Three-point positioning type wafer clamping finger

Abstract

The invention discloses a three-point positioning type wafer clamping finger which comprises a pair of clamping jaws, and an upper clamping seat and a guide mechanism are arranged on the pair of clamping jaws. And a height supporting lower clamping seat and a horizontal supporting lower clamping seat are respectively arranged on the pair of clamping jaws. The clamping jaw comprises a connecting part and a mounting part which are integrally formed, and a mounting hole is formed in the connecting part and used for being connected with driving equipment. Due to the fact that conventional clamping can be kept stable only through three points, horizontal positioning and height positioning of the wafer are both in a three-point mode through the arrangement of the lower clamping blocks which are asymmetrical in the left-right direction, and the clamping structure arranged in this way is lower in cost. If the clamping finger is designed into a symmetrical structure which is the same as that of the upper clamping block, the whole device needs higher precision, and the manufacturing cost of the clamping finger is sharply increased. And the guide columns are arranged, so that the influence caused by the flying-out of the wafer when the clamping fails can be effectively prevented.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer processing, in particular to a three-point positioning type wafer clamping finger. BACKGROUND

[0002] At present, the clamping fingers of the atmospheric clamping manipulator in China are usually divided into three parts, namely, a finger, an upper clamping block and a lower clamping block. A threaded hole is designed on the finger, and the upper clamping block and the lower clamping block are connected with the finger by means of a screw. The upper clamping block and the lower clamping block are designed in a certain geometric relationship, so that they can clamp the wafer between the upper clamping block and the lower clamping block. However, this kind of clamping finger has several problems.

[0003] Firstly, the finger of the atmospheric clamping manipulator usually adopts ceramic as the base material. The threaded hole processed by ceramic has a poorer effect than other metals such as stainless steel and aluminum alloy. Moreover, due to the product appearance, the threaded connection on the ceramic finger cannot use threaded fastening glue for anti-loosening, which may cause the screw to loosen and other adverse conditions once the threaded hole on the ceramic finger is processed incorrectly. Secondly, the atmospheric clamping manipulator does not consider the clamping failure. In actual production, various hardware and software problems may cause the atmospheric clamping manipulator to fail to clamp the wafer. If there is no safety measure, the wafer may fly out and break in the production equipment, which may affect the production efficiency or even damage the equipment. Thirdly, some existing wafer clamping devices adopt a four-point clamping method, which requires each clamping component to have very high precision. However, this design significantly increases the production cost. Finally, in the clamping process, the clamping block needs a slope to ensure that the wafer can climb on it. However, the existing one-piece clamping block is difficult to manufacture, which results in high cost of the part. SUMMARY

[0004] The present application aims to provide a three-point positioning type wafer clamping finger to achieve stable clamping effect of the wafer under the premise of three-point positioning support.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a three-point positioning type wafer clamping finger, comprising a pair of clamping jaws, a pair of clamping jaws being provided with an upper clamping seat and a guide mechanism; a pair of clamping jaws are further respectively provided with a height support lower clamping seat and a horizontal support lower clamping seat.

[0006] Preferably, the clamping jaw comprises an integral connecting part and a mounting part, the connecting part is provided with a mounting hole, and the mounting hole is used for connecting with a driving device; the upper clamping seat, the guide mechanism, the height support lower clamping seat and the horizontal support lower clamping seat are all arranged on the mounting part.

[0007] Preferably, the upper clamping seat comprises a first upper clamping block and a second upper clamping block, a clamping block groove is formed in the mounting portion, the first upper clamping block is fixed in the clamping block groove, and the contact surface of the first upper clamping block with the wafer is an inclined surface; a second clamping block groove is formed in the first upper clamping block, and the second upper clamping block is fixed in the second clamping block groove.

[0008] Preferably, a plurality of first upper clamping blocks are provided, and the inclined surfaces of the first upper clamping blocks are of different slopes.

[0009] Preferably, a plurality of second upper clamping blocks are provided, and each second upper clamping block is of different thickness.

[0010] Preferably, a first screw is further provided, the first upper clamping block is fixed in the clamping block groove through the first screw, and the second upper clamping block is fixed in the second clamping block groove through the first screw.

[0011] Preferably, the guide mechanism comprises a guide column and a fourth screw, a guide hole is formed in the mounting portion, and the fourth screw is screwed with the guide column through the guide hole.

[0012] Preferably, the height supporting lower clamping seat comprises a first lower clamping block and a second screw, the contact surface of the first lower clamping block with the wafer is an inclined surface, and the first lower clamping block is fixed in the mounting portion through the second screw.

[0013] Preferably, the horizontal supporting lower clamping seat comprises a second lower clamping block and a third screw, the contact surface of the second lower clamping block with the wafer is a right angle, and the second lower clamping block is fixed in the mounting portion through the third screw.

[0014] The application also provides an operating method of the three-point positioning type wafer clamping finger, the connecting portions of the two clamping jaws are connected with the symmetrically arranged driving devices to realize clamping of the wafer; the first upper clamping blocks of different slopes and the second upper clamping blocks of different thicknesses are adjusted as required during the clamping process; the two first upper clamping blocks and the first lower clamping blocks position the wafer in height during the clamping process; the two second upper clamping blocks and the second lower clamping blocks position the wafer horizontally to ensure stability of the entire clamping process; and the guide column prevents the wafer from flying out when the clamping fails during the process.

[0015] Compared with the prior art, the application has the following beneficial effects: Since conventional clamping only needs three points to maintain stability, the horizontal positioning and height positioning of the wafer are both three-point type by arranging the left and right asymmetric lower clamping blocks, so that the clamping structure is lower in cost. If the clamping structure is designed to be the same symmetric structure as the upper clamping blocks, the entire device needs higher precision, which will cause a sharp increase in the manufacturing cost of the clamping finger. The guide column can effectively prevent the wafer from flying out when the clamping fails.

[0016] By setting the detachable first upper clamping block and the second upper clamping block, the stable clamping effect for different models of wafers can be met by replacing the first upper clamping block with different slopes and the second upper clamping block with different thicknesses while ensuring that they can be replaced at any time and reducing processing costs. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-point positioning type wafer clamping finger structure of the present application.

[0018] Figure 2 It is a schematic diagram of the upper clamping seat structure of the present application.

[0019] Figure 3 It is a schematic diagram of the guide mechanism structure of the present application.

[0020] Figure 4 It is a schematic diagram of the lower clamping seat structure of the present application.

[0021] 1, jaw; 11, connecting part; 12, mounting part; 2, upper clamping seat; 21, first upper clamping block; 22, second upper clamping block; 23, first screw; 3, guide mechanism; 31, guide column; 32, fourth screw; 4, height support lower clamping seat; 41, first lower clamping block; 42, second screw; 5, horizontal support lower clamping seat; 51, second lower clamping block; 52, third screw. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0023] Please refer to Figures 1-4 The present application provides a technical solution: a three-point positioning type wafer clamping finger, comprising a pair of jaws 1, a pair of said jaws 1 is provided with an upper clamping seat 2 and a guide mechanism 3, and a pair of said jaws 1 is also respectively provided with a height support lower clamping seat 4 and a horizontal support lower clamping seat 5. The height support lower clamping seat 4 and the horizontal support lower clamping seat 5 are different in structure, so as to cooperate with a pair of upper clamping seats 2 with the same structure to realize three-point height support and horizontal support respectively.

[0024] The jaw 1 comprises an integrally formed connecting part 11 and a mounting part 12, the connecting part 11 is provided with a mounting hole, and the mounting hole is used for connecting with a driving device.

[0025] As Figure 1As shown, the side edges of the mounting portion 12 are close to each other to form a V-shaped structure, so that the upper end of the mounting portion 12 is narrow, which can ensure the use of the clamping fingers.

[0026] The upper clamping seat 2 includes a first upper clamping block 21 and a second upper clamping block 22. The mounting portion 12 is provided with a clamping block groove, and the first upper clamping block 21 is fixed in the clamping block groove. The first upper clamping block 21 is provided with a second clamping block groove, and the second upper clamping block 22 is fixed in the second clamping block groove. Such a design only needs to leave a clamping block groove on the clamping jaw 1, without the need for thread processing, thereby avoiding the error of processing threads on ceramic parts.

[0027] The first upper clamping block 21 is provided with a plurality of inclined surfaces, and the contact surface of the first upper clamping block 21 with the wafer is an inclined surface. The inclined surfaces of the first upper clamping blocks 21 have different slopes. The second upper clamping block 22 is provided with a plurality of second upper clamping blocks 22, and each second upper clamping block 22 has a different thickness.

[0028] The slopes of the inclined surfaces of the first upper clamping blocks 21 and the thicknesses of the second upper clamping blocks 22 are set in a ratio, so that the operator can select according to actual needs, and the wafer can be more finely supported.

[0029] The first upper clamping block 21 is fixed in the clamping block groove by the first screw 23, and the second upper clamping block 22 is fixed in the second clamping block groove by the first screw 23. The first screw 23 is locked by a nut to fix the first upper clamping block 21 and the second upper clamping block 22.

[0030] The clamping block groove and the second clamping block groove can also be designed as polygons, which can cooperate with the first screw 23 to make the installation of the first upper clamping block 21 and the second upper clamping block 22 more stable, so as to cooperate with the installation of the first screw 23 to make the entire clamping process more stable.

[0031] The guide mechanism 3 includes a guide column 31 and a fourth screw 32. The mounting portion 12 is provided with a guide hole, the guide column 31 is hollow, and the fourth screw 32 is screwed with the guide column 31 through the guide hole. The guide column 31 has a shielding effect, and is arranged at the left and right ends of the pair of clamping jaws 1 to prevent the wafer from flying out along the side edge of the clamping jaw.

[0032] The height supporting lower clamping seat 4 comprises a first lower clamping block 41 and a second screw 42, the contact surface of the first lower clamping block 41 with the wafer is beveled, and the first lower clamping block 41 is fixed to the mounting portion 12 through the second screw 42.

[0033] The horizontal supporting lower clamping seat 5 comprises a second lower clamping block 51 and a third screw 52, the contact surface of the second lower clamping block 51 with the wafer is perpendicular, and the second lower clamping block 51 is fixed to the mounting portion 12 through the third screw 52.

[0034] The first upper clamping block 21 and the first lower clamping block 41 are beveled, so that the wafer can slide on the bevel during clamping, and the wafer can be supported in the height direction after clamping. The second upper clamping block 22 and the second lower clamping block 51 are vertical, so that the wafer can be supported in the horizontal direction during clamping. In this way, three-point support is formed in the height supporting direction and the horizontal clamping direction. Compared with the conventional four-point clamping mechanism, the device has a larger allowance, so that the clamping hand does not need to have very high precision, and clamping of different wafers can be completed.

[0035] As shown in Figure 1 The first upper clamping block 21, the second upper clamping block 22, the first lower clamping block 41 and the second lower clamping block 51 are all inclined to the center of the clamping finger structure, which can better match the shape of the wafer, so that the clamping effect is more firm.

[0036] The first screw 23, the second screw 42, the third screw 52 and the fourth screw 32 can be selected as cross slot countersunk screws.

[0037] The materials of the first upper clamping block 21, the second upper clamping block 22, the guide column 31, the first lower clamping block 41 and the second lower clamping block 51 are all polyether ether ketone (PEEK).

[0038] The application also provides an operation method of the three-point positioning wafer clamping finger, which is connected with the symmetrically arranged driving device through the two side clamping jaws 1 to realize clamping of the wafer. During clamping, when it is found that the slope of the wafer clamping is not suitable, the first upper clamping block 21 is adjusted, and when it is found that the height of the wafer clamping is not suitable, the second upper clamping block 22 is adjusted. This process only needs to disassemble the first screw 23 and replace different first upper clamping blocks 21 and second upper clamping blocks 22.

[0039] During clamping, the first upper clamping block 21 and the first lower clamping block 41 position the wafer in the height direction, and the second upper clamping block 22 and the second lower clamping block 51 position the wafer in the horizontal direction, so as to ensure the stability of the whole clamping process. During this process, the guide column 31 will have a shielding effect to prevent the wafer from flying out when clamping fails.

[0040] Finally, it should be noted that the above only describes the preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art will appreciate that the technical solutions described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalent features, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A three-point positioning wafer chucking finger, characterized by: The utility model relates to a wafer clamping device, including a pair of clamping jaws (1), a pair of the clamping jaws (1) are equipped with upper clamping seat (2) and guide mechanism (3); A pair of the clamping jaws (1) are also respectively provided with height support lower clamping seat (4) and horizontal support lower clamping seat (5).

2. The three-point location wafer-chucking finger of claim 1, wherein: The clamping jaw (1) includes integrally-formed connecting portion (11) and mounting portion (12), the connecting portion (11) is provided with mounting hole, and the mounting hole is used for being connected with driving equipment; The upper clamping seat (2), guide mechanism (3), height support lower clamping seat (4) and horizontal support lower clamping seat (5) are all arranged on the mounting portion (12).

3. The three-point locating wafer chucking finger according to claim 2, wherein: The upper clamping seat (2) includes first upper clamping block (21) and second upper clamping block (22), the mounting portion (12) is provided with clamping block groove, the first upper clamping block (21) is fixed in the clamping block groove, and the contact surface of the first upper clamping block (21) with the wafer is inclined surface; The first upper clamping block (21) is provided with second clamping block groove, and the second upper clamping block (22) is fixed in the second clamping block groove.

4. The three-point locating wafer chucking finger according to claim 3, wherein: The first upper clamping block (21) is provided with a plurality of, and the inclined surface of each first upper clamping block (21) is different slope.

5. The three-point locating wafer chucking finger according to claim 3, wherein: The second upper clamping block (22) is provided with a plurality of, and each second upper clamping block (22) is different thickness.

6. The three-point locating wafer chucking finger of claim 3, wherein: Further including first screw (23), the first upper clamping block (21) is fixed in the clamping block groove through the first screw (23), and the second upper clamping block (22) is fixed in the second clamping block groove through the first screw (23).

7. The three-point locating wafer chucking finger of claim 2, wherein: The guide mechanism (3) includes guide column (31) and fourth screw (32), the mounting portion (12) is provided with guide hole, and the fourth screw (32) is screwed with the guide column (31) through the guide hole.

8. The three-point locating wafer chucking finger of claim 2, wherein: The height support lower clamping seat (4) includes first lower clamping block (41) and second screw (42), the contact surface of the first lower clamping block (41) with the wafer is inclined surface, and the first lower clamping block (41) is fixed in the mounting portion (12) through the second screw (42).

9. The three-point locating wafer chucking finger of claim 2, wherein: The horizontal support lower clamping seat (5) includes second lower clamping block (51) and third screw (52), the contact surface of the second lower clamping block (51) with the wafer is right angle, and the second lower clamping block (51) is fixed in the mounting portion (12) through the third screw (52).

10. A method of operating a three-point positioning wafer chucking finger as claimed in any one of claims 1 to 9, characterized in that: By connecting the connecting portion (11) of the clamping jaw (1) on both sides with the symmetrically arranged driving device, the wafer is clamped; During clamping, the first upper clamping block (21) with different slopes and the second upper clamping block (22) with different thicknesses are adjusted as required; During clamping, the first upper clamping block (21) and the first lower clamping block (41) position the wafer in height, and the second upper clamping block (22) and the second lower clamping block (51) position the wafer horizontally, ensuring the stability of the entire clamping process; During the process, the guide column (31) prevents the wafer from flying out when clamping fails.

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