Pressure-sensitive electronic pen and preparation method thereof

Abstract

The invention discloses a pressure-sensitive electronic pen and a preparation method thereof.The electronic pen comprises a pen body, a main board, a pen point module, a pressure-sensitive module and a main support, the main support is arranged in the pen body, the main board is arranged on the main support, the pressure-sensitive module comprises a strain sensor and a sensor board, an adapter board is arranged on the main board, the sensor board is correspondingly arranged on the main board, the strain sensor is correspondingly arranged on the sensor board, and the adapter board is arranged on the main board. The adapter plate is connected with the pen point module, and the adapter plate enables the tail end of the pen point module to act on the sensor plate. Pressure is maintained and monitored through deformation of the adapter plate and the sensor plate, so that the overall structure is firmer, the pen point module cannot be loosened or twisted, and the writing hand feeling is improved.

Description

Technical Field

[0001] This invention relates to the field of electronic pen technology, and in particular to a pressure-sensitive electronic pen and its manufacturing method. Background Technology

[0002] Currently, existing electronic pens (such as the pressure-sensitive electronic pen with overpressure protection disclosed in invention patent application number CN202311231997.7) use a loose pressure sensor mechanism. The pen tip cap is easily wobbled when attached to the pen; pulling the pen tip outwards causes it to loosen, and pushing the pen tip inwards or during writing also results in a loose pen tip, leading to a poor writing feel. This is because the pressure-sensitive mechanism and the pressure sensor only make contact and do not have a physical connection. Summary of the Invention

[0003] The technical problem to be solved by the embodiments of the present invention is to provide a pressure-sensitive electronic pen and its preparation method to prevent the pen tip from becoming loose.

[0004] To address the aforementioned technical problems, this invention provides a pressure-sensitive electronic pen, comprising a pen body, a main board, a pen tip module, a pressure-sensitive module, and a main support. The main support is located within the pen body, and the main board is mounted on the main support. The pressure-sensitive module includes a strain sensor and a sensor board. An adapter board is provided on the main board, and the sensor board is correspondingly mounted on the main board. The strain sensor is correspondingly mounted on the sensor board. The adapter board connects to the pen tip module, and the adapter board allows the end of the pen tip module to act on the sensor board.

[0005] Furthermore, the stiffness coefficient of the adapter plate is smaller than that of the sensor plate.

[0006] Furthermore, the adapter board and sensor board are arranged side by side at intervals on the front of the motherboard.

[0007] Furthermore, the two sides of the adapter board and the two sides of the sensor board are fixedly connected to the motherboard.

[0008] Furthermore, the front end of the motherboard is U-shaped, with the two sides of the adapter board connected to the two sides of the front end of the motherboard, and the two sides of the sensor board connected to the two sides of the front end of the motherboard.

[0009] Furthermore, both sides of the adapter board and both sides of the sensor board are U-shaped.

[0010] Furthermore, the sensor board and the corresponding U-shaped bottom of the front end of the motherboard are spaced apart by a preset distance L.

[0011] Furthermore, the pen tip module applies a preset pressure to the sensor board under the action of the adapter board.

[0012] Furthermore, the pen tip module has a front limiting part and a rear limiting part protruding, and the main support has a limiting part, which is located between the front limiting part and the rear limiting part.

[0013] Accordingly, embodiments of the present invention also provide a method for preparing a pressure-sensitive electronic pen, comprising: Step 1: Prepare the pen body, main board, pen tip module, pressure-sensitive module, main support, and adapter board; Step 2: Connect the adapter board and the pen tip module, install the pressure-sensitive module on the motherboard, use a positioning pad with a thickness of L between the sensor board and the end face of the motherboard, apply pressure to the sensor board through the pen tip module, and then solder the sensor board to the motherboard. Step 3: Remove the positioning plate, so that the pen tip module applies a preset pressure to the sensor board of the pressure-sensitive module and maintains it, and then solder the adapter board onto the motherboard; Step 4: Install the motherboard onto the main bracket, and then insert it into the pen body to obtain the pressure-sensitive electronic pen.

[0014] The beneficial effects of this invention are as follows: This invention uses the deformation of the adapter plate and sensor plate to maintain and monitor pressure, making the overall structure more robust, preventing the pen tip module from loosening or twisting, and improving the writing feel. Attached Figure Description

[0015] Figure 1 This is a front view of the pressure-sensitive electronic pen according to an embodiment of the present invention.

[0016] Figure 2 yes Figure 1 Sectional view at point AA.

[0017] Figure 3 This is a partial internal structure diagram of the pressure-sensitive electronic pen according to an embodiment of the present invention.

[0018] Figure 4 This is a structural diagram of the pressure-sensitive module according to an embodiment of the present invention.

[0019] Figure 5 This is a structural diagram of the pen tip module according to an embodiment of the present invention.

[0020] Figure 6 This is a schematic diagram of the fabrication process of the pressure-sensitive electronic pen according to an embodiment of the present invention.

[0021] Explanation of icon numbers 1. Positioning plate; 2. Compression spring; 10. Pen body; 20. Main board; 21. Adapter board; 30. Pen tip module; 31. Front limit part; 32. Rear limit part; 40. Pressure sensing module; 41. Strain sensor; 42. Sensor board; 50. Main bracket; 51. Limit part. Detailed Implementation

[0022] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] In this embodiment of the invention, directional indicators (such as up, down, left, right, front, back, etc.) are only used to explain the relative positional relationship and movement of each component in a specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0024] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0025] Please refer to Figures 1-5 The pressure-sensitive electronic pen of this invention includes a pen body, a motherboard, a pen tip module, a pressure-sensitive module, and a main support.

[0026] The main support is located inside the pen body, and the main board is located on the main support. The pressure-sensitive module includes a strain sensor and a sensor board. The strain sensor is mounted on the sensor board, and the sensor board is mounted on the main board. The strain sensor detects pressure by detecting the amount of deformation of the sensor board.

[0027] The motherboard features an adapter board, with the adapter board and sensor board positioned side-by-side at the front. The adapter board connects to the pen tip module, allowing the pen tip to apply pressure to the sensor board. Under the action of the adapter board, the pen tip applies a preset pre-pressure to the sensor board. This pre-deformation ensures the pen tip module always remains in close contact with the sensor board, guaranteeing that changes in pen tip pressure always cause strain deformation in the sensor. The stiffness coefficient of the adapter board is lower than that of the sensor board, meaning that under the same force, the adapter board deforms more than the sensor board. When the pressure-sensitive pen writes on the screen, the pen tip pressure causes a bending deformation in the sensor board, which in turn deforms the strain sensor. This results in different impedance changes in the pressure-sensitive element inside the strain sensor, thus detecting the writing pressure.

[0028] In one implementation, the two sides of the adapter board and the two sides of the sensor board are fixedly connected to the main board (preferably by direct soldering). The front end of the main board is U-shaped, and the two sides of the adapter board are respectively connected to the two sides of the front end of the main board, and the two sides of the sensor board are respectively connected to the two sides of the front end of the main board.

[0029] As one implementation method, both sides of the adapter board and both sides of the sensor board are U-shaped, allowing for welding to both sides of the mainboard for a more secure connection. The sensor board and adapter board are also protected when the pen tip is twisted.

[0030] In one implementation, the sensor board and the front end of the main board are spaced apart by a preset distance L at the corresponding U-shaped bottom. This invention limits the sensor board's position via the main board. This invention controls the deformation of the sensor board and strain sensor, restricting deformation to within the elastic range, allowing for rapid and complete recovery from deformation.

[0031] In one implementation, the pen tip module has a front limiting part and a rear limiting part protruding from it, and the main support has a limiting part, which is located between the front limiting part and the rear limiting part. This invention uses the front and rear limiting parts to limit the front and rear of the limiting parts, thus protecting the adapter plate and sensor plate from excessive deformation when the pen tip is subjected to additional external pulling force (when replacing the pen tip) and when the pen tip is subjected to overpressure.

[0032] The method for preparing the pressure-sensitive electronic pen according to this invention includes steps 1 to 4.

[0033] Step 1: Prepare the pen body, main board, pen tip module, pressure-sensitive module, main bracket, and adapter board.

[0034] Step 2: Please refer to Figure 6 The adapter board and pen tip module are connected, and the pressure-sensitive module is mounted on the motherboard. A positioning plate of thickness L is placed between the sensor board and the motherboard end face to maintain a preset distance L between them. Pressure is applied to the sensor board through the pen tip module, and then the sensor board is soldered to the motherboard. The positioning plate can be made of thin iron sheet. In practice, a compression spring can be installed on the pen tip module. An appropriate preload needs to be set on the compression spring to ensure that the positioning plate on the sensor board is tightly attached to the end face of the motherboard.

[0035] Step 3: Remove the positioning plate, allowing the pen tip module to apply a preset pressure to the pressure-sensitive module's sensor board and maintain it, causing the sensor board to elastically deform. Then, solder the adapter board onto the main board. In practice, a compression spring can be used to apply and maintain the preset pressure. After soldering the adapter board to the main board, the compression spring can be removed. After stopping the pressure maintenance (i.e., removing the compression spring), most of the deformation of the sensor board will recover, while the adapter board will undergo a reverse flexural deformation. Within the elastic deformation range, because the adapter board is thinner, it exhibits greater elastic deformation relative to the sensor board (within the elastic deformation range).

[0036] Step 4: Install the motherboard (along with the sensor board, pen tip module, and adapter board) onto the main bracket, and then install them into the pen body to obtain the pressure-sensitive electronic pen.

[0037] This invention, through pre-deformation, ensures that the pen tip module always fits snugly against the sensor plate, so that changes in pressure on the pen tip always cause strain deformation in the strain sensor, and the pen tip will accurately transmit pressure (causing the strain sensor to generate appropriate signal changes).

[0038] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A pressure-sensitive electronic pen, comprising a pen body, a motherboard, a pen tip module, a pressure-sensitive module, and a main support, characterized in that, The main support is located inside the pen body, and the main board is located on the main support. The pressure-sensitive module includes a strain sensor and a sensor board. An adapter board is provided on the main board, and the sensor board is correspondingly located on the main board. The strain sensor is correspondingly located on the sensor board. The adapter board connects to the pen tip module, and the adapter board allows the end of the pen tip module to act on the sensor board.

2. The pressure-sensitive electronic pen as described in claim 1, characterized in that, The stiffness coefficient of the adapter plate is smaller than that of the sensor plate.

3. The pressure-sensitive electronic pen as described in claim 1, characterized in that, The adapter board and sensor board are arranged side by side at intervals on the front of the motherboard.

4. The pressure-sensitive electronic pen as described in claim 3, characterized in that, The two sides of the adapter board and the two sides of the sensor board are fixedly connected to the motherboard.

5. The pressure-sensitive electronic pen as described in claim 4, characterized in that, The front of the motherboard is U-shaped, with the two sides of the adapter board connected to the two sides of the front of the motherboard, and the two sides of the sensor board connected to the two sides of the front of the motherboard.

6. The pressure-sensitive electronic pen as described in claim 5, characterized in that, Both sides of the adapter board and both sides of the sensor board are U-shaped.

7. The pressure-sensitive electronic pen as described in claim 5, characterized in that, The sensor board and the front end of the motherboard are spaced at a preset distance L from each other at the bottom of the U-shape.

8. The pressure-sensitive electronic pen as described in claim 1, characterized in that, The pen tip module applies a preset pressure to the sensor board under the action of the adapter board.

9. The pressure-sensitive electronic pen as described in claim 1, characterized in that, The pen tip module has a front limit part and a rear limit part protruding from it, and the main bracket has a limit part, which is located between the front limit part and the rear limit part.

10. A method for preparing a pressure-sensitive electronic pen as described in any one of claims 1-9, characterized in that, include: Step 1: Prepare the pen body, main board, pen tip module, pressure-sensitive module, main support, and adapter board; Step 2: Connect the adapter board and the pen tip module, install the pressure-sensitive module on the motherboard, use a positioning pad with a thickness of L between the sensor board and the end face of the motherboard, apply pressure to the sensor board through the pen tip module, and then solder the sensor board to the motherboard. Step 3: Remove the positioning plate, so that the pen tip module applies a preset pressure to the sensor board of the pressure-sensitive module and maintains it, and then solder the adapter board onto the motherboard; Step 4: Install the motherboard onto the main bracket, and then insert it into the pen body to obtain the pressure-sensitive electronic pen.

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