Foam structure heat conduction module
By designing a foam structure heat-conducting module, the combination of foam structure and heat-conducting structure solves the shortcomings of existing heat-conducting devices in terms of heat conduction efficiency and structural design, achieving more efficient heat dissipation performance and electromagnetic interference suppression.
Patent Information
- Application Number
- CN202410898409.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-05
- Publication Date
- 2026-01-06
AI Technical Summary
Existing heat dissipation devices are inadequate in terms of heat dissipation efficiency and structural design, and cannot meet the higher requirements of modern electronic products for heat dissipation performance.
The foam structure heat-conducting module includes a foam structure and a heat-conducting structure. The foam structure has multiple pores, and the heat-conducting structure is formed by the curing of thermosetting colloid. The design of the joint and heat dissipation part has a high thermal conductivity, which can effectively conduct the heat of the heat source to the surrounding environment.
Within a limited space, the foam structure heat-conducting module has a larger contact area with air or cooling liquid, which improves heat conduction and heat dissipation efficiency, reduces electromagnetic interference, and improves heat conduction through planar design.
Smart Images
Figure CN121284898A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to heat conduction devices, and particularly to a foam structure heat conduction module. Background Technology
[0002] With the rapid development of technology, while the performance of various electronic products has improved, their power consumption has also increased dramatically. This causes electronic components to generate a large amount of heat during operation. If heat cannot be dissipated effectively and in a timely manner, excessively high temperatures can lead to a decline in the performance of electronic components or even permanent damage. In more serious cases, it can even cause safety issues. Thermal conductive devices can transfer heat from electronic components to the surrounding environment, thereby maintaining the component temperature within a safe range. This not only improves the performance and reliability of electronic products but also extends their lifespan. Therefore, the application of thermal conductive devices is particularly important in electronic products.
[0003] Existing heat-conducting devices typically form multiple protrusions or fins through die extrusion or metal processing to increase the contact area between the heat-conducting device and the air, thereby improving heat dissipation efficiency.
[0004] The aforementioned heat conduction devices still have significant room for improvement in terms of heat conduction efficiency and structural design. To address these issues, this invention aims to provide a heat conduction device with higher heat conduction efficiency and a better structural design to meet the higher requirements of modern electronic products for heat dissipation performance. Summary of the Invention
[0005] In view of this, the purpose of the present invention is to provide a heat conduction device that has better heat conduction efficiency to meet the heat dissipation performance requirements of electronic components.
[0006] To achieve the above objectives, the present invention provides a foam structure thermally conductive module comprising a foam structure and a thermally conductive structure. The foam structure has multiple pores and a bonding portion and a heat dissipation portion. The thermally conductive structure is formed by curing a thermosetting colloid and has a first side and a second side opposite to each other. The first side is connected to the bonding portion, and the second side of the thermally conductive structure is used to receive heat from a heat source. Therefore, the heat energy of the heat source is transferred to the bonding portion of the foam structure via the thermally conductive structure, and then conducted to the heat dissipation portion for heat dissipation.
[0007] In one embodiment, the second side of the heat-conducting structure has a plane.
[0008] In one embodiment, the foam structure is made of at least one or a combination of graphene, silver, copper, gold, aluminum, or nickel.
[0009] In one embodiment, the porosity of the foam structure is between 60% and 95%.
[0010] In one embodiment, the diameter of each pore is between 0.1 and 10 mm.
[0011] In one embodiment, the thermal conductivity of the thermally conductive structure is greater than or equal to 70 W / mK.
[0012] In one embodiment, the ratio of the thickness of the heat dissipation portion of the foam structure to the thickness of the heat-conducting structure is between 2:1 and 10:1.
[0013] In one embodiment, the pore density of the foam structure is between 5 and 130 ppi.
[0014] In one embodiment, the thickness of the thermally conductive structure is between 1 and 2 mm.
[0015] In one embodiment, the foam structure thermal conductive module includes a thermally conductive medium disposed on the second side of the thermal conductive structure.
[0016] The advantage of this invention is that, compared to the protruding structure or fin structure of existing heat-conducting devices, the foam structure has a larger contact area with air or cooling liquid per unit volume. Therefore, through the heat-conducting structure and the conduction of the foam structure, the foam structure heat-conducting module can more efficiently conduct the heat from the heat source to the surrounding environment within a limited space. Attached Figure Description
[0017] Figure 1 This is a perspective view of the foam structure heat-conducting module according to the first preferred embodiment of the present invention.
[0018] Figure 2 This is a top view of the foam structure heat-conducting module of the first preferred embodiment of the present invention.
[0019] Figure 3 for Figure 2 A sectional view along the 3-3 direction.
[0020] Figure 4 This is an exploded view of the foam structure heat-conducting module of the first preferred embodiment of the present invention.
[0021] Figure 5 This is an exploded view of the foam structure heat-conducting module according to the second preferred embodiment of the present invention.
[0022] Explanation of reference numerals in the attached figures:
[0023] 100, 200: Foam structure heat conduction module
[0024] 10: Foam Structure
[0025] 12: Porosity
[0026] 14: Joint
[0027] 16: Heat dissipation section
[0028] 20: Thermally conductive structure
[0029] 22: First side
[0030] 24: Second side
[0031] 242: Plane
[0032] 30: Thermal conductive medium
[0033] H: Heat source
[0034] L1, L2: Thickness Detailed Implementation
[0035] To more clearly illustrate the present invention, preferred embodiments are described in detail below with reference to the accompanying drawings. Please refer to... Figures 1 to 4 As shown, this is a foam structure heat-conducting module 100 of the first preferred embodiment of the present invention. The foam structure heat-conducting module 100 is used to conduct heat from a heat source H to the surrounding environment. It should be noted that the surrounding environment can be ordinary air or cooling liquid in immersion cooling. In this embodiment, the heat source H is described using an electronic chip as an example. In practice, the heat source H can also be other electronic products that generate heat during operation, such as solid-state drives (SSDs) in desktop computer hosts.
[0036] like Figure 3 As shown, the foam structure thermal conductive module 100 includes a foam structure 10, a thermal conductive structure 20, and a thermal conductive medium 30 stacked in phase. In this embodiment, the foam structure 10 is illustrated using foamed copper as an example. In other embodiments, the material of the foam structure 10 can also be at least one or a combination of graphene, silver, copper, gold, aluminum, or nickel. The foam structure 10 contains a plurality of pores 12. Therefore, the heat generated by the heat source H is transferred to the foam structure 10 for heat dissipation via the thermal conductive medium 30 and the thermal conductive structure 20. Compared with existing thermally conductive bumps or heat dissipation fins formed by processing metal blocks, the foam structure 10 has a significantly increased contact area with air or cooling liquid per unit volume, thereby effectively improving heat conduction and heat dissipation efficiency. In addition, the foam structure 10 can effectively absorb and reflect electromagnetic waves, reducing the damage caused by electromagnetic interference (EMI) to electronic chips.
[0037] Furthermore, the pore diameter of each of the pores 12 is between 0.1 and 10 mm; the porosity of the foam structure 10 is between 60 and 95%; and the pore density of the foam structure 10 is between 5 and 130 ppi. Users can select the corresponding pore size, porosity, or pore density depending on the usage environment or heat source. By designing the aforementioned range of pore size, porosity, or pore density, the contact area between the foam structure 10 and the air or cooling liquid can be significantly increased, thereby improving heat conduction and heat dissipation efficiency.
[0038] Please continue to cooperate. Figure 3 The foam structure 10 has a bonding portion 14 and a heat dissipation portion 16. The thermally conductive structure 20 is formed by heating and curing a thermosetting colloid. The thermal conductivity of the thermally conductive structure 20 is greater than or equal to 70 W / mK. The operating temperature of the thermally conductive structure 20 is between -25 and 150 degrees Celsius. In this embodiment, the thermosetting colloid is a silicone-type thermally conductive liquid adhesive. In other embodiments, the thermosetting colloid can also be other thermally conductive thermosetting liquid adhesives, which can still achieve the purpose of transferring the heat energy generated by the heat source H to the foam structure 10 for heat dissipation. The thermally conductive structure 20 has a first side 22 and a second side 24 opposite to each other. The first side 22 is connected to the bonding portion 14, and the second side 24 is connected to the thermally conductive medium 30. Therefore, the heat energy of the heat source H is transferred to the bonding portion 14 of the foam structure 10 via the thermally conductive medium 30 and the thermally conductive structure 20, and then conducted to the heat dissipation portion 16 for heat dissipation.
[0039] For example, the user can apply the thermosetting adhesive to the bonding portion 14 of the foam structure 10, so that the thermosetting adhesive covers the bonding portion 14 of the foam structure 10 and fills the pores 12 of the bonding portion 14. After the thermosetting adhesive is heated and cured to form the thermally conductive structure 20, the thermally conductive structure 20 is connected to the foam structure 10. Moreover, the cured thermosetting adhesive can not only improve the mechanical properties of the bonding portion 14 of the foam structure 10, but also form a uniform shielding layer, thereby more effectively blocking electromagnetic interference.
[0040] Preferably, such as Figure 3 As shown, the thermosetting colloid completely covers the joint portion 14 of the foam structure 10, and the second side 24 of the thermally conductive structure 20 has a plane 242. Therefore, the problem of poor heat conduction is avoided because the joint portion 14 of the foam structure 10 is not conducive to contact with the heat source or the thermally conductive medium 30 due to uneven surface. In addition, by setting the plane 242, the plane 242 of the thermally conductive structure 20 can be closely attached to the surface of the heat source or the thermally conductive medium 30, thereby improving the heat conduction efficiency.
[0041] Furthermore, it should be noted that, generally speaking, since the thermal conductivity of the thermally conductive structure 20 is lower than that of the foam structure 10, in order to effectively improve the heat conduction efficiency of the foam structure thermally conductive module 100, while avoiding pores in the thermosetting adhesive surface of the thermally conductive structure 20 and ensuring the thermosetting adhesive can be formed intact, such as... Figure 3 As shown, the thinner the thickness L2 of the heat-conducting structure 20, the better. Preferably, the thickness L2 of the heat-conducting structure 20 is between 1 and 2 mm. The ratio of the thickness L1 of the heat dissipation part 16 of the foam structure 10 to the thickness L2 of the heat-conducting structure 20 is between 2:1 and 10:1.
[0042] The thickness ratio of the heat dissipation part 16 to the heat conduction structure 20 of the foam structure 10 can be adjusted according to different application scenarios, heat source temperature conditions, or environmental cleanliness. For example, when the joint between the foam structure 10 and the heat conduction structure 20 requires high mechanical strength, the ratio of the thickness L1 of the heat dissipation part 16 to the thickness L2 of the heat conduction structure 20 can be designed to be 7:3. By increasing the proportion of the heat conduction structure 20, the structural strength of the joint between the foam structure 10 and the heat conduction structure 20 can be strengthened. However, when encountering space limitations, such as in a solid-state drive in a computer host, the proportion of the heat conduction structure 20 can be reduced, and the ratio of the thickness L1 of the heat dissipation part 16 to the thickness L2 of the heat conduction structure 20 can be designed to be 9:1 to reduce the overall thickness of the foam structure heat conduction module 100.
[0043] Please cooperate. Figure 3 The thermally conductive medium 30 has one side attached to the heat source H and the other side attached to the plane 242 of the thermally conductive structure 20. Therefore, the heat from the heat source H is transferred to the thermally conductive structure 20 via the thermally conductive medium 30. In this embodiment, the thermally conductive medium 30 is a heat dissipation patch. The heat dissipation patch has a certain degree of elasticity, which can buffer and absorb the expansion or contraction caused by temperature changes, thereby reducing the mechanical stress between the heat source H and the thermally conductive structure 20. In other embodiments, the thermally conductive medium 30 can also be a paste-like medium. The paste-like medium is applied between the thermally conductive structure 20 and the heat source H. The paste-like medium makes close contact with the thermally conductive structure 20 and the heat source H through its own fluidity and viscosity, effectively improving the heat conduction efficiency.
[0044] Furthermore, the area of the foam structure heat-conducting module 100 can be adjusted according to the area of the heat source H. For example, if the area of the heat source H is 10×10mm (length×width), the area of the foam structure heat-conducting module 100 can be adjusted to 12×12mm (length×width) without interfering with other hardware to facilitate assembly error tolerance and ensure that the heat source H is completely covered by the foam structure heat-conducting module 100.
[0045] like Figure 5 As shown, the foam structure heat-conducting module 200 of the second preferred embodiment of the present invention has a structure that is substantially the same as that of the foam structure heat-conducting module 100 of the first preferred embodiment. The foam structure heat-conducting module 200 also includes the foam structure 10 and the heat-conducting structure 20. The difference is that the foam structure heat-conducting module 200 does not provide the heat-conducting medium 30. The first side 22 of the heat-conducting structure 20 is connected to the joint 14 of the foam structure 10. The plane 242 of the second side 24 of the heat-conducting structure 20 directly abuts against the heat source H, so that the heat energy of the heat source H is directly conducted to the heat-conducting structure 20. In this way, the heat energy of the heat source H can also be transferred to the joint 14 of the foam structure 10 through the heat-conducting structure 20, and then conducted to the heat dissipation part 16 for heat dissipation.
[0046] In summary, this invention, through the combination of the heat-conducting structure 20 and the foam structure 10, allows the heat generated by the heat source H to be transferred to the foam structure 10 for heat dissipation via the heat-conducting structure 20. Compared to the protruding structure or fin structure of existing heat-conducting devices, the foam structure 10 of the foam structure heat-conducting module 100 of this invention has a larger contact area with air or cooling liquid per unit volume. Therefore, through the conduction of the heat-conducting structure 20 and the foam structure 10, the foam structure conducts heat effectively within a limited space. Module 100 can more efficiently conduct heat from the heat source H to the surrounding environment. In addition, the design of the second side 24 of the heat-conducting structure 20 having the plane 242 can solve the problem of poor heat conduction caused by the uneven surface of the joint 14 of the foam structure 10, which is not conducive to contact with the heat source or the heat-conducting medium 30. Through the design of the plane 242, the plane 242 of the heat-conducting structure 20 can be closely attached to the heat source H, so that the heat-conducting structure 20 and the heat source H have good contact.
[0047] The above description is only a preferred and feasible embodiment of the present invention. Any equivalent changes made by applying the present invention specification and claims should be included within the patent scope of the present invention.
Claims
1. A foam structure heat conducting module, comprising A foam structure having a plurality of pores, and the foam structure has a combining portion and a heat dissipating portion; a foam structure having a first side and a second side, the first side of the foam structure having a bonding portion and a heat dissipating portion, the bonding portion of the foam structure being configured to be bonded to a heat source, the heat dissipating portion of the foam structure being configured to dissipate heat from the heat source; a heat conducting structure having a first side and a second side, the first side of the heat conducting structure being bonded to the bonding portion of the foam structure, the second side of the heat conducting structure being configured to receive heat from the heat source; whereby heat energy from the heat source is transferred through the heat conducting structure to the bonding portion of the foam structure and then to the heat dissipating portion for dissipation.
2. The foam structure heat conducting module of claim 1, wherein the second side of the heat conducting structure has a planar surface.
3. The foam structure heat conducting module of claim 1, wherein the foam structure is made of at least one of or a combination of graphene, silver, copper, gold, aluminum, or nickel.
4. The foam structure heat conducting module of claim 1, wherein the foam structure has a porosity between 60% and 95%.
5. The foam structure heat conducting module of claim 1, wherein each of the pores has a pore size between 0.1 mm and 10 mm.
6. The foam structure heat conducting module of claim 1, wherein the heat conducting structure has a thermal conductivity greater than or equal to 70 W / m.K.
7. The foam structure heat conducting module of claim 1, wherein the ratio of the thickness of the heat dissipating portion of the foam structure to the thickness of the heat conducting structure is between 2:1 and 10:
1.
8. The foam structure heat conducting module of claim 1, wherein the foam structure has a pore density between 5 ppi and 130 ppi.
9. The foam structure heat conducting module of claim 1, wherein the heat conducting structure has a thickness between 1 mm and 2 mm.
10. The foam structure heat conducting module of claim 1, further comprising a heat conducting medium disposed on the second side of the heat conducting structure.