PCB substrate graphene flake dip coating device

Abstract

The application discloses a PCB substrate graphene microsheet dip coating device, and belongs to the technical field of circuit board processing. The device comprises a gantry moving frame, a plurality of treatment tanks and a mounting rod, wherein a plurality of clamping units are equidistantly arranged on the mounting rod; the clamping unit comprises a U-shaped frame arranged on the mounting rod, a fixed clamping frame, a positioning block fixedly connected to the fixed clamping frame and a movable clamping frame hingedly connected to the fixed clamping frame, and a support fixedly connected to one side of the movable clamping frame close to the positioning block. The movable clamping frame is supported and limited by the support. When clamping the substrate, the substrate is only needed to be moved and the support is pushed by the substrate, so that the movable clamping frame is released from the limitation of the support, the clamping and fixing of the substrate are completed, the step of fastening all clamps one by one is omitted, the probability of substrate deflection during fastening of the clamps is reduced, the operation step is simplified, and the efficiency of dip coating and electroplating is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board processing, and particularly relates to a PCB substrate graphene microsheet dip coating device. BACKGROUND

[0002] PCB substrate is the core material for manufacturing printed circuit board (PCB), and its preparation process includes a series of procedures such as cutting, drilling, black hole, electroplating, dry film and the like. With the increasing lightness and miniaturization of electronic products, the circuit board generally has high thickness-diameter ratio characteristics, and the via structure tends to be slender, which can easily lead to the thickness of the copper layer in the hole being less than the hole opening in the electroplating process, thereby affecting the uniformity and reliability of the plating layer. In order to improve the electroplating effect, the method of constructing a graphene conductive layer in the via before electroplating is generally used at present, which promotes the uniform deposition of copper ions and improves the via metallization quality by virtue of the excellent conductivity of graphene.

[0003] However, when the above process is implemented based on a gantry type electroplating equipment, the position of the substrate to be fixed needs to be moved into the corresponding plurality of clamps, and all the corresponding clamps are fastened one by one while keeping the position of the substrate unchanged, so as to complete the fixation of the substrate. However, this method needs to fasten all the clamps one by one, which is complicated to operate. At the same time, since the two actions of keeping the substrate stable and fastening the clamps are performed at the same time, if the substrate is inclined during the fastening of the clamps, there will be an overlap between the two adjacent substrates after the fixation of the substrate is completed, which affects the adhesion of graphene microsheet and copper ions. In this state, the substrate needs to be re-fixed, which further increases the degree of complexity of the operation. SUMMARY

[0004] The present application provides a PCB substrate graphene microsheet dip coating device to overcome the disadvantage of complicated operation of the method of clamping the substrate used by the existing gantry type electroplating equipment.

[0005] The technical scheme of the present application is: a PCB substrate graphene microsheet immersion coating device, comprising: a gantry moving frame, a plurality of treatment tanks and a mounting rod, a plurality of treatment tanks are located in the middle of the gantry moving frame, the mounting rod is mounted on the gantry moving frame, a plurality of clamping units are arranged on the mounting rod at equal intervals, and the clamping units are used for clamping and fixing the substrate; the clamping unit comprises: a U-shaped frame, which is arranged on the mounting rod, the U-shaped frame is threadedly connected with a fastening knob for pressing the mounting rod, the U-shaped frame is provided with a fixed clamping frame, the fixed clamping frame is fixedly connected with a positioning block and hingedly connected with a movable clamping frame, one side of the movable clamping frame close to the positioning block is fixedly connected with a support abutting against the fixed clamping frame, the position of the fixed clamping frame close to the support is provided with a sliding groove for accommodating the support, and one side of the movable clamping frame away from the support is hingedly connected with a clamping arc piece in sliding connection with the fixed clamping frame; the clamping arc piece and the support are respectively located on both sides of the hinge point of the movable clamping frame and both have elasticity.

[0006] Further, the lower part of the fixed clamping frame is provided with an inclined surface close to the movable clamping frame, which is used for guiding the PCB substrate into the space between the fixed clamping frame and the movable clamping frame.

[0007] Further, one side of the clamping arc piece away from the movable clamping frame is fixedly connected with a fastening screw, the fastening screw is in sliding connection with the fixed clamping frame, the fastening screw penetrates through the fixed clamping frame and is threadedly connected with an adjusting knob, and the adjusting knob is in contact with the fixed clamping frame.

[0008] Further, the lower part of the fixed clamping frame and the movable clamping frame is provided with a mounting block, the mounting block is fixedly connected with a support piece, the mounting block is fixedly connected with an elastic shielding cylinder, the fixed clamping frame and the movable clamping frame are respectively in contact with adjacent elastic shielding cylinders, the elastic shielding cylinder is fixedly connected with an abutting piece, and the abutting piece is in contact with the support piece.

[0009] Further, the position where the support piece is in contact with the adjacent abutting piece is provided with a circular arc part, and the central axis of the circular arc part is parallel to the swing axis of the hinge point of the movable clamping frame.

[0010] Further, the edge of the abutting piece away from the adjacent support piece is provided with an accommodating ring groove, and the accommodating ring groove is used for accommodating the deformed elastic shielding cylinder.

[0011] Further, the distance between the clamping position of the movable clamping frame and the clamping arc piece and the hinge point of the movable clamping frame is greater than the distance between the hinge point of the movable clamping frame and the adjacent mounting block.

[0012] Further, the fixed clamping frame and the lower part of the movable clamping frame are detachably connected with mounting frames, and the fixed clamping frame and the movable clamping frame are respectively connected with the adjacent mounting blocks in a sliding mode.

[0013] Further, the U-shaped frame is hinged to the fixed clamping frame, the U-shaped frame is fixedly connected with elastic arc pieces, the fixed clamping frame is provided with three limiting grooves, and the elastic arc pieces limit the fixed clamping frame through the limiting grooves.

[0014] Further, the angle between the connecting line of the center points of the two adjacent limiting grooves and the rotation axis of the hinged point of the U-shaped frame is 90°, and the surfaces of the two limiting grooves except the middle one are coated with an insulating coating.

[0015] The skilled in the art can understand that the present application has at least the following beneficial effects: the present application supports and limits the movable clamping frame by the support piece, when clamping the substrate, only the substrate needs to be moved to push the support piece, and the support piece is released from the limitation of the movable clamping frame, so that the clamping and fixing of the substrate are completed, thus the step of tightening all clamps one by one is avoided, the probability of substrate deflection during the tightening of the clamps is reduced, the operation steps are simplified, and the efficiency of immersion coating and electroplating is improved.

[0016] The elastic shielding cylinder shields the circumferential side of the mounting block, the support piece and the abutting piece, cooperates with the substrate to block the direct contact of the electroplating solution with the mounting block, the support piece and the abutting piece, slows down the deposition rate of copper ions to the surface of the mounting block, the support piece and the abutting piece, and prolongs the service life of the mounting block, the support piece and the abutting piece.

[0017] The contact of the circular arc part with the support piece enables the support piece to swing automatically when being pressed by the substrate, and the support piece can automatically fit different specifications of the substrate, improving the practicability of the device. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the present application;

[0019] Figure 2 It is a schematic diagram of the three-dimensional structure of the mounting rod and the U-shaped frame of the present application;

[0020] Figure 3 It is a schematic diagram of the three-dimensional structure of the fixed clamping frame and the movable clamping frame of the present application;

[0021] Figure 4 It is a schematic diagram of the three-dimensional structure of the movable clamping frame and the support piece of the present application;

[0022] Figure 5 It is a schematic diagram of the three-dimensional structure of the movable clamping frame and the elastic shielding cylinder of the present application;

[0023] Figure 6 A perspective view of the structure of the elastic shielding cylinder and the abutting piece of the present application;

[0024] Figure 7 A perspective view of the structure of the U-shaped frame and the elastic arc piece of the present application;

[0025] Figure 8 A perspective view of the structure of the fixed clamping frame and the movable clamping frame in the clamping state of the present application.

[0026] Part names and serial numbers in the figure: 1-gantry mobile frame, 2-treatment tank, 3-mounting rod, 4-U-shaped frame, 5-tightening knob, 6-fixed clamping frame, 7-positioning block, 8-movable clamping frame, 9-supporting piece, 901-sliding groove, 10-clamping arc piece, 11-tightening screw, 12-adjusting knob, 13-mounting block, 14-supporting piece, 141-circular arc part, 15-elastic shielding cylinder, 16-abutting piece, 161-containing ring groove, 17-mounting frame, 18-elastic arc piece, 181-limiting groove. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the present application more clear and explicit, the present application will be further described in detail below in combination with the drawings and examples.

[0028] Example 1: The present embodiment provides a PCB substrate graphene microsheet dip coating device to solve the problem of complicated operation steps and inconvenient use of the existing gantry type electroplating equipment.

[0029] Referring to Figures 1 to 5 and Figure 8 A PCB substrate graphene microsheet dip coating device, comprising: a gantry mobile frame 1, a plurality of treatment tanks 2 and a mounting rod 3, the plurality of treatment tanks 2 are located in the middle part of the gantry mobile frame 1, the gantry mobile frame 1 and the treatment tank 2 are both existing devices, and are not shown in detail in the drawings; the mounting rod 3 is mounted on the gantry mobile frame 1 and is driven by the gantry mobile frame 1 to move up and down and front and back, the mounting rod 3 is provided with a plurality of clamping units distributed at equal intervals, the clamping units are used for clamping and fixing the substrate, and the number and spacing of the clamping units are determined according to the substrate specifications required to be processed by the current production line.

[0030] The clamping unit comprises a U-shaped frame 4 arranged on the mounting rod 3, a fastening knob 5 threadedly connected to the upper portion of the U-shaped frame 4, the fastening knob 5 being used to press against the mounting rod 3 to fix the U-shaped frame 4 to the mounting rod 3, a fixed clamping frame 6 arranged at the lower portion of the U-shaped frame 4, a positioning block 7 fixed to the lower portion of the front side of the fixed clamping frame 6, a movable clamping frame 8 hingedly connected to the middle portion of the front side of the fixed clamping frame 6, a support piece 9 fixed to the lower portion of the movable clamping frame 8, the support piece 9 being made of elastic metal material, a groove being arranged at the middle portion of the upper side of the support piece 9, the groove being used to control the position of the bending deformation of the support piece 9, the support piece 9 abutting against the fixed clamping frame 6 to keep the distance between the lower portion of the movable clamping frame 8 and the lower portion of the fixed clamping frame 6 unchanged, a sliding groove 901 arranged at the lower portion of the fixed clamping frame 6 and used to accommodate the support piece 9, a clamping arc piece 10 clamped to the upper portion of the movable clamping frame 8, the clamping arc piece 10 being made of elastic metal material and always being in a bending force storage state, the rear side of the clamping arc piece 10 being slidingly connected to the fixed clamping frame 6, and the clamping arc piece 10 and the support piece 9 being respectively arranged on the upper side and the lower side of the hinge point of the movable clamping frame 8.

[0031] The above arrangement can realize that the movable clamping frame 8 is supported and limited by the support piece 9, when clamping the substrate, the substrate is only needed to be moved and the support piece 9 is pushed by the substrate to release the limitation of the movable clamping frame 8 by the support piece 9, so that the clamping and fixing of the substrate are completed, thus the step of fastening all the clamps one by one is omitted, the probability of the substrate being deflected during fastening the clamps is reduced, the operation steps are simplified, and the efficiency of immersion coating and electroplating is improved.

[0032] It should be noted that, in the embodiment, the arrangement relationship between the U-shaped frame 4 and the fixed clamping frame 6 can be regarded as being fixedly connected, and the clamping and electrical connection of the substrate are realized by the lower portions of the fixed clamping frame 6 and the movable clamping frame 8.

[0033] Referring to Figure 3 and Figure 4 , the lower portion of the fixed clamping frame 6 is provided with an inclined surface, the inclined surface being used to guide the substrate to enter between the fixed clamping frame 6 and the movable clamping frame 8.

[0034] Referring to Figure 4 , the rear side of the clamping arc piece 10 is fixedly connected with a fastening screw 11, the fastening screw 11 being slidingly connected to the fixed clamping frame 6, the fastening screw 11 penetrating through the fixed clamping frame 6 and being threadedly connected with an adjusting knob 12, the adjusting knob 12 being in contact with the fixed clamping frame 6; in the working state, the rear side of the clamping arc piece 10 keeps a relative stationary state with the fixed clamping frame 6 by the extrusion force of the adjusting knob 12 and the clamping arc piece 10, when the clamping force needs to be adjusted, the extrusion force of the adjusting knob 12 and the clamping arc piece 10 on the fixed clamping frame 6 is released by rotating the adjusting knob 12, then the position of the rear side of the clamping arc piece 10 is adjusted, and the initial deformation force storage degree of the clamping arc piece 10 is changed.

[0035] The immersion coating process is as follows: clean liquid, graphene solution containing calcium carbonate particles, pickling liquid, and electroplating liquid are sequentially injected into different treatment tanks 2 from front to back; after the drilling of the substrate is completed, the substrate is clamped and fixed by using the fixed clamping frame 6 and the movable clamping frame 8, the gantry moving frame 1 is started, the gantry moving frame 1 is driven by the installation to sequentially probe into the treatment tanks 2 from front to back, and the substrate is cleaned by using the clean liquid; the substrate is immersed in the graphene solution, and a graphene layer formed by mixing calcium carbonate particles and graphene particles is attached to the surface of the through hole of the substrate by using the principle of overcharge adsorption; the substrate is immersed in the pickling liquid, the calcium carbonate particles contained in the graphene layer in the through hole of the substrate are acidified and dissolved, irregular micro-holes are generated in the inner wall of the graphene layer, a part of the micro-holes exist independently, and a part of the micro-holes are interconnected; the substrate after pickling is immersed in the electroplating liquid, copper ions enter the micro-holes of the graphene layer, and at the same time, the copper layer on the surface of the substrate is connected to form a more firm copper layer, thereby improving the adhesion of the copper layer on the hole wall; after the treatment is completed, the substrate is removed and the gantry moving frame 1 is stopped.

[0036] When the substrate is clamped and fixed by using the fixed clamping frame 6 and the movable clamping frame 8, the substrate is moved to the lower side of the fixed clamping frame 6 and the movable clamping frame 8 to be clamped in a vertical state (one substrate corresponds to multiple fixed clamping frames 6 and movable clamping frames 8, for the convenience of description, a group of fixed clamping frames 6 and movable clamping frames 8 and the movement of the substrate are described as an example in the subsequent description), then the substrate is moved upward, the upper side of the substrate enters between the fixed clamping frame 6 and the movable clamping frame 8, the distance between the upper side of the substrate and the support 9 gradually decreases, until the substrate contacts the support 9, at this time, the substrate is continuously moved upward, the support 9 is deformed from the groove by the substrate, the rear part of the support 9 moves relative to the fixed clamping frame 6, when the upper side of the substrate contacts the positioning block 7, the support 9 loses contact with the fixed clamping frame 6 and enters the sliding groove 901, at this time, the movable clamping frame 8 swings around the hinge point under the elastic force of the clamping arc piece 10, the distance between the lower part of the fixed clamping frame 6 and the movable clamping frame 8 gradually decreases, finally the fixed clamping frame 6 and the movable clamping frame 8 respectively contact the front and rear sides of the substrate, and the clamping of the substrate is completed.

[0037] When the substrate needs to be removed, the upper part of the movable clamping frame 8 is pushed forward, the movable clamping frame 8 swings and extrudes the clamping arc piece 10 to bend and deform, the distance between the lower part of the fixed clamping frame 6 and the movable clamping frame 8 gradually increases, and the movable clamping frame 8 drives the support 9 to move out of the sliding groove 901 and re-contacts the fixed clamping frame 6 at this time, the movable clamping frame 8 is stopped, the movable clamping frame 8 is kept stationary by the limiting action of the support 9, the substrate is taken down and properly stored, and the whole clamping and dismounting process is completed.

[0038] Embodiment 2: Based on Embodiment 1, a new way of clamping the substrate is provided to solve the problem that after the existing clamp completes clamping the substrate and follows the substrate to immerse in the electroplating solution, the copper ions in the electroplating solution directly adhere to the surface of the clamp.

[0039] Referring to Figures 3 to 6 The lower part of the fixed clamping frame 6 and the movable clamping frame 8 is provided with a mounting block 13, and the fixed clamping frame 6 and the movable clamping frame 8 are in contact with and electrically connected to the mounting block 13. The outer side surface of the fixed clamping frame 6 and the movable clamping frame 8 is coated with an insulating coating. The mounting block 13 is fixedly connected with a support piece 14. The mounting block 13 is fixedly connected with an elastic shielding cylinder 15. The fixed clamping frame 6 and the movable clamping frame 8 are respectively in contact with the adjacent elastic shielding cylinder 15. The elastic shielding cylinder 15 can be made of fluorine rubber. The elastic shielding cylinder 15 is fixedly connected with an abutting piece 16. The abutting piece 16 is in contact with the support piece 14. The support piece 14 and the abutting piece 16 are located in the elastic shielding cylinder 15.

[0040] The above arrangement can realize that the elastic shielding cylinder 15 shields the circumferential side of the mounting block 13, the support piece 14 and the abutting piece 16, and cooperates with the substrate to block the direct contact of the electroplating solution with the mounting block 13, the support piece 14 and the abutting piece 16, slow down the deposition rate of copper ions to the surface of the mounting block 13, the support piece 14 and the abutting piece 16, and further prolong the service life of the mounting block 13, the support piece 14 and the abutting piece 16.

[0041] It should be noted that in the present embodiment, the fixed clamping frame 6 and the movable clamping frame 8 and the adjacent mounting block 13 can be considered as fixedly connected.

[0042] Embodiment 3: Based on Embodiment 2, the present device is further optimized so that when clamping and fixing substrates of different thicknesses, the support piece 14 can be in contact with the substrate to provide reliable electrical connection.

[0043] Referring to Figure 6 The position where the support piece 14 contacts the adjacent abutting piece 16 is provided with a circular arc part 141, and the center axis of the circular arc part 141 is parallel to the swing axis of the hinge point of the movable clamping frame 8, that is, the inclination angle of the abutting piece 16 relative to the horizontal plane can change by itself.

[0044] The above arrangement can realize that the abutting piece 16 can swing by itself when being pressed by the substrate, and further make the abutting piece 16 can automatically fit different specifications of the substrate, thereby improving the practicability of the device.

[0045] Embodiment 4: Based on Embodiment 3, the present device is further optimized to enhance the reliability of the support piece 14 and the substrate in fitting and electrical connection.

[0046] Referring to Figure 6The edge of the abutting piece 16 away from the side of the adjacent supporting piece 14 is provided with a receiving ring groove 161 for receiving the deformed elastic shielding cylinder 15.

[0047] Process: In the process of reducing the distance between the fixed holder 6 and the movable holder 8, the edge of the elastic shielding cylinder 15 first contacts the substrate. As the movable holder 8 continues to move, the edge of the elastic shielding cylinder 15 is extruded and deformed, so that the distance between the supporting piece 14 and the substrate is reduced, and finally the supporting piece 14 is attached to the substrate; in the process of deforming the elastic shielding cylinder 15, the edge portion of the inner side of the elastic shielding cylinder 15 deforms inwardly and enters the receiving ring groove 161, so that the deformation of the elastic shielding cylinder 15 does not affect the attachment of the supporting piece 14 to the substrate, and the reliability of the attachment of the supporting piece 14 to the substrate is enhanced.

[0048] Embodiment 5: This embodiment is further optimized on the basis of embodiment 4.

[0049] Referring to Figure 4 The distance between the clamping arc piece 10 and the clamping position of the movable holder 8 is greater than the distance between the hinge point of the movable holder 8 and the adjacent mounting block 13, and the elastic force of the clamping arc piece 10 is amplified to serve as a clamping force by using the principle of leverage, so that not only the force required by the worker to push the movable holder 8 to swing is reduced, but also the position of the rear side of the clamping arc piece 10 is easily adjusted.

[0050] Embodiment 6: This embodiment is further optimized on the basis of embodiment 5 to provide the function of being detachably replaced, so as to avoid replacing the entire clamp when the clamping position of the clamp is damaged, thereby saving production cost.

[0051] Referring to Figures 3 to 5 The opposite sides of the lower parts of the fixed holder 6 and the movable holder 8 are detachably connected with a mounting frame 17, the fixed holder 6 and the movable holder 8 are respectively slidably connected with the adjacent mounting block 13, and the mounting frame 17 is in contact with the adjacent mounting block 13 to keep the relative stability of the positions of the fixed holder 6 and the movable holder 8 relative to the adjacent mounting block 13, and to isolate the external electroplating solution from directly contacting the side surface of the mounting block 13.

[0052] Embodiment 7: This embodiment is further optimized on the basis of embodiment 6.

[0053] In the actual use process, the current gantry type electroplating device is easily affected by the substrate specification, and the edge clamp is empty. If the edge clamp is not processed, the resistance at the edge clamp will be smaller than that at the remaining substrate, which will cause uneven distribution of ions in the electroplating solution, affecting the uniformity of the copper plating thickness. Therefore, when the above-mentioned empty situation occurs, a piece of waste board will be clamped on the empty clamp to balance the resistance of the electroplating solution at each position. However, this method causes the edge clamp and copper ions in the electroplating solution to be wasted, increasing the production cost.

[0054] Referring to Figure 2 , Figure 3 , Figure 7 and Figure 8 , the U-shaped frame 4 is hinged to the fixed clamping frame 6, the U-shaped frame 4 is fixedly connected with an elastic arc piece 18, the elastic arc piece 18 is made of elastic metal material, the fixed clamping frame 6 is provided with three limiting grooves 181, and the elastic arc piece 18 limits the fixed clamping frame 6 through the limiting grooves 181; the included angle between the center points of the adjacent two limiting grooves 181 and the rotation axis of the hinging point of the U-shaped frame 4 is 90°, and the surfaces of the other two limiting grooves 181 except the middle limiting groove 181 are coated with an insulating coating; in this way, when the U-shaped frame 4 and the fixed clamping frame 6 are on the same straight line, the U-shaped frame 4 and the fixed clamping frame 6 are electrically connected through the elastic arc piece 18, and when the U-shaped frame 4 and the fixed clamping frame 6 are in a vertical state (see Figure 2 the state of the left and right two groups of clamps), the U-shaped frame 4 and the fixed clamping frame 6 cannot be electrically connected.

[0055] The embodiments of the specific implementation are the preferred embodiments of the present application, and are not limited to the protection scope of the present application. Therefore, any equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. A PCB substrate graphene flake dip coating apparatus, characterized by, Include: Gantry mobile frame (1), several processing tank (2) and installation pole (3), several processing tank (2) are located in the middle part of gantry mobile frame (1), installation pole (3) is installed on gantry mobile frame (1), installation pole (3) is provided with multiple clamping units that are equidistantly distributed, clamping unit is used for clamping fixed base plate; The clamping unit comprises: U-shaped frame (4) is erected on the installation pole (3), the U-shaped frame (4) is threadedly connected with the fastening knob (5) for pressing the installation pole (3), the U-shaped frame (4) is provided with the fixed clamping frame (6), the fixed clamping frame (6) is fixedly connected with the positioning block (7) and is hingedly connected with the movable clamping frame (8), the movable clamping frame (8) is fixedly connected with the support (9) on the side close to the positioning block (7) and abuts against the fixed clamping frame (6), the fixed clamping frame (6) is provided with the sliding groove (901) for accommodating the support (9) at the position close to the support (9), the movable clamping frame (8) is hingedly connected with the clamping arc piece (10) on the side away from the support (9), the clamping arc piece (10) and the support (9) are respectively located on both sides of the hinging point of the movable clamping frame (8) and are both elastic.

2. The PCB substrate graphene flake dip coating apparatus of claim 1, wherein, The lower part of the fixed clamping frame (6) is provided with an inclined surface at the position close to the movable clamping frame (8), and the inclined surface is used for guiding the PCB substrate into the fixed clamping frame (6) and the movable clamping frame (8).

3. The PCB substrate graphene flake dip coating apparatus of claim 1, wherein, The side away from the movable clamping frame (8) of the clamping arc piece (10) is fixedly connected with the fastening screw (11), the fastening screw (11) is slidably connected with the fixed clamping frame (6), the fastening screw (11) penetrates through the fixed clamping frame (6) and is threadedly connected with the adjusting knob (12), and the adjusting knob (12) is in contact with the fixed clamping frame (6).

4. The PCB substrate graphene flake dip coating apparatus of claim 3, wherein, The lower part of the fixed clamping frame (6) and the movable clamping frame (8) is provided with the mounting block (13), the mounting block (13) is fixedly connected with the support piece (14), the mounting block (13) is fixedly connected with the elastic shielding cylinder (15), the fixed clamping frame (6) and the movable clamping frame (8) are respectively in contact with the adjacent elastic shielding cylinder (15), the elastic shielding cylinder (15) is fixedly connected with the abutting piece (16), and the abutting piece (16) is in contact with the support piece (14).

5. The PCB substrate graphene flake dip coating apparatus of claim 4, wherein, The position, where the support piece (14) is in contact with the adjacent abutting piece (16), is provided with a circular arc part (141), and the center axis of the circular arc part (141) is parallel to the swing axis of the hinging point of the movable clamping frame (8).

6. The PCB substrate graphene flake dip coating apparatus of claim 5, wherein, The edge of the abutting piece (16) away from the adjacent support piece (14) is provided with a containing ring groove (161), and the containing ring groove (161) is used for containing the deformed elastic shielding cylinder (15).

7. The PCB substrate graphene flake dip coating apparatus of claim 5, wherein, The distance between the clamping position of the movable clamping frame (8) and the clamping arc piece (10) and the hinging point of the movable clamping frame (8) is greater than the distance between the hinging point of the movable clamping frame (8) and the adjacent mounting block (13).

8. The PCB substrate graphene flake dip coating apparatus of claim 5, wherein, The opposite sides of the lower part of the fixed holder (6) and the movable holder (8) are detachably connected with mounting frames (17), the fixed holder (6) and the movable holder (8) are respectively in sliding connection with the adjacent mounting blocks (13), and the mounting frames (17) are in contact with the adjacent mounting blocks (13).

9. The PCB substrate graphene flake dip coating apparatus of claim 8, wherein, The U-shaped frame (4) is hinged to the fixed holder (6), the fixed holder (6) is fixedly connected with elastic arc pieces (18), the fixed holder (6) is provided with three limiting grooves (181), and the elastic arc pieces (18) limit the fixed holder (6) through the limiting grooves (181).

10. The PCB substrate graphene flake dip coating apparatus of claim 9, wherein, The included angle between the center points of the two adjacent limiting grooves (181) and the rotation axis of the hinging point of the U-shaped frame (4) is 90°, and the surfaces of the other two limiting grooves (181) except the middle one are coated with an insulating coating.

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