Apparatus, method and electronic device for testing passive radon measurement devices

Abstract

The application provides a kind of verification device, method and electronic equipment for passive radon measurement equipment, the device includes MCU controller, first box, second box, active radon measurement equipment, second box and first box are connected by first air inlet pipe and first air outlet pipe, second box and active radon measurement equipment are connected by second air inlet pipe and second air outlet pipe;Wherein, the first box is installed with hygrothermograph, the first air inlet pipe is installed with air pump, and the flow of air pump is set as the first air pump flow value;MCU controller is connected with hygrothermograph, active radon measurement equipment and air pump in communication respectively.The embodiment of the application can improve the efficiency of passive radon measurement equipment verification.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of instrument detection, and in particular to a verification device and method for a passive radon measurement device and an electronic device. BACKGROUND

[0002] Passive radon measurement devices (such as domestic radon measurement devices) have been widely used in radon concentration detection scenarios such as homes and offices due to their low cost and convenient operation. Before leaving the factory, such devices need to be tested for accuracy to ensure the reliability of the measurement results, and the core of the test is to have a stable and controllable standard radon concentration environment as a calibration reference.

[0003] At present, the existing radon concentration standard environment (such as a radon chamber verification system) has many defects and cannot meet the batch verification requirements of passive radon measurement devices before leaving the factory. The Ra-226 solid radon source used has high risk, and there is a significant radiation safety risk when preparing high-concentration radon gas. Professional personnel and supporting protective facilities are required for operation, and the overall process is complicated. At the same time, the construction and maintenance cost of the radon chamber is high, and it is only limited to laboratory fixed scenarios. The number of devices that can be tested at a time is small, and the cycle is long, which cannot meet the efficiency requirements of batch verification of passive radon measurement devices.

[0004] Therefore, how to improve the verification efficiency of passive radon measurement devices has become a problem to be solved. SUMMARY

[0005] The embodiments of the present application provide a verification device and method for a passive radon measurement device and an electronic device. By using granite as a natural radon source, a double-box layered layout, and a multi-fan homogenization design, the stability of the radon concentration environment is ensured. At the same time, multiple devices can be tested in parallel with the help of multiple layers of placement positions, and the cost and operation threshold are reduced with a modular structure, thereby improving the verification efficiency of passive radon measurement devices.

[0006] In a first aspect, the embodiments of the present application provide a verification device for a passive radon measurement device. The device includes an MCU controller, a first box, a second box, and an active radon measurement device. The second box and the first box are connected through a first air inlet pipe and a first air outlet pipe. The second box and the active radon measurement device are connected through a second air inlet pipe and a second air outlet pipe. The first box is installed with a temperature and humidity meter, and the first air inlet pipe is installed with an air pump. The flow rate of the air pump is set to a first air pump flow rate value. The MCU controller is in communication connection with the temperature and humidity meter, the active radon measurement device, and the air pump. In which:

[0007] The first box is a radon gas generation box, and a first space, a second space and a third space are sequentially arranged in the first box from top to bottom in a vertical direction; the first space is a first gas circulation space, and the hygrometer and a plurality of fans are installed in the first space, and a is an even number greater than or equal to 4; the second space is a desiccant placement position, and a desiccant is placed in the second space to keep the first box dry; and the third space is a granite placement position, and a granite is placed in the third space to generate radon gas.

[0008] The second box is a device under test placement box, and a fourth space and a fifth space are sequentially arranged in the second box from top to bottom in a vertical direction; the fourth space includes m layers of device under test placement positions, and m passive radon gas measurement devices are placed in the fourth space, each device under test placement position corresponds to one passive radon gas measurement device, and m is an integer greater than or equal to 2; and the fifth space is a second gas circulation space, and b fans are installed in the fifth space, and b is an even number greater than or equal to 6.

[0009] Optionally, the first box and the second box form a gas circulation loop through the first gas inlet pipe and the first gas outlet pipe.

[0010] The top of the first box is provided with a first gas inlet position and a first gas outlet position; and the top of the second box is provided with a second gas inlet position, a second gas outlet position, a third gas inlet position and a third gas outlet position.

[0011] One end of the first gas inlet pipe extends into the second gas inlet position and the extension depth is not less than a preset depth, and the other end of the first gas inlet pipe extends into the first gas outlet position and the extension depth is not less than the preset depth.

[0012] One end of the first gas outlet pipe extends into the second gas outlet position and the extension depth is not less than the preset depth, and the other end of the first gas outlet pipe extends into the first gas inlet position and the extension depth is not less than the preset depth.

[0013] Optionally, the second box and the active radon gas measurement device form a gas monitoring loop through the second gas inlet pipe and the second gas outlet pipe.

[0014] One end of the second gas inlet pipe is connected with a gas inlet end of the active radon gas measurement device, and the other end of the second gas inlet pipe extends into the third gas outlet position and the extension depth is not less than the preset depth.

[0015] One end of the second gas outlet pipe is connected with a gas outlet end of the active radon gas measurement device, and the other end of the second gas outlet pipe extends into the third gas inlet position and the extension depth is not less than the preset depth.

[0016] Optionally, the volume of the third space is greater than or equal to twice the sum of the volumes of the first space and the second space.

[0017] In a second aspect, the embodiments of the present application provide a method for verifying passive radon measurement devices, applied to an MCU controller in the device of the first aspect, and the method comprises the following steps:

[0018] determining a target radon concentration range corresponding to the preset target radon concentration;

[0019] receiving radon concentration data of the second box transmitted by the active radon measurement device, and adjusting a gas pump flow value of the gas pump according to the radon concentration data, so as to control the radon concentration in the second box to be within the target radon concentration range;

[0020] verifying the m passive radon measurement devices based on the target radon concentration range, to obtain a first verification index and m second verification indexes; each second verification index corresponds to one passive radon measurement device;

[0021] if the first verification index meets a preset first condition, obtaining second verification indexes that meet a preset second condition from the m second verification indexes, to obtain n second verification indexes; n is a natural number;

[0022] determining that n passive radon measurement devices corresponding to the n second verification indexes in the m passive radon measurement devices pass the verification.

[0023] In a third aspect, the embodiments of the present application provide an electronic device, comprising a processor, a memory, a communication interface, and one or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the processor, and the programs comprise instructions for executing the steps in the method of the second aspect of the embodiments of the present application.

[0024] In a fourth aspect, the embodiments of the present application provide a computer readable storage medium, wherein the computer readable storage medium stores a computer program for electronic data exchange, and the computer program causes a computer to execute part or all of the steps described in the method of the second aspect of the embodiments of the present application.

[0025] By implementing the embodiments of the present application, the natural radon source of granite can be used to replace the traditional high-risk radioactive radon source, and the safety hazards of the radioactive radon source can be avoided. Meanwhile, with the help of the double-box layered layout, the multi-fan homogenization design, and the MCU controller closed-loop control, a uniform and controllable standard radon concentration environment can be stably provided. Through the multi-layer device placement position, parallel verification of multiple passive radon measurement devices can be realized. The modular structure is matched to simplify the operation and reduce the construction and maintenance costs. On the premise of ensuring the verification accuracy, the batch verification efficiency of the passive radon measurement devices is greatly improved, and the accuracy verification demand of the passive radon measurement devices before leaving the factory is effectively met, which is low cost and high efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0027] Figure 1 is a structural schematic diagram of a verification device for a passive radon measurement device provided by an embodiment of the present application;

[0028] Figure 2 is a structural schematic diagram of a first box provided by an embodiment of the present application;

[0029] Figure 3 is a structural schematic diagram of a second box provided by an embodiment of the present application;

[0030] Figure 4 is a flowchart of a verification method for a passive radon measurement device provided by an embodiment of the present application;

[0031] Figure 5 is a flowchart of a method for controlling radon concentration in a second box provided by an embodiment of the present application;

[0032] Figure 6 is a flowchart of a method for calibrating a passive radon measurement device provided by an embodiment of the present application;

[0033] Figure 7 is a flowchart of a method for automatically monitoring a dry environment of a first box provided by an embodiment of the present application;

[0034] Figure 8 is a structural schematic diagram of an electronic device provided by an embodiment of the present application.

[0035] The drawings are described as follows: 100: a verification device for a passive radon measurement device; 1: an MCU controller; 2: a first box; 3: a second box; 4: an active radon measurement device; 5: a first air inlet pipe; 6: a first air outlet pipe; 7: a second air inlet pipe; 8: a second air outlet pipe; 9: a temperature and humidity meter; 21: a first space; 22: a second space; 23: a third space; 24: a first flip door; 31: a fourth space; 32: a fifth space; 33: a second flip door; 51: an air pump. DETAILED DESCRIPTION

[0036] In the following, the technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings in the embodiments of the present application, so that those skilled in the art can better understand the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0037] The terms "first", "second", and the like in the description and claims of the present application and the above drawings are used to distinguish different objects, and are not used to describe a specific order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can optionally include other steps or units not listed, or can optionally include other steps or units inherent to the process, method, product or device.

[0038] It should be understood that the term "and / or" herein is only used to describe the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in this paper represents that the front and rear associated objects are a "or" relationship. "Multiple" in the embodiments of the present application means two or more.

[0039] The "at least one" or similar expressions in the embodiments of the present application means any combination of these items, including any combination of single item or multiple items, means one or more, and multiple means two or more. For example, at least one of a, b or c can represent the following seven cases: a, b, c, a and b, a and c, b and c, a, b and c. Wherein, each of a, b and c can be an element or a set containing one or more elements.

[0040] The "connection" appearing in the embodiments of the present application means direct connection or indirect connection and various connection modes to realize communication between devices, which is not limited in the embodiments of the present application.

[0041] In this paper, "embodiment" means that the specific features, structures or characteristics described in conjunction with the embodiment can be included in at least one embodiment of the present application. The phrase appears at various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment to other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0042] First, the related terms involved in this application are explained as follows:

[0043] Ra-226 solid radon source: refers to a solid radon generator device made of radium-226 as the core radiation source, which is solidified, molded, and sealed packaged. It can generate radon gas through alpha decay and release radon gas in a controllable manner.

[0044] Radon chamber: refers to a specially designed closed experimental device used to accurately simulate and control radon gas concentration and environmental parameters to verify and calibrate the performance of radon detection instruments. Its core goal is to provide a standardized and traceable test environment for radon measurement equipment to ensure the accuracy and reliability of measurement results.

[0045] Microcontroller Unit (MCU): refers to a "chip-level computer" that integrates central processing unit, memory, timer / counter, input / output interface, analog-to-digital conversion, communication interface, and other functional modules on a single chip.

[0046] Passive radon measurement devices (such as household radon detectors) have been widely used in radon concentration detection scenarios such as homes and office spaces due to their low cost and convenient operation. Before leaving the factory, such devices need to be tested for accuracy to ensure the reliability of measurement results, and the core of the test is to have a stable and controllable standard radon concentration environment as a calibration reference.

[0047] Currently, existing radon concentration standard environments (such as radon chamber verification systems) have many defects and are difficult to adapt to the batch verification needs of passive radon measurement devices before leaving the factory. The Ra-226 solid radon source used has high risk, and there is significant radiation safety risk when preparing high-concentration radon gas. Professional personnel and supporting protection facilities are required for operation, and the overall process is complicated. At the same time, the construction and maintenance cost of the radon chamber is high, and it is only limited to laboratory fixed scene use, with few devices tested at a time, long cycle, and completely unable to meet the efficiency requirements of large batch verification of passive radon measurement devices.

[0048] Therefore, how to improve the test efficiency of passive radon measurement devices has become a problem to be solved.

[0049] To solve the above problems, the embodiment of the present application provides a kind of verification device, method and electronic equipment for passive radon measurement equipment, the device includes MCU controller, first box, second box, active radon measurement equipment, the second box and the first box are connected by first air inlet pipe and first air outlet pipe, the second box and the active radon measurement equipment are connected by second air inlet pipe and second air outlet pipe;Wherein, the first box is installed with temperature and humidity meter, the first air inlet pipe is installed with air pump, the flow of the air pump is set as first air pump flow value;The MCU controller is connected with the temperature and humidity meter, the active radon measurement equipment and the air pump respectively, wherein: the first box is radon generation box, first space, second space and third space are sequentially arranged in vertical direction from top to bottom in the inside, the first space is first gas circulation space, is installed with the temperature and humidity meter and a fan, a is even number greater than or equal to 4;The second space is desiccant placement site, for placing desiccant to keep the first box dry;The third space is granite placement site, for placing granite to generate radon;The second box is the equipment placement box to be measured, fourth space and fifth space are sequentially arranged in vertical direction from top to bottom in the inside, the fourth space includes m layers of equipment placement site to be measured, places m passive radon measurement equipment, each equipment placement site to be measured corresponds to a passive radon measurement equipment, m is integer greater than or equal to 2;The fifth space is second gas circulation space, is installed with b fans, b is even number greater than or equal to 6.

[0050] It can be seen that, by using granite as a natural radon source, a double-box layered layout and a multi-fan homogenization design, the stability of the radon concentration environment is ensured, and multiple devices are tested in parallel by means of multi-layer placement sites, which reduces the cost and operation threshold with a modular structure, and improves the testing efficiency of passive radon measurement equipment.

[0051] For ease of understanding, please refer to Figure 1 , Figure 1 is a structure diagram of a verification device for passive radon measurement equipment provided by the embodiment of the present application, it can be known that the verification device for passive radon measurement equipment 100 can include: MCU controller 1, first box 2, second box 3, active radon measurement equipment 4, second box 3 and first box 2 are connected by first air inlet pipe 5 and first air outlet pipe 6, second box 3 and active radon measurement equipment 4 are connected by second air inlet pipe 7 and second air outlet pipe 8;Wherein, the first box 2 is installed with temperature and humidity meter 9, the first air inlet pipe 5 is installed with air pump 51, the flow of the air pump 51 is set as first air pump flow value;The MCU controller 1 is connected with the temperature and humidity meter 9, the active radon measurement equipment 4 and the air pump 51 respectively.

[0052] The MCU controller 1 can receive the real-time uploaded humidity and temperature data in the first box 2 through serial communication, and when the humidity is greater than a preset threshold (for example, 70% RH), a first prompt signal (for example, an audible and light alarm signal) is generated to prompt the operator to replace the desiccant, so as to ensure the stability of the dry environment in the first box 2. The MCU controller 1 communicates with the active radon measurement device 4 in both directions, receives the real-time collected radon concentration data in the second box 3, and issues measurement parameter configuration instructions (such as sampling frequency and measurement accuracy level) to the active radon measurement device 4. The MCU controller 1 is in communication connection with the air pump 51, and can dynamically adjust the air pump flow value of the air pump 51 according to the deviation of the radon concentration data uploaded by the active radon measurement device 4 from the preset target concentration, so as to control the radon gas delivery rate in the first air inlet pipe 5, and realize closed-loop stable control of the radon concentration in the second box 3.

[0053] The first box 2 is a radon generating box, and the first box 2 is provided with a first space 21, a second space 22 and a third space 23 from top to bottom along the vertical direction. The first space 21 is a first gas circulation space, and is provided with a humidity and temperature meter 9 and a plurality of fans. The number a of the fans is an even number greater than or equal to 4. The second space 22 is a desiccant placement position for placing desiccant to keep the first box 2 dry. The third space 23 is a granite placement position for placing granite to generate radon.

[0054] For better understanding, please refer to Figure 2 , Figure 2 is a structural schematic diagram of a first box provided by the embodiment of the present application. A first flip door 24 is further arranged on the top of the first box 2. The first flip door 24 is rotatably connected to the top edge of the first box 2 through a hinge, and a sealing rubber ring is arranged at the contact position of the first flip door 24 and the first box 2 to ensure the airtightness of the first box 2. The first flip door 24 can be opened upward for easy operation of the operator to quickly take out, replace and maintain the granite in the third space 23 and the desiccant in the second space 22, and to maintain and repair the components such as the fans and the humidity and temperature meter 9 in the first box 2, so as to improve the operation convenience of the testing device 100 for the passive radon measurement device.

[0055] The height of the first space 21 is not less than 15 cm, so as to provide sufficient space for gas circulation and ensure that the airflow generated by the fans can form a complete circulation path to avoid airflow dead angles. The a fans in the first space 21 are symmetrically arranged on the horizontal two sides of the first box 2, and the airflow directions are opposite to each other (forming cross-circulation airflow). The a fans in the first space 21 can be directly connected to the power supply to start, without the need for the MCU controller 1 to control, so as to accelerate the mixing of the radon gas released by the granite and the air in the first box 2. The humidity and temperature meter 9 in the first space 21 can monitor the temperature and humidity data in the first box 2 in real time, and transmit the related data to the MCU controller 1 to trigger the desiccant replacement prompt.

[0056] The height of the second space 22 can be 5 cm, for placing a desiccant that can control the humidity in the first box 2 through physical adsorption, to avoid the formation of radon aerosol due to excessive humidity, affecting the accuracy of the measurement. The desiccant includes but is not limited to silica gel desiccant, molecular sieve desiccant, activated alumina desiccant, calcium chloride desiccant, which are not specifically limited here.

[0057] The third space 23 is used to place granite to release radon, to provide a safe and stable base gas source for the test device 100 of the passive radon measurement equipment, replacing the traditional high-risk radioactive radon source. The volume of the third space 23 is greater than or equal to twice the sum of the volumes of the first space 21 and the second space 22, that is, the volume of the third space 23 accounts for at least 2 / 3 of the volume of the first box 2, to facilitate the accommodation of a large enough granite, thereby ensuring sufficient radon generation. For example, if the volume of the first box 2 is 3m 3 , the length is 3m, the width is 1m, and the height is 1m, the height of the first space 21 can be set to 15cm, the height of the second space 22 can be set to 5cm, and the height of the third space 23 can be set to 80cm to meet the volume ratio requirement, and the radon supply capacity can be fully guaranteed.

[0058] The second box 3 is a device placement box, and the inside of the second box 3 is sequentially provided with a fourth space 31 and a fifth space 32 in the vertical direction from top to bottom. The fourth space 31 includes m layers of device placement positions, and m passive radon measurement devices are placed in the m device placement positions. Each device placement position corresponds to one passive radon measurement device, and m is an integer greater than or equal to 2. The fifth space 32 is a second gas circulation space, and b fans are installed in the fifth space 32, and b is an even number greater than or equal to 6.

[0059] For ease of understanding, please refer to Figure 3 , Figure 3 is a structural diagram of a second box provided by an embodiment of the present application. A second flip door 33 is further provided on the side of the second box 3. The second flip door 33 is rotatably connected to the side edge of the second box 3 through a hinge, and a sealing rubber ring is provided at the contact position of the second flip door 33 and the second box 3 to ensure the airtightness of the second box 3. The second flip door 33 can be flipped outward to open, facilitating the batch placement or removal of passive radon measurement devices, and cleaning or maintenance of the fans in the second box 3.

[0060] The fourth space 31 includes m layers of test device placement positions, each capable of holding one passive radon gas measuring device. The height of each test device placement position can be determined based on the height of the passive radon gas measuring device, and the number of test device placement positions can be determined in conjunction with the height of the fourth space 31. The passive radon gas measuring device is a testing device 100 (such as a household radon meter) that requires no external power supply and relies on its physical / chemical properties to achieve cumulative radon gas measurement.

[0061] The b fans in the fifth space 32 can be directly connected to the power supply and started without the need for additional control by the MCU controller 1, thus simplifying circuit design and reducing maintenance costs. These b fans are evenly arranged in a matrix (e.g., a 2×3 matrix distribution when b=6, and a 2×4 matrix distribution when b=8), and are mounted on a mounting plate at the bottom of the fifth space 32. This mounting plate has ventilation holes to ensure unobstructed airflow. The airflow direction of the fans is designed to point towards the top diagonal position of the second enclosure 3: the airflow from the fans in the left area points towards the top right diagonal, and the airflow from the fans in the right area points towards the top left diagonal, forming a cross-spiral circulating airflow.

[0062] In some embodiments, the first housing 2 and the second housing 3 form a gas circulation loop through the first air inlet pipe 5 and the first air outlet pipe 6; the top of the first housing 2 is provided with a first air inlet position and a first air outlet position; the top of the second housing 3 is provided with a second air inlet position, a second air outlet position, a third air inlet position and a third air outlet position; one end of the first air inlet pipe 5 extends into the second air inlet position with an insertion depth not less than a preset depth, and the other end extends into the first air outlet position with an insertion depth not less than a preset depth; one end of the first air outlet pipe 6 extends into the second air outlet position with an insertion depth not less than a preset depth, and the other end extends into the first air inlet position with an insertion depth not less than a preset depth.

[0063] Specifically, the top of the first housing 2 is provided with a first air inlet and a first air outlet, and both interfaces are equipped with sealing joints (such as rubber sealing rings and clamps) to ensure the airtightness of the pipeline connection; the top of the second housing 3 is provided with a second air inlet, a second air outlet, a third air inlet and a third air outlet, and each interface is equipped with a sealing joint to ensure the airtightness of the pipeline connection.

[0064] One end of the first air inlet pipe 5 passes through the second air inlet and extends into the second housing 3 to a depth not less than a preset depth; the other end of the first air inlet pipe 5 passes through the first air outlet and extends into the first space 21 of the first housing 2 to a depth not less than the preset depth, ensuring that the extracted gas is a stable, well-mixed gas source. Similarly, one end of the first air outlet pipe 6 passes through the second air outlet and extends into the second housing 3 to a depth not less than the preset depth; the other end of the first air outlet pipe 6 passes through the first air inlet and extends into the first space 21 of the first housing 2 to a depth not less than the preset depth. The preset depth can be set to 10 cm to ensure that both the inlet and outlet of the pipes are in the core area where the gas mixing is most complete, avoiding the extraction of low-concentration gas at the edges or leaked external air, and ensuring the uniformity of radon concentration within the circulation loop.

[0065] It should be noted that in this gas circulation loop, the radon gas generated in the first chamber 2 is transported to the second chamber 3 through the first outlet pipe 6 to provide a test gas source for the passive radon gas measuring device; the gas in the second chamber 3 flows back to the first chamber 2 through the first inlet pipe 5 to realize the recycling of radon gas, which reduces radon gas loss and avoids excessively high concentration due to continuous gas production, thus reducing the adjustment pressure of the MCU controller 1.

[0066] In some embodiments, the second housing 3 and the active radon gas measuring device 4 form a gas monitoring circuit through the second inlet pipe 7 and the second outlet pipe 8; one end of the second inlet pipe 7 is connected to the inlet end of the active radon gas measuring device 4, and the other end extends into the third outlet position with an insertion depth not less than a preset depth; one end of the second outlet pipe 8 is connected to the outlet end of the active radon gas measuring device 4, and the other end extends into the third inlet position with an insertion depth not less than a preset depth.

[0067] Specifically, one end of the second air inlet pipe 7 is fixedly connected to the air inlet of the active radon gas measuring device 4 via a sealing joint. The connection can be double-sealed using threaded locking and rubber sealing rings to ensure airtightness. The other end passes through the third air outlet of the second housing 3 and extends into the interior of the second housing 3, with an insertion depth not less than a preset depth. One end of the second air outlet pipe 8 is fixedly connected to the air outlet of the active radon gas measuring device 4 via a sealing joint, and the sealing method is the same as that of the second air inlet pipe 7. The other end passes through the third air inlet of the second housing 3 and extends into the interior of the second housing 3, with an insertion depth not less than a preset depth, ensuring that the return gas can be evenly integrated into the airflow circulation inside the housing.

[0068] It should be noted that in the gas monitoring loop, the active radon gas measuring device 4 draws the mixed gas in the second chamber 3 through the second inlet pipe 7, measures and outputs the radon concentration data to the MCU controller 1 in real time; the MCU controller 1 can compare the radon concentration data with the preset target concentration. If the radon concentration is too high, the flow rate of the gas pump 51 is reduced (reducing the amount of radon gas delivered from the first chamber 2 to the second chamber 3). If the radon concentration is too low, the flow rate of the gas pump 51 is increased, thereby achieving closed-loop precise control of the radon concentration in the second chamber 3. The gas monitored by the active radon gas measuring device 4 is then returned to the interior of the second chamber 3 through the second outlet pipe 8.

[0069] For easier understanding, please refer to Figure 4 , Figure 4 This is a flowchart illustrating a testing method for a passive radon gas measuring device provided in an embodiment of this application. The testing method for a passive radon gas measuring device is applied to the MCU controller in the testing apparatus for the passive radon gas measuring device, and the method includes, but is not limited to, the following steps:

[0070] Step S401: Determine the target radon concentration range corresponding to the preset target radon concentration.

[0071] Specifically, a target radon concentration can be set according to the requirements of the calibration scenario to obtain a preset target radon concentration. Common calibration concentrations for passive radon measurement equipment include 100 Bq / m³, 200 Bq / m³, 300 Bq / m³, and 500 Bq / m³, without further specific limitations. Then, a deviation percentage threshold (e.g., ±5%) is determined based on the industry accuracy of active radon measurement equipment and the factory allowable error of passive equipment. Finally, the target radon concentration range is determined based on the preset target radon concentration and the deviation percentage threshold. Alternatively, the target radon concentration range corresponding to the preset target radon concentration can be determined based on the mapping relationship between the preset target radon concentration and the target radon concentration range (e.g., 200-250 Bq / m³), without further specific limitations.

[0072] Step S402: Receive radon concentration data of the second chamber transmitted by the active radon gas measuring device, and adjust the gas pump flow rate value of the gas pump according to the radon concentration data to control the radon concentration in the second chamber to be within the target radon concentration range.

[0073] The specific steps of receiving radon concentration data of the second chamber transmitted by the active radon gas measuring device, and adjusting the gas pump flow rate based on the radon concentration data to control the radon concentration in the second chamber to be within the target radon concentration range include:

[0074] A1. Within a preset first time period, receive the radon concentration data collected by the active radon gas measuring device in the second chamber to obtain the first radon concentration dataset;

[0075] A2. If there are no two consecutive radon concentrations in the first radon concentration dataset that are both greater than the preset target radon concentration, then the flow rate of the air pump is maintained at the first air pump flow rate value; otherwise, the flow rate of the air pump is set to the second air pump flow rate value; the second air pump flow rate value is less than the first air pump flow rate value.

[0076] A3. Within a preset second time period, receive radon concentration data collected by the active radon gas measuring device in the second chamber to obtain a second radon concentration dataset; the start time of the preset second time period is the end time of the preset first time period.

[0077] A4. If there are no two consecutive radon concentrations in the second radon concentration dataset that are both greater than the preset reference radon concentration, then the flow rate of the air pump is maintained at the second air pump flow rate value; otherwise, the air pump is set to the off state; the preset reference radon concentration is greater than the preset target radon concentration.

[0078] A5. Within a preset third time period, receive radon concentration data collected by the active radon gas measuring device in the second chamber to obtain a third radon concentration dataset; the start time of the preset third time period is the end time of the preset second time period.

[0079] A6. If there are no two consecutive radon concentrations in the third radon concentration dataset that are both less than the preset target radon concentration, then the air pump is kept in the off state; otherwise, the air pump is set to the on state and the air pump flow rate is set to the second air pump flow rate value to control the radon concentration in the second chamber to be within the target radon concentration range.

[0080] The active radon gas measurement device includes, but is not limited to, Alphaguard and RAD7 devices, and can be used to perform a periodic calibration system of once a year to ensure the long-term stability of the device's measurement accuracy; no specific limitations are made here. This active radon gas measurement device has a rapid data output capability, and can complete a set of effective radon concentration measurements and output data within 10 minutes.

[0081] In a specific embodiment, within a preset first time period, the MCU controller can receive radon concentration data collected by the active radon gas measuring device from the second chamber at preset time intervals (e.g., every 10 minutes), and integrate them to form a first radon concentration dataset. If there are no two consecutive radon concentrations in the first radon concentration dataset that are both greater than a preset target radon concentration (e.g., 200 Bq / m³), the flow rate of the gas pump is maintained at a first gas pump flow rate value (e.g., 1 m³ / h); otherwise, the flow rate of the gas pump is set to a second gas pump flow rate value (e.g., 0.1 m³ / h), wherein the second gas pump flow rate value is less than the first gas pump flow rate value.

[0082] Next, within a preset second time period, radon concentration data from the second chamber collected by the active radon gas measuring device is received to obtain a second radon concentration dataset. The start time of the preset second time period is the end time of the preset first time period. If there are no two consecutive radon concentrations in the second radon concentration dataset that are both greater than a preset reference radon concentration (e.g., 250 Bq / m³), the air pump flow rate is maintained at the second air pump flow rate value; otherwise, the air pump is set to the off state. The preset reference radon concentration is greater than the preset target radon concentration.

[0083] Then, within a preset third time period, radon concentration data from the second chamber collected by an active radon gas measuring device is received to obtain a third radon concentration dataset. The start time of the preset third time period is the end time of the preset second time period. If there are no two consecutive radon concentrations in the third radon concentration dataset that are both lower than the preset target radon concentration, the air pump remains off; otherwise, the air pump is turned on, and the air pump flow rate is set to the second air pump flow rate value, thereby cyclically controlling the radon concentration in the second chamber to remain within the target radon concentration range.

[0084] It is evident that by setting differentiated radon concentration judgment thresholds and air pump flow parameters in stages, combined with precise radon concentration judgment rules, and gradually adjusting the air pump flow level or start / stop status, a closed-loop control logic is formed. This can quickly bring the radon concentration in the second chamber to the target radon concentration range, while effectively avoiding concentration exceeding the standard or being too low, thus achieving stable and precise control of radon concentration.

[0085] For easier understanding, please refer to Figure 5 , Figure 5This is a schematic diagram of a process for controlling the radon concentration in a second chamber, provided in an embodiment of this application. In the initial stage, the MCU controller controls the gas pump to operate at full speed with a first gas pump flow rate (e.g., 1 m³ / h) to rapidly deliver radon gas to the second chamber, shortening the time to reach the target concentration and quickly adapting to the radon requirements of the second chamber. During this process, an active radon gas measuring device collects a set of radon concentration data every 10 minutes and uploads it to the MCU controller. Then, it is determined whether there are two consecutive radon concentrations in the collected first radon concentration data set that are both greater than the preset target radon concentration. If not, the current first gas pump flow rate is maintained, and radon gas delivery continues; if so, the gas pump flow rate is reduced to the second gas pump flow rate. After switching the air pump flow rate to the second air pump flow rate value, it is determined whether there are two consecutive radon concentrations in the subsequently collected second radon concentration dataset that are both greater than the preset reference radon concentration. If not, the current second air pump flow rate value is maintained, and radon gas delivery continues; if so, the air pump is turned off, and radon gas delivery stops. After turning the air pump off, it is determined whether there are two consecutive radon concentrations in the subsequently collected third radon concentration dataset that are both less than the preset target radon concentration. If not, the air pump remains off; if so, the process returns to the step of "setting the air pump flow rate to the second air pump flow rate value" and restarts the adjustment cycle.

[0086] It is evident that precise control of the gas pump flow or start / stop based on periodic data collection can maintain stable radon concentration, reduce resource waste and energy consumption, and achieve efficient, energy-saving and stable radon supply control.

[0087] Step S403: Verify the m passive radon gas measuring devices to obtain a first verification index and m second verification indexes; each second verification index corresponds to one passive radon gas measuring device.

[0088] For easier understanding, please refer to Figure 6 , Figure 6 This is a schematic flowchart illustrating the verification process of a passive radon gas measuring device according to an embodiment of this application. The specific steps of verifying the m passive radon gas measuring devices to obtain a first verification index and m second verification indices include:

[0089] B1. Obtain the measurement value of each of the m passive radon gas measuring devices for a preset time, and obtain m measurement values;

[0090] B2. Calculate the coefficient of variation for the m measured values ​​according to the preset first formula;

[0091] B3. Use the coefficient of variation as the first verification index;

[0092] B4. Receive the radon concentration data collected by the active radon gas measuring device at the preset time to obtain the fourth radon concentration dataset;

[0093] B5. The average value of all radon concentrations in the fourth radon concentration dataset is taken as the agreed truth value;

[0094] B6. Based on the preset second formula and the agreed true value, calculate each of the m measured values ​​to obtain m error rates;

[0095] B7. Use the m error rates as the m second verification indicators.

[0096] In a specific embodiment, firstly, m passive radon gas measuring devices are continuously placed in the radon concentration environment of the second chamber for a preset time (e.g., 96 hours, to accommodate the cumulative measurement characteristics of the passive radon gas measuring devices). Then, the final measurement result of each passive radon gas measuring device is read, resulting in m measurement values. Next, the m measurement values ​​are calculated according to a preset first formula to obtain the coefficient of variation. The coefficient of variation is then used as the first verification index. The preset first formula is as follows:

[0097]

[0098] in, Indicates the coefficient of variation; This represents the standard deviation of m measurements. This represents the arithmetic mean of m measurements.

[0099] Then, radon concentration data collected by the active radon gas measuring device over a preset time period is received to obtain the fourth radon concentration dataset. The average value of all radon concentrations in the fourth radon concentration dataset is then calculated to obtain the agreed-upon true value. Next, based on the preset second formula and the agreed-upon true value, m error rates are calculated for each of the m measured values. Finally, the m error rates are used as m second verification indicators. The preset second formula is as follows:

[0100]

[0101] in, Represents the m-th error rate Error rate; Represents the m-th measurement value One measurement value; This indicates the agreed-upon truth value.

[0102] Step S404: If the first verification index meets the preset first condition, then obtain the second verification index that meets the preset second condition from the m second verification indices to obtain n second verification indices; n is a natural number.

[0103] Specifically, first, determine whether the first verification indicator (i.e., coefficient of variation) meets a preset first condition. When m is 5, this preset first condition can be a coefficient of variation less than or equal to 15%, without specific limitations. If the first verification indicator meets the preset first condition, then determine whether there is a second verification indicator among the m second verification indicators that meets the preset second condition. This preset second condition can be that the second verification indicator is within 0 ± 25%, without specific limitations. Then, obtain the second verification indicators among the m second verification indicators that meet the preset second condition, resulting in n second verification indicators.

[0104] Step S405: Determine that the n passive radon gas measuring devices corresponding to the n second verification indicators among the m passive radon gas measuring devices have passed the verification.

[0105] Specifically, from m passive radon gas measuring devices, n passive radon gas measuring devices corresponding to the second verification index are selected (i.e., n passive radon gas measuring devices with acceptable error rates), and it is determined that the n passive radon gas measuring devices have passed the verification and can directly enter the subsequent packaging and shipping process.

[0106] For easier understanding, please refer to Figure 7 , Figure 7 This is a schematic diagram of an automated monitoring process for the drying environment of a first chamber provided in an embodiment of this application, wherein the method further includes the following steps:

[0107] C1. Receive the temperature and humidity data of the first enclosure transmitted by the temperature and humidity meter; the temperature and humidity data includes multiple temperatures and multiple humidity levels;

[0108] C2. Determine the average values ​​of the plurality of temperatures and the plurality of humidity levels respectively to obtain the average temperature and average humidity values;

[0109] C3. Determine the reference humidity corresponding to the average temperature;

[0110] C4. If the average humidity is greater than the reference humidity, a first prompt signal is generated; the first prompt signal is used to prompt the replacement of the desiccant to ensure that the passive radon gas measuring device is in a dry environment.

[0111] In a specific embodiment, firstly, the MCU controller receives real-time temperature and humidity data from a temperature and humidity meter at a preset frequency (e.g., every 5 minutes) inside the first chamber via serial communication, obtaining multiple temperatures and multiple humidity levels. Then, the average values ​​of the multiple temperatures and multiple humidity levels are calculated to obtain the average temperature and average humidity. Next, based on a preset mapping relationship between temperature and reference humidity, the reference humidity corresponding to the average temperature is determined; this reference humidity is the maximum permissible relative humidity at that average temperature. It should be noted that a preset threshold can also be used as the reference humidity for subsequent determination of whether the desiccant needs to be replaced; this is not specifically limited here. If the average humidity is greater than the reference humidity, a first prompt signal is generated to prompt for desiccant replacement, ensuring the first chamber remains dry and thus ensuring the passive radon gas measuring device is in a dry environment.

[0112] As can be seen, the MCU controller automatically collects the temperature and humidity of the first chamber and takes the average value. Combined with the temperature, it matches the maximum allowable humidity. When the humidity exceeds the standard, it prompts to replace the desiccant, ensuring that the calibration environment of the passive measuring equipment is dry and thus ensuring the reliability of the calibration results.

[0113] For easier understanding, please refer to Figure 8 , Figure 8 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device includes one or more processors, a memory, a communication interface, and one or more programs. The processor is communicatively connected to the memory and the communication interface via an internal communication bus. The electronic device may include more or fewer structural elements than shown in the block diagram above, such as a power module, physical buttons, a Wi-Fi module, a speaker, a Bluetooth module, a sensor, and a display module, etc., without limitation herein. It is understood that this electronic device can be used to perform the testing method for a passive radon gas measuring device.

[0114] This application also provides a computer-readable storage medium storing a computer program for electronic data interchange, which causes a computer to perform some or all of the steps of any of the methods described in the above method embodiments, wherein the computer includes an electronic device.

[0115] It should be noted that, for the sake of simplicity, the above embodiments are all described as a series of actions. Those skilled in the art should understand that this application is not limited to the described order of actions, as some steps in the embodiments of this application can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions, steps, modules, or units involved are not necessarily essential to the embodiments of this application.

[0116] In the above embodiments, the descriptions of each embodiment in this application have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0117] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. This program can be stored in a computer-readable storage medium, and when executed, it can include the processes described in the above method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as ROM or random access memory (RAM), magnetic disks, or optical disks.

[0118] The steps of the methods or algorithms described in the embodiments of this application can be implemented in hardware or by a processor executing software instructions. The software instructions can consist of corresponding software modules, which can be stored in RAM, flash memory, ROM, EPROM, electrically erasable programmable read-only memory (EEPROM), registers, hard disk, portable hard disk, read-only optical disk (CD-ROM), or any other form of storage medium well known in the art. An exemplary storage medium is coupled to a processor, enabling the processor to read information from and write information to the storage medium. Of course, the storage medium can also be a component of the processor. The processor and storage medium can reside in an ASIC. Furthermore, the ASIC can reside in a terminal device or management device. Alternatively, the processor and storage medium can exist as discrete components in the terminal device or management device.

[0119] Those skilled in the art will recognize that, in one or more of the examples above, the functions described in the embodiments of this application can be implemented, in whole or in part, by software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product. This computer program product includes one or more computer instructions. When these computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The available media can be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., digital video discs (DVDs)), or semiconductor media (e.g., solid-state disks (SSDs)).

[0120] The modules / units included in the various devices and products described in the above embodiments can be software modules / units, hardware modules / units, or a combination of both. For example, for devices and products applied to or integrated into a chip, all modules / units can be implemented using hardware methods such as circuits, or at least some modules / units can be implemented using software programs that run on a processor integrated within the chip, while the remaining (if any) modules / units can be implemented using hardware methods such as circuits. For devices and products applied to or integrated into a chip module, all modules / units can be implemented using hardware methods such as circuits. Different modules / units can be located in the same component (e.g., chip, circuit module, etc.) or different components of the chip module, or at least some modules / units can be implemented using hardware methods such as circuits. The implementation is achieved through a software program that runs on the processor integrated within the chip module. The remaining modules / units (if any) can be implemented using hardware methods such as circuits. For various devices and products applied to or integrated into terminal equipment, each of their modules / units can be implemented using hardware methods such as circuits. Different modules / units can be located in the same component (e.g., chip, circuit module, etc.) or different components within the terminal equipment. Alternatively, at least some modules / units can be implemented through a software program that runs on the processor integrated within the terminal equipment, while the remaining modules / units (if any) can be implemented using hardware methods such as circuits.

[0121] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the embodiments of this application. It should be understood that the above descriptions are merely specific embodiments of the embodiments of this application and are not intended to limit the protection scope of the embodiments of this application. Any modifications, equivalent substitutions, improvements, etc., made on the basis of the technical solutions of the embodiments of this application should be included within the protection scope of the embodiments of this application.

Claims

1. A testing device for passive radon gas measuring equipment, characterized in that, The device includes an MCU controller, a first housing, a second housing, and an active radon gas measuring device. The second housing and the first housing are connected via a first inlet pipe and a first outlet pipe, and the second housing and the active radon gas measuring device are connected via a second inlet pipe and a second outlet pipe. The first housing is equipped with a thermometer and hygrometer, and the first inlet pipe is equipped with an air pump, the flow rate of which is set to a first air pump flow rate value. The MCU controller is communicatively connected to the thermometer and hygrometer, the active radon gas measuring device, and the air pump. The first chamber is a radon gas generator. Its interior, arranged vertically from top to bottom, comprises a first space, a second space, and a third space. The first space is a first gas circulation space, housing the aforementioned thermometer and hygrometer, and *a* fans, where *a* is an even number greater than or equal to 4. The second space is a desiccant placement area, used to place desiccant to keep the first chamber dry. The third space is a granite placement area, used to place granite to generate radon gas. The *a* fans are symmetrically arranged on both horizontal sides of the first chamber, with airflow directed towards their respective positions, forming a cross-circulating airflow. The *a* fans do not require control by the MCU controller and are directly connected to a power source for startup. The second enclosure is a test chamber for placing devices under test (DUTs). Its interior, arranged vertically from top to bottom, comprises a fourth space and a fifth space. The fourth space includes m layers of DUT placement positions, each holding m passive radon gas measuring devices. Each DUT placement position corresponds to one passive radon gas measuring device, where m is an integer greater than or equal to 2. The fifth space is a second gas circulation space, equipped with b fans, where b is an even number greater than or equal to 6. The b fans are evenly arranged in a matrix on a mounting plate at the bottom of the fifth space. The mounting plate has ventilation holes to ensure unobstructed airflow. The airflow direction is towards the diagonally opposite top of the second enclosure, forming a cross-spiral circulating airflow. The b fans do not require control by the MCU controller and are directly powered on. The volume of the third space is greater than or equal to twice the sum of the volumes of the first space and the second space; The MCU controller is communicatively connected to the air pump and can dynamically adjust the air pump flow rate based on the deviation between the radon concentration data uploaded by the active radon gas measuring device and the preset target concentration, thereby controlling the radon gas delivery rate in the first air inlet pipe and achieving closed-loop stable control of the radon concentration in the second chamber.

2. The apparatus as claimed in claim 1, characterized in that, The first housing and the second housing form a gas circulation loop through the first air inlet pipe and the first air outlet pipe; The top of the first housing is provided with a first air inlet and a first air outlet; the top of the second housing is provided with a second air inlet, a second air outlet, a third air inlet, and a third air outlet. One end of the first air intake pipe extends into the second air intake position to a depth not less than a preset depth, and the other end extends into the first air outlet position to a depth not less than the preset depth; One end of the first air outlet extends into the second air outlet position to a depth not less than the preset depth, and the other end extends into the first air inlet position to a depth not less than the preset depth.

3. The apparatus as described in claim 2, characterized in that, The second housing and the active radon gas measuring device form a gas monitoring circuit through the second inlet pipe and the second outlet pipe; One end of the second air inlet pipe is connected to the air inlet of the active radon gas measuring device, and the other end extends into the third air outlet with an insertion depth not less than the preset depth. One end of the second outlet pipe is connected to the outlet end of the active radon gas measuring device, and the other end extends into the third inlet position with an insertion depth not less than the preset depth.

4. A testing method for a passive radon gas measuring device, characterized in that, The method, applied to an MCU controller in any one of claims 1-3, comprises: Determine the target radon concentration range corresponding to the preset target radon concentration; The active radon gas measuring device receives radon concentration data of the second chamber and adjusts the flow rate of the gas pump according to the radon concentration data to control the radon concentration in the second chamber to be within the target radon concentration range. The m passive radon gas measuring devices are calibrated to obtain a first calibration index and m second calibration indexes; each second calibration index corresponds to one passive radon gas measuring device. If the first verification index meets the preset first condition, then the second verification index that meets the preset second condition among the m second verification indices is obtained, resulting in n second verification indices; n is a natural number. It is determined that among the m passive radon gas measuring devices, the n passive radon gas measuring devices corresponding to the n second verification indicators have passed the verification.

5. The method as described in claim 4, characterized in that, The step of receiving radon concentration data of the second chamber transmitted by the active radon gas measuring device, and adjusting the gas pump flow rate based on the radon concentration data to control the radon concentration in the second chamber to be within the target radon concentration range, includes: Within a preset first time period, the radon concentration data collected by the active radon gas measuring device in the second chamber is received to obtain the first radon concentration dataset. If there are no two consecutive radon concentrations in the first radon concentration dataset that are both greater than the preset target radon concentration, then the flow rate of the air pump is maintained at the first air pump flow rate value; otherwise, the flow rate of the air pump is set to the second air pump flow rate value; the second air pump flow rate value is less than the first air pump flow rate value. Within a preset second time period, the radon concentration data collected by the active radon gas measuring device in the second chamber is received to obtain a second radon concentration dataset; the start time of the preset second time period is the end time of the preset first time period. If there are no two consecutive radon concentrations in the second radon concentration dataset that are both greater than the preset reference radon concentration, then the flow rate of the air pump is maintained at the second air pump flow rate value; otherwise, the air pump is set to the off state; the preset reference radon concentration is greater than the preset target radon concentration. Within a preset third time period, the radon concentration data collected by the active radon gas measuring device in the second chamber is received to obtain a third radon concentration dataset; the start time of the preset third time period is the end time of the preset second time period. If there are no two consecutive radon concentrations in the third radon concentration dataset that are both less than the preset target radon concentration, then the air pump is kept in the off state; otherwise, the air pump is set to the on state, and the air pump flow rate is set to the second air pump flow rate value, so as to control the radon concentration in the second chamber to be within the target radon concentration range.

6. The method as described in claim 5, characterized in that, The calibration of the m passive radon gas measuring devices yields a first calibration index and m second calibration indices, including: Obtain the measurement value of each of the m passive radon gas measuring devices for a preset time period to obtain m measurement values; The coefficient of variation is obtained by calculating the m measured values ​​according to the preset first formula; The coefficient of variation is used as the first verification index. The active radon gas measuring device collects radon concentration data over a preset time period to obtain a fourth radon concentration dataset. The average value of all radon concentrations in the fourth radon concentration dataset is taken as the agreed true value; Based on the preset second formula and the agreed true value, each of the m measured values ​​is calculated to obtain m error rates; The m error rates are used as the m second verification indicators.

7. The method as described in claim 5 or 6, characterized in that, The method further includes: Receive temperature and humidity data of the first enclosure transmitted by the temperature and humidity meter; the temperature and humidity data includes multiple temperatures and multiple humidity levels; The average values ​​of the plurality of temperatures and the plurality of humidity levels are determined respectively to obtain the average temperature and average humidity. Determine the reference humidity corresponding to the average temperature; If the average humidity is greater than the reference humidity, a first prompt signal is generated; the first prompt signal is used to prompt the replacement of the desiccant to ensure that the passive radon gas measuring device is in a dry environment.

8. An electronic device, characterized in that, include: Processor, memory, communication interface, and one or more programs; The one or more programs are stored in the memory and configured to be executed by the processor, the programs including instructions for performing the steps of the method as described in any one of claims 4-7.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, the computer program including program instructions that, when executed by a processor, cause the processor to perform the method as described in any one of claims 4-7.

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