Scanning scattering type light beam analyzer
By employing a multi-position imaging scanning mechanism and image stitching technology, the problems of insufficient resolution and Rayleigh length coverage in existing high beam quality laser measurements have been solved, enabling high-precision beam quality analysis.
Patent Information
- Application Number
- CN202511946830.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-23
- Publication Date
- 2026-01-20
AI Technical Summary
Existing scattering imaging beam analyzers struggle to simultaneously guarantee high resolution and sufficient Rayleigh length coverage when measuring high-beam-quality lasers, leading to a significant increase in measurement errors.
A multi-position imaging scanning mechanism is adopted, which uses movable imaging components or fixed array imaging components to achieve full field-of-view acquisition of beam scattered light. Combined with host computer control, image stitching and parameter fitting are performed to obtain beam quality indicators.
It achieves high-resolution imaging and long Rayleigh length coverage, improving measurement accuracy and adapting to the measurement needs of high-power and high-beam-quality lasers.
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Figure CN121364060A_ABST
Abstract
Citation Information
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