Test system and test method of domain controller

By using a reconfigurable hardware interface matrix module and automatic identification technology, the interface compatibility and heat dissipation adaptability issues of domain controller testing equipment have been resolved, enabling efficient and accurate testing of multiple domain controller models and meeting the signal integrity requirements of high-speed communication protocols.

CN121325822APending Publication Date: 2026-01-13CHANGAN AUTOMOBILE (GRP) CO LTD
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Patent Information

Application Number
CN202511505301.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-10-21
Publication Date
2026-01-13

AI Technical Summary

Technical Problem

Existing domain controller testing equipment suffers from insufficient interface compatibility, poor thermal testing adaptability, and signal integrity degradation, resulting in resource waste, low testing efficiency, and decreased data accuracy.

Method used

Employing a reconfigurable hardware interface matrix module, a heat dissipation monitoring module, a dynamic analysis module, and a protocol simulation module, the system automatically identifies the domain controller model and heat dissipation method, enabling multi-model compatibility testing, optimizing signal transmission and heat dissipation monitoring, and generating temperature-performance reports.

Benefits of technology

It improves the compatibility and accuracy of the testing system, reduces equipment procurement costs, enhances testing efficiency and data accuracy, and meets the testing requirements of high-speed communication protocols.

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Abstract

A domain controller test system comprises a test management module used for configuring a test file and monitoring the whole test process; the reconfigurable hardware interface matrix module comprises an adapter and is used for connecting the test equipment and the domain controller; the heat dissipation monitoring module comprises a plurality of sensors and is used for collecting heat dissipation data of the domain controller; the dynamic analysis module is used for processing data and generating a temperature-performance report; and the protocol simulation module is used for parallel simulation of a vehicle-mounted communication protocol.
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Description

Technical Field

[0001] This invention relates to the field of electronic testing technology, and more specifically to a testing system and method for a domain controller. Background Technology

[0002] For different application scenarios, the functional positioning and working environment requirements of domain controllers vary greatly. Therefore, the models of domain controllers used are completely different. Different models of domain controllers have significant differences in interface specifications (pin definitions, mechanical dimensions, electrical parameters, etc.). Even domain controllers of the same model may use different heat dissipation methods such as liquid cooling, air cooling, or natural cooling.

[0003] However, current domain controller performance testing mostly relies on single-function testing equipment, which has the following problems: 1. Insufficient Interface Compatibility: Traditional test equipment uses a fixed interface design, meaning a single set of test equipment can typically only be compatible with a specific model of domain controller. However, different models of domain controllers have different interface specifications, causing the test system loaded on the test equipment to be incompatible with the domain controller. Therefore, enterprises need to provide corresponding test equipment for different models of domain controllers, resulting in serious resource waste and failing to meet the need for multiple models of domain controllers to share a single set of test equipment.

[0004] 2. Poor Adaptability of Thermal Testing: Domain controllers vary significantly in their cooling methods (liquid cooling, air cooling, natural cooling), leading to drastically different requirements for testing strategies. However, existing testing systems lack automatic adaptation capabilities, relying entirely on manual adjustments of thermal monitoring parameters by testers. This approach is inefficient in two ways. Firstly, the monitored indicators (such as coolant circulation status, fan operating parameters, ambient temperature, etc.) and threshold values ​​differ for different cooling methods. Testers must manually modify settings according to technical documentation, and repeated adjustments are necessary when switching models, consuming significant time. Secondly, manual operation is prone to errors. The accuracy of thermal parameter settings directly affects the validity of test data. Deviations in parameter settings (such as incorrect threshold settings or missing monitoring indicators) can distort test data, failing to accurately reflect the thermal performance of the domain controller and resulting in inaccurate test results.

[0005] 3. Signal integrity degradation: The signal transmission path of existing test equipment suffers severe attenuation at high frequencies, which cannot meet the testing requirements under high-speed communication protocols, resulting in a decrease in the accuracy of test data. Summary of the Invention

[0006] To address the aforementioned problems, this invention provides a testing system and method for domain controllers. It enables a single testing system to perform temperature performance tests on various models of domain controllers, significantly improving the system's compatibility, optimizing signal integrity, and enhancing testing accuracy.

[0007] The technical solution of the present invention is: a domain controller testing system, comprising: Test management module: Used to configure test files and monitor the entire testing process; Reconfigurable hardware interface matrix module: includes adapters for connecting test equipment and domain controllers; Thermal monitoring module: Includes multiple sensors for collecting thermal data from the domain controller; Dynamic Analysis Module: Used for data processing and generating temperature-performance reports; Protocol simulation module: Used for parallel simulation of vehicle communication protocols.

[0008] Preferably, the adapter head is connected to the matrix box of the test equipment via a magnetic snap-fit ​​structure, and the adapter head is connected to the domain controller via a probe array.

[0009] Preferably, the adapter head has a built-in non-volatile memory that stores an identifier ID. The identifier ID includes the domain controller model and the domain controller's heat dissipation method. The matrix box of the test equipment is equipped with a control board that reads and sends the identifier ID to the test management module via a bus.

[0010] Preferably, the adapter has a built-in impedance matching network containing programmable elements to adjust for common signal transmission requirements within a range and to adapt to the electrical characteristics of different domain controller models.

[0011] A testing method using the above-mentioned domain controller testing system includes the following steps: 1) Connect the test equipment to the domain controller via an adapter; 2) The test equipment identifies the adapter's identifier ID and sends it to the test management module; 3) The test management module calls the corresponding configuration test file according to the content of the identifier ID, activates the sensor corresponding to the heat dissipation monitoring module, and redefines the probe array of the adapter head; 4) The dynamic analysis module processes the data collected by the sensors of the heat dissipation monitoring module, adjusts the test strategy in real time, and generates a temperature-performance report.

[0012] Preferably, in step 3), if the heat dissipation method of the domain controller in the ID is identified as liquid cooling, the heat dissipation monitoring module activates the coolant temperature sensor, flow meter, and pressure transmitter; if the heat dissipation method of the domain controller in the ID is identified as air cooling, the heat dissipation monitoring module activates the temperature sensor, wind speed sensor, and wind pressure transmitter; if the heat dissipation method of the domain controller in the ID is identified as natural cooling, the heat dissipation monitoring module activates the ambient temperature sensor and the domain controller surface temperature sensor.

[0013] Preferably, in step 3), the probe array of the adapter head is redefined, specifically by: sending a sweep signal within a certain frequency range to identify valid signal pins; disabling conflicting pin combinations that are shorted between power and ground; recording the mapping relationship and storing it in non-volatile memory.

[0014] Preferably, in step 4), if the domain controller is a liquid-cooled domain controller, the test strategy is as follows: when the coolant temperature is < -20℃, test the cold start function; when the coolant temperature is > 100℃, activate the frequency reduction protection test. If the domain controller is an air-cooled domain controller, the test strategy is as follows: when the inlet air temperature is < -15℃, extend the preheating time; when the outlet air temperature is > 90℃ or the wind speed is < 1m / s and lasts for 10s, terminate the test. If the domain controller is a naturally cooled domain controller, the test strategy is as follows: when the ambient temperature is >60℃, reduce the test load; when the surface temperature difference of the domain controller is >20℃, trigger heat distribution detection.

[0015] Preferably, the testing strategy further includes fault injection, specifically: If the domain controller is a liquid-cooled heat dissipation domain controller, when the coolant temperature rise rate is >5℃ / s, the fault injection is: simulating a 50% step drop in coolant flow rate for 5s and maintaining a pressure <0.1MPa for 10s. If the domain controller is an air-cooled domain controller, when the inlet air temperature rise rate is >3℃ / s, the fault injection is: simulated fan stop for 10s and air duct blockage for 15s. If the domain controller is a naturally cooled domain controller, and the surface temperature of the domain controller rises at a rate greater than 2°C / s, the fault injection will be: simulate an ambient temperature rise of 10°C / min until the ambient temperature reaches 80°C.

[0016] Preferably, it further includes a signal integrity optimization step, specifically: ① Send a specific test pattern to measure eye opening; ② The parameters of the impedance matching network built into the adapter are adjusted through a closed-loop control algorithm; ③ After adjusting the impedance matching network parameters, if the insertion loss of the test pattern continues to be greater than 2dB@10GHz, the probe cleaning procedure is triggered.

[0017] The advantages of this invention are: 1. This invention enables a single test system to be compatible with 8-12 different models of domain controllers (regardless of whether they are liquid-cooled, air-cooled, or naturally cooled) by setting up a reconfigurable hardware interface matrix module. This eliminates the need to purchase test equipment separately for each model, reducing initial equipment procurement costs by 60%-70%, increasing equipment utilization from 30% to over 85%, reducing redundant investment, and lowering costs.

[0018] 2. This invention enables rapid configuration of test files and test strategies by setting an identification ID on the adapter head, which is read and transmitted to the test management module by the test equipment. This eliminates the need for manual adjustments, ensuring test accuracy and improving the efficiency of switching between multiple models (saving more than 90% of the time compared to manual adjustments).

[0019] 3. This invention reduces the insertion loss of 10GHz high-frequency signals to 0.8dB and increases the eye diagram opening by 40% through a programmable impedance matching network, thereby optimizing signal integrity and enabling the system to meet the test requirements of high-speed communication protocols (bit error rate ≤1E-12). Attached Figure Description

[0020] Figure 1 This is a framework diagram of the test system of the present invention; Figure 2 This is a schematic diagram of the connection of the adapter head of the present invention; Figure 3 This is a schematic diagram of the monitoring circuit during testing of the liquid-cooled heat dissipation domain controller of the present invention; Figure 4 This is a logic diagram showing the model-heat dissipation type association of the domain controller of the present invention; Figure 5 This is a flowchart of the present invention. Detailed Implementation

[0021] See Figures 1 to 5 A domain controller testing system, comprising: Test management module: Used to configure test files and monitor the entire testing process; The reconfigurable hardware interface matrix module includes an adapter for connecting test equipment and a domain controller. The adapter connects to the matrix box of the test equipment via a magnetic-snap structure and to the domain controller via a probe array. The adapter has a built-in non-volatile memory storing an identifier ID, which includes the domain controller's model number and heat dissipation method. The matrix box of the test equipment has a control board that reads and sends the identifier ID to the test management module via a bus. The adapter also includes a built-in impedance matching network with programmable components to adjust for common signal transmission requirements and adapt to the electrical characteristics of different domain controller models.

[0022] Thermal monitoring module: Includes multiple sensors for collecting thermal data from the domain controller; Dynamic Analysis Module: Used for data processing and generating temperature-performance reports; Protocol simulation module: Used for parallel simulation of vehicle communication protocols.

[0023] A testing method using the above-mentioned domain controller testing system includes the following steps: 1) Connect the test equipment to the domain controller via an adapter; 2) The test equipment identifies the adapter's identifier ID and sends it to the test management module; 3) The test management module calls the corresponding configuration test file based on the content of the identifier ID, and activates the corresponding sensors of the heat dissipation monitoring module. Specifically: if the heat dissipation method of the domain controller in the identifier ID is liquid cooling, the heat dissipation monitoring module activates the coolant temperature sensor, flow meter, and pressure transmitter; if the heat dissipation method of the domain controller in the identifier ID is air cooling, the heat dissipation monitoring module activates the temperature sensor, wind speed sensor, and wind pressure transmitter; if the heat dissipation method of the domain controller in the identifier ID is natural cooling, the heat dissipation monitoring module activates the ambient temperature sensor, the domain controller, and redefines the probe array of the adapter head. The redefinition specifically involves: sending a sweep frequency signal within a certain frequency range to identify valid signal pins; disabling conflicting pin combinations that are shorted between power and ground; recording the mapping relationship and storing it in non-volatile memory.

[0024] 4) The dynamic analysis module processes the data collected by the sensors of the heat dissipation monitoring module, adjusts the test strategy in real time, and generates a temperature-performance report.

[0025] If the domain controller is a liquid-cooled domain controller, the test strategy is as follows: when the coolant temperature is <-20℃, test the cold start function; when the coolant temperature is >100℃, activate the frequency reduction protection test. If the domain controller is an air-cooled domain controller, the test strategy is as follows: when the inlet air temperature is < -15℃, extend the preheating time; when the outlet air temperature is > 90℃ or the wind speed is < 1m / s and lasts for 10s, terminate the test. If the domain controller is a naturally cooled domain controller, the test strategy is as follows: when the ambient temperature is >60℃, reduce the test load; when the surface temperature difference of the domain controller is >20℃, trigger heat distribution detection.

[0026] The testing strategy also includes fault injection, specifically: If the domain controller is a liquid-cooled heat dissipation domain controller, when the coolant temperature rise rate is >5℃ / s, the fault injection is: simulating a 50% step drop in coolant flow rate for 5s and maintaining a pressure <0.1MPa for 10s. If the domain controller is an air-cooled domain controller, when the inlet air temperature rise rate is >3℃ / s, the fault injection is: simulated fan stop for 10s and air duct blockage for 15s. If the domain controller is a naturally cooled domain controller, and the surface temperature of the domain controller rises at a rate greater than 2°C / s, the fault injection will be: simulate an ambient temperature rise of 10°C / min until the ambient temperature reaches 80°C.

[0027] This method also includes a signal integrity optimization step, specifically: ① Send a specific test pattern to measure eye opening; ② The parameters of the impedance matching network built into the adapter are adjusted through a closed-loop control algorithm; ③ After adjusting the impedance matching network parameters, if the insertion loss of the test pattern continues to be greater than 2dB@10GHz, the probe cleaning procedure is triggered.

[0028] I. Domain Controller Test System The testing system includes a test management module, a reconfigurable hardware interface matrix module, a heat dissipation monitoring module, a dynamic analysis module, and a protocol simulation module, all of which work collaboratively. The collaborative timing logic is as follows: after the test management module issues a command, the heat dissipation monitoring module must activate the sensors within 50ms; the dynamic analysis module receives test data and updates the 3D model every 100ms; after a fault alarm is triggered, the test management module must send an emergency power-off command to the PLC within 1 second, and simultaneously, the protocol simulation module stops sending messages.

[0029] 1. Test Management Module As the control core of the testing system, it is responsible for configuring test cases, monitoring the testing process, and issuing instructions to other modules via gigabit Ethernet (the instructions include test item ID, parameter thresholds, and fault injection configuration).

[0030] 2. Reconfigurable hardware interface matrix module To achieve compatibility of a single system with multiple domain controller products, it includes replaceable modular adapters that connect to the matrix box of the testing equipment via a magnetic-snap mechanism (attachment force ≥15N, positioning accuracy ±0.05mm). Interface switching between different domain controller specifications can be completed within 30 seconds, eliminating the need for a separate testing system for each domain controller. Customized interface for the domain controller side of the adapter: includes a probe array, the probe pin spacing can be adjusted according to the interface requirements of different domain controllers, and the contact resistance is kept at a low level to ensure signal transmission quality; The matrix box-side standard interface of the adapter head: high-density connectors support stable high-speed signal transmission; The adapter has a built-in programmable impedance matching network, which includes programmable components and an adjustment range that covers common signal transmission requirements, adapting to the electrical characteristics of different domain controllers.

[0031] Detailed hardware design: Modular adapter Mechanical Structure: Employs a beryllium copper probe with a 2μm gold-plated layer (rated current 3A, contact resistance ≤50mΩ), with a pin spacing of 0.5-3mm electrically adjustable (accuracy ±0.01mm). The probe base has a built-in spring buffer structure (compression stroke 0.8mm, spring force 5-8N). It integrates 16 3mm×5mm neodymium iron boron magnets (NSN polarity alternating arrangement, single attraction force ≥1.2N, total attraction force ≥19.2N), coupled with stainless steel mechanical buckles (locking stroke 1.5mm, unlocking force ≥20N). PTFE insulating gaskets are placed around the magnets. It has two built-in CMOS optical sensors (resolution 1280×720, frame rate 30fps), paired with infrared positioning marks on the side of the matrix box (positioning accuracy ±0.05mm).

[0032] Electrical Design: The AD8138 programmable attenuator and the EP2C8F256C8 FPGA form an impedance matching network (50-150Ω, 1Ω step), and the SPI bus receives parameter commands; the signal channel is connected in series with a high-speed optocoupler (6N137, 10MHz), and the power channel is equipped with a 2A self-resetting fuse (PTTC, trigger current 2.5A); the EP2C8F256C8 FPGA communicates with the XC7A35T FPGA of the matrix box body via Gigabit Ethernet (response ≤10ms). The former focuses on impedance regulation and control, while the latter is responsible for high-speed signal routing. Their functions do not overlap, avoiding signal processing conflicts.

[0033] Impedance Matching Network: This network is the core component for signal integrity optimization, comprising three main functional units: ① Adjustment Unit (AD8138 Programmable Attenuator): Supports continuous impedance adjustment from 50-150Ω in 1Ω steps, with insertion loss ≤0.8dB in the 10GHz band, meeting the requirements for low-attenuation transmission of high-speed signals; ② Control Unit (EP2C8F256C8 FPGA): Receives adjustment commands from the dynamic analysis module via SPI bus (10Mbps rate), parses the commands into control signals for the AD8138 (voltage 0~3.3V), and simultaneously acquires reflection coefficient data from the high-speed ADC feedback, uploading it to the dynamic analysis module; ③ Auxiliary Unit: Each signal channel is connected in parallel with a 0.1μF high-frequency decoupling capacitor (to suppress high-frequency noise above 10GHz) and in series with a 100Ω terminating resistor (to match the characteristic impedance of the transmission line), ensuring reduced signal reflectivity and return loss ≥25dB@5GHz; For the electrical differences between different domain controller models (such as 3.3V LVDS signals, 5V CAN FD signals), the FPGA... The system reads the preset initial impedance value from the test configuration file and completes the initial adaptation within 10ms after power-on, without the need for manual adjustment.

[0034] The matrix box body of the test equipment Signal routing: Implements dynamic routing of 128 high-speed signals based on XC7A35T FPGA, supporting LVDS and PCIe 4.0 (bandwidth up to 10GHz). The FPGA receives configuration commands via Gigabit Ethernet (response ≤10ms). Power supply: TDK-Lambda switching power supply (output 3.3V / 5V / 12V / 24V, total power 500W), independent DC-DC converter for each channel (efficiency ≥92%), supports PWM dimming. Interface panel: 2 SFP+ fiber optic interfaces, 4 RJ45 Gigabit Ethernet ports, 1 USB 3.0 interface, and 16 standard test probe interfaces.

[0035] 3. Heat dissipation monitoring module Based on the model and cooling method of the currently connected domain controller, activate the corresponding sensor group to collect parameters and upload the parameters in real time: For liquid-cooled heat dissipation domain controllers: coolant temperature sensor (45℃~150℃, ±0.5℃), flow meter (0.5-10L / min, ≤1% FS), pressure transmitter (0-1MPa, 4-20mA). For air-cooled heat dissipation domain controllers: temperature sensor (45℃~150℃, ±0.5℃), wind speed sensor (0.5-20m / s, ≤2% FS), wind pressure transmitter (0-5kPa, 4-20mA); For controllers in natural cooling heat dissipation zones: ambient temperature sensor (-45℃~85℃, ±0.5℃), surface temperature sensor (contact type, ±0.3℃).

[0036] 4. Dynamic Analysis Module A temperature-performance correlation report is generated based on test data. The thermal resistance coefficient is calculated in real time (using the corresponding formula according to the heat dissipation method of the current domain controller model). A three-dimensional model of temperature-clock frequency-power consumption is established. Fault injection is triggered when the coolant temperature rise rate of the liquid-cooled domain controller is >5℃ / s, the inlet air temperature rise rate of the air-cooled domain controller is >3℃ / s, or the surface temperature rise rate of the domain controller of the natural cooling domain controller is >2℃ / s.

[0037] Detailed hardware design: Core computing unit: NVIDIA Jetson Xavier NX (6-core A57, 2.1GHz, 512-core Volta GPU), 8GB LPDDR4 (51.2GB / s), 128GB eMMC; connected to a high-speed ADC (AD9680, 14-bit precision, 1GSPS sampling rate) via PCIe 3.0 interface (8GB / s) for acquiring the reflection coefficient signal of the impedance matching network; communicates with the test management module via Gigabit Ethernet, and interacts with the FPGA of the impedance matching network via SPI bus (10Mbps) to issue adjustment commands and receive feedback data; Impedance matching control logic: First, a PRBS31 test pattern (rate 10Gbps) is sent to the impedance matching network. The output eye diagram signal is acquired through a high-speed ADC, and the eye opening (target ≥0.4V) and insertion loss (target ≤2dB@10GHz) are calculated. If the target is not met, the impedance adjustment is generated based on the PID algorithm (e.g., when the current impedance is 50Ω and the insertion loss is 2.2dB, it is calculated that it needs to be adjusted to 55Ω), and sent to the FPGA via the SPI bus. After the FPGA drives the AD8138 to adjust the attenuation value, the high-speed ADC acquires the reflection coefficient again (the impedance matching error is calculated through the S11 parameter) and feeds it back to the dynamic analysis engine until the error is <5% and the closed-loop control cycle is ≤20ms. Alarm control unit: LM311 comparator monitors temperature rise rate, 2-channel 10A relay-controlled power supply, power off 100ms after alarm, RS485 sends fault code.

[0038] 5. Protocol Simulation Module It supports parallel simulation of multiple mainstream vehicle communication protocols such as CAN FD and Ethernet, meeting the needs of multi-protocol interaction testing.

[0039] Detailed hardware design: CAN FD emulation unit: Microchip MCP2518FD controller (8Mbps), TI TJA1057T / 3 transceiver (40m bus, 32 nodes), ISO1540 isolation (2500Vrms); Ethernet emulation unit: Intel I210-IT Gigabit Ethernet NIC (IEEE 802.3), Broadcom BCM53128 24-port switch (≥10Gbps), DP83640 PTP clock (±100ns); Protocol processing unit: NXP i.MX8M Plus (4-core A53, 2.0GHz), 4GB LPDDR4, 64GB eMMC, running Linux and CANoe, custom message sending (adjustable from 1ms to 10s); the high-speed protocol signals generated by this module (such as 10Gbps Ethernet signals) need to be optimized by the impedance matching network of the reconfigurable hardware interface matrix before being injected into the domain controller. Before injection, the signal waveform is calibrated by an oscilloscope (bandwidth ≥ 20GHz) to ensure compliance with automotive protocol standards; during the injection process, 6N137 high-speed optocouplers are used for isolation to avoid electrical interference from the heat dissipation monitoring module and ensure signal integrity (bit error rate ≤ 1E-12).

[0040] II. Domain Controller Testing Methods Based on the above testing system, the following steps are included: 1. Automatic configuration loading The domain controller model and heat dissipation internal type are automatically identified by recognizing the adapter header ID. The test management module loads the corresponding test configuration file (including interface definition, heat dissipation type, temperature threshold and other parameters) based on the ID, without manual intervention, to adapt to the test requirements of different domain controller models. The implementation of the adapter identification and heat dissipation type recognition logic is as follows: The adapter has a built-in non-volatile memory (such as EEPROM) that stores a unique 16-bit binary "Adapter ID", which is bound to the domain controller model. The XC7A35T FPGA control board on the matrix box side reads this ID through the I2C bus and transmits it to the test management module. The test management module pre-stores a mapping table of "Adapter ID-Domain Controller Model-Heat Dissipation Type" (e.g., ID=0x0001 corresponds to model A-liquid cooling, ID=0x0002 corresponds to model B-air cooling). By querying the mapping table, the heat dissipation type of the current domain controller can be determined, and the corresponding sensor group is automatically activated (liquid cooling activates temperature sensor, flow meter, pressure transmitter; air cooling activates temperature sensor, wind speed sensor, wind pressure transmitter; natural cooling activates ambient temperature sensor, surface temperature sensor), without the need for manual switching.

[0041] 2. Pin function redefinition The pin adjustment function is implemented in real time using a programmable logic device (FPGA), with a reconfiguration time of ≤10ms. Specifically: ① Send a 0.1-10GHz sweep frequency signal to identify valid signal pins; ②Disable conflicting pin combinations that short power to ground; ③ Store the pin mapping relationship in non-volatile memory to adapt to the pin definitions of different domain controllers.

[0042] 3. Testing strategy adjustment Based on the current domain controller's heat dissipation method and real-time temperature parameters, the test process is automatically optimized: Liquid-cooled domain controllers: When the coolant temperature is < -20℃, the cold start function is tested first; (Cold start function definition: refers to the process of the domain controller going from a completely power-off state to normal power-on, completing core chip initialization, and responding to external communication commands in a low-temperature environment with a coolant temperature < -20℃. This verifies the hardware reliability at low temperatures and avoids problems such as chip failure to wake up due to low temperature; during the test, the protocol simulation module sends 3 wake-up messages according to automotive specifications, and the dynamic analysis engine monitors whether a feedback message is received from the domain controller within 500ms. If no feedback message is received or the core clock frequency is lower than 90% of the rated value, the cold start is considered to have failed). When the coolant temperature is >100℃, the frequency reduction protection test is activated. (Frequency reduction protection is defined as a protection mechanism in which the domain controller automatically reduces the clock frequency of the core components (CPU / FPGA) when the coolant temperature is >100℃ (close to the boiling point of the coolant or exceeding the upper limit of the chip's safe temperature). This reduces power consumption and heat generation by reducing the switching frequency of transistors, preventing hardware burn-out or permanent performance degradation. During the test, the dynamic analysis engine monitors whether the core frequency drops from the rated value (e.g., 2.1GHz) to the protection value (e.g., 1.2GHz) within 3 seconds after the temperature exceeds 100℃, and whether the power consumption decreases by ≥30%. If the standard is not met, the frequency reduction protection is deemed to have failed.)

[0043] For air-cooled domain controllers: extend the preheating time and increase the inlet air temperature when the inlet air temperature is < -15℃; terminate the test when the outlet air temperature is > 90℃ or the air velocity is < 1m / s for 10 seconds. Natural cooling domain controller: When the ambient temperature is >60℃, reduce the test load; when the temperature difference on the controller surface is >20℃, trigger heat distribution detection.

[0044] 4. Fault Injection Simulate a typical fault based on the current domain controller's heat dissipation method: Liquid-cooled domain controller: Flow rate drops by 50% for 5 seconds; Pressure remains <0.1MPa for 10 seconds. Air-cooled domain controller: Fan stops (fan speed drops to 0) for 10 seconds; airflow is blocked (fan speed drops by 70%) for 15 seconds; Natural cooling heat dissipation type domain controller: The ambient temperature rises rapidly by 10℃ / min until the ambient temperature reaches 80℃; 5. Signal integrity optimization Send PRBS31 test pattern to measure eye opening, adjust impedance matching network parameters using PID algorithm, and trigger probe cleaning procedure when insertion loss > 2dB@10GHz.

[0045] The specific implementation process is as follows: Step 1: Hardware infrastructure setup. Based on a programmable impedance matching network, this network is connected in series in the signal transmission path of "domain controller → adapter head → matrix box → dynamic analysis engine". The adapter head uses a 2μm gold-plated beryllium copper probe (contact resistance ≤50mΩ) on the domain controller side. The signal channel is connected in series with a 6N137 high-speed optocoupler (supporting 10MHz bandwidth). The power channel is equipped with a 2A self-resetting fuse to reduce the impact of contact loss and electrical interference on the signal.

[0046] Step 2: Test Pattern Transmission and Signal Acquisition. The dynamic analysis engine sends a PRBS31 test pattern (simulating the characteristics of a high-speed automotive protocol signal) at a rate of 10Gbps to the impedance matching network; the high-speed ADC (AD9680, 14-bit precision, 1GSPS sampling rate) on the matrix box side acquires the signal waveform after passing through the network in real time, and transmits the digital signal to the dynamic analysis engine through the PCIe 3.0 interface (rate 8GB / s) to generate an eye diagram and calculate key indicators: eye diagram opening (target ≥0.4V) and insertion loss (target ≤2dB@10GHz).

[0047] Step 3: PID Closed-Loop Impedance Adjustment. If the eye diagram opening is <0.4V or the insertion loss is >2dB@10GHz, the dynamic analysis module calculates the impedance adjustment amount using a PID algorithm (adjustment data is based on historical records stored in a 128GB eMMC). For example, if the current impedance is 50Ω and the insertion loss is 2.2dB, the algorithm calculates that it needs to be adjusted to 55Ω. Then, the command is sent to the EP2C8F256C8 FPGA via the SPI bus (10Mbps rate). The FPGA drives the AD8138 to complete the impedance adjustment. After adjustment, signal acquisition and index calculation are repeated until the index is met. The closed-loop control cycle is ≤20ms.

[0048] Step 4: Fault intervention and maintenance. When the insertion loss is consistently >2dB@10GHz (indicated by increased contact resistance due to probe oxidation), the test management module triggers the probe cleaning procedure: pauses the test and pops up the adapter head, prompting to clean the gold plating layer of the probe; after cleaning, the above steps are repeated to ensure that the signal integrity continues to meet the requirements, ultimately achieving the optimization effect of 10GHz high-frequency signal insertion loss ≤0.8dB, eye diagram opening improved by 40%, and bit error rate ≤1E-12, adapting to the testing requirements of vehicle high-speed communication protocols.

[0049] Example 1: Compatibility Testing of Multiple Domain Controller Models Test preparation: Connect adapter A (corresponding to domain controller model A) to the matrix box via a magnetic snap-fit ​​mechanism. The system will automatically identify the adapter ID and load the test configuration file for model A. Test execution: After completing the functional and performance tests of the Model A domain controller, remove adapter head A and replace it with adapter head B (corresponding to the Model B domain controller). Complete the connection and configuration loading within 30 seconds. Results Comparison: A single system continuously completed tests on domain controllers of models A and B without replacing any other hardware, and the test data all met the accuracy requirements, verifying the system's compatibility.

[0050] Example 2: Low-temperature cold start test Environmental settings: The heat dissipation monitoring module lowers the coolant temperature to -40℃, the flow rate is 2L / min, and the pressure is 0.2MPa; Test procedure: Delay power supply for 500ms, the protocol simulation module sends 3 CAN FD wake-up messages, the dynamic analysis engine monitors the response time, and if no ACK is received within 500ms, the cold start is judged to have failed; Results Recording: The test management module saves parameters such as response time and startup current to the database.

[0051] Example 3: Coolant Leakage Fault Test Initial conditions: coolant temperature 105℃, flow rate 3.0L / min, pressure 0.3MPa, ambient temperature 25℃±2℃; Fault injection: Reduce the flow rate to 1.5 L / min (a 50% decrease) within 100 ms and maintain this for 5 seconds; Judgment criteria: If the frequency reduction protection is not triggered when the temperature rise rate is >5℃ / s, it is judged as non-compliant. When non-compliant, the system stops testing and generates a fault report, prompting to check the sealing of the domain controller's heat dissipation circuit.

[0052] Example 4: High-load test of air-cooled controller Environment settings: The heat dissipation monitoring module is switched to air-cooling mode, the inlet air temperature is set to 60℃, and the initial air velocity is 5m / s; Test procedure: Gradually increase the domain controller load to 120% of its rated power, and record the outlet air temperature and CPU frequency every 5 minutes; Judgment criteria: If the controller fails to activate the frequency reduction protection within 3 seconds when the outlet air temperature is >90℃, it is judged as non-compliant.

[0053] Example 5: Ambient Temperature Test of Natural Cooling Controller Environmental settings: With active cooling devices off, the ambient temperature rises from 25°C to 80°C at a rate of 5°C / min. Test procedure: Continuously monitor the surface temperature distribution of the controller (sampling points ≥ 8) and the temperature of the core chip; Judgment criteria: If the surface temperature difference between any two points is greater than 25℃, or the core temperature is greater than 110℃, it is judged as not meeting the standard.

[0054] Example 6: Switching between different heat dissipation methods for multiple models Test Preparation 1: Connect adapter A (corresponding to liquid-cooled domain controller model A) to the matrix box via a magnetic-snap mechanism. The system will automatically identify model A and load its configuration file (including liquid cooling parameters). Test execution 1: After completing the test of model A (liquid cooling), remove adapter A and replace it with adapter B (corresponding to the air-cooled model B domain controller, the interface is different from A). Automatic adaptation: The system identifies model B through adapter header B and automatically loads its configuration file (including air-cooling parameters), without the need for manual adjustment of the heat dissipation monitoring module; Test Execution 2: Complete the test of Model B (air-cooled) to verify the system's compatibility with domain controllers of different models and with different cooling methods.

[0055] Example 7: High Temperature Test of Naturally Cooled Model Environment settings: The system recognizes that the current domain controller is a natural cooling model C domain controller and automatically activates the ambient temperature sensor and surface temperature sensor; Test procedure: The ambient temperature is gradually increased from 25℃ to 70℃, and the surface temperature distribution and operating status of the controller are recorded every 10℃. Judgment criteria: If the controller does not activate the power consumption limiting strategy when the ambient temperature is ≥60℃, or the maximum surface temperature exceeds 105℃, it is judged as non-compliant.

[0056] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications made to the present invention by those skilled in the art without departing from the spirit of the present invention shall fall within the protection scope of the present invention.

Claims

1. A domain controller testing system, characterized in that: include: Test management module: Used to configure test files and monitor the entire testing process; Reconfigurable hardware interface matrix module: includes adapters for connecting test equipment and domain controllers; Thermal monitoring module: Includes multiple sensors for collecting thermal data from the domain controller; Dynamic Analysis Module: Used for data processing and generating temperature-performance reports; Protocol simulation module: Used for parallel simulation of vehicle communication protocols.

2. The domain controller testing system according to claim 1, characterized in that: The adapter head is connected to the matrix box of the test equipment via a magnetic snap-fit ​​structure, and the adapter head is connected to the domain controller via a probe array.

3. The domain controller testing system according to claim 1, characterized in that: The adapter head has a built-in non-volatile memory that stores an identifier ID. The identifier ID includes the domain controller model and the domain controller's heat dissipation method. The matrix box of the test equipment is equipped with a control board that reads and sends the identifier ID to the test management module via a bus.

4. The domain controller testing system according to claim 1, characterized in that: The adapter has a built-in impedance matching network containing programmable elements to adjust for common signal transmission requirements within a range and adapt to the electrical characteristics of different domain controller models.

5. A test method using the domain controller test system as described in claims 1 to 4, characterized in that: Includes the following steps: 1) Connect the test equipment to the domain controller via an adapter; 2) The test equipment identifies the adapter's identifier ID and sends it to the test management module; 3) The test management module calls the corresponding configuration test file according to the content of the identifier ID, activates the sensor corresponding to the heat dissipation monitoring module, and redefines the probe array of the adapter head; 4) The dynamic analysis module processes the data collected by the sensors of the heat dissipation monitoring module, adjusts the test strategy in real time, and generates a temperature-performance report.

6. The method according to claim 5, characterized in that: Step 3): If the domain controller in the ID is identified as liquid cooling, the heat dissipation monitoring module activates the coolant temperature sensor, flow meter, and pressure transmitter; if the domain controller in the ID is identified as air cooling, the heat dissipation monitoring module activates the temperature sensor, wind speed sensor, and wind pressure transmitter; if the domain controller in the ID is identified as natural cooling, the heat dissipation monitoring module activates the ambient temperature sensor and the domain controller surface temperature sensor.

7. The method according to claim 5, characterized in that: In step 3), the probe array of the adapter head is redefined, specifically by: sending a sweep signal within a certain frequency range to identify valid signal pins; disabling conflicting pin combinations that are shorted between power and ground; and recording the mapping relationship and storing it in non-volatile memory.

8. The method according to claim 5, characterized in that: In step 4), if the domain controller is a liquid-cooled domain controller, the test strategy is as follows: when the coolant temperature is < -20℃, test the cold start function; when the coolant temperature is > 100℃, activate the frequency reduction protection test. If the domain controller is an air-cooled domain controller, the test strategy is as follows: when the inlet air temperature is < -15℃, extend the preheating time; when the outlet air temperature is > 90℃ or the wind speed is < 1m / s and lasts for 10s, terminate the test. If the domain controller is a naturally cooled domain controller, the test strategy is as follows: when the ambient temperature is >60℃, reduce the test load; when the surface temperature difference of the domain controller is >20℃, trigger heat distribution detection.

9. The method according to claim 8, characterized in that: The testing strategy also includes fault injection, specifically: If the domain controller is a liquid-cooled heat dissipation domain controller, when the coolant temperature rise rate is >5℃ / s, the fault injection is: simulating a 50% step drop in coolant flow rate for 5s and maintaining a pressure <0.1MPa for 10s. If the domain controller is an air-cooled domain controller, when the inlet air temperature rise rate is >3℃ / s, the fault injection is: simulated fan stop for 10s and air duct blockage for 15s. If the domain controller is a naturally cooled domain controller, and the surface temperature of the domain controller rises at a rate greater than 2°C / s, the fault injection will be: simulate an ambient temperature rise of 10°C / min until the ambient temperature reaches 80°C.

10. The method according to claim 5, characterized in that: It also includes signal integrity optimization steps, specifically: ① Send a specific test pattern to measure eye opening; ② The parameters of the impedance matching network built into the adapter are adjusted through a closed-loop control algorithm; ③ After adjusting the impedance matching network parameters, if the insertion loss of the test pattern continues to be greater than 2dB@10GHz, the probe cleaning procedure is triggered.