processing workpiece W), heat generated by the laser irradiation of the first conveyor plate 3-1 is transferred from the first conveyor plate 3-1 to the first heat dissipation member 5-1, and the first heat dissipation member 5-1 releases the heat received from the first conveyor plate 3-1 into the air. Furthermore, a workpiece processing step (processing workpiece W) is performed when the second heat dissipation member 5-2, configured to contact at least a portion of the second back surface 3n-2 of the second conveyor plate 3-2, suppresses the temperature rise of the second conveyor plate 3-2 due to the energy of the laser LB. For example, during the execution of the workpiece processing step (the process of processing workpiece W), the heat generated by the laser irradiation of the second conveyor plate 3-2 is transferred from the second conveyor plate 3-2 to the second heat dissipation component 5-2, and the second heat dissipation component 5-2 releases the heat received from the second conveyor plate 3-2 into the air.

[0237] exist Figure 12 , Figure 14 , Figure 15 , Figure 17 , Figure 18 , Figure 19 , Figure 24 , Figure 36 , Figure 39 , Figure 40 or Figure 41 In the described example, the workpiece processing step (processing workpiece W) is performed while the temperature rise of the first conveyor plate 3-1 is suppressed. Therefore, although the first conveyor plate 3-1 undergoes thermal deformation due to laser irradiation, large thermal deformation reaching thermoplastic deformation is suppressed. Furthermore, the workpiece processing step (processing workpiece W) is performed while the temperature rise of the second conveyor plate 3-2 is suppressed. Therefore, although the second conveyor plate 3-2 undergoes thermal deformation due to laser irradiation, large thermal deformation reaching thermoplastic deformation is suppressed.

[0238] In the third step ST3, a set of conveyor plates 3 is cooled. The third step ST3 is a cooling process. For example, the cooling process is carried out by natural cooling (third step ST3). More specifically, after the workpiece W is processed, the cooling process is carried out by placing a set of conveyor plates 3 at room temperature.

[0239] Alternatively, the cooling process may also include the forced cooling of a set of conveyor plates 3 using at least one of an air-cooled cooling device 95a and a liquid-cooled cooling device 95b. For example... Figure 34As illustrated, the cooling process may also include an air-cooled cooling device 95a blowing air onto a set of conveyor plates 3. Alternatively or additionally, the cooling process may also include passing the set of conveyor plates 3 through a liquid tank 97 containing liquid (e.g., water). Furthermore, the cooling process may also include a liquid-cooled cooling device 95b blowing liquid (e.g., water) onto the set of conveyor plates 3.

[0240] Forced cooling of a set of conveyor plates 3 using at least one of an air-cooled cooling device 95a and a liquid-cooled cooling device 95b can also be performed in parallel with the workpiece processing step (first step ST1) and the slag conveying step (second step ST2).

[0241] In the workpiece processing method of the third embodiment, thermoplastic deformation of the first conveyor plate 3-1 is suppressed, so the first conveyor plate 3-1, after being cooled in the cooling process, returns to its original shape before heat deformation. Furthermore, in the workpiece processing method of the third embodiment, thermoplastic deformation of the second conveyor plate 3-2 is suppressed, so the second conveyor plate 3-2, after being cooled in the cooling process, returns to its original shape before heat deformation. By repeatedly performing the first step ST1 to the third step ST3 described above, although each of the conveyor plates 3 undergoes slight plastic deformation, the degree of plastic deformation is reduced to a level that avoids hindering the operation of the slag conveyor 2.

[0242] This invention is not limited to the above-described embodiments or modifications. It is evident that appropriate modifications or alterations can be made to the embodiments or modifications within the scope of the inventive concept. Furthermore, various techniques used in the embodiments or modifications can be applied to other embodiments or modifications as long as they do not create technical contradictions. Moreover, any additional structures in the embodiments or modifications can be appropriately omitted. Explanation of reference numerals in the attached figures

[0243] 1. Laser processing device (1A, 1B); 2. Slag conveyor (2A, 2B); 3. Conveyor plate (3-1, 3-2, 3-3); 3. Conveyor plate (3-N); 3a, 3a-1, 3a-2, 3a-3 (left end); 3b, 3b-1, 3b-2, 3b-3 (right end); 3e (rear end); 3e-1 (first rear end); 3e-2 (second rear end); 3e-3 (third rear end); 3e-N (rear end of conveyor plate 3-N); 3f (front end); 3f-1 (first front end); 3f-2 (second front end); 3f-3 (third front end); 3m (middle section); 3m-1 (first middle section); 3m-2 (second middle section); 3m-3 (third middle section); 3n (back side); 3n-1 (first back side); 3n-2 (second back side); 3u (conveyor surface); 3u-1 (first conveyor surface); 3u-2 (second back side). Second conveying surface, 4-1 First temperature rise suppression surface, 4-2 Second temperature rise suppression surface, 4c-1 First heat conduction layer, 4c-2 Second heat conduction layer, 4n-1 First back side, 4n-2 Second back side, 4r-1 First laser reflective layer, 4r-2 Second laser reflective layer, 5-1 First heat dissipation component, 5-2 Second heat dissipation component, 7 Moving device, 8 Control device, 11 Transfer device, 12 Workpiece transfer device, 12a Plate transfer device, 13 Container, 15 Second conveyor, 21 First annular component, 21a First annular chain, 22 Second annular component, 22a Second annular chain, 28 Sprockets, 28a First sprocket, 28b Second sprocket, 28c Third sprocket, 28d Fourth sprocket, 29 Drive device, 30e-1 Rear receiving part, 30e-2 Rear receiving part, 30f-1 Front receiving part, 30f-2 Front receiving section, 31t, 32t contact surfaces, 50-1 first radiator, 50-2 second radiator, 51-1 first base section, 51-2 second base section, 52-1 first heat sink, 52-2 second heat sink, 52f-1, 52f-2 heat dissipation fins, 52p-1, 52p-2 heat dissipation pins, 60 laser irradiation device, 61 laser head, 63 laser source, 65 optical components, 70 base, 71 first moving device, 71a first moving body, 71b first driving device, 73 second moving device, 73a second moving body, 73b second driving device, 75 third moving device, 75a third moving body, 75b third driving device, 80 hardware processor, 82 memory, 84 communication circuit, 86 input device, 88 bus, 90 workpiece support component, 91 plate component, 92 top, 93 Frame, 95, 95a, 95b cooling devices, 96 air jet device, 97 liquid tank, 121 suction cup, 822 machining program, 826 workpiece data, 862 display with touch panel.BA1 First buckling section, BB1 Second buckling section, BA2 Third buckling section, BB2 Fourth buckling section, BT Bolt, CF Cutting blade, CP, CP1, CP2 Convex bending sections, D Slag hanger, EG Edge section, FP1 First flat section, FP2 Second flat section, LB Laser, OB Surrounding track, OP Injection port, PT Tray, R1 Injection command, RD1 First rod, RD2 Second rod, RD3 Third rod, RG1 Machining area, RG2 Discharge area, RG3 Removal area, S Movement command, SD1, SD2 Concave back surface, SF1, SF2 Flat conveyor surface, SN1, SN2 Flat back surface, SU1, SU2 Convex conveyor surface, TP Lifting setting section, TP1 First lifting setting section, TP2 Second lifting setting section, W Workpiece, Wb Finished workpiece, h1, h2 Hole section.

Claims

1. A slag-coating conveyor, comprising: A set of conveyor plates, including a first conveyor plate extending in a first direction and a second conveyor plate disposed adjacent to the first conveyor plate and extending in the first direction, conveys slag generated by irradiating a workpiece with a laser; A first temperature-inhibiting surface covers at least a portion of the first conveyor plate, inhibiting the first conveyor plate from heating up due to the energy of the laser; as well as A second temperature-inhibiting surface covers at least a portion of the second conveyor plate, inhibiting the second conveyor plate from heating up due to the energy of the laser.

2. The slag conveyor according to claim 1, wherein, The first temperature-inhibiting surface includes the surface of a first laser-reflective layer that covers at least a portion of the first conveying surface of the first conveyor plate.

3. The slag conveyor according to claim 1 or 2, wherein, The first temperature-inhibiting surface includes a surface of a first thermally conductive layer covering at least a portion of the first back surface of the first conveyor plate. The thermal conductivity of the first thermally conductive layer is higher than that of the first conveyor plate.

4. The slag conveyor according to claim 3, wherein, The first thermally conductive layer is composed of a copper-plated layer, an aluminum-plated layer, or a heat sink.

5. The slag-coating conveyor according to any one of claims 1 to 3, wherein, The main material of the first conveyor plate is steel. The first temperature-inhibiting surface is made of copper, copper alloy, aluminum, or aluminum alloy.

6. The slag conveyor according to any one of claims 1 to 5, wherein, The first temperature suppression surface includes the surface of a first heat dissipation member configured to contact at least a portion of the back side of the first intermediate portion of the first conveyor plate.

7. The slag conveyor according to claim 6, wherein, The first heat dissipation component includes multiple heat dissipation protrusions or multiple heat dissipation fins.

8. The slag-coating conveyor according to any one of claims 1 to 7, wherein, The rear end of the first conveyor plate overlaps with the front end of the second conveyor plate.

9. The slag-coating conveyor according to any one of claims 1 to 7, wherein, The rear end of the first conveyor plate is hinged to the front end of the second conveyor plate.

10. A slag-coating conveyor, wherein, The device comprises a set of conveyor plates, including a first conveyor plate extending in a first direction and a second conveyor plate disposed adjacent to the first conveyor plate and extending in the first direction, for conveying slag generated by irradiating the workpiece with a laser. The main material of the first conveyor plate is copper, copper alloy, aluminum, or aluminum alloy, and at least a portion of the first conveying surface of the first conveyor plate is made of copper, copper alloy, aluminum, or aluminum alloy. The main material of the second conveyor plate is copper, copper alloy, aluminum or aluminum alloy, and at least a portion of the second conveying surface of the second conveyor plate is made of copper, copper alloy, aluminum or aluminum alloy.

11. A laser processing apparatus, comprising: A laser irradiation device, comprising a laser head that irradiates a workpiece with laser light; A moving device that moves the laser head relative to the workpiece support member supporting the workpiece; Control device, controlling the laser irradiation device and the moving device; as well as Slag conveyor The slag conveyor includes: A set of conveyor plates, including a first conveyor plate extending in a first direction and a second conveyor plate disposed adjacent to the first conveyor plate and extending in the first direction, conveys slag generated by irradiating the workpiece with the laser; A first temperature-inhibiting surface covers at least a portion of the first conveyor plate, inhibiting the first conveyor plate from heating up due to the energy of the laser; and A second temperature-inhibiting surface covers at least a portion of the second conveyor plate, inhibiting the second conveyor plate from heating up due to the energy of the laser.

12. The laser processing apparatus according to claim 11, wherein, It includes a cooling device for forced cooling of a set of the conveyor plates.

13. A method for machining a workpiece, comprising: The process of processing the workpiece by irradiating it with a laser; and The process of conveying slag generated by irradiating the workpiece with laser is carried out using a set of conveyor plates, including a first conveyor plate extending in a first direction and a second conveyor plate disposed adjacent to the first conveyor plate and extending in the first direction. The process of processing the workpiece is performed in a state in which the first conveyor plate is prevented from heating up due to the energy of the laser by a first heating suppression surface covering at least a portion of the first conveyor plate, and in a state in which the second conveyor plate is prevented from heating up due to the energy of the laser by a second heating suppression surface covering at least a portion of the second conveyor plate.

14. The workpiece processing method according to claim 13, wherein, The process includes a step of forcibly cooling a set of the conveyor plates using at least one of an air-cooled cooling device and a liquid-cooled cooling device. The process of forcibly cooling a set of conveyor plates is performed in parallel with the process of processing the workpiece and the process of conveying the slag.

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