Soaking device for wafer photoresist removal

Abstract

The invention relates to the technical field of wafers, in particular to a soaking device for wafer photoresist removal, which comprises a photoresist removal structure, a top cover and a fixing structure, the photoresist removing structure comprises a soaking box and a bottom plate; a through hole is formed in the center of the bottom plate, so that the liquid medicine is discharged out of the soaking box through the through hole; a plurality of groups of convex blocks are arranged on one side, close to the soaking box, of the bottom plate, are uniformly distributed along the center of the bottom plate, and are used for enabling the liquid medicine to rotate so as to generate centrifugal force for cleaning floccules. The wafer can be soaked through the soaking box to achieve photoresist removing, then the other photoresist removing structures are operated, the photoresist removing structures can enable liquid medicine in the soaking box to rotate, so that centrifugal force is generated, floccules remaining on the surface of the wafer are scoured through collision between the liquid and the wafer, and the wafer is cleaned. And the floccules on the surface of the wafer are removed while the photoresist of the wafer is removed in the same working procedure, so that the device is convenient to use.

Description

Technical Field

[0001] This invention relates to the field of wafer technology, specifically to an immersion apparatus for removing resist from wafers. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. Its raw material is silicon. After silicon ingots are ground, polished, and sliced, they are formed into silicon wafers, which are wafers. After photolithography and metal ion evaporation, in order to remove the adhesive that has been deposited on the wafer, it is necessary to immerse it in a chemical solution to remove the adhesive. This requires the use of a wafer adhesive removal immersion device.

[0003] However, existing wafer resist removal immersion devices mostly employ two methods: one is to place the wafer in a static chemical solution, utilizing the chemical properties of the solution to remove the resist. However, in this method, the resist on the wafer surface forms flocculent matter that remains on the wafer surface. Since the chemical solution is harmful to the human body and cannot be manually cleaned, a second cleaning process is required. The second method is to use the chemical solution to rinse the wafer surface, which can remove both the resist and the flocculent matter. However, in this method, the contact time between the chemical solution and the wafer surface is limited, requiring a larger amount of chemical solution to complete the resist removal. To avoid wasting the chemical solution, a second filtration process is needed for reuse. This method cannot remove the resist and flocculent matter simultaneously in the same process, making it inconvenient to use. Summary of the Invention

[0004] The purpose of this invention is to solve the problem that existing wafer stripping soaking devices cannot remove flocculent material at the same time as stripping the resist in the same process, which makes them inconvenient to use.

[0005] To achieve the above objectives, the present invention provides the following technical solution: An immersion apparatus for removing resist from wafers includes: a resist removal structure, a top cover, and a fixing structure; The adhesive removal structure is used to remove adhesive from wafers and clean residual flocculent material. The adhesive removal structure includes an immersion tank and a base plate. The immersion tank includes an inlet and an outlet, allowing the reagent to enter the immersion tank from the inlet. The base plate is located at the outlet and is fixedly connected to the immersion tank. A through hole is provided in the center of the base plate, allowing the reagent to exit the immersion tank through the through hole. Multiple sets of protrusions are provided on the side of the base plate near the immersion tank, and these protrusions are evenly distributed along the center of the base plate. The protrusions are used to rotate the reagent, generating centrifugal force to clean the flocculent material. The top cover is positioned directly above the soaking tank; the outer diameter of the top cover is slightly smaller than the inner diameter of the soaking tank, allowing the top cover to enter the soaking tank and sealing the inlet; The fixing structure is connected to the top cover and is used to fix the wafer during the adhesive removal process.

[0006] Preferably, the adhesive removal structure further includes: A limiting member is disposed in the through hole; a slider is disposed on the outer side of the limiting member, the slider is disposed in a slide rail opened vertically in the inner wall of the through hole, and is slidably connected to the base plate through the slide rail; a groove is provided at the center of the limiting member; A filter cover is disposed in the groove, and the upper end face of the filter cover is flush with the upper end face of the base plate; A support plate is sleeved on the outside of the limiting member and is rotatably connected to the limiting member; the edge of the support plate is fixedly connected to the outer shell. The first motor has its output end fixedly connected to the end of the limiting member away from the base plate.

[0007] Preferably, the fixing structure includes: A drive assembly is disposed inside the top cover and connected to the top cover; Multiple sets of switching components are evenly arranged along the center of the driving component and connected to the driving component, so that the switching components switch the fixed position of the wafer under the drive of the driving component. Multiple sets of adjustable clamping components are provided, each set of adjustable clamping components is located directly below the switching component and connected to the switching component, and is used to adjust the clamping diameter.

[0008] Preferably, the driving component includes: The drive assembly consists of a first threaded rod, a circular plate, and multiple sets of strip plates; the first threaded rod passes through the axis of the circular plate and is threadedly connected to the circular plate; the multiple sets of strip plates are evenly distributed on the outer side of the circular plate; Multiple sets of rotating rods, the axis of each set of rotating rods being fixedly connected to the end of the strip plate away from the circular plate; The output end of the second motor is fixedly connected to one end of the first threaded rod.

[0009] Preferably, each group of the switching components includes: Two sets of first groove plates are symmetrically arranged on both sides of the rotating rod; the surface of the first groove plate is provided with a first sliding groove; Two sets of first moving rods, each set of first moving rods is provided with a first cylindrical pin at one end near the drive assembly, the first cylindrical pin is provided in the first sliding groove, and the first moving rod is slidably connected to the first groove plate through the first sliding groove; Two sets of second groove plates are symmetrically arranged on both sides of the rotating rod and perpendicular to the first groove plate; the surface of the second groove plate is provided with a second sliding groove; Two sets of second moving rods, each set of second moving rods having a second cylindrical pin at one end near the drive assembly, the second cylindrical pin being disposed in the second sliding groove, and the second moving rod being slidably connected to the second groove plate through the second sliding groove; Multiple sets of vertical rods are fixedly connected to the ends of the first and second moving rods away from the rotating rod, respectively.

[0010] Preferably, the first chute is composed of a first vertical chute and a first inclined chute; one end of the first inclined chute is connected to the top of the first vertical chute; the other end of the first inclined chute is located at the end of the first chute plate away from the rotating rod, and the height of the plane at the other end is higher than that of the first vertical chute.

[0011] Preferably, the second slide groove is composed of a second vertical slide groove and a second inclined slide groove; one end of the second inclined slide groove is connected to the top of the second vertical slide groove; the other end of the second inclined slide groove is located at the end of the second groove plate away from the rotating rod, and the height of the plane at the other end is lower than that of the second vertical slide groove.

[0012] Preferably, the length of the first vertical chute is the same as the length of the perpendicular lines at both ends of the second inclined chute, and they are located at the same height; the length of the second vertical chute is the same as the length of the perpendicular lines at both ends of the first inclined chute, and they are located at the same height.

[0013] Preferably, each set of the adjusting clamping components includes: The rotating component consists of a second threaded rod and a handwheel. One end of the second threaded rod passes through the vertical rod and is fixedly connected to the handwheel. The fixing component consists of a clamping part and a moving part. The moving part is sleeved on the outside of the second threaded rod and is threadedly connected to the second threaded rod. The end of the moving part away from the handwheel is fixedly connected to the clamping part. Two sets of seals are provided, each set consisting of a sealing plate and a sliding rod. One end of the sliding rod is fixedly connected to the end of the moving part near the handwheel; the other end of the sliding rod is fixedly connected to the sealing plate; the surface of the sliding rod is slidably connected to a guide rail formed on the surface of the vertical rod; the length of the sealing plate is twice the length of the guide rail.

[0014] Preferably, the adjusting clamping assembly further includes a scale; the scale is disposed above the sealing plate and is used to display the moving distance of the sealing plate.

[0015] Preferably, it further includes: a moving component; the moving component is disposed between the outer shell and the soaking tank and connected to the soaking tank, for moving the soaking tank.

[0016] Preferably, the moving component includes: Two sets of spur gears are disposed inside the housing and are rotatably connected to the housing; the two sets of spur gears are meshed with each other. The third motor, the output end of which is fixedly connected to the shaft of a set of spur gears; Two sets of rotating rods, one end of each set of rotating rods is fixedly connected to the shaft of the spur gear, and the other end is provided with a strip groove; Two sets of connectors, each set of connectors having a third cylindrical pin at one end, the third cylindrical pin being disposed in the strip groove, and the connector being slidably connected to the rotating rod through the strip groove; A support ring is fitted onto the outside of the soaking tank and is rotatably connected to the soaking tank; Multiple sets of connecting rods, with each set of connecting rods having its two ends fixedly connected to the support ring and the connecting member, respectively.

[0017] Preferably, it further includes: an electric push rod; the output end of the electric push rod is fixedly connected to the top cover and is used to push the top cover to move vertically.

[0018] The beneficial effects proposed by this invention are as follows: the wafer can be immersed in the immersion tank to remove the adhesive, and then the remaining adhesive removal structure is operated. The adhesive removal structure will cause the chemical solution in the immersion tank to rotate, thereby generating centrifugal force. The collision between the liquid and the wafer will wash away the flocculent material retained on the wafer surface. This achieves the removal of flocculent material from the wafer surface in the same process, which is convenient for use. During the adhesive removal, the centrifugal force will also move the flocculent material to the center. The adhesive removal structure can collect the flocculent material for subsequent cleaning. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 for Figure 1 Cross-sectional view of the internal connection structure; Figure 3 for Figure 2 A three-dimensional schematic diagram of the internal connection structure; Figure 4 for Figure 3 A three-dimensional diagram of the central connecting structure viewed from below; Figure 5 for Figure 3 Enlarged 3D schematic diagram of the central connecting structure; Figure 6 for Figure 5 A three-dimensional diagram of the central connecting structure viewed from below; Figure 7 for Figure 6 Enlarged 3D schematic diagram of the central connecting structure; Figure 8 for Figure 7 Enlarged 3D schematic diagram of the central connecting structure; Figure 9 for Figure 4 Enlarged 3D schematic diagram of the central connecting structure; Figure 10 for Figure 2 Enlarged 3D schematic diagram of the central connecting structure; Figure 11 for Figure 10 Exploded view of the central connecting structure; Figure 12 for Figure 11 A top-down view of the exploded structure connecting the middle sections; Figure 13 for Figure 5 Enlarged schematic diagram of the central drive unit structure; Figure 14 for Figure 7 Enlarged schematic diagram of the rotating component structure; Figure 15 for Figure 7 Enlarged cross-sectional view of the structure of the fixing component and the sealing component.

[0020] In the diagram: 1. Outer shell, 2. Soaking tank, 3. Top cover, 4. Bottom plate, 5. Limiting component, 6. Filter cover, 7. Support plate, 8. First motor, 9. Drive unit, 901. First threaded rod, 902. Circular plate, 903. Strip plate, 10. Second motor, 11. Rotating rod, 12. First groove plate, 13. Second groove plate, 14. First moving rod, 15. Second moving rod, 16. Vertical rod, 17. Rotating component, 1701. Second threaded rod, 1702. Handwheel, 18. Fixing component, 1801. Clamping part, 1802. Moving part, 19. Sealing component, 1901. Sealing plate, 1902. Sliding rod, 20. Scale, 21. Support ring, 22. Connecting rod, 23. Connecting component, 24. Rotating rod, 25. Spur gear, 26. Third motor, 27. Electric push rod. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings: This embodiment: Please see Figure 1-15 In this embodiment: a wafer resist removal soaking device includes: a shell 1, a resist removal structure, a top cover 3, and a fixing structure.

[0022] In this embodiment, the adhesive removal structure is used to remove adhesive from the wafer and clean up any retained flocculent material. The adhesive removal structure includes an immersion tank 2 and a base plate 4. The immersion tank 2 includes an inlet and an outlet, allowing the solution to enter the immersion tank 2 from the inlet. The base plate 4 is located at the outlet and is fixedly connected to the immersion tank 2. A through hole is provided in the center of the base plate 4, allowing the solution to be discharged from the immersion tank 2 through the through hole. Multiple sets of protrusions are provided on the side of the base plate 4 near the immersion tank 2, and the multiple sets of protrusions are evenly distributed along the center of the base plate 4. The protrusions are used to rotate the solution to generate centrifugal force to clean up the flocculent material.

[0023] In this embodiment, the desmearing structure is located inside the outer casing 1 and connected to the outer casing 1. The wafer can be immersed in the immersion tank 2 to remove the desmear. After that, the remaining desmearing structures are operated. The desmearing structures will cause the solution in the immersion tank 2 to rotate, thereby generating centrifugal force. The collision between the liquid and the wafer is used to wash away the flocculent material stuck on the wafer surface. This achieves the removal of flocculent material from the wafer surface in the same process, which is convenient for use. At the same time as desmearing, the centrifugal force will also move the flocculent material to the center. The desmearing structure can collect the flocculent material for subsequent cleaning.

[0024] The top cover 3 is positioned directly above the soaking tank 2; the outer diameter of the top cover 3 is slightly smaller than the inner diameter of the soaking tank 2, allowing the top cover 3 to enter the soaking tank 2 and seal the inlet.

[0025] In this embodiment, the outlet of the soaking tank 2 is opened by moving the top cover 3 vertically to replenish the medicine solution.

[0026] The fixing structure is connected to the top cover 3 and is used to fix the wafer during the desizing process.

[0027] In this embodiment, the movement of the liquid medicine will generate centrifugal force on the wafer. In order to prevent collisions between wafers, a fixing structure is used to fix the wafer. At the same time, since the liquid medicine is harmful to the human body, the fixing structure can be used to pick up and put down the wafer.

[0028] like Figure 10 , Figure 11 and Figure 12 As shown, the adhesive removal structure also includes: a base plate 4, a limiting component 5, a filter cover 6, a support plate 7, and a first motor 8.

[0029] The bottom plate 4 is located at the outlet and is fixedly connected to the soaking tank 2. A through hole is opened in the center of the bottom plate 4, and a vertically upward slide is opened on the inner wall of the through hole. Multiple sets of protrusions are provided on the side of the bottom plate 4 near the soaking tank 2, and the multiple sets of protrusions are evenly distributed along the center of the bottom plate 4.

[0030] In this embodiment, multiple sets of bumps can be used to increase the centrifugal force of the rotating liquid medicine. The limiting member 5 is disposed in the through hole; a slider is disposed on the outside of the limiting member 5, the slider is disposed in the slide rail, and is slidably connected to the base plate 4 through the slide rail; a groove is provided at the center of the limiting member 5.

[0031] In this embodiment, the outer diameter of the limiting member 5 is the same as the inner diameter of the through hole. When the limiting member 5 is inserted into the through hole and the bottom plate 4 and the support plate 7 are in contact, the cooperation between the slider and the slide rail allows the limiting member 5 to rotate synchronously with the bottom plate 4, thereby driving the soaking tank 2 to rotate and generating centrifugal force. The limiting member 5 is shaped as a cylinder with an inwardly recessed groove and a strip-shaped through groove that is flush with the inner diameter of the groove on its surface.

[0032] The filter cover 6 is disposed in the groove, and the upper end surface of the filter cover 6 is flush with the upper end surface of the base plate 4.

[0033] In this embodiment, the surface of the filter cover 6 is provided with filter holes, which allows the medicine to pass through and intercepts flocculent matter; when the base plate 4 contacts the support plate 7, the protrusion under the base plate 4 will cover the filter cover 6 to prevent the filter cover 6 from leaking the medicine prematurely.

[0034] The support plate 7 is sleeved on the outside of the limiting member 5 and is rotatably connected to the limiting member 5; the edge of the support plate 7 is fixedly connected to the outer shell 1.

[0035] In this embodiment, a sealed bearing is provided between the support plate 7 and the limiting member 5; the support plate 7 can support the rotation of the limiting member 5.

[0036] The output end of the first motor 8 is fixedly connected to the end of the limiting member 5 away from the base plate 4.

[0037] In this embodiment, the output end of the first motor 8 can drive the limiting member 5 to rotate; the first motor 8 is a common device on the market, and its model can be selected according to actual needs as long as it meets the working conditions.

[0038] During the desizing process, the wafer is placed in the immersion tank 2, and a chemical solution is added to the immersion tank 2. When the adhesive on the wafer surface turns into flocculent material, the external power supply of the first motor 8 is turned on, and the first motor 8 is started. The output end of the first motor 8 drives the limiting member 5 to rotate. The limiting member 5 drives the base plate 4 to rotate synchronously through the cooperation between the slider and the slide rail. The base plate 4 simultaneously drives multiple sets of protrusions and the immersion tank 2 to rotate, thereby generating centrifugal force in the chemical solution to wash the wafer. At the same time, the centrifugal force causes the flocculent material washed down to move towards the center and be collected by the filter cover 6. When cleaning is required, simply lift the base plate 4 so that it is detached from the limiting member 5, and the filter cover 6 can be removed for cleaning. This process can remove the flocculent material on the wafer surface while removing the adhesive in the same process, making it convenient to use.

[0039] like Figure 5and Figure 6 As shown, the fixed structure includes: a drive assembly, multiple sets of switching assemblies, and multiple sets of adjustment clamping assemblies.

[0040] Specifically, the driving component is located inside the top cover 3 and connected to the top cover 3; multiple sets of switching components are evenly arranged along the center of the driving component and connected to the driving component, so that the switching components switch the fixed position of the wafer under the drive of the driving component.

[0041] In this embodiment, by using the driving component, the switching component can change the position of the adjusting clamping component, thereby changing the position of the wafer fixation, so as to achieve omnidirectional removal of the adhesive from the wafer.

[0042] Each set of adjustable clamping components is located directly below the switching component and connected to the switching component, and is used to adjust the clamping diameter.

[0043] In this embodiment, two sets of symmetrical adjustment and clamping components along the rotating rod 11 work together to fix the wafer.

[0044] like Figure 3 and Figure 5 As shown, the drive assembly includes: drive assembly 9, multiple sets of rotating rods 11, and a second motor 10.

[0045] The drive assembly 9 consists of a first threaded rod 901, a circular plate 902, and multiple sets of strip plates 903. The first threaded rod 901 passes through the axis of the circular plate 902 and is threadedly connected to the circular plate 902. The multiple sets of strip plates 903 are evenly distributed on the outer side of the circular plate 902.

[0046] In this embodiment, the number of fixed wafers is controlled by the number of strip plates 903; the number of strip plates 903 is greater than or equal to two sets; when the first threaded rod 901 rotates, the circular plate 902 will move vertically.

[0047] The axis of each rotating rod 11 is fixedly connected to the end of the strip plate 903 away from the circular plate 902.

[0048] In this embodiment, the strip plate 903 can drive the rotating rod 11 to move vertically in sync; a limit rod is provided at the axis of the rotating rod 11, the rotating rod 11 is slidably connected to the limit rod, and the two ends of the limit rod are fixedly connected to the top cover.

[0049] The output end of the second motor 10 is fixedly connected to one end of the first threaded rod 901.

[0050] In this embodiment, the output end of the second motor 10 can drive the first threaded rod 901 to rotate synchronously; the second motor 10 is a common device on the market, and its model can be selected according to actual needs as long as it meets the working conditions.

[0051] When driving is required, the external power supply of the second motor 10 is turned on, so that the output end of the second motor 10 drives the first threaded rod 901 to rotate; the first threaded rod 901 causes the circular plate 902 and multiple sets of strip plates 903 to move vertically at the same time; the strip plates 903 drive the rotating rod 11 to move synchronously, while the limit rod restricts the rotating rod 11 to move only vertically and cannot rotate.

[0052] like Figure 2 and Figure 7 As shown, each switching component includes: two sets of first slot plates 12, two sets of first moving rods 14, two sets of second slot plates 13, two sets of second moving rods 15, and multiple sets of vertical rods 16.

[0053] Specifically, two sets of first groove plates 12 are symmetrically arranged on both sides of the rotating rod 11; the surface of the first groove plate 12 is provided with a first sliding groove 1201.

[0054] In this embodiment, the rotating rod 11 will drive the first slot plate 12 to move synchronously.

[0055] Each set of first moving rods 14 has a first cylindrical pin at one end near the drive assembly 9. The first cylindrical pin is disposed in the first slide groove 1201, and the first moving rod 14 is slidably connected to the first groove plate 12 through the first slide groove 1201.

[0056] In this embodiment, when the two sets of first groove plates 12 move vertically at the same time, the sliding between the first cylindrical pin (not shown in the figure) and the first sliding groove 1201 causes the two sets of first moving rods 14 to move towards the middle or outward at the same time. The first moving rods 14 are provided with round rods on both sides, and the round rods are slidably connected to the top cover 3, thereby restricting the first moving rods 14 to move only horizontally.

[0057] Two sets of second groove plates 13 are symmetrically arranged on both sides of the rotating rod 11 and are perpendicular to the first groove plate 12; the surface of the second groove plate 13 is provided with a second sliding groove 1301.

[0058] In this embodiment, the rotating rod 11 simultaneously drives the second groove plate 13 to move vertically.

[0059] Each set of second moving rods 15 is provided with a second cylindrical pin at one end near the drive assembly 9. The second cylindrical pin is disposed in the second slide groove 1301, and the second moving rod 15 is slidably connected to the second groove plate 13 through the second slide groove 1301.

[0060] In this embodiment, when the second groove plate 13 moves vertically, it slides between the second cylindrical pin (not shown in the figure) and the second sliding groove 1301, causing the two sets of second moving rods 15 to move simultaneously to the middle or to the outside; and when the second moving rod 15 moves, the first moving rod 14 remains stationary; while when the first moving rod 14 moves, the second moving rod 15 remains stationary; the second moving rod 15 has the same shape as the first moving rod 14.

[0061] Multiple sets of vertical rods 16 are fixedly connected to the ends of the first moving rod 14 and the second moving rod 15 away from the rotating rod 11, respectively.

[0062] In this embodiment, a cavity is provided at the end of the vertical rod 16 away from the rotating rod 11, and the adjusting clamping assembly is located in the cavity.

[0063] like Figure 7 As shown, the first slide 1201 is composed of a first vertical slide 12011 and a first inclined slide 12012; one end of the first inclined slide 12012 is connected to the top of the first vertical slide 12011; the other end of the first inclined slide 12012 is located at the end of the first groove plate 12 away from the rotating rod 11, and the height of the plane where the other end is located is higher than that of the first vertical slide 12011.

[0064] In this embodiment, the first vertical slide groove 12011 is located at the lower middle position of the first groove plate 12, while the first inclined slide groove 12012 is located at the upper left position of the first groove plate 12. At this time, the right end of the first groove plate 12 is in contact with the rotating rod 11.

[0065] like Figure 7 As shown, the second slide 1301 is composed of a second vertical slide 13011 and a second inclined slide 13012; one end of the second inclined slide 13012 is connected to the top of the second vertical slide 13011; the other end of the second inclined slide 13012 is located at the end of the second groove plate 12 away from the rotating rod 11, and the height of the plane where the other end is located is lower than that of the second vertical slide 13011.

[0066] In this embodiment, the second vertical slide groove 13011 is located at the upper middle position of the first groove plate 12, while the first inclined slide groove 12012 is located at the lower left position of the first groove plate 12. At this time, the right end of the first groove plate 12 is also in contact with the rotating rod 11.

[0067] like Figure 7 As shown, the length of the first vertical slide 12011 is the same as the length of the vertical lines at both ends of the second inclined slide 13012, and they are located at the same height; the length of the second vertical slide 13011 is the same as the length of the vertical lines at both ends of the first inclined slide 12012, and they are located at the same height.

[0068] In this embodiment, Figure 7 For example, the first moving rod 14 is located at the bottom end of the first vertical slide 12011, while the second moving rod 15 is located at the bottom end of the second inclined slide 13012. As the first groove plate 12 and the second groove plate 13 move vertically downwards simultaneously, the first vertical slide 12011 does not exert any force on the first moving rod 14, keeping the first moving rod 14 stationary. The second inclined slide 13012 exerts a horizontal force on the second moving rod 15, causing both sets of second moving rods 15 to move towards the center simultaneously. When the first moving rod 14 moves to the bottom end of the first inclined slide 12012, the second moving rod 15 is located at the bottom end of the second vertical slide 13011. As the first groove plate 12 and the second groove plate 13 continue to move, the second moving rod 15 remains stationary, while the first moving rod 14 moves outwards under the constraint of the first inclined slide 12012, thereby achieving the switching.

[0069] When a switch is required, the two sets of first moving rods 14 are in the middle position, maintaining the wafer's fixation. As the rotating rod 11 moves, it drives the two sets of first slot plates 12 and the two sets of second slot plates 13 to move vertically downwards simultaneously. At this time, since the first cylindrical pin is located at the bottom end of the first vertical slide 12011, it will not move as the first vertical slide 12011 moves vertically, thus maintaining the wafer's fixation. Meanwhile, the second cylindrical pin is located at the bottom end of the second inclined slide 13012. As the second inclined slide 13012 moves vertically, the two sets of second moving rods 15 will move towards the center, thereby driving the adjustment clamping assembly to move and fix the wafer. As the rotating rod 11 continues to move, when the first cylindrical pin moves into the first inclined slide 12012, the first inclined slide 12012 will cause the two sets of first moving rods 14 to move outward, while the second cylindrical pin is located in the second vertical slide 13011 and no longer moves, thereby realizing the change of the wafer fixing position.

[0070] like Figure 8 As shown, each set of adjusting clamping components includes: a rotating part 17, a fixing part 18, and two sets of sealing parts 19.

[0071] The rotating component 17 consists of a second threaded rod 1701 and a handwheel 1702. One end of the second threaded rod 1701 passes through the vertical rod 16 and is fixedly connected to the handwheel 1702.

[0072] In this embodiment, the second threaded rod 1701 can be driven to rotate synchronously by rotating the handwheel 1702.

[0073] The fixing member 18 consists of a clamping part 1801 and a moving part 1802. The moving part 1802 is sleeved on the outside of the second threaded rod 1701 and is threadedly connected to the second threaded rod 1701. The end of the moving part 1802 away from the handwheel 1702 is fixedly connected to the clamping part 1801.

[0074] In this embodiment, when the second threaded rod 1701 rotates, the moving part 1802 will move horizontally, thereby changing the position of the clamping part 1801 to fix wafers of different diameters.

[0075] Each set of seals 19 consists of a sealing plate 1901 and a sliding rod 1902. One end of the sliding rod 1902 is fixedly connected to the end of the moving part 1802 near the handwheel 1702; the other end of the sliding rod 1902 is fixedly connected to the sealing plate 1901; the surface of the sliding rod 1902 is slidably connected to the guide rail opened on the surface of the vertical rod 16; the length of the sealing plate 1901 is twice the length of the guide rail.

[0076] In this embodiment, when the moving part 1802 moves, the sliding rod 1902 drives the sealing plate 1901 to move, and the length of the sealing plate 1901 is used to seal the guide rail to prevent the liquid medicine from entering; the sealing plate 1901 is made of corrosion-resistant rubber material.

[0077] like Figure 8 As shown, the adjusting clamping assembly also includes a scale 20; the scale 20 is disposed above the sealing plate 1901 and is used to display the moving distance of the sealing plate 1901.

[0078] In this embodiment, the surface of the scale 20 is provided with a scale, and the movement distance of the clamping part 1801 can be determined by the change of the scale.

[0079] Since the distance between the two sets of first slide grooves 1201 is constant, this switching component can only fix wafers of the same diameter. Therefore, when it is necessary to fix wafers of other sizes, the user rotates the handwheel 1702 to drive the second threaded rod 1701 to rotate. The second threaded rod 1701 will cause the fixing member 18 to move horizontally. By changing the position of the corresponding fixing member 18, the fixing of wafers of different diameters can be changed. The sealing member 19 will block the guide rail opened on the surface of the vertical rod 16 and also restrict the corresponding position with the scale 20 to ensure that the corresponding fixing members 18 are symmetrical to each other.

[0080] The wafer resist removal immersion apparatus further includes: a moving component; the moving component is disposed between the housing 1 and the immersion tank 2 and is connected to the immersion tank 2 for moving the immersion tank 2.

[0081] like Figure 4 and Figure 9As shown, the moving assembly includes: two sets of spur gears 25, a third motor 26, two sets of rotating rods 24, two sets of connecting parts 23, a support ring 21, and multiple sets of connecting rods 22.

[0082] Specifically, two sets of spur gears 25 are disposed inside the housing 1 and are rotatably connected to the housing 1; the two sets of spur gears 25 are meshed with each other; the output end of the third motor 26 is fixedly connected to the shaft of one set of spur gears 25.

[0083] In this embodiment, the two sets of spur gears 25 rotate in opposite directions; the third motor 26 is a common device on the market, and its model can be selected according to actual needs as long as it meets the working conditions.

[0084] One end of each set of rotating rods 24 is fixedly connected to the shaft of the spur gear 25, and the other end is provided with a strip groove.

[0085] In this embodiment, the rotating rod 24 will rotate synchronously with the spur gear 25; Each set of connectors 23 has a third cylindrical pin at one end, which is located in a strip groove, allowing the connector 23 to slide through the strip groove and connect with the rotating rod 24.

[0086] In this embodiment, when the rotating rod 24 rotates, the third cylindrical pin moves vertically through the sliding between the strip groove and the third cylindrical pin.

[0087] The support ring 21 is sleeved on the outside of the soaking tank 2 and is rotatably connected to the soaking tank 2.

[0088] In this embodiment, the support ring 21 can both support the rotation of the soaking tank 2 and drive the soaking tank 2 to move vertically.

[0089] The two ends of each connecting rod 22 are fixedly connected to the support ring 21 and the connector 23, respectively.

[0090] In this embodiment, the connector 23 can drive the support ring 21 to move vertically through the connecting rod 22, and the sliding between the connecting rod 22 and the outer shell 1 can also restrict the connector 23 to move only vertically.

[0091] When cleaning is required, the fixed structure is at the top, providing space for the soaking tank 2 to move. The external power supply of the third motor 26 is connected, and the third motor 26 is started. The output end of the third motor 26 drives the two sets of spur gears 25 to rotate. The two sets of spur gears 25 will cause the two sets of rotating rods 24 to rotate in opposite directions. The rotating rods 24 slide between the strip groove and the third cylindrical pin, causing the third cylindrical pin to move vertically, thereby driving the connecting piece 23 to move. The connecting piece 23 drives the support ring 21 to move vertically through the connecting rod 22, thereby driving the soaking tank 2 to move.

[0092] like Figure 1 As shown, the wafer resist removal soaking device also includes: an electric push rod 27; the output end of the electric push rod 27 is fixedly connected to the top cover 3 and is used to push the top cover 3 to move vertically.

[0093] In this embodiment, the output end of the electric push rod 27 can push the top cover 3 and the fixed structure to move vertically, bringing the wafer out of the immersion tank 2.

[0094] Working principle: When using the wafer deresin immersion device, the wafer is placed between two sets of corresponding adjusting clamping components. By rotating the handwheel 1702, the second threaded rod 1701 is rotated, which causes the fixing member 18 to move horizontally. By changing the position of the corresponding fixing member 18, the fixing of wafers of different diameters can be changed. The sealing member 19 will block the guide rail opened on the surface of the vertical rod 16 and limit the corresponding position with the scale 20, ensuring that the corresponding fixing members 18 are symmetrical.

[0095] Subsequently, the retraction of the output end of the electric push rod 27 places the wafer into the immersion tank 2, and adds a chemical solution to the immersion tank 2. When the adhesive on the wafer surface turns into flocculent material, the external power supply of the first motor 8 is connected, and the first motor 8 is started. The output end of the first motor 8 drives the limiting member 5 to rotate. The limiting member 5 drives the base plate 4 to rotate synchronously through the cooperation between the slider and the slide rail. The base plate 4 simultaneously drives multiple sets of protrusions and the immersion tank 2 to rotate, thereby generating centrifugal force in the chemical solution to wash the wafer. At the same time, the centrifugal force causes the flocculent material washed down to move towards the center and be collected by the filter cover 6. When cleaning is required, simply lift the base plate 4 so that it is detached from the limiting member 5, and the filter cover 6 can be removed for cleaning. This process removes the adhesive from the wafer and the flocculent material on the wafer surface in the same process, making it convenient to use.

[0096] When switching is required, the external power supply of the second motor 10 is turned on, so that the output end of the second motor 10 drives the first threaded rod 901 to rotate; the first threaded rod 901 causes the circular plate 902 and multiple sets of strip plates 903 to move vertically at the same time; the strip plates 903 drive the rotating rod 11 to move synchronously, while the limit rod restricts the rotating rod 11 to move only vertically and cannot rotate.

[0097] At this time, the two sets of first moving rods 14 are in the middle position, maintaining the fixation of the wafer; as the rotating rod 11 moves, it will drive the two sets of first slot plates 12 and the two sets of second slot plates 13 to move vertically downwards simultaneously; at this time, since the first cylindrical pin is located at the bottom end of the first vertical slide 12011, as the first vertical slide 12011 moves vertically, the first cylindrical pin will not move, thus maintaining the fixation of the wafer; while at this time, the second cylindrical pin is located at the bottom end of the second inclined slide 13012, as the second inclined slide 13012 moves vertically, the first cylindrical pin will not move, thus maintaining the fixation of the wafer; and at this time, the second cylindrical pin is located at the bottom end of the second inclined slide 13012, as the second inclined slide 13012 moves vertically, the first cylindrical pin will not move, thus maintaining the fixation of the wafer. The vertical movement of groove 13012 causes the two sets of second moving rods 15 to move towards the center, thereby driving the adjustment clamping assembly to move and fix the wafer. As the rotating rod 11 continues to move, when the first cylindrical pin moves into the first inclined slide groove 12012, the first inclined slide groove 12012 will cause the two sets of first moving rods 14 to move outward. At this time, the second cylindrical pin is located in the second vertical slide groove 13011 and no longer moves, thereby changing the fixed position of the wafer and completing the removal of adhesive from the wafer.

[0098] Although the present invention has been illustrated and described with reference to preferred embodiments, those skilled in the art will understand that various changes in form and detail are possible within the scope of the claims.

Claims

1. A wafer resist removal soaking device, characterized in that, include: The adhesive removal structure, the top cover (3), and the fixing structure; The adhesive removal structure is used to remove adhesive from the wafer and clean up any retained flocculent material. The degumming structure includes: a soaking tank (2) and a bottom plate (4); the soaking tank (2) includes: an inlet and an outlet, allowing the medicine to enter the soaking tank (2) from the inlet; the bottom plate (4) is located at the outlet and is fixedly connected to the soaking tank (2); a through hole is provided in the center of the bottom plate (4), allowing the medicine to be discharged from the soaking tank (2) through the through hole; multiple sets of protrusions are provided on the side of the bottom plate (4) near the soaking tank (2), and the multiple sets of protrusions are evenly distributed along the center of the bottom plate (4), the protrusions are used to rotate the medicine to generate centrifugal force to clean the flocculent matter; The top cover (3) is positioned directly above the soaking tank (2); the outer diameter of the top cover (3) is slightly smaller than the inner diameter of the soaking tank (2), so that the top cover (3) can enter the soaking tank (2) and seal the inlet; The fixing structure is connected to the top cover (3) and is used to fix the wafer during the desizing process.

2. The immersion apparatus for removing resist from wafers according to claim 1, characterized in that: The adhesive removal structure also includes: A limiting member (5) is provided in the through hole; a slider is provided on the outside of the limiting member (5), the slider is provided in the slide rail opened vertically in the inner wall of the through hole, and is slidably connected to the bottom plate (4) through the slide rail; a groove is provided at the center of the limiting member (5); A filter cover (6) is disposed in the groove, and the upper end face of the filter cover (6) is flush with the upper end face of the base plate (4); A support plate (7) is sleeved on the outside of the limiting member (5) and rotatably connected to the limiting member (5); the edge of the support plate (7) is fixedly connected to the outer shell (1); The first motor (8) is fixedly connected to the end of the limiting member (5) away from the base plate (4).

3. The immersion apparatus for removing resist from wafers according to claim 1, characterized in that: The fixing structure includes: A drive component is disposed inside the top cover (3) and connected to the top cover (3); Multiple sets of switching components are evenly arranged along the center of the driving component and connected to the driving component, so that the switching components switch the fixed position of the wafer under the drive of the driving component. Multiple sets of adjustable clamping components are provided, each set of adjustable clamping components is located directly below the switching component and connected to the switching component, and is used to adjust the clamping diameter.

4. The immersion apparatus for removing resist from wafers according to claim 3, characterized in that: The driving component includes: The drive unit (9) is composed of a first threaded rod (901), a circular plate (902) and multiple sets of strip plates (903); the first threaded rod (901) passes through the axis of the circular plate (902) and is threadedly connected to the circular plate (902); the multiple sets of strip plates (903) are evenly distributed on the outer side of the circular plate (902); Multiple sets of rotating rods (11), the axis of each set of rotating rods (11) is fixedly connected to one end of the strip plate (903) away from the circular plate (902); The output end of the second motor (10) is fixedly connected to one end of the first threaded rod (901).

5. The immersion apparatus for removing resist from wafers according to claim 3, characterized in that: Each group of switching components includes: Two sets of first groove plates (12) are symmetrically arranged on both sides of the rotating rod (11); the surface of the first groove plate (12) is provided with a first sliding groove (1201). Two sets of first moving rods (14), each set of first moving rods (14) is provided with a first cylindrical pin at one end near the drive assembly (9), the first cylindrical pin is provided in the first sliding groove (1201), and the first moving rod (14) is slidably connected to the first groove plate (12) through the first sliding groove; Two sets of second groove plates (13) are symmetrically arranged on both sides of the rotating rod (11) and perpendicular to the first groove plate (12); the surface of the second groove plate (13) is provided with a second sliding groove (1301). Two sets of second moving rods (15), each set of second moving rods (15) is provided with a second cylindrical pin at one end near the drive assembly (9), the second cylindrical pin is provided in the second sliding groove, and the second moving rod (15) is slidably connected to the second groove plate (13) through the second sliding groove (1301); Multiple sets of vertical rods (16) are fixedly connected to the ends of the first moving rod (14) and the second moving rod (15) away from the rotating rod (11), respectively.

6. The immersion apparatus for removing resist from wafers according to claim 5, characterized in that: The first slide (1201) is composed of a first vertical slide (12011) and a first inclined slide (12012); one end of the first inclined slide (12012) is connected to the top of the first vertical slide (12011); the other end of the first inclined slide (12012) is located at the end of the first groove plate (12) away from the rotating rod (11), and the height of the plane at the other end is higher than that of the first vertical slide (12011).

7. The immersion apparatus for removing resist from wafers according to claim 6, characterized in that: The second slide (1301) is composed of a second vertical slide (13011) and a second inclined slide (13012); one end of the second inclined slide (13012) is connected to the top of the second vertical slide (13011); the other end of the second inclined slide (13012) is located at the end of the second groove plate (12) away from the rotating rod (11), and the height of the plane at the other end is lower than that of the second vertical slide (13011).

8. The immersion apparatus for removing resist from wafers according to claim 7, characterized in that: The length of the first vertical chute (12011) is the same as the length of the vertical lines at both ends of the second inclined chute (13012), and they are located at the same height; the length of the second vertical chute (13011) is the same as the length of the vertical lines at both ends of the first inclined chute (12012), and they are located at the same height.

9. The immersion apparatus for removing resist from wafers according to claim 5, characterized in that: Each set of the adjustable clamping components includes: The rotating component (17) consists of a second threaded rod (1701) and a handwheel (1702). One end of the second threaded rod (1701) passes through the vertical rod (16) and is fixedly connected to the handwheel (1702). The fixing member (18) consists of a clamping part (1801) and a moving part (1802). The moving part (1802) is sleeved on the outside of the second threaded rod (1701) and threadedly connected to the second threaded rod (1701). The end of the moving part (1802) away from the handwheel (1702) is fixedly connected to the clamping part (1801). Two sets of seals (19), each set of seals (19) consists of a sealing plate (1901) and a sliding rod (1902). One end of the sliding rod (1902) is fixedly connected to the end of the moving part (1802) near the handwheel (1702); the other end of the sliding rod (1902) is fixedly connected to the sealing plate (1901); the surface of the sliding rod (1902) is slidably connected to the guide rail opened on the surface of the vertical rod (16); the length of the sealing plate is twice the length of the guide rail.

10. The immersion apparatus for removing resist from wafers according to claim 9, characterized in that: The adjustment clamping assembly also includes a scale (20); the scale (20) is disposed above the sealing plate and is used to display the moving distance of the sealing plate.

11. The immersion apparatus for removing resist from wafers according to claim 1, characterized in that: Also includes: Movable component; the movable component is disposed between the outer shell (1) and the soaking tank (2) and is connected to the soaking tank (2) for moving the soaking tank (2).

12. The immersion apparatus for removing resist from wafers according to claim 1, characterized in that: The moving component includes: Two sets of spur gears (25) are disposed inside the housing (1) and are rotatably connected to the housing (1); the two sets of spur gears (25) are meshed with each other; The third motor (26) is fixedly connected to the shaft of a set of spur gears (25) at its output end. Two sets of rotating rods (24), one end of each set of rotating rods (24) is fixedly connected to the shaft of the spur gear (25), and the other end is provided with a strip groove; Two sets of connectors (23), each set of connectors (23) has a third cylindrical pin at one end, the third cylindrical pin is set in the strip groove, and the connector (23) is slidably connected to the rotating rod (24) through the strip groove; A support ring (21) is sleeved on the outside of the soaking tank (2) and is rotatably connected to the soaking tank (2); Multiple sets of connecting rods (22), each set of connecting rods (22) is fixedly connected at both ends to the support ring (21) and the connecting piece (23).

13. The immersion apparatus for removing resist from wafers according to claim 1, characterized in that: Also includes: Electric push rod (27); the output end of the electric push rod (27) is fixedly connected to the top cover (3) and is used to push the top cover (3) to move vertically.

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