Cleaning machine capable of recycling water and operation method of cleaning machine

Abstract

The invention belongs to the field of silicon wafer cleaning in the photovoltaic industry, and discloses a circulating water cleaning machine and an operation method thereof. Water for the cleaning mechanism, the oxidizing mechanism and the rinsing mechanism is circulated, the cleaning mechanism is provided with a cleaning water inlet water tank and a cleaning spraying water tank, the oxidizing mechanism is provided with an oxidizing water tank, and the rinsing mechanism is provided with a rinsing water tank and a rinsing spraying water tank. Wherein the cleaning water inlet water tank is used for supplying water to a cleaning tank in the cleaning mechanism and spraying water to the side and the bottom of the cleaning tank, after silicon wafers are cleaned by pure water in a rinsing tank, half of cleaning liquid flows back to the rinsing water tank, and the other half of the cleaning liquid flows back to the rinsing spraying water tank; the rinsing and spraying water tank is connected with a water pump, then cleaning liquid is used for spraying the spraying areas of the oxidizing mechanism and the rinsing mechanism, the cleaning liquid sprayed by the spraying area of the rinsing mechanism can flow back to the rinsing and spraying water tank, and the cleaning liquid sprayed by the spraying area of the oxidizing mechanism flows back to the cleaning and spraying water tank of the cleaning mechanism for use. The silicon wafers are conveyed through the roller way, cleaning baskets are omitted, and the cleaning effect is enhanced.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of silicon wafer cleaning in the photovoltaic industry, and relates to a circulating water cleaning machine and an operating method thereof. BACKGROUND

[0002] In the industrialized preparation process of photovoltaic silicon wafers, the cleaning process is a key link to ensure the cleanliness of the surface of the silicon wafer and then ensure the subsequent yield. At present, the mainstream silicon wafer cleaning equipment in the industry is a tank cleaning machine, and its core technical scheme is as follows: the device contains multiple functionally independent tanks, and when working, the silicon wafers to be cleaned are first regularly placed into a special silicon wafer bearing cleaning flower basket, the basket body adopts a dense grid structure to realize the vertical separation and positioning of the silicon wafers, and then the cleaning flower basket loaded with the silicon wafers is sequentially immersed into each functional tank in the preset process sequence by means of an automatic mechanical conveying arm or manual operation, and the surface impurities of the silicon wafers are removed by means of immersion combined with auxiliary cleaning actions.

[0003] However, the above-mentioned existing tank cleaning machine and the matching process have many technical defects to be solved, which are as follows:

[0004] The core cleaning efficiency is insufficient: firstly, when the acid and alkali reagents in the cleaning tank react with the organic matter and metal impurities on the surface of the silicon wafer, persistent foam is easily generated. Such foam will form a closed isolation layer on the surface of the silicon wafer, hinder the full contact reaction of the reagents and the impurities, and interfere with the cavitation effect of the ultrasonic cleaning system. The foam will consume a large amount of ultrasonic energy in the process of breaking, resulting in uneven transmission of ultrasonic energy in the tank, and directly causing the stripping efficiency of micron-level particles and metal ions on the surface of the silicon wafer to decrease significantly. Secondly, the water consumption in the rinsing process shows a significantly high trend: the existing equipment generally adopts a "single-tank single-time direct water supply" mode, and the fresh rinsing water is directly discharged after being injected and then being washed for a short time. In order to offset the negative impact of foam on the cleaning effect, the rinsing water volume and the washing frequency need to be increased, which further aggravates the waste of water resources and the pressure of waste water treatment.

[0005] There is a structural break in the process connection: the four core processes of the current tank cleaning machine, i.e. cleaning, oxidation, rinsing and drying, are mostly arranged in the form of independent tanks or multiple equipment combinations, and there is a lack of integrated linkage transmission mechanism between the processes. After the silicon wafers complete the previous process, they need to be transferred to the next process equipment by means of mechanical arm transfer, manual transfer or special conveying device. This non-continuous operation mode causes multiple problems: ① cost stacking: additional investment in the purchase cost of handling equipment and the operation and maintenance cost of manual operation, and accurate alignment adjustment needs to be performed every time the transfer is performed, which leads to the extension of the processing cycle of a single batch of silicon wafers and a significant reduction in production efficiency; ② aggravation of silicon wafer loss: during the transfer process, the silicon wafers are prone to rigid collision or friction with the cleaning flower basket grid and the handling mechanism, especially under the current trend of thinning of the silicon wafers to a thickness of less than 160 μm, the collision is easy to cause the silicon wafers to be edge-cracked or broken, so that the silicon wafer loss rate remains at a high level.

[0006] To solve the process connection problem, part of the technical scheme attempts to adopt the design of single tank body integrating multiple processes, and realizes the continuous transmission of the silicon wafer in the same tank body through the built-in roller conveying system. However, this scheme has fatal defects: the cleaning acid reagent, the oxidizing alkaline medium, the rinsing pure water and the drying hot air cannot be effectively isolated in the single tank body, and the neutralization of the mixed acid and alkaline medium will inevitably occur, and after the neutralization, the rinsing water will lose the cleaning ability after being polluted by the chemical reagent, and a large amount of water vapor produced by the contact between the drying hot air and the liquid will also cause secondary pollution of the silicon wafer.

[0007] In addition, the existing technology generally arranges the ultrasonic vibrator at the bottom of the tank body or in the upper and lower two layers in the transverse direction, which results in larger overall water consumption and poor ultrasonic effect. Enterprises are forced to prolong the cleaning time and increase the water consumption, forming a vicious cycle of "large water consumption-low ultrasonic energy efficiency-increased water consumption".

[0008] In summary, the existing photovoltaic silicon wafer tank cleaning machine has significant technical defects in cleaning efficiency, process connection and system matching, resulting in low production efficiency, large silicon wafer loss and high cleaning cost. It has been unable to adapt to the technical requirements of the photovoltaic industry for high efficiency, low consumption and high cleanliness cleaning, and a new type of silicon wafer cleaning technical scheme is urgently needed to solve the above problems. SUMMARY

[0009] In order to overcome the shortcomings of the prior art, the present application provides a circulating water cleaning machine and its operation method, which realizes continuous and stable transportation of silicon wafers for uninterrupted cleaning, reduces manual operation, greatly improves the degree of automation, and improves the production capacity of the equipment. By roller conveying silicon wafers, the basket is cancelled, the cleaning effect is enhanced, the wafer breakage rate is reduced, the yield is improved, and the overall cost of the equipment is reduced.

[0010] The above-mentioned object of the present application is achieved by the following technical scheme:

[0011] The present application provides an operation method of a circulating water cleaning machine, comprising the following steps:

[0012] The silicon wafers to be cleaned are conveyed into the cleaning mechanism by the existing feeding mechanism or wafer inserting machine; the silicon wafers to be cleaned are conveyed by the upper and lower two layers of conveying rollers, and sequentially pass through the cleaning mechanism, the oxidation mechanism, the rinsing mechanism and the drying mechanism to realize cleaning-oxidation-rinsing-drying. The ultrasonic assembly is arranged in the cleaning mechanism, the oxidation mechanism and the rinsing mechanism to assist the overall cleaning, and the water blocking assembly is arranged to block the interference between the mechanisms. The cleaning mechanism, the oxidation mechanism, the rinsing mechanism and the drying mechanism are driven by a main transmission hexagonal shaft to realize stable transmission of the upper and lower two layers of conveying rollers. The upper conveying roller in the upper layer of the upper and lower two layers of conveying rollers is floatingly arranged to realize stable conveying of the silicon wafers. After drying, the silicon wafers are sent to the next process by the existing unloading roller.

[0013] The water used by the cleaning mechanism, the oxidizing mechanism and the rinsing mechanism is in a recycling mode. The cleaning mechanism is provided with a cleaning water inlet tank and a cleaning spray water tank. The oxidizing mechanism is provided with an oxidizing water tank. The rinsing mechanism is provided with a rinsing water tank and a rinsing spray water tank.

[0014] The cleaning water inlet tank is used to supply water to the cleaning tank in the cleaning mechanism and the side spray and the bottom spray of the cleaning tank. The drainage from the cleaning area of the cleaning tank is returned to the cleaning water inlet tank, and after filtration, the water is used as the water source to supply the cleaning tank and the side spray and the bottom spray of the cleaning tank.

[0015] The cleaning spray water tank is used to supply water to the spray area of the cleaning tank in the cleaning mechanism. The drainage from the spray area of the oxidizing tank is returned to the cleaning spray water tank, and after filtration, the water is used as the water source to supply the spray area of the cleaning tank.

[0016] The oxidizing water tank is used to supply water to the oxidizing tank of the oxidizing water tank. The drainage from the middle part of the oxidizing tank is returned to the oxidizing water tank, and after filtration, the water is used as the water source to supply the oxidizing tank.

[0017] The rinsing spray water tank is used to supply water to the spray area of the rinsing tank and the spray area of the oxidizing tank. The partial drainage from the spray area of the rinsing tank and the front end of the rinsing tank is returned to the rinsing spray water tank, and after filtration, the water is used as the water source to supply the spray area of the rinsing tank and the spray area of the oxidizing tank.

[0018] The rinsing water tank is used to supply water to the rinsing tank of the rinsing mechanism. The drainage from the rear terminal of the rinsing tank is returned to the rinsing water tank. The outlet of the rinsing water tank is provided with a flow meter to monitor the water consumption.

[0019] The cleaning system can be provided with an existing sheet inserting machine. The existing sheet inserting machine is a four-channel roller. After the silicon wafer is conveyed by the roller of the sheet inserting machine, the workpiece silicon wafer is transferred to the cleaning mechanism by the feeding device.

[0020] The cleaning conditions in the cleaning tank in the cleaning mechanism are that the silicon wafer cleaning agent is added (in the cleaning water inlet tank), the cleaning temperature is maintained at 40-60℃, the oxidation conditions in the oxidizing tank of the oxidizing mechanism are that hydrogen peroxide and sodium hydroxide are used as the oxidizing agent (added in the oxidizing water tank), the oxidation temperature is maintained at 40-50℃, and the rinsing tank in the rinsing mechanism is rinsed with pure water, and the rinsing temperature is maintained at 50-60℃. The concentration of the silicon wafer cleaning agent is 1-5wt%, the concentration of the hydrogen peroxide is 20wt%, and the concentration of the sodium hydroxide is 20wt%. The silicon wafer cleaning agent and the oxidizing agent are added regularly according to the working conditions.

[0021] The cleaning machine has three different cleaning stations, namely a cleaning station realized by a cleaning mechanism, an oxidation station realized by an oxidation mechanism, and a rinsing station realized by a rinsing mechanism. Each station is provided with a corresponding water tank (a cleaning tank, an oxidation tank, a rinsing tank, a cleaning water inlet tank, an oxidation water tank, and a rinsing water tank) for accommodating the cleaning station. The silicon wafer is immersed in the solution when passing through the water tank for cleaning. The water tank (the cleaning water inlet tank, the oxidation water tank, and the rinsing water tank) is connected to the water inlet pipeline for supplying water to the water tank (the cleaning tank, the oxidation tank, and the rinsing tank). An electric ball valve is arranged on the water inlet pipeline to control the valve opening degree of the electric ball valve and adjust the water inlet amount. A heater is arranged in the water tank (the cleaning water inlet tank, the oxidation water tank, and the rinsing water tank) to heat the liquid in the water tank to the required temperature for cleaning. A liquid level float ball switch is arranged in the water tank (the cleaning water inlet tank, the oxidation water tank, and the rinsing water tank) to detect the liquid level in the water tank to prevent the heater from drying out, the pump from being dry suction, or the water tank from overflowing due to too high liquid level. The water tank (the cleaning water inlet tank, the oxidation water tank, and the rinsing water tank) is provided with an upper overflow drainage pipe and a bottom waste water tank drainage pipe. When the water level in the water tank is too high, the cleaning liquid and foam will overflow from the overflow drainage pipe. When the water tank needs to discharge the cleaning liquid, the pneumatic diaphragm valve connected to the waste water tank drainage pipe can be opened. The cleaning mechanism bottom spray is used to spray cleaning liquid to remove small air bubbles attached to the bottom of the silicon wafer when it is immersed in water. The cleaning agent in the cleaning tank will generate a large amount of foam during circulation. The cleaning mechanism side spray is used to spray and blow the foam back to the cleaning water inlet tank to prevent the foam from accumulating in the cleaning tank. The cleaning area in the cleaning tank is formed by the water blocking assembly to store the cleaning liquid. The silicon wafer is conveyed through the cleaning area by the upper and lower conveying rollers for immersion cleaning. The cleaning liquid in the cleaning area will continuously seep out from the gap between the cleaning upper water blocking roller A and the cleaning lower water blocking roller, and the cleaning upper water blocking roller B and the cleaning lower water blocking roller, to the side tank. The side tank is connected to the backflow pipe A. The cleaning liquid is filtered at the top of the cleaning water inlet tank and then backflows to the bottom of the cleaning water inlet tank. In the oxidation mechanism, the oxidizing agent needs to be added to the oxidation tank or the oxidation water tank. The pump connected to the oxidation water tank of the oxidation station pumps the cleaning liquid from the oxidation water tank to the oxidation tank. The cleaning liquid then backflows to the oxidation water tank through the side tank and is filtered. After filtration, the cleaning liquid backflows to the bottom of the oxidation water tank to form a cycle. The cleaning liquid in the rinsing tank is pure water. After the silicon wafer is cleaned by the pure water in the rinsing tank, half of the cleaning liquid backflows to the rinsing water tank, and the other half backflows to the rinsing spray water tank. The water pump connected to the rinsing spray water tank is used to spray the cleaning liquid to the spraying area of the oxidation mechanism and the rinsing mechanism to prevent the cleaning liquid from different cleaning stations from mixing. The cleaning liquid sprayed in the spraying area of the rinsing mechanism backflows to the rinsing spray water tank, and the cleaning liquid sprayed in the spraying area of the oxidation mechanism backflows to the cleaning spray water tank of the cleaning mechanism for use. Finally, the waste water is discharged through the cleaning spray drainage pipe.

[0022] The method adopts a circulating water cleaning machine, which comprises a cleaning mechanism, an oxidation mechanism, a rinsing mechanism and a drying mechanism arranged in sequence; the silicon wafer to be cleaned enters through the cleaning tank inlet of the cleaning mechanism; a partition is arranged between the cleaning mechanism, the oxidation mechanism, the rinsing mechanism and the drying mechanism, the partition is provided with long through holes for conveying the silicon wafer, ultrasonic assemblies are vertically arranged in the oxidation mechanism, the rinsing mechanism and the cleaning mechanism, spray assemblies are arranged at the front ends of the oxidation mechanism, the rinsing mechanism and the cleaning mechanism to spray the silicon wafer, a plurality of upper and lower conveying rollers are arranged in the cleaning mechanism, the oxidation mechanism and the rinsing mechanism, the silicon wafer is sequentially transferred between the cleaning mechanism, the oxidation mechanism and the rinsing mechanism through the guiding transmission assembly, and a water blocking assembly is further arranged in the cleaning mechanism for blocking water.

[0023] The existing feeding device or wafer inserting machine feeds the silicon wafer to be cleaned to the cleaning tank inlet of the cleaning mechanism.

[0024] Compared with the prior art, the method has the following beneficial effects:

[0025] The circulating water cleaning machine provided by the application drives the upper and lower conveying rollers of the whole machine through the same main transmission hexagonal shaft by the special structure of the cleaning mechanism, the oxidation mechanism and the rinsing mechanism, so that the overall transmission is more stable, the silicon wafer loss is greatly reduced, and the work efficiency is greatly improved.

[0026] The circulating water cleaning machine provided by the application is provided with the water blocking assembly, the partition and the side groove, precise separation is achieved, the cleaning mechanism is provided with a cleaning water inlet tank and a cleaning spray tank, the oxidation mechanism is provided with an oxidation water tank, the rinsing mechanism is provided with a rinsing water tank and a rinsing spray tank, the mechanisms are not mixed with each other, continuous circulation is achieved, no additional carrying function is needed, no additional carrying robot or truss is needed, the upper operation space is reduced, and the workshop working condition is more comprehensive.

[0027] The application provides a circulating water cleaning machine, which is characterized in that the water flowing direction of the rinsing mechanism is reversely changed by the special structure of the water blocking component, so that the rinsing effect is better and the rinsing time is shortened. The special structure of the vertical supporting limiting plate and the height of the cleaning mechanism, and the structure of the side spraying and the bottom spraying are arranged, the side spraying removes the foam interference generated by the silicon wafer cleaning agent of the cleaning mechanism (small air bubbles are attached to the bottom when the silicon wafer is soaked in the liquid), and the bottom spraying is used to spray the small air bubbles attached to the surface of the silicon wafer, so that the silicon wafer cleaning agent can fully contact the silicon wafer in the air bubble area. The cleaning efficiency is greatly improved, and the manual operation is reduced. The manual operation is not needed, the machine does not need to be stopped for processing, and the cleaning effect is good.

[0028] The application provides a circulating water cleaning machine, which is characterized in that the water flowing direction of the rinsing mechanism is reversely changed by the special structure of the water blocking component, so that the rinsing effect is better and the rinsing time is shortened. The special structure of the vertical supporting limiting plate and the height of the cleaning mechanism, and the structure of the side spraying and the bottom spraying are arranged, the side spraying removes the foam interference generated by the silicon wafer cleaning agent of the cleaning mechanism (small air bubbles are attached to the bottom when the silicon wafer is soaked in the liquid), and the bottom spraying is used to spray the small air bubbles attached to the surface of the silicon wafer, so that the silicon wafer cleaning agent can fully contact the silicon wafer in the air bubble area. The cleaning efficiency is greatly improved, and the manual operation is reduced. The manual operation is not needed, the machine does not need to be stopped for processing, and the cleaning effect is good.

[0029] The application provides a circulating water cleaning machine, which is characterized in that the water flowing direction of the rinsing mechanism is reversely changed by the special structure of the water blocking component, so that the rinsing effect is better and the rinsing time is shortened. The special structure of the vertical supporting limiting plate and the height of the cleaning mechanism, and the structure of the side spraying and the bottom spraying are arranged, the side spraying removes the foam interference generated by the silicon wafer cleaning agent of the cleaning mechanism (small air bubbles are attached to the bottom when the silicon wafer is soaked in the liquid), and the bottom spraying is used to spray the small air bubbles attached to the surface of the silicon wafer, so that the silicon wafer cleaning agent can fully contact the silicon wafer in the air bubble area. The cleaning efficiency is greatly improved, and the manual operation is reduced. The manual operation is not needed, the machine does not need to be stopped for processing, and the cleaning effect is good. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 It is a front view of the circulating water cleaning machine.

[0031] Figure 2 It is a perspective view of the circulating water cleaning machine.

[0032] Figure 3 It is Figure 2 The schematic view after removing the frame.

[0033] Figure 4 It is a front view of the cleaning mechanism.

[0034] Figure 5 It is a top view of the cleaning mechanism.

[0035] Figure 6 It is Figure 5 The A-A sectional view of

[0036] Figure 7is a perspective view of the cleaning mechanism in embodiment 2 of the present invention.

[0037] Figure 8 is Figure 5 perspective view A after removing the top frame.

[0038] Figure 9 is Figure 8 partial enlarged view of region I in

[0039] Figure 10 is Figure 5 perspective view B after removing the top frame.

[0040] Figure 11 is a perspective view of the oxidation tank of the present invention.

[0041] Figure 12 is Figure 11 partial enlarged view of region I in

[0042] Figure 13 is a perspective view of the rinsing tank of the present invention.

[0043] Figure 14 is Figure 13 partial enlarged view of region I in

[0044] Figure 15 is a partial structure diagram of the cleaning tank of the present invention. In order to clearly show the position of the water blocking plate and the side structure, other components of the top and bottom are not shown.

[0045] Figure 16 is Figure 15 partial enlarged view in, wherein figure A is a partial enlarged view of region I, and figure B is a partial enlarged view of region II.

[0046] Figure 17 is a partial structure diagram of the oxidation tank of the present invention. In order to clearly show the position of the water blocking plate and the side structure, other components of the top and bottom are not shown.

[0047] Figure 18 is a partial structure diagram of the rinsing tank of the present invention. In order to clearly show the position of the water blocking plate and the side structure, other components of the top and bottom are not shown.

[0048] Figure 19 is a perspective view of the cleaning tank of the present invention.

[0049] Figure 20 is a structure diagram of the cleaning tank body.

[0050] Figure 21Fig. 1 is a structural schematic diagram of the vertical support limiting plate of the present application, wherein Fig. A is a structural schematic diagram of vertical support limiting plate A, and Fig. B is a structural schematic diagram of vertical support limiting plate B.

[0051] Figure 22 Fig. 2 is a structural schematic diagram of the guiding transmission assembly of the present application.

[0052] Figure 23 Fig. 3 is a structural schematic diagram of the ultrasonic assembly of the present application, wherein Fig. A is a structural schematic diagram after removing one side ultrasonic baffle, and Fig. B is a structural schematic diagram without removing the ultrasonic baffle.

[0053] Figure 24 Fig. 4 is a structural schematic diagram of the spraying assembly A of the present application, wherein Fig. A is a perspective view, Fig. B is a perspective view after removing the dust cover, and Fig. C is a perspective view after removing the dust cover and vertical baffle.

[0054] Figure 25 Fig. 5 is a structural diagram of the cleaning water inlet tank, wherein Fig. A is a perspective view, and Fig. B is a perspective view of the cleaning water inlet tank after removing the water tank baffle.

[0055] Figure 26 Fig. 6 is a structural diagram of the cleaning spraying water tank, wherein Fig. A is a perspective view, and Fig. B is an A-A sectional view of Fig. A.

[0056] Figure 27 Fig. 7 is a structural schematic diagram of the drying groove of the present application.

[0057] In the figure: 1. cleaning mechanism, 2. oxidation mechanism, 3. rinsing mechanism, 4. drying mechanism, 7. silicon wafer, 101. cleaning water inlet tank, 102. cleaning spray water tank, 103. spray assembly A, 104. cleaning spray zone water inlet pipe, 105. cleaning spray side pipe, 106. cleaning spray drainage pipe, 107. backflow guide, 108. cleaning water pump, 109. cleaning spray water pump, 110. cleaning upper water-blocking roller A, 111. cleaning upper water-blocking roller B, 112. cleaning water inlet valve, 113. auxiliary spray water valve, 114. upper conveying roller, 115. lower conveying roller, 116. cleaning lower water-blocking roller, 117. water-blocking plate, 118. liquid level float switch A, 119. liquid level float switch B, 120. cleaning tank discharge port, 121. cleaning frame body, 122. main water inlet pipe, 123. pneumatic diaphragm valve A, 124. cleaning tank drainage pipe, 125. main transmission support seat, 126. main transmission hexagonal shaft, 127. driving bevel gear, 128. driven bevel gear, 129. driven gear, 130. drive motor mounting plate, 131. drive driving sprocket, 132. drive chain, 133. drive driven sprocket, 134. sprocket fixed support plate, 135. overflow guide pipe connector, 136. temperature sensor A, 137. ultrasonic vibration box, 138. drive motor A, 139. bearing, 140. driving gear, 141. temperature sensor fixing support, 142. liquid level float switch C, 143. side groove, 144. cleaning drainage port A, 145. cleaning spray drainage port, 146. lower vertical plate, 147. upper vertical plate, 148. blocking block, 149. adjustment bolt hole, 150. cleaning drainage port B, 151. ultrasonic wave connecting pipe, 152. cleaning pipe clamp, 153. cleaning tank bottom plate, 154. cleaning bottom nozzle, 155. cleaning bottom spray pipe, 156. plug, 157. ultrasonic wave support, 158. ultrasonic wave groove, 159. ultrasonic wave vibrator, 160. cleaning spray drainage connector, 201. oxidation water tank, 202. spray assembly B, 203. oxidation spray zone water inlet pipe, 204. oxidation upper water-blocking roller A, 205. oxidation upper water-blocking roller B, 206. oxidation drainage port A, 207. oxidation backflow connector, 208. oxidation drainage port B, 209. oxidation spray drainage connector, 210. oxidation spray drainage port, 301. rinsing spray water tank, 302. rinsing water tank, 303. spray assembly C, 304. rinsing oxidation water inlet pipe, 305. rinsing spray zone water inlet pipe, 306. rinsing upper water-blocking roller A, 307. rinsing upper water-blocking roller B, 308. flow meter, 309. rinsing water inlet pipe, 310. rinsing tank drainage pipe, 311. rinsing tank backwater pipe, 312. rinsing tank backflow pipe, 313. rinsing spray backflow pipe, 314. rinsing backflow connector A, 315. rinsing backflow connector B, 316. rinsing spray drainage connector, 317. rinsing spray drainage port, 318. rinsing drainage port A, 319. rinsing drainage port B, 401.Fan, 402. Air knife support, 403. Drying drain pipe, 404. Air knife, 405. Drying tank body, 406. Drive motor B, 407. Drive driving wheel, 408. Chain, 409. Drive motor fixing plate, 410. Drive driven wheel, 10101. Heating rod A, 10102. Cleaning water tank drain, 10103. Overflow drain pipe A, 10104. Pneumatic diaphragm valve B, 10105. Return pipe A, 10106. Top cover A, 10107. Temperature liquid level sensor A, 10108. Return chamber A, 10109. Pressing ring, 10110. Filter bag A, 10111. Cleaning water tank body, 10112. Water tank baffle, 10201. Overflow drain pipe B, 10202. Top cover B, 10203. Vertical pump fixing seat, 10204. Return chamber B, 10205. Vertical pump water outlet pipe, 10206. Pneumatic diaphragm valve C, 10207. Liquid level switch, 10208. Filter bag B, 10209. Filter basket, 10301. Cleaning tank inlet, 10302. Spray cover, 10303. Nozzle A, 10304. Upper spray pipe, 10305. Spray pipe mounting seat, 10306. Lower spray pipe, 10307. Sensor mounting bracket, 10308. Optical fiber sensor, 10309. U-shaped tube clamp, 10310. Lower spray baffle, 10311. Pressure gauge, 10312. Temperature sensor B, 10313. Manual ball valve B, 10314. Spray pipe water inlet connector, 10315. Cleaning spray drain connector hole, 10316. Splash plate, 10317. Spray pipe support, 10501. Nozzle B, 11501. Mandrel, 11502. Conveying pressing ring, 11503. Limiting ring, 60901. Motor C, 60902. Motor mounting plate, 60903. Leg, 60904. Roller support plate B, 60905. Roller connecting plate, 60906. Driving wheel B, 60907. Driven wheel B, 60908. Synchronous belt D, 60909. Transmission shaft, 60910. Pulley mounting fixing plate, 60911. Synchronous belt E, 60912. Pulley B, 60913. Coupling C. DETAILED DESCRIPTION

[0058] The application will be described in detail below through specific examples, but the protection scope of the application is not limited. Unless otherwise specified, the components used in the application can be obtained from commercial channels.

[0059] Example 1

[0060] A kind of circulating water cleaning machine, including cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, drying mechanism 4 arranged in sequence;Between cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, drying mechanism 4, setting baffle, long through-hole for the transport of silicon wafer is set on baffle, and ultrasonic assembly is vertically arranged in oxidation mechanism 2, rinsing mechanism 3, cleaning mechanism 1, and the front end in oxidation mechanism 2, rinsing mechanism 3, cleaning mechanism 1 is arranged spray assembly and is sprayed to silicon wafer, and a plurality of upper and lower two layers of transport roller are arranged in cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, drying mechanism 4, and the transport of silicon wafer in cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, drying mechanism 4 is sequentially transferred by the gap of the transport of silicon wafer in cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, drying mechanism 4, and the water resistance component for water resistance is also provided in cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3.

[0061] A plurality of upper and lower two layers of transport roller are arranged in cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, drying mechanism 4, and the transport of silicon wafer is circulated by the gap of the transport of silicon wafer in cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, drying mechanism 4, and the transport of silicon wafer is respectively arranged on the vertical support limiting plate in the two ends of the transport of silicon wafer in cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, drying mechanism 4, one end of the transport of silicon wafer in cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, drying mechanism 4 is connected with bearing 139, and the other end is inserted after vertical support limiting plate and is connected with the main transmission hexagonal shaft 126 in guiding transmission component to realize transmission.

[0062] Cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, drying mechanism 4 share a main transmission hexagonal shaft 126, and the two ends of the main transmission hexagonal shaft 126 are connected with the output end of drive motor A 138 and the output end of drive motor B 406 respectively, drive motor A 138 is arranged outside cleaning mechanism 1, and drive motor B 406 is arranged outside drying mechanism 4.

[0063] Drive motor A 138 is arranged below the cleaning tank of cleaning mechanism 1 by drive motor mounting plate 130, the output end of drive motor A 138 is connected with drive driving sprocket 131, drive driving sprocket 131 is connected with drive driven sprocket 133 through drive chain 132, drive driven sprocket 133 is arranged on the outer wall of the cleaning tank of cleaning mechanism 1 by sprocket fixed support plate 134, and drive driven sprocket 133 is connected with main transmission hexagonal shaft 126.

[0064] Drive motor B 406 is arranged below the drying tank of drying mechanism 4 by drive motor fixing plate 409, the output end of drive motor B 406 is connected with drive driving wheel 407, drive driving wheel 407 is connected with drive driven wheel 410 through chain 408, drive driven wheel 410 is arranged on the outer wall of the drying tank of drying mechanism 4 by sprocket fixing plate, and drive driven wheel 410 is connected with main transmission hexagonal shaft 126.

[0065] The upper and lower conveying rollers are respectively an upper conveying roller 114 and a lower conveying roller 115; the upper conveying roller 114 is located above the lower conveying roller 115; the guiding transmission assembly comprises a main transmission hexagonal shaft 126, a plurality of driving bevel gears 127 are sleeved on the main transmission hexagonal shaft 126, the driving bevel gears 127 are in meshing connection with driven bevel gears 128, the driving bevel gears 127 and the driven bevel gears 128 are vertically arranged, the driving bevel gears 127 are vertically arranged, and the driven bevel gears 128 are horizontally arranged. One end of the upper conveying roller 114 is connected with a driven gear 129, one end of the lower conveying roller 115 is connected with a driving gear 140, the driven gear 129 is in meshing connection with the driving gear 140, and the front end of the driving gear 140 is provided with the driven bevel gear 128; the driving gear 140 and the driven bevel gear 128 are arranged on a core shaft 11501.

[0066] The main transmission hexagonal shaft 126 is arranged in the side groove 143 of the cleaning mechanism 1, the oxidizing mechanism 2, the rinsing mechanism 3 and the drying mechanism 4 through a plurality of main transmission support seats 125, and the two ends of the main transmission hexagonal shaft 126 respectively extend out of the cleaning mechanism 1 and the drying mechanism 4.

[0067] The vertical support limiting plate comprises a vertical support limiting plate A and a vertical support limiting plate B; the vertical support limiting plate B is arranged on one side adjacent to the guiding transmission assembly, the vertical support limiting plate A and the vertical support limiting plate B are oppositely arranged, the vertical support limiting plate A comprises a lower vertical plate 146 and an upper vertical plate 147; the upper vertical plate 147 is arranged above the lower vertical plate 146, a plurality of grooves are arranged on the upper vertical plate 147, the distance between every two adjacent grooves is the same as the width of the ultrasonic wave vibration box 137; an insertion block 156 and a blocking block 148 are arranged in the grooves; the insertion block 156 is arranged above the blocking block 148, a circular channel formed between the insertion block 156 and the groove is used for the core shaft 11501 of the lower conveying roller 115 to pass through; and a circular channel formed between the bottom of the blocking block 148 and the insertion block 156 is used for the core shaft 11501 of the lower conveying roller 115 to pass through. The upper vertical plate is adjustably connected with the lower vertical plate through a plurality of adjusting bolts.

[0068] The lower vertical plate 146 of the vertical support limiting plate A and the vertical support limiting plate B is provided with a drainage opening according to specific working conditions.

[0069] In the cleaning mechanism 1, the height of the vertical support limiting plate A is higher than the height of the vertical support limiting plate B. In the oxidizing mechanism 2, the rinsing mechanism 3 and the drying mechanism 4, the height of the vertical support limiting plate A is the same as the height of the vertical support limiting plate B.

[0070] In the cleaning mechanism 1, the oxidation mechanism 2 and the rinsing mechanism 3, temperature sensors A136 and liquid level float switches C142 are further arranged on the vertical support limiting plate B, the temperature sensors A136 and the liquid level float switches C142 are arranged side by side, the temperature sensors A136 are connected with the vertical support limiting plate B through temperature sensor fixing supports 141, and the liquid level float switches C142 are connected with the vertical support limiting plate B through liquid level float switch C142 fixing supports.

[0071] The upper conveying roller 114 comprises a mandrel 11501, a plurality of pressing pieces are arranged on the mandrel 11501, the plurality of pressing pieces are equidistantly arranged, the pressing pieces comprise conveying pressing rings 11502 and limiting rings 11503, and one limiting ring 11503 is arranged at each end of the conveying pressing ring 11502. The mandrel 11501 is a stainless steel shaft. The conveying pressing ring 11502 is made of PVDF material.

[0072] The lower conveying roller 115 is a pp roller, the inside of the lower conveying roller 115 is the mandrel 11501, and the outer periphery of the lower conveying roller 115 is made of pp material. The mandrel 11501 is a stainless steel shaft.

[0073] The ultrasonic assembly is arranged on the inner side of the vertical support limiting plate A and the vertical support limiting plate B, the ultrasonic assembly comprises a plurality of ultrasonic wave supports 157, a plurality of ultrasonic wave vibration boxes 137 are arranged on the ultrasonic wave support 157, the plurality of ultrasonic wave vibration boxes 137 are continuously arranged, an ultrasonic wave groove 158 is arranged between adjacent two ultrasonic wave vibration boxes 137, and the mandrel 11501 of the upper conveying roller 114 and the lower conveying roller 115 passes through the ultrasonic wave groove 158 and is arranged in the vertical support limiting plate A or the vertical support limiting plate B.

[0074] A commercially available ultrasonic vibrator 159 is arranged in the ultrasonic wave vibration box 137, and an ultrasonic wave connecting pipe 151 is further preferably arranged on the top of the ultrasonic wave vibration box 137 and is used for being connected with an ultrasonic generator.

[0075] The cleaning mechanism 1 comprises a cleaning tank, a cleaning water inlet tank 101, and a cleaning spray water tank 102. A spray area and a cleaning area are arranged in the cleaning tank. A partition plate is arranged between the cleaning area and the spray area. A passage groove for passing the silicon wafer is arranged on the partition plate. A spray assembly A 103 is arranged in the spray area for spraying the silicon wafer. The silicon wafer after being sprayed enters the cleaning area to realize cleaning. Both the cleaning area and the spray area are provided with upper and lower two layers of conveying rollers. Water blocking assemblies are arranged at the front and rear ends of the cleaning area. The silicon wafer passes through the gap between the upper and lower two layers of conveying rollers. A side groove 143 is arranged in the cleaning tank and located at the side of the spray area and the cleaning area. The upper part of the side groove 143 is used for placing a guide transmission assembly, and the bottom part is used for draining and returning water. The cleaning water inlet tank 101 and the cleaning spray water tank 102 are arranged below the cleaning tank. The cleaning water inlet tank 101 is connected with the bottom of the cleaning tank to realize water feeding of the cleaning tank. The cleaning water inlet tank 101 is connected with the side of the cleaning tank to realize water return. The cleaning water inlet tank 101 is connected with the cleaning spray side pipe 105 at the side of the cleaning tank to realize side spraying. The cleaning spray water tank 102 is connected with the spray assembly A 103 to realize water supply of the spray area. The cleaning tank is arranged on a cleaning frame body 121.

[0076] The outer side of the water blocking assembly is provided with an upper conveying roller 114 and a lower conveying roller 115. The water blocking components near the spray area include a cleaning upper water blocking roller A 110 and a cleaning lower water blocking roller 116. The cleaning upper water blocking roller A 110 is arranged above the cleaning lower water blocking roller 116. A water blocking plate 117 is tangentially arranged below the cleaning lower water blocking roller 116. The water blocking plate 117 is vertically arranged on the cleaning tank bottom plate 153. The water blocking components near the oxidation mechanism 2 include a cleaning upper water blocking roller B 111 and a cleaning lower water blocking roller 116. The cleaning upper water blocking roller B 111 is arranged above the cleaning lower water blocking roller 116. The water blocking plate 117 is tangentially arranged below the cleaning lower water blocking roller 116. The water blocking plate 117 is vertically arranged on the cleaning tank bottom plate 153.

[0077] The cleaning upper water blocking roller A 110 and the cleaning upper water blocking roller B 111 are stainless steel shafts, the outer periphery of which is sleeved with a polypropylene sleeve. The outer periphery of the polypropylene sleeve is sleeved with a pp sponge. The cleaning lower water blocking roller 116 is a stainless steel shaft, the outer periphery of which is sleeved with a polypropylene sleeve.

[0078] The outer diameter of the cleaning upper water blocking roller A 110 and the cleaning upper water blocking roller B 111 is greater than the outer diameter of the upper conveying roller 114. The outer diameter of the cleaning lower water blocking roller 116 is greater than the outer diameter of the lower conveying roller 115. The setting height of the cleaning upper water blocking roller A 110 and the cleaning upper water blocking roller B 111 is the same.

[0079] The overflow guide pipe 135 is connected with the backflow pipe A10105 of the cleaning water inlet tank 101, and realizes backflow. The overflow guide pipe 135 and the backflow pipe A10105 jointly form the backflow guide 107, and realize stable backflow.

[0080] During use in the cleaning tank, the surface additive is added for cleaning the workpiece 7 silicon wafer. During actual cleaning, the cleaning spray side pipe 105 is arranged above the vertical support limiting plate A, the cleaning spray side pipe 105 sprays water, the foam floating on the upper layer is sprayed to the side of the vertical support limiting plate B, and the vertical support limiting plate A is higher than the vertical support limiting plate B. The foam is flushed into the side tank 143, and the foam is removed.

[0081] The cleaning spray side pipe 105 is provided with a plurality of nozzles B10501.

[0082] The cleaning spray side pipe 105 is connected with the cleaning water inlet tank 101 through the auxiliary spray side pipe, the cleaning water inlet tank 101 is connected with the cleaning spray side pipe 105 through the main water inlet pipe 122, the auxiliary spray pipe and the auxiliary spray side pipe in sequence. The auxiliary spray pipe is provided with an auxiliary spray water valve 113.

[0083] The spray assembly A103 is connected with the cleaning spray water tank 102 through the cleaning spray area water inlet pipe 104.

[0084] Among the two water blocking plates 117 in the cleaning tank, the water blocking plate 117 close to the oxidation mechanism 2 and the water blocking area formed by the partition plate, the bottom of the vertical support limiting plate B at the water blocking area is provided with a cleaning drain B150. The water blocking plate 117 close to the spray assembly A103 and the water blocking area formed by the partition plate, the bottom of the vertical support limiting plate B at the water blocking area is provided with a cleaning drain A144. The cleaning drain B150 and the cleaning drain A144 are communicated with the side tank 143.

[0085] The partition plate separating the cleaning tank and the oxidation tank of the oxidation mechanism 2 is provided with a cleaning tank discharge port 120.

[0086] The cleaning tank further comprises a cleaning tank bottom plate 153, a cleaning bottom water inlet main pipe is arranged on the cleaning tank bottom plate 153, the cleaning bottom water inlet main pipe is connected with the cleaning water inlet tank 101, the cleaning bottom water inlet main pipe is connected with a plurality of cleaning bottom spray pipes 155, the cleaning bottom spray pipes 155 are perpendicular to the cleaning bottom water inlet main pipe, a plurality of cleaning bottom spray nozzles 154 are arranged on the cleaning bottom spray pipes 155, and the cleaning bottom spray pipes 155 are arranged on the cleaning tank bottom plate 153 through the cleaning pipe clamps 152. The cleaning bottom spray pipes 155 are arranged in parallel with the partition plates, and the spray nozzles of the cleaning bottom spray pipes 155 are arranged towards the gap between the upper conveying rollers 114 and the lower conveying rollers 115. The cleaning tank bottom plate 153 is further provided with a cleaning main water inlet, the cleaning main water inlet is connected with the cleaning water inlet tank 101 through a bottom main water inlet pipe, and the bottom main water inlet pipe is provided with a cleaning water inlet valve 112. The bottom main water inlet pipe is connected with the cleaning water inlet tank 101 through the main water inlet pipe 122. The cleaning bottom water inlet main pipe is connected with the cleaning water inlet tank 101 through an auxiliary spraying branch pipe, and the cleaning water inlet tank 101 is connected with the cleaning bottom water inlet main pipe in sequence through the main water inlet pipe 122, the auxiliary spraying pipe and the auxiliary spraying branch pipe.

[0087] The cleaning tank bottom plate 153 of the cleaning tank is further communicated with a cleaning tank drain pipe 124 for draining water. The cleaning tank drain pipe 124 is provided with a pneumatic diaphragm valve A 123.

[0088] The upper conveying rollers 114 and the lower conveying rollers 115 are not in contact with the ultrasonic assembly.

[0089] The spraying area and the cleaning area are provided with through holes at the middle positions of the partition plates in the side tank 143 area for guiding the passing of the assembly.

[0090] The spraying assembly A 103 is arranged between two partition plates, the cleaning tank inlet 10301 is arranged on the outer partition plate, the spraying assembly A 103 outlet is arranged on the inner partition plate, and the inner partition plate is used to separate the spraying area and the cleaning area; the spraying assembly A 103 is separated from the lower part of the side tank 143 through the vertical support limiting plate B, but the cleaning spraying drain port 145 is arranged below the vertical support limiting plate B in the area of the spraying assembly A 103, the cleaning spraying drain connection pipe 160 is arranged on the outer wall of the corresponding side tank 143 of the spraying assembly A 103, and the cleaning spraying drain connection pipe 160 is connected with the cleaning spraying drain pipe 106 to realize the drainage of the area of the spraying assembly A 103.

[0091] The spraying assembly A103 comprises an upper spraying pipe 10304 and a lower spraying pipe 10306, the upper spraying pipe 10304 is arranged above the lower spraying pipe 10306, the upper spraying pipe 10304 and the lower spraying pipe 10306 are connected through a spraying connecting pipe, a plurality of nozzles A10303 are arranged on the upper spraying pipe 10304 and the lower spraying pipe 10306, a water baffle 10316 is arranged at the front end of the upper spraying pipe 10304, a plurality of optical fiber sensors 10308 are arranged on the water baffle 10316, and a lower spraying baffle 10310 is arranged at the front end of the lower spraying pipe 10306.

[0092] The plurality of optical fiber sensors 10308 are arranged on the water baffle 10316 through a sensor mounting bracket 10307.

[0093] The water baffle 10316 is connected with a spraying pipe bracket 10317. The water baffle 10316 has a Z-shaped structure, and the plates at the bottom and the top are arranged to be inclined for waterproofing. The lower spraying baffle 10310 is arranged on the bottom surface of the spraying area bottom plate. The lower spraying baffle 10310 has a Z-shaped structure, and the plates at the bottom and the top are arranged to be inclined for waterproofing.

[0094] The lower spraying pipe 10306 is arranged on the bottom surface of the spraying area bottom plate through a lower spraying pipe mounting seat 10305. The upper spraying pipe 10304 is fixed on the spraying pipe bracket 10317 above it through a U-shaped pipe clamp 10309. The nozzles A10303 on the upper spraying pipe 10304 are arranged downward, and the nozzles A10303 on the lower spraying pipe 10306 are arranged upward.

[0095] A spraying cover 10302 is arranged on the top of the spraying assembly A103, and a spraying handle is arranged on the top surface of the spraying cover 10302.

[0096] The spraying pipe bracket 10317 is fixed on the cleaning frame.

[0097] The upper spraying pipe 10304 and the lower spraying pipe 10306 and the spraying connecting pipe have a U-shaped structure, and the upper spraying pipe 10304 is further provided with a spraying pipe water inlet connector 10314 at the end not connected with the spraying connecting pipe, the spraying pipe water inlet connector 10314 is arranged vertically, and the spraying pipe water inlet connector 10314 is connected with a cleaning spraying area water inlet pipe 104.

[0098] The cleaning spraying area water inlet pipe 104 is sequentially provided with a manual ball valve B10313, a pressure gauge 10311 and a temperature sensor B10312 in the water inlet direction.

[0099] The cleaning water inlet tank 101 comprises a cleaning water inlet tank body 10111, a heating rod A10101 is arranged on the inner bottom of the cleaning water inlet tank body 10111, a reflux chamber A10108 is arranged above the heating rod A10101, one end of the reflux chamber A10108 is communicated with a reflux pipe A10105, and the other end of the reflux chamber A10108 is communicated with the inner bottom of the cleaning water inlet tank body 10111 through a filter bag A10110.

[0100] A cleaning water pump 108 is arranged on the side of the cleaning water inlet tank 101, and the cleaning water pump 108 is connected with the water outlet end of the cleaning water inlet tank 101. The cleaning water pump 108 is arranged on a main water inlet pipe 122.

[0101] A detachable water tank baffle 10112 is further arranged on the side wall of the cleaning water inlet tank body 10111.

[0102] A temperature liquid level sensor A10107 is further arranged in the cleaning water inlet tank 101, the temperature liquid level sensor A10107 is arranged in the lower area of the cleaning spray tank 102 from the top of the cleaning water inlet tank body 10111 but does not contact the bottom surface. A liquid level float switch A118 is further arranged in the lower part of the cleaning water inlet tank 101.

[0103] A top cover A10106 is further arranged on the top surface of the cleaning water inlet tank body 10111, and the top cover A10106 is arranged above the filter bag A10110 in the reflux chamber A10108.

[0104] A cleaning water inlet tank drain 10102 is arranged on the side bottom of the cleaning water inlet tank body 10111, the cleaning water inlet tank drain 10102 is connected with a cleaning water inlet tank drain pipe, and a pneumatic diaphragm valve B10104 is arranged on the cleaning water inlet tank drain pipe.

[0105] An overflow drain pipe A10103 is further connected to the upper part of the side of the cleaning water inlet tank body 10111.

[0106] The cleaning spray water tank 102 comprises a cleaning spray tank body, a cleaning spray water pump 109 is arranged on the cleaning spray tank body, the cleaning spray water pump 109 is arranged vertically, part of the cleaning spray water pump 109 is inserted into the cleaning spray tank body, the cleaning spray water pump 109 is connected with a vertical pump water outlet pipe 10205 in the cleaning spray tank body, the vertical pump water outlet pipe 10205 extends out of the top surface of the cleaning spray tank body and is arranged to be connected with a cleaning spray area water inlet pipe 104; a backflow chamber B 10204 is further arranged on the upper part of the cleaning spray tank body, a backwater outlet is arranged on the side of the upper part of the backflow chamber B 10204 for backwater, the bottom of the backflow chamber B 10204 is communicated with the bottom of the cleaning spray tank body through a filter bag B 10208; the filter bag B 10208 is arranged on the bottom surface of the backflow chamber B 10204 through a pressing ring 10109. A filter basket 10209 is arranged outside the filter bag. The upper part of the filter basket 10209 is arranged on the bottom surface of the backflow chamber B 10204 through the pressing ring 10109.

[0107] A top cover B 10202 is further arranged on the top surface of the cleaning spray tank body, the top cover B 10202 is arranged above the filter bag B 10208 in the backflow chamber B 10204.

[0108] Two liquid level switches 10207 are further arranged in the lower part of the cleaning spray tank 102, the liquid level switches 10207 are liquid level float ball switches B 119.

[0109] The cleaning spray water pump 109 is connected with the cleaning spray tank body through a vertical pump fixing seat 10203.

[0110] A cleaning spray tank drain is arranged on the bottom of the side surface of the cleaning spray tank body, the cleaning spray tank drain is connected with a cleaning spray tank drain pipe, a pneumatic diaphragm valve C 10206 is arranged on the cleaning spray tank drain pipe.

[0111] An overflow drain pipe B 10201 is further connected with the upper part of the side surface of the cleaning spray tank 102.

[0112] The oxidation mechanism 2 comprises an oxidation tank, an oxidation water tank 201, a spraying area and an oxidation area are arranged in the oxidation tank, a partition plate is arranged between the oxidation area and the spraying area, a channel groove for the silicon wafer to pass through is arranged on the partition plate, a spraying assembly B 202 is arranged in the spraying area for spraying the silicon wafer, and the silicon wafer after being sprayed enters the oxidation area to realize oxidation; both upper and lower conveying rollers are arranged in the oxidation area and the spraying area, water blocking assemblies are arranged at the front and rear ends of the oxidation area, the silicon wafer passes through the gap between the upper and lower conveying rollers, a side groove 143 is arranged in the oxidation tank, and the side groove 143 is located at the side of the oxidation area and the spraying area; the upper part of the side groove 143 is used for placing a guide transmission assembly, and the bottom part is used for draining and returning water; the oxidation water tank 201 is arranged below the oxidation tank, the oxidation water tank 201 is connected with the bottom of the oxidation tank to realize water feeding of the oxidation tank, the oxidation water tank 201 is connected with the side of the oxidation tank to realize water return, the inlet of the cleaning spraying water tank 102 is connected with the oxidation spraying drainage port 210 of the side wall of the side groove 143 of the spraying area of the oxidation tank to realize water supply of the spraying area of the cleaning tank, and the oxidation tank is arranged on the oxidation frame body.

[0113] The oxidation water tank 201 is not provided with a return pipe A 10105 at the top, and the position of the return pipe A 10105 is replaced by a return pipe A 10105. The other structures are the same as those of the cleaning water feeding tank 101.

[0114] The outer side of the water blocking assembly is provided with an upper conveying roller 114 and a lower conveying roller 115. The water blocking assembly close to the spraying area comprises an oxidation upper water blocking roller A 204 and an oxidation lower water blocking roller, the oxidation upper water blocking roller A 204 is arranged above the oxidation lower water blocking roller, a water blocking plate 117 is arranged tangentially below the oxidation lower water blocking roller, and the water blocking plate 117 is vertically arranged on the bottom plate of the oxidation tank. The water blocking assembly close to the rinsing mechanism 3 comprises an oxidation upper water blocking roller B 205 and an oxidation lower water blocking roller, the oxidation upper water blocking roller B 205 is arranged above the oxidation lower water blocking roller, a water blocking plate 117 is arranged tangentially below the oxidation lower water blocking roller, and the water blocking plate 117 is vertically arranged on the bottom plate of the oxidation tank.

[0115] The oxidation upper water blocking roller A 204 and the oxidation upper water blocking roller B 205 are made of a stainless steel shaft, a polypropylene sleeve is arranged on the outer periphery of the stainless steel shaft, and a pp sponge is further arranged on the outer periphery of the polypropylene sleeve. The oxidation lower water blocking roller is made of a stainless steel shaft, and a polypropylene sleeve is arranged on the outer periphery of the stainless steel shaft.

[0116] The outer diameter of the oxidation upper water blocking roller A 204 and the oxidation upper water blocking roller B 205 is greater than that of the upper conveying roller 114, and the outer diameter of the oxidation lower water blocking roller is greater than that of the lower conveying roller 115. The setting height of the oxidation upper water blocking roller A 204 and the oxidation upper water blocking roller B 205 is the same.

[0117] The middle region of the side tank 143 of the oxidation zone is also provided with an oxidation backflow connector 207, which is connected with the backflow pipe of the oxidation water tank 201 to realize backwater.

[0118] The water inlet pipe 203 of the oxidation spray zone is sequentially provided with a manual ball valve B10313, a pressure gauge 10311 and a temperature sensor B10312 in the water inlet direction.

[0119] The spray assembly B202 is connected with the rinsing spray water tank 301 through the water inlet pipe 203 of the oxidation spray zone to realize spray water supply.

[0120] Among the two water blocking plates 117 in the oxidation tank, the water blocking plate 117 close to the rinsing mechanism 3 and the water blocking area formed by the partition plate, the bottom of the vertical support limiting plate B at the water blocking area is provided with an oxidation drain A206. The water blocking plate 117 close to the spray assembly B202 and the water blocking area formed by the partition plate, the bottom of the vertical support limiting plate B at the water blocking area is provided with an oxidation drain B208. The oxidation drain A206 and the oxidation drain B208 are communicated with the side tank 143.

[0121] The partition plate separating the oxidation tank and the rinsing tank of the rinsing mechanism 3 is provided with an oxidation tank discharge port.

[0122] The oxidation tank also includes an oxidation tank bottom plate, and the oxidation tank bottom plate is provided with an oxidation main water inlet, which is connected with the oxidation water inlet tank through a bottom oxidation main water inlet pipe, and the bottom oxidation main water inlet pipe is provided with an oxidation water inlet valve.

[0123] The oxidation tank bottom plate of the oxidation tank is also communicated with an oxidation tank drain pipe for drainage. The oxidation tank drain pipe is provided with an adjusting valve. The adjusting valve is a pneumatic diaphragm valve.

[0124] The partition plate of the oxidation zone and the spray zone at the middle position of the side tank 143 region is provided with a through hole for guiding the passing of the assembly.

[0125] The spraying assembly B202 is identical in structure to the spraying assembly A103. The water inlet pipe of the spraying assembly B202 is connected with the water inlet pipe 203 of the oxidation spraying zone, and the water inlet pipe 203 is connected with the rinsing spraying water tank 301 of the rinsing mechanism 3. The spraying assembly B202 is arranged between two partitions, one of which is shared with the cleaning tank, and the other of which is provided with a discharge port of the spraying assembly B202. The inner partition is used to separate the spraying zone and the oxidation zone. The spraying assembly B202 is separated from the lower part of the side tank 143 by the vertical support limiting plate B, but the oxidation spraying drainage port 210 is arranged below the vertical support limiting plate B in the region of the spraying assembly B202. The oxidation spraying drainage pipe 209 is arranged on the outer wall of the corresponding side tank 143 of the spraying assembly B202, and is connected with the cleaning spraying water tank 102 to supply water to the region of the spraying assembly A103 of the cleaning tank.

[0126] The rinsing mechanism 3 comprises a rinsing tank, a rinsing spraying water tank 301 and a rinsing water tank 302. The rinsing tank is provided with a spraying zone and a rinsing zone. A partition is arranged between the rinsing zone and the spraying zone. A channel groove for passing the silicon wafer is arranged on the partition. The spraying assembly C303 is arranged in the spraying zone to spray the silicon wafer. The silicon wafer is sprayed and then enters the rinsing zone to be rinsed. The rinsing zone and the spraying zone are both provided with upper and lower conveying rollers. Water blocking assemblies are arranged at the front end and the rear end of the rinsing zone. The silicon wafer passes through the gap between the upper and lower conveying rollers. The side tank 143 is arranged in the rinsing tank and located at the side of the rinsing zone and the spraying zone. The upper part of the side tank 143 is used to place the guiding and transferring assembly, and the bottom part is used for drainage and backflow. The rinsing water tank 302 and the rinsing spraying water tank 301 are arranged below the rinsing tank. The rinsing water tank 302 is connected with the bottom of the rinsing tank to supply water to the rinsing tank. The rinsing water tank 302 is connected with the side of the rinsing tank to realize backflow of water. The rinsing spraying water tank 301 is connected with the side of the rinsing tank at the front end and connected with the rinsing spraying drainage pipe 316 arranged on the side wall of the side tank 143 in the spraying zone of the rinsing tank to realize backflow of water. The outlet of the rinsing spraying water tank 301 is connected with the rinsing oxidation water inlet pipe 304 to supply water to the spraying zone of the rinsing tank and the spraying zone of the oxidation tank. The rinsing tank is arranged on the rinsing frame body.

[0127] The rinsing water tank 302 is identical in structure to the oxidation water tank 201. The rinsing spraying water tank 301 is identical in structure to the cleaning spraying water tank 102.

[0128] The outer side of the water blocking assembly is provided with an upper conveying roller 114 and a lower conveying roller 115. The water blocking component near the spraying area includes a rinsing upper water blocking roller A 306 and a rinsing lower water blocking roller. The rinsing upper water blocking roller A 306 is arranged above the rinsing lower water blocking roller. A water blocking plate 117 is tangentially arranged below the rinsing lower water blocking roller. The water blocking plate 117 is vertically arranged on the rinsing tank bottom plate. The water blocking component near the drying mechanism 4 includes a rinsing upper water blocking roller B 307 and a rinsing lower water blocking roller. The rinsing upper water blocking roller B 307 is arranged above the rinsing lower water blocking roller. A water blocking plate 117 is tangentially arranged below the rinsing lower water blocking roller. The water blocking plate 117 is vertically arranged on the rinsing tank bottom plate.

[0129] The rinsing upper water blocking roller A 306 and the rinsing upper water blocking roller B 307 are made of a stainless steel shaft, a polypropylene sleeve is arranged on the outer periphery of the stainless steel shaft, and a pp sponge is arranged on the outer periphery of the polypropylene sleeve. The rinsing lower water blocking roller is made of a stainless steel shaft, and a polypropylene sleeve is arranged on the outer periphery of the stainless steel shaft.

[0130] The outer diameter of the rinsing upper water blocking roller A 306 and the rinsing upper water blocking roller B 307 is greater than the outer diameter of the upper conveying roller 114. The outer diameter of the rinsing upper water blocking roller B 307 is greater than the outer diameter of the rinsing upper water blocking roller A 306. The outer diameter of the rinsing lower water blocking roller is greater than the outer diameter of the lower conveying roller 115. The rinsing upper water blocking roller A 306 and the rinsing upper water blocking roller B 307 are arranged at different heights. The height of the rinsing upper water blocking roller B 307 is greater than the height of the rinsing upper water blocking roller A 306.

[0131] The rinsing oxidation water inlet pipe 304 is connected with the rinsing spraying area water inlet pipe 305 and the oxidation spraying area water inlet pipe 203 respectively. The rinsing spraying area water inlet pipe 305 is connected with the spraying pipe water inlet connector in the spraying assembly C 303. The oxidation spraying area water inlet pipe 203 is connected with the spraying pipe water inlet connector in the spraying assembly B 202.

[0132] The rinsing spraying area water inlet pipe 305 is sequentially provided with a manual ball valve B 10313, a pressure gauge 10311 and a temperature sensor B 10312 in the water inlet direction.

[0133] The rinsing backflow connector A 314 is arranged in the rear section area of the side tank 143 in the rinsing area. The rinsing backflow connector A 314 is connected with the rinsing tank backwater pipe 311 of the rinsing water tank 302 to realize backwater. The rinsing backflow connector B 315 is arranged on the outer wall of the rinsing area near the spraying area. The rinsing backflow connector B 315 is connected with the rinsing spraying water tank 301 through the rinsing tank backflow pipe 312.

[0134] The spraying assembly C 303 is connected with the rinsing spraying water tank 301 through the rinsing spraying area water inlet pipe 305 to realize spraying water supply.

[0135] In the two water-blocking plates 117 in the rinsing tank, the water-blocking plate 117 close to the drying mechanism 4 forms a water-blocking area with the partition plate, and the bottom of the vertical support limiting plate B at the water-blocking area is provided with a rinsing drainage port B319. The water-blocking plate 117 close to the spraying assembly C303 forms a water-blocking area with the partition plate, and the bottom of the vertical support limiting plate B at the water-blocking area is provided with a rinsing drainage port A318. The rinsing drainage port A318, the rinsing drainage port B319 and the side tank 143 are communicated.

[0136] The rinsing water pump outlet of the rinsing water tank 302 is provided with a flow meter 308 for monitoring the water consumption.

[0137] The partition plate separating the rinsing tank and the drying tank of the drying mechanism 4 is provided with a rinsing tank discharge port.

[0138] The rinsing tank further comprises a rinsing tank bottom plate, and a rinsing main water inlet is arranged on the rinsing tank bottom plate. The rinsing main water inlet is connected with the rinsing water pump outlet of the rinsing water tank 302 through a rinsing water inlet pipe 309, and a rinsing water inlet valve is arranged on the rinsing water inlet pipe 309. The rinsing main water inlet is arranged on one side close to the drying mechanism 4.

[0139] The rinsing tank bottom plate of the rinsing tank is further communicated with a rinsing tank drainage pipe 310 for drainage. An adjusting valve is arranged on the rinsing tank drainage pipe 310. The adjusting valve is a pneumatic diaphragm valve.

[0140] The partition plate separating the rinsing area and the spraying area is provided with a through hole at a middle position in the area of the side tank 143 for guiding the passing of the transmission assembly.

[0141] The spraying assembly C303 has the same structure as the spraying assembly A103. The spraying pipe water inlet connector of the spraying assembly C303 is connected with a rinsing spraying area water inlet pipe 305, the rinsing spraying area water inlet pipe 305 is connected with the rinsing spraying water tank 301 through a rinsing oxidation water inlet pipe 304. The spraying assembly C303 is arranged between two partition plates. The outer partition plate is shared with the oxidation tank, and the inner partition plate is provided with a spraying assembly C303 discharge port. The inner partition plate is used to separate the spraying area and the rinsing area. The spraying assembly C303 is separated from the lower part of the side tank 143 through the vertical support limiting plate B. However, the rinsing spraying drainage connector 316 is arranged on the outer wall of the corresponding side tank 143 of the spraying assembly C303, the rinsing spraying drainage connector 316 is connected with the rinsing spraying water tank 301 through the rinsing spraying backflow pipe 313 to realize the water supply of the spraying assembly B202 and the spraying assembly C303.

[0142] The drying mechanism 4 comprises a drying groove, one baffle is arranged at each end of the drying groove, a passage groove for passing the silicon wafer is arranged on the baffle, the baffle arranged close to the rinsing mechanism 3 is a baffle shared with the rinsing mechanism 3, and the passage groove arranged on the other baffle is used for conveying the processed silicon wafer to the discharging device 6.

[0143] A drying area is arranged in the drying groove, and upper and lower conveying rollers are arranged in the drying area, the silicon wafer passes through the gap between the upper and lower conveying rollers, a side groove 143 is arranged in the drying groove, and the side groove 143 is located at the side of the drying area; the upper part of the side groove 143 is used for placing a guiding and transferring assembly, and the bottom of the side groove 143 is used for draining water; a plurality of air knives 404 are arranged in the drying area, the air knives 404 are arranged on the bottom plate of the drying groove through an air knife support 402, the air knives 404 are communicated with a fan 401 arranged below a drying groove body 405 through an air duct pipeline, and the air knives 404 are arranged in two layers.

[0144] The drying groove and the fan 401 are arranged on the drying frame body.

[0145] The drying groove further comprises the drying groove body 405, and the bottom of the drying groove body 405 is further connected with a drying drainage pipe 403.

[0146] Further, the workpiece 7 in the application is a silicon wafer.

[0147] The application further comprises a PLC control system, the cleaning water inlet tank 101, the cleaning spray water tank 102, the spray assembly A 103, the cleaning water pump 108, the cleaning spray water pump 109, the cleaning water inlet valve 112, the auxiliary spray water valve 113, the liquid level float switch A 118, the liquid level float switch B 119, the pneumatic diaphragm valve A 123, the temperature sensor A 136, the ultrasonic generator, the driving motor A 138, the liquid level float switch C 142, the cleaning bottom nozzle 154, the oxidation water tank 201, the rinsing spray water tank 301, the rinsing water tank 302, the spray assembly B 202, the spray assembly C 303, the flow meter 308, the fan 401, the driving motor B 406, the heating rod A 10101, the pneumatic diaphragm valve B 10104, the temperature liquid level sensor A 10107, the pneumatic diaphragm valve C 10206, the liquid level switch 10207, the nozzle A 10303, the optical fiber sensor 10308, the pressure gauge 10311, the temperature sensor B 10312, the nozzle B 10501, the motor C 60901, the loading proximity switch, the oxidation water inlet valve, the adjusting valve and the rinsing water inlet valve are connected with the PLC control system, and are not limited to a specific model, and the working functions thereof are realized.

[0148] Example 2

[0149] The water cleaning machine for recycling water of embodiment 1 can be provided with two, which can be arranged side by side or arranged in upper and lower layers. When arranged in upper and lower layers, the water tanks of the cleaning mechanism 1, the oxidation mechanism 2 and the rinsing mechanism 3 can share the lower layer.

[0150] Specific work: the existing plug-in machine (market products are not the application points, only explain the working description) transfer the workpiece silicon wafer 7, conveying to the cleaning mechanism 1 in the cleaning tank inlet 10301. By driving motor A138, driving motor B406 simultaneously drive the main transmission hex shaft 126, and then in turn drive the driving bevel gear 127, driven bevel gear 128, driving gear 140, driven gear 129 rotation, and then drive the gap transmission silicon wafer 7 in the middle of the upper and lower two layers of conveying roller, and the vertically arranged ultrasonic assembly ultrasonic work, silicon wafer 7 in turn through the cleaning mechanism 1 cleaning, oxidation mechanism 2 oxidation, rinsing mechanism 3 rinsing, drying mechanism 4 drying; wherein the cleaning mechanism 1 cleaning, silicon wafer 7 first enters the spray assembly A103 in the spray area, the optical fiber sensor 10308 gives the silicon wafer in place signal feedback to the PLC control system, the PLC control system gives the cleaning spray water tank 102 working instruction, nozzle A10303 up and down spray on the silicon wafer 7, the spray water along the corresponding side groove 143 bottom through the outer wall on the setting cleaning spray drainage connector 160 and cleaning spray drainage pipe 106 to realize drainage, the silicon wafer 7 after spraying through one upper and lower two layers of conveying roller after the middle of the cleaning upper water blocking roller A110, cleaning lower water blocking roller 116 into the cleaning area, after cleaning the surface active agent solution in the cleaning area, the silicon wafer 7 through the cleaning upper water blocking roller B111, cleaning lower water blocking roller 116 after passing through one upper and lower two layers of conveying roller into the oxidation mechanism 2 for oxidation, in the cleaning mechanism 1 in the cleaning area, the height of the vertical support limiting plate A is higher than the height of the vertical support limiting plate B. The spray setting of the side of the cleaning mechanism 1 blows the foam on the top layer to the side groove 143 direction, the foam flows into the side groove and returns to the cleaning inlet water tank 101, which can be discharged through the overflow drainage pipe A10103 in the cleaning inlet water tank 101. The spray setting at the bottom of the cleaning mechanism 1 can remove the small bubbles in the silicon wafer 7. The silicon wafer 7 after cleaning in the cleaning mechanism 1 enters the spray assembly B in the oxidation mechanism 2 for spraying, and its conveying and ultrasonic and water blocking are the same as the cleaning mechanism 1. The silicon wafer 7 after oxidation in the oxidation mechanism 1 enters the rinsing mechanism 3 for rinsing, the water flow direction is opposite to the silicon wafer 7 flow direction, and the height of the rinsing upper water blocking roller B307 is higher than the height of the rinsing upper water blocking roller A306. It satisfies the reverse rinsing, and the rinsing effect is better. The silicon wafer 7 after rinsing enters the drying mechanism 4, and is dried by the air knife 404 in the drying mechanism 4, and is conveyed to the discharging device 6 through the passage groove on the partition plate.The water used by the cleaning mechanism 1, the oxidizing mechanism 2 and the rinsing mechanism 3 is in a recycling mode. The cleaning mechanism 1 is provided with a cleaning inlet water tank 101 and a cleaning spray water tank 102. The oxidizing mechanism 2 is provided with an oxidizing water tank 201. The rinsing mechanism 3 is provided with a rinsing water tank 302 and a rinsing spray water tank 301. The cleaning inlet water tank 101 is used to supply water to the cleaning tank in the cleaning mechanism 1 and the spray and bottom spray of the cleaning tank. The water drained from the cleaning area of the cleaning tank is returned to the cleaning inlet water tank 101 and, after filtration, is used as the water source to supply the cleaning tank and the spray and bottom spray of the cleaning tank. The cleaning spray water tank 102 is used to supply water to the spray area of the cleaning tank in the cleaning mechanism 1. The water drained from the spray area of the oxidizing tank is returned to the cleaning spray water tank 102 and, after filtration, is used as the water source to supply the spray area of the cleaning tank. The outlet of the oxidizing water tank 201 is provided with a flow meter 308 to monitor the water consumption. The rinsing spray water tank 301 is used to supply water to the spray area of the rinsing tank and the spray area of the oxidizing tank. The water drained from the spray area of the rinsing tank and the front end of the rinsing tank is returned to the rinsing spray water tank 301 and, after filtration, is used as the water source to supply the spray area of the rinsing tank and the spray area of the oxidizing tank. The rinsing water tank 302 is used to supply water to the rinsing tank of the rinsing mechanism 3. The water drained from the rear end of the rinsing tank is returned to the rinsing water tank 302. The outlet of the rinsing water tank 302 is provided with a flow meter 308 to monitor the water consumption. The silicon wafer 7 is transferred from the drying mechanism 4 to the next process.

[0151] The above-described embodiments are merely preferred embodiments of the present application, and are not all-encompassing of all embodiments of the present application. Any obvious modifications made by those skilled in the art without departing from the principles and spirit of the present application should be considered within the scope of the claims of the present application.

Claims

1. A method of operating a recirculating water cleaning machine, characterized by, It comprises the following steps: The water used in the cleaning mechanism (1), the oxidizing mechanism (2) and the rinsing mechanism (3) is recycled; the cleaning mechanism (1) is provided with a cleaning water inlet tank (101) and a cleaning spray water tank (102), the oxidizing mechanism (2) is provided with an oxidizing water tank (201), and the rinsing mechanism (3) is provided with a rinsing water tank (302) and a rinsing spray water tank (301); The cleaning water inlet tank (101) is used to supply water to the cleaning tank in the cleaning mechanism (1) and the spray and bottom spray of the cleaning tank, the drainage from the cleaning area of the cleaning tank is returned to the cleaning water inlet tank (101) and is filtered to be used as the water source for the cleaning tank and the spray and bottom spray of the cleaning tank; The cleaning spray water tank (102) is used to supply water to the spray area of the cleaning tank in the cleaning mechanism (1), and the drainage from the spray area of the oxidation tank is returned to the cleaning spray water tank (102) and is filtered to be used as the water source for the spray area of the cleaning tank; The oxidizing water tank (201) is used to supply water to the oxidation tank in the oxidizing water tank (201), and the drainage from the middle part of the oxidation tank is returned to the oxidizing water tank (201) and is filtered to be used as the water source for the oxidation tank; The rinsing spray water tank (301) is used to supply water to the spray area of the rinsing tank and the spray area of the oxidation tank, and the drainage from the spray area of the rinsing tank and the front end of the rinsing tank is returned to the rinsing spray water tank (301) and is filtered to be used as the water source for the spray area of the rinsing tank and the spray area of the oxidation tank; The rinsing water tank (302) is used to supply water to the rinsing tank in the rinsing mechanism (3), and the drainage from the rear terminal of the rinsing tank is returned to the rinsing water tank (302), and a flow meter (308) is arranged at the outlet of the rinsing water tank (302) to monitor the water consumption; The silicon wafer (7) to be cleaned is conveyed by the upper and lower conveying rollers, sequentially passes through the cleaning mechanism (1), the oxidizing mechanism (2), the rinsing mechanism (3) and the drying mechanism (4) to realize cleaning-oxidizing-rinsing-drying, the ultrasonic assembly is arranged in the cleaning mechanism (1), the oxidizing mechanism (2) and the rinsing mechanism (3) to assist the overall cleaning, and the water blocking assembly is arranged to block the interference between the mechanisms, the cleaning mechanism (1), the oxidizing mechanism (2), the rinsing mechanism (3) and the drying mechanism (4) are driven by a main transmission hexagonal shaft (126) to realize stable transmission of the upper and lower conveying rollers, the upper conveying roller in the upper layer is floatingly arranged to realize stable conveying of the silicon wafer (7), and the dried silicon wafer (7) is sent to the next process.

2. The method of claim 1 wherein the water is recirculated. The method adopts a circulating water cleaning machine, which comprises sequentially arranged cleaning mechanism (1), oxidation mechanism (2), rinsing mechanism (3) and drying mechanism (4); the cleaning mechanism (1), the oxidation mechanism (2), the rinsing mechanism (3) and the drying mechanism (4) are provided with partitions, the partitions are provided with long through holes for silicon wafer conveying, the oxidation mechanism (2), the rinsing mechanism (3) and the cleaning mechanism (1) are vertically provided with ultrasonic assemblies, the front ends of the oxidation mechanism (2), the rinsing mechanism (3) and the cleaning mechanism (1) are provided with spraying assemblies for spraying silicon wafers, the cleaning mechanism (1), the oxidation mechanism (2), the rinsing mechanism (3) and the drying mechanism (4) are provided with a plurality of upper and lower conveying rollers, the upper and lower conveying rollers are connected with the bearing (139) at one end and connected with the main transmission hexagonal shaft (126) of the guiding transmission assembly at the other end to realize transmission.

3. The operating method of the circulating water cleaning machine as described in claim 2, characterized in that, The cleaning mechanism (1) comprises a cleaning tank, a cleaning water inlet tank (101) and a cleaning spraying water tank (102), the cleaning tank is provided with a spraying area and a cleaning area, a partition is arranged between the cleaning area and the spraying area, the partition is provided with a channel groove for the silicon wafer to pass through, the spraying area is provided with a spraying assembly A (103) for spraying the silicon wafer, the sprayed silicon wafer enters the cleaning area to realize cleaning; the cleaning area and the spraying area are provided with upper and lower conveying rollers, the front and rear ends of the cleaning area are provided with water blocking assemblies, the silicon wafer passes through the gap between the upper and lower conveying rollers, the cleaning tank is provided with a side groove (143) located at the side of the spraying area and the cleaning area; the upper part of the side groove (143) is used for placing the guiding transmission assembly, and the bottom part is used for draining and returning water; the cleaning water inlet tank (101) and the cleaning spraying water tank (102) are arranged below the cleaning tank, the cleaning water inlet tank (101) is connected with the bottom of the cleaning tank to supply water to the cleaning tank, the cleaning water inlet tank (101) is connected with the side of the cleaning tank to return water, the cleaning water inlet tank (101) is connected with the cleaning spraying side pipe (105) of the side of the cleaning tank to realize side spraying, and the cleaning spraying water tank (102) is connected with the spraying assembly A (103) to supply water to the spraying area.

4. The method of claim 2, wherein the water is heated to a temperature of about 60°C to about 80°C. ​ 5. The method of claim 2 wherein the water is recycled. The cleaning mechanism (1), the oxidation mechanism (2), the rinsing mechanism (3) and the drying mechanism (4) share a main transmission hexagonal shaft (126), the two ends of the main transmission hexagonal shaft (126) are connected with the output ends of the driving motor A (138) and the driving motor B (406) respectively, the driving motor A (138) is arranged outside the cleaning mechanism (1), and the driving motor B (406) is arranged outside the drying mechanism (4).

6. The method of claim 2, wherein the water used in the cleaning process is recycled. The upper and lower conveying rollers are respectively an upper conveying roller (114) and a lower conveying roller (115), the upper conveying roller (114) is located above the lower conveying roller (115), the guiding transmission assembly comprises a main transmission hexagonal shaft (126), a plurality of driving bevel gears (127) are sleeved on the main transmission hexagonal shaft (126), the driving bevel gears (127) are in meshing connection with driven bevel gears (128), the driving bevel gears (127) and the driven bevel gears (128) are perpendicular to each other, the driving bevel gears (127) are vertically arranged, and the driven bevel gears (128) are horizontally arranged; one end of the upper conveying roller (114) is connected with a driven gear (129), one end of the lower conveying roller (115) is connected with a driving gear (140), the driven gear (129) is in meshing connection with the driving gear (140), and the front end of the driving gear (140) is provided with the driven bevel gear (128); the driving gear (140) and the driven bevel gear (128) are arranged on a mandrel (11501). The main transmission hexagonal shaft (126) is arranged in the side groove (143) of the cleaning mechanism (1), the oxidation mechanism (2), the rinsing mechanism (3) and the drying mechanism (4) through a plurality of main transmission support seats (125), and the two ends of the main transmission hexagonal shaft (126) protrude out of the cleaning mechanism (1) and the drying mechanism (4) respectively.

7. The operating method of the circulating water cleaning machine as described in claim 3, characterized in that, The vertical support limiting plates comprise a vertical support limiting plate A and a vertical support limiting plate B, the vertical support limiting plate B is arranged on one side adjacent to the guiding transmission assembly, the vertical support limiting plate A and the vertical support limiting plate B are oppositely arranged, the vertical support limiting plate A comprises a lower vertical plate (146) and an upper vertical plate (147), the upper vertical plate (147) is arranged above the lower vertical plate (146), a plurality of grooves are arranged on the upper vertical plate (147), the distance between every two adjacent grooves is the same as the width of the ultrasonic wave vibration box (137), an insertion block (156) and a blocking block (148) are arranged in the grooves, the insertion block (156) is arranged above the blocking block (148), a circular channel formed between the insertion block (156) and the groove is used for the mandrel (11501) of the lower conveying roller (115) to pass through, and a circular channel formed between the bottom of the blocking block (148) and the insertion block (156) is used for the mandrel (11501) of the lower conveying roller (115) to pass through; the upper vertical plate is adjustably connected with the lower vertical plate through a plurality of adjusting bolts; in the cleaning mechanism (1), the height of the vertical support limiting plate A is higher than that of the vertical support limiting plate B; in the oxidation mechanism (2), the rinsing mechanism (3) and the drying mechanism (4), the height of the vertical support limiting plate A is the same as that of the vertical support limiting plate B.

8. The operating method of the circulating water cleaning machine as described in claim 3, characterized in that, The outer side of the water blocking assembly in the cleaning mechanism (1) is provided with an upper conveying roller (114) and a lower conveying roller (115); the water blocking member close to the spraying area comprises a cleaning upper water blocking roller A (110) and a cleaning lower water blocking roller (116), the cleaning upper water blocking roller A (110) is arranged above the cleaning lower water blocking roller (116), and a water blocking plate (117) is arranged below the cleaning lower water blocking roller (116) in a tangent manner, and the water blocking plate (117) is vertically arranged on the cleaning tank bottom plate (153); the water blocking member close to the oxidation mechanism (2) comprises a cleaning upper water blocking roller B (111) and a cleaning lower water blocking roller (116), the cleaning upper water blocking roller B (111) is arranged above the cleaning lower water blocking roller (116), and a water blocking plate (117) is arranged below the cleaning lower water blocking roller (116) in a tangent manner, and the water blocking plate (117) is vertically arranged on the cleaning tank bottom plate (153); The water blocking assembly of the oxidation mechanism (2) is the same in structure as the water blocking assembly of the cleaning mechanism (2); in the rinsing mechanism (3), the height of the rinsing upper water blocking roller B (307) is higher than that of the rinsing upper water blocking roller A (306).

9. The method of claim 6 wherein the water is recycled. The upper conveying roller (114) comprises a mandrel (11501), a plurality of pressing members are arranged on the mandrel (11501), the plurality of pressing members are equidistantly arranged, and the pressing members comprise conveying pressing rings (11502) and limiting rings (11503); the conveying pressing rings (11502) are respectively provided with a limiting ring (11503) at two ends.

10. The method of claim 7, wherein the water used in the cleaning process is recycled. The ultrasonic assembly is arranged on the inner side of the vertical support limiting plate A and the vertical support limiting plate B, the ultrasonic assembly comprises a plurality of ultrasonic wave supports (157), a plurality of ultrasonic wave vibration boxes (137) are arranged on the ultrasonic wave supports (157), the plurality of ultrasonic wave vibration boxes (137) are continuously arranged, an ultrasonic wave groove (158) is arranged between adjacent two ultrasonic wave vibration boxes (137), and the mandrel (11501) of the upper conveying roller (114) and the lower conveying roller (115) passes through the ultrasonic wave groove (158) and is arranged in the vertical support limiting plate A or the vertical support limiting plate B; in the rinsing mechanism (3), the height of the rinsing upper water blocking roller B (307) of the water blocking assembly is higher than that of the rinsing upper water blocking roller A (306).

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