Monitoring system and monitoring method

Abstract

A monitoring system for monitoring the pressure of a plurality of vacuum pumps provided in a work device is provided with: a sensor for detecting the pressure of an air flow path communicating with the plurality of vacuum pumps; a pressure acquisition unit that, while sequentially switching the operating vacuum pumps, executes an acquisition process in which, in a state in which one of the plurality of vacuum pumps is operated and the remaining vacuum pumps are stopped, the detection value of the sensor is acquired as the pressure of the operating vacuum pump; and a determination unit that determines the state of each of the plurality of vacuum pumps on the basis of the pressure acquired in the acquisition process.

Description

TECHNICAL FIELD

[0001] The present specification discloses a monitoring system and a monitoring method. BACKGROUND

[0002] In the past, a technical solution has been proposed to monitor vacuum pressure generated by a vacuum pump or the like. For example, Patent Literature 1 describes that temporal data of vacuum pressure detected by a detection sensor is stored, a change amount of the temporal data is calculated to determine whether there is an abnormality in a pipe that supplies vacuum pressure, and maintenance such as cleaning is performed. PRIOR ART DOCUMENT PATENT LITERATURE

[0003] Patent Literature 1: Japanese Patent Application Publication No. H05-185390 SUMMARY PROBLEMS TO BE SOLVED BY THE INVENTION

[0004] As described above, monitoring vacuum pressure to supply appropriate vacuum pressure is an important issue in achieving stabilization of production work or the like, and further improvement is desired.

[0005] The main object of the present disclosure is to more appropriately perform monitoring of a vacuum pump. MEANS FOR SOLVING THE PROBLEMS

[0006] To achieve the above main object, the present disclosure employs the following means.

[0007] A monitoring system of the present disclosure monitors pressures of a plurality of vacuum pumps provided to a work device, and the gist of the monitoring system is to include: a sensor that detects a pressure of an air flow path that communicates with the plurality of vacuum pumps; a pressure acquisition unit that executes the following acquisition processing while sequentially switching vacuum pumps that are operated: in a state in which one of the plurality of vacuum pumps is operated and the remaining vacuum pumps are stopped, acquires a detection value of the sensor as a pressure of the vacuum pump that is operated; and a determination unit that determines a state of each of the plurality of vacuum pumps based on the pressure acquired in the acquisition processing.

[0008] In the installation device of the present disclosure, since the pressure of the vacuum pump is acquired to determine the state, the monitoring of the vacuum pump can be more appropriately performed. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 is a configuration diagram that shows a configuration outline of an installation system 1 including an installation device 10. Figure 2 is a plan view of the installation device 10. Figure 3 is a configuration diagram of a pressure supply device 70. Figure 4is a flowchart showing one example of pressure-related information transmission processing. Figure 5 is a flowchart showing one example of pressure acquisition processing. Figure 6 is an explanatory diagram showing one example of a pump state display screen. Figure 7 is an explanatory diagram showing one example of a pump state display screen. Figure 8 is an explanatory diagram showing one example of a pump state display screen. Figure 9 is a flowchart showing one example of pump state confirmation processing. Figure 10 is an explanatory diagram showing one example of a pressure-related information database 103a. Figure 11 is an explanatory diagram showing one example of a case of determining a pump state. Figure 12 is a configuration diagram showing a configuration outline of a pressure supply device 170 of a modification example. DETAILED DESCRIPTION

[0010] Embodiments of the present disclosure will be described using the accompanying drawings. Figure 1 is a configuration diagram showing a configuration outline of a mounting system 1 including a mounting device 10. Figure 2 is a plan view of the mounting device 10. The mounting system 1 is provided with the mounting device 10 and a management device 100 that manages the mounting device 10. The mounting system 1 is provided with a mounting line in which the mounting devices 10 that perform mounting processing of picking up components supplied from a feeder and mounting the components on a board S are arranged side by side in a conveyance direction (X-axis direction) of the board S. In addition, the mounting system 1 is provided with a board conveyance device (not shown), a solder paste printing device, an inspection device, a reflow furnace, and the like. Figure 1 In the present embodiment, the mounting device 10 is shown as one device. In addition, the mounting system 1 can be provided with the solder paste printing device, the inspection device, the reflow furnace, and the like on the mounting line. Figure 1 The left-right direction of the mounting device 10 is the X-axis direction, the front-rear direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

[0011] The mounting device 10 is provided with a board conveyance device (not shown), first and second feeders F1, F2, first and second heads 15a, 15b, first and second slide members 20a, 20b, first and second X-axis moving devices 30a, 30b, first and second Y-axis moving devices 40a, 40b, and first and second component cameras 50a, 50b. These components are mounted on the base 12 and housed in the housing 11. In addition, the mounting device 10 is provided with a display operation panel 55 provided to the housing 11, a pressure supply device 70 (refer to Figure 3 ), and a control device 90 (refer to Figure 3). On both left and right sides of the upper stage of the base 12, support tables 13 extending in the front-rear direction are provided. Note that the first head 15a and the second head 15b are sometimes referred to simply as heads 15, and the first component camera 50a and the second component camera 50b are sometimes referred to simply as component cameras 50. The substrate conveyance device conveys the substrate S on the conveyance belt from left to right by driving the conveyance belt with a motor.

[0012] First and second feeder sections F1, F2, which are detachably provided with feeders that supply components, are provided on both front and rear sides of the base 12. The first feeder section F1 supplies components to the first head 15a, and the second feeder section F2 supplies components to the second head 15b. Note that the feeder sections can also be provided on only one side of the front and rear sides.

[0013] The first and second heads 15a, 15b have a suction nozzle 16 (see Fig. 1) that suctions components, and a nozzle holding section 17 (see Fig. 1) that holds the suction nozzle 16 and is capable of ascending and descending. Figure 3 Figure 3 The first head 15a is supported to the first slide member 20a in a manner capable of moving in the left-right (X-axis) direction. The second head 15b is supported to the second slide member 20b in a manner capable of moving in the left-right (X-axis) direction.

[0014] The first and second slide members 20a, 20b are long members extending in the left-right (X-axis) direction, and are arranged in parallel to each other and are supported to a pair of Y-axis linear guides 41 (rails) that are common to both the first and second slide members 20a, 20b, and move in the front-rear (Y-axis) direction along the pair of Y-axis linear guides 41.

[0015] The first Y-axis moving device 40a moves the first slide member 20a in the front-rear (Y-axis) direction. The second Y-axis moving device 40b moves the second slide member 20b in the front-rear (Y-axis) direction. The first and second Y-axis moving devices 40a, 40b have a pair of Y-axis linear guides 41 and Y-axis linear motors 42 arranged on the left and right sides, respectively. The Y-axis linear motor 42 is configured as a flat linear motor having a Y-axis stator 43 and a Y-axis mover 44, wherein the Y-axis stator 43 is fixed to the support table 13 in a manner extending in the front-rear direction, and the Y-axis mover 44 faces the Y-axis stator 43 with a predetermined gap therebetween and is fixed to the first or second slide member 20a, 20b. The Y-axis stator 43 has a plurality of permanent magnets arranged in a flat manner with polarities of N and S alternating in the Y-axis linear guide 41. The Y-axis mover 44 has a plurality of cores each of which is formed by laminating an electromagnetic steel plate, and a plurality of phase coils each of which is wound around a corresponding core. The Y-axis mover 44 moves in the front-rear (Y-axis) direction by applying three-phase alternating current to the phase coils.

[0016] ​Further, on mutually opposite sides (side walls) of each of the frames of the first and second slide members 20a, 20b, although not shown, are respectively joined a pair of iron X-axis linear guides (rails) extending in the left-right direction in parallel with each other. The first and second heads 15a, 15b are supported to the first and second slide members 20a, 20b in a manner so as to be movable in the left-right direction along the X-axis linear guides. A first X-axis moving device 30a moves the first head 15a in the left-right direction (X-axis direction). A second X-axis moving device 30b moves the second head 15b in the left-right direction (X-axis direction). Although not shown, the first and second X-axis moving devices 30a, 30b, like the first and second Y-axis moving devices 40a, 40b, have X-axis linear guides and X-axis linear motors configured as flat linear motors.

[0017] Thus, the mounting device 10 moves the slide members 20 (20a, 20b) in the front-rear direction (Y-axis direction) by the Y-axis moving devices 40 (40a, 40b) and moves the heads 15 (15a, 15b) in the left-right direction (X-axis direction) relative to the slide members 20 by the X-axis moving devices 30 (30a, 30b). As a result, the heads 15 (15a, 15b) are movable in the front-rear left-right direction (XY-axis direction).

[0018] The first and second component cameras 50a, 50b are disposed between the first and second feeder sections Fl, F2 and the substrate conveyance device. The first and second component cameras 50a, 50b have a range above them in which they take images of objects such as components held by the suction nozzles 16 from below and generate captured images. The display operation panel 55 is a touch panel configured to display various information and receive input operations from an operator.

[0019] As shown in FIG. 1, the mounting device 10 includes a first head 15a, a second head 15b, a first slide member 20a, a second slide member 20b, a first Y-axis moving device 40a, a second Y-axis moving device 40b, a first X-axis moving device 30a, a second X-axis moving device 30b, a first component camera 50a, a second component camera 50b, a pressure supply device 70, and a control device 90. Figure 3 As shown in FIG. 1, the mounting device 10 includes a first head 15a, a second head 15b, a first slide member 20a, a second slide member 20b, a first Y-axis moving device 40a, a second Y-axis moving device 40b, a first X-axis moving device 30a, a second X-axis moving device 30b, a first component camera 50a, a second component camera 50b, a pressure supply device 70, and a control device 90.

[0020] The management device 100 manages production and states of one or more mounting devices 10, and includes a CPU 101, a ROM 102, a HDD 103, and a RAM 104. The HDD 103 stores a production plan database including production tasks, a pressure correlation information database 103a described later, and the like. In addition, the management device 100 includes an input device 107 such as a mouse and a keyboard, and a display 108. The management device 100 transmits production tasks to the control device 90, and acquires information related to production states and working states of the mounting device 10 from the control device 90.

[0021] Figure 3 is a configuration diagram showing an outline of a structure of the pressure supply device 70 that supplies negative pressure. The pressure supply device 70, as a negative pressure source, includes three vacuum pumps 71, a first vacuum pump 71a, a second vacuum pump 71b, and a third vacuum pump 71c. As shown in Figure 3 The nozzle 16 sucks and holds an element with the suction port 16a of the tip (lower end) of the cylindrical shaft portion, and a flange portion 16b is formed at the upper end of the shaft portion. The nozzle holder 17 is formed with a central hole 17a that penetrates the center portion from top to bottom, a ring-shaped recessed portion 17b provided on the bottom surface (holding surface), and a communication hole 17c that penetrates the bottom surface from top to bottom so as to communicate from the top surface to the recessed portion 17b. The recessed portion 17b of the nozzle holder 17 is covered by the top surface of the flange portion 16b of the nozzle 16, thereby forming a negative pressure chamber. The nozzle 16 is sucked and held by the nozzle holder 17 by supplying negative pressure to the negative pressure chamber (inside the recessed portion 17b) thereof via the communication hole 17c. In addition, the nozzle 16 sucks and holds an element with the suction port 16a by supplying negative pressure to the suction port 16a via the central hole 17a of the nozzle holder 17 and the central hole of the shaft portion. Note that the mounting device 10 includes two heads 15 (15a, 15b), and negative pressure needs to be supplied to each of the nozzles 16 and the nozzle holders 17. That is, since a large negative pressure needs to be generated, a structure including a plurality of (for example, three) vacuum pumps 71 is adopted. In addition, although not shown, a permanent magnet is embedded in a portion of the bottom surface of the recessed portion 17b. In addition, a metal plate is embedded in a position of the top surface (held surface) of the flange portion 16b of the nozzle 16 that faces the permanent magnet of the recessed portion 17b. Thus, the nozzle 16 is held by the nozzle holder 17 by the suction force of negative pressure and the attraction force of the magnet.

[0022] As the air flow path from which negative pressure is supplied, the pressure supply device 70 is provided with a first flow path 73 connected to the first vacuum pump 71a, a second flow path 74 connected to the second vacuum pump 71b, a connection flow path 75, 79a, 79b, a third flow path 76 connected to the third vacuum pump 71c, a component suction flow path 77a, 77b, and a nozzle holding flow path 78a, 78b. The connection flow path 75 is connected to the first flow path 73, the second flow path 74, and the component suction flow path 77a, 77b. The component suction flow path 77a is connected to the central hole 17a of the nozzle holding portion 17 of the head 15a, and supplies negative pressure for suction of a component to the suction port 16a of the nozzle 16 of the head 15a via the central hole 17a. The component suction flow path 77b is connected to the central hole 17a of the nozzle holding portion 17 of the head 15b, and supplies negative pressure for suction of a component to the suction port 16a of the nozzle 16 of the head 15b via the central hole 17a. The nozzle holding flow path 78a is connected to the component suction flow path 77a, and is connected to the communication hole 17c of the nozzle holding portion 17 of the head 15a, and supplies negative pressure for holding (suction) of the nozzle 16 to the recessed portion 17b via the communication hole 17c. The nozzle holding flow path 78b is connected to the component suction flow path 77b, and is connected to the communication hole 17c of the nozzle holding portion 17 of the head 15b, and supplies negative pressure for holding (suction) of the nozzle 16 to the recessed portion 17b via the communication hole 17c. The connection flow path 79a is connected to the third flow path 76 and the nozzle holding flow path 78a. The connection flow path 79b is connected to the third flow path 76 and the nozzle holding flow path 78b.

[0023] Further, the pressure supply device 70 is provided with a pressure sensor 72 that detects pressure (negative pressure). The pressure sensor 72 is mounted to the component suction flow path 77b, for example. In addition, although not shown, the pressure supply device 70 is configured to be able to supply positive pressure to the negative pressure chamber of the nozzle holding portion 17 and the suction port 16a of the nozzle 16. Thus, it is possible to release suction of the nozzle 16 suctioned by the nozzle holding portion 17, and to release suction of the component suctioned by the nozzle 16, and to mount to the substrate S.

[0024] The mounting apparatus 10 configured in this way performs a component pickup and substrate S mounting process as follows. During the mounting process, the CPU 91 moves the heads 15 (15a, 15b) above the component supply position of the feeder, and lowers the nozzle 16 to pick up the component. When the component pickup is complete, the CPU 91 moves the heads 15 above the component camera 50 (50a, 50b) to capture an image of the component picked up by the nozzle 16. Based on the captured image, the CPU 91 determines the pickup deviation of the component relative to the nozzle 16 and corrects the target mounting position to eliminate the pickup deviation. Then, based on the target mounting position, the CPU 91 moves the heads 15 above the substrate S, lowers the nozzle 16, and mounts the component onto the substrate S. The CPU 91 repeats this component pickup and mounting process for all components that are to be mounted.

[0025] Furthermore, during the installation process, the CPU 91 collects various information and stores it in the HDD 93, then sends it to the management device 100. As examples of this information, the adsorption success rate and installation success rate are collected. The adsorption success rate is calculated by dividing the number of components successfully adsorbed without adsorption defects by the nozzle 16 by the total number of components to be installed. Components that fall from the nozzle 16, or components whose adsorption deviation, as determined by the image captured by the part camera 50, is outside the predetermined allowable range, are considered adsorption defects. The installation success rate is calculated by dividing the number of components successfully installed onto the substrate S without installation defects by the total number of components to be installed. Components that cannot be properly desorbed during installation onto the substrate S and are brought back are considered installation defects. Furthermore, the adsorption success rate and installation success rate can be calculated as the success rate from the start to the end of production over a predetermined period (e.g., 1 day). Adsorption defects and installation defects can also be affected by positional deviations of the supplied components, poor component shape, warping of the substrate S, etc., but can also be affected by pressure malfunctions of the vacuum pumps 71 of the pressure supply device 70.

[0026] In addition, in the installation system 1, various procedures are performed to confirm the status of each vacuum pump 71 and the necessity of maintenance. Figure 4 This is a flowchart of an example of pressure-related information transmission processing, executed by the CPU 91 of the control device 90.

[0027] In the pressure correlation information transmission process, CPU91 determines whether it is the right time to acquire the pressure of each vacuum pump 71 (S100). If it is determined to be the right time to acquire the pressure, then execute... Figure 5 Pressure acquisition process (S110); if it is determined that it is not the right time to acquire pressure, proceed to S150. The right time to acquire pressure can be set to, for example, the time before the installation process of the installation device 10 begins, or the time when the operator indicates the time to confirm the pressure through the display operation panel 55 when production is not in progress.

[0028] In Figure 5 the pressure acquisition process (S110), the CPU 91 first sets a state (first state) in which the first vacuum pump 71a is operated (turned on) and the second vacuum pump 71b and the third vacuum pump 71c are stopped (turned off) (S200). Also, the CPU 91 acquires the detection value of the pressure sensor 72 as the pressure of the first vacuum pump 71a in operation and displays it on the display operation panel 55 (S210, Figure 6 ). In the pump state display screen, for example, as shown in Figure 6 , the first pump (first vacuum pump 71a) is displayed as being turned on, and its pressure (— * * kPa) is displayed. Next, the CPU 91 sets a state (second state) in which the second vacuum pump 71b is operated and the first vacuum pump 71a and the third vacuum pump 71c are stopped (S220). Also, the CPU 91 acquires the detection value of the pressure sensor 72 as the pressure of the second vacuum pump 71b in operation and displays it on the display operation panel 55 (S230, Figure 7 ).

[0029] Next, the CPU 91 sets a state (third state) in which the third vacuum pump 71c is operated and the first vacuum pump 71a and the second vacuum pump 71b are stopped (S240). Also, the CPU 91 acquires the detection value of the pressure sensor 72 as the pressure of the third vacuum pump 71c in operation and displays it on the display operation panel 55 (S250, Figure 8 ), ending the pressure acquisition process. Thus, in the pressure acquisition process, the state in which one of the vacuum pumps 71 is operated (turned on) and the remaining two vacuum pumps are stopped (turned off) is switched, and the detection value of the pressure sensor 72 is acquired as the pressure of the vacuum pump 71 in operation.

[0030] When the pressure acquisition process is executed as such, the CPU 91 determines whether there is a pressure abnormality in any of the vacuum pumps 71 (S120). When there is a pressure abnormality in any of the vacuum pumps 71 (S120: Yes), Figure 5When any of the predetermined pressure threshold values Pl for pressure abnormality determination, which are acquired in S210, S230, and S250 of the pump state confirmation processing, is on the positive side (small in absolute value), the CPU 91 determines that there is a pressure abnormality. If it is determined that there is a pressure abnormality, the CPU 91 notifies of the pressure abnormality (S130); if it is determined that there is no pressure abnormality, S130 is skipped. In S130, the CPU 91 can notify by, for example, displaying the content of the pressure abnormality on the display operation panel 55, or by lighting an alarm lamp not shown, outputting an alarm sound from a speaker, or the like. Through the notification of the pressure abnormality, the operator can promptly respond, for example, by replacing the vacuum pump 71 determined to be abnormal. Further, the CPU 91 transmits the pressures of the respective vacuum pumps 71 acquired (detected) in the pressure acquisition processing to the management device 100 (S140). Note that the CPU 91 can also transmit the content of the pressure abnormality to the management device 100, and the management device 100 can display the content of the pressure abnormality on the display 108.

[0031] Next, the CPU 91 determines whether it is a timing for transmitting production information including the above-described adsorption success rate, installation success rate, and the like (S150). The timing for transmission can be set to a timing at which production (installation processing) ends in a predetermined period (for example, 1 day), or the like. If it is determined that it is the timing for transmission, the CPU 91 transmits the production information to the management device 100 (S160), and ends the pressure correlation information transmission processing; if it is determined that it is not the timing for transmission, S160 is skipped, and the pressure correlation information transmission processing ends.

[0032] Next, the processing of the management device 100 will be described. Figure 9 is a flowchart of an example of the pump state confirmation processing, and is executed by the CPU 101 of the management device 100. The CPU 101 determines whether the pressure transmitted from the installation device 10 is received (S300), and whether the production information transmitted from the installation device 10 is received (S305). If the CPU 101 determines that the pressure is received or the production information is received, it is saved in the pressure correlation information database 103a (S310, Figure 10 ).

[0033] When the pressure is received, if there is no recent production information corresponding to the pressure in the pressure correlation information database 103a, the CPU 101 saves the pressure in correspondence with the production information and updates the date and time of the saving. Further, if there is no production information corresponding to the pressure in the pressure correlation information database 103a, the CPU 101 saves the pressure without correspondence with the production information. When the production information is received, if there is no recent pressure corresponding to the production information in the pressure correlation information database 103a, the CPU 101 saves the production information in correspondence with the pressure and updates the date and time of the saving. Further, if there is no pressure corresponding to the production information in the pressure correlation information database 103a, the CPU 101 saves the production information without correspondence with the pressure. Thus, in the pressure correlation information database 103a, the pressures and the production information received at a date and time (acquisition date and time) close to each other are in correspondence with each other and are saved in the order of the time series.

[0034] Next, the CPU 101 determines whether it is a confirmation timing for confirming the state of each vacuum pump 71 (S315). If the pressure and the production information are saved in correspondence in S310, the CPU 101 determines that it is the confirmation timing in S315. Alternatively, it can be a timing at which the confirmation of the state is instructed by the operator via the input device 107 or the like. If it is determined that it is the confirmation timing, the CPU 101 confirms the state of each vacuum pump 71 based on the pressure and the production information saved in the pressure correlation information database 103a (S320) and determines whether there is a sign of abnormality (S325). If the CPU 101 determines that there is a sign of abnormality in the state of a certain vacuum pump 71, it notifies the maintenance instruction of the vacuum pump 71 (S330); if it determines that there is no sign, it skips S330.

[0035] Here, Figure 11is a explanatory diagram showing a case of determining the state of the pump, and the vertical axis represents pressure. As described above, when the pressure of the vacuum pump 71 is on the positive side (small in absolute value) from the predetermined pressure threshold value Pl for abnormality determination, and is within a predetermined abnormal range, it is determined that the pressure is abnormal. Note that in the pump state confirmation processing by the management device 100, the pressure can be compared with the pressure threshold value Pl to determine the pressure abnormality. Further, when the pressure of the vacuum pump 71 is on the negative side (large in absolute value) from the pressure threshold value Po, and is within a predetermined normal range, it is determined that the pressure is normal. In addition, when the pressure of the vacuum pump 71 is between the pressure threshold value Po and the pressure threshold value Pl, and the adsorption success rate and the installation success rate of the production information are each lower than a predetermined rate, the CPU 101 determines that there is a sign of abnormality. Note that the predetermined rate for the adsorption success rate and the predetermined rate for the installation success rate can be different values. Further, if either of the adsorption success rate and the installation success rate is lower than the predetermined rate, even if the other is the predetermined rate or more, the CPU 101 can determine that there is a sign of abnormality. In this way, even if the pressure of the vacuum pump 71 is not within the abnormal range, the trend of the pressure decrease can be grasped based on the adsorption success rate and the installation success rate, it is determined that there is a sign of abnormality, and the guidance for maintenance is notified. Further, since the pressure and the production information are stored in the pressure correlation information database 103a in chronological order, the CPU 101 can determine the sign of abnormality based on the trend of the change in the pressure over time, the trend of the change in the production information. For example, the CPU 101 can determine that there is a sign of abnormality when it is grasped that the amount of change in the pressure to the positive side is a predetermined pressure or more, or when it is grasped that the amount of change in the adsorption success rate and the installation success rate is a predetermined rate or more.

[0036] Next, the CPU 101 determines whether the timing of the regular maintenance of a certain vacuum pump 71 has come (S335), and if it is determined that the timing of the regular maintenance has not come, the pump state confirmation processing is ended. The timing of the regular maintenance is a timing that is set in advance based on the elapsed period from the last maintenance. On the other hand, if the CPU 101 determines that the timing of the regular maintenance of a certain vacuum pump 71 has come, the necessity of maintenance is confirmed based on the pressure and the production information of the vacuum pump 71 (S340), and it is determined whether the regular maintenance is required to be performed (S345).

[0037] Here, for example, when the pressure of the vacuum pump 71 is on the positive side from the pressure threshold value Po (refer to Figure 11 ), the CPU 101 can determine that the regular maintenance is required to be performed. Further, when the pressure of the vacuum pump 71 is on the negative side from the pressure threshold value Po, and thus is within the normal range, the CPU 101 can determine that the regular maintenance is not required to be performed. Note that when the pressure of the vacuum pump 71 is within the normal range and the adsorption success rate and the installation success rate of the production information are each a predetermined rate or more, the CPU 101 can also determine that the maintenance is not required to be performed.

[0038] If the CPU 101 determines that periodic maintenance is required in S345, the maintenance instruction is notified (S350), and the pump state confirmation processing is ended. On the other hand, if the CPU 101 determines that periodic maintenance is not required, the timing of the periodic maintenance of the vacuum pump 71 is postponed (S355), and the pump state confirmation processing is ended. The CPU 101 can postpone the timing by a certain period such as a predetermined number of days.

[0039] Here, the correspondence between the constituent elements of the present embodiment and the constituent elements of the present disclosure is made clear. The pressure sensor 72 in the present embodiment corresponds to the "sensor" of the present disclosure; the control device 90 that executes the S110 (pressure acquisition processing) of the pressure correlation information transmission processing corresponds to the "pressure acquisition section"; the control device 90 that executes the S120, S130 of the pressure correlation information transmission processing, the management device 100 that executes the pump state confirmation processing correspond to the "determination section". The control device 90 that executes the S160 of the pressure correlation information transmission processing corresponds to the "information acquisition section"; the management device 100 (HDD 103) that stores the pressure correlation information database 103a corresponds to the "storage section". In the present embodiment, by explaining the operation of the installation system 1, an example of the monitoring method of the present disclosure is also made clear.

[0040] In the installation system 1 of the above-described embodiment, the following pressure acquisition processing is executed while sequentially switching the operating vacuum pump 71: in a state in which one of the plurality of vacuum pumps 71 is operated and the remaining vacuum pumps are stopped, the detection value of the pressure sensor 72 is acquired as the pressure of the operating vacuum pump 71. Also, the state of the plurality of vacuum pumps 71 is determined based on the acquired pressure, so that the monitoring of the vacuum pump 71 can be more appropriately performed. Furthermore, the state of the plurality of vacuum pumps 71 can be determined using the detection value of one pressure sensor 72, and it is not necessary to provide the same number of pressure sensors 72 as the number of vacuum pumps 71, so that the cost of the pressure supply device 70 can be reduced and miniaturization can be achieved.

[0041] In addition, since the acquisition processing of the pressure is executed at the timing before the start of the installation processing (production work) of the installation device 10, it is possible to prevent hindrance to the production work due to the abnormality of the vacuum pump 71.

[0042] Further, production information affected by a change in pressure by the vacuum pump 71 is acquired in the installation process, and the pressure acquired in the pressure acquisition process is stored in the pressure correlation information database 103a in association with the production information acquired in the production operation after the execution of the pressure acquisition process. Also, based on the pressure and the production information in association with the pressure in the pressure correlation information database 103a, the states of the plurality of vacuum pumps 71 are determined respectively. Therefore, the monitoring of the vacuum pumps 71 can be performed more appropriately based on the pressure and the production information.

[0043] Further, when the pressure is in the abnormal range, it is determined that the vacuum pump 71 is in a state of pressure abnormality, and when the pressure is not in the abnormal range, it is determined whether the vacuum pump 71 is in a state requiring maintenance (a precursory state) based on the production information in association with the pressure. Therefore, the precursory abnormality of the vacuum pump 71 can be determined accurately, and the maintenance and the like can be performed as early as possible.

[0044] Further, even when there is a vacuum pump 71 for which the timing of periodic maintenance has come, the timing of periodic maintenance is postponed when the pressure is in a predetermined normal range. Therefore, the necessity of periodic maintenance can be determined accurately, and if the maintenance is not required immediately, the periodic maintenance can be postponed and the installation process can be continued. Therefore, frequent periodic maintenance can be prevented, the work burden of the operator can be reduced, and the installation process can be performed efficiently.

[0045] Note that the present disclosure is not limited at all to the above-described embodiments, and it is obvious that the present disclosure can be implemented in various ways within the technical scope of the present disclosure.

[0046] For example, in the above-described embodiments, even when the timing of periodic maintenance has come, the timing is postponed if the pressure is in a predetermined normal range, but this is not limiting, and it can be that if the timing of periodic maintenance has come, the maintenance is performed regardless of the pressure. That is, the processes of S340, S345, and S355 of the pump state confirmation process can be omitted.

[0047] In the embodiments, when the pressure is not in the abnormal range, it is determined whether the vacuum pump 71 is in a state requiring maintenance based on the production information in association with the pressure, but this is not limiting, and such determination can be omitted. For example, it can be that if the pressure is not in the abnormal range but is in a range between the normal range and the abnormal range (between the pressure threshold P0 and the pressure threshold P1), Figure 11 the state requiring maintenance is determined regardless of the production information.

[0048] In the embodiment, as the timing of acquisition of the pressure, the timing before the start of the installation process is exemplified, but is not limited thereto, and can be the timing after the end of the installation process or the like. That is, the production information acquired in the production work and the pressure acquired in the pressure acquisition process after the end of the production work can be stored in correspondence with each other. Further, it is not limited to storage in the time series order in the pressure correlation information database 103a, but as long as the pressure and the production information are stored in correspondence with each other, the determination of the abnormality precursor or the like can be performed. Alternatively, it is not limited to acquisition of the production information, but various determinations of the state of the vacuum pump 71, the timing of the regular maintenance, or the like can be performed based on the pressure acquired in the pressure acquisition process.

[0049] In addition, the pressure supply device 70 can also be configured as a modification example as follows. Figure 12 is a configuration diagram showing a configuration outline of the pressure supply device 170 of the modification example. The pressure supply device 170 of the modification example omits the first flow path 73, the second flow path 74, and the connection flow path 75 in the embodiment. Further, in the modification example, the element suction flow path 177a is connected to the first vacuum pump 71a and to the center hole 17a of the nozzle holding portion 17 of the head 15a, and the element suction flow path 177b is connected to the second vacuum pump 71b and to the center hole 17a of the nozzle holding portion 17 of the head 15b. The third flow path 76, the nozzle holding flow paths 78a, 78b, and the connection flow paths 79a, 79b other than them are connected similarly to the embodiment. In addition, the pressure sensor 72 of the modification example is mounted to the connection flow path 79b, for example.

[0050] That is, the pressure supply device 170 of the modification example differs from the pressure supply device 70 of the embodiment in that there is no flow path (the first flow path 73, the second flow path 74, and the connection flow path 75) for directly supplying negative pressure to the nozzle holding portion 17 of each head 15a, 15b by connecting the first vacuum pump 71a and the second vacuum pump 71b to each other. Even in this modification example, similarly to the embodiment, it is possible to more appropriately perform monitoring of the plurality of vacuum pumps 71 by performing the pressure acquisition process of acquiring the detection value of the pressure sensor 72 as the pressure of the vacuum pump 71 in operation in a state where one of the plurality of vacuum pumps 71 is operated and the remaining vacuum pumps are stopped.

[0051] In the embodiment, the pressure supply device 70 is exemplified as having three vacuum pumps 71, but is not limited thereto, and can have two or more vacuum pumps 71. Alternatively, the pressure supply device 70 can have only one vacuum pump 71, and is not limited to a plurality of vacuum pumps 71. Also, in a state in which the vacuum pump 71 is operating, the detection value of the pressure sensor 72 is acquired as the pressure of the operating vacuum pump 71, and the state of the vacuum pump 71 is determined, similarly to the embodiment. Further, the mounting device 10 is exemplified as having two heads 15, but can have a single head 15. In this case, the mounting device 10 can have one or a set of each of the feeder section, the slide member 20, the X-axis moving device 30, the Y-axis moving device 40, and the part camera 55.

[0052] In the embodiment, the mounting device 10 is exemplified as performing the mounting process as a production operation, but is not limited thereto, and can be an operation device provided with the vacuum pump 71, i.e., an operation device that performs a production operation using the vacuum pressure generated by the vacuum pump 71. Further, the management device 100 performs the pump state confirmation process, but is not limited thereto, and the pump state confirmation process can be performed by the mounting device 10.

[0053] The specification also discloses the technical idea of changing "the monitoring system according to claim 1 or 2" to "the monitoring system according to any one of claims 1 to 4" in original claim 5. Industrial applicability

[0054] The present disclosure can be used for monitoring of a vacuum pump provided in an operation device, and the like. Explanation of reference numerals

[0055] 1 installation system, 10 installation device, 11 housing, 12 base, 13 support table, 15 head, 15a first head, 15b second head, 20 sliding member, 20a first sliding member, 20b second sliding member, 30 X-axis moving device, 30a first X-axis moving device, 30b second X-axis moving device, 40 Y-axis moving device, 40a first Y-axis moving device, 40b second Y-axis moving device, 41 Y-axis linear guide, 42 Y-axis linear motor, 43 Y-axis stator, 44 Y-axis rotor, 50a, 50b component camera, 55 display operation panel, 70, 170 pressure supply device, 71 vacuum pump, 71a first vacuum pump, 71b second vacuum pump, 71c third vacuum pump, 72 pressure sensor, 73 first flow path, 74 second flow path, 75, 79a, 79b connection flow path, 76 third flow path, 77a, 77b, 177a, 177b component suction flow path, 78a, 78b suction nozzle holding flow path, 90 control device, 91, 101 CPU, 92, 102 ROM, 93, 103 HDD, 94, 104 RAM, 100 management device, 103a pressure correlation information database, 107 input device, 108 display, F1 first feeder portion, F2 second feeder portion, S substrate.

Claims

1. A monitoring system for monitoring the pressure of multiple vacuum pumps in an operating device. The monitoring system has the following features: Sensors detect the pressure in the airflow path connected to the plurality of vacuum pumps; The pressure acquisition unit performs the following acquisition process while sequentially switching between operating vacuum pumps: While operating one of the plurality of vacuum pumps and stopping the others, it acquires the sensor's detection value as the pressure of the operating vacuum pump; and The determination unit determines the status of each of the plurality of vacuum pumps based on the pressure obtained in the acquisition process.

2. The monitoring system according to claim 1, wherein, The pressure acquisition unit performs the acquisition process before the production operation of the work device begins.

3. The monitoring system according to claim 1 or 2, wherein, The monitoring system has the following features: The information acquisition unit acquires information about the impact of pressure changes in the vacuum pump on the production operation of the work device as production information. as well as The storage unit stores the pressure obtained during the acquisition process in a corresponding manner with the production information obtained during the production operation before or after the acquisition process. The determination unit determines the status of the plurality of vacuum pumps based on the pressure obtained in the acquisition process and the production information corresponding to that pressure.

4. The monitoring system according to claim 3, wherein, When the pressure obtained in the acquisition process is within a predetermined abnormal range, the determination unit determines that the vacuum pump is in a pressure abnormal state. When the pressure obtained in the acquisition process is not within the abnormal range, the determination unit determines whether the vacuum pump is in a state that requires maintenance based on the production information corresponding to the pressure.

5. The monitoring system according to claim 1 or 2, wherein, The multiple vacuum pumps are configured for periodic maintenance. Even if the vacuum pump is due for regular maintenance, the determination unit postpones the scheduled maintenance of the vacuum pump when the pressure obtained in the acquisition process is within a predetermined normal range.

6. A monitoring system for monitoring the pressure of a vacuum pump in an operating device. The monitoring system has the following features: A sensor detects the pressure in the airflow path connected to the vacuum pump; The pressure acquisition unit performs the following acquisition process: while the vacuum pump is operating, it acquires the detection value of the sensor as the pressure of the vacuum pump during operation; The information acquisition unit acquires information about the impact of pressure changes in the vacuum pump on the production operation of the work device as production information. The storage unit stores the pressure obtained in the acquisition process in a corresponding manner with the production information obtained in the production operation before or after the acquisition process is executed; as well as The determination unit determines the state of the vacuum pump based on the pressure obtained in the acquisition process and the production information corresponding to that pressure.

7. A monitoring method for monitoring the pressure of multiple vacuum pumps in a working device. The monitoring method includes the following steps: (a) While switching the working vacuum pumps in sequence, the following acquisition process is performed: while one of the multiple vacuum pumps is working and the rest are stopped, the detection value of the sensor is acquired as the pressure of the working vacuum pump, wherein the sensor detects the pressure of the air flow path connected to the multiple vacuum pumps. as well as (b) The status of the plurality of vacuum pumps is determined based on the pressure obtained in the acquisition process.

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