Temperature control and active cleaning system and method suitable for self-heating ultra-precision cutting scene

Abstract

The invention relates to a temperature control and active cleaning system and method for a self-heating ultra-precision cutting scene, and aims to solve the problems that in laser-ultrasonic and other self-heating scenes, the machining precision is degraded due to thermal expansion of a tool base, and energy loss and graphitization are caused by contamination of the rear end face of diamond. The system comprises an embedded micro-channel constant-temperature subsystem and a diamond rear end face dual-mode cleaning subsystem, wherein the constant-temperature subsystem realizes pump-free temperature control through a snakelike micro-channel in a hard alloy cutter base by utilizing self-driven phase change circulation of a water-ethylene glycol mixed medium; the cleaning subsystem triggers high-pressure gas or a gas-liquid mixture to be sprayed in a grading mode through a temperature sensor, and positive-pressure protection and active cleaning are formed. The system does not need an external power source, thermal deformation of the tool base can be restrained, the diamond graphitization risk is completely eradicated, and the system is suitable for laser-ultrasonic composite cutting and single-energy-field cutting scenes.

Description

Technical Field

[0001] This invention relates to the field of precision and ultra-precision machining technology, and more particularly to a temperature control and active cleaning system and method for self-heating ultra-precision cutting scenarios. Background Technology

[0002] The application of energy field-assisted machining in the field of ultra-precision machining provides a technical feasibility for the ultra-precision machining of difficult-to-machine materials. It has broad application prospects, especially for difficult-to-machine hard and brittle materials (such as semiconductor materials and optical crystal materials).

[0003] Laser-assisted cutting (LAD) technology focuses a high-energy laser beam onto the workpiece's cutting area, raising the temperature of the cutting zone to an appropriate level, reducing material hardness, increasing its cutting deformation capacity, and decreasing cutting force, thereby achieving better machinability. However, traditional LAD is difficult to apply in ultra-precision cutting: Currently, traditional LAD generally suffers from excessively large distances between the laser spot and the tool. To maintain the cutting zone temperature, high-power lasers are required, resulting in high energy consumption. Furthermore, high-power laser spots easily generate large stress fields, leading to surface damage in brittle materials. The influence of cutting fluid on the laser beam path also increases the uncertainty of the laser focusing position. In addition, applying high-power lasers struggles to solve the problem of heat accumulation, making it impossible to guarantee workpiece surface accuracy.

[0004] Existing technologies include laser-assisted in-situ turning devices, which can effectively circumvent the process difficulties of traditional laser-assisted machining, as described in patent documents CN111069767B and CN108818983A. However, existing in-situ laser-assisted cutting designs still have design flaws, which create bottlenecks in their application processes. Firstly, the laser beam generates heat as it passes through the interior of a diamond tool, a phenomenon exacerbated by defects within the diamond itself (this is unavoidable; no medium is completely non-destructive). Due to diamond's excellent thermal conductivity, the heat is rapidly conducted to the tool base (typically made of cemented carbide). The tool base expands due to heat, affecting cutting accuracy (resulting in a forward movement of the cutting edge, increased depth of cut, and consequently, reduced machining precision). For example... Figure 1 As shown, as cutting proceeds, heat accumulates on the tool base, which increases the amount of material removed at the center of the workpiece, resulting in a basin-like surface that is high around the edges and low in the middle.

[0005] Secondly, the laser beam needs to be refracted through the rear end face of the cutting tool before entering the diamond cutting edge. If the rear end face of the cutting edge is contaminated, it will significantly affect the propagation of laser energy, rapidly converting the laser energy into heat at the tool's rear end face. If the contaminated area is small, the heat can be conducted in time, only causing the aforementioned impact on machining accuracy. However, if the contaminated area is large, the excessive heat will not only affect cutting accuracy but may also cause the diamond cutting edge to graphitize rapidly, rendering the entire tool unusable and resulting in significant economic losses. Most contamination on the rear end face of the cutting edge is caused by cutting fluid splashing onto the tool's rear end face, evaporating after being heated by laser irradiation, leaving residue adhering to the tool's rear end face. Existing designs mostly introduce high-pressure air to create a positive pressure environment, thereby preventing cutting fluid from splashing onto the tool's rear end face. However, this design lacks self-cleaning functionality; once the rear end face becomes contaminated, it becomes ineffective. Furthermore, this design relies on a relatively closed environment (because a positive pressure environment is required), which has significant limitations.

[0006] Ultrasonic vibration machining is also an important method of energy field-assisted machining, and it can be considered one of the most widely used methods in the field of energy field-assisted machining, along with laser-assisted machining. Taking ultrasonic elliptical vibration cutting as an example, the tool is currently mounted by screws to a variable amplitude rod (such as CN113510061A and CN113510060A). However, there is a heat generation problem at the contact point between the bottom surface of the tool base and the variable amplitude rod (the ultrasonic vibration propagation process passes through different interfaces, converting vibration energy into heat energy). This problem cannot be avoided and can only be reduced by optimizing the device. The increased temperature of the tool base will also cause thermal expansion, affecting the cutting accuracy.

[0007] In the machining field, existing technologies such as CN109759611B "Integrated Eddy Current Cooling Tool Suitable for Machining of Energetic Materials" rely on external compressed air sources, which cannot meet the requirements of laser-ultrasonic cutting without external pipelines. The cooling target is the workpiece cutting area, and there is no design for the thermal expansion of the tool base, which cannot solve the problem of base deformation caused by laser energy conduction. CN110091213A "Diamond Coated Tool with Microstructure Cooling Function Suitable for Titanium Alloy Machining" does not have an active cleaning design. If cutting fluid residue adheres to the diamond coating surface, it will block the laser beam path, which cannot meet the cutting scenario where the laser needs to penetrate the diamond. CN114101725B "Heat-Dissipating Diamond Coated Tool and Manufacturing Method Thereof" relies on an external cutting fluid power unit for heat dissipation, which conflicts with the requirements of laser-ultrasonic cutting for lightweight and no external devices.

[0008] Therefore, there is an urgent need to propose a new type of clean cooling device to suppress the influence of temperature on machining accuracy in self-heating energy field assisted processes such as ultrasound and laser. Summary of the Invention

[0009] In light of the aforementioned issues in laser-ultrasonic elliptical vibration cutting, such as the degradation of machining accuracy due to thermal expansion of the tool base, energy loss and graphitization risk caused by contamination of the diamond tool's rear end face, and the poor compatibility of existing cooling and cleaning solutions with composite energy field processes, this invention provides a temperature control and active cleaning system and method for self-heating ultra-precision cutting scenarios. This invention can be applied to in-situ laser-ultrasonic elliptical vibration cutting processes, or it can be applied independently to both in-situ laser cutting and ultrasonic elliptical vibration cutting.

[0010] The technical means employed in this invention are as follows: A temperature control and active cleaning system for self-heating ultra-precision cutting scenarios includes an embedded microfluidic thermostatic subsystem and a dual-mode cleaning subsystem for the diamond back face. The embedded microfluidic thermostatic subsystem includes: a carbide tool base with an internally integrated serpentine microfluidic channel, a cooling medium storage tank for the condenser tube, and an outlet micro check valve and an inlet micro check valve; the serpentine microfluidic channel is formed by laser welding and sealing two pre-processed micro-grooves of carbide substrate; the condenser tube is covered with metal fins, one end of which is connected to the outlet of the microfluidic channel, and the other end is connected to the cooling medium storage tank; the outlet micro check valve and the inlet micro check valve are respectively located at the inlet and outlet of the microfluidic channel to achieve unidirectional flow; The dual-mode cleaning subsystem for the rear end face of the diamond cutting tool includes: an equalizing water pipe, a resistance temperature sensor, a controller, an electromagnetic reversing valve, and a high-pressure air source; the equalizing water pipe is located on the upper right side of the diamond cutting tool and is used to spray high-pressure gas or a gas-liquid mixture; the resistance temperature sensor is attached to the side of the diamond cutting tool; the controller is electrically connected to the temperature sensor and the electromagnetic reversing valve; the electromagnetic reversing valve is used to switch the path between the high-pressure air source and the cleaning liquid.

[0011] Furthermore, the cross-section of the serpentine microchannel is circular with a diameter of 2-4 mm, and the total length of the microchannel is 3-4 times the length of the tool base.

[0012] Furthermore, the opening pressure threshold of both the outlet micro check valve and the inlet micro check valve is 0.05~0.2MPa.

[0013] Furthermore, the condenser tube is an aluminum capillary tube with an inner diameter of 3-5 mm and a wall thickness of 1-1.5 mm. The metal fins are fixed to the outer wall of the condenser tube by brazing, with a fin spacing of 1-3 mm and a height of 10-20 mm.

[0014] Furthermore, the jet nozzle is located to the right rear of the rear end face of the cutting tool, the angle between the jet nozzle of the equalizing water pipe and the rear end face of the diamond cutting tool is 30°~60°, and the diameter of the jet nozzle is 0.5~1mm.

[0015] Furthermore, the controller is configured to: when the temperature sensor detects that the tool temperature exceeds the cleaning threshold, trigger the electromagnetic reversing valve to conduct the cleaning liquid, forming a mixture with a gas-liquid volume ratio of 1:5 to 1:8; when the temperature is below the cleaning threshold, only high-pressure gas is conducted to form a positive pressure environment.

[0016] Furthermore, the cooling medium is a mixture of water and ethylene glycol, wherein the volume percentage of ethylene glycol is 30% to 50%.

[0017] Furthermore, it also includes an ultrasonic vibration unit and / or a laser channel to be suitable for single laser or ultrasonic conditions or laser-ultrasonic composite cutting, wherein the ultrasonic vibration unit is rigidly connected to the tool base, and the laser channel penetrates the tool base and is aligned with the diamond cutting edge.

[0018] This invention also discloses a method for using the temperature control and active cleaning system for the above-mentioned self-heating ultra-precision cutting scenario, comprising the following steps: The resistance temperature sensor is tightly attached to the side of the diamond cutting tool. During the machining process, the temperature data it acquires is transmitted to the controller. The controller is based on a preset cleaning threshold. When the detected temperature is below the cleaning threshold, the controller outputs a signal to make the electromagnetic reversing valve only open the high-pressure gas source passage and cut off the cleaning liquid. When the temperature is above the cleaning threshold, the controller switches the electromagnetic reversing valve passage to make the high-pressure gas source and the cleaning liquid open at the same time. The high-pressure gas negative pressure is used to draw in the cleaning liquid to form a mixture with a gas-liquid volume ratio of 1:5 to 1:8. The equalizing water pipe receives the medium from the electromagnetic reversing valve. Under normal conditions, when the temperature is below the preset cleaning threshold, high-pressure gas is ejected from the nozzle, forming a positive pressure barrier on the rear end face of the cutting blade to prevent the cutting fluid from splashing and adhering. In the cleaning mode when the temperature is above the preset cleaning threshold, the gas-liquid mixture is ejected at a preset high speed, removing residual stains through the dual action of airflow impact and liquid dissolution. At the same time, the airflow is used to cool down the temperature of the rear end face of the cutting blade to a preset value.

[0019] The core of this invention relies on the closed-loop linkage of various structures within the embedded microfluidic temperature control subsystem, with the specific path as follows: When laser energy penetrates the tool base or ultrasonic vibration unit and transmits vibrational heat, the heat is directly conducted to the serpentine microchannel inside the base; the water-ethylene glycol mixture in the microchannel increases in temperature due to heat absorption, meets the underheated boiling condition, and the medium changes from liquid to gas-liquid mixture, and the volume expansion increases the pressure inside the microchannel. Pressure drives the outlet micro check valve to open, and the gas-liquid mixture flows along the condenser tube to the cooling medium storage tank; during this process, the metal fins on the outer wall of the aluminum condenser tube increase the heat dissipation area, and with the natural air convection, the gaseous medium is quickly liquefied, preventing heat from flowing back to the base; The liquefied medium flows back to the storage tank, the pressure in the microchannel drops, the inlet micro check valve opens automatically, and the liquid medium in the storage tank is replenished into the microchannel.

[0020] Compared with the prior art, the present invention has the following advantages: the system of the present invention does not require the external compressed air source and external cutting fluid pump of the prior art, thus reducing the weight of the overall structure; at the same time, the serpentine microchannel is directly attached to the tool base, and the heat of the base is quickly removed through the medium circulation, so as to effectively reduce the thermal expansion of the base, thereby completely eliminating the machining deviation caused by the deformation of the base on the machined surface.

[0021] The cleaning structure effectively treats the contamination on the rear end face of the cutting tool, reduces laser energy loss, improves laser energy utilization, effectively avoids the risk of diamond graphitization due to high temperature, and increases the service life of the cutting tool. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 The results show the accuracy measurement of the surface shape of single-crystal silicon in in-situ laser-assisted cutting.

[0024] Figure 2 This is a schematic diagram of the structure of the present invention.

[0025] In the diagram: 1. Diamond cutting tool; 2. Laser channel; 3. Laser beam; 4. Ultrasonic vibration unit; 5. Tool body; 6. Outlet micro check valve; 7. Metal finned heat sink; 8. Storage tank; 9. Inlet micro check valve; 10. Tool body; 11. Microflow channel; 12. Resistance temperature sensor; 13. Controller; 14. Electromagnetic directional valve; 15. Cleaning liquid; 16. High-pressure gas source; 17. High-pressure gas / gas-liquid mixture. Detailed Implementation

[0026] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of exemplary embodiments according to the invention. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0029] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0030] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention. The directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0031] For ease of description, spatial relative terms such as "above," "over," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation besides the orientation of the device as described in the figures. For example, if the device in the figures is inverted, a device described as "above" or "above" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0032] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0033] like Figure 1 As shown in the figure, the present invention discloses a temperature control and active cleaning system for self-heating ultra-precision cutting scenarios, which is used to suppress the degradation of machining accuracy and tool failure caused by thermal expansion of the tool base and contamination of the diamond rear end face in composite energy field machining.

[0034] This invention includes an embedded microfluidic thermostatic subsystem and a dual-mode cleaning subsystem for the diamond rear end face; The embedded microfluidic thermostatic subsystem includes: a cemented carbide tool base 10 with an internally integrated serpentine microfluidic channel 11, a condenser tube, a cooling medium storage tank 8, and an outlet micro-check valve 6 and an inlet micro-check valve 9. The serpentine microfluidic channel 11 is formed by laser welding two pre-machined micro-grooves on a cemented carbide substrate. Specifically, a serpentine micro-groove is first machined on the surface of the cemented carbide, and then combined with another piece of cemented carbide to form a tool base, thereby forming the microfluidic channel. The two alloys are sealed by laser welding. The cross-section of the microfluidic channel is circular. The condenser tube is covered with metal fins 7, one end of which is connected to the outlet of the microfluidic channel 11, and the other end is connected to the cooling medium storage tank 8. There are two micro-check valves 6 and 9, which are respectively located at the inlet and outlet of the microfluidic channel 11 to achieve unidirectional flow. The dual-mode cleaning subsystem for the rear end face of the diamond cutting tool includes: a pressure equalizing water pipe, a resistance temperature sensor 12, a controller 13, an electromagnetic reversing valve 14, and a high-pressure air source 16. The pressure equalizing water pipe is located on the upper right side of the diamond cutting tool 1 and is used to spray high-pressure gas or a gas-liquid mixture 17. The resistance temperature sensor 12 is attached to the side of the diamond cutting tool 1. The controller 13 is electrically connected to the temperature sensor 12 and the electromagnetic reversing valve 14. The electromagnetic reversing valve 14 is used to switch the passage between the high-pressure air source 16 and the cleaning liquid 15.

[0035] Furthermore, the cross-section of the serpentine microchannel 11 is circular with a diameter of 2-4 mm, and the total length of the microchannel is 3-4 times the length of the tool base 10.

[0036] Furthermore, the opening pressure threshold of the micro check valves 6 and 9 is 0.05~0.2MPa.

[0037] Furthermore, the condenser tube is an aluminum capillary tube with an inner diameter of 3-5 mm and a wall thickness of 1-1.5 mm. The metal fins 7 are fixed to the outer wall of the condenser tube by brazing, with a fin spacing of 1-3 mm and a height of 10-20 mm.

[0038] Furthermore, the jet nozzle is located to the right rear of the rear end face of the cutting tool, the angle between the jet nozzle of the equalizing water pipe and the rear end face of the diamond cutting tool 1 is 30°~60°, and the diameter of the jet nozzle is 0.5~1mm.

[0039] Furthermore, the controller 13 is configured to: when the temperature sensor 12 detects that the tool temperature exceeds the cleaning threshold, trigger the electromagnetic reversing valve 14 to conduct the cleaning liquid 15 to form a mixture 17 with a gas-liquid volume ratio of 1:5 to 1:8; when the temperature is below the cleaning threshold, only the high-pressure gas 16 is conducted to form a positive pressure environment.

[0040] Furthermore, the cooling medium is a mixture of water and ethylene glycol, wherein the volume percentage of ethylene glycol is 30% to 50%. In this embodiment, the cooling medium is a water-ethylene glycol mixture with a freezing point of -30°C. This can cover cutting environments ranging from -20°C to 100°C. Simultaneously, the high specific heat capacity of the medium ensures a gradual temperature rise after absorbing heat from the base, reducing the frequency of phase change cycles and extending system life. The system can operate stably in cold workshops or under high-temperature cutting conditions, exhibiting strong environmental adaptability. Of course, as other optional implementation methods, other cooling media can be selected according to actual working conditions.

[0041] Furthermore, it also includes an ultrasonic vibration unit and / or a laser channel to be suitable for single laser or ultrasonic conditions or laser-ultrasonic composite cutting, wherein the ultrasonic vibration unit is rigidly connected to the tool base 10, and the laser channel penetrates the tool base 10 and is aligned with the diamond cutting edge 1.

[0042] This invention also discloses a method for using the temperature control and active cleaning system for the above-mentioned self-heating ultra-precision cutting scenario, comprising the following steps: The resistance temperature sensor 12 is tightly attached to the side of the diamond cutting tool 1. During the processing, the temperature data it acquires is transmitted to the controller 13. The controller 13 is based on a preset cleaning threshold. When the detected temperature is lower than the cleaning threshold, the controller outputs a signal to make the electromagnetic reversing valve 14 only open the high-pressure gas source 16 passage and cut off the cleaning liquid 15. When the temperature is higher than the cleaning threshold, the controller switches the electromagnetic reversing valve passage to make the high-pressure gas source and the cleaning liquid open at the same time. The high-pressure gas negative pressure is used to draw in the cleaning liquid to form a mixture with a gas-liquid volume ratio of 1:5 to 1:8. The pressure equalizing water pipe receives the medium from the electromagnetic reversing valve. Under normal conditions, when the pressure is below the preset cleaning threshold, high-pressure gas is ejected from the nozzle, forming a positive pressure barrier on the rear end face of the cutting tool to prevent cutting fluid from splashing and adhering. In cleaning mode, when the pressure is above the preset cleaning threshold, the gas-liquid mixture is ejected at a preset high speed, removing residual stains through the dual action of airflow impact and liquid dissolution. Simultaneously, the airflow cooling reduces the temperature of the rear end face of the cutting tool to a preset value. The preset high-speed injection is adjusted based on specific processing conditions, such as 30-80 m / s.

[0043] The preset cleaning threshold and preset value can be adjusted according to the specific processing conditions. In this embodiment, the preset cleaning threshold and preset value are 60°C.

[0044] This may also include the following steps: Operating condition switching adaptation: Among them, single ultrasonic cutting is: the laser channel is closed, only the ultrasonic vibration unit is turned on, and the cleaning subsystem maintains only high-pressure gas mode to avoid gas-liquid mixture from affecting metal chip removal. Single laser cutting involves: shutting down the ultrasonic vibration unit, opening the laser channel, strengthening the circulation of the constant temperature subsystem, and switching the cleaning subsystem normally according to the temperature threshold. Laser-ultrasonic composite cutting involves simultaneously activating the ultrasonic vibration unit and the laser channel, with the constant temperature subsystem and the cleaning subsystem operating at full capacity to ensure that base temperature control and blade cleaning are effective simultaneously.

[0045] The working principle and process of the embedded microfluidic constant temperature system are as follows: When the tool base 10 is heated by heat conduction, the water-ethylene glycol cooling medium in the microfluidic channel 11 undergoes underheating and boiling to generate bubbles. The internal pressure increases, pushing the outlet micro check valve 6 to open. The vaporized medium enters the condenser tube, liquefies, and flows back to the storage tank 8. After the pressure drops, the inlet micro check valve 9 opens to replenish the liquid medium, forming a closed-loop phase change cooling.

[0046] The isothermal subsystem of this invention employs a cemented carbide tool holder with an internally integrated serpentine microfluidic channel. It connects to a finned condenser and a cooling medium storage tank via inlet and outlet micro-check valves, achieving pump-free active temperature control through a self-driven phase change cycle of the water-glycol cooling medium. The cleaning subsystem uses a temperature sensor to monitor the tool status in real time. A controller triggers cleaning modes in stages based on temperature thresholds, spraying high-pressure gas and gas-liquid mixtures through pressure-equalizing water pipes and high-pressure gas pipes according to different cleaning modes. This invention eliminates cutting deviations caused by deformation of the heated tool holder through phase change boiling circulation and prevents laser energy loss and diamond graphitization risks caused by contamination. It can be applied to self-heating ultra-precision cutting scenarios such as laser-ultrasonic composite cutting and single laser / ultrasonic vibration.

[0047] During ultrasonic vibration machining, the ultrasonic vibration unit is rigidly connected to the tool base 10 through a flange to ensure that the vibration is transmitted to the cutting tool without attenuation. At the same time, the embedded microchannel thermostatic subsystem cools the base to avoid base deformation caused by the accumulation of vibration friction heat, thus ensuring the accuracy of vibration transmission.

[0048] In laser processing, the laser channel penetrates the tool base and is coaxial with the rear end face of the tool. The embedded microchannel thermostatic subsystem suppresses the thermal expansion of the base and avoids deviation in the coaxiality of the channel. The diamond rear end face dual-mode cleaning subsystem keeps the rear end face clean and prevents the laser from focusing deviation caused by the refraction of dirt. The two work together to ensure that the laser energy accurately penetrates the tool.

[0049] When switching to single laser cutting, only the ultrasonic vibration unit is turned off, while the thermostat and cleaning subsystems remain operational, using microfluidic temperature control to adapt to the high laser temperature. When switching to single ultrasonic cutting, the laser is turned off, and the cleaning subsystem maintains only positive pressure protection to prevent liquid from affecting metal chip removal. When switching to composite cutting, all devices work together, with the thermostat controlling temperature, the cleaning subsystem providing protection, and the ultrasonic-laser transmission being precise, requiring no additional module replacements. This synergistic effect offers better adaptability and higher integration compared to traditional single processing scenarios, covering all scenarios of laser-ultrasonic composite and single laser / ultrasonic cutting for hard and brittle materials (including semiconductors, optical crystals, etc.).

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A temperature control and active cleaning system for self-heating ultra-precision cutting scenarios, characterized in that, This includes an embedded microfluidic thermostatic subsystem and a dual-mode cleaning subsystem for the diamond back end face; The embedded microfluidic thermostatic subsystem includes: a carbide tool base (10) with an internally integrated serpentine microfluidic channel (11), a condenser tube, a cooling medium storage tank (8), an outlet micro check valve (6), and an inlet micro check valve (9); the serpentine microfluidic channel (11) is formed by laser welding and sealing two pre-processed micro-grooves of carbide substrates; the condenser tube is covered with metal fins (7), one end of which is connected to the outlet of the serpentine microfluidic channel (11), and the other end is connected to the cooling medium storage tank (8); the outlet micro check valve (6) and the inlet micro check valve (9) are respectively located at the outlet and inlet of the microfluidic channel (11) to achieve unidirectional flow; The dual-mode cleaning subsystem for the rear end face of the diamond includes: a pressure equalizing water pipe, a resistance temperature sensor (12), a controller (13), an electromagnetic reversing valve (14), and a high-pressure air source (16); the pressure equalizing water pipe is located on the upper right side of the diamond cutting tool (1) and is used to spray high-pressure gas or a gas-liquid mixture (17); the resistance temperature sensor (12) is attached to the side of the diamond cutting tool (1); the controller (13) is electrically connected to the temperature sensor (12) and the electromagnetic reversing valve (14); the electromagnetic reversing valve (14) is used to switch the passage of the high-pressure air source (16) and the cleaning liquid (15).

2. The temperature control and active cleaning system for self-heating ultra-precision cutting scenarios according to claim 1, characterized in that, The cross-section of the serpentine microchannel (11) is circular with a diameter of 2-4 mm, and the total length of the microchannel is 3-4 times the length of the tool base (10).

3. The temperature control and active cleaning system for self-heating ultra-precision cutting scenarios according to claim 1, characterized in that, The opening pressure threshold of the outlet micro check valve (6) and the inlet micro check valve (9) is 0.05~0.2MPa.

4. The temperature control and active cleaning system for self-heating ultra-precision cutting scenarios according to claim 1, characterized in that, The condenser tube is an aluminum capillary tube with an inner diameter of 3~5mm and a wall thickness of 1~1.5mm. The metal fins (7) are fixed to the outer wall of the condenser tube by brazing, with a fin spacing of 1~3mm and a height of 10~20mm.

5. The temperature control and active cleaning system for self-heating ultra-precision cutting scenarios according to claim 1, characterized in that, The jet nozzle is located to the right rear of the rear end face of the cutting tool. The angle between the jet nozzle of the equalizing water pipe and the rear end face of the diamond cutting tool (1) is 30°~60°, and the diameter of the jet nozzle is 0.5~1mm.

6. The temperature control and active cleaning system for self-heating ultra-precision cutting scenarios according to claim 1, characterized in that, The controller (13) is configured to: when the temperature sensor (12) detects that the tool temperature exceeds the cleaning threshold, trigger the electromagnetic reversing valve (14) to conduct the cleaning liquid (15) to form a mixture (17) with a gas-liquid volume ratio of 1:5 to 1:8; when the temperature is below the cleaning threshold, only high-pressure gas (16) is conducted to form a positive pressure environment.

7. The temperature control and active cleaning system for self-heating ultra-precision cutting scenarios according to claim 1, characterized in that, The cooling medium is a mixture of water and ethylene glycol, wherein the volume percentage of ethylene glycol is 30% to 50%.

8. The temperature control and active cleaning system for self-heating ultra-precision cutting scenarios according to claim 1, characterized in that, It also includes an ultrasonic vibration unit and / or a laser channel to be suitable for single laser or ultrasonic conditions or laser-ultrasonic composite cutting, wherein the ultrasonic vibration unit is rigidly connected to the tool base (10), and the laser channel passes through the tool base (10) and is aligned with the diamond cutting bit (1).

9. A method of using the temperature control and active cleaning system for a self-heating ultra-precision cutting scenario as described in any one of claims 1 to 8, characterized in that, Includes the following steps: The resistance temperature sensor (12) is tightly attached to the side of the diamond cutting tool (1). During the processing, the temperature data it acquires is transmitted to the controller (13). The controller (13) is based on a preset cleaning threshold. When the detected temperature is lower than the cleaning threshold, the controller outputs a signal to make the electromagnetic reversing valve (14) only open the high-pressure gas source (16) passage and cut off the cleaning liquid (15). When the temperature is higher than the cleaning threshold, the controller switches the electromagnetic reversing valve passage to make the high-pressure gas source and the cleaning liquid open at the same time. The high-pressure gas negative pressure is used to draw in the cleaning liquid to form a mixture with a gas-liquid volume ratio of 1:5 to 1:

8. The equalizing water pipe receives the medium from the electromagnetic reversing valve: Under normal conditions, when the temperature is below the preset cleaning threshold, high-pressure gas is ejected from the nozzle, forming a positive pressure barrier on the rear end face of the cutting blade to prevent the cutting fluid from splashing and adhering; under cleaning mode, when the temperature is above the preset cleaning threshold, the gas-liquid mixture is ejected at a preset high speed, removing residual stains through the dual action of airflow impact and liquid dissolution, while using airflow cooling to reduce the temperature of the rear end face of the cutting blade to a preset value.

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