Integrated injection molding device for computer shell
The automated control and dual cooling system of the computer shell integrated injection molding device have solved the problems of poor molding and low production efficiency in the existing technology, and achieved high-precision molding and rapid cooling, making it suitable for mass production.
Patent Information
- Application Number
- CN202511739096.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-25
- Publication Date
- 2026-01-23
AI Technical Summary
Existing technologies cannot simultaneously achieve high-precision integrated molding, automated and efficient production, and rapid cooling and shaping of computer casings, resulting in poor product quality, low production efficiency, long production cycles, and difficulty in meeting the needs of mass production.
It adopts an integrated injection molding device for computer shells, including a support platform, lower mold assembly, upper mold assembly, sliding assembly, lifting assembly and ejector pin device. It achieves automated control through a drive device, combined with hydraulic or pneumatic drive, and is equipped with a dual cooling device for rapid cooling to ensure accurate mold closing and rapid solidification.
It achieves high-precision unibody molding of computer casings, improving product quality and lifespan, reducing manual intervention, increasing production efficiency and equipment utilization, and is suitable for mass production.
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Figure CN121374973A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of injection molding machines, in particular to a computer housing integrated injection molding device. BACKGROUND
[0002] In the field of computer housing manufacturing, with the development of lightweight and high-precision electronic devices, the market has higher requirements for the structural integrity, size accuracy and production efficiency of computer housings, but traditional production processes and equipment are difficult to meet these needs, gradually becoming a bottleneck for industry development.
[0003] Currently, some computer housing production still relies on split assembly process, which first processes each part of the housing and then assembles them. This method not only forms obvious joints at the joint, resulting in insufficient structural strength and easy cracking of the housing, but also causes low size accuracy and poor appearance flatness due to errors in manual alignment and assembly, which seriously affects product quality and service life. Even if injection molding process is used, the existing equipment has key defects: lack of stable mold moving and positioning structure, the lower mold movement relies on manual pushing, and the upper mold lifting has no reliable limiting guide, resulting in low mold closing precision and easy molding defects. At the same time, the equipment has low automation, and manual intervention is required from mold alignment, injection molding to finished product removal, resulting in complicated production process, long time consumption, and single cooling system design, which can only cool one side or part of the mold, slow the solidification speed of plastic raw materials, further prolong the production cycle, and make the equipment utilization rate low and the production efficiency difficult to improve, which cannot meet the mass production demand. In summary, the core technical problems that need to be solved in the current computer housing production field are: traditional processes or equipment cannot balance the integrated high-precision molding, automated efficient production and rapid cooling of computer housings, resulting in poor product quality, low production efficiency, long production cycle, and difficulty in adapting to mass production demand. SUMMARY
[0004] The present application provides a computer housing integrated injection molding device, which solves the technical problem that the existing technology or equipment cannot balance the integrated high-precision molding, automated efficient production and rapid cooling of computer housings, resulting in poor product quality, low production efficiency, long production cycle, and difficulty in adapting to mass production demand.
[0005] The technical solution adopted by the embodiments of the present application is as follows.
[0006] The utility model provides a computer housing integrated injection molding device, including support table, lower film subassembly, upper film subassembly, sliding component, lifting assembly and support frame, the support frame sets up one side of support table, sliding component sets up on support table, and sliding component is located below support frame, lifting assembly installs on support frame, upper film subassembly sets up on lifting assembly, and lifting assembly limits at least one part lifting path of upper film subassembly, lower film subassembly sets up on sliding component, and sliding component limits at least one part sliding path of lower film subassembly.
[0007] As a further improvement of the above technical solution: Further technical solutions are: the lifting assembly includes a lifting plate, a connecting seat, a limiting rod, and a first driving device; the first driving device is installed on the support frame; the lifting plate is arranged on the piston end of the first driving device; the limiting rod is arranged on the lifting plate and penetrates through the support frame; the connecting seat is installed on the lifting plate; and the upper film subassembly is installed on the connecting seat.
[0008] Further technical solutions are: the sliding component includes a sliding plate, a sliding block, a sliding rail, a connecting block, and a second driving device; the sliding block is arranged on the sliding plate; the sliding block is slidingly connected to the sliding rail; the sliding rail and the second driving device are both installed on the support table; the piston end of the second driving device is connected to the sliding plate through the connecting block; and the lower film subassembly is installed on the sliding plate.
[0009] Further technical solutions are: the lower film subassembly includes a lower film tool and a first cooling device; the lower film tool is installed on the sliding plate; and the first cooling device is installed on both sides of the lower film tool.
[0010] Further technical solutions are: the upper film subassembly includes an upper film tool, a second cooling device, and an injection joint; the upper film tool is installed on the connecting seat; the second cooling device is installed on both sides of the upper film tool; and the injection joint is connected to the upper film tool.
[0011] Further technical solutions are: the lower film tool and the upper film tool are both internally provided with a thimble device; the thimble device includes a thimble and a third driving device; an installation opening is formed in the lower film tool and the upper film tool, and an installation cover is installed at one end of the installation opening; the third driving device is arranged on the installation cover; and the thimble is arranged on the piston end of the third driving device.
[0012] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages: 1、The device realizes the integrated injection molding of the computer shell through the precise closing of the upper film assembly and the lower film assembly, avoids the problems such as joints and insufficient strength caused by the traditional splicing process, and the computer shell after molding has complete structure, high size precision, smooth appearance, and improved overall quality and service life of the product. The device is equipped with a sliding assembly, a lifting assembly and a ejector pin device, and through the driving device, the process from moving, closing, injection molding, cooling to opening and ejecting the finished product of the lower film assembly is automatically controlled, without too much manual intervention, reducing the manual operation steps and time, significantly improving the production efficiency, and being suitable for mass production of computer shells. The upper film assembly and the lower film assembly are respectively equipped with a second cooling device and a first cooling device, which can quickly cool the plastic raw material in the mold cavity, accelerate the solidification speed of the plastic raw material, greatly shorten the cooling time compared with the natural cooling method, and thus shorten the whole production cycle and improve the utilization rate of the equipment. 2、The limiting rod in the lifting assembly can ensure the stable lifting of the lifting plate and the upper film assembly, and avoid deviation; the sliding block and the sliding rail of the sliding assembly cooperate to ensure the stable sliding of the lower film assembly; each driving device is driven by hydraulic pressure or air pressure, and the power is stable and controllable, so that the overall structure of the device is stable and reliable, and faults are not easy to occur during operation, ensuring the safety of the operators and the smooth progress of the production. The upper die and the lower die of the device can be replaced according to different models and sizes of computer shells, and different specifications of products can be produced by replacing the corresponding molds, so that the device has strong versatility; at the same time, the structure of each part of the device is simple, and the connection mode adopts detachable connection such as bolts and buckles, so that the device is easy to disassemble and install during later maintenance, and the maintenance cost and difficulty are reduced. During the opening process, the shell is first separated from the upper part by the ejector pin device of the upper die, and then the finished product is ejected by the ejector pin device of the lower die, avoiding the problems such as shell jamming and deformation caused by traditional single ejection, further ensuring the integrity of the finished product and reducing the defective product rate. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 It is a whole structure schematic diagram of a computer shell integrated injection molding device in the application.
[0014] Figure 2 It is a partial structure schematic diagram for embodying the connection relationship between the lifting assembly and the upper film assembly in the application.
[0015] Figure 3 It is a partial structure schematic diagram for embodying the connection relationship between the sliding assembly and the lower film assembly in the application.
[0016] Figure 4 It is a partial structure schematic diagram for embodying the ejector pin device in the application.
[0017] In the diagram: 1. Support platform; 2. Lower film assembly; 21. Lower film fixture; 22. First cooling device; 3. Upper film assembly; 31. Upper film fixture; 32. Second cooling device; 33. Injection joint; 4. Sliding assembly; 41. Slide plate; 42. Slider; 43. Slide rail; 44. Connecting block; 45. Second drive device; 5. Lifting assembly; 51. Lifting plate; 52. Connecting seat; 53. Limiting rod; 54. First drive device; 6. Support frame; 7. Ejector device; 71. Ejector; 72. Third drive device. Detailed Implementation
[0018] This application provides an integrated injection molding device for computer casings, which solves the technical problem that existing processes or equipment cannot simultaneously achieve high-precision integrated molding, automated and efficient production, and rapid cooling and shaping of computer casings, resulting in poor product quality, low production efficiency, long cycle time, and difficulty in adapting to the needs of mass production.
[0019] The technical solution in this application is to solve the above problems, and the overall approach is as follows: To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.
[0020] An integrated injection molding device for computer casings, such as Figures 1-4 As shown, it consists of a support platform 1, a lower membrane assembly 2, an upper membrane assembly 3, a sliding assembly 4, a lifting assembly 5, a support frame 6, and a pin device 7. The support frame 6 is fixedly installed on one side of the support platform 1, providing a support base for the lifting and lowering of the entire device; the sliding component 4 is installed on the platform of the support platform 1, and the position of the sliding component 4 is directly below the support frame 6, ensuring that the lower film assembly 2 can complete the sliding action below the support frame 6; the lifting component 5 is installed on the top crossbeam of the support frame 6, and is used to drive the upper film assembly 3 to achieve lifting and lowering; the upper film assembly 3 is connected to the lifting component 5, and can move up and down along the set lifting and lowering path under the action of the lifting component 5; the lower film assembly 2 is installed on the sliding component 4, and can slide left and right along the set sliding path through the drive of the sliding component 4. The lifting assembly 5 specifically includes a lifting plate 51, a connecting seat 52, limiting rods 53, and a first driving device 54. The first driving device 54 is a hydraulic cylinder, the cylinder body of which is fixedly installed on the top crossbeam of the support frame 6, and the piston end is set vertically downward and connected to the center of the upper surface of the lifting plate 51. There are four limiting rods 53, which are fixed at the four corners of the upper surface of the lifting plate 51, and the end of the limiting rod 53 away from the lifting plate 51 passes through the top crossbeam of the support frame 6, and can slide up and down in the crossbeam, so as to guide and limit the lifting of the lifting plate 51. There are two connecting seats 52, which are symmetrically fixed on the lower surface of the lifting plate 51 for connecting the upper membrane assembly 3. The sliding assembly 4 is composed of a sliding plate 41, a sliding block 42, a sliding rail 43, a connecting block 44 and a second driving device 45. The sliding rail 43 is provided with two parallel fixed on the table surface of the support table 1; the sliding block 42 is provided with four, every two as a group is respectively installed on the lower surface of the two sides of the sliding plate 41, and the sliding block 42 is matched with the sliding rail 43, and can smoothly slide on the sliding rail 43; the second driving device 45 selects a cylinder, the cylinder body is fixed on the table surface of the support table 1, and the piston end is connected with one side of the sliding plate 41 through the connecting block 44; the lower film assembly 2 is fixedly installed on the upper surface of the sliding plate 41. The lower film assembly 2 includes a lower film tool 21 and a first cooling device 22. The lower film tool 21 is fixed on the upper surface of the sliding plate 41 by bolts, and the mold cavity is matched with the shape of the lower surface of the computer shell; the first cooling device 22 selects a cooling water pipe group, and two groups of first cooling devices 22 are respectively installed on the left and right sides of the lower film tool 21 through buckles, and the water inlet and outlet of the cooling water pipe are respectively connected with the external cooling water source. The upper film assembly 3 is composed of an upper film tool 31, a second cooling device 32 and an injection joint 33. The upper film tool 31 is fixed on the lower surface of the connecting seat 52 by bolts, and the mold cavity is matched with the shape of the upper surface of the computer shell, and corresponds to the lower film tool 21 up and down; the second cooling device 32 also selects a cooling water pipe group, and two groups of second cooling devices 32 are respectively installed on the left and right sides of the upper film tool 31 through buckles, and the water inlet and outlet of the cooling water pipe are also connected with the external cooling water source; the injection joint 33 is fixedly connected on the center position of the upper surface of the upper film tool 31, and communicates with the flow channel inside the upper film tool 31, and the end of the injection joint 33 away from the upper film tool 31 is connected with the discharge port of the external injection molding machine. The ejector pin device 7 is provided with two groups, which are respectively arranged in the inside of the lower film tool 21 and the upper film tool 31. Each group of ejector pin devices 7 includes an ejector pin 71 and a third driving device 72, and the third driving device selects a small hydraulic cylinder; the side surface of the lower film tool 21 and the upper film tool 31 is provided with an installation port, and the end of the installation port away from the mold cavity is provided with an installation cover fixed by bolts; the cylinder body of the third driving device 72 is fixedly installed on the installation cover, and the piston end faces the mold cavity; one end of the ejector pin 71 is connected with the piston end of the third driving device 72, the other end extends to the inside of the mold cavity, and the gap between the outer wall of the ejector pin 71 and the inner wall of the mold cavity is sealed. Operation flow Device initialization: check whether the device components are in normal state, ensure that the first drive device 54, the second drive device 45, the third drive device 72 of the hydraulic or pneumatic system pressure is normal, the cooling water pipe connection of the first cooling device 22 and the second cooling device 32 is unobstructed, the injection joint 33 is connected with the external injection machine stably. At this time, the lifting assembly 5 drives the upper film assembly 3 to be in the highest position, the sliding assembly 4 drives the lower film assembly 2 to be in the initial position away from the support frame 6, and the ejector pin 71 of the ejector pin device 7 is retracted in the mold.
[0021] Lower film assembly movement: start the second drive device 45, the piston end of the second drive device 45 retracts, drives the sliding plate 41 to move downward along the slide rail 43 through the connecting block 44, until the lower film 21 moves to the position directly below the upper film 31, and the second drive device 45 is closed.
[0022] Upper film assembly descending: start the first drive device 54, the piston end of the first drive device 54 extends, drives the lifting plate 51 to move downward along the guide of the limiting rod 53, the lifting plate 51 drives the upper film assembly 3 to descend synchronously through the connecting seat 52, until the upper film 31 and the lower film 21 are tightly attached, the mold closing action is completed, and the first drive device 54 is closed.
[0023] Injection molding: start the external injection machine, the injection machine injects the molten plastic raw material into the mold cavity formed by the upper film 31 and the lower film 21 through the injection joint 33, until the cavity is filled with plastic raw material, the injection machine stops feeding and maintains a certain holding time.
[0024] Cooling and shaping: while the injection pressure is maintained, start the first cooling device 22 and the second cooling device 32, and the external cooling water source transports cooling water to the upper film 31 and the lower film 21 through the cooling water pipe respectively, and cools the plastic raw material in the mold, so that the plastic raw material is quickly solidified into a computer shell. The cooling time is set according to the characteristics of the plastic raw material and the thickness of the shell, generally 3-5 minutes, and the cooling device is closed after cooling.
[0025] Mold opening and upper film stripping: start the first drive device 54, the piston end of the first drive device 54 retracts, drives the lifting plate 51 and the upper film assembly 3 to move upward; in this process, the third drive device 72 in the upper film 31 is started synchronously, the piston end of the third drive device 72 extends, drives the ejector pin 71 to move into the mold cavity, and ejects the computer shell attached to the upper film 31 cavity, so that the upper film is separated and falls onto the surface of the lower film 21; continue to maintain the action of the first drive device 54, until the upper film 31 returns to the initial highest position, and the first drive device 54 is closed.
[0026] The lower film ejects the finished product: immediately start the third drive device 72 inside the lower film fixture 21, the piston end of the third drive device 72 extends, drives the ejector pin 71 to move to the inside of the mold cavity, and ejects the completely solidified computer shell on the lower film fixture 21 from the mold cavity; after ejection is completed, the third drive device 72 inside the lower film fixture 21 is closed, the ejector pin 71 is retracted, and at the same time the third drive device 72 inside the upper film fixture 31 is also closed synchronously, and the ejector pin 71 is retracted.
[0027] The lower film assembly is reset and the material is taken out: start the second drive device 45, the piston end of the second drive device 45 extends, drives the sliding plate 41 and the lower film assembly 2 to return to the initial position, the operator takes out the ejected computer shell from the lower film fixture 21, completes a injection molding operation, and the device can enter the next cycle.
[0028] Advantages 1、The device realizes the integrated injection molding of the computer shell through the precise clamping of the upper film assembly 3 and the lower film assembly 2, avoids the problems such as joints and insufficient strength caused by traditional splicing process, and the computer shell after molding has complete structure, high size precision, smooth appearance, and improves the overall quality and service life of the product. The device is equipped with a sliding assembly 4, a lifting assembly 5 and an ejector pin device 7, and is automatically controlled through a drive device, from moving, clamping, injection, cooling to opening the mold and ejecting the finished product, the whole process does not need too much manual intervention, reduces the manual operation steps and time, significantly improves the production efficiency, and is suitable for mass production of computer shells. The upper film assembly 3 and the lower film assembly 2 are respectively equipped with a second cooling device 32 and a first cooling device 22, which can quickly cool the plastic raw material in the mold cavity, accelerate the solidification speed of the plastic raw material, compared with the natural cooling method, greatly shorten the cooling time, and further shorten the whole production cycle, improve the utilization rate of the equipment.
[0029] 2、The limiting rod 53 in the lifting assembly 5 can ensure the stable lifting of the lifting plate 51 and the upper film assembly 3, and avoid deviation; the slider 42 and the slide rail 43 of the sliding assembly 4 cooperate to ensure the stable sliding of the lower film assembly 2; each driving device is driven by hydraulic pressure or air pressure, the power is stable and controllable, the overall structure of the device is stable and reliable, and the device is not prone to failure during operation, which ensures the safety of the operator and the smooth progress of production. The upper film fixture 31 and the lower film fixture 21 of the device can be replaced according to different models and sizes of computer housings, and only the corresponding mold needs to be replaced to produce products of different specifications, so the device has strong versatility; at the same time, the structure of each component of the device is simple, and the connection mode adopts detachable connection by bolts, buckles and the like, so that the device is convenient to disassemble and install during later maintenance, and the maintenance cost and difficulty are reduced. During the mold opening process, the upper film fixture 31 needle device 7 first separates the housing from the top, and then the lower film fixture 21 needle device 7 ejects the finished product, avoiding the problems of shell jamming and deformation caused by traditional single ejection, further ensuring the integrity of the finished product and reducing the defective product rate. Although preferred embodiments of the application have been described, those skilled in the art will be able to make additional changes and modifications to these embodiments once they have the basic inventive concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.
[0030] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application also intends to include these modifications and variations.
Claims
1. A computer housing integrated injection molding apparatus, characterized by: The application relates to a film production device, which comprises a support table (1), a lower film assembly (2), an upper film assembly (3), a sliding assembly (4), a lifting assembly (5) and a support frame (6); the support frame (6) is arranged on one side of the support table (1); the sliding assembly (4) is arranged on the support table (1) and located below the support frame (6); the lifting assembly (5) is installed on the support frame (6); the upper film assembly (3) is arranged on the lifting assembly (5) and the lifting assembly (5) defines at least part of the lifting path of the upper film assembly (3); the lower film assembly (2) is arranged on the sliding assembly (4) and the sliding assembly (4) defines at least part of the sliding path of the lower film assembly (2).
2. The computer enclosure integrated injection molding apparatus of claim 1, wherein: The lifting assembly (5) comprises a lifting plate (51), a connecting seat (52), a limiting rod (53) and a first driving device (54); the first driving device (54) is installed on the support frame (6); the lifting plate (51) is arranged on the piston end of the first driving device (54); the limiting rod (53) is arranged on the lifting plate (51) and penetrates through the support frame (6); the connecting seat (52) is installed on the lifting plate (51); and the upper film assembly (3) is installed on the connecting seat (52).
3. The computer enclosure integrated injection molding apparatus of claim 2, wherein: The sliding assembly (4) comprises a sliding plate (41), a sliding block (42), a sliding rail (43), a connecting block (44) and a second driving device (45); the sliding block (42) is arranged on the sliding plate (41); the sliding block (42) is slidably connected to the sliding rail (43); the sliding rail (43) and the second driving device (45) are both installed on the support table (1); the piston end of the second driving device (45) is connected to the sliding plate (41) through the connecting block (44); and the lower film assembly (2) is installed on the sliding plate (41).
4. The computer enclosure integrated injection molding apparatus of claim 3, wherein: The lower film assembly (2) comprises a lower film tool (21) and a first cooling device (22); the lower film tool (21) is installed on the sliding plate (41); and the first cooling device (22) is installed on both sides of the lower film tool (21).
5. The computer enclosure integrated injection molding apparatus of claim 4, wherein: The upper film assembly (3) comprises an upper film tool (31), a second cooling device (32) and an injection joint (33); the upper film tool (31) is installed on the connecting seat (52); the second cooling device (32) is installed on both sides of the upper film tool (31); and the injection joint (33) is connected to the upper film tool (31).
6. The computer enclosure integrated injection molding apparatus of claim 5, wherein: The lower film tool (21) and the upper film tool (31) are both internally provided with a thimble device (7); the thimble device (7) comprises a thimble (71) and a third driving device (72); the lower film tool (21) and the upper film tool (31) are both internally provided with an installation opening, one end of the installation opening is provided with an installation cover; the third driving device (72) is arranged on the installation cover; and the thimble (71) is arranged on the piston end of the third driving device (72).