Cooling pin wheel housing device of RV speed reducer
By integrating a multi-mode cooling system that combines semiconductor refrigeration, liquid convection, and direct liquid exchange cooling, the problem of insufficient cooling capacity of RV reducers under varying operating conditions is solved, achieving a balance between thermal stability and energy efficiency of the pin gear housing.
Patent Information
- Application Number
- CN202511753697.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-26
- Publication Date
- 2026-01-16
AI Technical Summary
The existing cooling solutions for RV reducers cannot adapt to varying operating conditions and intermittent overloads, resulting in energy waste at low loads and insufficient cooling capacity at high loads or instantaneous overheating. They cannot achieve precise energy-saving cooling when the temperature rise is slight, or powerful and efficient heat dissipation when the temperature rise is aggravated.
A cooling device for the pin gear housing of an RV reducer is designed, which integrates three cooling mechanisms: semiconductor refrigeration, liquid convection, and direct cooling with liquid exchange. Through the coordinated work of the first and second cooling systems, precise energy-saving cooling and powerful and efficient heat dissipation are achieved at different temperature rise stages, and a three-dimensional heat dissipation network closely attached to the heat source is constructed.
It achieves adaptive control of heat load under different operating conditions, avoids the performance limitations and energy waste of a single cooling mode, and ensures the thermal stability of the needle-tooth shell under heavy load and high speed conditions.
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Figure CN121345983A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of RV reducer, and particularly relates to an RV reducer needle gear shell cooling device, in particular to an RV reducer cooling device with multi-stage cooling and temperature control. BACKGROUND
[0002] As the core transmission component of high-end equipment such as industrial robots and precision machine tools, the performance and reliability of the RV reducer directly determine the precision and service life of the whole machine. The needle gear shell, as a key bearing component of the RV reducer, will generate a large amount of heat due to internal friction and deformation under high-speed and heavy-load working conditions. Continuous temperature rise not only causes thermal deformation of the needle gear shell itself, affecting the transmission precision, but also accelerates the failure of internal lubricating grease and the wear of key parts such as bearings, thereby shortening the service life of the whole reducer.
[0003] Firstly, the passivity and limitation of single cooling mode are prominent. Whether air cooling, natural cooling, or simple liquid cooling circulation, fixed cooling intensity is adopted. For complex working conditions such as variable working conditions and intermittent overload, the fixed intensity cooling scheme cannot match the dynamic changing heat load: at low load, excessive cooling causes energy waste; while at high load or instantaneous overheating, the cooling capacity is insufficient to effectively suppress temperature rise, resulting in thermal deformation, lubrication failure and other problems.
[0004] Secondly, there is a lack of adaptive and step-by-step cooling strategy for different temperature rise stages. The existing technology fails to organically integrate and cooperatively control different cooling methods (such as high-efficiency low-temperature of semiconductor refrigeration, uniform heat dissipation of fluid convection, and large heat carrying of liquid direct cooling). Therefore, it is impossible to realize the intelligent process of "precise energy-saving cooling when temperature rise is slight, and powerful and efficient heat dissipation when temperature rise is severe", so it is difficult to balance between energy efficiency and heat dissipation efficiency.
[0005] Therefore, it is of great significance to the technical progress in the field to design a step-by-step cooling RV reducer needle gear shell device. SUMMARY
[0006] The application aims to provide an RV reducer cooling needle gear shell device to solve the problem that fixed intensity cooling scheme cannot match dynamic changing heat load under complex working conditions such as variable working conditions and intermittent overload, and to realize the effect of precise energy-saving cooling when temperature rise is slight and powerful and efficient heat dissipation when temperature rise is severe.
[0007] According to the above idea, the technical scheme adopted by the application is: According to the embodiment of the present application, a RV reducer pin gear shell cooling device is provided, which comprises a first cooling system, a second cooling system, a liquid replacement system, a support and a heat dissipation shell; the heat dissipation shell is provided with the first cooling system on the left and right sides, and is provided with the second cooling system on the upper and lower sides, the second cooling system is connected with the liquid replacement system, and the support is connected with the two sides of the second cooling system and is fixedly connected with the liquid replacement system.
[0008] In some embodiments, the heat dissipation shell comprises a flow channel, a groove and a limiting block; The flow channel is in a ring structure, the groove is arranged on the surface of the flow channel close to the central axis, a plurality of grooves are arranged symmetrically around the central axis of the ring-shaped flow channel, the limiting block is fixedly arranged on the inner surface of the heat dissipation shell, and a bolt hole for fixing the pin gear shell is arranged on the limiting block.
[0009] Further, the inner diameter of the heat dissipation shell is consistent with the outer diameter of the pin gear shell.
[0010] Further, the pin gear shell is installed at the center position of the heat dissipation shell and is limited in movement by the limiting block.
[0011] Further, the pin gear shell transmits heat to the liquid in the flow channel of the heat dissipation shell through the large-area heat conduction of the groove.
[0012] In some embodiments, the first cooling system is two semiconductor refrigeration pieces, and the semiconductor refrigeration pieces are arranged on the outer side of the heat dissipation shell.
[0013] In some embodiments, the second cooling system comprises two symmetrically arranged arc-shaped heat dissipation pipes, the arc-shaped heat dissipation pipes are provided with internal passages penetrating through the liquid replacement system, the two ends of the arc-shaped heat dissipation pipes are fixed on the surface of the heat dissipation shell, and the internal passages of the arc-shaped heat dissipation pipes are in communication with the flow channel in the heat dissipation shell.
[0014] Further, the cooling liquid in the arc-shaped heat dissipation pipe transmits heat of the heat dissipation shell to the environment through heat convection.
[0015] Further, the material of the arc-shaped heat dissipation pipe of the second cooling system is a heat-conducting material.
[0016] Preferably, the heat-conducting material comprises any one of copper, copper alloy, aluminum and aluminum alloy.
[0017] In some embodiments, the liquid replacement system comprises an inlet pipe, an outlet pipe, a liquid pump and a temperature sensor.
[0018] Further, the inlet pipe and the outlet pipe are arranged on the arc-shaped heat dissipation pipe of the second cooling system; and the inlet pipe and the outlet pipe are centrally symmetrically distributed. Furthermore, both the inlet and outlet pipes are equipped with a liquid pump and a temperature sensor, with the temperature sensor located on the side of the liquid pump near the heat dissipation housing.
[0019] Furthermore, when the temperature sensor detects that the temperature exceeds the threshold, a liquid pump is activated via a signal switch to directly replace the liquid and cool the heat sink casing.
[0020] Furthermore, the bracket is fixedly connected to the liquid inlet pipe and the arc-shaped heat dissipation pipe; similarly, the bracket is fixedly connected to the liquid outlet pipe and the arc-shaped heat dissipation pipe.
[0021] The beneficial effects of this invention are as follows: 1. This invention utilizes the coordinated operation of a first cooling system and a second cooling system. In the low-temperature range, semiconductor refrigeration is activated for precise and efficient cooling; as the temperature rises, liquid thermal convection circulation is used to enhance heat dissipation; and in cases of overheating at high temperatures, a liquid exchange system is activated for forced cooling. This adaptive control strategy based on temperature rise avoids the performance limitations of a single cooling mode and prevents energy waste caused by continuous high-intensity cooling.
[0022] 2. This invention integrates three mechanisms: semiconductor cooling, liquid convection, and direct cooling with liquid exchange. By constructing a three-dimensional heat dissipation network that is close to the heat source through a heat dissipation shell surrounding the pin tooth shell and symmetrically distributed arc-shaped heat dissipation pipes, it increases the effective heat dissipation area and heat exchange efficiency, ensuring the thermal stability of the pin tooth shell under harsh conditions such as heavy load and high speed. Attached Figure Description
[0023] Figure 1 This is a structural diagram of the overall device of the present invention.
[0024] Figure 2 This is a cross-sectional view of the heat dissipation casing and cooling system of the present invention.
[0025] Figure 3 This is a structural diagram of the heat dissipation casing of the present invention.
[0026] Figure 4 This is a structural diagram of the needle-tooth shell of the present invention.
[0027] Figure label: First cooling system 1, second cooling system 2, fluid exchange system 3, bracket 4, heat dissipation shell 5, needle-tooth shell 6, semiconductor cooling chip 11, arc-shaped heat dissipation pipe 21, internal channel 22, liquid inlet pipe 31, liquid outlet pipe 32, liquid pump 33, temperature sensor 34, flow channel 51, groove 52, limit block 53 and bolt hole 531. Detailed Implementation
[0028] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the invention as detailed in the appended claims.
[0029] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless otherwise defined, the technical or scientific terms used in this application should be understood in their ordinary sense by one of ordinary skill in the art to which this invention pertains. The words “a” or “one” and similar terms used in this application specification and claims do not indicate a limitation of quantity, but rather indicate the presence of at least one. “A plurality” means two or more. The words “comprising” or “including” and similar terms mean that the element or object preceding “comprising” or “including” covers the element or object listed following “comprising” or “including” and its equivalents, and does not exclude other elements or objects. The words “connected” or “linked” and similar terms are not limited to physical or mechanical connections and can include electrical connections, whether direct or indirect. The words “above” and / or “below” and similar terms are for ease of description only and are not limited to a location or spatial orientation. The singular forms “a,” “the,” and “the” used in this application specification and appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more associated listed items.
[0030] This application provides a device for cooling the pinion gear housing of an RV reducer. The device includes a first cooling system 1, a second cooling system 2, a fluid exchange system 3, a bracket 4, and a heat dissipation shell 5. The first cooling system 1 is arranged on the left and right sides of the heat dissipation shell 5, and the second cooling system 2 is arranged on the upper and lower sides of the heat dissipation shell 5. The second cooling system 2 and the fluid exchange system 3 are connected. The bracket 4 connects the two sides of the second cooling system 2 and fixes the fluid exchange system 3.
[0031] This invention is achieved through design such as Figure 1The RV reducer cooling pin housing device utilizes the coordinated operation of a first cooling system 1 and a second cooling system 2. In the low-temperature range, semiconductor cooling is activated for precise and efficient cooling; as the temperature rises, liquid convection circulation is initiated to enhance heat dissipation; and in cases of overheating at high temperatures, a liquid exchange system is activated for forced cooling. This invention integrates three mechanisms: semiconductor cooling, liquid convection, and direct liquid exchange cooling. Furthermore, a three-dimensional heat dissipation network is constructed around the heat source via a heat dissipation shell 5 surrounding the pin housing 6 and symmetrically distributed arc-shaped heat dissipation pipes 21. This increases the effective heat dissipation area and heat exchange efficiency, avoids localized overheating, and ensures the thermal stability of the pin housing under harsh conditions such as heavy loads and high speeds.
[0032] The RV reducer cooling pin gear housing device described in this application is used in reducer devices of high-end equipment such as industrial robots and precision machine tools.
[0033] The following is in conjunction with the appendix Figures 1 to 4 This application provides a detailed description of an RV reducer cooling pin gear housing device.
[0034] like Figure 1 As shown, the core design of the RV reducer pin gear housing cooling device provided in this embodiment is to construct a multi-mode, active composite cooling system around the pin gear housing 6. The device mainly consists of a heat dissipation shell 5, a first cooling system 1, a second cooling system 2, a fluid exchange system 3, and a support bracket 4 that provides support and fixation.
[0035] In this embodiment, the heat dissipation housing 5, as a component that directly contacts the heat source (needle-toothed housing 6), has its inner diameter precisely machined to ensure a high-precision fit with the outer diameter of the needle-toothed housing 6, thereby achieving the maximum effective contact area. Figure 3 As shown, the inner surface of the heat dissipation housing 5 is designed with an annular limiting block 53. The limiting block 53 can also be a protrusion or a pin structure. The limiting block 53 is provided with bolt holes 531, which are used to axially position and constrain the pin tooth housing 6 during assembly to prevent it from displacing during operation.
[0036] In this embodiment, as Figure 2 As shown, the heat dissipation shell 5 has an annular flow channel 51 machined around its circumference to carry the circulating coolant. Furthermore, several grooves 52 are formed on the inner wall of the flow channel 51 near the needle-tooth shell 6, and these grooves 52 are symmetrically distributed around the central axis of the heat dissipation shell 5. These grooves 52 increase the contact area between the coolant and the high-heat area of the heat dissipation shell 5, and also disturb the flow field, enhancing the heat exchange efficiency.
[0037] In this embodiment, the first cooling system 1 consists of two thermoelectric coolers 11. They are tightly attached to the left and right outer surfaces of the heat dissipation housing 5 using a highly thermally conductive medium such as thermal grease. The cold end of the thermoelectric cooler 11 faces the heat dissipation housing 5 to absorb heat, and the hot end may also be equipped with an additional corrugated surface for air cooling.
[0038] In this embodiment, the second cooling system 2 includes two arc-shaped heat dissipation pipes 21 symmetrically arranged on the upper and lower sides of the heat dissipation shell 5. The arc-shaped heat dissipation pipes 21 are preferably made of a material with excellent thermal conductivity, and their internal channels 22 are connected to both ends of the annular flow channel 51 of the heat dissipation shell 5 through sealed joints, together forming a complete closed liquid circulation loop.
[0039] Furthermore, the heat-conducting material of the arc-shaped heat dissipation pipe 21 includes materials with high thermal conductivity such as copper, copper alloys, aluminum, and aluminum alloys.
[0040] Furthermore, under medium load operating conditions, the RV reducer cannot effectively dissipate heat in a timely manner relying solely on the heat dissipation rate of the two semiconductor cooling chips 11 in the first cooling system 1. At this time, the heated coolant in the flow channel 51 and the coolant with a lower temperature in the arc-shaped heat dissipation pipe 21 naturally form a temperature gradient, thereby driving the entire circuit to generate thermal convection and continuously dissipating heat to the outside through the arc-shaped heat dissipation pipe 21.
[0041] In this embodiment, the fluid exchange system 3 is integrated with the second cooling system 2, including an inlet pipe 31 and an outlet pipe 32, which are centrally symmetrically connected to the upper and lower arc-shaped heat dissipation pipes 21, respectively. Inside both the inlet pipe 31 and the outlet pipe 32, a liquid pump 33 (such as a miniature magnetic pump) and a temperature sensor 34 (such as a PT100 RTD) are installed. The probe of the temperature sensor 34 is positioned on the side of the liquid pump 33 near the flow channel 51 of the heat dissipation housing 5 to ensure accurate and rapid detection of the coolant temperature flowing out from the needle-tooth housing 6. The bracket 4 securely fixes the arc-shaped heat dissipation pipes 21 to the inlet pipe 31 and the outlet pipe 32 via mechanical connections (such as screws or clips), ensuring the structural rigidity of the entire fluid circuit under vibration conditions.
[0042] Furthermore, when the temperature detected by the temperature sensor 34 exceeds the set threshold temperature, the liquid pump 33 is activated via a signal switch to replace the coolant in the overall heat dissipation housing 5 and quickly remove the accumulated heat.
[0043] Detailed implementation methods and principles: When the RV reducer is under light load or in the start-up phase, the temperature rise of the pin gear housing 6 is relatively slow. At this time, only the first cooling system 1 is activated, and the semiconductor cooling chip 11 works, with its cold end directly providing active cooling to the heat dissipation housing 5, quickly transferring the small amount of heat.
[0044] When the RV reducer is in a stable, uniform speed phase with a low load, the coolant in the flow channel 51 of the heat dissipation shell 5 is heated, forming a temperature gradient difference with the coolant in the arc-shaped heat dissipation pipe 21. The coolant in the flow channel 51 transfers heat to the arc-shaped heat dissipation pipe 21 for heat dissipation through thermal convection.
[0045] When the reducer faces heavy load, overload, or instantaneous high heat load, and the temperature sensor 34 detects that the temperature exceeds the set threshold (e.g., 70℃), the system determines that conventional circulating heat dissipation is insufficient to control the temperature rise. The liquid pump 33 of the fluid exchange system 3 is activated, and the fluid exchange system 3 operates at full capacity: the liquid pumps 33 in the inlet pipe 31 and outlet pipe 32 operate at high speed, continuously pumping low-temperature coolant from the external container into the system through the inlet pipe 31, while simultaneously continuously discharging the high-temperature coolant, which has absorbed a large amount of heat, from the device through the outlet pipe 32. This "direct cooling" method can quickly remove a huge amount of heat, achieving rapid and powerful cooling of the needle-tooth shell 6 until its temperature drops back to a safe range, avoiding localized overheating and ensuring the thermal stability of the needle-tooth shell under harsh conditions such as heavy load and high speed.
[0046] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. The invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the following claims.
[0047] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.
Claims
1. A cooling device for the pin gear housing of an RV reducer, characterized in that, It includes a first cooling system (1), a second cooling system (2), a fluid exchange system (3), a bracket (4), and a heat dissipation shell (5); the first cooling system (1) is provided on the left and right sides of the heat dissipation shell (5), and the second cooling system (2) is provided on the upper and lower sides of the heat dissipation shell (5). The second cooling system (2) and the fluid exchange system (3) are connected. The bracket (4) is connected to both sides of the second cooling system (2) and is fixedly connected to the fluid exchange system (3).
2. The RV reducer pin gear housing cooling device according to claim 1, characterized in that, The heat dissipation housing (5) includes a flow channel (51), a groove (52), and a limiting block (53); The flow channel (51) is an annular structure. The groove (52) is provided on the surface of the flow channel (51) near the central axis. A plurality of grooves (52) are symmetrically arranged around the central axis of the annular flow channel (51). The limiting block (53) is fixedly installed on the inner surface of the heat dissipation shell (5). The limiting block (53) is provided with bolt holes (531) for fixing the needle tooth shell (6).
3. The RV reducer pin gear housing cooling device according to claim 1, characterized in that, The inner diameter of the heat dissipation shell (5) is the same as the outer diameter of the needle-tooth shell (6).
4. The RV reducer pin gear housing cooling device according to claim 1, characterized in that, The first cooling system (1) consists of two semiconductor cooling chips (11), which are attached to the outside of the heat dissipation shell (5).
5. A cooling device for the pin gear housing of an RV reducer according to claim 1, characterized in that, The second cooling system (2) includes two symmetrically arranged arc-shaped heat dissipation pipes (21). The arc-shaped heat dissipation pipes (21) are provided with internal channels (22) that penetrate the fluid exchange system (3). The two ends of the arc-shaped heat dissipation pipes (21) are fixed to the surface of the heat dissipation shell (5). The internal channels (22) of the arc-shaped heat dissipation pipes (21) are also connected to the flow channels (51) in the heat dissipation shell (5).
6. A cooling device for the pin gear housing of an RV reducer according to claim 5, characterized in that, The material of the arc-shaped heat dissipation pipe (21) of the second cooling system (2) is a thermally conductive material.
7. A cooling device for the pin gear housing of an RV reducer according to claim 6, characterized in that, The material of the second cooling system (2) includes any one of copper, copper alloy, aluminum and aluminum alloy.
8. A cooling device for the pin gear housing of an RV reducer according to claim 1, characterized in that, The fluid exchange system (3) includes an inlet pipe (31), an outlet pipe (32), a liquid pump (33), and a temperature sensor (34); The liquid inlet pipe (31) and liquid outlet pipe (32) are both installed on the arc-shaped heat dissipation pipe (21) of the second cooling system (2); the liquid inlet pipe (31) and liquid outlet pipe (32) are centrally symmetrically distributed; Both the inlet pipe (31) and the outlet pipe (32) are equipped with a liquid pump (33) and a temperature sensor (34), and the temperature sensor (34) is located on the side of the liquid pump (33) close to the heat dissipation shell (5).
9. A cooling device for the pin gear housing of an RV reducer according to claim 1, characterized in that, The bracket (4) is fixedly connected to the liquid inlet pipe (31) and the arc-shaped heat dissipation pipe (21); similarly, the bracket (4) is fixedly connected to the liquid outlet pipe (32) and the arc-shaped heat dissipation pipe (21).