Solder ball mounting device

Abstract

The invention discloses a solder ball reballing device which is used for solving the technical problems that the production cost is increased and the reballing efficiency is low due to the fact that an existing solder ball reballing device cannot meet the solder ball reballing requirements of different types of electronic elements. The feeding end of a feeding channel is communicated with a feeding channel, and the discharging end of the feeding channel is communicated with a discharging channel; the upper base is provided with a first control valve and a second control valve; the second control air channel is communicated with the vacuum channel and the ventilation channel, the second control valve is used for controlling connection and disconnection of the vacuum channel and the second control air channel and controlling connection and disconnection of the ventilation channel and the second control air channel, and the second control air channel is communicated with the discharging end of the feeding channel; the first control air channel is communicated with the vacuum channel and the ventilation channel, the first control valve is used for controlling connection and disconnection of the vacuum channel and the first control air channel and controlling connection and disconnection of the ventilation channel and the first control air channel, and the first control air channel is communicated with the first position of the feeding channel.

Description

Technical Field

[0001] This invention relates to the field of solder ball planting technology, and more particularly to a solder ball planting device. Background Technology

[0002] Ball Grid Array (BGA) is a surface mount technology for integrated circuits, typically used to permanently mount chips such as microprocessors. Currently, the BGA process utilizes equipment such as solder ball placement devices and reflow ovens. First, the BGA chip is fixed onto the fixture of the solder ball placement device. Then, a layer of solder paste is applied to the chip surface to fix the solder balls during the placement process and to act as a flux during soldering. Next, the solder ball placement device implants the solder balls one by one into the corresponding positions on the chip substrate. Finally, the BGA chip with solder balls is removed and placed into a reflow oven for high-temperature soldering.

[0003] Currently, existing solder ball placement devices generally employ a mass transfer process to implant solder balls onto electronic components such as chips. Specifically, the solder ball placement device uses a suction cup with multiple suction holes inserted into a suction head to pick up a number of solder balls corresponding to the number of suction holes at once. During the placement process, in order to ensure that the solder balls fall accurately and simultaneously into the corresponding positions, the distance between the suction head and the surface of the component to be placed must be very small. Therefore, for components with uneven surfaces (such as components with curved structures or components whose surfaces have already been pre-mounted), it is necessary to replace the suction cup or even the entire suction head with one that matches the shape and size of the electronic component. This undoubtedly greatly increases production costs and seriously affects the placement efficiency.

[0004] Therefore, finding a technical solution that can solve the above-mentioned technical problems has become an important research topic for those skilled in the art. Summary of the Invention

[0005] This invention discloses a solder ball placement device to solve the technical problem that existing solder ball placement devices cannot meet the solder ball placement needs of different types of electronic components, resulting in increased production costs and low placement efficiency.

[0006] The present invention provides a solder ball placement device, comprising an upper base and a lower base, wherein a connecting plate is provided between the upper base and the lower base;

[0007] The upper base is provided with a feeding channel, a vacuum channel, and a ventilation channel;

[0008] The lower base is provided with a nozzle and a discharge channel communicating with the nozzle;

[0009] The connecting plate is provided with a feeding channel, a first control air channel and a second control air channel, wherein the feeding end of the feeding channel is connected to the feeding channel and the discharging end of the feeding channel is connected to the discharging channel.

[0010] The upper base is provided with a feeding assembly, which is used to drive the solder balls in the feeding channel to move toward the discharge end of the feeding channel;

[0011] The upper base is equipped with a first control valve and a second control valve;

[0012] The second control air passage is connected to the vacuum passage and the ventilation passage. The second control valve is used to control the connection and disconnection between the vacuum passage and the second control air passage, and to control the connection and disconnection between the ventilation passage and the second control air passage. The second control air passage is connected to the discharge end of the feeding passage.

[0013] The first control air passage is connected to the vacuum passage and the ventilation passage. The first control valve is used to control the connection and disconnection between the vacuum passage and the first control air passage, and to control the connection and disconnection between the ventilation passage and the first control air passage. The first control air passage is connected to a first position of the feeding passage, wherein the first position is close to the discharge end of the feeding passage.

[0014] Optionally, the feeding assembly includes an ultrasonic vibrator;

[0015] The ultrasonic vibrator is disposed on the upper base, and the ultrasonic vibrator is used to emit vibrations to the upper base to drive the solder balls in the feeding channel to move towards the discharge end of the feeding channel.

[0016] Optionally, it also includes a barometric pressure detection component;

[0017] The air pressure detection component includes a detection channel and an air pressure sensor;

[0018] The detection channel is located on the upper base, with one end of the detection channel connected to the discharge end of the feeding channel and the other end of the detection channel connected to the air pressure sensor.

[0019] Optionally, the feeding channel is provided with an optical channel;

[0020] The axis of the optical channel is perpendicular to the axis of the feed channel;

[0021] A first photoelectric sensor is provided at one end of the optical channel, and a second photoelectric sensor is provided at the other end of the optical channel. The light emitted by the first photoelectric sensor can pass through the optical channel and be received by the second photoelectric sensor.

[0022] Optionally, the inlet end of the feeding channel is a ball storage trough recessed into the connecting plate, and the ball storage trough is connected to the outlet end of the feeding channel.

[0023] Optionally, the upper base is provided with a first connecting air passage and a second connecting air passage;

[0024] The second end of the first connecting air passage is connected to the first control air passage, the first end of the first connecting air passage is connected to the vacuum passage and the ventilation passage, and the first control valve is used to control the connection and disconnection between the vacuum passage and the first connecting air passage and to control the connection and disconnection between the ventilation passage and the first connecting air passage.

[0025] The second end of the second connecting air passage is connected to the second control air passage, the first end of the second connecting air passage is connected to the vacuum passage and the ventilation passage, and the second control valve is used to control the connection and disconnection between the vacuum passage and the second connecting air passage and to control the connection and disconnection between the ventilation passage and the second connecting air passage.

[0026] Optionally, the upper base is recessed inward to form a first mounting cavity and a second mounting cavity;

[0027] The vacuum channel, the ventilation channel, and the first connecting air channel are all connected to the first mounting cavity, and the first control valve is embedded in the first mounting cavity.

[0028] The vacuum channel, the ventilation channel, and the second connecting air channel are all connected to the second mounting cavity, and the second control valve is embedded in the second mounting cavity.

[0029] Optionally, the width of the first control air passage gradually narrows towards the discharge end of the feeding channel;

[0030] The width of the second control air passage gradually narrows towards the discharge end of the feeding channel.

[0031] Optionally, the nozzle has an internal spray channel that is connected to the discharge channel.

[0032] Optionally, the feed end of the feed channel is exposed on the upper base to form a feed inlet.

[0033] Compared with the prior art, the present invention has the following beneficial effects:

[0034] In the solder ball placement device of the present invention, the solder ball enters the feed end of the feeding channel through the feeding channel, the feeding component drives the solder ball to move along the feeding channel, and the vacuum and nitrogen switching between the first control air channel and the second control air channel is completed by controlling the first control valve and the second control valve. When solder ball placement begins, both the first and second control valves are de-energized, and both the first and second control air channels are connected to the vacuum channel. The first solder ball is vacuum-adsorbed at the first position of the feeding channel. Then, the first solenoid valve is energized, and the first control air channel is connected to the ventilation channel. Nitrogen gas is blown out of the first control air channel to blow the solder ball to the discharge end of the feeding channel. The solder ball is vacuum-adsorbed at the discharge end. Then, the first control valve is de-energized, and the first control air channel is connected to the vacuum channel again. At this time, the second solder ball is vacuum-adsorbed at the first position. Next, the second control valve is energized, and the second control air channel is connected to the ventilation channel. Nitrogen gas is blown out of the second control air channel to blow the first solder ball to the discharge channel, and then it is sprayed from the nozzle to the designated position of the electronic component. The above cycle is repeated to complete the solder ball placement process.

[0035] In the above design, solder balls can be continuously and orderly ejected from the nozzle to the designated position of the electronic component, effectively solving the technical problem that existing solder ball placement devices cannot be used for different types of electronic components due to the mass transfer process, and effectively improving the accuracy and efficiency of solder ball placement. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the structure of a solder ball planting device provided by the present invention;

[0038] Figure 2 A schematic diagram of the bottom structure of the upper base of a solder ball planting device provided by the present invention;

[0039] Figure 3 A schematic diagram of the top surface structure of the upper base of a solder ball planting device provided by the present invention;

[0040] Figure 4 This is a schematic diagram of the connecting plate of a solder ball planting device provided by the present invention;

[0041] Figure 5 A perspective view of the connecting plate of a solder ball planting device provided by the present invention;

[0042] Figure 6 This is a schematic diagram of the lower base of a solder ball mounting device provided by the present invention;

[0043] Illustration: Upper base 1; Lower base 2; Connecting plate 3; Feeding channel 4; Feed inlet 401; Ultrasonic vibrator 5; First control valve 6; Second control valve 7; Vacuum connector 8; Nitrogen connector 9; Pressure sensor 10; First photoelectric sensor 11; Second photoelectric sensor 12; First connecting air passage 13; Second connecting air passage 14; First mounting cavity 15; Second mounting cavity 16; Feeding channel 17; Feeding end of feeding channel 17a; First position of feeding channel 17b; Ball storage tank 18; First control air passage 19; Second control air passage 20; Injection channel 21; Nozzle 22; Discharge channel 23; Vacuum channel 24; Ventilation channel 25. Detailed Implementation

[0044] This invention discloses a solder ball placement device to solve the technical problem that existing solder ball placement devices cannot meet the solder ball placement needs of different types of electronic components, resulting in increased production costs and low placement efficiency.

[0045] To enable those skilled in the art to better understand the present invention, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] Please see Figures 1 to 6 The present invention provides a solder ball placement device, which includes an upper base 1 and a lower base 2, wherein a connecting plate 3 is provided between the upper base 1 and the lower base 2;

[0047] The upper base 1 is provided with a feeding channel 4, a vacuum channel 24, and a ventilation channel 25;

[0048] The lower base 2 is provided with a nozzle 22 and a discharge channel 23 communicating with the nozzle 22;

[0049] The connecting plate 3 is provided with a feeding channel 17, a first control air passage 19 and a second control air passage 20, wherein the feeding end of the feeding channel 17 is connected to the feeding channel 4 and the discharging end of the feeding channel 17 is connected to the discharging channel 23.

[0050] The upper base 1 is provided with a feeding assembly, which is used to drive the solder balls in the feeding channel 17 to move toward the discharge end of the feeding channel 17.

[0051] The upper base 1 is provided with a first control valve 6 and a second control valve 7;

[0052] The second control air passage 20 is connected to the vacuum passage 24 and the ventilation passage 25. The second control valve 7 is used to control the connection and disconnection between the vacuum passage 24 and the second control air passage 20, and to control the connection and disconnection between the ventilation passage 25 and the second control air passage 20. The second control air passage 20 is connected to the discharge end of the feeding passage 17.

[0053] The first control air passage 19 is connected to the vacuum passage 24 and the ventilation passage 25. The first control valve 6 is used to control the connection and disconnection between the vacuum passage 24 and the first control air passage 19, and to control the connection and disconnection between the ventilation passage 25 and the first control air passage 19. The first control air passage 19 is connected to a first position of the feeding passage 17, wherein the first position is close to the discharge end of the feeding passage 17.

[0054] It should be noted that the vacuum channel 24 is also connected to a vacuum connector 8 for connection to a vacuum generator, and the ventilation channel 25 is also connected to a nitrogen connector 9 for connection to a nitrogen source.

[0055] In addition, for the convenience of automated control, the first control valve 6 and the second control valve 7 mentioned above are preferably solenoid valves.

[0056] In the solder ball placement device of this embodiment, the solder ball enters the feeding end of the feeding channel 17 through the feeding channel 4. The feeding component drives the solder ball to move along the feeding channel 17. By controlling the first control valve 6 and the second control valve 7, the vacuum and nitrogen switching of the first control air channel 19 and the second control air channel 20 are completed. When the solder ball placement begins, both the first control valve 6 and the second control valve 7 are de-energized. The first control air passage 19 and the second control air passage 20 are both connected to the vacuum passage 24. The first solder ball is vacuum-adsorbed at the first position of the feeding passage 17. Then, the first solenoid valve is energized, and the first control air passage 19 is connected to the ventilation passage 25. The first control air passage 19 blows nitrogen gas to blow the solder ball to the discharge end of the feeding passage 17. The solder ball is vacuum-adsorbed at the discharge end. Then, the first control valve 6 is de-energized, and the first control air passage 19 is connected to the vacuum passage 24 again. At this time, the second solder ball is vacuum-adsorbed at the first position. Then, the second control valve 7 is energized, and the second control air passage 20 is connected to the ventilation passage 25. The second control air passage 20 blows nitrogen gas to blow the first solder ball to the discharge passage 23, and then it is sprayed from the nozzle 22 to the designated position of the electronic component. The above cycle is repeated to complete the solder ball placement process.

[0057] In the above design, solder balls can be continuously and orderly ejected from nozzle 22 to the designated position of electronic components, effectively solving the technical problem that existing solder ball placement devices cannot be used for different types of electronic components due to the mass transfer process, and effectively improving the accuracy and efficiency of solder ball placement.

[0058] Furthermore, the feeding assembly in this embodiment includes an ultrasonic vibrator 5;

[0059] The ultrasonic vibrator 5 is disposed on the upper base 1. The ultrasonic vibrator 5 is used to emit vibrations to the upper base 1 to drive the solder balls in the feeding channel 17 to move toward the discharge end of the feeding channel 17.

[0060] It should be noted that, through the above design, the ultrasonic vibrator 5 can generate a certain frequency of vibration on the upper base 1 when it is working, so that the connecting plate 3 vibrates synchronously, thereby enabling the solder balls that enter the feeding channel 17 from the feeding channel 4 to move along the feeding channel 17 towards the discharge end of the feeding channel 17.

[0061] Furthermore, the solder ball placement device in this embodiment also includes a pressure detection component;

[0062] The air pressure detection component includes a detection channel and an air pressure sensor 10;

[0063] The detection channel is located on the upper base 1, and one end of the detection channel is connected to the discharge end of the feeding channel 17, while the other end of the detection channel is connected to the air pressure sensor 10.

[0064] It should be noted that, through the above design, production personnel can use the air pressure value fed back by the air pressure sensor 10 to determine whether the solder balls are vacuum-adsorbed at the discharge end of the feeding channel 17, thereby detecting whether the solder ball placement device is in normal working condition.

[0065] Furthermore, in this embodiment, the feeding channel 4 is provided with an optical channel;

[0066] The axis of the optical channel is perpendicular to the axis of the feed channel 4;

[0067] A first photoelectric sensor 11 is provided at one end of the optical channel, and a second photoelectric sensor 12 is provided at the other end of the optical channel. The light emitted by the first photoelectric sensor 11 can pass through the optical channel and be received by the second photoelectric sensor 12.

[0068] With the above design, when there is a certain number of solder balls in the feeding channel 4, the solder balls will block the light channel, so that the light emitted by the first photoelectric sensor 11 cannot be received by the second photoelectric sensor 12, thereby allowing the production personnel to know that the number of solder balls in the feeding channel 4 is at a normal level.

[0069] When the number of solder balls in the feeding channel 4 is insufficient, the light channel is not blocked by the solder balls. At this time, the light emitted by the first photoelectric sensor 11 can be received by the second photoelectric sensor 12, so that the production personnel know that the number of solder balls in the feeding channel 4 is insufficient, and then notify the production personnel to add solder balls to the feeding channel 4 in time.

[0070] Furthermore, in this embodiment, the feeding end of the feeding channel 17 is a ball storage trough 18 recessed into the interior of the connecting plate 3, and the ball storage trough 18 is connected to the discharge end of the feeding channel 4.

[0071] It should be noted that, through the above design, the solder balls falling from the feeding channel 4 will first enter the ball storage tank 18 for buffering, and then the ultrasonic vibrator 5 will vibrate to vibrate the solder balls into the feeding channel 17, so that the solder balls can enter the feeding channel 17 in an orderly manner, ensuring the smooth operation of the solder ball placement device.

[0072] Furthermore, in this embodiment, the upper base 1 is provided with a first connecting airway 13 and a second connecting airway 14;

[0073] The second end of the first connecting airway 13 is connected to the first control airway 19, the first end of the first connecting airway 13 is connected to the vacuum channel 24 and the ventilation channel 25, and the first control valve 6 is used to control the connection and disconnection between the vacuum channel 24 and the first connecting airway 13 and to control the connection and disconnection between the ventilation channel 25 and the first connecting airway 13.

[0074] The second end of the second connecting airway 14 is connected to the second control airway 20, the first end of the second connecting airway 14 is connected to the vacuum channel 24 and the ventilation channel 25, and the second control valve 7 is used to control the connection and disconnection between the vacuum channel 24 and the second connecting airway 14 and to control the connection and disconnection between the ventilation channel 25 and the second connecting airway 14.

[0075] It should be noted that, through the above design, when the first control valve 6 is de-energized, the vacuum channel 24 is connected to the first connecting gas channel 13 through the first control valve 6 to achieve connection with the first control gas channel 19.

[0076] When the first control valve 6 is energized, the ventilation channel 25 is connected to the first control air passage 19 through the first control valve 6 to achieve connection with the first control air passage 19.

[0077] In addition, when the second control valve 7 is de-energized, the vacuum channel 24 is connected to the second connecting gas channel 14 through the second control valve 7 to achieve connection with the second control gas channel 20.

[0078] When the second control valve 7 is energized, the ventilation channel 25 is connected to the second control air passage 2020 through the second control valve 7 to achieve connection with the second control air passage 20.

[0079] Furthermore, in this embodiment, the upper base 1 is recessed inward to form a first mounting cavity 15 and a second mounting cavity 16;

[0080] The vacuum channel 24, the ventilation channel 25, and the first connecting air channel 13 are all connected to the first mounting cavity 15, and the first control valve 6 is embedded in the first mounting cavity 15.

[0081] The vacuum channel 24, the ventilation channel 25, and the second connecting air channel 14 are all connected to the second mounting cavity 16, and the second control valve 7 is embedded in the second mounting cavity 16.

[0082] It should be noted that, through the above design, the first control valve 6 and the second control valve 7 can be embedded in the upper base 1, which can effectively reduce the overall volume of the solder ball planting device.

[0083] Furthermore, in this embodiment, the width of the first control air passage 19 gradually narrows towards the discharge end of the feeding channel 17;

[0084] It should be noted that the above design can ensure the vacuum strength and air blowing strength at the first position of the feeding channel 17.

[0085] The width of the second control air passage 20 gradually narrows towards the discharge end of the feeding passage 17;

[0086] It should be noted that the above design can ensure the vacuum strength and air blowing strength at the feed end of the feeding channel 17.

[0087] Furthermore, in this embodiment, the nozzle 22 has an internal spray channel 21, which is connected to the discharge channel 23.

[0088] It should be noted that, through the above design, the solder ball enters the spray channel 21 after being discharged from the discharge channel 23, and is finally sprayed out from the spray channel 21 to the designated position of the electronic component.

[0089] Furthermore, the feed end of the feed channel 4 is exposed on the upper base 1 to form a feed inlet 401.

[0090] It should be noted that the aforementioned feed inlet 401 can also be covered with a sealing cap to prevent dust and other impurities from entering the interior of the solder ball placement device through the feed channel 4.

[0091] Furthermore, in this embodiment, the width of the feeding channel 17 is matched with the diameter of the solder ball to ensure that each position of the feeding channel 17 can only accommodate one solder ball, thereby ensuring that the solder balls will not accumulate and block, and thus ensuring the orderly ejection of the solder balls.

[0092] The foregoing has provided a detailed description of a solder ball mounting device provided by the present invention. For those skilled in the art, based on the ideas of the embodiments of the present invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A solder ball mounting device, characterized in that, It includes an upper base (1) and a lower base (2), wherein a connecting plate (3) is provided between the upper base (1) and the lower base (2); The upper base (1) is provided with a feeding channel (4), a vacuum channel (24), and a ventilation channel (25); The lower base (2) is provided with a nozzle (22) and a discharge channel (23) connected to the nozzle (22). The connecting plate (3) is provided with a feeding channel (17), a first control air channel (19) and a second control air channel (20), wherein the feeding end of the feeding channel (17) is connected to the feeding channel (4), and the discharging end of the feeding channel (17) is connected to the discharging channel (23). The upper base (1) is provided with a feeding assembly, which is used to drive the solder balls in the feeding channel (17) to move toward the discharge end of the feeding channel (17); The upper base (1) is provided with a first control valve (6) and a second control valve (7); The second control air passage (20) is connected to the vacuum passage (24) and the ventilation passage (25). The second control valve (7) is used to control the opening and closing of the vacuum passage (24) and the second control air passage (20) and to control the opening and closing of the ventilation passage (25) and the second control air passage (20). The second control air passage (20) is connected to the discharge end of the feeding passage (17). The first control air passage (19) is connected to the vacuum passage (24) and the ventilation passage (25). The first control valve (6) is used to control the opening and closing of the vacuum passage (24) and the first control air passage (19) and the ventilation passage (25) and the first control air passage (19). The first control air passage (19) is connected to a first position of the feeding passage (17), wherein the first position is close to the discharge end of the feeding passage (17).

2. The solder ball mounting device according to claim 1, characterized in that, The feeding assembly includes an ultrasonic vibrator (5); The ultrasonic vibrator (5) is disposed on the upper base (1). The ultrasonic vibrator (5) is used to vibrate the upper base (1) to drive the solder balls in the feeding channel (17) to move toward the discharge end of the feeding channel (17).

3. The solder ball mounting device according to claim 1, characterized in that, It also includes a barometric pressure detection component; The air pressure detection component includes a detection channel and an air pressure sensor (10). The detection channel is located on the upper base (1), and one end of the detection channel is connected to the discharge end of the feeding channel (17), while the other end of the detection channel is connected to the air pressure sensor (10).

4. The solder ball mounting device according to claim 1, characterized in that, The feeding channel (4) is equipped with a light channel; The axis of the optical channel is set perpendicular to the axis of the feed channel (4); A first photoelectric sensor (11) is provided at one end of the optical channel, and a second photoelectric sensor (12) is provided at the other end of the optical channel. The light emitted by the first photoelectric sensor (11) can pass through the optical channel and be received by the second photoelectric sensor (12).

5. The solder ball mounting device according to claim 1, characterized in that, The feeding end of the feeding channel (17) is a ball storage trough (18) recessed into the connecting plate (3), and the ball storage trough (18) is connected to the discharge end of the feeding channel (4).

6. The solder ball mounting device according to claim 1, characterized in that, The upper base (1) is provided with a first connecting airway (13) and a second connecting airway (14). The second end of the first connecting airway (13) is connected to the first control airway (19), the first end of the first connecting airway (13) is connected to the vacuum channel (24) and the ventilation channel (25), and the first control valve (6) is used to control the opening and closing of the vacuum channel (24) and the first connecting airway (13) and to control the opening and closing of the ventilation channel (25) and the first connecting airway (13); The second end of the second connecting air passage (14) is connected to the second control air passage (20), the first end of the second connecting air passage (14) is connected to the vacuum passage (24) and the ventilation passage (25), and the second control valve (7) is used to control the opening and closing of the vacuum passage (24) and the second connecting air passage (14) and to control the opening and closing of the ventilation passage (25) and the second connecting air passage (14).

7. The solder ball mounting device according to claim 6, characterized in that, The upper base (1) is recessed into itself to form a first mounting cavity (15) and a second mounting cavity (16). The vacuum channel (24), the ventilation channel (25) and the first connecting air channel (13) are all connected to the first mounting cavity (15), and the first control valve (6) is embedded in the first mounting cavity (15); The vacuum channel (24), the ventilation channel (25) and the second connecting air channel (14) are all connected to the second mounting cavity (16), and the second control valve (7) is embedded in the second mounting cavity (16).

8. The solder ball planting device according to claim 1, characterized in that, The width of the first control air passage (19) gradually narrows towards the discharge end of the feeding passage (17); The width of the second control air passage (20) gradually narrows towards the discharge end of the feeding passage (17).

9. The solder ball mounting device according to claim 1, characterized in that, The nozzle (22) has an injection channel (21) inside, and the injection channel (21) is connected to the discharge channel (23).

10. The solder ball mounting device according to claim 1, characterized in that, The feed end of the feed channel (4) is exposed on the upper base (1) to form a feed inlet (401).

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