Optical packaging structure and manufacturing method thereof

Abstract

The invention discloses an optical package structure and a manufacturing method thereof. The optical package structure includes a substrate, an optical element, a spacer, and a package. The substrate has a top surface. The optical element is adjacent to the top surface of the substrate and has a first height H1. The spacer surrounds the optical element and has a top surface. A distance between the top surface of the substrate and the top surface of the spacer is defined as a second height H2. The package is located between the optical element and the spacer and has a third height H3 at a position adjacent to the optical element. The package covers at least a portion of the optical element. The optical element is exposed from the encapsulation, and H2gt; h1 > = H3.

Description

[0001] Related information of divisional application

[0002] This application is a divisional application of the application for patent with the application number “202010071410.0” and the title “Optical package structure and method of manufacturing the same” filed on January 21, 2020. TECHNICAL FIELD

[0003] The present disclosure relates to an optical package structure and a method, and to an optical package structure with a spacer and a method of manufacturing the optical package structure. BACKGROUND

[0004] In an optical package structure including an optical element, an encapsulant can be disposed to cover the optical element, however, an active area of a surface of the optical element must be exposed from the encapsulant. Therefore, in a process of such an optical package structure, a removable mold can be first disposed on the active area of the optical element to cover the active area of the optical element, and then an encapsulant is formed to surround side surfaces and a top surface of the optical element and the removable mold. Finally, the removable mold is removed, thus forming an opening of the encapsulant to expose the active area of the optical element. In a subsequent process, a panel can be disposed on a top surface of the optical package structure, for example, a top surface of the encapsulant. However, since a portion of the encapsulant is located on the top surface of the optical element, the optical package structure is thicker, and needs to be improved. SUMMARY

[0005] In some embodiments, an optical package structure includes a substrate, an optical element, a spacer, and an encapsulant. The substrate has a top surface. The optical element is adjacent to the top surface of the substrate and has a first height H1. The spacer surrounds the optical element and has a top surface. A distance between the top surface of the substrate and the top surface of the spacer is defined as a second height H2. The encapsulant is located between the optical element and the spacer and has a third height H3 at a location adjacent to the optical element. The encapsulant covers at least a portion of the optical element. The optical element is exposed from the encapsulant, and H2 > H1 ≥ H3.

[0006] In some embodiments, an optical packaging structure includes a substrate, an optical element, a spacer, and a package body. The substrate has a top surface. The optical element is adjacent to the top surface of the substrate. The spacer surrounds the optical element and has an outer surface. The package body covers at least a portion of the optical element and is located between the optical element and the spacer. The package body is exposed from the outer surface of the spacer, and the side surfaces of the package body are substantially coplanar with the outer surface of the spacer.

[0007] In some embodiments, a method of manufacturing an optical packaging structure includes: (a) providing a plurality of optical elements adjacent to a top surface of a substrate, wherein the optical elements have a first height H1; and (b) providing at least one spacer on the substrate and forming at least one package body to surround the optical elements by dispensing, wherein the spacer has a top surface, the distance between the top surface of the substrate and the top surface of the spacer is defined as a second height H2, and the package body has a third height H3 adjacent to the optical elements, and H2>H1≥H3. Attached Figure Description

[0008] Some aspects of embodiments of the invention will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that the various structures may not be drawn to scale, and the dimensions of the various structures may be arbitrarily increased or decreased for clarity of explanation.

[0009] Figure 1 A top view illustrating an example of an optical packaging structure according to some embodiments of the present invention.

[0010] Figure 2 Description shown in Figure 1 A cross-sectional view of the optical packaging structure taken along line II.

[0011] Figure 3 Instruction panel and display Figure 1 and Figure 2 A cross-sectional view of the optical packaging structure assembly.

[0012] Figure 4 A top view illustrating an example of an optical packaging structure according to some embodiments of the present invention.

[0013] Figure 5 illustrate Figure 4 The optical packaging structure shown is a cross-sectional view taken along line II-II.

[0014] Figure 6 Description shown in Figure 4 A cross-sectional view of the optical packaging structure taken along line III-III.

[0015] Figure 7 Description shown in Figure 4 Left side view of the optical packaging structure.

[0016] Figure 8 A side view illustrating an example of an optical packaging structure according to some embodiments of the present invention.

[0017] Figure 9 A top view illustrating an example of an optical packaging structure according to some embodiments of the present invention.

[0018] Figure 10 illustrate Figure 9 The image shows a cross-sectional view of the optical packaging structure taken along line IV-IV.

[0019] Figure 11 This describes one or more stages of an example of a method for manufacturing an optical packaging structure according to some embodiments of the present invention.

[0020] Figure 12 This describes one or more stages of an example of a method for manufacturing an optical packaging structure according to some embodiments of the present invention.

[0021] Figure 13 This describes one or more stages of an example of a method for manufacturing an optical packaging structure according to some embodiments of the present invention.

[0022] Figure 14 This describes one or more stages of an example of a method for manufacturing an optical packaging structure according to some embodiments of the present invention.

[0023] Figure 15 This describes one or more stages of an example of a method for manufacturing an optical packaging structure according to some embodiments of the present invention.

[0024] Figure 16 This describes one or more stages of an example of a method for manufacturing an optical packaging structure according to some embodiments of the present invention.

[0025] Figure 17 This describes one or more stages of an example of a method for manufacturing an optical packaging structure according to some embodiments of the present invention.

[0026] Figure 18 This describes one or more stages of an example of a method for manufacturing an optical packaging structure according to some embodiments of the present invention.

[0027] Figure 19 This describes one or more stages of an example of a method for manufacturing an optical packaging structure according to some embodiments of the present invention.

[0028] Figure 20 This describes one or more stages of an example of a method for manufacturing an optical packaging structure according to some embodiments of the present invention.

[0029] Figure 21 This describes one or more stages of an example of a method for manufacturing an optical packaging structure according to some embodiments of the present invention.

[0030] Figure 22 This describes one or more stages of an example of a method for manufacturing an optical packaging structure according to some embodiments of the present invention. Detailed Implementation

[0031] Common reference numerals are used throughout the drawings and detailed description to indicate the same or similar components. Embodiments of the invention will be readily understood from the following detailed description taken in conjunction with the accompanying drawings.

[0032] The following disclosure provides numerous different embodiments or instances for implementing various features of the provided subject matter. Specific examples of components and arrangements are described below to explain certain aspects of the invention. Of course, these components and arrangements are merely examples and are not intended to be limiting. For example, in the following description, the formation of a first feature above or on a second feature may include embodiments where the first feature directly contacts the second feature, and may also include embodiments where an additional feature is formed or disposed between the first and second features such that the first and second features do not directly contact each other. Furthermore, reference numerals and / or letters may be repeated in various instances of the invention. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0033] To reduce the thickness of the aforementioned optical packaging structure, another example discloses a package whose side surface surrounding the optical element is not located on the top surface of the optical element. For example, the package can be formed by dispensing to surround the side surface of the optical element. In subsequent processes, because the top surface of the package formed by dispensing is not flat, it is impossible to mount a panel on the package and support it through the package. Therefore, a support structure must be provided to surround the optical packaging structure to support the panel, which disadvantageously increases production costs and size.

[0034] This invention solves at least the above-mentioned problems and provides an improved optical packaging structure and an improved technique for manufacturing said optical packaging structure. In the optical packaging structure, spacers are provided on the package body, so a panel can be provided on the spacers and supported by the spacers.

[0035] Figure 1A top view illustrating an example of an optical packaging structure 1 according to some embodiments of the present invention. Figure 2 Description shown in Figure 1 A cross-sectional view of the optical packaging structure 1 taken along line II. The optical packaging structure 1 includes a substrate 2, an optical element 3, at least one wire 36, a spacer 4, and a package body 5.

[0036] The substrate 2 has a first surface 21, a second surface 22 opposite to the first surface 21, and a side surface 23 extending between the first surface 21 and the second surface 22. The first surface 21 may be a top surface. The substrate 2 may be a substrate of any type and material, which is not limited in this invention. For example, the substrate 2 may contain styrene-butadiene-styrene (SBS). In some embodiments, the substrate 2 may include a circuit layer having at least one conductive pad 26 located on the first surface 21.

[0037] Optical element 3 is located on substrate 2, for example, on a first surface 21 of substrate 2. Optical element 3 may include an active region (sensing region) 30. In some embodiments, optical element 3 includes an optical sensing chip 31 and a light-transmissive component 32 sequentially located on substrate 2. Optical sensing chip 31 may be a contact image sensor (CIS) chip or a fingerprint recognition chip, and light-transmissive component 32 may be a collimating element. Optical sensing chip 31 has a first surface 311, a second surface 312 opposite to the first surface 311, and a side surface 313 extending between the first surface 311 and the second surface 312. The second surface 312 of optical sensing chip 31 may be attached to the first surface 21 of substrate 2, for example, by adhesive bonding. Light-transmissive component 32 covers a portion of optical sensing chip 31, while exposing another portion of the second surface 312 of optical sensing chip 31. The optical sensing chip 31 may also include a circuit layer having a conductive pad 34 located on a first surface 311.

[0038] The light-transmitting component 32 has a first surface 321, a second surface 322 opposite to the first surface 321, and a side surface 323 extending between the first surface 321 and the second surface 322. The second surface 322 of the light-transmitting component 32 can be attached to the first surface 311 of the optical sensing chip 31, for example, by adhesive bonding. The side surface 313 of the optical sensing chip 31 and the side surface 323 of the light-transmitting component 32 can be coplanar on at least one side, such as... Figure 2As shown in the figure. However, in other embodiments, the side surface 313 of the optical sensing chip 31 and the side surface 323 of the light-transmitting component 32 may not be coplanar. The active region (sensing region) 30 may be located at the optical sensing chip 31. The active region (sensing region) 30 is used to receive light from the environment or receive external pressing force. The size of the light-transmitting component 32 is smaller than the size of the optical sensing chip 31. Therefore, the light-transmitting component 32 may not cover or contact the conductive pad 34 of the optical sensing chip 31. Figure 2 As shown, optical element 3 is a combination of two elements (e.g., optical sensing chip 31 and light transmissive component 32). However, in other embodiments, optical element 3 may be a single element, or optical element 3 may contain three or more elements.

[0039] The conductive wire 36 connects the conductive pad 34 of the optical sensing chip 31 to the conductive pad 26 of the substrate 2. That is, the optical element 3 is electrically connected to the substrate 2 via the conductive wire 36. Therefore, the signal generated by the optical element 3 can be transmitted to the substrate 2 via the conductive wire 36. The material of the conductive wire 36 may include copper, gold, or other suitable metals. Figure 2 As shown, the wire 36 is located on one side of the optical sensing chip 31. However, in other embodiments, the wire 36 may be located on two or more sides of the optical sensing chip 31.

[0040] Spacer 4 is located on package 5 and surrounds optical element 3. Spacer 4 has a first surface 41, a second surface 42 opposite to the first surface 41, and an outer surface 43 extending between the first surface 41 and the second surface 42. The first surface 41 may be a top surface. In some embodiments, the first surface 41 may be generally flat. The second surface 42 faces the first surface 21 of substrate 2 and contacts package 5. Viewed from top, spacer 4 has a closed ring shape. Figure 1 As shown, the spacer 4 is in the shape of a rectangular frame. That is, the spacer 4 has an inner surface 44 that defines a through-hole 45 extending from its first surface 41 to its second surface 42. A portion of the optical element 3, such as the light-transmitting component 32, is exposed in the through-hole 45 of the spacer 4. The spacer 4 may cover a portion of the substrate 2, a portion of the optical sensing chip 31, and a portion of the conductive wire 36. For example, the conductive wire 36 and the substrate 2 may be located below the spacer 4. In some embodiments, the spacer 4 does not contact the substrate 2. For example, the spacer 4 may be located on the package 5. A gap exists between the second surface 42 of the spacer 4 and the first surface 21 of the substrate 2.

[0041] The package 5 is located between the optical element 3 and the spacer 4, and between the spacer 4 and the substrate 2. Additionally, the package 5 covers at least a portion of the optical element 3, at least a portion of the substrate 2, and the conductive wire 36. For example, the package 5 is located on a portion of the first surface 21 of the substrate 2 and the first surface 311 of the optical sensing chip 31. The package 5 contacts the second surface 42 of the spacer 4, thus supporting the second surface 42 of the spacer 4. In some embodiments, a portion of the package 5 is further located between the side surface 323 of the light-transmitting component 32 and the inner surface 44 of the spacer 4, and exposed in the through-hole 45 of the spacer 4. The package 5 has a concave surface 51 (i.e., a top surface) located between the side surface 323 of the light-transmitting component 32 and the inner surface 44 of the spacer 4. Another portion of the package 5 is further located below the spacer 4. The package 5 is exposed from the outer surface 43 of the spacer 4. The package 5 has a side surface 53 that is substantially coplanar with the outer surface 43 of the spacer 4 and / or the side surface 23 of the substrate 2. The material of the package 5 may be a molding compound or an underfill, and is not limited thereto in this invention. Preferably, the package 5 provides light shielding, for example, having a transmittance of less than 0.1% at a thickness of about 200 μm.

[0042] like Figure 2 As shown, the optical element 3 has a first height H1. The distance between the top surface of the substrate 2 (i.e., the first surface 21) and the top surface of the spacer 4 (i.e., the first surface 41) is defined as a second height H2. The package 5 has a third height H3 adjacent to the optical element 3, and H2 > H1 ≥ H3. For example, the first height H1 may be defined between the second surface 312 of the optical sensing chip 31 and the first surface 321 of the light-transmitting component 32. The third height H3 may be the distance from the first surface 21 of the substrate 2 to the highest point of the side surface 323 of the package 5 that contacts the light-transmitting component 32 (or the intersection of the concave surface 51 of the package 5 and the side surface 323 of the light-transmitting component 32).

[0043] In a device including an optical packaging structure 1, the panel 8 (such as...) Figure 3The panel 8 (shown in the diagram) can be directly located on the spacer 4 of the optical packaging structure 1. The optical packaging structure 1 can provide a generally flat surface (e.g., the first surface 41 of the spacer 4) for the panel 8 to be disposed thereon, and the panel 8 disposed thereon does not require other support structures surrounding the optical packaging structure 1. Since the second height H2 is greater than the first height H1, the panel 8 does not need to contact the optical element 3, thus preventing damage to the optical element 3. In addition, since the first height H1 is equal to or greater than the third height H3, the package 5 does not need to cover the first surface 321 of the light-transmitting component 32 of the optical element 3. Therefore, the package 5 does not need to cover the active area (sensing area) 30 of the optical element 3, and does not affect the function of the optical element 3. Therefore, the thickness of the optical packaging structure 1 is reduced. For example, the thickness of the optical packaging structure 1 can be about 600 μm to about 700 μm.

[0044] Figure 4 A top view illustrating an optical packaging structure 1b according to some embodiments of the present invention. Figure 5 and Figure 6 Explained and displayed respectively Figure 4 A cross-sectional view of the optical packaging structure 1b taken along lines II-II and III-III. Figure 7 Description shown in Figure 4 The left-side view of the optical packaging structure 1b shown in the image. The optical packaging structure 1b is similar to that shown in the image. Figure 1 and Figure 2 The optical packaging structure 1 in the middle, except for the structure of the spacer 4b.

[0045] like Figure 6 As shown, spacer 4b is located on and attached to substrate 2. For example, spacer 4b may be wall-shaped, extending upward from a first surface 21 of substrate 2, and the bottom of spacer 4b may contact or be located on the first surface 21 of substrate 2. In some embodiments, spacer 4b defines an opening 40. That is, from a top view, spacer 4b is not a closed loop shape. For example, as... Figure 4 As shown, from a top view, the spacer 4b is rectangular in shape, with one side of the rectangle being optional. Therefore, an opening 40 is defined on the omitted side. The package 5 is exposed from the omitted side and within the opening 40 of the spacer 4b. The wire 36 can be positioned adjacent to the opening 40 of the spacer 4b, and therefore may not be covered by the spacer 4b.

[0046] like Figure 5 and Figure 7As shown, spacer 4b further defines tunnel 46. For example, tunnel 46 may be located on the side opposite to opening 40. Tunnel 46 extends from outer surface 43 to inner surface 44 of spacer 4b. A portion of encapsulation 5 is further located in and fills tunnel 46 of spacer 4b. Therefore, encapsulation 5 is exposed from outer surface 43 of spacer 4b. The shape of tunnel 46 is not limited in this invention. In one embodiment, the width of tunnel 46 is greater than the width of optical element 3.

[0047] Since the spacer 4b is located on the substrate 2, the spacer 4b provides for the panel 8 located thereon. Figure 3 The tunnel 46 provides stronger support for the package 5. In addition, the tunnel 46 provides a communication path for the package 5 to flow through during the manufacture of the optical package structure 1b. Furthermore, the inner surface 44 of the spacer 4b may further define a recess portion to facilitate the flow of the package 5 during manufacture.

[0048] Figure 8 A side view illustrating an optical packaging structure 1c according to some embodiments of the present invention is shown. The optical packaging structure 1c is similar to that shown in... Figures 4 to 7 The optical packaging structure 1b, except for the shape of the tunnel 46c defined by the spacer 4c. For example... Figure 8 As can be seen, tunnel 46c has a lower height at the center and a higher height on both sides. This shape provides preferred structural strength for spacer 4c, while still allowing sufficient space for encapsulation 5 to flow through during its manufacture. In comparison, Figure 7 Tunnel 46 has a generally consistent height, while Figure 8 Tunnel 46c, however, does not have a consistent height.

[0049] Figure 9 A top view illustrating an optical packaging structure 1d according to some embodiments of the present invention. Figure 10 illustrate Figure 9 The image shows a cross-sectional view of the optical packaging structure 1d taken along line IV-IV. The optical packaging structure 1d is similar to that shown in... Figures 4 to 7 The optical packaging structure 1b, excluding the spacer 4d, is as follows. Figure 9 and Figure 10 As can be seen, opening 40 is omitted, and spacer 4d completely surrounds optical element 3. In addition, tunnel 46 is defined on both sides.

[0050] Figures 11 to 14 This invention describes a method for manufacturing an optical packaging structure according to some embodiments of the present invention. In some embodiments, the method is used to manufacture an optical packaging structure, for example, as shown in [illustration / example]. Figure 1 andFigure 2 The optical packaging structure 1 in the text.

[0051] See Figure 11 A substrate 2 is provided. The substrate 2 has a first surface 21 and a second surface 22 opposite to the first surface 21. The first surface 21 may be a top surface. The substrate 2 may be a substrate of any type and material, and is not limited thereto in this invention. For example, the substrate 2 may comprise styrene-butadiene-styrene. In some embodiments, the substrate 2 may comprise a circuit layer having at least one conductive pad 26 located on the first surface 21.

[0052] A plurality of optical elements 3 are provided, and the plurality of optical elements 3 are disposed adjacent to the top surface (e.g., the first surface 21) of the substrate 2. In some embodiments, each of the optical elements 3 includes an optical sensing chip 31 and a light-transmitting component 32 sequentially located on the substrate 2. The optical sensing chip 31 may be a contact image sensor chip or a fingerprint recognition chip, and the light-transmitting component 32 may be a collimating element. The optical sensing chip 31 has a first surface 311, a second surface 312 opposite to the first surface 311, and a side surface 313 extending between the first surface 311 and the second surface 312. The second surface 312 of the optical sensing chip 31 may be attached to the first surface 21 of the substrate 2, for example, by adhesive bonding. The light-transmitting component 32 covers a portion of the optical sensing chip 31, while another portion of the second surface 312 of the optical sensing chip 31 is exposed. The optical sensing chip 31 may also include a circuit layer having conductive pads 34 located on the first surface 311.

[0053] The light-transmitting component 32 has a first surface 321, a second surface 322 opposite to the first surface 321, and a side surface 323 extending between the first surface 321 and the second surface 322. The second surface 322 of the light-transmitting component 32 can be attached to, for example, the first surface 311 of the optical sensing chip 31 by adhesive bonding. The optical element 3 has a first height H1. For example, the first height H1 may be defined between the second surface 312 of the optical sensing chip 31 and the first surface 321 of the light-transmitting component 32. The optical element 3 includes an active region (sensing region) 30 located at the optical sensing chip 31. The active region (sensing region) 30 is used to receive light from the environment or receive external pressure. The size of the light-transmitting component 32 is smaller than the size of the optical sensing chip 31. Therefore, the light-transmitting component 32 may not cover or contact the conductive pad 34 of the optical sensing chip 31. Figure 11 As shown, optical element 3 is a combination of two elements (e.g., optical sensing chip 31 and light transmissive component 32). However, in other embodiments, optical element 3 may be a single element, or optical element 3 may contain three or more elements.

[0054] At least one wire 36 is provided to connect the conductive pad 34 of the optical sensing chip 31 to the conductive pad 26 of the substrate 2. That is, the optical element 3 is electrically connected to the substrate 2 via the wire 36. Therefore, signals generated by the optical element 3 can be transmitted to the substrate 2 via the wire 36. The material of the wire 36 may include copper, gold, or other suitable metals. Figure 11 As shown, the wire 36 is located on one side of the optical sensing chip 31. However, in other embodiments, the wire 36 may be located on two or more sides of the optical sensing chip 31.

[0055] See Figure 12 An encapsulation 5 is formed on the first surface 21 of the substrate 2 by dispensing, and surrounds the optical element 3. Preferably, the dispensing process in this invention excludes the molding process. For example, the encapsulation 5 may be an encapsulation compound or a primer, and may not have been cured. The encapsulation 5 may cover at least a portion of the side surface 313 of the optical sensing chip 31 and the side surface 323 of the light-transmitting component 32. However, the encapsulation 5 does not cover the top surface of the optical element 3 (e.g., the first surface 321 of the light-transmitting component 32).

[0056] Next, a spacer 4 is provided. The spacer 4 has a first surface 41 and a second surface 42 opposite to the first surface 41. The first surface 41 may be a top surface. In some embodiments, the first surface 41 may be generally flat. The spacer 4 has a plurality of inner surfaces 44, each defining a through hole 45 extending through the first surface 41 and the second surface 42 of the spacer 4.

[0057] See Figure 13 A spacer 4 is disposed on the package 5, wherein through-holes 45 correspond to optical elements 3 respectively. The second surface 42 of the spacer 4 faces the first surface 21 of the substrate 2 and contacts the package 5. Each optical element 3, such as a light-transmitting component 32, is exposed in a corresponding through-hole 45 of the spacer 4. The spacer 4 may cover a portion of the substrate 2, a portion of the optical sensing chip 31, and a portion of the conductive wire 36. For example, the conductive wire 36 may be located below the spacer 4. In some embodiments, the spacer 4 does not contact the substrate 2. For example, the spacer 4 is supported by the uncured package 5.

[0058] The spacer 4 can press the package 5 so that a portion of the package 5 is located between the optical element 3 and the spacer 4 and exposed in the through-hole 45 of the spacer 4. The package 5 can adhere to the side surface 323 of the light-transmitting component 32 and the inner surface 44 of the spacer 4, thus forming a concave surface 51. Then, the package 5 is cured.

[0059] The distance between the top surface of substrate 2 (i.e., the first surface 21) and the top surface of spacer 4 (i.e., the first surface 41) is defined as the second height H2. The package 5 has a third height H3 adjacent to the optical element 3, where H2 > H1 ≥ H3. For example, the third height H3 can be the distance from the first surface 21 of substrate 2 to the highest point of the side surface 323 of the package 5 that contacts the light-transmitting component 32 (or the intersection of the concave surface 51 of the package 5 and the side surface 323 of the light-transmitting component 32).

[0060] See Figure 14 The monomerization process is carried out along the sawing path 10, thus forming multiple optical encapsulation structures 1, such as... Figure 1 and Figure 2 As shown in the figure. The monomerization process forms the side surface 23 of the substrate 2, the outer surface 43 of the spacer 4, and the side surface 53 of the package 5, as shown in the figure. Figure 2 As shown in the diagram. After the monomerization process, the package 5 is exposed from the outer surface 43 of the spacer 4. The package 5 has a side surface 53 that is substantially coplanar with the outer surface 43 of the spacer 4 and / or the side surface 23 of the substrate 2. Furthermore, from a top view, the spacer 4 has a closed ring shape. For example, the spacer 4 has a rectangular frame shape.

[0061] Figures 15 to 19 This invention describes a method for manufacturing an optical packaging structure according to some embodiments of the present invention. In some embodiments, the method is used to manufacture an optical packaging structure, for example, as shown in [illustration / example]. Figures 4 to 7 The optical packaging structure 1b in the description. The initial stage of the process is the same as or similar to that described in the description. Figure 11 The stage in. Figure 15 Depicted in Figure 11 The stage following the stage described in the text.

[0062] See Figure 15 A spacer 4b is provided and the spacer 4b is disposed on the substrate 2. Figure 16 Description shown in Figure 15 A top view of the structure in the middle, and Figure 17 Explanation along the display Figure 16 A cross-sectional view of the structure shown is taken by line VV. The spacer 4b has a first surface 41 and a second surface 42 opposite to the first surface 41. The first surface 41 may be a top surface. In some embodiments, the first surface 41 may be generally flat. The spacer 4b has a plurality of inner surfaces 44, each defining a through-hole 45 extending through the first surface 41 and the second surface 42 of the spacer. See also... Figure 17 Spacer 4b is located on and attached to substrate 2, with through-holes 45 corresponding to optical elements 3. Optical elements 3 and wires 36 are fully exposed within the through-holes 45 of spacer 4b. See also...Figure 17 The spacer 4b may be wall-shaped and extend upward from the first surface 21 of the substrate 2. The spacer 4b further defines a plurality of tunnels 46. Each tunnel 46 extends through two adjacent inner surfaces of the spacer 4b. That is, the tunnel 46 communicates with the through-hole 45 of the spacer 4b. The shape of the tunnel 46 is not limited in this invention.

[0063] See Figure 18 An encapsulation 5 is disposed between the spacer 4b and the optical element 3, for example, on the substrate 2 and in the via 45 of the spacer 4b. The encapsulation 5 surrounds each of the optical elements 3. The encapsulation 5 may cover at least a portion of the side surface 313 of the optical sensing chip 31 and the side surface 323 of the light-transmitting component 32. However, the encapsulation 5 does not cover the top surface of the optical element 3 (e.g., the first surface 321 of the light-transmitting component 32). For example, the encapsulation 5 may be an encapsulating compound or primer and may not have been cured. Therefore, the encapsulation 5 may flow into the tunnel 46 and through the tunnel 46 into each of the vias 45 of the spacer 4b. Therefore, the height of the encapsulation 5 in each via 45 of the spacer 4b may be substantially the same. A portion of the encapsulation 5 is further located in and fills the tunnel 46 of the spacer 4b.

[0064] Next, after the solidified encapsulated body 5, a monomerization process is carried out along the saw cut 10b, thus forming as shown in the figure. Figures 4 to 7 The multiple optical packaging structures 1b shown herein. The monomerization process forms the side surface 23 of the substrate 2, the outer surface 43 of the spacer 4b, and the side surface 53 of the package 5, as follows: Figures 5 to 7 As shown in the figure. After the monomerization process, a portion of the package 5 located in the tunnel 46 of the spacer 4b is exposed from the outer surface 43 of the spacer 4b. The package 5 has a side surface 53 that is substantially coplanar with the outer surface 43 of the spacer 4b and / or the side surface 23 of the substrate 2. Figure 19 illustrate Figure 18 The diagram shows a top view of the structure. After the monomerization process, spacer 4b defines opening 40. Figure 4 That is, from a top view, spacer 4b is not a closed shape. For example, as... Figure 4 As shown, the spacer 4b is rectangular in shape when viewed from above, with one side of the rectangle being optional. Therefore, an opening 40 is defined on the omitted side, and the opening 40 can be located opposite the tunnel 46. The encapsulation body 5 is exposed from the omitted side and located within the opening of the spacer 4b.

[0065] Figure 20 This invention describes a method for manufacturing an optical packaging structure according to some embodiments of the present invention. In some embodiments, the method is used to manufacture an optical packaging structure, for example, as shown in [illustration / example]. Figure 8The optical packaging structure 1c described herein. The initial stage of the process is the same as or similar to that described in [the original text]. Figure 15 and Figure 16 In the stages, except Figure 20 The shape of the tunnel 46c of the spacer 4c shown in the figure is different.

[0066] See Figure 20 The tunnel 46c has a lower height at the center and a higher height at both sides. This shape provides the spacer 4c with preferred structural strength, while still having sufficient space for the package 5 to flow through during its manufacturing process. The illustrated process is shown in Figure 20 The stages following the middle stage are similar to those described in Figure 18 and Figure 19 The stage in which it is presented, thus forming a display Figure 8 The optical packaging structure 1c in the middle.

[0067] Figure 21 and Figure 22 This invention describes a method for manufacturing an optical packaging structure according to some embodiments of the present invention. In some embodiments, the method is used to manufacture an optical packaging structure, for example, as shown in [illustration / example]. Figure 9 and Figure 10 The optical packaging structure 1d in the diagram. The initial stage of the process described is the same as or similar to that described in the diagram. Figures 15 to 19 In the stages, except Figure 21 and Figure 22 Outside the position of saw cut 10d shown in the image.

[0068] See Figure 21 and Figure 22 The monomerization process can be carried out along the saw cut 10d to form multiple optical encapsulation structures 1d, such as Figure 9 and Figure 10 As shown in the figure. The monomerization process forms the side surface 23 of the substrate 2, the outer surface 43 of the spacer 4d, and the side surface 53 of the package 5, as shown in the figure. Figure 9 and Figure 10 As shown in the diagram. After the monomerization process, a portion of the package 5 located in the tunnel 46 of the spacer 4d is exposed from the outer surface 43 of the spacer 4d. The package 5 has side surfaces 53 that are substantially coplanar with the outer surface 43 of the spacer 4 and / or the side surface 23 of the substrate 2. However, from a top view, the spacer 4d has a closed ring shape. The spacer 4d completely surrounds the optical element 3. In addition, the tunnel 46 is defined on both sides.

[0069] Unless otherwise specified, spatial descriptions such as "above," "below," "upward," "left," "right," "downward," "top," "bottom," "vertical," "horizontal," "side," "higher," "lower," "upper," "above," and "below" are used to indicate orientations relative to those shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and actual implementations of the structures described herein can be arranged in space in any orientation or manner, provided that the advantages of the embodiments of the invention are not deviated from by such arrangement.

[0070] As used herein, the terms “approximately,” “generally,” “roughly,” and “about” are used to describe and take into account minor variations. When used in conjunction with an event or situation, the terms may refer to a situation where the event or situation occurred precisely or very close to occurring. For example, when used in conjunction with a numerical value, the terms may refer to a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the difference between two values ​​is less than or equal to ±10% of the average of the values ​​(e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%), then the two values ​​can be considered "substantially" the same.

[0071] If the displacement between two surfaces is no greater than 5 μm, 2 μm, 1 μm, or 0.5 μm, then the two surfaces can be considered coplanar or substantially coplanar.

[0072] Unless the context clearly indicates otherwise, as used herein, the singular terms “a” and “the” may include multiple indicators.

[0073] As used herein, the terms “conductive,” “electrically conductive,” and “conductivity” refer to the ability to conduct electric current. Conductive materials typically indicate those that exhibit minimal or zero resistance to the flow of electric current. A measure of conductivity is Siemens per meter (S / m). Typically, conductive materials have a conductivity greater than approximately 10. 4 S / m (e.g., at least 10) 5 S / m or at least 10 6 A material is defined as having an electrical conductivity of S / m. The electrical conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the electrical conductivity of a material is measured at room temperature.

[0074] In addition, quantities, ratios, and other values ​​are sometimes presented in range format in this document. It should be understood that such range format is used for convenience and brevity, and should be flexibly interpreted to include not only the values ​​explicitly defined as range limits, but also all individual values ​​or subranges covered by that range, as if each value and subrange were explicitly defined.

[0075] Although the invention has been described and illustrated with reference to specific embodiments thereof, such description and illustration are not restrictive. Those skilled in the art will understand that various changes and substitutions may be made without departing from the true spirit and scope of the invention as defined by the appended claims. Illustrations need not be drawn to scale. Due to manufacturing processes and limitations, artistic representations of the invention may differ from actual devices. Other embodiments of the invention may exist that are not specifically described. This specification and drawings should be considered illustrative rather than restrictive. Modifications may be made to adapt particular circumstances, materials, compositions, methods, or processes to the objectives, spirit, and scope of the invention. All such modifications are intended to be within the scope of the appended claims. While the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations may be combined, reclassified, or reordered to form equivalent methods without departing from the teachings of the invention. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of the invention.

Claims

1. An optical packaging structure, comprising: Substrate, having a top surface; An optical element, which is adjacent to the top surface of the substrate; and A spacer surrounding the optical element, wherein the spacer is located on and attached to the substrate and defines a tunnel.

2. The optical packaging structure of claim 1, wherein the spacer has an outer surface, and the optical element is exposed from the outer surface of the spacer.

3. The optical packaging structure according to claim 1, wherein the spacer has a first surface and a second surface opposite to the first surface, the second surface faces the substrate and there is a gap between the second surface and the substrate, and the top end of the optical element is located between the extension plane of the first surface of the spacer and the extension plane of the second surface.

4. The optical packaging structure according to claim 1, wherein the spacer covers a portion of the optical element.

5. The optical packaging structure according to claim 1, wherein a portion of the spacer overlaps perpendicularly with the optical element.

6. The optical packaging structure according to claim 1, wherein the distance between the inner surface of the tunnel and the extended plane of the side surface of the optical element is less than the height of the optical element.

7. The optical packaging structure according to claim 1, wherein the height of the tunnel is less than the height of the optical element.

8. The optical packaging structure according to claim 1, wherein, viewed from above, the spacer is not in the shape of a closed ring, and the spacer further defines an opening.

9. The optical packaging structure of claim 1, further comprising a packaging body, wherein a portion of the packaging body is located in the tunnel of the spacer.

10. An optical packaging structure comprising: Substrate; An optical element, adjacent to the substrate, having a first surface and at least one side surface adjacent to the first surface; and A spacer surrounding the optical element and having an outer surface, wherein the spacer is not in a closed loop shape, and wherein at least one side surface of the optical element is exposed from the outer surface of the spacer.

11. The optical packaging structure of claim 10, wherein the optical element further has a second surface opposite to the first surface, the second surface facing the substrate, and the side surface extending between the first surface and the second surface.

12. The optical packaging structure of claim 10, wherein the spacer has a first surface and a second surface opposite to the first surface, the second surface facing the substrate, and the outer surface extending between the first surface and the second surface.

13. The optical packaging structure of claim 12, wherein a gap exists between the second surface of the spacer and the substrate, and the top end of the optical element is located between an extension plane of the first surface of the spacer and an extension plane of the second surface.

14. An optical packaging structure comprising: Substrate; Optical elements are located on the substrate; and A spacer, located on the substrate and surrounding the optical element, wherein the spacer has a top surface and an outer surface connected to the top surface, the top surface defining a first opening and the outer surface defining a second opening.

15. The optical packaging structure according to claim 14, wherein the first opening is a through hole and the second opening is a tunnel.

16. The optical packaging structure of claim 14, further comprising an adhesive base located between the spacer and the substrate, wherein both the optical element and the adhesive base are exposed from the outer surface of the spacer.

17. The optical packaging structure of claim 16, wherein the substrate has a curved surface, the curved surface being lower than the top surface of the optical element.

18. The optical packaging structure according to claim 14, wherein the extending direction of the first opening is different from the extending direction of the second opening.

19. The optical packaging structure of claim 14, wherein the top surface intersects the outer surface perpendicularly.

20. An optical packaging structure comprising: Substrate, having a top surface; An optical sensing chip is located on the top surface of the substrate; A light-transmitting component is located on the optical sensing chip; and A package that covers the optical sensing chip and the light-transmitting component.

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