Apparatus and method for cooperative transfer of a film carrier in multi-robot semiconductor device handling

Abstract

The application provides a device and a method for cooperative conveying of a film carrier mechanism in a semiconductor device, which comprises a taking and placing module, a moving module and a buffer module. The taking and placing module comprises a taking and placing seat, a first taking and placing assembly and a second taking and placing assembly. The first taking and placing assembly comprises a first taking and placing moving mechanism and a first taking and placing mechanism. The second taking and placing assembly comprises a second taking and placing moving mechanism and a second taking and placing mechanism. The taking and placing position of the first taking and placing mechanism and the taking and placing position of the second taking and placing mechanism are oppositely arranged in the X-axis direction. The buffer module is oppositely arranged with the taking and placing module in the Y-axis direction, and a space is arranged between the taking and placing module and the buffer module. The buffer module comprises a buffer support and a buffer clamping jaw mechanism. The buffer clamping jaw mechanism is arranged on the buffer support, and the clamping direction of the buffer clamping jaw mechanism is arranged towards the taking and placing module. The film carrier mechanism for conveying the semiconductor device has high reliability, and the device utilization rate is high, and the device does not occupy too much space.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a device and method for multi-robot cooperative conveying of a film-carrying mechanism in a semiconductor device. BACKGROUND

[0002] In the back-end packaging process of a semiconductor device, the chips on the wafer after being singulated are usually carried on a blue film with adhesion for subsequent expansion, detection, picking and mounting processes. The blue film carrying the wafer or chips as a whole is usually referred to as a "film-carrying mechanism", which is a key carrier for the flow between processes.

[0003] In a modern semiconductor packaging production line, in order to achieve efficient and continuous production, the film-carrying mechanism needs to be quickly and accurately transferred between different processing equipment, such as from a dicing machine to an expansion machine, and then to a picking and mounting device. Currently, the handling operation mainly relies on two working modes, one is manual handling mode in which an operator manually takes the film-carrying mechanism from one station and places it on the next target station, and the other is automatic handling mode in which a single or multiple robots are introduced. If only a single robot is used, the cycle period is limited by the working efficiency of the robot itself, resulting in low equipment utilization. If multiple robots are used, the occupied area of the equipment will be too large. SUMMARY

[0004] The purpose of the present application is to provide a device and method for multi-robot cooperative conveying of a film-carrying mechanism in a semiconductor device, which has high reliability in conveying the film-carrying mechanism in a semiconductor device and high equipment utilization without occupying too much equipment space.

[0005] To achieve the above purpose, the technical solution of the present application is: a device for multi-robot cooperative conveying of a film-carrying mechanism in a semiconductor device, comprising a taking and placing module, a moving module and a buffer module. The taking and placing module comprises a taking and placing seat, at least one first taking and placing assembly and at least one second taking and placing assembly. The first taking and placing assembly comprises a first taking and placing moving mechanism and a first taking and placing mechanism, and the second taking and placing assembly comprises a second taking and placing moving mechanism and a second taking and placing mechanism. The taking and placing seat is arranged on the moving module, the first taking and placing moving mechanism and the second taking and placing moving mechanism are arranged on the taking and placing seat, the first taking and placing mechanism is arranged on the first taking and placing moving mechanism, the second taking and placing mechanism is arranged on the second taking and placing moving mechanism, and the taking and placing position of the first taking and placing mechanism and the taking and placing position of the second taking and placing mechanism are arranged opposite to each other in the X-axis direction. The taking and placing position of the first taking and placing mechanism is arranged opposite to the material taking area, and the taking and placing position of the second taking and placing mechanism is arranged opposite to the sorting stage. The buffer module is arranged opposite to the taking and placing module in the Y-axis direction, and there is a space between the taking and placing module and the buffer module. The buffer module comprises a buffer support and a buffer gripper mechanism, the buffer gripper mechanism is arranged on the buffer support, and the gripping direction of the buffer gripper mechanism is arranged towards the taking and placing module.

[0006] The above structure, with its first and second pick-and-place mechanisms positioned opposite each other—the first pick-and-place mechanism opposite the material handling area and the second pick-and-place mechanism opposite the sorting platform—along with a buffer module opposite the pick-and-place module, allows for multi-arm collaborative transport of semiconductor device carrier films. In operation, the first pick-and-place mechanism moves towards the material handling area and pulls the carrier film containing the semiconductor device out. Then, it moves in the opposite direction to transport the carrier film into the space. Next, a moving module moves the carrier film towards the buffer module, where it is gripped by a buffer gripper mechanism. The first pick-and-place mechanism then releases its grip, and the second pick-and-place mechanism grips the carrier film again. Finally, the second pick-and-place mechanism inserts the carrier film into the sorting platform. This device, through the coordinated action of the first pick-and-place mechanism, the second pick-and-place mechanism and the buffer gripper mechanism, reliably transfers the film carrier mechanism located on one side of the device to the sorting platform on the other side within a small space, resulting in high equipment utilization and minimal space occupation.

[0007] The device of the present invention, through the coordinated action of the first pick-and-place mechanism, the second pick-and-place mechanism and the buffer gripper mechanism, reliably transfers the film carrier mechanism located on one side of the device to the sorting stage on the other side in a small space, thereby achieving high equipment utilization and not occupying too much equipment space.

[0008] Furthermore, the moving module includes a Y-axis linear module and a Z-axis linear module. The pick-and-place module is slidably disposed on the Z-axis linear module and can move along the Z-axis direction. The Z-axis linear module is slidably disposed on the Y-axis linear module and can move along the Y-axis direction.

[0009] The above setup uses a Y-axis linear module and a Z-axis linear module to form a moving module to drive the entire pick-and-place module, enabling the pick-and-place module to move in the horizontal and vertical directions, making it easier for the pick-and-place module to reach the required position.

[0010] Further, the first pick-and-place moving mechanism comprises a first pick-and-place motor, a first pick-and-place driving wheel, a first pick-and-place driven wheel and a first pick-and-place belt. The first pick-and-place motor is installed on the pick-and-place seat. The first pick-and-place driving wheel is rotatably installed on one end of the pick-and-place seat. The output shaft of the first pick-and-place motor is connected with the first pick-and-place driving wheel. The first pick-and-place driven wheel is rotatably installed on the other end of the pick-and-place seat. The first pick-and-place belt is sleeved between the first pick-and-place driving wheel and the first pick-and-place driven wheel. The second pick-and-place moving mechanism comprises a second pick-and-place motor, a second pick-and-place driving wheel, a second pick-and-place driven wheel and a second pick-and-place belt. The second pick-and-place motor is installed on the pick-and-place seat. The second pick-and-place driving wheel is rotatably installed on one end of the pick-and-place seat. The output shaft of the second pick-and-place motor is connected with the second pick-and-place driving wheel. The second pick-and-place driven wheel is rotatably installed on the other end of the pick-and-place seat. The second pick-and-place belt is sleeved between the second pick-and-place driving wheel and the second pick-and-place driven wheel.

[0011] With the above arrangement, the first pick-and-place motor drives the first pick-and-place driving wheel to rotate, thereby driving the first pick-and-place belt to move, so as to drive the first pick-and-place mechanism to move in the X-axis direction. The second pick-and-place motor drives the second pick-and-place driving wheel to rotate, thereby driving the second pick-and-place belt to move, so as to drive the second pick-and-place mechanism to move in the X-axis direction.

[0012] Further, the first pick-and-place mechanism comprises a first hand bottom plate, a first hand finger, a first clamping jaw base, a first clamping driving and a first clamping jaw fixing plate. The first clamping jaw fixing plate is slidably arranged on the pick-and-place seat and connected with the first pick-and-place moving mechanism. The first hand bottom plate is arranged on the first clamping jaw fixing plate. The first clamping jaw base is arranged on the first hand bottom plate. The first clamping driving is arranged on the first clamping jaw base. The first hand finger is arranged on the output shaft of the first clamping driving. A first clamping gap is formed between the first hand bottom plate and the first hand finger. The pick-and-place position of the first pick-and-place mechanism is located on one side of the first clamping gap. The second pick-and-place mechanism comprises a second hand bottom plate, a second hand finger, a second clamping jaw base, a second clamping driving and a second clamping jaw fixing plate. The second clamping jaw fixing plate is slidably arranged on the pick-and-place seat and connected with the second pick-and-place moving mechanism. The second hand bottom plate is arranged on the second clamping jaw fixing plate. The second clamping jaw base is arranged on the second hand bottom plate. The second clamping driving is arranged on the second clamping jaw base. The second hand finger is arranged on the output shaft of the second clamping driving. A second clamping gap is formed between the second hand bottom plate and the second hand finger. The pick-and-place position of the second pick-and-place mechanism is located on one side of the second clamping gap.

[0013] When the first clamping drive works, the first clamping drive drives the first hand finger to move, and the first hand finger and the first hand bottom plate act on the film carrying mechanism to clamp and release the film carrying mechanism, so that reliable clamping and conveying of the film carrying mechanism can be realized.

[0014] Further, the first hand bottom plate is arranged in an arc shape on one side of the first clamping gap; and the second hand bottom plate is arranged in an arc shape on one side of the second clamping gap.

[0015] With the above arrangement, generally, the film carrying mechanism has a circular shape, and when the one side of the first hand bottom plate and the second hand bottom plate is arranged in an arc shape, the first hand bottom plate and the second hand bottom plate can better dock with the shape of the film carrying mechanism when the film carrying mechanism is taken out or placed.

[0016] Further, the first hand bottom plate is arranged in an arc shape on one side of the first clamping gap; and the second hand bottom plate is arranged in an arc shape on one side of the second clamping gap.

[0017] With the above arrangement, when the film carrying mechanism is taken out or placed, the first inclined surface and the second inclined surface can guide the film carrying mechanism when it enters the first taking and placing mechanism and the second taking and placing mechanism.

[0018] Further, the buffer clamping jaw mechanism comprises a buffer hand bottom plate, a buffer hand finger, a buffer clamping jaw base, a buffer clamping drive, and a buffer clamping jaw fixing plate, the buffer clamping jaw fixing plate is arranged on the buffer rack, the buffer clamping jaw base is arranged on the buffer clamping jaw fixing plate, the buffer clamping drive is arranged on the buffer clamping jaw base, the buffer hand finger is arranged on the output shaft of the buffer clamping drive, and the buffer clamping gap is arranged between the buffer hand bottom plate and the buffer hand finger.

[0019] With the above arrangement, when the buffer clamping drive works, the buffer hand finger can be driven to move, and the buffer hand finger and the buffer hand bottom plate act on the film carrying mechanism to clamp and release the film carrying mechanism, so that reliable clamping and conveying of the film carrying mechanism can be realized.

[0020] Further, the buffer clamping jaw mechanism is arranged on the buffer support and slides in the Y-axis direction, and a transverse driving mechanism is arranged between the buffer support and the buffer clamping jaw mechanism.

[0021] With the above arrangement, the buffer clamping jaw mechanism can be driven to move transversely by arranging the transverse driving mechanism, so as to realize position adjustment of the buffer clamping jaw mechanism in the transverse direction and accurate docking of the buffer clamping jaw mechanism with the first taking and placing mechanism and the second taking and placing mechanism.

[0022] Further, the first pick-and-place assembly and the second pick-and-place assembly are arranged in a staggered manner in the Z-axis direction; the buffer gripper mechanism is provided with two or more than two, and the buffer gripper mechanisms are arranged in a staggered manner in the Z-axis direction.

[0023] With the above arrangement, the first pick-and-place assembly and the second pick-and-place assembly are arranged in a staggered manner, so as to avoid mutual interference of the first pick-and-place assembly and the second pick-and-place assembly. By providing two or more than two buffer gripper mechanisms, the buffer positions can be increased, so as to improve the conveying efficiency of the film carrying mechanism.

[0024] The application further provides a method for cooperatively conveying a film carrying mechanism in a semiconductor device by multiple robot arms, comprising the following steps:

[0025] S1. The first pick-and-place assembly is moved by the movement module, so that the pick-and-place position of the first pick-and-place mechanism is aligned with the film carrying mechanism to be taken out in the material taking area.

[0026] S2. The first pick-and-place mechanism is moved towards the material taking area by the first pick-and-place movement mechanism, and the film carrying mechanism to be taken out in the material taking area is clamped and taken out by the first pick-and-place mechanism.

[0027] S3. The first pick-and-place mechanism is moved in the reverse direction by the first pick-and-place movement mechanism.

[0028] S4. The first pick-and-place mechanism with the clamped film carrying mechanism is moved towards the buffer module by the movement module, and the film carrying mechanism is clamped by the buffer gripper mechanism, and the first pick-and-place mechanism releases the film carrying mechanism.

[0029] S5. The other side of the film carrying mechanism is clamped by the second pick-and-place mechanism, and the clamping of the film carrying mechanism by the buffer gripper mechanism is released.

[0030] S6. The film carrying mechanism is inserted into the sorting stage by the second pick-and-place movement mechanism and the second pick-and-place mechanism.

[0031] With the above method, the film carrying mechanism located on one side of the device is reliably transferred to the sorting stage on the other side in a small space by the cooperative action of the first pick-and-place mechanism, the second pick-and-place mechanism and the buffer gripper mechanism, so that the utilization rate of the equipment is high, and the equipment space is not occupied. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 A schematic view of a device for cooperatively conveying a film carrying mechanism in a semiconductor device, a film carrying device and a sorting stage.

[0033] Figure 2 A schematic view of a film carrying mechanism.

[0034] Figure 3 A schematic view of the structure of the application.

[0035] Figure 4 is a side view of the present application.

[0036] Figure 5 is a structural schematic diagram of another angle of the present application.

[0037] Figure 6 is a structural schematic diagram of a third perspective of the present application.

[0038] Figure 7 is a structural schematic diagram of a pick-and-place module of the present application.

[0039] Figure 8 is a Figure 7 is an enlarged view of A in the middle.

[0040] Figure 9 is a Figure 7 is an enlarged view of B in the middle.

[0041] Figure 10 is a structural schematic diagram of a cache module of the present application.

[0042] Figure 11 is a Figure 10 is an enlarged view of C in the middle.

[0043] BRIEF DESCRIPTION OF THE DRAWINGS

[0044] b1 - pick-and-place module; b10 - pick-and-place seat; b11 - first pick-and-place assembly; b100 - space; b111 - first pick-and-place moving mechanism; b112 - first pick-and-place mechanism; b1111 - first pick-and-place motor; b1112 - first pick-and-place belt; b1113 - first linear guide rail; b1114 - first slider; b1121 - first gripper bottom plate; b1122 - first gripper finger; b1123 - first gripper base; b1124 - first clamping drive; b1125 - first gripper fixed plate; b1126 - first gripper sensor; b12 - second pick-and-place assembly; b121 - second pick-and-place moving mechanism; b1211 - second pick-and-place motor; b1212 - second pick-and-place belt; b1213 - second linear guide rail; b1214 - second slider; b122 - second pick-and-place mechanism; b1221 - second gripper bottom plate; b1222 - second gripper finger; b1223 - second gripper base; b1224 - second clamping drive; b1225 - second gripper fixed plate; b1226 - second gripper sensor; b1227 - second clamping gap; b2 - moving module; b21 - Y-axis linear module; b22 - Z-axis linear module; b200 - material loading device; b3 - buffer module; b31 - buffer support; b32 - buffer gripper mechanism; b300 - sorting stage; b321 - buffer gripper bottom plate; b322 - buffer gripper finger; b323 - buffer gripper base; b324 - buffer limiting plate; b325 - buffer gripper sensor; b326 - buffer gripper fixed plate; b327 - buffer clamping drive; b328 - buffer clamping gap; b33 - third linear guide rail; b34 - transverse driving mechanism; b400 - film loading mechanism; b401 - ring; b402 - film; b403 - semiconductor device. DETAILED DESCRIPTION

[0045] The application will be further described in detail below in conjunction with the drawings and specific embodiments.

[0046] As Figure 1As shown, the device for cooperatively conveying the film carrier mechanism in the semiconductor device among multiple robot arms transfers the film carrier mechanism carrying the semiconductor device in the taking area to the sorting stage b300 and transfers the film carrier mechanism in the sorting stage b300 from which the semiconductor device has been taken to the taking area. In the embodiment, the taking area is arranged in the carrier device b200, which is used for loading the film carrier mechanism b400 with semiconductor devices and recycling the film carrier mechanism b400 returned from the sorting stage b300; the carrier device b200 can load multiple layers of film carrier mechanisms b400 and drive the film carrier mechanism b400 to rise through the lifting mechanism, so as to facilitate the device for cooperatively conveying the film carrier mechanism in the semiconductor device among multiple robot arms to take and place the film carrier mechanism b400; in the present application, the carrier device b200 belongs to the prior art, and its specific structure will not be described here. In the embodiment, the sorting stage b300 adopts the structure of application No. 202510569244.X. In the embodiment, the carrier device b200 is located on one side of the device for cooperatively conveying the film carrier mechanism in the semiconductor device among multiple robot arms in the X direction, and the sorting stage b300 is located on the other side of the device for cooperatively conveying the film carrier mechanism in the semiconductor device among multiple robot arms in the X direction.

[0047] As shown in Figure 2 , the film carrier mechanism b400 includes a ring b401 and a film b402. In the embodiment, the ring b401 refers to a metal ring or a plastic ring for clamping the film b402. The film b402 can be a blue film or other film for carrying semiconductor devices b403. In the embodiment, the semiconductor device is a chip.

[0048] As shown in Figure 1 , Figure 3 , and Figure 4 , the device for cooperatively conveying the film carrier mechanism in the semiconductor device among multiple robot arms includes a taking and placing module b1, a moving module b2, and a buffer module b3.

[0049] As shown in Figures 5 to 7 , the taking and placing module b1 includes a taking and placing seat b10, at least one first taking and placing assembly b11, and at least one second taking and placing assembly b12. The first taking and placing assembly b11 includes a first taking and placing moving mechanism b111 and a first taking and placing mechanism b112, and the second taking and placing assembly b12 includes a second taking and placing moving mechanism b121 and a second taking and placing mechanism b122. The buffer module b3 includes a buffer support b31 and a buffer clamping jaw mechanism b32.

[0050] As shown in Figure 6 , Figure 7 , and Figure 9As shown, the first pick-and-place moving mechanism b111 includes a first pick-and-place motor b1111, a first pick-and-place driving wheel, a first pick-and-place driven wheel, and a first pick-and-place belt b1112. The first pick-and-place motor b1111 is mounted on the pick-and-place seat b10. The first pick-and-place driving wheel is mounted on one end of the pick-and-place seat b10 through a first rotating shaft and a bearing, and rotates with the first rotating shaft. The output shaft of the first pick-and-place motor b1111 is connected with the first rotating shaft. The first pick-and-place driven wheel is mounted on the other end of the pick-and-place seat b10 through a second rotating shaft and a bearing, and rotates with the second rotating shaft. The first pick-and-place belt b1112 is sleeved between the first pick-and-place driving wheel and the first pick-and-place driven wheel. A first linear guide rail b1113 is mounted on the pick-and-place seat b10. The first pick-and-place mechanism b112 is provided with a first sliding block b1114 which slides on the first linear guide rail b1113.

[0051] As shown, Figure 9 The first pick-and-place mechanism b112 includes a first hand bottom plate b1121, a first hand finger b1122, a first clamping jaw base b1123, a first clamping driving b1124, a first clamping jaw fixing plate b1125, and a first clamping jaw sensor b1126. The first clamping jaw fixing plate b1125 is fixed on the first sliding block b1114. The first clamping jaw fixing plate b1125 is fixed on the first pick-and-place belt b1112. The first hand bottom plate b1121 is fixed on the first clamping jaw fixing plate b1125. The first clamping jaw base b1123 is fixed on the first hand bottom plate b1121. The first clamping driving b1124 is mounted on the first clamping jaw base b1123. In this embodiment, the first clamping driving b1124 is a thin air cylinder. The first hand finger b1122 is arranged on the output shaft of the first clamping driving b1124. In this embodiment, the first hand finger b1122 is fixed on the output shaft of the first clamping driving b1124. One end of the first hand finger b1122 extends out of the first clamping jaw base b1123. A first clamping gap is formed between the first hand bottom plate b1121 and the first hand finger b1122. The first pick-and-place mechanism b112 is located on one side of the first clamping gap, which is the pick-and-place position of the first pick-and-place mechanism b112. The first clamping jaw sensor b1126 is mounted on the first hand bottom plate b1121 and located on one side of the first clamping jaw base b1123. The first clamping jaw sensor b1126 is used to sense whether the film loading mechanism b400 has been positioned.

[0052] In the embodiment, when the first pick-and-place motor b1111 works, the first pick-and-place motor b1111 drives the first pick-and-place driving wheel to rotate, the first pick-and-place driving wheel drives the first pick-and-place belt b1112 to move, so as to drive the first clamping jaw fixing plate b1125 to move in the X-axis direction, the first clamping jaw fixing plate b1125 drives the first supporting hand bottom plate b1121, the first supporting hand finger b1122, the first clamping jaw base b1123, the first clamping driving b1124 and the first clamping jaw sensor b1126 to move in the X-axis direction. In the movement process, the first sliding block b1114 moves on the first linear guide rail b1113 to guide the movement of the first clamping jaw fixing plate b1125.

[0053] In the embodiment, when the first clamping driving b1124 works, the first clamping driving b1124 drives the first supporting hand finger b1122 to move relative to the first supporting hand bottom plate b1121, when the first supporting hand finger b1122 moves towards the first supporting hand bottom plate b1121, the first clamping gap becomes smaller, so as to clamp the edge of the film carrying mechanism b400, when the first supporting hand finger b1122 moves away from the first supporting hand bottom plate b1121, the first clamping gap becomes larger, so as to release the film carrying mechanism b400.

[0054] As shown in Figure 6 , Figure 7 and Figure 8 , the second pick-and-place moving mechanism b121 includes a second pick-and-place motor b1211, a second pick-and-place driving wheel, a second pick-and-place driven wheel and a second pick-and-place belt b1212, the second pick-and-place motor b1211 is installed on the pick-and-place seat b10, the second pick-and-place driving wheel is installed on one end of the pick-and-place seat b10 through a third rotating shaft and a bearing, the second pick-and-place driving wheel rotates together with the third rotating shaft, the output shaft of the second pick-and-place motor b1211 is connected with the third rotating shaft, the second pick-and-place driven wheel is installed on the other end of the pick-and-place seat b10 through a fourth rotating shaft and a bearing, the second pick-and-place driven wheel rotates together with the fourth rotating shaft, the second pick-and-place belt b1212 is sleeved between the second pick-and-place driving wheel and the second pick-and-place driven wheel. The second linear guide rail b1213 is installed on the pick-and-place seat b10, the second sliding block b1214 is arranged on the second linear guide rail b1213 and slides.

[0055] As shown in Figure 8As shown, the second pick-and-place mechanism b122 includes a second hand bottom plate b1221, a second hand finger b1222, a second jaw base b1223, a second clamping drive b1224, a second jaw fixing plate b1225 fixed on the second sliding block b1214, a second jaw fixing plate b1225 fixed on the second pick-and-place belt b1212, the second hand bottom plate b1221 fixed on the second jaw fixing plate b1225, the second jaw base b1223 fixed on the second hand bottom plate b1221, the second clamping drive b1224 installed on the second jaw base b1223, in this embodiment, the second clamping drive b1224 is a thin air cylinder, the second hand finger b1222 is arranged on the output shaft of the second clamping drive b1224, in this embodiment, the second hand finger b1222 is fixed on the output shaft of the second clamping drive b1224, one end of the second hand finger b1222 extends out of the second jaw base b1223, a second clamping gap b1227 is formed between the second hand bottom plate b1221 and the second hand finger b1222, the second pick-and-place mechanism b122 is located on one side of the second clamping gap b1227, which is the pick-and-place position of the second pick-and-place mechanism b122, and the second jaw sensor b1226 is installed on the second hand bottom plate b1221 and located on one side of the second jaw base b1223, which is used to sense whether the film carrying mechanism b400 has been positioned.

[0056] In this embodiment, when the second pick-and-place motor b1211 works, the second pick-and-place motor b1211 drives the second pick-and-place driving wheel to rotate, the second pick-and-place driving wheel drives the second pick-and-place belt b1212 to move, so as to drive the second jaw fixing plate b1225 to move in the X-axis direction, and the second jaw fixing plate b1225 drives the second hand bottom plate b1221, the second hand finger b1222, the second jaw base b1223, the second clamping drive b1224 and the second jaw sensor b1226 to move in the X-axis direction. In this movement process, the second sliding block b1214 moves on the second linear guide rail b1213 to guide the movement of the second jaw fixing plate b1225.

[0057] In this embodiment, when the second clamping drive b1224 works, the second clamping drive b1224 drives the second hand finger b1222 to move relative to the second hand bottom plate b1221, when the second hand finger b1222 moves towards the second hand bottom plate b1221, the second clamping gap b1227 becomes smaller, so as to clamp the edge of the film carrying mechanism b400, and when the second hand finger b1222 moves away from the second hand bottom plate b1221, the second clamping gap b1227 becomes larger, so as to release the film carrying mechanism b400.

[0058] AsFigure 7 As shown, the first hand support bottom plate b1121 is arranged in an arc shape on one side of the first clamping seam; the second hand support bottom plate b1221 is arranged in an arc shape on one side of the second clamping seam b1227. As shown, Figure 2 As shown, the shape of the film loading mechanism b400 is generally circular. When one side of the first hand support bottom plate b1121 and the second hand support bottom plate b1221 is arranged in an arc shape, the first hand support bottom plate b1121 and the second hand support bottom plate b1221 can better dock with the shape of the film loading mechanism b400 when taking and placing the film loading mechanism b400, facilitating clamping of the ring b401 of the film loading mechanism b400.

[0059] As shown, Figure 7 As shown, the first hand support bottom plate b1121 is arranged in an arc shape on one side of the first clamping seam; the second hand support bottom plate b1221 is arranged in an arc shape on one side of the second clamping seam b1227. As shown,

[0060] As shown, Figure 3 As shown, the movement module b2 includes a Y-axis linear module b21 and a Z-axis linear module b22, the taking and placing module b1 is slidingly arranged on the Z-axis linear module b22 and can move along the Z-axis direction, the Z-axis linear module b22 is slidingly arranged on the Y-axis linear module b21 and can move along the Y-axis direction, the taking and placing module b1 is slidingly connected to the Z-axis linear module b22, when the Z-axis linear module b22 moves on the Y-axis linear module b21, the taking and placing module b1 moves on the Y-axis at the same time, and the taking and placing module b1 can move on the Z-axis linear module b22, so that the taking and placing module b1 can move along the Y-axis and Z-axis directions at the same time without occupying too much equipment area. In this embodiment, the Y-axis linear module b21 and the Z-axis linear module b22 both adopt an existing motor, screw, and nut structure.

[0061] The buffer clamping jaw mechanism b32 is arranged on the buffer support b31, and the clamping direction of the buffer clamping jaw mechanism b32 faces the taking and placing module b1. As shown, Figure 10 and Figure 11As shown, the third linear guide rail b33 extending along the X-axis direction is arranged on the buffer support b31, the third slider sliding on the third linear guide rail b33 is arranged, the transverse driving mechanism b34 is arranged between the buffer support b31 and the buffer clamp jaw mechanism b32, and the transverse driving mechanism b34 is a pneumatic cylinder in the embodiment, so that the buffer clamp jaw mechanism b32 is driven to move in the X-axis direction, and the position of the buffer clamp jaw mechanism b32 in the X-axis direction is changed. The buffer clamp jaw mechanism b32 includes a buffer holder bottom plate b321, a buffer holder finger b322, a buffer clamp jaw base b323, a buffer limiting plate b324, a buffer clamp jaw sensor b325, a buffer clamp jaw fixing plate b326, and a buffer clamping drive b327. One end of the buffer clamp jaw fixing plate b326 is fixed on the third slider, the buffer holder bottom plate b321 is fixed on the buffer clamp jaw fixing plate b326, the buffer clamp jaw base b323 is fixed on the buffer holder bottom plate b321 by bolts, the buffer clamping drive b327 is installed on the buffer base b323, one end of the buffer holder finger b322 extends out of the buffer clamp jaw base b323, the buffer limiting plate b324 is installed on the buffer holder finger b322 and is used for limiting the film carrying mechanism b400, the buffer clamp jaw sensor b325 is installed on the buffer holder bottom plate b321 and is located on one side of the buffer clamp jaw base b323 and is used for detecting whether the film carrying mechanism b400 is in place. The buffer clamping gap b328 is formed between the buffer holder bottom plate b321 and the buffer holder finger b322. In the embodiment, when the buffer clamping drive b327 works, the buffer clamping drive b327 drives the buffer holder finger b322 to move relative to the buffer holder bottom plate b321. When the buffer holder finger b322 moves towards the buffer holder bottom plate b321, the buffer clamping gap b328 becomes smaller, so that the edge of the film carrying mechanism b400 can be clamped. When the buffer holder finger b322 moves away from the buffer holder bottom plate b321, the buffer clamping gap b328 becomes larger, so that the film carrying mechanism b400 can be released.

[0062] In the application, the taking and placing position of the first taking and placing mechanism b112 and the taking and placing position of the second taking and placing mechanism b122 are arranged opposite to each other in the X-axis direction. The taking and placing position of the first taking and placing mechanism b112 is arranged opposite to the material taking area, and the taking and placing position of the second taking and placing mechanism b122 is arranged opposite to the sorting stage b300. The buffer module b3 and the taking and placing module b1 are arranged opposite to each other in the Y-axis direction, and the space b100 is formed between the taking and placing module b1 and the buffer module b3. The clamping direction of the buffer clamp jaw mechanism b32 is arranged towards the taking and placing module b1, and the buffer clamp jaw mechanism b32 is provided with two or more than two.

[0063] In the embodiment, the first pick-and-place assembly b11 is provided with one, the second pick-and-place assembly b12 is provided with one, the first pick-and-place assembly b11 and the second pick-and-place assembly b12 are arranged in a staggered manner in the Z-axis direction, the buffer gripper mechanism b32 is provided with two, and the two buffer gripper mechanisms b32 are arranged in a staggered manner in the Z-axis direction. The above arrangement can reduce the mutual interference of the first pick-and-place assembly b11 and the second pick-and-place assembly b12, and the first pick-and-place assembly b11 and the second pick-and-place assembly b12 can realize independent work in the X-axis direction; the two buffer gripper mechanisms b32 arranged in a staggered manner in the Z-axis direction can also realize independent work of the buffer gripper mechanism b32 without mutual interference.

[0064] The method for the mechanical arm to cooperate with the conveying film carrier mechanism in the semiconductor device is realized by the device for the mechanical arm to cooperate with the conveying film carrier mechanism in the semiconductor device, and includes the following steps:

[0065] S1, the first pick-and-place assembly b11 is moved by the moving module b2 to align the pick-and-place position of the first pick-and-place mechanism b112 with the film carrier mechanism b400 to be taken out in the material taking area. Specifically, according to the position of the film carrier mechanism b400 to be taken out from the material conveying device b200, the Y-axis linear module b21 and the Z-axis linear module b22 are started to align the first pick-and-place mechanism b112 with the film carrier mechanism b400, that is, to align the first clamping slot with the film carrier mechanism b400.

[0066] S2, the first pick-and-place mechanism b112 is moved towards the material taking area by the first pick-and-place moving mechanism b111, and the film carrier mechanism b400 to be taken out in the material taking area is clamped and taken out by the first pick-and-place mechanism b112.

[0067] S3, the first pick-and-place mechanism b112 is moved in the reverse direction by the first pick-and-place moving mechanism b111.

[0068] S4, the pick-and-place module b1 clamping the film carrier mechanism b400 is moved towards the buffer module b3 by the moving module b2, the film carrier mechanism b400 is clamped by the buffer gripper mechanism b32, and the first pick-and-place mechanism b112 releases the film carrier mechanism b400.

[0069] S5, the other side of the film carrier mechanism b400 is clamped by the second pick-and-place mechanism b122, and the clamping of the film carrier mechanism b400 by the buffer gripper mechanism b32 is released.

[0070] S6, the film carrier mechanism b400 is inserted into the sorting stage b300 by the second pick-and-place moving mechanism b121 and the second pick-and-place mechanism b122.

[0071] Of course, the used film carrier mechanism b400 can also be conveyed and transferred into the material conveying device b200, and the steps are as follows:

[0072] S11, the second pick-and-place assembly b12 is driven by the moving module b2 to move, so that the pick-and-place position of the second pick-and-place mechanism b122 is opposite to the film carrier mechanism b400 that needs to be picked out in the sorting platform b300. Specifically, according to the position of the film carrier mechanism b400 that needs to be picked out in the sorting platform b300, the Y-axis linear module b21 and the Z-axis linear module b22 are started to align the second pick-and-place mechanism b122 with the film carrier mechanism b400, that is, to align the second clamping slot b1227 with the film carrier mechanism b400.

[0073] S12, the second pick-and-place mechanism b122 is driven by the second pick-and-place moving mechanism b121 to move towards the sorting platform b300, and the film carrier mechanism b400 that needs to be picked out in the sorting platform b300 is clamped and picked out by the second pick-and-place mechanism b122.

[0074] S13, the second pick-and-place mechanism b122 is driven by the second pick-and-place moving mechanism b121 to move reversely.

[0075] S14, the pick-and-place module b1 clamping the film carrier mechanism b400 is driven by the moving module b2 to move towards the buffer module b3, and the film carrier mechanism b400 is clamped by the buffer clamping jaw mechanism b32, and the second pick-and-place mechanism b122 releases the film carrier mechanism b400.

[0076] S15, the other side of the film carrier mechanism b400 is clamped by the first pick-and-place mechanism b112, and the clamping of the film carrier mechanism b400 by the buffer clamping jaw mechanism b32 is released.

[0077] S16, the film carrier mechanism b400 is inserted into the carrier device b200 by the first pick-and-place moving mechanism b111 and the first pick-and-place mechanism b112.

[0078] In this embodiment, when two buffer clamping jaw mechanisms b32 are provided, the film carrier mechanism b400 can be transported to the sorting platform b300 and the carrier device b200 at the same time, so the efficiency is high.

[0079] The device and method of the application can reliably transfer the film carrier mechanism b400 located on one side of the device to the sorting platform b300 on the other side in a small space through the cooperation of the first pick-and-place mechanism, the second pick-and-place mechanism and the buffer clamping jaw mechanism, so that the utilization rate of the equipment is high and the equipment space is not occupied.

Claims

1. A device for the collaborative transport of a carrier film mechanism in a semiconductor device using multiple robotic arms, characterized in that: The device comprises a taking and placing module, a moving module and a buffer module; the taking and placing module comprises a taking and placing seat, at least one first taking and placing assembly and at least one second taking and placing assembly, the first taking and placing assembly comprises a first taking and placing moving mechanism and a first taking and placing mechanism, the second taking and placing assembly comprises a second taking and placing moving mechanism and a second taking and placing mechanism, the taking and placing seat is arranged on the moving module, the first taking and placing moving mechanism and the second taking and placing moving mechanism are arranged on the taking and placing seat, the first taking and placing mechanism is arranged on the first taking and placing moving mechanism, the second taking and placing mechanism is arranged on the second taking and placing moving mechanism, and the taking and placing position of the first taking and placing mechanism and the taking and placing position of the second taking and placing mechanism are arranged opposite to each other in the X-axis direction; the taking and placing position of the first taking and placing mechanism is arranged opposite to the material taking area, and the taking and placing position of the second taking and placing mechanism is arranged opposite to the sorting stage; The buffer module is arranged opposite to the taking and placing module in the Y-axis direction, and a space is arranged between the taking and placing module and the buffer module; the buffer module comprises a buffer support and a buffer clamping jaw mechanism, the buffer clamping jaw mechanism is arranged on the buffer support, and the clamping direction of the buffer clamping jaw mechanism is arranged towards the taking and placing module; through the cooperation of the first taking and placing mechanism, the second taking and placing mechanism and the buffer clamping jaw mechanism, the film carrying mechanism on one side of the device is transferred to the sorting stage on the other side.

2. The apparatus of claim 1, wherein the plurality of robots are configured to cooperate to transport the film in the semiconductor device manufacturing process. The moving module comprises a Y-axis linear module and a Z-axis linear module, the taking and placing module is slidably arranged on the Z-axis linear module and can move along the Z-axis direction, and the Z-axis linear module is slidably arranged on the Y-axis linear module and can move along the Y-axis direction.

3. The apparatus of claim 1, wherein the plurality of robots are configured to cooperate to transport the film carrier mechanism. The first taking and placing moving mechanism comprises a first taking and placing motor, a first taking and placing driving wheel, a first taking and placing driven wheel and a first taking and placing belt, the first taking and placing motor is mounted on the taking and placing seat, the first taking and placing driving wheel is rotatably mounted on one end of the taking and placing seat, the output shaft of the first taking and placing motor is connected with the first taking and placing driving wheel, the first taking and placing driven wheel is rotatably mounted on the other end of the taking and placing seat, and the first taking and placing belt is sleeved between the first taking and placing driving wheel and the first taking and placing driven wheel; the second taking and placing moving mechanism comprises a second taking and placing motor, a second taking and placing driving wheel, a second taking and placing driven wheel and a second taking and placing belt, the second taking and placing motor is mounted on the taking and placing seat, the second taking and placing driving wheel is rotatably mounted on one end of the taking and placing seat, the output shaft of the second taking and placing motor is connected with the second taking and placing driving wheel, the second taking and placing driven wheel is rotatably mounted on the other end of the taking and placing seat, and the second taking and placing belt is sleeved between the second taking and placing driving wheel and the second taking and placing driven wheel.

4. The apparatus according to claim 1 or 3, wherein the plurality of robots are arranged to cooperate with each other to transport the film in the semiconductor device manufacturing process. The first pick-and-place mechanism comprises a first hand bottom plate, a first hand finger, a first clamping jaw base, a first clamping drive and a first clamping jaw fixing plate. The first clamping jaw fixing plate is slidably arranged on the pick-and-place seat and connected with the first pick-and-place moving mechanism. The first hand bottom plate is arranged on the first clamping jaw fixing plate. The first clamping jaw base is arranged on the first hand bottom plate. The first clamping drive is arranged on the first clamping jaw base. The first hand finger is arranged on the output shaft of the first clamping drive. A first clamping gap is formed between the first hand bottom plate and the first hand finger. The side of the first pick-and-place mechanism located at the first clamping gap is the pick-and-place position of the first pick-and-place mechanism. The second pick-and-place mechanism comprises a second hand bottom plate, a second hand finger, a second clamping jaw base, a second clamping drive and a second clamping jaw fixing plate. The second clamping jaw fixing plate is slidably arranged on the pick-and-place seat and connected with the second pick-and-place moving mechanism. The second hand bottom plate is arranged on the second clamping jaw fixing plate. The second clamping jaw base is arranged on the second hand bottom plate. The second clamping drive is arranged on the second clamping jaw base. The second hand finger is arranged on the output shaft of the second clamping drive. A second clamping gap is formed between the second hand bottom plate and the second hand finger. The side of the second pick-and-place mechanism located at the second clamping gap is the pick-and-place position of the second pick-and-place mechanism.

5. The apparatus of claim 4, wherein the plurality of robots are configured to cooperate to transport the film carrier mechanism. The first hand bottom plate is arranged in an arc shape on the side located at the first clamping gap. The second hand bottom plate is arranged in an arc shape on the side located at the second clamping gap.

6. The apparatus of claim 5, wherein the plurality of robots are configured to cooperate to transport the film. First inclined surfaces are arranged on the upper surfaces of both ends of the first hand bottom plate arranged in the arc shape. Second inclined surfaces are arranged on the upper surfaces of both ends of the second hand bottom plate arranged in the arc shape.

7. The apparatus of claim 1, wherein the plurality of robots are configured to cooperate to transport the film. The buffer clamping jaw mechanism comprises a buffer hand bottom plate, a buffer hand finger, a buffer clamping jaw base, a buffer clamping drive and a buffer clamping jaw fixing plate. The buffer clamping jaw fixing plate is arranged on the buffer rack. The buffer clamping jaw base is arranged on the buffer clamping jaw fixing plate. The buffer clamping drive is arranged on the buffer clamping jaw base. The buffer hand finger is arranged on the output shaft of the buffer clamping drive. A buffer clamping gap is formed between the buffer hand bottom plate and the buffer hand finger.

8. The apparatus of claim 1, wherein the plurality of robots are configured to cooperate to transport the film. The buffer clamping jaw mechanism is slidably arranged on the buffer support in the Y-axis direction. A transverse driving mechanism is arranged between the buffer support and the buffer clamping jaw mechanism.

9. The apparatus of claim 1, wherein the plurality of robots are configured to cooperate to transport the film in the film handling mechanism. The first pick-and-place assembly and the second pick-and-place assembly are arranged in a staggered manner in the Z-axis direction. The buffer clamping jaw mechanism comprises two or more buffer clamping jaw mechanisms arranged in a staggered manner in the Z-axis direction.

10. A method for transferring a film support mechanism in a semiconductor device by the apparatus for transferring a film support mechanism in a semiconductor device by a plurality of robots according to any one of claims 1 to 9, characterized in that: The method comprises the following steps: S1. The first pick-and-place assembly is moved by the moving module, so that the pick-and-place position of the first pick-and-place mechanism is aligned with the film carrying mechanism to be taken out in the material taking area. S2. The first pick-and-place mechanism is moved towards the material taking area by the first pick-and-place moving mechanism. The film carrying mechanism to be taken out in the material taking area is clamped and taken out by the first pick-and-place mechanism. S3. The first pick-and-place mechanism is moved in the reverse direction by the first pick-and-place moving mechanism. S4. The pick-and-place module clamping the film carrying mechanism is moved towards the buffer module by the moving module. The film carrying mechanism is clamped by the buffer clamping jaw mechanism. The film carrying mechanism is released by the first pick-and-place mechanism. S5, the other side of the film carrying mechanism is clamped by the second pick-and-place mechanism, and the clamping of the film carrying mechanism by the buffer clamp jaw mechanism is released; S6, the film carrying mechanism is inserted onto the sorting stage by the second pick-and-place moving mechanism and the second pick-and-place mechanism.

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