A double-sided chip packaging structure

Abstract

The application relates to the technical field of chip packaging, and particularly discloses a double-sided chip packaging structure which comprises an upper mold, a lower mold, a sliding plate, a positioning assembly and an adjusting assembly. The upper mold is provided with a mounting groove, the sliding plate is arranged in the mounting groove, a through hole is arranged at the bottom of the mounting groove, and a jacking rod is arranged at the lower side of the sliding plate. The positioning assembly comprises a positioning block and a pressing block, and the positioning block is provided with a positioning groove matched with the chip pin. During packaging, the chip pin is arranged in the positioning groove, the upper mold is lowered to press the pin tightly through the pressing block to fix the chip. The adjusting assembly controls the movement of the sliding plate, the jacking rod is sealed or opened to the through hole, and the blowing and dust removal and vacuumization of the mold cavity are realized in cooperation with a gas path system. The stable clamping of the chip is realized through the positioning assembly, the chip is prevented from being displaced during glue pouring, the dust pollution in the mold cavity and the glue pouring bubble problem are effectively solved through the combination of the sliding plate and the gas path design, and the packaging quality and the yield of the double-sided chip are remarkably improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip packaging, in particular to a double-sided chip packaging structure. BACKGROUND

[0002] With the development of electronic devices towards miniaturization, high integration and multi-function, chip packaging technology needs to achieve higher component density and performance in limited space. Double-sided chip packaging has become a key technology direction in the fields of consumer electronics, automotive electronics and other fields because it can fully utilize the space on both sides of the substrate to significantly improve the packaging integration. Double-sided chip is a technical solution that relies on the space on both sides of the substrate to realize chip packaging. Its typical structure takes the substrate as the carrier, uses epoxy adhesive to mount the chip on both sides of the substrate, and realizes the electrical connection between the chip and the substrate through wire bonding or flip-chip. Some solutions combine through silicon vias to optimize performance. In related prior art, in order to enhance the adaptability of double-sided chip in special environment, the chip is packaged so that the chip only has pins to connect with other components.

[0003] The Chinese patent application file with publication number CN118335659A discloses a double-sided chip packaging structure and a packaging method thereof. The double-sided chip packaging structure comprises a main body, a lock catch fixedly connected to the front surface of the main body, a sealing groove formed in the lock catch, the sealing groove penetrating through the top of the main body, two sliding grooves formed in one side of the main body close to the middle part of the main body, the two sliding grooves being symmetrically distributed with the middle part of the main body as the center, and two fixed sliding blocks fixedly connected to the rear wall of the main body. When the top cover is pressed and combined, the pressing plate is pushed downward by the sliding rods extending outward, and when the C-shaped sliding block moves, the arc-shaped top plate will squeeze the air bag through the moving rod, so that the gas in the air bag enters the air outlet chamber through the hose, and the floating dust on the chip is blown and cleaned, preventing dust or pollutants in the environment from entering the chip connection, affecting the quality of chip packaging.

[0004] In related prior art, when double-sided chips are packaged, the double-sided chips are placed in a mold for glue pouring packaging. Liquid insulation glue is injected into the cavity between the chip and the mold cavity, and a protective layer is formed after solidification. However, when glue pouring packaging is performed, the position of the chip needs to be fixed to prevent the chip from moving during the glue pouring process. At the same time, there may be dust in the air inside the mold cavity during glue pouring, and bubbles may be generated in the glue liquid during glue pouring, which may result in unqualified chip packaging. SUMMARY

[0005] The present application provides a double-sided chip packaging structure, which aims to solve the problem of unqualified chip packaging caused by the need to fix the position of the chip to prevent the chip from moving during glue pouring packaging, and the presence of dust in the air inside the mold cavity during glue pouring and the generation of bubbles in the glue liquid during glue pouring in related technologies.

[0006] A double-sided chip packaging structure for packaging chips includes an upper mold and a lower mold; it also includes a sliding plate, a positioning component, and an adjustment component. The upper mold has a vertically formed mounting groove on its upper surface. The sliding plate is slidably disposed within the mounting groove. A through hole is provided between the bottom of the mounting groove and the cavity of the upper mold. A push rod is provided on the lower side of the sliding plate, the diameter of which matches the through hole. Multiple through-holes are provided on the sliding plate. The adjustment component includes a telescopic rod, a mounting plate, and an air inlet pipe. The mounting plate is disposed at the upper end of the mounting groove, the air inlet pipe is disposed on the mounting plate, and the telescopic rod is disposed on the mounting plate. The telescopic end of the telescopic rod is fixed to the sliding plate. The positioning component includes a positioning block and a pressing block. The positioning blocks are disposed on both sides of the lower mold near the cavity. The positioning blocks have positioning grooves with the same width as the chip pins. The pressing blocks are disposed at the lower end of the upper mold and their positions correspond to the positioning blocks. During packaging, the chip pins are placed into the positioning grooves corresponding to the positioning blocks. When the upper mold moves downward, the pressing blocks on both sides press the pins respectively.

[0007] The effect is as follows: through the synergistic action of the positioning and adjustment components, the reliability and yield of the packaging process are significantly improved. Regarding position adjustment, the positioning slots of the positioning block mounted on the lower mold provide initial positioning of the chip pins. Combined with the downward movement of the upper mold, the squeezing block adjusts the chip's position and squeezes the pins, achieving stable chip clamping. This positioning method effectively solves the problem of chip displacement or deflection due to the impact of the potting fluid in traditional packaging, ensuring the chip is centered within the mold cavity. The sliding plate and air path system design enables the mold to perform both dust cleaning and vacuum potting functions. After mold closing and before potting, the adjustment component controls the sliding plate to move upward and open the through-hole. Clean air is then introduced through the air inlet pipe to blow out the mold cavity, thoroughly removing suspended dust and simultaneously cleaning the chip itself. Subsequently, the system switches to a vacuum mode to create a vacuum environment, eliminating air resistance during adhesive filling and significantly reducing the generation of air bubbles within the adhesive. Finally, by moving the sliding plate downwards, the top rod seals the through hole, ensuring the airtightness of the potting and curing process, thereby greatly improving the compactness and insulation performance of the packaged product.

[0008] Preferably, the positioning component further includes a flexible strip, which is arranged in a ring on the lower end face of the upper mold and positioned between the extrusion block and the mold cavity of the upper mold. Its effect is that the flexible strip acts as a buffer during mold closing, protecting the mold and chip from impact. The flexible strip forms a reliable sealing ring between the extrusion block and the lower mold, and the deformed flexible strip fills the gap between the pin and the positioning groove, providing the necessary sealed environment for subsequent vacuuming operations.

[0009] Preferably, the upper side of the sliding plate is provided with a filter plate covering the upper ends of the plurality of through air holes. Its effect is that when air blowing cleaning is performed, the filter plate can effectively prevent dust particles in the air from entering the mold cavity, thereby effectively solving the problem that the air in the mold cavity contains floating dust when air blowing is performed on the mold cavity, and ensuring the cleanliness of the packaging environment.

[0010] Preferably, the mounting plate is fixed on the upper end face of the upper mold by a limiting bolt, and an annular sealing strip is arranged on the side wall of the mounting plate in contact with the mounting groove. Its effect is that the design of the sealing strip significantly improves the air tightness between the mounting plate and the mounting groove, preventing air leakage, thereby ensuring the efficiency of vacuum pumping and the maintenance of vacuum degree, and the fixing mode of the limiting bolt facilitates the disassembly and maintenance of the mounting plate.

[0011] Preferably, a plurality of clamping rings are arranged on the outer periphery of the air inlet pipe, and an air pump assembly is connected to the air inlet pipe, which is used for air pumping or air supply in the mold cavity. Its effect is that the clamping ring increases the friction and fastening degree of the hose connection, preventing the pipeline from falling off during high-pressure air blowing or negative-pressure air pumping, and the external air pump assembly realizes flexible switching between the two modes of air blowing dust removal and vacuum pumping bubble removal in the mold cavity.

[0012] Preferably, a cleaning ring is arranged at the lower edge of the side wall of the sliding plate in contact with the mounting groove, and a limiting ring is arranged on the top rod, and the distance between the lower end face of the limiting ring and the lower end face of the top rod is the same as the vertical length of the through hole. Its effect is that the cleaning ring can scrape off the dust or colloid residues attached to the inner wall of the mounting groove when the sliding plate moves up and down, and has a self-cleaning effect. The limiting ring controls the limit position of the downward movement of the top rod, ensuring that the lower end face of the top rod is flush with the top wall of the mold cavity, avoiding leaving indentations or protrusions on the packaged product.

[0013] Preferably, the positioning block is mounted on the lower mold by a limiting bolt. Its effect is that the detachable mounting mode enables the mold to adapt to chips of different sizes or pin layouts by replacing positioning blocks of different specifications, greatly improving the versatility and flexibility of the mold and reducing production costs.

[0014] Preferably, the end face of the extrusion block in contact with the pins of the chip is an arc face. Its effect is that the smooth arc face can guide the pins of the chip during mold closing, prompting the chip to automatically adjust its position to the center, while reducing physical damage to the pins caused by rigid contact.

[0015] Preferably, a plurality of guide columns are arranged on the upper mold, a plurality of guide holes are arranged on the lower mold, and the guide columns are matched with the guide holes. Its effect is that the precise fit of the guide columns and the guide holes ensures the stability of the upper mold and the lower mold during mold closing, preventing mold deviation from causing inaccurate chip positioning or pin damage, and ensuring the consistency of packaging.

[0016] Preferably, the extrusion block is clamped on the upper die, and the arc-shaped surface of the extrusion block in contact with the pin is coated with a wear-resistant layer. Its effect lies in: the clamping mode facilitates the quick replacement of the extrusion block, the wear-resistant layer not only prolongs the service life of the extrusion block, but also reduces the friction coefficient, further protects the surface of the chip pin, and ensures the stability of the equipment in long-term production.

[0017] By adopting the technical scheme, the application has the following beneficial effects:

[0018] 1. When the chip is packaged, the positioning groove on the positioning block of the lower die preliminarily limits the chip pin, and then the extrusion block extrudes the pin when the upper die moves downward, so as to realize the position adjustment of the chip, ensure the position of the chip in the whole packaging process, and effectively resist the fluid impact during glue pouring. Meanwhile, the arc-shaped contact surface of the extrusion block and the buffering effect of the flexible strip realize the flexible clamping of the chip pin, avoid physical damage, improve the sealing effect of the connection position, can adapt to the small gap between the pin and the positioning groove, and enhance the air tightness of the equipment.

[0019] 2. The closed mold cavity is blown by the external air pump, so that the air and suspended dust in the mold cavity can be almost completely discharged from the feeding port, the risk of impurity pollution is significantly reduced, and the density, electrical performance and mechanical strength of the packaged body are greatly improved.

[0020] 3. The mold cavity is vacuumized before glue pouring, so that the air in the mold cavity is discharged in advance, thereby reducing the air bubbles during glue pouring and the air resistance in the mold cavity during glue pouring. After the glue pouring is completed, the installation groove is further vacuumized, so that the air bubbles in the glue body overflow quickly, thereby reducing the air bubbles in the glue solution, and improving the yield of the double-sided chip during packaging. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the packaging structure of the application.

[0022] Figure 2 It is a side view schematic diagram of the packaging structure of the application.

[0023] Figure 3 It is a schematic diagram of the lower die structure of the application.

[0024] Figure 4 It is a schematic diagram of the positioning block installation of the application.

[0025] Figure 5 It is a schematic diagram of the upper die structure of the application.

[0026] Figure 6 It is a schematic diagram of the adjusting assembly structure of the application.

[0027] Figure 7Fig. 1 is a schematic view of the sliding plate structure of the present application.

[0028] Figure 8 Fig. 2 is a schematic view of the front structure of the mounting plate and the sliding plate of the present application.

[0029] Figure 9 Fig. 3 is a schematic view of the filter plate structure of the present application.

[0030] Figure 10 Fig. 4 is a schematic view of the air hole structure on the sliding plate of the present application.

[0031] Figure 11 Fig. 5 is a schematic view of the chip structure of the present application.

[0032] Reference signs:

[0033] 11, chip; 111, pin; 12, upper mold; 121, mounting groove; 122, through hole; 123, guide post; 13, lower mold; 131, guide hole; 2, sliding plate; 21, ejector rod; 211, limiting ring; 22, air hole; 23, filter plate; 24, cleaning ring; 3, positioning assembly; 31, positioning block; 311, positioning groove; 32, extrusion block; 33, flexible strip; 4, adjusting assembly; 41, telescopic rod; 42, mounting plate; 421, limiting bolt; 422, sealing strip; 43, air inlet pipe; 431, snap ring. DETAILED DESCRIPTION

[0034] Embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings. The embodiments described below by reference to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0035] The existing packaging structure is provided with an upper mold 12, a lower mold 13 and a chip 11. The lower mold 13 is fixedly arranged on a lower end driving device, and the upper mold 12 is arranged on a driving device in a direction perpendicular to the lower mold 13, and the driving device is used to control the mold closing and opening between the upper mold 12 and the lower mold 13. When the chip 11 is packaged, the chip 11 is placed in the lower mold 13, so that the pins 111 of the chip 11 are in an inverted trapezoidal shape, and then the driving device controls the upper mold 12 to move towards the lower mold 13 to close the mold. The bottom of the lower mold 13 is provided with a packaging feeding port in communication with the outside, and after the mold is closed, the gel is poured into the mold cavity through the feeding port to package the chip 11.

[0036] As Figures 1 to 11The application provides a double-sided chip packaging structure, which comprises a sliding plate 2 and a positioning assembly 3. An upper end surface of an upper die 12 is vertically provided with a mounting groove 121, and the sliding plate 2 is arranged in the mounting groove 121 in a sliding mode, so that the sliding plate 2 can slide up and down in the mounting groove 121. A through hole 122 is arranged between the bottom of the mounting groove 121 and a die cavity of the upper die 12, the lower side of the sliding plate 2 is provided with a ejector pin 21, and the ejector pin 21 has the same diameter as the through hole 122. When the sliding plate 2 moves downwards, the ejector pin 21 extends into the through hole 122, so that the mounting groove 121 is no longer communicated with the die cavity of the upper die 12.

[0037] The positioning assembly 3 comprises a positioning block 31 and an extrusion block 32. The positioning block 31 is arranged on both sides of the die cavity of the lower die 13, the positioning block 31 is provided with a positioning groove 311 with the same width as the pin 111 of the chip 11, and the extrusion block 32 is arranged on both sides of the lower end of the upper die 12 along the arrangement direction of the positioning block 31, so that the positioning block 31 and the extrusion block 32 are arranged correspondingly. When the chip 11 is packaged, the pin 111 of the chip 11 is placed into the positioning groove 311 corresponding to the positioning block 31, and then the upper die 12 is driven to move downwards, so that the extrusion blocks 32 on both sides extrude the pin 111 of the chip 11.

[0038] Therefore, the positioning groove 311 of the positioning block 31 can preliminarily limit the pin 111 of the chip 11, the extrusion blocks 32 on both sides can adjust the position of the chip 11 when the upper die 12 moves downwards, so that the chip 11 is located at the middle position of the die cavity. After the position of the chip 11 is adjusted, the two extrusion blocks 32 extrude the pin 111 synchronously, so that the position of the chip 11 is fixed, and the chip 11 is prevented from being displaced during the glue pouring process.

[0039] As shown in the figure, Figures 3 to 11 The upper die 12 and the lower die 13 are usually made of die steel with high strength, high hardness and wear resistance. In order to ensure the stability of the die closing process, the bottom of the upper die 12 is provided with a plurality of cylindrical guide columns 123. In the embodiment, the guide columns 123 are arranged as four and are distributed at the four corners of the upper die 12, and the corresponding positions of the lower die 13 are provided with guide holes 131 matched with the guide columns 123. When the upper die 12 moves downwards and is closed with the lower die 13, the guide columns 123 are first inserted into the guide holes 131, so as to guide and ensure that the upper die 12 and the lower die 13 are aligned along the preset track and are prevented from deviating, thereby providing a stable basis for subsequent positioning of the chip 11. The upper surface of the lower die 13 is recessed to form a die cavity in the central region, and the shape and size of the die cavity are designed according to the final shape of the chip 11 to be packaged.

[0040] As shown in the figure, Figures 5 to 11 The positioning assembly 3 comprises a positioning block 31 and an extrusion block 32. The positioning block 31 is arranged on the lower die 13, the extrusion block 32 is arranged on the upper die 12, and the positioning block 31 and the extrusion block 32 are correspondingly arranged on both sides of the chip 11 with the pin 111.

[0041] Specifically, on both sides of the mold cavity of the lower mold 13, two strip-shaped positioning blocks 31 are detachably installed on both sides of the lower mold 13 through limiting bolts 421. The positioning block 31 close to the side wall of the mold cavity is located in the same plane as the mold cavity, and the plane where the positioning block 31 is located on the upper side is located in the same plane as the upper end surface of the lower mold 13. After replacing different positioning blocks 31, the mold clamping between the upper and lower molds 13 can be completed. The detachable design greatly improves the flexibility and adaptability of the mold. When a chip 11 of different size or pin 111 layout needs to be packaged, only the corresponding positioning block 31 needs to be replaced, without the need to replace the entire lower mold 13. On the side of each positioning block 31 facing the mold cavity, a plurality of positioning grooves 311 matching the width, pitch and thickness of the pins 111 of the chip 11 are processed.

[0042] The depth of the positioning groove 311 is designed to be slightly larger than the thickness of the pin 111, which not only ensures effective limiting of the pin 111, but also avoids difficulty in sealing the upper side of the pin 111 due to excessive depth. The width of the positioning groove 311 has a slight positive tolerance with the width of the pin 111, to ensure that the pin 111 can be smoothly placed but will not have obvious shaking. The entrance edge of the positioning groove 311 is chamfered to guide the pin 111 to smoothly slide into the groove and reduce friction damage during insertion.

[0043] During feeding, the upper mold 12 and the lower mold 13 are separated by controlling the driving device. The operator or the automatic mechanical hand places the double-sided chip 11 to be packaged into the mold cavity of the lower mold 13, and embeds the pins 111 on both sides of the chip 11 into the positioning grooves 311 of the positioning blocks 31 one by one. The pins 111 of the chip 11 are preliminarily limited by the positioning grooves 311 of the positioning blocks 31.

[0044] As Figures 3 to 10 , two extrusion blocks 32 corresponding to the positioning blocks 31 are arranged on the lower end surface of the upper mold 12, the two extrusion blocks 32 are arranged on the upper mold 12 along the arrangement direction of the positioning blocks 31, and the extrusion blocks 32 are located outside the mold cavity of the upper mold 12. The extrusion blocks 32 are preferably fixed on the upper mold 12 in a clamping manner, which is convenient for quick replacement and maintenance. The pins 111 of the chip 11 are inverted trapezoidal in the vertical projection plane. When the extrusion blocks 32 move downward, the extrusion blocks 32 can extrude the inner side wall of the inverted trapezoidal of the pins 111, so that the pins 111 move the chip 11 horizontally under the action of the extrusion blocks 32, until the two extrusion blocks 32 can extrude the pins 111 of the chip 11.

[0045] Further, the end surface of the extrusion block 32 in contact with the pin 111 of the chip 11, i.e. the outer end surface of the lower side of the extrusion block 32, is designed as a smooth arc surface. By setting the outer end surface of the lower side of the extrusion block 32 as an arc surface, the arc-shaped portion of the extrusion block 32 can abut against the pin 111 of the chip 11 when the upper mold 12 and the lower mold 13 move relative to each other. Under the action of the arc surface, the pin 111 of the chip 11 makes the chip 11 symmetrical on both sides until the extrusion blocks 32 on both sides of the upper mold 12 abut against the pin 111 of the chip 11, so that the chip 11 is located at the center position of the cavity of the lower mold 13.

[0046] The extrusion block 32 is made of hard alloy and is fixed on the side of the lower end of the upper mold 12 by clamping. The distance between the two extrusion blocks 32 can be adjusted according to the width of the inverted trapezoidal pin 111, further improving the adaptability of the mold to different specifications of the chip 11.

[0047] The arc surface of the lower side of the extrusion block 32 is also coated with a layer of wear-resistant layer with high hardness and low friction coefficient. This coating not only prevents the wear of the extrusion block 32 itself during long-term use, ensuring the durability of the clamping precision, but also reduces the friction between the extrusion block 32 and the pin 111, further protecting the surface of the pin 111.

[0048] When the mold is closed, the control driving device controls the upper mold 12 to move downward smoothly under the guidance of the guide column 123, and the mold closing between the upper mold 12 and the lower mold 13 is performed. The guide column 123 is first inserted into the guide hole 131 to guide and ensure the accurate alignment of the upper mold 12 and the lower mold 13 along the preset trajectory, and at the same time, the extrusion block 32 adjusts the position of the chip 11.

[0049] When the upper mold 12 moves downward, the extrusion block 32 arranged at the bottom of the upper mold 12 positions the chip 11. The arc surface of the extrusion block 32 contacts the pin 111 on one side of the chip 11. The extrusion block 32 makes the chip 11 move to the side first contacted with the extrusion block 32 under the action of the pin 111, until the extrusion blocks 32 on both sides extrude the pin 111, so that the chip 11 is located at the center position of the cavity of the lower mold 13. After the position adjustment of the chip 11 is completed, the two extrusion blocks 32 extrude the pin 111 synchronously, realizing the stable fixation of the chip 11 and preventing the chip 11 from shifting during the glue pouring process. At the same time, the arc contact surface of the extrusion block 32 realizes the flexible clamping of the pin 111 of the chip 11, avoiding physical damage.

[0050] As shown in FIG. 6, the upper mold 12 is provided with two extrusion blocks 32 on both sides of the lower end of the upper mold 12. The two extrusion blocks 32 are arranged symmetrically on both sides of the lower end of the upper mold 12, and the distance between the two extrusion blocks 32 can be adjusted according to the width of the pin 111 of the chip 11. Figures 2 to 10 In addition, a flexible strip 33 is arranged around the edge between the extrusion block 32 and the mold cavity on the lower end surface of the upper mold 12. The flexible strip 33 is embedded on the lower end surface of the upper mold 12 and moves up and down with the upper mold 12. The flexible strip 33 is preferably made of high-temperature-resistant and chemical-corrosion-resistant silicone rubber or fluororubber material.

[0051] When the upper die 12 approaches the lower die 13, the flexible strip 33 at the bottom of the upper die 12 first contacts the surface of the lower die 13 to seal the mold cavity. As the upper die 12 continues to descend to the final closed position, the arc surface of the extrusion block 32 on the upper die 12 will press on the pins 111 of the chip 11.

[0052] The flexible strip 33 is deformed when the mold is closed, which can play two important roles when the flexible strip 33 is deformed: one is to buffer the impact at the moment of mold closing; the second is to form a reliable sealing ring between the positioning block 31 of the upper die 12 and the lower die 13, which provides a sealed environment for the subsequent vacuum operation, and at the same time clamps and fixes the pins 111 of the chip 11 in the positioning groove 311. The deformed flexible strip 33 seals the gap between the positioning groove 311 and the upper die 12, ensuring the airtightness of the mold cavity after the mold is closed.

[0053] The limiting bolt 421 is arranged at the two ends of the positioning block 31 in the length direction, and is an internal hexagonal countersunk head bolt. The head of the limiting bolt 421 matches the recess depth of the upper surface of the positioning block 31, so that the flatness error of the upper surface of the positioning block 31 after installation is not more than 0.02 mm, and there is no step feeling at the joint of the upper end surface of the lower die 13.

[0054] As Figures 4 to 11 , the installation groove 121 is opened in the upper end surface of the upper die 12, and the installation groove 121 is vertically opened in a cylindrical shape. The sliding plate 2 is slidably arranged in the installation groove 121, and the circular sliding plate 2 has the same diameter as the installation groove 121. The sliding plate 2 can freely slide up and down in the installation groove 121, and the sliding plate 2 is usually made of lightweight high-strength aluminum alloy or engineering plastic. At the bottom of the installation groove 121, a through hole 122 penetrating to the top of the mold cavity of the upper die 12 is opened. The lower side surface of the sliding plate 2 is fixedly connected with a top rod 21 at the center, and the diameter of the top rod 21 is matched with the inner diameter of the through hole 122. The top rod 21 can extend into the through hole 122 when it is vertically placed and slides down. Since the diameter of the top rod 21 is matched with the diameter of the through hole 122, the top rod 21 can seal the through hole 122.

[0055] A limiting ring 211 is arranged on the top rod 21. The position of the limiting ring 211 is measured so that when the sliding plate 2 moves to the lowermost end, the lower end surface of the limiting ring 211 abuts against the top wall of the mold cavity of the upper die 12. At this time, the lower end surface of the top rod 21 is flush with the top wall of the mold cavity of the upper die 12.

[0056] A plurality of air holes 22 penetrating through the sliding plate 2 are uniformly opened on the plate body of the sliding plate 2. Air can be blown into the closed mold cavity through the air holes 22. In order to prevent external dust from entering, a replaceable filter plate 23 is covered on the upper surface of the sliding plate 2. The filter plate 23 is a microporous filter membrane or a metal sintered mesh, which can effectively filter out dust particles in the air.

[0057] AsFigures 3 to 9 The adjusting assembly 4 is a mechanism for controlling the movement of the sliding plate 2 and connecting the external air pump. The adjusting assembly 4 comprises a telescopic rod 41, a mounting plate 42 and an air inlet pipe 43. The mounting plate 42 is fixed and sealed at the top opening of the mounting groove 121 by a plurality of limiting bolts 421. The mounting groove 121 is sealed at the top by the mounting plate 42. In order to improve the sealing between the mounting plate 42 and the mounting groove 121, a sealing strip 422 composed of a ring of circular sealing rings is embedded in the side wall of the mounting plate 42 in contact with the mounting groove 121. When the mounting plate 42 is installed, the sealing strip 422 will deform to form an annular sealing ring between the mounting plate 42 and the mounting groove 121. The sealing strip 422 can effectively reduce the air leakage between the mounting plate 42 and the mounting groove 121. The sealing groove is set so that the diameter of the mounting plate 42 is slightly smaller than that of the sealing groove, which makes the mounting plate 42 easier to install and reduces the workload during disassembly during installation or maintenance.

[0058] As shown in Figures 3 to 9 Two telescopic rods 41 are provided on the mounting plate 42. The telescopic rod 41 can be a miniature air cylinder or an electromagnetic push rod. The movable end of the telescopic rod 41 is fixedly connected to the upper surface of the sliding plate 2. By controlling the extension and retraction of the telescopic rod 41, the sliding plate 2 can be driven to move up and down in the mounting groove 121, thereby adjusting the positional relationship between the ejector rod 21 and the through hole 122, and simultaneously cleaning the side wall of the mounting groove 121 with the sliding plate 2.

[0059] As shown in Figures 3 to 9 An air inlet pipe 43 is provided on the upper side of the mounting plate 42. The air inlet pipe 43 connects the mounting groove 121 on the lower side of the mounting plate 42 with the outside. The outer periphery of the air inlet pipe 43 is provided with a plurality of barb-shaped clamping rings 431. The plurality of barb-shaped clamping rings 431 are arranged at equal intervals in the vertical direction, which facilitates quick, firm and sealed connection with the hose of the external air pump assembly. Through the air inlet pipe 43, the entire closed space composed of the mounting groove 121 and the mold cavity can be pumped or supplied with air.

[0060] In order to maintain the cleanliness of the system, a cleaning ring 24 made of an elastic wiper is provided at the lower edge of the side wall in contact with the sliding plate 2.

[0061] After the mold is closed, the telescopic rod 41 is controlled to retract, driving the sliding plate 2 to slide upward, so that the ejector rod 21 moves out of the through hole 122. The entire mold cavity is connected with the through hole 122, the mounting groove 121 and the air inlet pipe 43, forming a closed space jointly guaranteed by the flexible strip 33 and the sealing strip 422.

[0062] When cleaning, the air pump assembly is connected to the air inlet pipe 43 and set to the blowing mode. The air pump starts to work, and the clean air passing through the filter plate 23 enters the mold cavity. The clean air enters the mold cavity to replace the air in the mold cavity, and at the same time, the clean air flows in the mold cavity to blow and clean the surface of the chip 11, so that the surface of the chip 11 is clean and convenient for subsequent glue pouring. The air and suspended dust in the mold cavity are discharged from the feed port of the lower mold 13.

[0063] Subsequently, the glue pouring equipment is connected to the feed port, the air pump is set to the air suction mode, and the air pump starts to work. The air in the mold cavity passes through the through hole 122 upward, enters the lower space of the sliding plate 2, and then passes through the plurality of air holes 22 on the sliding plate 2. After being filtered by the filter plate 23, the air is sucked out from the air inlet pipe 43. In a short time, the vacuum degree in the mold cavity can meet the process requirements.

[0064] When the sliding plate 2 moves up and down, the cleaning ring 24 can scrape off the dust attached to the inner wall of the mounting groove 121 like a piston ring to play a self-cleaning role, so that the impurities in the mounting groove 121 are collected on the lower side of the mounting plate 42, preventing leakage and enabling concentrated cleaning.

[0065] Working principle: by controlling the driving device, the upper mold 12 and the lower mold 13 are separated. The operator or the automatic mechanical hand places the double-sided chip 11 to be packaged into the mold cavity of the lower mold 13, and embeds the pins 111 on both sides of the chip 11 into the positioning grooves 311 of the positioning blocks 31 one by one.

[0066] By controlling the driving device, the upper mold 12 stably moves downward under the guidance of the guide column 123, and the mold closing between the upper mold 12 and the lower mold 13 is performed. When the upper mold 12 moves downward, the extrusion blocks 32 arranged at the bottom of the upper mold 12 position the chip 11. The arc surface of the extrusion blocks 32 contacts the pins 111 on one side of the chip 11. The extrusion blocks 32 make the chip 11 move to the side first contacting the extrusion blocks 32 under the action of the pins 111, until the extrusion blocks 32 on both sides extrude the pins 111.

[0067] When the upper mold 12 approaches the lower mold 13, the flexible strips 33 at the bottom of the upper mold 12 first contact the surface of the lower mold 13 to seal the mold cavity and seal the position of the pins 111. As the upper mold 12 continues to move downward to the final closed position, the arc surface of the extrusion blocks 32 on the upper mold 12 presses on the pins 111 of the chip 11.

[0068] After the mold is closed, the slide plate 2 is slid upward, the ejector rod 21 is moved out of the through hole 122, the entire mold cavity is connected with the air inlet pipe 43 through the through hole 122 and the mounting groove 121, and a sealed space is formed which is ensured by the flexible strip 33 and the sealing strip 422. At this time, the air pump assembly is connected to the air inlet pipe 43 and is set to the blowing mode. The air pump starts to work, and the clean air passing through the filter plate 23 enters the mold cavity, and the air and suspended dust in the mold cavity are discharged through the feeding port.

[0069] After the cleaning is completed, the glue filling equipment is connected to the feeding port, the air pump is set to the pumping mode, and the air pump starts to work. The air in the mold cavity passes through the through hole 122, enters the lower space of the slide plate 2, passes through the plurality of air holes 22 on the slide plate 2, passes through the filter plate 23, and is pumped out from the air inlet pipe 43. In a short time, the vacuum degree in the mold cavity can meet the process requirements.

[0070] In the state of maintaining the vacuum, the liquid insulation glue is injected into the mold cavity through the feeding port on the lower mold 13. Since the mold cavity is close to vacuum, the glue can smoothly fill every tiny corner. After the glue is filled, the air pump can be started to further pump the vacuum, so that the gas in the glue is discharged from the through hole 122 to the mounting groove 121. At the same time, since the chip 11 is firmly clamped, the impact force of the glue filling will not affect the position of the chip 11. After the air pump pumps the vacuum, the ejector rod 21 is inserted into the through hole 122 through the telescopic rod 41, and then the glue is waited to be solidified at room temperature. After the glue is completely solidified, the mold is opened through the control driving device.

[0071] Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A double-sided chip packaging structure for packaging chips, comprising: The upper mold and the lower mold are characterized by further comprising: a sliding plate, a positioning component, and an adjusting component. The upper mold has a vertically formed mounting groove on its upper end face. The sliding plate is slidably disposed in the mounting groove. A through hole is provided between the bottom of the mounting groove and the mold cavity of the upper mold. A push rod is provided on the lower side of the sliding plate. The diameter of the push rod is adapted to the through hole. Multiple through air holes are provided on the sliding plate. The adjusting component includes: a telescopic rod, a mounting plate, and an air inlet pipe. The mounting plate is disposed at the upper end of the mounting groove. The air inlet pipe is disposed on the mounting plate. The telescopic rod is disposed on the mounting plate. The telescopic end of the telescopic rod is fixed to the sliding plate. The positioning component includes: a positioning block and a pressing block. The positioning blocks are disposed on both sides of the lower mold near the mold cavity. The positioning blocks are provided with positioning grooves adapted to the pin width of the chip. The pressing block is disposed at the lower end of the upper mold and its position corresponds to the positioning block. During packaging, the upper and lower molds are separated, and the double-sided chip to be packaged is placed into the cavity of the lower mold. The chip pins are embedded into the corresponding positioning slots of the positioning blocks. When the upper mold moves down, the pressing blocks on both sides press the pins respectively.

2. The double-sided chip packaging structure according to claim 1, characterized in that, The positioning component also includes a flexible strip, which is arranged in a ring on the lower end face of the upper mold and is positioned between the extrusion block and the mold cavity of the upper mold.

3. The double-sided chip packaging structure according to claim 1, characterized in that, A filter plate is provided on the upper side of the sliding plate, and the filter plate covers the upper end of multiple through-holes.

4. The double-sided chip packaging structure according to claim 3, characterized in that, The mounting plate is fixed to the upper end face of the upper mold by limiting bolts, and an annular sealing strip is provided on the side wall of the mounting plate that contacts the mounting groove.

5. A double-sided chip packaging structure according to claim 4, characterized in that, The air inlet pipe is provided with multiple retaining rings on its outer periphery, and an air pump assembly is connected to the outside of the air inlet pipe. The air pump assembly is used to extract or supply air into the mold cavity.

6. A double-sided chip packaging structure according to claim 5, characterized in that, A cleaning ring is provided at the lower edge of the side wall where the sliding plate contacts the mounting groove, and a limit ring is provided on the top rod. The distance between the lower end face of the limit ring and the lower end face of the top rod is the same as the vertical length of the through hole.

7. A double-sided chip packaging structure according to claim 4, characterized in that, The positioning block is installed on the lower mold by limiting bolts.

8. A double-sided chip packaging structure according to claim 7, characterized in that, The end face of the extrusion block that contacts the chip's pins is an arc-shaped surface.

9. A double-sided chip packaging structure according to claim 1, characterized in that, The upper mold is provided with multiple guide pillars, and the lower mold is provided with multiple guide holes, with the guide pillars and guide holes being adapted to each other.

10. A double-sided chip packaging structure according to claim 8, characterized in that, The extrusion block is snapped onto the upper die, and the arc-shaped surface of the extrusion block that contacts the pin is coated with a wear-resistant layer.

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