Novel flexible circuit board double-sided hollow circuit manufacturing method

Abstract

The invention discloses a novel flexible circuit board double-sided hollow circuit manufacturing method. The method comprises the following steps: a, substrate pretreatment: cutting a double-sided copper-clad substrate to a set size; b, pasting a protective film: pasting a layer of protective film on the non-hollowed-out surface of the L1-layer circuit by using a processing device so as to play a protection role when the L2-layer circuit is cleaned; c, L2 layer surface treatment: removing impurities, pollution and oxides on the copper surface of the L2 layer circuit by using the treatment device again, and roughening the plate surface to increase the binding force of the covering film; d, removing the protective film: removing the copper surface protective film of the L1 layer; and e, laser patterning processing: cutting out the circuit in the hollow area by using UV laser, and reserving a certain connecting position to ensure that the cut circuit pattern has a certain supporting force. According to the invention, the traditional circuit etching processing method is abandoned, the laser technology pattern is utilized, the integrity of the bonding pad in the hollow area is better protected, and the optimal product is obtained on the structure of the circuit board.

Description

Technical Field

[0001] This invention belongs to the field of circuit board technology, specifically relating to a novel method for fabricating double-sided hollowed-out circuits on flexible circuit boards. Background Technology

[0002] In traditional printed circuit boards, chemicals are used to etch away the exposed copper after development to form circuit patterns. However, when creating the cutout areas, unevenness on the board surface can lead to chemical residue and poor exposure, resulting in incomplete circuits in the cutout areas and air bubbles due to improper film pressing. Summary of the Invention

[0003] The purpose of this invention is to provide a novel method for fabricating double-sided hollowed-out circuits on flexible circuit boards, so as to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a novel method for fabricating double-sided hollowed-out circuits on a flexible circuit board, comprising the following steps: Substrate pretreatment: Cut the double-sided copper-clad substrate to the set size; b. Apply protective film: Apply a protective film to the non-cutout side of the L1 layer circuit using a processing device to protect the L2 layer circuit during cleaning; c. L2 layer surface treatment: The L2 layer copper surface is removed again using a treatment device to remove impurities, contaminants and oxides, and the board surface is roughened to increase the adhesion of the cover film; d. Remove protective film: Remove the copper protective film from layer L1; e. Laser graphic processing: UV laser is used to cut out the lines in the hollow area, and a certain number of connection positions are reserved to ensure that the cut line graphic has a certain support.

[0005] Preferably, the processing device includes a workbench with a semicircular groove and two rectangular grooves in the middle. The two rectangular grooves are symmetrical about the semicircular groove. A power device with the same symmetry is provided in the rectangular groove. A ring is connected to the front and rear sides of the semicircular groove. A connecting rod is connected to the inner side of the ring. A fixing device is fixedly connected in the middle of the connecting rods on the front and rear sides.

[0006] Preferably, the power device includes a fixed plate, which is connected to a movable block by a telescopic rod. The movable block has several circular grooves, and a spring is fixedly connected to one side of each circular groove. A push rod is fixedly connected to the other side of the spring. Both the movable block and the push rod have through holes.

[0007] Preferably, the fixing device includes two clamping devices located symmetrically on the left and right sides. Each clamping device includes a fixing block. The fixing block has several through holes II. A push rod II is provided in each through hole II. An elastic block is connected to the inner side of the push rod II. Both the fixing block and the push rod II have through holes III. The front and rear sides of the two fixing blocks on the left and right sides are provided with two upper and lower arc rods for connection. The arc rods are connected to a connecting rod.

[0008] Preferably, push rod one and push rod two correspond one-to-one.

[0009] Preferably, a circuit board is provided between the left and right elastic blocks, and the elastic blocks are provided with four through holes.

[0010] Preferably, when the elastic blocks on the left and right sides clamp the circuit board, the first push rod just contacts the outer side of the fixed block. At this time, the first through hole of the moving block and the first push rod are on a straight line, and the third through hole of the fixed block and the second push rod are on a straight line.

[0011] The technical effects and advantages of this invention are as follows: 1. Abandoning traditional circuit etching methods, laser technology is used to better protect the integrity of the solder pads in the cutout area, achieving the optimal product in terms of the circuit board's own structure.

[0012] 2. The circuit board can be well fixed by the combination of the fixing device and the power device, and the fixing force is always kept at an appropriate level so as not to damage the circuit board.

[0013] 3. The design of the ring and through-hole allows the circuit board to be rotated after the protective film is applied for cleaning on the other side, simplifying operation and improving work efficiency.

[0014] 4. By setting up elastic blocks, through holes, and a power device, it is also possible to check whether the long side of the circuit board is cut neatly. At the same time, it can adapt to the detection of the long side of rectangular circuit boards of different sizes, solving the problem that the long side of the circuit board is not easy to detect. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the present invention; Figure 2 This is a cross-sectional view of the present invention; Figure 3 This is a schematic diagram of the present invention with the push rod removed from the top structure; Figure 4 For the present invention Figure 1 Enlarged view of part A in the middle; Figure 5 This is a front view schematic diagram of the fixing block of the present invention.

[0016] In the diagram: 100 Workbench, 110 Semicircular Groove, 120 Rectangular Groove, 200 Ring, 210 Connecting Rod, 220 Arc Rod, 300 Fixing Plate, 310 Telescopic Rod, 320 Moving Block, 330 Circular Groove, 340 Spring, 350 Push Rod I, 360 Through Hole I, 400 Fixing Block, 410 Through Hole II, 420 Push Rod II, 430 Elastic Block, 440 Through Hole III, 450 Through Hole IV, 500 Circuit Board. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Example A novel method for fabricating double-sided hollowed-out circuits on flexible printed circuit boards includes the following steps: a. Substrate pretreatment: Cut the double-sided copper-clad substrate to the set size; b. Apply protective film: Apply a protective film to the non-cutout side of the L1 layer circuit using a processing device to protect the L2 layer circuit during cleaning; c. L2 layer surface treatment: The L2 layer copper surface is removed again using a treatment device to remove impurities, contaminants and oxides, and the board surface is roughened to increase the adhesion of the cover film; d. Remove protective film: Remove the copper protective film from layer L1; e. Laser graphic processing: UV laser is used to cut out the lines in the hollow area, and a certain number of connection positions are reserved to ensure that the cut line graphic has a certain support.

[0019] Reference Figure 1 As shown, the workbench 100 has a semicircular groove 110 and two rectangular grooves 120 in the middle. The two rectangular grooves 120 are symmetrical about the semicircular groove 110. A power device with the same symmetry is installed in the rectangular groove 120. A ring 200 is connected to the front and rear sides of the semicircular groove 110. A connecting rod 210 is connected to the inner side of the ring 200. A fixing device is fixedly connected in the middle of the connecting rod 210 on the front and rear sides. The fixing device is fixed by the action of the power device. The ring 200 can rotate the entire fixing device in the semicircular groove 110.

[0020] Reference Figure 2 and Figure 3As shown, the power unit includes a fixed plate 300, which is connected to a movable block 320 by a telescopic rod 310. The movable block 320 has several circular grooves 330. One side of a spring 340 is fixedly connected in each circular groove 330, and the other side of the spring 340 is fixedly connected to a push rod 350. Both the movable block 320 and the push rod 350 have through holes 360. The extension and retraction of the telescopic rod 310 can drive the fixed plate 300 to slide in the rectangular groove 120, thereby causing the push rod 350 to move left and right.

[0021] Reference Figure 2 and Figure 3 As shown, the fixing device includes two clamping devices located symmetrically on the left and right sides. Each clamping device includes a fixing block 400. The fixing block 400 has several through holes 410. A push rod 420 is provided in each through hole 410. The inner side of the push rod 420 is connected to an elastic block 430. Both the fixing block 400 and the push rod 420 have through holes 440. The front and rear sides of the two fixing blocks 400 are connected by two upper and lower arc rods 220. The arc rods 220 are connected to a connecting rod 210. When the push rod 420 is compressed, it can drive the elastic block 430 to compress, thereby forming a fixing effect.

[0022] Reference Figure 2 and Figure 3 As shown, push rod 350 and push rod 420 correspond one-to-one. The push force generated by push rod 350 is constant, which means that push rod 420 receives the same force, and therefore push rod 420 moves inward the same distance.

[0023] Reference Figure 4 and Figure 5 A circuit board 500 is provided between the left and right elastic blocks 430. The elastic blocks 430 are provided with through holes 450. The elastic blocks 430 on both sides can clamp the circuit board. When the length of the circuit board 500 does not require so many elastic blocks 430, the elastic blocks that are not in contact with the circuit board 500 can be threaded through the round rod corresponding to the through hole 450, so that they move together with the elastic blocks 430 that participate in clamping the circuit board 500.

[0024] Reference Figures 1-5 When the elastic blocks 430 on the left and right sides clamp the circuit board 500, the push rod 350 just contacts the outer side of the fixed block 400. At this time, the moving block 320 and the through hole 360 ​​of the push rod 350 are on a straight line and can be detected by the round rod corresponding to the through hole 360. The fixed block 400 and the through hole 440 of the push rod 420 are on a straight line and can be detected by the round rod corresponding to the through hole 440.

[0025] The specific operating procedure is as follows: Place the circuit board 500 on two fixed blocks 400, activate the telescopic rod 310 to extend a specific length, at which point push rod 350 pushes push rod 420 inward, and the elastic block 430 presses the circuit board 500. At this point, push rod 350 just contacts the outer side of the fixed block 400 to achieve optimal fixing force. Then, insert the round rod 2 corresponding to through hole 360 ​​into through hole 360. If it can be inserted smoothly, it means that the long side dimension of the circuit board is qualified; otherwise, there is a defect and subsequent steps cannot be performed. When the round rod 2 is successfully inserted into through hole 360, insert the round rod 3 corresponding to through hole 440 into through hole 440, and perform L... Apply a protective film to the L1 layer circuit. When cleaning the L2 layer circuit is required, rotate the ring 200 to flip it over. Then, pull out the second round rod from the through hole 360 ​​to limit the fixing device and prevent it from shaking. This device is suitable for circuit boards 500 of the same size. If you encounter a circuit board of a different size, you can use the corresponding round rod 1 through the through hole 450 to thread the spring block that is not in contact with the circuit board 500, so that it moves together with the spring block 430 that participates in clamping the circuit board 500. At the same time, the extension length of the telescopic rod 310 is increased or decreased according to the difference in width so that the spring block 430 achieves the same clamping force. The subsequent steps are the same.

[0026] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for manufacturing a novel flexible circuit board double-sided hollow circuit, comprising the following steps, characterized in that: a. substrate pretreatment: cutting a double-sided copper-clad substrate to a specified size; b. attaching a protective film: attaching a protective film to the non-hollow surface of the L1 layer circuit using a processing device to protect the L2 layer circuit during cleaning; c. L2 layer surface treatment: removing impurities, contaminants and oxides from the L2 layer circuit copper surface using a processing device, and roughening the board surface to increase the bonding force of the cover film; d. removing the protective film: removing the copper surface protective film of the L1 layer; e. laser patterning: using a UV laser to cut out the hollow area circuit, and reserving a certain number of connection sites to ensure that the circuit pattern has a certain support force after cutting. 2.A method for manufacturing a novel flexible circuit board double-sided hollow circuit, the processing device comprising a workbench (100), a semicircular groove (110) and two rectangular grooves (120) are arranged in the middle of the workbench (100), the two rectangular grooves (120) are symmetric about the semicircular groove (110), power devices are arranged in the rectangular grooves (120), a circular ring (200) is connected to the front and back sides of the semicircular groove (110), a connecting rod (210) is connected to the inner side of the circular ring (200), and a fixing device is fixedly connected to the middle of the front and back connecting rods (210). The power device comprises a fixed plate (300), the fixed plate (300) is connected to a moving block (320) by means of an extension rod (310), a plurality of circular grooves (330) are arranged in the moving block (320), a spring (340) is fixedly connected to one side of each circular groove (330), and the other side of the spring (340) is fixedly connected to a push rod (350); the moving block (320) and the push rod (350) are both provided with a through hole (360). The fixing device comprises two clamping devices arranged symmetrically left and right, the clamping device comprises a fixed block (400), the fixed block (400) is provided with a plurality of through holes (410), a push rod (420) is arranged in the through holes (410), an elastic block (430) is connected to the inner side of the push rod (420), the fixed block (400) and the push rod (420) are both provided with a through hole (440), and the front and back sides of the two fixed blocks (400) are connected by two circular arc rods (220) arranged in an upper and lower manner, and the circular arc rods (220) are connected to the connecting rods (210). The push rod (350) and the push rod (420) are in one-to-one correspondence. A circuit board (500) is arranged between the left and right elastic blocks (430), and the elastic blocks (430) are provided with through holes (450). When the left and right elastic blocks (430) clamp the circuit board (500), the push rod (350) just contacts the outer side of the fixed block (400), at this time, the through holes (360) of the moving block (320) and the push rod (350) are located on a straight line, and the through holes (440) of the fixed block (400) and the push rod (420) are located on a straight line.

3. The method according to claim 2, wherein the method is characterized by: ​ 4. The method according to claim 2, wherein the method is characterized by: ​ 5. The method according to claim 3 and claim 4, characterized in that: ​ 6. The method according to claim 4, wherein the method is characterized by: ​ 7. The method according to claim 4, wherein the method is characterized by: ​

Images