Temperature control device based on square partition heat two-way active transportation

Abstract

The invention discloses a temperature control device based on square partition heat two-way active transportation, and belongs to vacuum environment temperature control equipment. A cylindrical vacuum inner tank body is fixedly arranged in a cylindrical vacuum outer tank body, an annular cylindrical vacuum cavity is arranged between the inner wall surface of the cylindrical vacuum outer tank body and the outer wall surface of the cylindrical vacuum inner tank body, and an annular circulating cooling water cavity is arranged on the inner wall surface of a cylindrical side plate of the cylindrical vacuum inner tank body. A square electric heating radiant panel assembly is arranged in a cavity of the cylindrical vacuum inner tank body, a temperature controller and a vacuum pump assembly are fixedly arranged outside the cylindrical vacuum outer tank body, and the temperature controller is communicated with the square electric heating radiant panel assembly. The vacuum pump assembly is respectively communicated with the vacuum cavity of the cylindrical vacuum outer tank body and the annular circulating cooling water cavity of the cylindrical vacuum inner tank body; according to the device, a heat bidirectional active transport structure is added on the basis of partition heat radiation, so that the temperature control efficiency is improved, the uniformity of heat distribution is optimized, and accurate regulation and control of the temperature in a vacuum environment are realized.

Description

Technical Field

[0001] This invention belongs to the technical field of vacuum environment temperature control equipment, and mainly relates to a temperature control device based on bidirectional active heat transport in a square partition. Background Technology

[0002] As the development level of ultra-precision instruments and equipment continues to improve, the requirements for the working environment of precision instruments and equipment are becoming more stringent. Even slight environmental changes can have a significant impact on the accuracy of the instruments. Among them, thermal disturbance is one of the main sources of error. For example, in the interferometer lens group of a molecular measuring machine that works in a vacuum environment, the laser will generate thermal interference, causing changes in the air refractive index and thermal deformation of optical components, resulting in measurement errors. Therefore, it is necessary to control the working environment temperature of the instruments efficiently and accurately.

[0003] In the prior art, patent application CN201710290677.7 discloses a zoned temperature control system for a vacuum furnace used in heat treatment: the vacuum furnace chamber is divided into several independent zones, each equipped with a heater. Temperature is monitored by sensors, and a controller adjusts the heating power to regulate the temperature within the furnace chamber and ensure temperature uniformity. This device can achieve a uniform temperature distribution in the vacuum environment; however, each zone is independent, and the temperature of each zone can only be adjusted by regulating the power of the controller. It cannot respond quickly when adjusting for temperature uniformity, and when the power of a certain module is excessive or insufficient, adjustment can only be made by regulating the heating power of the controller. Patent application CN202210086786.8 discloses a multi-zone independent temperature control method for thermal vacuum testing, which uses a heat-conducting medium to adjust the cooling or heating amount and controls the temperature of the temperature-controlled zones through radiative heat exchange. However, it also suffers from the problem of relatively independent temperature-controlled zones. Patent application CN202411532728.9 discloses a temperature control device and method for a three-axis rotary table in a vacuum environment: the heating circuit consists of several electrically connected heating elements, different heating circuits are set on the surface of the three-axis rotary table, and the heating power is regulated by a control module. A heat dissipation surface is also provided to adjust the temperature distribution of the three-axis rotary table in a vacuum environment. However, the use of radiation heat dissipation is inefficient and cannot achieve rapid temperature regulation. Furthermore, each heating module heats the three-axis rotary table through heat conduction, resulting in a relatively fast but independent heating speed, poor heat transfer, and low temperature control accuracy.

[0004] In summary, considering the thermal stability requirements of precision instruments in a vacuum environment, independent zone temperature control cannot achieve localized heat transfer and power regulation, and the temperature control accuracy for a single zone is low and the control speed is slow. The aforementioned technologies cannot meet the operating environment control requirements of precision instruments for high thermal stability and fast temperature control response. Summary of the Invention

[0005] The purpose of this invention is:

[0006] To address the shortcomings of the existing technology, this invention provides a temperature control device based on bidirectional active heat transfer in a square partition. It utilizes a square electric heating radiant plate for partitioned temperature control, a semiconductor cooling chip for bidirectional active heat transfer between partitions, and a controller to regulate the power of the heaters in each partition and the input voltage of the semiconductor cooling chip, thereby achieving the goal of meeting the working environment control requirements of high thermal stability and fast temperature control response of precision instruments.

[0007] The objective of this invention is achieved as follows:

[0008] This application provides a temperature control device based on bidirectional active heat transport in a square partition, including a temperature controller, a cylindrical vacuum inner tank fixed inside a cylindrical vacuum outer tank, an annular vacuum cavity between the inner wall of the cylindrical vacuum outer tank and the outer wall of the cylindrical vacuum inner tank, an annular circulating cooling water cavity on the inner wall of the cylindrical side plate of the cylindrical vacuum inner tank, a square electrothermal radiation plate assembly installed inside the cavity of the cylindrical vacuum inner tank, and a temperature controller and vacuum pump assembly fixed outside the cylindrical vacuum outer tank. The square electrothermal radiation plate assembly is composed of square electrothermal radiation plates, semiconductor cooling chips, and temperature sensors. Adjacent square electrothermal radiation plates are spliced ​​together through a common edge to form a cylindrical matrix-like dense arrangement structure. A semiconductor cooling chip is embedded in each common edge, the plane of the semiconductor cooling chip completely coincides with the common edge, and its length is consistent with the side length of the square electrothermal radiation plate. The cold end of the semiconductor cooling chip is connected to the adjacent square edge. The heat-absorbing surfaces of the electric heating radiant plates are attached, and the hot end of the thermoelectric cooler is attached to the heat dissipation surface of the adjacent square electric heating radiant plate. By controlling the installation method and current direction of the thermoelectric cooler, heat is actively transported from the high-temperature unit to the low-temperature unit along a bidirectional alternating path. A temperature sensor is attached to the center of the surface of the square electric heating radiant plate, and the temperature sensor is connected to the temperature controller via a signal line. The temperature controller calculates the local temperature gradient caused by thermal disturbance inside the square electric heating radiant plate assembly based on real-time data from the temperature sensor. The temperature controller dynamically adjusts the heating power of the corresponding square electric heating radiant plate and the input voltage from the adjacent radiant plates to the thermoelectric cooler based on the calculated temperature gradient, so that heat is transported along a preset bidirectional path, and the heat accumulated on both sides of the square electric heating radiant plate assembly is evenly dispersed. By reducing the heating power of the square electric heating radiant plate where heat is concentrated, the temperature consistency of the square electric heating radiant plate assembly is ensured. The annular circulating cooling water cavity on the surface of the cylindrical vacuum inner tank provides a cold source background, which, together with the square electric heating radiation plate assembly, controls the temperature of the controlled target within the set temperature range.

[0009] The beneficial effects of this invention are:

[0010] This invention provides a temperature control device based on bidirectional active heat transfer in a square partition. During operation, the device precisely controls the heat flow path from the heat source area to the remaining heat radiation partitions by pre-setting the current direction of the semiconductor cooling chip. When local thermal interference occurs, the heating power of the heat radiation plates is reduced to maintain overall temperature consistency, and the locally concentrated heat is rapidly and directionally conducted to other heat radiation partitions in the bidirectional heat transfer path for even distribution, improving the response speed to local temperature changes. Simultaneously, the series connection of the heat radiation plates expands the control range of the heat radiation power, and the water-cooled heat sink provides a cold source background for maintaining the set temperature of the heat radiation partitions. When a sudden thermal interference is detected on the heat radiation plates on both sides of the square electric heat radiation plate assembly, heat can be rapidly conducted to the center of the assembly, i.e., to the other square electric heat radiation plates in the bidirectional transport path, through the adjacent semiconductor cooling chip, reducing the temperature difference between the plates and simultaneously reducing the heating power of the electric heat radiation plates in this path, forming a thermal isolation zone. The remaining square heat radiation plates can maintain their original temperature settings, preventing the spread of thermal interference.

[0011] The square partitioned radiative temperature control structure uses a dense arrangement of shared sides to form a continuous radiative heat surface. The square partitions have the characteristic of central symmetry, which allows heat to be distributed more evenly during the radiative temperature control process. Moreover, the regular geometric shape of the square facilitates the calculation of parameters such as the amount of radiative heat and the heat transfer efficiency of each partition. This allows the control system to more accurately adjust the heating power of each partition based on these precise calculation results, thereby achieving high-precision temperature control.

[0012] By controlling the installation method of the semiconductor cooling chip, heat can be transferred from both sides of the thermal radiation partition assembly to the opposite side, dispersing the concentrated heat pollution on both sides and realizing bidirectional heat transfer on demand. This can increase the power control range of the thermal radiation partitions at both ends of the thermal radiation partition assembly, solve the problem of severe heat pollution at both ends of the controlled target, eliminate the need for mechanical moving parts, and improve temperature control efficiency and temperature stability.

[0013] By actively transporting heat, independent radiant heat panels are connected in series, and the heat accumulated on both sides is transferred towards each other. During the transport process, the concentrated heat caused by interference sources is evenly dispersed, reducing the temperature difference of the radiant heat panels and increasing the radiant heat area. Compared with radiant heat zoning with small area and high temperature difference, this method can improve the speed at which the radiant heat zoning zone and the cold source reach the set temperature, thereby increasing the temperature control efficiency. The power adjustment range of a single radiant heat panel is limited, so the zoning structure with independent temperature control may not be able to complete the temperature regulation task of eliminating severe thermal interference. The structure of multiple radiant heat panels connected in series can increase the power adjustment range many times over to cope with severe thermal pollution and improve the applicability of the device. At the same time, heat can be quickly transported bidirectionally to the low-thermal-sensitive area, preventing the long-term accumulation of heat from adversely affecting the temperature-sensitive area. This invention solves the problem in existing technologies where uneven heat distribution necessitates independent adjustment of the power of each radiant heat plate by the controller for temperature control. By actively transporting heat and increasing the heat transfer path, the temperature control range of radiant heat control is improved. Simultaneously, heat is actively transported and distributed across multiple radiant heat plates. The larger connected radiant heat area allows for a faster temperature control response, significantly reducing the temperature gradient in a short time and eliminating sudden heat abrupt changes on both sides of the square radiant heat plate assembly. This ensures that the overall temperature control device can quickly achieve temperature uniformity and also solves the problems of divergent heat transport direction and uncontrolled transport power, significantly improving temperature control efficiency and accuracy. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of a temperature control device based on bidirectional active heat transport in a square partition.

[0015] Figure 2 This is a schematic diagram of a square electric heating radiant panel assembly structure;

[0016] Figure 3 This is a schematic diagram of the heat transport direction of a square electric radiant panel assembly;

[0017] Figure 4 This is a schematic diagram of the vacuum pump assembly structure.

[0018] Part numbers in the diagram: 1. Cylindrical vacuum outer tank; 2. Cylindrical vacuum inner tank; 3. Square electric heating radiation plate assembly; 3-1 Square electric heating radiation plate; 3-2 Semiconductor cooling chip; 3-2-1 Cold end of cooling chip; 3-2-2 Hot end of cooling chip; 3-3 Temperature sensor; 4. Temperature controller; 5. Vacuum pump assembly; 5-1 Vacuum gauge; 5-2 Backing pump; 5-3 Main pump; 5-4 Chiller; 5-5 Water pipe A; 5-6 Water pipe B; 5-7 Water pipe C; 5-8 Gas pipe A; 5-9 Gas pipe B; 5-10 Gas pipe C; 5-11 Gas pipe D; 6. Annular circulating cooling water chamber. Detailed Implementation

[0019] The embodiments of the present invention will now be clearly and completely described with reference to the accompanying drawings.

[0020] This invention provides a temperature control device based on bidirectional active heat transport in a square partition, see [link to related document]. Figures 1-4 The system includes a temperature controller 4, a cylindrical vacuum inner tank 2 fixed inside a cylindrical outer vacuum tank 1, an annular vacuum cavity between the inner wall of the cylindrical outer vacuum tank 1 and the outer wall of the cylindrical inner vacuum tank 2, an annular circulating cooling water cavity 6 on the inner wall of the cylindrical side plate of the cylindrical inner vacuum tank 2, a square electric heating radiation plate assembly 3 installed inside the cavity of the cylindrical inner vacuum tank 2, and a temperature controller 4 and a vacuum pump assembly 5 fixed outside the cylindrical outer vacuum tank 1.

[0021] The square electric heating radiation plate assembly 3 is composed of square electric heating radiation plates 3-1, semiconductor cooling chips 3-2, and temperature sensors 3-3. Adjacent square electric heating radiation plates 3-1 are spliced ​​together through a common edge to form a cylindrical matrix-like dense arrangement structure. A semiconductor cooling chip 3-2 is embedded in each common edge, with the plane of the semiconductor cooling chip 3-2 completely overlapping the common edge and its length being the same as the side length of the square electric heating radiation plate 3-1. The cold end 3-2-1 of the semiconductor cooling chip 3-2 is in contact with the heat absorption surface of the adjacent square electric heating radiation plate 3-1, and the hot end 3-2-2 of the semiconductor cooling chip 3-2 is in contact with the heat dissipation surface of the adjacent square electric heating radiation plate 3-1. The active transport of heat from the high-temperature unit to the low-temperature unit along a bidirectional alternating path is achieved by controlling the current direction. A temperature sensor 3-3 is attached to the center of the surface of the square electric heating radiation plate 3-1. The temperature sensor 3-3 is connected to the temperature controller 4 via a signal line. The temperature controller 4 calculates the local temperature gradient caused by thermal disturbance inside the square electric heating radiation plate assembly 3 based on the real-time data of the temperature sensor 3-3. The temperature controller 4 dynamically adjusts the heating power of the corresponding square electric heating radiation plate 3-1 and the input voltage of the adjacent radiation plate to the semiconductor cooling chip 3-2 based on the calculated temperature gradient, so that the heat is transported along a preset bidirectional path, and the heat gathered on both sides is evenly dispersed and transferred to the cylindrical vacuum inner tank 2 through thermal radiation. The annular circulating cooling water cavity 6 set on the surface of the cylindrical vacuum inner tank 2 provides a cold source background, which works together with the square electric heating radiation plate assembly 3 to control the temperature of the controlled target within the set temperature range.

[0022] The vacuum pump assembly 5 includes a vacuum gauge 5-1, a backing pump 5-2, a main pump 5-3, and a circulating chiller 5-4. The vacuum gauge 5-1, the backing pump 5-2, and the main pump 5-3 are connected to the vacuum inner cavity of the cylindrical vacuum outer tank 1 through gas pipes A 5-8, B 5-9, and C 5-10, respectively. The backing pump 5-2 and the main pump 5-3 are connected to each other through gas pipe D 5-11. The circulating chiller 5-4 is connected to the annular circulating cooling water cavity 6 on the cylindrical vacuum inner tank 2 and the main pump 5-3 through water pipes A 5-5 and B 5-6, respectively. Water pipe C 5-7 connects the main pump 5-3 to the backing pump 5-2.

[0023] During operation, the circulating cooling water flows continuously in the annular circulating cooling water chamber 6, the circulating chiller 5-4, the fore-pump 5-2, and the main pump 5-3 to provide a low-temperature background. Each square electric heating radiant plate 3-1 is set with the same initial heating power to maintain the initial temperature of the square electric heating radiant plate assembly 3. The side surfaces of the square electric heating radiant plates 3-1 are thermally connected by semiconductor cooling chips 3-2, establishing an active heat transport channel. Heat is transported according to a pre-defined direction: the cold end 3-2-1 of the semiconductor cooling chip 3-2 is attached to the square electric heating radiant plate 3-1 receiving the heat, and the hot end 3-2-2 of the semiconductor cooling chip 3-2 is attached to the square electric heating radiant plate 3-1 transporting the heat. Simultaneously, a temperature sensor 3-3 monitors the temperature in real time. A temperature controller 4 automatically controls the input power of each square electric heating radiant plate 3-1 based on the signal measured by the temperature sensor 3-3 and the pre-defined temperature control range. When the measured temperature exceeds the set temperature, the temperature controller 4 reduces the heating power and changes the input voltage of the semiconductor cooling chip 3-2, increasing the semiconductor cooling output. The temperature difference between the cold end 3-2-1 and the hot end 3-2-2 of the cooling plate 3-2 increases the heat transport power. The inner surface of the square electric heating radiation plate assembly 3 exchanges heat with the heat source that generates thermal disturbance inside. When a temperature gradient is generated on the surface of the square electric heating radiation plate assembly 3, the temperature controller 4 will reduce the heating power of the heat radiation plate where the heat is concentrated, and maintain a consistent heat distribution on the surface of the controlled target. The square electric heating radiation plate assembly 3 and the annular circulating cooling water cavity 6 set on the inner wall of the cylindrical vacuum inner tank 2 work together to stabilize the temperature at the set value. Heat is actively transported bidirectionally between the square electric heating radiation plates 3-1, avoiding the problem of heat accumulation on both sides of the controlled target and the inability to dissipate heat quickly inside the device, thus improving the temperature control efficiency and ensuring the uniformity of the internal temperature and the thermal stability of the temperature control device. During the operation of the device, the fore-pump 5-2 starts running first, and the vacuum gauge 5-1 monitors the air pressure inside the cylindrical vacuum outer tank 1. When the air pressure drops to a certain value, the main pump 5-3 starts running until the vacuum degree reaches the working requirements of the device. During this process, the circulating chiller 5-4 is always in operation.

Claims

1. A temperature control device based on square partition heat bidirectional active transport, comprising a temperature controller (4), characterized in that: In the cylindrical vacuum outer tank (1), a cylindrical vacuum inner tank (2) is fixed, a ring-shaped vacuum cavity is arranged between the inner wall of the cylindrical vacuum outer tank (1) and the outer wall of the cylindrical vacuum inner tank (2), a ring-shaped circulating cooling water cavity (6) is arranged on the inner wall of the cylindrical side plate of the cylindrical vacuum inner tank (2), a square-shaped electric heating radiation plate assembly (3) is arranged in the cavity of the cylindrical vacuum inner tank (2), and the temperature controller (4) and the vacuum pump assembly (5) are fixedly arranged outside the cylindrical vacuum outer tank (1). The square-shaped electric heating radiation plate assembly (3) is composed of a square-shaped electric heating radiation plate (3-1), a semiconductor refrigeration sheet (3-2) and a temperature sensor (3-3). Adjacent square-shaped electric heating radiation plates (3-1) are spliced by sharing edges to form a cylindrical matrix dense arrangement structure. A semiconductor refrigeration sheet (3-2) is arranged on each shared edge. The plane of the semiconductor refrigeration sheet (3-2) is completely coincident with the shared edge, and the length of the semiconductor refrigeration sheet (3-2) is consistent with the length of the square-shaped electric heating radiation plate (3-1). The cold end (3-2-1) of the semiconductor refrigeration sheet (3-2) is attached to the heat absorption surface of the adjacent square-shaped electric heating radiation plate (3-1), and the hot end (3-2-2) of the semiconductor refrigeration sheet (3-2) is attached to the heat dissipation surface of the adjacent square-shaped electric heating radiation plate (3-1). The installation mode and current direction of the semiconductor refrigeration sheet (3-2) are controlled to realize the active transport of heat from the high-temperature unit to the low-temperature unit along the bidirectional alternate path. The temperature sensor (3-3) is attached to the center of the surface of the square-shaped electric heating radiation plate (3-1), and the temperature sensor (3-3) is in communication with the temperature controller (4) through a signal line. The temperature controller (4) calculates the local temperature gradient caused by the thermal disturbance in the square-shaped electric heating radiation plate assembly (3) according to the real-time data of the temperature sensor (3-3). The temperature controller (4) dynamically adjusts the heating power of the corresponding square-shaped electric heating radiation plate (3-1) and the input voltage of the adjacent radiation plate to the semiconductor refrigeration sheet (3-2) according to the calculated temperature gradient, so that the heat is transported along the preset bidirectional path, the heat gathered on both sides of the square-shaped electric heating radiation plate assembly (3) is uniformly dissipated, the heating power of the square-shaped electric heating radiation plate (3-1) with concentrated heat is reduced, and the temperature consistency of the square-shaped electric heating radiation plate assembly (3) is ensured. The ring-shaped circulating cooling water cavity (6) on the surface of the cylindrical vacuum inner tank (2) provides a cold source background, and cooperates with the square-shaped electric heating radiation plate assembly (3) to control the target temperature within a set temperature range.

2. The temperature control device based on square partitioned heat bidirectional active transport of claim 1, wherein: The vacuum pump assembly (5) comprises a vacuum gauge (5-1), a backing pump (5-2), a main pump (5-3) and a circulating cold water machine (5-4), the vacuum gauge (5-1), the backing pump (5-2) and the main pump (5-3) are communicated with the vacuum inner cavity of the cylindrical vacuum outer tank body (1) through air pipes A (5-8), B (5-9) and C (5-10) respectively, the backing pump (5-2) and the main pump (5-3) are communicated with each other through an air pipe D (5-11), the circulating cold water machine (5-4) is communicated with the annular circulating cooling water cavity (6) on the cylindrical vacuum inner tank body (2) and the main pump (5-3) through water pipes A (5-5) and B (5-6) respectively, and a water pipe C (5-7) communicates the main pump (5-3) with the backing pump (5-2).

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