Cutting tool and manufacturing method thereof

Abstract

The invention provides a cutting tool and a manufacturing method of the cutting tool. The cutting tool comprises a cutting edge part located on the outer edge and a fixing part located in the center. The blade part comprises a binding agent and abrasive particles, the binding agent binds and fixes the abrasive particles embedded in the binding agent to form a grinding layer, and the grinding layer is used for cutting a part to be cut; the fixing part comprises a fiber structure and a binding agent, the fiber structure is added into the binding agent, the fiber structure and the binding agent are combined to form the fixing part, and the fixing part is used for fixing the cutting tool on the cutting equipment. According to the cutting tool, the cutting edge part and the fixing part are made of different materials, the cutting edge part comprises the binding agent and the abrasive particles, and the abrasive particles are embedded and fixed into the binding agent; the fixing part is formed by combining the fiber structure and the binding agent, the fiber structure is added into the binding agent and fixed, the overall stability of the cutting tool is improved, and deflection or distortion of the cutting tool in the cutting process can be effectively avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of cutting tools, in particular to a cutting tool, and also relates to a manufacturing method of the cutting tool. BACKGROUND

[0002] At present, the cutting of semiconductor wafers or semiconductor packages is mainly through radiation energy cutting and tool cutting. For example, the radiation energy cutting is cutting through laser, and the laser cutting is non-contact cutting. When the laser is used to cut the semiconductor wafer, the laser energy obtains high energy density through optical focusing, and directly gasifies the semiconductor wafer along the cutting track of the semiconductor wafer, so as to separate the dies on the surface of the semiconductor wafer. However, due to the high cost of laser cutting equipment, its wide use is hindered.

[0003] The tool cutting is a commonly used cutting process in the field of semiconductor wafers and packages. This method directly separates each die on the wafer by applying mechanical force along the predetermined cutting track on the wafer surface through the cutting tool. However, in the actual cutting process, due to the insufficient strength of the cutting tool, the cutting tool is prone to deflection or distortion at high speed, which leads to deviation of the cutting path, rough cutting, and even causes die edge collapse or micro-cracks and other defects, affecting the cutting precision and product yield.

[0004] Therefore, how to strengthen the strength of the cutting tool to avoid the deflection or distortion of the cutting tool during the cutting process has become a technical problem to be solved. SUMMARY

[0005] The present application provides a cutting tool to solve the technical problem of how to strengthen the strength of the cutting tool to avoid the deflection or distortion of the cutting tool. The present application also provides a manufacturing method of the cutting tool.

[0006] The present application provides a cutting tool, comprising: a cutting edge part located at an outer edge and a fixing part located at a center; The cutting edge part comprises a binder and abrasive grains, the binder combines and fixes the abrasive grains embedded therein to form an abrasive layer, and the abrasive layer is used for cutting a component to be cut; The fixing part comprises a fiber structure and the binder, the fiber structure is added in the binder and combined with each other to form the fixing part, and the fixing part is used for fixing the cutting tool on a cutting device.

[0007] Optionally, the fiber structure comprises a fiber web and / or cut fiber.

[0008] Optionally, the fiber web is a single-layer structure or a multi-layer structure.

[0009] Optionally, the fiber diameter of the fiber web is in a range of 0.1-50 µm, inclusive.

[0010] Optionally, the line distance of the fiber web is in a range of 30-500 µm, inclusive.

[0011] Optionally, the fiber diameter of the cut fiber is in a range of 0.1-50 µm, inclusive.

[0012] Optionally, the fiber aspect ratio of the cut fiber is in a range of 100:1-5000:1, inclusive.

[0013] Optionally, the cut fiber is formed by cutting a glass fiber yarn, and the length of the cut fiber is in a range of 0.03-5.0 mm, inclusive.

[0014] Optionally, the material of the fiber web or the cut fiber comprises at least one of carbon fiber, graphite fiber, glass fiber, ceramic fiber, or a combination thereof.

[0015] Optionally, the binder is a metal binder.

[0016] Optionally, the material of the metal binder comprises at least one of copper alloy, tin alloy, titanium alloy, aluminum alloy, nickel alloy, stainless steel, silver alloy, or a combination thereof.

[0017] Optionally, the material of the metal binder comprises at least one of silver, tin, titanium, copper, or a combination thereof.

[0018] Optionally, the abrasive particles embedded in the binder are fixedly combined, including that the abrasive particles are located within the binder, and / or the abrasive particles protrude the surface of the binder.

[0019] Optionally, the material of the abrasive particles comprises at least one of diamond, cubic boron nitride, boron carbide, silicon carbide, aluminum oxide, tungsten carbide, or a combination thereof.

[0020] Optionally, the particle size of the abrasive particles is in a range of 0.5-80 µm, inclusive, or in a range of 0.1-100 µm, inclusive.

[0021] Optionally, the area percentage of the abrasive particles in the binder in the blade portion is in a range of 20%-70%, inclusive.

[0022] Optionally, the fixed portion further comprises abrasive particles added in the binder.

[0023] Optionally, the volume percentage of the abrasive grains in the cutting edge portion is greater than or equal to the volume percentage of the abrasive grains in the fixed portion.

[0024] Optionally, the volume percentage of the abrasive grains in the cutting edge portion is greater than or equal to the volume percentage of the abrasive grains in the fixed portion.

[0025] Optionally, the cutting edge portion further comprises lubricating particles embedded in the binder for forming a lubricating film during cutting.

[0026] Optionally, the lubricating particles are solid, and the solid lubricating particles comprise at least one of molybdenum sulfide, cubic boron nitride, mica, talc, or a combination thereof.

[0027] Optionally, the particle size of the solid lubricating particles is in a range of 0.5-200 μm, inclusive, or in a range of 0.1-100 μm, inclusive.

[0028] Optionally, the volume percentage of the solid lubricating particles in the cutting edge portion is in a range of 5-25%, inclusive.

[0029] Optionally, the fixed portion is in a ring structure, and the cutting edge portion is annularly arranged around and fixed outside the ring structure.

[0030] Optionally, the center of the ring structure is provided with a mounting hole for fixing the cutting tool on a rotating shaft of the cutting device.

[0031] Optionally, the cutting edge portion and the fixed portion are integrally formed by hot-press sintering.

[0032] Optionally, the cutting tool is applied to cutting of a semiconductor wafer, and the thickness of the cutting tool is in a range of 0.05-0.2 mm, inclusive.

[0033] Optionally, the cutting tool is applied to cutting of a semiconductor package, and the thickness of the cutting tool is in a range of 0.2-0.5 mm, inclusive.

[0034] The application further provides a manufacturing method of a cutting tool, comprising: In the green body stage, the fiber web and / or cut fiber and the binder are pre-placed in the corresponding fixed portion of a mold, and the binder and the abrasive grains are pre-placed in the corresponding cutting edge portion of the mold, and a preset pressure is applied to form a green body with a preset shape; In the sintering stage, the green body is heated to a preset temperature, so that the cutting edge portion forms an abrasive layer, and the fiber web and / or cut fiber in the fixed portion forms a fiber structure.

[0035] Optionally, the binding agent is a metal binding agent.

[0036] Compared with the prior art, the present application has the following advantages: The present application provides a cutting tool, which comprises a cutting edge part at an outer edge and a fixing part at a center; the cutting edge part comprises a binding agent and abrasive grains, the binding agent binds and fixes the abrasive grains embedded therein to form an abrasive layer, the abrasive layer is used for cutting a part to be cut; the fixing part comprises a fiber structure and the binding agent, the fiber structure is added in the binding agent and is combined with each other to form the fixing part, the fixing part is used for fixing the cutting tool on a cutting device.

[0037] The present application provides a cutting tool, which comprises a cutting edge part at an outer edge and a fixing part at a center, and the cutting edge part and the fixing part are made of different materials; specifically, the cutting edge part comprises a binding agent and abrasive grains, the abrasive grains are embedded and fixed in the binding agent, and the abrasive grains realize a cutting function; and the fixing part is formed by combining a fiber structure and the binding agent with each other, the fiber structure is added in the binding agent and is fixed, the fiber structure has very high tensile strength, can effectively resist centrifugal force, and increases structural integrity and overall strength of the cutting tool, so that deformation and vibration during high-speed rotation can be reduced, and deviation or distortion of the cutting tool during cutting can be effectively prevented. BRIEF DESCRIPTION OF DRAWINGS

[0038] Figure 1 FIG. 1 is a structural schematic diagram of a cutting tool provided by an embodiment of the present application.

[0039] Figure 2 FIG. 2 is a sectional view of FIG. 1. Figure 1

[0040] Figure 3 FIG. 3 is a partial enlarged view of FIG. 2. Figure 1

[0041] Figure 4 FIG. 4 is a sectional view of another cutting tool provided by an embodiment of the present application.

[0042] REFERENCE SIGNS: 10: cutting edge part; 20: fixing part; 201: mounting hole; A: abrasive grain; B: binding agent; C: fiber structure; D: lubricating particle. DETAILED DESCRIPTION

[0043] ​​In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced without the specific details. In other instances, well-known methods have not been described in detail in order not to unnecessarily obscure aspects of the present application.

[0044] In the description of the present application, it needs to be understood that the terms "upper", "lower", "left", "right", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0045] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0046] In the related art, the cutting tool cutting is a commonly used cutting process in the semiconductor wafer or semiconductor package, which directly acts on the cutting track of the semiconductor wafer by mechanical force to separate the dies on the surface of the semiconductor wafer. However, in the actual cutting process, the cutting tool is easy to cause the cutting tool to deflect or twist, which leads to the deviation of the cutting path, the roughness of the cutting, and even causes the die to collapse or micro-cracks, etc. Defects, affecting the cutting precision and product yield.

[0047] Therefore, the present application provides a cutting tool, which comprises a cutting edge part at the outer edge and a fixing part at the center. The cutting edge part comprises a binder and abrasive grains, the binder fixes the abrasive grains embedded therein to form an abrasive layer for cutting the component to be cut. The fixing part comprises a fiber structure and the binder, the fiber structure is added to the binder and is combined with each other to form the fixing part, and the fixing part is used to fix the cutting tool on the cutting equipment.

[0048] It can be understood that the cutting tool in the present application comprises a cutting edge part at the outer edge and a fixing part at the center, that is, the cutting tool is a double-ring structure, and the materials of the inner and outer rings are different (the materials of the cutting edge part and the fixing part are different). The fixing part at the center comprises a fiber structure and a binder, the cutting edge part at the outer edge comprises abrasive grains and a binder, and the fiber structure can improve the integrity and overall strength of the cutting tool, and can avoid the deflection or twisting of the cutting tool to ensure the stability and accuracy of the cutting process.

[0049] Next, the structure of the cutting tool will be described in detail in combination with the relevant drawings.

[0050] Figure 1 is a structural schematic diagram of a cutting tool provided by the embodiment of the present application. Figure 2 is Figure 1 a sectional view. Figure 3 is Figure 1 a partial enlarged view. Figure 4 is a sectional view of another cutting tool provided by the embodiment of the present application.

[0051] The embodiment of the present application provides a cutting tool, which is a cutting tool used in a "wafer slicing" process, and thus can also be referred to as a wafer slicing tool. As shown in Figures 1-4 , the typical shape of the cutting tool described in the embodiment is a thin circular ring, but other shapes are not excluded, for example, a sawtooth shape in a ring shape, or other shapes according to needs. For the present application, more emphasis is placed on the improvement of the constituent materials and the structure, and the overall shape of the cutting tool can be designed according to needs. The following takes a circular ring cutting tool as a specific example for description.

[0052] The cutting tool comprises a blade part 10 at the outer edge and a fixing part 20 at the center. Specifically, the blade part 10 and the fixing part 20 are fixed as a whole, and the blade part 10 is located at the outer edge position for cutting the component to be cut. The fixing part 20 is located at the center position, and the cutting tool is installed on the cutting device through the fixing part 20.

[0053] As shown in Figure 1 and Figure 3 , the fixing part 20 is a ring structure, and the blade part 10 is annularly arranged and fixed outside the ring structure. In the embodiment of the present application, the structure of the blade part 10 is determined by the fixing part 20, that is, the structures of the blade part 10 and the fixing part 20 are both ring structures, and the blade part and the fixing part constitute a double-ring structure cutting tool, and the inner side of the blade part 10 is fixed along the outer side of the fixing part 20, that is, the fixing part 20 is located at the inner side of the blade part 10. In the preferred processing mode, the blade part 10 and the fixing part 20 are integrally formed by hot pressing sintering, and only the constituent components of the two parts are different, which can simplify the manufacturing process of the cutting tool.

[0054] The center of the ring structure is provided with a mounting hole 201, which is used to fix the cutting tool on the rotating shaft of the cutting device. The mounting hole 201 in the center of the fixing part 20 is only a preferred way provided in this embodiment, and for different shapes of tools and application occasions, the specific mounting structure can be designed according to various mounting structures in the prior art, and this embodiment is not limited.

[0055] As shown in Figure 2 and Figure 4 , the center of the ring structure of the fixing part 20 is provided with a mounting hole 201, through which the cutting tool can be fixed on the rotating shaft of the cutting device, and the cutting tool is driven to cut by the rotation of the rotating shaft.

[0056] In the embodiment of the present application, as shown in Figure 2 , the thickness of the blade part 10 and the thickness of the fixing part 20 are the same; in terms of specific size, for occasions such as semiconductor wafer cutting, for example, the thickness H of the blade part 10 can be set to between 0.005 mm and 0.120 mm, inclusive (the numerical ranges in the present application all include the end points, and the following will not be repeated), inclusive means closed interval, that is, including the end point value, in the present application, "inclusive" means this. Of course, the thickness of the blade part 10 and the fixing part 20 can also be adjusted according to the specific working condition, here, the thickness of the blade part 10 and the fixing part 20 is not limited, as long as it meets the working requirement.

[0057] Another example, the cutting tool can be applied in the cutting of semiconductor wafers or the cutting manufacturing of semiconductor packages; when applied in the cutting of semiconductor wafers, the component to be cut is a semiconductor wafer, at this time the thickness of the cutting tool is for example between 0.05 mm and 0.2 mm. When applied in the cutting of semiconductor packages, the component to be cut may be a wafer that has completed manufacturing, a panel or substrate after packaging, a multi-chip stacked structure, etc., at this time the thickness of the cutting tool is for example between 0.2 mm and 0.5 mm.

[0058] Of course, the cutting tool described in the present application is not only applied in the cutting of semiconductor wafers or the cutting manufacturing of semiconductor packages, but also can be applied in the cutting of other components, which will not be listed one by one here. The specific thickness of the cutting tool can be set according to the specific component to be cut.

[0059] As shown in Figures 1-2 , the blade part 10 includes a bonding agent B and abrasive grains A, the bonding agent B fixes the abrasive grains A embedded therein to form an abrasive layer, and the abrasive layer is used to cut the component to be cut.

[0060] Specifically, the blade part 10 is formed by embedding the abrasive grains A in the binder B, and a grinding layer is formed on the blade part 10, which is used to cut the components to be cut. In order to strengthen the hardness and wear resistance of the blade part 10, the abrasive grains A are embedded in the binder B to avoid the problem that the blade part 10 of the cutting tool is abraded during use, becomes blunt, and increases the cutting resistance, resulting in rough cutting surface and even wafer breakage.

[0061] The abrasive grains A are embedded in the binder B, and the abrasive grains A (such as diamond, cubic boron nitride, alumina, etc.) have much higher hardness and rigidity than the binder B. When these high-hardness particles are uniformly dispersed and fixed in the binder, they can limit the deformation of the matrix material on a microscale. Moreover, in some cases, the presence of the abrasive grains A can also promote the fine-grain strengthening effect of the binder B, that is, by hindering dislocation movement to improve the overall rigidity and strength of the material. It can be understood that the abrasive grains A can form a "hard point" around them, which can resist deformation when stressed, thereby enhancing its rigidity. Secondly, in a pure matrix, external loads will cause stress to concentrate in some weak areas, easily causing crack propagation or material failure. When the abrasive grains A are present, they can act as stress concentration points, dispersing the stress that would otherwise be concentrated in a single point to a larger area. Moreover, because the abrasive grains A have high hardness, they can withstand large local stresses at multiple locations, thereby reducing the stress burden on the binder B and preventing it from deforming or breaking excessively.

[0062] The grinding layer refers to the part of the cutting tool that is used to actually cut the wafer, that is, the part of the blade part that plays a cutting role, and the main role of the grinding layer is to achieve precise and efficient cutting by high-speed rotation and contact with the wafer surface. In the embodiments of the present application, the grinding layer is formed by embedding abrasive grains in the binder and hot-pressing sintering.

[0063] In the embodiments of the present application, the binder is a base material for fixing and supporting the abrasive grains. In the present application, the binder B is a metal binder. The metal binder, as the name implies, is a binder B made of metal material, in which the abrasive grains A are embedded and fixed together to form an abrasive layer. The metal binder has excellent wear resistance, high strength, and good thermal conductivity, making it perform well in certain applications. For example: the metal binder can effectively fix the abrasive grains A, so that they are not easily detached during the grinding process, ensuring the service life and stability of the grinding tool. In addition, the metal binder has excellent thermal conductivity, which helps to quickly dissipate the heat generated during grinding, reducing damage to the workpiece caused by high temperature. Moreover, the rigidity of the metal binder is higher than that of the resin binder, which can ensure that the grinding tool maintains a stable shape after long-term use, especially suitable for applications that require precise cutting, such as wafer cutting or semiconductor package cutting. Of course, the binder B can also be a resin binder, a ceramic binder, etc., and will not be listed one by one here.

[0064] The material of the metal binder includes at least one of copper alloy, tin alloy, titanium alloy, aluminum alloy, nickel alloy, stainless steel, silver alloy, or a combination thereof. The combination can be any two, any three, any four, any five, any six, or a combination of all of the copper alloy, tin alloy, titanium alloy, aluminum alloy, nickel alloy, stainless steel, and silver alloy. The material of the metal binder includes at least one of silver, tin, titanium, copper, or a combination thereof. The combination can be any two, any three, or a combination of all of the silver, tin, titanium, and copper. It can be understood that the metal alloy can be a metal such as silver, tin, titanium, and copper, or an alloy thereof. The metal binder can strengthen the bonding strength of the metal binder on the surface of the abrasive grain A.

[0065] The binder B fixes and embeds the abrasive grains A, including: the abrasive grains A are located inside the binder B, and / or the abrasive grains A protrude from the surface of the binder B. Here, protruding from the surface of the binder B can include protruding from the outer diameter surface, and also include protruding from the side surface.

[0066] Specifically, the abrasive grains A are embedded in the binder B, and generally, the abrasive grains A are uniformly distributed in the binder B. It can be understood that the abrasive grains A can be uniformly distributed inside the binder B; or the abrasive grains A can be uniformly distributed on the surface of the binder B, i.e., the abrasive grains A protrude from the surface of the binder B; or part of the abrasive grains A are uniformly distributed inside the binder B, and part of the abrasive grains A are uniformly distributed on the surface of the binder B. The position of the abrasive grains A in the binder B can be determined according to the specific working conditions, and will not be described in detail here.

[0067] In this embodiment, abrasive particles A can be uniformly embedded in and / or on the surface of binder B via hot pressing sintering. Hot pressing sintering is a process that uses high-temperature heating to bond abrasive particles A together and form a dense structure. By precisely controlling the temperature, pressure, and sintering time, the density, mechanical strength, and wear resistance of the abrasive material can be significantly improved. Compared to traditional electroforming, hot pressing sintering reduces material waste, lowers production costs, and avoids the problem of heavy metal waste liquid disposal associated with electroforming plating solutions.

[0068] The material of the abrasive grain A includes at least one of the following: diamond, cubic boron nitride, boron carbide, silicon carbide, aluminum oxide, tungsten carbide, or combinations thereof.

[0069] In this embodiment, the material of abrasive particle A includes at least one of diamond, cubic boron nitride, boron carbide, silicon carbide, alumina, tungsten carbide, or combinations thereof. The combination can be any two, three, four, five, or all of the following: diamond, cubic boron nitride, boron carbide, silicon carbide, alumina, and tungsten carbide. The diamond can be synthetic diamond, which is currently the hardest abrasive. Cubic boron nitride is second only to diamond in hardness and wear resistance. Silicon carbide and alumina also have high hardness and wear resistance, but are slightly softer than boron carbide. Silicon carbide is second only to diamond and boron carbide in hardness, possessing high hardness, high wear resistance, and good chemical stability. The Mohs hardness of diamond, cubic boron nitride, boron carbide, silicon carbide, and tungsten carbide are: diamond 10, cubic boron nitride 10, boron carbide 9.3, silicon carbide 9, and tungsten carbide 8.5-9.

[0070] The selection of abrasive grain A can be based on specific grinding requirements and material properties. For example, for hard and brittle materials, diamond or cubic boron nitride can be selected as abrasive grain A, combined with a wear-resistant binder B. The selection of the material for abrasive grain A will not be discussed in detail here, as long as it meets the requirements.

[0071] like Figure 3 As shown, the particle size CD of the abrasive grain A is in the range of 0.5~80µm, including the end, or in the range of 0.1~100µm, including the end. Specifically, the particle size CD and particle size of the abrasive grain A are two related concepts describing the size of the abrasive material. The particle size CD of the abrasive grain A refers to the size of a single abrasive grain A, while the particle size of the abrasive grain A is used to represent the size and distribution of the abrasive grains A in the abrasive layer. That is, the particle size of the abrasive grain A is an index used to represent the size distribution of all abrasive grains A in the abrasive material. It can be understood that the particle size represents the average diameter or size of all abrasive grains A, for example, the average particle size of "#600" is 30µm, and the average particle size of "#800" is 20µm. The smaller the value after "#", the larger the average particle size of the abrasive grain A.

[0072] Larger abrasive grains A have better chip removal due to their larger protrusion. However, because each grain of abrasive grain A has a large cutting depth, it is more prone to breakage in materials with lower toughness, resulting in a rougher surface finish. Conversely, smaller abrasive grains A have a smaller protrusion, making them more prone to clogging during cutting. However, because each grain of abrasive grain A has a smaller cutting depth, it is less likely to break in materials with lower toughness, resulting in a better surface finish. The protrusion refers to the height by which the tip of the abrasive grain A extends beyond the surface of the binder B during cutting; that is, the height by which the abrasive grain A protrudes outward from the binder B. Therefore, the appropriate abrasive grain size A can be selected based on the specific material of the part to be cut.

[0073] In the cutting edge 10, the abrasive particle A occupies an area of ​​the binder B in the range of 20% to 70%, including the end. This area percentage can be understood as the ratio of the area occupied by the abrasive particle A to the total area of ​​the binder B region on a given observation cross-section. Specifically, it refers to the percentage of the projected area of ​​a certain phase (such as abrasive particle A) to the total area of ​​the target region (such as the binder B region) in a two-dimensional cross-sectional image of the material.

[0074] In the cutting edge 10, the abrasive particles A constitute between 20% and 70% of the area of ​​the binder B, preferably between 30% and 50%. The amount of abrasive particles A contained in the binder B can be expressed by concentration. For example, a concentration of 100 indicates that the content of abrasive particles A is 25%, while a concentration of 200 indicates that the content of abrasive particles A is 50%. A higher concentration indicates a denser distribution of abrasive particles A in the abrasive layer, which generally affects the life of the cutting tool and the stability of the machining process. Furthermore, a higher concentration indicates denser abrasive particles A, leading to faster wear and a faster cutting speed, but may also result in finer cutting marks due to the smaller interparticle spacing between abrasive particles A. A lower concentration indicates a more dispersed distribution of abrasive particles A in the abrasive layer, which may result in a slower cutting speed, but may also result in coarser cutting marks due to the larger interparticle spacing between abrasive particles A.

[0075] like Figures 1-2 As shown, the fixing part 20 further includes abrasive particles A, which are added to the binder B. It can be understood that the fixing part 20 includes a fiber structure C, a binder B, and abrasive particles A, with the fiber structure C and the abrasive particles A added to the binder B. Furthermore, the volume percentage of the abrasive particles A in the cutting edge 10 is greater than or equal to the volume percentage of the abrasive particles A in the fixing part 20.

[0076] Specifically, the blade part 10 and the fixed part 20 both include abrasive grains A, and the volume percentage of the abrasive grains A in the blade part 10 is greater than or equal to the volume percentage of the abrasive grains A in the fixed part 20. That is, the volume percentage of the abrasive grains A in the blade part 10 is the same as the volume percentage of the abrasive grains A in the fixed part 20, or the volume percentage of the abrasive grains A in the blade part 10 is greater than the volume percentage of the abrasive grains A in the fixed part 20. In the embodiment of the present application, the volume percentage of the abrasive grains A in the blade part 10 or the fixed part 20 is in the range of 10% to 45%, inclusive. That is, the volume percentage of the abrasive grains A in the blade part 10 is between 10% and 45%, and the volume percentage of the abrasive grains A in the fixed part 20 is between 10% and 45%.

[0077] For the calculation of the volume percentage, a theoretical calculation method (based on powder ratio) can be used, which is suitable for powder metallurgy processes (such as hot-pressing sintering and cold isostatic pressing). First, the mass of the original powder is measured, such as the mass of the abrasive grains A M1 and the mass of the binder B powder M2. The densities of the abrasive grains A and the binder B are obtained, that is, the density of the abrasive grains A is , the density of the binder B is , and the volumes of the abrasive grains and the binder are calculated by the volume formula, that is, the volume of the abrasive grains is V1 and the volume of the binder is V2. Finally, the volume percentages of the two are calculated. Alternatively, a three-dimensional imaging and reconstruction method (experimental measurement) can be used, in which high-precision equipment is used to perform three-dimensional scanning on the sintered sample to directly measure the volume. For example, the volume fractions of the two can be obtained by X-ray Micro-CT. In the absence of three-dimensional data, a two-dimensional cross-sectional area method (approximate estimation) can be used, in which a cross-sectional image obtained by metallography or SEM (Scanning Electron Microscope) is used to approximate the volume percentage by the area percentage. In this regard, the calculation of the volume percentage of the abrasive grains A in the blade part 10 or the fixed part 20 is not limited.

[0078] The area percentage and the volume percentage of the abrasive grains A in the binder B are independent indicators, and both can be satisfied or only one of them can be used as a reference. The volume percentage is a more essential indicator, and the area percentage can approximately represent the volume percentage. In addition to the abrasive grains A and the binder B, there are also pores, which are considered as part of the binder B in the embodiment of the present application. The pore percentage is also an important indicator for the cutting tool, and can be adjusted by those skilled in the art as needed.

[0079] As Figure 4As shown, the blade portion 10 further comprises lubricating particles D embedded in the binder B for forming a lubricating film during cutting to reduce friction. Specifically, the blade portion 10 further comprises lubricating particles D, i.e. the lubricating particles D, abrasive grains A and binder B are combined by hot-press sintering to form the blade portion 10 at the outer edge.

[0080] wherein the lubricating particles D are solid, and the solid lubricating particles D comprise at least one of molybdenum disulfide, cubic boron nitride, mica, talc or a combination thereof.

[0081] The solid lubricating particles D refer to adding tiny solid lubricant particles in the abrasive layer to improve the lubricating performance and durability of the abrasive layer. The solid lubricating particles D are extruded out during cutting to form a thin lubricating film on the surface of the cutting tool. The lubricating film can reduce the friction coefficient and reduce wear, thereby improving the durability of the abrasive layer.

[0082] Specifically, the material of the solid lubricating particles D comprises at least one of molybdenum disulfide, cubic boron nitride, mica, talc or a combination thereof. Here, the combination can be any two or any three or all of molybdenum disulfide, cubic boron nitride, mica, talc. The layered structure of molybdenum disulfide makes it have excellent lubricating performance, which can be used as a solid lubricant to reduce friction and wear. The lubricity of mica is mainly derived from its lamellar structure, which forms a sliding layer between the friction surfaces to reduce friction. The lubricity of talc is derived from its small particles and soft texture, which can fill the surface voids and provide lubricating effect.

[0083] In the embodiments of the present application, the particle size of the solid lubricating particles D is in the range of 0.5-200 pm, including the end points, or in the range of 0.1-100 pm, including the end points. The volume percentage of the solid lubricating particles D in the blade portion 10 is in the range of 5%-25%, including the end points. The size of the particle size of the solid lubricating particles D and the volume percentage of the solid lubricating particles D in the blade portion 10 can be selected according to the specific working conditions. The calculation of the volume percentage of the solid lubricating particles D in the blade portion 10 can refer to the above-mentioned volume percentage calculation method.

[0084] The above are two different blade portions 10, and the appropriate blade portion 10 can be selected according to the specific working conditions. Next, the fixed portion 20 will be described in detail.

[0085] The fixing part 20 comprises the fiber structure C and the binder B; or the fixing part 20 comprises the fiber structure C, the binder B and the abrasive grain A. The fiber structure C or the fiber structure C and the abrasive grain A are added in the binder B and combined with each other to form the fixing part 20 for fixing the cutting tool on the cutting device. That is, the combination part can be that the fiber structure C is added in the binder B and combined with each other to form; or the fiber structure C and the abrasive grain A are added in the binder B and combined with each other to form.

[0086] Specifically, the fiber structure C or the fiber structure C and the abrasive grain A are added in the binder B, specifically in the metal binder, to form the fixing part 20 in the form of a ring structure at the center. The fixing part 20 is fixed on the cutting device through the mounting hole 201 arranged at the center of the fixing part 20. The fiber structure C comprises a fiber web and / or a cut fiber. The fiber web or the cut fiber forms a continuous or semi-continuous web structure after sintering and penetrates the metal binder. The fiber structure C supports the whole fixing part 20 like a “skeleton” and can limit the free deformation of the metal binder.

[0087] During the cutting process, the binder B can generate micro cracks due to impact. However, the fiber structure C has high tensile strength and toughness, and when the cracks meet the fiber web or the cut fiber, the cracks are blocked, deflected or bridged to prevent rapid expansion. The elastic modulus of the fiber (especially the metal fiber or the carbon fiber) is much higher than that of the metal binder. When the fiber is uniformly distributed in the metal binder, the overall elastic modulus (i.e. rigidity) of the fixing part 20 is significantly improved.

[0088] The abrasive grain A bears huge local pressure during cutting. The fiber structure C can disperse these point loads to a larger area to avoid local fragmentation of the binder B. The strength of the fixing part 20 is strengthened by embedding the fiber web or the cut fiber with high strength and high modulus in the binder B to form a “reinforced concrete” composite structure, thereby improving the overall deformation resistance of the fixing part 20, inhibiting cracks and reducing distortion to ensure stable and accurate cutting process. Therefore, the fiber structure C is added in the metal binder in the fixing part to reduce the cutting tool deflection or distortion caused by insufficient strength.

[0089] The fiber web is a single-layer structure or a multi-layer structure. The single-layer fiber web is a two-dimensional web structure formed by interweaving or arranging one layer of fibers, which is thin in thickness and simple in structure. The multi-layer fiber web is a three-dimensional structure formed by stacking and combining two or more single-layer fiber webs, which can be combined by adhesion, sintering, needling and the like.

[0090] The fiber diameter of the fiber web is in the range of 0.1-50 pm, inclusive. The mesh of the fiber web is in the range of #40-#300, inclusive. The mesh refers to the number of openings per unit length.

[0091] The fiber diameter and mesh of the fiber web are important parameters for describing the web structure. The fiber diameter refers to the thickness of a single fiber, usually measured in micrometers (pm). Smaller fiber diameters mean thinner fibers, which are usually more flexible and easier to bend. In addition, the mesh refers to the number of openings per unit length, usually expressed in the number of openings per inch (mesh count). The mesh is closely related to the fiber diameter. The more the mesh, the smaller the opening. In addition, the pore size of the fiber web depends on the distance between fibers (i.e., line distance), which is usually between tens of microns and hundreds of microns.

[0092] In the embodiments of the present application, the line distance of the fiber web is in the range of 30-500 pm, inclusive. The line distance refers to the distance between the centers of two adjacent fibers in the fiber web. It is usually divided into warp line distance and weft line distance. If it is a square mesh, the two are equal. In a woven mesh, the line distance = the width (or height) of the mesh; in a punched mesh or etched mesh, the line distance = the distance between the centers of two holes.

[0093] The line distance of the fiber web can be calculated according to the fiber diameter and mesh structure, for example: the diameter of the fiber is D, and the size of the mesh is a, then the line distance is d = a + D. Alternatively, the line distance can be determined according to the functional requirements. The empirical rule is: line distance ≥ 2 × maximum abrasive A particle size; line distance ≥ 5 × binder B powder average particle size. Alternatively, refer to the standard mesh specifications. The industry commonly uses standard metal mesh (such as stainless steel mesh, copper mesh), the line distance of which is determined by the mesh count (Mesh Count): mesh count: the number of mesh per inch (25.4 mm) length, which can be determined according to the following chart:

[0094] Of course, the line distance of the fiber web can also be calculated in other ways, which are not listed here.

[0095] The fiber diameter of the fiber web is in the range of 0.1-50 pm, inclusive. The mesh of the fiber web is in the range of #40-#300, inclusive. The mesh refers to the number of openings per unit length.

[0096] In the embodiments of the present application, the cut fiber, also known as a strand section, is a kind of short fiber material cut from a glass fiber yarn strand, with a length of about 0.03mm-5.0mm. The cut fiber is mainly used as a reinforcing material, added to a metal binder to improve the strength, rigidity and durability of the cutting tool.

[0097] The material of the fiber web or the cut fiber includes at least one of carbon fiber, graphite fiber, glass fiber, ceramic fiber or a combination thereof. The combination can be a combination of any two, any three or all of carbon fiber, graphite fiber, glass fiber and ceramic fiber. Carbon fiber is made of carbon atoms combined in a crystal structure, with high strength, high rigidity and light weight. Graphite fiber is a kind of carbon fiber, but its structure is closer to graphite, with a more perfect crystal structure, excellent electrical conductivity and corrosion resistance. Glass fiber is composed of fine glass material, with the characteristics of light weight, hardness, corrosion resistance and good insulation. Ceramic fiber is made of ceramic material and can withstand extremely high temperature.

[0098] The above is a cutting tool provided by the present application, which includes a cutting edge part 10 at the outer edge and a fixed part 20 at the center, and the material of the cutting edge part 10 and the fixed part 20 is different. The cutting edge part 10 includes a binder B and abrasive particles A, which provide sufficient hardness to cut the parts to be cut. In addition, in order to strengthen the strength of the fixed part, the fixed part 20 is formed by the mutual combination of the fiber structure C and the binder B, that is, the fiber structure C is added to the binder of the fixed part. To avoid the technical problem of deflection or distortion caused by insufficient strength of the cutting tool.

[0099] The present application also provides a manufacturing method of a cutting tool, including: a green body stage, placing a fiber web and / or cut fiber and a binder in the corresponding fixed part of the mold in advance, and placing a binder and abrasive particles in the corresponding cutting edge part of the mold in advance, applying a preset pressure to form a green body with a preset shape; a sintering stage, heating the green body to a preset temperature to form an abrasive layer in the cutting edge part, and the fiber web and / or cut fiber in the fixed part forms a fiber structure to enhance the overall stability of the cutting tool.

[0100] The binder is a metal binder.

[0101] Specifically, the fiber web and / or the cut fiber are placed in the mold in advance during the green compact pressing stage of powder metallurgy, and are pressed into a compact together with other grinding materials (such as abrasive particles, metal binders), and then enter the subsequent sintering stage. Green compact pressing and sintering are two important steps in the powder metallurgy process. The green compact pressing is to apply a predetermined pressure to the powder material in the mold to shape it into a desired shape. The desired shape can be determined according to the specific working conditions. In the embodiments of the present application, the desired shape is a blade part located at the outer edge and a fixed part located at the center, and both are annular structures. The sintering is to heat the green compact to a predetermined temperature, so that the powder particles are combined with each other to form a dense solid material, thereby improving the mechanical properties and physical properties. In the embodiments of the present application, the predetermined pressure and the predetermined temperature can be determined according to the specific working conditions, and here, no specific limitation is made.

[0102] The hot-pressed and sintered cutting tool uses the fiber structure composed of the fiber web and / or the cut fiber to strengthen the strength of the fixed part of the cutting tool, including impact strength, structural toughness, rupture strength and other structural properties. In addition, the fiber structure composed of the fiber web and / or the cut fiber is located in the central annular area of the cutting tool, which can reduce the problems of deflection or distortion of the cutting tool caused by insufficient strength, and also can improve the problem of uneven cutting of the semiconductor wafer or the semiconductor package.

[0103] The specific implementation of the manufacturing method of the cutting tool in this embodiment is similar to the cutting tool of the above-mentioned embodiments, and specific details can be found in the related content of the above-mentioned embodiments, which will not be repeated here.

[0104] It should be noted that although several structures, components or units for implementing related functions are mentioned in the above detailed description, the division is not mandatory. In fact, according to the specific implementation of the present application, the features and functions of two or more structures, components or units described above can be embodied in one structure, component or unit. Conversely, the features and functions of one structure, component or unit described above can be further divided into multiple components, structures or units for embodiment.

[0105] In addition, although the components and the mounting manner between the components of the assembly or device in the present application are described in a specific order in the drawings, this does not require or imply that the assembly or device must be designed in this specific component or mounting manner between the components, or must contain all the shown components to achieve the desired results. In addition or alternatively, some components can be omitted, multiple components can be combined into one component to realize the corresponding function, and / or one component can be divided into multiple components to realize the corresponding function, etc.

[0106] Although the present application is disclosed with reference to the preferred embodiments above, it is not intended to limit the present application, and any person skilled in the art who learns the present application can make possible changes and modifications without departing from the spirit and scope of the present application, and the protection scope of the present application should be defined by the scope of the claims of the present application.

Claims

1. A cutting tool characterized by, The cutting tool comprises: a cutting edge portion located at the outer edge and a fixed portion located at the center; the cutting edge portion comprises a binder and abrasive grains, the binder binds and fixes the abrasive grains embedded therein to form an abrasive layer for cutting a component to be cut; the fixed portion comprises a fiber structure and the binder, the fiber structure is added in the binder and is bound to each other to form the fixed portion, the fixed portion is used to fix the cutting tool on a cutting device.

2. The cutting tool of claim 1 wherein, the fiber structure comprises a fiber web and / or a cut fiber; the fiber web is a single-layer structure or a multi-layer structure; the fiber diameter of the fiber web is in the range of 0.1-50 μm, inclusive; the mesh of the fiber web is in the range of #40-#300, inclusive; the line distance of the fiber web is in the range of 30-500 μm, inclusive; the fiber diameter of the cut fiber is in the range of 0.1-50 μm, inclusive; the fiber length-width ratio of the cut fiber is in the range of 100:1-5000:1, inclusive; the cut fiber is formed by cutting a glass fiber yarn; the length of the cut fiber is in the range of 0.03-5.0 mm, inclusive; the material of the fiber web or the cut fiber comprises at least one of carbon fiber, graphite fiber, glass fiber, ceramic fiber, or a combination thereof.

3. The cutting tool of claim 1 wherein, the binder is a metal binder; the material of the metal binder comprises at least one of copper alloy, tin alloy, titanium alloy, aluminum alloy, nickel alloy, stainless steel, silver alloy, or a combination thereof, or the material of the metal binder comprises at least one of silver, tin, titanium, copper, or a combination thereof.

4. The cutting tool of claim 1 wherein, the binder binds and fixes the abrasive grains embedded therein, comprising: the abrasive grains are located within the binder, and / or the abrasive grains protrude from the surface of the binder; the material of the abrasive grains comprises at least one of diamond, cubic boron nitride, boron carbide, silicon carbide, aluminum oxide, tungsten carbide, or a combination thereof; the particle size of the abrasive grains is in the range of 0.5-80 μm, inclusive, or in the range of 0.1-100 μm, inclusive; the area percentage of the abrasive grains in the binder in the cutting edge portion is in the range of 20%-70%, inclusive.

5. The cutting tool of claim 1 wherein, the fixed portion also comprises abrasive grains added in the binder; the volume percentage of the abrasive grains in the cutting edge portion is greater than or equal to the volume percentage of the abrasive grains in the fixed portion, or the volume percentage of the abrasive grains in the cutting edge portion or the fixed portion is in the range of 10%-45%, inclusive.

6. The cutting tool of claim 1 wherein, the cutting edge portion also comprises lubricating particles embedded in the binder for forming a lubricating film during the cutting process of the cutting edge portion; the lubricating particles are solid, and the solid lubricating particles comprise at least one of molybdenum sulfide, cubic boron nitride, mica, talc, or a combination thereof; the particle size of the solid lubricating particles is in the range of 0.5-200 μm, inclusive, or in the range of 0.1-100 μm, inclusive; the volume percentage of the solid lubricating particles in the cutting edge portion is in the range of 5%-25%, inclusive.

7. The cutting tool of claim 1 wherein, The fixed part is annular structure, the blade part annularly surrounds and is fixed outside the annular structure along the annular structure; The center of the annular structure is provided with a mounting hole for fixing the cutting tool on the rotating shaft of the cutting device; The blade part and the fixed part are integrally formed by hot pressing sintering.

8. The cutting tool of claim 1 wherein, The cutting tool is applied to the cutting of semiconductor wafers, and the thickness of the cutting tool is in the range of 0.05-0.2mm, including the end part, or The cutting tool is applied to the cutting of semiconductor packages, and the thickness of the cutting tool is in the range of 0.2-0.5mm, including the end part.

9. A method of manufacturing a cutting tool, characterized by, It comprises: In the green body stage, the fiber web and / or cut fiber and the binder are pre-placed in the corresponding fixed part of the mold, and the binder and the abrasive particles are pre-placed in the corresponding blade part of the mold, and a predetermined pressure is applied to form a green body with a predetermined shape; In the sintering stage, the green body is heated to a predetermined temperature to form an abrasive layer in the blade part, and the fiber web and / or cut fiber in the fixed part form a fiber structure.

10. The method of manufacturing a cutting tool according to claim 9, wherein The binder is a metal binder.

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