Display device and electronic device including the same

Abstract

Disclosed are a display device and an electronic device including the same, the display device may include: a sub-pixel over a base layer and including a light emitting element; a light sensing pixel over the base layer and including a light receiving element configured to acquire a sensing signal corresponding to light emitted from the light emitting element; and a touch sensor layer configured to acquire information related to a touch input, and including a conductive pattern layer forming a sensing electrode, the conductive pattern layer includes a second conductive pattern layer including a body portion surrounding the light receiving element in plan view and arm portions extending in respective directions from the body portion, and a second conductive pattern layer in a layer different from the second conductive pattern layer and included in respective regions between respective ones of the arm portions in plan view. And a first conductive pattern layer of separated segments.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2024-0094516, filed on July 17, 2024, in the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. TECHNICAL FIELD

[0002] Various embodiments of the present disclosure relate to a display device and to an electronic device including the same. BACKGROUND

[0003] As progress is made in the face of an information society, the demand for display devices configured to display images has increased in various types. Recently, research and development have been conducted on a technology of integrating a sensor for recognizing input information, such as a fingerprint, into at least a portion of a display panel that covers a large area of a display device. SUMMARY

[0004] Aspects of the present disclosure relate to a display device in which a light sensing pixel can have improved light sensing performance, thereby making it possible to clearly detect an external input, and to an electronic device including the same.

[0005] Aspects of the present disclosure relate to a display device having improved viewing angle characteristics, and to an electronic device including the same.

[0006] Aspects of the present disclosure relate to a display device having improved touch sensitivity and an electronic device including the same.

[0007] One or more embodiments of the present disclosure can provide a display device including a sub-pixel above a base layer and including a light emitting element, a light sensing pixel above the base layer and including a light receiving element configured to acquire a sensing signal corresponding to light emitted from the light emitting element, and a touch sensor layer configured to acquire information related to a touch input and including a conductive pattern layer forming a sensing electrode, and the conductive pattern layer includes a second conductive pattern layer including a main body portion enclosing the light receiving element in a plan view and an arm portion extending from the main body portion in a corresponding direction, and a first conductive pattern layer in a different layer from the second conductive pattern layer and including segments separated from each other in a corresponding area between corresponding arm portions among the arm portions in the plan view.

[0008] The display device can further include a sensing area having the sensing electrode therein, a display area having the sub-pixel therein, the display area including an emission area and being overlapped with the sensing area, and a fingerprint sensing area having the light sensing pixel therein, the fingerprint sensing area including a light receiving area and being overlapped with the display area.

[0009] The second conductive pattern layer can include a hole region superposed with the light-receiving region.

[0010] The segment can be around a periphery of the second conductive pattern layer, and can be separated from the hole region and the light-receiving region in a plan view.

[0011] One of the segments can be between the emission region and the second conductive pattern layer in a plan view, and can be in a ring structure of the second conductive pattern layer surrounding the emission region.

[0012] The first conductive pattern layer can include a range facing the emission end, facing the emission region, and defining a light output path of light emitted from the light emitting element; and a range facing the optical end, facing the light-receiving region.

[0013] The range facing the emission end can define a range of an external light path of external light applied from the outside of the display device.

[0014] The light output path can have a first interface angle with respect to a thickness direction of the base layer, the first interface angle having a maximum value when the light output path is directly adjacent to the range facing the emission end, wherein the external light path has a second interface angle with respect to the thickness direction, the second interface angle having a maximum value when the external light path is directly adjacent to the range facing the emission end.

[0015] The second interface angle can be greater than the first interface angle.

[0016] The range facing the optical end and the second conductive pattern layer can be separated in a plan view.

[0017] One end of the range facing the optical end and the second conductive pattern layer can be aligned.

[0018] The first conductive pattern layer and the second conductive pattern layer can be superposed, and can be electrically insulated from each other.

[0019] The first conductive pattern layer and the second conductive pattern layer can be superposed, and can be electrically connected to each other.

[0020] The first conductive pattern layer and the second conductive pattern layer can be separated in a plan view.

[0021] The segment can include an electrically floating isolation portion.

[0022] The light receiving element can include a light receiving layer, wherein the light emitting element includes an emission layer, wherein the touch sensor layer includes: a sensor base layer including a base and a first conductive pattern layer above the base; and an intermediate insulating layer between the first conductive pattern layer and a second conductive pattern layer, wherein the display device further includes a pixel definition layer covering a portion of the light receiving layer and a portion of the emission layer, and an encapsulation layer covering the light receiving element and the light emitting element, the sensor base layer being directly on the encapsulation layer.

[0023] One or more embodiments of the disclosure can provide a display device including: a sub-pixel above a base layer and including a light emitting element; a light sensing pixel above the base layer and including a light receiving element configured to acquire a sensing signal corresponding to light emitted from the light emitting element; and a touch sensor layer configured to acquire information related to a touch input and including a conductive pattern layer forming a sensing electrode, and the conductive pattern layer includes a first conductive pattern layer, a second conductive pattern layer having a portion forming a hole region overlapping the light receiving element and another portion forming a sidewall, and an intermediate insulating layer between the first conductive pattern layer and the second conductive pattern layer, and the intermediate insulating layer has a first thickness in a first region overlapping the hole region and a second thickness smaller than the first thickness in a second region, wherein the sidewall is between the first region and the second region.

[0024] The first conductive pattern layer can not surround a periphery of the hole region.

[0025] The second conductive pattern layer can include: an upper component above the intermediate insulating layer having the first thickness in the first region; and a lower component above the intermediate insulating layer having the second thickness in the second region, wherein the sidewall is between the lower component and the upper component.

[0026] One or more embodiments of the disclosure can provide an electronic device including a processor configured to provide input image data, a power supply configured to supply power, a display device configured to receive the power and display an image based on the input image data, and the display device includes: a sub-pixel including a light emitting element; a light sensing pixel including a light receiving element configured to acquire a sensing signal corresponding to light emitted from the light emitting element; and a touch sensor layer configured to acquire information related to a touch input; and including a conductive pattern layer forming a sensing electrode, and the conductive pattern layer includes a second conductive pattern layer including a main portion enclosing the light receiving element in a plan view and an arm portion extending from the main portion in a corresponding direction, and a first conductive pattern layer in a different layer from the second conductive pattern layer and including segments separated from each other in a corresponding region between corresponding arm portions among the arm portions in the plan view.

[0027] The electronic device can include a smartphone, a television, a monitor, a tablet, an electric vehicle, a mobile phone, a tablet personal computer (PC), a mobile communication terminal, an electronic notebook, an electronic book, a portable multimedia player (PMP), a navigation device, an ultra-mobile PC (UMPC), a laptop computer, a billboard, an Internet of Things (IoT) device, a smart watch, a watch phone, or a head-mounted display (HMD). BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a schematic cross-sectional view illustrating a display device according to one or more embodiments.

[0029] Figure 2 and Figure 3 is a schematic plan view illustrating a display device according to one or more embodiments.

[0030] Figure 4 is a schematic cross-sectional view illustrating a display panel according to one or more embodiments.

[0031] Figure 5 is a schematic cross-sectional view illustrating a touch sensor layer according to one or more embodiments.

[0032] Figure 6 is a schematic plan view illustrating a sensing electrode according to one or more embodiments.

[0033] Figure 7 is a schematic cross-sectional view illustrating a touch sensor layer according to one or more embodiments.

[0034] Figure 8 and Figure 9 is a schematic plan view illustrating a portion of a display area including a fingerprint sensing area in a display device according to one or more embodiments.

[0035] Figure 10 is a schematic cross-sectional view taken along a line C-C' of Figure 8 and Figure 9

[0036] Figures 11 to 14 is a schematic cross-sectional view taken along a line D-D' of Figure 8 and Figure 9

[0037] Figure 15 and Figure 16 is a schematic enlarged view of an area EA1 of Figure 9

[0038] Figure 17 ​​​is a schematic plan view showing a portion of a display area of a display device including a fingerprint sensing area according to one or more embodiments.

[0039] Figure 18 is a schematic cross-sectional view taken along line E-E' of Figure 17 .

[0040] Figure 19 is a schematic block diagram showing an electronic device including a display device according to one or more embodiments.

[0041] Figure 20 is a schematic diagram showing an example in which the electronic device of Figure 19 is implemented as a smart phone.

[0042] Figure 21 is a schematic diagram showing an example in which the electronic device of Figure 19 is implemented as a tablet PC. DETAILED DESCRIPTION

[0043] Aspects of some embodiments of the present disclosure and methods of implementing the present disclosure can be more readily understood by reference to the following detailed description, taken with the accompanying drawings, in which like reference numerals may, when

[0044] The described embodiments can have various modifications and can be implemented in different forms and should not be interpreted as being limited to the embodiments shown herein. "May" used in describing the embodiments corresponds to one or more embodiments of the present disclosure.

[0045] It will be appreciated by persons of ordinary skill in the art that each suitable feature of various embodiments of the present disclosure can be partially or wholly combined or combined with each other in light of the overall disclosure, and can be technically interlocked and operated in various suitable ways, and each embodiment can be implemented independently of or in combination with each other in any suitable way, unless otherwise specified or implied.

[0046] In the drawings, the relative dimensions of elements, layers and regions shown in the figures can be exaggerated for clarity and / or descriptive purposes. In other words, the dimensions and / or thicknesses of the elements shown in the figures can be arbitrarily shown for purposes of description and / or illustration, and can not be shown to scale. Also, the use of cross- hatching and / or shading in the figures is for the purpose of clarity and / or illustration only and does not imply any particular material, material properties, dimensions, proportions, commonality of the illustrated elements, and / or any other characteristic, attribute, property, etc. of the elements shown in the figures, unless otherwise specified.

[0047] Various embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of embodiments and / or intermediate structures being utilized in the description of various embodiments. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. In addition, the descriptions herein of certain embodiments or features of embodiments can be presented in terms of sequences of actions, which can be performed by, for example, components of the embodiments, or by other means. The descriptions herein can not explicitly describe all permutations and / or combinations of actions or features. It will be apparent to those skilled in the art that numerous permutations and / or combinations can be derived from the descriptions herein without departing from the spirit and / or scope of the embodiments.

[0048] For example, an implant region shown as rectangular will typically have rounded (circular) or curved features at its edges and / or a gradient of implant concentration, rather than a binary change from the implant region to the non-implant region. Likewise, a buried region formed by implantation can cause some implantation in the region between the buried region and the surface through which implantation occurs.

[0049] For ease of description, spatially relative terms, such as “under”, “below”, “lower”, “bottom”, “on”, “above”, “upper”, “at or over”, “higher”, “top”, “side” (e.g., as in “sidewall”), and the like, can be used herein for describing the relationship between one element or feature to another element or feature as shown in the drawings. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or in operation, in addition to the orientations depicted in the drawings. For example, if a device in the drawings is turned over, elements described as “below” or “under” other elements or features would then be oriented “above” the other elements or features. Thus, the example terms “below” and “under” can encompass both orientations, depending on the orientation of the device. The device can be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. Similarly, when a first part (component) is described as being “on” a second part (component), it indicates that the first part (component) is disposed on a top side or bottom side of the second part (component), unless otherwise specified.

[0050] Furthermore, the phrase "in plan view" means when viewing the subject portion from above, and the phrase "in a schematic cross-sectional view" means when viewing a schematic cross-section taken through a vertical cut of the subject portion from the side. The term "overlying" or "overlie" means that a first object can be above or below or to the side of a second object, or vice versa. In addition, the term "overlying" can include, without limitation, stacked, facing or facing toward, extending over, covering or partially covering, or any other suitable term as will be appreciated and understood by one of ordinary skill in the art. The expression "not overlying" can include the meaning of "separated" or "offset" or "offset from" or any other suitable equivalent as will be appreciated and understood by one of ordinary skill in the art. The terms "facing" and "facing toward" can mean that a first object can be directly or indirectly opposite a second object. In case a third object is interposed between the first object and the second object, the first object and the second object can be understood as indirectly opposite each other, but still facing each other.

[0051] It will be understood that when an element, layer, region or component (for example, a device, apparatus, circuit, wire, electrode, terminal, conductive film, etc.) is referred to as being "formed on" another element, layer, region or component, "over" another element, layer, region or component, "connected to" or "coupled to" another element, layer, region or component, it can be directly formed on, directly over, directly connected to or directly coupled to the other element, layer, region or component, or indirectly formed on, indirectly over, indirectly connected to or indirectly coupled to the other element, layer, region or component, such that one or more intervening elements, layers, regions or components can be present. Further, this can be inclusive of direct or indirect coupling or connection and unitary or non-unitary coupling or connection. For example, when a layer, region or component is referred to as being "electrically connected" or "electrically coupled" to another layer, region or component, the layer, region or component can be directly electrically connected or directly coupled to the other layer, region and / or component, or one or more intervening layers, regions or components can be present. The one or more intervening components can include switches, transistors, resistors, inductors, capacitors, and / or diodes, etc. Thus, the connections are not limited to those shown in the drawings or detailed description, and can also include other types of connections. In describing embodiments, the expression of connection indicates electrical connection unless explicitly described as direct connection, and "directly connected / directly coupled" or "directly over" means that one component is directly connected or coupled to another component or is directly over another component without intervening components.

[0052] Also, in this Specification, when a portion of a layer, film, region, plate, etc. is formed "on" another portion, the direction of formation is not limited to an upward direction, but includes formation of the portion on a side surface or in a downward direction. Conversely, when a portion of a layer, film, region, plate, etc. is formed "under" another portion, this includes not only the case where the portion is "directly under" the other portion, but also the case where there is another portion between the portion and the other portion. At the same time, other expressions describing relationships between components, such as "between," "directly between," or "adjacent to" and "directly adjacent to," can be interpreted similarly. It will be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between the two elements or layers or one or more intervening elements or layers can also be present.

[0053] For purposes of the present disclosure, the expression such as "at least one of... or "any one of... or "one or more of when following a list of elements, modifies the entire list of elements and does not modify the individual elements of the list. For example, "at least one of X, Y, and Z" and "at least one of a group consisting of X, Y, and Z" can be interpreted as X alone, Y alone, Z alone, or any combination or set of two or more of X, Y, and Z (such as, for example, without limitation, XYZ, XY, YZ, and XZ), or any variation of the foregoing. Similarly, the expression "at least one of A and B" can include A, B, or A and B. As used herein, "or" generally means "and / or," and the term "and / or" includes any and all combinations of one or more of the associated listed items. For example, the expression "A and / or B" can include A, B, or A and B. Similarly, when an expression such as "at least one of... or "one or more of precedes or follows a list of elements, the expression modifies the entire list of elements and does not modify the individual elements of the list. In reciting "C to D," unless otherwise stated, "C to D" means C or greater and D or less.

[0054] It will be understood that, although the terms“first,”“second,”“third,” etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus,“a first element,”“a first component,”“a first region,”“a first area,”“a first layer,” or“a first section” described below could be termed a“second element,”“a second component,”“a second region,”“a second area,”“a second layer,” or“a second section,” without departing from the spirit and scope of the present disclosure. An element described as“first” need not necessarily be“primary” or“important” and can be“secondary” or“insignificant” in use. The terms“first,”“second,” etc. can also be used herein to distinguish different categories or sets of elements. For the sake of simplicity, the terms“first,”“second,” etc. can be used herein to designate the“first category (or first set)” and the“second category (or second set),” respectively, as an example.

[0055] In examples, the x-axis, the y-axis and / or the z-axis are not limited to the three axes of a rectangular coordinate system and can be interpreted in a broader sense. For example, the x-axis, the y-axis and the z-axis can be perpendicular to each other or can represent different directions that are not perpendicular to each other. The same applies to the first direction DR1, the second direction DR2 and / or the third direction DR3.

[0056] The terminology used herein is for the purpose of describing embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms“a,”“an” and“the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms“comprises,”“comprising,”“includes” and / or“including,” when used herein, specify the presence of stated features, integers, steps, operations, elements, and / or components but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0057] As used herein, the terms "substantially," "about," "approximately," and the like, are used as terms of approximation and not as terms of degree, and are intended to account for the inherent deviations in measured or calculated values that would be recognized by those of ordinary skill in the art. For example, "substantially" can include a range of + / - 5% of a recited value. As used herein, "about" or "approximately" includes the recited value and means within an acceptable range of deviation of the specific value, as determined by one of ordinary skill in the art, considering the measurement being discussed and the error in measuring the quantity (i.e., the limitations of the measurement system). For example, "about" or "approximately" can mean within one or more standard deviations, or within + / - 30%, + / - 20%, + / - 10%, + / - 5% of the recited value. Furthermore, the use of "may" when describing embodiments of the present disclosure means that one or more embodiments of the present disclosure. In addition, the expression "same" can mean "substantially the same." In other words, the expression "same" can include a range acceptable to one of ordinary skill in the art. Other expressions can also be expressions that omit "substantially."

[0058] In some embodiments, well-known structures and devices are described in the figures in terms of one or more functional blocks (e.g., block diagrams), units, and / or modules. Those skilled in the art will appreciate that these blocks, units, and / or modules are represented in the figures by logical blocks, individual components, microprocessors, hard-wired circuitry, memory elements, lines connecting elements, and other electronics. This can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. Blocks, units, and / or modules implemented by microprocessors or other similar hardware can be programmed and controlled using software to perform various functions discussed herein, and can have them selectively driven by firmware and / or software. In addition, each block, unit, and / or module can be implemented by dedicated hardware, or a combination of dedicated hardware that performs some functions and a processor (e.g., one or more programmed microprocessors and associated circuitry) that performs functions different from those of the dedicated hardware. In addition, in some embodiments, blocks, units, and / or modules can be physically separated into two or more individual blocks, units, and / or modules that interact with each other in some embodiments without departing from the scope of the present disclosure. In addition, in some embodiments, blocks, units, and / or modules can be physically combined into more complex blocks, units, and / or modules without departing from the scope of the present disclosure.

[0059] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and / or the present specification, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0060] Various embodiments of the present disclosure relate to a display device and an electronic device including the same. Hereinafter, a display device and an electronic device including the display device according to one or more embodiments will be described with reference to the accompanying drawings.

[0061] Hereinafter, a display device DD according to one or more embodiments will be described with reference to Figures 1 to 7

[0062] Figure 1 is a schematic cross-sectional view illustrating a display device DD according to one or more embodiments.

[0063] Referring to Figure 1 , the display device DD is configured to provide light. The display device DD can include a display panel DP and a touch sensor layer TSP. In one or more embodiments, the display device DD can further include a color filter layer CFL and a window layer WD.

[0064] The display panel DP can display visual information. The display panel DP can include various light sources capable of providing light. For example, the display panel DP can include an organic light emitting diode.

[0065] The touch sensor layer TSP can be directly on the display panel DP, or can be located on the display panel DP with a separate layer such as an adhesive layer or a substrate (or an insulating layer) interposed between the touch sensor layer TSP and the display panel DP (as used herein, "on" can mean "above").

[0066] The touch sensor layer TSP can be located on an image display surface of the display panel DP, and can be configured to receive a touch input from a user. The touch sensor layer TSP can acquire information related to the touch input. The touch sensor layer TSP can identify a touch event of the display device DD through a hand of the user or a separate input unit. The touch sensor layer TSP can identify a touch event using a capacitive method.

[0067] The touch sensor layer TSP can sense a touch input using a mutual capacitive method, or can sense a touch input using a self-capacitive method.

[0068] ​A color filter layer CFL can be located on the touch sensor layer TSP. The color filter layer CFL can include color filters CF (refer to Figure 10 ), each of which selectively transmits light of a corresponding color and includes a dye or a pigment. A window layer WD can be located on the color filter layer CFL. The window layer WD can protect the underlying layers from external impact and can provide an input surface and / or a display surface for a user. The window layer WD can transmit light. The window layer WD can be bonded to the color filter layer CFL by various methods such as using an adhesive layer.

[0069] The display device DD according to one or more embodiments is a device that displays moving images and / or still images. The display device DD can be applied to portable electronic devices such as mobile phones, smart phones, tablet personal computers (PCs), mobile communication terminals, electronic notebooks, electronic books, portable multimedia players (PMPs), navigation devices, and ultra-mobile PCs (UMPCs). For example, the display device DD can be applied to a display unit of a television, a laptop computer, a monitor, a billboard, or an Internet of Things (IoT) device. Alternatively, in one or more embodiments, the display device DD can be applied to a smart watch, a watch phone, and / or a head-mounted display device (HMD) for implementing virtual reality and / or augmented reality.

[0070] Figure 2 and Figure 3 is a schematic plan view illustrating a display device DD according to one or more embodiments. Figure 2 is a schematic plan view illustrating a display panel DP and a driving circuit portion DCP included in the display device DD according to one or more embodiments. Figure 3 is a schematic plan view illustrating a touch sensor layer TSP and a driving circuit portion DCP included in the display device DD according to one or more embodiments.

[0071] For ease of explanation, although Figure 2 and Figure 3 illustrate the driving circuit portion DCP separately from the display panel DP and the touch sensor layer TSP, the present disclosure is not limited thereto. In one or more embodiments, the entirety or a part of the driving circuit portion DCP can be implemented integrally with the display panel DP.

[0072] Referring to Figure 2 and Figure 3 , the display device DD can include a base substrate layer BSL and pixels PXL and sensing electrodes SP located on the base substrate layer BSL. The display device DD can include a driving circuit portion DCP. The driving circuit portion DCP can include a panel driver PNDP, a fingerprint detector FPDP, and a touch driver TDV.

[0073] The base layer BSL can form a base surface of the display device DD. In one or more embodiments, the base layer BSL can be a bottom substrate for depositing layers of the display device DD. The base layer BSL can be rigid, or can be a flexible substrate or film. For example, the base layer BSL can include a glass material. Alternatively, the base layer BSL can include a silicon material. As a further alternative, the base layer BSL can include a polyimide. However, the present disclosure is not limited to the foregoing examples.

[0074] The plane defined in the present specification can extend in the first direction DR1 and the second direction DR2, and can be defined based on a plane on which the base layer BSL is located. In one or more embodiments, the third direction DR3 can correspond to a thickness direction of the base layer BSL. The third direction DR3 can correspond to a light output direction of the display device DD.

[0075] The display device DD (or the display panel DP) can include a display area DA in which the pixels PXL are located, and a non-display area NDA in which the pixels PXL are omitted. The non-display area NDA can surround at least a portion of the display area DA. Various lines can be located in the non-display area NDA, pads (also referred to as "bond pads" or "bonding pads") can be located therein, and at least a portion of the driving circuit portion DCP can be located therein.

[0076] The pixel PXL can include a sub-pixel SPX. Two or more sub-pixels SPX can form a pixel (or a pixel unit) PXL.

[0077] According to one or more embodiments, the pixel PXL (or the sub-pixel SPX) can be arranged in a stripe or PENTILE ® arrangement, but the present disclosure is not limited thereto (PENTILE ® is a registered trademark of Samsung Display Co., Ltd. of Korea). Various embodiments can be applied to the present disclosure.

[0078] The display device DD can include a fingerprint sensing area FA in which the light sensing pixels PSR are located. The fingerprint sensing area FA can be an area in which a fingerprint input from a user can be sensed. In a plan view, the fingerprint sensing area FA can overlap the display area DA. The fingerprint sensing area FA can be inside the display area DA, and can partially surround a portion of the display area DA. The range of the fingerprint sensing area FA in the display device DD is not limited to any specific example.

[0079] In one or more embodiments, the fingerprint sensing area FA can overlap the display area DA. Accordingly, the pixels PXL can also be located in the fingerprint sensing area FA. Accordingly, in one or more embodiments, a fingerprint of a user can be sensed in an image visible area.

[0080] The light sensing pixels PSR can sense light emitted from a light source (e.g., a light emitting element LD as illustrated, for example) reflected by an external object (e.g., a user's finger). For example, each of the light sensing pixels PSR can sense information related to a fingerprint input from a user. Figure 4

[0081] The drive circuit portion DCP can drive the display panel DP. For example, the drive circuit portion DCP can output a data signal corresponding to image data to the display panel DP, or can output a driving signal for the light sensing pixels PSR, and can receive an electrical signal (e.g., a sensing signal) from the light sensing pixels PSR. The drive circuit portion DCP can detect a fingerprint shape of a user using the electrical signal.

[0082] The drive circuit portion DCP can include a panel driver PNDP and a fingerprint detector (or sensor driver) FPDP. For ease of explanation, Figure 2 and Figure 3 The panel driver PNDP and the fingerprint detector FPDP are respectively illustrated, but the present disclosure is not limited thereto. For example, at least a portion of the fingerprint detector FPDP can be integrated with the panel driver PNDP, or can operate in conjunction with the panel driver PNDP.

[0083] The panel driver PNDP can sequentially scan the sub-pixels SPX in the display area DA, and can supply a data signal corresponding to an image data signal to the sub-pixels SPX. In this case, the display panel DP can display an image corresponding to the image data.

[0084] The panel driver PNDP can supply a driving signal for fingerprint sensing to the sub-pixels SPX. The driving signal can be provided to cause the sub-pixels SPX to emit light, and can operate as a light source for fingerprint input sensing by the light sensing pixels PSR. In one or more embodiments, the panel driver PNDP can also supply a driving signal and / or other driving signals for fingerprint sensing to the light sensing pixels PSR. However, the present disclosure is not limited to the foregoing example, and the driving signal for fingerprint sensing can be provided by the fingerprint detector FPDP.

[0085] The fingerprint detector FPDP can detect biometric information related to a fingerprint or the like of a user based on a sensing signal received from the light sensing pixels PSR. In one or more embodiments, the fingerprint detector FPDP can supply a driving signal to the light sensing pixels PSR and / or the sub-pixels SPX.

[0086] ​The driving circuit part DCP can drive the touch sensor layer TSP. For example, the touch driver TDV can supply a sensing signal to the sensing electrode SP, and can receive a user input signal obtained by sensing a touch input from a user. For example, the sensing electrode SP can include a first sensing electrode SP1 extending in a first direction DR1 and a second sensing electrode SP2 extending in a second direction DR2. In one or more embodiments, one of the first sensing electrode SP1 and the second sensing electrode SP2 can be a transmitter (Tx) pattern electrode, and the other can be a receiver (Rx) pattern electrode.

[0087] When a user provides a touch input, the sensing electrode SP can sense a change in capacitance between the first sensing electrode SP1 and the second sensing electrode SP2, and the touch driver TDV can determine a position of the user touch input based on the change in capacitance.

[0088] In one or more embodiments, the display area DA and the sensing area SA can be overlaid with each other. Also, the fingerprint sensing area FA can be overlaid with the sensing area SA. In one or more embodiments, the non-display area NDA and the non-sensing area NSA can be overlaid with each other. Unless otherwise specified in the following description, the display area DA and the sensing area SA can be interpreted as being at corresponding positions.

[0089] A light emitting element LD and a light receiving element OPL according to one or more embodiments will be described with reference to Figure 4

[0090] Figure 4 is a schematic cross-sectional view illustrating a display panel DP according to one or more embodiments. Figure 4 A cross-sectional structure of the display panel DP included in the fingerprint sensing area FA in the display area DA is schematically illustrated.

[0091] Referring to Figure 4 , the display panel DP can include a light emitting element LD included in a pixel PXL (or a sub-pixel SPX) and a light receiving element OPL included in a light sensing pixel PSR.

[0092] In one or more embodiments, the pixel PXL can include an emission area EMA and a non-emission area NEMA adjacent to the emission area EMA. In one or more embodiments, the emission area EMA can be defined by a first opening OPN1 of a pixel defining layer PDL, in which a first opening OPN1 the emission layer EML can be located. The emission area EMA can be an area in which light is emitted from the emission layer EML.

[0093] ​In one or more embodiments, the light sensing pixel PSR can include a light receiving area FXA and a non-emission area NEMA adjacent to the light receiving area FXA. The light receiving area FXA can be defined by a second opening OPN2 of the pixel defining layer PDL, the light receiving layer OP can be located in the second opening OPN2. The light receiving area FXA can be an area to which a target light to be sensed is applied to the light receiving layer OP.

[0094] In one or more embodiments, the display panel DP can include a circuit layer CIL including a base layer BSL and an element layer ELL on the circuit layer CIL.

[0095] The circuit layer CIL can include the base layer BSL, and can include a pixel circuit PXC for driving the light emitting element LD and a sensor circuit SSC for driving the light receiving element OPL placed on the base layer BSL. The circuit layer CIL can include a semiconductor layer, a conductive layer, and an insulating layer, which are disposed to form the pixel circuit PXC and the sensor circuit SSC.

[0096] The element layer ELL can include the light emitting element LD and the light receiving element OPL, and can include the pixel defining layer PDL and the encapsulation layer TFE adjacent to the light emitting element LD and the light receiving element OPL.

[0097] The light emitting element LD can include an anode electrode AE, an emission layer EML, and a cathode electrode CE. The light emitting element LD can be an organic light emitting diode.

[0098] The anode electrode AE can be located on the circuit layer CIL, and can be electrically connected to the pixel circuit PXC. The pixel defining layer PDL can cover a portion of the anode electrode AE while allowing a portion of an upper surface of the anode electrode AE to be exposed. The emission layer EML can be located on the anode electrode AE, and can include a hole transport component, an emission component, and an electron transport component. The cathode electrode CE can be located on the emission layer EML.

[0099] The light receiving element OPL can include a first light receiving electrode E1, a light receiving layer OP, and a second light receiving electrode E2. The light receiving element OPL can be a photodiode. However, the present disclosure is not limited to the foregoing example.

[0100] The light-receiving element OPL can be configured to obtain a sensing signal corresponding to light emitted from the light-emitting element LD. When a fingerprint input is provided from a user, the light-receiving element OPL can sense light rays reflected by ridges of the user's fingerprint and valleys between the ridges, thereby recognizing the fingerprint. For example, if a user's finger is in contact with the window layer WD, light output from the light-emitting element LD can be reflected by the ridges and valleys of the fingerprint of the finger, and the reflected light can reach the light-receiving element OPL. The light-receiving element OPL can distinguish between light reflected from the ridges of the fingerprint of the finger and light reflected from the valleys of the fingerprint of the finger, thereby recognizing a pattern of the user's fingerprint.

[0101] The first light-receiving electrode E1 can be located on the circuit layer CIL and can be electrically connected to the sensor circuit SSC. The pixel definition layer PDL can cover a portion of the first light-receiving electrode E1 while allowing a portion of an upper surface of the first light-receiving electrode E1 to be exposed. The light-receiving layer OP can be located on the first light-receiving electrode E1 and can include an electron-blocking layer and a light-receiving component. The second light-receiving electrode E2 can be located on the light-receiving layer OP.

[0102] In one or more embodiments, the cathode electrode CE and the second light-receiving electrode E2 can be patterned by the same process and can be integrally formed. Each of the cathode electrode CE and the second light-receiving electrode E2 can include a thin metal layer or various transparent conductive materials. The anode electrode AE can include various conductive materials. The pixel definition layer PDL can include an organic material or an inorganic material.

[0103] The encapsulation layer TFE can be located on the light-emitting element LD and the light-receiving element OPL and can encapsulate the underlying layers. The encapsulation layer TFE can include an organic layer and / or an inorganic layer, but the present disclosure is not limited to any specific example.

[0104] A touch sensor layer TSP according to one or more embodiments will be described with reference to Figures 5 to 7 A touch sensor layer TSP according to one or more embodiments will be described with reference to

[0105] Figure 5 is a schematic cross-sectional view illustrating a touch sensor layer TSP according to one or more embodiments. Figure 6 is a schematic plan view illustrating a sensing electrode SP according to one or more embodiments. Figure 6 schematically illustrates a plan structure in which a first sensing electrode SP1 and a second sensing electrode SP2 are adjacent to each other. Figure 7 is a schematic cross-sectional view illustrating a touch sensor layer TSP according to one or more embodiments. Figure 7 schematically illustrates a cross-sectional structure taken along a line A-A' of Figure 6 and a cross-sectional structure taken along a line B-B' of Figure 6 .

[0106] Referring to Figures 5 to 7 The touch sensor layer TSP can be located (e.g., directly located) on the encapsulation layer TFE. The touch sensor layer TSP can include a sensor base layer SBSL, a first conductive pattern layer CP1, an intermediate insulating layer ILD, a second conductive pattern layer CP2, and a passivation layer PVX.

[0107] In one or more embodiments, the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can be located on different layers. In a plan view, the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can partially overlap each other.

[0108] In one or more embodiments, the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can be patterned in one area to form a sense electrode SP. For example, at least a portion of each of the first conductive pattern layer CP1 and the second conductive pattern layer CP2 or the second conductive pattern layer CP2 can form a first sense electrode SP1. At least a portion of each of the first conductive pattern layer CP1 and the second conductive pattern layer CP2 or the second conductive pattern layer CP2 can form a second sense electrode SP2.

[0109] The sensor base layer SBSL can be located (e.g., directly located) on the encapsulation layer TFE. The sensor base layer SBSL can provide an area in which the first conductive pattern layer CP1, the intermediate insulating layer ILD, the second conductive pattern layer CP2, and the passivation layer PVX are located.

[0110] The first conductive pattern layer CP1 can be located on the sensor base layer SBSL. The second conductive pattern layer CP2 can be located on the intermediate insulating layer ILD. The first conductive pattern layer CP1 and the second conductive pattern layer CP2 can be spaced apart from each other with the intermediate insulating layer ILD interposed therebetween.

[0111] Each of the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can include a single metal layer or a plurality of metal layers. Each of the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can include at least one of various metals including gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), platinum (Pt), etc., and alloys thereof. In one or more embodiments, the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can include at least one of various transparent conductive materials including at least one of silver nanowires (AgNW), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), aluminum zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO2), carbon nanotubes, and graphene.

[0112] The intermediate insulating layer ILD can be located on the first conductive pattern layer CP1. The intermediate insulating layer ILD can be disposed between the first conductive pattern layer CP1 and the second conductive pattern layer CP2. The passivation layer PVX can be located on the second conductive pattern layer CP2.

[0113] The sensor base substrate layer SBSL can include one or more of inorganic materials and organic materials. The intermediate insulating layer ILD can include one or more of inorganic materials and organic materials. In an embodiment, the passivation layer PVX can include an organic material. The inorganic materials can include one or more selected from a group consisting of silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiO x N y ), and aluminum oxide (AlO x ). The organic material can include one or more selected from a group consisting of acrylic resin, epoxy resin, phenol resin, polyamide resin, and polyimide resin. However, the present disclosure is not limited to the foregoing examples.

[0114] The cut region CA can be a region formed by cutting at least one of the first conductive pattern layer CP1 and the second conductive pattern layer CP2. For example, the cut region CA can be a region formed by cutting at least a portion of the second conductive pattern layer CP2 to electrically separate the first sensing electrode SP1 and the second sensing electrode SP2 from each other. For example, the first sensing electrode SP1 and the second sensing electrode SP2 can be adjacent to each other with the cut region CA disposed therebetween and can be physically spaced apart from each other.

[0115] The sensing electrode SP can include cells C and bridges BRD. Each of the cells C can have a relatively large surface area. Each of the bridges BRD can have a relatively small surface area. The associated cells C adjacent to each other can be electrically connected to each other by the corresponding bridges BRD. The cells C can include first cells C1 and second cells C2. The bridges BRD can include first bridges BRD1 and second bridges BRD2.

[0116] In one or more embodiments, the first cells C1 and the second cells C2 can be part of the second conductive pattern layer CP2. The first bridges BRD1 can be part of the second conductive pattern layer CP2. A portion of the second bridges BRD2 can be part of the first conductive pattern layer CP1. However, the present disclosure is not limited to the aforementioned example. For example, the first cells C1 and the second cells C2 can be part of the first conductive pattern layer CP1. In one or more embodiments, the first bridges BRD1 can be part of the first conductive pattern layer CP1. A portion of the second bridges BRD2 can be part of the second conductive pattern layer CP2. Another portion of the second bridges BRD2 can be part of the first conductive pattern layer CP1.

[0117] In one or more embodiments, the sensing electrode SP can form a mesh structure MESH. The cells C and the bridges BRD can form the mesh structure MESH. For example, the second conductive pattern layer CP2 for forming the sensing electrode SP can be patterned according to the mesh structure MESH.

[0118] The first sensing electrode SP1 can have a structure in which the first cells C1 each having a relatively large surface area and the first bridges BRD1 having a relatively small surface area are connected to each other. For example, the first cells C1 can include a 1-1st cell C1-1 and a 1-2nd cell C1-2. The first bridges BRD1 can electrically connect the 1-1st cell C1-1 and the 1-2nd cell C1-2 to each other.

[0119] The second sensing electrode SP2 can have a structure in which the second cells C2 each having a relatively large surface area and the second bridges BRD2 having a relatively small surface area are connected to each other. For example, the second cells C2 can include a 2-1st cell C2-1 and a 2-2nd cell C2-2. The second bridges BRD2 can electrically connect the 2-1st cell C2-1 and the 2-2nd cell C2-2 to each other.

[0120] In one or more embodiments, the second bridge BRD2 can be electrically connected to the 2-1 unit C2-1 through the contact CNT, and can be electrically connected to the 2-2 unit C2-2 through another contact CNT. Accordingly, the second bridge BRD2 located at a layer different from that of the second unit C2 can electrically connect the 2-1 unit C2-1 and the 2-2 unit C2-2 to each other through the contact CNT. In one or more embodiments, the contact CNT can pass through the intermediate insulating layer ILD.

[0121] The first unit C1 and the second unit C2 can each have a rhombus shape. However, the shape of each of the first unit C1 and the second unit C2 is not particularly limited to the aforementioned example.

[0122] According to one or more embodiments, the cut region CA can be defined between the sensing electrodes SP electrically spaced apart from each other. For example, the first sensing electrode SP1 and the second sensing electrode SP2 can be adjacent to each other, and the cut region CA is interposed between the first sensing electrode SP1 and the second sensing electrode SP2. The cut region CA can be defined in a region between the first sensing electrode SP1 and the second sensing electrode SP2. For example, the cut region CA can be located (e.g., formed or defined) between the 1-1 unit C1-1 and the second unit C2. The cut region CA can be located (e.g., formed or defined) between the first bridge BRD1 and the second unit C2.

[0123] Hereinafter, a display device DD according to one or more embodiments will be described with reference to Figures 8 to 16 For convenience of explanation, the description of the contents repeated with the above-described embodiments will be simplified or omitted.

[0124] Figure 8 and Figure 9 are schematic plan views showing a portion of the display region DA including the fingerprint sensing region FA in the display device DD according to one or more embodiments. Figure 8 and Figure 9 show the same regions. Accordingly, the planar arrangement between the components of the display device DD will be clearly understood with reference to Figure 8 and Figure 9

[0125] Figure 10 are schematic cross-sectional views taken along the line C-C' of Figure 8 and Figure 9 Figures 11 to 14 are schematic cross-sectional views taken along the line D-D' of Figure 8 and Figure 9 Figure 11 show the cross-sectional structure of the display device DD according to one or more embodiments. Figures 12 to 14 each show a display device DD having a fingerprint sensing region FA​​​Figure 11 A cross-sectional structure of the display device DD having a structure partially different from that shown in FIG. 1A.

[0126] Figure 15 and Figure 16 is Figure 9 a schematic enlarged view of the area EA1. Figure 15 and Figure 16 shows the same area. Figure 15 shows the first and second conductive pattern layers CP1 and CP2 and the hole area PH, whereas Figure 16 shows the first conductive pattern layer CP1 and the hole area PH, without showing the second conductive pattern layer CP2.

[0127] In one or more embodiments, the sub-pixels SPX can include a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. The first sub-pixel SPX1 can provide light of a first color (e.g., red R). The second sub-pixel SPX2 can provide light of a second color (e.g., green G). The third sub-pixel SPX3 can provide light of a third color (e.g., blue B).

[0128] In one or more embodiments, Figure 8 and Figure 9 shows the first to third sub-pixels SPX1 to SPX3 arranged in a PENTILE ® layout (PENTILE ® is a registered trademark of Samsung Display Co., Ltd. of Korea). However, the present disclosure is not limited to the foregoing example.

[0129] In one or more embodiments, the position of each sub-pixel SPX can correspond to an emission area EMA that provides light emitted from a corresponding light emitting element LD. The position of each light sensing pixel PSR can correspond to a light reception area FXA in which light is received by a corresponding light receiving element OPL.

[0130] In one or more embodiments, because the fingerprint sensing area FA is in the display area DA, the light reception area FXA and the emission area EMA can be arranged in a single area. For example, the first to third sub-pixels SPX1 to SPX3 can be located around a periphery of each light reception area FXA. Thus, light emitted from the light emitting element LD can be provided from the emission area EMA, based on which light reflected from a fingerprint of a user can be provided to the light reception area FXA of the light sensing pixel PSR.

[0131] In one or more embodiments, the emission area EMA and the light-receiving area FXA can be formed based on the first opening OPN1 and the second opening OPN2 defined by the pixel-defining layer PDL. Accordingly, the pixel-defining layer PDL can be located in at least a portion of an area other than the emission area EMA and the light-receiving area FXA.

[0132] In one or more embodiments, the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can be located around a periphery of the emission area EMA and the light-receiving area FXA. The first conductive pattern layer CP1 and the second conductive pattern layer CP2 can be superposed with the pixel-defining layer PDL in a plan view.

[0133] In one or more embodiments, the first conductive pattern layer CP1 can be located around a periphery of a portion of the second conductive pattern layer CP2 that forms each hole area PH. The first conductive pattern layer CP1 can not be superposed with the hole area PH and the light-receiving area FXA.

[0134] In one or more embodiments, the first conductive pattern layer CP1 can be located between each emission area EMA and a corresponding light-receiving area FXA. The first conductive pattern layer CP1 can be located between each emission area EMA and the second conductive pattern layer CP2. For example, the first conductive pattern layer CP1 (e.g., a segment SEG in Figure 15

[0135] In one or more embodiments, the second conductive pattern layer CP2 can have a mesh structure. The second conductive pattern layer CP2 can form the mesh structure around a periphery of the sub-pixel SPX and the light-sensing pixel PSR. The second conductive pattern layer CP2 can include a cutout area CA formed by a cutout in at least some areas.

[0136] In one or more embodiments, the second conductive pattern layer CP2 can form the hole area PH. For example, the second conductive pattern layer CP2 can include the hole area PH, which is an opening superposed with each light-receiving area FXA in a plan view.

[0137] Referring to Figure 10 , the touch sensor layer TSP can be located on the display panel DP. The color filter layer CFL and the window layer WD can be located on the touch sensor layer TSP.

[0138] ​Each of the light emitting elements LD of the first to third sub-pixels SPX1 to SPX3 can include an anode electrode AE including the first to third anode electrodes AE1 to AE3, an emission layer EML including the first to third emission layers EML1 to EML3, and a cathode electrode CE. The first to third emission layers EML1 to EML3 can respectively emit light of the first to third colors.

[0139] The color filter layer CFL can include the color filters CF and the light blocking pattern layer LBP. The color filters CF can include a first color filter CF1 located in the first sub-pixel SPX1, a second color filter CF2 located in the second sub-pixel SPX2, and a third color filter CF3 located in the third sub-pixel SPX3.

[0140] The first color filter CF1 can include a color filter material (e.g., a pigment or a dye) for allowing light of the first color (e.g., red) to selectively pass therethrough. The light of the first color provided from the light emitting element LD of the first sub-pixel SPX1 can pass through the first color filter CF1 and can be emitted to the outside.

[0141] The second color filter CF2 can include a color filter material (e.g., a pigment or a dye) for allowing light of the second color (e.g., green) to selectively pass therethrough. The light of the second color provided from the light emitting element LD of the second sub-pixel SPX2 can pass through the second color filter CF2 and can be emitted to the outside.

[0142] The third color filter CF3 can include a color filter material (e.g., a pigment or a dye) for allowing light of the third color (e.g., blue) to selectively pass therethrough. The light of the third color provided from the light emitting element LD of the third sub-pixel SPX3 can pass through the third color filter CF3 and can be emitted to the outside.

[0143] In one or more embodiments, a non-emission area NEMA in which light of a certain color can not be visible can be located between the emission areas EMA. In one or more embodiments, in the non-emission area NEMA, the first color filter CF1, the second color filter CF2, and the third color filter CF3 can be stacked on each other in a plan view, thereby forming the light blocking pattern layer LBP.

[0144] Referring to Figures 11 to 14 A cross-sectional structure of a display apparatus DD including an optical path for an optical receiving element OPL to sense light is disclosed. Figures 11 to 14 An optical sensing pixel PSR and a sub-pixel SPX adjacent thereto are shown.

[0145] In one or more embodiments, light emitted from the light emitting element LD can be provided to the front surface, and can be provided to the outside along the light output path PL. The light output path PL can have a first interface angle AG_I with respect to a thickness direction (e.g., the third direction DR3) of the base layer BSL.

[0146] In order for the display device DD to have excellent viewing angle characteristics, light emitted from the light emitting element LD can be sufficiently provided in the lateral direction. Accordingly, it can be appropriate for the light output path PL to be relatively wide (e.g., have a relatively wide angle).

[0147] The range of the light output path PL can be defined by the first conductive pattern layer CP1. For example, light emitted from the light emitting element LD can be provided to the front surface, and at least a portion of the light emitted from the light emitting element LD can be provided in the lateral direction.

[0148] The range of the light output path PL can be defined by the first conductive pattern layer CP1 facing the emission end EFE. For example, in a case where the light output path PL is adjacent (e.g., directly adjacent) to the first conductive pattern layer CP1 facing the emission end EFE, the first interface angle AG_I can have a maximum value.

[0149] In one or more embodiments, the range of the light output path PL can be defined (e.g., formed) by the first conductive pattern layer CP1 rather than the second conductive pattern layer CP2. In one or more embodiments, a portion of the second conductive pattern layer CP2 forming the hole region PH can be spaced farther apart from the light emitting element LD than the first conductive pattern layer CP1. Experimentally, in a case where the second conductive pattern layer CP2 protrudes toward the emission area EMA, there is a risk that the light output path PL is limited, which can decrease the viewing angle of the display device DD.

[0150] However, according to one or more embodiments, the first conductive pattern layer CP1 adjacent to the light emitting element LD at a relatively small height with respect to the base layer BSL can define the range of the light output path PL. Accordingly, the display device DD can have excellent viewing angle characteristics.

[0151] In one or more embodiments, external light can be applied from the outside to the display device DD along an external light path OL. The external light path OL can have a second interface angle AG_O with respect to a thickness direction (e.g., the third direction DR3) of the base layer BSL.

[0152] In one or more embodiments, the second interface angle AG_O can be greater than the first interface angle AG_I.

[0153] It can be appropriate that external light or other light (other than light emitted from the light emitting element LD (as target light to be sensed)) is not applied to the light-receiving layer OP in order to enhance the sensing sensitivity of the light-receiving element OPL.

[0154] In one or more embodiments, the first conductive pattern layer CP1 can form an external light-blocking structure, thereby improving the sensing performance of the light-sensing pixel PSR.

[0155] The external light path OL directed to the light-receiving layer OP can be substantially inclined. Here, the first conductive pattern layer CP1 can protrude toward the emission area EMA. The range of the external light path OL can be defined by (e.g., formed by) the emission-end-facing surface of the first conductive pattern layer CP1. For example, in a case where the external light path OL is adjacent (e.g., directly adjacent) to the emission-end-facing surface of the first conductive pattern layer CP1, the second interface angle AG_O can have a maximum value.

[0156] In one or more embodiments, the range of the external light path OL can be defined by (e.g., formed by) the first conductive pattern layer CP1 rather than the second conductive pattern layer CP2. In one or more embodiments, the second conductive pattern layer CP2 can be spaced apart from the light emitting element LD farther than the first conductive pattern layer CP1. Thus, in a case where the second conductive pattern layer CP2 protrudes toward the emission area EMA, there is a risk that not only the external light path OL but also the light output path PL is restricted, which can decrease the viewing angle of the display device DD.

[0157] However, according to one or more embodiments, the first conductive pattern layer CP1 adjacent to the light emitting element LD at a relatively small height with respect to the base substrate layer BSL can define the range of the external light path OL. Thus, the display device DD can have excellent viewing angle characteristics, and the sensing performance of the light-sensing pixel PSR can be improved.

[0158] In one or more embodiments, the first conductive pattern layer CP1 can form both an external light-blocking structure for improving the sensing performance of the light-sensing pixel PSR and a structure for improving the viewing angle characteristics of the sub-pixel SPX.

[0159] In one or more embodiments, light sensed by the light-receiving element OPL can be applied to the light-receiving layer OP along the light-receiving path SLP. In one or more embodiments, in a case where a fingerprint input from a user is applied to the display device DD (or the window layer WD), light emitted from the light emitting element LD can be provided to the user's finger along the light output path PL, and light reflected by the finger can be provided to the light-receiving layer OP along the light-receiving path SLP.

[0160] In one or more embodiments, light reflected by the finger can be provided to the light-receiving layer OP through the hole region PH formed by the second conductive pattern layer CP2. The light recognition range of the light-receiving element OPL can be defined by the size of the hole region PH.

[0161] In one or more embodiments, as described above, at least a portion of the second conductive pattern layer CP2 can function as the sensing electrode SP. Another portion of the second conductive pattern layer CP2 can be positioned around the periphery of the light-receiving region FXA, thereby forming the hole region PH.

[0162] In one or more embodiments, the hole region PH can cover an area wider than the light-receiving region FXA in a plan view. The hole region PH can overlap the light-receiving layer OP in a plan view, and can also overlap a portion of the pixel-defining layer PDL.

[0163] Referring to Figure 11 In one or more embodiments, the end portions of the first conductive pattern layer CP1 defining the outer light path OL and the light output path PL and the end portion of the second conductive pattern layer CP2 defining the light-receiving path SLP can be substantially adjacent to each other in a plan view, but can not overlap each other.

[0164] In one or more embodiments, the second conductive pattern layer CP2 can be floating. The second conductive pattern layer CP2 can not be electrically connected to other conductive structures.

[0165] In a plan view, the facing optical end OFE of the first conductive pattern layer CP1 can be aligned with one end of the second conductive pattern layer CP2. The first conductive pattern layer CP1 and the second conductive pattern layer CP2 can not include surfaces that overlap each other in a plan view.

[0166] In this case, because a portion of the second conductive pattern layer CP2 can form the sensing electrode SP, the risk of unintended capacitance between the second conductive pattern layer CP2 and the first conductive pattern layer CP1 can be reduced.

[0167] Referring to Figure 12 In one or more embodiments, the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can overlap each other in a plan view, and can be electrically separated from each other.

[0168] For example, the facing optical end OFE of the first conductive pattern layer CP1 can overlap the second conductive pattern layer CP2 in a plan view. At least a portion of the second conductive pattern layer CP2 can protrude toward the emission area EMA, and can not overlap the light output path PL defined by the first conductive pattern layer CP1. Accordingly, the light output path PL can be appropriately designated, and a process margin for forming the second conductive pattern layer CP2 can be ensured.

[0169] Referring to Figure 13 In one or more embodiments, the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can be stacked on each other in a plan view, and can be electrically connected to each other.

[0170] In one or more embodiments, the second conductive pattern layer CP2 and the first conductive pattern layer CP1 can be electrically connected to each other through the contact CNT between the emission area EMA and the light-receiving area FXA. In this case, even in the case where the first conductive pattern layer CP1 and the second conductive pattern layer CP2 are stacked on each other, the risk of unintended capacitance between the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can be reduced.

[0171] Referring to Figure 14 In one or more embodiments, the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can be spaced apart from each other in a plan view.

[0172] In one or more embodiments, the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can not be stacked on each other in a plan view. Because the first conductive pattern layer CP1 and the second conductive pattern layer CP2 are spaced apart from each other by a relatively small distance in the thickness direction (e.g., the third direction DR3) of the base layer BSL, the risk of forming an external light path OL between the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can be reduced. Thus, while the risk of forming capacitance between the first conductive pattern layer CP1 and the second conductive pattern layer CP2 is reduced due to the separation between the first conductive pattern layer CP1 and the second conductive pattern layer CP2, a process margin can be ensured during a process of manufacturing the first conductive pattern layer CP1 and the second conductive pattern layer CP2.

[0173] Referring to Figure 15 and Figure 16 A planar structure between the first conductive pattern layer CP1 and the second conductive pattern layer CP2 according to one or more embodiments is illustrated.

[0174] In one or more embodiments, the second conductive pattern layer CP2 can form a mesh structure for forming a sensing electrode SP, and can form a hole region PH for defining a light-receiving path SLP. To this end, the second conductive pattern layer CP2 can include a body portion BOD and an arm portion AM integrated with the body portion BOD and extending in two or more directions.

[0175] For example, the body portion BOD can include an opening, forming a hole region PH. The body portion BOD can enclose the light-receiving element OPL. Each of the arm portions AM can extend in one direction from at least one side of the body portion BOD. In one or more embodiments, a plurality of arm portions AM can be provided. For example, the arm portions AM can include a first arm portion AM1 extending in a first extension direction, a second arm portion AM2 extending in a second extension direction, a third arm portion AM3 extending in a third extension direction, and a fourth arm portion AM4 extending in a fourth extension direction.

[0176] In one or more embodiments, the body portion BOD can have a width greater than each of the arm portions AM. In this case, the external light path OL can be between the second conductive pattern layer CP2 and the first conductive pattern layer CP1, thereby reducing the risk of applying external light to the light-receiving layer OP.

[0177] In one or more embodiments, the first conductive pattern layer CP1 can be (e.g., in a plan view) around a periphery of the hole region PH, and can be patterned to avoid overlapping with the second conductive pattern layer CP2. Accordingly, the first conductive pattern layer CP1 can include segments SEG spaced apart from each other. For example, based on the hole region PH, the segments SEG can include a first segment SEG1 located at a first side of the hole region PH, a second segment SEG2 located at a second side of the hole region PH, a third segment SEG3 located at a third side of the hole region PH, and a fourth segment SEG4 located at a fourth side of the hole region PH.

[0178] In one or more embodiments, each of the segments SEG can be floating (e.g., electrically floating).

[0179] In one or more embodiments, the segments SEG can be spaced apart from each other, and each of the segments SEG can have an isolated form, for example, the segments SEG can include electrically floating isolation portions. In one or more embodiments, each of the segments SEG can be located between a corresponding one of the arm portions AM. Each of the segments SEG can be adjacent to the body portion BOD.

[0180] In one or more embodiments, the first conductive pattern layer CP1 can include segments SEG spaced apart from each other, thereby forming a structure in which the first conductive pattern layer CP1 and the second conductive pattern layer CP2 do not overlap each other. As a result, the light output path PL can be relatively wide, and can block the external light path OL. Accordingly, the sensing performance of the photosensing pixel PSR can be enhanced, and the risk of electrical signal interference for the sensing electrode SP can be reduced, thereby further improving the touch sensitivity.

[0181] Hereinafter, reference will be made to Figure 17 and Figure 18A display device DD according to one or more other embodiments is described. For ease of explanation, the description of the content that is repetitive of the above-described embodiments will be simplified or omitted.

[0182] Figure 17 is a schematic plan view showing a portion of a display area DA of the display device DD including a fingerprint sensing area FA according to one or more embodiments. Figure 18 is a schematic cross-sectional view taken along the line E-E' of Figure 17 .

[0183] Referring to Figure 17 and Figure 18 , the second conductive pattern layer CP2 can form a sidewall SW around the periphery of the hole area PH, and the first conductive pattern layer CP1 can not be patterned around the periphery of the hole area PH.

[0184] In one or more embodiments, the sidewall SW as at least a portion of the second conductive pattern layer CP2 can extend in a direction different from an extension direction of a plane in which the base substrate layer BSL is located.

[0185] The intermediate insulating layer ILD can have different respective thicknesses in different areas. For example, the intermediate insulating layer ILD can have a first thickness TK1 in the first area A1 and a second thickness TK2 smaller than the first thickness TK1 in the second area A2.

[0186] In one or more embodiments, the first area A1 can cover the light sensing pixel PSR (e.g., the light receiving layer OP). In a plan view, the hole area PH can be included in the entire area of the first area A1. The second area A2 can cover an area adjacent to the light sensing pixel PSR.

[0187] In one or more embodiments, the intermediate insulating layer ILD can be patterned using a mask including a half-tone portion and a full-tone portion, thereby allowing the intermediate insulating layer ILD having different thicknesses in different areas to be manufactured.

[0188] In one or more embodiments, the second conductive pattern layer CP2 can be positioned across the first area A1 and the second area A2. Accordingly, the second conductive pattern layer CP2 can cover a stepped portion formed by the intermediate insulating layer ILD having the first thickness TK1 and the second thickness TK2. Accordingly, the sidewall SW as a portion of the second conductive pattern layer CP2 can face the light receiving area FXA.

[0189] In one or more embodiments, the second conductive patterned layer CP2, as part of the lower component LP, may be located on a portion of the intermediate insulating layer ILD having a second thickness TK2. The second conductive patterned layer CP2, as part of the upper component UP, may be located on another portion of the intermediate insulating layer ILD having a first thickness TK1. In one or more embodiments, the sidewall SW may be located between the upper component UP and the lower component LP.

[0190] In one or more embodiments, because the light output path PL and the external light path OL are defined by the lower component LP formed at a relatively low height, the display device DD can have wide viewing angle characteristics and the risk of external light being applied to the light receiving layer OP can be reduced. Furthermore, because the upper component UP, formed at a relatively high height, does not protrude excessively toward the emitting region EMA, the risk of deterioration in viewing angle characteristics can be reduced. Additionally, the presence of the sidewall SW further reduces the risk of external light being applied to the light receiving layer OP.

[0191] Figure 19 This is a schematic block diagram illustrating an electronic device 1000 including a display device 1060 according to one or more embodiments. Figure 20 It is shown Figure 19 A schematic diagram illustrating an example of an electronic device 1000 implemented as a smartphone. Figure 21 It is shown Figure 19 A schematic diagram illustrating an example of an electronic device 1000 implemented as a tablet PC.

[0192] Reference Figures 19 to 21 Electronic device 1000 may include a processor 1010, a memory device 1020, a storage device 1030, an input / output (I / O) device 1040, a power supply 1050, and a display device 1060. The display device 1060 may be the aforementioned display device DD. Electronic device 1000 may also include various ports for communicating with video cards, sound cards, memory cards, USB devices, or other systems. In one or more embodiments, such as Figure 20 As shown, the electronic device 1000 can be implemented as a smartphone. In one or more embodiments, as Figure 21 As shown, the electronic device 1000 can be implemented as a tablet PC. However, the foregoing example is illustrative, and the electronic device 1000 is not limited to the foregoing example. For example, the electronic device 1000 can be implemented as a cellular phone, video phone, smart tablet, smartwatch, navigation device for vehicle, computer monitor, laptop computer, head-mounted display device, etc.

[0193] The processor 1010 can perform corresponding calculations or tasks. In one or more embodiments, the processor 1010 can be a microprocessor, a central processing unit, an application processor, etc. The processor 1010 can be connected to other components through an address bus, a control bus, a data bus, etc. In one or more embodiments, the processor 1010 can be connected to an expansion bus such as a peripheral component interconnect (PCI) bus. In one or more embodiments, the processor 1010 can provide input image data to the display device 1060. Accordingly, the display device 1060 can display an image based on the input image data provided from the processor 1010.

[0194] The memory device 1020 can store data suitable for performing operations of the electronic device 1000. For example, the memory device 1020 can include a non-volatile memory device such as an erasable programmable read-only memory (EPROM) device, an electrically erasable programmable read-only memory (EEPROM) device, a flash memory device, a phase-change random access memory (PRAM) device, a resistive random access memory (RRAM) device, a nano floating gate memory (NFGM) device, a polymer random access memory (PoRAM) device, a magnetic random access memory (MRAM) device, and a ferroelectric random access memory (FRAM) device, and / or a volatile memory device such as a dynamic random access memory (DRAM) device, a static random access memory (SRAM) device, a mobile DRAM device, etc.

[0195] The storage device 1030 can include a solid state drive (SSD), a hard disk drive (HDD), a CD-ROM, etc.

[0196] The I / O device 1040 can include an input device such as a keyboard, a keypad, a touchpad, a touchscreen, and a mouse, and an output device such as a speaker and a printer. In one or more embodiments, the display device 1060 can be included in the I / O device 1040.

[0197] The power supply 1050 can supply power suitable for performing operations of the electronic device 1000. For example, the power supply 1050 can be a power management integrated circuit (PMIC). In one or more embodiments, the power supply 1050 can supply power to the display device 1060.

[0198] The display device 1060 can display an image corresponding to visual information of the electronic device 1000. The display device 1060 can be connected to other components through a bus or other communication link.

[0199] Various embodiments of the present disclosure can provide a display device and an electronic device including the same, in which a light sensing pixel can have improved light sensing performance, thereby making it possible to clearly detect an external input.

[0200] Various embodiments of the present disclosure can provide a display device having improved viewing angle characteristics and an electronic device including the same.

[0201] Various embodiments of the present disclosure can provide a display device having improved touch sensitivity and an electronic device including the same.

[0202] Although various embodiments have been described above, it will be appreciated by those skilled in the art that various modifications, additions and substitutions can be made without departing from the scope and spirit of the present disclosure.

[0203] Accordingly, the embodiments disclosed in the present specification are only for the purpose of illustration and are not intended to limit the technical spirit of the present disclosure. The scope of the present disclosure must be defined by the appended claims, and the functional equivalents thereof are included therein.

Claims

1. A display device comprising: a sub-pixel, over a base layer, and including a light emitting element; a light sensing pixel, over the base layer, and including a light receiving element configured to acquire a sensing signal corresponding to light emitted from the light emitting element; and a touch sensor layer configured to acquire information related to a touch input, and including a conductive pattern layer forming a sensing electrode, and the conductive pattern layer includes: a second conductive pattern layer including a main portion enclosing the light receiving element in a plan view and an arm portion extending from the main portion in a corresponding direction; and a first conductive pattern layer in a different layer from the second conductive pattern layer, and including segments separated from each other in a corresponding region between corresponding arm portions among the arm portions in a plan view. 2.The display device of claim 1, further comprising: a sensing region having the sensing electrode therein; a display region having the sub-pixel therein, the display region including an emission region, and overlapping the sensing region; and a fingerprint sensing region having the light sensing pixel therein, the fingerprint sensing region including a light receiving region, and overlapping the display region, wherein the second conductive pattern layer includes an aperture region overlapping the light receiving region, and wherein the segments are around a periphery of the second conductive pattern layer, and are separated from the aperture region and the light receiving region in a plan view. one of the segments is between the emission region and the second conductive pattern layer in a plan view, and is in a ring structure of the second conductive pattern layer enclosing the emission region.

3. The display device of claim 2, wherein, the first conductive pattern layer includes:

4. The display device according to claim 2, wherein an emission facing end facing the emission region, and defining a range of a light output path of light emitted from the light emitting element; and an optical facing end facing the light receiving region, wherein the emission facing end defines a range of an external light path of external light applied from an outside of the display device. the light output path has a first interface angle with respect to a thickness direction of the base layer, the first interface angle having a maximum value when the light output path is directly adjacent to the emission facing end, 5. The display device of claim 4, wherein, wherein the external light path has a second interface angle with respect to the thickness direction, the second interface angle having a maximum value when the external light path is directly adjacent to the emission facing end, and wherein the second interface angle is greater than the first interface angle. the optical facing end and the second conductive pattern layer are separated in a plan view, and 6. The display device according to claim 4, wherein wherein one end of the optical facing end and the second conductive pattern layer are aligned. the first conductive pattern layer and the second conductive pattern layer overlap, and are electrically insulated from each other.

7. The display device according to claim 4, wherein the first conductive pattern layer and the second conductive pattern layer overlap, and are electrically connected to each other.

8. The display device according to claim 4, wherein the first conductive pattern layer and the second conductive pattern layer are separated in a plan view.

9. The display device according to claim 4, wherein the segments include electrically floating isolation portions.

10. The display device of claim 1, wherein, the light receiving element includes a light receiving layer, 11. The display device according to claim 1, wherein the light emitting element includes an emission layer, ​ The touch sensor layer includes a sensor base layer including a base and the first conductive pattern layer is above the base, and an intermediate insulating layer between the first conductive pattern layer and the second conductive pattern layer, The display device further includes a pixel definition layer covering a portion of the light receiving layer and a portion of the emission layer, and an encapsulation layer covering the light receiving element and the light emitting element, and the sensor base layer is directly on the encapsulation layer. 12.A display device, the display device comprising: a sub-pixel above a base layer and including a light emitting element; a light sensing pixel above the base layer and including a light receiving element configured to acquire a sensing signal corresponding to light emitted from the light emitting element; and a touch sensor layer configured to acquire information related to a touch input and including a conductive pattern layer forming a sensing electrode, and the conductive pattern layer includes a first conductive pattern layer, a second conductive pattern layer having a portion forming a hole region overlapped with the light receiving element and another portion forming a side wall, and an intermediate insulating layer between the first conductive pattern layer and the second conductive pattern layer and having a first thickness in a first region overlapped with the hole region and a second thickness smaller than the first thickness in a second region, wherein the side wall is between the first region and the second region.

13. The display device of claim 12, wherein, The first conductive pattern layer does not surround a periphery of the hole region.

14. The display device of claim 12, wherein, The second conductive pattern layer includes: an upper assembly above the intermediate insulating layer having the first thickness in the first region; and a lower assembly above the intermediate insulating layer having the second thickness in the second region, and wherein the side wall is between the lower assembly and the upper assembly. 15.An electronic device, the electronic device comprising: a processor configured to provide input image data; a power supply configured to supply power; a display device configured to receive the power and display an image based on the input image data, and the display device includes a sub-pixel including a light emitting element, a light sensing pixel including a light receiving element configured to acquire a sensing signal corresponding to light emitted from the light emitting element, and a touch sensor layer configured to acquire information related to a touch input and including a conductive pattern layer forming a sensing electrode, and the conductive pattern layer includes a second conductive pattern layer including a main portion enclosing the light receiving element in a plan view and an arm portion extending from the main portion in a corresponding direction, and a first conductive pattern layer in a different layer from the second conductive pattern layer and including segments separated from each other in a corresponding region between corresponding arm portions in the plan view.

Images