Liquid feeding local gold plating mechanism

Abstract

A liquid feeding local gold plating mechanism relates to the technical field of gold plating structures and comprises a fixed seat, a coaming is fixedly connected to the upper surface of the fixed seat, a plurality of liquid spraying plates are distributed on the fixed seat in the coaming in a matrix mode, liquid spraying holes are evenly distributed in the liquid spraying plates, and a flow limiting shielding plate is attached to the lower portion of each liquid spraying plate. The flow limiting shielding plates are jointly supported on the flow dividing shielding plate, the flow dividing shielding plate is supported on the flow channel flow dividing plate, the flow channel flow dividing plate is provided with main flow dividing flow channels corresponding to the flow limiting shielding plates, and the flow dividing shielding plate and the flow limiting shielding plates are provided with liquid distribution structures enabling the main flow dividing flow channels to be communicated with the liquid spraying holes. The device solves the problems that in the conveying process of gold liquid in the prior art, the gold liquid cannot be in uniform contact with the gold-plated surface of a product, and then the gold-plated uniformity of the surface of the product is affected; and in the local gold plating process of an existing product, local gold plating can only be carried out on a single product each time, so that the gold plating efficiency is reduced.

Description

Technical Field

[0001] This invention relates to the field of gold plating structure technology, and more specifically to a liquid-based local gold plating mechanism. Background Technology

[0002] A heat spreader is a device used to dissipate heat from easily heated electronic components in electrical appliances. They are mostly made of aluminum alloy, brass, or bronze and can be in the form of plates, sheets, or multiple sheets. For example, the CPU central processing unit in a computer requires a fairly large heat spreader, and the power transistors, horizontal output transistors, and power amplifier transistors in a television all use heat spreaders.

[0003] However, heat sinks are usually coated with a layer of nickel metal to prevent oxidation. Since gold is expensive, it is not possible to plate the entire heat sink with gold. Therefore, gold can only be plated in the contact area of ​​the heat sink, which is a local electroplating technique.

[0004] A prior art patent, CN1296522C, discloses a solution comprising a DC power supply and an anode and cathode electrically connected thereto. The cathode is electrically connected to the workpiece. A cavity capable of being filled with plating solution is provided between the surface of the workpiece to be plated and the anode. The dedicated machine includes a worktable, a support placed on the worktable, and a movable plating solution supply device. A mask is provided on the worktable to cover areas not to be plated. A pneumatic lifting device is provided on the support to fix the workpiece and provide an indirect cathode. This invention implements partial electroplating, eliminating the need to seal the workpiece. A glue-cast mask is used to cover the surface of the unplated areas of the workpiece, saving significant manpower and resources. It features pollution-free operation, high efficiency, low cost, and simple operation, making it suitable for modern mechanized mass production.

[0005] With use, existing devices, including those mentioned above, have gradually revealed shortcomings in this technology, mainly in the following aspects:

[0006] First, during the existing gold liquid transportation process, the gold liquid cannot achieve uniform contact with the gold-plated surface of the product, thus affecting the uniformity of gold plating on the product surface.

[0007] Secondly, existing products can only perform partial gold plating on a single product at a time during the localized gold plating process, which reduces the efficiency of the gold plating process.

[0008] As can be seen from the above, the existing technology obviously has inconveniences and defects in practical use, so it is necessary to improve it. Summary of the Invention

[0009] To address the shortcomings of existing technologies, this invention provides a liquid-on-plating local gold plating mechanism to solve the problems in traditional technologies where the liquid gold cannot achieve uniform contact with the gold plating surface of the product during the transportation process, thus affecting the uniformity of gold plating on the product surface; and where existing products can only perform local gold plating on a single product at a time, thus reducing the gold plating efficiency.

[0010] To achieve the above objectives, the present invention provides the following technical solution.

[0011] A liquid-applied partial gold plating mechanism includes a fixed base, a surrounding plate fixed to the upper surface of the fixed base, and several spray plates arranged in a matrix inside the surrounding plate. Spray holes are evenly distributed on the spray plates. A flow-limiting shield plate is attached to the lower part of each spray plate. Several flow-limiting shield plates are supported together on a flow-dividing shield plate, which is supported on a flow channel divider plate. A main flow channel is provided on the flow channel divider plate corresponding to each flow-limiting shield plate. A liquid distribution structure connecting the main flow channel and the spray holes is provided on the flow-dividing shield plate and the flow-limiting shield plate.

[0012] As an optimized solution, a main liquid inlet channel is vertically opened at the center of the flow channel divider plate, and the inlet ends of several main diversion channels are connected to the main liquid inlet channel.

[0013] As an optimized solution, the diversion shielding plate is provided with a slot for each of the flow limiting shielding plates, and the liquid distribution structure includes a number of auxiliary diversion channels opened at the bottom of the slot.

[0014] As an optimized solution, an auxiliary liquid inlet channel is vertically opened at the center of the card slot and is connected to the main diversion channel. The inlet ends of several auxiliary diversion channels are connected to the auxiliary liquid inlet channel.

[0015] As an optimized solution, the liquid distribution structure includes liquid distribution holes arranged in parallel on the flow-limiting shield plate along the extension direction of a plurality of auxiliary diversion channels.

[0016] As an optimized solution, the auxiliary diversion channels are arranged in a star-shaped pattern.

[0017] As an optimized solution, a conductive anode connecting block is fixed between the sidewalls of adjacent spray plates.

[0018] As an optimized solution, a conductive anode is connected to the conductive anode connecting block.

[0019] As an optimized solution, the bottom of the fixed base is vertically fixed with an upper liquid pipe, and the upper port of the upper liquid pipe is connected to the main liquid inlet channel.

[0020] As an optimized solution, the fixing seat has a vertically formed return liquid channel on its bottom surface between the inner wall of the enclosure and the outer wall of the flow channel divider plate.

[0021] As an optimized solution, the upper end of the diversion shield is connected to a spray chamber positioning plate, and a spray chamber is provided on the spray chamber positioning plate corresponding to each of the flow-limiting shields.

[0022] As an optimized solution, a top support groove is provided on the top edge of the spray chamber, and the spray plate is fitted into the top support groove.

[0023] As an optimized solution, a bottom support groove is provided at the top edge of the card slot, and the current limiting shielding plate is installed in the bottom support groove.

[0024] Compared with the prior art, the beneficial effects of the present invention are:

[0025] When the localized gold plating uniform spraying mechanism is working, the gold liquid is transported to the flow channel distribution plate through the liquid supply pipeline. The flow channel distribution plate is equipped with a main distribution channel corresponding to the position of each product. The gold liquid is transported to the auxiliary liquid inlet channel on the distribution shielding plate through each main distribution channel. The liquid is then evenly distributed to the corresponding spraying chamber through the auxiliary distribution channel. After the spraying chamber is full, the gold liquid is sprayed onto the product surface through the flow limiting shielding plate and the spraying liquid to complete the localized uniform gold plating.

[0026] By using a matrix of evenly distributed spray plates, it is possible to simultaneously perform localized gold plating on several products, thereby improving the gold plating efficiency.

[0027] Furthermore, by setting up a main liquid inlet channel, a main branch channel, an auxiliary liquid inlet channel, an auxiliary branch channel, and spray holes, the gold liquid can be evenly sprayed onto the product surface, thereby improving the uniformity of gold plating on the product surface. Attached Figure Description

[0028] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0029] Figure 1 and Figure 2 This is a schematic diagram of the exploded structure of the present invention;

[0030] Figure 3 This is a schematic diagram of the assembly structure of the present invention;

[0031] Figure 4 This is a top view of the structure of the present invention;

[0032] Figure 5 for Figure 4 Schematic diagram of the cross-sectional structure of the AA image.

[0033] In the diagram: 1-Fixed base; 2-Flow channel divider plate; 3-Flow divider shield plate; 4-Spray chamber positioning plate; 5-Spray chamber; 6-Spray plate; 7-Spray hole; 8-Flow limiting shield plate; 9-Auxiliary inlet channel; 10-Auxiliary diversion channel; 11-Distribution hole; 12-Main diversion channel; 13-Enclosure plate; 14-Liquid supply pipeline; 15-Conductive anode connection block; 16-Main inlet channel; 17-Conductive anode; 18-Return channel. Detailed Implementation

[0034] The embodiments of the technical solution of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the technical solution of the present invention and are therefore intended to limit the scope of protection of the present invention.

[0035] like Figures 1 to 5 As shown, the liquid-plating local gold plating mechanism includes a fixed base 1, with a surrounding plate 13 fixed to the upper surface of the fixed base 1. Several spray plates 6 are arranged in a matrix inside the surrounding plate 13. Spray holes 7 are evenly distributed on the spray plates 6. A flow-limiting shield plate 8 is attached to the bottom of each spray plate 6. Several flow-limiting shield plates 8 are supported on a flow-diverting shield plate 3. The flow-diverting shield plate 3 is supported on a flow channel diversion plate 2. A main flow channel 12 is opened on the flow channel diversion plate 2 corresponding to each flow-limiting shield plate 8. A liquid distribution structure is opened on the flow-diverting shield plate 3 and the flow-limiting shield plate 8 to connect the main flow channel 12 with the spray holes 7.

[0036] A main inlet flow channel 16 is vertically opened at the center of the flow channel divider plate 2, and the inlet ends of several main branch flow channels 12 are connected to the main inlet flow channel 16.

[0037] The diversion shielding plate 3 has a slot corresponding to each flow limiting shielding plate 8, and the liquid distribution structure includes several auxiliary diversion channels 10 opened at the bottom of the slot.

[0038] A secondary liquid inlet channel 9, which is connected to the main diversion channel 12, is vertically opened at the center of the slot. The inlet ends of several secondary diversion channels 10 are connected to the secondary liquid inlet channel 9.

[0039] The liquid distribution structure includes liquid distribution holes 11 arranged in parallel on the flow-limiting shield plate 8 along the extension direction of several auxiliary diversion channels 10.

[0040] Several auxiliary diversion channels 10 are arranged in a cross shape.

[0041] A conductive anode connecting block 15 is fixed between the side walls of adjacent spray plates 6.

[0042] A conductive anode 17 is connected to the conductive anode connecting block 15.

[0043] The bottom of the fixed base 1 is vertically fixed with an upper liquid pipe 14, and the upper port of the upper liquid pipe 14 is connected to the main liquid inlet channel 16.

[0044] The fixed seat 1 is located on the bottom surface between the inner wall of the enclosure 13 and the outer wall of the flow channel divider 2, and a return liquid channel 18 is vertically provided.

[0045] The upper end of the diversion shield plate 3 is connected to the spray chamber positioning plate 4, and the spray chamber positioning plate 4 has a spray chamber 5 corresponding to each flow limiting shield plate 8.

[0046] The fixed base 1, the flow channel divider plate 2, the flow divider shield plate 3, and the spray tank positioning plate 4 are fastened together with bolts.

[0047] The top edge of the spray chamber 5 is provided with a top support groove, and the spray plate 6 is fitted into the top support groove.

[0048] A bottom support groove is provided at the top edge of the card slot, and the current limiting shield 8 is installed in the bottom support groove.

[0049] The working principle of this device is as follows:

[0050] When the local gold plating uniform spraying mechanism is working, the gold liquid is transported to the flow channel divider plate 2 through the liquid supply line 14. The flow channel divider plate 2 is provided with a main flow channel 12 corresponding to the position of each product. The gold liquid is transported to the auxiliary liquid inlet channel 9 on the flow shielding plate 3 through each main flow channel 12. The liquid is then evenly distributed to the corresponding spraying tank 5 through the auxiliary flow channel 10. After the spraying tank 5 is full, the gold liquid is sprayed onto the product surface through the flow limiting shielding plate 8 and the spraying liquid to complete the local uniform gold plating.

[0051] By using a matrix of evenly distributed spray plates 6, it is possible to simultaneously perform localized gold plating on several products, thereby improving the gold plating efficiency.

[0052] Furthermore, by setting up the main liquid inlet channel 16, the main branch channel 12, the auxiliary liquid inlet channel 9, the auxiliary branch channel 10, and the spray hole 7, the gold liquid can be evenly sprayed onto the product surface, thereby improving the uniformity of gold plating on the product surface.

[0053] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered within the scope of the claims and specification of the present invention.

Claims

1. A mechanism for liquid pick-up and local gold plating, characterized in that: The utility model provides a liquid spraying device, including fixed seat (1), the upper surface of fixed seat (1) is fixedly connected with the coaming (13), a plurality of liquid spraying plates (6) are distributed in the coaming (13) inside in the fixed seat (1) in matrix, the liquid spraying plate (6) is uniformly distributed with liquid spraying hole (7), the lower side of every liquid spraying plate (6) is attached with the flow limiting shield plate (8), a plurality of flow limiting shield plates (8) are supported on the flow distribution shield plate (3) in common, the flow distribution shield plate (3) is supported on the flow channel distribution plate (2), the flow channel distribution plate (2) is set up with main flow distribution flow channel (12) on every flow limiting shield plate (8) correspondence, the flow distribution shield plate (3) and flow limiting shield plate (8) are set up with the cloth liquid structure that the main flow distribution flow channel (12) is linked together with liquid spraying hole (7).

2. The liquid-up local gold plating mechanism according to claim 1, wherein: The center of the flow channel distribution plate (2) is vertically provided with a main liquid inlet flow channel (16), and the inlet ends of a plurality of the main flow distribution flow channels (12) are commonly communicated with the main liquid inlet flow channel (16).

3. The liquid-up local gold plating mechanism according to claim 2, wherein: The flow distribution shield plate (3) is respectively provided with a clamping groove corresponding to each of the flow limiting shield plates (8), and the cloth liquid structure comprises a plurality of auxiliary flow distribution flow channels (10) provided at the bottom of the clamping groove.

4. The liquid-up local gold plating mechanism according to claim 3, wherein: The center of the clamping groove is vertically provided with an auxiliary liquid inlet flow channel (9) communicated with the main flow distribution flow channel (12), and the inlet ends of a plurality of the auxiliary flow distribution flow channels (10) are commonly communicated with the auxiliary liquid inlet flow channel (9).

5. The liquid-up local gold plating mechanism according to claim 4, wherein: A plurality of the auxiliary flow distribution flow channels (10) are arranged in a cross shape, and the cloth liquid structure comprises cloth liquid holes (11) provided in parallel along the extension direction of a plurality of the auxiliary flow distribution flow channels (10) on the flow limiting shield plate (8).

6. The liquid-up local gold plating mechanism according to claim 1, wherein: The side walls of adjacent liquid spraying plates (6) are fixedly connected with conductive anode connecting blocks (15), and the conductive anode connecting blocks (15) are connected with conductive anodes (17).

7. The liquid-up local gold plating mechanism according to claim 2, wherein: The bottom of the fixed seat (1) is vertically fixedly connected with a liquid inlet pipeline (14), and the upper end of the liquid inlet pipeline (14) is communicated with the main liquid inlet flow channel (16).

8. The liquid-up local gold plating mechanism according to claim 1, wherein: The upper end of the flow distribution shield plate (3) is connected with a liquid spraying bin positioning plate (4), and the liquid spraying bin positioning plate (4) is provided with a liquid spraying bin (5) corresponding to each of the flow limiting shield plates (8).

9. The liquid-up local gold plating mechanism according to claim 8, wherein: The top edge of the liquid spraying bin (5) is provided with a top supporting groove, and the liquid spraying plate (6) is clamped in the top supporting groove.

10. The liquid-up local gold plating mechanism according to claim 3, wherein: The top edge of the clamping groove is provided with a bottom supporting groove, and the flow limiting shield plate (8) is clamped in the bottom supporting groove.

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