Wafer ink jet device based on visual inspection

Abstract

The invention discloses a wafer ink-jet device based on visual inspection, and relates to the technical field of wafer detection, the wafer ink-jet device comprises a detection ink-jet assembly, a processing table, an ink-jet head arranged on the top of the processing table, a first industrial camera fixed on the ink-jet head, a second industrial camera arranged on the top of the processing table, and a bearing assembly arranged on the processing table, comprising a material frame piece penetrating through a machining table, a supporting piece is fixed to the top of the machining table, an auxiliary heating piece is fixed to the top of the machining table, and a driving assembly is arranged on the machining table and comprises a stepping motor fixed to the bottom of the machining table. Through the arrangement of the bearing assembly and the driving assembly, the machining requirements of multiple stations on the bearing assembly can be met at the same time, automatic downward moving feeding and automatic upward moving storage are completed, extra equipment intervention is not needed, the overall integration degree is high, and the continuous, integrated and convenient ink jet detection requirements of multiple wafers are better met.

Description

Technical Field

[0001] This invention relates to the field of wafer inspection technology, and in particular to a wafer inkjet device based on vision inspection. Background Technology

[0002] A wafer is a circular thin film made of high-purity single-crystal silicon. It is the core substrate material for manufacturing semiconductor chips. In the actual production and processing, a camera based on a vision inspection system is used to identify and detect defects on the wafer surface. In order to complete the physical marking and facilitate subsequent processes, an inkjet device is used to perform targeted inkjet printing in conjunction with the vision inspection system.

[0003] Existing wafer inkjet devices typically use mechanical trays to transport individual wafers for loading, placement, lifting, and unloading operations. However, this design still requires other equipment to complete the inkjet printing of multiple wafers, resulting in low integration, a complex process, and higher operating costs, thus limiting its effectiveness. Summary of the Invention

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0005] In view of the problems existing in the above and / or existing vision-based inspection wafer inkjet devices, the present invention is proposed.

[0006] Therefore, the problem to be solved by the present invention is how to solve the problem that the existing wafer inkjet device requires the cooperation of other equipment to complete the inkjet printing operation of multiple wafers, which has low integration, complex process and higher cost.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a wafer inkjet device based on vision inspection, comprising: an inkjet inspection assembly including a processing table, an inkjet head disposed on the top of the processing table, a first industrial camera fixed on the inkjet head, a second industrial camera disposed on the top of the processing table; a support assembly disposed on the processing table, including a material rack component passing through the processing table; a support component fixed on the top of the processing table; an auxiliary heating component fixed on the top of the processing table; and a drive assembly disposed on the processing table, including a stepper motor fixed to the bottom of the processing table, a rotating rod fixed to the output end of the stepper motor, a transmission component disposed on the outer ring of the rotating rod, a bracket mounted on the transmission component, a screw rotatably connected to the bottom of the processing table, an auxiliary component installed between the screw and the rotating rod, and a guide component disposed on the outer ring of the rotating rod.

[0008] As a preferred embodiment of the vision-based wafer inkjet device of the present invention, wherein: an X-axis drive is mounted on the top of the processing table, a Z-axis drive is mounted on the moving end of the X-axis drive, a first Y-axis drive and a second Y-axis drive are respectively mounted on the moving end of the Z-axis drive, the inkjet head is fixed on the moving end of the first Y-axis drive, and the second industrial camera is fixed on the moving end of the second Y-axis drive.

[0009] As a preferred embodiment of the vision-based wafer inkjet device of the present invention, the processing table has a through slot on the top and cooperates with the material rack component, the processing table has a processing groove fixed on the top, the processing table has a slot, and an electromagnetic block is fixed on the top of the processing table.

[0010] As a preferred embodiment of the vision-based wafer inkjet device of the present invention, the material rack includes a first auxiliary plate located in a through slot, a first support base fixed to the top of the first auxiliary plate, a reinforcing rod fixed through the first auxiliary plate, a positioning head fixed to the bottom of the lowest first auxiliary plate, a support plate provided at the bottom of the first auxiliary plate, a fastening bolt provided through the bottom of the support plate, a displacement frame fixed to the bottom of the support plate, and a guide frame fixed to the bottom of the support plate.

[0011] As a preferred embodiment of the vision-based wafer inkjet device of the present invention, the support member includes a second auxiliary plate bolted to the processing groove, and a second support slot seat is fixed to the top of the second auxiliary plate.

[0012] As a preferred embodiment of the vision-based wafer inkjet device of the present invention, the auxiliary heating element includes a third auxiliary plate bolted to the processing groove, an arc-shaped groove on the top of the third auxiliary plate, an arc-shaped guide rod fixed in the arc-shaped groove, a fixing ring fixed on the top of the third auxiliary plate, a rotating ring rotatably connected to the outside of the fixing ring, a drive frame fixed on the outer ring of the rotating ring, a protrusion fixed on the bottom of the drive frame, a first spring fixed on the protrusion, the first spring being sleeved on the arc-shaped guide rod, the end of the first spring away from the protrusion being fixed to the inner wall of the arc-shaped groove, and a third support slot seat fixed on the top of the third auxiliary plate.

[0013] As a preferred embodiment of the wafer inkjet device based on vision inspection described in this invention, the rotating rod has a receiving groove inside, a corrugated groove on the outer ring of the rotating rod, and a recess on the outer ring of the rotating rod, wherein the receiving groove, the corrugated groove, and the recess are connected in sequence.

[0014] As a preferred embodiment of the vision-based wafer inkjet device of the present invention, the transmission component includes an auxiliary ring located outside the rotating rod. A vertical rod is fixed to the top of the auxiliary ring, and the top end of the vertical rod passes through a bracket and slides in contact with the bracket. A connecting frame is fixed to the inner ring of the auxiliary ring, and the connecting frame is rotatably connected to the outer ring of the rotating rod via a bearing. A limiting groove is formed at the bottom of the inner ring of the auxiliary ring. A pressing rod is slidably connected to the top of the receiving groove. A second spring is sleeved on the pressing rod. One end of the second spring is fixed in the receiving groove, and the other end of the second spring is fixed on the pressing rod. An auxiliary frame is fixed to the rotating rod. An inclined plate is rotatably connected to the auxiliary frame. A first torsion spring is sleeved on the auxiliary frame. One end of the first torsion spring is fixed to the auxiliary frame, and the other end of the first torsion spring is fixed to the inclined plate. A stop block is fixed to the bottom end of the inclined plate and cooperates with the limiting groove. An insert rod is slidably connected in the limiting groove. A third spring is sleeved on the top of the insert rod. The bottom end of the third spring is fixed to the auxiliary ring, and the top end of the third spring is fixed to the insert rod.

[0015] As a preferred embodiment of the wafer inkjet device based on vision inspection described in this invention, wherein: a positioning ball is fitted with the bracket near the end of the rotating rod with a clearance fit; the bottom end of the screw passes through the displacement frame and is threadedly connected to the displacement frame; the auxiliary component includes a drive sprocket fixed on the rotating rod; a driven sprocket is fixed on the outer ring of the screw; and a chain is sleeved between the driven sprocket and the drive sprocket and connected by chain drive.

[0016] As a preferred embodiment of the vision-based wafer inkjet device of the present invention, the guide includes a protrusion rotatably connected in a groove, a chuck fixed on the protrusion, a ratchet fixed on the outer ring of the protrusion, a bracket fixed on the outer ring of the rotating rod, a pawl rotatably connected on the bracket, and a second torsion spring sleeved on the bracket, one end of the second torsion spring being fixed on the bracket, and the other end of the second torsion spring being fixed on the pawl.

[0017] The beneficial effects of this invention are as follows: by setting up the support component and the drive component, the rotating rod can rotate 90 degrees at a fixed angle under the drive of the stepper motor, and then the transmission component and the bracket cooperate to meet the processing needs of multiple stations on the support component at the same time using multiple brackets. It also enables the feeding rack to automatically move down to supply material and the unloading rack to automatically move up to lift material, without the need for additional equipment intervention. The overall integration is high and better meets the inkjet printing requirements for the continuity, integration and convenience of multiple wafers. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a scene diagram of a wafer inkjet device based on vision inspection.

[0020] Figure 2 This is a structural diagram of a vision-based inspection wafer inkjet device.

[0021] Figure 3 This is a top view of the inspection inkjet assembly of a vision-based wafer inkjet device.

[0022] Figure 4 This is a structural diagram of the carrier component of a vision-based inspection wafer inkjet device.

[0023] Figure 5 This is a diagram showing the separation of the material rack components in a vision-based inkjet device.

[0024] Figure 6 This is a structural diagram of the support component for a vision-based inspection wafer inkjet device.

[0025] Figure 7 This is a cross-sectional view of the auxiliary heating element of a vision-based inkjet wafer device.

[0026] Figure 8 This is a structural diagram of the drive component of a vision-based wafer inkjet device.

[0027] Figure 9 Another perspective view of the auxiliary components of a vision-based wafer inkjet device.

[0028] Figure 10 This is a diagram showing the installation of the rotating rod and transmission components of a vision-based wafer inkjet device.

[0029] Figure 11 For vision-based inspection wafer inkjet devices Figure 10 Enlarged view of point A in the middle.

[0030] Figure 12 For vision-based inspection wafer inkjet devices Figure 10 Enlarged view of section B in the middle.

[0031] Figure 13 This is a diagram showing the installation of the rotating rod and guide components of a vision-based wafer inkjet device.

[0032] Figure 14 For vision-based inspection wafer inkjet devices Figure 13 Enlarged view of point C in the middle.

[0033] In the diagram: 1. Inkjet printing assembly; 11. Processing table; 111. Through slot; 112. Processing groove; 113. Slot; 114. Electromagnetic block; 12. Inkjet head; 121. First industrial camera; 13. Second industrial camera; 14. X-axis drive; 15. Z-axis drive; 16. First Y-axis drive; 17. Second Y-axis drive; 2. Bearing assembly; 21. Material rack; 211. First auxiliary plate; 2 12. First support base; 213. Reinforcing rod; 214. Positioning head; 215. Fastening bolt; 216. Support plate; 217. Displacement frame; 218. Guide frame; 22. Support component; 221. Second auxiliary plate; 222. Second support slot; 23. Auxiliary heating component; 231. Third auxiliary plate; 2311. Arc-shaped groove; 2312. Arc-shaped guide rod; 232. Fixing ring; 233. Rotating ring; 234. Drive frame ; 2341, protrusion; 235, first spring; 236, third support slot; 3, drive assembly; 31, stepper motor; 32, rotating rod; 321, storage slot; 322, corrugated groove; 323, groove; 33, transmission component; 331, auxiliary ring; 3311, vertical rod; 3312, connecting frame; 3313, limiting groove; 332, pressing rod; 3321, second spring; 333, auxiliary frame; 33 31. First torsion spring; 334. Inclined plate; 335. Stop block; 336. Insert rod; 3361. Third spring; 34. Bracket; 341. Positioning ball; 35. Screw; 36. Auxiliary component; 361. Drive sprocket; 362. Driven sprocket; 363. Chain; 37. Guide component; 371. Protruding rod; 372. Chuck; 373. Ratchet; 374. Bracket; 3741. Second torsion spring; 375. Pawl. Detailed Implementation

[0034] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0035] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0036] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0037] Example 1, referring to Figure 1 and Figure 2 This is the first embodiment of the present invention. This embodiment provides a wafer inkjet device based on vision inspection. The wafer inkjet device based on vision inspection includes an inkjet detection component 1, a carrier component 2, and a drive component 3. By setting up the carrier component 2 and the drive component 3, the processing needs of multiple stations on the carrier component 2 can be met simultaneously, and automatic downward feeding and automatic upward storage can be completed without the need for additional equipment intervention. The overall integration is high, which is more in line with the continuous, integrated, and convenient inkjet inspection needs of multiple wafers.

[0038] Specifically, the inkjet assembly 1 includes a processing table 11, an inkjet head 12 is provided on the top of the processing table 11, a first industrial camera 121 is fixed on the inkjet head 12, and a second industrial camera 13 is provided on the top of the processing table 11.

[0039] The first industrial camera 121 and the second industrial camera 13 are based on visual inspection technology and have been widely used in modern intelligent manufacturing. Their core function is to achieve high-precision detection, measurement and analysis of industrial scenes through optical imaging and digital signal processing. The process can be divided into optical signal acquisition, photoelectric conversion, digital signal processing and result output. It can be well applied to the wafer inspection process. The working principle of this part is existing technology and can be clearly understood by those skilled in the art, so it will not be described in detail here.

[0040] Specifically, the supporting component 2 is set on the processing table 11, including a material rack component 21 that runs through the processing table 11, a support component 22 fixed on the top of the processing table 11, and an auxiliary heating component 23 fixed on the top of the processing table 11.

[0041] There are two rack components 21, one of which is a raw material rack fully loaded with wafers, and the other is an empty storage rack.

[0042] Specifically, the drive assembly 3 is mounted on the processing table 11 and includes a stepper motor 31 fixed to the bottom of the processing table 11. A rotating rod 32 is fixed to the output end of the stepper motor 31. A transmission component 33 is provided on the outer ring of the rotating rod 32. A bracket 34 is mounted on the transmission component 33. A screw 35 is rotatably connected to the bottom of the processing table 11. An auxiliary component 36 is installed between the screw 35 and the rotating rod 32. A guide component 37 is provided on the outer ring of the rotating rod 32.

[0043] The top of the bracket 34 is equipped with a vacuum chuck, which is used to vacuum adsorb the bottom of the wafer in the working state, thereby ensuring the stability of wafer transfer. In practical applications, the shape of the bracket 34 can be designed as a ring surface to further increase the uniformity of adsorption with the wafer. The working principle of this part is all existing technology, which can be clearly understood by those skilled in the art, and will not be described in detail here.

[0044] Example 2, refer to Figures 2-14 This is the second embodiment of the present invention, which is based on the previous embodiment.

[0045] Specifically, an X-axis drive unit 14 is installed on the top of the processing table 11, a Z-axis drive unit 15 is installed on the moving end of the X-axis drive unit 14, a first Y-axis drive unit 16 and a second Y-axis drive unit 17 are respectively installed on the moving end of the Z-axis drive unit 15, an inkjet head 12 is fixed on the moving end of the first Y-axis drive unit 16, and a second industrial camera 13 is fixed on the moving end of the second Y-axis drive unit 17.

[0046] Both the X-axis drive unit 14 and the Z-axis drive unit 15 are servo motors with ball screw drives, and are equipped with high-precision linear guides such as ball guides to ensure smooth movement. A grating ruler / encoder provides position feedback. The first Y-axis drive unit 16 and the second Y-axis drive unit 17 are high-precision cylinders. With the cooperation of the X-axis drive unit 14, the Z-axis drive unit 15, the first Y-axis drive unit 16 and the second Y-axis drive unit 17, the positions of the inkjet head 12, the first industrial camera 121 and the second industrial camera 13 can be flexibly adjusted. The working principle of this part is existing technology and can be clearly understood by those skilled in the art, so it will not be described in detail here.

[0047] Specifically, the top of the processing table 11 is provided with a through groove 111, which cooperates with the material rack 21, and the top of the processing table 11 is fixed with a processing groove 112.

[0048] Specifically, the material rack component 21 includes a first auxiliary plate 211 located in the through groove 111. A first support base 212 is fixed to the top of the first auxiliary plate 211, a support plate 216 is provided at the bottom of the first auxiliary plate 211, a fastening bolt 215 is provided through the bottom of the support plate 216, and a displacement frame 217 is fixed to the bottom of the support plate 216.

[0049] Specifically, the support member 22 includes a second auxiliary plate 221 bolted to the machining groove 112, and a second support seat 222 is fixed to the top of the second auxiliary plate 221.

[0050] The second auxiliary plate 221 and the second support slot 222 can stably support the wafer, thereby meeting the needs of subsequent inkjet printing by the inkjet head 12 and inspection by the first industrial camera 121.

[0051] Specifically, the auxiliary heating component 23 includes a third auxiliary plate 231 bolted to the machining groove 112. The top of the third auxiliary plate 231 has an arc-shaped groove 2311. An arc-shaped guide rod 2312 is fixed in the arc-shaped groove 2311. A fixing ring 232 is fixed to the top of the third auxiliary plate 231. A rotating ring 233 is rotatably connected to the outside of the fixing ring 232. A drive frame 234 is fixed to the outer ring of the rotating ring 233. A protrusion 2341 is fixed to the bottom of the drive frame 234. A first spring 235 is fixed on the protrusion 2341. The first spring 235 is sleeved on the arc-shaped guide rod 2312. The end of the first spring 235 away from the protrusion 2341 is fixed to the inner wall of the arc-shaped groove 2311. A third support seat 236 is fixed to the top of the third auxiliary plate 231.

[0052] The connection point between the rotating ring 233 and the drive frame 234 is higher than that of the fixed ring 232, thereby avoiding direct contact and friction damage between the drive frame 234 and the fixed ring 232.

[0053] There are several fixed rings 232 and rotating rings 233, which are evenly distributed on the third auxiliary plate 231 to match the wafer shape, thereby enabling uniform heating of the bottom of the wafer.

[0054] The bottom of the bracket 34 is fixed with a protrusion that cooperates with the drive frame 234. Through the cooperation of the arc groove 2311 and the protrusion 2341, and the guidance of the arc guide rod 2312 to move the protrusion 2341, when the bracket 34 rotates, the protrusion contacts the drive frame 234, ensuring that the drive frame 234 rotates stably at a certain angle, thereby linking multiple rotating rings 233 to rotate. The friction generated by the fixed ring 232 increases the temperature around the third support slot 236, accelerating the drying of the wafer ink droplets on the third support slot 236.

[0055] During the above process, the drive frame 234 rotates at a certain angle due to the drive of the protrusion. The fixed ring 232 and the rotating ring 233 rotate relative to each other, generating a frictional heating. The first spring 235 is compressed. When the protrusion no longer contacts the drive frame 234, the first spring 235 is automatically released, the drive frame 234 automatically reverses, and the fixed ring 232 and the rotating ring 233 rotate relative to each other again, generating a frictional heating, which meets the drying requirements of the ink droplets on the top of the wafer after inkjet printing.

[0056] Specifically, the rotating rod 32 has a storage groove 321 inside, a corrugated groove 322 on the outer ring of the rotating rod 32, and a recess 323 on the outer ring of the rotating rod 32. The storage groove 321, the corrugated groove 322 and the recess 323 are connected in sequence.

[0057] Specifically, the transmission component 33 includes an auxiliary ring 331 located outside the rotating rod 32. A vertical rod 3311 is fixed to the top of the auxiliary ring 331. The top of the vertical rod 3311 passes through the bracket 34 and slides in contact with the bracket 34. A connecting frame 3312 is fixed to the inner ring of the auxiliary ring 331. The connecting frame 3312 is rotatably connected to the outer ring of the rotating rod 32 via a bearing. A limiting groove 3313 is formed at the bottom of the inner ring of the auxiliary ring 331. A pressing rod 332 is slidably connected to the top of the receiving groove 321. A second spring 3321 is sleeved on the pressing rod 332. One end of the second spring 3321 is fixed in the receiving groove 321, and the other end of the second spring 3321 is fixed to the pressing rod 332. An auxiliary frame 333 is fixed on the pressure rod 332 and the rotating rod 32. An inclined plate 334 is rotatably connected to the auxiliary frame 333. A first torsion spring 3331 is sleeved on the auxiliary frame 333. One end of the first torsion spring 3331 is fixed to the auxiliary frame 333, and the other end of the first torsion spring 3331 is fixed to the inclined plate 334. A stop block 335 is fixed at the bottom of the inclined plate 334 and cooperates with the limiting groove 3313. An insert rod 336 is slidably connected in the limiting groove 3313. A third spring 3361 is sleeved on the top of the insert rod 336. The bottom end of the third spring 3361 is fixed to the auxiliary ring 331, and the top end of the third spring 3361 is fixed to the insert rod 336.

[0058] The processing table 11 has a slot 113 on its top and an electromagnetic block 114 fixed on its top. There are four slots 113 and four electromagnetic blocks 114, which correspond to the positions of the through slot 111 and the processing slot 112. The slot 113 is adapted to the insertion rod 336. When the insertion rod 336 is lowered and placed into the through slot 111, the auxiliary ring 331 cannot rotate. The bottom of the stop block 335 is fixed with a protruding magnetic block. When the stop block 335 rotates to the top of the processing slot 112, it will be magnetically attracted by the processing slot 112 and automatically move down.

[0059] The bracket 34 is fitted with a positioning ball 341 at one end near the rotating rod 32. The positioning ball 341 is located in the corrugated groove 322 and rotates in contact with the corrugated groove 322. Under the guidance of the positioning ball 341 and the corrugated groove 322, when the rotating rod 32 rotates and the bracket 34 is stationary, the bracket 34 will move up and down.

[0060] The vertical rod 3311 can guide the vertical displacement of the bracket 34. When the auxiliary ring 331 is stationary, the bracket 34 cannot rotate, but when the auxiliary ring 331 rotates, the bracket 34 rotates synchronously.

[0061] The bottom of the connecting frame 3312 is at a higher level than the top of the electromagnetic block 114. This design avoids collisions and conflicts between the two, which would affect subsequent actions.

[0062] With the cooperation of the limiting groove 3313 and the stop block 335, when the stop block 335 is placed in the limiting groove 3313, the rotating rod 32 rotates in a circle, which will drive the auxiliary ring 331 to rotate together. At the same time, the stop block 335, which is stuck in the limiting groove 3313, will also lift the insertion rod 336 upward. The third spring 3361 is stretched, and the bottom end of the insertion rod 336 is disengaged from the slot 113, thus completing the unlocking.

[0063] When the bracket 34 is in the highest position, that is, the positioning ball 341 is in the highest position in the corrugated groove 322, the positioning ball 341 squeezes the corrugated groove 322 to move inward, the second spring 3321 is compressed, and then pushes the top of the inclined plate 334 to move. Under the positioning of the auxiliary frame 333, the bottom end of the inclined plate 334 rotates outward, and the first torsion spring 3331 is tightened.

[0064] Specifically, the bottom end of the screw 35 passes through the displacement frame 217 and is threadedly connected to the displacement frame 217. The auxiliary component 36 includes a drive sprocket 361 fixed on the rotating rod 32, a driven sprocket 362 fixed on the outer ring of the screw 35, and a chain 363 sleeved between the driven sprocket 362 and the drive sprocket 361 and connected by the chain 363.

[0065] The two screws 35 have opposite thread directions. When the two screws 35 rotate in the same direction, the displacement frame 217 corresponding to the material rack 21 of the raw material rack will move down, and the displacement frame 217 corresponding to the material rack 21 of the storage rack will move up.

[0066] Specifically, the guide 37 includes a protruding rod 371 rotatably connected in the groove 323, a chuck 372 fixed on the protruding rod 371, a ratchet 373 fixed on the outer ring of the protruding rod 371, a bracket 374 fixed on the outer ring of the rotating rod 32, a pawl 375 rotatably connected on the bracket 374, and a second torsion spring 3741 sleeved on the bracket 374. One end of the second torsion spring 3741 is fixed on the bracket 374, and the other end of the second torsion spring 3741 is fixed on the pawl 375.

[0067] The groove 323 is used to meet the rotation space requirements of the chuck 372. The outer ring of the chuck 372 has multiple cavities to meet the storage requirements of the positioning ball 341. As the positioning ball 341 moves in the corrugated groove 322, when a positioning ball 341 is disengaged from the chuck 372, it will cause the chuck 372 to rotate at a certain angle, and then the next level cavity of the chuck 372 will meet the storage and positioning requirements of the next positioning ball 341.

[0068] Example 3, referring to Figures 2-14 This is the third embodiment of the present invention, which is based on the first two embodiments.

[0069] Specifically, a reinforcing rod 213 is fixed through the first auxiliary plate 211. There are several first auxiliary plates 211, and each first auxiliary plate 211 is equipped with a first support seat 212 to meet the load-bearing requirements of multiple wafers. The presence of the reinforcing rod 213 effectively improves the structural stability.

[0070] A positioning head 214 is fixed at the bottom of the first auxiliary plate 211 at the bottom. The top of the support plate 216 has a placement groove that works with the positioning head 214. The fastening bolt 215 passes through the placement groove and is threaded to the positioning head 214 to stably install the first auxiliary plate 211 on the support plate 216. In practical applications, in order to improve the efficiency of disassembling and assembling the first auxiliary plate 211 and save operation time, elastic buckles can also be used for fixing, provided that the installation of the first auxiliary plate 211 is stable.

[0071] A guide frame 218 is fixed at the bottom of the pallet 216. The top of the guide frame 218 passes through the processing table 11 and slides in contact with the processing table 11. It is used to guide the displacement of the pallet 216 and ensure the stability of the pallet 216's movement.

[0072] The fixing ring 232 is made of aluminum nitride ceramic, which has the advantage of extremely high thermal conductivity. After frictional heat generation, it can quickly conduct heat to the surface of the ring, efficiently heating the surrounding air. The material has high purity and no impurities volatilize, so it will not generate dust during friction, avoiding air pollution and thus affecting the wafer. It has strong thermal stability and can withstand high temperatures above 300℃. It will not deform even after long-term heat generation, ensuring the uniformity of air heating.

[0073] The rotating ring 233 is made of polished graphite ceramic. When it is rotated in combination with the fixed ring 232 made of aluminum nitride ceramic, it can stably generate the heat required for drying. After the surface is polished, there is no risk of particle shedding. At the same time, the graphite component has good radiative heat dissipation effect, which can help the air around the ring to heat up quickly. It has high mechanical strength and strong wear resistance. Long-term rotation will not affect the heat generation stability due to wear.

[0074] In summary, when the fixed ring 232 and the rotating ring 233 rotate relative to each other, heat is transferred to the bottom of the wafer through the radiation of the ring body and the convection of the air. The heating rate is fast and gentle, which allows the ink droplets on the wafer surface to dry gradually at a stable temperature, avoiding the cracking of ink droplets caused by sudden temperature rise. At the same time, the heat is quickly diffused to the air around the ring body, forming a uniform hot airflow that surrounds the bottom of the wafer to achieve overall heating and ensure uniform drying of ink droplets.

[0075] The end of the compression rod 332 near the positioning ball 341 is hemispherical, and the center of the hemisphere of the compression rod 332 and the center of the positioning ball 341 are not on the same horizontal line. With this setting, when the compression rod 332 moves outward actively, it will compress the positioning ball 341 to move within the corrugated groove 322.

[0076] In use, initially, the fully loaded wafer rack 21 protrudes from the processing table 11, while the unloaded wafer rack 21 is recessed from the processing table 11, as shown in the attached diagram of the instruction manual. Figure 4 As shown, the bracket 34 is located at the top of the first auxiliary plate 211 and the bottom of the wafer, the positioning ball 341 is in the low position in the corrugated groove 322, the insertion rod 336 is elastically supported by the third spring 3361 and is inserted into the slot 113, the stop block 335 is magnetically attracted by the working electromagnetic block 114, and the pressing rod 332 is protruding.

[0077] The stepper motor 31 is controlled to work and the electromagnetic block 114 is stopped, which drives the rotating rod 32 to rotate clockwise. At this time, since the auxiliary ring 331 cannot rotate, the bracket 34 moves up first under the cooperation of the positioning ball 341 and the corrugated groove 322, thereby lifting the wafer on the first support seat 212 until the positioning ball 341 is placed at the highest point of the corrugated groove 322.

[0078] During the above process, the positioning ball 341 will first enter the chuck 372, and under the unidirectional transmission of the ratchet 373 and pawl 375, the positioning ball 341 will be stably positioned at a high position in the corrugated groove 322. Since the rotating rod 32 has rotated 90 degrees, the next-level pressing rod 332 will be aligned with the positioning ball 341, and the positioning ball 341 will press the pressing rod 332 to move inward, which will cause the linkage inclined plate 334 to rotate, so that the stop block 335 will actively enter the limiting groove 3313, and the pressing rod 336 will move upward and disengage from the slot 113.

[0079] In this state, when the stepper motor 31 is driven to work again, the rotating rod 32, the auxiliary ring 331 and the bracket 34 can rotate together, thereby transferring the wafer to the next process. At this time, the insertion rod 336 is aligned with the new slot 113 again, and the stop block 335 is aligned with the new electromagnetic block 114. Controlling the electromagnetic block 114 to work can actively move the extrusion rod 332 outward and extrude the inclined plate 334 to move at a certain angle in the corrugated groove 322 and enter the downward path in the corrugated groove 322. Under the elastic support of the third spring 3361, the insertion rod 336 is inserted into the new slot 113.

[0080] By controlling the stepper motor 31 to work again, the rotating rod 32 can be rotated independently, causing the bracket 34 to gradually move down and fall onto the second support seat 222, which is used to meet the visual inspection of the first industrial camera 121 and the inkjet processing of the inkjet head 12.

[0081] By repeating this cycle, the wafer can be raised, rotated, and lowered to meet the processing needs of multiple workstations.

[0082] When the wafer is on the third support slot 236, as the bracket 34 rotates, the drive frame 234 will rotate synchronously. The fixed ring 232 and the rotating ring 233 work together to generate heat through friction, which accelerates the drying of ink droplets on the wafer surface and works in conjunction with the second industrial camera 13 for visual inspection and recognition.

[0083] During the aforementioned process, as the rotating rod 32 rotates, and the transmission between the driving sprocket 361, the driven sprocket 362, and the chain 363, combined with the fixed pitch of the screw 35, the displacement frame 217 will move up or down stably and accurately, thereby simultaneously causing the first auxiliary plate 211 to move, completing the automatic rise or fall of the material rack 21, satisfying the automatic downward feeding of multiple wafers and the automatic upward storage operation, meeting the requirements of continuous operation.

[0084] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A wafer inkjet printing device based on vision inspection, characterized in that: include, The inkjet assembly (1) includes a processing table (11), an inkjet head (12) is provided on the top of the processing table (11), a first industrial camera (121) is fixed on the inkjet head (12), and a second industrial camera (13) is provided on the top of the processing table (11). The supporting component (2) is set on the processing table (11) and includes a material rack component (21) that runs through the processing table (11). A support component (22) is fixed on the top of the processing table (11), and an auxiliary heating component (23) is fixed on the top of the processing table (11). The drive assembly (3) is set on the processing table (11) and includes a stepper motor (31) fixed to the bottom of the processing table (11). A rotating rod (32) is fixed to the output end of the stepper motor (31). A transmission component (33) is provided on the outer ring of the rotating rod (32). A bracket (34) is installed on the transmission component (33). A screw (35) is rotatably connected to the bottom of the processing table (11). An auxiliary component (36) is installed between the screw (35) and the rotating rod (32). A guide component (37) is provided on the outer ring of the rotating rod (32).

2. The wafer inkjet device based on vision inspection as described in claim 1, characterized in that: The processing table (11) is equipped with an X-axis drive (14) on top, and a Z-axis drive (15) is installed on the moving end of the X-axis drive (14). A first Y-axis drive (16) and a second Y-axis drive (17) are respectively installed on the moving end of the Z-axis drive (15). The inkjet head (12) is fixed on the moving end of the first Y-axis drive (16), and the second industrial camera (13) is fixed on the moving end of the second Y-axis drive (17).

3. The wafer inkjet printing device based on vision inspection as described in claim 1 or 2, characterized in that: The processing table (11) has a through groove (111) on the top, which cooperates with the material rack (21). The processing table (11) has a processing groove (112) fixed on the top. The processing table (11) has a slot (113) on the top. The processing table (11) has an electromagnetic block (114) fixed on the top.

4. The wafer inkjet device based on vision inspection as described in claim 3, characterized in that: The material rack component (21) includes a first auxiliary plate (211) located in the through groove (111). A first support base (212) is fixed on the top of the first auxiliary plate (211). A reinforcing rod (213) is fixed through the first auxiliary plate (211). A positioning head (214) is fixed at the bottom of the lowest first auxiliary plate (211). A support plate (216) is provided at the bottom of the first auxiliary plate (211). A fastening bolt (215) is provided through the bottom of the support plate (216). A displacement frame (217) is fixed at the bottom of the support plate (216). A guide frame (218) is fixed at the bottom of the support plate (216).

5. The wafer inkjet printing device based on vision inspection as described in claim 4, characterized in that: The support member (22) includes a second auxiliary plate (221) bolted to the machining groove (112), and a second support seat (222) is fixed to the top of the second auxiliary plate (221).

6. The wafer inkjet printing device based on vision inspection as described in claim 5, characterized in that: The auxiliary heating element (23) includes a third auxiliary plate (231) bolted to the machining groove (112). The top of the third auxiliary plate (231) is provided with an arc-shaped groove (2311). An arc-shaped guide rod (2312) is fixed in the arc-shaped groove (2311). A fixing ring (232) is fixed to the top of the third auxiliary plate (231). A rotating ring (233) is rotatably connected to the outside of the fixing ring (232). A drive frame (234) is fixed to the outer ring of the rotating ring (233). A protrusion (2341) is fixed to the bottom of the drive frame (234). A first spring (235) is fixed on the protrusion (2341). The first spring (235) is sleeved on the arc-shaped guide rod (2312). The end of the first spring (235) away from the protrusion (2341) is fixed to the inner wall of the arc-shaped groove (2311). A third support seat (236) is fixed to the top of the third auxiliary plate (231).

7. The wafer inkjet device based on vision inspection as described in claim 6, characterized in that: The rotating rod (32) has a storage groove (321) inside, a corrugated groove (322) on the outer ring of the rotating rod (32), and a recess (323) on the outer ring of the rotating rod (32). The storage groove (321), the corrugated groove (322) and the recess (323) are connected in sequence.

8. The wafer inkjet device based on vision inspection as described in claim 7, characterized in that: The transmission component (33) includes an auxiliary ring (331) located outside the rotating rod (32). A vertical rod (3311) is fixed to the top of the auxiliary ring (331). The top of the vertical rod (3311) passes through the bracket (34) and slides in contact with the bracket (34). A connecting frame (3312) is fixed to the inner ring of the auxiliary ring (331). The connecting frame (3312) is rotatably connected to the outer ring of the rotating rod (32) via a bearing. A limiting groove (3313) is opened at the bottom of the inner ring of the auxiliary ring (331). A pressing rod (332) is slidably connected to the top of the receiving groove (321). A second spring (3321) is sleeved on the pressing rod (332). One end of the second spring (3321) is fixed in the receiving groove (321), and the other end of the second spring (3321) is fixed to the pressing rod (332). On the rotating rod (332), an auxiliary frame (333) is fixed on the rotating rod (32). An inclined plate (334) is rotatably connected to the auxiliary frame (333). A first torsion spring (3331) is sleeved on the auxiliary frame (333). One end of the first torsion spring (3331) is fixed on the auxiliary frame (333), and the other end of the first torsion spring (3331) is fixed on the inclined plate (334). A stop block (335) is fixed at the bottom of the inclined plate (334) and cooperates with the limiting groove (3313). A plug rod (336) is slidably connected in the limiting groove (3313). A third spring (3361) is sleeved on the top of the plug rod (336). The bottom end of the third spring (3361) is fixed on the auxiliary ring (331), and the top end of the third spring (3361) is fixed on the plug rod (336).

9. The wafer inkjet device based on vision inspection as described in claim 8, characterized in that: The bracket (34) has a positioning ball (341) with a clearance fit near the end of the rotating rod (32). The bottom end of the screw (35) passes through the displacement frame (217) and is threadedly connected to the displacement frame (217). The auxiliary component (36) includes a drive sprocket (361) fixed on the rotating rod (32). A driven sprocket (362) is fixed on the outer ring of the screw (35). A chain (363) is sleeved between the driven sprocket (362) and the drive sprocket (361) and is connected by transmission through the chain (363).

10. The wafer inkjet apparatus based on vision inspection as described in claim 9, characterized in that: The guide (37) includes a protruding rod (371) rotatably connected in a groove (323), a chuck (372) fixed on the protruding rod (371), a ratchet (373) fixed on the outer ring of the protruding rod (371), a bracket (374) fixed on the outer ring of the rotating rod (32), a pawl (375) rotatably connected on the bracket (374), and a second torsion spring (3741) sleeved on the bracket (374). One end of the second torsion spring (3741) is fixed on the bracket (374), and the other end of the second torsion spring (3741) is fixed on the pawl (375).

Images