Temperature reliability test method, device and equipment of solid state disk and storage medium

Abstract

The present application relates to the technical field of solid state disk testing, and discloses a temperature reliability test method, device, equipment and storage medium for a solid state disk. The temperature reliability test method comprises the following steps: placing a preconfigured solid state disk in a high-low temperature test box to perform card opening operation and firmware programming, and monitoring state data in the programming process; performing reliability verification test on the solid state disk in a high-temperature environment to obtain first test data; performing built-in self-test on the solid state disk in the high-temperature environment to obtain second test data; performing built-in self-test on the solid state disk in a low-temperature environment to obtain third test data; and comprehensively evaluating the reliability of the solid state disk according to the state data, the first test data, the second test data and the third test data. Through the above method, the present application can improve the comprehensiveness and accuracy of the test.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of solid state disk testing, in particular to a temperature reliability testing method, device and equipment of a solid state disk and a storage medium. BACKGROUND

[0002] As a new type of storage medium, solid state disks (SSDs) have been widely used in various fields, including military, vehicle-mounted, industrial control, video surveillance, power, medical treatment and aviation, due to their advantages of fast reading and writing, low power consumption, small size, etc. In order to ensure that the SSD can still maintain high performance and high stability after being put on the market, it is often necessary to test the SSD before it is shipped, such as process testing, voltage testing and temperature testing. However, the existing testing method has insufficient testing time under high and low temperature environments, and the read-write testing mode is single, which leads to the inability to comprehensively and accurately evaluate the reliability of the solid state disk. SUMMARY

[0003] The present application provides a temperature reliability testing method, device and equipment of a solid state disk, which can accurately and comprehensively evaluate the reliability of the solid state disk.

[0004] To solve the above technical problems, one technical solution adopted by the present application is to provide a reliability method of a solid state disk, comprising:

[0005] Placing a pre-configured solid state disk in a high-low temperature test box to perform card opening operation and firmware programming, and monitoring state data in the programming process;

[0006] Performing reliability verification testing on the solid state disk in a high temperature environment to obtain first test data;

[0007] Performing built-in self-test testing on the solid state disk in a high temperature environment to obtain second test data;

[0008] Performing built-in self-test testing on the solid state disk in a low temperature environment to obtain third test data;

[0009] Comprehensively evaluating the reliability of the solid state disk according to the state data, the first test data, the second test data and the third test data.

[0010] According to one embodiment of the present application, the placing of the pre-configured solid state disk in the high-low temperature test box to perform card opening operation and firmware programming, and the monitoring of the state data in the programming process comprises:

[0011] Placing the solid state disk in a high-low temperature test box, setting the environmental temperature to 68-72℃, and connecting the solid state disk to a test host in a physical disk or logical disk mode after the temperature is stable;

[0012] Run the pre-configured firmware update program to flash the firmware to the solid-state drive and monitor the status data during the flashing process;

[0013] The solid-state drive is formatted into multiple partitions, and different operating systems are installed on each partition. The differences in read and write management of the solid-state drive by the different operating systems are simulated.

[0014] According to one embodiment of the present invention, the reliability verification test of the solid-state drive under high temperature environment to obtain first test data includes:

[0015] Connect the solid-state drive to the test host as a physical disk;

[0016] The solid-state drive is subjected to data read and write operations in a sequential read and write mode for 30 minutes, and the first test data is output; the first test data includes the first test log and the first system monitoring data.

[0017] According to one embodiment of the present invention, the step of performing a built-in self-test on the solid-state drive under high-temperature environment to obtain second test data includes...

[0018] The solid-state drive (SSD) was used as a physical disk, and data read and write operations were performed on the SSD in sequential read and write mode. The test temperature was 68~72℃, the test time was 18~24 hours, and the second test log and the second system monitoring data were output.

[0019] The solid-state drive was used as a logical drive, and data read and write operations were performed on the solid-state drive in sequential read and write mode. The test temperature was 68~72℃, the test time was 18~24 hours, and the third test log was output.

[0020] The solid-state drive was used as a logical drive, and data read and write operations were performed on the solid-state drive in random read and write mode. The test temperature was 68~72℃, the test time was 18~24 hours, and the fourth test log was output.

[0021] The second test data includes the second test log, the second system monitoring data, the third test log, and the fourth test log.

[0022] According to one embodiment of the present invention, the step of performing a built-in self-test on the solid-state drive in a low-temperature environment to obtain third test data includes:

[0023] The solid-state drive was used as a physical disk, and data read and write operations were performed on the solid-state drive in sequential read and write mode. The test temperature was -2~2℃, the test time was 18~24 hours, and the fifth test log was output.

[0024] Perform a bad block check on the solid-state drive and record the information of the first bad block;

[0025] The solid-state drive was used as a logical drive, and data read and write operations were performed on the solid-state drive in sequential read and write mode. The test temperature was -2~2℃, the test time was 18~24 hours, and the sixth test log was output.

[0026] Perform a bad block check on the solid-state drive and record the information of the second bad block;

[0027] The solid-state drive was used as a logical drive, and data read and write operations were performed on the solid-state drive in random read and write mode. The test temperature was -2~2℃, the test time was 18~24 hours, and the seventh test log was output.

[0028] Perform a bad block check on the solid-state drive and record the information of the third bad block;

[0029] The third test data includes the fifth test log, the sixth test log, the seventh test log, the first bad block information, the second bad block information, and the third bad block information.

[0030] According to one embodiment of the present invention, the comprehensive evaluation of the reliability of the solid-state drive based on the status data, the first test data, the second test data, and the third test data includes:

[0031] The status data, the first test data, the second test data, and the third test data are organized and cleaned.

[0032] Extract bad block information, SMART attributes, performance information, error information, and environmental information from the cleaned and processed data;

[0033] Based on the extracted results, bad block growth analysis, SMART data trend analysis, performance degradation analysis, and error anomaly analysis are performed, and the reliability of the solid-state drive is evaluated based on the analysis results.

[0034] According to one embodiment of the present invention, the status data includes the initial number of bad blocks, SMART attributes, temperature information, performance information, and error information; the step of performing bad block growth analysis, SMART data trend analysis, performance degradation analysis, and error anomaly analysis based on the extraction results, and evaluating the reliability of the solid-state drive based on the analysis results includes:

[0035] The number of newly added bad blocks is calculated based on the first test data and the status data;

[0036] The number of newly added bad blocks is compared with a preset threshold.

[0037] If the number of newly added bad blocks exceeds a preset threshold, the solid-state drive is determined to be potentially unusable.

[0038] To solve the above-mentioned technical problems, another technical solution adopted by the present invention is: to provide a temperature reliability testing device for solid-state drives, comprising:

[0039] The initialization module is used to place the pre-configured solid-state drive in a high and low temperature test chamber to perform card opening and firmware burning, and to monitor the status data during the burning process.

[0040] The first test module is used to perform reliability verification tests on the solid-state drive under high temperature environment and obtain first test data;

[0041] The second test module is used to perform a built-in self-test on the solid-state drive under high temperature conditions and obtain second test data.

[0042] The third test module is used to perform a built-in self-test on the solid-state drive in a low-temperature environment and obtain third test data.

[0043] The evaluation module is used to comprehensively evaluate the reliability of the solid-state drive based on the status data, the first test data, the second test data, and the third test data.

[0044] To solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a computer device, including: a memory, a processor, and a computer program stored on the memory and executable on the processor, wherein the processor executes the computer program to implement the temperature reliability testing method for the solid-state drive.

[0045] To solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a computer storage medium on which a computer program is stored, wherein the computer program is executed by a processor to implement the above-mentioned temperature reliability testing method for solid-state drives.

[0046] The beneficial effects of this invention are: by using multiple testing methods such as card opening and firmware burning stages, high-temperature reliability verification tests, high-temperature built-in self-test tests, and low-temperature built-in self-test tests, it comprehensively simulates the complex working environment of solid-state drives in actual applications, overcomes the limitations of existing technologies that only perform basic tests, and improves the comprehensiveness and accuracy of the tests. Attached Figure Description

[0047] Figure 1 This is a flowchart illustrating a method for testing the temperature reliability of a solid-state drive according to an embodiment of the present invention.

[0048] Figure 2 This is a flowchart illustrating step S10 of an embodiment of the present invention.

[0049] Figure 3 This is a flowchart illustrating step S20 of an embodiment of the present invention.

[0050] Figure 4 This is a flowchart illustrating step S30 of an embodiment of the present invention.

[0051] Figure 5 This is a flowchart illustrating step S40 of an embodiment of the present invention.

[0052] Figure 6 This is a flowchart illustrating step S50 of an embodiment of the present invention.

[0053] Figure 7 This is a schematic diagram of the structure of a solid-state drive temperature reliability testing device according to an embodiment of the present invention.

[0054] Figure 8 This is a schematic diagram of the structure of a computer device according to an embodiment of the present invention.

[0055] Figure 9 This is a schematic diagram of the structure of a computer storage medium according to an embodiment of the present invention. Detailed Implementation

[0056] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0057] The terms "first," "second," and "third" used in this invention are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this invention are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0058] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0059] Figure 1 This is a flowchart illustrating a method for testing the temperature reliability of a solid-state drive according to an embodiment of the present invention. It should be noted that if substantially the same results are obtained, the method of the present invention is not necessarily identical. Figure 1 The illustrated process sequence is limited. For example... Figure 1 As shown, the method includes the following steps:

[0060] Step S10: Place the pre-configured solid-state drive in a high and low temperature test chamber to perform card opening and firmware burning, and monitor the status data during the burning process.

[0061] In step S10, the card activation and firmware flashing stage serves as a fundamental preliminary step in the entire reliability test. Its purpose is to ensure that the solid-state drive (SSD) is in a stable, reliable, and standardized initial state before entering subsequent high-temperature and other complex environmental tests. Specifically, the newly activated SSD undergoes a card activation process, enabling it to have basic recognition and usability. Simultaneously, firmware is flashed onto the SSD. This firmware contains various programs and configuration information required for the drive's operation, providing a stable software foundation for subsequent tests. This step provides a unified and reliable starting condition for subsequent tests, avoiding deviations in test results due to the instability of the SSD's initial state.

[0062] Step S20: Perform a reliability verification test on the solid-state drive under high temperature environment to obtain the first test result.

[0063] In step S20, the test involves performing data read / write operations and other related tests on the solid-state drive (SSD) under a high-temperature environment (68-72°C). By simulating a high-temperature operating environment, the test results are statistically analyzed. This step can initially screen out SSDs that may experience potential failures under high-temperature conditions, providing a rapid assessment of the reliability of SSDs under such conditions.

[0064] Step S30: Perform a built-in self-test on the solid-state drive under high temperature conditions to obtain the second test result.

[0065] In step S30, the test involves performing multiple tests on the solid-state drive (SSD) under high-temperature conditions. These tests include sequential read / write and random read / write operations on the SSD in both physical and logical drive configurations. The test temperature is 68-72°C, which can be adjusted according to actual needs (e.g., 68°C, 70°C, or 72°C). The test duration is relatively long, typically 18-24 hours, and can be adjusted to 18, 20, or 24 hours to ensure sufficient read / write operations on the SSD under high-temperature conditions, thus testing its stability and reliability under prolonged high-temperature conditions. This step provides a more in-depth and comprehensive assessment of the SSD's reliability under different logical configurations and read / write modes under high-temperature conditions, further deepening and supplementing step S20. This step relies on the relatively reliable SSD samples selected in step S20 or further verifies potential problems discovered in step S20.

[0066] Step S40: Perform a built-in self-test on the solid-state drive in a low-temperature environment to obtain the third test result.

[0067] In step S40, the ambient temperature is switched to a low-temperature environment, with a test temperature of 0±2℃. This temperature range can be adjusted according to actual needs, and can be -2℃, 0℃, or 2℃. This temperature range represents the lower limit of the common operating temperature of solid-state drives (SSDs) in low-temperature environments. Choosing this temperature simulates usage conditions in extreme low-temperature environments and evaluates the reliability of the SSD in such environments. The test duration is relatively long, generally 18-24 hours, and can be adjusted according to actual needs, such as 18 hours, 20 hours, or 24 hours, to ensure sufficient read and write operations on the SSD in a low-temperature environment to test its stability and reliability under prolonged low-temperature conditions. Multiple tests of different types are performed on the SSD, including sequential read / write and random read / write tests, both as a physical drive and a logical drive. Solid-state drives (SSDs) may face low-temperature environments in real-world use, such as outdoor devices in winter or refrigerated environments. This step is mainly to evaluate the reliability of SSDs in low-temperature environments, complementing the testing steps in high-temperature environments. It comprehensively covers the reliability assessment of SSDs under different extreme temperature conditions, further improving the overall assessment of SSD reliability under different temperature conditions.

[0068] Step S50: Evaluate the reliability of the solid-state drive based on the results of the first test, the second test, and the third test.

[0069] In step S50, the test data is first systematically organized and cleaned to remove invalid or abnormal data. Then, it is categorized and stored according to different test scenarios, and the data format is standardized for subsequent analysis and processing. Next, data from incomplete or abnormally interrupted tests is removed to ensure the completeness and validity of the analysis data. Then, by matching the number of bad blocks before and after the test with SMART (Self-Monitoring, Analysis and Reporting Technology) data, the increment of the number of bad blocks is calculated (increment of bad blocks = number of bad blocks after test - initial number of bad blocks), and bad block information, SMART attributes, performance information, error information, and environmental information are extracted. Finally, bad block growth analysis, SMART data trend analysis, performance degradation analysis, and error anomaly analysis are performed. Based on these analysis results, the reliability of the solid-state drive is comprehensively evaluated.

[0070] The temperature reliability testing method for solid-state drives in one embodiment of the present invention comprehensively simulates the complex working environment of solid-state drives in actual applications through multiple testing methods, including card opening and firmware burning stages, high-temperature reliability verification tests, high-temperature built-in self-test tests, and low-temperature built-in self-test tests. This overcomes the limitations of existing technologies that only perform basic tests and improves the comprehensiveness and accuracy of the tests.

[0071] As one example, please refer to Figure 2 Step S10 further includes the following steps:

[0072] Step S101: Place the solid-state drive in a high and low temperature test chamber, set the ambient temperature to 68~72℃, and after the temperature stabilizes, connect the solid-state drive to the test host as a physical disk or logical disk.

[0073] In this step, a temperature sensor is installed inside the high and low temperature test chamber to monitor the temperature in real time. The ambient temperature is set at 68~72℃, a temperature range suitable for various high-temperature real-world usage scenarios for solid-state drives (SSDs) (such as high-temperature server rooms in summer, and long-running automotive equipment), effectively simulating the extreme high-temperature operating environments that SSDs may face. A stable temperature environment is defined as a temperature fluctuation range of -1℃ to -1℃ that lasts for 10 minutes. The SSD is then connected to the test host either as a physical drive or a logical drive. Connecting as a physical drive involves directly connecting via the SATA / PCIe interface, bypassing operating system cache interference, and directly obtaining the underlying response data of the SSD, ensuring that the test data accurately reflects the drive's performance. Connecting as a logical drive involves using relevant operating system settings to treat it as a logical storage device to simulate different usage scenarios.

[0074] Step S102: Run the pre-configured firmware update program to flash the firmware to the solid-state drive and monitor the status data during the flashing process.

[0075] In this step, the firmware update program is run to flash the firmware onto the SSD. Firmware is the core software for the SSD's operation, and the flashing process requires strict monitoring. Status data includes the initial number of bad blocks, SMART attributes, temperature information, performance information, and error information. Temperature information includes recording the ambient temperature around the SSD (target range 68~72℃) using a temperature sensor built into a high and low temperature test chamber, and monitoring the chip-level temperature using the SSD's built-in temperature sensor to ensure the flashing process is performed at a suitable temperature, avoiding the impact of excessively high or low temperatures on firmware flashing quality. Performance information includes recording the write speed during the flashing process to ensure the efficiency and quality of firmware flashing. Error information includes capturing error logs output by the flashing tool (such as ECC error correction failure, abnormal bad block marking, etc.) to promptly identify potential problems during the flashing process.

[0076] Step S103: Format the solid-state drive into multiple partitions, install different operating systems on each partition, and simulate the differences in read and write management of the solid-state drive by different operating systems.

[0077] In this step, the SSD is formatted into three partitions, and Windows 10 and Windows 11 operating systems are installed on each partition (more different systems can be installed depending on the actual situation). The purpose of this operation is to simulate the differences in read and write management of the SSD by different file systems (NTFS, etc.) and the underlying system drivers, covering more real-world usage scenarios. Different operating systems and file systems manage read and write operations on SSDs differently. By installing multiple operating systems, bad block management or read / write policy conflicts caused by differences in file systems can be exposed, providing more comprehensive initial conditions for subsequent testing.

[0078] As one example, please refer to Figure 3 Step S20 further includes the following steps:

[0079] Step S201: Connect the solid-state drive to the test host as a physical disk.

[0080] In this step, the solid-state drive (SSD) is connected to the test host as a physical disk. This means that the SSD with the firmware already burned is connected to the test host as a physical disk (directly mapped to the system drive letter, such as D:\, without going through RAID or virtualization layer). This reduces the impact of intermediate steps on the test results and directly obtains the real data of the hard drive during read and write operations.

[0081] Step S202: Perform data read and write operations on the solid-state drive in sequential read and write mode for 30 minutes, and output the first test data; the first test data includes the first test log and the first system monitoring data.

[0082] In this step, the sequential read / write mode simulates typical SSD usage scenarios such as copying large files in daily use, like copying a large video file from one folder to another. A standardized sequential read / write test tool (such as IOMeter, configured with: block size 1MB, queue depth 1, and 100% sequential write ratio) is run for 30 minutes. This short-duration high-load test quickly exposes issues such as write speed drops under high temperatures and controller overheating protection triggering.

[0083] Furthermore, after step S202, a potential failure determination of the solid-state drive (SSD) can be performed. Specifically, the current number of bad blocks is extracted based on the first test data, the initial number of bad blocks is extracted based on the status data, and the number of newly added bad blocks is calculated based on the current number of bad blocks and the initial number of bad blocks. The number of newly added bad blocks is compared with a preset threshold. If the number of newly added bad blocks exceeds the preset threshold, it is determined that the SSD has a potential failure. The number of newly added bad blocks can directly reflect the durability defects of the SSD under high-temperature sequential write pressure.

[0084] As one example, please refer to Figure 4 Step S30 further includes the following steps:

[0085] Step S301: Use the solid-state drive as a physical disk and perform data read and write operations on the solid-state drive in sequential read and write mode. The test temperature is 68~72℃ and the test time is 18~24 hours. Output the second test log and the second system monitoring data.

[0086] In this step, the physical disk sequential read / write test involves connecting the SSD as a physical disk and running a sequential read / write test (block size 4KB, queue depth 32, read / write ratio 50%:50%) for 18-24 hours (a long-term test simulating a continuous high-temperature working scenario). The second test log includes temperature, write volume, and error count per minute. The second system monitoring data includes CPU / memory usage ≤15%, excluding host interference. This test can simulate the sequential read / write behavior of a solid-state drive under prolonged high-temperature operation, such as in a server where a solid-state drive performs data storage and retrieval operations for extended periods. Long-term testing can expose slow degradation issues, such as slow leakage of flash memory cells.

[0087] Step S302: Treat the solid-state drive as a logical drive and perform data read and write operations on the solid-state drive in sequential read and write mode. The test temperature is 68~72℃ and the test time is 18~24 hours. Output the third test log.

[0088] In this step, the logical disk sequential read / write test initializes the SSD as a logical disk (assigning a drive letter, such as E:\, using Windows Disk Management tools) and runs a sequential read / write test (block size 4KB, queue depth 32, read / write ratio 50%:50%) for 18-24 hours. The logical disk mode verifies whether the file system's (such as NTFS) read / write scheduling strategy for the SSD fails under high temperatures. Because logical disks are affected by file system caching, unlike physical disks, this test further evaluates the file system's ability to manage SSD read / write operations under high-temperature conditions.

[0089] Step S303: Use the solid-state drive as a logical drive and perform data read and write operations on the solid-state drive in random read and write mode. The test temperature is 68~72℃ and the test time is 18~24 hours. Output the fourth test log.

[0090] In this step, the logical disk random read / write test uses the SSD as a logical disk and runs a random read / write test (block size 4KB, queue depth 32, 100% random write) for 18-24 hours. Random read / write is a typical load for applications such as databases and virtual machines. The degradation of random performance under high temperature can reflect the addressing latency problem of flash memory chips. This test can evaluate the reliability of solid-state drives when handling random read / write tasks in high-temperature environments.

[0091] Furthermore, the second test data includes the second test log, the second system monitoring data, the third test log, and the fourth test log.

[0092] This embodiment combines sequential and random read / write tests to comprehensively evaluate the performance and reliability of solid-state drives (SSDs) under different read / write modes. Sequential read / write tests primarily assess the stability of continuous data read / write operations, while random read / write tests evaluate the performance of non-continuous data read / write operations. Furthermore, by testing both physical and logical drives separately, and combining sequential and random read / write mode switching, the wear leveling performance of the SSD is comprehensively evaluated, addressing the lack of effective verification techniques for hard drive wear leveling in existing technologies.

[0093] As one example, please refer to Figure 5 Step S40 further includes the following steps:

[0094] Step S401: Treat the solid-state drive as a physical disk and perform data read and write operations on the solid-state drive in sequential read and write mode. The test temperature is -2~2℃ and the test time is 18~24 hours. Output the fifth test log.

[0095] In this step, the physical disk sequential read / write test involves connecting the SSD as a physical disk and sequentially reading and writing for 18 to 24 hours in an environment of -2 to 2℃, and then outputting the fifth test log.

[0096] Step S402: Perform a bad block check on the solid-state drive and record the information of the first bad block.

[0097] In this step, the Diskinfo command (e.g., diskinfo -b, to read the number of reallocated sectors) is run, and the number of bad blocks is recorded. This test switches the ambient temperature to -2~2℃ (simulating low-temperature scenarios such as outdoor equipment and refrigeration environments in winter) to test the sequential read / write reliability of the physical disk in a low-temperature environment. Through long-term testing, the growth of bad blocks during sequential read / write operations of the solid-state drive can be observed.

[0098] Step S403: Treat the solid-state drive as a logical drive and perform data read and write operations on the solid-state drive in sequential read and write mode. The test temperature is -2~2℃ and the test time is 18~24 hours. Output the sixth test log.

[0099] In this step, the logical disk sequential read / write test uses the SSD as the logical disk and performs sequential read / write operations for 18 to 24 hours in an environment of -2 to 2℃, outputting the sixth test log.

[0100] Step S404: Perform a bad block check on the solid-state drive and record the information of the second bad block.

[0101] In this step, the Diskinfo command is run to check for bad blocks. Logical disk sequential read / write tests can verify the file system's caching management capabilities for SSD sequential read / write operations in low-temperature environments, and the impact of low temperature on the reliability of logical disk sequential read / write operations.

[0102] Step S405: Treat the solid-state drive as a logical drive and perform data read and write operations on the solid-state drive in random read and write mode. The test temperature is -2~2℃ and the test time is 18~24 hours. Output the seventh test log.

[0103] In this step, the logical disk random read / write test uses the SSD as the logical disk and performs random read / write operations (block size 4KB, 100% random, queue depth 32) for 18 to 24 hours in an environment of -2 to 2℃, outputting the seventh test log.

[0104] Step S406: Perform a bad block check on the solid-state drive and record the information of the third bad block.

[0105] In this step, the Diskinfo command is run to check for bad blocks. This test can evaluate the reliability of the solid-state drive (SSD) during random read / write operations of the logical drive in low-temperature environments, as well as the impact of low temperature on flash memory chip addressing and data read / write. Checking for bad blocks using Diskinfo can accurately record the growth of bad blocks.

[0106] Furthermore, the third test data includes the fifth test log, the sixth test log, the seventh test log, the first bad block information, the second bad block information, and the third bad block information.

[0107] This embodiment combines sequential and random read / write tests to comprehensively evaluate the performance and reliability of solid-state drives (SSDs) under different read / write modes. Sequential read / write tests primarily assess the stability of continuous data read / write operations, while random read / write tests evaluate the performance of non-continuous data read / write operations. Furthermore, by testing both physical and logical drives separately, and combining sequential and random read / write mode switching, the wear leveling performance of the SSD is comprehensively evaluated, addressing the lack of effective verification techniques for hard drive wear leveling in existing technologies.

[0108] As one example, please refer to Figure 6 Step S50 further includes the following steps:

[0109] Step S501: Organize and clean the status data, first test data, second test data, and third test data.

[0110] In this step, data cleaning includes removing data from incomplete or abnormally interrupted tests to ensure data integrity and validity. Data processing involves converting all test data into a unified format and storing it in categories for subsequent analysis. This step summarizes the test data from all test scenarios (high-temperature reliability verification test, high-temperature built-in self-test test, low-temperature built-in self-test test) and stores it in categories according to "test type - ambient temperature - read / write mode", such as "high temperature - reliability verification test - 70℃ - sequential write".

[0111] Step S502: Extract bad block information, SMART attributes, performance information, error information, and environmental information from the cleaned and processed data.

[0112] In this step, bad block information includes the number of sectors reassigned and the number of sectors to be mapped; SMART attributes include temperature, number of ECC error corrections, and bad block growth rate; performance information includes average write speed (MB / s) and IOPS fluctuation range; error information includes write error count and number of timeout errors; environmental information does not include the actual temperature at each stage.

[0113] Step S503: Based on the extraction results, perform bad block growth analysis, SMART data trend analysis, performance degradation analysis, and error anomaly analysis, and evaluate the reliability of the solid-state drive based on the analysis results.

[0114] In this step, the following steps are performed: Bad block growth analysis: If the increase in the number of bad blocks in a certain test scenario is greater than the threshold (e.g., 5 bad blocks / 24 hours), it is marked as high risk; SMART data trend analysis: Observe whether the temperature continues to approach the upper limit (e.g., >80℃) and whether the number of ECC error corrections increases linearly over time. If so, it indicates a decrease in reliability; Performance degradation analysis: If the write speed decreases by more than 20% or the IOPS fluctuation is greater than 30%, it indicates deterioration in storage performance; Error anomaly analysis: If CRC check failure or timeout error occurs, it is necessary to correlate the specific temperature and read / write mode to locate the cause of failure.

[0115] This embodiment analyzes the test results, including bad block growth analysis, SMART data trend analysis, performance degradation analysis, and error anomaly analysis, to accurately assess the performance change trend of solid-state drives and effectively identify potential failure risks.

[0116] Figure 7 This is a schematic diagram of the temperature reliability testing device for solid-state drives according to an embodiment of the present invention. Figure 7 As shown, the device 70 includes an initialization module 71, a first test module 72, a second test module 73, a third test module 74, and an evaluation module 75.

[0117] The initialization module 71 is used to place the pre-configured solid-state drive in a high and low temperature test chamber for card opening and firmware burning, and to monitor the status data during the burning process;

[0118] The first test module 72 is used to perform reliability verification tests on the solid-state drive under high temperature environment and obtain the first test data;

[0119] The second test module 73 is used to perform a built-in self-test on the solid-state drive under high temperature conditions and obtain second test data.

[0120] The third test module 74 is used to perform a built-in self-test on the solid-state drive in a low-temperature environment and obtain third test data.

[0121] Evaluation module 75 is used to comprehensively evaluate the reliability of the solid-state drive based on status data, first test data, second test data, and third test data.

[0122] Please see Figure 8 , Figure 8 This is a schematic diagram of the structure of a computer device according to an embodiment of the present invention. Figure 8As shown, the computer device 80 includes a processor 81 and a memory 82 coupled to the processor 81.

[0123] The memory 82 stores program instructions for implementing the temperature reliability testing method for solid-state drives as described in any of the above embodiments.

[0124] The processor 81 is used to execute program instructions stored in the memory 82 to perform temperature reliability testing of the solid-state drive.

[0125] The processor 81 can also be referred to as a CPU (Central Processing Unit). The processor 81 may be an integrated circuit chip with signal processing capabilities. The processor 81 can also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), an off-the-shelf programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. A general-purpose processor can be a microprocessor or any conventional processor.

[0126] See Figure 9 , Figure 9 This is a schematic diagram of the structure of a computer storage medium according to an embodiment of the present invention. The computer storage medium of this embodiment stores a program file 91 capable of implementing all the above methods. This program file 91 can be stored in the computer storage medium in the form of a software product, including several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned computer storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks, or terminal devices such as computers, servers, mobile phones, and tablets.

[0127] In the embodiments provided by this invention, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces, indirect coupling or communication connection between apparatuses or units, and may be electrical, mechanical, or other forms.

[0128] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0129] The above are merely embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A method for testing the temperature reliability of a solid-state drive, characterized in that, include: The pre-configured solid-state drive was placed in a high and low temperature test chamber for card opening and firmware burning, and the status data during the burning process was monitored. The solid-state drive was subjected to a reliability verification test under a high-temperature environment to obtain the first test data. The solid-state drive was subjected to a built-in self-test under high temperature conditions to obtain second test data. The solid-state drive was subjected to a built-in self-test in a low-temperature environment to obtain third test data. The reliability of the solid-state drive is comprehensively evaluated based on the status data, the first test data, the second test data, and the third test data. The step of placing the pre-configured solid-state drive in a high and low temperature test chamber for card opening and firmware flashing, and monitoring the status data during the flashing process, includes: The solid-state drive was placed in a high and low temperature test chamber, and the ambient temperature was set to 68~72℃. After the temperature stabilized, the solid-state drive was connected to the test host as a physical disk or a logical disk. Run the pre-configured firmware update program to flash the firmware to the solid-state drive and monitor the status data during the flashing process; The solid-state drive is formatted into multiple partitions, different operating systems are installed on each partition, and the differences in read and write management of the solid-state drive by the different operating systems are simulated. The reliability verification test of the solid-state drive under high temperature environment, and the acquisition of the first test data, includes: Connect the solid-state drive to the test host as a physical disk; The solid-state drive is subjected to data read and write operations in a sequential read and write mode for 30 minutes, and the first test data is output; the first test data includes the first test log and the first system monitoring data.

2. The method for testing the temperature reliability of a solid-state drive according to claim 1, characterized in that, The step of performing a built-in self-test on the solid-state drive under high-temperature conditions to obtain the second test data includes... The solid-state drive (SSD) was used as a physical disk, and data read and write operations were performed on the SSD in sequential read and write mode. The test temperature was 68~72℃, the test time was 18~24 hours, and the second test log and the second system monitoring data were output. The solid-state drive was used as a logical drive, and data read and write operations were performed on the solid-state drive in sequential read and write mode. The test temperature was 68~72℃, the test time was 18~24 hours, and the third test log was output. The solid-state drive was used as a logical drive, and data read and write operations were performed on the solid-state drive in random read and write mode. The test temperature was 68~72℃, the test time was 18~24 hours, and the fourth test log was output. The second test data includes the second test log, the second system monitoring data, the third test log, and the fourth test log.

3. The method for testing the temperature reliability of a solid-state drive according to claim 1, characterized in that, The third test data obtained by performing a built-in self-test on the solid-state drive in a low-temperature environment includes: The solid-state drive was used as a physical disk, and data read and write operations were performed on the solid-state drive in sequential read and write mode. The test temperature was -2~2℃, the test time was 18~24 hours, and the fifth test log was output. Perform a bad block check on the solid-state drive and record the information of the first bad block; The solid-state drive was used as a logical drive, and data read and write operations were performed on the solid-state drive in sequential read and write mode. The test temperature was -2~2℃, the test time was 18~24 hours, and the sixth test log was output. Perform a bad block check on the solid-state drive and record the information of the second bad block; The solid-state drive was used as a logical drive, and data read and write operations were performed on the solid-state drive in random read and write mode. The test temperature was -2~2℃, the test time was 18~24 hours, and the seventh test log was output. Perform a bad block check on the solid-state drive and record the information of the third bad block; The third test data includes the fifth test log, the sixth test log, the seventh test log, the first bad block information, the second bad block information, and the third bad block information.

4. The method for testing the temperature reliability of a solid-state drive according to claim 1, characterized in that, The comprehensive evaluation of the reliability of the solid-state drive based on the status data, the first test data, the second test data, and the third test data includes: The status data, the first test data, the second test data, and the third test data are organized and cleaned. Extract bad block information, SMART attributes, performance information, error information, and environmental information from the cleaned and processed data; Based on the extracted results, bad block growth analysis, SMART data trend analysis, performance degradation analysis, and error anomaly analysis are performed, and the reliability of the solid-state drive is evaluated based on the analysis results.

5. The method for testing the temperature reliability of a solid-state drive according to claim 4, characterized in that, The status data includes the initial number of bad blocks, SMART attributes, temperature information, performance information, and error information; the steps of performing bad block growth analysis, SMART data trend analysis, performance degradation analysis, and error anomaly analysis based on the extracted results, and evaluating the reliability of the solid-state drive based on the analysis results, include: The number of newly added bad blocks is calculated based on the first test data and the status data; The number of newly added bad blocks is compared with a preset threshold. If the number of newly added bad blocks exceeds a preset threshold, the solid-state drive is determined to be potentially unusable.

6. A temperature reliability testing device for solid-state drives, characterized in that, include: The initialization module is used to place the pre-configured solid-state drive in a high and low temperature test chamber to perform card opening and firmware burning, and to monitor the status data during the burning process. The first test module is used to perform reliability verification tests on the solid-state drive under high temperature environment and obtain first test data; The second test module is used to perform a built-in self-test on the solid-state drive under high temperature conditions and obtain second test data. The third test module is used to perform a built-in self-test on the solid-state drive in a low-temperature environment and obtain third test data. An evaluation module is used to comprehensively evaluate the reliability of the solid-state drive based on the status data, the first test data, the second test data, and the third test data. The initialization module performs the following steps: placing the pre-configured solid-state drive in a high and low temperature test chamber for card activation and firmware flashing, and monitoring the status data during the flashing process, including: The solid-state drive was placed in a high and low temperature test chamber, and the ambient temperature was set to 68~72℃. After the temperature stabilized, the solid-state drive was connected to the test host as a physical disk or a logical disk. Run the pre-configured firmware update program to flash the firmware to the solid-state drive and monitor the status data during the flashing process; The solid-state drive is formatted into multiple partitions, different operating systems are installed on each partition, and the differences in read and write management of the solid-state drive by the different operating systems are simulated. The first test module performs the reliability verification test on the solid-state drive under high temperature environment, and obtains the first test data including: Connect the solid-state drive to the test host as a physical disk; The solid-state drive is subjected to data read and write operations in a sequential read and write mode for 30 minutes, and the first test data is output; the first test data includes the first test log and the first system monitoring data.

7. A computer device, comprising: A memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, when the processor executes the computer program, it implements the temperature reliability testing method for a solid-state drive as described in any one of claims 1-5.

8. A computer storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the temperature reliability testing method for solid-state drives as described in any one of claims 1-5.

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