Method for manufacturing display panel and display panel

Abstract

The application belongs to the technical field of display, and particularly relates to a preparation method of a display panel and the display panel. The preparation method of the display panel comprises the following steps: providing a substrate, wherein a light-emitting functional layer and an encapsulation layer covering the light-emitting functional layer are formed on the substrate; forming a patterned light-shielding piece and a patterned light-filtering color resist on the encapsulation layer, wherein the light-shielding piece is arranged adjacent to the light-filtering color resist; and irradiating the light-shielding piece and the light-filtering color resist by laser, so that the light-shielding piece absorbs laser energy and generates heat energy, and the heat energy promotes the light-filtering color resist adjacent to the light-shielding piece to be solidified. The application can realize effective solidification of the color filter layer, reduce damage of the light-emitting functional layer caused by thermal effects in the solidification process, and improve product performance and reliability.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of display, and particularly relates to a preparation method of a display panel and the display panel. BACKGROUND

[0002] With the development of display technology, an organic light-emitting diode structure of Color Filter on Encapsulation (COE) is born on the thin film encapsulation layer. The structure aims to replace the polarizer with an integrated color filter, thereby significantly improving the light transmittance of the panel and helping to achieve better display effect and thinner product design.

[0003] However, there are significant challenges in the process of curing the color filter layer in the manufacturing process of the COE structure. The heat required in the curing process is extremely easy to cause thermal damage to the underlying light-emitting functional layer, which severely limits the range of available materials and the process window, thereby restricting the further development and application of the technology. SUMMARY

[0004] The purpose of the present application is to provide a preparation method of a display panel and the display panel, which can effectively cure the color filter layer while reducing the damage to the light-emitting functional layer caused by the thermal effect in the curing process, and improve the product performance and reliability.

[0005] The first aspect of the present application provides a preparation method of a display panel, comprising: providing a substrate, the substrate being formed with a light-emitting functional layer and an encapsulation layer covering the light-emitting functional layer; forming a patterned light-shielding member and a patterned light-filtering color resist on the encapsulation layer, the light-shielding member being arranged adjacent to the light-filtering color resist; irradiating the light-shielding member and the light-filtering color resist with laser light, so that the light-shielding member absorbs laser energy and generates heat energy, and the heat energy causes the light-filtering color resist adjacent thereto to be cured.

[0006] In an exemplary embodiment of the present application, in the step of irradiating with laser light, the laser light is irradiated in a direction at an inclined angle relative to the surface of the encapsulation layer, and the light-shielding member is configured to shield the laser light from irradiating the light-emitting functional layer.

[0007] In an exemplary embodiment of the present application, the included angle between the irradiation direction of the laser light and the surface of the encapsulation layer is α, the height of the light-shielding member is h, and the spacing between two adjacent light-shielding members is L, wherein α satisfies: .

[0008] In an exemplary embodiment of the present application, the step of forming the patterned light-blocking member on the encapsulation layer comprises: applying a light-blocking material on the encapsulation layer; performing a first solidification treatment on the applied light-blocking material to form a pre-solidified light-blocking material layer; performing a patterning treatment on the pre-solidified light-blocking material layer to form the patterned light-blocking member; and performing a second solidification treatment on the patterned light-blocking member by laser irradiation.

[0009] In an exemplary embodiment of the present application, the step of performing laser irradiation on the patterned light-blocking member comprises: performing a first laser irradiation on the light-blocking member at a first oblique angle; and performing a second laser irradiation on the light-blocking member at a second oblique angle; wherein the irradiation direction of the first laser irradiation is symmetrical to the irradiation direction of the second laser irradiation relative to the normal direction of the light-blocking member.

[0010] In an exemplary embodiment of the present application, the step of forming the patterned light-blocking member on the encapsulation layer comprises: applying a light-blocking material on the encapsulation layer; performing a first solidification treatment on the applied light-blocking material to form a pre-solidified light-blocking material layer; performing a patterning treatment on the pre-solidified light-blocking material layer to form the patterned light-blocking member; and performing a second solidification treatment on the patterned light-blocking member by laser irradiation.

[0011] In an exemplary embodiment of the present application, the step of performing laser irradiation on the patterned light-blocking member comprises: performing a first laser irradiation on the light-blocking member at a first oblique angle; and performing a second laser irradiation on the light-blocking member at a second oblique angle; wherein the irradiation direction of the first laser irradiation is symmetrical to the irradiation direction of the second laser irradiation relative to the normal direction of the light-blocking member.

[0012] In an exemplary embodiment of the present application, the step of providing a substrate having a light-emitting functional layer and an encapsulation layer covering the light-emitting functional layer comprises: forming a first inorganic encapsulation layer on the light-emitting functional layer; forming an organic encapsulation layer on the first inorganic encapsulation layer; performing a patterning treatment on the organic encapsulation layer to form a recessed portion in a region corresponding to the light-blocking member; and forming a second inorganic encapsulation layer on the organic encapsulation layer having the recessed portion; wherein the light-blocking member is formed in the recessed portion of the encapsulation layer.

[0013] In an example embodiment of the present application, in the step of forming the patterned light-blocking member and the patterned filter color resist on the encapsulation layer, the patterned light-blocking member and the patterned filter color resist are respectively subjected to pre-curing treatment; and the step of making the light-blocking member absorb laser energy and generate heat energy by laser irradiation is performed after the light-blocking member and the filter color resist are both subjected to pre-curing treatment.

[0014] The second aspect of the present application provides a display panel, comprising: a substrate; a light-emitting functional layer disposed on the substrate; an encapsulation layer covering the light-emitting functional layer; a color filter layer disposed on a side of the encapsulation layer away from the substrate, the color filter layer comprising a light-blocking member and a filter color resist located between adjacent light-blocking members; wherein the light-blocking member is configured to be able to absorb laser energy and generate heat energy, and the heat energy generated by the light-blocking member can be transmitted to the filter color resist adjacent thereto.

[0015] The display panel preparation method and the display panel of the present application scheme have at least the following beneficial effects:

[0016] The display panel preparation method provided by the present application uses laser to irradiate the patterned light-blocking member and the filter color resist adjacent thereto at the same time, so that the filter color resist can obtain the energy required for curing through two paths at the same time: one is to directly absorb part of the laser irradiation energy, and the other is to receive the heat energy converted and transmitted by the light-blocking member after absorbing the laser. This dual energy action mechanism significantly improves the curing efficiency and uniformity of the filter color resist, thereby ensuring that it can be fully and effectively cured. At the same time, due to the existence of the light-blocking member and its main absorption of laser energy, most of the heat is confined to the light-blocking member and its adjacent area, thereby efficiently completing the curing of the filter color resist while minimizing the thermal impact on the underlying heat-sensitive light-emitting functional layer, successfully reducing the core contradiction between the high-temperature curing process and the heat resistance of the light-emitting functional layer device. This method not only improves the reliability of the curing process, but also provides the possibility of using conventional filter materials with more stable performance, which is conducive to improving product yield and reducing production cost.

[0017] Other characteristics and advantages of the present application will become apparent from the following detailed description, or will be learned by practice of the present application.

[0018] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0019] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments consistent with the application and, together with the description, further serve to explain the principles of the application. It is to be understood that the drawings are only illustrations of some embodiments of the application and that, to one of ordinary skill in the art, other embodiments can be clearly inferred from the drawings without paying creative labor.

[0020] Figure 1 A flowchart of a method for manufacturing a display panel is shown.

[0021] Figure 2 A flowchart of a method for manufacturing a light shielding member is shown.

[0022] Figure 3 A flowchart of a method for manufacturing a light shielding member using twice laser irradiation is shown.

[0023] Figure 4 A flowchart of a method for manufacturing a light shielding member using twice laser irradiation is shown.

[0024] Figure 5 A flowchart of a method for manufacturing a light shielding member using twice laser irradiation is shown.

[0025] Figure 6 A flowchart of a method for manufacturing a light shielding member using twice laser irradiation is shown.

[0026] Figure 7 A flowchart of a method for manufacturing a light shielding member using twice laser irradiation is shown.

[0027] Figure 8 A schematic diagram of a cross-sectional structure of a pixel unit in a display panel is shown.

[0028] Figure 9 A flowchart of a method for manufacturing an organic encapsulation layer with a recess is shown.

[0029] Figure 10 A flowchart of a method for manufacturing an organic encapsulation layer with a recess is shown.

[0030] Figure 11 A flowchart of a method for manufacturing an organic encapsulation layer with a recess is shown.

[0031] Figure 12 A flowchart of a method for manufacturing an organic encapsulation layer with a recess is shown.

[0032] Figure 13 A structural schematic diagram of an array of light-emitting functional layers arranged on a substrate is shown.

[0033] Labeling of the drawings:

[0034] 100, display panel; 110, substrate; 120, light-emitting functional layer; 130, encapsulation layer; 131, first inorganic encapsulation layer; 132, organic encapsulation layer; 133, recessed part; 134, second inorganic encapsulation layer; 140, light-shielding member; 150, color filter; M, laser. DETAILED DESCRIPTION

[0035] Example implementations will now be described more fully with reference to the accompanying drawings. Example implementations may, however, be implemented in many different forms and should not be construed as limited to the implementations set forth in this disclosure; rather, these implementations are provided so that this disclosure will be thorough and complete, and will fully convey the inventive aspects of example implementations to those skilled in the art. Like reference numerals may refer to like elements throughout the description of the figures.

[0036] In this application, the terms "first", "second", etc. are used only to describe different instances, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.

[0037] In this application, unless otherwise explicitly specified and limited, the terms "assembly", "connection" and the like should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integrated; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0038] In addition, the described features, structures or characteristics can be combined in any suitable manner in one or more embodiments. In the following description, many specific details are provided to give a sufficient understanding of the embodiments of the present application. However, those skilled in the art will realize that the technical solutions of the present application can be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. can be used. In other cases, well-known methods, devices, implementations or operations are not shown or described in detail to avoid obscuring the aspects of the present application.

[0039] The embodiment of the present application provides a preparation method of a display panel 100, which effectively reduces the problem that the underlying light-emitting functional layer 120 is easily damaged when the color filter layer is cured at high temperature in the COE structure. Referring to Figure 1 As shown in the figure, the method can include the following steps:

[0040] In step S100, a substrate 110 is provided, and the substrate 110 is formed with a light-emitting functional layer 120 and an encapsulation layer 130 covering the light-emitting functional layer 120.

[0041] In step S200, a patterned light-blocking member 140 and a patterned light-filtering color resist 150 are formed on the encapsulation layer 130, and the light-blocking member 140 is arranged adjacent to the light-filtering color resist 150.

[0042] In step S300, laser M is irradiated, so that the light-blocking member 140 absorbs laser M energy and generates heat energy, and the heat energy promotes curing of the light-filtering color resist 150 adjacent to the light-blocking member 140.

[0043] The preparation method of the display panel 100 provided by the present application simultaneously irradiates the patterned light-blocking member 140 and the light-filtering color resist 150 adjacent to the light-blocking member 140 by using laser M, so that the light-filtering color resist 150 can obtain energy required for curing through two paths: one is directly absorbing part of the irradiation energy of laser M; and the other is receiving heat energy converted and transmitted by the light-blocking member 140 after absorbing laser M. The double energy action mechanism significantly improves the curing efficiency and uniformity of the light-filtering color resist 150, so as to ensure that the light-filtering color resist 150 can be fully and effectively cured. At the same time, due to the existence of the light-blocking member 140 and the main absorption of laser M energy, most of the heat is limited to the light-blocking member 140 and the adjacent area, so that the light-filtering color resist 150 is efficiently cured, and the heat influence on the underlying heat-sensitive light-emitting functional layer 120 is minimized, and the core contradiction between the high-temperature curing process and the heat resistance of the light-emitting functional layer 120 is successfully reduced. The method not only improves the reliability of the curing process, but also provides the possibility of using conventional light-filtering materials with more stable performance, which is conducive to improving product yield and reducing production cost.

[0044] In step S100, the substrate 110 can be a glass substrate 110, a flexible polymer substrate 110, etc. On the substrate 110, a thin film transistor (TFT) array (not shown in the figure) is formed by using a mature semiconductor process, and then the light-emitting functional layer 120 of an organic light-emitting diode is prepared on the thin film transistor array. The light-emitting functional layer 120 can include an anode, an organic light-emitting layer, and a cathode. Subsequently, a thin film encapsulation layer 130 is formed on the light-emitting functional layer 120 to block water and oxygen and protect the light-emitting functional layer 120. The encapsulation layer 130 is a single inorganic layer, or more commonly an inorganic / organic / inorganic multilayer structure.

[0045] In step S200, a patterned light shielding member 140 and a patterned color filter 150 are prepared on the encapsulation layer 130. The light shielding member 140 is arranged adjacent to the color filter 150. The light shielding member 140 can be a black matrix (BM) for separating different sub-pixels and preventing light crosstalk. The color filter 150 includes at least red (R), green (G), and blue (B) colors, corresponding to different sub-pixel regions, respectively.

[0046] In step S300, the region where the light shielding member 140 and the color filter 150 are located is irradiated by laser M, so that the color filter 150 obtains double curing energy: part of the energy directly comes from the laser M absorbed by itself; and the other part of the more major energy comes from the heat energy converted and transmitted by the light shielding member 140 after absorbing the laser M. The heat energy promotes the curing of the color filter 150 which is closely adjacent to it. This mechanism ensures that the color filter 150 can be fully and effectively cured. At the same time, since the laser M energy is mainly absorbed and converted by the light shielding member 140, and the heat energy transmission range is limited, the heat impact on the light-emitting functional layer 120 below is minimized, thereby achieving effective curing of the color filter 150 while protecting the material of the organic light-emitting layer in the heat-sensitive light-emitting functional layer 120.

[0047] In some embodiments, the laser M is irradiated at an inclined angle relative to the surface of the encapsulation layer 130. At the same time, the size and position of the light shielding member 140 are designed to completely block the directly incident laser M, so that it cannot directly irradiate the light-emitting functional layer 120 below, achieving physical light isolation.

[0048] For example, as shown in Figure 12 , the angle between the laser M irradiation direction and the surface of the encapsulation layer 130 is α, the height of the light shielding member 140 is h, and the distance between two adjacent light shielding members 140 (i.e. the sub-pixel opening width) is L, which satisfy the geometric relationship: . Among them, the maximum angle α of laser M irradiation satisfies . This condition ensures that the light rays of the laser M incident at this inclined angle α will be completely blocked by the side wall of the light shielding member 140, thereby providing reliable protection for the light-emitting functional layer 120 below.

[0049] It can be understood that the laser M used can be a pulsed laser or a continuous laser, and the wavelength can be selected in the near-infrared region (such as 808 nm, 850 nm, 940 nm).

[0050] Among them, referring to Figure 2 , the step S200 and the step of forming the patterned light shielding member 140 on the encapsulation layer 130 include:

[0051] S210, coating a light shielding material on the encapsulation layer 130.

[0052] S220 is used to perform the first curing treatment on the coated light-shielding material to form a pre-cured light-shielding material layer.

[0053] S230, patterning the pre-cured light-shielding material layer to form a patterned light-shielding element 140.

[0054] S240, the patterned light-shielding component 140 is irradiated with laser M to cause the light-shielding component 140 to undergo a second curing.

[0055] The light-blocking material can be a black light-blocking material (such as black glue), which can be pre-cured at a low temperature of 80℃ (first curing) to initially set its shape. The patterning process can include exposure and development processes; that is, the pre-cured light-blocking material is used to form a patterned light-blocking part 140 through processes such as exposure and development.

[0056] Understandably, firstly, the low-temperature pre-curing at 80℃ (first curing) provides the necessary mechanical support for subsequent patterning processes such as exposure and development, while ensuring the safety of the heat-sensitive lower light-emitting functional layer 120. Secondly, the laser M irradiation after patterning can localize the energy to the light-shielding component 140 itself, achieving complete curing and stabilization of its material. This endows the light-shielding component 140 with excellent photothermal conversion characteristics, making it an efficient and controllable point heat source for the subsequent curing of adjacent color filter 150. On the other hand, it also reduces the risk of damage to the light-emitting device caused by the overall high-temperature baking process in related technologies. Thus, while ensuring the reliability of the entire process, it significantly broadens the range of material selection and improves process compatibility.

[0057] See Figure 3 and Figure 4 As shown, in step S240, the light-shielding member 140 can be irradiated twice symmetrically with laser M. For example, the step of irradiating the patterned light-shielding member 140 with laser M includes:

[0058] Step S241: Perform the first irradiation at the first tilt angle.

[0059] Step S242: Perform a second irradiation at a second tilt angle.

[0060] Wherein, both the first tilt angle and the second tilt angle are related to the laser M irradiation tilt angle α defined above (i.e., satisfying...). The same or substantially the same, and the irradiation direction of the first laser M irradiation and the irradiation direction of the second laser M irradiation are symmetrical relative to the normal direction of the light shielding piece 140. That is, the laser M can be symmetrically irradiated to the light shielding piece 140 from two directions with the same, controlled inclination angle a. It can ensure that both opposite side walls of the light shielding piece 140 can be fully irradiated and uniformly absorbed by the laser M, thereby obtaining consistent heating and curing effect, reducing the curing unevenness or thermal stress problems caused by unilateral irradiation, while strictly maintaining the shielding protection of the light shielding piece 140 to the underlying light-emitting functional layer 120.

[0061] Referring to Figure 5 As shown, after the preparation of the above-mentioned light shielding piece 140 is completed, each color filter color resist 150 is prepared and cured in turn, which includes the following steps:

[0062] Step S250, coating the filter color resist 150 material on the encapsulation layer 130.

[0063] Step S260, performing first curing treatment on the coated filter color resist 150 material to form a layer of pre-cured filter color resist 150 material.

[0064] Step S270, performing patterning treatment on the layer of pre-cured filter color resist 150 material to form a patterned filter color resist 150, which is located in the area between the light shielding pieces 140 and is arranged adjacent to the light shielding pieces 140.

[0065] Step S280, performing laser M irradiation on the light shielding piece 140 and the patterned filter color resist 150 adjacent thereto.

[0066] Wherein, when performing laser M irradiation, the laser M is irradiated in a direction with an inclination angle relative to the surface of the encapsulation layer 130, and the heat energy generated by the light shielding piece 140 absorbing the laser M energy promotes the curing of the filter color resist 150.

[0067] For example, taking the red (R) color resist as an example:

[0068] First, the red filter color resist 150 material is coated in the corresponding sub-pixel area defined by the light shielding member 140. Subsequently, the coated material is subjected to a low-temperature pre-curing (first curing) treatment (for example, at 80°C), forming a pre-cured red filter material layer. Next, the pre-cured layer is processed through a patterning process such as exposure and development, thereby forming a patterned red color resist located in the area between the light shielding members 140 and arranged adjacent to the light shielding members 140. Then, the light shielding member 140 and the patterned red color resist adjacent thereto are subjected to laser M irradiation. During this irradiation, the laser M is irradiated at an oblique angle with respect to the surface of the encapsulation layer 130. Part of the laser M energy is absorbed by the light shielding member 140, and the heat generated thereby is conducted to the adjacent red color resist through the sidewall; another part of the laser M can also directly act on the surface of the color resist. The two work together to cause the red color resist to be fully cured, and the light shielding member 140 effectively blocks the thermal influence of the laser M on the area below. The green (G) and blue (B) color resists can be prepared and cured in sequence according to the same step sequence (coating of the corresponding material, low-temperature pre-curing, patterning, laser M irradiation), and finally the light shielding member 140 and each filter color resist 150 are prepared, as shown in Figure 8

[0069] It can be understood that, by introducing the low-temperature pre-curing step, the filter material only needs to be subjected to mild heat treatment during the patterning stage, thereby reducing the risk of thermal damage to the underlying light-emitting functional layer 120 caused by the high-temperature baking process in the related art during the patterning process; at the same time, the laser M irradiation is used as a curing means, and the already cured light shielding member 140 is used as an efficient heat absorber and directional heat source, so that the curing energy can be highly concentrated and accurately delivered, not only ensuring the sufficient and uniform curing of the filter color resist 150 itself, but also strictly limiting the diffusion of heat to the light-emitting functional layer 120 through the physical shielding effect of the light shielding member 140, thereby achieving precise local thermal management during the curing process. That is, while ensuring high-quality curing of the filter layer, the requirement for the overall thermal budget of the device is significantly reduced, thereby widening the range of filter materials that can be selected (for example, conventional high-temperature curing materials), and improving the compatibility and reliability of the entire process flow for heat-sensitive devices.

[0070] Referring to Figure 6 and Figure 7 , in step S280, the step of irradiating the light shielding member 140 and the filter color resist 150 adjacent thereto with laser M includes:

[0071] Step S281, first laser M irradiation at a third oblique angle.

[0072] Step S282, second laser M irradiation at a fourth oblique angle.

[0073] ​wherein the third and fourth inclination angles are the same or substantially the same as the aforementioned defined laser M irradiation inclination angle a (i.e. the angle satisfying the relationship, and the irradiation direction of the first laser M irradiation is symmetrical to the irradiation direction of the second laser M irradiation with respect to the normal direction of the light shielding member 140. That is, the laser M can symmetrically irradiate the light shielding member 140 from two directions with the same, controlled inclination angle a.

[0074] It can be understood that the adoption of twice symmetrical inclined laser M irradiation can achieve more sufficient and uniform solidification of the color filter color resist 150. On the one hand, the direct irradiation of the laser M can provide solidification energy for the color filter color resist 150 itself; on the other hand, the irradiation simultaneously heats the adjacent light shielding member 140, so that it converts the light energy into heat energy and effectively transfers the heat energy to the side wall of the color filter color resist 150. The double action mechanism combining direct and indirect heating can significantly enhance the heating effect of the color filter color resist 150 and the side wall of the joint area with the light shielding member 140 through the directional heat transfer of the light shielding member 140 to the adjacent interface of the color filter color resist 150, so as to ensure that the solidification quality of the key interface position is more complete and reliable, and further improve the solidification uniformity and structural stability of the color filter color resist 150 as a whole.

[0075] In addition, the two-step method of pre-solidification and final solidification of the laser M effectively isolates the thermal risk. The patterning step can be completed after low-temperature pre-solidification, and the thermal effect on the underlying light-emitting functional layer 120 is minimal. All subsequent higher heat input (from the laser M) is applied to the local part of the formed pattern, which reduces the overall heating of the OLED through the physical shielding of the light shielding member 140 and the design of the heat conduction path.

[0076] Secondly, referring to FIGS. 1A and 1B, Figure 4 or Figure 7 It can be understood that the adoption of twice symmetrical inclined laser M irradiation can achieve more sufficient and uniform solidification of the color filter color resist 150. On the one hand, the direct irradiation of the laser M can provide solidification energy for the color filter color resist 150 itself; on the other hand, the irradiation simultaneously heats the adjacent light shielding member 140, so that it converts the light energy into heat energy and effectively transfers the heat energy to the side wall of the color filter color resist 150. The double action mechanism combining direct and indirect heating can significantly enhance the heating effect of the color filter color resist 150 and the side wall of the joint area with the light shielding member 140 through the directional heat transfer of the light shielding member 140 to the adjacent interface of the color filter color resist 150, so as to ensure that the solidification quality of the key interface position is more complete and reliable, and further improve the solidification uniformity and structural stability of the color filter color resist 150 as a whole.

[0077] In addition, the order of the four irradiations produces a cumulative and synergistic effect. The first two irradiations cause the light-shielding member 140 to be thoroughly and uniformly cured into a high-efficiency heat source with stable performance. When the last two irradiations are applied to the color filter resist 150, the laser M energy not only acts directly on the color filter resist, but is also efficiently absorbed by this already optimized adjacent light-shielding member 140 and uniformly conducted to the entire sidewall interface of the color filter resist from both sides. This ensures that the color filter resist, especially the critical and usually difficult-to-fully-cure edge region combined with the light-shielding member 140, can achieve a deep and uniform curing from the interface to the bulk, thereby greatly improving the overall densification, adhesion, and optical reliability of the color filter layer.

[0078] That is, the first two laser M irradiations lay a foundation for efficient heat conduction for the last two, and the last two make full use of this foundation to achieve interface-enhanced curing. The entire process realizes the curing effect of the upper color filter layer under the premise of absolutely safe lower light-emitting functional layer 120.

[0079] In another embodiment, as shown in FIGS. 1A and 1B, the method comprises the following steps: Figure 9 and Figure 10 When forming the encapsulation layer 130, the method comprises:

[0080] Step S110: Forming a first inorganic encapsulation layer 131 on the light-emitting functional layer 120.

[0081] Step S120: Forming an organic encapsulation layer 132 on the first inorganic encapsulation layer 131.

[0082] Step S130: Performing a patterning process on the organic encapsulation layer 132 to form a recessed portion 133 in the region corresponding to the light-shielding member 140.

[0083] Step S140: Forming a second inorganic encapsulation layer 134 on the organic encapsulation layer 132 with the recessed portion 133.

[0084] The first inorganic encapsulation layer 131 can be made of a dense barrier material such as silicon nitride (SiNx) or silicon oxide (SiO2). The organic encapsulation layer 132 is then coated on the first inorganic encapsulation layer 131, for example, an acrylic resin with high light transmittance and easy film formation, or an organic silicon resin with better flexibility and thermal stability. After curing the organic encapsulation layer 132, a certain depth of recess 133 is formed in the corresponding area where the light shielding member 140 needs to be formed by a patterning process such as photolithography, imprinting or laser M ablation, and the depth is usually not more than half of the total thickness of the organic encapsulation layer 132 (for example, the depth of the recess 133 is 5 μm) to ensure that the overall encapsulation effect is not affected. Then, the second inorganic encapsulation layer 134 is deposited, for example, SiNx or SiO2, thereby obtaining a complete encapsulation layer 130 with a regular recess structure on the surface. When the light shielding member 140 is prepared on this structure, the light shielding material will fill the recess 133. This allows the effective height of the light shielding member 140 to be increased to h2 (h2 > h) while keeping the top surface of the light shielding member 140 flush with the top surface of the filter color resist 150. Recall the relationship With the fixed sub-pixel pitch L, a larger h2 allows a larger laser M tilt angle a2 (i.e. a2 > a1 in the figure, a1 is the maximum angle of laser irradiation without recess), thereby improving the utilization efficiency of laser M energy, the irradiation coverage and the process alignment tolerance.

[0085] In other embodiments, referring to Figure 12 In the steps of forming the patterned light shielding member 140 and the patterned filter color resist 150 on the encapsulation layer 130, the patterned light shielding member 140 and the patterned filter color resist 150 are subjected to a pre-curing process, respectively. The step of absorbing laser M energy and generating heat energy in the light shielding member 140 by laser M irradiation is performed after the pre-curing process of the light shielding member 140 and the filter color resist 150 is completed.

[0086] The complete curing steps of the light shielding member 140 and the filter color resist 150 are unified to the last stage. The steps include:

[0087] First, referring to Figure 12As shown, patterned light-shielding elements 140 and patterned color filter color resists of all types (such as R, G, B) are sequentially fabricated on the encapsulation layer 130. This process includes pre-curing the light-shielding elements 140 and the color filter color resists 150 respectively. Subsequently, after the light-shielding elements 140 and all color filter color resists 150 have completed the pre-curing process, the light-shielding elements 140 and all color filter color resists 150 are finally cured together through a unified laser M irradiation step. The unified laser M irradiation step includes two tilted laser M irradiations. The irradiation directions of these two laser M irradiations are symmetrical about the normal of the light-shielding elements 140, and their irradiation tilt angles are the same as the tilt angle α defined in the aforementioned embodiment, that is, satisfying the condition... The relationship is shown in the diagram (where h is the height of the light-shielding component 140 and L is the distance between adjacent light-shielding components 140). During this irradiation process, the light-shielding component 140 absorbs the heat energy generated by the laser M and transfers it to all adjacent color resists, causing them to cure synchronously. This two symmetrical irradiations, while meeting the safety conditions of a uniform angle, ensure the high uniformity of heating and curing on both sides of the light-shielding component 140 and among each adjacent color resist. This process integrates multiple independent curing steps into a single symmetrical irradiation process that satisfies specific geometric relationships, significantly improving production efficiency while ensuring curing quality and the safety of underlying devices.

[0088] In other embodiments, to enhance the absorption efficiency of the light-shielding element 140 for laser M energy, microstructures can be constructed on its surface (e.g., sidewalls or top surface), such as by etching to form rough textures, groove arrays, or wrinkles. These structures can increase the optical path and absorption area, thereby improving photothermal conversion efficiency. Similarly, micromorphologies that facilitate light scattering or heat conduction can be designed on the surface of the color filter 150 or at the contact interface with the light-shielding element 140 to improve the uniformity and efficiency of heat transfer from the light-shielding element 140 to the color filter.

[0089] In other embodiments, a heating resistor (not shown in the figure) made of a transparent conductive material such as indium tin oxide (ITO) can be integrated inside or on the surface of the encapsulation layer 130. This resistor is arranged in a manner that combines optical and thermal design, and can be achieved through the following methods and steps:

[0090] First, during the formation of the encapsulation layer 130, after the first inorganic encapsulation layer 131 is deposited, a continuous indium tin oxide (ITO) thin film is deposited on its surface using physical vapor deposition (such as magnetron sputtering) or chemical vapor deposition. Next, the ITO thin film is patterned using photolithography and wet / dry etching processes to form the required resistance wire arrangement pattern according to the design requirements.

[0091] The pattern can include: a grid arrangement, i.e., the resistance wire is mainly arranged in the non-opening area corresponding to the edge of the light shielding member 140 to minimize the impact on light transmission; or a surrounding arrangement, i.e., the resistance wire is precisely wired along the predetermined contour of each light shielding member 140 through high-precision photolithography, thereby concentrating the auxiliary heat to the light shielding member 140 and the adjacent color resistance interface; the resistance wire pattern can also be designed as multiple heating blocks controlled independently in different zones, and each block is connected through an independent conductive lead to realize differential temperature control of different regions. After patterning, the subsequent preparation of the organic encapsulation layer 132 and the second inorganic encapsulation layer 134 is continued, so as to embed the resistance wire inside the encapsulation layer 130 or place it on the surface thereof.

[0092] These resistance wires with micron-level line width and pitch made by the above-mentioned microfabrication process can, while ensuring high light transmittance, generate uniform and controllable auxiliary heat when irradiated by the laser M or at a specific stage by passing a small current through the external circuit. The heat can effectively make up for the insufficient energy in the area that cannot be covered by the direct laser M, so as to realize more uniform and complete curing effect in cooperation with the laser M without significantly increasing the overall thermal budget.

[0093] In still other embodiments, in order to provide a wider safety margin, a transparent thermal insulation layer (not shown in the figure) can be added at a certain position between the light-emitting functional layer 120 and the color filter layer, for example, inside the encapsulation layer 130. The thermal insulation layer can be composed of a transparent material with low thermal conductivity (for example, porous silicon dioxide, a specific polymer), which functions to further block the residual heat conducted downward from the area of the color filter layer above, providing additional protection for the heat-sensitive light-emitting functional layer 120.

[0094] Referring to Figure 8 and Figure 13 It is shown that the embodiments of the present application also provide a display panel 100 made by the above-mentioned method. The display panel 100 includes a substrate 110, a light-emitting functional layer 120 disposed on the substrate 110, an encapsulation layer 130 covering the light-emitting functional layer 120, and a color filter layer disposed on the encapsulation layer 130. The color filter layer includes patterned light shielding members 140 and multiple color filters 150 (such as R, G, and B) located between adjacent light shielding members 140.

[0095] Among them, the light shielding member 140 is designed to be able to absorb the radiant energy of a specific wave band (such as the wavelength of the above-mentioned laser M) and efficiently convert it into heat energy, and the structure of the panel ensures that the heat energy generated by the light shielding member 140 can be effectively transmitted to the adjacent color filter 150.

[0096] In some embodiments, to enhance the absorption efficiency of the light shield 140 to the laser M energy, microstructures can be constructed on the surface (e.g., sidewall or top surface) thereof, such as rough textures, groove arrays or corrugations formed by etching. These structures can increase the optical path and absorption area, thereby improving the light-to-heat conversion efficiency. Similarly, at the surface of the color filter resist 150 or the contact interface with the light shield 140, micro topographies that facilitate light scattering or heat conduction can also be designed to improve the uniformity and efficiency of heat energy transfer from the light shield 140 to the color filter resist.

[0097] In some embodiments, a heating resistor (not shown in the figure) made of a transparent conductive material such as indium tin oxide (ITO) is integrated inside or on the surface of the encapsulation layer 130, which adopts an arrangement designed in coordination with optics and thermotics: for example, arranged in a grid pattern across the entire display area, and the resistor wire is mainly arranged in the non-opening area corresponding to the edge of the light shield 140 to minimize the impact on light transmission; or arranged in a surrounding manner, so that the resistor wire is precisely routed along the contour of each light shield 140, thereby concentrating auxiliary heat to the light shield 140 and the adjacent color filter resist interface; the resistor wire can also be divided into multiple heating zones controlled independently, to achieve differential temperature control in different areas. These micrometer-level resistor wires with small line width and spacing can, while ensuring high light transmittance, pass a small current when irradiated by the laser M or at a specific stage, generating uniform and controllable auxiliary heat, effectively making up for the energy deficiency in areas that may not be covered by direct laser M irradiation, thereby achieving more uniform and complete curing effect in cooperation with the laser M without significantly increasing the overall thermal budget.

[0098] In some embodiments, a transparent thermal insulation layer (not shown in the figure) is added at a certain position between the light-emitting functional layer 120 and the color filter layer, for example, inside the encapsulation layer 130. The thermal insulation layer can be composed of a transparent material with low thermal conductivity (e.g., porous silicon dioxide, specific polymers), which functions to further block the residual heat conducted downward from the color filter layer area above, providing additional protection for the heat-sensitive light-emitting functional layer 120.

[0099] The display panel 100 preparation method and display panel 100 provided in the present application achieve local thermal management of the curing process by irradiating the light shield 140 with the laser M and utilizing the heat energy generated thereby to cure the adjacent color filter resist 150, thereby reducing the damage to the heat-sensitive light-emitting functional layer 120 below caused by the overall high-temperature baking in the related art. Secondly, by introducing oblique laser M irradiation and satisfying the specific geometric relationship The design of the encapsulation layer 130, combined with twice directionally symmetrical irradiation, not only ensures reliable optical protection of the underlying device, but also significantly improves the uniformity and completeness of the curing of the light shielding member 140 and the filter color resist 150. Furthermore, by optimizing the structure of the encapsulation layer 130 (such as setting the recess 133) to increase the effective height of the light shielding member 140, the process window of the laser M irradiation is further widened, and the energy utilization efficiency is improved. In addition, the proposed unified curing process flow and the optional integration of transparent auxiliary heating elements significantly improve the production efficiency, enhance the robustness and controllability of the process, and ensure the curing quality. Finally, while ensuring the high reliability and excellent optical performance of the display panel 100, the process thermal budget is significantly reduced, the range of optional filter materials is widened, thereby having outstanding industrial application value and cost advantage.

[0100] In the description of the present specification, the description referring to the terms "some embodiments", "exemplarily", and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are contained in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, different embodiments or examples described in the present specification and the features of different embodiments or examples can be combined and combined by those skilled in the art without contradiction.

[0101] Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application. Therefore, any changes or modifications made in accordance with the claims and specification of the present application shall be within the scope of the present application.

Claims

1. A method for manufacturing a display panel, characterized in that, include: A substrate is provided, wherein a light-emitting functional layer and an encapsulation layer covering the light-emitting functional layer are formed on the substrate; forming the encapsulation layer includes forming a first inorganic encapsulation layer on the light-emitting functional layer; forming an organic encapsulation layer on the first inorganic encapsulation layer; patterning the organic encapsulation layer to form a recess; and forming a second inorganic encapsulation layer on the organic encapsulation layer having the recess. A patterned light-shielding element and a patterned color filter are formed on the encapsulation layer. The light-shielding element is formed in the recess and is disposed adjacent to the color filter. By irradiating the light-shielding component and the color filter with a laser, the light-shielding component absorbs the laser energy and generates heat energy, which causes the adjacent color filter to solidify. The laser irradiates at an angle α relative to the surface of the encapsulation layer; the height of the light-shielding element is h, and the distance between two adjacent light-shielding elements is L, wherein α satisfies: .

2. The method for manufacturing a display panel according to claim 1, characterized in that, In the laser irradiation step, the laser irradiates at an angle relative to the surface of the encapsulation layer, and the light-shielding member is configured to block the laser irradiation onto the light-emitting functional layer.

3. The method for manufacturing a display panel according to claim 1, characterized in that, The step of forming a patterned light-shielding element on the encapsulation layer includes: A light-shielding material is coated onto the encapsulation layer; The coated light-shielding material is subjected to a first curing treatment to form a pre-cured light-shielding material layer; The pre-cured light-shielding material layer is patterned to form the patterned light-shielding component; The patterned light-shielding component is subjected to laser irradiation to cause a second curing of the light-shielding component.

4. The method for manufacturing a display panel according to claim 3, characterized in that, The step of laser irradiating the patterned light-shielding component includes: The light-shielding component is subjected to a first laser irradiation at a first tilt angle; The light-shielding component is subjected to a second laser irradiation at a second tilt angle; The irradiation direction of the first laser irradiation and the irradiation direction of the second laser irradiation are symmetrical with respect to the normal direction of the light-shielding component.

5. The method for manufacturing a display panel according to claim 1, characterized in that, The step of forming patterned color filter resist on the encapsulation layer includes: A color filter material is coated on the encapsulation layer; The coated color filter material is subjected to a first curing treatment to form a pre-cured color filter material layer. The pre-cured color filter material layer is patterned to form a patterned color filter, which is located in the area between the light-shielding elements and is disposed adjacent to the light-shielding elements. The light-shielding member and the adjacent patterned color filter are irradiated with laser light. During the laser irradiation, the laser is directed at an angle relative to the surface of the encapsulation layer, and the heat generated by the absorption of laser energy by the light-shielding component causes the color filter to solidify.

6. The method for manufacturing a display panel according to claim 5, characterized in that, The step of laser irradiating the light-shielding member and the adjacent patterned color filter includes: The first laser irradiation was performed at the third tilt angle; A second laser irradiation is performed at the fourth tilt angle; The directions of the first and second laser irradiations are symmetrical with respect to the normal direction of the light-shielding component.

7. The method for manufacturing a display panel according to claim 1, characterized in that, The step of forming a patterned light-shielding element and a patterned color filter on the encapsulation layer includes pre-curing the patterned light-shielding element and the patterned color filter respectively. Furthermore, the step of causing the light-shielding component to absorb laser energy and generate heat energy by laser irradiation is performed after both the light-shielding component and the color filter have completed pre-curing treatment, by irradiating the light-shielding component and the color filter together with laser.

8. A display panel manufactured using the method for manufacturing a display panel according to any one of claims 1 to 7, characterized in that, include: substrate; A light-emitting functional layer is disposed on the substrate; An encapsulation layer that covers the light-emitting functional layer; A color filter layer is disposed on the side of the encapsulation layer away from the substrate, and the color filter layer includes a light-shielding element and a color filter element located between adjacent light-shielding elements; The light-shielding element is configured to absorb laser energy and generate heat, and the heat generated by the light-shielding element can be transferred to the adjacent color filter.

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