Circuit board warpage detection and sorting device

Abstract

A circuit board warping degree detection sorting device relates to the field of circuit board detection, including: base, center is equipped with stand, stand week side is equipped with four along its circumference movement support plate, to bear the circuit board; transfer mechanism, including two rotation axis parallel to the base radial support block, support block has along the own thickness movement frame, frame is equipped with conveying roller in, frame both sides are equipped with first clamping block, for clamping circuit board; sorting mechanism, including along the vertical movement U-shaped frame, U-shaped frame inside is equipped with along its length direction movement sorting plate; detection mechanism, including two mounting plate, reciprocating movement clamp plate between both, clamp plate both sides are equipped with second clamping block, to clamp the circuit board on support plate, away from the sorting mechanism mounting plate below is equipped with the receiving plate, for receiving circuit board, mounting plate is equipped with laser leveling instrument, to detect the circuit board warping degree. Can carry out preliminary screening to the circuit board, avoid appearing wrong detection, miss detection, and detect the warping degree of circuit board.

Description

Technical Field

[0001] This invention relates to the field of circuit board inspection technology, and in particular to a circuit board warpage detection and sorting device. Background Technology

[0002] During the production and processing of circuit boards, warping may occur due to the combined effects of material properties, processing technology, structural design, and environmental factors. Warping can lead to problems such as poor component installation, broken solder joints, or signal interference. Therefore, it is necessary to inspect the warping degree of the circuit boards after each process to promptly screen out those that fail to meet the warping standards. In existing technologies, at the end of each process, circuit boards with obviously unacceptable warping are usually initially screened by manual visual inspection. Furthermore, the specific warping value of these boards is measured to determine whether straightening treatment is necessary. While this reduces the pressure of further screening, manual screening often results in misidentification and omissions, leading to over-inspection when measuring the specific warping value, which impacts production efficiency. Summary of the Invention

[0003] In view of the shortcomings of the above-mentioned prior art, this application provides a circuit board warpage detection and sorting device, which can perform preliminary screening of circuit boards with unqualified warpage, avoid false detection and missed detection, and detect the warpage value of the circuit board in a timely manner, which has strong practicality.

[0004] To achieve the above objectives, the present invention employs the following techniques:

[0005] A circuit board warpage detection and sorting device includes: a base, a transfer mechanism, a sorting mechanism, and a detection mechanism.

[0006] The base is disc-shaped with a central column. Four equally spaced support plates, movable along the circumference of the column, support the circuit boards. A stop bar is located at the end of each support plate near the column to abut the circuit board. The sorting mechanism includes a U-shaped frame mounted on the base and movable vertically. When the support plates are stationary, one support plate is located inside the U-shaped frame. A sorting plate, movable radially along the base, is located inside the U-shaped frame to sort circuit boards with unacceptable warpage. The detection mechanism includes two mounting plates spaced 90 degrees apart along the circumference of the base and a clamping plate that reciprocates between the two mounting plates. One mounting plate is adjacent to the U-shaped frame 301 and spaced 90 degrees apart. The clamping plate rotates and moves along its own thickness, with its rotation axis radially along the base. Second clamping blocks, movable in opposite directions, are located on both sides of the clamping plate to hold the circuit boards on the support plates. A receiving plate is located below the mounting plate away from the sorting mechanism to receive the circuit boards held by the second clamping blocks. A laser leveling instrument is mounted on the mounting plate to detect the warpage of the circuit boards.

[0007] Furthermore, the base is provided with through slots on both sides of the length of the U-shaped frame, and limiting blocks are inserted in the through slots. Both sides of the support plate are provided with long slots. When the support plate is in a static state, the long slots are aligned with the through slots. The limiting blocks are inserted in the long slots, and their upper ends are higher than the top surface of the support plate. They are used to limit the two sides of the circuit board. The opposite side of the limiting blocks is arc-shaped and is used to abut against the edge of the bottom of the through slot. The lower end is installed on the base plate. The bottom surface of the base plate is provided with a vertical rod, which is inserted in the side frame and fitted with a second spring. The two ends of the second spring abut against the base plate and the side frame respectively, and are always in a compressed state. The side frame is fitted on the crossbar and connected to the moving end of the first bidirectional linear mechanism. The crossbar and the first bidirectional linear mechanism are both installed at the bottom of the base.

[0008] Furthermore, a connecting rod is provided on the side of the sorting plate away from the center of the base. The connecting rod passes through the horizontal plate, and the two ends of the horizontal plate are slidably fitted onto the U-shaped frame and move along its length. A first spring is sleeved on the connecting rod, and the two ends of the first spring abut against the horizontal plate and the sorting plate respectively, and are always in a compressed state. A stop is provided at the end of the connecting rod, and laser sensors are provided at both ends of the horizontal plate. When the sorting plate comes into contact with the circuit board, the sorting plate moves, and the stop blocks the laser emitted by the laser sensor. At this time, the horizontal plate moves in a direction away from the center of the base.

[0009] Furthermore, the U-shaped frame has an opening facing the center of the base, and both sides are provided with moving rods. The moving rods have sliding grooves on their sides, and both ends of the horizontal plate slide in the sliding grooves in the vertical direction. The lower end of the moving rod is connected to the moving end of the second linear mechanism. The second linear mechanism is installed below the base and arranged along the length of the U-shaped frame.

[0010] Furthermore, the end of the clamping plate is provided with a connecting plate, the surface of the connecting plate is provided with a sliding rod, and it is connected to the moving end of the third linear mechanism. The sliding rod passes through the rotating block, the third linear mechanism is installed on the rotating block, the rotating block is rotatably installed on the slider, the slider is slidably sleeved on the arc-shaped rod and moves along its trajectory, and the arc-shaped rod is installed on the column.

[0011] Furthermore, the rotating block has two protruding rods on its side and two arc-shaped grooves at the end of the slider, with the protruding rods slidingly engaged in the arc-shaped grooves.

[0012] Furthermore, both sides of the receiving plate are provided with limiting grooves, and a locking block is slidably fitted in the limiting groove. The locking block is connected to the moving end of the third bidirectional linear mechanism, which is installed on the bottom surface of the receiving plate.

[0013] Furthermore, the transfer mechanism includes two support blocks rotatably mounted on the column. The rotation axes of the support blocks are arranged radially along the base and perpendicular to each other. The support blocks and the mounting plate are arranged in a cross shape. The support blocks are equipped with frames that move along their own thickness direction. The length direction of the frames is arranged radially along the base, and multiple conveying rollers are arranged sequentially along their length direction inside for conveying circuit boards. The frames have first clamping blocks that move towards each other on both sides of their length direction for clamping circuit boards. When the support plate is stationary, the frames are located directly above one of the support plates and transfer the circuit board between the support plate and the conveying rollers.

[0014] Furthermore, a protruding plate is provided at the end of the frame, and a guide rod is provided on the side of the protruding plate and connected to the moving end of the first linear mechanism. The guide rod passes through the support block, and the first linear mechanism is installed on the support block.

[0015] Furthermore, both the first clamping block and the second clamping block are L-shaped, and there is a gap between the short end of the first clamping block and the conveying roller, and a gap between the short end of the second clamping block and the surface of the clamping plate. The long ends of the first clamping block and the second clamping block are respectively connected to the moving end of a second bidirectional linear mechanism, which is respectively mounted on the frame and the clamping plate.

[0016] Furthermore, grooves are provided on both sides of the support plate for the passage of the first clamping block and the second clamping block, and when the frame or clamping plate is at its lowest point of travel, the inner side of the short end of the first clamping block or the second clamping block is flush with the top surface of the support plate.

[0017] The beneficial effects of this invention are as follows: the sorting mechanism can perform preliminary screening of circuit boards with unqualified warpage, and the moving support plate can transfer the circuit boards with unqualified warpage to the detection mechanism, avoiding false detection and missed detection; the detection mechanism can detect the warpage values ​​on both sides of the circuit board in a timely manner to determine whether the circuit boards with unqualified warpage need to be straightened. Attached Figure Description

[0018] The accompanying drawings described herein are merely illustrative of selected embodiments, not all possible implementations, and are not intended to limit the scope of the invention.

[0019] Figure 1 This is a three-dimensional schematic diagram of the overall structure of an embodiment of this application.

[0020] Figure 2 This is a front view of an embodiment of this application.

[0021] Figure 3 This is a schematic diagram showing the distribution of the sorting and testing mechanisms in an embodiment of this application.

[0022] Figure 4 This is a three-dimensional schematic diagram of the base according to an embodiment of this application.

[0023] Figure 5 This is a three-dimensional schematic diagram of the bottom surface of the base according to an embodiment of this application.

[0024] Figure 6 This is a schematic diagram of the installation of the limit block according to an embodiment of this application.

[0025] Figure 7 This is a schematic diagram of the transfer mechanism in an embodiment of this application.

[0026] Figure 8 This is a three-dimensional schematic diagram of the sorting mechanism according to an embodiment of this application.

[0027] Figure 9 This is a three-dimensional schematic diagram of the testing mechanism according to an embodiment of this application.

[0028] Figure 10 This is a schematic diagram of the clamp installation according to an embodiment of this application.

[0029] Explanation of reference numerals in the attached drawings: 100—base, 200—transfer mechanism, 300—sorting mechanism, 400—detection mechanism, 101—column, 102—support plate, 103—groove, 104—stop bar, 105—arc-shaped rod, 106—through groove, 107—limiting block, 108—long groove, 109—base plate, 110—vertical rod, 111—side frame, 112—second spring, 113—crossbar, 201—support block, 202—frame, 203—transfer roller, 204—first clamping block, 205—convex plate, 206— Guide rod, 207—Top frame, 301—U-shaped frame, 302—Sorting plate, 303—Connecting rod, 304—Horizontal plate, 305—First spring, 306—Stop block, 307—Moving rod, 308—Slide groove, 401—Mounting plate, 402—Clamping plate, 403—Receiving plate, 404—Second clamping block, 405—Through groove, 406—Connecting plate, 407—Slide rod, 408—Rotating block, 409—Slider, 410—Limiting groove, 411—Card block, 412—Protruding rod, 413—Arc groove, 414—Laser leveling instrument. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the implementation methods of the present invention will be described in detail below with reference to the accompanying drawings. However, the embodiments described in this invention are only some embodiments of the present invention, and not all embodiments.

[0031] like Figures 1-10 As shown in the figure, this application provides a circuit board warpage detection and sorting device, including: a base 100, a sorting mechanism 300, a detection mechanism 400, etc.

[0032] The base 100 has a column 101 at its center, and four support plates 102 arranged at equal intervals around the column 101 and moving along its circumference to support the circuit board; here, optionally, the circuit board is placed on the support plate 102 manually.

[0033] Preferably, to achieve automated transfer of circuit boards, a transfer mechanism 200 can be provided. The transfer mechanism 200 includes two support blocks 201 reciprocally mounted on the column 101. The rotation axes of the support blocks 201 are perpendicular to each other and arranged radially along the base 100. Each support block 201 is equipped with a frame 202 that moves along its thickness direction. Multiple conveyor rollers 203 are arranged along the length of each frame 202. The conveyor rollers 203 in both frames 202 are actively rotating to facilitate the transport of circuit boards. Each frame 202 has a conveyor belt at its end. One conveyor belt transports the circuit board onto the conveyor roller 203, while the other conveyor belt transports the circuit board away from the conveyor roller 203. First clamping blocks 204, which move towards each other on both sides of the frame 202, are used to clamp the circuit board. When board 102 stops moving, the two frames 202 are respectively located directly above a support plate 102. At this time, one of the conveyor belts transports the circuit board to the conveyor roller 203 of one of the frames 202. Then, the two first clamping blocks 204 move towards each other to clamp the circuit board. To prevent the first clamping blocks 204 from damaging the circuit board, a rubber buffer pad can be set on the inner side of the first clamping blocks 204. Then, the support block 201 is rotated 180 degrees so that the circuit board faces down. Then, the frame 202 is moved downward. After the frame 202 moves to the predetermined position, the two first clamping blocks 204 can be moved away from each other, and the circuit board is placed on the support plate 102. The circuit board on the other frame 202 is transported to another conveyor belt and transported away.

[0034] Specifically, the sorting mechanism 300 includes a U-shaped frame 301 mounted on the base 100 and movable in the vertical direction. When the support plates 102 are in a stopped state, one of the support plates 102 is located inside the U-shaped frame 301. A sorting plate 302, movable along the length of the U-shaped frame 301, is provided inside the U-shaped frame 301. The sorting plate 302 is moved towards the column 101. If the warpage of the circuit board is acceptable, the sorting plate 302 can completely pass through the circuit board. Then, the support plate 102 is moved along the circumference of the base 100, and the acceptable circuit boards on the support plate 102 are manually transferred. A transfer mechanism 200 is also provided. At this time, the support plate 102 moves along the circumference of the base 100, so that the support plate 102 carrying the qualified circuit board moves to the bottom of another frame 202, so that the first clamping blocks 204 on both sides of the frame 202 can clamp the circuit board and transfer it to the conveyor belt; if the warpage of the circuit board is not qualified, the sorting plate 302 will come into contact with the circuit board and prevent the sorting plate 302 from moving further. When the sorting plate 302 comes into contact with the circuit board, the sorting plate 302 is immediately moved back. At this time, the support plate 102 is rotated in another direction, so that the circuit board with unqualified warpage moves to the bottom of the detection mechanism 400.

[0035] Specifically, this example preferably provides a structure for monitoring the contact between the sorting plate 302 and the circuit board, so as to facilitate the control of the reversal movement of the sorting plate 302.

[0036] Specifically, such as Figures 1-3 , Figure 8 As shown, a connecting rod 303 is provided on the side of the sorting plate 302 away from the center of the base 100. The connecting rod 303 passes through the horizontal plate 304. The two ends of the horizontal plate 304 are slidably engaged with the U-shaped frame 301 and move along its length. A first spring 305 is sleeved on the connecting rod 303. The two ends of the first spring 305 abut against the horizontal plate 304 and the sorting plate 302 respectively and are always in a compressed state. A stop block 306 is provided at the end of the connecting rod 303. Laser sensors are provided at both ends of the horizontal plate 304. When the sorting plate 302 comes into contact with the circuit board, the sorting plate 302 moves relative to the horizontal plate 304. A keyway can be provided on the connecting rod 303 to guide the movement of the sorting plate 302, ensuring that the sorting plate 302 is in a horizontal state. The stop block 306 blocks the laser emitted by the laser sensor. The horizontal plate 304 immediately moves away from the center of the base 100. When sorting the circuit boards, the horizontal plate 304 is moved toward the column 101. If the circuit board warpage is qualified, the sorting plate 302 can pass completely over the circuit board. Then the support plate 102 can be rotated to transfer the circuit board to the underside of another frame 202. If the circuit board warpage is unqualified, the sorting plate 302 will contact the circuit board and force the sorting plate 302 to approach the horizontal plate 304. The first spring 305 is further compressed, and the stop block 306 will also move synchronously and block the laser emitted by the laser sensor. At this time, the laser sensor sends a signal to control the horizontal plate 304 to move back immediately. Then the support plate 102 carrying the unqualified circuit board can be moved to the underside of the detection mechanism 400.

[0037] More specifically, such as Figure 1 , Figure 8 As shown, in order to accommodate circuit boards of different thicknesses, the height of the sorting plate 302 needs to be adjusted. The U-shaped frame 301 can be connected to the moving end of a vertical lifting mechanism. The vertical lifting mechanism is installed on the base 100. In order to achieve precise adjustment of the height of the sorting plate 302, the vertical lifting mechanism can be a motor lead screw structure. When adjusting the height of the U-shaped frame 301, it is only necessary to drive the U-shaped frame 301 up and down through the vertical lifting mechanism.

[0038] Specifically, such as Figure 1 , Figure 8As shown, the U-shaped frame 301 has its opening facing the center of the base 100, and both sides are provided with moving rods 307. The moving rods 307 have sliding grooves 308 on their sides. Both ends of the horizontal plate 304 slide in the sliding grooves 308 in the vertical direction. The lower end of the moving rods 307 is connected to the moving end of the second linear mechanism. The second linear mechanism is installed below the base 100 and is arranged along the length of the U-shaped frame 301. When the height of the sorting plate 302 is adjusted, the horizontal plate 304 will move along the sliding grooves 308 to avoid interference. When it is necessary to drive the horizontal plate 304 to move, the moving rods 307 are driven to move through the second linear mechanism, which can then drive the horizontal plate 304 to move.

[0039] The testing mechanism 400 includes two mounting plates 401 arranged at 90-degree intervals along the circumference of the base 100 and a clamping plate 402 that reciprocates between the two mounting plates 401. The mounting plates 401 can be directly mounted on the column 101, and the mounting plates 401 and the frame 202 are arranged in a cross shape. The clamping plate 402 is rotatably set and moves along its own thickness direction, and the rotation axis of the clamping plate 402 is arranged radially along the base 100. Second clamping blocks 404 are provided on both sides of the clamping plate 402 and are arranged to move towards each other to clamp the circuit board on the support plate 102. A receiving plate 403 is provided below the mounting plate 401 away from the sorting mechanism 300 to receive the circuit board clamped by the second clamping blocks 404. A laser leveling instrument 414 is provided on the mounting plate 401 to detect the warpage of the circuit board. When a circuit board with unqualified warpage is moved below the clamping plate 402, the clamping plate 402 is moved downward. The two second clamping blocks 404 are moved towards each other to clamp the defective circuit board on the support plate 102. Then, the clamping plate 402 is moved upward and rotated 180 degrees so that the circuit board is above the clamping plate 402. Then, the warpage of one side of the defective circuit board can be measured using a laser level 414. Then, the clamping plate 402 is moved above the receiving plate 403 and rotated 180 degrees back so that the circuit board is below the clamping plate 402. The circuit board is then placed on the receiving plate 403. Then, the clamping plate 402 is removed from above the receiving plate 403 and reset. Then, the laser level 414 can be used to detect the warpage of the other side of the defective circuit board to determine whether it needs to be straightened. Circuit boards that need to be straightened are collected in one material box, while circuit boards that do not need to be straightened are collected in another material box.

[0040] Specifically, such as Figure 4 As shown, in order to prevent unqualified circuit boards from being pushed away during the movement of the sorting plate 302, a baffle 104 is provided at one end of the support plate 102 near the column 101 to abut against the circuit board and limit the end of the circuit board.

[0041] Specifically, such as Figure 1 , Figure 7 , Figure 9 As shown, to facilitate clamping the circuit board, both the first clamping block 204 and the second clamping block 404 are L-shaped. The short end of the first clamping block 204 has a gap with the conveyor roller 203, and the short end of the second clamping block 404 has a gap with the surface of the clamping plate 402, to accommodate circuit boards of different thicknesses. The long ends of both the first clamping block 204 and the second clamping block 404 are respectively connected to the moving end of a second bidirectional linear mechanism. The second bidirectional linear mechanism is mounted on the frame 202 and the clamping plate 402. When the circuit board on the conveyor belt is transported to the conveyor roller 203 on the frame 202, the first clamping blocks 204 on both sides of the frame 202 move towards each other, so that the long ends of the first clamping blocks 204 contact the sides of the circuit board, thus clamping the circuit board. Limits are applied on both sides, and the circuit board will not fall off even if the frame 202 rotates due to the restriction of the short end of the first clamping block 204, ensuring the smooth transfer of the circuit board. Then, the frame 202 is moved downward and the first clamping blocks 204 are moved away from each other, so that the circuit board can be placed on the support plate 102. When it is necessary to transfer the qualified circuit board on the support plate 102 to another frame 202, the operation is repeated in reverse. The working principle of the second clamping block 404 is the same. When clamping the unqualified circuit board on the support plate 102, the circuit board is supported by the short end of the second clamping block 404. Then, the clamping plate 402 is moved upward to realize the transfer of the unqualified circuit board on the support plate 102.

[0042] Specifically, such as Figure 1 , Figure 7 , Figure 9 As shown, the support plate 102 has grooves 103 on both sides for the first clamping block 204 and the second clamping block 404 to pass through. When the frame 202 or the clamping plate 402 is at its lowest point of travel, the inner side of the short end of the first clamping block 204 or the second clamping block 404 is flush with the top surface of the support plate 102 to ensure that the circuit board can be transferred smoothly, avoid interference, and also avoid the circuit board being too far from the support plate 102, which would cause the circuit board to fall directly onto the support plate 102 and be damaged by collision.

[0043] Specifically, such as Figure 1 , Figures 4-6As shown, during the process of placing the circuit board on the support plate 102, the circuit board may move under the friction between itself and the short end of the first clamping block 204, which may prevent the circuit board from being placed smoothly on the support plate 102. In order to ensure that the circuit board can be placed smoothly on the support plate 102, it is necessary to apply a limit to both sides of the circuit board during this process. Therefore, the base 100 is provided with through slots 106 on both sides of the length direction of the U-shaped frame 301, and a limit block 107 is inserted in the through slots 106. Both sides of the support plate 102 are provided with long slots 108. When the support plate 102 is in a stationary state, the long slots 108 and the through slots 106 are aligned. The circuit board is positioned such that the limiting block 107 passes through the long slot 108, with its upper end higher than the top surface of the support plate 102, thus limiting the circuit board on both sides. The opposite side of the limiting block 107 is arc-shaped, used to abut against the edge of the bottom of the through slot 106, and its lower end is mounted on the base plate 109. The bottom surface of the base plate 109 is provided with a vertical rod 110, which passes through the side frame 111 and is fitted with a second spring 112. The two ends of the second spring 112 abut against the base plate 109 and the side frame 111 respectively, and are always in a compressed state. The side frame 111 is fitted on the crossbar 113 and connected to the moving end of the first bidirectional linear mechanism. Both the first bidirectional linear mechanism and the first bidirectional linear mechanism are installed at the bottom of the base 100. During the process of placing the circuit board on the frame 202 onto the support plate 102, the two side frames 111 are moved towards each other, causing the limiting blocks 107 to move synchronously towards each other, so that the limiting blocks 107 are located in the long groove 108. After the short end of the first clamping block 204 is flush with the top surface of the support plate 102, the circuit board is located between the limiting blocks 107. Then, the first clamping blocks 204 are moved away from each other, and the circuit board is successfully placed on the support plate 102 under the blocking action of the limiting blocks 107. Afterwards, the frame 202 is reset, and then the circuit board is sorted by warpage detection. After selection, the first bidirectional linear mechanism drives the two side frames 111 to move away from each other, and drives the limiting blocks 107 to move away from each other synchronously. During this process, the arc-shaped surface of the limiting block 107 will contact the edge of the bottom of the slot 106, thereby forcing the limiting block 107 to move downward. At this time, the second spring 112 is further compressed until the upper end of the limiting block 107 is lower than the top surface of the base 100, so as to avoid affecting the movement of the support plate 102. If the warpage of the circuit board initially meets the requirements, the circuit board is moved to the bottom of another frame 202. If the warpage of the circuit board is not qualified, it is transferred to the bottom of the detection mechanism 400.

[0044] More specifically, such as Figures 1-4As shown, all support plates 102 are connected to a rotating frame, which is rotatably mounted on the column 101. The rotation of the rotating frame simultaneously drives all support plates 102 to move synchronously. The rotating frame can be driven by gear transmission. That is, a driven gear is installed in the center of the rotating frame, and the driven gear meshes with the driving gear. The driving gear is mounted on a rotating shaft, which is rotatably mounted on a support frame, and one end of the shaft is connected to the output end of a motor. The motor is directly mounted on the support frame, which can be mounted on the column 101. The rotation of the driving gear drives the rotating frame to rotate.

[0045] Specifically, such as Figures 1-3 , Figure 7 As shown, the frame 202 has a protruding plate 205 at its end, and a guide rod 206 is provided on the side of the protruding plate 205 and connected to the moving end of the first linear mechanism. The guide rod 206 passes through the support block 201. The first linear mechanism is installed on the support block 201. The guide rod 206 provides support and guidance for the movement of the frame 202. The first linear mechanism drives the frame 202 to move, transferring the circuit board between the frame 202 and the support plate 102. The support block 201 can be provided with a rotating shaft at its end, which is rotatably installed on the top frame 207. The top frame 207 is installed on the column 101, and one end of the rotating shaft is connected to the output end of the power equipment. The power equipment can be installed on the top frame 207. Alternatively, the rotating shaft can be driven by a gear drive.

[0046] Specifically, such as Figure 1 , Figures 9-10 As shown, both sides of the clamping plate 402 are provided with through slots 405 arranged along its width direction. The second clamping block 404 is fitted into the through slot 405. When the support plate 102 is located directly below the clamping plate 402, the through slot 405 is aligned with the groove 103 so that the second clamping block 404 can pass through the groove 103 to clamp the defective circuit board on the support plate 102.

[0047] Specifically, such as Figure 1 , Figures 9-10As shown, the clamping plate 402 has a connecting plate 406 at its end, and a slide rod 407 is provided on the surface of the connecting plate 406 and connected to the moving end of the third linear mechanism. The slide rod 407 passes through the rotating block 408, and the third linear mechanism is mounted on the rotating block 408. The rotating block 408 is rotatably mounted on the slider 409, and the slider 409 is slidably sleeved on the arc-shaped rod 105 and moves along its trajectory. The arc-shaped rod 105 is mounted on the top frame 207. When it is necessary to clamp the defective circuit board on the support plate 102, the clamping plate 402 is driven downward by the third linear mechanism until the surface of the short end of the second clamping block 404 is flush with the top surface of the support plate 102. The second clamping blocks 404 on both sides move towards each other and enter the groove 103 to clamp the defective circuit board. Then, the clamping plate 402 is driven to move upward and reset by the third linear mechanism. At this time, the rotating block 408 can be rotated 180 degrees so that the circuit board is above the clamping plate 402, so that the laser leveling instrument 414 above the clamping plate 402 can detect the warpage of the surface of the defective circuit board. Then, the clamping plate 402 is moved toward the receiving plate 403. During this process, the clamping plate 402 is rotated back 180 degrees so that the defective circuit board is below the clamping plate 402, so that the defective circuit board can be placed on the receiving plate 403.

[0048] Specifically, such as Figure 1 , Figures 9-10 As shown, the rotating block 408 has two protruding rods 412 on its side and the slider 409 has two arc-shaped grooves 413 at its end. The protruding rods 412 slide in the arc-shaped grooves 413, thereby limiting the rotation of the rotating block 408 and ensuring that the rotating block 408 rotates at an angle of 180 degrees each time. The same structure can also be added to the rotating structure of the frame 202 to ensure that the rotation of the frame 202 is more stable.

[0049] For the movement of slider 409, slider 409 can be connected to a drive block that rotates around the central axis of base 100. The drive block can be driven by gears, which is the same as the movement of support plate 102.

[0050] Specifically, such as Figure 1 , Figures 9-10As shown, both sides of the receiving plate 403 are provided with limiting grooves 410, and locking blocks 411 are slidably engaged in the limiting grooves 410. The locking blocks 411 are connected to the moving end of the third bidirectional linear mechanism, which is installed on the bottom surface of the receiving plate 403. During the process of placing the defective circuit board on the receiving plate 403, the locking blocks 411 are driven to move towards each other by the third bidirectional linear mechanism, so that the two locking blocks 411 adapt to the width of the defective circuit board. In order to ensure that the defective circuit board is smoothly placed on the receiving plate 403, locking blocks 411 are provided on both sides of the receiving plate 403. Align the recess with the through slot 405, then move the clamping plate 402 downwards until the second clamping block 404 is located in the recess, and the top surface of the short end of the second clamping block 404 is flush with the top surface of the receiving plate 403. Then move the second clamping blocks 404 away from each other. With the obstruction of the locking block 411, the defective circuit board is successfully placed on the receiving plate 403. Then remove and reset the clamping plate 402. At this time, the laser leveling instrument 414 above the receiving plate 403 can detect the warpage of the other side of the defective circuit board, so as to facilitate the determination of whether straightening treatment is required.

[0051] More specifically, the rotation of the rotating block 408 and the support block 201 can be directly driven by a motor, or indirectly driven by gear transmission.

[0052] The first linear mechanism, second linear mechanism, third linear mechanism, first bidirectional linear mechanism, second bidirectional linear mechanism, and third bidirectional linear mechanism used in this application can all adopt the structure of a cylinder or a motor lead screw.

[0053] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Obviously, those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include these modifications and variations.

Claims

1. A circuit board warpage detection and sorting device, characterized in that, include: The base (100) is disc-shaped, with a column (101) at its center. The column (101) has four equally spaced support plates (102) that move along its circumference to support the circuit board. The support plate (102) has a baffle (104) at one end near the column (101) to abut against the circuit board. The sorting mechanism (300) includes a U-shaped frame (301) mounted on the base (100) and movable in the vertical direction. When the support plate (102) is in a stationary state, one of the support plates (102) is located inside the U-shaped frame (301). The U-shaped frame (301) is provided with a sorting plate (302) that moves radially along the base (100) for sorting circuit boards with unqualified warpage. The testing mechanism (400) includes two mounting plates (401) arranged at 90-degree intervals along the circumference of the base (100) and a clamping plate (402) that reciprocates between the two mounting plates (401). One of the mounting plates (401) is adjacent to the U-shaped frame (301) and arranged at 90-degree intervals. The clamping plate (402) is rotatably set and moves along its own thickness direction, and the axis of rotation is arranged radially along the base (100). The clamping plate (402) has second clamping blocks (404) on both sides that move towards each other for clamping the circuit board on the support plate (102). A receiving plate (403) is provided below the mounting plate (401) away from the sorting mechanism (300) for receiving the circuit board clamped by the second clamping block (404). A laser leveling instrument (414) is provided on the mounting plate (401) for detecting the warpage of the circuit board.

2. The circuit board warpage detection and sorting device according to claim 1, characterized in that, The base (100) is provided with through slots (106) on both sides of the length direction of the U-shaped frame (301). A limiting block (107) is inserted in the through slot (106). The support plate (102) is provided with long slots (108) on both sides. When the support plate (102) is in a stationary state, the long slots (108) are aligned with the through slots (106). The limiting block (107) is inserted in the long slot (108) and its upper end is higher than the top surface of the support plate (102) to limit the two sides of the circuit board. The opposite side of the limiting block (107) is arc-shaped to abut against the circuit board. The bottom edge of the slot (106) is installed on the bottom plate (109). The bottom surface of the bottom plate (109) is provided with a vertical rod (110). The vertical rod (110) passes through the side frame (111) and is fitted with a second spring (112). The two ends of the second spring (112) abut against the bottom plate (109) and the side frame (111) respectively, and are always in a compressed state. The side frame (111) is fitted on the crossbar (113) and connected to the moving end of the first bidirectional linear mechanism. The crossbar (113) and the first bidirectional linear mechanism are both installed at the bottom of the base (100).

3. The circuit board warpage detection and sorting device according to claim 1, characterized in that, A connecting rod (303) is provided on the side of the sorting plate (302) away from the center of the base (100). The connecting rod (303) passes through the horizontal plate (304). The two ends of the horizontal plate (304) are slidably fitted onto the U-shaped frame (301) and move along its length. A first spring (305) is sleeved on the connecting rod (303). The two ends of the first spring (305) abut against the horizontal plate (304) and the sorting plate (302) respectively, and are always in a compressed state. 3) A stop block (306) is provided at the end. Laser sensors are provided at both ends of the horizontal plate (304). When the horizontal plate (304) moves toward the column (101), when the sorting plate (302) comes into contact with the circuit board, the stop block (306) moves relative to the horizontal plate (304) and blocks the laser emitted by the laser sensor as the horizontal plate (304) continues to move. When the block is detected, the horizontal plate (304) moves toward the direction away from the center of the base (100).

4. The circuit board warpage detection and sorting device according to claim 3, characterized in that, The U-shaped frame (301) has an opening facing the center of the base (100), and both sides are provided with moving rods (307). The moving rods (307) have sliding grooves (308) on their sides. Both ends of the horizontal plate (304) are slidably fitted in the sliding grooves (308) in the vertical direction. The lower end of the moving rods (307) is connected to the moving end of the second linear mechanism. The second linear mechanism is installed below the base (100) and arranged along the length of the U-shaped frame (301).

5. The circuit board warpage detection and sorting device according to claim 1, characterized in that, The clamping plate (402) is provided with a connecting plate (406) at its end. The surface of the connecting plate (406) is provided with a sliding rod (407) and connected to the moving end of the third linear mechanism. The sliding rod (407) passes through the rotating block (408). The third linear mechanism is installed on the rotating block (408). The rotating block (408) is rotatably installed on the slider (409). The slider (409) is slidably sleeved on the arc rod (105) and moves along its trajectory. The arc rod (105) is installed on the column (101). The rotating block (408) has two protruding rods (412) on its side, and the slider (409) has two arc-shaped grooves (413) at its end. The protruding rods (412) are slidably engaged in the arc-shaped grooves (413).

6. The circuit board warpage detection and sorting device according to claim 1, characterized in that, The receiving plate (403) is provided with limiting grooves (410) on both sides. A locking block (411) is slidably fitted in the limiting groove (410). The locking block (411) is connected to the moving end of the third bidirectional linear mechanism. The third bidirectional linear mechanism is installed on the bottom surface of the receiving plate (403).

7. The circuit board warpage detection and sorting device according to any one of claims 1-6, characterized in that, It also includes a transfer mechanism (200), which includes two support blocks (201) rotatably mounted on the column (101). The rotation axis of the support blocks (201) is arranged radially along the base (100) and perpendicular to each other. The support blocks (201) and the mounting plate (401) are arranged in a cross shape. The support blocks (201) are equipped with a frame (202) that moves along its own thickness direction. The frame (202) is arranged radially along the base (100) in the length direction and has a plurality of conveying rollers (203) arranged sequentially along its length direction inside for conveying circuit boards. The frame (202) has first clamping blocks (204) that move towards each other on both sides in the length direction for clamping circuit boards. When the support plate (102) is in a stationary state, the frame (202) is located directly above one of the support plates (102) and transfers the circuit board between the support plate (102) and the conveying roller (203).

8. The circuit board warpage detection and sorting device according to claim 7, characterized in that, The frame (202) has a protruding plate (205) at one end, and a guide rod (206) is provided on the side of the protruding plate (205) and connected to the moving end of the first linear mechanism. The guide rod (206) passes through the support block (201), and the first linear mechanism is installed on the support block (201).

9. The circuit board warpage detection and sorting device according to claim 7, characterized in that, Both the first clamping block (204) and the second clamping block (404) are L-shaped, and there is a gap between the short end of the first clamping block (204) and the conveying roller (203), and a gap between the short end of the second clamping block (404) and the surface of the clamping plate (402). The long ends of the first clamping block (204) and the second clamping block (404) are respectively connected to the moving end of a second bidirectional linear mechanism, which is respectively mounted on the frame (202) and the clamping plate (402).

10. The circuit board warpage detection and sorting device according to claim 7, characterized in that, The support plate (102) has grooves (103) on both sides for passing through the first clamping block (204) and the second clamping block (404). When the frame (202) or the clamping plate (402) is at its lowest point of travel, the inner side of the short end of the first clamping block (204) or the second clamping block (404) is flush with the top surface of the support plate (102).

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