Balanced test method, equipment and system for distributed BMS slave control board, and medium

Abstract

The invention provides an equalization test method, equipment and system for a distributed BMS slave control board, and a medium, and relates to the technical field of battery equalization. The distributed BMS slave control board is connected with a battery module, and the method comprises the steps that the distributed BMS slave control board is controlled to start an equalization program, and temperature information in the equalization process is acquired; performing balance control and performance test on the distributed BMS slave control board according to the temperature information; and optimizing the distributed BMS slave control board and / or the battery module according to a test result. According to the system provided by the invention, balance testing and performance optimization can be carried out on the distributed BMS slave control board, and the safety and reliability of the slave control board are improved.

Description

Technical Field

[0001] This application relates to the field of battery equalization technology, and in particular to an equalization test method, device, system and medium for a distributed BMS slave control board. Background Technology

[0002] In a battery management system (BMS), battery balancing is a crucial function. It ensures that the voltage of each battery cell remains within a reasonable range, preventing overcharging or over-discharging, thereby extending the battery pack's lifespan and improving safety.

[0003] In a distributed BMS design, the distributed BMS slave control board is located within the battery pack to manage and balance the batteries. In related technologies, the distributed BMS slave control board includes resistors, each connected to a specific battery group within the pack. The slave control board monitors the voltage of each battery group. When it detects that the voltage of a battery group exceeds a set value, it initiates a balancing program. This program uses control circuitry (such as MOSFET switches) to discharge the resistors connected to that battery group, releasing excess energy as heat and lowering the voltage, thus achieving battery balancing. However, the heat generated by resistor discharge can cause localized temperature increases on the distributed BMS slave control board, affecting the normal operation of the BMS system and, in severe cases, even causing board burnout.

[0004] However, the related technologies do not conduct research on load balancing testing and optimization when performing performance tests on distributed BMS slave control boards, resulting in poor security and reliability of distributed BMS slave control boards. Summary of the Invention

[0005] This application provides a method, device, system, and medium for balanced testing of distributed BMS slave control boards, which can perform balanced testing and performance optimization on distributed BMS slave control boards, thereby improving the security and reliability of distributed BMS slave control boards.

[0006] In a first aspect, embodiments of this application provide a method for balancing a distributed BMS slave control board, wherein the distributed BMS slave control board is connected to a battery module, and the method includes:

[0007] The distributed BMS is controlled to start the equalization program from the control board and to obtain temperature information during the equalization process.

[0008] Based on the temperature information, perform balanced control and performance testing on the distributed BMS slave control board;

[0009] The distributed BMS slave control board and / or the battery module are optimized based on the test results.

[0010] In one possible implementation, the temperature information includes the resistor temperature and / or chip temperature of the distributed BMS slave control board, and the step of performing equalization control and performance testing on the distributed BMS slave control board based on the temperature information includes one or more of the following:

[0011] Determine whether there is a first resistance temperature greater than or equal to a first temperature threshold among the resistance temperatures; if so, determine the first resistance corresponding to the first resistance temperature and reduce the equalization current corresponding to the first resistance; determine whether there is a second resistance among the first resistances with a resistance temperature greater than or equal to a second temperature threshold; if so, control the equalization circuit where the second resistance is located to be cut off.

[0012] Determine whether there is a first chip temperature greater than or equal to a first temperature threshold among the chip temperatures; if so, identify the first chip corresponding to the first chip temperature and reduce the equalization current corresponding to the first chip; determine whether there is a second chip among the first chips with a chip temperature greater than or equal to a second temperature threshold; if so, control the equalization circuit where the second chip is located to be cut off.

[0013] Wherein, the second temperature threshold is the critical temperature at which the distributed BMS slave control board overheats and is damaged, and the first temperature threshold is less than the second temperature threshold.

[0014] In one possible implementation, the battery module is optimized based on test results, including:

[0015] Determine the first battery pack connected to each first resistor, and the temperature of the first battery pack corresponding to each first battery pack;

[0016] Determine the second battery pack connected to each second resistor, and the temperature of each second battery pack.

[0017] Cluster analysis is performed on the temperatures of the first battery pack and the second battery pack to determine the corresponding battery pack temperature categories.

[0018] Determine whether each battery pack has any abnormalities based on the battery pack temperature category, and if so, the category of the abnormality.

[0019] The battery modules are optimized based on whether there are any abnormalities in each battery pack and the type of abnormality when they are present.

[0020] In one possible implementation, the distributed BMS slave control board is optimized based on test results, including:

[0021] The actual balancing current value is determined based on the actual resistance value and actual voltage value of the second resistor;

[0022] The actual power of the second resistor is determined based on the actual equalization current value and the actual resistance value.

[0023] Determine whether the actual power of the second resistor is greater than or equal to the rated power of the second resistor;

[0024] If the rated power is greater than or equal to that of the second resistor, the optimized resistor value is determined based on the current value corresponding to the uninterrupted equalization circuit, and the distributed BMS slave control board is optimized based on the resistor model corresponding to the optimized resistor value.

[0025] If the power is less than the rated power of the second resistor, then the equalization variables when the distributed BMS slave control board starts the equalization program are optimized.

[0026] In one possible implementation, optimizing the balancing variables when the distributed BMS slave control board starts the balancing program includes:

[0027] Based on multiple preset balancing variables, the distributed BMS control board is controlled to start the corresponding balancing program.

[0028] For each equilibrium variable, obtain the temperature information during the equilibrium process after the equilibrium program corresponding to the equilibrium variable is started; determine the temperature dispersion of the equilibrium variable based on the temperature information.

[0029] The equilibrium variable is determined based on the equilibrium variable with the smallest temperature dispersion when the distributed BMS starts the equilibrium program from the control board.

[0030] In one possible implementation, the temperature information includes the battery pack temperature of the battery module, and the step of performing equalization control and performance testing on the distributed BMS slave control board based on the temperature information includes:

[0031] Determine whether there is a third battery pack temperature that is greater than or equal to a third temperature threshold, where the third temperature threshold is the critical temperature at which the battery pack is overheated and damaged.

[0032] If it exists, determine the third battery pack corresponding to the temperature of the third battery pack, and control the equalization circuit where the third battery pack is located to be cut off.

[0033] Accordingly, the battery module is optimized based on the test results, including:

[0034] The third battery pack is optimized based on the other battery packs in the battery module besides the third battery pack.

[0035] In one possible implementation, the temperature information includes the component temperatures of each component on the distributed BMS slave control board, and the step of performing balanced control and performance testing on the distributed BMS slave control board based on the temperature information includes:

[0036] The average component temperature is determined based on the component temperatures of each component.

[0037] Determine whether there is a target component temperature whose difference from the average component temperature is outside the allowable error range;

[0038] If it exists, then determine the target component corresponding to the temperature of the target component, and control the equalization circuit where the target component is located to be cut off;

[0039] Accordingly, the distributed BMS slave control board is optimized based on the test results, including:

[0040] The target component is optimized based on other components in the distributed BMS slave control board.

[0041] Secondly, embodiments of this application provide a computing device, including:

[0042] The acquisition module is used to control the distributed BMS to start the equalization program from the control board and acquire temperature information during the equalization process.

[0043] The processing module is used to perform balanced control and performance testing on the distributed BMS slave control board based on the temperature information; and to optimize the distributed BMS slave control board and / or the battery module based on the test results.

[0044] Thirdly, embodiments of this application provide another computing device, including:

[0045] The processor, and the memory that is in communication with the processor;

[0046] Memory is used to store instructions that the computer executes;

[0047] The processor is configured to execute computer execution instructions stored in memory, causing the processor to perform the first aspect and / or various possible implementations of the first aspect as described above.

[0048] Fourthly, embodiments of this application provide a balanced testing system for a distributed BMS slave control board, comprising: a battery module and a computing device as described in the third aspect;

[0049] The distributed BMS slave control board includes multiple resistors, one or more chips, and multiple components, wherein the resistors are connected to the battery pack in the battery module.

[0050] The resistor is also connected to a first temperature acquisition device, which is used to acquire the resistance temperature of the resistor and send the resistance temperature to the computing device.

[0051] The battery pack is connected to a second temperature acquisition device, which is used to acquire the battery pack temperature and send the battery pack temperature to the computing device.

[0052] The chip is connected to a third temperature acquisition device, which is used to acquire the chip temperature and send the chip temperature to the computing device.

[0053] The component is connected to a fourth temperature acquisition element, which is used to acquire the component temperature of the component and send the component temperature to the computing device.

[0054] Fifthly, embodiments of this application provide a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the first aspect and / or various possible implementations of the first aspect described above.

[0055] In a sixth aspect, embodiments of this application provide a computer program product, including a computer program, which, when executed by a processor, is used to implement the first aspect and / or various possible implementations of the first aspect as described above.

[0056] This application provides a method, device, system, and medium for equalization testing of a distributed BMS slave control board. After the equalization program is started on the distributed BMS slave control board, the computing device can obtain temperature information during the equalization process and perform equalization control and performance testing on the distributed BMS slave control board based on the temperature information. This avoids damage to the distributed BMS slave control board due to excessive temperature during the equalization process, and also optimizes the distributed BMS slave control board and / or battery module based on the test results, thereby improving the safety and reliability of the distributed BMS slave control board. Attached Figure Description

[0057] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0058] Figure 1 This is a schematic diagram of the structure of a distributed BMS slave control board load balancing test system according to an embodiment of this application;

[0059] Figure 2 This is a flowchart illustrating a distributed BMS slave control board load balancing test method according to an embodiment of this application.

[0060] Figure 3 This is a schematic diagram of the load balancing test process of a distributed BMS slave control board according to an embodiment of this application;

[0061] Figure 4 This is a schematic diagram of the structure of a computing device according to an embodiment of this application;

[0062] Figure 5 This is a schematic diagram of the structure of a computing device according to another embodiment of this application.

[0063] Reference numerals: 1. Battery module; 2. Computing device; 3. Distributed BMS slave control board; 4. Resistor; 5. Battery pack; 6. Chip; 7. First temperature acquisition device; 8. Second temperature acquisition device; 9. Third temperature acquisition device; 10. High and low temperature environment chamber.

[0064] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0065] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0066] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0067] It should be noted that in the embodiments of this application, certain software, components, models and other existing solutions in the industry may be mentioned. These should be regarded as exemplary and are only intended to illustrate the feasibility of implementing the technical solution of this application. However, it does not mean that the applicant has used or necessarily used the solution.

[0068] The equalization test method, equipment, system, and medium for distributed BMS slave control boards of this application can be used in the field of battery equalization, and can also be used in any field other than battery equalization, such as the field of performance testing of distributed BMS slave control boards. The application field of the equalization test method, equipment, system, and medium for distributed BMS slave control boards of this application is not limited.

[0069] The distributed BMS slave control board equalization test method, equipment, system and medium of this application can be applied to scenarios for testing the performance of distributed BMS slave control boards. The distributed BMS slave control board can be set in the battery pack of a vehicle to manage the battery pack. The performance test of any distributed BMS slave control board can be performed using the distributed BMS slave control board equalization test method, equipment, system and medium of this application.

[0070] First, let me explain the terms used in this application:

[0071] A thermocouple is a temperature sensor based on the Seebeck effect. It can directly convert temperature signals into electrical signals and is widely used in industrial temperature measurement, scientific research experiments, energy monitoring and other fields. Its core principle is that when two conductors or semiconductors of different materials form a closed circuit, if the temperatures at the two junctions are different, a thermoelectric potential (thermoelectric electromotive force) will be generated in the circuit. By measuring this potential, the temperature can be indirectly calculated.

[0072] In a battery management system (BMS), battery balancing is a crucial function. It ensures that the voltage of each battery cell remains within a reasonable range, preventing overcharging or over-discharging, thereby extending the battery pack's lifespan and improving safety.

[0073] The exceptional difficulty in controlling the safe and efficient operation of power battery packs stems from the fact that lithium-ion battery systems differ from typical industrial controlled objects. The internal mechanisms of individual battery cells are not fully understood; their charging and discharging processes involve complex conversions of electrical, chemical, and thermal energy, exhibiting high nonlinearity and uncertainty. Internal parameters cannot be directly measured and are highly susceptible to factors such as temperature, battery aging, and charge / discharge rates, all of which are interconnected. When hundreds or thousands of battery cells are connected in series and parallel to form battery modules / packs, variations in manufacturing processes mean that even batteries of the same model from the same batch will not have identical capacity, internal resistance, and other parameters. During use, differences in temperature, ventilation, self-discharge levels, and electrolyte density among individual cells within the battery pack increase inconsistencies in parameters such as voltage, internal resistance, and capacity. Over long-term use, this manifests as voltage deviations in individual cells, creating voltage differences between them. Failure to correct these voltage deviations can lead to overcharging or over-discharging of certain cells, ultimately damaging the entire battery pack. Battery balancing technology adjusts the battery voltage to keep the voltage of each battery cell at a consistent level, ensuring stable usable capacity of the battery pack and improving cycle life.

[0074] In a distributed BMS design, the distributed BMS control board is located within the battery pack to manage and balance the batteries. The fundamental purpose of battery balancing is to transfer energy from high-SOC battery cells to low-SOC battery cells, thereby achieving balance between battery cells. This is a key means to improve the inconsistency of power batteries and enhance the usable capacity, lifespan, and safety of the battery pack.

[0075] In related technologies, the distributed BMS slave control board is equipped with resistors, which are connected one-to-one with each battery pack in the battery pack. The distributed BMS slave control board can monitor the voltage of each battery pack. When it detects that the voltage of a battery pack is higher than a set value, the distributed BMS slave control board starts the equalization program. Through control circuits (such as MOSFET switches), it controls the resistors connected to that battery pack to discharge, releasing the excess electrical energy of the battery pack in the form of heat energy, thereby reducing the voltage and achieving the effect of battery equalization.

[0076] This passive balancing method is widely used due to its advantages such as low cost and simple circuit. However, the heat generated by the resistor discharge can easily cause the temperature of the distributed BMS control board to rise locally, affecting the normal operation of the BMS system. In severe cases, it can even lead to board burnout.

[0077] However, the related technologies do not have research on load balancing testing when performing performance testing on distributed BMS slave control boards. This can easily lead to board burnout during performance testing, affecting testing and project progress, resulting in poor security and reliability of distributed BMS slave control boards.

[0078] Based on the above-mentioned technical problems, the inventive concept of this application is to provide a solution that can perform load balancing tests on distributed BMS slave control boards, thereby improving the security and reliability of distributed BMS slave control boards.

[0079] This application provides a method, device, system, and medium for equalization testing of a distributed BMS slave control board. After the equalization program is started on the distributed BMS slave control board, the computing device can obtain temperature information during the equalization process and perform equalization control and performance testing on the distributed BMS slave control board based on the temperature information. This avoids damage to the distributed BMS slave control board due to excessive temperature during the equalization process, and also optimizes the distributed BMS slave control board and / or battery module based on the test results, thereby improving the safety and reliability of the distributed BMS slave control board.

[0080] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0081] Figure 1 This is a schematic diagram of the structure of a distributed BMS slave control board load balancing test system according to an embodiment of this application, as shown below. Figure 1 As shown, the distributed BMS slave control board balancing test system may include: battery module 1 and computing device 2.

[0082] The distributed BMS slave control board 3 may include multiple resistors 4, one or more chips 6, and multiple components (not shown in the figure). The resistors 4 are connected to the battery packs 5 in the battery module 1.

[0083] Each resistor 4 is also connected to a corresponding first temperature acquisition element 7, which can be used to acquire the resistance temperature of the corresponding resistor 4 and send the resistance temperature to the computing device 2.

[0084] Each battery pack 5 is connected to a corresponding second temperature acquisition unit 8. The second temperature acquisition unit 8 can be used to acquire the battery pack temperature of the corresponding battery pack 5 and send the battery pack temperature to the computing device 2.

[0085] Each chip 6 is connected to a corresponding third temperature acquisition unit 9. The third temperature acquisition unit 9 can be used to acquire the chip temperature of the corresponding chip 6 and send the chip temperature to the computing device 2.

[0086] Each component is connected to a corresponding fourth temperature acquisition unit (not shown in the figure). The fourth temperature acquisition unit can be used to acquire the component temperature of the corresponding component and send the component temperature to the computing device 2.

[0087] The computing device 2 can be used to control the distributed BMS slave control board to start the equalization program and acquire the temperature information collected by the temperature acquisition device during the equalization process; perform equalization control and performance testing on the distributed BMS slave control board based on the temperature information; and optimize the distributed BMS slave control board and / or battery module based on the test results.

[0088] In this embodiment, battery module 1 may include a battery fixture and a DC regulated power supply. The battery fixture can be used to simulate a battery pack. The DC regulated power supply and the battery fixture work together to simulate the battery charging process, provide test conditions for BMS equalization, and create start-up conditions for battery equalization.

[0089] In this embodiment, resistor 4 can be connected one-to-one with battery pack 5 in battery module 1. When the voltage of a certain battery pack is detected to exceed the equalization voltage threshold, the resistor corresponding to that battery pack can be controlled to discharge by using MOSFET switches, etc., so as to reduce the voltage and achieve the effect of battery equalization.

[0090] In this embodiment, the resistor 4 can also be connected one-to-one with the first temperature acquisition element 7, and the resistance temperature of each resistor 4 can be acquired by the first temperature acquisition element 7.

[0091] In this embodiment, the battery pack 5 may include one or more battery cells, and the battery pack 5 may be connected one-to-one with the second temperature acquisition device 8 to acquire the battery pack temperature of each battery pack 5.

[0092] In this embodiment, the distributed BMS slave control board 3 may include one or more chips 6, and each chip 6 may be connected to a third temperature acquisition device 9 in a one-to-one correspondence, using the third temperature acquisition device 9 to acquire the chip temperature of each chip 6.

[0093] In this embodiment, the distributed BMS slave control board 3 may include electronic components, PCB substrate, thermally conductive silicone, housing, and other components; the specific types of components are not limited here. Each component (part or more parts of a component) can be connected to a fourth temperature acquisition device to acquire the component temperature of each component.

[0094] In this embodiment, the specific types of the first temperature acquisition element 7, the second temperature acquisition element 8, the third temperature acquisition element 9, and the fourth temperature acquisition element are not limited in any way, as long as they can acquire the temperature of the connected device / component. For example, the first temperature acquisition element 7, the second temperature acquisition element 8, the third temperature acquisition element 9, and the fourth temperature acquisition element can all be type K thermocouples; of course, they can also be other types of thermocouples. The types of the first temperature acquisition element 7, the second temperature acquisition element 8, the third temperature acquisition element 9, and the fourth temperature acquisition element can be the same or different.

[0095] In this embodiment, the first temperature acquisition element 7, the second temperature acquisition element 8, the third temperature acquisition element 9, and the fourth temperature acquisition element can be connected to the corresponding device / component using heat-resistant adhesive or tape. Of course, other methods can also be used to connect the temperature acquisition element to the corresponding device / component, and no restrictions are imposed here.

[0096] In this embodiment, the first temperature acquisition unit 7, the second temperature acquisition unit 8, the third temperature acquisition unit 9, and the fourth temperature acquisition unit can be connected to the computing device 2. The computing device 2 can acquire the resistance temperature acquired by the first temperature acquisition unit 7, the battery pack temperature acquired by the second temperature acquisition unit 8, the chip temperature acquired by the third temperature acquisition unit 9, and the component temperature acquired by the fourth temperature acquisition unit.

[0097] In this embodiment, the computing device can be a terminal device such as a computer or a mobile phone, or a server-side device such as a physical server or a cloud server; no restrictions are imposed here.

[0098] In this embodiment, the computing device can monitor and manage the temperature collected by the temperature acquisition device in real time. For example, it can display the temperature of resistors, battery packs, chips, components, etc., in different areas according to their categories and arrange them in order of temperature from high to low.

[0099] In this embodiment, the equalization test system for the distributed BMS slave control board may further include a high and low temperature environment chamber 10. The high and low temperature environment chamber 10 simulates the actual working environment of the distributed BMS slave control board and the battery module. The simulated environmental temperature of the high and low temperature environment chamber 10 can be flexibly set according to actual needs, such as simulating a low temperature of -20℃, a normal temperature of 20℃, a normal temperature of 25℃, a high temperature of 50℃ or a high temperature of 55℃, etc., to simulate the actual working conditions of the battery. The distributed BMS slave control board is tested under the actual working environmental temperature of the battery, which improves the accuracy and adaptability of the equalization control and performance testing of the distributed BMS slave control board.

[0100] In this embodiment, equalization control and performance testing of the distributed BMS slave control board may include: monitoring the temperature of resistors, battery packs, chips, and components, and controlling the on / off state of the equalization circuit accordingly; testing whether the temperature of each component on the distributed BMS slave control board is uniform; testing whether the resistors and chips are reasonable; testing whether the equalization variables are reasonable; and testing whether the battery pack is abnormal. Based on the results of the above tests, the distributed BMS slave control board and / or battery module can be optimized to avoid damage to the distributed BMS slave control board due to excessively high equalization temperatures during actual use.

[0101] In this embodiment, equalization control of the battery packs can be achieved using resistors connected to each battery pack. A first temperature acquisition device connected to each resistor can acquire the resistance temperature of each resistor, a second temperature acquisition device connected to each battery pack can acquire the battery pack temperature, a third temperature acquisition device connected to each chip on the distributed BMS slave control board can acquire the chip temperature, and a fourth temperature acquisition device connected to each component on the distributed BMS slave control board can acquire the component temperature. After the computing device obtains the resistor temperature, battery pack temperature, chip temperature, and component temperature, it can perform equalization control and performance testing of the distributed BMS slave control board. This avoids damage to the distributed BMS slave control board due to overheating during the equalization process and allows for optimization of the distributed BMS slave control board and / or battery modules based on the test results, improving the safety and reliability of the distributed BMS slave control board.

[0102] Figure 2 This is a flowchart of a distributed BMS slave control board load balancing test method according to an embodiment of this application. In this embodiment, the execution subject is... Figure 1 The computing equipment of the distributed BMS slave control board load balancing test system describes the load balancing test method for this distributed BMS slave control board. For example... Figure 2 As shown, the load balancing test method for this distributed BMS slave control board may include the following steps:

[0103] S201: Controls the distributed BMS to start the equalization program from the control board and obtains temperature information during the equalization process.

[0104] In this embodiment, a specific balancing program can be set according to the actual operating conditions of the distributed BMS slave control board (battery pack) to improve the consistency of SOC and voltage, increase the available capacity and energy of the battery pack, and extend the service life of the battery pack. For example, a specific balancing strategy can be designed for the operating conditions of heavy-duty truck new energy vehicle systems.

[0105] In this embodiment, the computing device can control the distributed BMS slave control board to start the equalization program when it detects that the following conditions are met: ① There are no related faults that prohibit equalization in the battery management system (such as single cell voltage detection fault, temperature detection fault, current detection fault, internal CAN communication fault, EE fault, etc.); ② The lowest single cell voltage is greater than the allowed equalization voltage threshold (e.g., 3.1V).

[0106] In this embodiment, after the equalization program is started, if the voltage of a certain battery pack is detected to exceed the equalization voltage threshold, the distributed BMS slave control board controls the resistor connected to the battery pack to discharge.

[0107] In this embodiment, the distributed BMS slave control board may include multiple resistors, one or more chips, and multiple components, with the resistors connected to the battery packs in the battery module.

[0108] Each resistor is also connected to a corresponding first temperature acquisition unit, which can be used to acquire the resistance temperature of the corresponding resistor and send the resistance temperature to the computing device.

[0109] Each battery pack is connected to a corresponding second temperature acquisition unit, which can be used to acquire the battery pack temperature of the corresponding battery pack and send the battery pack temperature to the computing device.

[0110] Each chip is connected to a corresponding third temperature acquisition device, which can be used to acquire the chip temperature of the corresponding chip and send the chip temperature to the computing device.

[0111] Each component is connected to a corresponding fourth temperature acquisition unit, which can be used to acquire the component temperature of the corresponding component and send the component temperature to the computing device.

[0112] In this embodiment, after the computing device obtains the resistor temperature, battery pack temperature, chip temperature, and component temperature, it can display the resistor temperature, battery pack temperature, chip temperature, and component temperature in different areas according to their categories and arrange them in descending order of temperature, so as to monitor and manage the temperature collected by the temperature acquisition device in real time.

[0113] S202: Perform balanced control and performance testing on the distributed BMS slave control board based on temperature information.

[0114] In this embodiment, the temperature information may include one or more of the following: resistor temperature, battery pack temperature, chip temperature, and component temperature.

[0115] In this embodiment, equalization control and performance testing of the distributed BMS slave control board may include: monitoring the temperature of resistors, battery packs, chips, and components, and controlling the on / off state of the equalization circuit accordingly; testing whether the temperature of each component on the distributed BMS slave control board is uniform; testing whether the resistor and chip settings are reasonable; testing whether the equalization variables are reasonable; and testing whether the battery pack is abnormal, etc.

[0116] S203: Optimize the distributed BMS slave control board and / or battery module based on the test results.

[0117] In this embodiment, the battery pack in the battery module can be optimized based on the test results of the resistance temperature and battery pack temperature to ensure the balance and consistency of the battery pack; the distributed BMS slave control board can be optimized based on the test results of the resistance temperature, chip temperature and component temperature to ensure the balance, consistency and safety of the distributed BMS slave control board.

[0118] In this embodiment, after the equalization program is started on the distributed BMS slave control board, the computing device can obtain the temperature information during the equalization process, and perform equalization control and performance testing on the distributed BMS slave control board based on the temperature information. This not only avoids damage to the distributed BMS slave control board due to excessive temperature during the equalization process, but also optimizes the distributed BMS slave control board and / or battery module based on the test results, thereby improving the safety and reliability of the distributed BMS slave control board.

[0119] In one possible implementation, the temperature information may include the resistor temperature and / or chip temperature of the distributed BMS slave control board. The above step S202, which performs balanced control and performance testing on the distributed BMS slave control board based on the temperature information, may include one or more of the following A and B:

[0120] A: Determine if there is a first resistance temperature greater than or equal to the first temperature threshold among the resistance temperatures; if so, determine the first resistance corresponding to the first resistance temperature and reduce the equalization current corresponding to the first resistance; determine if there is a second resistance among the first resistances with a resistance temperature greater than or equal to the second temperature threshold; if so, control the equalization circuit where the second resistance is located to be cut off.

[0121] B: Determine if there is a first chip temperature greater than or equal to the first temperature threshold among the chip temperatures; if so, identify the first chip corresponding to the first chip temperature and reduce the equalization current corresponding to the first chip; determine if there is a second chip among the first chips with a chip temperature greater than or equal to the second temperature threshold; if so, control the equalization circuit where the second chip is located to be cut off.

[0122] The second temperature threshold is the critical temperature at which the distributed BMS slave control board overheats and is damaged, and the first temperature threshold is less than the second temperature threshold.

[0123] In this embodiment, the specific second temperature threshold can be flexibly set by those skilled in the art according to the model of the distributed BMS slave control board, etc. For example, the second temperature threshold can be 120°C or 125°C. There are no restrictions here, as long as the distributed BMS slave control board can work normally when the temperature is lower than the second temperature threshold.

[0124] In this embodiment, the specific first temperature threshold can be flexibly set by those skilled in the art according to actual conditions. For example, the first temperature threshold can be 60°C or 65°C, as long as the first temperature threshold is less than the second temperature threshold.

[0125] In this embodiment, reducing the equalization current corresponding to the first resistor / first chip can be done by reducing the equalization current corresponding to the first resistor / first chip to half of its original value, or by reducing the equalization current corresponding to the first resistor / first chip to another proportion of the original current (such as 30% of the current). No restrictions are imposed here.

[0126] In this embodiment, if the second resistor / second chip is detected to be overheated, the computing device can generate and output an abnormal temperature warning message based on the specific location and identification information of the second resistor / second chip, so as to prompt the tester to make improvements and improve the performance of the control board.

[0127] In this embodiment, the computing device can monitor the resistor temperature and chip temperature in real time. If the temperature of a resistor is greater than or equal to a first temperature threshold, the equalization current corresponding to that resistor is reduced. If the temperature of a resistor is greater than or equal to a second temperature threshold, the equalization circuit containing that resistor is cut off. The chip temperature is handled in the same way. Through this setting, equalization control can be performed using resistor temperature and chip temperature, preventing damage to the distributed BMS slave control board and battery pack due to overheating during the equalization process, thus improving the safety and reliability of the distributed BMS slave control board.

[0128] In one possible implementation, optimizing the battery module based on the test results in step S203 above may include:

[0129] S11: Determine the first battery pack connected to each first resistor, and the temperature of the first battery pack corresponding to each first battery pack.

[0130] S12: Determine the second battery pack connected to each second resistor, and the temperature of each second battery pack.

[0131] S13: Perform cluster analysis on the temperatures of the first and second battery packs to determine the corresponding battery pack temperature categories.

[0132] S14: Determine whether there are any abnormalities in each battery pack based on the battery pack temperature category, and the category of abnormality if there are abnormalities.

[0133] S15: Optimize the battery modules based on whether there are any abnormalities in each battery pack and the type of abnormality when they exist.

[0134] In this embodiment, the resistance temperature of the first resistor is too high, and the resistance temperature of the second resistor is too high. Both of these may cause damage to the distributed BMS slave control board. Therefore, it is necessary to perform anomaly analysis on the battery pack connected to the first resistor and the second resistor.

[0135] In this embodiment, cluster analysis can be performed using existing algorithms such as K-Means clustering, and no restrictions are imposed.

[0136] In this embodiment, cluster analysis can be performed directly on the temperatures of the first battery pack and the second battery pack, or cluster analysis can be performed on the temperature difference between the first battery pack and the second battery pack (the degree of deviation from the temperature mean). No restrictions are imposed here.

[0137] In this embodiment, the battery pack temperature category can be distinguished according to the battery pack temperature range (the temperature difference range of the battery pack temperature). For example, a temperature difference range of [0,2) can be a temperature category (high temperature consistency), and [2,4) can be a temperature category (relatively high temperature consistency), etc.

[0138] In this embodiment, technicians can pre-set whether the battery pack temperature category corresponds to an anomaly in the battery pack, and the anomaly category when an anomaly occurs. For example, a temperature difference range of [0,2) corresponds to a high temperature consistency category, which means the battery pack does not have an anomaly.

[0139] In this embodiment, the abnormality categories may include abnormal cell capacity, abnormal cell voltage difference, etc., and no limitation is made here.

[0140] For example, K-Means clustering can be used to identify abnormal battery pack temperature data based on the temperature difference values ​​of different resistors on the distributed BMS control board. This can then identify cells with abnormal capacity and voltage differences. By using program feedback signals, abnormal cells can be balanced and optimized to improve the consistency of cell performance and extend the battery pack's lifespan.

[0141] In this embodiment, after identifying the type of anomaly, the corresponding battery pack in the battery module can be optimized according to the type of anomaly, such as replacing abnormal cells, until the temperature consistency of each battery pack in the battery module is relatively high when balanced.

[0142] In this embodiment, if the resistance temperature is too high, it may be due to an unreasonable battery pack setting in the battery module. Therefore, after obtaining the abnormal first battery pack temperature and second battery pack temperature, cluster analysis can be performed on the first battery pack temperature and second battery pack temperature to determine whether each battery pack has an anomaly, and the anomaly category when an anomaly exists. Based on the anomaly category when an anomaly exists, the battery packs in the battery module can be replaced and optimized to improve the safety and reliability of the distributed BMS slave control board during equalization.

[0143] In one possible implementation, optimizing the distributed BMS slave control board based on the test results in step S203 above may include:

[0144] S21: Determine the actual balancing current value based on the actual resistance value and actual voltage value of the second resistor.

[0145] S22: Determine the actual power of the second resistor based on the actual equalization current value and the actual resistance value.

[0146] S23: Determine whether the actual power of the second resistor is greater than or equal to the rated power of the second resistor.

[0147] S24: If the rated power of the second resistor is greater than or equal to that of the second resistor, the optimized resistor value is determined based on the current value corresponding to the uninterrupted equalization circuit, and the distributed BMS slave control board is optimized based on the resistor model corresponding to the optimized resistor value.

[0148] S25: If the power is less than the rated power of the second resistor, then optimize the equalization variables when the distributed BMS slave control board starts the equalization program.

[0149] In this embodiment, the actual equalization current value = actual voltage value / actual resistance value, and the actual power = actual resistance value × actual equalization current value × actual equalization current value.

[0150] In this embodiment, if the power is greater than or equal to the rated power of the second resistor, it indicates that the temperature is too high due to abnormal resistor settings. The optimized resistor value can be calculated based on the current value corresponding to the uninterrupted equalization circuit (resistor temperature is normal), and the corresponding resistor model database can be searched to provide the resistor model corresponding to the optimized resistor value, thereby optimizing the distributed BMS slave control board.

[0151] In this embodiment, if the power is less than the rated power of the second resistor, it indicates that the resistor setting is normal. The excessively high temperature may be caused by abnormal setting of balancing variables such as balancing voltage, and the balancing variables need to be optimized when the distributed BMS slave control board starts the balancing program.

[0152] In this embodiment, if the temperature of the second resistor is too high, it may be caused by improper resistor setting or improper equalization variable setting in the equalization program. By comparing the actual power of the second resistor with its rated power, it is possible to accurately determine whether the problem is caused by improper resistor setting or improper equalization voltage variable setting.

[0153] In one possible implementation, optimizing the balancing variables when the distributed BMS slave control board starts the balancing program in step S25 above may include:

[0154] S31: Based on multiple preset balancing variables, control the distributed BMS slave board to start the corresponding balancing program.

[0155] S32: For each equilibrium variable, obtain the temperature information during the equilibrium process after the equilibrium program corresponding to the equilibrium variable is started.

[0156] S33: Determine the degree of temperature dispersion corresponding to the equilibrium variable based on the temperature information.

[0157] S34: Determine the equilibrium variable when the distributed BMS starts the equilibrium program from the control board, based on the equilibrium variable with the smallest temperature dispersion.

[0158] In this embodiment, the preset balancing variables may include parameters that are easy to measure and identify, such as open-circuit voltage, operating voltage, SOC, remaining available capacity, and maximum available energy.

[0159] In this embodiment, the temperature information may include one or more of the following: resistor temperature, battery pack temperature, chip temperature, and component temperature.

[0160] In this embodiment, the temperature dispersion can be the temperature deviation of each resistor / chip / battery pack / component, which can be represented by the average difference, variance, standard deviation, etc. of the temperature of each resistor / chip / battery pack / component.

[0161] In this embodiment, the distributed BMS slave control board can perform equalization tests based on different equalization variables and determine the temperature dispersion corresponding to each equalization variable. Based on the equalization variable with the smallest temperature dispersion, the equalization variable when the distributed BMS slave control board starts the equalization program can be determined, thereby achieving high accuracy in characterizing battery consistency and further improving the safety and reliability of the distributed BMS slave control board.

[0162] In one possible implementation, the temperature information may include the battery pack temperature of the battery module. Step S202, which involves equalization control and performance testing of the distributed BMS slave control board based on the temperature information, may further include:

[0163] S41: Determine whether there is a third battery pack temperature that is greater than or equal to the third temperature threshold, which is the critical temperature at which the battery pack is damaged due to overheating.

[0164] S42: If it exists, determine the third battery pack corresponding to the temperature of the third battery pack, and control the equalization circuit where the third battery pack is located to be cut off.

[0165] Accordingly, optimizing the battery module based on the test results in step S203 above may include:

[0166] The third battery pack is optimized based on the other battery packs in the battery module, excluding the third battery pack itself.

[0167] In this embodiment, the specific third temperature threshold can be flexibly set by those skilled in the art according to the battery pack model, etc. For example, the third temperature threshold of lithium iron phosphate battery can be set to 50°C, etc. There are no restrictions here, as long as the battery pack can work normally when the temperature is lower than the third temperature threshold.

[0168] In this embodiment, it can also be determined whether there is a fourth battery pack temperature that is greater than or equal to the fourth temperature threshold. If so, the fourth battery pack corresponding to the fourth battery pack temperature is determined, and the equalization current corresponding to the fourth battery pack is reduced. It can also be determined whether there is a third battery pack in the fourth battery pack whose battery pack temperature is greater than or equal to the third temperature threshold. If there is a third battery pack, the equalization circuit where the third battery pack is located is controlled to be cut off.

[0169] The specific fourth temperature threshold can be flexibly set by those skilled in the art according to actual conditions. For example, the fourth temperature threshold can be 40°C or 45°C, as long as the fourth temperature threshold is less than the third temperature threshold.

[0170] In this embodiment, the computing device can monitor the battery pack temperature in real time. Since the battery pack's temperature tolerance differs from that of the resistor and chip (slave control board), the equalization circuit of any battery pack whose temperature is greater than or equal to the third temperature threshold is cut off. Afterwards, a suitable battery pack can be selected based on the parameters of other battery packs (with normal battery pack temperatures) to replace and optimize the third battery pack.

[0171] In one possible implementation, the temperature information may include the component temperatures of each part of the distributed BMS slave control board. Step S202, which involves balanced control and performance testing of the distributed BMS slave control board based on the temperature information, may further include:

[0172] S51: Determine the average component temperature based on the component temperature of each component.

[0173] S52: Determine whether there is a target component temperature whose temperature difference from the average component temperature is outside the allowable error range.

[0174] S53: If it exists, determine the target component corresponding to the target component temperature, and control the equalization circuit where the target component is located to be cut off.

[0175] Accordingly, the optimization of the distributed BMS slave control board based on the test results in step S203 above may include:

[0176] The target component is optimized based on other components in the distributed BMS control board.

[0177] In this embodiment, the components of the distributed BMS slave control board may include electronic devices, PCB substrate, thermally conductive silicone, housing, and other components.

[0178] In this embodiment, the allowable error range can be flexibly set by those skilled in the art according to actual conditions. It can be a positive and negative value range. As long as the difference between the component temperature of each component on the control board and the average component temperature is within the allowable error range, the temperature of each component on the control board can be evenly distributed.

[0179] In this embodiment, when the difference between the temperature of the target component and the average component is outside the allowable error range, it indicates that there is a large deviation in the temperature of the target component, resulting in uneven temperature distribution on the slave control board. It is necessary to optimize the target component based on the parameters of other components (components with normal temperature) to improve the performance of the slave control board.

[0180] In this embodiment, the computing device can monitor the component temperature in real time. Based on the temperature uniformity of each component, it can provide feedback on the balanced heat dissipation performance of the control board, identify components with abnormal temperatures on the control board, and optimize and improve the abnormal parts. This improves the temperature uniformity of each component on the control board and further enhances the security and reliability of the distributed BMS control board.

[0181] The application process of the distributed BMS slave control board load balancing test system of this application is described below with a specific embodiment.

[0182] In one specific embodiment, the equalization test system for the distributed BMS slave control board may include a battery module, a computing device, and a high and low temperature environment chamber. The battery module includes a battery fixture and a DC regulated power supply. The battery fixture is used to simulate a battery pack, and the DC regulated power supply and the battery fixture work together to simulate the battery charging process. The high and low temperature environment chamber is used to simulate the ambient temperature when the distributed BMS slave control board and the battery fixture are actually working.

[0183] The distributed BMS slave control board includes multiple resistors, one or more chips, and multiple components. The resistors are connected to the battery packs in the battery module.

[0184] Each resistor is also connected to a corresponding first temperature acquisition unit, which is used to acquire the resistance temperature of the corresponding resistor and send the resistance temperature to the computing device.

[0185] Each battery pack is connected to a corresponding second temperature acquisition unit, which is used to acquire the battery pack temperature of the corresponding battery pack and send the battery pack temperature to the computing device.

[0186] Each chip is connected to a corresponding third temperature acquisition unit, which is used to acquire the chip temperature of the corresponding chip and send the chip temperature to the computing device.

[0187] Each component is connected to a corresponding fourth temperature acquisition unit, which is used to acquire the component temperature of the corresponding component and send the component temperature to the computing device.

[0188] Figure 3 This is a schematic diagram of the load balancing test process of a distributed BMS slave control board according to an embodiment of this application, as shown below. Figure 3 As shown, the specific load balancing test process for the distributed BMS slave control board is as follows:

[0189] The first step is that the computing device detects that there is no fault related to disabling equalization on the distributed BMS slave control board, and the lowest battery cell voltage is greater than the allowed equalization voltage threshold (e.g., 3.1V), and controls the distributed BMS slave control board to start the equalization program.

[0190] The second step involves the computing device acquiring the resistance temperature collected by the first temperature acquisition device, the battery pack temperature collected by the second temperature acquisition device, the chip temperature collected by the third temperature acquisition device, and the component temperatures of each component on the distributed BMS slave control board collected by the fourth temperature acquisition device.

[0191] The third step is to calculate whether there is a first resistance temperature greater than or equal to 60°C in the resistance temperature range. If so, the first resistance corresponding to the first resistance temperature is determined, and the equalization current corresponding to the first resistance is reduced to 50%. The calculation device then determines whether there is a second resistance with a resistance temperature greater than or equal to 120°C in the first resistance range. If the second resistance exists, the equalization circuit containing the second resistance is cut off.

[0192] The fourth step involves the computing device determining whether there is a first chip with a temperature greater than or equal to 60°C. If so, the device identifies the first chip corresponding to the first chip temperature and reduces the equalization current corresponding to the first chip to 50%. The device then determines whether there is a second chip with a temperature greater than or equal to 120°C among the first chips. If a second chip exists, the device controls the equalization circuit containing the second chip to be cut off.

[0193] The fifth step involves the computing device determining the first battery pack connected to each first resistor and the corresponding temperature of each first battery pack; determining the second battery pack connected to each second resistor and the corresponding temperature of each second battery pack; performing cluster analysis on the first and second battery pack temperatures to determine the corresponding battery pack temperature categories; determining whether each battery pack has any anomalies based on the battery pack temperature categories, and if so, the anomaly category; and optimizing the battery modules based on whether each battery pack has any anomalies and the anomaly category.

[0194] Step 6: The calculation device determines the actual balancing current value based on the actual resistance value and actual voltage value of the second resistor; determines the actual power of the second resistor based on the actual balancing current value and actual resistance value; determines whether the actual power of the second resistor is greater than or equal to the rated power of the second resistor; if it is greater than or equal to the rated power of the second resistor, then determines the optimized resistance value based on the current value corresponding to the uninterrupted balancing circuit, and optimizes the distributed BMS slave control board according to the resistor model corresponding to the optimized resistance value.

[0195] Step 7: If the power is less than the rated power of the second resistor, the computing device controls the distributed BMS slave control board to start the corresponding equalization program according to multiple preset equalization variables; for each equalization variable, the temperature information during the equalization process is obtained after the equalization program corresponding to the equalization variable is started; the temperature dispersion corresponding to the equalization variable is determined according to the temperature information; the equalization variable with the smallest temperature dispersion is determined when the distributed BMS slave control board starts the equalization program, and the problematic parameters in the equalization program are identified and optimized.

[0196] Step 8: The calculation device determines whether there is a fourth battery pack with a temperature greater than or equal to 45°C. If so, it identifies the fourth battery pack corresponding to the fourth battery pack temperature and reduces the equalization current corresponding to the fourth battery pack to 50%. It also determines whether there is a third battery pack with a temperature greater than or equal to 50°C in the fourth battery pack. If there is a third battery pack, it controls the equalization circuit containing the third battery pack to be cut off.

[0197] The ninth step involves the computing device optimizing the third battery pack based on the other battery packs in the battery module, excluding the third battery pack itself.

[0198] Step 10: The calculation device determines the average component temperature based on the component temperature of each component; it then determines whether there is a target component temperature whose difference from the average component temperature is outside the allowable error range; if so, it identifies the target component corresponding to the target component temperature and controls the equalization circuit of the target component to be cut off.

[0199] In the eleventh step, the computing device optimizes the target component based on other components in the distributed BMS control board.

[0200] Step 12: Simulate different ambient temperatures for the distributed BMS slave control board to operate in real time using a high and low temperature environment chamber. Repeat steps 1-11 above to obtain balanced control and performance test results under different ambient temperatures, and optimize the distributed BMS slave control board and / or battery module.

[0201] Figure 4 This is a schematic diagram of the structure of a computing device according to an embodiment of this application, as shown below. Figure 4As shown, the computing device includes: an acquisition module 41, used to control the distributed BMS slave control board to start the equalization program and acquire temperature information during the equalization process; a processing module 42, used to perform equalization control and performance testing on the distributed BMS slave control board based on the temperature information; and to optimize the distributed BMS slave control board and / or battery module based on the test results.

[0202] The computing device provided in this application embodiment can execute the technical solution shown in the above method embodiment. Its implementation principle and beneficial effects are similar, and will not be repeated here.

[0203] Figure 5 This is a schematic diagram of the structure of a computing device according to another embodiment of this application, such as... Figure 5 As shown, the computing device includes: a processor 501 and a memory 502 communicatively connected to the processor 501; the memory 502 stores computer execution instructions; the processor 501 executes the computer execution instructions stored in the memory 502 to implement the steps of the distributed BMS slave control board load balancing test method in the above method embodiments.

[0204] In the aforementioned computing device, the memory 502 and the processor 501 are electrically connected directly or indirectly to enable data transmission or interaction. For example, these components can be electrically connected to each other via one or more communication buses or signal lines, such as a bus connection. The memory 502 stores computer execution instructions that implement data access control methods, including at least one software functional module that can be stored in the memory 502 in the form of software or firmware. The processor 501 executes various functional applications and data processing by running the software programs and modules stored in the memory 502.

[0205] The memory 502 may be, but is not limited to, Random Access Memory (RAM), Read Only Memory (ROM), Programmable Read-Only Memory (PROM), Erasable Programmable Read-Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM), etc. The memory 502 stores programs, which are then executed by the processor 501 upon receiving execution instructions. Furthermore, the software programs and modules within the memory 502 may include an operating system, which may include various software components and / or drivers for managing system tasks (e.g., memory management, storage device control, power management, etc.) and can communicate with various hardware or software components to provide an operating environment for other software components.

[0206] Processor 501 can be an integrated circuit chip with signal processing capabilities. The aforementioned processor 501 can be a general-purpose processor, including a Central Processing Unit (CPU), a Network Processor (NP), etc. It can implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of this application. The general-purpose processor can be a microprocessor or any conventional processor.

[0207] An embodiment of this application also provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the steps of the various method embodiments of this application.

[0208] An embodiment of this application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the various method embodiments of this application.

[0209] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to this application.

[0210] It should be further noted that although the steps in the flowchart are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowchart may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.

[0211] It should be understood that the above-described device embodiments are merely illustrative, and the device of this application can also be implemented in other ways. For example, the division of units / modules in the above embodiments is only a logical functional division, and there may be other division methods in actual implementation. For example, multiple units, modules, or components may be combined, or integrated into another system, or some features may be ignored or not executed.

[0212] Furthermore, unless otherwise specified, the functional units / modules in the various embodiments of this application can be integrated into one unit / module, or each unit / module can exist physically separately, or two or more units / modules can be integrated together. The integrated units / modules described above can be implemented in hardware or as software program modules.

[0213] In the above embodiments, the descriptions of each embodiment have their own emphasis. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments. The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered within the scope of this specification.

[0214] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the appended claims.

[0215] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A load balancing test method for distributed BMS slave control boards, characterized in that, The distributed BMS slave control board is connected to the battery module, and the method includes: The distributed BMS is controlled to start the equalization program from the control board and to obtain temperature information during the equalization process. Based on the temperature information, perform balanced control and performance testing on the distributed BMS slave control board; The distributed BMS slave control board and / or the battery module are optimized based on the test results.

2. The load balancing test method for distributed BMS slave control boards according to claim 1, characterized in that, The temperature information includes the resistor temperature and / or chip temperature of the distributed BMS slave control board. The step of performing balanced control and performance testing on the distributed BMS slave control board based on the temperature information includes one or more of the following: Determine whether there is a first resistance temperature greater than or equal to a first temperature threshold among the resistance temperatures; if so, determine the first resistance corresponding to the first resistance temperature and reduce the equalization current corresponding to the first resistance; determine whether there is a second resistance among the first resistances with a resistance temperature greater than or equal to a second temperature threshold; if so, control the equalization circuit where the second resistance is located to be cut off. Determine whether there exists a first chip temperature that is greater than or equal to a first temperature threshold among the chip temperatures; If it exists, determine the first chip corresponding to the first chip temperature and reduce the equalization current corresponding to the first chip; determine whether there is a second chip in the first chip whose chip temperature is greater than or equal to the second temperature threshold; if there is a second chip, control the equalization circuit where the second chip is located to be cut off. Wherein, the second temperature threshold is the critical temperature at which the distributed BMS slave control board overheats and is damaged, and the first temperature threshold is less than the second temperature threshold.

3. The load balancing test method for distributed BMS slave control boards according to claim 2, characterized in that, The battery module was optimized based on the test results, including: Determine the first battery pack connected to each first resistor, and the temperature of the first battery pack corresponding to each first battery pack; Determine the second battery pack connected to each second resistor, and the temperature of each second battery pack. Cluster analysis is performed on the temperatures of the first battery pack and the second battery pack to determine the corresponding battery pack temperature categories; Determine whether each battery pack has any abnormalities based on the battery pack temperature category, and if so, the category of the abnormality. The battery modules are optimized based on whether there are any abnormalities in each battery pack and the type of abnormality when they are present.

4. The load balancing test method for distributed BMS slave control boards according to claim 2, characterized in that, Based on the test results, the distributed BMS slave control board was optimized, including: The actual balancing current value is determined based on the actual resistance value and actual voltage value of the second resistor; The actual power of the second resistor is determined based on the actual equalization current value and the actual resistance value. Determine whether the actual power of the second resistor is greater than or equal to the rated power of the second resistor; If the rated power is greater than or equal to that of the second resistor, the optimized resistor value is determined based on the current value corresponding to the uninterrupted equalization circuit, and the distributed BMS slave control board is optimized based on the resistor model corresponding to the optimized resistor value. If the power is less than the rated power of the second resistor, then the equalization variables when the distributed BMS slave control board starts the equalization program are optimized.

5. The load balancing test method for distributed BMS slave control boards according to claim 4, characterized in that, The optimization of the balancing variables when the distributed BMS slave control board starts the balancing program includes: Based on multiple preset balancing variables, the distributed BMS control board is controlled to start the corresponding balancing program. For each equilibrium variable, obtain the temperature information during the equilibrium process after the equilibrium program corresponding to the equilibrium variable is started; determine the temperature dispersion of the equilibrium variable based on the temperature information. The equilibrium variable is determined based on the equilibrium variable with the smallest temperature dispersion when the distributed BMS starts the equilibrium program from the control board.

6. The load balancing test method for distributed BMS slave control boards according to any one of claims 1-5, characterized in that, The temperature information includes the battery pack temperature of the battery module. The step of performing equalization control and performance testing on the distributed BMS slave control board based on the temperature information includes: Determine whether there is a third battery pack temperature that is greater than or equal to a third temperature threshold, where the third temperature threshold is the critical temperature at which the battery pack is overheated and damaged. If it exists, determine the third battery pack corresponding to the temperature of the third battery pack, and control the equalization circuit where the third battery pack is located to be cut off. Accordingly, the battery module is optimized based on the test results, including: The third battery pack is optimized based on the other battery packs in the battery module besides the third battery pack.

7. The load balancing test method for distributed BMS slave control boards according to any one of claims 1-5, characterized in that, The temperature information includes the component temperatures of each part of the distributed BMS slave control board. The step of performing balanced control and performance testing on the distributed BMS slave control board based on the temperature information includes: The average component temperature is determined based on the component temperatures of each component. Determine whether there is a target component temperature whose difference from the average component temperature is outside the allowable error range; If it exists, then determine the target component corresponding to the temperature of the target component, and control the equalization circuit where the target component is located to be cut off; Accordingly, the distributed BMS slave control board is optimized based on the test results, including: The target component is optimized based on other components in the distributed BMS slave control board.

8. A computing device, characterized in that, include: A processor, and a memory communicatively connected to the processor; The memory is used to store computer-executed instructions; The processor is used to execute computer execution instructions stored in the memory, causing the processor to perform the load balancing test method for the distributed BMS slave control board as described in any one of claims 1-7.

9. A load balancing test system for a distributed BMS slave control board, characterized in that, include: The battery module and the computing device as described in claim 8; The distributed BMS slave control board includes multiple resistors, one or more chips, and multiple components, wherein the resistors are connected to the battery pack in the battery module. The resistor is also connected to a first temperature acquisition device, which is used to acquire the resistance temperature of the resistor and send the resistance temperature to the computing device. The battery pack is connected to a second temperature acquisition device, which is used to acquire the battery pack temperature and send the battery pack temperature to the computing device. The chip is connected to a third temperature acquisition device, which is used to acquire the chip temperature and send the chip temperature to the computing device. The component is connected to a fourth temperature acquisition element, which is used to acquire the component temperature of the component and send the component temperature to the computing device.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement the balanced testing method for the distributed BMS slave control board as described in any one of claims 1-7.

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