Chip surface quality double-sided detection system

Abstract

The invention discloses a chip surface quality double-sided detection system, which relates to the field of chip surface detection and comprises a detection table, a sliding groove is formed in the detection table, a positioning plate is assembled in the sliding groove in a sliding manner, a transverse positioning boss and a longitudinal positioning boss are fixed on the top surface of the positioning plate, and the transverse positioning boss and the longitudinal positioning boss are in right-angle connection. A sliding groove is formed in the detection table and used for forming a positioning base angle, a clamping assembly is arranged on the detection table and comprises a small-diameter negative pressure pipe and a small-diameter extrusion rod, the small-diameter negative pressure pipe and the small-diameter extrusion rod move close to or away from the sliding groove, a lower industrial camera and an upper industrial camera are arranged below and above the detection table respectively, and a chip overturning mechanism is arranged on the detection table. The chip overturning mechanism is used for overturning the chip by 180 degrees, so that the pin of the chip is upside-down on the detection table, the pin does not need to be used as a positioning reference, interference of pin deformation on positioning is avoided from the source, and the accuracy of pin point position detection is remarkably improved.

Description

Technical Field

[0001] This invention relates to the field of chip surface inspection, specifically to a double-sided chip surface quality inspection system. Background Technology

[0002] In the semiconductor chip manufacturing process, the surface quality of the chip (such as scratches, stains, dents, bumps, pin deformation, or oxidation defects) directly affects its electrical performance, reliability, and lifespan. Therefore, surface quality inspection is a crucial step in the chip production process. Existing chip surface inspection technologies are mostly single-sided, meaning that after acquiring images and analyzing defects on one side of the chip using an industrial camera, the chip needs to be manually or mechanically flipped to inspect the other side, resulting in low inspection efficiency. Secondly, since the accuracy of chip pin positions is a core indicator determining the reliability of chip-to-circuit board soldering, any pin misalignment can directly lead to poor soldering, short circuits, or even functional failure. Therefore, surface quality inspection also needs to determine whether the pin positions are within the solderable range. The principle of chip pin detection is to compare the pin image with the image of a standard chip to quickly determine the pin position accuracy. However, in the existing chip vision inspection process, the technical bottleneck in the positioning stage directly restricts the accuracy of pin position detection. Specific problems are concentrated in the following two aspects: On the one hand, the failure of the positioning reference leads to insufficient positioning accuracy. Currently, chips are generally placed in a "front-loading" mode, with the chip body facing upwards and the pins downwards on the inspection stage. In this case, traditional inspection systems often default to using the edge or end of the pin as the positioning reference. However, in actual production, chip pins are easily subjected to external pressure and friction during cutting, conveying, and transfer, resulting in varying degrees of offset and bending, and are not in a standard shape. Especially for chips with pins on all four sides (such as QFP, QFN, etc.), the degree of deformation of the pins on each side is often inconsistent. If deformed pins are forcibly used as the positioning reference, it will cause a deviation between the overall coordinate system of the chip and the standard coordinate system during visual imaging. Ultimately, this will lead to "misjudgment" of the pin position detection results, misidentifying the deformation of the pin itself as a position offset, or missing the actual position deviation due to reference misalignment.

[0003] On the other hand, the increased stress on the pins exacerbates deformation, further interfering with positioning and detection. Because the chip is fed and transported with its "feet down," the pins directly contact the detection stage surface and transport track. Under the influence of gravity and slight vibrations and friction during transport, the already slightly deformed pins will experience continuous stress, leading to increased offset and more severe bending. This not only causes the pin shape to deviate further from the standard state, increasing the unreliability of the positioning reference, but also directly affects the chip's subsequent soldering compatibility. Even if pin adjustments are made after detection, excessively deformed pins may be difficult to restore to the standard position due to metal fatigue, ultimately reducing product yield. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a double-sided chip surface quality inspection system to address the deficiencies of the prior art.

[0005] The objective of this invention is achieved through the following technical solution: a double-sided chip surface quality inspection system, comprising an inspection stage, a sliding groove provided on the inspection stage, the sliding groove extending through the height of the inspection stage, a positioning plate slidably mounted within the sliding groove, a transverse positioning boss and a longitudinal positioning boss fixed on the top surface of the positioning plate, the transverse positioning boss and the longitudinal positioning boss being connected at right angles to form a positioning base angle, a clamping assembly provided on the inspection stage, the clamping assembly including a small-diameter negative pressure tube and a small-diameter extrusion rod, the small-diameter negative pressure tube and the small-diameter extrusion rod being arranged opposite each other on both sides of the sliding groove, the small-diameter negative pressure tube and the small-diameter extrusion rod both moving closer to or away from the sliding groove, a lower industrial camera and an upper industrial camera respectively provided below and above the inspection stage, and a chip flipping mechanism provided on the inspection stage, the chip flipping mechanism being used to flip the chip 180° so that the chip's pins face upwards and are inverted on the inspection stage.

[0006] Furthermore, the clamping assembly also includes two driving assemblies, each including a driving slide plate and a lifting driving block. The driving slide plate is slidably mounted on the testing table and moves closer to or further away from the positioning base angle. The lifting driving block is slidably mounted on the driving slide plate. The small-diameter negative pressure tube and the small-diameter extrusion rod are respectively mounted on the lifting driving blocks of the two driving assemblies.

[0007] Furthermore, the testing platform has a horizontal mounting groove at the location where the drive slide is set. The horizontal mounting groove extends through the height of the testing platform. The drive slide is slidably set in the horizontal mounting groove. A first cylinder is horizontally mounted on the testing platform. The telescopic shaft of the first cylinder is connected to the drive slide. A second cylinder is vertically mounted at the bottom of the drive slide. The telescopic shaft of the second cylinder is connected to the lifting drive block.

[0008] Furthermore, the end of the small-diameter negative pressure tube away from the positioning base angle is connected to a negative pressure seat, the negative pressure seat is fixed on one of the lifting drive blocks, the negative pressure seat is provided with a negative pressure cavity, the small-diameter negative pressure tube is connected to the negative pressure cavity, the end of the small-diameter extrusion rod away from the positioning base angle is connected to a pressure seat, the pressure seat is fixed on another lifting drive block, a pressure sensor is installed in the pressure seat, one end of the small-diameter extrusion rod slides into the pressure seat and contacts the pressure detection shaft of the pressure sensor, a limiting ring is fixedly sleeved on the small-diameter extrusion rod, and the limiting ring contacts the inner wall of the pressure seat.

[0009] Furthermore, the transverse positioning boss is provided with a negative pressure cavity, and a plurality of negative pressure holes are opened on the inner side of the transverse positioning boss. The negative pressure holes are connected to the negative pressure cavity. The transverse positioning boss is connected to a negative pressure pump through a first negative pressure pipe, and the negative pressure seat is connected to the negative pressure pump through a second negative pressure pipe. Solenoid valves are installed on both the first negative pressure pipe and the second negative pressure pipe.

[0010] Furthermore, the chip flipping mechanism includes a first flipping frame and a second flipping frame. Both the first flipping frame and the second flipping frame have the freedom to move along the height direction of the detection stage. A first rotating block is rotatably mounted on the first flipping frame, and a first negative pressure pipe is connected to the bottom of the first rotating block. A sliding plate is slidably arranged on the second flipping frame. The sliding plate moves closer to or away from the positioning base angle. A second rotating block is rotatably arranged on the sliding plate, and a second negative pressure pipe is connected to the bottom of the second rotating block.

[0011] Furthermore, a first motor is installed on the first tilting frame, a first rotating shaft is fixed on the first rotating block, the first rotating shaft is rotatably connected to the first tilting frame, and the output shaft of the first motor is connected to the first rotating shaft via a coupling.

[0012] Furthermore, a third cylinder is horizontally mounted on the second tilting frame, the telescopic shaft of the third cylinder is connected to a sliding plate, a second motor is mounted on the sliding plate, a second rotating shaft is fixed on the second rotating block, the second rotating shaft is rotatably connected to the sliding plate, and the output shaft of the second motor is drivenly connected to the second rotating shaft.

[0013] Furthermore, the industrial camera is equipped with a multi-degree-of-freedom support mechanism, which includes a lifting beam, a crossbeam, and a horizontal sliding seat. Two lifting beams are spaced apart, and the detection platform is positioned between the two lifting beams. The two ends of the crossbeam are slidably mounted on the two lifting beams, respectively. The horizontal sliding seat is slidably mounted on the crossbeam, and the direction of movement of the horizontal sliding seat is perpendicular to the direction of movement of the crossbeam. A camera mounting base is rotatably mounted on the horizontal sliding seat, and the rotation axis of the camera mounting base is parallel to the direction of movement of the crossbeam. The industrial camera is mounted on the camera mounting base.

[0014] Furthermore, each of the lifting beams is vertically equipped with a drive cylinder, the telescopic shaft of the drive cylinder is connected to the lifting beam, a first linear drive module is installed on the top surface of the lifting beam, the crossbeam is installed on the slide of the first linear drive module, a second linear drive module is installed on the lifting beam, a horizontal sliding seat is installed on the slide of the second linear drive module, a U-shaped groove is opened at the bottom of the horizontal sliding seat, a camera drive shaft is rotatably arranged in the U-shaped groove, the camera mounting base is fixedly sleeved on the camera drive shaft, a camera drive motor is installed on the side wall of the horizontal sliding seat, and the output shaft of the camera drive motor is connected to the camera drive shaft.

[0015] The beneficial effects of this invention are: 1. Due to the certain distance between the chip's pins and the chip's top surface, the chip is flipped 180° by a chip flipping mechanism and placed upside down on the testing stage, with the pins facing upwards and the top surface facing downwards. The chip is positioned using the distance between the chip's top surface and the pins, so that the two vertical sidewalls of the chip contact the horizontal and vertical positioning protrusions respectively. At this time, the horizontal and vertical positioning protrusions are located between the pins and the chip's top surface, thus avoiding the influence of the pins on the chip's positioning. The positioning reference is not used for the pins, thus avoiding the interference of pin deformation on positioning from the root. This effectively reduces the situation of "misjudging pin deformation as point offset" or "missing the detection of real point deviation", significantly improving the accuracy of pin point detection and providing reliable data support for subsequent pin adjustment.

[0016] 2. After the chip is positioned on the inspection stage, it is clamped by the cooperation of a small-diameter negative pressure tube and a small-diameter extrusion rod, so that the chip is suspended in the air. Then the positioning plate is removed, so that the lower industrial camera can perform visual imaging on the top surface of the chip. The upper and lower industrial cameras simultaneously perform chip surface quality inspection. Compared with the traditional "single-sided inspection + chip flipping" mode, the inspection cycle is greatly shortened, the time loss of intermediate links is reduced, and the high-efficiency inspection needs of large-scale mass production scenarios are met. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a double-sided chip surface quality inspection system according to the present invention. Figure 1 ; Figure 2 for Figure 1 Enlarged view of point A in the middle; Figure 3 This is a schematic diagram of the structure of a double-sided chip surface quality inspection system according to the present invention. Figure 2 ; Figure 4 for Figure 3 Enlarged view at point B in the middle; Figure 5This is a schematic diagram of the internal structure of the pressure seat in a double-sided chip surface quality detection system of the present invention; Figure 6 This is a schematic diagram of the structure of a double-sided chip surface quality inspection system according to the present invention. Figure 3 ; In the diagram, 1-detection table, 2-slide groove, 3-positioning plate, 4-lateral positioning boss, 5-longitudinal positioning boss, 6-small diameter negative pressure pipe, 7-small diameter extrusion rod, 8-lower industrial camera, 9-upper industrial camera, 10-negative pressure hole, 11-first flipping frame, 12-second flipping frame, 13-drive slide plate, 14-lifting drive block, 15-horizontal mounting slot, 16-first cylinder, 17-second cylinder, 18-negative pressure seat, 19-pressure seat, 20-pressure transmitter Sensor, 21-Limiting ring, 22-First rotating block, 23-First negative pressure pipe, 24-Sliding plate, 25-Second rotating block, 26-Second negative pressure pipe, 27-First motor, 28-Third cylinder, 29-Second motor, 30-Lifting beam, 31-Crossbeam, 32-Horizontal sliding seat, 33-Camera mounting base, 34-Drive cylinder, 35-First linear drive module, 36-Second linear drive module, 37-U-shaped slot, 38-Camera drive motor. Detailed Implementation

[0018] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited to the following description.

[0019] Example 1 like Figures 1 to 6As shown, a double-sided chip surface quality inspection system includes an inspection stage 1. A slide groove 2 is provided on the inspection stage 1, extending through the stage along its height. A positioning plate 3 is slidably mounted within the slide groove 2. A transverse positioning boss 4 and a longitudinal positioning boss 5 are fixed to the top surface of the positioning plate 3. The transverse positioning boss 4 and the longitudinal positioning boss 5 are connected at right angles to form a positioning base angle. A clamping assembly is provided on the inspection stage 1, comprising a small-diameter negative pressure tube 6 and a small-diameter extrusion rod 7. The small-diameter negative pressure tube 6 and the small-diameter extrusion rod 7 are arranged opposite each other on both sides of the slide groove 2. The small-diameter extruded tubes 7 move closer to or further away from the slide 2. A lower industrial camera 8 and an upper industrial camera 9 are respectively installed below and above the inspection table 1. A chip flipping mechanism is installed on the inspection table 1 to flip the chip 180°, so that the chip's pins face upwards on the inspection table 1. A six-axis robotic arm loads the chip onto the operating station of the chip flipping mechanism. Because the gripper of the six-axis robotic arm can only hold the empty area between the chip's top surface and the pins, the chip is loaded in a pin-down state. Therefore, the chip flipping mechanism... After the chip is flipped 180° and placed upside down on the detection stage 1, with the pins facing upwards and the top surface downwards, the chip is positioned using the gap between the top surface and the pins. The two vertical sidewalls of the chip are then positioned to contact the lateral positioning protrusion 4 and the longitudinal positioning protrusion 5, respectively. At this point, the lateral positioning protrusion 4 and the longitudinal positioning protrusion 5 are located between the pins and the top surface of the chip, thus avoiding the influence of the pins on chip positioning. This eliminates the need to use the pins as a positioning reference, fundamentally avoiding interference from pin deformation on positioning, and effectively reducing the possibility of "misjudging pin deformation as position offset" or "missing the detection of true position deviation." Furthermore, it significantly improves the accuracy of pin point detection, providing reliable data support for subsequent pin adjustments. After the chip is positioned, the chip is clamped by the cooperation of the small-diameter negative pressure tube 6 and the small-diameter extrusion rod 7, making the chip suspended. Then the positioning plate 3 is removed, allowing the lower industrial camera 8 to perform visual imaging on the top surface of the chip. The upper industrial camera 9 and the lower industrial camera 8 simultaneously perform chip surface quality inspection. Compared with the traditional "single-sided inspection + chip flipping" mode, it greatly shortens the inspection cycle, reduces the time loss of intermediate links, and meets the high-efficiency inspection requirements in large-scale mass production scenarios.

[0020] Example 2 Based on Example 1, such as Figures 1 to 6As shown, the industrial camera 9 is equipped with a multi-degree-of-freedom support mechanism, which includes a lifting beam 30, a crossbeam 31, and a horizontal sliding seat 32. Two lifting beams 30 are spaced apart, and the detection table 1 is positioned between the two lifting beams 30. The two ends of the crossbeam 31 are slidably mounted on the two lifting beams 30, respectively. The horizontal sliding seat 32 is slidably mounted on the crossbeam 31, and the direction of movement of the horizontal sliding seat 32 is perpendicular to the direction of movement of the crossbeam 31. A camera mounting base 33 is rotatably mounted on the horizontal sliding seat 32, and the rotation axis of the camera mounting base 33 is parallel to the crossbeam 30. In the direction of movement 1, the industrial camera 9 is mounted on the camera mounting base 33. After the chip is inverted, the chip's pins are exposed with their faces upwards, facilitating imaging inspection of the chip pins to determine if there are defects or if the offset meets requirements. However, the pins on each side of the chip are linearly arranged, causing the sidewalls of the pins to obstruct each other, making it impossible to determine if there are cracks, bulges, solder joints, or other problems on the sidewalls of the pins. Therefore, a multi-degree-of-freedom support mechanism is used to adjust the imaging angle and imaging position of the industrial camera 9 to achieve sidewall inspection of the pins. The specific process is as follows... The industrial camera 9 first images the chip directly, ensuring the chip falls entirely within the imaging range for surface quality inspection. Then, it inspects the sides of the chip pins. During inspection, the camera mounting base 33 tilts, allowing the industrial camera 9 to image the chip pins from this tilted position. The lifting beam 30 moves the crossbeam 31 downwards, bringing the industrial camera 9 closer to the chip, facilitating focused imaging on the chip pins. Because the industrial camera 9 is tilted, the imaging area penetrates between adjacent pins, acting on the pin sidewall. Then, in conjunction with the movement of the horizontal sliding block 32, the industrial camera 9 moves along the linear array direction of the pins, completing the inspection of one side of the pins. The camera mounting base 33 then tilts the industrial camera 9 in the opposite direction, and the horizontal sliding block 32 resets the industrial camera 9, completing the inspection of the other side of the pins. Through the movement of the crossbeam 31, the industrial camera 9 acts on another column of pins on the chip, repeating the above process to complete the inspection of the pins on the other sidewall of the chip. This ensures that chip inspection is not limited to surface inspection, making the inspection more comprehensive and accurately reflecting the chip's quality.

[0021] Furthermore, each lifting beam 30 is vertically equipped with a drive cylinder 34. The telescopic shaft of the drive cylinder 34 is connected to the lifting beam 30. A first linear drive module 35 is installed on the top surface of the lifting beam 30. A crossbeam 31 is installed on the slide of the first linear drive module 35. A second linear drive module 36 is installed on the lifting beam 30. A horizontal sliding seat 32 is installed on the slide of the second linear drive module 36. A U-shaped groove 37 is opened at the bottom of the horizontal sliding seat 32. A camera drive shaft is rotatably installed in the U-shaped groove 37. A camera mounting base 33 is fixedly sleeved on the camera drive shaft. The side wall of the horizontal sliding seat 32 is equipped with... Equipped with a camera drive motor 38, the output shaft of the camera drive motor 38 is connected to the camera drive shaft. The extension and retraction of the drive cylinder 34 drives the lifting beam 30 to move up and down, which can adjust the distance between the upper industrial camera 9 and the chip. The first linear drive module 35 drives the crossbeam 31 to move, and the second linear drive module 35 drives the horizontal sliding seat 32 to move on the crossbeam 31. The camera drive motor 38 drives the camera mounting base 33 to deflect, thereby adjusting the tilt angle of the upper industrial camera 9. This gives the upper industrial camera 9 four degrees of freedom, which can meet the requirements of the inspection and realize the comprehensive inspection of the chip.

[0022] Example 3 Based on Example 2, such as Figures 1 to 6 As shown, the clamping assembly also includes two drive assemblies, each including a drive slide plate 13 and a lifting drive block 14. The drive slide plate 13 is slidably mounted on the testing table 1, and moves closer to or away from the positioning base angle. The lifting drive block 14 is slidably mounted on the drive slide plate 13. The small-diameter negative pressure pipe 6 and the small-diameter extrusion rod 7 are respectively mounted on the lifting drive blocks 14 of the two drive assemblies. The testing table 1 has a horizontal mounting groove 15 at the position where the drive slide plate 13 is set. The horizontal mounting groove 15 extends along the height direction of the testing table 1. The drive slide plate 13 is slidably mounted in the horizontal mounting groove 15. A first cylinder 16 is horizontally mounted on the testing table 1. The telescopic shaft of the first cylinder 16 is connected to the drive slide plate 13. A second cylinder 17 is vertically mounted at the bottom of the drive slide plate 13. The telescopic shaft of cylinder 17 is connected to the lifting drive block 14. The length of the transverse positioning boss 4 and the length of the longitudinal positioning boss 5 are both less than the side wall length of the chip. After the chip is positioned by the positioning base corner, it partially protrudes from the positioning base corner. This exposed part is the clamping position of the clamping assembly. The height of the lifting drive block 14 is adjusted by the second cylinder 17, thereby controlling the clamping height of the small-diameter negative pressure tube 6 and the small-diameter extrusion rod 7. This allows for clamping operations on different types of chips. The first cylinder 16 drives the drive slide plate 13 to move closer to the chip, so that the small-diameter negative pressure tube 6 and the small-diameter extrusion rod 7 act on the chip to complete the chip clamping action. The negative pressure generated by the small-diameter negative pressure tube 6 adsorbs the chip, thereby reducing the extrusion force of the small-diameter extrusion rod 7 on the chip and avoiding chip clamping deformation.

[0023] Example 4 Based on Example 3, such as Figures 1 to 5 As shown, the end of the small-diameter negative pressure pipe 6 furthest from the positioning base angle is connected to a negative pressure seat 18. The negative pressure seat 18 is fixed on one of the lifting drive blocks 14. A negative pressure chamber is provided inside the negative pressure seat 18, and the small-diameter negative pressure pipe 6 is connected to the negative pressure chamber. The end of the small-diameter extrusion rod 7 furthest from the positioning base angle is connected to a pressure seat 19. The pressure seat 19 is fixed on another lifting drive block 14. A pressure sensor 20 is installed inside the pressure seat 19. One end of the small-diameter extrusion rod 7 slides into the pressure seat 19 and contacts the pressure sensor 20. The pressure detection shaft is 0. A limiting ring 21 is fixedly sleeved on the small-diameter extrusion rod 7. The limiting ring 21 contacts the inner wall of the pressure seat 19. A negative pressure cavity is provided inside the transverse positioning boss 4. Several negative pressure holes 10 are opened on the inner side of the transverse positioning boss 4. The negative pressure holes 10 are connected to the negative pressure cavity. The transverse positioning boss 4 is connected to the negative pressure pump through the first negative pressure pipe. The negative pressure seat 18 is connected to the negative pressure pump through the second negative pressure pipe. Solenoid valves are installed on both the first negative pressure pipe and the second negative pressure pipe. The chip flipping mechanism will... After the chip is rotated 180°, it is placed in the positioning base corner. Then, the first negative pressure pipe of the transverse positioning boss 4 is opened, and negative pressure is generated through the negative pressure hole to attract the chip. This allows for fine adjustment of the chip's position, bringing the chip into contact with the transverse positioning boss 4. The transverse positioning boss 4 is parallel to the small-diameter negative pressure pipe 6. Then, the small-diameter negative pressure pipe 6 moves closer to the chip, attracting the chip. Then, the negative pressure of the transverse positioning boss 4 is disconnected, and the small-diameter negative pressure pipe 6 drives the chip to move closer to the longitudinal positioning boss 5, bringing the chip into contact with the longitudinal positioning boss 5. At this time, the two side walls of the chip contact the transverse positioning boss 4 and the longitudinal positioning boss 5 respectively to complete the positioning operation. Next, the small-diameter extrusion rod 7 moves closer to the chip, bringing it into contact with the chip to perform a clamping action. The force of the small-diameter extrusion rod 7 squeezing the chip will act on the pressure detection shaft of the pressure sensor 20, thereby facilitating the control of the clamping force on the chip and avoiding excessive clamping force that could deform the chip. Combined with the negative pressure, this reduces the clamping force on the chip.

[0024] Example 5 Based on Example 4, such as Figures 1 to 4As shown, the chip flipping mechanism includes a first flipping frame 11 and a second flipping frame 12. Both the first flipping frame 11 and the second flipping frame 12 have the freedom to move along the height direction of the detection stage 1. A first rotating block 22 is rotatably mounted on the first flipping frame 11, and a first negative pressure pipe 23 is connected to the bottom of the first rotating block 22. A sliding plate 24 is slidably mounted on the second flipping frame 12. The sliding plate 24 moves closer to or away from the positioning base angle. A second rotating block 25 is rotatably mounted on the sliding plate 24, and a second negative pressure pipe 26 is connected to the bottom of the second rotating block 25. A first motor 27 is mounted on the first flipping frame 11. A first rotating shaft is fixed on the first rotating block 22, and the first rotating shaft is rotatably connected to the first flipping frame 11. The output shaft of the first motor 27 is driven and connected to the first rotating shaft through a coupling. A third cylinder 28 is horizontally mounted on the second flipping frame 12. The telescopic shaft of the third cylinder 28 is connected to the sliding plate 24. A second motor 29 is mounted on the sliding plate 24. A second rotating shaft is fixed on the second rotating block 25, and the second rotating shaft is rotatably connected to the sliding plate 24. The output shaft of the second motor 29 is driven and connected to the second rotating shaft. The six-axis robot arm first places the chip on the working position of the first negative pressure tube 23. A detection table 1 is vertically mounted with... A first flip-frame cylinder and a second flip-frame cylinder are connected. The telescopic shaft of the first flip-frame cylinder is connected to the first flip-frame 11, and the telescopic shaft of the second flip-frame cylinder is connected to the flip-frame slide. A push cylinder is horizontally mounted on the flip-frame slide, and the telescopic shaft of the push cylinder is connected to the second flip-frame 12. The first flip-frame cylinder drives the first flip-frame 11 to move downward, causing the first negative pressure tube 23 to adsorb the top surface of the chip. Then, the first flip-frame 11 resets, causing the chip to detach from the detection stage 1. Then, the first motor 27 drives the first rotating block 22 to deflect 90° toward the second flip-frame 12. At the same time, the second motor 29 drives the second rotating block 22 to deflect 90° toward the second flip-frame 12. Block 25 deflects 90° toward the first flipping frame 11, and then the second flipping frame 12 moves closer to the chip by pushing the cylinder, so that the second negative pressure tube 26 contacts the chip. The second negative pressure tube 26 adsorbs the bottom surface of the chip by negative pressure. The first negative pressure tube 23 disconnects the negative pressure, and the cylinder pushes the second flipping frame 12 to reset. Then the second motor 29 reverses and drives the second rotating block 25 to rotate back to reset, thereby flipping the chip 180° so that the top surface of the chip is facing down and unobstructed. Finally, the chip is placed in the positioning base corner by the movement of the sliding plate 24 and the lifting and lowering of the second flipping frame 12, realizing the inverted positioning of the chip.

Claims

1. A chip surface quality double-sided detection system, characterized in that, Including the detection platform (1), the detection platform (1) is provided with a chute (2), the chute (2) is through the setting along the height direction of detection platform (1), the chute (2) is equipped with the positioning plate (3) inside sliding, the top surface of positioning plate (3) is fixed with horizontal positioning boss (4) and longitudinal positioning boss (5), horizontal positioning boss (4) and longitudinal positioning boss (5) are connected at right angles, for forming positioning base angle, the detection platform (1) is provided with clamping assembly, the clamping assembly includes small diameter negative pressure pipe (6) and small diameter extrusion rod (7), small diameter negative pressure pipe (6) and small diameter extrusion rod (7) are oppositely arranged on both sides of chute (2), small diameter negative pressure pipe (6) and small diameter extrusion pipe (7) are close to or away from the movement of chute (2), the lower and upper of detection platform (1) are provided with lower industrial camera (8) and upper industrial camera (9) respectively, the detection platform (1) is provided with chip turnover mechanism, the chip turnover mechanism is used to turn over 180 ° chip, and the pin of chip is inverted on the detection platform (1).

2. The chip surface quality double-sided detection system according to claim 1, wherein The clamping assembly further includes two drive assemblies, the drive assembly includes a drive slide (13) and a lifting drive block (14), the drive slide (13) is slidably mounted on the detection platform (1), the drive slide (13) moves close to or away from the positioning base angle, the lifting drive block (14) is slidably provided on the drive slide (13), the small diameter negative pressure pipe (6) and the small diameter extrusion rod (7) are respectively installed on the lifting drive block (14) of the two drive assemblies.

3. The chip surface quality double-sided detection system according to claim 2, wherein, The detection platform (1) is provided with a horizontal mounting groove (15) at the position of the drive slide (13), the horizontal mounting groove (15) is through the setting along the height direction of detection platform (1), the drive slide (13) is slidably provided in the horizontal mounting groove (15), the first cylinder (16) is horizontally mounted on the detection platform (1), the telescopic shaft of the first cylinder (16) is connected with the drive slide (13), the second cylinder (17) is vertically mounted on the bottom of the drive slide (13), the telescopic shaft of the second cylinder (17) is connected with the lifting drive block (14).

4. The chip surface quality double-sided detection system according to claim 2, wherein, The small diameter negative pressure pipe (6) is connected with a negative pressure seat (18) at one end away from the positioning base angle, the negative pressure seat (18) is fixed on one of the lifting drive blocks (14), the negative pressure seat (18) is provided with a negative pressure cavity, the small diameter negative pressure pipe (6) is connected with the negative pressure cavity, the small diameter extrusion rod (7) is connected with a pressure seat (19) at one end away from the positioning base angle, the pressure seat (19) is fixed on the other lifting drive block (14), the pressure sensor (20) is installed in the pressure seat (19), one end of the small diameter extrusion rod (7) is slidably inserted into the pressure seat (19) and contacts the pressure detection shaft of the pressure sensor (20), the limiting ring (21) is fixedly sleeved on the small diameter extrusion rod (7), and the limiting ring (21) contacts the inner wall of the pressure seat (19).

5. The chip surface quality double-sided detection system according to claim 4, wherein, The transverse positioning boss (4) is internally provided with a negative pressure cavity, a plurality of negative pressure small holes (10) are formed on the inner side of the transverse positioning boss (4), the negative pressure small holes (10) are communicated with the negative pressure cavity, the transverse positioning boss (4) is connected with a negative pressure pump through a first negative pressure pipeline, the negative pressure seat (18) is connected with the negative pressure pump through a second negative pressure pipeline, and the first negative pressure pipeline and the second negative pressure pipeline are both provided with electromagnetic valves.

6. The chip surface quality double-sided detection system according to claim 1, wherein, The chip turnover mechanism comprises a first turnover frame (11) and a second turnover frame (12), the first turnover frame (11) and the second turnover frame (12) both have the freedom of moving along the height direction of the detection table (1), a first rotating block (22) is rotatably arranged on the first turnover frame (11), and a first negative pressure pipe (23) is connected to the bottom of the first rotating block (22); a sliding plate (24) is slidably arranged on the second turnover frame (12), the sliding plate (24) moves close to or away from the positioning base corner, a second rotating block (25) is rotatably arranged on the sliding plate (24), and a second negative pressure pipe (26) is connected to the bottom of the second rotating block (25).

7. The chip surface quality double-sided detection system according to claim 6, wherein, A first motor (27) is arranged on the first turnover frame (11), a first rotating shaft is fixed on the first rotating block (22), the first rotating shaft is rotatably connected to the first turnover frame (11), and the output shaft of the first motor (27) is drivingly connected to the first rotating shaft through a shaft coupling.

8. The chip surface quality double-sided detection system according to claim 6, wherein, A third air cylinder (28) is horizontally arranged on the second turnover frame (12), the telescopic shaft of the third air cylinder (28) is connected to the sliding plate (24), a second motor (29) is arranged on the sliding plate (24), a second rotating shaft is fixed on the second rotating block (25), the second rotating shaft is rotatably connected to the sliding plate (24), and the output shaft of the second motor (29) is drivingly connected to the second rotating shaft.

9. The chip surface quality double-sided detection system according to claim 1, wherein, The upper industrial camera (9) is provided with a multi-degree-of-freedom support mechanism, the multi-degree-of-freedom support mechanism comprises lifting beams (30), a cross beam (31) and a horizontal sliding seat (32), two lifting beams (30) are arranged at intervals, the detection table (1) is arranged between the two lifting beams (30), the two ends of the cross beam (31) are slidably arranged on the two lifting beams (30) respectively, the horizontal sliding seat (32) is slidably arranged on the cross beam (31), the moving direction of the horizontal sliding seat (32) is perpendicular to the moving direction of the cross beam (31), a camera mounting base (33) is rotatably arranged on the horizontal sliding seat (32), the rotating shaft of the camera mounting base (33) is parallel to the moving direction of the cross beam (31), and the upper industrial camera (9) is arranged on the camera mounting base (33).

10. The chip surface quality double-sided detection system according to claim 9, wherein, Each of the lifting beams (30) is vertically arranged with a driving cylinder (34), the telescopic shaft of the driving cylinder (34) is connected with the lifting beam (30), the top surface of the lifting beam (30) is provided with a first linear driving module (35), the cross beam (31) is installed on the sliding seat of the first linear driving module (35), the lifting beam (30) is provided with a second linear driving module (36), the horizontal sliding seat (32) is installed on the sliding seat of the second linear driving module (36), the bottom of the horizontal sliding seat (32) is provided with a U-shaped notch (37), a camera driving shaft is rotatably arranged in the U-shaped notch (37), the camera mounting base (33) is fixedly sleeved on the camera driving shaft, the sidewall of the horizontal sliding seat (32) is provided with a camera driving motor (38), and the output shaft of the camera driving motor (38) is in transmission connection with the camera driving shaft.

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