Infrared temperature feedback-based closed-loop control method and system for solder temperature

Abstract

This application relates to the field of infrared temperature measurement technology, and provides a closed-loop control method and system for solder temperature based on infrared temperature measurement feedback. It addresses problems such as significant deviations in temperature measurement results from the true value in the critical phase transition region and inaccuracies caused by failure to consider material state changes. This application detects the ambient temperature of the welding area and the initial temperature value of the solder during the welding process to obtain solder phase transition emissivity data; determines the real-time state of the solder, and obtains the calibrated solder temperature by combining the solder phase transition emissivity data and the ambient temperature; compares the calibrated solder temperature with the phase transition temperature range to obtain the temperature comparison result, and obtains the adjusted heating power parameters based on the calibrated solder temperature; controls the solder heating device to heat the solder according to the adjusted heating power parameters until a calibrated solder temperature within the preset target temperature range is obtained, achieving high-precision real-time calibration and dynamic closed-loop control of the solder temperature, ensuring that the welding process remains stably within the target temperature range.

Description

Technical Field

[0001] This application relates to the field of infrared temperature measurement technology, and in particular to a closed-loop control method and system for solder temperature based on infrared temperature measurement feedback. Background Technology

[0002] As electronic devices become increasingly miniaturized and integrated, the soldering window becomes narrower. Solder must melt and wet within a specific phase transition temperature range, avoiding both insufficient temperature leading to cold solder joints and overheating causing component damage or pad peeling. Therefore, there is an urgent need for a closed-loop control mechanism that can accurately sense the actual solder temperature in real time and dynamically adjust the heating energy accordingly to meet the temperature measurement challenges brought about by the abrupt changes in the physical properties of solder during the solid-liquid phase transition.

[0003] Current mainstream solutions include automated soldering systems that use infrared thermometry combined with fixed emissivity parameters for temperature feedback. However, existing solutions have certain drawbacks. For example, they ignore the physical characteristic that the emissivity of solder undergoes a significant jump during phase transition, leading to a serious deviation of the measured temperature from the true value in the critical phase transition region. When the solder begins to melt, if the emissivity of the solid-state stage is still used for temperature inversion, the system may misjudge the actual temperature as too low, thus continuously increasing the heating power and easily causing overheating. Conversely, during the cooling and solidification stage, the system may prematurely terminate heating due to a misjudgment of too high a temperature, resulting in incomplete soldering. Summary of the Invention

[0004] The purpose of this application is to provide a closed-loop control method and system for solder temperature based on infrared temperature feedback, in order to solve the problems in the prior art where the temperature measurement results deviate significantly from the true value in the critical region of phase transition and the inaccuracy of temperature measurement caused by changes in material state is not considered.

[0005] In a first aspect, this application provides a closed-loop control method for solder temperature based on infrared temperature feedback, comprising:

[0006] Infrared thermometry is used to detect the ambient temperature of the welding area and the initial temperature value of the solder during the welding process, and to obtain the phase transition emissivity data of the solder. The phase transition emissivity data of the solder includes the first emissivity when the solder is in a solid state, the second emissivity when the solder is in a liquid state, and the phase transition temperature range of the solder from solid to liquid state.

[0007] Based on the initial temperature measurement value, the real-time state of the solder is determined. Combining the solder phase change emissivity data and the ambient temperature, the initial temperature measurement value is calibrated using an infrared temperature measurement compensation algorithm to obtain the calibrated solder temperature.

[0008] The calibrated solder temperature is compared with the phase transition temperature range to obtain the temperature comparison result;

[0009] Based on the calibrated solder temperature and the temperature comparison result, the heating power parameters of the solder heating device are adjusted to obtain the adjusted heating power parameters;

[0010] The solder heating device is controlled to heat the solder according to the adjusted heating power parameters until the calibrated solder temperature is obtained within the preset target temperature range, thereby realizing closed-loop control of solder temperature.

[0011] Optionally, based on the initial temperature measurement value, the real-time state of the solder is determined. Combining the solder phase transition emissivity data and the ambient temperature, an infrared temperature compensation algorithm is used to calibrate the initial temperature measurement value, obtaining the calibrated solder temperature, including:

[0012] The initial temperature value is compared with the phase transition temperature range to determine the real-time state of the solder. When the initial temperature value is less than the lower limit of the phase transition temperature range, the real-time state of the solder is determined to be solid. When the initial temperature value is greater than the upper limit of the phase transition temperature range, the real-time state of the solder is determined to be liquid. When the initial temperature value is within the phase transition temperature range, the real-time state of the solder is determined to be in a phase transition state.

[0013] Based on the solder phase transition emissivity data, the initial temperature measurement value, and the phase transition temperature range, the third emissivity of the solder in the phase transition state is calculated.

[0014] The temperature difference between the ambient temperature and the preset standard reference ambient temperature is calculated. Based on the temperature difference, an infrared temperature measurement compensation algorithm is used to determine the ambient temperature correction coefficient. Combined with the emissivity corresponding to the real-time state of the solder, the initial temperature measurement value is calibrated to obtain the calibrated solder temperature. The emissivity includes the first emissivity when the solder is in a solid state, the second emissivity when the solder is in a liquid state, or the third emissivity when the solder is in a phase transition state.

[0015] Optionally, using an infrared temperature compensation algorithm, an ambient temperature correction coefficient is determined, and combined with the emissivity corresponding to the real-time state of the solder, the initial temperature measurement value is calibrated to obtain the calibrated solder temperature, including:

[0016] Based on the infrared temperature measurement characteristics under different welding scenarios, the influence weight of ambient temperature is determined. Combining the temperature difference and the preset standard reference ambient temperature, the ambient temperature correction coefficient is calculated using the infrared temperature measurement compensation algorithm.

[0017] Based on the ambient temperature correction coefficient and the initial temperature measurement value, the ambient temperature correction term is calculated;

[0018] The emissivity correction term is calculated based on the emissivity corresponding to the real-time state of the solder and the reference emissivity parameter of the infrared thermometry technology.

[0019] Based on the emissivity correction term and the ambient temperature correction term, the initial temperature measurement value is calibrated to obtain the calibrated solder temperature.

[0020] Optionally, based on the calibrated solder temperature and the temperature comparison result, the heating power parameters of the solder heating device are adjusted to obtain the adjusted heating power parameters, including:

[0021] Based on the temperature comparison results, set the power adjustment coefficient;

[0022] Obtain the heating power parameters of the solder heating device and calculate the temperature deviation value. Based on the temperature deviation value, the power adjustment coefficient, and the heating power parameters, calculate the total power adjustment amount.

[0023] The calibrated solder temperature is compared with the preset target temperature range to determine the power adjustment direction;

[0024] Based on the power adjustment direction, the positive or negative attribute of the total power adjustment amount is determined to adjust the heating power parameters and obtain the adjusted heating power parameters.

[0025] Optionally, the calibrated solder temperature is compared with a preset target temperature range to determine the power adjustment direction, including:

[0026] Based on the upper and lower limits of the preset target temperature range, the median value of the preset target temperature range is calculated.

[0027] When the calibrated solder temperature is less than the lower limit of the preset target temperature range, the power adjustment direction is determined to be to increase the heating power;

[0028] When the calibrated solder temperature is greater than the upper limit of the preset target temperature range, the power adjustment direction is determined to be to reduce the heating power;

[0029] When the calibrated solder temperature is greater than or equal to the lower limit of the preset target temperature range and less than or equal to the upper limit of the preset target temperature range, the target temperature range in which the calibrated solder temperature is located is determined based on the intermediate value, and the target temperature range is divided into a target temperature center sub-range and a target temperature edge sub-range according to a preset deviation threshold.

[0030] If the calibrated solder temperature is within the center sub-range of the target temperature, the power adjustment direction is determined to be no adjustment of heating power. If the calibrated solder temperature is within the lower edge sub-range of the target temperature, the power adjustment direction is determined to be to increase heating power. If the calibrated solder temperature is within the upper edge sub-range of the target temperature, the power adjustment direction is determined to be to decrease heating power.

[0031] Optionally, based on the temperature deviation value, the power adjustment coefficient, and the heating power parameters, the total power adjustment is calculated, including:

[0032] Based on the temperature deviation value and the proportional coefficient of the power adjustment coefficient corresponding to the temperature deviation value, the proportional adjustment component is calculated.

[0033] Based on the temperature deviation value, the integral coefficient of the power regulation coefficient corresponding to the temperature deviation value, and the preset integral time, the integral regulation component is calculated.

[0034] Based on the temperature deviation value, the temperature deviation value calculated in the previous closed-loop control cycle, the differential coefficient of the power regulation coefficient corresponding to the temperature deviation value, and the preset differential time interval, the differential regulation component is calculated.

[0035] Based on the rated power parameters of the solder heating device, a power safety threshold is set, and the power safety margin is calculated in combination with the heating power parameters. The proportional adjustment component, the integral adjustment component, and the derivative adjustment component are superimposed to obtain the initial power adjustment amount.

[0036] If the absolute value of the initial power adjustment is less than or equal to the power safety margin, then the initial power adjustment is used as the total power adjustment. If the absolute value of the initial power adjustment is greater than the power safety margin and the initial power adjustment is positive, then the power safety margin is used as the total power adjustment. If the absolute value of the initial power adjustment is greater than the power safety margin and the initial power adjustment is negative, then the negative value of the power safety margin is used as the total power adjustment.

[0037] Optionally, the heating power parameters are adjusted to obtain adjusted heating power parameters, including:

[0038] Set the power safety boundary parameters of the solder heating device, and calculate the initial heating power based on the heating power parameters, the total power adjustment amount, and the positive or negative attribute of the total power adjustment amount. The power safety boundary parameters include the minimum allowable heating power value and the maximum allowable heating power value. The maximum allowable heating power value does not exceed the rated power parameters of the solder heating device, and the minimum allowable heating power value is the minimum power threshold for maintaining stable solder temperature.

[0039] The initial heating power is compared with the minimum allowable heating power value and the maximum allowable heating power value respectively. If the initial heating power is less than the minimum allowable heating power value, the minimum allowable heating power value is used as the adjusted heating power parameter. If the initial heating power is greater than the maximum allowable heating power value, the maximum allowable heating power value is used as the adjusted heating power parameter. If the initial heating power is greater than or equal to the minimum allowable heating power value and less than or equal to the maximum allowable heating power value, the initial heating power is used as the adjusted heating power parameter.

[0040] Secondly, this application provides an infrared temperature feedback closed-loop control system for solder temperature, comprising:

[0041] The acquisition module is used to detect the ambient temperature of the welding area and the initial temperature value of the solder during the welding process using infrared thermometry, and to acquire the phase transition emissivity data of the solder. The phase transition emissivity data of the solder includes the first emissivity when the solder is in a solid state, the second emissivity when the solder is in a liquid state, and the phase transition temperature range of the solder from solid to liquid state.

[0042] The calibration module is used to determine the real-time state of the solder based on the initial temperature measurement value, and to calibrate the initial temperature measurement value by combining the solder phase change emissivity data and the ambient temperature using an infrared temperature measurement compensation algorithm to obtain the calibrated solder temperature.

[0043] The comparison module is used to compare the calibrated solder temperature with the phase transition temperature range to obtain the temperature comparison result;

[0044] The adjustment module is used to adjust the heating power parameters of the solder heating device based on the calibrated solder temperature and the temperature comparison result, so as to obtain the adjusted heating power parameters.

[0045] The heating module is used to control the solder heating device to heat the solder according to the adjusted heating power parameters until the calibrated solder temperature is obtained within the preset target temperature range, thereby realizing closed-loop control of solder temperature.

[0046] Thirdly, this application provides an electronic device, comprising:

[0047] Memory, used to store computer programs;

[0048] A processor, configured to execute the computer program to implement the steps of the closed-loop control method for solder temperature based on infrared temperature feedback as described in the first aspect above.

[0049] Fourthly, this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, can implement the steps of the infrared temperature feedback closed-loop control method for solder temperature as described in the first aspect above.

[0050] The beneficial effects of this application are:

[0051] The infrared thermometry feedback-based closed-loop control method for solder temperature provided in this application utilizes infrared thermometry technology to detect the ambient temperature of the soldering area and the initial temperature value of the solder during the soldering process, and obtains solder phase transition emissivity data. This data includes the first emissivity of the solder in a solid state, the second emissivity of the solder in a liquid state, and the phase transition temperature range from solid to liquid. Based on the initial temperature value, the real-time state of the solder is determined. Combining the solder phase transition emissivity data and the ambient temperature, an infrared thermometry compensation algorithm is used to calibrate the initial temperature value, obtaining a calibrated solder temperature. The calibrated solder temperature is compared with the phase transition temperature range to obtain a temperature comparison result. Based on the calibrated solder temperature and the temperature comparison result, the heating power parameters of the solder heating device are adjusted to obtain adjusted heating power parameters. The solder heating device is controlled to heat the solder according to the adjusted heating power parameters until a calibrated solder temperature within a preset target temperature range is obtained, thus achieving closed-loop control of the solder temperature. By simultaneously acquiring ambient temperature and initial solder temperature measurements, and incorporating different emissivity and phase transition temperature ranges of solder in solid and liquid states, benchmark data matching the material's physical state is provided for subsequent temperature calibration. This improves the accuracy of temperature sensing in the critical phase transition region, avoiding temperature misjudgments caused by incorrect emissivity settings, and ensures that the heating strategy is synchronized with the solder's physical process. Closed-loop control of the solder temperature is achieved, ensuring that the solder remains stably within the target temperature range throughout the entire soldering process, improving soldering quality consistency and process robustness. Furthermore, based on the calibrated solder temperature and the temperature comparison results, the heating power parameters of the solder heating device are adjusted. By comparing the calibrated solder temperature with the preset target temperature range, the direction of power adjustment is determined, and the total power adjustment is assigned positive or negative attributes accordingly, ultimately outputting the adjusted heating power parameters. This solves the risk of overheating or underheating caused by a fixed emissivity model, meeting the stringent requirements of high-density electronic soldering for a narrow temperature control window. Attached Figure Description

[0052] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0053] Figure 1 A schematic flowchart of the closed-loop control method for solder temperature based on infrared temperature feedback provided in the embodiments of this application;

[0054] Figure 2 A schematic diagram illustrating a specific implementation of the closed-loop control method for solder temperature based on infrared temperature feedback provided in this application embodiment;

[0055] Figure 3 A schematic diagram of the structure of the closed-loop control system for solder temperature with infrared temperature feedback provided in the embodiments of this application. Detailed Implementation

[0056] To address the increasingly narrow soldering window requirements in the context of miniaturization and high integration of electronic devices, existing automatic soldering systems using infrared thermometry combined with fixed emissivity parameters fail to accurately obtain the true temperature in the critical phase transition region due to neglecting the physical characteristics of the sudden change in emissivity during the solid-liquid phase transition of solder. This leads to inaccurate heating control and problems such as overheating damage or insufficient soldering. This application simultaneously acquires ambient temperature, initial solder temperature, and solder phase transition emissivity data during the soldering process. Based on the initial temperature value, the real-time physical state of the solder is determined, and the temperature measurement results are dynamically compensated and calibrated in conjunction with the corresponding emissivity and ambient temperature to obtain a calibrated solder temperature that is closer to the true state. Then, the calibrated temperature is compared with the phase transition temperature range to generate a temperature comparison result. Based on this, the heating power parameters of the solder heating device are dynamically adjusted, and the heating device is ultimately controlled to perform heating according to the adjusted parameters, so that the solder temperature stably converges to the preset target range. This constructs a high-precision closed-loop temperature control mechanism that can adapt to the phase transition characteristics of solder, breaking through the bottlenecks of inaccurate temperature measurement and control lag in the phase transition region of existing technologies.

[0057] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0058] The core of this application is to provide a closed-loop control method for solder temperature based on infrared temperature measurement feedback. A flowchart of one specific implementation is shown below. Figure 1 As shown, the method includes:

[0059] Step 101: Using infrared thermometry, detect the ambient temperature of the welding area and the initial temperature value of the solder during the welding process, and obtain the solder phase transition emissivity data. The solder phase transition emissivity data includes the first emissivity when the solder is in a solid state, the second emissivity when the solder is in a liquid state, and the phase transition temperature range of the solder from solid to liquid state.

[0060] In this step, infrared thermometry refers to the technique of determining the temperature of an object by detecting the infrared energy emitted by the object; the welding area refers to the specific area in contact with the solder and the component being welded during the welding operation; the ambient temperature refers to the actual temperature of the environment surrounding the welding area; the initial temperature value refers to the original temperature value of the solder directly detected by infrared thermometry; the solder phase transition emissivity data refers to the dataset recording the infrared emissivity and phase transition temperature range of the solder in different states of matter; the first emissivity refers to the infrared emissivity of the solder when it is in a solid state; the second emissivity refers to the infrared emissivity of the solder when it is in a liquid state; and the phase transition temperature range refers to the temperature range corresponding to the process of the solder changing from a solid state to a liquid state.

[0061] In this embodiment, the infrared thermometry device is first activated, and its detection end is aligned with the soldering area. The infrared detection module of the device captures the infrared signal of the soldering area in real time. Part of the signal is used to convert it into the ambient temperature of the soldering area, and another part of the signal is used to capture the infrared energy of the solder surface and convert it into the initial temperature value of the solder. At the same time, the phase transition emissivity data of the solder that matches the solder currently used is retrieved from the pre-stored solder parameter database. This data clearly records the first emissivity of the solder when it is in a solid state, the second emissivity when it is in a liquid state, and the phase transition temperature range of the solder when it changes from a solid state to a liquid state. This completes the acquisition of the ambient temperature, the initial temperature value, and the solder phase transition emissivity data. These acquired parameters will serve as the basis for subsequently determining the real-time state of the solder and calibrating the initial temperature value.

[0062] Step 102: Based on the initial temperature measurement value, determine the real-time state of the solder. Combining the solder phase transition emissivity data and the ambient temperature, use an infrared temperature measurement compensation algorithm to calibrate the initial temperature measurement value and obtain the calibrated solder temperature.

[0063] In this step, the real-time state refers to the current physical state of the solder determined based on the initial temperature measurement value and the phase transition temperature range; the infrared temperature measurement compensation algorithm refers to the calculation logic used to correct the deviation of the initial temperature measurement value caused by changes in ambient temperature and solder emissivity; and the calibrated solder temperature refers to the actual solder temperature value obtained after correcting the initial temperature measurement value through the infrared temperature measurement compensation algorithm.

[0064] Step 103: Compare the calibrated solder temperature with the phase transition temperature range to obtain the temperature comparison result.

[0065] In this step, the temperature comparison result refers to the conclusion drawn from comparing the calibrated solder temperature with the phase transition temperature range.

[0066] In this embodiment, the calibrated solder temperature is compared with the phase transition temperature range. If the calibrated solder temperature is lower than the lower limit of the phase transition temperature range, the temperature comparison result is that the calibrated solder temperature is lower than the phase transition temperature range; if the calibrated solder temperature is higher than the upper limit of the phase transition temperature range, the temperature comparison result is that the calibrated solder temperature is higher than the phase transition temperature range; if the calibrated solder temperature is greater than or equal to the lower limit of the phase transition temperature range and less than or equal to the upper limit of the phase transition temperature range, the temperature comparison result is that the calibrated solder temperature is within the phase transition temperature range. The temperature comparison result is obtained, and this result, together with the calibrated solder temperature, serves as the basis for subsequent adjustment of the heating power parameters.

[0067] Step 104: Based on the calibrated solder temperature and the temperature comparison result, adjust the heating power parameters of the solder heating device to obtain the adjusted heating power parameters.

[0068] In this step, the solder heating device refers to the equipment used to heat the solder; the heating power parameter refers to the power value currently output by the solder heating device for heating the solder; the adjusted heating power parameter refers to the power value obtained after adjusting the heating power parameter and used to control the subsequent heating of the solder heating device.

[0069] Step 105: Control the solder heating device to heat the solder according to the adjusted heating power parameters until the calibrated solder temperature is obtained within the preset target temperature range, thereby realizing closed-loop control of solder temperature.

[0070] In this step, the preset target temperature range refers to the range of solder temperature range that is pre-set to ensure soldering quality.

[0071] In this embodiment, the adjusted heating power parameter is input to the control module of the solder heating device. The control module drives the heating element of the solder heating device to work according to the adjusted heating power parameter, so that the solder heating device heats the solder at the power. At the same time, the solder temperature is continuously detected by infrared thermometry, and the calibration process is repeated to obtain the real-time calibrated solder temperature. The real-time calibrated solder temperature is compared with the preset target temperature range. If the real-time calibrated solder temperature is within the preset target temperature range, the current adjusted heating power parameter is maintained and heating continues. If the real-time calibrated solder temperature is not within the preset target temperature range, the heating power parameter is readjusted until the calibrated solder temperature within the preset target temperature range is obtained, thus achieving closed-loop control of the solder temperature.

[0072] This application embodiment achieves closed-loop control of solder temperature; the entire process improves the accuracy and stability of solder temperature control by accurately acquiring temperature measurement parameters, calibrating temperature measurement deviations, and dynamically adjusting heating power, avoiding problems such as overheating of solder and damage to components or insufficient temperature for soldering due to inaccurate temperature measurement or improper power adjustment, and ensuring the consistency of soldering quality.

[0073] This application provides a specific embodiment. Step 102 involves determining the real-time state of the solder based on the initial temperature measurement value, combining the solder phase transition emissivity data and the ambient temperature, and calibrating the initial temperature measurement value using an infrared temperature compensation algorithm to obtain the calibrated solder temperature. The specific steps include:

[0074] Step 201: Compare the initial temperature measurement value with the phase transition temperature range to determine the real-time state of the solder. When the initial temperature measurement value is less than the lower limit of the phase transition temperature range, the real-time state of the solder is determined to be solid. When the initial temperature measurement value is greater than the upper limit of the phase transition temperature range, the real-time state of the solder is determined to be liquid. When the initial temperature measurement value is within the phase transition temperature range, the real-time state of the solder is determined to be in a phase transition state.

[0075] In this step, the lower limit of the phase transition temperature range refers to the lowest temperature at which the solder begins to transform from a solid to a liquid state; the upper limit of the phase transition temperature range refers to the highest temperature at which the solder completely transforms from a solid to a liquid state; and the phase transition state refers to the transitional state of the solder between a solid and a liquid state, where it is partially melted and partially unmelted.

[0076] In this embodiment, the phase transition temperature range is first retrieved from the initial temperature measurement value and the solder phase transition emissivity data. The lower limit and upper limit of the phase transition temperature range are extracted from the phase transition temperature range. Then, the initial temperature measurement value is compared with the lower limit and upper limit of the phase transition temperature range, respectively. If the initial temperature measurement value is less than the lower limit of the phase transition temperature range, it indicates that the solder has not started to melt, and the real-time state of the solder is determined to be solid. If the initial temperature measurement value is greater than the upper limit of the phase transition temperature range, it indicates that the solder has completely melted, and the real-time state of the solder is determined to be liquid. If the initial temperature measurement value is greater than or equal to the lower limit of the phase transition temperature range and less than or equal to the upper limit of the phase transition temperature range, it indicates that the solder is in the melting process, and the real-time state of the solder is determined to be phase transition state. This real-time state will be used as the basis for subsequent calculation of the third emissivity and selection of the calibration emissivity.

[0077] Step 202: Based on the solder phase transition emissivity data, the initial temperature measurement value, and the phase transition temperature range, calculate the third emissivity of the solder in the phase transition state.

[0078] In this step, the third emissivity refers to the infrared emissivity calculated by combining the first emissivity in the solid state and the second emissivity in the liquid state when the solder is in a phase transition state, and taking into account the relationship between the initial temperature measurement value and the phase transition temperature range.

[0079] In this embodiment, the first emissivity of the solder in a solid state and the second emissivity in a liquid state are first extracted from the solder phase change emissivity data. Then, the initial temperature measurement value, the lower limit of the phase change temperature range, and the upper limit of the phase change temperature range are retrieved. Based on the position of the initial temperature measurement value within the phase change temperature range, the third emissivity is calculated using a linear interpolation method: the third emissivity = the first emissivity + (initial temperature measurement value - lower limit of the phase change temperature range) × (second emissivity - first emissivity) / (upper limit of the phase change temperature range - lower limit of the phase change temperature range). The third emissivity of the solder in a phase change state is obtained through this calculation. This third emissivity will be used for subsequent initial temperature measurement value calibration of the solder in a phase change state.

[0080] Step 203: Calculate the temperature difference between the ambient temperature and the preset standard reference ambient temperature. Based on the temperature difference, use an infrared temperature measurement compensation algorithm to determine the ambient temperature correction coefficient. Combine the emissivity corresponding to the real-time state of the solder to calibrate the initial temperature measurement value and obtain the calibrated solder temperature. The emissivity includes the first emissivity when the solder is in a solid state, the second emissivity when the solder is in a liquid state, or the third emissivity when the solder is in a phase transition state.

[0081] In this step, the preset standard reference ambient temperature refers to the pre-set benchmark ambient temperature used to eliminate the influence of ambient temperature fluctuations on the infrared temperature measurement results; the temperature difference refers to the numerical difference between the ambient temperature and the preset standard reference ambient temperature; the ambient temperature correction coefficient refers to the coefficient calculated based on the temperature difference and used to correct the influence of ambient temperature on the initial temperature measurement value; and the emissivity refers to the parameter characterizing the infrared radiation capability of an object, specifically referring to the first emissivity of solder when it is in a solid state, the second emissivity when it is in a liquid state, or the third emissivity when it is in a phase transition state.

[0082] In this embodiment, the ambient temperature is first retrieved, and numerical calculations are performed between the ambient temperature and a preset standard reference ambient temperature to obtain the temperature difference = ambient temperature - preset standard reference ambient temperature. Then, based on the temperature difference and the influence weight of ambient temperature, the ambient temperature correction coefficient is calculated = temperature difference × ambient temperature influence weight. Next, according to the real-time state of the solder, the corresponding emissivity is selected: if the real-time state is solid, the first emissivity is selected; if the real-time state is liquid, the second emissivity is selected; if the real-time state is a phase transition state, the third emissivity is selected. Subsequently, the standard emissivity is retrieved, and the emissivity correction term is calculated = selected emissivity / standard emissivity. Finally, based on the initial temperature measurement value, the ambient temperature correction coefficient, and the emissivity correction term, the initial temperature measurement value is calibrated to obtain the calibrated solder temperature = initial temperature measurement value × emissivity correction term + (initial temperature measurement value × ambient temperature correction coefficient). This calibrated solder temperature accurately reflects the actual temperature of the solder.

[0083] The embodiments of this application eliminate the dual interference of solder emissivity changes with state and ambient temperature fluctuations on temperature measurement results, improve the accuracy of solder temperature detection, and lay a reliable foundation for the precise adjustment of subsequent heating power.

[0084] This application provides a specific embodiment. Step 203 involves using an infrared temperature measurement compensation algorithm to determine the ambient temperature correction coefficient, and combining this with the emissivity corresponding to the real-time state of the solder to calibrate the initial temperature measurement value, thereby obtaining the calibrated solder temperature. This specifically includes the following steps:

[0085] Step 211: Based on the infrared temperature measurement characteristics under different welding scenarios, determine the influence weight of ambient temperature, and combine the temperature difference and the preset standard reference ambient temperature to calculate the ambient temperature correction coefficient using the infrared temperature measurement compensation algorithm.

[0086] In this step, different welding scenarios refer to various specific application scenarios formed by different solder types, materials of the parts being welded, and welding environmental conditions during welding operations; infrared temperature measurement characteristics refer to the inherent attributes of the influence of factors such as ambient temperature and object emissivity on the temperature measurement results during the infrared temperature measurement process in a specific welding scenario; ambient temperature influence weight refers to the parameter used to quantify the degree of influence of ambient temperature on infrared temperature measurement results in different welding scenarios.

[0087] In this embodiment, the specific scenario of the current welding operation is first identified, such as determining a specific welding scenario based on the solder type and the component being welded; then, the infrared temperature measurement characteristics under this scenario are analyzed, that is, the deviation of the infrared temperature measurement result when the ambient temperature changes by a certain value; based on the infrared temperature measurement characteristics, the influence weight of the ambient temperature is determined through statistical analysis or experimental data fitting, and this weight is positively correlated with the infrared temperature measurement characteristics of the scenario; then, the temperature difference and the preset standard reference ambient temperature are retrieved, and combined with the determined influence weight of the ambient temperature, the ambient temperature correction coefficient is calculated as: temperature difference × ambient temperature influence weight, to obtain the ambient temperature correction coefficient, which will be used to calculate the ambient temperature correction item in the subsequent calculation.

[0088] Step 212: Calculate the ambient temperature correction term based on the ambient temperature correction coefficient and the initial temperature measurement value.

[0089] In this step, the ambient temperature correction term refers to the specific value calculated based on the ambient temperature correction factor and the initial temperature measurement value, used to correct the influence of the ambient temperature on the initial temperature measurement value.

[0090] In this embodiment, the ambient temperature correction factor and the initial temperature measurement value are retrieved and numerically calculated to obtain the ambient temperature correction term. This correction term quantifies the impact of ambient temperature fluctuations on the initial temperature measurement value and will be used for subsequent calibration of the initial temperature measurement value.

[0091] Step 213: Calculate the emissivity correction term based on the emissivity corresponding to the real-time state of the solder and the reference emissivity parameter of the infrared thermometry technology.

[0092] In this step, the reference emissivity parameter of infrared thermometry refers to the emissivity value that the infrared thermometry device uses by default as the reference for temperature measurement calculation; the emissivity correction term refers to the specific value used to correct the influence of emissivity differences on the initial temperature measurement value, calculated based on the emissivity corresponding to the real-time state of the solder and the reference emissivity parameter of infrared thermometry.

[0093] In this embodiment, the emissivity corresponding to the real-time state of the solder and the reference emissivity parameter of the infrared thermometry technology are retrieved, and the two are numerically calculated to obtain the emissivity correction term = emissivity corresponding to the real-time state / reference emissivity parameter of the infrared thermometry technology. This emissivity correction term quantifies the impact of the difference between the actual emissivity of the solder and the reference emissivity of the device on the initial temperature measurement value, and will be used for subsequent calibration of the initial temperature measurement value.

[0094] Step 214: Based on the emissivity correction term and the ambient temperature correction term, calibrate the initial temperature measurement value to obtain the calibrated solder temperature.

[0095] In this embodiment, the ambient temperature correction term, emissivity correction term, and initial temperature measurement value are retrieved. The initial temperature measurement value is calibrated through numerical calculation, and the calibrated solder temperature is calculated as: initial temperature measurement value × emissivity correction term + ambient temperature correction term. This calibrated solder temperature comprehensively eliminates the influence of ambient temperature and emissivity differences on the initial temperature measurement value, and can accurately reflect the actual temperature of the solder.

[0096] The embodiments of this application achieve precise correction for both ambient temperature fluctuations and emissivity differences, improving the accuracy and stability of solder temperature measurement and providing reliable temperature data support for precise control of the soldering process.

[0097] This application provides a specific embodiment, such as Figure 2 As shown, step 104 involves adjusting the heating power parameters of the solder heating device based on the calibrated solder temperature and the temperature comparison result, to obtain the adjusted heating power parameters. This specifically includes the following steps:

[0098] Step 401: Set the power adjustment coefficient based on the temperature comparison results.

[0099] In this step, the power adjustment coefficient refers to a parameter used to quantify the influence of temperature deviation on the adjustment range of heating power parameters, and its value is determined based on the temperature comparison results.

[0100] In this embodiment, the temperature comparison results are retrieved, and the relationship between the calibrated solder temperature and the phase transition temperature range is analyzed: if the temperature comparison result shows that the calibrated solder temperature is lower than the phase transition temperature range, it indicates that the power needs to be adjusted significantly, and a large power adjustment coefficient is set; if the temperature comparison result shows that the calibrated solder temperature is within the phase transition temperature range, it indicates that the power needs to be adjusted steadily, and a medium power adjustment coefficient is set; if the temperature comparison result shows that the calibrated solder temperature is higher than the phase transition temperature range, it indicates that the power needs to be adjusted slightly to avoid overheating, and a small power adjustment coefficient is set. A power adjustment coefficient matching the current temperature comparison result is obtained, and this coefficient will be used to calculate the total power adjustment amount in the subsequent calculation.

[0101] Step 402: Obtain the heating power parameters of the solder heating device and calculate the temperature deviation value. Based on the temperature deviation value, the power adjustment coefficient, and the heating power parameters, calculate the total power adjustment amount.

[0102] In this step, the temperature deviation value refers to the numerical difference between the calibrated solder temperature and the reference temperature of the preset target temperature range; the total power adjustment amount refers to the amplitude value used to adjust the heating power parameters, calculated based on the temperature deviation value, the power adjustment coefficient, and the heating power parameters.

[0103] In this embodiment, the current heating power parameters are first read from the control module of the solder heating device; then, the calibrated solder temperature and the preset target temperature range are retrieved, and the median value of the preset target temperature range is selected as the reference temperature. The temperature deviation value is calculated as: calibrated solder temperature - median value of the preset target temperature range. Next, based on the temperature deviation value, the power adjustment coefficient, and the heating power parameters, the proportional adjustment component is calculated as: proportional coefficient of the power adjustment coefficient × temperature deviation value; the integral adjustment component is calculated as: integral coefficient of the power adjustment coefficient × temperature deviation value × preset integral time; the derivative adjustment component is calculated as: (current temperature deviation value - temperature deviation value of the previous closed-loop control cycle) × derivative coefficient of the power adjustment coefficient / preset derivative time interval. Finally, the proportional adjustment component, integral adjustment component, and derivative adjustment component are superimposed to obtain the total power adjustment amount. This adjustment amount will be used to adjust the heating power parameters in conjunction with the power adjustment direction.

[0104] Step 403: Compare the calibrated solder temperature with the preset target temperature range to determine the power adjustment direction.

[0105] In this step, the power adjustment direction refers to the direction in which the heating power parameter should be increased, decreased, or maintained, based on the comparison between the calibrated solder temperature and the preset target temperature range.

[0106] In this embodiment, the calibrated solder temperature and the preset target temperature range are retrieved, and the lower limit and upper limit of the preset target temperature range are extracted. The calibrated solder temperature is compared with the lower limit and upper limit respectively: if the calibrated solder temperature is less than the lower limit of the preset target temperature range, it indicates that the current temperature is too low, and the power adjustment direction is determined to increase the heating power; if the calibrated solder temperature is greater than the upper limit of the preset target temperature range, it indicates that the current temperature is too high, and the power adjustment direction is determined to decrease the heating power; if the calibrated solder temperature is greater than or equal to the lower limit of the preset target temperature range and less than or equal to the upper limit of the preset target temperature range, and combined with the median value of the preset target temperature range and the preset deviation threshold, if the calibrated solder temperature is in the center sub-range of the target temperature, the power adjustment direction is determined to maintain the heating power; if it is in the lower edge sub-range of the target temperature edge sub-range, the power adjustment direction is determined to increase the heating power; if it is in the upper edge sub-range, the power adjustment direction is determined to decrease the heating power, thus obtaining a clear power adjustment direction, which will be used to determine the positive or negative attribute of the total power adjustment amount.

[0107] Step 404: Determine the positive or negative attribute of the total power adjustment amount according to the power adjustment direction, so as to adjust the heating power parameters and obtain the adjusted heating power parameters.

[0108] In this step, the positive or negative attribute of the total power regulation refers to the positive or negative numerical attribute assigned to the total power regulation based on the power regulation direction.

[0109] In this embodiment, the total power adjustment amount and the power adjustment direction are retrieved. The positive or negative attribute of the total power adjustment amount is determined according to the adjustment direction. If the power adjustment direction is to increase the heating power, the positive or negative attribute of the total power adjustment amount is set to positive, that is, the total power adjustment amount takes a positive value; if the power adjustment direction is to decrease the heating power, the positive or negative attribute of the total power adjustment amount is set to negative, that is, the total power adjustment amount takes a negative value; if the power adjustment direction is to maintain the heating power, the positive or negative attribute of the total power adjustment amount is set to zero, that is, the total power adjustment amount takes zero. Then, the current heating power parameter is retrieved, and the adjusted heating power parameter is calculated as: current heating power parameter + total power adjustment amount. At the same time, the power safety boundary parameter is used for verification. If the calculation result exceeds the safety boundary, the corresponding safety boundary value is taken as the adjusted heating power parameter. Finally, the adjusted heating power parameter that can be directly used to control the solder heating device is obtained.

[0110] The embodiments of this application achieve precise and dynamic adjustment of heating power, avoiding solder temperature runaway caused by incorrect power adjustment direction or improper amplitude, ensuring that the solder temperature can stably approach the preset target temperature range, and improving the reliability and quality of the soldering process.

[0111] This application provides a specific embodiment. Step 403 involves comparing the calibrated solder temperature with a preset target temperature range to determine the power adjustment direction, specifically including the following steps:

[0112] Step 411: Calculate the median value of the preset target temperature range based on the upper and lower limits of the preset target temperature range.

[0113] In this step, the median value of the preset target temperature range refers to the arithmetic mean of the upper and lower limits of the preset target temperature range, which is used as the basis for dividing the target temperature sub-ranges.

[0114] In this embodiment, a preset target temperature range is retrieved, and the upper limit and lower limit of the preset target temperature range are extracted from this range. The median value of the preset target temperature range is calculated by numerical calculation = (upper limit of the preset target temperature range + lower limit of the preset target temperature range) / 2. This median value will be used as the basis for subsequent judgment of the position of the calibrated solder temperature within the target temperature range and for dividing the target temperature sub-range.

[0115] Step 412: When the calibrated solder temperature is less than the lower limit of the preset target temperature range, the power adjustment direction is determined to be to increase the heating power.

[0116] In this embodiment, the calibrated solder temperature and the lower limit of the preset target temperature range are retrieved, and the calibrated solder temperature is compared with the lower limit of the preset target temperature range. If the value of the calibrated solder temperature is less than the lower limit of the preset target temperature range, it means that the current solder temperature is far below the target temperature range that ensures the soldering quality and cannot meet the soldering requirements. At this time, the power adjustment direction is determined to increase the heating power. This adjustment direction will be used to assign positive and negative attributes to the total power adjustment amount in the future.

[0117] Step 413: When the calibrated solder temperature is greater than the upper limit of the preset target temperature range, the power adjustment direction is determined to be to reduce the heating power.

[0118] In this embodiment, the calibrated solder temperature and the upper limit of the preset target temperature range are retrieved, and the calibrated solder temperature is compared with the upper limit of the preset target temperature range. If the value of the calibrated solder temperature is greater than the upper limit of the preset target temperature range, it indicates that the current solder temperature is too high, which may cause the solder to overheat and oxidize or damage the soldered component. At this time, the power adjustment direction is determined to be to reduce the heating power. This adjustment direction will be used to assign positive and negative attributes to the total power adjustment amount in the future.

[0119] Step 414: When the calibrated solder temperature is greater than or equal to the lower limit of the preset target temperature range and less than or equal to the upper limit of the preset target temperature range, the target temperature range where the calibrated solder temperature is located is determined based on the intermediate value, and the target temperature range is divided into a target temperature center sub-range and a target temperature edge sub-range according to the preset deviation threshold.

[0120] In this step, the preset deviation threshold refers to the pre-set temperature difference standard used to divide the target temperature center sub-range and the target temperature edge sub-range; the target temperature center sub-range refers to the temperature range formed by floating the preset deviation threshold up or down based on the midpoint of the preset target temperature range, within which the solder temperature is most suitable for soldering; the target temperature edge sub-range refers to the temperature range outside the target temperature center sub-range within the preset target temperature range, within which the solder temperature is close to the boundary of the target temperature range.

[0121] In this embodiment, if the calibrated solder temperature is greater than or equal to the lower limit of the preset target temperature range and less than or equal to the upper limit of the preset target temperature range, the median value of the preset target temperature range and a preset deviation threshold are retrieved first. The upper and lower boundaries of the target temperature center sub-range are determined through numerical calculation. The lower boundary of the target temperature center sub-range is calculated as: median value of the preset target temperature range - preset deviation threshold; the upper boundary of the target temperature center sub-range is calculated as: median value of the preset target temperature range + preset deviation threshold. Then, based on the boundaries of the center sub-range, the preset target temperature range is divided into two parts: the area between the lower and upper boundaries of the center sub-range is the target temperature center sub-range; the area between the lower limit of the preset target temperature range and the lower boundary of the center sub-range, and the area between the upper boundary of the center sub-range and the upper limit of the preset target temperature range, is the target temperature edge sub-range. After the sub-range division is completed, the specific position of the calibrated solder temperature in the edge sub-range can be further determined, providing a basis for determining the power adjustment direction in the next step.

[0122] Step 415: If the calibrated solder temperature is within the center sub-range of the target temperature, determine the power adjustment direction as no adjustment of heating power; if the calibrated solder temperature is within the lower edge sub-range of the target temperature edge sub-range, determine the power adjustment direction as increasing heating power; if the calibrated solder temperature is within the upper edge sub-range of the target temperature edge sub-range, determine the power adjustment direction as decreasing heating power.

[0123] In this step, the lower edge sub-range of the target temperature edge sub-range refers to the temperature interval within the target temperature edge sub-range that lies between the lower limit of the preset target temperature range and the lower boundary of the target temperature center sub-range; the upper edge sub-range of the target temperature edge sub-range refers to the temperature interval within the target temperature edge sub-range that lies between the upper boundary of the target temperature center sub-range and the upper limit of the preset target temperature range; not adjusting the heating power means maintaining the current heating power parameters of the solder heating device without performing any power increase or decrease operations.

[0124] In this embodiment, the calibrated solder temperature and the target temperature center sub-range and target temperature edge sub-range are retrieved. The calibrated solder temperature is compared with the boundaries of each sub-range. If the calibrated solder temperature is within the target temperature center sub-range, it indicates that the current solder temperature is in the optimal soldering temperature range, and no power adjustment is required. The power adjustment direction is determined to be no adjustment of heating power. If the calibrated solder temperature is within the lower edge sub-range of the target temperature edge sub-range, it indicates that the current solder temperature is within the target range but close to the lower limit, and has a tendency to decrease outside the target range. The power adjustment direction is determined to be increasing heating power. If the calibrated solder temperature is within the upper edge sub-range of the target temperature edge sub-range, it indicates that the current solder temperature is within the target range but close to the upper limit, and has a tendency to increase outside the target range. The power adjustment direction is determined to be decreasing heating power. Finally, a clear power adjustment direction is obtained, which will be directly used to determine the positive or negative attribute of the total power adjustment amount.

[0125] The embodiments of this application realize graded judgment of power adjustment direction, which not only avoids large deviations when the temperature exceeds the target range, but also prevents frequent ineffective adjustments when the temperature fluctuates within the target range. This ensures that the solder temperature can be stably maintained in the optimal soldering range, improves the accuracy of power adjustment and the stability of the soldering process, and reduces soldering quality problems caused by misjudgment of adjustment direction.

[0126] This application provides a specific embodiment. Step 402 involves calculating the total power adjustment based on the temperature deviation value, the power adjustment coefficient, and the heating power parameters. This specifically includes the following steps:

[0127] Step 421: Calculate the proportional adjustment component based on the temperature deviation value and the proportional coefficient of the power adjustment coefficient corresponding to the temperature deviation value.

[0128] In this step, the proportional coefficient of the power regulation coefficient refers to the parameter in the power regulation coefficient used to quantify the degree of immediate impact of the current temperature deviation value on the power regulation; the proportional regulation component refers to the power regulation value used to respond to the temperature deviation in real time, calculated based on the temperature deviation value and the proportional coefficient of the power regulation coefficient.

[0129] In this embodiment, the temperature deviation value and the set power adjustment coefficient are retrieved, and the proportional coefficient of the power adjustment coefficient is extracted from the power adjustment coefficient; the temperature deviation value and the proportional coefficient of the power adjustment coefficient are numerically calculated to obtain the proportional adjustment component = temperature deviation value × proportional coefficient of the power adjustment coefficient; the proportional adjustment component obtained by this calculation can directly reflect the real-time power adjustment demand corresponding to the current temperature deviation, and this component will serve as one of the bases for subsequent calculation of the initial power adjustment amount.

[0130] Step 422: Calculate the integral adjustment component based on the temperature deviation value, the integral coefficient of the power adjustment coefficient corresponding to the temperature deviation value, and the preset integral time.

[0131] In this step, the integral coefficient of the power regulation coefficient refers to the parameter in the power regulation coefficient used to quantify the influence of the cumulative effect of historical temperature deviation on power regulation; the preset integral time refers to the time period set in advance for accumulating temperature deviation; the integral regulation component refers to the power regulation value calculated based on the temperature deviation value, the integral coefficient of the power regulation coefficient, and the preset integral time, used to compensate for the cumulative effect of historical temperature deviation.

[0132] In this embodiment, the temperature deviation value, the set power adjustment coefficient, and the preset integral time are retrieved, and the integral coefficient of the power adjustment coefficient is extracted from the power adjustment coefficient. The temperature deviation value, the integral coefficient of the power adjustment coefficient, and the preset integral time are numerically calculated to obtain the integral adjustment component = temperature deviation value × integral coefficient of power adjustment coefficient × preset integral time. This integral adjustment component can compensate for the inability of the proportional adjustment component to cope with continuous temperature deviation, and gradually corrects the long-term temperature deviation through the cumulative effect. This component will serve as one of the bases for subsequent calculation of the initial power adjustment amount.

[0133] Step 423: Calculate the differential adjustment component based on the temperature deviation value, the temperature deviation value calculated in the previous closed-loop control cycle, the differential coefficient of the power adjustment coefficient corresponding to the temperature deviation value, and the preset differential time interval.

[0134] In this step, the previous closed-loop control cycle refers to the previous complete control cycle before the current power adjustment calculation; the derivative coefficient of the power adjustment coefficient refers to the parameter in the power adjustment coefficient used to quantify the influence of the temperature deviation value change trend on the power adjustment; the preset derivative time interval refers to the time interval set in advance for calculating the rate of change of the temperature deviation value; the derivative adjustment component refers to the power adjustment value calculated based on the current temperature deviation value, the temperature deviation value of the previous closed-loop control cycle, the derivative coefficient of the power adjustment coefficient, and the preset derivative time interval, used to predict the temperature change trend and adjust in advance.

[0135] In this embodiment, the current temperature deviation value, the stored temperature deviation value calculated in the previous closed-loop control cycle, the set power adjustment coefficient, and the preset differential time interval are retrieved. The differential coefficient of the power adjustment coefficient is extracted from the power adjustment coefficient. First, the difference between the current temperature deviation value and the temperature deviation value of the previous closed-loop control cycle is calculated. Then, the difference, the differential coefficient of the power adjustment coefficient, and the preset differential time interval are numerically calculated to obtain the differential adjustment component = (current temperature deviation value - temperature deviation value of the previous closed-loop control cycle) × differential coefficient of the power adjustment coefficient / preset differential time interval. This differential adjustment component can adjust the power in advance according to the changing trend of the temperature deviation to avoid excessive temperature fluctuations. This component will serve as one of the bases for subsequent calculation of the initial power adjustment amount.

[0136] Step 424: Based on the rated power parameters of the solder heating device, set the power safety threshold, calculate the power safety margin in combination with the heating power parameters, and superimpose the proportional adjustment component, the integral adjustment component and the derivative adjustment component to obtain the initial power adjustment amount.

[0137] In this step, the rated power parameter of the solder heating device refers to the maximum allowable output power specified in the design of the solder heating device; the power safety threshold refers to the maximum allowable power adjustment limit set based on the rated power parameter of the solder heating device to prevent overload of the heating device; the power safety margin refers to the difference between the power safety threshold and the current heating power parameter, used to limit the maximum safe range of power adjustment; the initial power adjustment amount refers to the power adjustment value obtained by superimposing the proportional adjustment component, integral adjustment component and derivative adjustment component without safety verification.

[0138] In this embodiment, the rated power parameters of the solder heating device are first read from the parameter manual or control module of the solder heating device, and a power safety threshold is set based on the rated power parameters. Then, the current heating power parameters are retrieved, and the power safety margin is calculated as power safety threshold - current heating power parameters. Subsequently, the proportional adjustment component, integral adjustment component, and derivative adjustment component are retrieved, and the three components are superimposed to calculate the initial power adjustment amount as proportional adjustment component + integral adjustment component + derivative adjustment component. The obtained initial power adjustment amount has not yet been verified for safety and needs to be adjusted in conjunction with the power safety margin.

[0139] Step 425: If the absolute value of the initial power adjustment is less than or equal to the power safety margin, then the initial power adjustment is used as the total power adjustment. If the absolute value of the initial power adjustment is greater than the power safety margin and the initial power adjustment is positive, then the power safety margin is used as the total power adjustment. If the absolute value of the initial power adjustment is greater than the power safety margin and the initial power adjustment is negative, then the negative value of the power safety margin is used as the total power adjustment.

[0140] In this step, the absolute value of the initial power adjustment refers to the non-negative value of the initial power adjustment after removing the positive and negative signs, which is used to compare with the power safety margin; the negative value of the power safety margin refers to the value obtained by taking the negative of the power safety margin, which is used to limit the adjustment range when the initial power adjustment is negative and exceeds the safety range.

[0141] In this embodiment, the absolute value of the initial power adjustment is first calculated, and then compared with the power safety margin. If the absolute value of the initial power adjustment is less than or equal to the power safety margin, it indicates that the initial adjustment is within the safe range, and the initial power adjustment is directly used as the total power adjustment. If the absolute value of the initial power adjustment is greater than the power safety margin and the initial power adjustment is positive, it indicates that the positive adjustment range exceeds the safe range, and the power safety margin is used as the total power adjustment. If the absolute value of the initial power adjustment is greater than the power safety margin and the initial power adjustment is negative, it indicates that the negative adjustment range exceeds the safe range, and the negative value of the power safety margin is used as the total power adjustment. Finally, a total power adjustment that meets the safety requirements is obtained.

[0142] The embodiments of this application avoid heating failures caused by a single adjustment component being unable to cope with complex temperature deviations or by the adjustment range exceeding the equipment's capacity, thus ensuring the stable operation of the solder heating device and the precise control of solder temperature.

[0143] This application provides a specific embodiment. Step 404 involves adjusting the heating power parameters to obtain adjusted heating power parameters, specifically including the following steps:

[0144] Step 431: Set the power safety boundary parameters of the solder heating device. Calculate the initial heating power based on the heating power parameters, the total power adjustment amount, and the positive / negative attribute of the total power adjustment amount. The power safety boundary parameters include a minimum allowable heating power value and a maximum allowable heating power value. The maximum allowable heating power value does not exceed the rated power parameters of the solder heating device, and the minimum allowable heating power value is the minimum power threshold for maintaining stable solder temperature.

[0145] In this step, the power safety boundary parameter refers to the set of parameters used to limit the output power range of the solder heating device. This set includes the minimum allowable heating power value and the maximum allowable heating power value. The minimum allowable heating power value refers to the lowest power threshold for maintaining a stable solder temperature, that is, the minimum output power to ensure that the solder will not cool down due to excessively low power. The maximum allowable heating power value refers to the upper limit of the output power of the solder heating device, and this value does not exceed the rated power parameter of the solder heating device. The initial heating power refers to the heating power value calculated based on the current heating power parameter, the total power adjustment amount and its positive and negative attributes, without undergoing safety boundary verification. The minimum power threshold for maintaining a stable solder temperature refers to the minimum heating power required to ensure that the solder temperature does not decrease over time and is maintained at the current level.

[0146] In this embodiment, the heating power parameters, total power adjustment amount, and the positive / negative attribute of the total power adjustment amount are retrieved. Simultaneously, power safety boundary parameters for the solder heating device are set. When determining the maximum allowable heating power value, the rated power parameters of the solder heating device must be referenced to ensure that the maximum allowable heating power value does not exceed these rated power parameters. When determining the minimum allowable heating power value, the minimum power threshold for maintaining stable solder temperature must be determined based on the current solder type and the calibrated solder temperature; this threshold is the minimum allowable heating power value. The initial heating power is calculated based on the positive / negative attribute of the total power adjustment amount: if the attribute is positive, the heating power requirement increases, and the initial heating power is calculated as: heating power parameter + total power adjustment amount; if the attribute is negative, the heating power requirement decreases, and the initial heating power is calculated as: heating power parameter - absolute value of the total power adjustment amount. The initial heating power obtained through this calculation needs to be subsequently compared with the power safety boundary parameters to ensure safety and effectiveness.

[0147] Step 432: Compare the initial heating power with the minimum allowable heating power value and the maximum allowable heating power value respectively. If the initial heating power is less than the minimum allowable heating power value, the minimum allowable heating power value is used as the adjusted heating power parameter. If the initial heating power is greater than the maximum allowable heating power value, the maximum allowable heating power value is used as the adjusted heating power parameter. If the initial heating power is greater than or equal to the minimum allowable heating power value and less than or equal to the maximum allowable heating power value, the initial heating power is used as the adjusted heating power parameter.

[0148] In this embodiment, the initial heating power and the set power safety boundary parameters are retrieved, and the initial heating power is compared with the minimum allowable heating power value and the maximum allowable heating power value, respectively. If the initial heating power is less than the minimum allowable heating power value, it indicates that the initial power is too low and cannot meet the requirement of maintaining a stable solder temperature, which will cause the solder temperature to drop. In this case, the minimum allowable heating power value should be used as the adjusted heating power parameter. If the initial heating power is greater than the maximum allowable heating power value, it indicates that the initial power is too high and exceeds the safe output range of the solder heating device, which may cause the device to overload and be damaged or the solder to overheat. In this case, the maximum allowable heating power value should be used as the adjusted heating power parameter. If the initial heating power is greater than or equal to the minimum allowable heating power value and less than or equal to the maximum allowable heating power value, it indicates that the initial power is within the safe range and can meet the solder temperature regulation requirements. In this case, the initial heating power is directly used as the adjusted heating power parameter, which can be directly input into the control module of the solder heating device to drive the device to perform subsequent heating at this power.

[0149] The embodiments of this application ensure the safe and stable operation of the solder heating device, while ensuring that the solder temperature can be maintained within a reasonable range, providing reliable power control support for high-quality soldering.

[0150] Figure 3 This is a schematic diagram of a specific embodiment of an infrared temperature feedback closed-loop control system for solder temperature provided in this application. (Refer to...) Figure 3 The system may include:

[0151] The acquisition module 21 is used to detect the ambient temperature of the welding area and the initial temperature value of the solder during the welding process using infrared thermometry, and to acquire the phase transition emissivity data of the solder. The phase transition emissivity data of the solder includes the first emissivity of the solder when it is in a solid state, the second emissivity of the solder when it is in a liquid state, and the phase transition temperature range of the solder when it changes from a solid state to a liquid state.

[0152] The calibration module 22 is used to determine the real-time state of the solder based on the initial temperature measurement value, and to calibrate the initial temperature measurement value by combining the solder phase change emissivity data and the ambient temperature using an infrared temperature measurement compensation algorithm to obtain the calibrated solder temperature.

[0153] The comparison module 23 is used to compare the calibrated solder temperature with the phase transition temperature range to obtain the temperature comparison result;

[0154] Adjustment module 24 is used to adjust the heating power parameters of the solder heating device based on the calibrated solder temperature and the temperature comparison result, so as to obtain the adjusted heating power parameters;

[0155] The heating module 25 is used to control the solder heating device to heat the solder according to the adjusted heating power parameters until the calibrated solder temperature is obtained within the preset target temperature range, thereby realizing closed-loop control of the solder temperature.

[0156] An infrared temperature feedback solder temperature closed-loop control system according to an embodiment of this application is used to implement the aforementioned infrared temperature feedback solder temperature closed-loop control method. Therefore, the specific implementation of the infrared temperature feedback solder temperature closed-loop control system can be found in the embodiment section of the infrared temperature feedback solder temperature closed-loop control method above. The specific implementation can be referred to the description of the corresponding embodiments, which will not be repeated here.

[0157] This application also provides an electronic device, comprising: a memory for storing a computer program; and a processor for executing the computer program to implement the steps of the infrared temperature feedback closed-loop control method for solder temperature described above.

[0158] This application also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps of any of the above-described infrared temperature feedback closed-loop control methods for solder temperature.

[0159] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as USB flash drives, read-only memory, random access memory, portable hard drives, magnetic disks, or optical disks.

[0160] Embodiments of the present invention also provide a computer program product, which includes a computer program that, when executed by a processor, implements the steps in any of the above-described embodiments of the infrared temperature feedback closed-loop control method for solder temperature.

[0161] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0162] The foregoing has provided a detailed description of the closed-loop control method and system medium for solder temperature based on infrared temperature feedback provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and its core ideas. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. A soldering temperature closed-loop control method of infrared temperature measurement feedback, characterized in that, The method comprises the following steps: Utilizing infrared temperature measurement technology, detecting the ambient temperature of the welding area in the welding process, the initial temperature measurement value of the solder, and obtaining solder phase change emissivity data, which includes the first emissivity when the solder is in a solid state, the second emissivity when the solder is in a liquid state, and the phase change temperature interval when the solder changes from a solid state to a liquid state; According to the initial temperature measurement value, determining the real-time state of the solder, combining the solder phase change emissivity data and the ambient temperature, utilizing infrared temperature measurement compensation algorithm to calibrate the initial temperature measurement value, and obtaining the calibrated solder temperature; Comparing the calibrated solder temperature with the phase change temperature interval to obtain a temperature comparison result; Based on the calibrated solder temperature and the temperature comparison result, adjusting the heating power parameter of the solder heating device to obtain an adjusted heating power parameter; Controlling the solder heating device to heat the solder according to the adjusted heating power parameter until the calibrated solder temperature in the preset target temperature range is obtained, and realizing closed-loop control of the solder temperature; According to the initial temperature measurement value, determining the real-time state of the solder, combining the solder phase change emissivity data and the ambient temperature, utilizing infrared temperature measurement compensation algorithm to calibrate the initial temperature measurement value, and obtaining the calibrated solder temperature, which comprises the following steps: Comparing the initial temperature measurement value with the phase change temperature interval to determine the real-time state of the solder, wherein when the initial temperature measurement value is less than the lower limit value of the phase change temperature interval, it is determined that the real-time state of the solder is a solid state; when the initial temperature measurement value is greater than the upper limit value of the phase change temperature interval, it is determined that the real-time state of the solder is a liquid state; and when the initial temperature measurement value is within the phase change temperature interval, it is determined that the real-time state of the solder is a phase change state; Based on the solder phase change emissivity data, the initial temperature measurement value, and the phase change temperature interval, calculating the third emissivity when the solder is in a phase change state; Calculating the temperature difference between the ambient temperature and the preset standard reference ambient temperature, based on the temperature difference, utilizing infrared temperature measurement compensation algorithm to determine the ambient temperature correction coefficient, combining the emissivity corresponding to the real-time state of the solder to calibrate the initial temperature measurement value, and obtaining the calibrated solder temperature, wherein the emissivity includes the first emissivity when the solder is in a solid state, or the second emissivity when the solder is in a liquid state, or the third emissivity when the solder is in a phase change state.

2. The soldering temperature closed-loop control method of infrared temperature measurement feedback according to claim 1, wherein, Utilizing infrared temperature measurement compensation algorithm to determine the ambient temperature correction coefficient, combining the emissivity corresponding to the real-time state of the solder to calibrate the initial temperature measurement value, and obtaining the calibrated solder temperature, which comprises the following steps: Based on the infrared temperature measurement characteristics under different welding scenes, determining the ambient temperature influence weight, combining the temperature difference and the preset standard reference ambient temperature, utilizing infrared temperature measurement compensation algorithm to calculate the ambient temperature correction coefficient; Based on the ambient temperature correction coefficient and the initial temperature measurement value, calculating the ambient temperature correction term; According to the emissivity corresponding to the real-time state of the solder and the reference emissivity parameter of the infrared temperature measurement technology, calculating the emissivity correction term; Calibrate the initial temperature measurement value based on the emissivity correction term and the ambient temperature correction term to obtain a calibrated solder temperature.

3. The soldering temperature closed-loop control method of infrared temperature measurement feedback according to claim 1, wherein, Adjust the heating power parameter of the solder heating device based on the calibrated solder temperature and the temperature comparison result to obtain an adjusted heating power parameter, including: Setting a power adjustment coefficient according to the temperature comparison result; Obtaining the heating power parameter of the solder heating device and calculating a temperature deviation value, calculating a total power adjustment amount based on the temperature deviation value, the power adjustment coefficient, and the heating power parameter; Comparing the calibrated solder temperature with a preset target temperature range to determine a power adjustment direction; Determining the positive or negative attribute of the total power adjustment amount according to the power adjustment direction to adjust the heating power parameter to obtain an adjusted heating power parameter.

4. The soldering temperature closed-loop control method of claim 3, wherein, Comparing the calibrated solder temperature with a preset target temperature range to determine a power adjustment direction, including: Calculating a middle value of the preset target temperature range based on the upper limit value and the lower limit value of the preset target temperature range; When the calibrated solder temperature is less than the lower limit value of the preset target temperature range, determining that the power adjustment direction is to increase the heating power; When the calibrated solder temperature is greater than the upper limit value of the preset target temperature range, determining that the power adjustment direction is to decrease the heating power; When the calibrated solder temperature is greater than or equal to the lower limit value of the preset target temperature range and less than or equal to the upper limit value of the preset target temperature range, determining a target temperature range in which the calibrated solder temperature is located based on the middle value, and dividing the target temperature range into a target temperature center sub-range and a target temperature edge sub-range according to a preset deviation threshold; If the calibrated solder temperature is in the target temperature center sub-range, determining that the power adjustment direction is not to adjust the heating power, if the calibrated solder temperature is in a lower edge sub-range of the target temperature edge sub-range, determining that the power adjustment direction is to increase the heating power, and if the calibrated solder temperature is in an upper edge sub-range of the target temperature edge sub-range, determining that the power adjustment direction is to decrease the heating power.

5. The soldering temperature closed-loop control method of claim 3, wherein, Calculating a total power adjustment amount based on the temperature deviation value, the power adjustment coefficient, and the heating power parameter, including: Calculating a proportional adjustment component based on the temperature deviation value and a proportional coefficient of the power adjustment coefficient corresponding to the temperature deviation value; Calculating an integral adjustment component based on the temperature deviation value, an integral coefficient of the power adjustment coefficient corresponding to the temperature deviation value, and a preset integral time; Calculating a differential adjustment component based on the temperature deviation value, a temperature deviation value calculated in a previous closed-loop control period, a differential coefficient of the power adjustment coefficient corresponding to the temperature deviation value, and a preset differential time interval; Setting a power safety threshold according to a rated power parameter of the solder heating device, calculating a power safety margin in combination with the heating power parameter, and superimposing the proportional adjustment component, the integral adjustment component, and the differential adjustment component to obtain an initial power adjustment amount; If the absolute value of the initial power adjustment amount is less than or equal to the power safety margin, the initial power adjustment amount is taken as the total power adjustment amount; if the absolute value of the initial power adjustment amount is greater than the power safety margin, and the initial power adjustment amount is positive, the power safety margin is taken as the total power adjustment amount; if the absolute value of the initial power adjustment amount is greater than the power safety margin, and the initial power adjustment amount is negative, the negative value of the power safety margin is taken as the total power adjustment amount.

6. The soldering temperature closed-loop control method of claim 3, wherein, The heating power parameter is adjusted to obtain an adjusted heating power parameter, including: A power safety boundary parameter of the solder heating device is set, and an initial heating power is calculated according to the heating power parameter, the total power adjustment amount, and the positive and negative attributes of the total power adjustment amount. The power safety boundary parameter includes a minimum allowable heating power value and a maximum allowable heating power value. The maximum allowable heating power value does not exceed the rated power parameter of the solder heating device, and the minimum allowable heating power value is the lowest power threshold for maintaining the stability of the solder temperature. The initial heating power is compared with the minimum allowable heating power value and the maximum allowable heating power value respectively. If the initial heating power is less than the minimum allowable heating power value, the minimum allowable heating power value is taken as the adjusted heating power parameter. If the initial heating power is greater than the maximum allowable heating power value, the maximum allowable heating power value is taken as the adjusted heating power parameter. If the initial heating power is greater than or equal to the minimum allowable heating power value and less than or equal to the maximum allowable heating power value, the initial heating power is taken as the adjusted heating power parameter.

7. An infrared temperature measurement feedback soldering temperature closed loop control system, characterized by, Including: An acquisition module is configured to detect the ambient temperature of a welding area and an initial temperature measurement value of solder during a welding process by using an infrared temperature measurement technology, and to acquire solder phase change emissivity data, which includes a first emissivity when the solder is in a solid state, a second emissivity when the solder is in a liquid state, and a phase change temperature interval when the solder changes from the solid state to the liquid state. A calibration module is configured to determine a real-time state of the solder according to the initial temperature measurement value, to combine the solder phase change emissivity data and the ambient temperature, and to calibrate the initial temperature measurement value by using an infrared temperature measurement compensation algorithm to obtain a calibrated solder temperature. A comparison module is configured to compare the calibrated solder temperature with the phase change temperature interval to obtain a temperature comparison result. An adjustment module is configured to adjust a heating power parameter of a solder heating device based on the calibrated solder temperature and the temperature comparison result to obtain an adjusted heating power parameter. A heating module is configured to control the solder heating device to heat the solder according to the adjusted heating power parameter until a calibrated solder temperature within a preset target temperature range is obtained, thereby realizing closed-loop control of the solder temperature. The initial temperature measurement value is used to determine a real-time state of the solder, the solder phase change emissivity data and the ambient temperature are combined, and an infrared temperature measurement compensation algorithm is used to calibrate the initial temperature measurement value to obtain a calibrated solder temperature, including: comparing the initial temperature value with the phase transition temperature interval to determine a real-time state of the solder, wherein when the initial temperature value is less than a lower limit value of the phase transition temperature interval, it is determined that the real-time state of the solder is solid state, when the initial temperature value is greater than an upper limit value of the phase transition temperature interval, it is determined that the real-time state of the solder is liquid state, and when the initial temperature value is within the phase transition temperature interval, it is determined that the real-time state of the solder is phase transition state; calculating a third emissivity of the solder in the phase transition state based on the solder phase transition emissivity data, the initial temperature value and the phase transition temperature interval; calculating a temperature difference between the ambient temperature and a preset standard reference ambient temperature, determining an ambient temperature correction coefficient by using an infrared temperature compensation algorithm based on the temperature difference, calibrating the initial temperature value by combining an emissivity corresponding to the real-time state of the solder to obtain a calibrated solder temperature, and the emissivity includes a first emissivity of the solder in the solid state, a second emissivity of the solder in the liquid state, or a third emissivity of the solder in the phase transition state.

8. An electronic device, comprising: comprise: a memory for storing a computer program; a processor for executing the computer program to implement the steps of the infrared temperature feedback solder temperature closed-loop control method according to any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that, The computer readable storage medium stores a computer program, and the computer program is executed by the processor to implement the infrared temperature feedback solder temperature closed-loop control method according to any one of claims 1 to 6.

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