Circular ring composite target structure aligned by LDI exposure machine and manufacturing process of circular ring composite target structure

Abstract

The invention provides a circular ring composite target structure for alignment of an LDI exposure machine. The circular ring composite target structure comprises a target point piece and a laminated piece, the target spot piece comprises a first hard board lamination layer and a mother target arranged on the first hard board lamination layer, the ladder-shaped mother target is formed by extending from the top position of the second hard board layer into the third semi-solidified bonding sheet, a first semi-solidified bonding sheet is arranged above the mother target, and a groove is formed in the first hard board layer; the laminated part comprises a second hard board laminated layer and a circular ring target arranged on the second hard board laminated layer, and the circular ring target is arranged at the position, corresponding to the mother target, on the second hard board laminated layer. According to the ring composite target structure aligned by the LDI exposure machine and the manufacturing process of the ring composite target structure, the interlayer alignment degree can be improved, interlayer offset caused by the precision problem superior to a machine table in the manufacturing process can be reduced, the normal production requirement of a PCB with a compact pattern structure and high layer offset requirement can be met, and the production efficiency is improved. The problems of precise patterns, small space and small hole ring of laser holes can be solved, the production efficiency is improved, and the product yield is increased.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of printed circuit board, in particular to a kind of LDI exposure machine alignment ring composite target structure and its manufacturing process. BACKGROUND

[0002] Under the trend of electronic equipment constantly towards miniaturization, light weight, high performance, with the future PCB manufacturing into micro-precision era, PCB interlayer alignment and through-hole high-precision requirement is a problem that must be overcome;Traditional PCB manufacturing process interlayer or when layer is all with X-ray or mechanical drilling to make through-hole to provide laser machine and traditional exposure machine for alignment, due to the cumulative effect of X-ray drilling, mechanical drilling and the alignment precision of traditional exposure machine, interlayer and when layer alignment is not precise enough, far from meeting the development trend of high-precision requirement, there are layer deviation, hole deviation and other abnormalities in production, therefore, a production process with smaller layer deviation and stronger when layer alignment capability is needed to meet the increasingly strict production requirements. SUMMARY

[0003] The purpose of the present application is to overcome the deficiencies in the prior art, provide a kind of LDI exposure machine alignment ring composite target structure and its manufacturing process, laser machine is aligned by grabbing the next layer pattern, to meet the precision alignment requirement of laser hole to the next layer pattern, and then composite target point is made for LDI by laser, to meet the alignment requirement of when layer, to solve the problem of hole deviation caused by small laser hole ring and high precision alignment requirement.

[0004] The technical scheme adopted by the present application is: A kind of LDI exposure machine alignment ring composite target structure, comprising target point piece and laminated piece; The target point piece includes first hard board laminated and mother target arranged on the first hard board laminated, the first hard board laminated includes fourth hard board layer, third semi-solid adhesive sheet, third hard board layer, second semi-solid adhesive sheet, second hard board layer, first semi-solid sheet adhesive sheet and first hard board layer arranged from bottom to top in sequence, the mother target is formed in trapezoidal shape from the top position of second hard board layer to third semi-solid adhesive sheet, recess is arranged on the first semi-solid sheet adhesive sheet and first hard board layer above the mother target. The laminated piece comprises a second hard board laminated piece and a circular ring target arranged on the second hard board laminated piece, the second hard board laminated piece comprises, from bottom to top, an eighth hard board layer, a seventh semi-cured adhesive sheet, a seventh hard board layer, a sixth semi-cured adhesive sheet, a sixth hard board layer, a fifth semi-cured adhesive sheet, and a fifth hard board layer, and the circular ring target is arranged on the second hard board laminated piece at a position corresponding to the mother target, and the circular ring target is arranged between the fifth hard board layer and the seventh semi-cured adhesive sheet. Preferably, the LDI exposure machine is aligned with the circular ring composite target structure, wherein the fourth hard board layer, the third hard board layer, the second hard board layer, and the first hard board layer each comprise a hard board and copper foils arranged on both sides of the hard board, the copper foils of the third hard board layer corresponding to the position of the mother target are removed to form a first removal section, and the length of the first removal section is 16-25 mil longer than the length of the position corresponding to the mother target.

[0005] Preferably, the LDI exposure machine is aligned with the circular ring composite target structure, wherein the eighth hard board layer, the seventh hard board layer, the sixth hard board layer, and the fifth hard board layer each comprise a hard board and copper foils arranged on both sides of the hard board, the copper foils of the seventh hard board layer and the sixth hard board layer corresponding to the position of the circular ring target are removed to form a second removal section and a third removal section, and the lengths of the second removal section and the third removal section are 16-25 mil longer than the length of the position corresponding to the circular ring target.

[0006] Preferably, the LDI exposure machine is aligned with the circular ring composite target structure, wherein a through hole is arranged in the middle of the circular ring target of the laminated piece.

[0007] Preferably, the LDI exposure machine is aligned with the circular ring composite target structure, wherein the method comprises the following steps: Step S1. Making a first hard board laminated piece; Step S2. Brownizing the copper foils of the first hard board layer in the first hard board laminated piece, then making a groove on the first hard board layer by a laser machine, and finally making a mother target on the second hard board layer along the groove; Step S3. Making a second hard board laminated piece; Step S4. Brownizing the copper foils of the fifth hard board layer in the second hard board laminated piece, and then forming a circular ring target on the second hard board laminated piece at a position corresponding to the mother target by a laser machine.

[0008] Preferably, the LDI exposure machine is aligned with the circular ring composite target structure, wherein step S1 specifically comprises the following steps: Step S11. Providing a fourth hard board layer, making a circuit pattern on the layer, and then brownizing the fourth hard board layer; Step S12. Providing a third semi-cured adhesive sheet and a third hard board layer, the copper foils of the third hard board layer corresponding to the position of the mother target have been removed to form a first removal section; brownizing the copper foils of the third hard board layer, and pressing the fourth hard board layer, the third semi-cured adhesive sheet, and the fourth hard board layer. Step S13. Circuit pattern is made on the third hard board layer, and then the third hard board layer is subjected to brown processing, and the third hard board layer is laminated on the third prepreg; Step S14. The second prepreg and the second hard board layer are provided, the copper foil of the second hard board layer is subjected to brown processing, and then the second prepreg and the second hard board layer are laminated on the third hard board layer; Step S15. Circuit pattern is made on the second hard board layer, and then the second hard board layer is subjected to brown processing, and the second hard board layer is laminated on the second prepreg; Step S16. The first prepreg and the first hard board layer are provided, the copper foil of the first hard board layer is subjected to brown processing, and the first prepreg and the first hard board layer are laminated on the second hard board layer to obtain the first hard board stack.

[0009] Preferably, the LDI exposure machine is provided with a circular ring composite target structure for alignment, wherein in step S4, the laser machine makes a circular ring target, a laser aperture with a diameter of 3.5-4 mil is selected to make a circular ring with a width of 8-10 mil by superimposed and burning, the laser energy is 3-5 mj, the outer diameter of the circular ring is 3.0-3.2 mm, and the inner diameter of the circular ring is 2.6-2.8 mm.

[0010] Preferably, the LDI exposure machine is provided with a circular ring composite target structure for alignment, wherein step S3 specifically comprises the following steps: Step S31. An eighth hard board layer is provided, circuit pattern is made on the layer, and then the eighth hard board layer is subjected to brown processing; Step S32. A seventh prepreg and a seventh hard board layer are provided, the copper foil of the seventh hard board layer is removed to form a second removal section at the position corresponding to the circular ring target, the copper foil of the seventh hard board layer is subjected to brown processing, and the seventh hard board layer, the seventh prepreg and the eighth hard board layer are laminated; Step S33. Circuit pattern is made on the seventh hard board layer, and then the seventh hard board layer is subjected to brown processing; the seventh hard board layer is laminated on the seventh prepreg; Step S34. A sixth prepreg and a sixth hard board layer are provided, the copper foil of the sixth hard board layer is removed to form a third removal section at the position corresponding to the circular ring target, the copper foil of the sixth hard board layer is subjected to brown processing, and then the sixth prepreg and the sixth hard board layer are laminated on the seventh hard board layer; Step S35. Circuit pattern is made on the sixth hard board layer, and then the sixth hard board layer is subjected to brown processing; the sixth hard board layer is laminated on the sixth prepreg; Step S36. A fifth prepreg and a fifth hard board layer are provided, the copper foil of the fifth hard board layer is subjected to a brown processing, and the fifth prepreg and the fifth hard board layer are placed on the sixth hard board layer for pressing to obtain a second hard board stack.

[0011] Preferably, the LDI exposure machine is aligned with the ring composite target structure, wherein the brown processing speed is 3.8-4.2 m / min, the brown processing temperature is 30-40℃, the micro-etching rate is 45-60 u"; the high-temperature section pressure during pressing is 380-480 psi, the pressing temperature is 180-200℃, and the pressing time is 80-120 min.

[0012] Preferably, the LDI exposure machine is aligned with the ring composite target structure, wherein after step S4, a step S5 of making a through hole is further included, and step S5 specifically comprises: drilling a through hole with a hole diameter of 1.0-1.5 mm at the center position of the ring target of the second hard board stack.

[0013] Advantages of the present application: (1) The LDI exposure machine alignment ring composite target structure and the manufacturing process thereof can improve the interlayer alignment accuracy, reduce the interlayer deviation caused by the machine precision problem in the manufacturing process, and meet the normal requirements for PCBs with high requirements for close layer deviation of pattern structure.

[0014] (2) The LDI exposure machine alignment ring composite target structure and the manufacturing process thereof can solve the problem of small hole deviation of small space laser holes, improve the production efficiency, and improve the product yield. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a picture of the mother target of the present application.

[0016] Figure 2 It is a structure schematic diagram of the target point piece of the present application.

[0017] Figure 3 It is a picture of the ring target of embodiment 1 of the present application.

[0018] Figure 4 It is a structure schematic diagram of the stack piece of embodiment 1 of the present application.

[0019] Figure 5 It is a picture of the ring target of embodiment 2 of the present application.

[0020] Figure 6 It is a structure schematic diagram of the stack piece of embodiment 2 of the present application. DETAILED DESCRIPTION

[0021] The present application will be further described below in combination with specific drawings and embodiments.

[0022] Embodiment 1 As Figures 1-2 A circular ring composite target structure for LDI exposure machine alignment, comprising a target point piece 1 and a laminated piece 3; The target point piece 1 comprises a first hard plate laminated layer and a mother target 2 arranged on the first hard plate laminated layer, the first hard plate laminated layer comprises a fourth hard plate layer 1-1, a third prepreg 1-2, a third hard plate layer 1-3, a second prepreg 1-4, a second hard plate layer 1-5, a first prepreg 1-6, and a first hard plate layer 1-7 arranged from bottom to top in sequence, a trapezoidal mother target 2 is formed in the third prepreg 1-2 from the top position of the second hard plate layer 1-5, and grooves 4 are arranged on the first prepreg 1-6 and the first hard plate layer 1-7 above the mother target 2; The laminated piece 3 comprises a second hard plate laminated layer and a circular ring target 5 arranged on the second hard plate laminated layer, the second hard plate laminated layer comprises an eighth hard plate layer 3-1, a seventh prepreg 3-2, a seventh hard plate layer 3-3, a sixth prepreg 3-4, a sixth hard plate layer 3-5, a fifth prepreg 3-6, and a fifth hard plate layer 3-7 arranged from bottom to top in sequence, and the circular ring target 5 is arranged on the second hard plate laminated layer corresponding to the position of the mother target 2, and the circular ring target 5 is arranged between the fifth hard plate layer and the seventh prepreg 3-2.

[0023] The fourth hard plate layer 1-1, the third hard plate layer 1-3, the second hard plate layer 1-5, and the first hard plate layer 1-7 each comprise a hard plate and copper foils arranged on both sides of the hard plate, the copper foils corresponding to the position of the mother target 2 are removed from the third hard plate layer 1-3 to form a first removal section 1-3-1, and the length of the first removal section 1-3-1 is 16 mil longer than the length corresponding to the position of the mother target 2.

[0024] The eighth hard plate layer 3-1, the seventh hard plate layer 3-3, the sixth hard plate layer 3-5, and the fifth hard plate layer 3-7 each comprise a hard plate and copper foils arranged on both sides of the hard plate, the copper foils corresponding to the position of the circular ring target 5 are removed from the seventh hard plate layer 3-3 and the sixth hard plate layer 3-5 to form a second removal section 3-3-1 and a third removal section 3-5-1, and the lengths of the second removal section 3-3-1 and the third removal section 3-5-1 are 20 mil longer than the lengths corresponding to the position of the circular ring target 5.

[0025] A manufacturing process of a circular ring composite target structure for LDI exposure machine alignment, comprising the following steps: Step S1. Manufacturing a first hard plate laminated layer; Step S2. Brown the copper foils of the first hard plate layer 1-7 in the first hard plate laminated layer, then manufacture grooves 4 on the first hard plate layer 1-7 by a laser machine, and finally manufacture a mother target 2 on the second hard plate layer 1-5 along the grooves 4 downward; Step S3. Making the second hard board stack; Step S4. The copper foil of the fifth hard board layer 3-7 in the second hard board stack is browned, and then a circular ring target 5 is formed on the second hard board stack corresponding to the position of the mother target 2 by a laser machine. When the laser machine makes the circular ring target 5, a laser hole with a 4 mil aperture is selected for superimposed and fired to make a circular ring with a width of 10 mil. The laser energy is 4 mj, the outer diameter of the circular ring is 3.2 mm, and the inner diameter of the circular ring is 2.7 mm. The circular ring target 5 serves as the alignment target of the LDI exposure machine when making the circuit pattern on the first hard board layer.

[0026] Step S1 specifically includes the following steps: Step S11. Providing the fourth hard board layer 1-1, making a circuit pattern on it, and then brown processing the fourth hard board layer 1-1; Step S12. Providing the third prepreg 1-2 and the third hard board layer 1-3, and the copper foil of the third hard board layer 1-3 corresponding to the position of the mother target 2 has been removed to form a first removed section 1-3-1; Brown processing the copper foil of the third hard board layer 1-3, and pressing the fourth hard board layer 1-1, the third prepreg 1-2 and the fourth hard board layer 1-1; Step S13. Making a circuit pattern on the third hard board layer 1-3, and then brown processing the third hard board layer 1-3; Pressing the third hard board layer 1-3 on the third prepreg 1-2; Step S14. Providing the second prepreg 1-4 and the second hard board layer 1-5, brown processing the copper foil of the second hard board layer 1-5, and then pressing the second prepreg 1-4 and the second hard board layer 1-5 on the third hard board layer 1-3; Step S15. Making a circuit pattern on the second hard board layer 1-5, and then brown processing the second hard board layer 1-5; Pressing the second hard board layer 1-5 on the second prepreg 1-4; Step S16. Providing the first prepreg 1-6 and the first hard board layer 1-7, brown processing the copper foil of the first hard board layer 1-7, and pressing the first prepreg 1-6 and the first hard board layer 1-7 on the second hard board layer 1-5 to obtain the first hard board stack.

[0027] Step S3 specifically includes the following steps: Step S31. Providing the eighth hard board layer 3-1, making a real copper pattern at the corresponding position of the circular ring target 5, making a circuit pattern on it, and then brown processing the eighth hard board layer 3-1; Step S32. A seventh prepreg 3-2 and a seventh rigid board layer 3-3 are provided, the seventh rigid board layer 3-3 is removed at a position corresponding to the circular target 5 to form a second removed section 3-3-1, the copper foil of the seventh rigid board layer 3-3 is subjected to a brown processing, and the seventh rigid board layer 3-1, the seventh prepreg 3-2 and an eighth rigid board layer 3-1 are laminated; Step S33. A circuit pattern is made on the seventh rigid board layer 3-3, and then the seventh rigid board layer 3-3 is subjected to a brown processing; and the seventh rigid board layer 3-3 is laminated on the seventh prepreg 3-2. Step S34. A sixth prepreg 3-4 and a sixth rigid board layer 3-5 are provided, the sixth rigid board layer 3-5 is removed at a position corresponding to the circular target 5 to form a third removed section 3-5-1, the copper foil of the sixth rigid board layer 3-5 is subjected to a brown processing, and then the sixth prepreg 3-4 and the sixth rigid board layer 3-5 are laminated on the seventh rigid board layer 3-3. Step S35. A circuit pattern is made on the sixth rigid board layer 3-5, and then the sixth rigid board layer 3-5 is subjected to a brown processing; and the sixth rigid board layer 3-5 is laminated on the sixth prepreg 3-4. Step S36. A fifth prepreg 3-6 and a fifth rigid board layer 3-7 are provided, the copper foil of the fifth rigid board layer 3-7 is subjected to a brown processing, and the fifth prepreg 3-6 and the fifth rigid board layer 3-7 are laminated on the sixth rigid board layer 3-5 to obtain a second rigid board stack.

[0028] The brown processing is performed at a speed of 4.0 m / min, a brown temperature of 35℃ and a micro-etching speed of 50u"; the lamination is performed at a high-temperature section pressure of 420 psi, a lamination temperature of 190℃ and a lamination time of 100 min.

[0029] Figure 1 The picture of the mother target is used for alignment by a laser machine, and all the alignment effects of previous processes are removed, so that the laser hole of the first rigid board layer 1-7 is accurately aligned with the second rigid board layer 1-5. Figure 4 Step S31. A solid copper is made at a position corresponding to the circular target 5 of the eighth rigid board layer 3-1, which is used to receive the laser hole of the circular target in step S4, and the circular target produced by the laser machine in step S4 is used to align the first rigid board layer 1-7 when the pattern circuit of the first rigid board layer 1-7 is made, so that the pattern of the first rigid board layer 1-7 is more accurately aligned with the laser hole.

[0030] Example 1 is a 10-layer HDI consumer product, which has a laser hole in the board, and the size of the hole ring is only 2.1 mil. The laser hole offset rejection rate is 7.5% during the production process of the product, and the laser hole offset rejection rate is 0% after the process of example 1 is used, which reduces the production cost and improves the production capacity.

[0031] Embodiment 2 As Figures 1-2 A circular ring composite target structure for LDI exposure machine alignment includes a target point piece 1 and a laminated piece 3. The target point piece 1 includes a first hard board laminated layer and a mother target 2 arranged on the first hard board laminated layer, and the first hard board laminated layer includes a fourth hard board layer 1-1, a third prepreg 1-2, a third hard board layer 1-3, a second prepreg 1-4, a second hard board layer 1-5, a first prepreg 1-6, and a first hard board layer 1-7 arranged in sequence from bottom to top, and the mother target 2 is formed in a trapezoidal shape extending from the top of the second hard board layer 1-5 to the third prepreg 1-2, and grooves 4 are arranged on the first prepreg 1-6 and the first hard board layer 1-7 above the mother target 2. The laminated piece 3 includes a second hard board laminated layer and a circular ring target 5 arranged on the second hard board laminated layer, and the second hard board laminated layer includes an eighth hard board layer 3-1, a seventh prepreg 3-2, a seventh hard board layer 3-3, a sixth prepreg 3-4, a sixth hard board layer 3-5, a fifth prepreg 3-6, and a fifth hard board layer 3-7 arranged in sequence from bottom to top, and the circular ring target 5 is arranged on the second hard board laminated layer corresponding to the position of the mother target 2, and the circular ring target 5 is arranged between the fifth hard board layer and the seventh prepreg 3-2. The fourth hard board layer 1-1, the third hard board layer 1-3, the second hard board layer 1-5, and the first hard board layer 1-7 each include a hard board and copper foils arranged on both sides of the hard board, and the copper foils corresponding to the position of the mother target 2 are removed from the third hard board layer 1-3 to form a first removal section 1-3-1, and the length of the first removal section 1-3-1 is 16 mil longer than the length corresponding to the position of the mother target 2.

[0032] The eighth hard board layer 3-1, the seventh hard board layer 3-3, the sixth hard board layer 3-5, and the fifth hard board layer 3-7 each include a hard board and copper foils arranged on both sides of the hard board, and the copper foils corresponding to the position of the circular ring target 5 are removed from the seventh hard board layer 3-3 and the sixth hard board layer 3-5 to form a second removal section 3-3-1 and a third removal section 3-5-1, and the lengths of the second removal section 3-3-1 and the third removal section 3-5-1 are 20 mil longer than the lengths corresponding to the position of the circular ring target 5; and a through hole 6 is arranged in the middle of the circular ring target of the laminated piece 3.

[0033] A manufacturing process of a circular ring composite target structure for LDI exposure machine alignment includes the following steps: Step S1. Manufacturing a first hard board laminated layer; Step S2. Brownizing the copper foils of the first hard board layer 1-7 in the first hard board laminated layer, then manufacturing grooves 4 on the first hard board layer 1-7 by a laser machine, and finally manufacturing a mother target 2 on the second hard board layer 1-5 downward along the grooves; Step S3. Manufacturing a second hard board laminated layer; Step S4. The copper foil of the fifth hard board layer 3-7 in the second hard board stack is browned. Then, a circular target 5 is formed on the second hard board stack at the position corresponding to the mother target 2 using a laser machine. When the laser machine makes the circular target 5, a laser with a 4mil aperture is selected to stack and burn to make a ring with a width of 10mil. The laser energy is 4mJ, the outer diameter of the ring is 3.2mm, and the inner diameter of the ring is 2.7mm. Step S5. Drill a through hole 6 at the center of the circular target 5 of the second hard plate stack. The diameter of the through hole is 1.3mm.

[0034] Step S1 specifically includes the following steps: Step S11. Provide a fourth rigid board layer 1-1, create circuit patterns on this layer, and then perform browning treatment on the fourth rigid board layer 1-1; Step S12. Provide a third semi-cured adhesive sheet 1-2 and a third rigid layer 1-3. The copper foil at the position of the mother target 2 in the third rigid layer 1-3 has been removed to form a first removal section 1-3-1. The copper foil of the third rigid layer 1-3 is subjected to browning treatment. The fourth rigid layer 1-1, the third semi-cured adhesive sheet 1-2 and the fourth rigid layer 1-1 are pressed together. Step S13. Create the circuit pattern on the third rigid board layer 1-3, and then perform browning treatment on the third rigid board layer 1-3; place the third rigid board layer 1-3 on the third semi-cured adhesive sheet 1-2 and press them together; Step S14. Provide a second semi-cured adhesive sheet 1-4 and a second rigid layer 1-5, perform a browning treatment on the copper foil of the second rigid layer 1-5, and then place the second semi-cured adhesive sheet 1-4 and the second rigid layer 1-5 on the third rigid layer 1-3 for pressing. Step S15. Fabricate the circuit pattern of the second rigid board layer 1-5, and then perform a browning treatment on the second rigid board layer 1-5; place the second rigid board layer 1-5 on the second semi-cured adhesive sheet 1-4 and press them together; Step S16. Provide the first semi-cured adhesive sheet 1-6 and the first rigid board layer 1-7, perform a browning treatment on the copper foil of the first rigid board layer 1-7, and place the first semi-cured adhesive sheet 1-6 and the first rigid board layer 1-7 on the second rigid board layer 1-5 and press them together to obtain the first rigid board stack.

[0035] Step S3 specifically includes the following steps: Step S31. Provide the eighth rigid board layer 3-1, make solid copper patterns at the corresponding positions of the circular target 5, make circuit patterns on this layer, and then perform browning treatment on the eighth rigid board layer 3-1. Step S32. Provide a seventh semi-cured adhesive sheet 3-2 and a seventh rigid layer 3-3. Remove the copper foil at the position of the circular target 5 corresponding to the seventh rigid layer 3-3 to form a second removal section 3-3-1. Perform browning treatment on the copper foil of the seventh rigid layer 3-3. Press the seventh rigid layer 3-1, the seventh semi-cured adhesive sheet 3-2 and the eighth rigid layer 3-1 together. Step S33. Create the circuit pattern on the seventh rigid layer 3-3, and then perform browning treatment on the seventh rigid layer 3-3; place the seventh rigid layer 3-3 on the seventh semi-cured adhesive sheet 3-2 and press them together; Step S34. Provide a sixth semi-cured adhesive sheet 3-4 and a sixth rigid layer 3-5. Remove the copper foil at the position of the circular target 5 corresponding to the sixth rigid layer 3-5 to form a third removal section 3-5-1. Perform browning treatment on the copper foil of the sixth rigid layer 3-5. Then place the sixth semi-cured adhesive sheet 3-4 and the sixth rigid layer 3-5 on the seventh rigid layer 3-3 and press them together. Step S35. Create the circuit pattern on the sixth rigid board layer 3-5, then perform browning treatment on the sixth rigid board layer 3-5, and press the sixth rigid board layer 3-5 onto the sixth semi-cured adhesive sheet 3-4. Step S36. Provide a fifth semi-cured adhesive sheet 3-6 and a fifth rigid board layer 3-7, perform a browning treatment on the copper foil of the fifth rigid board layer 3-7, and place the fifth semi-cured adhesive sheet 3-6 and the fifth rigid board layer 3-7 on the sixth rigid board layer 3-5 for pressing to obtain a second rigid board stack.

[0036] The browning treatment speed was 4.0 m / min, the browning temperature was 35℃, and the micro-etching rate was 50 μm / min; the pressure in the high-temperature section during pressing was 420 psi, the pressing temperature was 190℃, and the pressing time was 100 min.

[0037] Figure 6 In step S31, solid copper is made at the corresponding position of the circular target 5 in the eighth rigid layer 3-1 to receive the laser hole when making the circular target in step S4. In step S4, the laser machine makes a composite target when producing laser holes. In step S5, a through hole 6 is made in the center of the ring to form a composite target point of laser ring + through hole, which is used to align the pattern circuit of the first rigid layer 1-7, so that the pattern of the first rigid layer 1-7 is more accurately aligned with the laser hole.

[0038] Example 2 is a 10-layer HDI AR glasses product. Both laser holes and through holes exist in the board. The ring size of the laser holes is 2.2 mil, and the ring size of the through holes is 2.8 mil. During the production process, the defect rate of laser holes was 5.5%, and the defect rate of through holes was 4.1%. After changing to the process of Example 2, the defect rate of laser holes was 0.5%, and the defect rate of through holes was 0%, which is significantly effective and improves the production capacity of the product.

[0039] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to examples, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A circular composite target structure for alignment in an LDI exposure machine, characterized in that: Includes target component (1) and laminated component (3); The target component (1) includes a first rigid plate stack and a mother target (2) disposed on the first rigid plate stack. The first rigid plate stack includes a fourth rigid plate layer (1-1), a third semi-cured adhesive sheet (1-2), a third rigid plate layer (1-3), a second semi-cured adhesive sheet (1-4), a second rigid plate layer (1-5), a first semi-cured adhesive sheet (1-6), and a first rigid plate layer (1-7) arranged sequentially from bottom to top. A trapezoidal mother target (2) extends from the top of the second rigid plate layer (1-5) into the third semi-cured adhesive sheet (1-2). Grooves (4) are provided on the first semi-cured adhesive sheet (1-6) and the first rigid plate layer (1-7) above the mother target (2). The stacked component (3) includes a second rigid plate stack and a circular target (5) disposed on the second rigid plate stack. The second rigid plate stack includes an eighth rigid plate layer (3-1), a seventh semi-cured adhesive sheet (3-2), a seventh rigid plate layer (3-3), a sixth semi-cured adhesive sheet (3-4), a sixth rigid plate layer (3-5), a fifth semi-cured adhesive sheet (3-6), and a fifth rigid plate layer (3-7) disposed sequentially from bottom to top. A circular target (5) is disposed on the second rigid plate stack at a position corresponding to the mother target (2). The circular target (5) is disposed between the fifth rigid plate layer (3-7) and the seventh semi-cured adhesive sheet (3-2).

2. The circular composite target structure for LDI exposure machine alignment as described in claim 1, characterized in that: The fourth hard plate layer (1-1), the third hard plate layer (1-3), the second hard plate layer (1-5), and the first hard plate layer (1-7) all include a hard plate and copper foil disposed on both sides of the hard plate. The third hard plate layer (1-3) removes the copper foil at the position corresponding to the mother target (2) to form a first removal segment (1-3-1). The length of the first removal segment (1-3-1) is 16-25 mil longer than the length at the position corresponding to the mother target (2).

3. The circular composite target structure for LDI exposure machine alignment as described in claim 1, characterized in that: The eighth rigid plate layer (3-1), the seventh rigid plate layer (3-3), the sixth rigid plate layer (3-5), and the fifth rigid plate layer (3-7) all include a rigid plate and copper foil disposed on both sides of the rigid plate. The copper foil at the position corresponding to the circular target (5) of the seventh rigid plate layer (3-3) and the sixth rigid plate layer (3-5) is removed to form the second removal segment (3-3-1) and the third removal segment (3-5-1). The lengths of the second removal segment (3-3-1) and the third removal segment (3-5-1) are both 16-25 mil longer than the length at the position corresponding to the circular target (5).

4. The circular composite target structure for LDI exposure machine alignment as described in claim 1, characterized in that: A through hole (6) is provided in the middle position of the annular target (5) of the laminate (3).

5. The fabrication process of the circular composite target structure for LDI exposure machine alignment as described in any one of claims 1-3, characterized in that: Includes the following steps: Step S1. Fabricate the first rigid board layer; Step S2. The copper foil of the first rigid board layer (1-7) in the first rigid board stack is browned, and then a groove (4) is made on the first rigid board layer (1-7) by a laser machine. Finally, a mother target (2) is made on the second rigid board layer (1-5) along the groove downwards. Step S3. Fabricate the second rigid board layer; Step S4. Brown the copper foil of the fifth rigid layer (3-7) in the second rigid board stack, and then form a circular target (5) on the second rigid board stack corresponding to the mother target (2) using a laser machine.

6. The fabrication process of the circular composite target structure for LDI exposure machine alignment as described in claim 5, characterized in that: Step S1 specifically includes the following steps: Step S11. Provide a fourth rigid board layer (1-1), create circuit patterns on this layer, and then perform browning treatment on the fourth rigid board layer (1-1); Step S12. Provide a third semi-cured adhesive sheet (1-2) and a third rigid plate layer (1-3). The copper foil of the third rigid plate layer (1-3) corresponding to the position of the mother target (2) has been removed to form a first removal section (1-3-1). The copper foil of the third rigid plate layer (1-3) is browned. The fourth rigid plate layer (1-1), the third semi-cured adhesive sheet (1-2) and the fourth rigid plate layer (1-1) are pressed together. Step S13. Create a circuit pattern on the third rigid board layer (1-3), then perform browning treatment on the third rigid board layer (1-3), and press the third rigid board layer (1-3) onto the third semi-cured adhesive sheet (1-2). Step S14. Provide a second semi-cured adhesive sheet (1-4) and a second rigid layer (1-5), perform a browning treatment on the copper foil of the second rigid layer (1-5), and then place the second semi-cured adhesive sheet (1-4) and the second rigid layer (1-5) on the third rigid layer (1-3) for lamination. Step S15. Create a circuit pattern on the second rigid board layer (1-5), then perform browning treatment on the second rigid board layer (1-5), and press the second rigid board layer (1-5) onto the second semi-cured adhesive sheet (1-4). Step S16. Provide a first semi-cured adhesive sheet (1-6) and a first rigid board layer (1-7), perform browning treatment on the copper foil of the first rigid board layer (1-7), and place the first semi-cured adhesive sheet (1-6) and the first rigid board layer (1-7) on the second rigid board layer (1-5) for pressing to obtain a first rigid board stack.

7. The fabrication process of the circular composite target structure for LDI exposure machine alignment as described in claim 5, characterized in that: In step S4, when the laser machine makes the circular target (5), a laser hole with a diameter of 3.5-4mil is selected to be stacked and burned to make a circular target (5) with a width of 8-10mil. The laser energy is 3-5mj, the outer diameter of the circular target is 3.0-3.2mm, and the inner diameter of the circular target is 2.6-2.8mm.

8. The fabrication process of the circular composite target structure for LDI exposure machine alignment as described in claim 5, characterized in that: Step S3 specifically includes the following steps: Step S31. Provide an eighth rigid board layer (3-1), create a circuit pattern on this layer, and then brown the eighth rigid board layer (3-1); Step S32. Provide a seventh semi-cured adhesive sheet (3-2) and a seventh rigid layer (3-3). Remove the copper foil at the position of the circular target (5) of the seventh rigid layer (3-3) to form a second removal section (3-3-1). Perform browning treatment on the copper foil of the seventh rigid layer (3-3). Press the seventh rigid layer (3-1), the seventh semi-cured adhesive sheet (3-2), and the eighth rigid layer (3-1) together. Step S33. Create a circuit pattern on the seventh rigid board layer (3-3), then perform browning treatment on the seventh rigid board layer (3-3), and press the seventh rigid board layer (3-3) onto the seventh semi-cured adhesive sheet (3-2); Step S34. Provide a sixth semi-cured adhesive sheet (3-4) and a sixth rigid layer (3-5). Remove the copper foil at the position of the circular target (5) of the sixth rigid layer (3-5) to form a third removal section (3-5-1). Perform browning treatment on the copper foil of the sixth rigid layer (3-5). Then place the sixth semi-cured adhesive sheet (3-4) and the sixth rigid layer (3-5) on the seventh rigid layer (3-3) and press them together. Step S35. Create a circuit pattern on the sixth rigid board layer (3-5), then perform browning treatment on the sixth rigid board layer (3-5), and press the sixth rigid board layer (3-5) onto the sixth semi-cured adhesive sheet (3-4); Step S36. Provide a fifth semi-cured adhesive sheet (3-6) and a fifth rigid board layer (3-7), perform browning treatment on the copper foil of the fifth rigid board layer (3-7), and place the fifth semi-cured adhesive sheet (3-6) and the fifth rigid board layer (3-7) on the sixth rigid board layer (3-5) for pressing to obtain a second rigid board stack.

9. The fabrication process of the circular composite target structure for LDI exposure machine alignment as described in claim 6 or 8, characterized in that: The browning treatment rate is 3.8-4.2 m / min, the browning temperature is 30-40℃, and the micro-etching rate is 45-60 μm. During the pressing process, the high-temperature section pressure is 380-480 psi, the pressing temperature is 180-200℃, and the pressing time is 80-120 min.

10. The fabrication process of the circular composite target structure for LDI exposure machine alignment as described in claim 5, characterized in that: Step S4 is followed by step S5, which involves making a through hole (6). Step S5 specifically involves drilling a through hole (6) at the center of the circular target (5) of the second hard plate stack. The diameter of the through hole is 1.0-1.5 mm.

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