Diamond wire cutting liquid and preparation method thereof

Abstract

The invention belongs to the technical field of silicon wafer processing, and discloses diamond wire cutting liquid and a preparation method thereof. The diamond wire cutting liquid comprises the following components in percentage by weight: 25%-50% of a lubricant, 10%-30% of a wetting agent, 10%-20% of a solubilizer, 0.1%-1.0% of a dispersing agent and 5%-50% of water, the lubricant comprises polyoxyethylene polyoxypropylene trans-block polyether, the wetting agent comprises alkynediol and isomeric alcohol polyoxyethylene polyoxypropylene ether, and the solubilizer comprises polyoxyethylene polyoxypropylene block polyether and alkynediol polyoxyethylene ether. The diamond wire cutting liquid provided by the invention has excellent lubricating, dispersing and wetting properties, is low in surface tension value, and can reduce the abrasion of a fret saw, reduce the wire breaking rate and improve the cutting yield of products. And meanwhile, the diamond wire cutting liquid has extremely low foam and extremely high foam breaking rate, the generation of foam in the cutting process can be reduced, and the problem of cylinder overflow is solved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of silicon wafer processing, and particularly relates to a diamond wire cutting fluid and a preparation method thereof. BACKGROUND

[0002] Semiconductor silicon wafers are the core basic materials of integrated circuits (IC) and photovoltaic (PV) cells, and the quality (such as surface integrity, geometric precision, thickness uniformity, and damage-free layer) directly determines the performance and yield of the final device. The cutting of silicon wafers is a crucial processing link, and therefore the quality and processing efficiency are crucial to the performance and cost of the final product.

[0003] Diamond wire sawing (DWS) technology has become the mainstream slicing technology for semiconductor-grade single crystal silicon wafers due to its high cutting efficiency, low material loss (narrow cutting gap), good silicon wafer surface quality, and environmental protection (usually water-based cutting fluid). However, the diamond wire cutting fluid still has some defects, such as frequent wire breakage during cutting, leading to an increase in product scrap rate, and easy overflow of foam from the cylinder during cutting. Therefore, it is necessary to develop a diamond wire cutting fluid with low breakage rate and high product cutting yield. SUMMARY

[0004] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a diamond wire cutting fluid and a preparation method thereof. The diamond wire cutting fluid provided by the present application has excellent lubricating and wetting properties, a low surface tension value, can effectively reduce the breakage rate, and improve the cutting yield of the product. At the same time, the diamond wire cutting fluid can also reduce the generation of foam during cutting and solve the overflow problem.

[0005] The present application provides a diamond wire cutting fluid.

[0006] Specifically, a diamond wire cutting fluid comprises the following components by weight percentage: 25%-50% lubricant, 10%-30% wetting agent, 10%-20% solubilizer, 0.1%-1.0% dispersant, and 5%-50% water; the lubricant comprises polyoxyethylene polyoxypropylene trans-block polyether, the wetting agent comprises acetylenic diol and isomeric alcohol polyoxyethylene polyoxypropylene ether, and the solubilizer comprises polyoxyethylene polyoxypropylene block polyether and acetylenic diol polyoxyethylene ether.

[0007] In some embodiments of the present application, the diamond wire cutting fluid comprises the following components by weight percentage: 25%-45% lubricant, 15%-28% wetting agent, 15%-20% solubilizer, 0.1%-0.5% dispersant, and 15%-44% water.

[0008] In some embodiments of the application, the polyoxyethylene polyoxypropylene reverse block polyether has a molecular weight of 2000-4000.

[0009] In some embodiments of the application, the polyoxyethylene polyoxypropylene reverse block polyether comprises one or more of Pluronic RPE1740, Pluronic RPE1720. Preferably, the polyoxyethylene polyoxypropylene reverse block polyether comprises Pluronic RPE1740 and Pluronic RPE1720, the mass ratio of the Pluronic RPE1740 to the Pluronic RPE1720 being (1.5-2.5): 1.

[0010] In some embodiments of the application, the wetting agent has a surface tension of 25-30 mN / m.

[0011] In some embodiments of the application, the acetylenic diol comprises 2,5,8,11-tetramethyl-6-dodecyn-5,8-diol. As a mixture of 2,5,8,11-tetramethyl-6-dodecyn-5,8-diol and dipropylene glycol solvent (HMP-610T).

[0012] In some embodiments of the application, the isomeric alcohol polyoxyethylene polyoxypropylene ether comprises isooctanol polyoxyethylene polyoxypropylene ether C8EO m PO n (m=2-10, n=1-5), isononanol polyoxyethylene polyoxypropylene ether IC9EO m PO n (m=2-10, n=1-5), isotridecanol polyoxyethylene polyoxypropylene ether C 10 EO m PO n (m=2-10, n=1-5), isotridecanol polyoxyethylene polyoxypropylene ether C 10 EO m PO n (m=2-10, n=0-5).

[0013] In some embodiments of the application, the polyoxyethylene polyoxypropylene reverse block polyether has a molecular weight of 2000-4000, and a surface tension of 40±3 mN / m.

[0014] In some embodiments of the application, the polyoxyethylene polyoxypropylene reverse block polyether comprises one or more of Pluronic RPE1740, Pluronic RPE1720. Preferably, the polyoxyethylene polyoxypropylene reverse block polyether comprises Pluronic RPE1740 and Pluronic RPE1720, the mass ratio of the Pluronic RPE1740 to the Pluronic RPE1720 being (1.5-2.5): 1.

[0015] In some embodiments of the present application, the acetylenic diol polyoxyethylene ether is one or more of 2,4,7,9-tetramethyl-5-decyne-4,7-diol or 2,5,8,11-tetramethyl-6-dodecyne-5,8-diol, which is polymerized with ethylene oxide to form acetylenic diol polyoxyethylene ether of 4-10EO.

[0016] In some embodiments of the present application, the dispersant includes at least one of polyvinylpyrrolidone, polystyrene-maleic anhydride copolymer, and polyacrylic acid dispersant.

[0017] The present application also provides a preparation method of the diamond wire cutting fluid, which comprises the following steps: The lubricant, the wetting agent, the solubilizing agent, and the dispersant are mixed, then water is added, and then the mixture is stirred and mixed to obtain the diamond wire cutting fluid.

[0018] In some embodiments of the present application, the stirring and mixing process is as follows: the stirring speed is 1000-1200 rpm, and the stirring is continued for 10-60 min after a stable clear transparent system is formed.

[0019] It should be noted that the mixing of the lubricant, the wetting agent, the solubilizing agent, and the dispersant has no specific order within the above specified mass percentage range. The above diamond wire cutting fluid can be used as a silicon wafer cutting fluid, and can be diluted by 100-200 times.

[0020] Compared with the prior art, the present application has the following beneficial effects: (1) The diamond wire cutting fluid provided by the present application uses polyoxyethylene polyoxypropylene reverse block polyether as a lubricant to lubricate the diamond wire and the silicon wafer, reduce friction and wear; uses acetylenic diol and isomeric alcohol polyoxyethylene polyoxypropylene ether as a wetting agent to reduce the surface tension of the diamond wire cutting fluid, provide sufficient wetting, and enhance the penetration performance; uses polyoxyethylene polyoxypropylene block polyether and acetylenic diol polyoxyethylene ether as a solubilizing agent to solubilize isomeric alcohol polyoxyethylene polyoxypropylene ether, and the two synergistically promote the cutting fluid to infiltrate the diamond wire and the silicon wafer in the cutting process, reduce the wire saw wear, play a role in rapid cooling, reduce the wire breakage rate, and improve the yield of silicon wafer cutting.

[0021] (2) The diamond wire cutting fluid provided by the present application mainly includes a lubricant, a wetting agent, and a solubilizing agent. The present application fully utilizes the synergistic effect of the wetting agent and the solubilizing agent through unique component selection and dosage control, realizes excellent lubricity to reduce the cutting force, protect the wire saw, and improve the surface quality, effectively reduces the surface / subsurface damage (microcracks, scratches) of the silicon wafer, reduces the TTV / Warp, and improves the surface roughness (Ra), thereby providing a higher quality substrate for subsequent processing.

[0022] (3) The diamond wire cutting fluid provided by the application has excellent lubricating, dispersing and wetting properties, low surface tension value, can reduce the wear of the wire saw, reduce the wire breaking rate, and improve the cutting yield of the product. Meanwhile, the diamond wire cutting fluid has extremely low foam and extremely fast foam breaking rate, can also reduce the generation of foam in the cutting process, and solves the overflow problem.

[0023] (4) The diamond wire cutting fluid provided by the application has excellent lubricating property, wetting and penetrating property, and cooling performance, can improve the machining precision, and the machined workpiece is easy to clean without the need of using additional cleaning agent. DETAILED DESCRIPTION

[0024] In order to make the skilled in the art more clearly understand the technical solutions described in the application, the following examples are used for illustration. It should be pointed out that the following examples do not constitute a limitation on the scope of protection required by the application.

[0025] The raw materials, reagents or devices used in the following examples and comparative examples can be obtained from conventional commercial channels or can be obtained by existing known methods if not specifically stated. The trans-block polyether mixed lubricant used in the following examples and comparative examples is: Pluronic RPE1740 and Pluronic RPE1720 in a mass ratio of 2:1; acetylenic diol polyoxyethylene ether: 2,4,7,9-tetramethyl-5-decyne-4,7-diol-10EO.

[0026] Example 1 Prepare 100 kg of diamond wire cutting fluid, and weigh each component according to the following mass: Trans-block polyether mixed lubricant: 30 kg; Polyoxyethylene polyoxypropylene block polyether L64: 12.6 kg; Acetylenic diol polyoxyethylene ether: 3 kg; Isnonanol polyoxyethylene polyoxypropylene ether: 10 kg; Isocetyl alcohol polyoxyethylene polyoxypropylene ether: 1 kg; Acetylenic diol HMP-610T: 1 kg; Dispersant (polyvinylpyrrolidone): 0.1 kg; Ultrapure water: 42.3 kg.

[0027] Mix the above organic components, then pour water into them after mixing, and then stir at a stirring speed of 1200 rpm until a stable clear transparent system is formed, and continue stirring for 30 min. When used, dilute 200 times.

[0028] Example 2 Prepare 100 kg of diamond wire cutting fluid, and weigh each component according to the following mass: Trans block polyether mixed lubricant: 30 kg; Polyoxyethylene polyoxypropylene block polyether L64: 12.6 kg; Acetylenic diol polyoxyethylene ether: 4 kg; Acetylenic diol HMP-610T: 1.5 kg; Isnonanol polyoxyethylene polyoxypropylene ether: 12 kg; Isocotanol polyoxyethylene polyoxypropylene ether: 1 kg; Dispersant (polyvinylpyrrolidone): 0.1 kg; Ultra-pure water: 38.8 kg.

[0029] The above organic components are mixed, after mixing, water is poured into it, then stirred at a stirring speed of 1200 rpm until a stable clear transparent system is formed, and then stirred for another 30 min. When used, dilute 200 times.

[0030] Example 3 Prepare 100 kg of diamond wire cutting fluid, and weigh each component according to the following mass: Trans block polyether mixed lubricant: 30 kg; Polyoxyethylene polyoxypropylene block polyether L64: 14 kg; Acetylenic diol polyoxyethylene ether: 4 kg; Acetylenic diol HMP-610T: 1.5 kg; Isnonanol polyoxyethylene polyoxypropylene ether: 15 kg; Isocotanol polyoxyethylene polyoxypropylene ether: 2 kg; Dispersant (polyvinylpyrrolidone): 0.1 kg; Ultra-pure water: 33.4 kg.

[0031] The above organic components are mixed, after mixing, water is poured into it, then stirred at a stirring speed of 1200 rpm until a stable clear transparent system is formed, and then stirred for another 30 min. When used, dilute 200 times.

[0032] Example 4 Prepare 100 kg of diamond wire cutting fluid, and weigh each component according to the following mass: Trans block polyether mixed lubricant: 30 kg; Polyoxyethylene polyoxypropylene block polyether L64: 14 kg; Acetylenic diol polyoxyethylene ether: 4 kg; Acetylenic diol HMP-610T: 1.5 kg; Isnonanol polyoxyethylene polyoxypropylene ether: 18 kg; Isocotanol polyoxyethylene polyoxypropylene ether: 2 kg; Dispersant (polyvinyl pyrrolidone): 0.1 kg; Ultra-pure water: 30.4 kg.

[0033] The above organic components are mixed, after mixing, water is poured into it, then stirred at a stirring speed of 1200 rpm until a stable clear transparent system is formed, and then stirred for 30 min. When used, it is diluted 200 times.

[0034] Example 5 Prepare 100 kg of diamond wire cutting fluid, and weigh each component according to the following mass: Trans-block polyether mixed lubricant: 30 kg; Polyoxyethylene polyoxypropylene block polyether L64: 13 kg; Acetylenic diol polyoxyethylene ether: 4 kg; Acetylenic diol HMP-610T: 3 kg; Isopropyl alcohol polyoxyethylene polyoxypropylene ether: 18 kg; Isopropyl alcohol polyoxyethylene polyoxypropylene ether: 2 kg; Dispersant (polyvinyl pyrrolidone): 0.2%; Ultra-pure water: 29.8 kg.

[0035] The above organic components are mixed, after mixing, water is poured into it, then stirred at a stirring speed of 1200 rpm until a stable clear transparent system is formed, and then stirred for 30 min. When used, it is diluted 200 times.

[0036] Example 6 Prepare 100 kg of diamond wire cutting fluid, and weigh each component according to the following mass: Trans-block polyether mixed lubricant: 30 kg; Polyoxyethylene polyoxypropylene block polyether L44: 14 kg; Acetylenic diol polyoxyethylene ether: 3 kg; Acetylenic diol HMP-610T: 1 kg; Isopropyl alcohol polyoxyethylene polyoxypropylene ether: 10 kg; Isopropyl alcohol polyoxyethylene polyoxypropylene ether: 1 kg; Dispersant (polyvinyl pyrrolidone): 0.1%; Ultra-pure water: 40.9 kg.

[0037] The above organic components are mixed, after mixing, water is poured into it, then stirred at a stirring speed of 1200 rpm until a stable clear transparent system is formed, and then stirred for 30 min. When used, it is diluted 200 times.

[0038] Example 7 Formulate 100 kg of diamond wire cutting fluid, and each component is weighed as follows: Trans-block polyether mixed lubricant: 40 kg; Polyoxyethylene polyoxypropylene block polyether L44: 13 kg; Acetylene glycol polyoxyethylene ether: 2 kg; Acetylene glycol HMP-610T: 1.5 kg; Isornic alcohol polyoxyethylene polyoxypropylene ether: 15 kg; Isocotanol polyoxyethylene polyoxypropylene ether: 2 kg; Dispersant (polyvinylpyrrolidone): 0.1%; Ultrapure water: 26.4 kg.

[0039] Mix the above organic components, then pour water into them after mixing, and then stir at a stirring speed of 1200 rpm until a stable clear transparent system is formed, and continue stirring for 30 min. When used, dilute 200 times.

[0040] Example 8 Formulate 100 kg of diamond wire cutting fluid, and each component is weighed as follows: Trans-block polyether mixed lubricant: 30 kg; Polyoxyethylene polyoxypropylene block polyether L64: 14 kg; Acetylene glycol polyoxyethylene ether: 3 kg; Acetylene glycol HMP-610T: 2 kg; Isornic alcohol polyoxyethylene polyoxypropylene ether: 22 kg; Isocotanol polyoxyethylene polyoxypropylene ether: 3 kg; Dispersant (polyvinylpyrrolidone): 0.2%; Ultrapure water: 25.8 kg.

[0041] Mix the above organic components, then pour water into them after mixing, and then stir at a stirring speed of 1200 rpm until a stable clear transparent system is formed, and continue stirring for 30 min. When used, dilute 200 times.

[0042] Comparative Examples 1-6 are designed on the basis of lower proportion (Example 2) and higher proportion (Example 8) of wetting agent isornic alcohol polyoxyethylene polyoxypropylene ether. The wetting agent can meet the cutting requirements at a relatively low proportion, and a higher proportion of wetting agent can adapt to higher working conditions of cutting, and achieve good wetting and penetration effect. Comparative Examples 1-6 compare the cutting effect of cutting fluid under different amounts of wetting agent.

[0043] Comparative Example 1: The diamond wire cutting fluid provided in this comparative example differs from Example 2 in that the isononyl alcohol polyoxyethylene polyoxypropylene ether is replaced by isomeric tridecanol polyoxyethylene-7-ether.

[0044] Comparative Example 2: The diamond wire cutting fluid provided in this comparative example differs from Example 8 in that the isononyl alcohol polyoxyethylene polyoxypropylene ether is replaced by isomeric tridecanol polyoxyethylene-7-ether.

[0045] Comparative Example 3: The diamond wire cutting fluid provided in this comparative example differs from Example 2 in that the isononyl alcohol polyoxyethylene polyoxypropylene ether is replaced by isomeric decanol polyoxyethylene-7-ether.

[0046] Comparative Example 4: The diamond wire cutting fluid provided in this comparative example differs from Example 8 in that the isononyl alcohol polyoxyethylene polyoxypropylene ether is replaced by isomeric decanol polyoxyethylene-7-ether.

[0047] Comparative Example 5: The diamond wire cutting fluid provided in this comparative example differs from Example 2 in that the isononyl alcohol polyoxyethylene polyoxypropylene ether is replaced by fatty alcohol polyoxyethylene ether AEO-9.

[0048] Comparative Example 6: The diamond wire cutting fluid provided in this comparative example differs from Example 8 in that the isononyl alcohol polyoxyethylene polyoxypropylene ether is replaced by fatty alcohol polyoxyethylene ether AEO-9.

[0049] Comparative Example 7 A 100 kg diamond wire cutting fluid was prepared by weighing the following components by mass: Trans-block polyether mixed lubricant: 30 kg; Polyoxyethylene polyoxypropylene block polyether L64: 17 kg; Acetylenic diol HMP-610T: 3 kg; Isononyl alcohol polyoxyethylene polyoxypropylene ether: 18 kg; Isooctanol polyoxyethylene polyoxypropylene ether: 2 kg; Dispersant (polyvinylpyrrolidone): 0.2%; Ultra-pure water: 29.8 kg.

[0050] The above organic components were mixed, after mixing, water was poured into it, then stirred at a stirring speed of 1200 rpm until a stable clear transparent system was formed, and then stirred for 30 min. When used, it was diluted 200 times.

[0051] Comparative Example 8 A 100 kg diamond wire cutting fluid was prepared by weighing the following components by mass: Trans-block polyether mixed lubricant: 30 kg; Polyoxyethylene polyoxypropylene block polyether L64: 14kg; Acetylene glycol polyoxyethylene ether: 5 kg; HMP-610T acetylacetonate diol: 4 kg; Isononyl alcohol polyoxyethylene polyoxypropylene ether: 25kg; Isooctyl alcohol polyoxyethylene polyoxypropylene ether: 3.5 kg; Dispersant (polyvinylpyrrolidone): 0.2%; Ultrapure water: 18.3 kg.

[0052] Mix the above organic components, then pour in water and stir at 1200 rpm until a stable, clear, and transparent system is formed. Continue stirring for another 30 minutes. Dilute 200 times before use.

[0053] Product effectiveness test (1) The rate of decrease in dynamic surface tension reflects the adsorption rate of surfactants transferring from the bulk solution phase to the interface. During diamond wire cutting of single-crystal silicon, the cutting fluid wets both the diamond wire and the silicon wafer. According to Young's equation: S = gamma gl (cos theta - 1) S is the spreading coefficient; gamma gl S represents the liquid / gas surface tension; θ is the contact angle of the liquid on the solid material surface. The contact angle of the cutting fluid on the diamond wire and single-crystal silicon is 0° < θ < 90°, therefore S < 0. The cutting fluid wets and penetrates the solid; the faster the wetting and penetration rate, the better the cooling effect, reducing the probability of wire breakage and improving product quality. The dynamic surface tension of gas / liquid during the cutting process... gamma gl The lower the value, the better the wetting and penetration effect. Dynamic surface tension tests were performed on the diamond wire cutting fluids of all examples and comparative examples. The dynamic surface tension curves of the diamond wire cutting fluid diluted 200 times at room temperature (25°C) were measured using a Krüss K100 dynamic surface tension meter, and the dynamic surface tension values ​​were recorded over 1000 ms. The results are shown in Table 1.

[0054] (2) Foam performance is measured by the speed of foam defoaming. Take 50 ml of diamond wire cutting fluid diluted 200 times into a 100 ml stoppered graduated cylinder, shake for 20 seconds, and record the foam defoaming time.

[0055] (3) The silicon wafers were cut using the diamond wire cutting fluids from the examples and comparative examples. The specific steps included: under the same conditions of steel wire, wire transfer process, silicon wafer specifications, machine model, silicon rod adhesive, and cutting fluid addition, different ratios of experimental cutting fluids were used to cut the silicon wafers. The silicon wafer cutting situation, overflow situation, and wire breakage rate were statistically analyzed. The results are shown in Table 1.

[0056] Wherein, the broken line rate refers to the proportion of the number of knives of broken line in cutting provided by each group of examples or comparative examples in the total number of knives in a day, and the calculation formula is: broken knife number / total knife number*100%=broken line rate.

[0057] Table 1

[0058] Note: no overflow O, slight overflow**, overflow***, severe overflow****

[0059] From Table 1, it can be seen that the surface tension value of the diamond wire cutting fluid provided by the embodiment of the application is low, which can reduce the broken line rate, improve the cutting yield of the product, and improve the quality of the silicon wafer; at the same time, the diamond wire cutting fluid can also reduce the generation of foam in the cutting process, and solve the problem of overflow. As can be seen from Comparative Examples 1-5, 8 and Comparative Example 9, with the increase of the proportion of wetting agent, the broken line rate gradually decreases, but when the proportion is too high, it is easy to cause the problem of difficult compatibility of the system, which not only brings the risk of foam overflow, but also affects the broken line rate. Therefore, only when the components of the diamond wire cutting fluid are in the appropriate proportion range, can the diamond wire cutting fluid achieve a lower surface tension value, improve the cutting yield of the product, and solve the problem of overflow.

[0060] The above-described examples only express several embodiments of the present application, and the description is more specific and detailed, but it should not be understood as limiting the scope of the patent of the present application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A diamond wire cutting fluid, characterized in that, By weight percentage, it includes the following components: 25%-50% lubricant, 10%-30% wetting agent, 10%-20% solubilizer, 0.1%-1.0% dispersant, 5%-50% water; the lubricant comprises polyoxyethylene polyoxypropylene trans-block polyether, the wetting agent comprises acetylenic glycol and isomeric alcohol polyoxyethylene polyoxypropylene ether, and the solubilizer comprises polyoxyethylene polyoxypropylene block polyether and acetylenic glycol polyoxyethylene ether.

2. The diamond wire cutting fluid according to claim 1, characterized in that, By weight percentage, it comprises the following components: 25%-45% lubricant, 15%-28% wetting agent, 15%-20% solubilizer, 0.1%-0.5% dispersant, and 15%-44% water.

3. The diamond wire cutting fluid according to claim 1 or 2, characterized in that, The molecular weight of the polyoxyethylene polyoxypropylene trans-block polyether is 2000-4000.

4. The diamond wire cutting fluid according to claim 1 or 2, characterized in that, The acetylenic diol includes 2,5,8,11-tetramethyl-6-dodecyne-5,8-diol.

5. The diamond wire cutting fluid according to claim 1 or 2, characterized in that, The isomeric alcohol polyoxyethylene polyoxypropylene ethers include isooctanol polyoxyethylene polyoxypropylene ether C8EO m PO n , m = 2-10, n = 1-5; isononyl alcohol polyoxyethylene polyoxypropylene ether IC9EO m PO n , m = 2-10, n = 1-5; isodecanol polyoxyethylene polyoxypropylene ether C 10 EO m PO n , m = 2-10, n = 1-5; isotridecanol polyoxyethylene polyoxypropylene ether C 10 EO m PO n , m = 2-10, n = 0-5.

6. The diamond wire cutting fluid according to claim 1 or 2, characterized in that, The polyoxyethylene polyoxypropylene block polyether has a molecular weight of 2000-4000 and a surface tension of 40±3mN / m.

7. The diamond wire cutting fluid according to claim 6, characterized in that, The polyoxyethylene polyoxypropylene block polyether includes one or more of Pluronic L64 and Pluronic L44.

8. The diamond wire cutting fluid according to claim 1 or 2, characterized in that, The acetylenic diol polyoxyethylene ether is one or more of the following: acetylenic diol polyoxyethylene ether polymerized with ethylene oxide to form 4-10EO using 2,4,7,9-tetramethyl-5-decyn-4,7-diol or 2,5,8,11-tetramethyl-6-dodecyn-5,8-diol as the initiator.

9. The method for preparing the diamond wire cutting fluid according to any one of claims 1-8, characterized in that, Includes the following steps: The lubricant, wetting agent, solubilizer and dispersant are mixed, then water is added and stirred to prepare the diamond wire cutting fluid.

10. The preparation method according to claim 9, characterized in that, The stirring and mixing process is as follows: at a stirring speed of 1000-1200 rpm, stir until a stable, clear and transparent system is formed, and then continue stirring for 10-60 minutes.

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