A method for preparing a potted capacitor

Abstract

A method for manufacturing a potted capacitor, the potted capacitor comprising a plastic encapsulation shell, a capacitor body, and potting compound, wherein the capacitor body is disposed within the plastic encapsulation shell, and the potting compound is filled within the plastic encapsulation shell to fix the capacitor body, the capacitor body comprising a first frame, a second frame, and a plurality of capacitor chips; the first frame comprising a first frame body, two first extension plates disposed opposite to each other on the first frame body, and two first pin terminals spaced apart on the first frame body; the second frame comprising a second frame body disposed opposite to the first frame body, two second extension plates disposed opposite to each other on the second frame body, and two second pin terminals respectively disposed on the two second extension plates; the plurality of capacitor chips are sequentially arranged between the first frame and the second frame; by defining the structural composition of the first frame and the second frame, the two first extension plates or the two second extension plates can form a heat dissipation space, thereby improving the reliability and stability of the potted capacitor.

Description

Technical Field

[0001] This invention belongs to the field of capacitor manufacturing, and specifically relates to a method for manufacturing a potted capacitor. Background Technology

[0002] Encapsulation is the process of mechanically or manually injecting a liquid compound into a device containing electronic components and circuitry, which then cures at room temperature or under heating conditions to form a high-performance thermosetting polymer insulating material. Encapsulation can enhance the overall integrity of electronic devices, improve their resistance to external impacts and vibrations; improve the insulation between internal components and circuitry, which is beneficial for device miniaturization and weight reduction; avoid direct exposure of components and circuitry, improve the device's waterproof and moisture-proof performance, and enhance its performance and stability parameters.

[0003] Existing potted capacitors suffer from insufficient heat dissipation space due to structural limitations, which reduces their reliability and stability during use and greatly limits their application scenarios, thus requiring further improvement. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method for preparing a potted capacitor.

[0005] The present invention adopts the following technical solution:

[0006] A method for preparing a potted capacitor, the potted capacitor comprising a plastic encapsulation shell, a capacitor body and potting compound, wherein the capacitor body is disposed in the plastic encapsulation shell, and the potting compound is filled in the plastic encapsulation shell to fix the capacitor body, the capacitor body comprising a first frame, a second frame and a plurality of capacitor chips;

[0007] The first frame includes a first frame body, two first extension plates disposed opposite to each other on the first frame body, and two first pin ends disposed at intervals on the first frame body. The plastic encapsulation shell is provided with two first clearance holes for the two first pin ends to pass through.

[0008] The second frame is disposed opposite to the first frame and includes a second frame body disposed opposite to the first frame body, two second extension plates disposed opposite to the second frame body, and two second pins respectively disposed on the two second extension plates. The two second extension plates are respectively opposite to the two first extension plates. The plastic encapsulation shell is provided with two second clearance holes for the two second pins to pass through.

[0009] Multiple capacitor chips are arranged sequentially between the first frame and the second frame, and the end electrodes at both ends of the capacitor chips are respectively connected to the first frame or the second frame.

[0010] Its preparation method specifically includes the following steps:

[0011] Step 1: Multiple capacitor chips are welded and fixed between the first frame and the second frame using a welding fixture to obtain the capacitor body;

[0012] Step 2: Place the capacitor body into the plastic-encapsulated housing, so that the first lead and the second lead pass through the corresponding first clearance hole and second clearance hole, respectively;

[0013] Step 3: Place the capacitor body with the plastic-encapsulated shell into the potting tank, with the first lead end and the second lead end facing upwards. At this time, the height of the first clearance hole is lower than the height of the second clearance hole.

[0014] Step four: Inject potting compound into the plastic encapsulation shell through the first clearance hole until the potting compound is flush with the first clearance hole. After curing, continue to inject potting compound into the plastic encapsulation shell through the second clearance hole until the potting compound is flush with the second clearance hole. After curing, remove the potting groove to obtain the potted capacitor.

[0015] Furthermore, the welding fixture includes a welding base plate, a first positioning plate, and a second positioning plate. The second positioning plate is disposed on the welding base plate and is used to support the second frame. The first positioning plate is located above the second positioning plate and fixes the first frame. When welding the capacitor body, the second frame is first supported on the second positioning plate, then multiple capacitor chips are arranged sequentially on the second frame, then the first frame is placed on top of the multiple capacitor chips and fixed by the first positioning plate. Finally, it is sent into the welding equipment for welding to obtain the capacitor body.

[0016] Furthermore, during the welding or potting of the capacitor body, a limiting seat is required to limit the first frame and the second frame; the limiting seat includes a first limiting plate and a second limiting plate, the first limiting plate is supported on the second limiting plate, and is provided with two first limiting parts respectively connected to the two first pin ends; the second limiting plate is provided with two second limiting parts respectively connected to the two second pin ends; during the potting of the capacitor body, the limiting seat is supported on the plastic encapsulation shell, so that the first limiting part is connected to the corresponding first pin end, and the second limiting part is connected to the corresponding second pin end.

[0017] Furthermore, when the limiting seat is supported on the plastic-encapsulated shell, a gap is formed between the first limiting part and the opposite first clearance hole, and a gap is formed between the second limiting part and the opposite second clearance hole.

[0018] Furthermore, the first limiting plate is supported on the second limiting plate in an inverted L-shape.

[0019] Furthermore, the first pin end is provided with a first pin hole, the second pin end is provided with a second pin hole, the first limiting part is provided with a first locking hole opposite to the first pin hole, the second limiting part is provided with a second locking hole opposite to the second pin hole, the first pin end is fixed on the first limiting part by a first bolt in conjunction with the first pin hole and the first locking hole, and the second pin end is fixed on the second limiting part by a second bolt in conjunction with the second pin hole and the second locking hole.

[0020] Furthermore, the first positioning plate and the first frame have an inwardly extending first positioning groove on their opposite surfaces, and the second positioning plate and the first frame have an inwardly extending second positioning groove on their opposite surfaces. When the capacitor body is welded, the first frame and the second frame are respectively placed in the first positioning groove and the second positioning groove, and the end electrodes of the capacitor chip opposite to the first positioning groove or the second positioning groove can extend into the first positioning groove or the second positioning groove. The multiple capacitor chips are positioned by the cooperation of the first positioning groove and the second positioning groove.

[0021] Furthermore, the top surface of the welding base plate is provided with a placement groove, and the second positioning plate is supported in the placement groove.

[0022] Furthermore, the inner wall of the potting shell is formed with a plurality of spaced-apart extension grooves, which extend outward from the inner wall of the potting shell.

[0023] Furthermore, the height of the potting groove is lower than the height of the plastic-sealed shell.

[0024] As can be seen from the above description of the present invention, compared with the prior art, the beneficial effects of the present invention are as follows: By defining the structural composition of the potted capacitor and further defining the structural composition of the first frame and the second frame, the two first extension plates or the two second extension plates can form a heat dissipation space, thereby improving the heat dissipation performance of the potted capacitor during use, further extending the working life of the potted capacitor, improving the reliability and stability of the potted capacitor, and enabling the potted capacitor to have higher reliability under special working conditions; wherein, by further defining the preparation method of the potted capacitor, through the setting of the first clearance hole and the second clearance hole, combined with the multi-step reverse potting method, it is ensured that the potting adhesive will not delaminate in the plastic encapsulation shell, effectively guaranteeing the performance of the prepared potted ceramic capacitor;

[0025] During the welding and potting of the capacitor body, a limiting seat is required in conjunction with the welding fixture and the potting tank. The limiting seat effectively limits the first frame and the second frame to ensure the dimensional accuracy of the prepared potted capacitor. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of a potted capacitor.

[0027] Figure 2 This is an exploded view of the structure of a potted capacitor;

[0028] Figure 3 This is a structural exploded view of the capacitor body;

[0029] Figure 4 This is a schematic diagram of the structure of the plastic-encapsulated casing;

[0030] Figure 5 This is a schematic diagram of the capacitor body during welding.

[0031] Figure 6 for Figure 5 A structural decomposition diagram;

[0032] Figure 7 This is a schematic diagram of the structure of the first positioning plate;

[0033] Figure 8 Schematic diagram of the limiting seat Figure 1 ;

[0034] Figure 9 Schematic diagram of the limiting seat Figure 2 ;

[0035] Figure 10 This is a schematic diagram of the capacitor body during potting.

[0036] Figure 11 for Figure 10 A structural decomposition diagram;

[0037] In the diagram, 1. Plastic-encapsulated casing; 2. Capacitor body; 3. Encapsulating compound; 4. Welding fixture; 5. Limiting seat; 6. Encapsulation groove; 11. Extension groove; 12. First clearance hole; 13. Second clearance hole; 21. First frame; 211. First frame body; 212. First extension plate; 213. First pin terminal; 214. First pin hole; 22. Second frame; 221. Second frame body; 222. Second extension plate; 223. Second pin terminal; 224. Second pin hole; 23. Capacitor chip; 24. Heat dissipation space; 41. Welding base plate; 411. Placement slot; 42. First positioning plate; 421. First positioning slot; 43. Second positioning plate; 431. Second positioning slot; 51. First limiting plate; 511. First limiting part; 512. First locking hole; 513. First bolt; 52. Second limiting plate; 521. Second limiting part; 522. Second locking hole; 523. Second bolt. Detailed Implementation

[0038] The present invention will be further described below through specific embodiments.

[0039] Reference Figures 1 to 2As shown, a potted capacitor includes a plastic encapsulation shell 1, a capacitor body 2, and potting compound 3, wherein the capacitor body 2 is disposed in the plastic encapsulation shell 1, and the potting compound 3 is filled in the plastic encapsulation shell 1 to fix the capacitor body 2.

[0040] Reference Figure 2 As shown, the capacitor body 2 includes a first frame 21, a second frame 22, and multiple capacitor chips 23.

[0041] The first frame 21 includes a first frame body 211, two first extension plates 212 disposed opposite to each other on the first frame body 211, and two first pin ends 213 disposed at intervals on the first frame body 211. The plastic encapsulation shell 1 is provided with two first clearance holes 12 for the two first pin ends 213 to pass through. Specifically, the two first pin ends 213 are located between the two first extension plates 212, and the first pin ends 213 are provided with first pin holes 214. By defining the mechanism of the first frame 21, it is arranged in a U-shape, so that the space between the two first extension plates 212 can form a heat dissipation space 24, which improves the heat dissipation capacity of the capacitor and effectively improves the reliability and stability of the capacitor.

[0042] The second frame 22 is disposed opposite to the first frame 21 and includes a second frame body 221 disposed opposite to the first frame body 211, two second extension plates 222 disposed opposite to the second frame body 221, and two second pin ends 223 disposed on the two second extension plates 222 respectively. The plastic encapsulation shell 1 is provided with two second clearance holes 13 for the two second pin ends 223 to pass through, and the second pin ends 223 are provided with second pin holes 224. Specifically, the two second extension plates 222 are opposite to the two first extension plates 212, and the two second pin ends 223 are staggered from the two first pin ends 213.

[0043] Multiple capacitor chips 23 are arranged sequentially between the first frame 21 and the second frame 22. Each capacitor chip 23 has a terminal electrode at both ends, and the terminal electrodes at both ends are connected to the first frame 21 or the second frame 22 respectively.

[0044] Reference Figure 4 As shown, the encapsulated housing 1 has multiple extended grooves 11 arranged at intervals on its inner wall. The multiple extended grooves 11 are arranged at intervals from the opening of the encapsulated housing 1 inward. The extended grooves 11 extend outward from the inner wall of the encapsulated housing 1 to increase the contact area between the potting compound 3 and the encapsulated housing 1 and improve the stability of the encapsulated capacitor structure.

[0045] Reference Figures 10 to 11As shown, during the preparation of the potted capacitor, the capacitor body 2 is first welded and formed by the welding fixture 4, and then the potting glue 3 is injected through the potting tank 6. During the welding of the capacitor body 2 or the injection of the potting glue 3, the limiting seat 5 is required to limit the first frame 21 and the second frame 22 to ensure the dimensional accuracy of the prepared potted capacitor. Specifically, the height of the potting tank 6 is lower than the height of the plastic-encapsulated shell 1, and the potting tank 6 is made of polytetrafluoroethylene material.

[0046] Reference Figures 5 to 7 As shown, the welding fixture 4 includes a welding base plate 41, a first positioning plate 42, and a second positioning plate 43. The top surface of the welding base plate 41 is provided with a placement groove 411. The second positioning plate 43 is disposed in the placement groove 411 and is used to support the second frame 22. The first positioning plate 42 is located above the second positioning plate 43 and fixes the first frame 21. Specifically, the opposite surface of the first positioning plate 42 and the first frame 21 forms an inwardly extending first positioning groove 421, and the opposite surface of the second positioning plate 43 and the first frame 21 forms an inwardly extending second positioning groove 431. When welding the capacitor body 2, the first frame 21 and the second frame 22 are respectively placed in the first positioning groove 421 and the second positioning groove 431, and the end electrodes of the capacitor chip 23 opposite to the first positioning groove or the second positioning groove 421 or the second positioning groove 431 can extend into the first positioning groove 421 or the second positioning groove 431. The multiple capacitor chips 23 are positioned by the cooperation of the first positioning groove 421 and the second positioning groove 431.

[0047] Reference Figures 8 to 9As shown, the limiting seat 5 includes a first limiting plate 51 and a second limiting plate 52. The first limiting plate 51 is supported on the second limiting plate 52 and has two first limiting parts 511 respectively connected to the two first pin ends 213. The second limiting plate 52 has two second limiting parts 521 respectively connected to the two second pin ends 223. When the capacitor body 2 is welded, the limiting seat 5 is supported in the placement groove 411 and arranged opposite to the first positioning plate 42 and the second positioning plate 43 to limit and fix the first frame 21 and the second frame 22. When the capacitor body 2 is potted, the limiting seat 5 is supported on the plastic encapsulation shell 1, so that the first pin ends 213 of the first limiting parts 511 are connected, and the second limiting parts 521 are connected to the opposite second pin ends 223. Specifically, the first limiting plate 51 is supported in an inverted L-shape on the second limiting plate 52. 2. The first limiting part 511 is provided with a first locking hole 512 opposite to the first pin hole 214, and the second limiting part 521 is provided with a second locking hole 522 opposite to the second pin hole 224. During potting, the first pin end 213 is fixed on the first limiting part 511 by the first bolt 513 in conjunction with the first pin hole 214 and the first locking hole 512, and the second pin end 223 is fixed on the second limiting part 521 by the second bolt 523 in conjunction with the second pin hole 224 and the second locking hole 522. Furthermore, when the limiting seat 5 is supported on the plastic encapsulation shell 1, a gap is formed between the first limiting part 511 and the opposite first clearance hole 12, and a gap is formed between the second limiting part 521 and the opposite second clearance hole 13, so as to allow the potting compound 3 to be injected into the plastic encapsulation shell 1 through the first clearance hole 12 or the second clearance hole 13.

[0048] Its preparation method specifically includes the following steps:

[0049] Step 1, Soldering the capacitor body 2: First, place the second positioning plate 43 and the limiting seat 5 on the welding base plate 41 with their left and right sides facing each other. Then, support the second frame 22 with solder paste applied on the second positioning plate 43. Next, arrange multiple capacitor chips 23 on the second frame 22 in sequence. Then, place the first frame 21 with solder paste applied on top of the multiple capacitor chips 23. Fix the first frame 21 with the first positioning plate 42 and fix the first frame 21 and the second frame 22 with the limiting seat 5. Finally, send it into the welding equipment for welding to obtain the capacitor body 2.

[0050] Step 2: Place the capacitor body 2 into the plastic-encapsulated housing 1, so that the first lead 213 and the second lead 223 pass through the corresponding first clearance hole 12 and second clearance hole 13 respectively.

[0051] Step 3: Place the capacitor body 2, which is fitted with the plastic encapsulation shell 1, into the potting tank 6, with the opening of the plastic encapsulation shell 1 facing down and the first lead end 213 and the second lead end 223 facing up. At this time, the height of the first clearance hole 12 is lower than the height of the second clearance hole 13.

[0052] Step 4: Support the limiting seat 5 downwards on the plastic-encapsulated shell 1, so that the first limiting part 511 and the second limiting part 521 are respectively connected to the corresponding first pin end 213 and second pin end 223.

[0053] Step 5: Inject potting compound 3 into the plastic encapsulation shell 1 through the first clearance hole 12 until the potting compound 3 is flush with the first clearance hole 12. After curing, continue to inject potting compound 3 into the plastic encapsulation shell 1 through the second clearance hole 13 until the potting compound 3 is flush with the second clearance hole 13. After curing, remove the potting groove 6 to obtain the potted capacitor.

[0054] This application defines the structural composition of the potted capacitor, and further defines the structural composition of the first frame 21 and the second frame 22, so that the two first extension plates 212 or the two second extension plates 222 can form a heat dissipation space 24, thereby improving the heat dissipation performance of the potted capacitor during use, further extending the working life of the potted capacitor, improving the reliability and stability of the potted capacitor, and making the potted capacitor have higher reliability under special working conditions; wherein, the preparation method of the potted capacitor is further defined, by setting the first clearance hole 12 and the second clearance hole 13, and cooperating with the multi-step reverse potting method, it is ensured that the potting glue 3 will not delaminate in the plastic shell 1, effectively guaranteeing the performance of the prepared potted ceramic capacitor.

[0055] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the specification should still fall within the scope of the present invention.

Claims

1. A method for manufacturing a potted capacitor, the potted capacitor including a plastic-encapsulated case, a capacitor body, and a potting adhesive, the capacitor body being disposed in the plastic-encapsulated case, the potting adhesive being filled in the plastic-encapsulated case for fixing the capacitor body, characterized in that: The capacitor body includes a first frame, a second frame, and multiple capacitor chips; The first frame includes a first frame body, two first extension plates disposed opposite to each other on the first frame body, and two first pin ends disposed at intervals on the first frame body. The plastic encapsulation shell is provided with two first clearance holes for the two first pin ends to pass through. The second frame is disposed opposite to the first frame and includes a second frame body disposed opposite to the first frame body, two second extension plates disposed opposite to the second frame body, and two second pins respectively disposed on the two second extension plates. The two second extension plates are respectively opposite to the two first extension plates. The plastic encapsulation shell is provided with two second clearance holes for the two second pins to pass through. Multiple capacitor chips are arranged sequentially between the first frame and the second frame, and the end electrodes at both ends of the capacitor chips are respectively connected to the first frame or the second frame. Its preparation method specifically includes the following steps: Step 1: Multiple capacitor chips are welded and fixed between the first frame and the second frame using a welding fixture to obtain the capacitor body; Step 2: Place the capacitor body into the plastic-encapsulated housing, so that the first lead and the second lead pass through the corresponding first clearance hole and second clearance hole, respectively; Step 3: Place the capacitor body with the plastic-encapsulated shell into the potting tank, with the first lead end and the second lead end facing upwards. At this time, the height of the first clearance hole is lower than the height of the second clearance hole. Step 4: Inject potting compound into the plastic encapsulation shell through the first clearance hole until the potting compound is flush with the first clearance hole. After curing, continue to inject potting compound into the plastic encapsulation shell through the second clearance hole until the potting compound is flush with the second clearance hole. After curing, remove the potting groove to obtain the potted capacitor. The welding fixture includes a welding base plate, a first positioning plate, and a second positioning plate. The second positioning plate is disposed on the welding base plate and is used to support the second frame. The first positioning plate is located above the second positioning plate and fixes the first frame. When welding the capacitor body, the second frame is first supported on the second positioning plate, then multiple capacitor chips are arranged sequentially on the second frame, then the first frame is placed on top of the multiple capacitor chips and fixed by the first positioning plate. Finally, it is sent into the welding equipment for welding to obtain the capacitor body. When the capacitor body is welded or potted, a limiting seat is required to limit the first frame and the second frame. The limiting seat includes a first limiting plate and a second limiting plate. The first limiting plate is supported on the second limiting plate and is provided with two first limiting parts that are respectively connected to the two first pin ends. The second limiting plate is provided with two second limiting parts that are respectively connected to the two second pin ends. When the capacitor body is potted, the limiting seat is supported on the plastic encapsulation shell, so that the first limiting part is connected to the corresponding first pin end and the second limiting part is connected to the corresponding second pin end.

2. The method for preparing a potted capacitor according to claim 1, characterized in that: When the limiting seat is supported on the plastic-encapsulated shell, a gap is formed between the first limiting part and the corresponding first clearance hole, and a gap is formed between the second limiting part and the corresponding second clearance hole.

3. The method for preparing a potted capacitor according to claim 1, characterized in that: The first limiting plate is supported on the second limiting plate in an inverted L-shape.

4. The method for preparing a potted capacitor according to claim 1, characterized in that: The first pin end is provided with a first pin hole, the second pin end is provided with a second pin hole, the first limiting part is provided with a first locking hole opposite to the first pin hole, the second limiting part is provided with a second locking hole opposite to the second pin hole, the first pin end is fixed on the first limiting part by a first bolt in conjunction with the first pin hole and the first locking hole, and the second pin end is fixed on the second limiting part by a second bolt in conjunction with the second pin hole and the second locking hole.

5. The method for preparing a potted capacitor according to claim 1, characterized in that: The first positioning plate and the first frame have an inwardly extending first positioning groove on their opposite surfaces, and the second positioning plate and the first frame have an inwardly extending second positioning groove on their opposite surfaces. When the capacitor body is welded, the first frame and the second frame are respectively placed in the first positioning groove and the second positioning groove, and the end electrodes of the capacitor chip that are opposite to the first positioning groove or the second positioning groove can extend into the first positioning groove or the second positioning groove. The multiple capacitor chips are positioned by the cooperation of the first positioning groove and the second positioning groove.

6. The method for preparing a potted capacitor according to claim 1, characterized in that: The top surface of the welding base plate is provided with a placement groove, and the second positioning plate is supported in the placement groove.

7. The method for preparing a potted capacitor according to claim 1, characterized in that: The inner wall of the potting housing is formed with a plurality of spaced-apart extension grooves, which extend outward from the inner wall of the potting housing.

8. The method for preparing a potted capacitor according to claim 1, characterized in that: The height of the potting groove is lower than the height of the potting shell.

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