A silicon carbide power device package structure

Abstract

The application discloses a silicon carbide power device packaging structure and belongs to the technical field of chip packaging. The silicon carbide power device packaging structure comprises a bottom plate, a top plate is arranged at the top end of the bottom plate, a chip body is arranged between the top plate and the bottom plate, a heat dissipation mechanism is arranged in the top plate, the heat dissipation mechanism comprises cooling water pipes fixedly installed in the top plate, a partition plate is arranged in the top plate, the partition plate is arranged between the cooling water pipes and the chip body, a plurality of heat conduction blocks are fixedly installed on the surface of the partition plate, and an agitating assembly is arranged in the top plate close to the chip body. The silicon carbide power device packaging structure is provided with a three-dimensional heat dissipation system of 'active heat absorption, strengthened conduction and dynamic heat dissipation', and the problem of low heat dissipation efficiency of traditional packaging is solved. Heat is transferred to the heat absorption long pipes through the heat dissipation channels, the rotating rod is driven to rotate through thermal expansion, the spiral impeller is driven to rotate by the rotating rod, the circulation of the cooling liquid in the spiral cooling water pipes is accelerated, and rapid heat dissipation is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip packaging, in particular to a silicon carbide power device packaging structure. BACKGROUND

[0002] Silicon carbide power devices have become the core basic devices in high-end power electronic fields such as new energy vehicles, smart grids, rail transit, aerospace, etc. due to their excellent characteristics such as wide band gap, high breakdown field strength, high thermal conductivity and high temperature resistance. Compared with traditional silicon-based power devices, silicon carbide power devices can work stably under higher voltage, larger current and higher temperature conditions, and can significantly improve the power density, conversion efficiency and reliability of power electronic systems.

[0003] Silicon carbide power devices generate a large amount of Joule heat under high-frequency and high-power working conditions. The heat dissipation path of the traditional packaging structure is single, and the heat is easily accumulated at the contact interface between the chip body and the packaging shell, which leads to rapid rise of the chip junction temperature. High temperature not only reduces the electrical performance parameters such as switching speed and on-state voltage drop of the device, but also accelerates the aging of the internal bonding wire and the failure of the packaging material, and even causes thermal runaway, which greatly shortens the service life of the device. In addition, the traditional heat dissipation structure lacks active thermal management capability and cannot dynamically adjust the heat dissipation efficiency according to the real-time heat generation of the device, which is difficult to adapt to complex and variable working conditions. SUMMARY

[0004] The purpose of the present application is to provide a silicon carbide power device packaging structure to solve the problem of the lack of active thermal management capability of the traditional heat dissipation structure, the inability to dynamically adjust the heat dissipation efficiency according to the real-time heat generation of the device, and the difficulty in adapting to complex and variable working conditions.

[0005] To achieve the above purpose, the present application provides the following technical scheme: a silicon carbide power device packaging structure, comprising a bottom plate, a top plate is arranged at the top end of the bottom plate, and a chip body is arranged between the top plate and the bottom plate, a heat dissipation mechanism is arranged inside the top plate, the heat dissipation mechanism comprises a cooling water pipe fixedly installed inside the top plate, a partition plate is arranged inside the top plate, and an adsorption partition plate is arranged between the cooling water pipe and the chip body, a plurality of heat conduction blocks are fixedly installed on the surface of the adsorption partition plate, an agitating assembly is arranged inside the top plate close to the chip body, the agitating assembly comprises a heat-absorbing long pipe fixedly installed inside the top plate, a rotating rod is rotatably installed inside the heat-absorbing long pipe, a moving plate is slidably installed on the outer surface of the rotating rod, a spiral impeller is rotatably installed inside the cooling water pipe, and a belt is transmissionally installed between the spiral impeller and the rotating rod.

[0006] As a preferred technical scheme of the present application, a spiral groove is formed on the outer surface of the rotating rod, and a sliding block is fixedly installed on the surface of the moving plate and slidably installed inside the spiral groove.

[0007] As a preferred technical scheme of the present application, the inside of the heat-absorbing long tube is fixedly installed with a sliding plate, the moving plate slides between the sliding plate and the inner wall of the heat-absorbing long tube, a plurality of heat dissipation channels are formed in the surface of the top plate close to the chip body, and one end of the sliding plate is communicated with the inside of the chip body through the heat dissipation channels.

[0008] As a preferred technical scheme of the present application, the cooling water pipe is in a spiral shape, and the two ends of the cooling water pipe are communicated and butt-jointed, one end of the cooling water pipe is provided with a water inlet pipe, and the top end of the water inlet pipe is provided with a piston.

[0009] As a preferred technical scheme of the present application, the inside of the top plate is fixedly installed with a supporting filter screen, the supporting filter screen is located between the adsorbing partition plate and the chip body, and the outer surface of the top plate is fixedly installed with a cover plate for protecting the heat-conducting block.

[0010] As a preferred technical scheme of the present application, the inside of the top plate is fixedly installed with staggered adsorbing cotton plates, the adsorbing cotton plates are located between the supporting filter screen and the chip body, and a plurality of protection pads are fixedly installed on the surface of the adsorbing cotton plates close to the chip body.

[0011] As a preferred technical scheme of the present application, a sealing mechanism is arranged between the top plate and the bottom plate, the sealing mechanism comprises sealing grooves formed in the surfaces of the top plate and the bottom plate, a sealing plate for closing the chip body is installed through the two sealing grooves, annular rubber tubes for air inflation sealing are fixedly installed at the two ends of the sealing plate, the rubber tubes are inserted into the sealing grooves, and air inflation tubes for air supplementing inflation are arranged at one end of the rubber tubes.

[0012] As a preferred technical scheme of the present application, the inside of the sealing groove close to the rubber tube is filled with potting glue for reinforcing sealing, and the potting glue is an epoxy resin type potting glue.

[0013] As a preferred technical scheme of the present application, a positioning mechanism is arranged between the top plate and the bottom plate, the positioning mechanism comprises a limiting plate fixedly installed in the inside of the top plate, a damping spring is fixedly installed at the bottom end of the limiting plate, a positioning ball is fixedly installed at the free end of the damping spring, a ball groove is formed in the top end of the bottom plate, and the positioning ball is inserted into the ball groove.

[0014] As a preferred technical scheme of the present application, glue pouring holes are formed in the two sides of the top plate and the bottom plate and are communicated, the glue pouring holes are in a rhombic shape, and air exhaust grooves are formed in the two ends of the glue pouring holes.

[0015] Compared with the prior art, the present application has the following beneficial effects:

[0016] 1、The present application constructs a three-dimensional heat dissipation system of "active heat absorption-strengthened conduction-dynamic heat dissipation" through the collaborative design of multiple components of the heat dissipation mechanism, completely solving the low efficiency of traditional packaging heat dissipation. The heat generated by the chip body is first transmitted to the heat absorption long pipe through the heat dissipation channel, and the heat expansion drives the rotating rod to rotate, and the rotating rod drives the spiral impeller to rotate, accelerating the flow of water flow inside the cooling water pipe, realizing rapid heat dissipation. At the same time, the heat conduction block efficiently conducts the heat collected by the adsorption partition plate to the spiral cooling water pipe, and the spiral structure increases the heat dissipation area, and cooperates with the cooling liquid flow driven by the internal spiral impeller, which significantly improves the heat exchange efficiency.

[0017] 2、The spiral cooling water pipe arranged in the present application can form a full-coverage cooling flow channel inside the top plate, and cooperates with the uniformly distributed heat conduction blocks on the adsorption partition plate, so that the heat of different regions of the chip body can be conducted to the cooling water pipe simultaneously, avoiding the local heat aggregation problem of "high temperature in the center of the chip and low temperature at the edge" in the traditional heat dissipation structure.

[0018] 3、The present application uses the double design of "inflatable expansion sealing + potting glue reinforcement" to solve the sealing failure of traditional packaging in cold and hot cycles and harsh environments. After the annular rubber tube is inflated and expanded through the inflation pipe, it is tightly fitted with the inner wall of the sealing groove, forming the first elastic sealing barrier, which can adapt to the thermal expansion and contraction deformation of the top plate and the bottom plate, avoiding the appearance of sealing gap, and the epoxy resin potting glue filled in the sealing groove forms the second rigid sealing layer, which has excellent adhesion and insulation, further blocking the invasion of water vapor, corrosive gas and dust.

[0019] 4、The present application realizes high-precision assembly and vibration buffering of the top plate and the bottom plate through the design of "damping spring + ball groove positioning". The damping spring fixed by the limiting plate provides continuous elastic pressure for the positioning ball, ensuring that it is stably embedded in the ball groove of the bottom plate, avoiding stress concentration caused by assembly deviation of the chip body, in addition, the damping spring also has vibration absorption function, which can buffer impact load when transporting or working in vibration, preventing electrical connection failure and heat conduction path damage caused by loose packaging structure.

[0020] 5、The present application can efficiently adsorb water vapor and small impurities in the packaging cavity through the staggered arrangement of the adsorption cotton plate, avoiding chip electrode corrosion and passivation layer failure; the gasket plate on the surface of the adsorption cotton plate is made of elastic material, which forms a buffer between the chip and the top plate, relieving the thermal stress and mechanical stress caused by chip cracking; the supporting filter screen not only fixes the position of the adsorption partition plate, but also blocks the contact of large particle impurities with the heat conduction structure. The multi-layer protection improves the environmental interference resistance of the chip and reduces internal faults. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is the overall structure schematic diagram of the present application;

[0022] Figure 2It is the top plate cross section structure schematic diagram of the present application;

[0023] Figure 3 It is the top plate cross section structure schematic diagram of the present application; Figure 2 It is the enlarged structure schematic diagram of A in the present application;

[0024] Figure 4 It is the sealing plate internal structure schematic diagram of the present application;

[0025] Figure 5 It is the top plate internal structure schematic diagram of the present application;

[0026] Figure 6 It is the heat dissipation channel structure schematic diagram of the present application;

[0027] Figure 7 It is the support filter screen structure schematic diagram of the present application;

[0028] Figure 8 It is the stirring assembly structure schematic diagram of the present application;

[0029] Figure 9 It is the cooling water pipe structure schematic diagram of the present application;

[0030] Figure 10 It is the long pipe internal structure schematic diagram of the present application.

[0031] In the figure: 1, bottom plate; 2, chip body; 3, top plate; 4, positioning mechanism; 41, limiting plate; 42, damping spring; 43, positioning ball; 44, ball groove; 45, exhaust groove; 46, glue pouring hole; 5, sealing mechanism; 51, rubber tube; 52, sealing plate; 53, sealing groove; 54, inflation tube; 6, heat dissipation mechanism; 61, pad; 62, adsorbing cotton board; 63, support filter screen; 64, adsorbing partition plate; 65, heat conduction block; 66, cooling water pipe; 67, stirring assembly; 671, heat absorbing long pipe; 672, moving plate; 673, rotating rod; 674, sliding plate; 675, spiral impeller; 676, belt; 677, heat dissipation channel; 68, cover plate. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0033] Please refer to Figures 1-10The application provides a silicon carbide power device packaging structure, which comprises a bottom plate 1, the top end of the bottom plate 1 is provided with a top plate 3, a chip body 2 is arranged between the top plate 3 and the bottom plate 1, the inside of the top plate 3 is provided with a heat dissipation mechanism 6, the heat dissipation mechanism 6 comprises cooling water pipes 66 fixedly installed in the inside of the top plate 3, the inside of the top plate 3 is provided with a partition plate, and an adsorption partition plate 64 is arranged between the cooling water pipes 66 and the chip body 2, a plurality of heat conduction blocks 65 are fixedly installed on the surface of the adsorption partition plate 64, the inside of the top plate 3 close to the chip body 2 is provided with an agitating assembly 67, the agitating assembly 67 comprises a heat absorption long pipe 671 fixedly installed in the inside of the top plate 3, a rotating rod 673 is rotatably installed in the inside of the heat absorption long pipe 671, a moving plate 672 is slidably installed on the outer surface of the rotating rod 673, a spiral impeller 675 is rotatably installed in the inside of the cooling water pipe 66, and a belt 676 is transmissionally installed between the spiral impeller 675 and the rotating rod 673.

[0034] The top plate 3 and the bottom plate 1 form a closed cavity, the chip body 2 is limited in the cavity to realize physical packaging protection and electrical isolation, when the temperature in the inside of the chip body 2 increases, at this moment, the heat flow is guided into the inside of the heat absorption long pipe 671 through the heat dissipation channel 677, so that the moving plate 672 is driven to move through thermal expansion, the moving plate 672 drives the rotating rod 673 to rotate through the action of the spiral groove, so as to accelerate the air flow in the pipe, and the rotating rod 673 drives the spiral impeller 675 in the inside of the cooling water pipe 66 to rotate through the belt 676, so as to accelerate the flow of the cooling liquid in the inside of the cooling water pipe 66, the self-adaptive adjustment of the heat dissipation efficiency is realized, and the heat dissipation effect is promoted; the adsorption partition plate 64 can adsorb water vapor impurities in the cavity, the heat conduction blocks 65 on the surface of the adsorption partition plate 64 can efficiently conduct the heat generated by the chip body 2 to the cooling water pipe 66, so that the heat conduction is fast, the moisture in the cavity can be adsorbed, and the service life of the chip body 2 is prolonged.

[0035] In some embodiments, the outer surface of the rotating rod 673 is provided with a spiral groove, the surface of the moving plate 672 is fixedly installed with a sliding block, and the sliding block is slidably installed in the inside of the spiral groove.

[0036] The spiral groove on the outer surface of the rotating rod 673 and the sliding block on the moving plate 672 constitute a spiral transmission, when the heat flow is concentrated in the inside of the heat absorption long pipe 671, the moving plate 672 is driven to move through thermal expansion, the axial force of the moving plate 672 acts through the spiral lift angle of the spiral groove, the rotating rod 673 is driven to rotate, the linear reciprocating motion of the moving plate 672 is efficiently converted into the rotary motion of the rotating rod 673, the movement of the moving plate 672 can fully agitate the air in the heat absorption long pipe 671, the convection of the air in the pipe is enhanced, and the heat absorption efficiency of the chip body 2 is improved.

[0037] In some embodiments, the inner part of the heat-absorbing long tube 671 is fixedly installed with a sliding plate 674, the moving plate 672 slides between the sliding plate 674 and the inner wall of the heat-absorbing long tube 671, a plurality of heat dissipation channels 677 are opened on the surface of the top plate 3 close to the chip body 2, and one end of the sliding plate 674 communicates with the inside of the chip body 2 through the heat dissipation channel 677.

[0038] Wherein, the sliding plate 674 plays a guiding and limiting role for the moving plate 672, limiting it to only slide axially along the heat-absorbing long tube 671; the heat generated by the chip body 2 enters the heat-absorbing long tube 671 through the heat dissipation channel 677, ensuring the stability of the moving track of the moving plate 672, and the reciprocating movement of the moving plate 672 accelerates the air flow in the tube, forming a directional heat conduction path between the chip body 2 and the heat-absorbing long tube 671, shortening the heat transfer distance, improving the heat dissipation response speed, and avoiding the problem of excessive junction temperature caused by heat accumulation on the chip surface.

[0039] In some embodiments, the cooling water pipe 66 is spiral-shaped, and the two ends of the cooling water pipe 66 are communicatively connected and docked, one end of the cooling water pipe 66 is provided with a water inlet pipe, and the top end of the water inlet pipe is provided with a piston.

[0040] Wherein, the spiral-shaped cooling water pipe 66 forms a full-coverage cooling flow channel inside the top plate 3, after the cooling liquid is injected from the water inlet pipe, it flows along the spiral path, greatly increasing the heat exchange area with the inside of the top plate 3; the structure of the two ends being communicatively connected and docked realizes the circulating flow of the cooling liquid, reducing the consumption of the cooling liquid.

[0041] In some embodiments, the inside of the top plate 3 is fixedly installed with a support filter screen 63, and the support filter screen 63 is located between the adsorption partition plate 64 and the chip body 2, and the outer surface of the top plate 3 is fixedly installed with a cover plate 68 for protecting the heat-conducting block 65.

[0042] Wherein, the support filter screen 63 is located between the adsorption partition plate 64 and the chip body 2, which not only fixes the position of the adsorption partition plate 64, but also filters large particles in the cavity to prevent them from contacting the chip or the heat-conducting block 65; the cover plate 68 covers the outer surface of the top plate 3, and forms physical protection for the heat-conducting block 65, and is isolated from external impact and dust.

[0043] In some embodiments, the inside of the top plate 3 is fixedly installed with staggered adsorption cotton boards 62, and the adsorption cotton boards 62 are located between the support filter screen 63 and the chip body 2, and a plurality of protection pads 61 are fixedly installed on the surface of the adsorption cotton boards 62 close to the chip body 2.

[0044] The staggered adsorbing cotton board 62 can adsorb water vapor and small impurities in the cavity, preventing water vapor from condensing or impurities from adhering to the surface of the chip to cause electrode corrosion and passivation layer failure. The gasket 61 is made of elastic material and forms a buffer layer between the chip body 2 and the top plate 3, thereby relieving mechanical stress generated by thermal expansion and cold contraction of the chip and ensuring the structural integrity and electrical performance stability of the chip.

[0045] In some embodiments, a sealing mechanism 5 is arranged between the top plate 3 and the bottom plate 1. The sealing mechanism 5 includes sealing grooves 53 formed on the surfaces of the top plate 3 and the bottom plate 1, and a sealing plate 52 arranged between the two sealing grooves 53 to seal the chip body 2. The two ends of the sealing plate 52 are fixedly installed with annular rubber tubes 51 for inflation sealing. The rubber tubes 51 are inserted into the sealing grooves 53, and one end of the rubber tube 51 is connected with an inflation tube 54 for air inflation.

[0046] The sealing plate 52 penetrates the sealing grooves 53 of the top plate 3 and the bottom plate 1 to achieve preliminary physical sealing of the cavity. The rubber tube 51 is inflated by the inflation tube 54, and the rubber tube 51 is tightly attached to the inner wall of the sealing groove 53 after inflation, forming an elastic sealing barrier to further reduce the gap of traditional rigid sealing, block the intrusion of external water vapor and dust, and achieve multiple protection of the cavity, suitable for high-humidity and high-dust industrial-grade harsh working conditions.

[0047] In some embodiments, the sealing groove 53 near the inner part of the rubber tube 51 is filled with potting glue for reinforcing sealing. The potting glue is an epoxy resin type potting glue.

[0048] The rubber tube 51 in the sealing groove 53 is filled with epoxy resin potting glue around the periphery. The epoxy resin potting glue has high adhesion and high insulation, which not only reinforces the sealing structure, but also avoids current leakage at the sealing part, suitable for the insulation requirements of high-voltage silicon carbide power devices. The elastic sealing of the rubber tube 51 forms a composite sealing system of “elasticity + rigidity”, further strengthening the sealing effect.

[0049] In some embodiments, a positioning mechanism 4 is arranged between the top plate 3 and the bottom plate 1. The positioning mechanism 4 includes a limiting plate 41 fixedly installed inside the top plate 3. The bottom end of the limiting plate 41 is fixedly installed with a damping spring 42, and the free end of the damping spring 42 is fixedly installed with a positioning ball 43. The top end of the bottom plate 1 is provided with a ball groove 44, and the positioning ball 43 is inserted into the ball groove 44.

[0050] Wherein, the cooperation of the ball groove 44 and the positioning ball 43 realizes high-precision positioning, avoiding stress concentration of the chip body 2 due to assembly deviation; the damping spring 42 provides continuous elastic pressure for the positioning ball 43, so that the positioning ball 43 is stably embedded in the ball groove 44 of the bottom plate 1, realizing accurate positioning of the top plate 3 and the bottom plate 1, and the damping spring 42 can buffer the impact load generated by transportation or working condition vibration, ensuring the stability of the electrical performance and heat dissipation performance of the device.

[0051] In some embodiments, the top plate 3 and the bottom plate 1 are both provided with a communicating glue pouring hole 46, and the glue pouring hole 46 is sealed by a rhombic sealing plug, and the two ends of the glue pouring hole 46 are provided with exhaust grooves 45 for exhaust.

[0052] Wherein, the glue pouring hole 46 of the top plate 3 and the bottom plate 1 is used for injecting potting glue, realizing bonding and reinforcement of the top plate 3 and the bottom plate 1; the rhombic sealing plug structure improves the sealing performance of the glue pouring hole 46, preventing the potting glue from leaking; the exhaust groove 45 can exhaust the bubbles generated during the glue pouring process, ensuring uniform filling of the potting glue.

[0053] Working principle: the top plate 3 and the bottom plate 1 form a closed cavity, and the chip body 2 is limited in the cavity to realize physical packaging protection and electrical isolation; when the temperature inside the chip body 2 increases, the heat flow is introduced into the inside of the heat-absorbing long pipe 671 through the heat dissipation channel 677, so as to drive the moving plate 672 to move through thermal expansion, and the moving plate 672 drives the rotating rod 673 to rotate through the action of the spiral groove, so as to accelerate the air flow in the pipe, and the rotating rod 673 drives the spiral impeller 675 inside the cooling water pipe 66 to rotate through the belt 676, so as to accelerate the flow of the cooling liquid inside the cooling water pipe 66, realizing self-adaptive adjustment of the heat dissipation efficiency and promoting the heat dissipation effect.

[0054] The above is only a specific embodiment of the present application, but the technical features of the present application are not limited to this. Any simple change, equivalent replacement or modification made on the basis of the present application to solve the basically same technical problem and realize the basically same technical effect is covered in the protection scope of the present application.

Claims

1. A silicon carbide power device packaging structure, comprising a base plate (1), characterized in that: A top plate (3) is provided at the top of the base plate (1), and a chip body (2) is provided between the top plate (3) and the base plate (1). A heat dissipation mechanism (6) is provided inside the top plate (3). The heat dissipation mechanism (6) includes a cooling water pipe (66) fixedly installed inside the top plate (3). A partition is provided inside the top plate (3), and an adsorption partition (64) is located between the cooling water pipe (66) and the chip body (2). Multiple heat-conducting blocks (65) are fixedly installed on the surface of the adsorption partition (64). (3) An agitation assembly (67) is provided inside the chip body (2). The agitation assembly (67) includes a heat-absorbing long tube (671) fixedly installed inside the top plate (3). A rotating rod (673) is rotatably installed inside the heat-absorbing long tube (671). A moving plate (672) is slidably installed on the outer surface of the rotating rod (673). A spiral impeller (675) is rotatably installed inside the cooling water pipe (66). A belt (676) is installed between the spiral impeller (675) and the rotating rod (673). The outer surface of the rotating rod (673) is provided with a spiral groove. The surface of the moving plate (672) is fixedly installed with a slider, and the slider is slidably installed inside the spiral groove. The inside of the heat-absorbing tube (671) is fixedly installed with a sliding plate (674), and the moving plate (672) slides between the sliding plate (674) and the inner wall of the heat-absorbing tube (671). The surface of the top plate (3) near the chip body (2) is provided with multiple heat dissipation channels (677), and one end of the sliding plate (674) is connected to the inside of the chip body (2) through the heat dissipation channel (677).

2. The silicon carbide power device packaging structure according to claim 1, characterized in that: The cooling water pipe (66) is spiral-shaped, and the two ends of the cooling water pipe (66) are connected and connected. One end of the cooling water pipe (66) is provided with a water inlet pipe, and the top end of the water inlet pipe is provided with a piston.

3. The silicon carbide power device packaging structure according to claim 1, characterized in that: The top plate (3) is fixedly installed with a support filter (63), and the support filter (63) is located between the adsorption partition (64) and the chip body (2). The outer surface of the top plate (3) is fixedly installed with a cover plate (68) for protecting the heat-conducting block (65).

4. The silicon carbide power device packaging structure according to claim 1, characterized in that: The top plate (3) is fixedly installed with staggered adsorption cotton plates (62), and the adsorption cotton plates (62) are located between the support filter (63) and the chip body (2). Multiple protective pads (61) are fixedly installed on the surface of the adsorption cotton plates (62) near the chip body (2).

5. The silicon carbide power device packaging structure according to claim 1, characterized in that: A sealing mechanism (5) is provided between the top plate (3) and the bottom plate (1). The sealing mechanism (5) includes sealing grooves (53) formed on the surfaces of the top plate (3) and the bottom plate (1). A sealing plate (52) for sealing the chip body (2) is installed through the two sealing grooves (53). Both ends of the sealing plate (52) are fixedly installed with annular rubber tubes (51) for gas expansion sealing. The rubber tubes (51) are inserted into the interior of the sealing grooves (53), and one end of the rubber tubes (51) is connected to an inflation tube (54) for gas replenishment expansion.

6. The silicon carbide power device packaging structure according to claim 5, characterized in that: The sealing groove (53) near the rubber tube (51) is filled with potting compound for reinforcing the seal, and the potting compound is an epoxy resin potting compound.

7. The silicon carbide power device packaging structure according to claim 1, characterized in that: A positioning mechanism (4) is provided between the top plate (3) and the bottom plate (1). The positioning mechanism (4) includes a limiting plate (41) fixedly installed inside the top plate (3). A damping spring (42) is fixedly installed at the bottom end of the limiting plate (41). A positioning ball (43) is fixedly installed at the free end of the damping spring (42). A ball groove (44) is opened at the top of the bottom plate (1), and the positioning ball (43) is inserted inside the ball groove (44).

8. The silicon carbide power device packaging structure according to claim 7, characterized in that: Both sides of the top plate (3) and the bottom plate (1) are provided with connected glue-filling holes (46), and the glue-filling holes (46) are sealed with diamond shapes. Both ends of the glue-filling holes (46) are provided with exhaust grooves (45) for exhaust.

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