Multi-station single wafer cleaning equipment and single wafer cleaning method

Abstract

The invention discloses multi-station wafer single-piece cleaning equipment and a wafer single-piece cleaning method. The wafer single-piece cleaning equipment comprises a machine body, and the machine body is provided with a cleaning unit, a feeding unit and a transferring unit; the cleaning unit comprises a plurality of cleaning parts, and each cleaning part can independently execute wafer cleaning work; the feeding unit comprises a plurality of wafer taking and placing positions, and each wafer taking and placing position can be used for independently placing wafers; the transfer unit further comprises a transfer cavity, a transfer mechanism is arranged in the transfer cavity, the wafer taking and placing assembly comprises a first bearing piece and a second bearing piece, and the transfer assembly can carry the wafer taking and placing assembly to move relative to the rack so as to transfer the wafer between the wafer taking and placing position and the cleaning parts and between the different cleaning parts. Through the flexible movement design of the transfer assembly, the alignment integrating degree when the wafer is placed in the target cleaning position can be improved, the situation that due to alignment deviation, the coverage of a cleaning area is incomplete or a cleaning mechanism interferes with the wafer is reduced, and smooth proceeding of the cleaning process is guaranteed.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of wafer cleaning, and particularly relates to a multi-station wafer single-wafer cleaning device and a wafer single-wafer cleaning method. BACKGROUND

[0002] In a semiconductor manufacturing process, wafer cleaning is a core link for guaranteeing device yield and performance. Contaminants such as particles, organic residues and metal ions on the wafer surface can directly cause pattern distortion in a subsequent photolithography process, etching precision to decrease, and even cause electrical performance failure of the device. Current wafer cleaning devices are mainly divided into two categories: tank cleaning and single-wafer cleaning. Tank cleaning devices achieve cleaning through batch soaking, although the cost is relatively low, but there are problems such as cross contamination, uneven cleaning, etc., and it is difficult to adapt to the demand for cleanliness of advanced processes; single-wafer cleaning devices take independent processing of a single wafer as the core, and can accurately control cleaning parameters for different types of pollution, which is significantly superior to tank devices in yield and process flexibility, and has become a mainstream technology.

[0003] However, the single-wafer cleaning device needs to complete high-frequency transfer of the wafer between the loading position, the multiple cleaning stations and the buffer position, and there are still multiple technical bottlenecks in the actual application of the existing technology:

[0004] Firstly, the wafer is easily contaminated or damaged during the transfer process. The wafer pick-and-place assembly of the existing device is mostly of a unified structure, and the photoresist debris and trace dust attached to the surface of the wafer to be cleaned are easily detached due to the strong adsorption of the material of the pick-and-place assembly, thereby contaminating the subsequent cleaning stations.

[0005] Secondly, the transfer efficiency and precision between the material taking position and the cleaning position of the existing cleaning device are low. In order to save production line space, the material taking position and the cleaning position of the single-wafer cleaning device are often densely arranged in the horizontal or vertical direction, and the existing transfer mechanism mostly adopts a single drive module or a fixed track design. When facing a multi-directional and multi-height station layout, the motion direction needs to be adjusted multiple times, the connection process takes a long time, and the overall transfer efficiency is difficult to improve. At the same time, due to factors such as transmission gap and assembly error, the positioning precision of the wafer during transfer between the material taking position and the cleaning position often cannot meet the cleaning requirements, and the wafer may be offset after being placed in the cleaning position, thereby causing cleaning blind spots or collision damage between the cleaning mechanism and the wafer.

[0006] In addition, the function division of the cleaning part of the existing device is fuzzy, and some devices integrate pre-cleaning and rinsing in the same station, which causes cross contamination of cleaning liquid. The parameter control of key cleaning media such as ultrapure water is not accurate, which further affects the cleaning effect. Therefore, developing a multi-station wafer single-wafer cleaning device that can adapt to the differences in wafer characteristics, take into account the transfer efficiency and precision, and be coordinated with the cleaning process depth, has become the key to solving the current technical problems. SUMMARY

[0007] This application provides a multi-station wafer cleaning equipment and a wafer cleaning method to solve the technical problems in traditional wafer cleaning equipment, such as the susceptibility to secondary contamination or damage during wafer transfer, low wafer transfer efficiency, and insufficient coordination between the cleaning process and the transfer logic.

[0008] The technical solution adopted in this application is as follows:

[0009] A multi-station wafer cleaning device includes a body, which is provided with a cleaning unit, a loading unit, and a transfer unit. The cleaning unit includes multiple cleaning sections, each of which has a wafer cleaning position, and each cleaning section can independently perform wafer cleaning work. The loading unit includes multiple wafer pick-and-place positions, each of which can individually place a wafer. The transfer unit further includes a transfer cavity, which is provided with a transfer mechanism. The transfer mechanism includes a frame and a transfer assembly and a wafer pick-and-place assembly mounted on the frame. The wafer pick-and-place assembly includes several first support members for supporting wafers at the wafer pick-and-place positions and second support members for supporting wafers in the cleaning sections. The transfer assembly can carry the wafer pick-and-place assembly to move relative to the frame to realize the transfer of wafers between the wafer pick-and-place positions and the cleaning sections, as well as between different cleaning sections.

[0010] The cleaning equipment described in this application also includes the following additional technical features:

[0011] The wafer pick-and-place assembly includes at least two first supports and at least two second supports. The plurality of first supports can respectively support wafers in different wafer pick-and-place positions, and the plurality of second supports can respectively support wafers in different cleaning sections.

[0012] Multiple wafer pick-and-place positions are arranged sequentially along the width direction of the machine body. The transfer assembly includes a first driving member, a transfer base, and a first transfer slide rail. The wafer pick-and-place assembly is mounted on the transfer base. The first transfer slide rail extends along the width direction of the machine body. The first driving member drives the transfer base to slide along the first transfer slide rail to move the wafer pick-and-place assembly.

[0013] The transfer seat includes a sliding seat and a rotating seat. The sliding seat is slidably connected to the first transfer slide rail. The rotating seat is mounted on the top of the sliding seat via a second driving member. The wafer pick-and-place assembly is mounted on the top of the rotating seat. The second driving member drives the rotating seat to rotate relative to the sliding seat, thereby causing the wafer pick-and-place assembly to switch between the direction toward the wafer pick-and-place position and the direction toward the cleaning section.

[0014] The rotating seat top is provided with a first sliding rail corresponding to the number of the first supporting members and a second sliding rail corresponding to the number of the second supporting members, the rotating seat is provided with a third driving member, the third driving member drives the first supporting members to slide along the first sliding rail to approach or move away from the wafer taking and placing position, and the third driving member drives the second supporting members to slide along the second sliding rail to approach or move away from the cleaning part.

[0015] The cleaning unit comprises a first cleaning layer and a second cleaning layer arranged in a top-down manner, the first cleaning layer and the second cleaning layer each comprise a plurality of cleaning parts extending along the width direction of the machine body; the machine frame is provided with second transfer sliding rails extending in the vertical direction at intervals on both sides, the two ends of the first transfer sliding rail are respectively connected to the second transfer sliding rails in a sliding manner through sliding blocks, and the transfer assembly further comprises a fourth driving member, the fourth driving member drives the first transfer sliding rail to slide along the second transfer sliding rail.

[0016] The second cleaning layer is located above the first cleaning layer, the machine frame is provided with limiting blocks located at the top ends of the two second transfer sliding rails, and when the sliding blocks abut against the limiting blocks, the second supporting members are aligned with the second cleaning layer.

[0017] The cleaning part comprises a pre-cleaning part, a wet cleaning part, an ultrapure water rinsing part and a drying part arranged in sequence according to the wafer cleaning process.

[0018] The application also provides a wafer single-piece cleaning method applied to the cleaning equipment, the cleaning method comprising the following steps: S1: taking the wafer to be cleaned from the wafer taking and placing position of the feeding unit by the first supporting members of the transfer unit, and moving the wafer to be cleaned to the pre-cleaning part by the first supporting members of the transfer assembly; S2: pre-cleaning treatment: the pre-cleaning part sprays low-pressure ultrapure water or blows nitrogen on the wafer to remove loose particles on the surface of the wafer; S3: moving the wafer treated in step S2 to the wet cleaning part by the second supporting members of the transfer unit, spraying the wafer with SC-1 cleaning solution for 30-60 seconds in the wet cleaning part to remove organic residues and metal ions; S4: moving the wafer treated in step S3 to the ultrapure water rinsing part by the second supporting members, and washing the wafer by overflow of ultrapure water for 20-40 seconds to remove residual chemical liquid; S5: drying treatment: moving the wafer treated in step S4 to the drying part by the second supporting members, and drying the wafer by isopropyl alcohol vapor or nitrogen blowing to remove surface residual moisture.

[0019] The cleaning method described in the application further comprises the following additional technical features:

[0020] The SC-1 cleaning solution in S3 is a mixed solution composed of ammonia water, hydrogen peroxide and ultrapure water; and the resistivity of the ultrapure water in S4 is ≥18.2MΩ·cm.

[0021] By adopting the technical solutions, the application has the following beneficial effects:

[0022] 1. The multi-station wafer single-piece cleaning equipment of the application provides multi-dimensional support for the cleanliness, smoothness of transfer, and process stability of wafer cleaning in the actual production scene of semiconductor single-piece cleaning through the overall architecture of the machine body integrating the cleaning unit, the feeding unit, and the transfer unit, the first supporting member and the second supporting member in the transfer mechanism with differentiated division of labor, multiple cleaning parts that can operate independently, and the transfer assembly that can drive the wafer pick-and-place assembly to move flexibly. Through the functional division of the first supporting member and the second supporting member in the wafer pick-and-place assembly, the adaptability of supporting wafers in different states is realized. For example, the wafer pick-and-place position of the feeding unit is used for temporarily storing the wafers to be cleaned transferred from the FOUP box. At this time, the first supporting member is specially used for pick-and-place and transfer operations of the wafers to be cleaned. The first supporting member is designed for the state that the wafers to be cleaned may have photoresist debris and trace dust attached to the surface, which can reduce the situation that these attachments fall off due to insufficient adaptability of the supporting structure during pick-and-place, thereby reducing the risk of interference of the attachments with the subsequent cleaning process when entering the cleaning area with the supporting member. When the wafer enters the cleaning part to complete part of the cleaning process and needs to be transferred between different cleaning parts, the second supporting member is specially responsible for the operation, which is optimized for the state that the wafer may have liquid residue or a wet surface during the cleaning process. It can reduce the friction damage of the cleaning state wafer when in contact with the supporting member, and reduce the possibility of reaction between the material of the supporting member and the residual liquid on the wafer surface, providing protection for the cleanliness and physical integrity of the wafer during the whole transfer period.

[0023] In terms of stability and quality control of the cleaning process, the cleaning unit is provided with multiple cleaning parts each equipped with a dedicated wafer cleaning position, and each cleaning part can independently perform cleaning work. In the actual cleaning scene, these independent cleaning parts can be clearly functionally divided according to the process requirements of wafer cleaning. Each cleaning part only focuses on a single type of cleaning operation, for example, some cleaning parts focus on removing loose particles on the wafer surface, and some cleaning parts focus on decomposing organic residues or metal ions. In the independent operation process, each cleaning part can reduce the cross-interference of cleaning media caused by shared stations between different cleaning processes, ensure that each cleaning process can be carried out in an adaptive environment, and provide support for the consistency of wafer cleaning quality, which meets the stringent requirements of advanced semiconductor processes for wafer surface cleanliness.

[0024] In terms of transportation efficiency and smoothness of station connection, the transportation cavity of the transportation unit provides a relatively closed movement space for the transportation mechanism, and the transportation assembly can carry the wafer taking and placing assembly to move flexibly relative to the rack to achieve smooth transportation of the wafer between the wafer taking and placing station and the cleaning part, and between different cleaning parts. In the actual production process, when it is necessary to transport the wafer to be cleaned from the wafer taking and placing station to the target cleaning part, the transportation assembly can directly drive the first supporting part to adjust the position, and the connection of taking and feeding can be completed without multiple switching of the driving module, which helps to shorten the waiting time of the transportation link; when the wafer completes a cleaning process and needs to be transferred to the next cleaning part, the transportation assembly can drive the second supporting part to quickly adjust the movement track, cooperate with the independent layout of each cleaning part, and improve the transportation continuity between different cleaning processes; at the same time, the flexible movement design of the transportation assembly can improve the alignment fit degree when the wafer is placed into the target cleaning station, reduce the incomplete coverage of the cleaning area caused by alignment deviation, or the interference between the cleaning mechanism and the wafer, and further ensure the smooth progress of the cleaning process.

[0025] In addition, the feeding unit is provided with a plurality of wafer taking and placing stations capable of separately placing wafers, which can simultaneously accommodate a plurality of wafers to be cleaned in actual operation, and cooperate with the differential supporting parts of the transportation mechanism and the movement of the transportation assembly to realize orderly feeding and transportation of multiple wafers, reduce the waiting time caused by insufficient feeding stations, and provide support for the continuous and stable operation of the equipment; the design of the transportation cavity can also reduce the entry of particles and impurities in the external environment into the transportation link and contact with the wafer, and further provide auxiliary protection for the cleanliness of the wafer transportation process.

[0026] 2. The wafer single-piece cleaning method of the present application realizes deep cooperation between the cleaning process and the equipment structure by combining the differential transportation of the first supporting part and the second supporting part, the step design of the cleaning method, and the close adaptation of the step design to the structural characteristics of the equipment. In step S1, the first supporting part specially takes the wafer to be cleaned from the wafer taking and placing station and transfers it to the pre-cleaning part, which is consistent with the supporting design of the first supporting part for the wafer to be cleaned, reduces the interference of the surface particle shedding of the wafer to be cleaned with the pre-cleaning part; after the pre-cleaning process in step S2 is completed, the transportation operation in steps S3 to S5 is performed by the second supporting part, which is optimized for the characteristics of the cleaned wafer, and can reduce the surface damage of the wafer during transportation between the wet cleaning, ultrapure water rinsing, drying and other processes, or the secondary influence caused by the contact between the supporting part and the chemical solution.

[0027] Meanwhile, the method strictly follows the process sequence of pre-cleaning, wet cleaning, ultrapure water rinsing, and drying, and the wafers are transferred by the second supporting member and sequentially pass through each dedicated cleaning part, and each process is completed in a suitable cleaning environment, reducing the decline in cleaning effect caused by process reversal. This process synergy also synchronously improves the continuity of the cleaning process: when one wafer completes pre-cleaning and enters the wet cleaning part, another wafer to be cleaned can be driven by the first supporting member to enter the pre-cleaning part, realizing the sequential and streamlined processing of multiple wafers, and greatly improving the overall cleaning efficiency of the equipment.

[0028] In addition, the division of labor between the first supporting member for the wafer to be cleaned and the second supporting member for the wafer being cleaned in the present cleaning method can avoid cross contamination caused by switching between the wafers to be cleaned and the wafers being cleaned in the same supporting member, for example, the first supporting member does not contact the cleaning solution of the wafer being cleaned, and the second supporting member does not contact the particles of the wafer to be cleaned, further providing support for the stability of the cleaning quality of each process, and meeting the high requirements of the semiconductor production line for wafer cleanliness. BRIEF DESCRIPTION OF DRAWINGS

[0029] The accompanying drawings, which are included to provide a further understanding of the present application, constitute a part of this application and illustrate exemplary embodiments of the present application and its description, which serve to explain the present application, and do not constitute an improper limitation on the present application. In the drawings:

[0030] Figure 1 FIG. 1 is a structural schematic diagram of a multi-station wafer single-wafer cleaning equipment according to an embodiment of the present application;

[0031] Figure 2 FIG. 2 is a schematic diagram of a cleaning unit according to an embodiment of the present application;

[0032] Figure 3 FIG. 3 is a structural schematic diagram of a transfer mechanism according to an embodiment of the present application;

[0033] Figure 4 FIG. 4 is a structural schematic diagram of a part of the transfer mechanism according to an embodiment of the present application; Figure 1

[0034] Figure 5 FIG. 5 is a structural schematic diagram of a part of the transfer mechanism according to an embodiment of the present application; Figure 2

[0035] LIST OF COMPONENTS AND REFERENCE NUMBERS:

[0036] 1 body;

[0037] 2 cleaning part, 21 pre-cleaning part, 22 wet cleaning part, 23 ultrapure water rinsing part, 24 drying part;

[0038] 3 wafer pick-and-place station; ​​

[0039] 4 transfer cavity;

[0040] 5 transfer mechanism, 51 rack, 511 limit block, 52 first transfer slide rail, 53 second transfer slide rail, 54 third driving member;

[0041] 6 first supporting member;

[0042] 7 second supporting member;

[0043] 8 transfer seat, 81 sliding seat, 82 rotating seat;

[0044] 9 first cleaning layer;

[0045] 10 second cleaning layer. DETAILED DESCRIPTION

[0046] In order to more clearly illustrate the overall concept of the present application, the following will be described in detail with reference to the accompanying drawings.

[0047] In the following description, a lot of specific details are set forth in order to facilitate a thorough understanding of the present application, however, the present application can also be implemented in other ways different from those described herein, therefore, the protection scope of the present application is not limited by the specific embodiments disclosed below. It should be noted that the embodiments of the present application and the features in each embodiment can be combined with each other without conflict.

[0048] In addition, in the description of the present application, it should be understood that the terms "top", "bottom", "inner", "outer", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation to the present application.

[0049] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected, or it can be communicated; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above-mentioned terms in the present application can be understood according to the specific circumstances.

[0050] In this application, unless otherwise explicitly specified and limited, a first feature is "on" or "under" a second feature can mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the description of the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples.

[0051] As shown in Figures 1 to 5 A multi-station wafer single piece cleaning equipment includes a machine body 1, the machine body 1 is provided with a cleaning unit, a feeding unit and a transfer unit; the cleaning unit includes a plurality of cleaning parts 2, each cleaning part 2 is provided with a wafer cleaning position, and each cleaning part 2 can independently perform wafer cleaning work; the feeding unit includes a plurality of wafer taking and placing positions 3, and each wafer taking and placing position 3 can independently place a wafer; the transfer unit further includes a transfer cavity 4, the transfer cavity 4 is provided with a transfer mechanism 5, the transfer mechanism 5 includes a rack 51 and a transfer assembly and a wafer taking and placing assembly installed on the rack 51, the wafer taking and placing assembly includes a plurality of first supporting members 6 respectively used for supporting wafers on the wafer taking and placing positions 3 and a second supporting member 7 used for supporting wafers in the cleaning parts 2, and the transfer assembly can carry the wafer taking and placing assembly to move relative to the rack 51 to realize the transfer of wafers between the wafer taking and placing positions 3 and the cleaning parts 2 and between different cleaning parts 2.

[0052] The multi-station wafer single-piece cleaning equipment of the present application, through the overall architecture of the body 1 integrating the cleaning unit, the feeding unit and the transfer unit, in combination with the first supporting piece 6 and the second supporting piece 7 in the transfer mechanism 5, the multiple cleaning parts 2 that can independently operate, and the transfer assembly that can drive the wafer pick-and-place assembly to move flexibly, provides multi-dimensional support for the cleanliness of wafer cleaning, the smoothness of transfer and the stability of process in the actual production scene of semiconductor single-piece cleaning. Through the functional division of the first supporting piece 6 and the second supporting piece 7 in the wafer pick-and-place assembly, the adaptive support of wafers in different states is realized. For example, the wafer pick-and-place position 3 of the feeding unit is used for temporarily storing the wafers to be cleaned transferred from the FOUP box, at this time the first supporting piece 6 specially performs the pick-and-place and transfer operation of the wafers to be cleaned, and the first supporting piece 6 is designed for the state that the wafers to be cleaned may have photoresist debris and trace dust attached to the surface, which can reduce the situation that these attachments fall off due to insufficient adaptability of the supporting structure during pick-and-place, thereby reducing the risk of interference of the attachments with the subsequent cleaning process when entering the cleaning area with the supporting piece; when the wafer enters the cleaning part 2 to complete part of the cleaning process, and needs to be transferred between different cleaning parts 2, the second supporting piece 7 is specially responsible for the operation, which is optimized for the state that the wafer may have liquid residue or surface wetness during the cleaning process, which can reduce the friction damage of the cleaning state wafer when contacting with the supporting piece, and reduce the possibility of reaction between the material of the supporting piece and the residual liquid on the surface of the wafer, thereby providing protection for the cleanliness and physical integrity of the wafer during the whole transfer period.

[0053] In terms of stability and quality control of the cleaning process, the cleaning unit is provided with multiple cleaning parts 2 respectively equipped with dedicated wafer cleaning positions, and each cleaning part 2 can independently perform cleaning work. In the actual cleaning scene, these independent cleaning parts 2 can be clearly functionally divided according to the process requirements of wafer cleaning, each cleaning part 2 only focuses on a single type of cleaning operation, for example, some cleaning parts 2 focus on removing loose particles on the surface of the wafer, and some cleaning parts 2 focus on decomposing organic residues or metal ions. In the independent operation process, each cleaning part 2 can reduce the cross interference of cleaning media caused by shared stations between different cleaning processes, ensure that each cleaning process can be carried out in an adaptive environment, provide support for the consistency of wafer cleaning quality, and meet the stringent requirements of advanced semiconductor processes for wafer surface cleanliness.

[0054] In terms of transportation efficiency and smoothness of the station connection, the transportation cavity 4 of the transportation unit provides a relatively closed movement space for the transportation mechanism 5, and the transportation assembly can carry the wafer taking and placing assembly to move flexibly relative to the rack 51, so as to realize smooth transportation of the wafer between the wafer taking and placing station 3 and the cleaning part 2 and between different cleaning parts 2. In the actual production process, when it is necessary to transport the wafer to be cleaned from the wafer taking and placing station 3 to the target cleaning part 2, the transportation assembly can directly drive the first supporting part 6 to adjust the position, and the connection between the taking and feeding can be completed without multiple switching of the driving module, which helps to shorten the waiting time of the transportation link. When the wafer completes a cleaning process and needs to be transferred to the next cleaning part 2, the transportation assembly can drive the second supporting part 7 to quickly adjust the movement track, cooperate with the independent layout of each cleaning part 2, and improve the transportation continuity between different cleaning processes. At the same time, the flexible movement design of the transportation assembly can improve the alignment fitting degree when the wafer is placed into the target cleaning position, reduce the situation that the cleaning area is not fully covered or the cleaning mechanism is interfered with the wafer due to alignment deviation, and further ensure the smooth progress of the cleaning process.

[0055] In addition, the feeding unit is provided with multiple wafer taking and placing stations 3 capable of separately placing wafers, which can simultaneously accommodate multiple wafers to be cleaned in actual operation, and cooperate with the differential supporting parts of the transportation mechanism 5 and the movement of the transportation assembly to realize orderly feeding and transportation of multiple wafers, reduce the waiting caused by insufficient feeding positions, and provide support for the continuous and stable operation of the equipment. The design of the transportation cavity 4 can also reduce the entry of particles and impurities in the external environment into the transportation link and the wafer, and further provide auxiliary protection for the cleanliness of the wafer transportation process.

[0056] Specifically, the machine body 1 includes a shell, and the transportation unit and the cleaning unit are located inside the machine body 1. The first supporting part 6 and the second supporting part 7 are both formed by two supporting tooth forks, and multiple limiting protrusions are arranged on the upper surfaces of the first supporting part 6 and the second supporting part 7, respectively, for limiting the radial deviation of the wafers and reducing the risk of shaking and falling of the wafers during transportation or cleaning.

[0057] As a preferred embodiment of the present application, the wafer taking and placing assembly includes at least two first supporting parts 6 and at least two second supporting parts 7. The multiple first supporting parts 6 can support the wafers in different wafer taking and placing stations 3, respectively, and the multiple second supporting parts 7 can support the wafers in different cleaning parts 2, respectively.

[0058] In actual production scenarios, the semiconductor production line often needs to process multiple pieces of wafer to be cleaned at the same time to match the production capacity demand. The multiple wafer taking and placing positions 3 of the feeding unit synchronously store the wafers to be cleaned transferred from different FOUP boxes. At this time, at least two first supporting members 6 can correspond to different wafer taking and placing positions 3 respectively and perform taking operations. Taking the two first supporting members 6 as an example, after the two first supporting members 6 respectively take wafers from the wafer taking and placing positions 3, the two first supporting members 6 are sequentially sent to the two cleaning parts 2 to perform cleaning work on the wafers respectively.

[0059] When the multiple cleaning parts 2 perform different processes respectively, at least two second supporting members 7 can support wafers in different cleaning states respectively to realize the parallel advancement of multiple cleaning processes. This cooperative working mode of the multiple first supporting members 6 and the multiple second supporting members 7 can fully utilize the independent running capability of each cleaning part 2 and avoid process stagnation caused by repeated running of a single second supporting member 7 between different cleaning parts 2, thereby further improving the continuity of the cleaning process.

[0060] Specifically, the multiple first supporting members 6 and the multiple second supporting members 7 are arranged in sequence along the vertical direction, and the multiple first supporting members 6 are arranged below the multiple second supporting members 7.

[0061] As a preferred embodiment of the present application, the multiple wafer taking and placing positions 3 are arranged in sequence along the width direction of the machine body 1, the transfer assembly includes a first driving member, a transfer seat 8, and a first transfer sliding rail 52, the wafer taking and placing assembly is installed on the transfer seat 8, the first transfer sliding rail 52 extends along the width direction of the machine body 1, and the first driving member drives the transfer seat 8 to slide along the first transfer sliding rail 52 to drive the wafer taking and placing assembly to move.

[0062] In the actual layout of the semiconductor production line, the feeding unit often needs to be connected to multiple FOUP boxes to ensure wafer supply. Arranging the multiple wafer taking and placing positions 3 along the width direction of the machine body 1 can adapt to the parallel placement mode of the FOUP boxes and reduce the space waste of the feeding area. At this time, the first transfer sliding rail 52 of the transfer assembly extends along the width direction, and the transfer seat 8 slides along the sliding rail under the driving of the first driving member, which can quickly switch between different wafer taking and placing positions 3. For example, when the wafers in the left placing position are taken, the transfer seat 8 does not need to adjust the moving direction and can be moved to the right placing position by sliding along the first transfer sliding rail 52, thereby avoiding the time consumption caused by repeatedly adjusting the direction of the transfer mechanism 5 due to the disordered arrangement of the placing positions in the existing device and significantly shortening the connection time of the taking position switching.

[0063] Meanwhile, the wafer taking and placing assembly is installed on the transfer seat 8, and when the transfer seat 8 slides in the width direction, the first supporting member 6 can be synchronously moved to the target placing position, so that the first supporting member 6 is always adapted to the position of the placing position. In an actual taking scenario, after the wafer to be cleaned is transferred from the FOUP box to the wafer taking and placing position 3, the transfer seat 8 can be sequentially slid to each wafer taking and placing position 3 according to the feeding sequence, and the first supporting member 6 performs the taking operation, and in cooperation with the design of the plurality of wafer taking and placing positions 3, the orderly taking of multiple wafers is realized, and the feeding congestion caused by poor switching of the taking position is reduced.

[0064] Specifically, the first driving member is a servo motor cooperating with a ball screw assembly, the screw shaft is parallel to the first transfer sliding rail 52, the motor is connected with the screw through a shaft coupling, and the screw nut is fixed with the transfer seat 8. When the motor rotates, the nut drives the transfer seat 8 to stably slide along the sliding rail, and the sliding speed can be adjusted through the controller.

[0065] As a preferred embodiment of the present embodiment, the transfer seat 8 includes a sliding seat 81 and a rotating seat 82, the sliding seat 81 is slidably connected with the first transfer sliding rail 52, the rotating seat 82 is installed on the top of the sliding seat 81 through the second driving member, the wafer taking and placing assembly is installed on the top of the rotating seat 82, and the second driving member drives the rotating seat 82 to rotate relative to the sliding seat 81 to drive the wafer taking and placing assembly to switch between the direction towards the wafer taking and placing position and the direction towards the cleaning part 2.

[0066] The layout of the wafer taking and placing position 3 and the cleaning part 2 often has a direction difference, for example, the wafer taking and placing position 3 is located outside the machine body 1 to facilitate the docking with the FOUP box, and the cleaning part 2 is located inside the machine body 1. The sliding seat 81 is slidably connected with the first transfer sliding rail 52 and is responsible for adjusting the position in the width direction, and the rotating seat 82 is installed on the top of the sliding seat 81 through the second driving member and can drive the wafer taking and placing assembly to rotate and switch the direction: when taking the wafer from the wafer taking and placing position 3, the second driving member drives the rotating seat 82 to rotate, so that the first supporting member 6 faces the wafer taking and placing position 3, and the first supporting member 6 can accurately align below the wafer of the placing position; after the taking is completed, the sliding seat 81 or the whole transfer mechanism 5 does not need to be moved, and only the rotating seat 82 is rotated to make the second supporting member 7 and the first supporting member 6 carrying the wafer to be cleaned face the cleaning part 2, so that the direction switching of taking and feeding is quickly completed.

[0067] The rotating switching design is more obvious in the production scene with dense stations, for example, when multiple wafer taking and placing stations 3 and cleaning parts 2 are distributed on both sides of the machine body 1, the rotating seat 82 can be flexibly adjusted to different directions according to the needs, avoiding the long-distance movement of the transfer mechanism 5 due to the need to cover multiple direction stations, reducing the invalid stroke in the transfer process. At the same time, the rotating action of the rotating seat 82 is fast, compared with the direction adjustment of the whole mechanism, it can greatly shorten the direction switching time, especially when multiple wafers are continuously transferred, the direction switching time of each taking and placing is reduced, which can significantly improve the overall transfer efficiency of the equipment.

[0068] In addition, when the rotating seat 82 drives the wafer taking and placing assembly to rotate, the motion trajectory of the wafer is more gentle, which can reduce the wafer shaking caused by the large movement of the mechanism. Combined with the differential support of the first support 6 and the second support 7, further support is provided for the integrity of the wafer during the transfer direction switching process, reducing the risk of wafer surface damage caused by shaking.

[0069] Specifically, the top of the sliding seat 81 is provided with a circular groove with a diameter matching the rotating seat 82, a bearing is installed in the groove, and the bottom of the rotating seat 82 is embedded in the inner ring of the bearing and fixed by bolts; The outer side of the rotating seat 82 is provided with an annular gear ring, and the second driving part is a combination of a servo motor and a gear. The motor is installed on the side of the sliding seat 81, the gear is engaged with the gear ring, and the motor rotates to drive the rotating seat 82 to rotate. The rotation angle range is 0-180°.

[0070] As a preferred example under this embodiment, the top of the rotating seat 82 is provided with a first sliding rail corresponding to the number of first supports 6 and a second sliding rail corresponding to the number of second supports 7, and the rotating seat 82 is provided with a third driving part 54. The third driving part 54 drives the first support 6 to slide along the first sliding rail to approach or move away from the wafer taking and placing station 3, and the third driving part 54 drives the second support 7 to slide along the second sliding rail to approach or move away from the cleaning part 2.

[0071] The first sliding rail corresponds to the first support 6, and the second sliding rail corresponds to the second support 7. The third driving part 54 can drive the support to flexibly extend or retract along the sliding rail according to the needs of different stations: when the first support 6 takes materials from the wafer taking and placing station 3, the third driving part 54 drives the first support 6 to extend along the first sliding rail to the placing station, so that the support can accurately reach the support position below the wafer, avoiding unstable support of the wafer due to insufficient length of the support. After the material taking is completed, the third driving part 54 drives the first support 6 to retract along the sliding rail, reducing the risk of interference between the support and other structures during the transfer process.

[0072] When the wafer is taken out from the cleaning unit 2, the operation logic of the second supporting member 7 is consistent with that of the first supporting member 6. For example, the wafer cleaning position of the cleaning unit 2 is provided with a fixed support table, the third driving member 54 can drive the second supporting member 7 to extend to below the support table along the second sliding rail, and then retract after the wafer is stably placed in the supporting member, so as to ensure the stability of the wafer when it is taken out from the cleaning position. If the depths of the support tables of different cleaning units 2 are different, the extension length of the second supporting member 7 can be adjusted to adapt to the situation, without the need to replace the supporting member or adjust the position of the rotating seat 82, thereby improving the adaptability of the equipment to different cleaning units 2.

[0073] Specifically, the third driving member 54 includes a stepper motor and a synchronous belt assembly. Each first supporting member 6 and second supporting member 7 corresponds to a stepper motor, and the motor is installed at the end of the rotating seat 82. The synchronous belt pulley is connected with the output shaft of the motor, and the other end of the synchronous belt is fixed with the connecting block at the bottom of the supporting member. When the motor rotates, the synchronous belt drives the supporting member to extend or retract along the sliding rail. The extension length is accurately controlled by the number of steps of the motor, so as to ensure that the prongs are completely below the wafer.

[0074] As another preferred embodiment of the present embodiment, the cleaning unit includes a first cleaning layer 9 and a second cleaning layer 10 arranged in an up-down manner. The first cleaning layer 9 and the second cleaning layer 10 each include a plurality of cleaning units 2 extending along the width direction of the machine body 1. The second transfer sliding rail 53 extending in the vertical direction is arranged between the two sides of the rack 51. The two ends of the first transfer sliding rail 52 are respectively connected with the second transfer sliding rail 53 through the sliding blocks. The transfer assembly further includes a fourth driving member, and the fourth driving member drives the first transfer sliding rail 52 to slide along the second transfer sliding rail 53.

[0075] In the actual scene of a semiconductor production line, the space in the workshop is often limited. If the cleaning stations are arranged only in the plane, a large floor area needs to be occupied, and it is difficult to improve the production capacity by increasing the number of stations. By adopting the design of two cleaning layers arranged in an up-down manner, the first cleaning layer 9 and the second cleaning layer 10 are distributed in the vertical direction, and each layer is provided with a plurality of cleaning units 2 extending along the width direction of the machine body 1. Without expanding the floor area of the equipment in the plane, the number of cleaning stations is doubled, more wafers in different cleaning processes can be processed at the same time, the overall cleaning production capacity of the equipment is significantly improved, and the high production capacity demand of the semiconductor production line is adapted.

[0076] Meanwhile, the second transfer rails 53 on both sides of the rack 51 extend in the vertical direction, the two ends of the first transfer rail 52 are connected with the second transfer rails 53 through sliding blocks, and the fourth driving member can drive the first transfer rail 52 to ascend and descend along the second transfer rails 53. This design enables the transfer assembly to switch between the upper and lower cleaning layers: when the wafer needs to be transferred to the first cleaning layer 9 on the lower layer, the fourth driving member drives the first transfer rail 52 to descend to the corresponding height, and cooperates with the sliding of the first transfer rail 52 in the width direction to accurately send the wafer into the cleaning part 2 of the first cleaning layer 9; when the wafer needs to be transferred to the second cleaning layer 10 on the upper layer, the first transfer rail 52 is driven to ascend to the corresponding height. The whole ascending and descending process is stable and the trajectory is fixed, without the need to adjust other structures of the transfer assembly, so that the switching between the upper and lower cleaning parts 2 can be quickly completed, and the increase of the wafer transfer time caused by the too long distance between the plane stations is avoided.

[0077] Specifically, the second transfer rail 53 is a vertical linear guide rail installed on the vertical column on both sides of the rack 51, the sliding block is a C-shaped structure wrapped on both sides of the rail to improve the sliding stability of the sliding block, and the inner side of the sliding block is provided with a ball to reduce the ascending and descending friction; the fourth driving member includes a servo motor and a synchronous belt, the servo motor is installed on the top of the rack 51, the synchronous belt is arranged along the length direction of the rail, the sliding block is fixed with the synchronous belt, the motor drives the synchronous belt to drive the sliding block to ascend and descend along the rail, and the ascending and descending speed is adjusted through the controller.

[0078] As a preferred example under the present embodiment, the second cleaning layer 10 is located above the first cleaning layer 9, and the rack 51 is provided with limiting blocks 511 respectively located at the top ends of the two second transfer rails 53, when the sliding block abuts against the limiting block 511, the second supporting member 7 is aligned with the second cleaning layer 10.

[0079] By arranging the limiting blocks 511 at the top ends of the second transfer rails 53 on both sides of the rack 51, when the third driving member 54 drives the first transfer rail 52 to ascend along the second transfer rail 53, the sliding blocks at both ends of the first transfer rail 52 will move upward until they stop ascending after abutting against the limiting blocks 511, at this time, the second supporting member 7 is just located above the second cleaning layer 10, without the need to repeatedly detect the height through the sensor or manually adjust, the reference position for the upper transfer can be quickly determined, and the adjustment time of the ascending and descending height is significantly shortened.

[0080] The limiting block 511 can also ensure the consistency of the height during each transfer to the second cleaning layer 10. Even if the transmission components are slightly worn after long-term operation, the abutting position of the sliding block and the limiting block 511 remains fixed, avoiding height deviation caused by wear, and ensuring that the second supporting member 7 is accurately positioned at the corresponding position of the second cleaning layer 10 each time, providing a stable height reference for the subsequent extension of the second supporting member 7 along the sliding rail into the cleaning part 2 to take and place the wafer, and reducing the risk of interference between the supporting member and the cleaning part 2 caused by height deviation.

[0081] In addition, in the continuous production scene of the semiconductor production line, multiple wafers need to be frequently transferred to the second cleaning layer 10. The presence of the limiting block 511 eliminates the need for repeated height calibration during each lifting operation, and only needs to drive the sliding block to rise to abut against the limiting block 511, greatly improving the transfer efficiency of the upper cleaning part 2, and further supporting the smooth progress of the upper cleaning process by differentiating the support of the second supporting member 7, and reducing the risk of production interruption caused by height adjustment problems.

[0082] As a preferred embodiment of the present application, the cleaning part 2 includes a pre-cleaning part 21, a wet cleaning part 22, an ultrapure water rinsing part 23, and a drying part 24 arranged in sequence along the wafer cleaning process.

[0083] In the actual scenario of semiconductor wafer cleaning, the types of contaminants on the wafer surface are diverse, such as loose particles, organic residues, and metal ions, which need to be processed in the order of removing large particles first, then removing stubborn residues, and finally rinsing and drying. Reversing the process can easily lead to a decrease in cleaning effect. The device arranges the cleaning parts 2 in the order of pre-cleaning, wet cleaning, ultrapure water rinsing, and drying, and each cleaning part 2 is only focused on a single type of cleaning operation: the pre-cleaning part 21 mainly processes the loose particles on the surface of the wafer to be cleaned, reducing the risk of particle scratches on the wafer surface during subsequent wet cleaning; the wet cleaning part 22 focuses on decomposing organic residues and metal ions, achieving targeted cleaning through appropriate cleaning medium; the ultrapure water rinsing part 23 is used to remove the chemical liquid residues after wet cleaning, avoiding the continuous impact of the liquid on the wafer surface; and the drying part 24 is responsible for removing the moisture on the wafer surface, providing a dry environment for the subsequent wafer transfer and storage.

[0084] This process-arranged cleaning part 2 design can form a deep synergy with the transfer logic of the transfer assembly, which can transfer the wafer from the pre-cleaning part 21 to the wet cleaning part 22 according to the cleaning progress of the wafer, and then transfer it to the ultrapure water rinsing part 23 and the drying part 24 in sequence, ensuring that each cleaning process is completed in a dedicated cleaning part 2, reducing cross-residue caused by the sharing of different types of cleaning medium, and providing protection for the consistency of wafer cleaning quality.

[0085] A wafer single piece cleaning method applied to the cleaning equipment as described above, the cleaning method comprising: S1: taking a to-be-cleaned wafer from a wafer taking and placing position of a feeding unit by a first supporting member of a transfer unit, and driving the first supporting member to move the to-be-cleaned wafer to a pre-cleaning part; S2: pre-cleaning treatment: the pre-cleaning part sprays the wafer with low-pressure ultrapure water or blows the wafer with nitrogen to remove loose particles on the wafer surface; S3: a second supporting member of the transfer unit moves the wafer treated in step S2 to a wet cleaning part, and the wet cleaning part sprays the wafer with SC-1 cleaning solution for 30-60 seconds to remove organic residues and metal ions; S4: the second supporting member moves the wafer treated in step S3 to an ultrapure water rinsing part, and the wafer is washed with ultrapure water overflow for 20-40 seconds to remove residual chemical liquid; S5: drying treatment: the second supporting member moves the wafer treated in step S4 to a drying part, and the wafer is dried with isopropyl alcohol vapor or nitrogen blowing to remove surface residual moisture.

[0086] The wafer single piece cleaning method of the present application realizes deep cooperation of the cleaning process and the equipment structure through the differentiated transfer of the first supporting member and the second supporting member and the step design of the cleaning part according to the process, and the step design of the cleaning method is closely adapted to the structural characteristics of the equipment. In step S1, the first supporting member is specially used to take the to-be-cleaned wafer from the wafer taking and placing position and move it to the pre-cleaning part, which is consistent with the supporting design of the first supporting member for the to-be-cleaned wafer and reduces the interference of the surface particle falling of the to-be-cleaned wafer on the pre-cleaning part. After the pre-cleaning treatment in step S2 is completed, the transfer operations in steps S3 to S5 are performed by the second supporting member, which is optimized for the characteristics of the cleaned wafer and can reduce the surface damage of the wafer during the transfer between the wet cleaning, ultrapure water rinsing and drying processes, or the secondary influence caused by the contact of the supporting member with the chemical liquid.

[0087] Meanwhile, the method steps strictly follow the process sequence of pre-cleaning, wet cleaning, ultrapure water rinsing and drying, and the wafer is sequentially passed through each dedicated cleaning part under the transfer of the second supporting member, and each process is completed in the adapted cleaning environment, reducing the decline of the cleaning effect caused by the reversal of the process. This process cooperation can also simultaneously improve the continuity of the cleaning process: when one wafer completes the pre-cleaning and enters the wet cleaning part, another to-be-cleaned wafer can enter the pre-cleaning part under the driving of the first supporting member, realizing the process flow processing of multiple wafers, and greatly improving the overall cleaning efficiency of the equipment.

[0088] In addition, the division of labor between the first supporting member responsible for the to-be-cleaned wafer and the second supporting member responsible for the cleaned wafer in the cleaning method can avoid the cross contamination caused by the switching of the same supporting member between the to-be-cleaned wafer and the cleaned wafer, for example, the first supporting member does not contact the chemical liquid of the cleaned wafer, and the second supporting member does not contact the particles of the to-be-cleaned wafer, which further provides support for the stability of the cleaning quality of each process and meets the high requirements of the semiconductor production line for wafer cleanliness.

[0089] As a preferred embodiment of the present application, the SC-1 cleaning solution in S3 is a mixed solution of ammonia, hydrogen peroxide and ultrapure water; and the ultrapure water in S4 has a resistivity of ≥18.2 MΩ·cm.

[0090] The SC-1 cleaning solution is a mixed solution of ammonia, hydrogen peroxide and ultrapure water. This mixed system can decompose the organic contaminants on the wafer surface through the oxidation of hydrogen peroxide, and at the same time, it can dissolve the oxidation products and part of the metal ions in the alkaline environment of ammonia to form a targeted cleaning effect. In combination with the spraying operation of the wet cleaning section, it can more efficiently remove the stubborn residues on the wafer surface and avoid the situation of insufficient cleaning ability or excessive corrosion of the wafer surface due to the ambiguity of the cleaning solution composition.

[0091] In the ultrapure water rinsing scenario, S4 specifies the characteristics of the ultrapure water. Such ultrapure water contains very few impurity ions and can effectively dilute and carry away the residual SC-1 cleaning solution components on the wafer surface, avoiding ion residues due to insufficient purity of the ultrapure water. At the same time, high-purity ultrapure water can also reduce the secondary pollution to the cleaned area of the wafer surface during the rinsing process, and in combination with the overflow washing design of the ultrapure water rinsing section, it further improves the rinsing effect and provides a clean surface basis for the subsequent drying process.

[0092] The places not mentioned in the present application can be realized by adopting or referring to the existing technology.

[0093] Each of the embodiments in the specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments.

[0094] The above only describes the embodiments of the present application and is not intended to limit the present application. Those skilled in the art can make various modifications and changes to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the scope of the claims of the present application.

Claims

1. A multi-station wafer cleaning device, characterized in that, The machine includes a body, which is equipped with a cleaning unit, a feeding unit, and a transfer unit. The cleaning unit includes multiple cleaning sections, each of which is provided with a wafer cleaning station, and each cleaning section can independently perform wafer cleaning work. The feeding unit includes multiple wafer pick-and-place positions, each of which can individually place a wafer. The transfer unit further includes a transfer cavity, in which a transfer mechanism is provided. The transfer mechanism includes a frame and a transfer assembly and a wafer pick-and-place assembly mounted on the frame. The wafer pick-and-place assembly includes several first supports for supporting wafers at the wafer pick-and-place positions and second supports for supporting wafers in the cleaning section. The transfer assembly can carry the wafer pick-and-place assembly to move relative to the frame to realize the transfer of wafers between the wafer pick-and-place positions and the cleaning sections, as well as between different cleaning sections.

2. The cleaning equipment according to claim 1, characterized in that, The wafer pick-and-place assembly includes at least two first supports and at least two second supports. The plurality of first supports can respectively support wafers in different wafer pick-and-place positions, and the plurality of second supports can respectively support wafers in different cleaning sections.

3. The cleaning equipment according to claim 1, characterized in that, Multiple wafer pick-and-place positions are arranged sequentially along the width direction of the machine body. The transfer assembly includes a first driving member, a transfer base, and a first transfer slide rail. The wafer pick-and-place assembly is mounted on the transfer base. The first transfer slide rail extends along the width direction of the machine body. The first driving member drives the transfer base to slide along the first transfer slide rail to move the wafer pick-and-place assembly.

4. The cleaning equipment according to claim 3, characterized in that, The transfer seat includes a sliding seat and a rotating seat. The sliding seat is slidably connected to the first transfer slide rail. The rotating seat is mounted on the top of the sliding seat via a second driving member. The wafer pick-and-place assembly is mounted on the top of the rotating seat. The second driving member drives the rotating seat to rotate relative to the sliding seat, thereby causing the wafer pick-and-place assembly to switch between the direction toward the wafer pick-and-place position and the direction toward the cleaning section.

5. The cleaning equipment according to claim 4, characterized in that, The top of the rotating base is provided with a first slide rail corresponding to the number of the first support members and a second slide rail corresponding to the number of the second support members. The rotating base is provided with a third driving member. The third driving member drives the first support members to slide along the first slide rail to approach or move away from the wafer pick-and-place position. The third driving member drives the second support members to slide along the second slide rail to approach or move away from the cleaning section.

6. The cleaning equipment according to claim 3, characterized in that, The cleaning unit includes a first cleaning layer and a second cleaning layer arranged vertically, and both the first cleaning layer and the second cleaning layer include a plurality of cleaning sections extending along the width direction of the machine body; The frame is provided with second transfer slide rails extending vertically on both sides. The two ends of the first transfer slide rail are slidably connected to the second transfer slide rails through sliding blocks. The transfer assembly also includes a fourth driving member, which drives the first transfer slide rail to slide along the second transfer slide rail.

7. The cleaning equipment according to claim 6, characterized in that, The second cleaning layer is located above the first cleaning layer. The frame is provided with limiting blocks located at the top of the two second transfer slide rails respectively. When the sliding block abuts against the limiting block, the second support member is aligned with the second cleaning layer.

8. The cleaning equipment according to any one of claims 1 to 7, characterized in that, The cleaning unit includes a pre-cleaning unit, a wet cleaning unit, an ultrapure water rinsing unit, and a drying unit arranged sequentially along the wafer cleaning process.

9. A method for cleaning a single wafer, characterized in that, Applied to the cleaning equipment as described in claim 8, the cleaning method includes: S1: The first support of the transfer unit picks up the wafer to be cleaned from the wafer pick-up and drop position of the loading unit, and the transfer component drives the first support to transfer the wafer to be cleaned to the pre-cleaning section. S2 Pre-cleaning process: The pre-cleaning section sprays the wafer with low-pressure ultrapure water or purges it with nitrogen to remove loose particles from the wafer surface. S3: The second support of the transfer unit transfers the wafer processed in step S2 to the wet cleaning section. The wet cleaning section uses SC-1 cleaning solution to spray the wafer for 30-60 seconds to remove organic residues and metal ions. S4: The second support transfers the wafer processed in step S3 to the ultrapure water rinsing section, where it is rinsed with ultrapure water overflow for 20-40 seconds to remove residual chemical solutions. S5 Drying process: The second support transfers the wafer processed in step S4 to the drying section, where it is dried with isopropanol vapor or nitrogen to remove residual moisture from the surface.

10. The cleaning method according to claim 9, characterized in that, In S3, the SC-1 cleaning solution is a mixture of ammonia, hydrogen peroxide, and ultrapure water; in S4, the ultrapure water has a resistivity ≥18.2 MΩ·cm.

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