Vacuum-assisted wafer patch fixing device and patch equipment

Abstract

The invention relates to a vacuum-assisted wafer patch fixing device and patch equipment, the vacuum-assisted wafer patch fixing device comprises a flexible contact member and a support base, the flexible contact member is provided with a contact plane and a plurality of air holes, the contact plane is used for being in contact with a wafer, the first end of each air hole forms an opening in the contact plane, and the second end of each air hole forms an opening in the support base; the supporting base is used for fixing the flexible contact component and comprises a base base body and an air guide pipe, the supporting plane, making contact with the flexible contact component, of the base base body is provided with vacuum guide channels correspondingly communicated with the second ends of the air holes, vacuum connectors of the vacuum guide channels are communicated with the air guide pipe, and the air guide pipe is used for being connected with external vacuum equipment. According to the vacuum-assisted wafer patch fixing device, air between the wafer and the flexible contact member can be rapidly removed, so that the wafer and the flexible contact member are completely attached, the common problems of bubbles, upwarp and the like during patch of a traditional ceramic disc are avoided, and the attachment quality is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor material processing technology, and in particular to a vacuum-assisted wafer mounting device and mounting equipment. Background Technology

[0002] Existing silicon carbide wafer mounting processes typically use ceramic disks as the substrate and liquid wax as the adhesive. However, due to the lack of microscopic permeability and surface adaptability of ceramic materials, air bubbles easily form between the wafer and the ceramic disk when the wafer is placed on the disk because the bottom of the wafer cannot release air. This necessitates wafer removal, cleaning, and secondary processing, which significantly delays the overall processing progress, reduces the wafer mounting yield, and can even affect subsequent grinding and polishing processes, causing irreversible effects such as exceeding the total thickness variation (TTV) and local thickness variation (LTV) limits. Summary of the Invention

[0003] The first objective of this invention is to provide a vacuum-assisted wafer mounting device that can fix the wafer, prevent air bubbles from forming between the wafer and the device, and improve the bonding quality.

[0004] A second objective of the present invention is to provide a wafer mounting device including the vacuum-assisted wafer mounting fixture.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] In a first aspect of this application, a vacuum-assisted wafer mounting device is provided, comprising:

[0007] A flexible contact member having a contact plane and a plurality of pores, the contact plane being used to contact a wafer, and the first end of each pore forming an opening on the contact plane;

[0008] A support base is provided for fixing the flexible contact member. The support base includes a base body and a gas guide pipe. The support plane of the base body that contacts the flexible contact member is provided with a vacuum guide channel that is connected to the second end of each of the air holes. The vacuum interface of the vacuum guide channel is connected to the gas guide pipe. The gas guide pipe is used to connect to an external vacuum device.

[0009] In one possible implementation, the base body includes a support member and a channel structure member, the channel structure member being detachably disposed within the support member, the vacuum guide channel being disposed within the channel structure member, and the support plane being the surface of the channel structure member where the vacuum guide channel is disposed.

[0010] In one possible implementation, the base substrate further includes an annular sealing member surrounding the channel structure member and the flexible contact member, and for contacting the wafer to seal the gaps between the channel structure member and the flexible contact member, and between the flexible contact member and the wafer.

[0011] In one possible implementation, the vacuum-assisted wafer mounting device further includes a clamping fastener for clamping and fixing the wafer onto the flexible contact member and the annular sealing member.

[0012] In one possible implementation, the clamping fastener is an annular pressure plate, which is used to clamp and fix the circumferential edge of the wafer to the flexible contact member and the annular sealing member.

[0013] In one possible implementation, an annular limiting plate is provided on the outer edge of the annular pressure plate, which stands upright along the axial direction of the annular pressure plate and is used to limit the annular sealing member on the outside of the annular sealing member.

[0014] In one possible implementation, the support member is provided with a positioning and mating structure, which is used for positioning and installing the support member with the mounting platform of the patch device.

[0015] In one possible implementation, the positioning and mating structure is a plurality of positioning pin holes disposed at the bottom of the support member.

[0016] In one possible implementation, the flexible contact member is a flexible silicone pad.

[0017] As can be seen from the above technical solution, the present invention discloses a vacuum-assisted wafer mounting device, including a flexible contact component and a support base. The flexible contact component has a contact plane and multiple air holes. The contact plane is used to contact the wafer. The first end of the air hole forms an opening on the contact plane. The support base is used to fix the flexible contact component. The support base includes a base body and a gas guide pipe. The support plane of the base body that contacts the flexible contact component is provided with a vacuum guide channel that is connected to the second end of each air hole. The vacuum interface of the vacuum guide channel is connected to the gas guide pipe. The gas guide pipe is used to connect to an external vacuum device.

[0018] In application, the air duct is connected to an external vacuum device, and then the wafer is placed on the contact plane of the flexible contact component. At this time, the flexible contact component and the wafer make buffered contact to avoid damage to the wafer caused by direct hard contact. At the same time, the air vents expel the air between the flexible contact component and the wafer to prevent the formation of air bubbles. The external vacuum device is activated to form a uniform negative pressure field between the wafer and the flexible contact component, quickly expelling the air between the wafer and the flexible contact component and making them fully bonded. This avoids the problems of air bubbles and lifting that are common in traditional ceramic disc bonding, and helps to improve the bonding quality.

[0019] In a second aspect of this application, a chip mounting apparatus is provided, wherein a vacuum-assisted wafer mounting fixture as described in the first aspect and its possible implementations is provided on the mounting platform of the chip mounting apparatus.

[0020] The chip mounting equipment disclosed in this application adopts the vacuum-assisted wafer mounting device in the first aspect and its possible implementations described above. Therefore, the chip mounting equipment should have the same beneficial effects as the vacuum-assisted wafer mounting device described above, which will not be repeated here. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of the vacuum-assisted wafer mounting device provided in an embodiment of the present invention;

[0023] Figure 2 An exploded view of the vacuum-assisted wafer mounting device provided in an embodiment of the present invention.

[0024] In the picture:

[0025] 100 is a flexible contact component; 200 is a support base; 210 is a base body; 211 is a support component; 212 is a channel structure component; 2121 is a vacuum guide channel; 220 is a gas guide pipe; 230 is an annular sealing component; 300 is an annular pressure plate. Detailed Implementation

[0026] One of the core aspects of this invention is to provide a vacuum-assisted wafer bonding device. The structural design of this device enables it to fix the wafer, prevent air bubbles from forming between the device and the wafer, and improve bonding quality.

[0027] Another core aspect of this invention is to provide a chip mounting device that includes the aforementioned vacuum-assisted wafer mounting and fixing apparatus.

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] This application provides a vacuum-assisted wafer mounting device, such as... Figure 1 and Figure 2 As shown, the vacuum-assisted wafer mounting device includes a flexible contact member 100 and a support base 200.

[0030] The flexible contact member 100 has a contact plane and multiple pores. The contact plane is used to contact the wafer. The first end of the pore forms an opening on the contact plane and the pore penetrates through the flexible contact member 100. That is, the second end of the pore forms an opening on the bottom surface of the flexible contact member 100 facing away from the contact plane. The cross-section of the pore is formed in shapes including but not limited to circles, ellipses, and polygons. The pore diameters of the pores at different positions on the flexible contact member 100 can be the same or different. For example, the pore diameter at the center of the flexible contact member 100 can be appropriately increased.

[0031] It should be noted that the number of vents should be sufficient to form enough venting positions on the flexible contact member 100 to form uniform venting. The openings at the first end of each vent can be distributed in a concentric circle or matrix on the contact plane.

[0032] The support base 200 is used to fix the flexible contact member 100. The support base 200 includes a base body 210 and a gas guide pipe 220. The support plane of the base body 210 in contact with the flexible contact member 100 is provided with a vacuum guide channel 2121 that is connected to the second end of each air hole. The vacuum interface of the vacuum guide channel 2121 is connected to the gas guide pipe 220. The gas guide pipe 220 is used to connect to external vacuum equipment, including but not limited to vacuum pumps and vacuum pumps.

[0033] Vacuum guide channel 2121 is one or more groove channels provided on the support plane of base body 210. When there is one vacuum guide channel 2121, the vacuum guide channel 2121 is arranged in a spiral manner on the support plane of base body 210 so that it can pass through all the air hole positions. When there are multiple vacuum guide channels 2121, the vacuum guide channels 2121 are connected in parallel or in series.

[0034] Compared with the prior art, the vacuum-assisted wafer mounting device provided in this application connects the air duct 220 to an external vacuum device, and then places the wafer on the contact plane of the flexible contact member 100. At this time, the flexible contact member 100 and the wafer make buffer contact to avoid direct hard contact that could damage the wafer. At the same time, the air vents expel the air between the flexible contact member 100 and the wafer to prevent the formation of bubbles. The external vacuum device is then activated to form a uniform negative pressure field between the wafer and the flexible contact member 100, quickly removing the air between the wafer and the flexible contact member 100 and ensuring complete bonding. This avoids the common problems of bubbles and warping that are common in traditional ceramic disc mounting, and helps to improve the bonding quality.

[0035] To prevent air bubbles from forming between the openings at the first ends of each vent, a shallow groove can be provided between the opening at the first end of each vent and the openings at the first ends of other surrounding vents. The depth of the shallow groove is much smaller than the thickness of the flexible contact member 100. The shallow groove connects the openings at the first ends of two adjacent vents. When the flexible contact member 100 is pressed against the wafer, the shallow groove can assist in venting. Furthermore, due to the small depth of the shallow groove, when the flexible contact member 100 is deformed, the deformation of the flexible contact member 100 can reduce or even eliminate the front groove, thereby further improving the venting effect while ensuring the wafer support effect. To further optimize the above technical solution, in one embodiment of this application, the base substrate 210 adopts a split structure, such as... Figure 2 As shown, the base body 210 includes a support member 211 and a channel structure member 212. The channel structure member 212 and the support member 211 can be made of high-strength polymer or stable metal alloy, such as aluminum alloy or stainless steel. The channel structure member 212 is detachably disposed in the support member 211. The detachable connection between the channel structure member 212 and the support member 211 includes, but is not limited to, snap-fit, screw-fit, and threaded fastener connection. The vacuum guide channel 2121 is disposed in the channel structure member 212, and the support plane is the surface of the channel structure member 212 on which the vacuum guide channel 2121 is disposed.

[0036] To prevent external gas from being drawn into the gaps between the channel structure component 212 and the flexible contact component 100, and between the flexible contact component 100 and the wafer, under negative pressure, thus reducing the exhaust effect of the vacuum-assisted wafer mounting device in this embodiment, in one embodiment of this application, such as Figure 1As shown, the base body 210 also includes an annular sealing member 230, which surrounds the channel structure member 212 and the flexible contact member 100 and is used to contact the wafer to seal the gaps between the channel structure member 212 and the flexible contact member 100 and between the flexible contact member 100 and the wafer, preventing these gaps from causing air leakage and improving the airtightness of the vacuum-assisted wafer mounting device in this embodiment.

[0037] To further optimize the above technical solution and facilitate wafer fixation, in one embodiment of this application, such as... Figure 1 As shown, the vacuum-assisted wafer mounting device also includes a clamping fastener, which is used to clamp and fix the wafer onto the flexible contact member 100 and the annular sealing member 230.

[0038] Specifically, the clamping and fixing component is an annular pressure plate 300, which is used to press and fix the circumferential edge of the wafer onto the flexible contact member 100 and the annular sealing member 230. It should be noted that, in order to avoid damaging the wafer, a flexible pad is provided on the contact surface between the annular pressure plate 300 and the wafer to avoid hard contact between the annular pressure plate 300 and the wafer and damage to the wafer. This not only fixes the wafer, but also further eliminates the gap between the wafer and the edge of the flexible contact member 100 to prevent air leakage.

[0039] To further optimize the above technical solution, an annular limiting plate is provided on the outer edge of the annular pressure plate 300, which stands upright along the axial direction of the annular pressure plate 300. The annular limiting plate is used to limit the annular sealing member 230 on the outside of the annular sealing member 230.

[0040] It is foreseeable that if the vacuum-assisted wafer mounting device is displaced during the placement process, it will affect the placement quality. Therefore, in order to facilitate the positioning of the support base 200 on the mounting platform of the placement equipment, the support component 211 is provided with a positioning and mating structure. The positioning and mating structure is used for the positioning and installation of the support component 211 and the mounting platform of the placement equipment, so as to ensure the repeatability of the fixture of the placement equipment on the support base 200.

[0041] Specifically, in one embodiment of this application, the positioning and mating structure is a plurality of positioning pin holes provided at the bottom of the support member 211. Of course, it should be noted that the positioning and mating structure is not limited to positioning pin holes, and can also be achieved by grooves or protrusions, which is not limited here.

[0042] Specifically, in one embodiment of this application, both the flexible contact member 100 and the flexible pad are flexible silicone pads. A flexible silicone pad is a pad made of silicone material, which has the characteristics of good flexibility, stable chemical properties, high temperature resistance, corrosion resistance, aging resistance, and good insulation. When in contact with the wafer, it can protect the wafer without contaminating it.

[0043] In summary, the vacuum-assisted wafer mounting device provided in this application allows gas between the device and the wafer to be quickly discharged through the vent holes and vacuum guide channel 2121 during wafer bonding, preventing bubble formation and significantly improving bonding uniformity and processing yield. The flexible contact component 100 can adapt to different wafer thicknesses and warpage conditions, and its structure is detachable and replaceable, meeting the needs of mass production and reusability. It can adapt to wafers of different sizes and is suitable for automated bonding production lines, especially for silicon carbide device manufacturing processes with high yield and high cleanliness requirements.

[0044] A pressure detection device can be installed between the gas duct 220 and the vacuum equipment. The negative pressure in the pipeline is detected by the pressure detection device to control the working status of the vacuum equipment, thereby controlling the pressure acting on the wafer and preventing damage to the wafer.

[0045] Furthermore, the base body 210 is provided with multiple sets of air holes and a corresponding number of air guide pipes 220. Each air guide pipe 220 is connected in parallel to the vacuum equipment through a pipeline. Each pipeline is provided with a pressure detection device and a pressure regulating valve. The pressure detection device is used to detect the pressure in the pipeline, and the pressure regulating valve is used to regulate the pressure in the pipeline. Multiple sets of air holes are arranged in a ring along the radial direction of the base body 210.

[0046] During wafer adsorption and fixation, the pressure in each pipeline is monitored in real time by a pressure detection device. In the initial state, the negative pressure value of the pipeline connected to the vent in the middle of the base 210 is the largest, but lower than the target negative pressure value. The negative pressure values ​​in the pipelines connected to the vents in other pipelines gradually decrease. Then, the negative pressure value in each pipeline is gradually increased by a pressure regulating valve at a predetermined rate of change until the negative pressure value in each pipeline reaches the target negative pressure value. In this way, while venting is carried out through the vents, the gas between the wafer and the flexible contact member 100 is gradually squeezed towards the edge of the two by controlling the negative pressure in each pipeline, realizing bidirectional venting in both the vent direction and the radial direction, and further preventing the formation of bubbles between the wafer and the flexible contact member 100.

[0047] It should be noted that the pressure difference within each pipeline should be controlled within a reasonable range.

[0048] This application also provides a chip mounting apparatus, the mounting platform of which is equipped with the vacuum-assisted wafer mounting and fixing device as described in the above embodiments. Since this chip mounting apparatus uses the vacuum-assisted wafer mounting and fixing device described in the above embodiments, the technical effects of this chip mounting apparatus are as described in the above embodiments.

[0049] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "a," and / or "the" are not specifically singular and may include the plural. Generally, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements. An element defined by the phrase "comprising an..." does not exclude the presence of other identical elements in the process, method, product, or apparatus that includes the element.

[0050] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0051] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0052] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the core ideas of the present invention. It should be noted that those skilled in the art can make several improvements and modifications to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A vacuum-assisted wafer die attach fixture, comprising: The application relates to a vacuum-assisted wafer pasting fixing device. The vacuum-assisted wafer pasting fixing device comprises a flexible contact member (100) and a support base (200), wherein the flexible contact member (100) has a contact plane for contacting a wafer and a plurality of air holes, and a first end of each air hole forms an opening in the contact plane; the support base (200) is used for fixing the flexible contact member (100) and comprises a base body (210) and a gas guide pipe (220), wherein a support plane of the base body (210) in contact with the flexible contact member (100) is provided with a vacuum guide channel (2121) in communication with a second end of each air hole, a vacuum interface of the vacuum guide channel (2121) is in communication with the gas guide pipe (220), and the gas guide pipe (220) is used for connecting an external vacuum equipment. The base body (210) comprises a support member (211) and a channel structure member (212), the channel structure member (212) is detachably arranged in the support member (211), the vacuum guide channel (2121) is arranged in the channel structure member (212), and the support plane is a surface of the channel structure member (212) provided with the vacuum guide channel (2121).

2. The vacuum assisted wafer die pad fixture of claim 1, wherein, The base body (210) further comprises a ring-shaped sealing member (230) surrounding the channel structure member (212) and the flexible contact member (100) and used for contacting the wafer to seal a gap between the channel structure member (212) and the flexible contact member (100) and between the flexible contact member (100) and the wafer.

3. The vacuum assisted wafer die attach fixture of claim 2, wherein, The vacuum-assisted wafer pasting fixing device further comprises a pressing fixing member used for pressing and fixing the wafer on the flexible contact member (100) and the ring-shaped sealing member (230).

4. The vacuum assisted wafer die pad fixture of claim 3, wherein, The pressing fixing member is a ring-shaped pressing plate (300) used for pressing and fixing a circumferential edge of the wafer on the flexible contact member (100) and the ring-shaped sealing member (230).

5. The vacuum assisted wafer dicing die attach apparatus of claim 4, wherein, An outer edge of the ring-shaped pressing plate (300) is provided with a ring-shaped limiting plate standing along an axial direction of the ring-shaped pressing plate (300) and used for limiting the ring-shaped sealing member (230) on an outer side of the ring-shaped sealing member (230).

6. The vacuum assisted wafer dicing die attach apparatus of claim 5, wherein, The support member (211) is provided with a positioning and matching structure used for positioning and mounting the support member (211) on a mounting platform of a pasting equipment.

7. The vacuum assisted wafer die attach fixture of any of claims 2-6, wherein, The positioning and matching structure is a plurality of positioning pin holes arranged at a bottom of the support member (211).

8. The vacuum assisted wafer dicing tape fixture of claim 7, wherein, The flexible contact member (100) is a flexible silica gel pad.

9. The vacuum assisted wafer die attach fixture of any of claims 1-6, wherein, The mounting platform of the pasting equipment is provided with the vacuum-assisted wafer pasting fixing device as claimed in any one of claims 1 to 9.

10. A patch device characterized in that, ​

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