LED heat-conducting solid crystal glue composition and preparation method thereof

Abstract

The invention relates to the technical field of adhesives, in particular to an LED heat-conducting solid crystal adhesive composition and a preparation method thereof. The LED heat-conducting solid crystal glue composition is prepared from the following raw materials in parts by weight: 5 to 15 parts of vinyl MQ resin, 2 to 5 parts of double-end vinyl polysiloxane, 0.5 to 5 parts of epoxy silicon resin, 1.5 to 10 parts of hydrogen-containing silicone oil, 0.001 to 0.003 part of an inhibitor, 0.2 to 0.7 part of a bonding accelerant and 58 to 65 parts of modified spherical aluminum oxide. The heat-conducting solid crystal adhesive composition is an addition type organic silicon adhesive, has the advantages of high hardness, high bonding strength, high modulus and the like, has good boiling resistance and can be applied to LED wafer bonding, the service life of an LED product under the high-temperature and high-humidity condition is prolonged, and the preparation method is stable in process, convenient to control and suitable for large-scale production.

Description

Technical Field

[0001] This invention relates to the field of adhesive technology, specifically to an LED thermally conductive die-bonding adhesive composition and its preparation method. Background Technology

[0002] Traditional silicone adhesives mainly include addition-type and condensation-type silicones. Later, acrylic-modified and epoxy-modified silicones were developed, and these adhesives have been widely used in the electronics, automotive, and construction industries. Die-attach adhesives are used in LED packaging to fix LED wafers (chips) to the substrate, primarily for mechanical connection and thermal conduction, while also providing insulation and moisture protection. The operational stability and lifespan of LED products are directly related to the performance of the die-attach adhesive, which must possess good adhesive strength, thermal conductivity, hardness, and environmental stability. Addition-type silicone die-attach adhesives are an important type and have become a crucial material for LED packaging. However, existing traditional addition-type silicones often suffer from low hardness, low adhesive strength during use, decreased adhesive strength after boiling, and insufficient waterproof performance. Therefore, developing LED thermally conductive die-attach adhesives that combine high hardness with good adhesive strength, thermal conductivity, and boiling resistance is of great significance for improving product reliability. Summary of the Invention

[0003] The purpose of this invention is to address the shortcomings of the prior art by providing an LED thermally conductive die-bonding adhesive composition and its preparation method. This composition exhibits high hardness, good adhesive strength, and water resistance, and can be applied to LED wafer bonding to improve the waterproof performance of products, thereby extending the lifespan of LED products under high temperature and humidity conditions. The preparation method of this LED thermally conductive die-bonding adhesive composition is stable, easy to operate, and suitable for large-scale production.

[0004] The objective of this invention is achieved through the following technical solution: an LED thermally conductive die-bonding adhesive composition, comprising the following raw materials in parts by weight: 5-15 parts of vinyl MQ resin, 2-5 parts of double-ended vinyl polysiloxane, 0.5-5 parts of epoxy silicone resin, 1.5-10 parts of hydrogen-containing silicone oil, 0.001-0.003 parts of inhibitor, 0.2-0.7 parts of adhesion promoter, and 58-65 parts of modified spherical alumina.

[0005] Furthermore, the vinyl MQ resin has a vinyl content of 1.5-5.0% and an M / Q ratio of 0.6-1.0.

[0006] Furthermore, the hydrogen-containing silicone oil comprises the following raw materials in parts by weight: 0.5-5 parts of double-ended hydrogen-containing silicone oil and 1-5 parts of side-ended hydrogen-containing silicone oil.

[0007] Furthermore, the hydrogen content of the double-ended hydrogen-containing silicone oil is 0.1-0.3%.

[0008] Furthermore, the hydrogen content of the side-containing hydrogen silicone oil is 0.4-1.0%.

[0009] Furthermore, the inhibitor is one of ethynylcyclohexanol, methylbutynol, vinylcyclosiloxane, and methylvinylcyclosiloxane.

[0010] Furthermore, the preparation method of each part of the adhesion promoter includes the following steps: A1. Add epoxy silicone resin and silane coupling agent to the reactor and mix evenly. Then heat the mixture, add platinum catalyst, and stir evenly. A2. Vacuum and stir in the reactor; then cool to room temperature under normal pressure to obtain the adhesion promoter.

[0011] Furthermore, the preparation method of each part of the adhesion promoter includes the following steps: A1. Take 100 parts of epoxy silicone resin and 45-55 parts of silane coupling agent and add them to the reactor and mix them evenly. Then heat the mixture to 50-55℃, add 0.01-0.1 parts of platinum catalyst, and stir at 400-1000 rpm for 30-60 minutes. A2. Slowly evacuate the reactor to -0.06~0.095MPa; stir at 400-1000rpm for 10-30min; then cool to room temperature under normal pressure to obtain the adhesion promoter.

[0012] This invention provides an adhesive accelerator prepared using the aforementioned raw materials and preparation process. The adhesive accelerator is a composite of epoxy silicone resin and silane coupling agent. When added to a thermally conductive solid-crystal adhesive composition, it can achieve good compatibility with raw materials such as vinyl MQ resin and dual-terminated vinyl polysiloxane, thereby improving the adhesive strength and water resistance of the composition.

[0013] Furthermore, in step A1, the silane coupling agent is at least one of γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-(methacryloyloxy)propyltrimethoxysilane, and γ-mercaptopropyltrimethoxysilane.

[0014] The thermally conductive die-bonding adhesive composition of this invention, as an addition-type silicone adhesive, compared with other single-component addition-type silicone adhesives in the prior art, uses a composite of epoxy silicone resin and silane coupling agent as the adhesion promoter, which has a tackifying effect and imparts higher adhesive strength to the thermally conductive die-bonding adhesive composition, effectively improving water resistance. The crosslinking between the vinyl MQ resin polymer and the double-ended hydrogen-containing silicone oil, the side-containing hydrogen-containing silicone oil, and the modified spherical alumina forms a three-dimensional polymer with a high crosslinking density, simultaneously forming a firmly bonded film on the substrate surface, effectively preventing water penetration. The grafting of epoxy groups into the polymer greatly improves the polymer's adhesion to the substrate, allowing for better bonding of the LED wafer to the substrate during adhesive applications. During polymerization, the modified spherical alumina powder undergoes graft polymerization with the polymer, significantly increasing the polymer modulus. The modified powder and resin form a three-dimensional crosslink, increasing the thermal conductivity channels. The thermally conductive die bond composition of the present invention contains a certain amount of crosslinking agent. When used for surface application, it crosslinks with the surface of the wafer and substrate, thereby improving the bonding strength, waterproof performance, and heat resistance.

[0015] Furthermore, the preparation method of the modified spherical alumina includes the following steps: adding a silane coupling agent dropwise to a solvent and stirring continuously, then adding a pH adjuster to adjust the pH to 4.0-5.5 and stirring; then adding alumina, heating and stirring; collecting the solid, washing it with anhydrous ethanol, and drying it to obtain the modified spherical alumina.

[0016] Furthermore, the preparation method of the modified spherical alumina includes the following steps: take 40-50 parts of solvent, add 1-3 parts of silane coupling agent dropwise and stir continuously, then add acetic acid to adjust the pH to 4.0-5.5, and stir at 30-40℃ for 30 min; then add 90-100 parts of alumina, heat to 50-70℃, and stir for 60-120 min; collect the solid by vacuum filtration, wash with anhydrous ethanol 2-3 times, and then dry in an oven at 80-100℃ for 2-3 h to obtain modified spherical alumina.

[0017] Furthermore, in the preparation method of modified spherical alumina, the alumina is composed of large-diameter particles and small-diameter particles in a mass ratio of 2-4:1-3; the particle size D50 of the large-diameter particles is 2-5 μm, and the particle size D50 of the small-diameter particles is 0.1-1 μm.

[0018] This invention combines spherical alumina of different particle sizes and modifies it with a silane coupling agent, which helps to improve the thermal conductivity of the thermally conductive solid-crystal adhesive composition and reduce its viscosity. It also has good compatibility with resin matrices composed of vinyl MQ resin, dual-terminated vinyl polysiloxane, epoxy silicone resin, and other raw materials, reducing interface defects and improving ease of use.

[0019] The present invention also provides a method for preparing the above-mentioned LED thermally conductive die-bonding adhesive composition, comprising the following steps: (1) Mix vinyl MQ resin, double-ended vinyl polysiloxane and epoxy silicone resin, heat and stir evenly to obtain mixture one; (2) Add modified spherical alumina to mixture one and stir until homogeneous to obtain mixture two; (3) Cool the mixture and add hydrogen-containing silicone oil, inhibitor, platinum catalyst and adhesion promoter. Stir under vacuum and mix evenly.

[0020] Further, in step (1), vinyl MQ resin, dual-terminated vinyl polysiloxane and epoxy silicone resin are mixed, heated to 65-75℃ and stirred for 30-60 minutes at a stirring speed of 400-1000 rpm to obtain mixture one.

[0021] The beneficial effects of this invention are as follows: This invention prepares a thermally conductive die-bonding adhesive composition by compounding raw materials such as vinyl MQ resin, double-ended vinyl polysiloxane, epoxy silicone resin, double-ended hydrogen-containing silicone oil, side-containing hydrogen-containing silicone oil, inhibitor, adhesion promoter, and modified spherical alumina. The thermally conductive die-bonding adhesive composition is an addition-type silicone adhesive. The various raw materials work synergistically to give the thermally conductive die-bonding adhesive composition advantages such as high hardness, high adhesive strength, and high modulus, as well as good water resistance. It can be applied to LED wafer bonding, improving the waterproof performance of the product and extending the service life of LED products under high temperature and high humidity conditions. The preparation method of the LED thermally conductive die-bonding adhesive composition is stable, easy to control, and suitable for large-scale production. Detailed Implementation

[0022] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments. The content mentioned in the embodiments is not intended to limit the present invention.

[0023] In some embodiments of the present invention, an LED thermally conductive die bond composition comprises the following raw materials in parts by weight: 5-15 parts of vinyl MQ resin, 2-5 parts of double-terminated vinyl polysiloxane, 0.5-5 parts of epoxy silicone resin, 1.5-10 parts of hydrogen-containing silicone oil, 0.001-0.003 parts of inhibitor, 0.2-0.7 parts of adhesion promoter, and 58-65 parts of modified spherical alumina.

[0024] In some embodiments of the present invention, the hydrogen-containing silicone oil comprises the following raw materials in parts by weight: 0.5-5 parts of double-ended hydrogen-containing silicone oil and 1-5 parts of side-ended hydrogen-containing silicone oil.

[0025] In some embodiments of the present invention, the hydrogen content of the double-ended hydrogen-containing silicone oil is 0.1-0.3%.

[0026] In some embodiments of the present invention, the hydrogen content of the side-hydrogenated silicone oil is 0.4-1.0%.

[0027] In some embodiments of the present invention, the vinyl MQ resin has a vinyl content of 1.5-5.0% and an M / Q ratio of 0.6-1.0.

[0028] In some embodiments of the present invention, the preparation method of each part of the adhesion promoter includes the following steps: A1. Take 100 parts of epoxy silicone resin and 50 parts of silane coupling agent and add them to the reactor and mix them evenly. Then heat the mixture to 50-55℃, add 0.01-0.1 parts of platinum catalyst, and stir for 30-60 minutes. A2. Slowly evacuate the reactor to -0.06~0.095MPa; stir at 400-1000rpm for 10-30min; then cool to room temperature under normal pressure to obtain the adhesion promoter.

[0029] Further, in step A1, the silane coupling agent is γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-(methacryloyloxy)propyltrimethoxysilane, and γ-mercaptopropyltrimethoxysilane. Preferably, the silane coupling agent is composed of γ-glycidoxypropyltrimethoxysilane and γ-mercaptopropyltrimethoxysilane in a mass ratio of 6-9:1-3.

[0030] In some embodiments of the present invention, the inhibitor is one of ethynylcyclohexanol, methylbutynol, vinylcyclosiloxane, and methylvinylcyclosiloxane.

[0031] In some embodiments of the present invention, the preparation method of the modified spherical alumina includes the following steps: taking 40-50 parts of solvent, adding 1-3 parts of γ-glycidyl etheroxypropyltrimethoxysilane dropwise while continuously stirring, then adding acetic acid to adjust the pH to 4.0-5.5, and stirring at 30-40℃ for 30 min; then adding 90-100 parts of alumina, heating to 50-70℃, and stirring for 60-120 min; collecting the solid by vacuum filtration, washing 2-3 times with anhydrous ethanol, and then drying in an oven at 80-100℃ for 2-3 h to obtain modified spherical alumina. The solvent is at least one of anhydrous ethanol and isopropanol.

[0032] In some embodiments of the present invention, in the preparation method of modified spherical alumina, the alumina is composed of large-diameter particles and small-diameter particles in a mass ratio of 2-4:1-3; the particle size D50 of the large-diameter particles is 2-5 μm, and the particle size D50 of the small-diameter particles is 0.1-1 μm.

[0033] In some embodiments of the present invention, a method for preparing the above-mentioned LED thermally conductive die-bonding adhesive composition includes the following steps: (1) Mix vinyl MQ resin, double-ended vinyl polysiloxane and epoxy silicone resin, heat to 65-75℃, and stir at 400-1000 rpm for 30-60 min to obtain mixture one; (2) Add modified spherical alumina to mixture one and stir at 400-1000 rpm for 30-60 min to obtain mixture two; (3) Cool the mixture to 30-40℃, add double-ended hydrogen-containing silicone oil, side-ended hydrogen-containing silicone oil, inhibitor, platinum catalyst and adhesion promoter, and stir for 10-40 min under vacuum conditions of -0.06~0.095MPa to obtain LED thermally conductive die bond composition.

[0034] Example 1 In this embodiment, an LED thermally conductive die bond composition includes the following raw materials in parts by weight: 10 parts of vinyl MQ resin, 4 parts of double-ended vinyl polysiloxane, 3 parts of epoxy silicone resin, 5 parts of hydrogen-containing silicone oil, 0.002 parts of inhibitor, 0.6 parts of adhesion promoter, and 62 parts of modified spherical alumina.

[0035] In this embodiment, the vinyl MQ resin is Guangzhou Xinhou Chemical AM-8032 vinyl MQ silicone resin. The double-terminated vinyl polysiloxane is Runhe Material double-terminated vinyl RHVi303. The epoxy silicone resin is Hubei Longsheng Sihai SH-9614 epoxy-modified organosilicon resin.

[0036] Furthermore, the hydrogen-containing silicone oil comprises the following raw materials in parts by weight: 3 parts of double-ended hydrogen-containing silicone oil and 2 parts of side-ended hydrogen-containing silicone oil.

[0037] The dual-end hydrogen-containing silicone oil is Runhe Material RH-H45 end hydrogen-containing silicone oil; the side hydrogen-containing silicone oil is RH-H502 side hydrogen-containing silicone oil.

[0038] Furthermore, the preparation method of each part of the adhesion promoter includes the following steps: A1. Take 100 parts of epoxy silicone resin and 50 parts of silane coupling agent and add them to the reactor and mix them evenly. Then heat the mixture to 50°C, add 0.03 parts of platinum catalyst, and stir for 40 minutes. The platinum catalyst is a caster catalyst with a platinum content of 2000 ppm.

[0039] A2. Slowly evacuate the reactor to -0.085 MPa; stir at 1000 rpm for 20 min; then cool to room temperature under normal pressure to obtain the adhesion promoter.

[0040] Furthermore, in step A1, the silane coupling agent is composed of γ-glycidoxypropyltrimethoxysilane and γ-mercaptopropyltrimethoxysilane in a mass ratio of 4:1.

[0041] Furthermore, the inhibitor is ethynylcyclohexanol.

[0042] Furthermore, the preparation method of the modified spherical alumina includes the following steps: take 45 parts of anhydrous ethanol, add 2 parts of γ-glycidoxypropyltrimethoxysilane dropwise and stir continuously, then add acetic acid to adjust the pH to 5, and stir at 35°C for 30 min; then add 95 parts of alumina, heat to 60°C, and stir for 90 min; collect the solid by vacuum filtration, wash twice with anhydrous ethanol, and then dry in an oven at 90°C for 2.5 h to obtain modified spherical alumina.

[0043] Furthermore, in the preparation method of modified spherical alumina, the alumina is composed of large-diameter particles and small-diameter particles in a mass ratio of 3:2; the particle size D50 of the large-diameter particles is 2-5 μm, and the particle size D50 of the small-diameter particles is 0.1-1 μm.

[0044] Furthermore, a method for preparing the above-mentioned LED thermally conductive die-bonding adhesive composition includes the following steps: (1) Mix vinyl MQ resin, double-ended vinyl polysiloxane and epoxy silicone resin, heat to 70°C, and stir at 600 rpm for 30 min to obtain mixture one; (2) Add modified spherical alumina to mixture one and stir at 600 rpm for 30 min to obtain mixture two; (3) Cool the mixture to 35°C, add double-ended hydrogen-containing silicone oil, side-ended hydrogen-containing silicone oil, inhibitor, platinum catalyst and adhesion promoter, and stir for 20 min under -0.09MPa vacuum to obtain LED thermally conductive die bond composition.

[0045] Example 2 In this embodiment, an LED thermally conductive die bond composition includes the following raw materials in parts by weight: 7 parts vinyl MQ resin, 3 parts double-ended vinyl polysiloxane, 3 parts epoxy silicone resin, 4 parts hydrogen-containing silicone oil, 0.002 parts inhibitor, 0.5 parts adhesion promoter, and 58 parts modified spherical alumina.

[0046] Furthermore, the hydrogen-containing silicone oil comprises the following raw materials in parts by weight: 2 parts of double-ended hydrogen-containing silicone oil and 2 parts of side-ended hydrogen-containing silicone oil.

[0047] Furthermore, the preparation method of each part of the adhesion promoter includes the following steps: A1. Take 100 parts of epoxy silicone resin and 50 parts of silane coupling agent and add them to the reactor and mix them evenly. Then heat the mixture to 50°C, add 0.03 parts of platinum catalyst, and stir for 40 minutes. A2. Slowly evacuate the reactor to -0.085 MPa; stir at 1000 rpm for 20 min; then cool to room temperature under normal pressure to obtain the adhesion promoter.

[0048] Furthermore, in step A1, the silane coupling agent is composed of γ-glycidoxypropyltrimethoxysilane and γ-mercaptopropyltrimethoxysilane in a mass ratio of 6:1.

[0049] Furthermore, the preparation method of the modified spherical alumina includes the following steps: take 45 parts of isopropanol, add 2 parts of γ-glycidoxypropyltrimethoxysilane dropwise and stir continuously, then add acetic acid to adjust the pH to 5, and stir at 35°C for 30 min; then add 95 parts of alumina, heat to 60°C, and stir for 90 min; collect the solid by vacuum filtration, wash twice with anhydrous ethanol, and then dry in an oven at 90°C for 2.5 h to obtain the modified spherical alumina.

[0050] Furthermore, in the preparation method of modified spherical alumina, the alumina is composed of large-diameter particles and small-diameter particles in a mass ratio of 4:1; the particle size D50 of the large-diameter particles is 2-5 μm, and the particle size D50 of the small-diameter particles is 0.1-1 μm.

[0051] Furthermore, a method for preparing the above-mentioned LED thermally conductive die-bonding adhesive composition includes the following steps: (1) Mix vinyl MQ resin, double-ended vinyl polysiloxane and epoxy silicone resin, heat to 70°C, and stir at 600 rpm for 40 min to obtain mixture one; (2) Add modified spherical alumina to mixture one and stir at 600 rpm for 40 min to obtain mixture two; (3) Cool the mixture to 35°C, add double-ended hydrogen-containing silicone oil, side-ended hydrogen-containing silicone oil, inhibitor, platinum catalyst and adhesion promoter, and stir for 30 min under -0.08MPa vacuum to obtain LED thermally conductive die bond composition.

[0052] The rest of the content of this embodiment is the same as that of Embodiment 1, and will not be repeated here.

[0053] Example 3 In this embodiment, an LED thermally conductive die bond composition includes the following raw materials in parts by weight: 13 parts vinyl MQ resin, 5 parts double-ended vinyl polysiloxane, 5 parts epoxy silicone resin, 6 parts hydrogen-containing silicone oil, 0.003 parts inhibitor, 0.5 parts adhesion promoter, and 62 parts modified spherical alumina.

[0054] Furthermore, the hydrogen-containing silicone oil comprises the following raw materials in parts by weight: 3 parts of double-ended hydrogen-containing silicone oil and 3 parts of side-ended hydrogen-containing silicone oil.

[0055] Furthermore, a method for preparing the above-mentioned LED thermally conductive die-bonding adhesive composition includes the following steps: (1) Mix vinyl MQ resin, double-ended vinyl polysiloxane and epoxy silicone resin, heat to 70°C, and stir at 600 rpm for 30 min to obtain mixture one; (2) Add modified spherical alumina to mixture one and stir at 600 rpm for 30 min to obtain mixture two; (3) Cool the mixture to 40°C, add double-ended hydrogen-containing silicone oil, side-ended hydrogen-containing silicone oil, inhibitor, platinum catalyst and adhesion promoter, and stir for 20 min under -0.09MPa vacuum to obtain LED thermally conductive die bond composition.

[0056] The rest of the content of this embodiment is the same as that of Embodiment 1, and will not be repeated here.

[0057] Comparative Example 1 The difference between this comparative example and Example 1 is that the LED thermally conductive die-bonding adhesive composition comprises the following raw materials in parts by weight: 13 parts vinyl MQ resin, 4 parts double-terminated vinyl polysiloxane, 5 parts hydrogen-containing silicone oil, 0.002 parts inhibitor, 0.6 parts adhesion promoter, and 62 parts modified spherical alumina. That is, the LED thermally conductive die-bonding adhesive composition in this comparative example does not contain epoxy silicone resin, but is replaced by an equal amount of vinyl MQ resin.

[0058] Comparative Example 2 The difference between this comparative example and Example 1 is that the LED thermally conductive die-bonding adhesive composition comprises the following raw materials in parts by weight: 10.6 parts vinyl MQ resin, 4 parts double-terminated vinyl polysiloxane, 3 parts epoxy silicone resin, 5 parts hydrogen-containing silicone oil, 0.002 parts inhibitor, and 62 parts modified spherical alumina. That is, the LED thermally conductive die-bonding adhesive composition in this comparative example does not contain adhesion promoters, which are replaced by an equal amount of vinyl MQ resin.

[0059] Comparative Example 3 The difference between this comparative example and Example 1 is that the LED thermally conductive die-bonding adhesive composition comprises the following raw materials in parts by weight: 10 parts vinyl MQ resin, 4 parts double-terminated vinyl polysiloxane, 3 parts epoxy silicone resin, 5 parts hydrogen-containing silicone oil, 0.002 parts inhibitor, 0.6 parts adhesion promoter, and 62 parts spherical alumina. That is, the LED thermally conductive die-bonding adhesive composition of this comparative example uses an equal amount of unmodified spherical alumina instead of modified spherical alumina.

[0060] The LED thermally conductive die-bonding adhesive compositions prepared in Example 1 and Comparative Examples 1-3 were subjected to performance testing using a dispensing machine. The test results are shown in the table below: Hardness was measured according to GB / T 531.1-2008, and the test type was Shore D. Adhesive strength was determined by a push test. A 1.0 × 1.0 mm aluminum support was bonded to the chip using an LED thermally conductive die-bonding adhesive composition. The bonding was cured at 150℃ for 1 hour, with the cured adhesive layer thickness controlled at 30 ± 5 μm. The pusher speed was 0.5 mm / s, and the pusher diameter was 200 μm. Adhesive strength (MPa) = maximum push force (N) / bonding area of ​​the chip (mm²). 2 The water resistance test involved placing the sample in boiling water for 168 hours, removing it, drying it, and then leaving it at room temperature for 2 hours before measuring the retention rate of its adhesive strength. Thermal conductivity was determined according to ASTM D5470.

[0061] This invention utilizes a compound of epoxy silicone resin, adhesion promoter, modified spherical alumina, vinyl MQ resin, double-terminated vinyl polysiloxane, and hydrogen-containing silicone oil. The synergistic effect of these ingredients results in a thermally conductive die-bonding adhesive composition with high hardness, high bond strength, and high modulus, along with excellent water resistance. It can be applied to bonding LED wafers or other products, improving their waterproof performance and extending their lifespan under high temperature and humidity conditions.

[0062] The specific embodiments described above are further illustrations of the technical solution and beneficial effects of the present invention, and are not intended to limit the implementation methods. For those skilled in the art, any obvious substitutions without departing from the concept of the present invention are within the protection scope of the present invention.

Claims

1. An LED heat-conductive die-bonding adhesive composition, characterized in that: The raw materials include the following components by weight: 5-15 parts of a vinyl MQ resin, 2-5 parts of a double-end vinyl polysiloxane, 0.5-5 parts of an epoxy silicone resin, 1.5-10 parts of a hydrogen-containing silicone oil, 0.001-0.003 parts of an inhibitor, 0.2-0.7 parts of an adhesion promoter, and 58-65 parts of modified spherical alumina.

2. The LED heat-conductive die-bonding adhesive composition of claim 1, wherein: The vinyl MQ resin has a vinyl content of 1.5-5.0% and an M / Q ratio of 0.6-1.

0.

3. The LED heat-conductive die-bonding adhesive composition of claim 1, wherein: The hydrogen-containing silicone oil includes the following components by weight: 0.5-5 parts of a double-end hydrogen-containing silicone oil and 1-5 parts of a side hydrogen-containing silicone oil.

4. The LED heat-conductive die-bonding adhesive composition of claim 3, wherein: The double-end hydrogen-containing silicone oil has a hydrogen content of 0.1-0.3%.

5. The LED heat-conductive die-bonding adhesive composition of claim 3, wherein: The side hydrogen-containing silicone oil has a hydrogen content of 0.4-1.0%.

6. The LED heat-conductive die-bonding adhesive composition of claim 1, wherein: The inhibitor is one of ethynylcyclohexanol, methylbutynol, vinylcyclosiloxane, and methylvinylcyclosiloxane.

7. The LED heat-conductive die-bonding adhesive composition of claim 1, wherein: The preparation method of the adhesion promoter includes the following steps: A1, the epoxy silicone resin and the silane coupling agent are added into a reactor and mixed uniformly, then heated, a platinum catalyst is added, and stirred uniformly; A2, vacuum is drawn in the reactor and stirred, then cooled to room temperature under normal pressure to obtain the adhesion promoter.

8. The LED heat-conductive die-bonding adhesive composition of claim 1, wherein: In step A1, the silane coupling agent is at least one of γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-(methacryloyloxy)propyltrimethoxysilane, and γ-mercaptopropyltrimethoxysilane.

9. The method of making an LED heat-conductive die-bonding adhesive composition according to any one of claims 1-8, wherein: The method includes the following steps: (1) the vinyl MQ resin, the double-end vinyl polysiloxane, and the epoxy silicone resin are mixed, heated, and stirred uniformly to obtain a mixture one; (2) the modified spherical alumina is added into the mixture one and stirred uniformly to obtain a mixture two; (3) the mixture two is cooled, the hydrogen-containing silicone oil, the inhibitor, the platinum catalyst, and the adhesion promoter are added, and stirred under vacuum to mix uniformly.

10. The method for preparing the LED thermally conductive die-bonding adhesive composition according to claim 9, characterized in that: In step (1), the vinyl MQ resin, the double-end vinyl polysiloxane, and the epoxy silicone resin are mixed, heated to 65-75°C, and stirred, the stirring time is 30-60 min, and the stirring speed is 400-1000 rpm to obtain the mixture one.

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