Test structure of semiconductor test equipment

Abstract

The invention discloses a test structure of semiconductor test equipment, and relates to the technical field of semiconductor test. The testing structure of the semiconductor testing equipment comprises a conveying line, a tray used for placing chips is installed on the conveying line, and detection devices used for judging the states of the chips are arranged on the two sides of the conveying line respectively. The detection device comprises a first base, the first base is slidably connected with a second base, the first base is provided with a connecting hole, the connecting hole is in threaded connection with a position adjusting piece, the position adjusting piece is rotatably connected with a connecting plate, the connecting plate is connected to the second base, and the position adjusting piece can drive the second base to vertically move after rotating; a mounting column is arranged on the second base, a plurality of mounting seats are connected to the mounting column in a sliding manner, a locking piece for limiting the mounting seat on the mounting column is detachably mounted on each mounting seat, and an optical fiber sensor is detachably mounted on each mounting seat. The position of the detection device is convenient to adjust.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor testing, and in particular to a test structure for a semiconductor testing device. Background Technology

[0002] In the field of semiconductor packaging and testing, commonly used semiconductor packaging and testing equipment usually consists of multiple different types of machines, such as sorting machines, chip mounters, and test benches. During testing, the chip needs to be placed on a dedicated tray, and then the tray and chip are transported together to different machines to complete different processes and thus complete the semiconductor packaging and testing.

[0003] Typically, before the pallets are transported to the workstations of the aforementioned machines via conveyor lines, and before processes such as picking, marking, and testing are performed, the status of the chips on the pallets needs to be assessed, such as presence and orientation. Orientation assessment refers to identifying whether the chips are skewed, stacked, or upright. Presence detection prevents the robotic arm from missing the chips during subsequent processes, while orientation assessment is used to prevent the chip structure from being damaged or to avoid affecting subsequent processes when the robotic arm picks them up.

[0004] Typically, to determine the presence and orientation of a chip, two detection devices, such as two sets of fiber optic sensors, are installed. The detection characteristics of the fiber optic sensors, such as their through-beam characteristics, are used to quickly complete the determination task.

[0005] In the traditional structure, when it is necessary to judge chips with different package heights, the position of the detection device needs to be adjusted accordingly, such as adjusting the horizontal and vertical positions. Currently, the optimal sensing position is usually found manually based on experience and repeated testing. This adjustment method is not only time-consuming and labor-intensive, but also unreliable. Summary of the Invention

[0006] To facilitate the adjustment of the position of the testing device, this application provides a test structure for a semiconductor testing device.

[0007] The semiconductor testing equipment testing structure provided in this application adopts the following technical solution: A semiconductor testing equipment test structure includes a conveyor line, on which a tray for placing chips is mounted, and on one side of the conveyor line is a detection device for judging the status of the chips. The detection device includes a first base, on which a second base is slidably connected. The first base has a connecting hole, and an adjusting member is threadedly connected to the connecting hole. The adjusting member is rotatably connected to a connecting plate, which is connected to the second base. The adjusting member is configured to rotate and cause the second base to move vertically. The second base has a mounting column, which is horizontally positioned. Multiple mounting seats are slidably connected to the mounting column and arranged along the conveying direction of the conveyor line. Each mounting seat is detachably equipped with a locking member to confine it to the mounting column. Each mounting seat is detachably equipped with an optical fiber sensor, which is configured to be installed at different positions on the mounting seat.

[0008] By adopting the above technical solution, rotating the adjusting component can drive the connecting plate to move vertically, thereby driving the second base to move vertically for adjustment, which is the vertical adjustment of the fiber optic sensor; releasing the locking component from the mounting base allows the mounting base to move horizontally, which is the horizontal adjustment of the fiber optic sensor. This application facilitates the horizontal and vertical adjustment of fiber optic sensors for chips with different package heights to meet testing requirements.

[0009] When the conveyor line transports the tray and chip through the detection device, the presence of the chip can be determined based on the principle of detecting by emitting light from a fiber optic sensor.

[0010] By installing different fiber optic sensors at different positions on corresponding mounting bases, the chip's attitude can be easily determined based on the detection of multiple sets of fiber optic sensors installed at different positions as the conveyor line transports the tray and chip through the detection device.

[0011] Preferably, the mounting base has a plurality of first connection holes, and the fiber optic sensor has a second connection hole. The second connection hole and one of the first connection holes are connected together with a fastener, and the second connection hole can be mated with any of the first connection holes.

[0012] By adopting the above technical solution, after removing the fastener, any of the first connection holes can be connected to the second connection hole and the fastener can be reinstalled, thereby changing the installation position of the fiber optic sensor.

[0013] Preferably, the mounting base includes a through sliding hole, and the mounting post is slidably connected to the sliding hole; the mounting base has a mounting hole that extends through to the sliding hole, the locking element is a pressing bolt, the pressing bolt is threadedly connected to the mounting hole, and an elastic pad is provided at one end of the pressing bolt near the mounting post.

[0014] By adopting the above technical solution, rotating the anti-compression bolt can drive the anti-compression bolt to move, thereby driving the elastic pad to move and press against the mounting column, thus locking the mounting seat on the mounting column.

[0015] Preferably, the second base is provided with a guide post, the guide post is arranged in the same direction as the connecting hole, the first base has a guide hole, and the guide post is slidably connected to the guide hole.

[0016] By adopting the above technical solution, the second base can be guided.

[0017] Preferably, a compression spring is fitted on the guide post, with one end of the compression spring connected to the second base and the other end connected to the first base.

[0018] By adopting the above technical solution, when the second base is subjected to external force, the compression spring can provide space for displacement of the second base, but can also ensure the reliable position of the second base, i.e. the fiber optic sensor, under normal conditions.

[0019] Preferably, the first base is provided with a first scale and a second scale, the first scale is vertically arranged and located on one side of the second base, and the second scale is horizontally arranged and located on one side of the mounting column.

[0020] By adopting the above technical solution, the vertical position of the second base and the fiber optic sensor can be easily determined by referring to the first scale, while the horizontal position of the second base and the fiber optic sensor can be easily determined by referring to the second scale.

[0021] Preferably, the connecting plate has a first mating hole, and the second base has a second mating hole, and the first and second mating holes are detachably connected to a locking element.

[0022] By adopting the above technical solution, the connection between the second base and the connecting plate can be released after the locking parts are removed, thus facilitating the maintenance of the fiber optic sensor.

[0023] Preferably, the tray has a receiving slot for placing the chip; the tray also has a through detection slot connected to the receiving slot, and the fiber optic sensor can emit light into the detection slot and illuminate the chip.

[0024] By adopting the above technical solution, it is easy to place the chip in the tray and ensure the chip's position is reliable. Based on the fact that the light emitted by the fiber optic sensor is directed onto the chip through the detection slot, it is easy to complete the determination of the chip's existence and attitude.

[0025] In summary, the present invention has at least one of the following beneficial technical effects: 1. By rotating the adjusting component, the connecting plate can be moved vertically, thereby causing the second base to move vertically for adjustment, which is the vertical adjustment of the fiber optic sensor. Releasing the locking component from the mounting base allows the mounting base to move horizontally, which is the horizontal adjustment of the fiber optic sensor. This application facilitates the vertical and horizontal adjustment of fiber optic sensors for chips with different package heights to meet testing requirements. When the conveyor line transports the tray and chip through the detection device, the presence of the chip can be determined based on the principle of light emitted by the fiber optic sensor. 2. By installing different fiber optic sensors at different positions on the corresponding mounting base, the chip's attitude can be easily determined based on the detection of multiple sets of fiber optic sensors installed at different positions when the conveyor line transports the tray and chip through the detection device. 3. When the second base is subjected to external force, the compression spring can provide space for displacement of the second base, but can also ensure the reliable position of the second base, i.e. the fiber optic sensor, under normal conditions. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of a semiconductor testing device test structure according to an embodiment of this application; Figure 2 This is a schematic diagram illustrating the structure of the detection device from one perspective. Figure 3 This is a cross-sectional view used to illustrate the testing device; Figure 4 This is a structural schematic diagram used to illustrate the detection device from another perspective; Figure 5 This is a top view used to illustrate the detection device; Figure 6 This is a structural schematic diagram used to illustrate the first connecting hole; Figure 7 This is a cross-sectional view used to illustrate the elastic pad; Figure 8 This is a structural diagram used to illustrate the pallet.

[0027] The attached diagram is labeled as follows: 1. Conveyor line; 2. Tray; 21. Receiving slot; 22. Detection slot; 3. Detection device; 31. First base; 311. Guide hole; 312. Connecting hole; 313. Limiting window; 314. First scale; 315. Second scale; 32. Second base; 321. Guide post; 33. Adjustment component; 34. Connecting plate; 341. First mating hole; 35. Mounting post; 36. Mounting base; 361. Locking component; 362. First connecting hole; 363. Sliding hole; 364. Mounting hole; 37. Fiber optic sensor; 371. Second connecting hole; 38. Compression bolt; 381. Elastic pad; 39. Compression spring. Detailed Implementation

[0028] The present invention will be further described in detail below with reference to the accompanying drawings.

[0029] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0030] This application discloses a test structure for a semiconductor testing device. It enables rapid adjustment of the testing device position based on chips with different package heights to meet testing requirements.

[0031] Reference Figure 1 A semiconductor testing equipment test structure includes a conveyor line 1, such as a belt conveyor mechanism, a tray 2 for placing chips is installed on the conveyor line 1, and a detection device 3 for judging the status of the chips is provided on both sides of the conveyor line 1.

[0032] The tray 2 containing the chip is transported by the conveyor line 1 to between two detection devices 3, which are used to determine the presence and orientation of the chip.

[0033] Reference Figure 2 and Figure 3 Taking one of the detection devices 3 as an example: the detection device 3 includes a first base 31, and a second base 32 is slidably connected to the first base 31; specifically, the second base 32 is provided with a guide post 321, the guide post 321 is vertically arranged, the first base 31 has a guide hole 311, and the guide post 321 is slidably connected to the guide hole 311. Therefore, the second base 32 can move up and down.

[0034] Reference Figure 2 and Figure 4 The first base 31 has a connecting hole 312, which is vertically oriented. An adjusting member 33, such as a bolt, is threaded onto the connecting hole 312. A connecting plate 34 is rotatably connected to the bottom of the adjusting member 33. The connecting plate 34 is connected to the second base 32. Rotation of the adjusting member 33 causes the second base 32 to move vertically. Furthermore, to limit the travel of the second base 32, the first base 31 has a limiting window 313. The connecting plate 34 is located within the limiting window 313. When the connecting plate 34 moves upward until it abuts against the upper surface of the limiting window 313, it reaches its upper limit position. When the connecting plate 34 moves downward until it abuts against the lower surface of the limiting window 313, it reaches its lower limit position.

[0035] Reference Figure 5 The second base 32 is provided with a mounting post 35, which is arranged horizontally. Multiple mounting seats 36 are slidably connected to the mounting post 35. The multiple mounting seats 36 are arranged along the conveying direction of the conveyor line 1. Each mounting seat 36 is detachably equipped with a locking member 361 for limiting the mounting seat 36 to the mounting post 35. Each mounting seat 36 is detachably equipped with an optical fiber sensor 37. The optical fiber sensor 37 can be installed at different positions on the mounting seat 36. In this embodiment, the optical fiber sensor 37 is a through-beam optical fiber sensor 37. Specifically, if the optical fiber sensor 37 of one detection device 3 is the transmitting end, then the optical fiber sensor 37 of the other detection device 3 is the receiving end. Each optical fiber sensor 37 that is the transmitting end and the corresponding optical fiber sensor 37 that is the receiving end form a group.

[0036] Rotating the adjusting component 33 causes the connecting plate 34 to move vertically, which in turn causes the second base 32 to move vertically for adjustment, thus adjusting the vertical position of the fiber optic sensor 37. Releasing the locking component 361 from the mounting base 36 causes the mounting base 36 to move horizontally, thus adjusting the horizontal position of the fiber optic sensor 37.

[0037] Reference Figure 5 and Figure 6 Specifically, the mounting base 36 has multiple first connecting holes 362, which are vertically and evenly arranged. Figure 2 The fiber optic sensor 37 has a second connection hole 371, which, along with a first connection hole 362, is connected to a fastener, such as a screw. The second connection hole 371 can mate with any of the first connection holes 362. By matetting the second connection hole 371 with different first connection holes 362 and locking it with the fastener, the mounting base 36 can be easily adjusted.

[0038] Reference Figure 5 , Figure 6 and Figure 7 The mounting base 36 includes a through sliding hole 363, which is horizontally arranged, and the mounting post 35 is slidably connected to the sliding hole 363. The mounting base 36 has a mounting hole 364 that extends through the sliding hole 363 and is vertically arranged. The locking element 361 is a pressing bolt 38, which is threadedly connected to the mounting hole 364. An elastic washer 381 is provided at the end of the pressing bolt 38 near the mounting post 35.

[0039] Rotating the anti-compression bolt 38 will cause the anti-compression bolt 38 to move downward, thereby causing the elastic pad 381 to move downward to press against the mounting post 35, thus locking the mounting seat 36 onto the mounting post 35.

[0040] Reference Figure 3In order to facilitate the horizontal and vertical adjustment of the second base 32, i.e. the fiber optic sensor 37, the first base 31 is provided with a first scale 314 and a second scale 315. The first scale 314 is vertically arranged and located on one side of the second base 32, and the second scale 315 is horizontally arranged and located on one side of the mounting column 35.

[0041] Reference Figure 3 To prevent structural damage to the second base 32 or ensure the accurate positioning of the fiber optic sensor 37 when subjected to external forces, a compression spring 39 is fitted onto the guide post 321. One end of the compression spring 39 is connected to the second base 32, and the other end is connected to the first base 31. The compression spring 39 is in a compressed state. When the base is subjected to external forces, the compression spring 39 provides space for displacement of the second base 32 while ensuring the reliable positioning of the second base 32, i.e., the fiber optic sensor 37, under normal conditions.

[0042] Reference Figure 4 In order to facilitate maintenance or cleaning of the second base 32 and related structures, the connecting plate 34 has a first mating hole 341 and the second base 32 has a second mating hole. The first mating hole 341 and the second mating hole are detachably connected to a locking component, preferably a screw.

[0043] Reference Figure 8 The tray 2 has a receiving slot 21 for placing the chip; the tray 2 also has a through detection slot 22, which is arranged along the width direction of the conveyor line 1 and is connected to the receiving slot 21. In this embodiment, the through-beam fiber optic sensor 37 can emit light and send it to the chip through the detection slot 22 to determine the presence of the chip.

[0044] To facilitate the determination of chip orientation, such as whether the chip is misaligned, stacked, or upright, this application requires adjusting the vertical position of the second base 32 to adjust the vertical position of multiple fiber optic sensors 37. Furthermore, it also requires altering the vertical and horizontal positions of some of the fiber optic sensors 37. Specifically, the heights of multiple through-beam fiber optic sensors 37 on one side of the conveyor line 1 can be adjusted sequentially along the conveying direction of the conveyor line 1, for example, by increasing the height of the multiple fiber optic sensors 37 in a stepped manner. Then, the chip orientation is determined based on the presence determination results of multiple sets of fiber optic sensors 37. The specific judgment logic required is existing technology and will not be elaborated here.

[0045] The implementation principle of a semiconductor testing device test structure in this application embodiment is as follows: Rotating the adjusting component 33 causes the connecting plate 34 to move vertically, thereby causing the second base 32 to move vertically for adjustment. At this time, the fiber optic sensor 37 is vertically adjusted. The locking component 361 is released from locking the mounting base 36, which then causes the mounting base 36 to move horizontally, thus adjusting the fiber optic sensor 37 horizontally. The chip is placed in the tray 2, and the tray 2 containing the chip is transported between two detection devices 3 by the conveyor line 1. Multiple sets of fiber optic sensors 37 are used to determine the presence and orientation of the chip.

[0046] The embodiments described herein are preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made in accordance with the structure, shape, and principle of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A semiconductor test equipment test structure, characterized by: Including conveying line (1), tray (2) for placing chip is installed on conveying line (1), one side of conveying line (1) is equipped with detection device (3) for judging the state of chip; The detection device (3) includes a first base (31), a second base (32) is slidably connected to the first base (31), a connecting hole (312) is formed in the first base (31), a positioning member (33) is threadedly connected to the connecting hole (312), the connecting plate (34) is rotatably connected to the positioning member (33), the connecting plate (34) is connected to the second base (32), and the positioning member (33) is configured to drive the second base (32) to move vertically after being rotated;The second base (32) is provided with a mounting column (35), the mounting column (35) is horizontally arranged, a plurality of mounting seats (36) are slidably connected to the mounting column (35), and the mounting seats (36) are arranged along the conveying direction of the conveying line (1), a locking member (361) for limiting the mounting seat (36) on the mounting column (35) is detachably mounted on each mounting seat (36), and an optical fiber sensor (37) is detachably mounted on each mounting seat (36), and the optical fiber sensor (37) is configured to be mounted at different positions of the mounting seat (36).

2. A semiconductor test equipment test structure according to claim 1, wherein: A plurality of first connecting holes (362) are formed in the mounting seat (36), a second connecting hole (371) is formed in the optical fiber sensor (37), the second connecting hole (371) and the first connecting hole (362) are connected with a fastener, and the second connecting hole (371) can be connected with any first connecting hole (362).

3. The test structure for a semiconductor test equipment according to claim 1, wherein: The mounting seat (36) includes a sliding hole (363) penetrating through, and the mounting column (35) is slidably connected to the sliding hole (363); The mounting seat (36) is provided with a mounting hole (364) penetrating into the sliding hole (363), the locking member (361) is a pressing bolt (38), the pressing bolt (38) is threadedly connected to the mounting hole (364), and the pressing bolt (38) is provided with an elastic pad (381) close to the mounting column (35).

4. The semiconductor test equipment test structure of claim 1, wherein: The second base (32) is provided with a guide column (321), the guide column (321) is arranged in the same direction as the connecting hole (312), and the first base (31) is provided with a guide hole (311), the guide column (321) is slidably connected to the guide hole (311).

5. A semiconductor test apparatus test structure according to claim 4, wherein: The guide column (321) is provided with a pressing spring (39), one end of the pressing spring (39) is connected to the second base (32), and the other end is connected to the first base (31).

6. The semiconductor test apparatus test structure of claim 1, wherein: The first base (31) is provided with a first scale table (314) and a second scale table (315), the first scale table (314) is vertically arranged and located on one side of the second base (32), and the second scale table (315) is horizontally arranged and located on one side of the mounting column (35).

7. The semiconductor test apparatus test structure of claim 1, wherein: The connecting plate (34) is provided with a first set of connecting holes (341), and the second base (32) is provided with a second set of connecting holes, and the first set of connecting holes (341) and the second set of connecting holes are detachably connected with locking members.

8. A semiconductor test apparatus test structure according to claim 7, wherein: The tray (2) is provided with a receiving groove (21) for placing a chip, and the tray (2) is further provided with a penetrating detection groove (22) which is communicated with the receiving groove (21), and the optical fiber sensor (37) can emit light to the detection groove (22) and irradiate the light on the chip.

Images