A nonlinear ultrasonic testing apparatus for brittle wafers and methods of using the same

Abstract

This invention provides a nonlinear ultrasonic testing device for brittle wafers and its method of use. The device includes a base plate with several legs on its top. A connecting frame is located at the top of each leg for placing the wafer during testing. An adjusting frame is located between the legs on the top of the base plate. The adjusting frame has a testing mechanism for ultrasonic testing of the wafer. A transfer frame is located on the top of the base plate for adsorbing and transferring the wafer to the connecting frame. This invention uses suction cups for adsorption and transfer. The inner side of the mounting hook is equipped with a silicone pad to prevent scratches or breakage of the wafer due to physical contact, making it suitable for brittle wafers and reducing the breakage rate. The mounting hook of the connecting frame can move synchronously, adapting to circular wafers with diameters of 50-300mm and various irregularly shaped wafers, eliminating the need to change clamps and improving testing versatility. The testing angle is continuously adjustable, eliminating the need to change probes and meeting the testing requirements of different incident angles, improving operational efficiency and convenience.

Description

Technical Field

[0001] This invention relates to the field of brittle wafer testing technology, and more specifically to a nonlinear ultrasonic testing device for brittle wafers and its method of use. Background Technology

[0002] With the rapid development of precision manufacturing fields such as semiconductors and optics, brittle wafers (such as single-crystal silicon, silicon carbide, quartz, and lithium niobate) are increasingly widely used as core basic components. However, during the manufacturing process, due to the inherent brittleness of the materials and the influence of processing stress, micro-defects inevitably occur inside the wafer. These micro-defects with stress concentration are highly susceptible to inducing microcracks, which can lead to wafer breakage or device failure during subsequent use. Therefore, achieving accurate detection of damage to brittle wafers not only has significant engineering value but also holds considerable economic implications.

[0003] Currently, nonlinear ultrasonic testing technology has become one of the main methods for identifying latent damage in brittle materials. This technology is based on the nonlinear behavior of ultrasonic waves propagating in materials: when ultrasonic waves encounter a damaged area inside the material, they will induce a nonlinear response in the originally linearly propagating wave field. By changing the incident position and angle of the ultrasonic waves and analyzing the characteristic changes of higher harmonics and subharmonics generated in the echo signal, qualitative identification and precise location of minute damage inside the material can be achieved.

[0004] However, existing nonlinear ultrasonic testing solutions, such as patent CN117825503A, while solving the problem of probe translation accuracy, still suffer from inconvenient testing operations.

[0005] Brittle wafers are thin, hard, and have poor toughness. The physical contact between the fixture and the wafer can easily cause relative slippage, resulting in scratches or breakage of the brittle wafer.

[0006] The relative positions of the two probe wedges that excite and receive ultrasonic waves are fixed, and it is impossible to move a single wedge probe, thus making it impossible to achieve ultrasonic excitation and reception at any position on the wafer.

[0007] The device has poor compatibility and is difficult to inspect larger-sized (e.g., 300mm in diameter) and other-shaped (e.g., circular) wafers.

[0008] It is difficult to flexibly adjust the detection angle between the probe wedge and the wafer surface according to the wafer inspection requirements. If the ultrasonic incident angle needs to be adjusted, other probes must be replaced, which is inconvenient. Summary of the Invention

[0009] The main objective of this invention is to provide a nonlinear ultrasonic testing device for brittle wafers and its usage method, which solves the problems of existing technologies that are prone to damaging brittle wafers, have fixed wafer size and shape that can be detected, have fixed relative positions for ultrasonic excitation and reception, and have difficulty in changing the incident angle of the sensor, making detection inconvenient.

[0010] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows:

[0011] A nonlinear ultrasonic testing device for brittle wafers includes a base plate with several legs on the top of the base plate.

[0012] The top of the support leg is equipped with a connecting bracket for placing the chip during testing;

[0013] The top of the base plate is equipped with an adjustment bracket located between several legs;

[0014] The adjustment frame is equipped with a testing mechanism, which is used for ultrasonic testing of the wafer;

[0015] The top of the base plate is equipped with a transfer rack, which is used to adsorb and transfer the wafer to the connecting frame for placement.

[0016] In the preferred embodiment, the number of outriggers is four;

[0017] There are two adjustment brackets, which are located between two different support legs.

[0018] The adjusting frame includes a first guide rod and a first screw rod disposed between the two support legs;

[0019] A first movable seat is slidably connected to the first guide rod; a first screw passes through the first movable seat and is threadedly connected to the first movable seat.

[0020] The outrigger is equipped with a first motor, and the output shaft of the first motor is connected to the end of the first screw for transmission.

[0021] The first movable seat is provided with a movable plate, and a support plate is provided at the top of the movable plate at the end away from the movable seat. A second guide rod and a second screw are provided between the movable seat and the support plate.

[0022] The second guide rod is slidably connected to the second movable seat; the second screw passes through the second movable seat and is threadedly connected to the second movable seat.

[0023] The first movable seat is equipped with a second motor, and the output shaft of the second motor is connected to the end of the second screw for transmission.

[0024] The top of the second movable seat is provided with a third guide rod, and the top of the third guide rod is provided with a fixing plate; a third screw is provided between the fixing plate and the second movable seat;

[0025] The third guide rod is slidably connected to the third movable seat; the third screw passes through the third movable seat and is threadedly connected to the third movable seat.

[0026] The bottom of the second movable seat is equipped with a third motor, and the output shaft of the third motor is connected to the end of the third screw for transmission.

[0027] The third activity area is equipped with a testing facility;

[0028] The top of the base plate is equipped with several slide rails, and the sliding end of the slide rails is connected to the movable plate.

[0029] In a preferred embodiment, the transfer frame includes a support frame fixed to the top of the base plate;

[0030] Several guide rails are provided between the support frame and the connecting frame, and a connecting box is slidably connected on the guide rails;

[0031] A connecting plate is fixed to the end of the guide rail away from the support frame; a fourth screw is provided between the connecting plate and the support frame, and the fourth screw passes through the connecting box and is threadedly connected to the connecting box.

[0032] The support frame is equipped with a fifth motor, and the output shaft of the fifth motor is connected to the fourth screw.

[0033] The bottom of the connector box is equipped with a vertically mounted telescopic rod, and the output end of the telescopic rod is equipped with a suction cup.

[0034] In a preferred embodiment, the connecting box includes a box body, and a sixth motor is provided on the side of the box body;

[0035] The output shaft of the sixth motor is equipped with a worm gear rotatably connected to the housing;

[0036] The box contains a rotating shaft, which has a worm gear that meshes with a worm.

[0037] The end of the pivot is connected to the telescopic rod.

[0038] In a preferred embodiment, a temporary storage stage is provided on the top of the base plate for placing the wafer under test;

[0039] The temporary storage platform includes a telescopic column located on the top of the base plate, and a connecting seat is provided on the top of the telescopic column;

[0040] The connector has a placement plate on top, which is used to place the chip under test;

[0041] The placement plate has a cavity in the middle;

[0042] The top of the connector is equipped with a detection mechanism, which is located inside the cavity;

[0043] The top surface of the testing unit and the top surface of the placement plate are on the same plane.

[0044] In a preferred embodiment, the testing mechanism includes an acrylic wedge housing; the acrylic wedge housing is fixed by screws.

[0045] The detector is fixed to the rotating plate by screws, and the rotation angle of the rotating plate is the same as the rotation angle of the detector.

[0046] One end of the rotating plate is hinged to the outer shell of the plexiglass wedge, and the other end is hinged to an adjusting block; an adjusting plate is hinged to the inner side of the outer shell of the plexiglass wedge.

[0047] The adjusting block is slidably connected to the adjusting plate;

[0048] The adjusting plate, adjusting block, and rotating plate are all made of acrylic glass.

[0049] The rotating plate is fixed to one end of a flexible bellows with screws; the opening of the flexible bellows can completely cover the ultrasonic transmission and reception range of the detector; the other end of the flexible bellows is fixed to the opening above the organic glass wedge shell with screws; both connections are sealed with sealing rings for liquid sealing.

[0050] The outer shell of the acrylic wedge has a through hole for liquid inlet. The liquid inlet pipe is connected to the outer shell of the acrylic wedge by screws and is equipped with a sealing ring to seal the liquid between the two and connect to the through hole.

[0051] The acrylic wedge has an arc-shaped through hole on its side, which is engraved with scales for observing the rotation angle of the detector.

[0052] The acrylic wedge housing has a position knob in its arc-shaped through hole, and the position knob is threadedly connected to the rotating plate.

[0053] In a preferred embodiment, a telescopic rod is provided on the side of the plexiglass wedge shell, with one end of the telescopic rod hinged to the plexiglass wedge shell and the other end hinged to the position knob.

[0054] In a preferred embodiment, the connecting frame includes several fixing rods, one end of which is fixed together, and the other end of which is fixed to the top of the support leg.

[0055] A fourth motor is installed at the top of the connection point of the fixed rod;

[0056] The output shaft of the fourth motor is equipped with a connecting shaft, and the connecting shaft is equipped with a gear;

[0057] The fixed rod is slidably connected to a movable sleeve. The bottom of the movable sleeve is provided with an installation hook. The bottom end of the installation hook is bent inward and is provided with a soft pad.

[0058] The top of the fixed rod is provided with a groove, and the movable sleeve has a built-in slider that extends into the groove;

[0059] Both sides of the fixed rod are provided with movable grooves, and a rack is slidably connected in the movable grooves;

[0060] The rack meshes with the gear, and one end of the rack is fixedly connected to the movable sleeve;

[0061] Each rack connects to only one movable sleeve, and the non-parallel racks have different heights.

[0062] A method of using a nonlinear ultrasonic testing device for brittle wafers includes the following steps:

[0063] S1. Place the chip under test in the temporary storage position;

[0064] S2. The wafer under test is moved to the detection position via the transfer structure;

[0065] S3. Adjust the position of the detection mechanism so that its detection end is aligned with the wafer being tested;

[0066] S4. The testing agency performs ultrasonic testing on the wafer under test;

[0067] S5. The test is completed, and the transfer structure removes the wafer under test.

[0068] In the preferred embodiment, in S1, after the wafer under test is placed in the temporary storage position, the testing mechanism in the temporary storage position performs ultrasonic testing on the central area of ​​the wafer under test until the testing of the central area is completed.

[0069] S2 includes:

[0070] S21. The wafer to be tested is adsorbed by the suction cup in the transfer frame;

[0071] S22. The transfer frame moves the wafer to be tested, which is attracted by the suction cup, into the connecting frame.

[0072] S23. The mounting hook inside the connector is moved to a position that matches the chip under test;

[0073] S24. Place the chip to be tested onto the mounting hook;

[0074] In S3, the detection mechanism is moved to fit the wafer under test by adjusting the frame;

[0075] A cavity is formed between the detector and the wafer under test in the testing facility, and the cavity is filled with coupling agent;

[0076] S4 includes:

[0077] S41. The wafer under test is tested by a testing agency;

[0078] When the detection angle needs to be adjusted: Adjust the angle of the detector until the expected detection angle is achieved. During the angle adjustment process, simultaneously fill or release the coupling agent into the cavity until the coupling agent fills the cavity and there are no air bubbles.

[0079] S42. After one position detection is completed, the chip is rotated to the next detection position by rotating the chuck.

[0080] Alternatively, the testing mechanism can be moved to the next testing position using an adjustment bracket;

[0081] S43. Repeat S41 and S42 until the detection is complete;

[0082] After the test is completed, the coupling agent is removed.

[0083] This invention provides a nonlinear ultrasonic testing device for brittle wafers and its method of use. By adopting the above solution, the following beneficial effects are achieved:

[0084] It uses suction cups for adsorption and transfer, and the inner side of the mounting hook is equipped with a silicone pad to avoid scratches or breakage of the chip due to physical contact. It is suitable for brittle chips and reduces the breakage rate.

[0085] The mounting hooks of the connector can move synchronously, adapting to round wafers with diameters of 50-300mm and various irregularly shaped wafers, eliminating the need to change fixtures and improving the versatility of testing.

[0086] The detection angle is continuously adjustable, eliminating the need to replace the probe and meeting the detection needs of a wide range of different incident angles, thus improving operational efficiency and making operation more convenient.

[0087] The entire process of automated transport, positioning, and inspection reduces human intervention and shortens the inspection time per test compared to traditional equipment, making it suitable for efficient inspection of batches of wafers.

[0088] By setting two independent detection positions, the position of each wedge can be adjusted individually to detect all positions of the wafer, eliminating blind spots and ensuring the accuracy of the detection results. Attached Figure Description

[0089] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0090] Figure 1 This is a schematic diagram of the structure of the present invention;

[0091] Figure 2 This is a front view of the present invention;

[0092] Figure 3 This is a schematic diagram of the connecting frame of the present invention;

[0093] Figure 4 This is a schematic diagram of the rack structure of the present invention;

[0094] Figure 5 This is a top view of the rack structure of the present invention;

[0095] Figure 6This is a schematic diagram of the structure of the connecting box of the present invention;

[0096] Figure 7 This is a schematic diagram of the internal structure of the connecting box of the present invention;

[0097] Figure 8 This is a schematic diagram of the structure of the temporary storage platform of the present invention;

[0098] Figure 9 This is a schematic diagram of the structure of the adjustment frame of the present invention;

[0099] Figure 10 This is a schematic diagram of the structure of the detection mechanism of the present invention;

[0100] Figure 11 This is a cross-sectional structural diagram of the testing mechanism of the present invention.

[0101] In the picture:

[0102] Base plate 1, support leg 2, adjusting frame 3, first movable seat 301, first screw 302, first guide rod 303, first motor 304, movable plate 305, support plate 306, second guide rod 307, second screw 308, second motor 309, second movable seat 310, slide rail 311, third guide rod 312, fixed plate 313, third screw 314, third motor 315, third movable seat 316, wafer 4, connecting frame 5, fixed rod 501, slide groove 502, movable sleeve 503, mounting hook 504, movable groove 505, rack 506, fourth motor 507, connecting shaft 508, gear 509, Transfer frame 6, Support frame 601, Guide rail 602, Connecting box 603, Box body 631, Rotating shaft 632, Worm gear 633, Sixth motor 634, Worm 635, Telescopic rod 604, Suction cup 605, Connecting plate 606, Fifth motor 607, Fourth screw 608, Temporary storage platform 7, Telescopic column 701, Connecting seat 702, Placement plate 703, Cavity 704, Detection mechanism 8, Acrylic wedge shell 801, Detector 802, Flexible corrugated pipe 803, Liquid inlet pipe 804, Adjusting plate 805, Rotating plate 806, Sealing ring 807, Position knob 808, Adjusting block 809. Detailed Implementation

[0103] Example 1:

[0104] like Figure 1-11 As shown, a nonlinear ultrasonic testing device for brittle wafers includes a base plate 1, which is preferably a Q355B steel plate with a finely ground surface. The bottom four corners are provided with leveling feet to ensure that the device is placed stably.

[0105] The base plate 1 has four support legs 2 welded to its top. The support legs 2 are stainless steel rods, and the top ends are fixed with connecting frames 5 by bolts, screws or welding for placing the wafer 4 during testing. The base plate 1 has an adjustment frame 3 and a transfer frame 6 located between the support legs 2. The adjustment frame 3 carries the testing mechanism 8 to realize ultrasonic testing. The transfer frame 6 transfers the wafer 4 by adsorption to avoid physical contact damage. The wafer 4 refers to the wafer being tested.

[0106] Furthermore, there are two adjustment frames 3, which are respectively set between two different sets of support legs 2 to realize the three-dimensional movement adjustment of the detection mechanism 8.

[0107] Specifically, the adjustment frame 3 includes a first guide rod 303 and a first screw 302 located between the two support legs 2. The first guide rod 303 is a stainless steel optical shaft, and the first screw 302 is a trapezoidal screw with smooth ends. The two are arranged in parallel.

[0108] A first movable seat 301 is slidably connected to the first guide rod 303, and a first screw 302 passes through the first movable seat 301 and is threadedly connected to it; a first motor 304, preferably a servo motor, is fixed on the support leg 2 by a motor seat, and its output shaft is connected to the first screw 302 through a coupling to drive the first movable seat 301 to move in the horizontal direction.

[0109] The first movable seat 301 is welded with a movable plate 305. The top of the base plate 1 is provided with 2-4 slide rails 311, preferably linear slide rails of model THKSSR25. The sliding end of the slide rail 311 is fixed to the bottom of the movable plate 305 to enhance the stability of movement. The top end of the movable plate 305 away from the first movable seat 301 is welded with a support plate 306. A second guide rod 307 and a second screw 308 are provided between the first movable seat 301 and the support plate 306.

[0110] The second guide rod 307 is slidably connected to the second movable seat 310, and the second screw 308 passes through the second movable seat 310 and is threadedly connected to it; the first movable seat 301 is fixed with a second motor 309, preferably a servo motor, whose output shaft is connected to the second screw 308, driving the second movable seat 310 to move in a horizontal direction perpendicular to the movement of the first movable seat 301.

[0111] The second movable seat 310 is provided with a third guide rod 312 at its top. A fixing plate 313 is welded to the top of the third guide rod 312. A third screw 314 is provided between the fixing plate 313 and the second movable seat 310. The third guide rod 312 is slidably connected to the third movable seat 316. The third screw 314 passes through the third movable seat 316 and is threadedly connected to it. A third motor 315, preferably a servo motor, is fixed at the bottom of the second movable seat 310. The output shaft is connected to the third screw 314 to drive the third movable seat 316 to move in the vertical direction. The third movable seat 316 is fixed with a detection mechanism 8 by bolts or screws to achieve three-dimensional precise positioning of the detection mechanism.

[0112] In use, the first motor 304 is started to drive the first screw 302 to rotate, thereby causing the first movable seat 301 to slide along the direction of the first guide rod 303. Similarly, the second motor 309 is started to drive the second movable seat 310 to slide along the direction of the second guide rod 307, and the third motor 315 is started to drive the third movable seat 316 to slide along the direction of the third guide rod 312. By working together, the three-dimensional adjustment of the detection mechanism 8 can be completed to adapt to different detection needs.

[0113] The transfer frame 6 includes a support frame 601 fixed to the top of the base plate 1. The support frame 601 consists of two vertical rods and a horizontal plate fixed to its top. Two parallel guide rails 602 are provided between the support frame 601 and the connecting frame 5. The cross-section of the guide rails 602 is preferably L-shaped. A connecting box 603 is slidably connected to the guide rails 602. The top of the connecting box 603 is provided with a guide groove that is adapted to the guide rails 602 for fitting the guide rails 602 and sliding.

[0114] A connecting plate 606 is welded to one end of the guide rail 602 away from the support frame 601. A fourth screw 608 is provided between the connecting plate 606 and the support frame 601. The fourth screw 608 passes through the connecting box 603 and is threadedly connected to it. A fifth motor 607, preferably a servo motor, is fixed on the support frame 601. The output shaft is connected to the fourth screw 608 to drive the connecting box 603 to move along the guide rail 602.

[0115] When in use, starting the fifth motor 607 can drive the fourth screw 608, which in turn drives the connector box 603 to slide along the guide rail 602, so that the connector box 603 can be moved between the temporary storage stage 7 and the connector frame 5, thereby facilitating the picking and placing of the chip 4 under test.

[0116] The connecting box 603 includes a box body 631. A sixth motor 634, preferably a stepper motor, is fixed to the side of the box body 631. Its output shaft is provided with a worm gear 635 rotatably connected inside the box body 631. A rotating shaft 632 is rotatably connected inside the box body 631 via a bearing. A worm wheel 633 is fixed on the rotating shaft 632 and meshes with the worm gear 635. The end of the rotating shaft 632 is connected to a vertically arranged telescopic rod 604. The telescopic rod 604 is preferably an electric push rod with a stroke of 150-300mm. A suction cup 605 is fixed to the output end of the telescopic rod 604. The suction cup 605 is preferably an electrostatic suction cup or a vacuum suction cup for adsorbing the wafer 4.

[0117] When it is necessary to transfer the chip 4, the suction cup 605 uses the existing method to generate suction to adsorb the chip 4, and then the sixth motor 634 is activated to move it to the required position.

[0118] Furthermore, a temporary storage platform 7 is provided on the top of the base plate 1 for placing the wafer 4 to be tested; the temporary storage platform 7 includes a telescopic column 701 provided on the top of the base plate 1, the telescopic column 701 is preferably a hydraulic telescopic cylinder, and a connecting seat 702 is welded to the top of the telescopic column 701; a placement plate 703 is fixed to the top of the connecting seat 702 by bolts or screws for placing the wafer 4 to be tested, the surface of the placement plate 703 is provided with anti-slip texture, and a circular cavity 704 is provided in the middle.

[0119] The top of the connector 702 is provided with a detection mechanism 8, which is located in the cavity 704. Its top surface is on the same plane as the top surface of the placement plate 703. It can detect the central area of ​​the wafer to detect the position of the wafer 4 subsequently held by the suction cup 605, thereby avoiding incomplete detection of the wafer 4 in the future.

[0120] The number of connection boxes 603 is set according to the actual situation. It is preferred to have 1-2 connection boxes 603 to facilitate the transfer and adsorption and meet different adsorption requirements. If two connection boxes 603 are used, they are connected to both sides of the wafer 4 under test to increase the stability during transfer. If one connection box 603 is used, it is connected to the center of the wafer 4 under test.

[0121] In a further embodiment, the detection mechanism 8 includes an acrylic wedge housing 801, which is fixed to the mounting position by screws. The mounting position includes a third movable seat 316 and a connecting seat 702. The detector 802 is preferably a nonlinear ultrasonic probe, which is fixed to a rotating plate 806 by screws. One end of the rotating plate 806 is hinged to the acrylic wedge housing 801, and the other end is hinged to an adjusting block 809. An adjusting plate 805 is hinged to the inner side of the acrylic wedge housing 801, and the adjusting block 809 is slidably connected to the adjusting plate 805. The adjusting plate 805, the adjusting block 809, and the rotating plate 806 are all made of acrylic to avoid interfering with the propagation of ultrasonic waves.

[0122] The rotating plate 806 is fixed to one end of a flexible bellows 803 by screws. The flexible bellows 803 is preferably made of silicone. The opening of the flexible bellows 803 can completely cover the ultrasonic transmission and reception range of the detector 802. The other end is fixed to the opening above the acrylic wedge housing 801 by screws. Both connections are equipped with sealing rings 807 to achieve liquid sealing. The acrylic wedge housing 801 is provided with a through hole for liquid inlet. The liquid inlet pipe 804 is connected to the housing by screws and is sealed with a sealing ring 807. The liquid inlet pipe 804 communicates with the through hole for injecting coupling agent. The coupling agent is preferably a 1:1 mixture of glycerol and water or pure water.

[0123] The acrylic wedge housing 801 has an arc-shaped through hole on its side, with angle markings for observing the rotation angle of the detector 802. A position knob 808 is located within the arc-shaped through hole and is threadedly connected to the rotating plate 806. A telescopic rod is located on the side of the acrylic wedge housing 801; preferably, it is an electric or hydraulic telescopic rod. One end of the telescopic rod is hinged to the acrylic wedge housing 801, and the other end is hinged to the position knob 808 for angle adjustment. Specifically, extending the telescopic rod pushes the position knob 808 downwards, thereby moving the rotating plate 806 to adjust the angle; retracting it in the opposite direction moves the rotating plate 806 to adjust the angle in the opposite direction.

[0124] In use, the adjusting frame 3 is used to move the acrylic wedge housing 801 so that its top is in contact with the wafer 4. Then, a coupling agent, such as water, is filled into the cavity between the detector 802, the flexible bellows 803, the opening above the acrylic wedge housing 801 and the wafer 4, so that the cavity is filled with coupling agent and free of air bubbles. Then the detector 802 can detect the wafer 4 in the existing manner.

[0125] In another embodiment, the opening at the top of the plexiglass wedge casing 801 is provided with a sealing glass, which is made of ultra-thin glass to prevent liquid leakage. Whether or not glass is used depends on the actual needs.

[0126] In a further embodiment, the connecting frame 5 includes, preferably, four fixing rods 501, one end of which is welded and fixed, and the other end is bolted or screwed to the top of the support leg 2; as shown Figure 1 As shown, it preferably forms an X-shaped structure, with a fourth motor 507, preferably a stepper motor, fixed at the top of the connection of the fixing rod 501. The output shaft of the motor is welded to a connecting shaft 508, and a gear 509 is fixed on the connecting shaft 508.

[0127] A movable sleeve 503 is slidably connected to the fixed rod 501. A mounting hook 504 is welded to the bottom of the movable sleeve 503. The bottom end of the mounting hook 504 is bent inward, and a silicone pad is pasted on the inside to avoid scratching the chip. A sliding groove 502 is provided at the top of the fixed rod 501. The slider inside the movable sleeve 503 extends into the sliding groove 502 to ensure smooth sliding. Movable grooves 505 are provided on both sides of the fixed rod 501. A rack 506 is slidably connected in the movable groove 505. The rack 506 meshes with a gear 509. One end is fixedly connected to the movable sleeve 503. The non-parallel racks 506 have different heights to ensure that the gears drive the four mounting hooks 504 to move synchronously, which can accommodate chips with different diameters of 50-300mm.

[0128] When in use, starting the fourth motor 507 can drive the connecting shaft 508 and gear 509 to rotate, which in turn drives the four racks 506 to slide, and finally drives the four mounting hooks 504 to move synchronously, so that they can move closer to each other or separate, thus adapting to the placement of different crystals 4.

[0129] Example 2:

[0130] A method of using a nonlinear ultrasonic testing device for brittle wafers includes the following steps:

[0131] S1: Placement and Preliminary Inspection of Wafer 4

[0132] The fragile wafer 4 to be tested is placed stably on the placement plate 703 of the temporary storage stage 7, with the center of the wafer 4 aligned with the cavity 704;

[0133] The testing mechanism 8 inside the temporary storage stage 7 is activated, and coupling agent is injected to fill the cavity between the flexible bellows 803 and the wafer 4. Ultrasonic testing is performed on the central area of ​​the wafer 4 to screen for obvious defects. After the testing is completed, the coupling agent is discharged.

[0134] S2: Wafer 4 is transferred to the detection position:

[0135] Start the fifth motor 607 of the transfer frame 6 to drive the connecting box 603 to move along the guide rail 602 to above the temporary storage platform 7;

[0136] The telescopic rod 604 extends, and the suction cup 605 contacts the surface of the wafer 4. The existing technology is used to adsorb the wafer 4 through the suction cup 605.

[0137] When the telescopic rod 604 retracts, the fifth motor 607 drives the connecting box 603 to move into the connecting frame 5;

[0138] Start the fourth motor 507, the gear 509 drives the rack 506 to move, the movable sleeve 503 slides along the fixed rod 501, and the mounting hook 504 moves to the position that matches the chip 4.

[0139] The telescopic rod 604 extends, placing the chip 4 onto the mounting hook 504. The suction cup 605 releases its suction, and the telescopic rod 604 retracts and resets. Alternatively, it can be done without depressurization and resetting.

[0140] S3: Location of the testing institution:

[0141] Driven by the first motor 304, the second motor 309 and the third motor 315 of the adjustment frame 3, the detection mechanism 8 is moved to the detection surface of the wafer 4, and the flexible bellows 803 contacts the surface of the wafer 4 to form a sealed cavity.

[0142] To adjust the detection angle, manually rotate or drive the position knob 808 via the telescopic rod on the side of the acrylic wedge housing 801 to rotate the rotating plate 806 around the hinge point. Observe the angle through the scale on the side of the acrylic wedge housing 801. After adjusting to the expected angle, fix the position knob 808 by using the telescopic rod on the side of the acrylic wedge housing 801.

[0143] Coupling agent is injected into the cavity through the inlet pipe 804. During the angle adjustment process, the coupling agent is simultaneously filled or released to ensure that the cavity is full and free of air bubbles.

[0144] S4: Comprehensive Inspection and Defect Identification

[0145] S41. Start detector 802 to perform nonlinear ultrasonic testing on the current position of wafer 4, collect ultrasonic signals, and analyze the characteristics of higher harmonics and lower harmonics to determine whether there are defects.

[0146] S42. After a position detection is completed, the chip 4 can be adsorbed by the suction cup of the transfer frame 6, and the sixth motor 634 drives the chip 4 to rotate to the next detection position, or the detection mechanism 8 can be moved to the next position by the adjustment frame 3.

[0147] Repeat steps S41 and S42 until the entire surface of wafer 4 is inspected.

[0148] After the test is completed, the coupling agent is discharged through the inlet pipe 804, and the adjusting frame 3 drives the testing mechanism 8 to reset.

[0149] S5: Chip 4 removed:

[0150] The suction cup 605 of the transfer frame 6 adsorbs the wafer 4 after the detection is completed, and the fourth motor 507 drives the mounting hook 504 away from the wafer 4.

[0151] The fifth motor 607 drives the connecting box 603 to move to the designated position, the telescopic rod 604 extends, the suction cup 605 releases its adsorption, the chip 4 is placed, and the test is completed.

[0152] The above embodiments are merely preferred technical solutions of the present invention and should not be considered as limitations on the present invention. The scope of protection of the present invention should be limited to the technical solutions described in the claims, including equivalent substitutions of the technical features described in the claims. That is, equivalent substitutions and improvements within this scope are also within the scope of protection of the present invention.

Claims

1. A nonlinear ultrasonic testing device for brittle wafers, characterized in that: Includes a base plate (1), and the top of the base plate (1) is provided with several legs (2); The top of the support leg (2) is provided with a connecting frame (5) for placing the chip (4) during testing; The size of the connecting bracket (5) for placing the wafer (4) is adjustable, and it is used to place wafers (4) of different sizes and shapes. The top of the base plate (1) is provided with an adjustment frame (3) located between several legs (2); The adjustment frame (3) is equipped with a detection mechanism (8), which is used to perform ultrasonic testing on the wafer (4); The top of the base plate (1) is provided with a transfer frame (6), which is used to adsorb and transfer the wafer (4) to the connecting frame (5) for placement; The top of the base plate (1) is provided with a temporary storage platform (7) for placing the wafer (4) to be tested, so that the transfer rack (6) can directly pick it up; The number of outriggers (2) is four; There are two adjustment brackets (3), and the two adjustment brackets (3) are set between two different support legs (2); The adjustment frame (3) includes a first guide rod (303) and a first screw rod (302) disposed between the two support legs (2); A first movable seat (301) is slidably connected to the first guide rod (303); a first screw (302) passes through the first movable seat (301) and is threadedly connected to the first movable seat (301); The outrigger (2) is equipped with a first motor (304), and the output shaft of the first motor (304) is connected to the end of the first screw (302) for transmission. The first movable seat (301) is provided with a movable plate (305), and a support plate (306) is provided at the top of the movable plate (305) away from the movable seat (301). A second guide rod (307) and a second screw (308) are provided between the movable seat (301) and the support plate (306). The second guide rod (307) is slidably connected to the second movable seat (310); the second screw (308) passes through the second movable seat (310) and is threadedly connected to the second movable seat (310); The first movable seat (301) is equipped with a second motor (309), and the output shaft of the second motor (309) is connected to the end of the second screw (308) for transmission. The top of the second movable seat (310) is provided with a third guide rod (312), and the top of the third guide rod (312) is provided with a fixing plate (313); a third screw (314) is provided between the fixing plate (313) and the second movable seat (310). The third guide rod (312) is slidably connected to the third movable seat (316); the third screw (314) passes through the third movable seat (316) and is threadedly connected to the third movable seat (316); The bottom of the second movable seat (310) is provided with a third motor (315), and the output shaft of the third motor (315) is connected to the end of the third screw (314) for transmission. The third movable seat (316) is equipped with a testing mechanism (8); The top of the base plate (1) is provided with several slide rails (311), and the sliding end of the slide rails (311) is connected to the movable plate (305); The testing unit (8) includes an acrylic wedge housing (801); the acrylic wedge housing (801) is fixed by screws; The detector (802) is fixed to the rotating plate (806) by screws, and the rotation angle of the rotating plate (806) is the same as the rotation angle of the detector (802); One end of the rotating plate (806) is hinged to the outer shell (801) of the plexiglass wedge, and the other end is hinged to an adjusting block (809); an adjusting plate (805) is hinged to the inner side of the outer shell (801) of the plexiglass wedge. The adjusting block (809) is slidably connected to the adjusting plate (805); The adjusting plate (805), adjusting block (809), and rotating plate (806) are all made of plexiglass; The rotating plate (806) is fixed to one end of the flexible bellows (803) by screws; the opening of the flexible bellows (803) can completely cover the ultrasonic transmission and reception range of the detector (802); the other end of the flexible bellows (803) is fixed to the opening above the organic glass wedge shell (801) by screws; both connections are sealed with sealing rings (807) for liquid sealing. The acrylic wedge housing (801) is provided with a through hole for liquid inlet, and the liquid inlet pipe (804) is connected to the acrylic wedge housing (801) by screws, and is provided with a sealing ring (807) to seal the liquid between the two and connect to the through hole; The acrylic wedge shell (801) has an arc-shaped through hole on its side, with a scale engraved on it for observing the rotation angle of the detector (802); The acrylic wedge housing (801) has an arc-shaped through hole with a position knob (808) which is threadedly connected to the rotating plate (806); The connecting frame (5) includes several fixing rods (501), one end of the several fixing rods (501) is fixed together, and the other end of the fixing rods (501) is fixed to the top of the support leg (2); A fourth motor (507) is provided at the top of the connection of the fixing rod (501); The output shaft of the fourth motor (507) is provided with a connecting shaft (508), and the connecting shaft (508) is provided with a gear (509); The fixed rod (501) is slidably connected to a movable sleeve (503). The bottom of the movable sleeve (503) is provided with an installation hook (504). The bottom end of the installation hook (504) is bent inward and is provided with a soft pad. The top of the fixed rod (501) is provided with a groove (502), and the movable sleeve (503) has a built-in slider that extends into the groove (502); The fixed rod (501) has movable grooves (505) on both sides, and a rack (506) is slidably connected in the movable grooves (505); The rack (506) meshes with the gear (509), and one end of the rack (506) is fixedly connected to the movable sleeve (503); A rack (506) is connected to only one movable sleeve (503), and the non-parallel racks (506) have different heights.

2. The nonlinear ultrasonic testing device for brittle wafers according to claim 1, characterized in that: The transfer frame (6) includes a support frame (601) fixed to the top of the base plate (1). A number of guide rails (602) are provided between the support frame (601) and the connecting frame (5), and a connecting box (603) is slidably connected on the guide rails (602). A connecting plate (606) is fixed to one end of the guide rail (602) away from the support frame (601); a fourth screw (608) is provided between the connecting plate (606) and the support frame (601), and the fourth screw (608) passes through the connecting box (603) and is threadedly connected to the connecting box (603); The support frame (601) is equipped with a fifth motor (607), and the output shaft of the fifth motor (607) is connected to the fourth screw (608); The bottom of the connecting box (603) is provided with a vertically arranged telescopic rod (604), and the output end of the telescopic rod (604) is provided with a suction cup (605).

3. The nonlinear ultrasonic testing device for brittle wafers according to claim 2, characterized in that: The connecting box (603) includes a box body (631), and a sixth motor (634) is provided on the side of the box body (631). The output shaft of the sixth motor (634) is provided with a worm gear (635) rotatably connected to the housing (631); The housing (631) is equipped with a rotating shaft (632), the rotating shaft (632) is equipped with a worm gear (633), and the worm gear (633) meshes with the worm (635); The end of the pivot (632) is connected to the telescopic rod (604).

4. The nonlinear ultrasonic testing device for brittle wafers according to claim 2, characterized in that: The temporary storage platform (7) includes a telescopic column (701) located on the top of the base plate (1), and a connecting seat (702) is provided on the top of the telescopic column (701). The connector (702) has a placement plate (703) on its top, which is used to place the chip under test (4). A cavity (704) is provided in the middle of the placement plate (703); The top of the connecting seat (702) is provided with a detection mechanism (8), which is located inside the cavity (704); The top surface of the testing unit (8) and the top surface of the placement plate (703) are on the same plane.

5. The nonlinear ultrasonic testing device for brittle wafers according to claim 1, characterized in that: The acrylic wedge housing (801) has a telescopic rod on its side. One end of the telescopic rod is hinged to the acrylic wedge housing (801), and the other end is hinged to the position knob (808).

6. A method of using the nonlinear ultrasonic testing apparatus for brittle wafers according to any one of claims 1-5, characterized in that: Includes the following steps: S1. Place the chip under test in the temporary storage position; S2. The wafer under test is moved to the detection position via the transfer structure; S3. Adjust the position of the detection mechanism so that its detection end is aligned with the wafer under test. S4. The testing agency performs ultrasonic testing on the wafer under test; S5. The test is completed, and the transfer structure removes the wafer under test.

7. The method of using the nonlinear ultrasonic testing device for brittle wafers according to claim 6, characterized in that: exist In S1, after the chip under test is placed in the temporary storage position, the testing mechanism in the temporary storage position performs ultrasonic testing on the central area of ​​the chip under test until the testing of the central area is completed. S2 includes: S21. The wafer to be tested is adsorbed by the suction cup in the transfer frame; S22. The transfer frame moves the wafer to be tested, which is attracted by the suction cup, into the connecting frame. S23. The mounting hook inside the connector is moved to a position that matches the chip under test; S24. Place the chip to be tested onto the mounting hook; In S3, the detection mechanism is moved to fit the wafer under test by adjusting the frame; A cavity is formed between the detector and the wafer under test in the testing facility, and the cavity is filled with coupling agent; S4 includes: S41. The wafer under test is tested by a testing agency; When the detection angle needs to be adjusted: Adjust the angle of the detector until the expected detection angle is achieved. During the angle adjustment process, simultaneously fill or release the coupling agent into the cavity until the coupling agent fills the cavity and there are no air bubbles. S42. After one position detection is completed, the chip is rotated to the next detection position by rotating the chuck. Alternatively, the testing mechanism can be moved to the next testing position using an adjustment bracket; S43. Repeat S41 and S42 until the detection is complete; After the test is completed, the coupling agent is removed.

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