A power electronic device

By using a combination of heat sink housing and heat pipe in power electronic equipment, efficient heat dissipation of the magnetic core and windings is achieved, solving the problem of low heat dissipation efficiency of the magnetic core and improving the operational reliability of the equipment.

CN121306716BActive Publication Date: 2026-05-12BEIJING YISUO POWER TECHNOLOGY CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIJING YISUO POWER TECHNOLOGY CO LTD
Filing Date
2025-10-14
Publication Date
2026-05-12

AI Technical Summary

Technical Problem

In existing power electronic devices, the heat dissipation efficiency of the magnetic core is low, which leads to a decrease in the reliability of the equipment.

Method used

A heat dissipation shell is used to cover part of the surface of the magnetic core. The heat dissipation shell has a heat dissipation channel and a turbulence structure is set in the channel to force heat dissipation using heat dissipation fluid. At the same time, a heat dissipation pipe is set in the magnetic core to directly conduct internal heat.

Benefits of technology

This improves the heat dissipation efficiency of the magnetic core and windings, avoiding the problems of low efficiency in natural heat dissipation or air cooling, and ensuring stable operation of the equipment.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN121306716B_ABST
    Figure CN121306716B_ABST
Patent Text Reader

Abstract

The embodiment of the application discloses a power electronic device, relates to the field of device heat dissipation technology, and is invented to improve the heat dissipation efficiency of a magnetic core. The power electronic device comprises a shell, the magnetic core is arranged in the shell, a winding is arranged on the magnetic core, a heat dissipation shell is arranged on the magnetic core, the heat dissipation shell is provided with a first heat dissipation channel, a first turbulence structure is arranged on the wall opposite to the first heat dissipation channel, one end of the first heat dissipation channel is used for inputting heat dissipation fluid, and the other end is used for outputting heat dissipation fluid. The application is suitable for providing power demand.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application relates to the field of equipment heat dissipation technology, and more particularly to a power electronic device. Background Technology

[0002] With the rapid development of technology, the application of power electronic equipment is becoming more and more widespread. One type of power equipment includes a magnetic core with wires wound around it, which works using the principle of electromagnetic induction. However, during the operation of this type of power electronic equipment, the magnetic core generates a lot of heat. In order to dissipate heat from the magnetic core, the existing technology uses natural heat dissipation or air cooling on the outer surface of the magnetic core. Such heat dissipation methods have low heat dissipation efficiency for the magnetic core. Summary of the Invention

[0003] In view of this, embodiments of this application provide a power electronic device that can improve the heat dissipation efficiency of the magnetic core.

[0004] This application provides a power electronic device, including: a housing; a magnetic core; the magnetic core being disposed in the housing; a winding wound around the magnetic core; a heat dissipation shell; the heat dissipation shell at least covering a portion of the surface of the magnetic core; a first heat dissipation channel being provided in the heat dissipation shell; a first turbulence structure being provided on the wall of the heat dissipation shell opposite to the first heat dissipation channel; one end of the first heat dissipation channel being used for inputting heat dissipation fluid, and the other end being used for outputting heat dissipation fluid.

[0005] According to a specific implementation of an embodiment of this application, the magnetic core includes a base, a first side post, a second side post, and a middle post; one end of the first side post, the second side post, and the middle post are respectively disposed on the base; the winding is wound on the middle post; the heat dissipation housing includes a bottom plate, an end plate, and a side plate, the end plate and the side plate are respectively connected to the bottom plate; the first heat dissipation channel is disposed in the bottom plate, the end plate, or the side plate.

[0006] According to a specific implementation of an embodiment of this application, the end plate includes a first end plate; when the first heat dissipation channel is disposed in the first end plate, the first end plate is in contact with the base of the magnetic core; the side plate is provided with a second heat dissipation channel, and the side plate is in contact with the side post of the magnetic core.

[0007] According to a specific implementation of an embodiment of this application, the central column is provided with a third heat dissipation channel, and a heat dissipation pipe is inserted through the third heat dissipation channel. One end of the heat dissipation pipe is used to input heat dissipation fluid, and the other end is used to output heat dissipation fluid.

[0008] According to one specific implementation of the present application, a second turbulence structure is provided on the inner wall of the heat dissipation pipe.

[0009] According to a specific implementation of an embodiment of this application, the first end plate is provided with a first main flow channel and a first branch flow channel; the first branch flow channel and the first heat dissipation channel are respectively connected to the first main flow channel; the first branch flow channel is connected to one end of the heat dissipation pipe; and the first heat dissipation channel is connected to the second heat dissipation channel.

[0010] According to one specific implementation of this application, the first branch guide channel is disposed opposite to the base.

[0011] According to a specific implementation of an embodiment of this application, the end plate further includes a second end plate, the second end plate having a second main flow channel and a second branch flow channel; the other end of the heat dissipation pipe is connected to the second main flow channel through the second branch flow channel; the second heat dissipation channel is connected to the second main flow channel.

[0012] According to a specific implementation of this application, a sealing structure mounting seat is provided on the end face of the first end plate near the heat sink, and the sealing structure mounting seat is connected to the first branch flow channel; a sealing structure is provided on the sealing structure mounting seat, and the sealing structure is sleeved on one end of the heat sink; or, a sealing structure is provided between one end of the heat sink and the first branch flow channel.

[0013] According to one specific implementation of this application, the heat dissipation pipe is made of an insulating and thermally conductive material.

[0014] According to one specific implementation of an embodiment of this application, at least two second heat dissipation channels are arranged side by side in the side plate.

[0015] In this embodiment of the power electronic device, a heat sink housing at least covers a portion of the surface of the magnetic core. The heat sink housing has a first heat dissipation channel. One end of the first heat dissipation channel is used to input heat dissipation fluid, and the other end is used to output heat dissipation fluid. Thus, heat is conducted from the magnetic core to the first heat dissipation channel, and then carried to the outside by the heat dissipation fluid within the first heat dissipation channel. Furthermore, because a first turbulence structure is provided on the wall of the heat sink housing opposite to the first heat dissipation channel, the first turbulence structure can cause disturbance to the fluid flowing through the first heat dissipation channel, further carrying more heat to the outside, thereby reducing the temperature of the magnetic core. Since the heat sink housing at least covers a portion of the surface of the magnetic core, has a first heat dissipation channel, and a first turbulence structure on the wall of the heat sink housing opposite to the first heat dissipation channel, and one end of the first heat dissipation channel is used to input heat dissipation fluid, and the other end is used to output heat dissipation fluid, the heat dissipation efficiency of the magnetic core can be improved. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of a power electronic device provided in an embodiment of this application;

[0018] Figure 2 This is a schematic diagram of the structure of a power electronic device provided in yet another embodiment of this application;

[0019] Figure 3 This is a schematic diagram of the structure of a magnetic core provided in a specific embodiment of this application;

[0020] Figure 4 This is a schematic diagram of the structure of the first end plate in one embodiment of this application;

[0021] Figure 5 This is a schematic diagram of the structure of the heat dissipation housing in one embodiment of this application;

[0022] Figure 6 This is a cross-sectional view of the first end plate in one embodiment of this application;

[0023] Figure 7 This is a schematic diagram of the structure of a power electronic device provided in an embodiment of this application. Detailed Implementation

[0024] The embodiments of this application will now be described in detail with reference to the accompanying drawings. It should be understood that the described embodiments are merely some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0025] To enable those skilled in the art to better understand the technical concept, implementation scheme and beneficial effects of the embodiments of this application, detailed descriptions are provided below through specific embodiments.

[0026] See Figure 1 and Figure 2 The power electronic device of this embodiment may include: a housing, a magnetic core 1, a winding 2 and a heat sink 3. The winding 2 is wound on the magnetic core 1, and the heat sink 3 covers at least a portion of the surface of the magnetic core 1. A first heat dissipation channel 4 is provided in the heat sink 3. A first turbulence structure is provided on the wall of the heat sink 3 opposite to the first heat dissipation channel 4. One end of the first heat dissipation channel 4 is used to input heat dissipation fluid, and the other end is used to output heat dissipation fluid.

[0027] In this embodiment, the magnetic core 1 is housed within the outer casing. The winding 2 and the heat dissipation housing 3 are also housed within the outer casing.

[0028] The electronic device in this embodiment may specifically include a transformer, an inductor, a switching power supply, etc. In a specific scenario, the electronic device in this embodiment is a high-power, high-frequency power electronic device.

[0029] The magnetic core 1 provides a path with low magnetic resistance (relative to air) for the magnetic field. In some specific examples, the type of magnetic core 1 may include E type, EE type (with double central pillars), EC type, PQ type, RM type, UF type, EQ type, EP type, C type, toroidal, U type, etc.

[0030] In some cases, the magnetic core 1 is a monolithic sintered structure, which can reduce magnetic resistance.

[0031] In this embodiment, the winding 2 can also be called a conductor, through which direct current or alternating current can be passed to form a magnetic field.

[0032] The first turbulence structure may include ribs or dot-like protrusions, wherein the ribs may be spirally arranged on the wall of the heat dissipation housing 3 opposite to the first heat dissipation channel 4.

[0033] During operation, the magnetic core 1 generates heat due to hysteresis and eddy current losses. Excessive heat can lead to high core 1 temperatures, causing unstable operation and reduced reliability of the power electronic equipment. Therefore, heat dissipation is necessary for the magnetic core 1. However, existing technologies have low heat dissipation efficiency. To improve this efficiency, in this embodiment, a heat dissipation shell 3 covers at least a portion of the surface of the magnetic core 1. The heat dissipation shell 3 contains a first heat dissipation channel 4. One end of the first heat dissipation channel 4 is used for inputting cooling fluid, and the other end is used for outputting cooling fluid. The cooling fluid passing through the first heat dissipation channel 4 can carry away the heat from the magnetic core 1. Specifically, the fluid can be externally forced to circulate, such as by using a pump to drive the cooling fluid to circulate in the first heat dissipation channel 4, thereby dissipating heat from the magnetic core 1.

[0034] The heat dissipation fluid entering the first heat dissipation channel 4 has a low temperature. The heat dissipation fluid can be either a liquid or a gas.

[0035] The heat sink housing 3 can be made of high thermal conductivity materials such as metal, aluminum nitride ceramic, alumina ceramic, silicon carbide ceramic, or engineering plastics. Ceramic materials, in particular, combine high insulation and corrosion resistance, eliminating the need for an additional insulation layer. They can be arranged close to the winding, achieving a "compact and easily integrated structure," and are suitable for applications with high insulation requirements. The manufacturing processes for the heat sink housing include, but are not limited to, extrusion profiles and casting.

[0036] The cross-sectional shape of the heat dissipation housing 3, which is perpendicular to the axial direction of the first heat dissipation channel 4, can be U-shaped, L-shaped, C-shaped, etc.

[0037] The first heat dissipation channel 4 can be a regular or irregular shape, such as a hole or a slot, and this embodiment does not limit this. It should be noted that the specific form of the hole can be a circular hole, an elliptical hole, a slot-shaped hole, an irregularly shaped hole, etc. Among them, irregularly shaped holes include special shapes such as those with a combination of arc segments and straight segments.

[0038] The number of first heat dissipation channels 4 can be one or more. When the size of the magnetic core 1 is large or the heat source is distributed relatively widely, a design scheme with multiple first heat dissipation channels 4 can be adopted.

[0039] The heat dissipation housing 3 can cover part of the magnetic core or the entire magnetic core.

[0040] Understandably, the heat sink 3 is also covered outside the winding.

[0041] During operation, the temperature of the heat dissipation fluid is low when it flows into the first heat dissipation channel 4. As it flows through the first heat dissipation channel 4, the heat dissipation fluid absorbs heat from part of the surface of the magnetic core 1. The temperature of the heat dissipation fluid when it flows out of the first heat dissipation channel 4 is generally higher than the temperature of the fluid when it flows into the first heat dissipation channel 4.

[0042] In this embodiment, the heat dissipation housing 3 at least covers a portion of the surface of the magnetic core 1; the heat dissipation housing 3 is provided with a first heat dissipation channel 4; one end of the first heat dissipation channel 4 is used for inputting heat dissipation fluid, and the other end is used for outputting heat dissipation fluid. In this way, heat is conducted from the magnetic core 1 to the first heat dissipation channel 4, and then carried to the outside by the heat dissipation fluid in the first heat dissipation channel 4. Furthermore, since a first turbulence structure is provided on the wall of the heat dissipation housing opposite to the first heat dissipation channel, the first turbulence structure can turbulentize the fluid flowing through the first heat dissipation channel, further carrying more heat to the outside by the fluid, thereby reducing the temperature of the magnetic core 1. Since the heat dissipation shell 3 covers at least part of the surface of the magnetic core, and a first heat dissipation channel 4 is provided in the heat dissipation shell 3, a first turbulence structure is provided on the wall of the heat dissipation shell 3 opposite to the first heat dissipation channel 4, one end of the first heat dissipation channel 4 is used to input heat dissipation fluid, and the other end is used to output heat dissipation fluid, which can improve the heat dissipation efficiency of the magnetic core 1. Since the winding 2 is wound on the magnetic core 1, the heat of the winding can also be dissipated through the heat dissipation fluid, that is, the overall heat dissipation efficiency of the magnetic core 1 and the winding is improved, avoiding the problem of low heat dissipation efficiency caused by natural heat dissipation or air cooling for the outer surface of the magnetic core 1 and the winding 2 in the prior art.

[0043] The heat dissipation housing 3 can also be wrapped around the winding 2 to dissipate heat from the winding 2.

[0044] There are many types of magnetic core 1. As a preferred embodiment, such as... Figure 1 , Figure 3 and Figure 4 In the embodiment shown, the magnetic core 1 may include a base 1a, a first side post 1b, a second side post 1c, and a middle post 1d; one end of the first side post 1b, the second side post 1c, and the middle post 1d are respectively disposed on the base 1a; the winding 2 is wound on the middle post 1d; the heat dissipation housing 3 may include a base plate 30, an end plate 31, and a side plate 32, the end plate 31 and the side plate 32 being respectively connected to the base plate 30; the first heat dissipation channel 4 is disposed in the base plate 30, the end plate 31, or the side plate 32.

[0045] In some examples, the end plate 31 and the side plate 32 may be an integral structure; in other examples, the end plate 31 and the side plate 32 may be detachably connected, and a sealing structure may be provided at the assembly point of the two.

[0046] It is understandable that the first side post 1b, the second side post 1c, the middle post 1d, and the base 1a are all magnetically conductive components.

[0047] The first side post 1b and the second side post 1c are respectively perpendicularly arranged on the base 1a, and the first side post 1b and the second side post 1c are parallel to each other. The middle post 1d is arranged between the first side post 1b and the second side post 1c.

[0048] The end plate 31 and side plate 32 of the heat dissipation housing 3 can dissipate heat from the magnetic core. Furthermore, the end plate 31 or side plate 32 with the first heat dissipation channel 4 can further improve the heat dissipation efficiency of the magnetic core.

[0049] Specifically, in some examples, the first turbulence structure can be set on the wall of the first end plate 31a opposite to the first heat dissipation channel 4, so that the fluid flowing through the first heat dissipation channel 4 can be disturbed.

[0050] In other examples, a turbulence channel can also be provided on the wall opposite the second heat dissipation channel in the side plate 32, so that the fluid flowing through the second heat dissipation channel can be disturbed.

[0051] In one embodiment, see Figure 5 and Figure 6 The end plate 31 includes a first end plate 31a. When the first heat dissipation channel 4 is disposed in the first end plate 31a, the first end plate 31a is in contact with the base of the magnetic core. The side plate 32 is provided with a second heat dissipation channel 5, and the side plate 32 is in contact with the side post of the magnetic core. While improving the heat dissipation efficiency of the magnetic core, it does not require additional space inside the equipment. It solves the problem that metal heat conduction parts need to be fixed by brackets and occupy a large space in the prior art. It can flexibly adapt to the design requirements of miniaturized and highly integrated power electronic equipment.

[0052] During the operation of the magnetic core 1, the amount of heat generated varies in different parts of the magnetic core 1, with heat source areas, i.e., areas with more heat. These areas determine whether the magnetic core 1 can operate reliably. To improve reliability, the heat in these areas needs to be removed, i.e., cooled. The areas with more heat in the magnetic core 1 include the central column 1d wound in the winding 2. Therefore, in one embodiment, see... Figure 3 and Figure 7 The central column 1d is provided with a third heat dissipation channel 6, and a heat dissipation pipe 7 is installed in the third heat dissipation channel 6. One end of the heat dissipation pipe 7 is used to input heat dissipation fluid, and the other end is used to output heat dissipation fluid.

[0053] The central column 1d of the magnetic core 1 is a region of concentrated winding and high heat source. Without forced heat dissipation, the heat conduction path of the central column 1d is long, and the central column 1d is prone to becoming a "hot spot," which cannot meet the requirements of high power density equipment. In this embodiment, the heat dissipation pipe 7 can carry away the heat generated in the central column 1d, thus dissipating heat from the central column 1d. This allows the heat source to directly contact the coolant (heat dissipation fluid) in the heat dissipation pipe 7, eliminating the need for indirect heat conduction through the magnetic core 1 body, significantly shortening the heat dissipation path, and solving the problem of difficulty in dissipating heat from the central column 1d and winding 2 in the prior art.

[0054] The heat pipe 7 penetrates the magnetic core to form a built-in "support skeleton," which can offset the thermal expansion and contraction stress of the device during long-term operation, reduce the risk of magnetic core cracking and component loosening, minimize potting expansion, extend the device's service life, and improve structural stability and reliability. A potting compound is provided between the heat pipe 7 and the third heat dissipation channel 6. In this embodiment, the heat pipe 7 penetrates the magnetic core, which can also offset the curing shrinkage stress of the potting compound.

[0055] The heat sink 7 can also have a gap with the third heat dissipation channel 6, or the gap can be filled with thermally conductive adhesive. The heat sink 7 is fixed by setting metal brackets at both ends of the heat sink 7, with sealing rings inside the metal brackets, and the sealing brackets are respectively mounted on the first end plate 31a and the second end plate 31b. The sealing bracket on the first end plate 31a can be an integral structure with the first end plate 31a; the sealing bracket on the second end plate 31b can be an integral structure with the second end plate 31b.

[0056] The combination of the third heat dissipation channel 6 and the heat pipe 7 can accurately position the relative position of the magnetic core and the coil, avoid the offset error of manual assembly, ensure the consistency of core parameters such as magnetoresistive and inductance values ​​of mass-produced devices, reduce performance fluctuations, thereby optimizing magnetic circuit consistency and production controllability, and improving production yield.

[0057] The third heat dissipation channel 6 can be a regular or irregular shape, such as a hole or a slot; this embodiment does not limit this. It should be noted that the hole can specifically be a circular hole, an elliptical hole, a slot-shaped hole, an irregularly shaped hole, etc. Irregularly shaped holes include special shapes such as those with a combination of curved and straight segments.

[0058] The number of third heat dissipation channels 6 can be one or more. When the size of the magnetic core 1 is large or the heat source is distributed relatively widely, a design scheme with multiple third heat dissipation channels 6 can be adopted.

[0059] When heat dissipation is carried out through heat pipe 7, in some examples, a heat dissipation fluid for cooling the central column 1d can be introduced into heat pipe 7. Specifically, it can be a liquid or a gas, that is, heat dissipation is carried out by using a fluid.

[0060] The material of heat pipe 7 can be a thermally conductive material.

[0061] The heat pipe 7 and the third heat dissipation channel 6 can be interference-fitted so that the wall of the heat pipe 7 fits snugly against the interior of the third heat dissipation channel 6. Alternatively, a thermally conductive material such as potting compound can be filled between the heat pipe 7 and the third heat dissipation channel 6. Understandably, a gap may also exist between the heat pipe 7 and the third heat dissipation channel 6.

[0062] To avoid forming a conductive circuit with the magnetic core 1 and the winding, which could induce electromagnetic induction and generate eddy current losses, leading to increased material heating and further mitigating equipment failure risks, in some cases, the heat sink 7 is made of an insulating and thermally conductive material. High-temperature resistant insulating materials such as aluminum nitride ceramics, polytetrafluoroethylene (PTFE), epoxy glass cloth tubes, alumina ceramics (low cost), SiC ceramics (high thermal conductivity and high temperature resistance), high thermal conductivity silicone tubes (flexible fit), and high thermal conductivity plastic tubes (PPS / PEEK, high precision) all meet the requirements of "high temperature resistance + insulation + thermal conductivity," adapting to different costs and operating conditions.

[0063] In an alternative implementation, the heat pipe 7 can be a heat pipe, specifically including a pipe body and a phase change medium disposed in the pipe body, which absorbs heat through phase change and dissipates heat through flow, eliminating the need for an external water circuit and adapting to scenarios without a continuous water supply.

[0064] In embodiments employing heat pipes, the heat pipes can be insulated heat pipes, and the outer shell of the heat pipes can be made of insulating materials such as aluminum nitride ceramic or epoxy glass cloth tubes.

[0065] The heat sink 7 is made of a high thermal conductivity insulating material, which enables direct heat exchange between the central column 1d and the heat sink 7. It quickly conducts the heat generated by the central column 1d of the magnetic core 1, and also takes into account the insulation, which can block the eddy current loop that may be caused by the metal material, prevent the eddy current from generating additional heat and consuming energy, ensure the integrity of the magnetic circuit and the stability of electrical parameters such as the stability of inductance, avoid the decline of device efficiency, avoid equipment failure, and support the stable operation of the equipment.

[0066] In this embodiment, the heat dissipation pipe 7 is disposed in the third heat dissipation channel 6 in the magnetic core 1, that is, the heat dissipation pipe 7 is integrated into the magnetic core 1, and the heat dissipation housing 3 is arranged in close contact with the outer surface of the magnetic core 1 without occupying additional space.

[0067] Heat is conducted from the interior of the central column 1d to the first heat dissipation channel 4, and then carried to the outside through the heat dissipation pipe 7, thereby reducing the temperature of the magnetic core 1. Since the magnetic core 1 is provided with a third heat dissipation channel 6, and the heat dissipation pipe 7 is installed in the third heat dissipation channel 6, the heat dissipation efficiency of the magnetic core 1 can be improved, avoiding the problem of low heat dissipation efficiency caused by natural heat dissipation or air cooling on the outer surface of the magnetic core 1 in the prior art.

[0068] It is understandable that the third heat dissipation channel 6 can be formed in a magnetic core of any shape or at any location within the core. Besides the core structures described in the examples above, in other examples, such as E-type, EE-type (including double-column), EC-type, PQ-type, RM-type, and UF-type cores, a through-hole is formed axially or radially in the core heat source area (column / central magnetic conductor section) as the third heat dissipation channel 6; a C-type core has an opening in the straight core area, where the C-type core is adapted for single-sided winding equipment, and the toroidal core is adapted for low magnetic leakage inductors; a toroidal core has an opening in the radial section; and a U-type core has an opening in the transverse connecting section as the third heat dissipation channel 6. The position of the third heat dissipation channel 6 within the core 1 is based on the premise of not disrupting the magnetic conduction path and being able to cover the heat source.

[0069] In the example where cooling fluid is introduced into the heat pipe 7 to dissipate heat from the magnetic core 1, one port of the heat pipe 7 is used to input the cooling fluid, and the other port is used to output the cooling fluid.

[0070] In this embodiment, on the one hand, the heat in the magnetic core 1 and the winding 2 are conducted from the inside of the central column 1d of the magnetic core 1 to the inner wall of the magnetic core 1 corresponding to the first heat dissipation channel 4, and then are quickly transferred to the coolant flowing inside the heat dissipation pipe 7 through the high thermal conductivity of the heat dissipation pipe 7. The coolant carries the heat to the external heat dissipation system for dissipation. On the other hand, the heat on the outer surface of the magnetic core 1 is absorbed and carried away by the coolant in the liquid cooling channel inside the heat dissipation shell 3 through contact with the heat dissipation shell 3.

[0071] The two heat dissipation methods work together to achieve three-dimensional heat dissipation of the high-frequency transformer and inductor from the inside out, specifically targeting the magnetic core 1 and the winding, significantly improving the overall heat dissipation efficiency. At the same time, the insulating properties of the insulating liquid cooling pipe effectively avoid electromagnetic interference or short circuits between the heat dissipation structure and the magnetic core 1 and the winding.

[0072] It is understood that in some embodiments, a first heat dissipation channel 4 (non-axial) can be opened along the diameter direction of the central column 1d. In particular, opening a first heat dissipation channel 4 along the diameter direction of the central column 1d is suitable for thin devices with limited axial space of the central column 1d.

[0073] When setting the first heat dissipation channel 4, the magnetic connection between the first side column 1b and the middle column 1d and the magnetic connection between the second side column 1c and the middle column 1d are not cut off to ensure the stability of the magnetic path; the heat dissipation pipe 7 is installed radially, and the sealing structure at both ends is adapted to the radial space, so as to still meet the core function of directly contacting the heat source of the middle column 1d.

[0074] In other embodiments, axial through holes can be opened in the first side post 1b and / or the second side post 1c as the first heat dissipation channel 4. In particular, this is applicable to scenarios where the first side post 1b and the second side post 1c are densely wound and become secondary heat source areas (such as multi-winding 2 high-frequency transformers).

[0075] The through holes of the first side post 1b and / or the second side post 1c should be symmetrical (e.g., both middle posts 1d should have holes) to avoid magnetic circuit deviation and to form a "dual heat source heat dissipation" in conjunction with the cooling pipe of the middle post 1d, thereby further improving the overall heat dissipation efficiency.

[0076] In other embodiments, a through hole can be made in the base 1a. Specifically, a hole can be made in a local area of ​​the base 1a near the central column 1d, perpendicular to the plane of the base 1a. This is suitable when the base 1a is in close contact with the heat dissipation substrate and the local temperature is high. When making the hole, care should be taken to ensure that the hole does not affect the magnetic connection between the central column 1d and the base 1a. The sealing structure is sealed and matched with the base 1a, and can be used only as an auxiliary to the liquid cooling of the central column 1d.

[0077] In a preferred embodiment, when a cooling fluid is introduced into the heat sink 7 to dissipate heat from the magnetic core, a second turbulence structure is provided on the inner wall of the heat sink 7.

[0078] The second turbulence structure can turbulentize the fluid flowing through the heat sink 7, thereby carrying away more heat from the magnetic core 1. In some examples, the second turbulence structure may include ribs or dot-like protrusions, wherein the ribs may be spirally arranged on the inner wall of the heat sink 7.

[0079] In one specific example, the heat dissipation fluid may be an aqueous solution of ethylene glycol or a fluorinated liquid.

[0080] See Figure 2 , Figure 4 and Figure 6 In one example, the first end plate 31a is provided with a first main flow channel 8 and a first branch flow channel 9; the first branch flow channel 9 and the first heat dissipation channel 4 are respectively connected to the first main flow channel 8; the first branch flow channel 9 is connected to one end of the heat dissipation pipe 7; and the first heat dissipation channel 4 is connected to the second heat dissipation channel 5.

[0081] The externally supplied heat dissipation fluid flows into the inlet of the first main flow channel 8. A portion of the heat dissipation fluid in the first main flow channel 8 flows into the first branch flow channel 9 and further into the heat dissipation pipe 7. Another portion of the heat dissipation fluid flows into the first heat dissipation channel 4, and the heat dissipation fluid in the first heat dissipation channel 4 flows into the second heat dissipation channel 5.

[0082] It is understandable that a flow channel can also be provided on the outer casing. The flow channel on the outer casing is connected to the first main flow channel 8. The flow channel on the outer casing can serve as a total flow channel, receiving heat dissipation fluid from the outside and further supplying it to the first main flow channel 8.

[0083] In the above embodiments, the first branch flow channel 9 is used to guide the heat dissipation fluid in the first main flow channel 8 into the heat dissipation pipe 7. In order to improve the heat dissipation efficiency, in some examples, the first branch flow channel 9 is arranged opposite to the base 1a.

[0084] The first branch flow channel 9 is positioned opposite to the magnetic core 1, so that the heat dissipation fluid flowing through the first branch flow channel 9 can also dissipate heat from the magnetic core 1.

[0085] The cooling fluid in heat pipe 7 can flow out from the other end of heat pipe 7, and the cooling fluid in the second heat dissipation channel 5 can flow out from the other end. The outflowing cooling fluid can be directly discharged outside the electronic device, or it can flow out through a general outlet. In some examples, see Figure 2 The end plate 31 may also include a second end plate 31b, in which a second main flow channel 10 and a second branch flow channel are provided; the other end of the heat dissipation pipe 7 is connected to the second main flow channel 10 through the second branch flow channel, and the second heat dissipation channel 5 is connected to the second main flow channel 10. In this way, the heat dissipation fluid flowing through the heat dissipation pipe 7 and the second heat dissipation channel 5 converges at one end of the second main flow channel 10 and flows out from the other end of the second main flow channel 10.

[0086] To improve heat dissipation, in some examples, at least two second heat dissipation channels 5 are provided side by side in the side plate 32.

[0087] It is understandable that at least two second heat dissipation channels 5 arranged side by side are connected to the first heat dissipation channel 4.

[0088] For some examples, see Figure 2 The side plate 32 may include a first side plate 32a and a second side plate 32b, which are arranged parallel to each other on the base plate 40. The first side plate 32a corresponds to the first side post 1b of the magnetic core 1, and the second side plate 32b corresponds to the second side post 1c of the magnetic core 1. When both the first side plate 32a and the second side plate 32b are provided with heat dissipation channels, the first side post 1b and the second side post 1c can be cooled respectively.

[0089] In a specific example, a second heat dissipation channel 5 can be provided in the first side plate 32a, and a second heat dissipation channel 5 can also be provided in the second side plate 32b.

[0090] The second heat dissipation channel 5 in the first side plate 32a can be connected to the first heat dissipation channel 4 on the first end plate 31a, so that the heat dissipation fluid in the first heat dissipation channel 4 can flow into the second heat dissipation channel 5 in the first side plate 32a and the second heat dissipation channel 5 in the second side plate 32b respectively.

[0091] Furthermore, multiple second heat dissipation channels 5 can be provided in the first side plate 32a, and multiple second heat dissipation channels 5 can also be provided in the second side plate 32b.

[0092] In one example, multiple second heat dissipation channels 5 in the first side plate 32a can be connected end-to-end to form an S-shaped heat dissipation channel, creating a first total input port and a first total output port; similarly, multiple second heat dissipation channels 5 in the second side plate 32b can also be connected end-to-end to form an S-shaped heat dissipation channel, creating a second total input port and a second total output port. The first and second total input ports are respectively connected to the first heat dissipation channel 4; the first and second total output ports are respectively connected to the second main flow channel 10 on the second end plate 31b.

[0093] In another example, the first end plate is provided with a main input port for introducing external cooling fluid and a main output port for discharging cooling fluid to the outside. One end of the second cooling channel 5 in the first side plate 32a is connected to one end of the second cooling channel 5 in the second side plate 32b through a through hole in the second end plate. The other end of the second cooling channel 5 in the first side plate 32a is connected to the main input port, and the other end of the second cooling channel 5 in the second side plate 32b is connected to the main output port.

[0094] In one embodiment, the other end of the second heat dissipation channel 5 in the first side plate 32a can be connected to the main input port through the first heat dissipation channel.

[0095] To improve sealing and prevent leakage of heat dissipation fluid from affecting heat dissipation efficiency and the reliability of power electronic equipment, in some examples, a sealing structure mounting seat is provided on the end face of the first end plate 31a near the heat dissipation pipe 7. The sealing structure mounting seat is connected to the first branch flow channel 9. A sealing structure is provided on the sealing structure mounting seat and is sleeved on one end of the heat dissipation pipe 7.

[0096] The sealing structure can be a sealing ring such as a silicone sealing ring or a fluororubber sealing ring; specifically, a plastic sealing seat (sealing structure mounting seat) can be set on the first end plate 31a, and the silicone sealing ring can be fitted onto the plastic sealing seat and the silicone sealing ring can be fitted onto the heat dissipation pipe 7. In addition, the sealing ring is used for sealing, which facilitates subsequent disassembly.

[0097] It is understandable that the heat dissipation pipe 7 is connected to the first branch flow channel 9 through the sealing structure mounting base, that is, the heat dissipation fluid flows through the first branch flow channel 9 and the through hole provided in the sealing structure mounting base to flow into the heat dissipation pipe 7.

[0098] In other examples, a sealing structure is provided between one end of the heat pipe 7 and the first branch flow channel 9.

[0099] The sealing structure in this embodiment can also be an adhesive layer, specifically by bonding the heat dissipation pipe 7 to the base 1a of the magnetic core 1 with high-temperature resistant insulating adhesive, sealing the water interface, suitable for long-term fixation, and preventing leakage.

[0100] The sealing structure can also be a quick-connect connector. Specifically, an insulated quick-connect connector (with built-in silicone / fluororubber sealing ring) is inserted into the through hole of the base 1a and connected to one end of the heat dissipation pipe 7 to achieve quick disassembly of the water circuit and facilitate frequent maintenance.

[0101] The sealing structure in this embodiment achieves reliable sealing through professional design, preventing leakage of heat dissipation fluid, ensuring long-term stable operation of the heat dissipation system, and meeting the stringent requirements of industrial-grade equipment for insulation and reliability.

[0102] The sealing structure can also be set at the other end of the heat dissipation pipe 7, which can be connected to the external water circuit to achieve double sealing between the cooling pipe and the magnetic core 1 and the external water circuit.

[0103] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0104] The various embodiments in this specification are described in a related manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0105] The above description is merely a specific embodiment of this application, but the scope of protection of this application is limited.

[0106] This is not the limitation; any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the protection scope of this application. Therefore, the protection scope of this application should be determined by the scope of the claims.

Claims

1. A power electronic device, characterized in that, include: shell; Magnetic core; the magnetic core is disposed in the outer casing; A winding, wherein the winding is wound on the magnetic core; A heat dissipation housing; the heat dissipation housing at least covers a portion of the surface of the magnetic core; The heat dissipation housing is provided with a first heat dissipation channel; a first turbulence structure is provided on the wall of the heat dissipation housing opposite to the first heat dissipation channel; one end of the first heat dissipation channel is used to input heat dissipation fluid, and the other end is used to output heat dissipation fluid. The magnetic core includes a base, a first side post, a second side post, and a middle post; one end of the first side post, the second side post, and the middle post are respectively disposed on the base; the winding is wound on the middle post. The heat dissipation housing includes a base plate, an end plate, and a side plate, wherein the end plate and the side plate are respectively connected to the base plate; the end plate includes a first end plate. The first heat dissipation channel is disposed in the first end plate, and the first end plate is in contact with the base of the magnetic core; The side plate is provided with a second heat dissipation channel, and the side plate is in contact with the side post of the magnetic core; The central column is provided with a third heat dissipation channel, and a heat dissipation pipe is inserted through the third heat dissipation channel. One end of the heat dissipation pipe is used to input heat dissipation fluid, and the other end is used to output heat dissipation fluid. The first end plate is provided with a first main flow channel and a first branch flow channel; The first branch flow channel and the first heat dissipation channel are respectively connected to the first main flow channel; The first branch flow channel is connected to one end of the heat dissipation pipe; the first heat dissipation channel is connected to the second heat dissipation channel.

2. The power electronic device according to claim 1, characterized in that, The inner wall of the heat dissipation pipe is provided with a second turbulence structure.

3. The power electronic device according to claim 1, characterized in that, The first branch flow channel is positioned opposite to the base.

4. The power electronic device according to claim 1, characterized in that, The end plate also includes a second end plate, which has a second main flow channel and a second branch flow channel. The other end of the heat pipe is connected to the second main flow channel through the second branch flow channel; the second heat dissipation channel is connected to the second main flow channel.

5. The power electronic device according to claim 1, characterized in that, The first end plate has a sealing structure mounting seat on its end face near the heat dissipation pipe, and the sealing structure mounting seat is connected to the first branch flow channel; the sealing structure mounting seat has a sealing structure, and the sealing structure is sleeved on one end of the heat dissipation pipe; or, A sealing structure is provided between one end of the heat dissipation pipe and the first branch flow channel.

6. The power electronic device according to claim 1, characterized in that, The heat dissipation pipe is made of an insulating and thermally conductive material.

7. The power electronic device according to claim 1, characterized in that, The side panel has at least two second heat dissipation channels arranged side by side.